Cooling device

Abstract

The present specification relates to a cooling device and, more specifically, to a device for cooling a semiconductor element. The cooling device according to one embodiment may comprise: a main body; a fluid supply unit which is connected to the main body and which supplies, to the main body, fluid supplied from a fluid supply device; and a fluid discharge unit which is connected to the main body, and which transfers, to the fluid supply device, the fluid discharged from the main body. In one embodiment, the main body can include an upper plate, a middle plate and a lower plate.

Description

Cooling device

[0001] This specification relates to a cooling device, and more particularly to a device for cooling a semiconductor device.

[0002]

[0003] Semiconductor devices are devices used to control and process electrical signals in electronic devices. They are typically made from semiconductor materials such as silicon. Examples of semiconductor devices include central processing units (CPUs) and random access memory (RAM), but the types of semiconductor devices are not limited to these.

[0004] Semiconductor devices operate on electrical energy. When electricity flows through a semiconductor device, it consumes power, and some of this electrical energy is converted into heat. Heat generated during the testing or use of semiconductor devices can degrade their electrical performance or reduce their stability. Therefore, the introduction of appropriate cooling devices is essential to address heat generation issues that may arise during semiconductor device testing or use.

[0005]

[0006] The purpose of this specification is to provide a cooling device capable of efficiently cooling a semiconductor device during the operation of the semiconductor device.

[0007] The purpose of this specification is not limited to the aforementioned purposes, and other purposes and advantages of this specification not mentioned herein will be more clearly understood by the embodiments of this specification described below. Furthermore, the purposes and advantages of this specification can be realized by the components and combinations thereof described in the claims.

[0008]

[0009] A cooling device according to one embodiment may include a main body, a fluid supply unit connected to the main body and supplying fluid supplied from a fluid supply device to the main body, and a fluid discharge unit connected to the main body and delivering the fluid discharged from the main body to the fluid supply device.

[0010] In one embodiment, the body may include an upper plate, a middle plate, and a lower plate.

[0011] In one embodiment, the upper plate may include a plurality of first walls formed on an upper surface of the upper plate and a plurality of first passages formed between each of the first walls.

[0012] In one embodiment, the intermediate plate may include a plurality of second walls formed on a lower surface of the intermediate plate and a plurality of second channels formed between each of the first walls.

[0013] In one embodiment, the lower plate may include a cooling region formed on a lower surface of the lower plate.

[0014] In one embodiment, the fluid supply unit may include an inlet through which the fluid flows, a first opening formed in the upper plate, and a first circulation unit communicating with the inlet.

[0015] In one embodiment, the fluid discharge unit may include a discharge port through which the fluid is discharged, a second opening formed in the upper plate, and a second circulation unit communicating with the discharge port.

[0016] In one embodiment, the upper plate may further include a first opening formed at a position corresponding to a first circulation portion formed in the fluid supply portion and a second opening formed at a position corresponding to a second circulation portion formed in the fluid discharge portion.

[0017] In one embodiment, the intermediate plate may further include a third opening formed at a position corresponding to the first opening formed in the upper plate and a fourth opening formed at a position corresponding to the second opening formed in the upper plate.

[0018] In one embodiment, the upper plate may further include a blocking wall disposed on one side of the plurality of first euros.

[0019] In one embodiment, the blocking wall may be disposed between the second opening formed in the upper plate and the plurality of first channels.

[0020] In one embodiment, the upper plate may further include a resistive protrusion formed on a side surface of each of the first walls.

[0021] In one embodiment, the resistance protrusion may include a first resistance protrusion protruding in a first direction intersecting the extension direction of each of the first walls, and a second resistance protrusion protruding in a second direction opposite to the first direction.

[0022] In one embodiment, the intermediate plate may further include one or more apertures formed in each of the second euros.

[0023] In one embodiment, the intermediate plate may further include a resistive protrusion formed on a side surface of each of the second walls.

[0024] In one embodiment, the resistance protrusion may include a third resistance protrusion protruding in a first direction intersecting the extension direction of each of the second walls, and a fourth resistance protrusion protruding in a second direction opposite to the first direction.

[0025] In one embodiment, the resistance protrusions may be positioned adjacent to the apertures formed in each of the second euros.

[0026]

[0027] The cooling device according to the embodiments has a higher cooling performance than conventional devices and can efficiently cool semiconductor devices during their operation. Accordingly, the performance and reliability of the semiconductor devices can be improved during their operation.

[0028]

[0029] Figure 1 is a top perspective view of a cooling device according to one embodiment.

[0030] Figure 2 is a bottom perspective view of a cooling device according to one embodiment.

[0031] FIG. 3 is a bottom perspective view of a fluid supply section and a fluid discharge section of a cooling device according to one embodiment.

[0032] FIG. 4 is a top perspective view of an upper plate constituting a main body of a cooling device according to one embodiment.

[0033] FIG. 5 is a bottom perspective view of an upper plate constituting a main body of a cooling device according to one embodiment.

[0034] FIG. 6 is a bottom perspective view of an upper plate constituting a main body of a cooling device according to another embodiment.

[0035] FIG. 7 is a top perspective view of a middle plate constituting a main body of a cooling device according to one embodiment.

[0036] FIG. 8 is a bottom perspective view of a middle plate constituting a main body of a cooling device according to one embodiment.

[0037] FIG. 9 is a bottom perspective view of a middle plate constituting a main body of a cooling device according to another embodiment.

[0038] FIG. 10 is a top perspective view of a lower plate constituting a main body of a cooling device according to one embodiment.

[0039] FIG. 11 is a bottom perspective view of a lower plate constituting a main body of a cooling device according to one embodiment.

[0040] Figure 12 is a top perspective view of a cooling device according to another embodiment.

[0041]

[0042] The above-described objects, features, and advantages are described in detail below with reference to the attached drawings, so that those skilled in the art to which the present disclosure pertains can easily practice the embodiments of the present disclosure. In describing the present disclosure, if a detailed description of a known technology related to the present disclosure is determined to unnecessarily obscure the gist of the present disclosure, a detailed description thereof will be omitted. Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the attached drawings. In the drawings, the same reference numerals indicate the same or similar components.

[0043] Figure 1 is a top perspective view of a cooling device according to one embodiment. Figure 2 is a bottom perspective view of a cooling device according to one embodiment. Figure 3 is a bottom perspective view of a fluid supply section and a fluid discharge section of a cooling device according to one embodiment.

[0044] Referring to FIGS. 1 and 2, a cooling device (1) according to one embodiment may include a main body (10), a fluid supply unit (21) coupled to one side of the upper surface of the main body (10), and a fluid discharge unit (22) coupled to the other side of the upper surface of the main body (10).

[0045] The main body (10) may have a plate shape. Inside the main body (10), an opening and a receiving portion formed at a position corresponding to the fluid supply portion (21), a flow path for the fluid, and an opening and a receiving portion formed at a position corresponding to the fluid discharge portion (22) may be formed. The fluid flowing inside the main body (10) may be a refrigerant. The fluid may be supplied into the main body (10) through the fluid supply portion (21) and the opening and receiving portion formed in the main body (10). The fluid flowing inside the main body (10) may flow in a direction from the fluid supply portion (21) toward the fluid discharge portion (22). The fluid flowing inside the main body (10) may be discharged to the outside through the opening and receiving portion formed at a position corresponding to the fluid discharge portion (22) and the fluid discharge portion (22).

[0046] As described below, a cooling area that comes into contact with a semiconductor element to be cooled can be formed on the lower surface of the main body (10). The semiconductor element that is positioned to come into contact with the cooling area can be cooled by a fluid flowing within the main body (10).

[0047] The main body (10), fluid supply unit (21), and fluid discharge unit (22) may each be made of metal. However, the materials of the main body (10), fluid supply unit (21), and fluid discharge unit (22) are not limited thereto.

[0048] Figure 3 shows a bottom perspective view of the fluid supply section and the fluid discharge section.

[0049] Referring to FIG. 3, the fluid supply unit (21) may include an inlet (211) and a first circulation unit (212).

[0050] Fluid supplied from an external device (e.g., a refrigerant supply device or a refrigerant circulation device) can be introduced into the fluid supply unit (21) through the inlet port (211). A first connector (31) as illustrated in Fig. 1 can be connected to the inlet port (211). A component such as a pipe or hose can be connected between the first connector (31) and the external device.

[0051] The first circulation section (212) is a space formed inside the fluid supply section (21) and can be communicated with the inlet (211). Accordingly, the fluid flowing in through the inlet (211) can flow into the first circulation section (212). As described below, the first circulation section (212) can be communicated with an opening (the first opening, or the first opening and the third opening) formed in the main body (10) and the first receiving section. Accordingly, the fluid flowing into the first circulation section (212) can flow into the inside of the main body (10) through the opening and the first receiving section.

[0052] In one embodiment, the fluid supply unit (21) may include a first coupling hole (21a) and a second coupling hole (21b). The first coupling hole (21a) and the second coupling hole (21b) may be formed at positions corresponding to the first coupling hole and the second coupling hole formed in the main body (10), respectively. A fixing member (e.g., a bolt) for coupling and fixing the fluid supply unit (21) and the main body (10) may be inserted into the first coupling hole (21a) and the second coupling hole (21b), and the first coupling hole and the second coupling hole formed in the main body, respectively.

[0053] Referring again to FIG. 3, the fluid discharge portion (22) may include a discharge port (221) and a second circulation portion (222).

[0054] The second circulation section (222) is a space formed inside the fluid discharge section (22). As described below, the second circulation section (222) can be connected to an opening (the second opening, or the second opening and the fourth opening) formed in the main body (10) and a second receiving section. Accordingly, a fluid flowing in a flow path formed inside the main body (10) can flow into the second circulation section (222) through the opening and the second receiving section.

[0055] The second circulation unit (222) may be connected to the discharge port (221). Accordingly, the fluid flowing into the second circulation unit (222) may be discharged to an external device (e.g., a refrigerant supply device or a refrigerant circulation device) through the discharge port (221). A second connector (32) as illustrated in FIG. 1 may be connected to the discharge port (221). A component such as a pipe or hose may be connected between the second connector (32) and the external device.

[0056] In one embodiment, the fluid discharge unit (22) may include a first coupling hole (22a) and a second coupling hole (22b). The first coupling hole (22a) and the second coupling hole (22b) may be formed at positions corresponding to the first coupling hole and the second coupling hole formed in the main body (10), respectively. A fixing member (e.g., a bolt) for coupling and fixing the fluid discharge unit (22) and the main body (10) may be inserted into the first coupling hole (22a) and the second coupling hole (22b), and the first coupling hole and the second coupling hole formed in the main body, respectively.

[0057] A body (10) of a cooling device (1) according to one embodiment may include an upper plate, a middle plate coupled to a lower surface of the upper plate, and a lower plate coupled to a lower surface of the middle plate. Hereinafter, embodiments of the upper plate, the middle plate, and the lower plate are described.

[0058] Fig. 4 is a top perspective view of an upper plate constituting a main body of a cooling device according to one embodiment. Fig. 5 is a bottom perspective view of an upper plate constituting a main body of a cooling device according to one embodiment.

[0059] Referring to FIGS. 4 and 5, the upper plate (11a) of the main body (10) according to one embodiment may include a first opening (111) formed at one end of the upper plate (11a) and a second opening (112) formed at the other end of the upper plate (11a).

[0060] The first opening (111) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21). The first opening (111) may have a shape corresponding to the first circulation section (212).

[0061] A first coupling hole (111a) and a second coupling hole (111b) may be formed on both sides of the first opening (111). The first coupling hole (111a) and the second coupling hole (111b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), respectively.

[0062] The second opening (112) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22). The second opening (112) may have a shape corresponding to the second circulation section (222).

[0063] A first coupling hole (112a) and a second coupling hole (112b) may be formed on both sides of the second opening (112). The first coupling hole (112a) and the second coupling hole (112b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), respectively.

[0064] Referring to FIG. 5, a plurality of first walls (113) arranged at predetermined intervals may be formed on the lower surface of the upper plate (11a) according to one embodiment. A first flow path (114), which is a space through which a fluid flows, may be formed between each of the first walls (113). When the upper plate (11a) and the intermediate plate (12a or 12b) described below are combined, the lower surface of each of the first walls (113) formed on the lower surface of the upper plate (11a) may come into contact with the upper surface of the intermediate plate (12a or 12b). Each of the first walls (113) and each of the first flow paths (114) may be arranged in a direction crossing the first opening (111) and the second opening (112).

[0065] In one embodiment, a blocking wall (115) may be arranged on one side of a plurality of first walls (113). In one embodiment, the blocking wall (115) may be arranged between the second openings (112) and the plurality of first walls (113). With this structure, the flow of fluid flowing into the first flow path (114) through the first openings (111) may be blocked by the blocking wall (115). Therefore, the fluid flowing through the first flow path (114) cannot flow into the second opening (112). Therefore, the low-temperature fluid flowing through the first opening (111) does not flow out through the second opening (112) but stays in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0066] In addition, the temperature of the fluid can be lowered as the relatively high temperature fluid flowing from the second passage (124) through the hole (125) formed in the intermediate plate (12a or 12b) described later is mixed with the relatively low temperature fluid flowing through the first passage (114). The fluid mixed in the first passage (114) and its temperature is lowered can remain in the first passage (114) for a longer period of time without flowing into the second opening (112) due to the blocking wall (115), thereby improving cooling efficiency.

[0067] FIG. 6 is a bottom perspective view of an upper plate constituting a main body of a cooling device according to another embodiment.

[0068] Although not shown, the upper surface of the upper plate (11b) of the cooling device (10) according to another embodiment may have the same structure as the upper surface of the upper plate (11a) shown in FIG. 4.

[0069] Referring to FIG. 6, the upper plate (11b) of the cooling device (10) according to another embodiment may include a first opening (111) formed at one end of the upper plate (11b) and a second opening (112) formed at the other end of the upper plate (11b).

[0070] The first opening (111) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21). The first opening (111) may have a shape corresponding to the first circulation section (212).

[0071] A first coupling hole (111a) and a second coupling hole (111b) may be formed on both sides of the first opening (111). The first coupling hole (111a) and the second coupling hole (111b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), respectively.

[0072] The second opening (112) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22). The second opening (112) may have a shape corresponding to the second circulation section (222).

[0073] A first coupling hole (112a) and a second coupling hole (112b) may be formed on both sides of the second opening (112). The first coupling hole (112a) and the second coupling hole (112b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), respectively.

[0074] Referring to Fig. 6, a plurality of first walls (113) arranged at predetermined intervals may be formed on the lower surface of the upper plate (11b) according to another embodiment. A first flow path (114), which is a space through which a fluid flows, may be formed between each of the first walls (113). When the upper plate (11a) and the intermediate plate (12a or 12b) described below are combined, the lower surface of each of the first walls (113) formed on the lower surface of the upper plate (11a) may come into contact with the upper surface of the intermediate plate (12a or 12b). Each of the first walls (113) and each of the first flow paths (114) may be arranged in a direction crossing the first opening (111) and the second opening (112).

[0075] In one embodiment, a blocking wall (115) may be arranged on one side of a plurality of first walls (113). In one embodiment, the blocking wall (115) may be arranged between the second openings (112) and the plurality of first walls (113). With this structure, the flow of fluid flowing into the first flow path (114) through the first openings (111) may be blocked by the blocking wall (115). Therefore, the fluid flowing through the first flow path (114) cannot flow into the second opening (112). Therefore, the low-temperature fluid flowing through the first opening (111) does not flow out through the second opening (112) but stays in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0076] In addition, the temperature of the fluid can be lowered as the relatively high temperature fluid flowing from the second passage (124) through the hole (125) formed in the intermediate plate (12a or 12b) described later is mixed with the relatively low temperature fluid flowing through the first passage (114). The fluid mixed in the first passage (114) and its temperature is lowered can remain in the first passage (114) for a longer period of time without flowing into the second opening (112) due to the blocking wall (115), thereby improving cooling efficiency.

[0077] Referring back to FIG. 6, resistance protrusions (116, 117) may be formed on the side surfaces of each of the first walls (113) disposed on the lower surface of the upper plate (11b) according to another embodiment. In one embodiment, a first resistance protrusion (116) protruding in a first direction intersecting the extension direction of the first wall (113) may be formed on one side surface of each of the first walls (113). In one embodiment, a second resistance protrusion (117) protruding in a second direction opposite to the first direction may be formed on the other side surface of each of the first walls (113). The first resistance protrusions (116) and the second resistance protrusions (117) may be alternately arranged on each of the first walls (113).

[0078] According to this structure, when the fluid flows in the first passage (114), the flow speed of the fluid can be reduced due to the resistance caused by the resistance protrusions (116, 117). Accordingly, the cooling efficiency of the cooling device (1) can be improved as the fluid stays in the first passage (114) for a longer period of time.

[0079] Fig. 7 is a top perspective view of a middle plate constituting a main body of a cooling device according to one embodiment. Fig. 8 is a bottom perspective view of a middle plate constituting a main body of a cooling device according to one embodiment.

[0080] Referring to FIGS. 7 and 8, the middle plate (12a) of the main body (10) according to one embodiment may include a third opening (121) formed at one end of the middle plate (12a) and a fourth opening (122) formed at the other end of the middle plate (12a).

[0081] The third opening (121) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21) and the first opening (111) formed in the upper plate (11a or 11b). The third opening (121) may have a shape corresponding to the first circulation section (212) and the first opening (111).

[0082] A first coupling hole (121a) and a second coupling hole (121b) may be formed on both sides of the third opening (121). The first coupling hole (121a) and the second coupling hole (121b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), and the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), respectively.

[0083] The fourth opening (122) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22) and the second opening (112) formed in the upper plate (11a or 11b). The fourth opening (122) may have a shape corresponding to the second circulation section (222) and the second opening (112).

[0084] A first coupling hole (122a) and a second coupling hole (122b) may be formed on both sides of the fourth opening (122). The first coupling hole (122a) and the second coupling hole (122b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), and the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), respectively.

[0085] Referring to Fig. 8, a plurality of second walls (123) arranged at predetermined intervals may be formed on the lower surface of the intermediate plate (12a) according to one embodiment. A second flow path (124), which is a space through which a fluid flows, may be formed between each of the second walls (123). When the intermediate plate (12a) and the lower plate (13) described below are combined, the lower surface of each of the second walls (123) formed on the lower surface of the intermediate plate (12a) may be in contact with the upper surface of the lower plate (13). Each of the second walls (123) and each of the second flow paths (124) may be arranged in a direction crossing the third opening (121) and the fourth opening (122).

[0086] Referring to Fig. 8, a plurality of openings (125) may be formed in each second flow path (124). Each opening (125) may be formed in the second flow path (124) at a predetermined interval. According to this structure, heat exchange occurs as the fluid moving through the second flow path (124) and the fluid moving through the first flow path (114) are mixed with each other, thereby improving the cooling efficiency of the cooling device (1).

[0087] In one embodiment, a greater number of perforations (145) may be formed in the central region (128) of the middle plate (12a) than in the peripheral region. The central region (128) may be formed at a position corresponding to a cooling region (135) formed on the lower surface of the lower plate (13) described below.

[0088] FIG. 9 is a bottom perspective view of a middle plate constituting a main body of a cooling device according to another embodiment.

[0089] Although not shown, the upper surface of the middle plate (12b) of the cooling device (10) according to another embodiment may have the same structure as the upper surface of the middle plate (12a) shown in FIG. 7.

[0090] Referring to FIG. 9, the middle plate (12b) of the cooling device (10) according to another embodiment may include a third opening (121) formed at one end of the middle plate (12a) and a fourth opening (122) formed at the other end of the middle plate (12a).

[0091] The third opening (121) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21) and the first opening (111) formed in the upper plate (11a or 11b). The third opening (121) may have a shape corresponding to the first circulation section (212) and the first opening (111).

[0092] A first coupling hole (121a) and a second coupling hole (121b) may be formed on both sides of the third opening (121). The first coupling hole (121a) and the second coupling hole (121b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), and the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), respectively.

[0093] The fourth opening (122) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22) and the second opening (112) formed in the upper plate (11a or 11b). The fourth opening (122) may have a shape corresponding to the second circulation section (222) and the second opening (112).

[0094] A first coupling hole (122a) and a second coupling hole (122b) may be formed on both sides of the fourth opening (122). The first coupling hole (122a) and the second coupling hole (122b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), and the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), respectively.

[0095] According to another embodiment, a plurality of second walls (123) arranged at predetermined intervals may be formed on the lower surface of the intermediate plate (12b). A second flow path (124), which is a space through which a fluid flows, may be formed between each of the second walls (123). When the intermediate plate (12b) and the lower plate (13) described below are combined, the lower surface of each of the second walls (123) formed on the lower surface of the intermediate plate (12b) may be in contact with the upper surface of the lower plate (13). Each of the second walls (123) and each of the second flow paths (124) may be arranged in a direction crossing the third opening (121) and the fourth opening (122).

[0096] Referring to Fig. 9, a plurality of openings (125) may be formed in each second flow path (124). Each opening (125) may be formed in the second flow path (124) at a predetermined interval. According to this structure, heat exchange occurs as the fluid moving through the second flow path (124) and the fluid moving through the first flow path (114) are mixed with each other, thereby improving the cooling efficiency of the cooling device (1).

[0097] In one embodiment, a greater number of perforations (145) may be formed in the central region (128) of the middle plate (12b) than in the peripheral region. The central region (128) may be formed at a position corresponding to a cooling region (135) formed on the lower surface of the lower plate (13) described below.

[0098] Referring back to FIG. 9, resistance protrusions (126, 127) may be formed on the side surfaces of each of the second walls (123) disposed on the lower surface of the intermediate plate (12b) according to another embodiment. In one embodiment, a third resistance protrusion (126) protruding in a first direction intersecting the extension direction of the second wall (123) may be formed on one side surface of each of the second walls (123). In one embodiment, a fourth resistance protrusion (127) protruding in a second direction opposite to the first direction may be formed on the other side surface of each of the second walls (123). The third resistance protrusions (126) and the fourth resistance protrusions (127) may be alternately arranged on each of the second walls (123).

[0099] According to this structure, when the fluid flows in the second passage (124), the flow speed of the fluid can be reduced due to the resistance caused by the resistance protrusions (126, 127). Accordingly, the cooling efficiency of the cooling device (1) can be improved as the fluid stays in the second passage (124) for a longer period of time.

[0100] In addition, each of the resistance protrusions (126, 127) may be arranged adjacent to each of the holes (125). According to this structure, the fluid flowing in the second flow path (124) can move more quickly to the first flow path (114) through the hole (125) adjacent to the resistance protrusions (126, 127) as it collides with the resistance protrusions (126, 127). Accordingly, the circulation of the fluid through the hole (125) occurs more quickly, and the cooling efficiency of the cooling device (1) can be improved.

[0101] Fig. 10 is a top perspective view of a lower plate constituting a main body of a cooling device according to one embodiment. Fig. 11 is a bottom perspective view of a lower plate constituting a main body of a cooling device according to one embodiment.

[0102] As illustrated in FIGS. 10 and 11, a first coupling hole (131a) and a second coupling hole (131b) may be formed on one side of the lower plate (13). The first coupling hole (131a) and the second coupling hole (131b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), and the first coupling hole (121a) and the second coupling hole (121b) formed in the middle plate (12a or 12b).

[0103] In addition, a first coupling hole (132a) and a second coupling hole (132b) may be formed on the other side of the lower plate (13). The first coupling hole (132a) and the second coupling hole (132b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), and the first coupling hole (122a) and the second coupling hole (122b) formed in the middle plate (12a or 12b).

[0104] Referring to FIG. 11, a cooling area (135) having a flat shape and a plurality of inclined surface portions (135a, 135b, 135c, 135d) extending from the cooling area (135) and formed at the periphery of the cooling area (135) can be formed on the lower surface of the lower plate (13).

[0105] In one embodiment, the cooling device (1) may be placed on a substrate having a flat shape and may be placed so as to be in contact with the upper surface of the semiconductor element to be cooled. At this time, the cooling area (135) formed on the lower surface of the lower plate (13) may be in direct contact with or in close contact with the upper surface of the semiconductor element to be cooled. Accordingly, the semiconductor element in contact with the cooling area (135) may be cooled by a fluid (e.g., a coolant) flowing through the second flow path (124) placed above the cooling area (135).

[0106] Each of the inclined surfaces (135a, 135b, 135c, 135d) may have a predetermined inclination angle so that the angle becomes lower than the cooling area (135) as it moves away from the cooling area (135).

[0107] Figure 12 is a top perspective view of a cooling device according to another embodiment.

[0108] Referring to FIG. 12, a cooling device (2) according to another embodiment may include a main body (10), a fluid supply unit (21) coupled to one side of the upper surface of the main body (10), and a fluid discharge unit (22) coupled to the other side of the upper surface of the main body (10).

[0109] The main body (10) may have a triple layer structure including an upper plate (11a or 11b), a middle plate (12a or 12b), and a lower plate (13) as described above.

[0110] The cooling device (2) may further include a connecting portion (23) that connects the fluid supply portion (21) and the fluid discharge portion (22) and is formed integrally with the fluid supply portion (21) and the fluid discharge portion (22).

[0111] Additionally, the cooling device (2) may include a first holder (41a) and a second holder (41b) that are connected to one end of the fluid supply unit (21) and formed integrally with the fluid supply unit (21). The first holder (41a) and the second holder (41b) may be formed with a first hole (43b) and a second hole (43b), respectively, into which a fixing member (e.g., a bolt) may be inserted.

[0112] Additionally, the cooling device (2) may include a first holder (42a) and a second holder (42b) that are connected to one end of the fluid discharge portion (22) and formed integrally with the fluid discharge portion (22). The first holder (42a) and the second holder (42b) may be formed with a first hole (44b) and a second hole (44b), respectively, into which a fixing member (e.g., a bolt) may be inserted.

[0113] In order to cool a semiconductor element placed on a substrate using a cooling device (2), the cooling area (125, 155) of the cooling device (2) must be in close contact with the upper surface of the semiconductor element. The cooling device (2) can be fixed to the substrate by inserting fixing members (e.g., bolts) into the first hole (43b) and the second hole (43b) formed in the first holder (41a) and the second holder (41b), respectively, the first hole (44b) and the second hole (44b) formed in the first holder (42a) and the second holder (42b), respectively, and the holes of the substrate corresponding to the first hole (43b), the second hole (43b), the first hole (44b), and the second hole (44b). When the cooling device (2) is fixed to the substrate by the fixing members inserted into the first hole (43b), the second hole (43b), the first hole (44b), and the second hole (44b), the pressure applied to the fluid supply portion (21) and the fluid discharge portion (22) can be distributed by the connecting portion (23). Accordingly, a stable connection between the substrate and the cooling device (2) can be ensured, and the cooling area (125, 155) and the upper surface of the semiconductor element can be in better contact.

[0114] Although the present specification has been described with reference to the drawings exemplified above, the present specification is not limited to the embodiments and drawings disclosed herein, and various modifications may be made by those skilled in the art. Furthermore, even if the effects resulting from the configuration of the present specification have not been explicitly described and explained while describing the embodiments of the present specification, the effects predictable by the corresponding configuration should also be acknowledged.

Claims

1. Main body; A fluid supply unit connected to the main body and supplying fluid supplied from a fluid supply device to the main body; and It includes a fluid discharge unit that is connected to the main body and transmits the fluid discharged from the main body to the fluid supply device, The above body top plate; middle plate; and including a lower plate, The above upper plate A plurality of first walls formed on the upper surface of the upper plate; and comprising a plurality of first passages formed between each of the first walls, The above middle plate A plurality of second walls formed on the lower surface of the intermediate plate; and comprising a plurality of second passages formed between each of the first walls, The above lower plate including a cooling area formed on the lower surface of the lower plate; Cooling device.

2. In paragraph 1, The above fluid supply unit an inlet through which the fluid flows; and A first opening formed in the upper plate and a first circulation part communicating with the inlet are included. Cooling device.

3. In paragraph 1, The above fluid discharge section an outlet through which the fluid is discharged; and A second opening formed in the upper plate and a second circulation part communicating with the outlet are included. Cooling device.

4. In paragraph 1, The above upper plate A first opening formed at a position corresponding to the first circulation section formed in the fluid supply section; and It further includes a second opening formed at a position corresponding to the second circulation section formed in the fluid discharge section. Cooling device.

5. In paragraph 1, The above middle plate A third opening formed at a position corresponding to the first opening formed in the upper plate; and Further comprising a fourth opening formed at a position corresponding to the second opening formed in the upper plate. Cooling device.

6. In paragraph 1, The above upper plate Further comprising a blocking wall disposed on one side of the plurality of first euros. Cooling device.

7. In paragraph 6, The above blocking wall The second opening formed in the upper plate and the plurality of first flow paths are arranged between the second opening and the plurality of first flow paths. Cooling device.

8. In paragraph 1, The above upper plate Further comprising a resistance protrusion formed on the side of each first wall body. Cooling device.

9. In paragraph 8, The above resistance protrusion A first resistance protrusion protruding in a first direction intersecting the extension direction of each first wall; and Including a second resistance protrusion protruding in a second direction opposite to the first direction. Cooling device.

10. In paragraph 1, The above middle plate Further comprising one or more openings formed in each second euro. Cooling device.

11. In paragraph 1, The above middle plate Further comprising a resistance protrusion formed on the side of each second wall body. Cooling device.

12. In paragraph 11, The above resistance protrusion A third resistance projection protruding in a first direction intersecting the extension direction of each second wall; and Including a fourth resistance protrusion protruding in a second direction opposite to the first direction. Cooling device.

13. In paragraph 11, The above resistance protrusion Placed adjacent to the opening formed in each second euro Cooling device.

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