Mask, mask manufacturing method, and ITO glass

Using an LDI exposure machine to make masks solves the problems of uneven edges of ITO glass traces and environmental risks, achieving smooth ITO glass traces and reducing production costs.

WO2025015638A1PCT designated stage expired Publication Date: 2025-01-23JIANGMEN YEEBO SEMICON
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Patent Information

Application Number
PCT/CN2023/110734
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-07-14
Filing Date
2023-08-02
Publication Date
2025-01-23

AI Technical Summary

Technical Problem

During the production of existing ITO glass, the film operation results in unsmoothing and environmentally friendly risks. The production cost of chrome plate fixtures is high, making it difficult to reduce production costs.

Method used

An LDI exposure machine is used to make a mask. By coating photoresist on the glass substrate and performing exposure, development and curing processes, a clear pattern texture is formed, which effectively blocks light during the production of ITO glass and avoids uneven trace edges. smooth.

Benefits of technology

The smoothness of the edge of the ITO glass wiring is achieved, avoiding jagged phenomena, while reducing production costs, localization of raw materials, and eliminating environmental protection risks.

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Abstract

The present invention provides a mask, a mask manufacturing method, and an ITO glass. The mask manufacturing method comprises: coating a coating surface of a glass substrate with a photoresist and forming a photoresist layer; carrying out exposure treatment on the coated glass substrate by using an LDI exposure machine; carrying out development treatment on the exposed glass substrate to form pattern texture on the glass substrate; and curing and baking the developed glass substrate to obtain a mask. In the present application, the LDI exposure machine is innovatively used for manufacturing a mask, so that the pattern texture of the mask is clear, and thus light can be effectively blocked in the manufacturing process of the ITO glass, avoiding the unsmooth wiring edge of the ITO glass caused during film operation; moreover, the manufacturing materials of the mask are the glass substrate and the photoresist layer, so that the localization of materials is achieved, the manufacturing costs are low, and the environmental protection risk of a film is eliminated; in addition, the surface of the glass substrate of the mask is plated with ITO, achieving an antistatic function, and is plated with SiO2, achieving high adhesion, wiping resistance, and solvent resistance.
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Description

A mask, a method for manufacturing a mask, and ITO glass Technical Field

[0001] The present invention relates to the technical field of mask production, and in particular to a mask, a method for producing the mask, and ITO glass. Background Art

[0002] The current ITO glass production process requires the use of film or chrome plate jigs to block light in areas where the pattern needs to be retained. However, the ITO glass produced using film has uneven and noticeably jagged edges. Furthermore, film requires imported film raw materials, which poses certain environmental risks. While the ITO glass produced using chrome plate jigs has smooth edges, the production cost of chrome plates is high, hindering production cost reduction.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to provide a mask, a method for manufacturing a mask and ITO glass, aiming to produce a mask that can ensure the quality of ITO glass routing, reduce production costs, achieve localization of raw materials and eliminate environmental risks.

[0005] In order to achieve the above object, the technical solutions of the present invention are:

[0006] The present invention provides a method for manufacturing a mask, comprising:

[0007] S10: coating a photoresist on the coating surface of the glass substrate to form a photoresist layer;

[0008] S20: Expose the coated glass substrate using an LDI exposure machine;

[0009] S30: performing a development process on the exposed glass substrate to form a pattern texture on the glass substrate;

[0010] S40: curing and baking the developed glass substrate to obtain a mask.

[0011] The present application innovatively uses an LDI exposure machine to produce a mask. Due to the high processing precision of the LDI exposure machine, the pattern texture of the mask is clear, thereby effectively blocking light during the production process of the ITO glass, avoiding the uneven edges of the ITO glass caused by the use of film in the prior art. Moreover, the production cost of the mask is low compared to the production cost of the chrome plate jig in the prior art.

[0012] In one embodiment, step S20 includes:

[0013] S210: Import the ITO image file into the LDI exposure machine;

[0014] S220: The LDI exposure machine parses the ITO pattern file, converts the pattern file in the ITO pattern file from a vector format to a scalar format, and performs exposure processing on the glass substrate according to the pattern file in the scalar format, so that the photoresist layer of the glass substrate is divided into an exposed area and an unexposed area.

[0015] In one embodiment, when the LDI exposure machine exposes the coated glass substrate, the exposure light integrated dose is 1700 mj / cm 2 ~2300mj / cm 2 , energy uniformity ≥ 95%, splicing accuracy is 3um, laser head scanning speed is controlled within 300mm / s ~ 500mm / s, line width consistency ±10%; and the environmental control parameters in the LDI exposure machine are set to cleanliness level 1000 or above, temperature is controlled at 20℃ ~ 24℃, and humidity is controlled at 50% ~ 70%.

[0016] In one embodiment, when the LDI exposure machine exposes the coated glass substrate, the laser head scanning position and light product balance of the LDI exposure machine are adjusted so that the light product of the rows exposed on the photoresist layer are close to the same.

[0017] In one embodiment, the adjustment of the scanning position of the laser head of the LDI exposure machine is specifically to adjust the target position parameters of the LDI exposure machine to adjust the distance between two adjacent exposure paths in the travel path of the laser head.

[0018] In one embodiment, the light product balance adjustment of the LDI exposure machine is specifically to adjust the exposure position, dose, exposure time and light compensation of the LDI exposure machine according to the measured light product data of the LDI exposure machine, so that the light product of the LDI exposure machine is controlled within the control standard range.

[0019] In one embodiment, the measured light product data of the LDI exposure machine is specifically obtained by regularly testing a distribution area within the exposure range of the LDI exposure machine using a light product tester;

[0020] Among them, the control standard range is 1700mj / cm 2 ~2300mj / cm 2 .

[0021] In one embodiment, before S10 , the coated surface of the glass substrate is subjected to a protective film coating process; the protective film includes an ITO film and / or a SiO 2 film.

[0022] The present invention provides a mask plate, which is manufactured by adopting the above-mentioned mask plate manufacturing method.

[0023] The present invention provides an ITO glass, which is manufactured using the mask plate described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0025] FIG1 is a schematic diagram of an ITO pattern on an ITO glass produced by film in the prior art;

[0026] FIG2 is a schematic diagram of a mask of the present application;

[0027] FIG3 is a schematic diagram of an ITO pattern on an ITO glass produced using a mask according to the present application;

[0028] FIG4 is a flowchart of the present application;

[0029] FIG5 is a schematic structural diagram of the mask of the present application (the photoresist layer is not shown in the figure). DETAILED DESCRIPTION

[0030] In order to better illustrate the present invention, the present invention is described in further detail below with reference to the accompanying drawings.

[0031] It should be clear that the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the embodiments of the present application.

[0032] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the embodiments of the present application. The singular forms "a," "the," and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0033] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0034] In this application, unless otherwise specified, "plurality" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exists simultaneously, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0035] In the production process of ITO glass in the prior art, a film or chrome plate jig is required to block light in the area where the pattern needs to be retained, so that the corresponding ITO pattern can be formed on the ITO glass. However, the ITO glass obtained by using film processing has uneven edges of the ITO pattern due to the low precision of the film itself, and has obvious jagged edges, as shown in Figure 1. At the same time, the film originally needs to use imported film raw materials, and film has certain environmental risks. The ITO glass obtained by using chrome plate jig processing has smooth edges of the ITO pattern, but the chrome plate needs to use metal chromium as a coating, resulting in high production costs, which is not conducive to reducing production costs.

[0036] In combination with Figures 2 to 5, in order to solve the above-mentioned technical problems, the present application provides a mask and a method for manufacturing a mask. The mask innovatively uses an LDI exposure machine to manufacture the mask. Due to the high processing precision of the LDI exposure machine, the pattern texture of the mask is clear, so that it can effectively block light during the production process of the ITO glass, making the pattern trace edges of the ITO glass smooth and without obvious jagged edges; and the production cost of the mask is the glass substrate and the photoresist layer, and the materials are domestically produced. Compared with the chrome plate jig in the prior art, the production cost of the mask of the present application is low.

[0037] In this application, a large piece of glass is cut into glass substrates of corresponding sizes according to the size requirements of the mask to be produced, and the surface of the glass substrate is cleaned so as to reduce the interference of dust, dirt and other impurities on the production of the light-blocking layer on the glass substrate in subsequent processes.

[0038] The present invention provides a method for manufacturing a mask, comprising:

[0039] S10: coating a photoresist on a coating surface of the glass substrate. The operator selects one side of the glass substrate as the coating surface and coats the photoresist on the coating surface to form a photoresist layer.

[0040] S20: The coated glass substrate is exposed using an LDI exposure machine. Specifically, the operator uses circuit design software to design and process the ITO pattern to obtain an ITO file that can be recognized by the LDI exposure machine. The pattern file can be designed with multiple partitions, each partition having an independent and different ITO pattern. Each partition can also be designed as a unified ITO pattern so that multiple ITO patterns can be light-blocked in one mask. The pattern file can also be designed as a large-area ITO pattern so that the mask can block light for large-scale ITO patterns.

[0041] S210: The operator imports the ITO pattern into the LDI exposure machine, and the LDI exposure machine reads and processes the ITO pattern after receiving it;

[0042] S220: The LDI exposure machine analyzes the ITO pattern file, converting the pattern file in the ITO pattern file from a vector format to a scalar format. This improves the processing accuracy of the LDI exposure machine when exposing the photoresist layer, paving the way for a smooth, aliased ITO pattern trace on the subsequent mask. The LDI exposure machine exposes the glass substrate according to the scalar pattern file, dividing the photoresist layer of the glass substrate into exposed areas and unexposed areas.

[0043] The pattern file divides the ITO pattern into pixel-based images. Each pixel has only a 0 or 1 attribute. Different line widths or spacings can lead to incomplete equality between the two formats during the conversion process, thereby improving the resolution accuracy of the ITO pattern file. It should be noted that pixel-based images represent the minimum resolution of the LDI exposure machine.

[0044] Furthermore, when the LDI exposure machine exposes the coated glass substrate, the exposure light volume is 1700mj / cm 2 ~2300mj / cm 2Energy uniformity ≥ 95%, stitching accuracy 3µm, laser head scanning speed controlled within 300mm / s to 500mm / s, and line width consistency ±10%. The environmental control parameters within the LDI exposure machine are set to cleanliness level 1000 or higher, with temperature controlled between 20°C and 24°C and humidity controlled between 50% and 70%. The temperature variation within the LDI exposure machine must be less than 1°C within 4 hours, and the humidity within the LDI exposure machine must be condensation-free, ensuring that the glass substrate and photoresist remain in optimal condition.

[0045] It should be noted that in the prior art, LDI exposure machines are generally used for PCB circuit board production, and no manufacturer uses LDI exposure machines to produce masks. The applicant combines the glass substrate and photoresist material of this application and uses the LDI exposure machine to expose the photoresist layer using the above-mentioned parameters to ensure the exposure accuracy of the photoresist layer.

[0046] Because the LDI exposure machine's processing path involves exposing from bottom to top, then turning and then exposing from top to bottom, this exposure path results in the appearance of joint marks between rows of the photoresist layer on the glass substrate, causing problems with the appearance of the mask pattern. To address this issue, the LDI exposure machine adjusts the laser head scanning position and light product balance when exposing the coated glass substrate, ensuring that the light product of each row on the photoresist layer is close to the same during exposure, thus avoiding joint marks.

[0047] Specifically, the laser head scanning position adjustment of the LDI exposure machine is specifically to adjust the bull's eye position parameters of the LDI exposure machine to adjust the distance between the two adjacent exposure paths in the travel path of the laser head. Generally speaking, the light product of the light spot generated by the laser head is the highest in the middle position, and the closer the light product is to the edge of the light spot, the lower it will be. The edges of the light spots between the two adjacent exposure paths overlap (that is, the light products of the overlapping areas will be superimposed). Once the light product of the overlapping areas is overexposed, the splicing will be overexposed, that is, the light product exceeds the standard, resulting in differences in the appearance size of the pattern of the mask after molding, and splicing print problems. In this application, when the light product exceeds the standard, the travel path of the laser head is adjusted by the bull's eye position parameters to make the light product of the overlapping area and the light product of the light spots of the two exposure paths approach the same (that is, keep the light product of the overlapping area consistent with the light product of the light spots of the two exposure paths). For example, when the light product exceeds the standard, the light product of the overlapping area can be reduced by increasing the distance between the two adjacent exposure paths.

[0048] Furthermore, the light product balance adjustment of the LDI exposure machine specifically involves adjusting the exposure position, dose, exposure time, and light compensation of the LDI exposure machine based on the measured light product data of the LDI exposure machine, so as to control the light product of the LDI exposure machine within the control standard range. In one embodiment, the measured light product data of the LDI exposure machine specifically involves regularly testing the distribution area within the exposure range of the LDI exposure machine using a light product meter; wherein the control standard range is 1700 mj / cm 2 ~2300mj / cm 2 The present application comprehensively solves the problem of marks at the joints through the above-mentioned methods, thereby making the pattern appearance and size of the final molded mask consistent.

[0049] S30: The exposed glass substrate is developed to form a pattern texture on the glass substrate. Specifically, the operator removes the exposed glass substrate from the LDI exposure machine and uses an alkaline reaction liquid to react with the exposed photoresist on the glass substrate and eliminate the exposed photoresist. The exposed photoresist is eliminated after the reaction with the alkaline reaction liquid, while the unexposed photoresist remains on the coated surface of the glass substrate and cooperates with the disappeared photoresist to form a pattern texture on the glass substrate. The pattern texture is consistent with the ITO pattern.

[0050] S40: Curing and baking the developed glass substrate to obtain a mask. Specifically, S40 involves curing and baking the developed glass substrate at a temperature of 245° C. to 255° C. for 14 to 15 minutes.

[0051] This application innovatively uses an LDI exposure machine to produce a mask. Due to the high processing precision of the LDI exposure machine, the pattern texture of the mask is clear, thereby effectively blocking light during the production process of the ITO glass, avoiding the uneven edges of the ITO glass caused by the use of film in the prior art; and the production cost of the mask is low compared to the production cost of the chrome plate jig in the prior art.

[0052] To improve the performance of the mask of this application, the coated surface of the glass substrate 1 is coated with a protective film prior to step S10; the protective film includes an ITO film and / or a SiO2 film. Specifically, the SiO2 film is plated on the coated surface of the glass substrate 1 to form a SiO2 layer 2, which is used to impart high adhesion, scratch resistance, and solvent resistance to the coated surface of the mask. The ITO film is then plated on the SiO2 layer 2 to form an ITO layer 3, which is used to impart antistatic properties to the mask.

[0053] In addition, in other embodiments, the glass substrate of the present application can be coated with a SiO2 film or an ITO film as needed, so that the mask plate produced by the process of the present application has high adhesion, wipe resistance and solvent resistance, or has anti-static function.

[0054] The present invention provides a mask, which is manufactured using the above-mentioned mask manufacturing method. As shown in FIG2 , the mask has multiple partitions and can perform light-blocking processing on multiple ITO patterns.

[0055] The present invention provides an ITO glass, which is made by using the mask plate as described above. As shown in FIG2 , the ITO glass has smooth lines without jagged edges, thereby improving the quality of the ITO glass.

[0056] In the description of the present invention, it should be understood that the terms "vertical", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the protection content of the present invention.

[0057] If words such as "first" and "second" are used in this document to limit components, those skilled in the art should know that the use of "first" and "second" is only for the convenience of describing the present invention and simplifying the description. Unless otherwise stated, the above words have no special meaning.

[0058] The present invention is not limited to the above-mentioned embodiments. If various changes or modifications of the present invention do not depart from the spirit and scope of the present invention, and if these changes and modifications fall within the scope of the claims of the present invention and equivalent technologies, the present invention is also intended to include these changes and modifications.

Claims

1. A method for making a mask, characterized in that: include: S10: coating a photoresist on a coating surface of the glass substrate to form a photoresist layer; S20: using an LDI exposure machine to expose the coated glass substrate; S30: performing a developing process on the exposed glass substrate to form a pattern texture on the glass substrate; S40: curing and baking the developed glass substrate to obtain a mask.

2. The method for making a mask according to claim 1, characterized in that: The S20 includes: S210: Import the ITO image file into the LDI exposure machine; S220: The LDI exposure machine parses the ITO image file, converts the pattern file in the ITO image file from a vector format to a scalar format, and performs exposure processing on the glass substrate according to the pattern file in the scalar format, so that the photoresist layer of the glass substrate is divided into an exposed area and an unexposed area.

3. The method for making a mask according to claim 1, characterized in that: When the LDI exposure machine exposes the coated glass substrate, the exposure light volume is 1700mj / cm 2 ~2300mj / cm 2 , energy uniformity ≥ 95%, stitching accuracy is 3um, laser head scanning speed is controlled within 300mm / s ~ 500mm / s, line width consistency ±10%; and the environmental control parameters in the LDI exposure machine are set to cleanliness level 1000 or above, temperature is controlled at 20℃ ~ 24℃, and humidity is controlled at 50% ~ 70%.

4. The method for making a mask according to claim 1, characterized in that: When the LDI exposure machine is performing exposure processing on the coated glass substrate, the scanning position of the laser head of the LDI exposure machine and the light product balance are adjusted so that the light product of the upper and lower rows of the photoresist layer when exposed are close to each other.

5. The method for making a mask according to claim 4, characterized in that: The laser head scanning position adjustment of the LDI exposure machine specifically involves adjusting the bull's eye position parameters of the LDI exposure machine to adjust the distance between two adjacent exposure paths in the walking path of the laser head.

6. The method for making a mask according to claim 4, characterized in that: The light product balance adjustment of the LDI exposure machine is specifically to adjust the exposure position, dosage, exposure time and light compensation of the LDI exposure machine according to the measured light product data of the LDI exposure machine, so that the light product of the LDI exposure machine is controlled within the control standard range.

7. The method for making a mask according to claim 6, characterized in that: The measured light product data of the LDI exposure machine is specifically obtained by regularly testing the distribution area within the exposure range of the LDI exposure machine using a light product tester; Among them, the control standard range is 1700mj / cm 2 ~2300mj / cm 2 .

8. The method for making a mask according to claim 1, characterized in that: Before S10, the coated surface of the glass substrate is subjected to a protective film coating process; The protective film includes an ITO film and / or a SiO2 film.

9. A mask, characterized in that: The mask is manufactured by the method for manufacturing a mask as described in any one of claims 1 to 8.

10. An ITO glass, characterized in that: The method is manufactured using the mask plate as claimed in claim 9.

Citation Information

Patent Citations

  • Direct-writing photoetching machine splicing method

    CN110531590A

  • Preparation method of high-precision circuit of rigid-flex printed circuit board

    CN113260178A

  • Shell, preparation method thereof and electronic equipment

    CN113692157A

  • Mask plate for exposure and mask plate group

    CN209149063U