Probe card

Abstract

[Problem] The purpose of the present invention is to improve heat dissipation efficiency when discharging heat of a probe to the outside of a guide unit. [Solution] The present invention includes: a plurality of probes 6; an upper guide plate 31a having a plurality of first through-holes 41 for guiding needle base parts 61 of the probes 6; a lower guide plate 31b having a plurality of second through-holes 42 for guiding needle tip parts 62 of the probes 6, placed opposite to the upper guide plate 31a, and forming a buckling chamber 33 for allowing the probes 6 to buckle between the upper guide plate 31a and the lower guide plate 31b; and a plurality of mutually slidable sliding members 5 each having a plurality of third through-holes 43 through which each probe 6 penetrates, and stacked in the buckling chamber 33.

Description

probe card

[0001] The present invention relates to a probe card, and more particularly to an improvement in a probe card having an upper guide plate and a lower guide plate for guiding a probe.

[0002] A probe card is a testing device used to test the electrical characteristics of semiconductor devices formed on a semiconductor wafer, and is equipped with a large number of probes that are brought into contact with electrode pads on the semiconductor wafer. The probe card has an upper guide plate that guides the bases of the probes and a lower guide plate that guides the tips of the probes. During testing, the electrode pads are pressed against the tips of the probes, and the probes buckle and deform between the upper and lower guide plates due to the needle pressure they receive from the electrode pads, ensuring electrical continuity between the probes and the electrode pads.

[0003] During testing, an electrical signal flows through the probe, generating heat. As the temperature of the probe rises, its resistance increases and its capacitance decreases. This results in a problem of reduced testing accuracy, so it is necessary to improve the probe's heat dissipation characteristics.

[0004] Probe cards equipped with a cooling structure for cooling probes have been proposed (for example, Patent Document 1). The probe card described in Patent Document 1 includes a cooling structure in a space between an upper guide plate that guides the base of the probe and a lower guide plate that guides the tip of the probe. The cooling structure is a structure with a flow path for a cooling medium, and an example of the cooling structure is a laminate formed by joining multiple thin metal plates. Another example is shown in which a gel-like deformation-permitting material is filled between the upper and lower guide plates.

[0005] However, when such a cooling structure is used, there is a problem that the conductivity between the probe and the electrode pad is reduced. A vertical probe ensures sufficient needle pressure and conductivity with the electrode pad by deforming the probe. Therefore, adopting a cooling structure with a cooling medium flow path hinders the deformation of the probe, making it difficult to ensure sufficient conductivity.

[0006] JP 2013-088257 A

[0007] The present invention has been made in view of the above circumstances, and aims to improve the heat dissipation efficiency of the probe, particularly to improve the heat dissipation characteristics of the probe card without hindering the buckling deformation of the probe during testing.

[0008] A probe card according to a first embodiment of the present invention comprises a plurality of probes, an upper guide plate having a plurality of first through holes for guiding the base portions of the probes, a lower guide plate having a plurality of second through holes for guiding the tip portions of the probes and arranged opposite the upper guide plate, forming a buckling chamber between the upper guide plate and the probes for buckling, and a plurality of sliding members each having a plurality of third through holes through which the probes pass, stacked within the buckling chamber, and able to slide freely against each other.

[0009] By adopting such a configuration, the sliding member slides in response to the buckling deformation of the probe. Therefore, the probe can be brought into contact with the sliding member during testing without hindering the buckling deformation of the probe. Therefore, heat from the probe can be conducted to the sliding member and further dissipated to the outside of the buckling chamber via the upper guide plate or the lower guide plate. This improves the heat dissipation efficiency of the guide unit.

[0010] In addition to the above configuration, the probe card according to the second embodiment of the present invention is configured so that the thermal conductivity of the sliding member is 3.32 W / m·k or more. By adopting such a configuration, the heat dissipation efficiency of the guide unit can be improved.

[0011] In addition to the above configuration, the probe card according to the third embodiment of the present invention is configured so that the coefficient of friction of the sliding member is less than 0.11. By adopting such a configuration, it is possible to stack a plurality of sliding members so that they can slide freely, and it is possible to prevent the sliding members from interfering with buckling deformation.

[0012] In addition to the above configuration, the probe card according to the fourth embodiment of the present invention is configured so that the plurality of sliding members have the same shape. By adopting such a configuration, it is not necessary to prepare sliding members with different shapes, and manufacturing costs can be reduced.

[0013] In addition to the above configuration, the probe card according to a fifth embodiment of the present invention is configured so that the thickness of the sliding member arranged near the vertical center of the buckling chamber is thinner than the thickness of the sliding member arranged adjacent to the upper guide plate or the lower guide plate.

[0014] By adopting such a configuration, the thickness of the sliding member can be made thinner near the vertical center of the buckling chamber where the buckling deformation of the probe is greatest, thereby improving the ability of the sliding member to follow the buckling deformation of the probe and preventing the sliding member from interfering with the buckling deformation of the probe.

[0015] In addition to the above configuration, a probe card according to a sixth embodiment of the present invention is configured to have an intermediate guide plate having a plurality of fourth through holes for guiding the probes and arranged between the upper guide plate and the lower guide plate, the fourth through holes being larger than the first through holes and the second through holes, the buckling chamber being divided into an upper buckling chamber and a lower buckling chamber by the intermediate guide plate, and a plurality of the sliding members being arranged in the upper buckling chamber and the lower buckling chamber, respectively.

[0016] By adopting this configuration, heat from the sliding member can be discharged to the outside of the buckling chamber through the intermediate guide plate, improving the heat dissipation efficiency of the guide unit. Also, by making the fourth through hole larger than the first and second through holes, it is possible to prevent the intermediate guide plate from interfering with the buckling deformation of the probe.

[0017] In addition to the above configuration, the probe card according to a seventh embodiment of the present invention is configured so that the sliding member arranged near the vertical center of the buckling chamber has a larger third through hole than the sliding member arranged adjacent to the upper guide plate or the lower guide plate.

[0018] By adopting such a configuration, the third through hole can be made larger near the vertical center of the buckling chamber where the buckling deformation of the probe is greatest, thereby preventing the sliding member from interfering with the buckling deformation of the probe.

[0019] The present invention aims to improve the efficiency of heat dissipation from probes, and in particular to improve the heat dissipation characteristics of a probe card without hindering the buckling deformation of the probes during testing.

[0020] FIG. 1 is a diagram showing an example of the configuration of a probe card 100 according to a first embodiment of the present invention. FIG. 2 is a diagram showing a state during inspection of the probe card 100 of FIG. 1. FIG. 3 is a diagram showing a state during assembly of a guide unit 3. FIG. 4 is a diagram showing an example of the configuration of a probe card 101 according to a second embodiment of the present invention. FIG. 5 is a diagram showing an example of the configuration of a probe card 102 according to a third embodiment of the present invention. FIG. 6 is a diagram showing an example of the configuration of a probe card 103 according to a fourth embodiment of the present invention.

[0021] 1 is a diagram showing an example of the configuration of a probe card 100 according to a first embodiment of the present invention, and is a cross-sectional view of the horizontally installed probe card 100 cut along a vertical plane. The probe card 100 includes a sliding member 5 for efficiently dissipating heat from the probes 6 to the outside of the guide unit 3.

[0022] The probe card 100 is attached to a card holder 21 so that the installation surface of the probes 6 faces the semiconductor wafer 200 on the stage 20, and by moving the stage 20 up and down, the tips of the probes 6 can be brought into contact with the electrode pads 201 on the semiconductor wafer 200. The probe card 100 includes a main substrate 10, a reinforcing plate 11, a guide unit 3, a plurality of sliding members 5, and a plurality of probes 6.

[0023] (1) Main Board 10, Reinforcing Plate 11 The main board 10 is a wiring board that can be detachably attached to a wafer prober, and is, for example, a disk-shaped glass epoxy board. The main board 10 is positioned horizontally, with the outer periphery of its lower surface supported by a card holder 21 of the wafer prober. A reinforcing plate 11 is attached to the center of the upper surface of the main board 10 to suppress distortion of the main board 10, and multiple external terminals 10e are provided on the outer periphery of the upper surface to which signal terminals of a tester device (not shown) are connected. In addition, probe electrodes 10p for connecting probes 6 are provided in the center of the lower surface of the main board 10.

[0024] (2) Guide Unit 3 The guide unit 3 is a probe support member that positions the probe 6 in a horizontal plane. The probe 6 is supported by the guide unit 3 so that its tip can move up and down, and is in elastic contact with the electrode pad 201. The guide unit 3 includes an upper guide plate 31a and a lower guide plate 31b that are arranged parallel to the main substrate 10, and a guide spacer 32 that is arranged between the upper guide plate 31a and the lower guide plate 31b, and is attached to the underside of the main substrate 10 by a guide unit attachment portion 12. Furthermore, a plurality of sliding members 5 are slidably stacked within a buckling chamber 33 of the guide unit 3.

[0025] The upper guide plate 31a is a guide plate that guides the needle base 61 of the probe 6, and is disposed downwardly away from the main board 10 via the guide unit mounting portion 12, facing the main board 10. The upper guide plate 31a is made of an insulating plate-like member, such as a ceramic plate, in which a plurality of first through holes 41 are formed. The first through holes 41 are holes that penetrate the upper guide plate 31a in the thickness direction, and the probes 6 are inserted through them. The needle base 61 is disposed within the first through hole 41, and the position of the needle base 61 in the horizontal plane is determined by the first through hole 41.

[0026] The lower guide plate 31b is a guide plate that guides the needle tip 62 of the probe 6, and is disposed facing the upper guide plate 31a, further downwardly spaced from the upper guide plate 31a via the guide spacer 32. The lower guide plate 31b is made of an insulating plate-like member, such as a ceramic plate, having a plurality of second through holes 42 formed therein. The second through holes 42 are holes that penetrate the lower guide plate 31b in the thickness direction, and the probe 6 is inserted therethrough, with the needle tip 62 disposed within the second through hole 42. The needle tip 62 is supported by the second through holes 42 so as to be vertically movable, and its position in the horizontal plane is determined.

[0027] The guide spacer 32 is a spacer interposed between the upper guide plate 31 a and the lower guide plate 31 b , and the upper guide plate 31 a and the lower guide plate 31 b are arranged to face each other at a predetermined distance, thereby forming a buckling chamber 33 .

[0028] The buckling chamber 33 is a space where the probe 6 undergoes buckling deformation due to overdrive during testing, and is formed as a space sandwiched between the upper guide plate 31 a and the lower guide plate 31 b. A plurality of sliding members 5 are stacked and arranged in the buckling chamber 33, and a plurality of probes 6 are arranged to penetrate the sliding members 5.

[0029] (3) Sliding Member 5 The sliding member 5 is an insulating plate-like member that dissipates heat from the probe 6 to the outside of the buckling chamber 33 and is disposed opposite the upper guide plate 31a and the lower guide plate 31b. Within the buckling chamber 33, a plurality of sliding members 5 having the same shape are stacked with their main surfaces facing each other. Each sliding member 5 is also formed with a plurality of third through holes 43. The third through holes 43 are holes that penetrate the sliding member 5 in the thickness direction, and the probe 6 is inserted through each of the third through holes 43. The probe 6 is sequentially inserted through the third through holes 43 of the plurality of sliding members 5 arranged in a stack within the buckling chamber 33, penetrating these sliding members 5. The first to third through holes 41 to 43 may be configured to have, for example, circular cross sections of the same diameter.

[0030] The sliding members 5 are stacked so as to be able to slide freely, and their main surfaces have a shape smaller than the horizontal cross section of the buckling chamber 33. Therefore, they move within the horizontal plane in response to deformation of the probe 6 during inspection. The sliding members 5 are thinner than the upper guide plate 31a or the lower guide plate 31b, and a flexible thin film, for example, a sheet-like or film-like member, can be used.

[0031] By forming the sliding members 5 using a material with a small coefficient of friction, friction between the sliding members 5 during horizontal movement can be reduced, and the sliding members 5 can be arranged to slide freely. The sliding members 5 are desirably formed using a material with a coefficient of friction of less than 0.11, and for example, polyimide resin can be used.

[0032] Furthermore, by forming the sliding member 5 using a material with good thermal conductivity, it is possible to improve the efficiency of exhausting heat from the buckling chamber 33. For the sliding member 5, a material with a thermal conductivity of 3.32 W / m·K or more, for example, a fluororesin filled with a thermally conductive filler, can be used.

[0033] Furthermore, by forming the sliding member 5 using an insulating material, the horizontal cross section of the probe 6 can be surrounded by an insulating substance, thereby improving the high frequency characteristics of the probe 6 compared to the conventional configuration in which adjacent probes 6 are separated only by air. In particular, by forming the sliding member 5 using a dielectric material having a desired dielectric constant, optimal high frequency characteristics can be obtained.

[0034] (4) Probe 6 The probe 6 is a vertical probe that extends in a direction intersecting the main substrate 10 and undergoes buckling deformation due to overdrive during testing. The probe 6 is made of a conductive material having an elongated shape, with its upper end connected to the probe electrode 10p and its lower end contacting an electrode pad 201 on the test object. The probe 6 is also inserted through the first to third through holes 41 to 43. The probe 6 is made of a metal material with good elasticity and conductivity, such as a nickel (Ni) alloy or a palladium (Pd) alloy.

[0035] The probe 6 is divided into a needle base portion 61 on the main board side, a needle tip portion 62 on the electrode pad side, and a deformation portion 63 sandwiched between the needle base portion 61 and the needle tip portion 62, and the needle base portion 61 is provided with a locking portion 64 to prevent it from falling off.

[0036] The probe 6 undergoes buckling deformation due to stress (needle pressure) received from the electrode pad 201 during testing. Due to the buckling deformation of the probe 6 within the buckling chamber 33, the tip of the probe 6 moves up and down depending on the amount of overdrive, allowing the probe 6 to elastically contact the electrode pad 201. In other words, the buckling deformation of the probe 6 allows the probe 6 to contact the electrode pad 201 with a predetermined needle pressure, ensuring conductivity.

[0037] The first through-holes 41 and second through-holes 42 through which the same probe 6 is inserted are arranged offset from each other by the same distance in the same direction (offset direction D) in the horizontal plane, and all of the probes 6 are gently bent in the same direction when not in inspection. Therefore, during inspection, all of the probes 6 are buckled and deformed in the offset direction D in the horizontal plane.

[0038] 2 is a diagram showing the state during testing of the probe card 100 of FIG. 2. The figure shows the state during overdrive in which the stage 20 is raised from the state in FIG. 1 to bring the electrode pads 201 into contact with the probes 6, and then the stage 20 is further raised to buckle and deform the probes 6.

[0039] When the probe 6 comes into contact with the electrode pad 201, the stress received from the electrode pad 201 causes the tip to rise and undergoes buckling deformation within the buckling chamber 33. Due to the buckling deformation of the probe 6, the side surface of the probe 6 abuts against the inner surface of the third through-hole 43, and the sliding member 5 is pushed by the probe 6 and moves horizontally.

[0040] At this time, all of the probes 6 buckle in the same direction, that is, in the offset direction D. On the other hand, the sliding member 5 has a shape in which the length in the offset direction D is smaller than that of the buckling chamber 33, is movable in the offset direction D, and is stacked slidably within the buckling chamber 33. Therefore, the sliding member 5 can move in response to the buckling deformation of the probes 6, and is unlikely to interfere with the buckling deformation of the probes 6.

[0041] During testing, the probe 6 is buckled and deformed and in contact with the sliding member 5, so that heat generated in the probe 6 is easily conducted to the sliding member 5, and the heat of the probe 6 can be efficiently discharged outside the buckling chamber 33. The heat conducted from the probe 6 to the sliding member 5 is further conducted to the guide unit 3, and is released from the guide unit 3 into the atmosphere, or is further conducted to the main board 10. For example, the heat is conducted between adjacent sliding members 5 and conducted to the upper guide plate 31a or the lower guide plate 31b. The conducted heat of the lower guide plate 31b is conducted to the main board 10 via the guide spacer 32 and the guide unit mounting portion 12.

[0042] Furthermore, by inserting the probes 6 into the third through holes 43 of the sliding member 5, the distance between adjacent probes 6 in the buckling chamber 33 can be maintained even during buckling deformation. Therefore, contact between adjacent probes 6 can be prevented.

[0043] Furthermore, by forming the sliding member 5 using a dielectric, it is possible to improve high-frequency characteristics. When a high-frequency signal is transmitted to probes 6 arranged at a narrow pitch via an air gap, an impedance mismatch occurs. By placing sliding members 5 with a predetermined dielectric constant between such probes 6, it is possible to match the impedance and improve high-frequency characteristics.

[0044] By arranging more sliding members 5 so as to increase the total volume inside the buckling chamber 33, it is possible to further improve the heat dissipation efficiency of the probe 6 and also to further improve the high frequency characteristics. However, in order to enable the sliding members 5 to move smoothly, the total thickness of the sliding members 5 needs to be smaller than the distance between the upper guide plate 31 a and the lower guide plate 31 b.

[0045] 3A to 3D are diagrams showing the state of assembling the guide unit 3, and show the method of inserting the probe 6 into the first to third through holes 41 to 43 in chronological order.

[0046] 3A shows how the guide plates 31 a, 31 b and the sliding member 5 are positioned using the positioning pin 7 in order to insert the probe 6. The positioning pin 7 is a pin that extends linearly, and by inserting it into the positioning through-hole 45, the guide plates 31 a, 31 b and the sliding member 5 are positioned.

[0047] The positioning through holes 45 are through holes that penetrate the guide plates 31a, 31b and the sliding member 5 in the thickness direction. A plurality of positioning through holes 45 are provided in each of the guide plates 31a, 31b and the sliding member 5. If the guide plates 31a, 31b and the sliding member 5 are arranged so that the positioning through holes 45 are aligned, the first to third through holes 41 to 43 also become aligned. Therefore, if the positioning pin 7 is inserted into the positioning through hole 45, the first to third through holes 41 to 43 will be aligned in a straight line, allowing the probe 6 to be inserted therethrough.

[0048] 3(b) shows how the probe 6 is being inserted. The linear probe 6 is inserted into the linearly aligned first to third through-holes 41 to 43. The probe 6 is inserted from the upper guide plate 31a side, and the locking portion 64 abuts against the upper surface of the upper guide plate 31a, locking the probe 6 to prevent it from falling off.

[0049] 3(c) and (d) show how the first and second through holes 41, 42 are offset. The first and second through holes 41, 42 can be offset by removing the positioning pin 7 from the positioning through hole 45 and horizontally moving the lower guide plate 31b in the offset direction D. By offsetting the first and second through holes 41, 42, the probe 6 is deformed, and the sliding member 5 moves in response to this deformation. The guide unit 3 assembled in this manner is attached to the main substrate 10 to obtain the probe card 100 shown in FIG. 1.

[0050] The probe card 100 according to this embodiment includes a plurality of probes 6, an upper guide plate 31a that guides needle base portions 61 of the probes 6, a lower guide plate 31b that guides needle tip portions 62 of the probes 6, and a plurality of sliding members 5. A buckling chamber 33 for buckling the probes 6 is formed between the upper guide plate 31a and the lower guide plate 31b, and the sliding members 5 are stacked in the buckling chamber 33 and are slidable relative to each other.

[0051] By adopting such a configuration, heat from the probe 6 can be efficiently dissipated via the sliding member 5. Also, contact between adjacent probes 6 during buckling can be prevented. Furthermore, the high frequency characteristics of the probe 6 can be improved.

[0052] Embodiment 2 In the first embodiment, an example was described in which the plurality of sliding members 5 have the same shape. In contrast, in the present embodiment, a case in which the plurality of sliding members 5 have different thicknesses will be described.

[0053] FIG. 4 is a diagram showing an example of the configuration of a probe card 101 according to embodiment 2 of the present invention. As with FIGS. 1 and 2, (a) in the diagram shows the state before testing, and (b) shows the state during testing.

[0054] 1 and 2 (Embodiment 1), the probe card 101 differs in that the thicknesses of the plurality of sliding members 5 are not the same. In the probe card 100, all of the sliding members 5 have the same shape, so there is no need to prepare sliding members 5 with different shapes, which reduces manufacturing costs. In contrast, in the probe card 101, the sliding members 5 arranged near the center of the buckling chamber 33 in the vertical direction are made thinner, which makes the sliding members 5 more likely to move and improves the ability of the sliding members 5 to follow deformation of the probes 6.

[0055] The sliding members 5 are stacked so that the thickness thereof is inversely proportional to the distance from the upper guide plate 31a or the lower guide plate 31b. That is, the sliding members 5 adjacent to the upper guide plate 31a or the lower guide plate 31b are the thickest, and are the thinnest near the center of the buckling chamber 33 in the height direction. The sliding members 5 may have two or more different thicknesses. Note that the main surfaces of the multiple sliding members 5 have the same shape.

[0056] The buckling deformation of the probe 6 during testing is greatest near the vertical center of the buckling chamber 33. Therefore, by reducing the thickness of the sliding member 5 near the vertical center of the buckling chamber 33, the sliding member 5 can be made to better follow the deformed portion 63 of the probe 6 that has undergone significant buckling deformation, thereby increasing the contact area between the probe 6 and the sliding member 5 and improving thermal conductivity.

[0057] Embodiment 3 In the above embodiment, an example was described in which the guide unit 3 does not have an intermediate guide plate. In contrast, in this embodiment, a case in which the guide unit 3 has an intermediate guide plate 31c will be described.

[0058] 5A and 5B are diagrams showing an example of the configuration of a probe card 102 according to a third embodiment of the present invention, in which (a) shows the state before testing and (b) shows the state during testing. The probe card 102 differs from the probe card 100 (first embodiment) of FIG. 1 in that the guide unit 3 has an intermediate guide plate 31c.

[0059] The intermediate guide plate 31c is a guide plate that guides the deformation portion 63 of the probe 6 and is disposed between the upper guide plate 31a and the lower guide plate 31b. The intermediate guide plate 31c is disposed downwardly away from the upper guide plate 31a via an upper guide spacer 32a and faces the upper guide plate 31a. The lower guide plate 31b is disposed downwardly away from the intermediate guide plate 31c via a lower guide spacer 32b and faces the intermediate guide plate 31c. In other words, the intermediate guide plate 31c divides the buckling chamber 33 into an upper buckling chamber 33a and a lower buckling chamber 33b.

[0060] The intermediate guide plate 31c is made of an insulating plate-like member, such as a ceramic plate, having a plurality of fourth through holes 44 formed therein. The fourth through holes 44 are holes that penetrate the intermediate guide plate 31c in the thickness direction, and the probes 6 are inserted therethrough. The deformation portions 63 of the probes 6 are disposed within the fourth through holes 44. The fourth through holes 44 have a shape that does not hinder buckling deformation of the probes 6. For example, the cross section of the fourth through holes 44 may be elongated in the offset direction D, and the length in the offset direction D may be equal to or greater than the maximum displacement of the probes 6 at the installation height of the intermediate guide plate 31c, while the width in the direction intersecting the offset direction D may be the same as that of the first and second through holes 41, 42.

[0061] A plurality of sliding members 5 are slidably stacked in the upper buckling chamber 33a. Similarly, a plurality of sliding members 5 are slidably stacked in the lower buckling chamber 33b. Heat conducted from the probe 6 to these sliding members 5 is discharged via the upper guide plate 31a and the lower guide plate 31b, and can also be discharged via the intermediate guide plate 31c. The heat conducted by the sliding members 5 in the upper buckling chamber 33a is conducted to the main board 10 via the upper guide spacer 32a and the upper guide plate 31a. Therefore, heat discharge efficiency can be improved compared to when the intermediate guide plate 31c is not provided.

[0062] Fourth Embodiment In the above-described embodiment, an example was described in which the plurality of sliding members 5 have the same shape. In contrast, in the present embodiment, a case in which the third through holes 43 have different sizes will be described.

[0063] 6 is a diagram showing an example of the configuration of a probe card 103 according to a fourth embodiment of the present invention, in which (a) shows the state before testing and (b) shows the state during testing. The probe card 103 differs from the probe card 100 (first embodiment) of FIGS. 1 and 2 in that the sizes of the third through holes 43 are not the same. In the probe card 103, by making the sizes of the third through holes 43 different, the sliding member 5 is prevented from interfering with the buckling deformation of the probes 6.

[0064] The cross section of the third through hole 43 of the sliding member 5 increases in inverse proportion to the distance from the upper guide plate 31a or the lower guide plate 31b. That is, the cross section of the third through hole 43 of the sliding member 5 adjacent to the upper guide plate 31a or the lower guide plate 31b is smallest, and the cross section of the third through hole 43 of the sliding member 5 arranged near the center in the height direction of the buckling chamber 33 is largest. The third through holes 43 may have two or more different sizes. Note that the sizes of the third through holes 43 formed in the same sliding member 5 are the same.

[0065] The buckling deformation of the probe 6 during inspection is greatest near the center in the vertical direction of the buckling chamber 33. Therefore, by increasing the cross-sectional area of ​​the third through hole 43 of the sliding member 5 arranged near the center in the vertical direction of the buckling chamber 33, the sliding member 5 becomes less likely to hinder the buckling deformation during inspection.

[0066] 100 to 103 Probe card 10 Main substrate 10e External terminal 10p Probe electrode 11 Reinforcing plate 12 Guide unit mounting portion 3 Guide unit 31a Upper guide plate 31b Lower guide plate 31c Intermediate guide plate 32 Guide spacer 32a Upper guide spacer 32b Lower guide spacer 33 Buckling chamber 33a Upper buckling chamber 33b Lower buckling chamber 41 First through hole 42 Second through hole 43 Third through hole 44 Fourth through hole 45 Positioning through hole 5 Sliding member 6 Probe 61 Probe base portion 62 Probe tip portion 63 Deformation portion 64 Locking portion 7 Positioning pin D Offset direction

Claims

1. A probe card comprising: a plurality of probes; an upper guide plate having a plurality of first through holes for guiding the base portions of the probes; a lower guide plate having a plurality of second through holes for guiding the tip portions of the probes, arranged opposite the upper guide plate and forming a buckling chamber between the upper guide plate for the probes to buckle; and a plurality of sliding members each having a plurality of third through holes through which the probes pass, stacked within the buckling chamber, and capable of sliding relative to each other.

2. The probe card according to claim 1, wherein the thermal conductivity of said sliding member is 3.32 W / m·k or more.

3. The probe card according to claim 1, wherein the friction coefficient of said sliding member is less than 0.

11.

4. The probe card according to any one of claims 1 to 3, wherein the plurality of sliding members have the same shape.

5. A probe card as described in any one of claims 1 to 3, characterized in that the thickness of the sliding member arranged near the vertical center of the buckling chamber is thinner than the thickness of the sliding member arranged adjacent to the upper guide plate or the lower guide plate.

6. A probe card as described in any one of claims 1 to 3, characterized in that it comprises an intermediate guide plate having a plurality of fourth through holes for guiding the probes and disposed between the upper guide plate and the lower guide plate, the fourth through holes being larger than the first through holes and the second through holes, the buckling chamber being divided into an upper buckling chamber and a lower buckling chamber by the intermediate guide plate, and a plurality of the sliding members being disposed within the upper buckling chamber and the lower buckling chamber, respectively.

7. A probe card as described in any one of claims 1 to 3, characterized in that the sliding member arranged near the vertical center of the buckling chamber has a third through hole larger than that of the sliding member arranged adjacent to the upper guide plate or the lower guide plate.

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