Sensor module, assembly, method for operating a sensor module and wearable device

Abstract

The sensor module (1) comprises an optical sensor element (2) and an evaluation circuit (3). The optical sensor element (2) comprises at least one optical emitter (21) and at least one optical receiver (22). The optical sensor element (2) is configured to contactless communicate with an optical interface (110) of an electronic device (100). The optical sensor element (2) is further configured to optically detect at least one sensing parameter. The evaluation circuit (3) is electrically connected to the optical sensor element (2) and is configured to determine the at least one sensing parameter. For example, the at least one optical emitter (21) is a micro-LED or any optoelectronic emitter.

Description

[0001] Description

[0002] SENSOR MODULE , ASSEMBLY, METHOD FOR OPERATING A SENSOR MODULE

[0003] AND WEARABLE DEVICE

[0004] A sensor module , an assembly, a method for operating a sensor module and a wearable device are speci fied .

[0005] One obj ect to be achieved is , inter alia, to speci fy an improved sensor module . Other obj ects to be achieved are , inter alia, to speci fy an assembly comprising such a sensor module , to speci fy a method for operating such a sensor module and to speci fy a wearable device comprising such a sensor module .

[0006] These obj ects are achieved, inter alia, by a sensor module comprising the features of independent claim 1 , by an assembly comprising the features of claim 10 , by a method comprising the features of claim 15 and by a wearable device comprising the features of claim 16 . Advantageous embodiments and further developments are the sub ect-matter of the respective dependent patent claims .

[0007] According to at least one embodiment , the sensor module comprises an optical sensor element and an evaluation circuit . The optical sensor element comprises at least one optical emitter and at least one optical receiver . In particular, i f here and in the following reference is made the "optical emitter" and the "optical receiver" it is understood that these terms are synonym to the "at least one optical emitter" and the "at least one optical receiver" , respectively . That is , features with respect to the optical emitter and / or the optical receiver may also include or apply to a plurality of optical emitters and / or optical receivers respectively, i f not indicated otherwise .

[0008] Preferably, the optical emitter and the optical receiver are optoelectronic semiconductor components . For example , each of the optical emitter and the optic receiver comprises an optoelectronic semiconductor chip configured for emitting or receiving electromagnetic radiation, respectively . In particular, electromagnetic radiation is generated, respectively received, in an active zone of the optoelectronic semiconductor chip of each of the emitter and receiver during intended operation . For example , each of the semiconductor chips comprises a semiconductor layer sequence . For example , the semiconductor layer sequence is based on an I I I-V compound semiconductor material or a silicon material system or the like . For example , the optical emitter comprises a semiconductor chip based on an I I I-V compound semiconductor material and the optical receiver comprises a semiconductor chip based on a silicon material system or vice versa . It is also possible that both the emitter and the receiver each comprise a semiconductor chip based on an I I I-V compound semiconductor material or a silicon material system .

[0009] It is possible that electromagnetic radiation in the infrared or visible wavelength range of the electromagnetic spectrum is generated, respectively received, by the active zone of the respective semiconductor chip . Preferably, the optical emitter is configured to emit electromagnetic radiation in the infrared wavelength range and the optical receiver is configured to receive electromagnetic radiation in the infrared wavelength range . In particular, the wavelength of the radiation is between 650 nm and 2000 nm or between 800 nm and 1000 nm . According to at least one embodiment the optical sensor element is configured to contactless communicate with an optical interface of an electronic device . In particular, the term "contactless" means that no physical contact is present between the optical sensor element and the electronic device . This may include that the communication between the optic sensor element and the electronic device is wireless and preferably completely optical .

[0010] For example , the sensor element is integrated or part of a portable device . For example , the portable device is a smartwatch, a smartphone , headphones , earphones , TWS ( true wireless stereo ) earbuds or the like . In this case the electronic device may be counterpart of the portable device , for example , a station such a charging station or charging device , a master device for evaluation and / or visuali zation data of the portable device , or the like . For example the electronic device is a personal computer, a smartphone , a charging case or the like . By the optical sensor element and the optical interface an optical communication between the portable device and the electronic device may be established . That is , the optical sensor element acts as a transceiver . For example , the portable device and the electronic device interchange data regarding battery status of the portable device , diagnostic information, updates of software and / or firmware of the portable device and / or the sensor module , or the like .

[0011] According to at least one embodiment of sensor module , the optic sensor element is configured to optically detect at least one sensing parameter . According to at least one embodiment of the sensor module , the evaluation circuit is electrically connected to the optical sensor element and is configured to determine the at least one sensing parameter . For example , the evaluation circuit is an application speci fic integrated circuit , also referred to as AS IC for short , or a microcontroller or a field programmable gate array, also referred to as FPGA for short , or the like . In particular, the evaluation circuit may receive at least one parameter signal optically obtained by the optical sensor element which has a correspondence to the at least one sensing parameter as an input and determined the at least one sensing parameter from the at least one parameter signal .

[0012] According to at least one embodiment of the sensor module , the at least one sensing parameter is at least one of the following parameters : a proximity, a vitality function, a touch force , a physical contact , a swipe movement , a distance to a target , a velocity of the target .

[0013] For example , by means of the optical emitter and the optical receiver a proximity may be optically obtained . I f , for example , the sensor module is integrated in a headphone or earphone or TWS earbuds , the optical sensor element may detect whether the headphone or earphone or TWS earbuds is placed in or on an ear of a user . In case that the sensor module is integrated in a smartphone or the like the optical sensor module may determine by detecting a proximity whether the smartphone is used by a user or is accidentally activated, for example inside a pocket of the user .

[0014] Additionally or alternatively one or more vitality functions may be obtained by the optical sensor element . For example , a hydration of a skin of the user or a heart rate of the user may be optically determined . In such a case , the optical sensor module may be integrated in a smartwatch or a fitness tracker or the like .

[0015] Additionally or alternatively a touch force may be obtained by the optical sensor element . To achieve this , for example , a deformable element that is deformable by applying a force may be placed in front of the optical emitter and / or the optic receiver . By radiating the deformable element with electromagnetic radiation of the optical emitter and receiving radiation reflected by the deformable element by the optic receiver a deformation of the deformable element may be determined . I f the mechanical properties of the deformable element are known, the applied force may be determined from the deformation of the deformable element .

[0016] Additionally or alternatively a physical contact and / or a swipe movement may be detected by the optical sensor element . For example , optical properties of a transparent element arranged in front of the optical receiver and / or the optical emitter may change due to a contact to the transparent element . Here , for example , the transparent element shows a transmissivity suitable for application . For example , a transmission coef ficient of the transparent element is at least 70 % or at least 80 % or at least 90 % . For example , the transparent element may be in contact with the skin of a user . The change in the optical properties may be determined by radiating the transparent element with electromagnetic radiation of the optical emitter and receiving radiation reflected by the transparent element by means of the optical receiver . By evaluating the physical contact over time a swipe movement may be detected. By tracking the contact over time, a swipe movement may be detected.

[0017] For example, by detecting a physical contact and / or a swipe movement, the sensor module may enable the possibility for a user interaction. That is, by swiping or touching the sensor module, an input command may be performed by the user. For example, if the sensor module is integrated in a portable device, the user may active a specific function of the device. That is, for example, the user may control a volume or the like by swiping or turn on or off the portable device.

[0018] Additionally or alternatively a distance to a target and / or a velocity of the target may be obtained by the optical sensor module. For example, the distance and / or velocity may be obtained by a time of flight measurement. Alternatively, the distance and / or velocity may be obtained by a LIDAR (Light Detection and Ranging) method. In this case, the optical sensor module acts as a LIDAR sensor.

[0019] Further alternatively, the distance and / or the velocity may be obtained by a SMI, short for self-mixing interferometry, method. In this case, the optical sensor element may act as a SMI sensor, where preferably at least one optical emitter may also act as a receiver. This optical emitter is in particular a laser such as a vertical cavity surface emitting laser, also referred to as VCSEL. With such a measurement setup a SMI signal may be in particular recorded if a laser beam, i.e. laser radiation, emitted by the optical emitter strikes the target, which scatters and at least partially reflects the laser radiation. The laser radiation comprises preferably a wavelength of the infrared wavelength range of the electromagnetic spectrum. A component of the scattered radiation may inj ect back into the emitter and superimposes on the existing field, i . e . , the radiation of the laser beam, modulating an amplitude and a frequency of the laser . The SMI signal is obtained in this example by observing the voltage of the laser or an output power of a photodiode . The SMI signal in particular comprises fringes . For example , by evaluating a beat frequency of the fringes or suitable other methodologies a distance and / or a velocity of the target may be obtained .

[0020] By a distance and / or velocity measurement of a target using, for example , the SMI method, also the proximity, a physical contact and / or a swipe movement may be detected .

[0021] In at least one embodiment the sensor module comprises an optical sensor element and an evaluation circuit . The optical sensor element comprises at least one optical emitter and at least one optical receiver . The optical sensor element is configured to contactless communicate with an optical interface of an electronic device . The optical sensor element is further configured to optically detect at least one sensing parameter . The evaluation circuit is electrically connected to the optical sensor element and is configured to determine the at least one sensing parameter .

[0022] The sensor module described here is based on the following technical considerations . At present all functions that include optical elements like proximity, vitality, touch force , swipe and communication are discrete sensors in di f ferent places of wearable devices . For example , presently all headphones or earphones or TWS earbuds are using proximity sensors to detect whether buds of the headphones or the TWS earbuds are placed in-ear or in a charging case or outside . In particular, power line communication as transceiver between the headphones or the TWS earbuds and the charging case is used . Other sensors such as vital sensors , touch force sensors and swipe sensors for regulation of a volume are separate sensors .

[0023] The sensor module described here makes use of the idea to integrate a plurality of functions into a single module . In particular, the sensor module is configured to optically communicate with a further electronic device and at the same time to obtain at least one sensing parameter . Thereby, the at least one optical emitter and the at least one optical receiver are preferably shared for a plurality of functions . That is , the optical emitter and the optical receiver are used to carry out the optical communication and the optical sensing of the at least one sensing parameter, possibly at the same time .

[0024] In contrast to a sensor module where for each function a discrete sensor is provided, the costs for a sensor module described here are signi ficantly lower, in particular due to integrating the plurality of functions in one module . Furthermore , since all these functions are exclusive the functions can be time multiplexed during operation of the sensor module . As a further advantage , the sensor module described herein has a reduced form factor compared to conventional solutions where for each function a discrete sensor is provided . Furthermore , the integration of a plurality of functions into one sensor module as described here may signi ficantly reduce power consumption, especially in an idle mode of a device in which the sensor module is integrated . In addition, by contactless , i . e . optical communication between the sensor module and the electrical device , environmental influences on the communication may be reduced . For example , electrical contact surfaces used for a connection between the portable device comprising the sensor module and the electrical device may be omitted . As such electrical contact surfaces may alter over time due to environmental influences or dust or dirt , a contactless communication has the advantage that a communication channel between the portable device comprising the sensor module and the electrical device is particularly robust .

[0025] According to at least one embodiment of the sensor module , the optical emitter is a light-emitting diode or a laser diode . The optical receiver is preferably a photodiode . For example , the optical emitter is a VCSEL . By using a light emitting diode or a laser diode for the optical emitter and a photodiode for the optical receiver, the sensor element may be cost ef ficiently produced with a small form factor .

[0026] According to at least one embodiment of the sensor module , the optical emitter is a micro-LED .

[0027] As a broad definition, a micro-LED could be seen as any light-emitting diode ( LED) - generally not a laser - with a particularly small si ze .

[0028] As a rule - and this is a very important criterion in addition to si ze - a growth substrate is removed from microLEDs , so that typical heights of such micro-LEDs are in the range of 1 . 5 pm to 10 pm, for example .

[0029] In principle , a micro-LED does not necessarily have to have a rectangular radiation emission surface . Generally, for example , an LED could have a radiation emission surface in which, in plan view of the layers of the layer stack, any lateral extent of the radiation emission surface is less than or equal to 100 pm or less than or equal to 70 pm or less than or equal to 1 . 5 pm .

[0030] For example , in the case of rectangular micro-LEDs , an edge length - especially in plan view of the layers of the layer stack - smaller than or equal to 70 pm or smaller than or equal to 50 pm pm or smaller than or equal to 1 . 5 pm is often cited as a criterion .

[0031] Mostly, such micro-LEDs are provided on wafers with - for the pLED non-destructively - detachable holding structures .

[0032] At present , micro-LEDs are mainly used in displays . The micro-LEDs form pixels or subpixels and emit light of a defined color . Small pixel si ze and a high density with close distances make micro-LEDs suitable , among others , for small monolithic displays for AR applications , especially data glasses . In addition, other applications are being developed, in particular regarding the use in data communication or pixelated lighting applications .

[0033] Di f ferent ways of spelling micro-LED, e . g . pLED, p-LED, uLED, u-LED or micro light emitting diode can be found in the relevant literature .

[0034] According to at least one embodiment , the sensor module comprises one optical receiver exclusively for the communication with the electronic device . The sensor module further comprises a laser diode configured as the emitter and the receiver for optically measuring the at least one sensing parameter . That is , the optical receiver exclusively for the communication with the electronic device is not used for obtaining a parameter signal for determining the sensing parameter . The optical emitter which is preferably a laser diode is configured for communication with the electronic device and for obtaining the sensing parameter . The laser diode furthermore is configured as an optical receiver for obtaining to sensing parameter .

[0035] In particular, the sensing parameter is obtained during operation by a SMI method . That is , the optical emitter which is a laser diode acts as a SMI sensor . Preferably, the laser diode is a VCSEL . By the laser diode a SMI signal is obtained as described above as the parameter signal , which is preferably evaluated in the evaluation circuit to determine the sensing parameter .

[0036] According to at least one embodiment , the evaluation circuit and the optical sensor module are monolithically integrated with each other . In particular, the optical sensor module and the evaluation circuit are part of one common die . For example , the optical sensor module and the evaluation circuit are produced in a common manufacturing process . This common manufacturing process is , for example , a CMOS process , short for Complementary Metal-Oxide-Semiconductor process . That is , the evaluation circuit is in this case preferably based on the semiconductor material . For example , the common die of the optical sensor element and the evaluation circuit is an AS IC or a FPGA or the like . Advantageously, the sensor module comprises a particularly small form factor i f the evaluation circuit and the optic sensor module are monolithically integrated with each other . According to at least one embodiment , the evaluation circuit comprises at least one circuit element distinct from the optic sensor element . The at least one circuit element is configured to determine the at least one sensing parameter and / or to drive the optical sensor element . By using distinct circuit elements for the sensing parameter and / or driving of the optic sensor element , the sensor module may be formed in a particular variable manner . Additionally, i f one of the circuit elements may show a mal function or the like , other functionalities of the sensor module may still be operated .

[0037] According to at least one embodiment , the evaluation circuit comprises a plurality of circuit elements . A first circuit element is configured to drive the optical sensor element . In particular, the first circuit element is configured to control the optical communication between the sensor module and the electric device . A second circuit element is configured determined to at least one sensing parameter . In particular, the circuit elements are distinct from each other . That is , the first circuit element is a driver and / or controller for the optical sensor element . I f , for example , a plurality of sensing parameters is obtained by the sensor module , it is possible that for obtaining each sensing parameter the evaluation circuit comprises a distinct circuit element . For example , each circuit element is an AS IC or a FPGA. In this embodiment , sensor module may be a system-on-a- chip, or SoC for short .

[0038] According to at least one embodiment , the sensor module comprises a cover plate arranged downstream of the optical emitter . The cover plate is preferably transparent for radiation emitted by the emitter and / or radiation received by the receiver . Here , for example , the transparent element shows a transmissivity suitable for application . For example , a transmission coef ficient of the transparent element is at least 70 % or at least 80 % or at least 90 % . Alternatively it is possible that the cover plate has a transmissivity of at most 5 % or at most 10 % or at most 20 % , for example for certain applications . In particular, the cover plate protects the emitter and / or to receiver from environmental influences and, for example , dust or the like . Preferably, the cover plate does not influence or only unessentially influence the radiation emitted by the emitter and / or the radiation received by the receiver .

[0039] It is possible that the cover plate is the deformable element used i f the optical sensor element acts as a force sensor .

[0040] It is further possible that , i f the optical sensor module acts as a physical contact and / or swipe sensor, physical contact is established with the cover plate .

[0041] Furthermore , an assembly is described . The assembly in particular comprises a sensor module described herein . That is , all features disclosed for the sensor module are also disclosed for the assembly and vice versa .

[0042] According to at least one embodiment of the assembly, the assembly comprises a sensor module described herein and an electronic device with an optical interface . The optical interface comprises at least one interface emitter and at least one interface receiver . The optical sensor element of the sensor module and the optical interface of the electronic device are configured to contactless communicate with each other . For example , the optical interface is a counterpart of the optical sensor element . As such the optical interface may comprise essentially the same features as the optical sensor element with respect to the communication functionality . That is , the optic interface may comprise essentially the same features as the optical sensor element i f the optical sensor element acts as a transceiver . In particular, the optic interface acts as a transceiver .

[0043] Preferably, the optical sensor element and the optical interface are aligned for optical communication . This means in particular, that during operation the radiation emitted by the optical sensor element may be received by the optical interface and radiation emitted by the optic interface may be received by the optical sensor element , preferably essentially without distortions .

[0044] In particular, the optical interface may comprise at least one interface emitter and at least one interface receiver . A configuration, a functionality and an ef fect of each of the interface emitter and the interface receiver may be the same as those of the optical emitter and optical receiver of the optical sensor element , respectively .

[0045] It is also possible , that the optic interface is further configured to determine at least one sensing parameter . This may be advantageous , i f , for example , the electronic device is a smartphone . In particular, a determination of the at least one sensing parameter is carried out in a similar way as determination of at least one sensing parameter by the sensor module .

[0046] According to at least one embodiment of the assembly, the electronic device comprises a driving circuit configured to control the optical interface . For example , the driving circuit is an AS IC or a FPGA or a microcontroller .

[0047] In a case where the optical interface is also configured to determine a sensing parameter, the driving circuit may perform an evaluation to obtain the sensing parameter . In this sense the driving circuit may comprise similar features as the evaluation circuit of the sensor module .

[0048] According to at least one embodiment of the assembly, the driving circuit and the optical interface are monolithically integrated with each other . That is , the optical interface of the driving circuit are part of a common die . Preferably, the optical interface and file circuit performed in a common manufacturing process .

[0049] According to at least one embodiment of the assembly, the optical interface of the electrical device and the optical sensor element of the sensor module are configured for exclusively optical communication . This means in particular that no other wireless connection apart from optical interaction takes place between the optical interface and the optical sensor element curing intended operation .

[0050] According to at least one embodiment of the assembly, the sensor module and the electric device are galvanically isolated from each other . That is , the sensor module and the electric device are not electrically connected to one another . In particular, a galvanically isolated channel is established between the sensor module and the electric device for the communication between the optical sensor element and the optical interface . Furthermore , a method for operating a sensor module is described . The method is in particular suitable to operate a sensor module described herein . That is , all features disclosed for the sensor module are also disclosed for the method and vice versa .

[0051] According to at least one embodiment of the method, the optical sensor element is operated in two operational states . In a first operational state the sensor module optically detects at least one sensing parameter . In the first operational state the method comprises a step of emitting a primary radiation by at least one optical emitter of the optical sensor element and receiving a secondary radiation by at least one optical receiver of the optical sensor element . The primary radiation may comprise a modulation . The modulation may be applied by the evaluation circuit . For example , the modulation is applied by a circuit element of the evaluation circuit configured to drive the optical sensor element .

[0052] The secondary radiation emerges from the primary radiation as a result of an interaction with the environment of the sensor module . Subsequently, the primary and / or secondary radiation are evaluated by the evaluation circuit to obtain the at least one sensing parameter . In particular, the interaction between the primary radiation and the environment is dependent on the sensing parameter . For example , i f the sensing parameter is a distance or a swipe movement or the like , the secondary radiation is a reflection and / or scattering radiation of the primary radiation . In particular, in the first operational state the sensor module works as a sensor for obtaining the at least one sensing parameter . It is possible , that a plurality of sensing parameters are obtained at the same time . Thereby, the sensor module may emit and receive primary and / or secondary radiation with mutually di f ferent optical properties depending on the sensing parameter to be obtained .

[0053] In a second operational state , the sensor module contactless communicates with an optical interface of an electrical device arranged in the vicinity of the sensor module . In the second operational state the method comprises the steps of emitting the primary radiation by the at least one emitter of the optical sensor element and receiving the primary radiation by at least one interface receiver of the optical interface . The primary radiation may comprise a modulation . The modulation may be applied by the evaluation circuit . For example , the modulation is applied by a circuit element of the evaluation circuit configured to drive the optical sensor element . Subsequently, the primary radiation is received by the optical interface is evaluated by a driving circuit of the electrical device .

[0054] Furthermore , the method in the second operational states comprises steps of emitting a third radiation by at least one interface emitter of the optical interface and receiving the third radiation by the at least one receiver of the optical sensor element . The third radiation may comprise a modulation . The modulation may be applied by the driving circuit . Subsequently, the third radiation received by the optical sensor element is evaluated by the evaluation circuit . For example , the steps of emitting and receiving the primary radiation and imaging and receiving the third radiation may be carried out at least partially simultaneously . In a similar way, the steps of evaluating the primary and third radiation may be carried out at least partially simultaneously .

[0055] By emitting the primary radiation and receiving the third radiation by the optical sensor element and by emitting the third radiation and receiving the primary radiation by the optic interface , the optic interface the optical sensor module may communicate with each other . For example , information data may be interchanged by the modulation of the primary and / or third radiation In particular, this communication is exclusively optical . In particular, both the optical sensor module and the optical interface work as a transceiver in this case .

[0056] Furthermore , a wearable device is speci fied . The wearable device comprises a sensor module described herein . That is , all features disclosed for the sensor module are also disclosed for the wearable device and vice versa .

[0057] Further advantages and advantageous embodiments and further developments of the sensor module , the assembly, the method for operating a sensor module and wearable device will become apparent from the following exemplary embodiments shown in connection with schematic drawings . Identical elements , elements of the same kind or elements having the same ef fect , are provided with the same reference signs in the figures . The figures and the proportions of the elements shown in the figures are not to be regarded as true to scale . Rather, individual elements may be shown exageratedly large for better representability and / or for better comprehensibility .

[0058] In the figures : Figures 1 and 2 show a schematic block diagram of an assembly and a sensor module described herein according to exemplary embodiments ;

[0059] Figure 3 shows a schematic block diagram of a sensor module described herein according to an exemplary embodiment ;

[0060] Figure 4 illustrates an assembly and a wearable described herein according to exemplary embodiments ;

[0061] Figure 5 illustrate a detection of a swipe motion by means of the sensor module described herein according to an exemplary embodiment .

[0062] Figure 1 shows a schematic block diagram of an assembly comprising an electrical device 100 and an optical sensor element 1 described herein according to an exemplary embodiment . The sensor module 1 comprises an optical sensor element 2 . In the exemplary embodiment the optical sensor element 2 comprises a two optical emitter 21 and an optical receiver 22 . The optical emitters 21 are light-emitting diodes or laser diodes . The optical receiver 22 is a photodiode .

[0063] The optical emitters 21 each comprise a semiconductor layer sequence with an active zone . During operation electromagnetic radiation is generated in the active zone and emitted by the emitters 21 . Preferably, electromagnetic radiation in the IR wavelength range of the electromagnetic spectrum is generated in the active zone . The optical receiver 22 comprises a semiconductor layer sequence with an active zone . During operation, the active zone of the receiver 22 is configured to receive electromagnetic radiation . For example , the active zone of the receiver 22 is configured to receive electromagnetic radiation in the IR wavelength range .

[0064] The sensor module 1 further comprises an evaluation circuit 3 . The evaluation circuit 3 comprises a first circuit element 31 and a second circuit element 32 . The first circuit element 31 is configured to drive the optical sensor module 2 and is electrically connected to the optical sensor element 2 via a plurality of contact lines . The second circuit element 32 is connected to the optical sensor element 2 via a plurality of contact lines .

[0065] The optical sensor element 2 is configured to determine a sensing parameter . In the present exemplary embodiment the optical sensor element 2 is configured to determine a proximity and / or a vitality function . In particular, the proximity and / or the vitality function is obtained optically by means of the emitter 21 and the receiver 22 in a first operational state of the sensor module 1 . Thereby a primary radiation 5 is emitted by the optical emitters 21 . The primary radiation is reflected by a target as a secondary radiation 6 , which is optically received by the receiver 22 .

[0066] In particular, a parameter signal is generated by the optical sensor element 2 out of the primary and / or secondary radiation 5 , 6 . By the connection lines the parameter signal is trans ferred to the second circuit element 32 . The second circuit element 32 is configured to evaluate the parameter signal and to obtain the sensing parameter, i . e . , the proximity and / or the vitality function . In the present exemplary embodiment , the optical sensor element 2 , the first circuit element 31 and the second circuit element 32 are distinct . For example , the sensor module 1 is a system-on-a-chip . The optical sensor element 2 , the first circuit element 31 and the second circuit element 32 may each be formed with an AS IC or the like .

[0067] For example , the sensor module 1 is part of a part of a portable device , for example a wearable device 200 .

[0068] The electronic device 100 may be a counterpart of the portable device , in which the sensor module 1 is integrated . The electronic device 100 may be a charging device for the portable device or the like .

[0069] The electronic device 100 comprises an optic interface 110 and a driving circuit 120 . The optical interface 110 comprises two optical interface emitters 111 and an optical interface receiver 112 . The interface emitters 111 and the interface receiver 112 may comprise the same features and / or the same functionality as the emitters 21 respectively the receiver 22 . The driving circuit 120 is configured to drive and control the optical interface 110 . Therefore the driving circuit 20 is electrically connected to the optic interface 110 by connection lines .

[0070] In a second operation state the optical sensor element 2 and the optic interface 110 communicate with each other . That is , in this case , both the optical sensor element 2 and the optical interface 110 act as a transceiver .

[0071] In the second operational state at least one of the optical emitters 21 emits a primary radiation 5 which is received by the interface receiver 112 . The primary radiation 5 received by interface receiver 112 is evaluated by the driving circuit 120 . For example , the primary radiation 5 comprises a modulation . In turn, a third radiation 7 is emitted by at least one of the interface emitters 111 . The third radiation 7 is detected by the optical receiver 22 and evaluated by the evaluation circuit 3 , in particular by the first circuit element 31 . It is possible that the third radiation 7 comprises a modulation . By interchanging the primary radiation 5 and the third radiation 7 a communication between the sensor module 1 and the electric device 100 is possible . In particular, this communication is exclusively optical . For example , a state of the electric device 100 and / or a device the sensor module 1 is integrated in is communicated . The communicated state is , for example , a battery state .

[0072] In contrast to Figure 1 , Figure 2 shows an exemplary embodiment , where the optical sensor element 2 and the evaluation circuit 3 are monolithically integrated with each other . That is , the optical sensor element 2 and the evaluation circuit 3 are part of a common die . The common die is , for example , an AS IC or a FPGA.

[0073] In a similar way, the optic interface 110 and the driving circuit 120 are monolithically integrated with each other in the exemplary embodiment of Figure 2 .

[0074] Deviating from Figure 1 and Figure 2 it is also possible that the optical sensor element 2 and the evaluation circuit 3 are integrated with each other and the optic interface 110 and the driving circuit 120 are distinct or vice versa . Figure 3 illustrates a sensor module 1 according to a further exemplary embodiment . In contrast to the sensor module 1 of Figure 1 , the sensor module 1 according to Figure 3 additionally comprises a third circuit element 33 . The third circuit element 33 is configured to evaluate a further sensing parameter is obtained by the optical sensor module 2 . The third circuit element 33 is distinct from the first and second circuit elements 31 , 32 . The third circuit element 33 is , for example an AS IC .

[0075] The further sensing parameter is , for example , a distance to a target and a velocity of the target . For example , the distance to the target and the velocity to the target are measured by an SMI method . That is , at least one of the optical emitters 21 also act as an optical receiver 22 . This optical emitter 21 is preferably a VCSEL . Primary radiation 5 , which is in particular a laser radiation, is emitted by the VCSEL . The target is radiated with the primary radiation 5 . At least a part of the primary radiation 5 is reflected as secondary radiation 6 by the target . The secondary radiation 6 is received by the VCSEL, where the secondary radiation 6 superimposes with the primary radiation 5 . This generates an interference pattern which gives an SMI signal . The SMI signal comprises fringes which may be evaluated, in particular by the third circuit element 33 , to obtain the distance and the velocity of the target .

[0076] In other aspects , the sensor module 1 of the exemplary embodiment of Figure 3 comprises the same features , functionality and ef fects i f the sensor module 1 of Figure 1 and / or of Figure 2 . Figure 4 illustrates an assembly of a wearable device 200 and an electronic device 100 . The wearable device 200 comprises a sensor module 1 according to one of the previously described exemplary embodiments . The wearable device 200 is a headphone or a TWS earbud .

[0077] The electronic device 100 comprises optical interfaces 110 according to one of the previously described exemplary embodiments which form counterparts to the sensor module 1 one of the wearable device 200 . The electronic device 100 is a charging case for the headphones or the TWS earbuds 200 .

[0078] Figure 5 illustrates the detection of a swipe motion 310 by a user 300 . The user 300 swipes over a cover plate 4 of a sensor module 1 . The sensor module 1 comprises an optical sensor element 2 , similar to the optical sensor element 2 of the exemplary embodiment of Figure 3 . In contrast to the exemplary embodiment of Figure 3 , the sensor module 2 according to Figure 5 comprises two emitters 21 which also act as receivers 22 . The emitters 21 are VCSEL . The swipe motion 310 is detected by a SMI method . The SMI method is carried out in a similar way as described in connection with Figure 3 .

[0079] Each of the emitters 21 detect a finger of the user 300 swiping over the cover plate 4 over time . By evaluating the distance and / or the velocity of this finger, the swipe direction 310 may be determined .

[0080] The invention is not restricted to the exemplary embodiments of the description on the basis of said exemplary embodiments . Rather, the invention encompasses any new feature and also any combination of features which in particular comprises any combination of features in the patent claims and any combination of features in the exemplary embodiments , even i f this feature or this combination itsel f is not explicitly speci fied in the patent claims or exemplary embodiments .

[0081] This patent application claims the priority of German patent application 102023119283 . 3 the disclosure content of which is hereby incorporated by reference .

[0082] References

[0083] 1 sensor module

[0084] 2 optical sensor element

[0085] 3 evaluation circuit

[0086] 4 cover plate

[0087] 5 primary radiation

[0088] 6 secondary radiation

[0089] 7 third radiation

[0090] 21 optical emitter

[0091] 22 optical receiver

[0092] 31 first circuit element

[0093] 32 second circuit element

[0094] 100 electronic device

[0095] 110 optical interface

[0096] 111 interface emitter

[0097] 112 interface receiver

[0098] 120 driving circuit

[0099] 200 wearable device

[0100] 300 user

[0101] 310 swipe direction

Claims

Claims1. Sensor module (1) comprising an optical sensor element (2) , and an evaluation circuit (3) , wherein- the optical sensor element (2) comprises at least one optical emitter (21) and at least one optical receiver (22) ,- the optical sensor element (21) is configured to- contactless communicate with an optical interface (110) of an electronic device (100) , and- optically detect at least one sensing parameter, the optical emitter (21) and the optical receiver (22) are configured to carry out optical communication to the electronic device (100) and optical detection of the at least one sensing parameter, and- the evaluation circuit (3) is electrically connected to the optical sensor element (2) and is configured to determine the at least one sensing parameter.

2. Sensor module (1) according to claim 1, wherein the at least one sensing parameter is at least one of the following parameters: a proximity, a vitality function, a touch force, a physical contact, a swipe movement, a distance to a target, a velocity of the target.

3. Sensor module (1) according to one of the preceding claims, wherein the optical emitter (21) is a lightemitting diode or laser diode and the optical receiver (22) is a photodiode.

4. Sensor module (1) according to claim 3, wherein the optical emitter (21) is a micro-LED.

5. Sensor module (1) according to one of the preceding claims, wherein- the sensor module (1) comprises one optical receiver (22) exclusively for communication with the electronic device (100) , and- the sensor module (1) comprises a laser diode configured as the emitter (21) and a receiver (22) for optically measuring the at least one sensing parameter.

6. Sensor module (1) according to one of the preceding claims, wherein the evaluation circuit (3) and the optical sensor module (2) are monolithically integrated with each other.

7. Sensor module (1) according to one of the claims 1 to 5, wherein- the evaluation circuit (3) comprises at least one circuit element (31, 32) distinct from the optical sensor element (2) , and- the at least one circuit element (31, 32) is configured to determine the at least one sensing parameter and / or to drive the optical sensor element(2) .

8. Sensor module according to claim 7, comprising a plurality of circuit elements (31, 32) , wherein- a first circuit element (31) is configured to drive the optical sensor element (2) , and- a second circuit element (32) is configured to determine the at least one sensing parameter.

9. Sensor module (1) according to one of the preceding claims, wherein- the sensor module (1) comprises a cover plate (4) arranged downstream of the optical emitter (21) , and- the cover plate (4) is transparent for radiation emitted by the optical emitter (21) and / or radiation received by the optical receiver (22) .

10. Assembly comprising the sensor module (1) according to one of the preceding claims and an electronic device (100) with an optical interface (110) , wherein- the optical interface (110) comprises at least one interface emitter (111) and at least one interface receiver (112) ,- the optical sensor element (2) of the sensor module (1) and the optical interface (110) of the electronic device (100) are configured to contactless communicate with each other.

11. Assembly according to claim 10, wherein the electronic device (100) comprises a driving circuit (120) configured to control the optical interface (110) .

12. Assembly according to claim 11, wherein the driving circuit (120) and the optical interface (110) are monolithically integrated with each other.

13. Assembly according to one of claims 10 to 12, wherein the optical sensor element (2) of the sensor module (1) and the optical interface (110) of the electrical device (100) are configured for exclusively optical communication .

14. Assembly according to one of claims 10 to 13, wherein the sensor module (1) and the electric device (100) are galvanically isolated from each other.

15. Method for operating a sensor module (1) with an optical sensor element (2) comprising two operational states, wherein- in a first operational state the sensor module (1) optically detects at least one sensing parameter, and operating in the first operational state comprises the steps of- emitting a primary radiation (5) by at least one optical emitter (21) of the optical sensor element (2) ,- receiving a secondary radiation (6) by at least one optical receiver (22) of the optical sensor element (2) , wherein the secondary radiation (6) emerges from the primary radiation (5) as a result of an interaction with the environment of the sensor module (1) ,- evaluating the primary (5) and / or secondary (6) radiation by the evaluation circuit (3) to obtain the at least one sensing parameter;- in a second operational state the sensor module (1) contactless communicates with an optical interface (110) of an electrical device (100) arranged in the vicinity of the sensor module (1) , and operating in the second operational state comprises the steps of- emitting the primary radiation (5) by the at least one emitter (21) of the optical sensor element (2) ,- receiving the primary radiation (5) by at least one interface receiver (122) of the optical interface (110) ,- evaluating the primary radiation (5) received by the optical interface (110) by a driving circuit (120) of the electric device (100) ,- emitting a third radiation (7) by at least one interface emitter (111) of the optical interface (110) ,- receiving the third radiation (7) by the at least one receiver (22) of the optical sensor element (2) ,- evaluating the third radiation (7) received by the optical sensor element (2) by the evaluation circuit (3) .

16. Wearable device (200) comprising a sensor module (1) according to one of the claims 1 to 9.

Images