Electric / electronic component and method for manufacturing electric / electronic component

Abstract

One embodiment of the present invention is an electric / electronic component comprising a substrate having a mounting surface with a normal direction in a first direction, and a position detection device mounted on the mounting surface. The position detection device includes: a first body part having a first fixing part which is fixed, by solder, to a pad provided on the mounting surface; a second body part capable of being displaced relative to the first body part and capable of fixing a member to be detected; a detection mechanism for measuring relative displacement between the first body part and the second body part; and a first reference part extending from the first body part and having a reference surface with an in-plane direction in the first direction. The reference surface has a second direction-side reference surface facing one side in a second direction which is one of in-plane directions of an intersection surface intersecting the first direction. The substrate includes an abutment part abutting the reference surface, and the abutment part has a second direction-side abutment part that abuts the second direction-side reference surface to determine the position of the detection mechanism. Thus, it is possible to achieve appropriate positioning between the position detection device and the substrate.

Description

Electrical and electronic components and manufacturing method for electrical and electronic components

[0001] The present invention relates to an electric / electronic component and a method for manufacturing the electric / electronic component.

[0002] Patent Document 1 discloses an electronic component that can be appropriately mounted on a printed circuit board, which includes a housing having an opening formed on the front surface and terminal members extending rearward, and a frame having a pair of board mounting pieces at positions corresponding to the side surfaces of the housing and attached to the housing so as to cover the opening, and the electronic component is mounted in a notch formed on the edge of the printed circuit board by the terminal members and board mounting pieces. In this electronic component, the terminal members have flat portions that make surface-to-surface contact with the surface of the printed circuit board, and the board mounting pieces are shaped to allow the flat portions to make surface-to-surface contact with the printed circuit board.

[0003] JP 2009-272195 A

[0004] When soldering an electronic component to a circuit board, the tension of the molten solder can cause the component to shift position. If the solder solidifies while the component is still in a misaligned state, the component's position when mounted on the circuit board will shift from its position after soldering. For electronic components that require position detection, if the component's body (e.g., the outer surface of the case) is used as the reference for position detection, the component's position shift due to soldering will affect the position detection accuracy.

[0005] An object of the present invention is to provide an electric / electronic component and a method for manufacturing an electric / electronic component that can appropriately position a position detection device and a substrate.

[0006] One aspect of the present invention is an electrical / electronic component comprising a substrate having a mounting surface whose normal direction is a first direction, and a position detection device mounted on the mounting surface, wherein the position detection device comprises a first main body portion having a first fixing portion fixed by solder to a pad provided on the mounting surface, a second main body portion that is displaceable relative to the first main body portion and can fix a member to be detected, a detection mechanism that measures the relative displacement between the first main body portion and the second main body portion, and a first reference portion extending from the first main body portion and having a reference surface whose in-plane direction is the first direction, wherein the reference surface has a second direction side reference surface that faces one side of a second direction that is one of the in-plane directions of an intersecting plane that intersects the first direction, and the substrate has an abutment portion that abuts against the reference surface, and the abutment portion has a second direction side abutment portion that abuts against the second direction side reference surface to position the detection mechanism.

[0007] With this configuration, when the position detection device is fixed by solder to a pad provided on the mounting surface of the board, the position detection device is properly positioned relative to the board by the abutment between the abutment portion of the board and the reference surface of the position detection device, and by the abutment between the second direction side abutment portion of the board and the second direction side reference surface of the position detection device.

[0008] In the electric / electronic component, the second body may be rotatable about a rotation axis along the first direction relative to the first body and have an engagement portion with which the detection target member can be engaged, the detection mechanism may measure relative displacement in the rotation direction about the rotation axis, and the second direction abutment portion may be a positioning reference in the rotation direction about the rotation axis, thereby allowing appropriate positioning of the position detection device in the rotation direction relative to the board.

[0009] In the electrical / electronic component, the second direction contact portion may extend in a direction intersecting the first direction and the second direction, whereby positioning is stabilized by contact between the second direction reference surface and the second direction contact portion.

[0010] In the above electric / electronic component, the position detection device may further include a second reference portion extending from a position different from the first reference portion of the first main body portion and having an other second-direction-side reference surface facing one side of the second direction, and the substrate may have an other second-direction-side abutment portion abutting against the other second-direction-side reference surface to position the detection mechanism in the second direction, the other second-direction-side abutment portion being a positioning reference in the rotational direction about the rotation axis of the detection mechanism. This allows stable positioning of the position detection device in the rotational direction relative to the substrate.

[0011] In the above-described electric / electronic component, the second-direction-side reference surface may be formed by an outer surface of the first reference portion, and the second-direction-side abutment portion may be provided on an inner wall of a reference hole that is recessed from the mounting surface in the first direction. In this way, the first reference portion of the position detection device fits into the reference hole of the board, and the outer surface of the first reference portion abuts against the inner wall of the reference hole, thereby properly positioning the position detection device with respect to the board.

[0012] In this case, the distance in the second direction between the second-direction reference surface of the first reference portion and the outer surface opposite the second-direction reference surface is preferably shorter than the diameter of the reference hole in the second direction by 400 μm or more, thereby providing sufficient clearance when fitting the first reference portion of the position detection device into the reference hole of the circuit board.

[0013] In the above electric / electronic component, the second-direction-side reference surface may be one of two surfaces provided on the first reference portion facing each other in the second direction, and the second-direction-side abutment portion may be provided on a wall portion of a reference protrusion that protrudes in the first direction from the mounting surface. In this way, the first reference portion of the position detection device abuts on the wall portion of the reference protrusion of the board, thereby properly positioning the position detection device with respect to the board.

[0014] In this case, the distance in the second direction between the second-direction reference surface of the first reference portion and the other of the two surfaces facing in the second direction is preferably 400 μm or more longer than the length of the reference protrusion in the second direction, thereby providing sufficient clearance when the first reference portion of the position detection device abuts against the wall of the reference protrusion on the substrate.

[0015] In the electric / electronic component, the second direction contact portion may be provided on a side wall of a notch that recedes from the side surface of the substrate in the second direction, whereby the first reference portion of the position detection device contacts the side wall of the notch of the substrate, thereby properly positioning the position detection device with respect to the substrate.

[0016] In the above-mentioned electrical / electronic component, when viewed in the first direction, the first center, which is the center of the first fixing portion, and the second center, which is the center of the pad, may be at the same position, or the second center may be located to one side of the first center in the second direction.

[0017] In this case, it is preferable that the position detection device has a plurality of first fixing portions, and the substrate has a plurality of pads corresponding to the plurality of first fixing portions, respectively.

[0018] In the above electric / electronic component, the reference surface may have a third-direction-side reference surface facing one of the in-plane directions of the intersecting surface and a third direction intersecting the second direction, and the abutment portion may have a third-direction-side abutment portion abutting against the third-direction-side reference surface to position the detection mechanism in the third direction relative to the board. Thus, the position detection device is appropriately positioned relative to the board by the abutment between the abutment portion of the board and the reference surface of the position detection device, the abutment between the second-direction-side abutment portion of the board and the second-direction-side reference surface of the position detection device, and the abutment between the third-direction-side abutment portion of the board and the third-direction-side reference surface of the position detection device.

[0019] In this case, when viewed in the first direction, it is preferable that the first center, which is the center of the first fixing part, and the second center, which is the center of the pad, are at the same position, or that the second center is located on one side of the first center in the second direction and on one side of the third direction.

[0020] In the electrical / electronic component, the second direction reference surface may extend in a direction intersecting the first direction and the second direction, whereby positioning is stabilized by abutment between the second direction reference surface and the second direction abutment portion at their surfaces.

[0021] In the electric / electronic component, an end of the second-direction reference surface may be visible in a first direction toward the mounting surface of the substrate, thereby facilitating the placement of the first reference portion when mounting the position detection device on the mounting surface of the substrate by viewing the end of the second-direction reference surface from the first direction.

[0022] In the electric / electronic component, an end of the other second-direction-side reference surface may be visible when viewed in a first direction toward the mounting surface of the substrate, thereby facilitating the placement of the second reference portion when mounting the position detection device on the mounting surface of the substrate by viewing the end of the other second-direction-side reference surface from the first direction.

[0023] Another aspect of the present invention is a method for manufacturing an electric / electronic component, the method including: a substrate having a mounting surface normal to a first direction; and a position detection device mounted on the mounting surface, the position detection device including: a first body portion having a first fixing portion fixed by solder to a pad provided on the mounting surface; a second body portion displaceable relative to the first body portion and capable of fixing a detection target member; a detection mechanism that measures the relative displacement between the first body portion and the second body portion; and a first reference portion extending from the first body portion in a direction intersecting the first direction and having a reference surface with the first direction as an in-plane direction, the reference surface having a second direction side reference surface facing one side of a second direction that is one of the in-plane directions of an intersecting plane intersecting the first direction; The electrical / electronic component is manufactured by including a mounting step in which a position detection device having a second direction side abutment portion that positions the mechanism is placed on the mounting surface of the substrate and the pad and the first fixed portion are opposed via the solder, and a reflow step in which the solder is melted and then solidified to fix the first fixed portion to the pad via the solder, wherein at the end of the mounting step, the second direction side reference surface and the second direction side abutment are not in contact, and the second center, which is the center of the pad, is located on one side in the second direction of the first center, which is the center of the first fixed portion, and at the end of the reflow step, the first center is located on one side in the second direction of the first center, which is the center of the first fixed portion, and the second direction side reference surface and the second direction side abutment are in contact, so that the detection mechanism is positioned.

[0024] With this configuration, in the mounting step, when the position detection device is placed on the mounting surface of the board and the pad and the first fixing portion are opposed via solder, the second direction side reference surface and the second direction side abutment portion do not need to come into contact with each other, resulting in rough positioning during mounting; in the reflow step, the surface tension caused by the melted solder is utilized to bring the second direction side reference surface and the second direction side abutment portion into contact, thereby positioning the detection mechanism and allowing the solder to solidify in this state.

[0025] In the above-described method for manufacturing an electrical / electronic component, the reference surface may have a third-direction-side reference surface that faces one of the in-plane directions of the intersecting surface and in a third direction that intersects with the second direction, the abutment portion may have a third-direction-side abutment portion that abuts against the third-direction-side reference surface to position the detection mechanism in the third direction, the second-direction-side reference surface and the second-direction-side abutment portion are not in contact with each other and the third-direction-side reference surface and the third-direction-side abutment portion are not in contact with each other at the end of the mounting step, the second center may be located on one side of the first center in the second direction and on one side of the third direction, and the first center may be located on one side of the first center in the third direction at the end of the reflow step, the second-direction-side reference surface and the second-direction-side abutment portion are in contact and the third-direction-side reference surface and the third-direction-side abutment portion are in contact with each other, and the detection mechanism may be positioned relative to the substrate in the second and third directions.

[0026] As a result, in the mounting step, the second direction side reference surface and the second direction side abutment portion do not need to come into contact with each other, and the mounting is performed with rough positioning; in the reflow step, the detection mechanism is positioned by contact between the second direction side reference surface and the second direction side abutment portion, and between the third direction side reference surface and the third direction side abutment portion, utilizing the surface tension caused by the melting solder, and the solder solidifies in this state.

[0027] According to the present invention, it is possible to provide an electric / electronic component and a method for manufacturing an electric / electronic component in which appropriate positioning of a position detection device and a substrate is performed.

[0028] FIG. 1 is a perspective view illustrating an electric / electronic component according to the present embodiment; FIG. 2 is a plan view illustrating an electric / electronic component according to the present embodiment; FIG. 3 is a side view illustrating a position detection device; FIG. 4 is a perspective view illustrating a position detection device; FIG. 5 is a plan view illustrating a substrate; FIG. 6 is a diagram illustrating a method for manufacturing an electric / electronic component according to the present embodiment; FIG. 7 is a diagram illustrating a method for manufacturing an electric / electronic component according to the present embodiment; FIG. 8 is a diagram illustrating a method for manufacturing an electric / electronic component according to the present embodiment; FIG. 9 is a diagram illustrating a method for manufacturing an electric / electronic component according to the present embodiment;

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same components will be designated by the same reference numerals, and the description of components that have already been described will be omitted as appropriate.

[0030] (Electrical / Electronic Component) FIG. 1 is a perspective view illustrating an electric / electronic component according to this embodiment. FIG. 2 is a plan view illustrating an electric / electronic component according to this embodiment. An electric / electronic component (hereinafter also referred to as an "electronic component") 1 according to this embodiment includes a substrate 10 and a position detection device 20. The substrate 10 has a mounting surface 10a having a first direction as a normal direction. In this embodiment, the first direction is the Z1-Z2 direction, for example. Pads 15 for fixing the position detection device 20 by soldering are provided on the mounting surface 10a. The pads 15 are provided in positions facing terminals 25 of the position detection device 20 to be soldered.

[0031] The position detection device 20 includes a first body portion 21 having terminals 25 fixed by solder to pads 15 provided on the mounting surface 10a, and a second body portion 22 that is displaceable relative to the first body portion 21 and can fix a detection target member. In this embodiment, the terminals 25 are an example of a first fixing portion. The first body portion 21 is an example of an exterior case, and the second body portion 22 is an example of a shaft holding portion that is rotatable relative to the case. The second body portion 22 is provided with an operation hole 22h into which a rotary operation shaft S can be inserted. As the rotary operation shaft S rotates, the shaft holding portion, which is an example of the second body portion 22, rotates relative to the case, which is an example of the first body portion 21. The rotary operation shaft S is an example of a detection target member, and the operation hole 22h is an example of an engagement portion with which the detection target member can engage. For example, the detection target member may be a member having a hole, and the engagement portion may be a shaft that engages with the hole of the member.

[0032] The position detection device 20 also includes a detection mechanism 23 that measures the relative displacement between the first body portion 21 and the second body portion 22. The detection mechanism 23 is housed in, for example, the first body portion 21. The detection mechanism 23 detects the relative displacement between the first body portion 21 and the second body portion 22, for example, by a change in resistance value. In the position detection device 20 according to this embodiment, the detection mechanism 23 detects the relative displacement between the first body portion 21 and the second body portion 22 in the rotational direction about the rotation axis O along the first direction (Z1-Z2 direction).

[0033] The position detection device 20 includes a first reference unit 30. The first reference unit 30 extends from the first main body unit 21 and has a reference surface 31 whose in-plane direction is the first direction (Z1-Z2 direction). The reference surface 31 has a second-direction-side reference surface 311 that faces one side of a second direction, which is one of the in-plane directions of an intersecting plane that intersects with the first direction. In this embodiment, as an example, the second direction is the Y1-Y2 direction, and one side of the second direction is the Y1 side.

[0034] The position detection device 20 may further include a second reference portion 40 extending from a position different from the first reference portion 30 of the first main body portion 21. The second reference portion 40 has a reference surface 41 whose in-plane direction is the first direction (Z1-Z2 direction). The reference surface 41 has another second-direction-side reference surface 411 facing one side (the Y1 side) of the second direction (the Y1-Y2 direction).

[0035] Furthermore, in the first reference unit 30 of the position detection device 20, the reference surface 31 may have a third direction-side reference surface 313 (see FIGS. 3 and 4) facing one side of the third direction. In this embodiment, as an example, the third direction is the X1-X2 direction, and one side of the third direction is the X1 side.

[0036] The substrate 10 on which such a position detection device 20 is mounted includes an abutment portion 11 that abuts against a reference surface 31 of the first reference portion 30 of the position detection device 20. The abutment portion 11 has a second direction side abutment portion 111 that abuts against a second direction side reference surface 311 of the first reference portion 30 of the position detection device 20 to position the detection mechanism 23.

[0037] Furthermore, when the position detection device 20 is provided with another second direction side reference surface 411, the substrate 10 has another second direction side abutment portion 112 (see FIG. 5 ) that abuts against the other second direction side reference surface 411. Furthermore, when the position detection device 20 is provided with a third direction side reference surface 313, the substrate 10 has a third direction side abutment portion 113 (see FIG. 5 ) that abuts against the third direction side reference surface 313.

[0038] When the position detection device 20 is mounted on the mounting surface 10a of this substrate 10 and fixed by solder to the pad 15 provided on the mounting surface 10a, the position detection device 20 is appropriately positioned in the second direction relative to the substrate 10 due to the abutment between the abutment portion 11 of the substrate 10 and the reference surface 31 of the position detection device 20, specifically, the abutment between the second direction side abutment portion 111 of the substrate 10 and the second direction side reference surface 311 of the position detection device 20.

[0039] Furthermore, when the position detection device 20 is provided with another second-direction-side reference surface 411, the abutment between the other second-direction-side reference surface 411 and the other second-direction-side abutment portion 112 provides more appropriate positioning in the rotational direction of the position detection device 20. Furthermore, when the position detection device 20 is provided with a third-direction-side reference surface 313, the abutment with the third-direction-side abutment portion 113 provides appropriate positioning of the position detection device 20 in the third direction.

[0040] (Position Detection Device) FIG. 3 is a side view illustrating an example of a position detection device. FIG. 4 is a perspective view illustrating an example of a position detection device. FIG. 3 shows a side view of the position detection device 20 as seen from the Y1 side. FIG. 4 shows a perspective view of the Y1 side and X2 side of the position detection device 20 as seen from the Z2 side in the Z1-Z2 direction. The terminals 25 are provided so as to extend laterally from the first main body portion 21, for example. The lower surfaces of the terminals 25 face the upper surfaces of the pads 15 of the substrate 10 shown in FIG. 1, and are disposed opposite each other when the position detection device 20 is mounted on the substrate 10.

[0041] The first reference portion 30 is provided to extend from the first main body portion 21 to one side (X1 side) in a third direction (X1-X2 direction), which is another direction intersecting the first direction. Furthermore, the first reference portion 30 is provided to extend downward (to the Z2 side in the Z1-Z2 direction) of the first main body portion 21. The side wall surface of the first reference portion 30 is the reference surface 31, and one of the two surfaces of this side wall surface that face in the second direction (Y1-Y2 direction) (the Y1 side) is the second direction side reference surface 311.

[0042] The end of the second-direction-side reference surface 311 of the first reference portion 30 is preferably provided so as to be visible when viewed in a first direction (Z2 direction) toward the mounting surface 10a among the first directions (Z1-Z2 directions). This makes it easier to visually recognize the end of the second-direction-side reference surface 311 from the first direction (Z1-Z2 direction) (for example, by capturing an image with a camera of a mounter) when mounting the position detection device 20 on the mounting surface 10a of the board 10, as shown in FIG. 2 , and facilitates the positioning of the first reference portion 30.

[0043] Of the side wall surfaces that serve as the reference surfaces 31 of the first reference portion 30 , the surface facing one side (X1 side) in the third direction (X1-X2 direction) serves as a third direction reference surface 313 .

[0044] The second reference portion 40 extends from a position different from the first reference portion 30 of the first main body portion 21. For example, when the first reference portion 30 extends on the X1 side of the first main body portion 21 in the X1-X2 direction, the second reference portion 40 extends on the X2 side of the first main body portion 21 in the X1-X2 direction.

[0045] As an example, the second reference portion 40 is provided so as to extend from the first main body portion 21 to the other side (X2 side) in the third direction (X1-X2 direction). Furthermore, the second reference portion 40 is provided so as to extend downward (to the Z2 side in the Z1-Z2 direction) from the first main body portion 21. The side wall surface of the second reference portion 40 is the reference surface 41, and one of the two surfaces of this side wall surface that face each other in the second direction (Y1-Y2 direction) (for example, the Y1 side) is the other second direction reference surface 411.

[0046] The end of the other second-direction-side reference surface 411 of the second reference portion 40 is preferably provided so as to be visible when viewed in a first direction (Z2 direction) toward the mounting surface 10a among the first directions (Z1-Z2 directions). This makes it easier to visually recognize the end of the other second-direction-side reference surface 411 from the first direction (Z1-Z2 direction) (for example, by capturing an image with a camera of a mounter) when mounting the position detection device 20 on the mounting surface 10a of the board 10, as shown in FIG. 2 , and facilitates the arrangement of the second reference portion 40.

[0047] A central protrusion 50 may be provided in the approximate center of the underside (Z2 side in the Z1-Z2 direction) of the first main body 21. The central protrusion 50 is provided between the first reference portion 30 and the second reference portion 40. This makes it easier to roughly position the position detection device 20 when mounting it on the substrate 10.

[0048] (Substrate) Fig. 5 is a plan view illustrating a substrate. Pads 15 are provided on the mounting surface 10a of the substrate 10. In this embodiment, four pads 15 are arranged to face four terminals 25 provided on the position detection device 20. The number of terminals 25 and pads 15 is not limited. The contact portion 11 provided on the substrate 10 has a second direction side contact portion 111 that abuts against the second direction side reference surface of the reference surface 31 of the position detection device 20.

[0049] In this embodiment, the reference hole 10h has an inner wall that recesses in a first direction (e.g., the Z1-Z2 direction) from the mounting surface 10a of the substrate 10, and the second-direction-side contact portion 111 and the other second-direction-side contact portion 112 are provided on one side (e.g., the Y1 side) of the second direction (e.g., the Y1 direction) of the inner wall of the reference hole 10h. The second-direction-side contact portion 111 and the other second-direction-side contact portion 112 may extend in a third direction (e.g., the X1-X2 direction). Furthermore, the reference hole 10h has an inner wall that recesses in a first direction (e.g., the Z1-Z2 direction) from the mounting surface 10a of the substrate 10, and the third-direction-side contact portion 113 is provided on one side (e.g., the X1 side) of the third direction (e.g., the X1 direction).

[0050] As a result, the first reference portion 30 of the position detection device 20 is fitted into the reference hole 10h of the substrate 10, and the position detection device 20 is appropriately positioned in the second direction (Y1-Y2 direction) and rotational direction relative to the substrate 10 by the abutment between the outer surface (second direction side reference surface 311) of the first reference portion 30 and the second direction side abutment portion 111, which is the inner wall of the reference hole 10h.

[0051] Here, when the second direction side contact portion 111 of the substrate 10 extends in a direction intersecting the first direction and the second direction (for example, the third direction (X1-X2 direction)), positioning is stabilized by the surface contact between the second direction side reference surface 311 and the second direction side contact portion 111. In other words, holding down with a surface rather than with a line enhances the function as a rotation stopper, and is therefore more effective as a positioning reference in the rotation direction.

[0052] In addition, the second reference portion 40 of the position detection device 20 is fitted into the reference hole 10h of the substrate 10, and the position detection device 20 is appropriately positioned relative to the substrate 10 in the second direction (Y1-Y2 direction) and the rotational direction by the abutment between the outer surface (other second direction side reference surface 411) of the second reference portion 40 and the other second direction side abutment portion 112, which is the inner wall of the reference hole 10h.

[0053] Furthermore, when the second direction side contact portion 112 of the substrate 10 extends in a direction intersecting the first direction and the second direction (for example, the third direction (X1-X2 direction)), positioning is stabilized by the surface contact between the second direction side reference surface 411 and the second direction side contact portion 112. In other words, holding down with a surface rather than with a line enhances the function as a rotation stopper, and is therefore more effective as a positioning reference in the rotation direction.

[0054] Furthermore, the first reference portion 30 of the position detection device 20 is fitted into the reference hole 10h of the substrate 10, and the position detection device 20 is appropriately positioned on one side (X1 side) of the third direction (X1-X2 direction) relative to the substrate 10 by the abutment between the third direction side reference surface 313 of the first reference portion 30 and the third direction side abutment portion 113 of the reference hole 10h.

[0055] When the central protrusion 50 is provided on the underside of the first main body 21, the reference hole 10h has a portion into which the central protrusion 50 is fitted. The portions of the reference hole 10h into which the first reference portion 30, the second reference portion 40, and the central protrusion 50 are fitted may be continuous, or any two of these portions may be continuous, or each may be provided independently.

[0056] The second direction side reference surface 311 provided on the substrate 10 may be provided on the wall portion of a reference protrusion (not shown) that protrudes from the mounting surface 10a in the first direction (for example, the Z1 side in the Z1-Z2 direction).

[0057] In the position detection device 20, there are cases where the positioning reference for the detection mechanism 23 is defined based on the external shape of the device (absolute linearity). In such cases, it is necessary to improve the assembly accuracy of the position detection device 20 relative to the board 10 in order to improve detection accuracy. From this perspective, the position detection device 20 and the board 10 are positioned by fitting them together, but in order to respond to device miniaturization and automated assembly, it may be difficult to position the position detection device 20 and the board 10 by fitting them together. Even in such cases, the present embodiment makes it possible to appropriately position the position detection device 20 and the board 10.

[0058] 6 to 9 are diagrams illustrating a method for manufacturing an electric / electronic component according to this embodiment. First, as shown in Fig. 6, a substrate 10 and a position detection device 20 are prepared, and the position detection device 20 is placed on the mounting surface 10a of the substrate 10. Solder 17 is provided in advance on the pads 15 of the substrate 10, and by placing the position detection device 20 on the mounting surface 10a of the substrate 10, the pads 15 and terminals 25 face each other via the solder 17 (mounting step).

[0059] 7 shows the positional relationship between the substrate 10 and the position detection device 20 when the position detection device 20 is placed on the mounting surface 10a of the substrate 10. For ease of explanation, the position detection device 20 is indicated by a two-dot chain line. In the mounting step, when the position detection device 20 is placed on the mounting surface 10a of the substrate 10, the first reference portion 30 is fitted into the reference hole 10h of the substrate 10. Furthermore, if a second reference portion 40 is provided, the second reference portion 40 is also fitted into the reference hole 10h.

[0060] Here, the distance in the second direction (Y1-Y2 direction) between the second direction reference surface 311 and the outer surface 315 opposite the second direction reference surface 311 in the first reference portion 30 is shorter than the diameter of the reference hole 10h in the second direction (Y1-Y2 direction). Specifically, it is preferable that this distance be shorter by 400 μm or more. This provides sufficient clearance when fitting the first reference portion 30 of the position detection device 20 into the reference hole 10h in the substrate 10.

[0061] In this mounting step, if the end of the second direction side reference surface 311 of the first reference portion 30 and the end of the other second direction side reference surface 411 of the second reference portion 40 are visible from the first direction (Z1-Z2 direction), it becomes easier to recognize these ends by capturing images of them with the mounter's camera, for example, and it becomes easier to position the first reference portion 30 and the second reference portion 40.

[0062] When the first reference portion 30 is fitted into the reference hole 10h, i.e., before the solder 17 is melted and solidified, the second direction side reference surface 311 of the first reference portion 30 and the second direction side abutment portion 111, which is the inner wall of the reference hole 10h, are spaced apart in the second direction (Y1-Y2 direction) (see gap d1 in Figure 7).

[0063] Furthermore, when the second reference portion 40 is provided and the second reference portion 40 is fitted into the reference hole 10h, the other second-direction-side reference surface 311 of the second reference portion 40 and the other second-direction-side abutment portion 112 of the reference hole 10h are spaced apart in the second direction (Y1-Y2 direction) (see gap d2 in FIG. 7 ). Furthermore, when the first reference portion 30 is provided with the third-direction-side reference surface 313, the third-direction-side reference surface 313 and the third-direction-side abutment portion 113 of the reference hole 10h are spaced apart in the third direction (X1-X2 direction) (see gap d3 in FIG. 7 ).

[0064] 7, at the end of the mounting step, the first reference portion 30 and the second reference portion 40 are loosely fitted into the reference hole 10h. In this state, the second-direction-side reference surface 311 and the second-direction-side contact portion 111 are not in contact with each other, the other second-direction-side reference surface 411 and the other second-direction-side contact portion 112 are not in contact with each other, and the third-direction-side reference surface 313 and the third-direction-side contact portion 113 are not in contact with each other. In this state, when viewed in the first direction (Z1-Z2 direction), the first center C1, which is the center of the terminal 25, and the second center C2, which is the center of the pad 15, do not coincide with each other. For example, the first center C1 is offset in the XY plane from the second center C2.

[0065] When the first reference portion 30 and the second reference portion 40 are fitted into the reference hole 10h, deviations in the direction along the mounting surface 10a of the position detection device 20 (in the XY plane) and in the rotational direction around the normal to the mounting surface 10a are restricted to a certain extent.

[0066] Next, the solder 17 is melted and then solidified, and the terminal 25 is fixed to the pad 15 via the solder 17 (reflow step). When the solder 17 melts in the reflow step, the relative positions of the terminal 25 and the pad 15 are aligned due to the self-alignment effect of the solder 17, due to the surface tension of the melted solder 17. As a result, the first center C1 of the terminal 25 moves to a position closer to the second center C2 of the pad 15 than at the end of the mounting step. This movement also moves the first reference portion 30 of the position detection device 20, and the second-direction-side reference surface 311 comes into contact with the second-direction-side abutment portion 111. The detection mechanism 23 is positioned by the contact between the second-direction-side reference surface 311 and the second-direction-side abutment portion 111, and the solder 17 solidifies in this state.

[0067] When the second reference portion 40 is provided, the second reference portion 40 also moves in the same manner as the first reference portion 30, and the other second-direction-side reference surface 411 comes into contact with the second-direction-side abutment portion 112. The first reference portion 30 abuts against the second-direction-side abutment portion 111, and the second reference portion 40 abuts against the other second-direction-side abutment portion 112, thereby more appropriately positioning the position detection device 20 in the X and Y directions as well as in the rotational direction.

[0068] Furthermore, when the first reference portion 30 is provided with the third-direction reference surface 313, the third-direction reference surface 313 comes into contact with the third-direction contact portion 113 of the reference hole 10h, thereby properly positioning the position detection device 20 on one side (the X1 side) of the third direction (the X1-X2 direction).

[0069] 9(a) is a side view illustrating the position of the position detection device 20 after the mounting step, and FIG. 9(b) is a side view illustrating the position of the position detection device 20 after the reflow step. After the mounting step shown in FIG. 9(a), the first reference portion 30 and the second reference portion 40 are loosely fitted into the reference hole 10h, so the position of the position detection device 20 relative to the substrate 10 varies within the range of the gap between the reference hole 10h and the first reference portion 30 and the second reference portion 40. In this state, the first center C1, which is the center of the terminal 25, is shifted from the second center C2, which is the center of the pad 15.

[0070] After the reflow step shown in FIG. 9B , the self-alignment effect caused by the surface tension of the melted solder 17 causes the position detector 20 to move in a direction in which the first center C1 of the terminal 25 is aligned with the second center C2 of the pad 15 (see the arrow in FIG. 9B ). This movement of the position detector 20 causes the first reference portion 30 and the second reference portion 40 to abut against the inner wall of the reference hole 10 h, and this abutment limits (stops) the movement of the position detector 20. As the solder 17 solidifies in this state, the position detector 20 is fixed in a position in which the first center C1 of the terminal 25 is aligned with the second center C2 of the pad 15.

[0071] That is, in this embodiment, when mounting the position detection device 20 on the substrate 10 in the mounting step, alignment accuracy is allowed to the extent that the first reference portion 30 fits loosely into the reference hole 10h, thereby achieving easy mounting. On the other hand, in the reflow step, the position detection device 20 can be intentionally moved in a predetermined direction by utilizing the self-alignment effect of the solder 17. This movement brings the first reference portion 30 and the second reference portion 40 into contact with the inner wall of the reference hole 10h, thereby properly positioning the position detection device 20 on the substrate 10. After the reflow step, the position detection device 20 is fixed in a position where the first center C1 (see FIG. 8) of the terminal 25 is aligned with the second center C2 (see FIG. 8) of the pad 15.

[0072] According to this embodiment, it is possible to provide an electric / electronic component 1 and a method for manufacturing the electric / electronic component 1 in which the position detection device 20 and the substrate 10 are appropriately positioned.

[0073] Although the present embodiment has been described above, the present invention is not limited to these examples. For example, the second direction side abutment portion 111 may be provided on a side wall of a notch that recedes from the side surface of the substrate 10 in the second direction. This allows the first reference portion 30 of the position detection device 20 to abut against the side wall of the notch in the substrate 10, thereby properly positioning the position detection device 20 relative to the substrate 10. Furthermore, any addition, deletion, or design change of components by a person skilled in the art to the above-described embodiments, or any appropriate combination of features of the configuration examples of the embodiments, is also within the scope of the present invention as long as it includes the gist of the present invention.

[0074] DESCRIPTION OF SYMBOLS 1...Electrical / electronic component 10...Substrate 10a...Mounting surface 10h...Reference hole 11...Contact portion 15...Pad 17...Solder 20...Position detection device 21...First main body portion 22...Second main body portion 22h...Operation hole (engagement portion) 23...Detection mechanism 25...Terminal 30...First reference portion 31, 41...Reference surface 40...Second reference portion 50...Central convex portion 111...Second direction side contact portion 112...Other second direction side contact portion 113...Third direction side contact portion 311...Second direction side reference surface 313...Third direction side reference surface 315...Outer surface 411...Other second direction side reference surface C1...First center C2...Second center O...Rotation axis d1, d2, d3...Gap S...Rotation operation axis (detection target member)

Claims

1. An electric / electronic component comprising: a substrate having a mounting surface whose normal direction is a first direction; and a position detection device mounted on the mounting surface, wherein the position detection device comprises: a first body portion having a first fixing portion fixed by solder to a pad provided on the mounting surface; a second body portion displaceable relative to the first body portion and capable of fixing a member to be detected; a detection mechanism which measures the relative displacement between the first body portion and the second body portion; and a first reference portion extending from the first body portion and having a reference surface with the first direction as its in-plane direction, wherein the reference surface has a second direction side reference surface facing one side of a second direction which is one of the in-plane directions of an intersecting plane that intersects with the first direction, the substrate has an abutment portion which abuts against the reference surface, and the abutment portion has a second direction side abutment portion which abuts against the second direction side reference surface to position the detection mechanism.

2. The electrical / electronic component described in claim 1, wherein the second main body portion is rotatable around a rotation axis along the first direction relative to the first main body portion and has an engagement portion with which the member to be detected can engage, the detection mechanism measures the relative displacement in the rotational direction about the rotational axis, and the second direction side abutment portion is a positioning reference in the rotational direction about the rotational axis.

3. The electrical / electronic component according to claim 2, wherein the second direction side abutment portion extends in a direction intersecting the first direction and the second direction.

4. The electric / electronic component described in claim 2, wherein the position detection device further comprises a second reference portion extending from a position different from the first reference portion of the first main body portion and having an other second direction side reference surface facing one of the second directions, the substrate has an other second direction side abutment portion abutting against the other second direction side reference surface to position the detection mechanism in the second direction, and the other second direction side abutment portion is a positioning reference in the rotational direction centered on the rotation axis of the detection mechanism.

5. An electrical / electronic component as described in claim 1, wherein the second direction side reference surface is formed from the outer surface of the first reference portion, and the second direction side abutment portion is provided on the inner wall of a reference hole that is recessed from the mounting surface in the first direction.

6. The electrical / electronic component described in claim 5, wherein the distance in the second direction between the second direction side reference surface and the outer surface opposite the second direction side reference surface in the first reference portion is 400 μm or more shorter than the hole diameter in the second direction of the reference hole.

7. An electric / electronic component as described in claim 1, wherein the second direction side reference surface comprises one of two surfaces facing each other in the second direction provided on the first reference portion, and the second direction side abutment portion is provided on a wall portion of a reference protrusion that protrudes in the first direction from the mounting surface.

8. An electrical / electronic component as described in claim 7, wherein the distance in the second direction between the second direction side reference surface and the other of the two surfaces facing the second direction in the first reference portion is at least 400 μm longer than the length in the second direction of the reference protrusion.

9. The electrical / electronic component according to claim 1, wherein the second direction side abutment portion is provided on a side wall of a cutout that recesses in the second direction from the side surface of the substrate.

10. The electrical / electronic component according to claim 1, wherein, when viewed in the first direction, a first center that is the center of the first fixing portion and a second center that is the center of the pad are at the same position, or the second center is located on the one side of the first center in the second direction.

11. The electrical / electronic component according to claim 10, wherein the position detection device has a plurality of the first fixing portions, and the substrate has a plurality of the pads corresponding to the respective first fixing portions.

12. The electrical / electronic component described in claim 1, wherein the reference surface has a third direction side reference surface that faces one of the in-plane directions of the intersecting surface and one of the third directions that intersects with the second direction, and the abutment portion has a third direction side abutment portion that abuts against the third direction side reference surface to position the detection mechanism in the third direction relative to the substrate.

13. The electrical / electronic component according to claim 12, wherein, when viewed in the first direction, a first center that is the center of the first fixing part and a second center that is the center of the pad are at the same position, or the second center is located on the one side in the second direction and on the one side in the third direction of the first center.

14. The electrical / electronic component according to claim 2, wherein the second direction side reference surface extends in a direction intersecting the first direction and the second direction.

15. An electrical / electronic component as described in claim 1, wherein an end of the second direction side reference surface is visible when viewed in a first direction toward the mounting surface among the first directions.

16. The electrical / electronic component according to claim 4, wherein an end of the other second direction side reference surface is visible when viewed in a first direction toward the mounting surface among the first directions.

17. A method for manufacturing an electric / electronic component, comprising: a substrate having a mounting surface normal to a first direction; and a position detection device mounted on the mounting surface, wherein the position detection device comprises: a first body portion having a first fixing portion fixed by solder to a pad provided on the mounting surface; a second body portion displaceable relative to the first body portion and capable of fixing a detection target member; a detection mechanism for measuring the relative displacement between the first body portion and the second body portion; and a first reference portion extending from the first body portion in a direction intersecting the first direction and having a reference surface with the first direction as an in-plane direction, wherein the reference surface has a second direction side reference surface facing one side of a second direction which is one of the in-plane directions of an intersecting plane intersecting the first direction, the substrate has an abutment portion in contact with the reference surface, and the abutment portion has a second direction side abutment portion in contact with the second direction side reference surface to position the detection mechanism, a mounting step of disposing the position detection device on the mounting surface of the substrate and arranging the pad and the first fixed portion opposite each other via solder; and a reflow step of melting the solder and then solidifying it to fix the first fixed portion to the pad via the solder, wherein at the end of the mounting step, the second direction side reference surface and the second direction side abutment are not in contact, and a second center which is the center of the pad is located on the one side in the second direction of a first center which is the center of the first fixed portion, and at the end of the reflow step, the first center is located on the one side in the second direction of a first center which is the center of the first fixed portion, and 18. The reference surface has a third direction side reference surface that faces one of the in-plane directions of the intersecting surface and is a third direction that intersects with the second direction, the abutment portion has a third direction side abutment portion that abuts with the third direction side reference surface to position the detection mechanism in the third direction, at the end of the mounting step, the second direction side reference surface and the second direction side abutment portion are not in contact and the third direction side reference surface and the third direction side abutment portion are not in contact, the second center is located on the one side of the second direction and on the one side of the third direction relative to the first center, at the end of the reflow step, the first center is located on the one side of the second direction and on the one side of the third direction relative to the end of the mounting step, 18. The method for manufacturing an electrical / electronic component as described in claim 17, wherein the second direction side reference surface is in contact with the second direction side abutment portion, and the third direction side reference surface is in contact with the third direction side abutment portion, and the detection mechanism is positioned relative to the substrate in the second direction and the third direction.

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