Light-emitting device and electronic equipment

Abstract

Provided is a light-emitting device capable of suppressing moisture infiltration even when a glass substrate is not provided as a sealing material.　The light-emitting device is provided with: a plurality of light-emitting elements; a sealing material for sealing the plurality of light-emitting elements; and a first inorganic thin film provided on the sealing material. The sealing material includes at least one among a resin layer and a second inorganic thin film. The first inorganic thin film includes an atomic layer deposition film.

Description

Light-emitting device and electronic device

[0001] The present disclosure relates to a light-emitting device and an electronic device including the same.

[0002] Light-emitting devices that include a glass substrate as a sealant to prevent moisture from seeping in are widely known. For example, Patent Document 1 discloses a display device in which self-luminous elements such as organic electroluminescent elements are sealed by a second base portion such as a glass substrate.

[0003] Japanese Patent Application Laid-Open No. 2022-36076

[0004] In recent years, there has been a demand for light emitting devices that do not require a glass substrate as a sealing material.

[0005] An object of the present disclosure is to provide a light emitting device that can suppress moisture intrusion even without a glass substrate as a sealant, and an electronic device including the same.

[0006] In order to solve the above-mentioned problems, the light-emitting device according to the present disclosure comprises a plurality of light-emitting elements, a sealing material that seals the plurality of light-emitting elements, and a first inorganic thin film provided on the sealing material, wherein the sealing material includes at least one of a resin layer and a second inorganic thin film, and the first inorganic thin film includes an atomic layer deposition film.

[0007] FIG. 1 is a plan view of a display device according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . FIG. 3A is a cross-sectional view of an OLED layer including a single layer of light-emitting units. FIG. 3B is a cross-sectional view of an OLED layer including two layers of light-emitting units. FIG. 4 is a process diagram illustrating a method for manufacturing a display device according to an embodiment. FIG. 5 is a process diagram illustrating a method for manufacturing a display device according to an embodiment. FIG. 6 is a process diagram illustrating a method for manufacturing a display device according to an embodiment. FIG. 7 is a cross-sectional view of a display device according to a modified example. FIG. 8 is a cross-sectional view of a display device according to a modified example. FIG. 9 is a cross-sectional view of a display device according to a modified example. FIG. 10 is a cross-sectional view of a display device according to a modified example. FIG. 11 is a cross-sectional view of a display device according to a modified example. FIG. 12 is a cross-sectional view of a display device according to a modified example. FIG. 13 is a cross-sectional view of a display device according to a modified example. FIG. 14 is a cross-sectional view of a display device according to a modified example. FIG. 15 is a cross-sectional view of a first example of a leakage suppression structure. FIG. 16 is a cross-sectional view of a second example of a leakage suppression structure. FIG. 17 is a cross-sectional view of a third example of a leakage suppression structure. FIG. 18 is a cross-sectional view of a fourth example of a leakage suppression structure. 19 is a cross-sectional view of a fifth example of a leak suppression structure. FIG. 20 is a cross-sectional view of a sixth example of a leak suppression structure. FIG. 21 is a cross-sectional view of a seventh example of a leak suppression structure. FIG. 22 is an enlarged cross-sectional view of the groove shown in FIG. 21. FIG. 23 is a cross-sectional view of an eighth example of a leak suppression structure. FIG. 24 is a cross-sectional view of a ninth example of a leak suppression structure. FIG. 25 is a plan view for explaining the arrangement of a first electrode and a third electrode. FIGS. 26A, 26B, and 26C are conceptual diagrams for explaining the relationship between a normal LN passing through the center of the light-emitting portion, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selection portion, respectively. FIG. 27 is a conceptual diagram for explaining the relationship between a normal LN passing through the center of the light-emitting portion, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selection portion. Figures 28A and 28B are conceptual diagrams for explaining the relationship between the normal line LN passing through the center of the light-emitting section, the normal line LN' passing through the center of the lens member, and the normal line LN" passing through the center of the wavelength selection section. Figure 29 is a conceptual diagram for explaining the relationship between the normal line LN passing through the center of the light-emitting section, the normal line LN' passing through the center of the lens member, and the normal line LN" passing through the center of the wavelength selection section.FIG. 30A is a schematic cross-sectional view illustrating a first example of a resonator structure. FIG. 30B is a schematic cross-sectional view illustrating a second example of a resonator structure. FIG. 31A is a schematic cross-sectional view illustrating a third example of a resonator structure. FIG. 31B is a schematic cross-sectional view illustrating a fourth example of a resonator structure. FIG. 32A is a schematic cross-sectional view illustrating a fifth example of a resonator structure. FIG. 32B is a schematic cross-sectional view illustrating a sixth example of a resonator structure. FIG. 33 is a schematic cross-sectional view illustrating a seventh example of a resonator structure. FIG. 34A is a front view of a digital still camera. FIG. 34B is a rear view of a digital still camera. FIG. 35 is a perspective view of a head-mounted display. FIG. 36 is a perspective view of a television device. FIG. 37 is a perspective view of a see-through head-mounted display. FIG. 38 is a perspective view of a smartphone. FIG. 39A is a view showing the interior of a vehicle from the rear to the front of the vehicle. FIG. 39B is a view showing the interior of a vehicle from diagonally rear to diagonally front of the vehicle.

[0008] Embodiments of the present disclosure will be described in the following order: 1. General Description of the Display Device According to the Present Disclosure 2. Background to the Creation of the Embodiments of the Present Disclosure 3. One Embodiment (Example of a Display Device) 4. Modifications 5. Example of a Leakage Suppression Structure 6. Relationship Between Normals Passing Through the Centers of the Light-Emitting Section, Lens Member, and Wavelength Selecting Section 7. Example of a Resonator Structure 8. Application Example (Example of an Electronic Device) The embodiments described below are preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments. Note that in the following description, components having substantially the same functional configuration are given the same reference numerals, and redundant description will be omitted as appropriate. Furthermore, to prevent the illustrations from becoming too complicated, reference numerals may be given to only some of the components, or the illustrations may be simplified, enlarged, or reduced in size.

[0009] <1 General Description of the Display Device According to the Present Disclosure> In the present disclosure, the plurality of light-emitting elements and the sealing material may be adjacent to each other without any other layer sandwiched therebetween, or the plurality of light-emitting elements and the sealing material may be separated from each other by one or more other layers sandwiched therebetween. Examples of other layers include a protective layer, a planarizing layer, a color filter, and a lens array.

[0010] In the present disclosure, the first inorganic thin film and the third inorganic thin film may be either an inorganic monolayer film or an inorganic multilayer film. In an inorganic multilayer film, the term "multilayer" refers to two or more layers. When the first inorganic thin film and the third inorganic thin film are inorganic multilayer films, it is preferable that at least one layer of the inorganic multilayer film is an atomic layer deposition film. The inorganic multilayer film may include a first thin film and a second thin film. When the first inorganic thin film is an inorganic multilayer film and includes a first thin film and a second thin film, the first thin film may be disposed adjacent to the encapsulant, or the second thin film may be disposed adjacent to the encapsulant. When the third inorganic thin film is an inorganic multilayer film and includes a first thin film and a second thin film, the first thin film may be disposed adjacent to the lens array, or the second thin film may be disposed adjacent to the lens array. For example, the first thin film may be an atomic layer deposition film, and the second thin film may be an atomic layer deposition film or a chemical vapor deposition film.

[0011] In the present disclosure, from the viewpoint of suppressing moisture penetration into the light-emitting device, the first inorganic thin film preferably covers the main surface of the encapsulant, and more preferably covers both the main surface and the side surface of the encapsulant. The first inorganic thin film may also cover the side surface of a layer provided below the encapsulant.

[0012] In the present disclosure, when the encapsulating material includes both a resin layer and a second inorganic thin film, the resin layer and the second inorganic thin film may be laminated. The resin layer and the second inorganic thin film may each have a single-layer structure or a laminated structure. The encapsulating resin layer may be, for example, a hard coat layer and may include a cured product of an ultraviolet-curable resin composition. The second inorganic thin film may be, for example, a chemical vapor deposition film.

[0013] The light-emitting device according to the present disclosure may be a display device, a lighting device, or other devices. The display device may be an OLED (Organic Light Emitting Diode) display device.

[0014] The display device according to the present disclosure may be included in an electronic device. For example, the display device according to the present disclosure may be included in an eyewear device such as a virtual reality (VR) device, a mixed reality (MR) device, or an augmented reality (AR) device, or may be included in an electronic viewfinder (EVF), a small projector, or the like.

[0015] In the present disclosure, "on object A" in expressions such as "object B is provided on object A" indicates the relative positional relationship between object A and object B, and includes not only a state in which object B is located directly on object A without any other objects in between, but also a state in which object B is located on object A with at least one other object in between.

[0016] In this disclosure, the refractive index refers to the refractive index for light with a wavelength of 589.3 nm (the D line of sodium).

[0017] 2. Background to the Creation of the Embodiments of the Present Disclosure The present inventors have been studying display devices that include a sealing resin layer, such as a hard coat layer, as a sealing material instead of a glass substrate. However, because the moisture permeability of the sealing resin layer is higher than that of the glass substrate, defects such as dark dots (non-emitting pixels or non-emitting sub-pixels) are likely to occur in display devices that include a sealing resin layer as a sealing material.

[0018] Therefore, the present inventors have conducted extensive research into a technology capable of suppressing moisture penetration in a display device provided with a sealing resin layer as a sealing material, and as a result have discovered a display device in which an inorganic multilayer film including an atomic layer deposition film is provided on a sealing resin layer.

[0019] 3. One embodiment [Schematic configuration of display device 101] Fig. 1 is a plan view of a display device 101 according to one embodiment. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. The display device 101 has a display region RE1 and a peripheral region RE2 provided around the display region RE1. The display device 101 is an example of a light-emitting device.

[0020] In this specification, a first direction and a second direction that are orthogonal to each other within the display surface of the display device 101 are referred to as the X-axis direction and the Y-axis direction, respectively, and a third direction that is perpendicular to the display surface of the display device 101 is referred to as the Z-axis direction. In one embodiment, an example will be described in which the X-axis direction is the horizontal direction of the display surface and the Y-axis direction is the vertical direction of the display surface.

[0021] In one embodiment, an example will be described in which the display device 101 is a top-emission display device, but the type of the display device 101 is not limited to this example. The display device 101 may also be a microdisplay.

[0022] A plurality of sub-pixels 10R, 10G, and 10B are two-dimensionally arranged in a specified arrangement pattern within the display region RE1. The specified arrangement pattern may be a stripe arrangement, a mosaic arrangement, a square arrangement, a delta arrangement, or any other arrangement. A pad section 111 and a driver (not shown) for displaying images are provided in the peripheral region RE2. A flexible printed circuit (FPC) (not shown) may be connected to the pad section 111.

[0023] The sub-pixel 10R can emit red light (first light). The sub-pixel 10G can emit green light (second light). The sub-pixel 10B can emit blue light (third light). In the following description, when the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, the sub-pixels 10R, 10G, and 10B may be simply referred to as sub-pixels 10. One pixel (one pixel) is composed of, for example, a plurality of adjacent sub-pixels 10R, 10G, and 10B. However, the configuration of one pixel is not limited to this example, and one pixel may be composed of, for example, a plurality of adjacent sub-pixels 10R, 10G, 10B, and 10B.

[0024] [Layer structure of display device 101] As shown in Figure 2, the display device 101 includes a drive substrate 11, a plurality of light-emitting elements 12, a contact electrode 124, an insulating layer 13, a protective layer 14, a planarization layer 15, a color filter 16, a light-shielding layer 16BK, a planarization layer 17, a lens array 18, a low-refractive index layer 19, a sealing resin layer 20, and an inorganic multilayer film 21.

[0025] In this specification, of the two surfaces of each layer constituting display device 101, the surface facing the display surface (top side) of display device 101 may be referred to as the first surface (upper surface), and the surface facing the opposite side (bottom side) of display device 101 from the display surface may be referred to as the second surface (lower surface). In this specification, the peripheral edge of the first surface refers to an area having a predetermined width extending inward from the peripheral edge of the first surface, and the peripheral edge of the second surface refers to an area having a predetermined width extending inward from the peripheral edge of the second surface. In this specification, a planar view refers to a planar view when an object is viewed from a direction perpendicular to the first surface or the second surface.

[0026] (Drive Substrate 11) The drive substrate 11 is a so-called backplane, and is capable of driving a plurality of light-emitting elements 12. The drive substrate 11 includes, for example, a substrate and an insulating layer, both of which are not shown, in this order.

[0027] A plurality of drive circuits (not shown) and the like are provided on the first surface of the substrate. The substrate may be, for example, a semiconductor substrate on which transistors and the like can be easily formed, or a glass substrate or resin substrate with low moisture and oxygen permeability. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single crystal silicon. The glass substrate includes, for example, high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The resin substrate includes, for example, at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0028] The insulating layer is provided on the first surface of the substrate and covers a plurality of drive circuits and the like. The insulating layer includes a plurality of contact plugs and a plurality of wirings therein. The plurality of contact plugs and the plurality of wirings electrically connect the light-emitting elements 12 to the drive circuits and the like. The contact plugs include at least one metal of copper (Cu) and titanium (Ti), for example. The insulating layer includes the pad portion 111 on the first surface side, and the first surface of the pad portion 111 is exposed and not covered by the insulating layer.

[0029] The insulating layer is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resins, acrylic-based resins, and novolac-based resins. The inorganic insulating layer is, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like.

[0030] (Light-emitting element 12) The light-emitting element 12 can emit white light under the control of a drive circuit, etc. In one embodiment, the light-emitting element 12 is an organic light-emitting diode element (OLED element). The light-emitting element 12 is included in each of the sub-pixels 10R, 10G, and 10B of each color.

[0031] The plurality of light-emitting elements 12 are two-dimensionally arranged in a specified arrangement pattern on the first surface of the drive substrate 11. The specified arrangement pattern is as described above as the specified arrangement pattern of the plurality of sub-pixels 10. The light-emitting element 12 includes a first electrode 121, an OLED layer 122, and a second electrode 123, which are arranged in this order on the first surface of the drive substrate 11.

[0032] (First electrode 121) The first electrode 121 is provided on the second surface side of the OLED layer 122. The first electrode 121 is an individual electrode provided individually for each of the plurality of light-emitting elements 12. That is, the first electrode 121 is divided between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11. The first electrode 121 is an anode. When a voltage is applied between the first electrode 121 and the second electrode 123, holes are injected from the first electrode 121 into the OLED layer 122.

[0033] The first electrode 121 may be composed of, for example, a metal layer, or may be composed of a metal layer and a transparent conductive oxide layer. When the first electrode 121 is composed of a metal layer and a transparent conductive oxide layer, it is preferable that the transparent conductive oxide layer be provided on the OLED layer 122 side, from the viewpoint of having a layer having a high work function adjacent to the OLED layer 122.

[0034] The metal layer may function as a reflective layer that reflects light emitted by the OLED layer 122. The metal layer may contain at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may contain at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy and a silver alloy. Specific examples of the aluminum alloy include AlNd and AlCu.

[0035] An underlayer (not shown) may be provided adjacent to the second surface side of the metal layer. The underlayer may be capable of improving the crystal orientation of the metal layer during deposition. The underlayer may contain, for example, at least one metal element selected from the group consisting of titanium (Ti) and tantalum (Ta). The underlayer may contain the at least one metal element as a constituent element of an alloy.

[0036] The transparent conductive oxide layer contains a transparent conductive oxide, for example, at least one selected from the group consisting of transparent conductive oxides containing indium (hereinafter referred to as "indium-based transparent conductive oxides"), transparent conductive oxides containing tin (hereinafter referred to as "tin-based transparent conductive oxides"), and transparent conductive oxides containing zinc (hereinafter referred to as "zinc-based transparent conductive oxides").

[0037] Examples of indium-based transparent conductive oxides include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. Indium tin oxide (ITO) has a particularly low work function barrier for hole injection into the OLED layer 122, allowing the driving voltage of the display device 101 to be particularly low. Examples of tin-based transparent conductive oxides include tin oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Examples of zinc-based transparent conductive oxides include zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, and gallium-doped zinc oxide (GZO).

[0038] (OLED Layer 122) The OLED layer 122 can emit white light. The OLED layer 122 is an example of an organic-material-containing layer that includes an organic light-emitting layer. The OLED layer 122 is provided between a plurality of first electrodes 121 and one second electrode 123. The OLED layer 122 connects adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is a layer common to the plurality of light-emitting elements 12.

[0039] The OLED layer 122 may be configured as a laminate including an organic light-emitting layer, in which case some layers of the laminate (e.g., an electron injection layer) may be inorganic. The OLED layer 122 may be an OLED layer having a single light-emitting unit U as shown in FIG. 3A , an OLED layer having two light-emitting units U1 and U2 (tandem structure) as shown in FIG. 3B , or an OLED layer having a structure other than these. The OLED layer 122 having a single light-emitting unit U has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a red light-emitting layer 1220R, an emission separation layer 1223, a blue light-emitting layer 1220B, a green light-emitting layer 1220G, an electron transport layer 1224, and an electron injection layer 1225 are stacked in this order from the first electrode 121 to the second electrode 123. The OLED layer having two light-emitting units U1 and U2 has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a blue light-emitting layer 1220B, an electron transport layer 1226, a charge generation layer 1227, a hole transport layer 1228, a yellow light-emitting layer 1220Y, an electron transport layer 1224, and an electron injection layer 1225 are laminated in this order from the first electrode 121 to the second electrode 123.

[0040] The hole injection layer 1221 can increase the efficiency of hole injection into the light-emitting layers 1220R, 1220G, and 1220B and suppress leakage. The hole transport layers 1222 and 1228 can increase the efficiency of hole transport into the light-emitting layers 1220R, 1220B, and 1220Y. The electron injection layer 1225 can increase the efficiency of electron injection into the light-emitting layers 1220G and 1220Y. The electron transport layers 1224 and 1226 can increase the efficiency of electron transport into the light-emitting layers 1220G, 1220B, and 1220Y. The emission separation layer 1223 is a layer for adjusting the injection of carriers into the light-emitting layers 1220R, 1220G, and 1220B. The balance of light emission of each color is adjusted by injecting electrons and holes into the light-emitting layers 1220R, 1220G, and 1220B via the emission separation layer 1223. The charge generating layer 1227 can supply electrons and holes to the blue light emitting layer 1220B and the yellow light emitting layer 1220Y, which are disposed so as to sandwich the charge generating layer 1227, respectively.

[0041] When an electric field is applied to the red light-emitting layer 1220R, the green light-emitting layer 1220G, the blue light-emitting layer 1220B, and the yellow light-emitting layer 1220Y, recombination occurs between holes injected from the first electrode 121 or the charge generation layer 1227 and electrons injected from the second electrode 123 or the charge generation layer 1227, and the red light, green light, blue light, and yellow light can be emitted.

[0042] (Second electrode 123) The second electrode 123 is provided on the first surface side of the OLED layer 122. The second electrode 123 is connected between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is an electrode common to the plurality of light-emitting elements 12.

[0043] The second electrode 123 is a cathode. When a voltage is applied between the first electrode 121 and the second electrode 123, electrons are injected from the second electrode 123 into the OLED layer 122. The second electrode 123 is translucent to the white light emitted from the OLED layer 122. The second electrode 123 is preferably a transparent electrode that is transparent to visible light. In this specification, visible light refers to light in a wavelength range of 360 nm or more and 780 nm or less.

[0044] In order to improve luminous efficiency, it is preferable that the second electrode 123 be made of a material that is as transparent as possible and has a small work function. The second electrode 123 is made of, for example, at least one layer of a metal layer and a transparent conductive oxide layer. More specifically, the second electrode 123 is made of a single layer film of a metal layer or a transparent conductive oxide layer, or a laminate film of a metal layer and a transparent conductive oxide layer. When the second electrode 123 is made of a laminate film, the metal layer may be provided on the OLED layer 122 side, or the transparent conductive oxide layer may be provided on the OLED layer 122 side. However, from the viewpoint of having a layer with a low work function adjacent to the OLED layer 122, it is preferable that the metal layer be provided on the OLED layer 122 side.

[0045] The metal layer contains, for example, at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an MgAg alloy, an MgAl alloy, and an AlLi alloy. The transparent conductive oxide layer contains a transparent conductive oxide. Examples of the transparent conductive oxide include the same materials as the transparent conductive oxide of the first electrode 121 described above.

[0046] (Contact electrode 124) The contact electrode 124 is provided on the first surface of the drive substrate 11 in the peripheral region RE2. The contact electrode 124 is an auxiliary electrode that connects the second electrode 123 to wiring (not shown) in the drive substrate 11. The first surface of the contact electrode 124 is electrically connected to the peripheral edge of the second surface of the second electrode 123. On the other hand, the second surface of the contact electrode 124 is connected to wiring via a plurality of contact plugs or the like.

[0047] In a plan view, the contact electrode 124 may have a closed loop shape that surrounds the entire outer periphery of the display region RE1, or may have a loop shape that surrounds the outer periphery of the display region RE1 and is divided at one or more points.

[0048] The contact electrode 124 is composed of, for example, at least one layer of a metal layer and a metal oxide layer. More specifically, for example, the contact electrode 124 is composed of a single layer film of a metal layer or a metal oxide layer, or a laminate film of a metal layer and a metal oxide layer. The contact electrode 124 preferably has a configuration similar to that of the first electrode 121 described above. In this case, the first electrode 121 and the contact electrode 124 can be formed in the same process, thereby simplifying the manufacturing process of the display device 101.

[0049] Examples of materials contained in the contact electrode 124 include the same materials as those of the above-described first electrode 121. Specifically, examples of materials contained in the metal layer of the contact electrode 124 include the same materials as those of the above-described metal layer of the first electrode 121, and examples of materials contained in the metal oxide layer of the contact electrode 124 include the same materials as those of the above-described metal oxide layer of the first electrode 121.

[0050] An underlayer (not shown) may be provided adjacent to the second surface side of the metal layer. Examples of materials contained in the underlayer include the same materials as those of the underlayer of the first electrode 121 described above.

[0051] (Insulating Layer 13) The insulating layer 13 is provided on the first surface of the drive substrate 11 in areas such as between the spaced apart first electrodes 121 and between the first electrodes 121 and the contact electrodes 124. The insulating layer 13 can provide insulation between the first electrodes 121 that are adjacent in the in-plane direction of the first surface of the drive substrate 11, and between the first electrodes 121 and the contact electrodes 124 that are adjacent in the in-plane direction of the first surface of the drive substrate 11.

[0052] The insulating layer 13 has a plurality of openings 13a, one opening 13d, and one opening 13e. The plurality of openings 13a are provided corresponding to the respective light-emitting elements 12. The plurality of openings 13a may be provided on the first surface (the surface facing the OLED layer 122) of each first electrode 121. That is, the peripheral portion of the first surface of each first electrode 121 may be covered by the insulating layer 13. In this case, the first electrode 121 and the OLED layer 122 come into contact with each other through the openings 13a. The shape of the openings 13a in a plan view is not particularly limited, and may be, for example, a substantially rectangular, a substantially circular, or a substantially elliptical shape.

[0053] The opening 13d is provided corresponding to the contact electrode 124. The opening 13d may be provided on the first surface of the contact electrode 124 (the surface connected to the peripheral edge of the second surface of the second electrode 123). In this case, the contact electrode 124 and the peripheral edge of the second electrode 123 come into contact with each other through the opening 13d. The opening 13d may have a groove shape similar to that of the contact electrode 124. The opening 13e is provided on the first surface of the pad portion 111.

[0054] The insulating layer 13 is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resins, acrylic-based resins, and novolac-based resins. The inorganic insulating layer is, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like.

[0055] (Protective Layer 14) The protective layer 14 is provided on the first surface of the second electrode 123 and covers the plurality of light-emitting elements 12. The protective layer 14 is translucent to white light emitted from the light-emitting elements 12. The protective layer 14 can protect the plurality of light-emitting elements 12 and the like. For example, the protective layer 14 can prevent moisture from entering the plurality of light-emitting elements 12 and the like from the external environment. Furthermore, when the second electrode 123 is formed of a metal layer, the protective layer 14 may have a function of preventing oxidation of this metal layer.

[0056] The protective layer 14 has one opening 14a. The opening 14a overlaps with the opening 13e of the insulating layer 13. The overlapping openings 14a and 13e form an opening 111a, and the first surface of the pad portion 111 is exposed through this opening 111a.

[0057] The protective layer 14 contains, for example, at least one of an inorganic material and an organic material having low moisture absorption. The protective layer 14 may have a single layer structure or a multilayer structure. When the thickness of the protective layer 14 is increased, a multilayer structure is preferable. This is because the internal stress in the protective layer 14 can be alleviated. The inorganic material can be, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ), silicon oxynitride (SiO ｘ N ｙ ), titanium oxide (TiO ｘ ) and aluminum oxide (AlO ｘ The organic material includes at least one selected from the group consisting of a thermosetting resin composition and a photosensitive resin composition. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition. Specific examples of the organic material include at least one selected from the group consisting of an acrylic resin, a polyimide resin, a novolac resin, an epoxy resin, a norbornene resin, and a parylene resin.

[0058] The protective layer 14 preferably includes an atomic layer deposition film. The atomic layer deposition film can be formed by atomic layer deposition (ALD). When the protective layer 14 includes an atomic layer deposition film, the effect of the protective layer 14 in suppressing moisture penetration can be improved. The atomic layer deposition film includes, for example, a metal oxide or a metal nitride. The metal oxide can be, for example, aluminum oxide (AlO ｘ ) or titanium oxide (TiO ｘ Metal nitrides include, for example, silicon nitride (SiN ｘ ) or titanium nitride (TiN ｘ ) is included.

[0059] (Planarization Layer 15) The planarization layer 15 is provided on the first surface of the protective layer 14. The planarization layer 15 fills in the irregularities on the first surface of the protective layer 14, and can form a flat first surface on the upper side of the protective layer 14. The planarization layer 15 is translucent to the white light emitted from the light-emitting element 12.

[0060] The planarization layer 15 is, for example, a resin layer. The resin layer includes, for example, a cured product of a photosensitive resin composition. The photosensitive resin composition may include either a positive-type photosensitive resin composition or a negative-type photosensitive resin composition. Specific examples of the photosensitive resin composition include at least one selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, acrylic resin, phenolic resin, and siloxane resin.

[0061] (Color Filter 16) The color filter 16 is a so-called on-chip color filter (OCCF). The color filter 16 is provided above the plurality of light-emitting elements 12. More specifically, the color filter 16 is provided on the first surface of the planarization layer 15. The color filter 16 includes, for example, a plurality of colored layers 16FR, a plurality of colored layers 16FG, and a plurality of colored layers 16FB. In the following description, when the colored layers 16FR, 16FG, and 16FB are referred to collectively without any particular distinction, the colored layers 16FR, 16FG, and 16FB may be simply referred to as colored layers 16F.

[0062] The multiple colored layers 16F are two-dimensionally arranged on the first surface of the planarization layer 15 in a specified arrangement pattern. The specified arrangement pattern is as described above for the multiple sub-pixels 10. Each colored layer 16F is provided above a light-emitting element 12. The sub-pixel 10R is composed of a light-emitting element 12 and a colored layer 16FR provided above the light-emitting element 12. The sub-pixel 10G is composed of a light-emitting element 12 and a colored layer 16FG provided above the light-emitting element 12. The sub-pixel 10B is composed of a light-emitting element 12 and a colored layer 16FB provided above the light-emitting element 12.

[0063] The coloring layer 16FR has a red color. The coloring layer 16FR transmits the red light component of the white light emitted from the light-emitting element 12 but can absorb visible light components other than red light. The coloring layer 16FG has a green color. The coloring layer 16FG transmits the green light component of the white light emitted from the light-emitting element 12 but can absorb visible light components other than green light. The coloring layer 16FB has a blue color. The coloring layer 16FB transmits the blue light component of the white light emitted from the light-emitting element 12 but can absorb visible light components other than blue light.

[0064] The colored layer 16FR includes, for example, a red color resist, the colored layer 16FG includes, for example, a green color resist, and the colored layer 16FB includes, for example, a blue color resist.

[0065] (Light-shielding layer 16BK) The light-shielding layer 16BK is provided on the first surface of the planarization layer 15 in the peripheral region RE2. The light-shielding layer 16BK is located above the contact electrodes 124 and covers the contact electrodes 124 from above. The light-shielding layer 16BK can absorb and block external light (visible light) that enters the peripheral region RE2. This can suppress reflection of external light on the contact electrodes 124 and the like. The light-shielding layer 16BK may have a loop shape similar to that of the contact electrodes 124.

[0066] The light-shielding layer 16BK preferably includes a colored layer 16FR and a colored layer 16FB. This configuration of the light-shielding layer 16BK allows the color filter 16 and the light-shielding layer 16BK to be formed in the same process. While FIG. 2 illustrates an example in which the colored layer 16FB is provided on the first surface of the colored layer 16FR, the colored layer 16FR may also be provided on the first surface of the colored layer 16FB. While FIG. 2 illustrates an example in which the colored layers 16FR and 16FB of the light-shielding layer 16BK are thinner than the colored layers 16FR and 16FB of the color filter 16, the colored layers 16FR and 16FB of the light-shielding layer 16BK may have substantially the same thickness as the colored layers 16FR and 16FB of the color filter 16.

[0067] The light-shielding layer 16BK is not limited to the above configuration, and may be, for example, a light-shielding layer 16BK containing a black light-absorbing material. The black light-absorbing material contains, for example, at least one material selected from the group consisting of a black resin material and a black metal-containing material. The black resin material contains, for example, a carbon material such as carbon black. The black resin material may contain, for example, a black color resist. The black metal-containing material is, for example, titanium nitride (TiN ｘ ) etc.

[0068] (Planarization Layer 17) The planarization layer 17 is provided on the first surface of the color filter 16. The planarization layer 17 fills in the irregularities on the first surface of the color filter 16, and can form a flat first surface on the upper side of the color filter 16. The planarization layer 17 is translucent to the red light, green light, and blue light emitted from the color filter 16. The planarization layer 17 is, for example, a resin layer. Examples of materials for the resin layer include the same materials as those for the planarization layer 15.

[0069] (Lens Array 18) The lens array 18 is provided on the first surface of the planarization layer 17. The lens array 18 includes a plurality of lenses 181. The lenses 181 can collect light emitted upward from the light-emitting elements 12 and incident through the colored layer 16F in a forward direction. The lenses 181 are convex lenses having a convex collecting surface on the side opposite to the light-emitting elements 12. The plurality of lenses 181 are so-called on-chip microlenses (OCLs), and are two-dimensionally arranged on the first surface of the planarization layer 17 in a specified arrangement pattern. The specified arrangement pattern is as described above for the specified arrangement pattern of the plurality of subpixels 10. The center of the lens 181 substantially coincides with the center of the light-emitting region of the light-emitting element 12 in a planar view.

[0070] The light-collecting surface of the lens 181 preferably has a convex curved surface shape. Examples of convex curved surfaces include, but are not limited to, a substantially parabolic or substantially hemispherical shape. Here, the term "substantially parabolic or substantially hemispherical" does not necessarily mean a parabolic or hemispherical shape in the strict sense, but includes shapes that are visually perceived as being close to a parabolic or hemispherical shape. For example, this includes a parabolic or hemispherical shape that is distorted or deformed within the range of tolerance, error, etc.

[0071] The lens 181 includes, for example, an organic material or an inorganic material that is transparent to visible light. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet curable resin composition. The inorganic material includes, for example, silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ The lens 181 may contain a filler. By adjusting the content of the filler contained in the lens 181, the refractive index n １ The filler may be an inorganic filler. The inorganic filler may be, for example, aluminum oxide (AlO ｘ ), titanium oxide (TiO ｘ ) and zirconium oxide (ZrO ｘ The filler may be a hollow filler.

[0072] (Low-Refractive Index Layer 19) The low-refractive index layer 19 is provided on the first surface of the lens array 18 and covers the light-collecting surfaces of the multiple lenses 181. By providing the low-refractive index layer 19 on the first surface of the lens array 18, the refractive index of the sealing resin layer 20 does not need to be lower than that of the lens array 18, thereby broadening the options for materials for the sealing resin layer 20. The low-refractive index layer 19 has a wall portion 191 on the periphery of the second surface (the surface facing the lens array 18). The wall portion 191 preferably has a closed loop shape in a planar view. The wall portion 191 covers the side surfaces of the planarization layer 15, the light-shielding layer 16BK, and the planarization layer 17, and the top of the wall portion 191 is in close contact with the first surface of the protective layer 14. This prevents moisture from entering the display device 101 from the side surfaces.

[0073] The low refractive index layer 19 is transparent to the light of each color emitted from the color filter 16. The low refractive index layer 19 has a refractive index n １ A low refractive index n ２ (n ２ <n １ The low refractive index layer 19 has a refractive index n １ A low refractive index n ２ By having this, it is possible to refract and concentrate light at the interface between the lens 181 and the sealing resin layer 20. Therefore, it is possible to improve the light extraction function.

[0074] The low refractive index layer 19 includes an organic material or an inorganic material that is transparent to visible light. The organic material includes, for example, a cured product of at least one resin selected from a thermosetting resin composition and an ultraviolet curable resin composition. The inorganic material includes, for example, silicon oxide (SiO ｘ ) and silicon oxynitride (SiO ｘ N ｙ The low refractive index layer 19 may contain a filler. By adjusting the content of the filler contained in the low refractive index layer 19, the refractive index n ２ The filler may be an inorganic filler. The inorganic filler may be, for example, silicon oxide (SiO ｘ ), aluminum oxide (AlOｘ ), titanium oxide (TiO ｘ ) and zirconium oxide (ZrO ｘ The filler may be a hollow filler.

[0075] (Encapsulating resin layer 20) The encapsulating resin layer 20 covers the first surface of the low refractive index layer 19 and the side surfaces of the low refractive index layer 19. The encapsulating resin layer 20 is an example of a resin layer (encapsulant). The encapsulating resin layer 20 encapsulates the plurality of light-emitting elements 12 and the like provided on the first surface of the drive substrate 11. The encapsulating resin layer 20 can protect each component, such as the plurality of light-emitting elements 12, from moisture, impact, and the like. The encapsulating resin layer 20 may be a hard coat layer. In this case, the properties of the display device 101, such as scratch resistance and weather resistance, can be improved. The encapsulating resin layer 20 is translucent to the light of each color emitted from the color filter 16.

[0076] The sealing resin layer 20 has a wall portion 201 at the periphery of the second surface (the surface on the low-refractive-index layer 19 side). The wall portion 191 preferably has a closed loop shape in a plan view. The wall portion 201 covers the side surface of the low-refractive-index layer 19, and the top of the wall portion 201 is in close contact with the first surface of the protective layer 14. This makes it possible to suppress moisture penetration from the side surface of the display device 101. The lower limit of the width D of the wall portion 201 is preferably selected in consideration of the suppression of moisture penetration and the adhesion of the wall portion 201 to the protective layer 14, and is, for example, 50 μm or more. The upper limit of the width D of the wall portion 201 is preferably 250 μm or less in order to suppress an increase in the area of ​​the peripheral region RE2.

[0077] The encapsulating resin layer 20 includes a cured product of an encapsulating resin composition. The encapsulating resin composition includes, for example, at least one of a thermosetting resin composition and a photosensitive resin composition. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition.

[0078] (Inorganic multilayer film 21) The inorganic multilayer film 21 covers the first surface (the main surface opposite to the light-emitting element 12 side) of the sealing resin layer 20, the side surfaces of the sealing resin layer 20, and the side surfaces of the protective layer 14. The inorganic multilayer film 21 is an example of a first inorganic thin film. The inorganic multilayer film 21 functions as a barrier film and can suppress moisture penetration into the display device 101. Preferably, the inorganic multilayer film 21 also functions as a multilayer anti-reflection film (multilayer AR film). Here, the multilayer anti-reflection film is a film configured to suppress light reflection by utilizing optical interference. The light whose reflection is suppressed by the multilayer anti-reflection film is light emitted from the light-emitting element 12 and / or external light incident on the display surface. In this specification, "and / or" means at least one of the following; for example, "X and / or Y" means three possibilities: X only, Y only, or X and Y.

[0079] When the inorganic multilayer film 21 is a multilayer anti-reflection film capable of suppressing light emitted from the light emitting element 12, it is possible to improve the light extraction efficiency from the display device 101. It is also possible to suppress reflection of stray light on the side surface of the sealing resin layer 20. On the other hand, when the inorganic multilayer film 21 is a multilayer anti-reflection film capable of suppressing external light incident on the display surface, it is possible to improve the visibility of the display device 101.

[0080] The inorganic multilayer film 21 includes a first thin film 21a and a second thin film 21b. The first thin film 21a and the second thin film 21b are stacked in this order on the first surface of the sealing resin layer 20, on the side surface of the sealing resin layer 20, and on the side surface of the protective layer 14. The function as a multilayer anti-reflection film can be obtained, for example, by controlling the refractive index and thickness of the first thin film 21a and the second thin film 21b. One of the first thin film 21a and the second thin film 21b may be a low refractive index film, and the other may be a high refractive index film.

[0081] The first thin film 21a is an atomic layer deposition film. Since an atomic layer deposition film is a dense film, the first thin film 21a is an atomic layer deposition film, which can improve the effect of suppressing moisture penetration. The atomic layer deposition film can be formed by atomic layer deposition (ALD). The atomic layer deposition film includes, for example, a metal oxide or a metal nitride. The metal oxide is, for example, aluminum oxide (AlO ｘ ) or titanium oxide (TiO ｘ Metal nitrides include, for example, silicon nitride (SiN ｘ ) or titanium nitride (TiN ｘ The thickness of the first thin film 21a is, for example, not less than 5 nm and not more than 150 nm.

[0082] The second thin film 21b may be made of a material different from that of the first thin film 21a. The second thin film 21b is preferably a low-temperature oxidation (LTO) film. When the second thin film 21b is a low-temperature oxide film, damage to the OLED layer 122 during the formation of the second thin film 21b can be suppressed. The low-temperature oxide film is, for example, an atomic layer deposition film or a chemical vapor deposition film, preferably an atomic layer deposition film. Because an atomic layer deposition film is a dense film, when the low-temperature oxide film is an atomic layer deposition film, the effect of suppressing moisture penetration into the inorganic multilayer film 21 can be further improved.

[0083] The atomic layer deposition film can be formed by atomic layer deposition (ALD). The chemical vapor deposition film can be formed by chemical vapor deposition (CVD). Examples of CVD include thermal CVD, catalytic chemical vapor deposition, photo CVD, vacuum plasma CVD, and atmospheric pressure plasma CVD. The second thin film 21b can be formed by, for example, silicon oxide (SiO ｘ The second thin film 21b may include silicon dioxide (SiOC) or silicon dioxide containing carbon (SiOC). The thickness of the second thin film 21b is, for example, not less than 50 nm and not more than 200 nm.

[0084] [Method for Manufacturing Display Device 101] Hereinafter, an example of a method for manufacturing the display device 101 according to an embodiment will be described with reference to FIGS. 2, 4, 5, and 6. FIG.

[0085] (Process for forming first electrodes 121 and contact electrodes 124) First, a metal layer and a metal oxide layer are formed in this order on the first surface of the drive substrate 11, for example, by vacuum deposition or sputtering, and then the metal layer and the metal oxide layer are patterned using, for example, photolithography. As a result, a plurality of first electrodes 121 and contact electrodes 124 are formed on the first surface of the drive substrate 11.

[0086] (Step of forming insulating layer 13) Next, the insulating layer 13 is formed on the first surface of the drive substrate 11 by, for example, CVD so as to cover the plurality of first electrodes 121 and the contact electrodes 124. Next, the plurality of openings 13a, one opening 13d, and one opening 13e are formed in the insulating layer 13 by, for example, photolithography.

[0087] (Step of forming OLED layer 122) Next, a hole transport layer, a red light-emitting layer, an emission separation layer, a blue light-emitting layer, a green light-emitting layer, an electron transport layer, and an electron injection layer are stacked in this order on the first surfaces of the plurality of first electrodes 121 and on the first surface of the insulating layer 13, for example, by vapor deposition, to form the OLED layer 122.

[0088] (Step of Forming Second Electrode 123) Next, the second electrode 123 is formed on the first surface of the OLED layer 122 and on the first surface of the contact electrode 124, for example, by vacuum deposition or sputtering. As a result, a plurality of light-emitting elements 12 are formed on the first surface of the drive substrate 11, and the peripheral portion of the second surface of the second electrode 123 is connected to the contact electrode 124.

[0089] (Step of Forming Protective Layer 14) Next, the protective layer 14 is formed on the first surface of the second electrode 123 and the first surface of the pad portion 111 by, for example, CVD.

[0090] (Step of forming planarization layer 15) Next, for example, a photosensitive resin composition is applied to the first surface of the protective layer 14, and then the photosensitive resin composition is exposed to light, developed, etc., to form the planarization layer 15 on the first surface of the protective layer 14.

[0091] (Process for Forming Color Filter 16 and Light-Shielding Layer 16BK) Next, a green color resist is applied to the first surface of the planarization layer 15, and then irradiated with ultraviolet light through a photomask for pattern exposure, followed by development to form multiple colored layers 16FG. Next, a red color resist is applied to the first surface of the planarization layer 15 so as to cover the multiple colored layers 16FG, and then irradiated with ultraviolet light through a photomask for pattern exposure, followed by development to form multiple colored layers 16FR. Next, a blue color resist is applied to the first surface of the planarization layer 15 so as to cover the multiple colored layers 16FG and the multiple colored layers 16FR, and then irradiated with ultraviolet light through a photomask for pattern exposure, followed by development to form multiple colored layers 16FB. This forms the color filter 16 and the light-shielding layer 16BK on the first surface of the planarization layer 15.

[0092] (Process for forming planarization layer 17) Next, for example, a photosensitive resin composition is applied to the first surface of the color filter 16 and the light-shielding layer 16BK, and then the photosensitive resin composition is exposed to light, developed, etc., to form a planarization layer 17 that covers the color filter 16 and the light-shielding layer 16BK.

[0093] (Lens Array 18 Formation Process) Next, a photosensitive resin composition serving as a lens material is applied to the first surface of the planarization layer 17 and cured by light irradiation to form a photosensitive resin layer serving as a lens material layer. Next, the photosensitive resin layer is patterned, for example, by photolithography technology, to form a plurality of pillars on the first surface of the planarization layer 17. Next, the plurality of pillars are processed into a convex curved surface, for example, by reflow treatment (heat treatment) or etch-back. In this way, a plurality of lenses 181 are formed on the first surface of the planarization layer 17.

[0094] (Step of Forming Low Refractive Index Layer 19) Next, a low refractive index resin composition is applied so as to cover the lenses 181 and the light-shielding layer 16BK, and then cured to form the low refractive index layer 19.

[0095] (Process for forming encapsulating resin layer 20) Next, an encapsulating resin composition is applied to the first surface of the low refractive index layer 19 and then cured to form the encapsulating resin layer 20. The encapsulating resin composition may be a hard coat resin composition. Next, as shown in FIG. 4 , a portion of the encapsulating resin layer 20 located above the pads 113 is removed by, for example, photolithography, to expose a portion of the first surface of the protective layer 14.

[0096] (Step of forming inorganic multilayer film 21) Next, a first thin film 21a is formed on the first surface of the sealing resin layer 20, on the side surfaces of the sealing resin layer 20, and on the side surfaces of the protective layer 14, for example, by atomic layer deposition (ALD). Next, a second thin film 21b is formed on the first surface of the first thin film 21a, on the side surfaces of the sealing resin layer 20, and on the side surfaces of the protective layer 14, for example, by atomic layer deposition (ALD) or chemical vapor deposition (CVD). As a result, the inorganic multilayer film 21 is formed on the first surface of the sealing resin layer 20, on the side surfaces of the sealing resin layer 20, and on the side surfaces of the protective layer 14.

[0097] (Step of forming opening 111a) Next, by using, for example, photolithography, the portions of the protective layer 14 and the inorganic multilayer film 21 that are located on the first surface of the pad portion 111 are removed. As a result, the opening 111a is formed on the first surface of the pad portion 111, as shown in FIG.

[0098] (Single Process) Next, if necessary, the drive substrate 11 on which the layers are stacked as described above is cut and singulated. Through the above process, the display device 101 according to one embodiment is obtained.

[0099] [Effects] In the display device 101 according to one embodiment, the inorganic multilayer film 21 covers the first surface (the surface opposite the light-emitting element 12) of the sealing resin layer 20 and the side surfaces of the sealing resin layer 20. The inorganic multilayer film 21 includes a first thin film 21a and a second thin film 21b, in that order, and at least the first thin film 21a of the first thin film 21a and the second thin film 21b is an atomic layer deposition film. This makes it possible to prevent moisture from entering the display device 101 even if the display device 101 does not include a glass substrate as a sealing material. This makes it possible to prevent defects such as dark dots from occurring.

[0100] Since the display surface of the display device 101 is covered with the inorganic multilayer film 21, the surface hardness can be improved compared to when the display surface of the display device 101 is configured with the sealing resin layer 20 such as a hard coat layer. Therefore, the scratch resistance and the like of the display device 101 can be improved.

[0101] The second thin film 21b, which is the outermost surface, is made of silicon oxide (SiO ｘ When the display device 101 contains a highly hydrophilic material such as acrylic resin, it is possible to improve resistance to the cleaning process. Therefore, it is possible to improve the handling property and yield during assembly of the display device 101. Here, the cleaning process refers to a cleaning process for the display surface of the display device 101 that is carried out when an optical element (e.g., a polarizing element) is bonded to the display surface of the display device 101.

[0102] Since the glass substrate as a sealing material can be omitted, a step of dividing the glass substrate can be omitted in the manufacturing process of the display device 101. Therefore, the number of manufacturing steps of the display device 101 can be reduced.

[0103] Since the inorganic multilayer film 21 covers the first surface of the sealing resin layer 20 (the surface opposite to the light-emitting element 12) and the side surface of the sealing resin layer 20, it is possible to prevent moisture from entering the display device 101 even if pinholes occur in the sealing resin layer 20 due to dust or the like during film formation.

[0104] 2 has been described in the embodiment, with the lens array 18 and the low-refractive-index layer 19 provided on the first surface of the planarization layer 17. However, the configuration of the display device 101 is not limited to this example. As shown in FIG. 7 , the lens array 18 and the low-refractive-index layer 19 may not be provided on the first surface of the planarization layer 17, and the sealing resin layer 20 may be provided directly on the first surface of the planarization layer 17. In this case, the wall portion 201 of the sealing resin layer 20 may cover the side surface of the planarization layer 15, the side surface of the light-shielding layer 16BK, and the side surface of the planarization layer 17.

[0105] [Variation 2] In the embodiment, the inorganic multilayer film 21 is provided on the sealing resin layer 20 because the moisture permeability of the sealing resin layer 20 is higher than that of the glass substrate, making defects such as dark spots more likely to occur. However, the moisture permeability of the inorganic sealing thin film is also higher than that of the glass substrate, which may result in defects such as dark spots. Therefore, as shown in FIG. 8 , in a display device 101 in which an inorganic sealing thin film 20a is provided as a sealing material instead of the sealing resin layer 20, the inorganic multilayer film 21 may cover the first surface of the inorganic sealing thin film 20a (the surface opposite to the light-emitting element 12), the side surface of the inorganic sealing thin film 20a, and the side surface of the protective layer 14. The inorganic sealing thin film 20a is an example of a second inorganic thin film (sealant).

[0106] The inorganic sealing thin film 20a is, for example, a chemical vapor deposition film. The chemical vapor deposition film can be formed by a chemical vapor deposition (CVD) method. The inorganic sealing thin film 20a is, for example, a silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like.

[0107] [Variation 3] In the embodiment, as shown in FIG. 2 , the lens array 18, the low-refractive index layer 19, and the sealing resin layer 20 are provided on the first surface of the planarization layer 17. However, the configuration of the display device 101 is not limited to this example. As shown in FIG. 9 , the lens array 18, the low-refractive index layer 19, and the sealing resin layer 20 may not be provided on the first surface of the planarization layer 17, and the inorganic multilayer film 21 may be provided directly on the first surface and the side surfaces of the planarization layer 17. In this case, the planarization layer 17 may have a wall portion 171 around the periphery of the second surface. The wall portion 171 preferably has a closed loop shape in a planar view. The wall portion 171 covers the side surfaces of the light-shielding layer 16BK and the planarization layer 15. The top of the wall portion 171 is in close contact with the first surface of the protective layer 14.

[0108] 2 has been described in the embodiment, in which the sealing resin layer 20 covers the first surface of the low refractive index layer 19 and the side surfaces of the low refractive index layer 19. However, the configuration of the display device 101 is not limited to this example, and as shown in FIG. 10 , the sealing resin layer 20 may not cover the first surface of the low refractive index layer 19 and the side surfaces of the low refractive index layer 19, and the inorganic multilayer film 21 may be provided directly on the first surface of the low refractive index layer 19 and the side surfaces of the low refractive index layer 19.

[0109] [Variation 5] As shown in FIG. 11 , the inorganic thin film 22 may be provided on the first surface (light-collecting surface) of the lens array 18, i.e., between the lens array 18 and the low-refractive index layer 19. The inorganic thin film 22 may also be provided on the first surface of the light-shielding layer 16BK, i.e., between the light-shielding layer 16BK and the low-refractive index layer 19. The inorganic thin film 22 is an example of a third inorganic thin film. The inorganic thin film 22 preferably conforms to the shape of the convex light-collecting surface of each lens 181. The inorganic thin film 22 functions as a barrier film and can prevent moisture from penetrating into layers below the inorganic thin film 22. The inorganic thin film 22 preferably also functions as an anti-reflection film (AR film). Here, the anti-reflection film is a film configured to suppress light reflection on the convex light-collecting surface of each lens 181 by utilizing optical interference. The light whose reflection is suppressed by the anti-reflection film is light emitted from the light-emitting element 12.

[0110] The inorganic thin film 22 is preferably a low-temperature oxide (LTO) film. When the inorganic thin film 22 is a low-temperature oxide film, damage to the OLED layer 122 during the formation of the inorganic thin film 22 can be suppressed. The inorganic thin film 22 is an inorganic single-layer film or an inorganic multi-layer film.

[0111] The inorganic monolayer film is, for example, an atomic layer deposition film or a chemical vapor deposition film, and is preferably an atomic layer deposition film. Since an atomic layer deposition film is dense and has excellent shape conformability, when the inorganic monolayer film is an atomic layer deposition film, the inorganic monolayer film (i.e., inorganic thin film 22) can have improved functions as a barrier film and an anti-reflection film.

[0112] In the inorganic multilayer film, the term "multilayer" refers to two or more layers. At least one layer of the inorganic multilayer film is preferably an atomic layer deposition film. The inorganic multilayer film may have the same configuration as the inorganic multilayer film 21 in one embodiment.

[0113] When the inorganic thin film 22 is provided on the first surface (light-collecting surface) of the lens array 18, the low refractive index layer 19, the sealing resin layer 20, and the inorganic multilayer film 21 may be omitted as shown in Fig. 12. In this case, the inorganic thin film 22 can suppress moisture penetration into the display device 101.

[0114] 2, an example has been described in which the low refractive index layer 19 is provided on the first surface (light-collecting surface) of the lens array 18. However, as shown in FIG. 13, the configuration of the display device 101 is not limited to this example, and the low refractive index layer 19 may not be provided on the first surface of the lens array 18, and the sealing resin layer 20 may be provided directly on the first surface of the lens array 18. In this case, the refractive index n ３ is the refractive index n of the lens 181 １ is preferably lower than (n ３ <n １ The refractive index n of the sealing resin layer 20 ３ is the refractive index n of the lens 170 １ Since the refractive index of the lens 181 is lower than that of the sealing resin layer 20, the light can be refracted and focused at the interface between the lens 181 and the sealing resin layer 20. Therefore, the light extraction function can be improved. By omitting the low refractive index layer 19 as described above, the configuration of the display device 101 can be simplified.

[0115] As described above, when the sealing resin layer 20 is provided directly on the first surface of the lens array 18, it is preferable to use a high refractive index material as the material of the lens array 18. Specific examples of high refractive index materials include amorphous silicon (a-Si, refractive index n=3.46), silicon nitride (SiN, refractive index n=1.9), and titanium oxide (TiO ２ , refractive index n=2.4), hafnium oxide (HfO ２ , refractive index n=2.0), tantalum oxide (Ta ２ O ５, refractive index n=2.16), or titanium oxide (TiO ２ Examples of suitable organic resins include organic resins (refractive index n=1.9 or less) to which .gamma.-hydroxybenzoates are added.

[0116] [Variation 7] In the embodiment, as shown in Fig. 2 , an example has been described in which the wall portion 191 of the low refractive index layer 19 and the wall portion 201 of the sealing resin layer 20 are in close contact with the first surface of the protective layer 14. However, the configuration of the display device 101 is not limited to this example. As shown in Fig. 14 , the sealing resin layer 20 may not have the wall portion 201, and only the wall portion 191 of the low refractive index layer 19 may be in close contact with the first surface of the protective layer 14. Although not shown, the low refractive index layer 19 may not have the wall portion 191, and only the wall portion 201 of the sealing resin layer 20 may be in close contact with the first surface of the protective layer 14.

[0117] Although not shown, the lens array 18 may have a wall portion on the periphery of the second surface, and the wall portion may be in close contact with the first surface of the protective layer 14. Although not shown, the planarizing layer 17 may have a wall portion on the periphery of the second surface, and the wall portion may be in close contact with the first surface of the protective layer 14.

[0118] In addition, among the layers stacked on the first surface of protective layer 14, the layer that adheres to the first surface of protective layer 14 via the wall portion is preferably selected taking into consideration the suppression of moisture penetration and the adhesion of the wall portion to protective layer 14.

[0119] A lens material layer 182 may be provided on the first surface of the planarization layer 17. The lens material layer 182 is made of the same material as the lens array 18, and is located above the light-shielding layer 16BK.

[0120] [Variation 8] In the embodiment, an example has been described in which the inorganic multilayer film 21 is provided as an inorganic thin film (barrier film) covering the sealing resin layer 20. However, the inorganic thin film covering the sealing resin layer 20 is not limited to this example, and an inorganic single-layer film may be provided instead of the inorganic multilayer film 21. In this case, the inorganic single-layer film may have a configuration similar to the first thin film 21a of the inorganic multilayer film 21. It is preferable that the inorganic single-layer film functions as a single-layer anti-reflection film (single-layer AR film). The light whose reflection is suppressed by the single-layer anti-reflection film is light emitted from the light-emitting element 12 and / or external light incident on the display surface.

[0121] [Variation 9] The inorganic multilayer film 21 may include a first portion covering the first surface of the sealing resin layer 20 and a second portion covering the side surface of the sealing resin layer 20 and the side surface of the protective layer 14, and the first portion and the second portion may have different configurations. Here, the different configurations of the first portion and the second portion mean that the first portion and the second portion are different in at least one of the film thickness, the number of layers, and the composition of the constituent materials.

[0122] [Modification 10] In the embodiment, an example in which the number of layers in the inorganic multilayer film is two has been described. However, the number of layers in the inorganic multilayer film is not limited to two, and the number of layers in the inorganic multilayer film may be three or more. In this case, the first thin film and the second thin film may be alternately stacked, or three or more layers made of different materials may be sequentially stacked.

[0123] [Modification 11] From the viewpoint of improving light extraction efficiency and / or improving color purity, the light emitting element 12 may have a resonator structure.

[0124] When the first electrode 121 is a reflective electrode that functions as a reflective layer, a resonator structure may be formed by the first electrode 121 and the second electrode 123. In this case, the optical distance between the first electrode 121 and the second electrode 123 may be set by the thickness of the OLED layer 122, by selecting the material of the first electrode 121, or by a combination of these.

[0125] When the first electrode 121 is a transparent electrode, a reflective layer may be provided below the transparent electrode, and a resonator structure may be formed by the reflective layer and the second electrode 123. In this case, the optical distance between the reflective layer and the second electrode 123 may be set by the thickness of the OLED layer 122, by selecting the material of the reflective layer, by the thickness of an insulating layer provided between the first electrode 121 (transparent electrode) and the reflective layer, or by a combination of two or more of these.

[0126] [Variation 12] In the embodiment, an example has been described in which the display device 101 includes a plurality of light-emitting elements 12 capable of emitting white light and a color filter 16, and a combination of these elements is capable of displaying a color image. However, the colorization method of the display device 101 is not limited to this. For example, instead of the plurality of light-emitting elements 12 capable of emitting white light, the display device 101 may include a plurality of light-emitting elements capable of emitting red light, a plurality of light-emitting elements capable of emitting green light, and a plurality of light-emitting elements capable of emitting blue light. In this case, the color filter is not an essential component and may or may not be included.

[0127] The light-emitting element capable of emitting light of a predetermined color (red light, green light, or blue light) is, for example, (1) a light-emitting element including a light-emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light); (2) a light-emitting element including a light-emitting layer capable of emitting white light and capable of resonating and emphasizing light of a predetermined wavelength (red light, green light, or blue light) contained in the white light emitted by the light-emitting layer using a resonator structure; or (3) a light-emitting element including a light-emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light) and capable of resonating and emphasizing light of a predetermined wavelength contained in the light of a predetermined color emitted by the light-emitting layer using a resonator structure.

[0128] [Modification 13] In the embodiment, an example in which the color filter 16 is provided has been described, but a quantum dot layer may be provided instead of the color filter 16, or a quantum dot layer may be provided together with the color filter 16. The quantum dot layer is a color conversion layer that contains quantum dots (semiconductor particles) and can convert the color of light emitted from the plurality of light-emitting elements 12. In this case, the plurality of light-emitting elements 12 may be configured to emit blue light.

[0129] [Modification 14] In the embodiment, an example has been described in which the light-emitting element 12 is an OLED element. However, the light-emitting element is not limited to this example, and may be, for example, a self-luminous light-emitting element such as an LED (Light Emitting Diode) element, an inorganic electroluminescence (IEL) element, a quantum dot light-emitting diode (QLED) element, or a semiconductor laser element. Two or more types of light-emitting elements may be provided in the display device 101.

[0130] [Other Modifications] Above, one embodiment of the present disclosure and its modification examples (hereinafter referred to as "one embodiment, etc.") have been specifically described, but the present disclosure is not limited to one embodiment, etc., and various modifications based on the technical ideas of the present disclosure are possible.

[0131] For example, the configurations, methods, steps, shapes, materials, and numerical values ​​given in one embodiment are merely examples, and different configurations, methods, steps, shapes, materials, and numerical values ​​may be used as necessary.

[0132] The configurations, methods, steps, shapes, materials, numerical values, etc. of the embodiments may be combined with one another without departing from the spirit of the present disclosure.

[0133] Unless otherwise specified, the materials exemplified in the embodiments and the like can be used singly or in combination of two or more.

[0134] Two or more of the configurations of Modifications 1 to 14 can be combined.

[0135] The present disclosure may also employ the following configurations. (1) A light-emitting device comprising: a plurality of light-emitting elements; a sealing material sealing the plurality of light-emitting elements; and a first inorganic thin film provided on the sealing material, wherein the sealing material includes at least one of a resin layer and a second inorganic thin film, and the first inorganic thin film includes an atomic layer deposition film. (2) The light-emitting device according to (1), wherein the first inorganic thin film includes a first thin film and a second thin film, and the first thin film is the atomic layer deposition film. (3) The light-emitting device according to (2), wherein the second thin film is an atomic layer deposition film or a chemical vapor deposition film. (4) The light-emitting device according to (2) or (3), wherein the second thin film includes silicon oxide. (5) The light-emitting device according to any one of (1) to (4), wherein the resin layer includes a cured product of an ultraviolet-curable resin composition. (6) The light-emitting device according to any one of (1) to (5), wherein the first inorganic thin film covers a main surface and a side surface of the sealing material. (7) The light-emitting device according to any one of (1) to (6), wherein the first inorganic thin film is configured to suppress reflection of light. (8) The light-emitting device according to any one of (1) to (7), further comprising a lens array provided between the plurality of light-emitting elements and the sealing material, wherein the refractive index of the sealing material is lower than that of the lens array. (9) The light-emitting device according to any one of (1) to (7), further comprising a lens array provided between the plurality of light-emitting elements and the sealing material, and a low-refractive index layer provided between the lens array and the sealing material, wherein the refractive index of the low-refractive index layer is lower than that of the lens array. (10) The light-emitting device according to any one of (1) to (7), further comprising a lens array provided between the plurality of light-emitting elements and the sealing material, and a third inorganic thin film provided on the lens array, wherein the third inorganic thin film includes an atomic layer deposition film. (11) The light-emitting device according to (10), further comprising: (12) The light-emitting device according to (10) or (11), further comprising a light-shielding layer, wherein the third inorganic thin film is also provided on the light-shielding layer.(13) A light-emitting device comprising: a plurality of light-emitting elements; a lens array provided above the plurality of light-emitting elements; and an inorganic thin film provided on the lens array, wherein the inorganic thin film includes an atomic layer deposition film. (14) An electronic device comprising the light-emitting device according to any one of (1) to (13).

[0136] <5. Examples of Leakage Suppression Structure> The OLED layer 122 of the display device 101 according to an embodiment and the like is connected between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is a layer common to the plurality of light-emitting elements 12. For this reason, in the display device 101 according to an embodiment and the like, there is a risk of current leakage occurring between adjacent light-emitting elements 12. Below, examples of leakage suppression structures for suppressing such current leakage between the light-emitting elements 12 will be described. Note that in the following first to seventh examples, examples will be described in which the OLED layer 122 has two light-emitting units U1 and U2.

[0137] (Leakage Suppression Structure: First Example) Fig. 15 is a cross-sectional view of a first example of the leakage suppression structure. Note that in Fig. 15, layers above the second electrode 123 are not shown. Similarly, in the cross-sectional views for explaining the leakage suppression structures of the second to ninth examples, layers above the second electrode 123 are not shown.

[0138] The insulating layer 13 has openings 13a above each first electrode 121, and covers the periphery of the first surface of the first electrode 121 and the side surfaces (end surfaces) of the first electrodes 121. Specifically, the insulating layer 13 has side wall portions 13b and extension portions 13c. The side wall portions 13b are erected perpendicular to the first surface of the drive substrate 11 and cover the side surfaces of the first electrodes 121. The extension portions 13c extend from the upper ends of the inner circumferential surfaces of the side wall portions 13b toward the center of the first surface of the first electrodes 121 and cover the periphery of the first surfaces of the first electrodes 121.

[0139] The inner periphery of the opening 13a in the insulating layer 13 has a canopy-like protruding portion 132b that protrudes toward the center of the opening 13a. The protruding portion 132b is spaced apart from the first surface of the first electrode 121. The protruding portion 132b is preferably provided around the entire periphery of the opening 13a, but may be provided on a portion of the entire periphery of the opening 13a.

[0140] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are disconnected or made highly resistant by the overhanging portion 132b (region A shown in FIG. 15 ). This makes it possible to suppress current leakage between adjacent light-emitting elements 12. Here, "high resistance" refers to the light-emitting unit U1 and the charge generation layer 1227 becoming extremely thin at the overhanging portion 132b, resulting in high resistance. The disconnection or high resistance of the light-emitting unit U1 and the charge generation layer 1227 caused by the overhanging portion 132b can occur due to the shadowing effect of the overhanging portion 132b during film formation of the OLED layer 122. A gap 132c may be formed between the overhanging portion 132b and the first electrode 121.

[0141] The insulating layer 13 has a first insulating layer 131 and a second insulating layer 132, which are arranged in this order on the first surface of the drive substrate 11 and the first surface of the first electrode 121. The first insulating layer 131 has a plurality of first openings 131a. The second insulating layer 132 has a plurality of second openings 132a. The opening 13a is composed of overlapping first openings 131a and second openings 132a. The inner periphery of the second opening 132a in the second insulating layer 132 protrudes further inward from the opening 13a than the inner periphery of the first opening 131a in the first insulating layer 131, forming a protruding portion 132b.

[0142] 16 is a cross-sectional view of a second example of the leakage suppression structure. The second example differs from the first example in that the insulating layer 13 includes a third insulating layer 133 in addition to the first insulating layer 131 and the second insulating layer 132.

[0143] The third insulating layer 133 is provided between the drive substrate 11 and the first insulating layer 131, and between the first electrode 121 and the first insulating layer 131. The third insulating layer 133 has a third opening 133a on the first surface of the first electrode 121. In the second example, the opening 13a is composed of a first opening 131a, a second opening 132a, and a third opening 133a that are overlapped with each other. The inner periphery of the third opening 133a protrudes further inward than the inner periphery of the first opening 131a. A gap 132c may be formed between the protruding portion 132b and the third insulating layer 133.

[0144] (Leakage Suppression Structure: Third and Fourth Examples) In the first and second examples, examples have been described in which the inner periphery of the opening 13a in the insulating layer 13 has one protruding portion 132b. However, the number of protruding portions that the inner periphery of the opening 13a in the insulating layer 13 has is not limited to these examples, and the inner periphery of the opening 13a in the insulating layer 13 may have two or more protruding portions. Below, an example (third example) in which the inner periphery of the opening 13a in the insulating layer 13 has two protruding portions and an example (fourth example) in which the inner periphery of the opening 13a in the insulating layer 13 has three protruding portions will be described.

[0145] 17 is a cross-sectional view of a third example of the leakage suppression structure. The third example differs from the second example in that insulating layer 13 has fourth insulating layer 134 and fifth insulating layer 135, in that order, on the first surface of second insulating layer 132, and that the inner periphery of opening 13a in insulating layer 13 has two eave-like protrusions 132b and 135b.

[0146] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 135b. The overhanging portion 135b is provided at a higher position than the overhanging portion 132b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the second insulating layer 132. The overhanging portion 135b is set back more away from the center of the opening 13a than the overhanging portion 132b.

[0147] The fourth insulating layer 134 has a fourth opening 134a. The fifth insulating layer 135 has a fifth opening 135a. In the third example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, and a fifth opening 135a that are overlapping each other. The inner periphery of the fourth opening 134a is recessed in a direction away from the center of the opening 13a relative to the inner peripheries of the second opening 132a and the fifth opening 135a. The inner periphery of the fifth opening 135a protrudes more inward from the opening 13a than the fourth opening 134a, forming a protruding portion 135b.

[0148] 18 is a cross-sectional view of a fourth example of the leakage suppression structure. The fourth example differs from the third example in that insulating layer 13 has sixth insulating layer 136 and seventh insulating layer 137 in this order on the first surface of fifth insulating layer 135, and the inner periphery of opening 13a in insulating layer 13 has three eave-like protrusions 132b, 135b, and 137b.

[0149] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b, the overhanging portion 135b, and the overhanging portion 137b. The overhanging portion 137b is provided at a higher position than the overhanging portion 135b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the fifth insulating layer 135. The overhanging portion 137b is set back more away from the center of the opening 13a than the overhanging portion 135b.

[0150] The sixth insulating layer 136 has a sixth opening 136a. The seventh insulating layer 137 has a seventh opening 137a. In the fourth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, a fifth opening 135a, a sixth opening 136a, and a seventh opening 137a, which are all overlapping each other. The inner periphery of the sixth opening 136a is recessed in a direction away from the center of the opening 13a from the inner peripheries of the fifth opening 135a and the seventh opening 137a. The inner periphery of the seventh opening 137a protrudes inward from the sixth opening 136a, forming a protruding portion 137b.

[0151] 19 is a cross-sectional view of a fifth example of a leakage suppression structure. The fifth example differs from the second example in that insulating layer 13 includes first insulating layer 131, second insulating layer 132, and third insulating layer 133, as well as eighth insulating layer 138, and that the inner periphery of opening 13a in insulating layer 13 includes two eave-shaped protrusions 132b and 133b.

[0152] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 133b. The overhanging portion 133b overhangs more inwardly of the opening 13a than the overhanging portion 132b. The overhanging portion 133b is located at a lower position than the overhanging portion 132b with respect to the first surface of the first electrode 121. The overhanging portion 133b is spaced apart from the first surface of the first electrode 121.

[0153] The eighth insulating layer 138 is provided between the drive substrate 11 and the third insulating layer 133, and between the first electrode 121 and the third insulating layer 133. The eighth insulating layer 138 has an eighth opening 138a. In the fifth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, and an eighth opening 138a, which are overlapped with each other. The inner periphery of the third opening 133a in the third insulating layer 133 protrudes further inward from the opening 13a than the inner periphery of the eighth opening 138a in the eighth insulating layer 138, thereby forming a protruding portion 133b.

[0154] (Leakage Suppression Structure: Sixth Example) Figure 20 is a cross-sectional view of a sixth example of a leakage suppression structure. The sixth example differs from the first example in that the insulating layer 13 has a protruding portion 13b1 on the outer periphery of the side wall portion 13b instead of having a protruding portion 132b on the inner periphery of the opening 13a. Although Figure 20 shows an example in which the insulating layer 13 has a single-layer structure, it may also have a laminated structure of two or more layers.

[0155] The protruding portion 13b1 protrudes outward from the outer periphery of the side wall portion 13b. A recess 13b2 is provided at a position a predetermined distance below the upper end of the outer periphery of the side wall portion 13b. By providing the recess 13b2 on the outer periphery of the side wall portion 13b in this manner, the protruding portion 13b1 is configured at the upper end of the outer periphery of the side wall portion 13b. The protruding portion 13b1 and the recess 13b2 are preferably provided around the entire periphery of the side wall portion 13b, but may be provided on a portion of the entire periphery of the side wall portion 13b.

[0156] The light-emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or made highly resistant by the protruding portion 132b (area A shown in FIG. 20 ), which makes it possible to suppress current leakage between adjacent light-emitting elements 12.

[0157] In the sixth example, the outer periphery of the side wall portion 13b has one protrusion 13b1 and one recess 13b2. However, the number of protrusions 13b1 and recesses 13b2 on the outer periphery of the side wall portion 13b is not limited to this example, and the outer periphery of the side wall portion 13b may have two or more protrusions 13b1 and two or more recesses 13b2. In this case, the two or more recesses 13b2 may be arranged sequentially at a predetermined distance from the upper end to the lower end of the outer periphery of the side wall portion 13b.

[0158] (Leakage Suppression Structure: Seventh Example) Fig. 21 is a cross-sectional view of a seventh example of the leakage suppression structure. A groove 13Gv is provided between adjacent light-emitting elements 12. The groove 13Gv may be provided between light-emitting elements 12 adjacent in a predetermined direction (e.g., the Y-axis direction), or may be provided so as to surround the light-emitting element 12. The groove 13Gv is formed across the insulating layer 13 and the insulating layer 112.

[0159] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the groove 13Gv. This makes it possible to suppress current leakage between adjacent light-emitting elements 12. Here, "high resistance" means that the light-emitting unit U1 and the charge generation layer 1227 have extremely thin film thicknesses within the groove 13Gv, thereby making them highly resistant, as shown in FIG. 22 . Of the layers included in the OLED layer 122, the light-emitting unit U2 located above the charge generation layer 1227 straddles the groove 13Gv.

[0160] (Leakage Suppression Structure: Eighth Example) FIG. 23 is a cross-sectional view of an eighth example of the leakage suppression structure. A plurality of wirings 112a, a plurality of contact plugs 112b, and a plurality of contact electrodes 112c are provided in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 and the wiring 112a. A groove 13Gv is provided between adjacent light-emitting elements 12. The bottom surface of the groove 13Gv is formed by the first surface of the contact electrode 112c. An auxiliary electrode 112d is provided on the side surface of each groove 13Gv. The auxiliary electrode 112d is in contact with the first surface of the contact electrode 112c.

[0161] The OLED layer 122 is cut by the grooves 13Gv. While FIG. 23 shows an example in which the second electrode 123 is also cut by the grooves 13Gv, the second electrode 123 may not be cut by the grooves 13Gv and may be connected between adjacent light-emitting elements 12. The second electrode 123 is in contact with the auxiliary electrode 112d on the side surface of the groove 13Gv. The second electrode 123 is in contact with the contact electrode 112c on the bottom surface of the groove 13Gv. A protective layer 14 may be provided on the first surface of the second electrode 123 so as to follow the shape of the second electrode 123.

[0162] In the eighth example, the leakage current between adjacent light emitting elements 12 can be drawn into the auxiliary electrode 112d and the contact electrode 112c. Therefore, the current leakage between adjacent light emitting elements 12 can be suppressed.

[0163] (Leakage Suppression Structure: Ninth Example) Fig. 24 is a cross-sectional view of a ninth example of the leakage suppression structure. In the ninth example, the display device 101 includes a plurality of third electrodes 125. The plurality of third electrodes 125 are provided on the second surface side of the OLED layer 122, similar to the plurality of first electrodes 121. Each third electrode 125 is disposed between adjacent first electrodes 121.

[0164] 25 is a plan view illustrating the arrangement of the first electrodes 121 and the third electrodes 125. The multiple third electrodes 125 are a group of island-shaped electrodes having a smaller area than the first electrodes 121. The multiple third electrodes 125 are regularly arranged so as to be equally spaced from adjacent first electrodes 121 in a plan view. From another perspective, the multiple third electrodes 125 are arranged at a predetermined distance from each first electrode 121 and so as to surround it in a plan view.

[0165] A plurality of wirings 112a, a plurality of wirings 112e, a plurality of contact plugs 112b, and a plurality of contact plugs 112f are provided in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 to the wiring 112a. Each contact plug 112f electrically connects the third electrode 125 to the wiring 112e.

[0166] The plurality of third electrodes 125 are connected to the internal circuitry of the display device 101 via contact plugs 112f, wiring 112e, etc., and are set to a common constant potential. Specifically, when a voltage is applied to the OLED layer 122, the potential of the third electrodes 125 is set to be smaller than the sum of the potential of the second electrodes 123 and the threshold voltage for the OLED layer 122. As a result, even if a voltage is applied to the OLED layer 122 by the first electrodes 121 and the second electrodes 123, causing a leakage current from the first electrodes 121, the leakage current flows preferentially to the third electrodes 125. This prevents the leakage current from flowing from the first electrodes 121 to adjacent first electrodes 121.

[0167] (Leakage Suppression Structure: Other Examples) In the first to seventh examples, the OLED layer 122 has two light-emitting units U1 and U2. However, the configuration of the OLED layer 122 is not limited to these examples, and the OLED layer 122 may have a single light-emitting unit U, or may have three or more light-emitting units U.

[0168] In the first to seventh examples, the light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portions 132b, 133b, 135b, 137b, and 13b1 and the grooves 13Gv (hereinafter referred to as "overhanging portions 132b and grooves 13Gv, etc."). However, the layers that are cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. are not limited to these examples. For example, the hole injection layer 1221 or the hole transport layer 1222 included in the OLED layer 122 may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc., or both the hole injection layer 1221 and the hole transport layer 1222 included in the OLED layer 122 may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. When the OLED layer 122 has three or more light-emitting units U, two or more light-emitting units U and two or more charge generating layers 1227 included in the OLED layer 122 may be cut or made highly resistant by the protrusion 132b and the groove 13Gv, etc.

[0169] <6 Relationship Between Normals Passing Through the Centers of the Light-Emitting Unit, the Lens Element, and the Wavelength Selecting Unit> Hereinafter, the relationship between the normal LN passing through the center of the light-emitting unit, the normal LN′ passing through the center of the lens element, and the normal LN″ passing through the center of the wavelength selecting unit will be described. Here, the light-emitting unit is, for example, the light-emitting element 12 in an embodiment or the like. The lens element is, for example, the lens 181 in an embodiment or the like. The wavelength selecting unit is, for example, the colored layer 16F in an embodiment or the like.

[0170] The size of the wavelength selecting section may be changed as appropriate in accordance with the light emitted by the light emitting section, or in the case where a light absorbing section (e.g., a black matrix section) is provided between the wavelength selecting sections of adjacent light emitting sections, the size of the light absorbing section may be changed as appropriate in accordance with the light emitted by the light emitting section. Also, the size of the wavelength selecting section may be determined by the distance (offset amount) d between the normal line passing through the center of the light emitting section and the normal line passing through the center of the wavelength selecting section. ０ The planar shape of the wavelength selection section may be the same as, similar to, or different from the planar shape of the lens member.

[0171] Below, with reference to Figures 26A, 26B, 26C, and 27, we will explain the relationship between the normals passing through the centers of the light-emitting unit 51, wavelength selection unit 52, and lens member 53 when they are arranged in this order.

[0172] As shown in FIG. 26A, the normal line LN passing through the center of the light emitting unit 51, the normal line LN″ passing through the center of the wavelength selecting unit 52, and the normal line LN′ passing through the center of the lens member 53 may coincide with each other. That is, D ０ = 0, d ０ = 0. However, D ０ represents the distance (offset amount) between the normal line LN passing through the center of the light-emitting portion 51 and the normal line LN′ passing through the center of the lens member 53, and d ０ represents the distance (offset amount) between the normal line LN passing through the center of the light emitting section 51 and the normal line LN″ passing through the center of the wavelength selecting section 52.

[0173] As shown in FIG. 26B, the normal line LN passing through the center of the light-emitting unit 51 and the normal line LN" passing through the center of the wavelength selecting unit 52 are aligned, but the normal line LN passing through the center of the light-emitting unit 51 and the normal line LN" passing through the center of the wavelength selecting unit 52 may not be aligned with the normal line LN' passing through the center of the lens member 53. That is, D ０ >0, d ０ = 0.

[0174] As shown in FIG. 26C, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selecting unit 52, and the normal line LN' passing through the center of the lens member 53 do not coincide with each other, and the normal line LN" passing through the center of the wavelength selecting unit 52 and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D ０ >0, d ０ >0, D ０ = d ０ may be.

[0175] As shown in FIG. 27, a configuration may be adopted in which the normal line LN passing through the center of the light-emitting unit 51, the normal line LN″ passing through the center of the wavelength selecting unit 52, and the normal line LN′ passing through the center of the lens member 53 do not coincide with each other. That is, D ０ >0, d ０ >0, D ０≠d ０ Here, it is preferable that the center of the wavelength selection unit 52 (position indicated by a black square in FIG. 27) is located on a straight line LL connecting the center of the light emitting unit 51 and the center of the lens member 53 (position indicated by a black circle in FIG. 27). Specifically, the distance between the center of the light emitting unit 51 and the center of the wavelength selection unit 52 in the thickness direction (vertical direction in FIG. 27) is LL. １ , the distance in the thickness direction between the center of the wavelength selection unit 52 and the center of the lens member 53 is LL ２ When this is done, D ０ >d ０ >0, and taking into account manufacturing variations, d ０ :D ０ =LL １ : (LL １ +LL ２ Here, the thickness direction refers to the thickness direction of the light emitting section 51, the wavelength selecting section 52, and the lens member 53.

[0176] Below, with reference to Figures 28A, 28B, and 29, we will explain the relationship between the normals passing through the centers of the light-emitting unit 51, lens member 53, and wavelength selection unit 52 when they are arranged in this order.

[0177] As shown in FIG. 28A, a normal line LN passing through the center of the light emitting unit 51, a normal line LN″ passing through the center of the wavelength selecting unit 52, and a normal line LN′ passing through the center of the lens member 53 may be configured to coincide with each other. That is, D ０ >0, d ０ = 0.

[0178] As shown in FIG. 28B, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selecting unit 52, and the normal line LN' passing through the center of the lens member 53 do not coincide with each other, and the normal line LN" passing through the center of the wavelength selecting unit 52 and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D ０ >0, d ０ >0, D ０ = d ０ may be.

[0179] As shown in FIG. 29 , a configuration may be adopted in which the normal line LN passing through the center of the light-emitting section 51, the normal line LN″ passing through the center of the wavelength selecting section 52, and the normal line LN′ passing through the center of the lens member 53 do not all coincide. Here, it is preferable that the center of the lens member 53 (the position indicated by the black circle in FIG. 29 ) is located on a straight line LL connecting the center of the light-emitting section 51 and the center of the wavelength selecting section 52 (the position indicated by the black square in FIG. 29 ). Specifically, the distance between the center of the light-emitting section 51 and the center of the lens member 53 in the thickness direction (the vertical direction in FIG. 29 ) is defined as LL. ２ , the distance in the thickness direction between the center of the lens member 53 and the center of the wavelength selection unit 52 is LL １ When this is the case, d ０ >D ０ >0, and taking into account manufacturing variations, D ０ :d ０ =LL ２ : (LL １ +LL ２ Here, the thickness direction refers to the thickness direction of the light emitting section 51, the wavelength selecting section 52, and the lens member 53.

[0180] 7. Example of Resonator Structure The subpixel 10 included in the display device 101 according to an embodiment or the like may be configured to have a resonator structure that resonates light generated by the light-emitting element 12. The resonator structure will be described below with reference to the drawings. In the following description, the first surface of each layer may be referred to as the upper surface.

[0181] (Resonator Structure: First Example) Fig. 30A is a schematic cross-sectional view for explaining a first example of a resonator structure. In the following description, when the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, these light-emitting elements may be referred to as light-emitting elements 12. When the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to separately, these light-emitting elements may be referred to as light-emitting elements 12. Ｒ , 12 Ｇ , 12 Ｂ The portions of the OLED layer 122 corresponding to the sub-pixels 10R, 10G, and 10B are called the OLED layer 122 Ｒ, OLED layer 122 Ｇ , OLED layer 122 Ｂ This is what happens.

[0182] In the first example, the first electrode 121 is formed to have a common film thickness in each light emitting element 12. The same is true for the second electrode 123.

[0183] A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. In the following description, the optical adjustment layers 72 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as the optical adjustment layers 72. Ｒ , 72 Ｇ , 72 Ｂ This is what happens.

[0184] The reflector 71 is formed to have a common film thickness for each light-emitting element 12. The film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. Ｒ , 72 Ｇ , 72 Ｂ By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0185] In the example shown in FIG. 30A, the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ As described above, the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel, so the position of the upper surface of the second electrode 123 is aligned with the light emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ It varies depending on the type of

[0186] The reflector 71 can be made of a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing any of these as its main component.

[0187] The optical adjustment layer 72 is made of silicon nitride (SiN ｘ ), silicon oxide (SiO ｘ), silicon oxynitride (SiO ｘ N ｙ The optical adjustment layer 72 may be formed using an inorganic insulating material such as acrylic resin or polyimide resin, or an organic resin material such as acrylic resin or polyimide resin. The optical adjustment layer 72 may be a single layer or a laminated film made of a plurality of these materials. The number of laminated layers may vary depending on the type of light-emitting element 12.

[0188] The first electrode 121 can be formed using a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO).

[0189] The second electrode 123 needs to function as a semi-transmissive reflective film. The second electrode 123 can be formed using magnesium (Mg) or silver (Ag), a magnesium-silver alloy (MgAg) containing these as main components, or an alloy containing an alkali metal or an alkaline earth metal.

[0190] (Resonator Structure: Second Example) FIG. 30B is a schematic cross-sectional view for explaining a second example of the resonator structure.

[0191] In the second example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .

[0192] Also in the second example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first example, the reflector 71 is formed to have the same film thickness for each light-emitting element 12, and the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel.

[0193] In the first example shown in FIG. 30A, the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The upper surfaces of the reflectors 71 are aligned, and the upper surface of the second electrode 123 is positioned so that the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ It differed depending on the type of

[0194] In contrast, in the second example shown in FIG. 30B, the upper surface of the second electrode 123 is Ｒ , 12 Ｇ , 12 Ｂ In order to align the upper surfaces of the second electrodes 123, the light emitting elements 12 Ｒ , 12 Ｇ , 12 Ｂ The upper surface of the reflector 71 is Ｒ , 12 Ｇ , 12 Ｂ Therefore, the lower surface of the reflector 71 (in other words, the upper surface of the base layer (insulating layer) 73) has a stepped shape according to the type of the light emitting element 12.

[0195] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0196] (Cavity Resonator Structure: Third Example) Fig. 31A is a schematic cross-sectional view illustrating a third example of the cavity resonator structure. In the following description, the reflectors 71 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as "reflectors 71" Ｒ , 71 Ｇ , 71 Ｂ This is what happens.

[0197] In the third example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .

[0198] Also in the third example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first and second examples, the film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. As in the second example, the position of the upper surface of the second electrode 123 is located above the first electrode 121 of the light-emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ are arranged to align.

[0199] In the second example shown in FIG. 31B, the lower surface of the reflector 71 has a stepped shape according to the type of light emitting element 12 in order to align the upper surface of the second electrode 123 .

[0200] In contrast, in the third example shown in FIG. 31A, the film thickness of the reflector 71 is Ｒ , 12 Ｇ , 12 Ｂ More specifically, the reflector 71 is set to have a different reflecting surface depending on the type of the reflector. Ｒ , 71 Ｇ , 71 Ｂ The film thickness is set so that the bottom surfaces of the

[0201] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0202] (Fourth Example of Resonator Structure) Fig. 31B is a schematic cross-sectional view illustrating a fourth example of the resonator structure. In the following description, the first electrodes 121 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as first electrodes 121 Ｒ , 121 Ｇ , 121 Ｂ This is what happens.

[0203] 31A , the first electrodes 121 and second electrodes 123 of each light-emitting element 12 are formed to have the same film thickness. A reflector 71 is disposed below the first electrodes 121 of the light-emitting elements 12 with an optical adjustment layer 72 sandwiched therebetween.

[0204] In contrast, in the fourth example shown in FIG. 31B, the optical adjustment layer 72 is omitted, and the film thickness of the first electrode 121 is set to the same as that of the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The settings were different depending on the type of

[0205] The reflector 71 is formed to have a common thickness for each light-emitting element 12. The thickness of the first electrode 121 varies depending on the color to be displayed by the sub-pixel. Ｒ , 121 Ｇ , 121 ＢBy having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0206] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0207] (Resonator Structure: Fifth Example) FIG. 32A is a schematic cross-sectional view for explaining a fifth example of the resonator structure.

[0208] 30A , the first electrode 121 and the second electrode 123 are formed to have the same film thickness in each light-emitting element 12. A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12 with an optical adjustment layer 72 sandwiched therebetween.

[0209] 32A, the optical adjustment layer 72 is omitted, and instead, an oxide film 74 is formed on the surface of the reflector 71. The thickness of the oxide film 74 is Ｒ , 12 Ｇ , 12 Ｂ In the following description, the oxide films 74 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as oxide films 74 Ｒ , 74 Ｇ , 74 Ｂ This is what happens.

[0210] The thickness of the oxide film 74 varies depending on the color to be displayed by the sub-pixel. Ｒ , 74 Ｇ , 74 Ｂ By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0211] The oxide film 74 is a film obtained by oxidizing the surface of the reflector 71, and is made of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, etc. The oxide film 74 functions as an insulating film for adjusting the optical path length (optical distance) between the reflector 71 and the second electrode 123.

[0212] Light-emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The oxide film 74, which has a different thickness depending on the type of material, can be formed, for example, as follows.

[0213] First, a container is filled with an electrolyte, and the substrate on which the reflector 71 is formed is immersed in the electrolyte. An electrode is disposed so as to face the reflector 71.

[0214] Then, a positive voltage is applied to the reflector 71 with the electrode as a reference, and the reflector 71 is anodized. The thickness of the oxide film formed by anodization is proportional to the voltage value applied to the electrode. Ｒ , 71 Ｇ , 71 Ｂ Anodic oxidation is performed while a voltage according to the type of light emitting element 12 is applied to each of the layers 71 and 72. This allows oxide films 74 with different thicknesses to be formed all at once.

[0215] The materials constituting the reflector 71, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore will not be described again.

[0216] (Resonator Structure: Sixth Example) FIG. 32B is a schematic cross-sectional view for explaining a sixth example of the resonator structure.

[0217] In the sixth example, the light emitting element 12 is configured by laminating a first electrode 121, an OLED layer 122, and a second electrode 123. However, in the sixth example, the first electrode 121 is formed so as to function both as an electrode and a reflector. The first electrode (also serving as a reflector) 121 is formed so as to function as a light emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ The first electrode (also serving as a reflector) 121 is formed of a material having an optical constant selected according to the type of color to be displayed. By varying the phase shift due to the first electrode (also serving as a reflector) 121, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light according to the color to be displayed.

[0218] The first electrode (also serving as a reflector) 121 can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing these as a main component.Ｒ First electrode (also serving as a reflector) 121 Ｒ is formed of copper (Cu), and the light emitting element 12 Ｇ First electrode (also serving as a reflector) 121 Ｇ and light-emitting element 12 Ｂ First electrode (also serving as a reflector) 121 Ｂ The insulating film 11 may be made of aluminum.

[0219] The material constituting the second electrode 123 is the same as that described in the first example, and therefore a description thereof will be omitted.

[0220] (Resonator Structure: Seventh Example) FIG. 33 is a schematic cross-sectional view for explaining a seventh example of the resonator structure.

[0221] The seventh example is basically the same as the light emitting element 12 Ｒ , 12 Ｇ The sixth example is applied to the light emitting element 12 Ｂ In this configuration, the optical distance that generates the optimum resonance for the wavelength of light corresponding to the color to be displayed can also be set.

[0222] Light-emitting element 12 Ｒ , 12 Ｇ First electrode (also serving as a reflector) 121 used in Ｒ , 121 Ｇ The electrode can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing any of these as a main component.

[0223] Light-emitting element 12 Ｂ Reflector 71 used in Ｂ , optical adjustment layer 72 Ｂ and the first electrode 121 Ｂ The materials constituting the second embodiment are the same as those described in the first embodiment, and therefore will not be described here.

[0224] 8. Application Examples (Electronic Devices) The display device 101 according to an embodiment etc. may be provided in various electronic devices. The display device 101 according to an embodiment etc. is particularly suitable for eyewear devices such as head-mounted displays, or electronic viewfinders for video cameras or single-lens reflex cameras that require high resolution and are used in close proximity to the eyes with magnification.

[0225] 34A and 34B show an example of the appearance of a digital still camera 310. This digital still camera 310 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 for the photographer to hold on the left side of the front.

[0226] A monitor 314 is provided at a position shifted to the left from the center of the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition. The electronic viewfinder 315 includes any one of the display devices 101 according to an embodiment.

[0227] 35 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 is an example of an eyewear device. The head-mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. The display unit 321 includes any one of the display devices 101 according to an embodiment, etc.

[0228] 36 shows an example of the appearance of a television device 330. This television device 330 has, for example, an image display screen unit 331 including a front panel 332 and a filter glass 333, and this image display screen unit 331 includes any one of the display devices 101 according to the embodiment.

[0229] 37 shows an example of the appearance of a see-through head mounted display 340. The see-through head mounted display 340 is an example of an eyewear device. The see-through head mounted display 340 includes a main body 341, an arm 342, and a lens barrel 343.

[0230] The main body 341 is connected to the arm 342 and the glasses 350. Specifically, an end of the long side of the main body 341 is coupled to the arm 342, and one side of the main body 341 is connected to the glasses 350 via a connecting member. The main body 341 may also be worn directly on the head of a human body.

[0231] The main body 341 incorporates a control board for controlling the operation of the see-through head mounted display 340 and a display unit. The arm 342 connects the main body 341 to the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the main body 341 and an end of the lens barrel 343, respectively, and fixes the lens barrel 343. The arm 342 also incorporates a signal line for communicating data related to images provided from the main body 341 to the lens barrel 343.

[0232] The lens barrel 343 projects image light provided from the main body 341 via the arm 342, through the eyepiece 351, toward the eyes of the user wearing the see-through head mounted display 340. In this see-through head mounted display 340, the display unit of the main body 341 includes any one of the display devices 101 according to an embodiment or the like.

[0233] 38 shows an example of the appearance of a smartphone 360. The smartphone 360 ​​includes a display unit 361 that displays various information, an operation unit 362 that includes buttons and the like that accept operation inputs from a user, and the like. The display unit 361 includes any one of the display devices 101 according to an embodiment and the like.

[0234] (Specific Example 6) The display device 101 according to an embodiment may be provided in various displays provided in vehicles.

[0235] 39A and 39B are diagrams showing an example of the internal configuration of a vehicle 500 equipped with various displays. Specifically, Fig. 39A is a diagram showing an example of the internal appearance of the vehicle 500 from the rear to the front of the vehicle 500, and Fig. 39B is a diagram showing an example of the internal appearance of the vehicle 500 from diagonally rear to diagonally front of the vehicle 500.

[0236] The vehicle 500 includes a center display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any one of the display devices 101 according to an embodiment, etc. For example, all of these displays may include any one of the display devices 101 according to an embodiment, etc.

[0237] The center display 501 is disposed in a portion of the dashboard facing the driver's seat 508 and the passenger's seat 509. While FIGS. 39A and 39B show an example of a horizontally elongated center display 501 extending from the driver's seat 508 to the passenger's seat 509, the screen size and location of the center display 501 are arbitrary. The center display 501 can display information detected by various sensors. As a specific example, the center display 501 can display an image captured by an image sensor, a distance image to obstacles in front of or to the side of the vehicle 500 measured by a ToF sensor, the body temperature of a passenger detected by an infrared sensor, and the like. The center display 501 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0238] The safety-related information includes information such as detection of drowsiness, distraction, child mischief, whether a seatbelt is fastened, and whether a passenger has been abandoned. This information is detected, for example, by a sensor placed on the rear side of the center display 501. The operation-related information is obtained by detecting gestures related to passenger operations using a sensor. The detected gestures may include operations of various equipment within the vehicle 500. For example, operations of the air conditioning system, navigation system, AV system, lighting system, etc. are detected. The life log includes life logs of all passengers. For example, the life log includes a record of each passenger's actions while on board. By acquiring and saving the life log, the condition of the passenger at the time of the accident can be confirmed. The health-related information is obtained by detecting the passenger's body temperature using a sensor such as a temperature sensor, and inferring the passenger's health condition based on the detected body temperature. Alternatively, an image sensor may be used to capture an image of the passenger's face, and the passenger's health condition may be inferred from the facial expression in the image. Furthermore, the system may have an automated voice conversation with the occupant and estimate the occupant's health condition based on the occupant's responses. The authentication / identification-related information includes a keyless entry function that uses a sensor to perform facial authentication, a function that automatically adjusts seat height and position using facial recognition, etc. The entertainment-related information includes a function that uses a sensor to detect operation information of an AV device by the occupant, a function that recognizes the occupant's face using a sensor and provides content suitable for the occupant via the AV device, etc.

[0239] The console display 502 can be used to display, for example, life log information. The console display 502 is disposed near a shift lever 511 on a center console 510 between a driver's seat 508 and a passenger seat 509. Information detected by various sensors can also be displayed on the console display 502. Furthermore, the console display 502 may display an image of the vehicle's surroundings captured by an image sensor, or an image showing the distance to an obstacle around the vehicle.

[0240] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. The head-up display 503 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 503 is often virtually located in front of the driver's seat 508, it is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500 and the remaining fuel (battery) level.

[0241] The digital rearview mirror 504 can not only display the rear of the vehicle 500 but also the status of passengers in the rear seats. Therefore, by placing a sensor on the back side of the digital rearview mirror 504, it can be used to display life log information, for example.

[0242] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 505 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.

[0243] The rear entertainment display 506 is attached to the back side of the driver's seat 508 and the passenger seat 509 and is intended for viewing by rear seat passengers. The rear entertainment display 506 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, since the rear entertainment display 506 is located directly in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 506. For example, the rear entertainment display 506 may display information related to the operation of an AV device or an air conditioning system, or may display the results of measuring the body temperature of the rear seat passengers using a temperature sensor.

[0244] A sensor may be arranged on the rear surface of the display device 101 or the like, enabling distances to surrounding objects to be measured. Optical distance measurement methods are broadly divided into passive and active types. Passive methods measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive methods include the lens focusing method, the stereo method, and the monocular vision method. Active methods measure distance by projecting light onto an object and receiving reflected light from the object with a sensor. Active methods include the optical radar method, the active stereo method, the photometric stereo method, the moire topography method, and the interferometry method. The display device 101 according to one embodiment or the like can be applied to any of these distance measurement methods. The above-described passive or active distance measurement can be performed by using a sensor arranged on the rear surface of the display device 101.

[0245] DESCRIPTION OF SYMBOLS 10R, 10G, 10B Subpixel 11 Drive substrate 12W Light-emitting element 13 Insulating layer 14 Protective layer 14a Opening 15 Planarization layer 16 Color filter 16FR, 16FG, 16FB Colored portion 16BK Light-shielding layer 17 Planarization layer 171 Wall portion 18 Lens array 181 Lens 19 Low refractive index layer 191 Wall portion 20 Sealing resin layer 20a Inorganic sealing thin film (second inorganic thin film) 201 Wall portion 21 Inorganic multilayer film (first inorganic thin film) 21a First thin film 21b Second thin film 22 Inorganic thin film (third inorganic thin film) 101 Display device 111 Pad portion 111a Opening 121 First electrode 122 OLED layer 123 Second electrode 124 Contact electrode 13a, 13d, 13e Opening 310 Digital still camera 320 Head mounted display 330 Television device 340 See-through head mounted display 360 Smartphone 500 Vehicle RE1 Display area RE2 Peripheral area

Claims

1. A light-emitting device comprising: a plurality of light-emitting elements; a sealing material that seals the plurality of light-emitting elements; and a first inorganic thin film provided on the sealing material, wherein the sealing material includes at least one of a resin layer and a second inorganic thin film, and the first inorganic thin film includes an atomic layer deposition film.

2. The light-emitting device according to claim 1, wherein the first inorganic thin film includes a first thin film and a second thin film, and the first thin film is the atomic layer deposition film.

3. The light emitting device according to claim 2, wherein the second thin film is an atomic layer deposition film or a chemical vapor deposition film.

4. The light emitting device according to claim 2, wherein the second thin film includes silicon oxide.

5. The light emitting device according to claim 1, wherein the resin layer includes a cured product of an ultraviolet curable resin composition.

6. The light emitting device according to claim 1, wherein the first inorganic thin film covers a main surface and a side surface of the sealing material.

7. The light emitting device according to claim 1, wherein the first inorganic thin film is configured to be capable of suppressing reflection of light.

8. The light emitting device according to claim 1, further comprising a lens array provided between the plurality of light emitting elements and the sealing material, wherein the refractive index of the sealing material is lower than that of the lens array.

9. The light emitting device according to claim 1, further comprising: a lens array provided between the plurality of light emitting elements and the sealing material; and a low refractive index layer provided between the lens array and the sealing material, wherein the refractive index of the low refractive index layer is lower than the refractive index of the lens array.

10. The light-emitting device according to claim 1, further comprising: a lens array provided between the plurality of light-emitting elements and the sealing material; and a third inorganic thin film provided on the lens array, the third inorganic thin film including an atomic layer deposition film.

11. The light emitting device according to claim 10, wherein the third inorganic thin film is configured to be capable of suppressing reflection of light.

12. The light emitting device according to claim 10, further comprising a light shielding layer, the third inorganic thin film being also provided on the light shielding layer.

13. A light-emitting device comprising: a plurality of light-emitting elements; a lens array provided above the plurality of light-emitting elements; and an inorganic thin film provided on the lens array, wherein the inorganic thin film includes an atomic layer deposition film.

14. An electronic device comprising the light emitting device according to claim 1.

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