Template for patterning metal electrode, stretchable metal electrode using same, and manufacturing method therefor

Abstract

The present invention relates to a template for patterning a metal electrode, comprising: a first region in which a material interfering with deposition of a metal is printed on a surface thereof; and a second region forming a position at which the metal is to be deposited, wherein the metal electrode can be selectively patterned without a mask.

Description

Template for metal electrode patterning, flexible metal electrode using the template, and method for manufacturing the same

[0001] The present invention relates to a means for depositing a metal on a substrate, a substrate deposited using the same, and a deposition method thereof.

[0002]

[0003] Forming conductive metal patterns using vacuum deposition is a widely used technique in various fields, such as metal wiring for electrical and electronic circuits, OLED light-emitting elements for displays, and electrodes for semiconductor devices. The most common method for forming conductive metal patterns using vacuum deposition is the metal mask method. This method involves physically removing the metal from the area where the pattern is to be formed by processing an alloy with a low coefficient of thermal expansion, thereby creating a metal mask. Then, electrodes are selectively deposited through the removed portion of this mask.

[0004] Conventional electronic circuits and components have been limited by their dimensional limitations, requiring them to be fabricated on a flat surface. However, with the recent advancement of flexible and stretchable materials, efforts are being made to create stretchable electronic circuits and components, and to implement these devices on stretchable substrates.

[0005] Metals, the primary materials used as electrodes, are representative conductive materials, exhibiting high conductivity and optical properties that can be tuned from translucency to reflectivity. While sufficiently thin metal films possess a certain degree of mechanical durability and can be used as flexible electrodes, they are known to crack at approximately 2% strain, potentially leading to electrical failures. Tensile strain is essential for forming flexible electrodes, necessitating inherent electrode elasticity. However, as previously explained, metal electrodes are vulnerable to tensile strain, making their application challenging.

[0006] In addition, for metal electrode patterning, a rigid shadow mask or photo mask must be used, but there is a limitation in that the process complexity increases because a subsequent process is required to remove the mask after the deposition process and leave only the necessary metal thin film.

[0007]

[0008] The present invention is intended to solve the problems of the above-described prior art, and aims to provide a template for patterning a metal electrode that can pattern a metal electrode on an elastic substrate without a shadow mask or photo mask in a deposition process, and a flexible electrode manufactured using the template and a manufacturing method.

[0009]

[0010] A template for metal electrode patterning proposed in one embodiment of the present invention comprises an elastic substrate, a first region on which a material that impedes metal deposition is printed on the surface, and a second region that forms a location where metal is to be deposited.

[0011] In one embodiment, the substrate may include at least one polymer selected from the group consisting of Styrene-Ethylene / Butylene-Styrene (SEBS) and polydimethylsiloxane (PDMS), and may include a network structure formed by the polymers therein.

[0012] In one embodiment, the material that inhibits deposition of the metal may include at least one selected from the group consisting of poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP), trichloro(1H,1H,2H,2H-perfluorooctyl)silane (FOTS), poly(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctylmethacrylate) (PFOMA) and (poly(1H,1H,2H,2H-perfluorodecyl methacrylate) (PFDMA).

[0013] According to one embodiment, the substrate may have a normalized resistance (R / R0) value of 70 or less in a uniaxial tensile strain range of 0% to 100%.

[0014] In one embodiment, the material that inhibits deposition of the metal may be made of a material that exhibits a tensile stress of less than 0.4 MPa in a tensile strain range of 0% to 800%.

[0015] According to another embodiment, a patterned metal electrode formed on a template may include a first region having a material that inhibits metal deposition printed on the surface thereof and a second region having a metal electrode deposited on the surface thereof, and an elastic substrate having a polymer network structure therein, wherein an intermediate layer in which metal atoms are impregnated into a network structure formed by polymers inside the substrate may be formed in a thickness direction from a surface on which the electrode is formed in the second region.

[0016] According to one embodiment, the metal electrode may be formed of one or more metals or alloys selected from the group consisting of gold (Au), silver (Ag), magnesium (Mg), copper (Cu), iron (Fe), and calcium (Ca).

[0017] In one embodiment, the metal electrode may include a pattern formed by physical vapor deposition (PVD).

[0018] According to one embodiment, the metal electrode may be patterned without a mask only in a second region excluding a first region where a material that inhibits metal deposition is printed.

[0019] In one embodiment, the intermediate layer may be one in which some metal atoms of the electrode are impregnated into the network structure formed by polymers within the substrate at a ratio of 30 to 90%.

[0020] According to another embodiment, a light emitting element coupled to a patterned metal electrode formed on a template includes a first region having a material printed on a surface thereof with a material that inhibits metal deposition and a second region having a metal electrode deposited on the surface thereof, and an elastic substrate having a network structure formed by polymers therein, wherein an intermediate layer is formed in which metal atoms are impregnated into the polymer network structure inside the substrate in a thickness direction from the surface of the second region where the electrode is formed, and the metal electrode may be electrically connected to the light emitting element.

[0021] In one embodiment, the elastic substrate may be tensile capable over a tensile strain range of 0% to 200%.

[0022] According to another embodiment, a method for manufacturing a patterned metal electrode formed on a template includes a step of preparing an elastic substrate, a step of printing a material that inhibits deposition of metal on the substrate to form a first region, a step of heat-treating the printed substrate, and a step of forming a metal electrode by exposing the heat-treated substrate to metal vapor in a high vacuum chamber, wherein the method for manufacturing a metal electrode may be performed using a template for patterning the metal electrode.

[0023]

[0024] According to the configuration of the present invention, a metal electrode that can be stretched without electrical defects can be formed on a substrate using a template that can pattern a metal electrode without a mask through a simple process.

[0025] The above template can be composed of heterogeneous elastomers, and has the advantage of being able to pattern a flexible metal electrode by utilizing the unique impregnation and desorption reactions exhibited by each elastomer when a metal is deposited, as well as securing a conductive path of the patterned electrode by utilizing the formation of micro-cracks due to tension.

[0026] The metal electrode formed on the template for metal electrode patterning of the present invention is a stretchable electrode that maintains electrical properties even when subjected to mechanical deformation, and can be further utilized universally in various soft electronics fields such as wearable devices for health monitoring, stretchable devices, human-machine interfaces, freeform displays, and tactile sensors.

[0027]

[0028] FIG. 1 is a schematic diagram schematically showing the structure of a template for metal electrode patterning according to one embodiment of the present invention.

[0029] FIG. 2 is a view of an elastic substrate on which a metal electrode is patterned on a template for metal electrode patterning according to one embodiment of the present invention.

[0030] FIG. 3 is a photograph taken under a microscope of the surface of an elastic substrate on which gold (Au) or silver (Ag) is patterned as a metal electrode on a template for metal electrode patterning according to one embodiment of the present invention.

[0031] FIG. 4 is a graph showing a change in electrode resistance according to a tensile strain in the range of 0 to 100% in a uniaxial direction applied to a metal electrode on which gold (Au) or silver (Ag) is patterned to a thickness of 50 nm on a template for metal electrode patterning according to one embodiment of the present invention.

[0032] FIG. 5 is a graph showing the change in resistance of a silver (Ag) electrode when a tensile strain of 0 to 30% is repeatedly applied 100 times to a silver (Ag) electrode patterned on a template for metal electrode patterning according to one embodiment of the present invention.

[0033] FIG. 6 is a graph showing the change in resistance of a gold (Au) electrode when a tensile strain ranging from 0 to 50% is repeatedly applied 100 times to a gold (Au) electrode patterned on a template for metal electrode patterning according to one embodiment of the present invention.

[0034] FIG. 7 is a graph of voltage change in a tensile strain range of 0 to 50%, in which a micro LED, which is a light-emitting element, is coupled to a metal electrode patterned on a template for metal electrode patterning according to one embodiment of the present invention.

[0035] FIG. 8 is a flowchart of a method for manufacturing a patterned metal electrode formed on a template for metal electrode patterning according to one embodiment of the present invention.

[0036]

[0037] The embodiments of the present invention are provided for the purpose of illustrating the technical concept of the present invention. The scope of the rights of the present invention is not limited to the embodiments presented below or the specific descriptions of these embodiments.

[0038] All technical and scientific terms used in this invention, unless otherwise defined, have the meanings commonly understood by those skilled in the art to which this invention pertains. All terms used in this invention have been selected for the purpose of more clearly explaining the invention and are not intended to limit the scope of the rights provided for in this invention.

[0039] Expressions such as “comprising,” “having,” and the like used in the present invention should be understood as open-ended terms that imply the possibility of including other embodiments, unless otherwise stated in the phrase or sentence in which the expression is included.

[0040] In the present invention, when a part such as a layer, film, region, or plate is said to be "over" or "on" another part, this includes not only cases where it is "directly over" the other part, but also cases where there is another part in between. Conversely, when a part is said to be "directly over" another part, it means that there is no other part in between. Furthermore, when a part is said to be "over" or "on" a reference part, it means that it is located above or below the reference part, and does not necessarily mean that it is located "over" or "on" the opposite direction of gravity.

[0041] In the present invention, “planar view” means a view when the object of the present invention is viewed from above, and “cross-sectional view” means a view when the object of the present invention is viewed from the side in a vertical cross-section.

[0042] The singular expressions described in the present invention may include plural meanings unless otherwise stated, and this also applies to the singular expressions described in the claims.

[0043]

[0044] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. In this process, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience. Furthermore, in the description of the embodiments below, redundant descriptions of identical or corresponding components may be omitted. However, omission of a description of a component does not imply that such component is not included in any embodiment.

[0045] In addition, the examples below do not limit the scope of the present invention, but are merely exemplary of the components presented in the claims of the present invention, and examples that include components that are included in the technical idea throughout the specification of the present invention and can be substituted as equivalents in the components of the claims may be included in the scope of the present invention.

[0046]

[0047] The present invention relates to a template for patterning a metal electrode, which includes a first region printed with a material that prevents metal deposition on an elastic substrate and a second region forming a location where metal is to be deposited, and more particularly, to a template capable of patterning a metal electrode on an elastic substrate without a commonly used shadow mask or photomask, and an electrode manufactured thereby, and a manufacturing method thereof.

[0048]

[0049] The present invention relates to a template capable of selectively patterning a metal electrode on an elastic substrate without a shadow mask or a photo mask, and provides a template for patterning a metal electrode including an elastic substrate.

[0050] The template for the above metal electrode patterning may include an elastic substrate, a first region on which a material that inhibits metal deposition is printed on the surface; and a second region that forms a location where the metal is to be deposited.

[0051] The above substrate can be formed to include a heterogeneous elastic body, and thus has the advantage that even when a significant tensile strain is applied while the patterned metal is deposited, microcracks may be generated on the substrate surface, but the metal electrodes will not be broken or the substrate will not be significantly damaged.

[0052]

[0053] The above elastic substrate may include at least one polymer composed of Styrene-Ethylene / Butylene-Styrene (SEBS) and polydimethylsiloxane (PDMS), and preferably, a Styrene-Ethylene / Butylene-Styrene (SEBS) substrate may be used.

[0054] The interior of the substrate may include a network structure formed by the polymers. The network structure is a complex matrix formed by the individual polymers being irregularly entangled with each other, which can prevent the substrate from being damaged by wear or external impact and provide elasticity and formability.

[0055] The above elastic substrate may be tensile capable in a tensile strain range of 0 to 200%.

[0056] The surface of the substrate may have a bulk surface through the polymer network structure. Since the network structure formed by the polymers forms an irregular surface, thereby increasing the surface area, a more effective and closely adhered form can be formed when another material is printed or deposited on top of the substrate.

[0057] According to one embodiment, the substrate may have a normalized resistance (R / R0) value of 70 or less in a uniaxial tensile strain range of 0% to 100%.

[0058] Materials that inhibit metal deposition may include polymeric materials that contain fluorine functional groups and have low surface energy. In one embodiment, the material that interferes with the metal may include at least one selected from the group consisting of poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP), trichloro(1H,1H,2H,2H-perfluorooctyl)silane (FOTS), poly(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctylmethacrylate (PFOMA) and (poly(1H,1H,2H,2H-perfluorodecyl methacrylate) (PFDMA), and preferably includes poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP). The printing method of the material that interferes with the deposition of the metal is not particularly limited, but it is preferably applied using a solution process, and for this purpose, it can be manufactured in the form of transparent ink. It is preferable that the material that interferes with the deposition be a material that not only has the property of interfering with the deposition but also has elasticity.

[0059] The material that inhibits the deposition of the metal should have inherently high elasticity, and more preferably, it should be a material that can maintain a film shape without breaking even in a tensile strain range of 800%. More preferably, it should be a material that can maintain a film shape without breaking even in a tensile strain range of 1000%. In addition, it is preferable that the material that inhibits the deposition of the metal be composed of a material that exhibits a tensile stress of less than 0.4 MPa in a tensile strain range of 0% to 800%.

[0060]

[0061] The material that inhibits the deposition of the metal may include various solvents such as Nmethyl-2-pyrrolidone (NMP), Triethyl phosphate (TEP), Dimethyl sulfoxide (DMSO), Methyl isobutyl ketone (MIBK), and Propylene glycol methyl ether acetate (PGMEA) to have properties suitable for the printing equipment (e.g., viscosity, surface tension, boiling point, etc.).

[0062] In addition, the material that interferes with the deposition of the metal may further include a crosslinking agent to secure mechanical flexibility of the printed pattern. The crosslinking agent may include a single agent or a mixture thereof selected from the group consisting of TAIC (1,3,5-Triallyl-1,3,5-triazinane-2,4,6-trione), BPO (dibenzoyl peroxide), DCP (Dicumyl peroxide), PBP (Perbutyl peroxide), MIKP (Methyl isobutyl ketone peroxide), and dimethyl di-t-butylperoxy hexane.

[0063] As an example, the composition of the material that inhibits metal deposition may be composed of 1 to 50 wt% of e-PVDF-HFP, 0.05 to 3 wt% of a crosslinker, and the remainder of a solvent.

[0064]

[0065] FIG. 1 is a schematic diagram schematically showing the structure of a template for metal electrode patterning according to one embodiment of the present invention, and illustrates a first region where a material that impedes metal deposition on an elastic substrate is printed; and a second region that forms a location where metal is to be deposited.

[0066]

[0067] The first region can be formed by printing a material that inhibits metal deposition on an elastic substrate in an engraved pattern. The printed film thickness is approximately tens of nm to 10 μm, and the applied ink can be used after heat treatment at room temperature to 180°C, preferably 100°C to 150°C. The line width of the printed pattern is limited by the ink application method of each process equipment. For example, when using an EHD printer, it is possible to implement a pattern with a minimum line width of tens of μm, so even fine patterns can be printed.

[0068] The substance that inhibits metal deposition can be applied using various printing equipment (e.g., inkjet printers, pneumatic dispensers, EHD printers), and can be printed in ink form to form a predetermined pattern using a printing process. In one embodiment, the substance that inhibits metal deposition can be applied using a roll-to-roll coating method.

[0069] As described above, since the surface of the elastic substrate has an irregular surface due to the polymer network structure, the material that inhibits the deposition of the metal printed in the first region can form a form that is completely in contact with the surface of the elastic substrate. Since the material that inhibits the deposition of the elastic metal can maintain a form that is completely in contact with the elastic substrate without peeling even when tensile strain is applied, it can be utilized as a template for metal electrode patterning.

[0070]

[0071] The second region forms a location where the metal is to be deposited. An area on the template including the elastic substrate, excluding the first region, may be defined as a second region forming a location where the metal is to be deposited. The second region is an area where a material that interferes with metal deposition is not printed, and the surface of the elastic substrate may be exposed.

[0072]

[0073] Hereinafter, as another embodiment of the present invention, a patterned metal electrode formed on a template using a template for metal electrode patterning will be described in detail. The metal electrode formed in this manner can be applied as an electrode of a variety of devices or as a substrate on which an electrode is mounted.

[0074] According to one embodiment, the patterned metal electrode formed on the template includes a first region having a material that inhibits metal deposition printed on the surface and a second region having a metal electrode deposited on the surface, and an elastic substrate having a polymer network structure therein, and an intermediate layer in which metal atoms are impregnated in the network structure formed by polymers inside the substrate in the thickness direction from the surface on which the electrode is formed in the second region may be formed.

[0075]

[0076] The above metal electrode can be formed by exposing the metal vapor on a template for metal electrode patterning in a high vacuum state. The template for metal electrode patterning is moved to a vacuum deposition chamber and deposited under a high vacuum, preferably at 10 -6 Deposition of a metal electrode can be performed under a pressure of less than 10 Torr. In one embodiment, the metal electrode may include a pattern formed by physical vapor deposition (PVD).

[0077] According to one embodiment, the metal electrode may be formed of one or more metals or alloys selected from the group consisting of gold (Au), silver (Ag), magnesium (Mg), copper (Cu), iron (Fe), and calcium (Ca).

[0078]

[0079] The growth of a deposited thin film on a metal electrode is influenced by the surface energy of the substrate. If the cohesive force between the metal atoms to be deposited is stronger than the interaction with the underlying substrate, the film will grow in an island-like manner, following the Volmer-Weber mode. Furthermore, some sources exhibit a complex phenomenon in which a substance that inhibits metal deposition fails to initiate a condensation reaction on the coated surface and instead desorbs, thereby controlling the growth rate of the deposited thin film.

[0080] When metal electrodes are deposited on a template for metal electrode patterning, the first region where a material that inhibits metal deposition is printed has a reduced deposition rate, preventing the formation of a metal thin film. Furthermore, the metal electrodes are selectively deposited only in the second region, which forms the location where the metal will be deposited. Therefore, selective metal electrode patterning is possible without using a separate mask or applying an additional wet process.

[0081]

[0082] The second region on which the metal electrode is deposited on the surface is a region in which metal vapor is deposited on the surface of an exposed elastic substrate, and the metal electrode can form a shape that adheres closely to the irregular surface of the elastic substrate. From the metal electrode formed on the surface of the second region, some metal atoms can diffuse into the interior of the substrate. Some of the diffused metal atoms can form an intermediate layer in which some metal atoms are impregnated into a network structure formed by polymers within the substrate.

[0083] The intermediate layer may be formed in the thickness direction on the surface of the substrate, and the depth of the intermediate layer may vary depending on deposition conditions such as the type of deposited metal, deposition rate, and deposition thickness. If the deposition rate of the metal is low, some of the metal vapor may diffuse deeper into the network structure of the substrate, thereby increasing the thickness of the intermediate layer.

[0084] The intermediate layer may tend to show a decreasing ratio of impregnated metal atoms as it deepens in the thickness direction from the surface of the substrate. The intermediate layer may be one in which some of the metal atoms of the electrode are impregnated in the network structure formed by the polymers inside the substrate at a ratio of preferably 30 to 90%. The impregnation ratio of the intermediate layer may vary depending on deposition conditions such as the type of metal, deposition rate, and deposition thickness. The impregnation ratio may be such that the metal atoms can diffuse and penetrate to a deeper depth when deposition is performed at a lower deposition rate, and more preferably, when an appropriate substrate thickness is formed, the metal atoms may be impregnated at a ratio of 40 to 80%.

[0085]

[0086] Some of the metal atoms in the intermediate layer can be impregnated with high molecular weight polymers forming a network structure to form an interlocked structure. This structure can form fine microcracks in the intermediate layer when a mechanical deformation, such as a tensile strain, is applied to the elastic substrate on which the metal electrode is deposited. As a result, since a conductive path is maintained through the microcracks in the intermediate layer even when a tensile strain is applied, a stretchable electrode capable of being stretched and a soft electrode having an overall low modulus can be realized.

[0087]

[0088] <Example 1>

[0089] Hereinafter, the performance of a metal electrode formed on a template according to one embodiment of the present invention in implementing the characteristics of a flexible electrode will be described in detail through experimental results.

[0090] According to the first embodiment described above, gold (Au) or silver (Ag) vapor was deposited on a template including a Styrene-Ethylene / Butylene-Styrene (SEBS) substrate to form a gold (Au) or silver (Ag) electrode in a second region of the template.

[0091] Fig. 2 is an image taken during a tensile test, and it can be confirmed that an elastic substrate with gold (Au) or silver (Ag) electrodes patterned on a template is well formed and that it is sufficiently tensile. Fig. 2 shows that patterning of gold (Au, left image) or silver (Ag, right image) electrodes on an elastic substrate is possible, and that tensile testing is possible together with the patterned metal electrodes formed on the template even without removing a substance that interferes with the deposition of the metal formed on the substrate.

[0092]

[0093] Figure 3 is a photograph of a gold (Au) or silver (Ag) electrode surface patterned on a template observed using an optical microscope.

[0094] The experiment was conducted using an Olympus, DSX510 instrument to photograph patterned metal electrodes formed on a template. The patterned metal electrode sample on the PVDF-HFP / SEBS template was fixed to a uniaxial tensile jig, tensile strain was applied, and observation was made under a microscope. The image in Fig. 3 was also taken in a state where the material that inhibits metal deposition was not removed, and the transparent area marked “Printed e-PVDF-HFP” is the area where the material that inhibits metal deposition was formed.

[0095] Referring to Fig. 3, on the surface of the first region where a material that inhibits metal deposition on the template is printed, it can be confirmed that gold (Au) or silver (Ag) electrodes are not deposited, and thus the transmittance is high when observed under a microscope. On the surface of the second region where gold (Au) or silver (Ag) electrodes are formed, it can be confirmed that metal electrodes are deposited on the surface, and it can be confirmed that micro-cracks are formed in the metal electrode region even in the tensile strain range of 50 to 100%. It can be observed that the material that inhibits metal deposition is in close contact with the lower substrate, and deforms in accordance with the movement of the lower substrate without peeling even in the tensile strain range of 50 to 100%. This is understood to be because it deforms without affecting the surrounding stress distribution due to the characteristics of the material having low tensile stress. In addition, since the material that inhibits metal deposition does not prevent the formation of micro-cracks in the metal electrode region, a structure that is advantageous for implementing a stretchable electrode can be formed.

[0096] Referring to Fig. 4, when a tensile strain ranging from 0 to 100% in the uniaxial direction is applied to a metal electrode patterned with gold (Au) or silver (Ag) to a thickness of 50 nm on a template, the normalized resistance (R / R0) value is 70 or less. Although the resistance increases with the strain as microcracks are formed, it can be confirmed that the conductive path is maintained without disconnection even at 100% tensile strain.

[0097] Referring to FIG. 5, even when a tensile strain ranging from 0 to 30% is repeatedly applied 100 times to a silver (Ag) electrode patterned on a template, the normalized resistance of the silver (Ag) electrode does not change significantly.

[0098] Referring to FIG. 6, the normalized resistance of the gold (Au) electrode is maintained even when a tensile strain ranging from 0 to 50% is repeatedly applied 100 times to the gold (Au) electrode patterned on the template.

[0099]

[0100] <Example 2>

[0101] According to one embodiment, a light-emitting element coupled to a patterned metal electrode formed on a template includes a first region having a material printed on a surface thereof with a material that inhibits metal deposition and a second region having a metal electrode deposited on the surface thereof, and an elastic substrate having a network structure formed by polymers therein, and an intermediate layer in which metal atoms are impregnated into the polymer network structure inside the substrate is formed in a thickness direction from a surface of the second region where the electrode is formed, and the metal electrode may be electrically connected to the light-emitting element.

[0102] In the present invention, the light-emitting element is not particularly limited, and any element that is electrically connected to an electrode and emits light can be used in the present invention. In one embodiment, the light-emitting element can be formed of any one selected from a group of light-emitting elements consisting of an LED, a mini LED, and a micro LED.

[0103] In one embodiment, the elastic substrate to which the light emitting element is electrically connected may be stretchable in a tensile strain range of 0 to 200%.

[0104] As an example, referring to FIG. 7, it was confirmed that a micro LED electrically connected to a gold (Au) electrode patterned on a template does not change voltage even when a tensile strain ranging from 0 to 50% is applied, and that it emits light without electrical defects even when a tensile strain of 50% is applied.

[0105]

[0106] Fig. 8 is a flowchart illustrating a method for manufacturing a patterned metal electrode formed on a template. The patterned metal electrode formed on the template utilizes the above-described template for metal electrode patterning, and may include a step of preparing an elastic substrate (S10); a step of printing a material that inhibits metal deposition on the substrate to form a first region (S20); a step of heat-treating the printed substrate (S30); and a step of exposing the heat-treated substrate to metal vapor in a high vacuum chamber to form a metal electrode (S40). Descriptions of the configuration of the above-described template and repetitive configurations in each step are omitted.

[0107]

[0108] The above description is merely an illustrative example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. In a template including an elastic substrate, The elastic substrate comprises a first region on which a material that inhibits metal deposition is printed on the surface; and a second region forming a location where the metal is to be deposited; Template for metal electrode patterning.

2. In paragraph 1, The substrate comprises at least one polymer selected from the group consisting of Styrene-Ethylene / Butylene-Styrene (SEBS) and polydimethylsiloxane (PDMS), The above substrate includes a network structure formed by the above polymers therein. Template for metal electrode patterning.

3. In paragraph 1, The material that interferes with the deposition of the metal includes at least one selected from the group consisting of Poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP), trichloro(1H,1H,2H,2H-perfluorooctyl)silane (FOTS), poly(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctylmethacrylate (PFOMA) and (poly(1H,1H,2H,2H-perfluorodecyl methacrylate) (PFDMA). Template for metal electrode patterning.

4. In paragraph 1, The above substrate has a normalized resistance (R / R0) value of 70 or less in a uniaxial tensile strain range of 0% to 100%. Template for metal electrode patterning.

5. In paragraph 1. The material that inhibits the deposition of the metal is made of a material that exhibits a tensile stress of less than 0.4 MPa in a tensile strain range of 0% to 800%. Template for metal electrode patterning.

6. A first region having a material printed on the surface that inhibits metal deposition; and A second region having a metal electrode deposited on the surface thereof, and comprising an elastic substrate having a polymer network structure therein; An intermediate layer impregnated with metal atoms is formed in a network structure formed by polymers inside the substrate in the thickness direction from the surface where the electrode of the second region is formed. A patterned metal electrode formed on a template.

7. In paragraph 6, The above metal electrode is formed of one or more metals or alloys selected from the group consisting of gold (Au), silver (Ag), magnesium (Mg), copper (Cu), iron (Fe), and calcium (Ca). A patterned metal electrode formed on a template.

8. In paragraph 6, The above metal electrode includes a pattern formed by physical vapor deposition (Physical Vapor Deposition, PVD). A patterned metal electrode formed on a template.

9. In paragraph 6, The above metal electrode is formed in a pattern without a mask only in a second area excluding a first area where a material that interferes with metal deposition is printed. A patterned metal electrode formed on a template.

10. In paragraph 6, The above intermediate layer is a layer in which some metal atoms of the electrode are impregnated in a network structure formed by polymers inside the substrate at a ratio of 30 to 90%. A patterned metal electrode formed on a template.

11. A first region having a material printed on the surface that inhibits metal deposition; and A second region having a metal electrode deposited on the surface thereof, and an elastic substrate including a network structure formed by polymers therein, An intermediate layer in which metal atoms are impregnated into the polymer network structure inside the substrate is formed in the thickness direction from the surface on which the electrode of the second region is formed, The above metal electrode is electrically connected to the light emitting element, A light emitting element coupled to a patterned metal electrode formed on a template.

12. In paragraph 11, The above elastic substrate is tensile capable in a tensile strain range of 0 to 200%, A light emitting element coupled to a patterned metal electrode formed on a template.

13. Step of preparing an elastic substrate; A step of forming a first region by printing a material that prevents deposition of metal on the substrate; A step of heat treating the printed substrate; and A step of forming a metal electrode by exposing the heat-treated substrate to metal vapor in a high vacuum chamber; In a method for manufacturing a metal electrode including: The method for manufacturing the above metal electrode is performed using a template for patterning the metal electrode of claim 1. A method for manufacturing a patterned metal electrode formed on a template.

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