Waste heat recovery method and apparatus for chip, storage medium, and vehicle system

Abstract

A waste heat recovery apparatus and method for a chip, a storage medium, and a vehicle system. The chip is provided in a housing; at least one heat conduction pipe is provided in the housing and a heat exchanger passes through the housing; one end of the heat exchanger is connected to the heat conduction pipe; and the other end of the heat exchanger is connected to an external circulation water path provided with a valve. The waste heat recovery method comprises: acquiring the temperature of the heat conduction pipe, the temperature of a coolant in the external circulation water path, and an ambient temperature; and when the ambient temperature is a preset temperature and the temperature of the heat conduction pipe is greater than the temperature of the coolant in the external circulation water path, controlling the valve to be opened, so as to recover waste heat of the chip by means of the heat exchanger and the coolant in the external circulation water path.

Description

Chip waste heat recovery method and device, storage medium and vehicle system Technical Field

[0001] The present disclosure relates to the technical field of waste heat recovery, and in particular to a waste heat recovery method for a chip, a computer-readable storage medium, a whole vehicle system, and a waste heat recovery device for a chip. Background Art

[0002] Vehicle components often generate heat during operation. If this heat is not recycled in time, it will be dissipated directly, causing waste and affecting the environment.

[0003] In related technologies, waste heat recovery in the chips inside the entire vehicle system or components is achieved by converting heat energy into electrical energy through thermoelectric power generation for recovery, directly recovering heat energy through circulating water, and directly recovering heat energy through a heat pump.

[0004] Among them, the efficiency of thermoelectric power generation is 3%-10%, which is low in efficiency and poor in recovery effect, making it difficult to use on a large scale in the mass production of actual project models; in the process of collecting heat energy directly through the cooling circuit or refrigerant circuit, the cooling circuit or refrigerant circuit needs to be pre-arranged in the components, and it is not easy to install, maintain and replace later. It is also not conducive to modularization and commonality in multiple models, and has poor feasibility.

[0005] Public content

[0006] The present disclosure aims to address, at least to some extent, one of the technical problems in the related art. To this end, the first objective of the present disclosure is to provide a method for recovering waste heat from a chip. This method uses a heat exchanger and coolant in an external circulating water circuit to recover waste heat conducted from the chip into a heat pipe, thereby improving heat recovery efficiency. Furthermore, the external circulating water circuit is easy to install and maintain, offering high versatility and feasibility. Furthermore, the method can achieve both waste heat recovery in winter and cooling in summer.

[0007] A second object of the present disclosure is to provide a computer-readable storage medium.

[0008] The third objective of the present disclosure is to provide a whole vehicle system.

[0009] The fourth objective of the present disclosure is to provide a waste heat recovery device for a chip.

[0010] In order to achieve the above-mentioned purpose, the first aspect embodiment of the present disclosure proposes a method for recovering waste heat of a chip, wherein the chip is arranged inside a shell, at least one heat pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, and a valve is provided in the external circulating water circuit. The method includes: obtaining the temperature of the heat pipe, the temperature of the coolant in the external circulating water circuit and the ambient temperature; when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, controlling the valve to open to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

[0011] According to the waste heat recovery method of the chip proposed in the embodiment of the present disclosure, the waste heat conducted from the chip to the heat pipe is recovered by the coolant in the heat exchanger and the external circulating water circuit, which can improve the recovery efficiency of heat energy. The external circulating water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.

[0012] In addition, the chip waste heat recovery method according to the above embodiment of the present disclosure may also have the following additional technical features:

[0013] According to one embodiment of the present disclosure, the ambient temperature meets the preset temperature, including: the ambient temperature is less than or equal to a first preset temperature, or the ambient temperature is greater than or equal to a second preset temperature, and the first preset temperature is less than the second preset temperature.

[0014] According to an embodiment of the present disclosure, the value range of the first preset temperature is [5°C, 10°C], and the value range of the second preset temperature is [30°C, 40°C].

[0015] According to an embodiment of the present disclosure, a first heat conducting pipe and a second heat conducting pipe are provided inside the housing. The first heat conducting pipe is used to support the chip, and the second heat conducting pipe is provided above the chip.

[0016] According to an embodiment of the present disclosure, a groove is further provided on the first heat pipe, and the groove is used to place the chip.

[0017] According to an embodiment of the present disclosure, a portion of the first heat pipe used for supporting the chip is provided with at least one opening.

[0018] According to one embodiment of the present disclosure, heat insulation cotton is provided on the inner side of the shell.

[0019] In order to achieve the above-mentioned purpose, the second embodiment of the present disclosure proposes a computer-readable storage medium, on which a chip waste heat recovery program is stored. When the chip waste heat recovery program is executed by a processor, the above-mentioned chip waste heat recovery method is implemented.

[0020] The computer-readable storage medium according to the above-mentioned embodiment of the present disclosure can improve the recovery efficiency of heat energy generated during chip operation, and has strong versatility and feasibility. At the same time, it can realize waste heat recovery in winter and cooling in summer.

[0021] In order to achieve the above-mentioned purpose, the third aspect embodiment of the present disclosure proposes a whole vehicle system, which includes a memory, a processor and a waste heat recovery program of a chip stored in the memory and runnable on the processor. When the processor executes the waste heat recovery program, the above-mentioned waste heat recovery method of the chip is implemented.

[0022] The vehicle system proposed according to the embodiment of the present disclosure can improve the recovery efficiency of the heat energy generated during chip operation, and the waste heat recovery method is highly versatile and feasible, and can also achieve waste heat recovery in winter and cooling in summer.

[0023] In order to achieve the above-mentioned purpose, the fourth aspect embodiment of the present disclosure proposes a waste heat recovery device for a chip, wherein the chip is arranged inside a shell, at least one heat pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, and a valve is provided in the external circulating water circuit. The device includes: an acquisition module for obtaining the temperature of the heat pipe, the coolant temperature in the external circulating water circuit and the ambient temperature; a control module for controlling the valve to open when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the coolant temperature in the external circulating water circuit, so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

[0024] According to the waste heat recovery device of the chip proposed in the embodiment of the present disclosure, the control module controls the heat exchanger and the coolant in the external circulating water circuit to recover the waste heat conducted into the heat pipe by the chip, which can improve the recovery efficiency of heat energy. The external circulating water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.

[0025] Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic diagram of the structure of components including a chip according to an embodiment of the present disclosure;

[0027] FIG2 is a schematic flow chart of a method for recovering waste heat from a chip according to an embodiment of the present disclosure;

[0028] FIG3 is a schematic diagram of the structure of components of a vehicle lamp according to a specific embodiment of the present disclosure;

[0029] FIG4 is a schematic flow diagram of a method for recovering waste heat from a chip according to a specific embodiment of the present disclosure;

[0030] FIG5 is a block diagram of a vehicle system according to an embodiment of the present disclosure;

[0031] FIG6 is a block diagram of a waste heat recovery device for a chip according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] The following describes in detail embodiments of the present disclosure, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0033] The following describes a chip waste heat recovery method, a computer-readable storage medium, a vehicle system, and a chip waste heat recovery device according to embodiments of the present disclosure with reference to the accompanying drawings.

[0034] FIG1 is a schematic diagram of components including a chip according to an embodiment of the present disclosure.

[0035] Specifically, in some embodiments of the present disclosure, the chip 13 is arranged inside the shell 10, at least one heat pipe is provided inside the shell 10, a heat exchanger 15 is provided through the shell 10, one end of the heat exchanger 15 is connected to the heat pipe, and the other end of the heat exchanger 15 is connected to an external circulating water circuit, a valve 20 is provided in the external circulating water circuit, and when coolant passes through the external circulating water circuit, the heat on the heat pipe can be discharged through the coolant through the heat exchanger 15.

[0036] FIG2 is a schematic flow chart of a method for recovering waste heat from a chip according to an embodiment of the present disclosure.

[0037] Specifically, in some embodiments of the present disclosure, as shown in FIG2 , a chip waste heat recovery method includes the following steps:

[0038] S101, obtaining the temperature of the heat pipe, the temperature of the coolant in the external circulating water circuit, and the ambient temperature.

[0039] Specifically, in this embodiment, a temperature sensor can be set on the heat exchanger to obtain the temperature of the heat pipe, a temperature sensor can be set in the external circulating water circuit to obtain the coolant temperature of the external circulating water circuit, and a temperature sensor can be set outside the shell to obtain the ambient temperature. Of course, the temperature of the pipe in the external circulating water circuit can be detected, and then the temperature of the coolant can be calculated based on the temperature of the pipe. The environmental information can also be determined by obtaining weather temperature information released by the Meteorological Bureau. In addition, the present disclosure may not specifically limit the method of obtaining the temperature of the heat pipe, the coolant temperature in the external circulating water circuit, and the ambient temperature.

[0040] S102, when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, the control valve is opened to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

[0041] Specifically, in this embodiment, when the ambient temperature is less than or equal to a first preset temperature, or when the ambient temperature is greater than or equal to a second preset temperature, the first preset temperature is less than the second preset temperature, and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, the valve is controlled to open, thereby recovering waste heat from the chip through the heat exchanger and the coolant in the external circulating water circuit. Furthermore, when the ambient temperature is greater than the first preset temperature and less than the second preset temperature, the chip operates within a suitable temperature range, requiring neither heat dissipation to prevent component ablation nor excessive heat absorption. Therefore, within this temperature range, the valve does not need to be controlled to open.

[0042] It should be noted that the value range of the first preset temperature is [5°C, 10°C], and the value range of the second preset temperature is [30°C, 40°C]. Among them, the value of the first preset temperature can be preferably 7°C, and the value of the second preset temperature can be preferably 35°C. That is, when the ambient temperature is less than or equal to 7°C, due to the low ambient temperature, the heat energy generated by the chip operation can be recovered and used elsewhere in the vehicle, so the valve needs to be opened; and when the ambient temperature is greater than or equal to 35°C, due to the high ambient temperature, the temperature of the chip working environment needs to be lowered to prevent component ablation, so the valve also needs to be opened. In addition, the present disclosure does not specifically limit the values ​​of the first preset temperature and the second preset temperature.

[0043] Furthermore, in some embodiments of the present disclosure, a first heat conducting pipe and a second heat conducting pipe are provided inside the housing, the first heat conducting pipe is used to carry the chip, and the second heat conducting pipe is provided above the chip.

[0044] Specifically, in this embodiment, as shown in FIG1 , a first heat pipe 11 and a second heat pipe 12 are provided inside the housing 10. The first heat pipe 11 is also provided with a groove (not shown in the figure), which can be used to place the chip 13. The portion of the first heat pipe 11 used to carry the chip 13 is provided with at least one opening, thereby increasing the heat exchange efficiency and reducing the contact thermal resistance. In addition, the heat exchange efficiency can be increased by applying thermal adhesive on the heat source side of the first heat pipe 11 and the second heat pipe 12. The second heat pipe 12 is arranged above the chip 13. The heat generated by the chip 13 during operation can heat the air above it, thereby generating a heat flow. Therefore, arranging the second heat pipe 12 above the chip 13 can improve the waste heat recovery rate. Of course, in some examples, the second heat pipe 12 can also be set in a ring shape to surround the chip 13. In other words, the first heat pipe 11 and the second heat pipe 12 can also be designed in a non-standard manner such as a special shape, that is, the first heat pipe 11 and the second heat pipe 12 can be customized for the heat dissipation device.

[0045] It should be noted that, as shown in Figure 1, a PCB (Printed Circuit Board) 14 is also placed on the first heat pipe 11. The bottom surface of the PCB 14 contacts the heat source side of the first heat pipe. Therefore, when the temperature of the chip 13 rises, the heat from the PCB 14 or the chip 13 is transferred to the heat exchanger 15 through the first heat pipe 11. The control valve 20 is opened, and coolant enters the heat exchanger 15 through the inlet pipe 16 of the external circulating water circuit. After absorbing the heat from the heat exchanger 15, the coolant flows out through the outlet pipe 17 of the external circulating water circuit, collecting the heat in the vehicle's heating circuit for utilization, such as heating the seat backs and the interior ambient temperature of the vehicle. Furthermore, the present disclosure does not specifically limit the use of the collected heat; it can be determined based on the user's real-time needs. It should be noted that the heat exchanger 15 is also equipped with a temperature sensor 18 for detecting the temperature of the heat exchanger 15, as well as a base 19 for supporting the housing 10.

[0046] Furthermore, in some embodiments of the present disclosure, heat insulation cotton is provided on the inner side of the shell.

[0047] Specifically, in this embodiment, by providing thermal insulation cotton inside the housing, heat loss can be prevented, facilitating maximum heat collection. Furthermore, thermal insulation materials such as foam and fiber materials can also be provided inside the housing. Furthermore, the present disclosure does not specifically limit the selection of thermal insulation materials provided within the housing. Of course, in some examples, the housing 10 can also be configured as a heat pipe to participate in the recovery of waste heat from the chip.

[0048] Taking the vehicle headlights as an example, as shown in Figure 3, when the chip waste heat recovery method is applied to the headlights, the temperature of the headlight chip 25 rises when it is working, and the heat generated by the headlight PCB board 24 and / or the headlight chip 25 will be transferred to the headlight heat exchanger 32 through the headlight PCB heat pipe 26. The heat radiation and the rising hot air flow heat the upper components, such as the reflector 23, the lampshade 29, the decorative ring 30 and the lens 31. The reflector heat pipe 22 above the headlight chip 25 and in contact with the reflector 23 will transfer the heat of the reflector 23 and other components to the headlight heat exchanger 32, thereby preventing the components from being burned and failing.

[0049] The headlight temperature sensor 36 can preferentially obtain the temperature of the headlight PCB heat pipe 26, that is, the priority of the headlight PCB heat pipe 26 is higher than the priority of the reflector heat pipe 22. In addition, the present disclosure may not specifically limit the priority of the headlight PCB heat pipe 26 and the reflector heat pipe 22. When the ambient temperature is less than or equal to the first preset temperature or the ambient temperature is greater than or equal to the second preset temperature, and the headlight temperature sensor 36 obtains that the temperature of the headlight PCB heat pipe 26 is higher than the temperature of the coolant in the external circulating water circuit, the headlight valve 34 is controlled to open, and the coolant enters the headlight heat exchanger 32 through the headlight water inlet pipe 33 of the external circulating water circuit. After the coolant absorbs the heat from the headlight heat exchanger 32, it flows out through the water outlet pipe 37 of the external circulating water circuit, and then collects the heat into the vehicle heating circuit. The collected heat is utilized, for example, to heat the seat backs and the internal ambient temperature of the vehicle body, thereby reducing the energy consumption of the entire vehicle. The headlight also includes a bracket 27, a first headlight shell 21 and a second headlight shell 28, wherein the bracket 27 is used to support the headlight PCB heat pipe 26 to fix the headlight PCB heat pipe 26. The first headlight shell 21 and the second headlight shell 28 are arranged in conjunction with each other to protect the internal components of the headlight. At the same time, heat insulation cotton can be provided on the inner side of the first headlight shell 21 and the second headlight shell 28 to prevent heat loss and facilitate the maximum collection of the heat generated by the headlight.

[0050] It should be noted that the waste heat recovery method of the chip disclosed in the present invention can be applied not only to car lights, but also to engines, brake pads and other places. As long as it is a place on the vehicle that generates heat, this method can be used to recover heat. The present disclosure does not specifically limit the application scenarios of the waste heat recovery method of the chip.

[0051] The following describes the specific process steps of the chip waste heat recovery method in conjunction with FIG4 and a specific embodiment of the present disclosure. As shown in FIG4 , the following steps are performed:

[0052] S1, start to recover chip waste heat.

[0053] S2, the heat exchanger water circuit is closed by default, that is, the valve is closed by default so that the heat exchanger is not connected to the external circulating water circuit for heat exchange.

[0054] S3, obtaining the temperature of the heat pipe, the temperature of the coolant in the external circulating water circuit, and the ambient temperature.

[0055] S4, when the ambient temperature is less than or equal to the first preset temperature or the ambient temperature is greater than or equal to the second preset temperature, and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, the valve in the external circulating water circuit is controlled to open, wherein the first preset temperature is less than the second preset temperature.

[0056] S5, opening the heat exchanger water circuit to achieve heat exchange between the external circulation water circuit and the heat exchanger.

[0057] In summary, according to the waste heat recovery method of the chip proposed in the embodiment of the present disclosure, the waste heat conducted from the chip to the heat pipe is recovered through the heat exchanger and the coolant in the external circulating water circuit, which can improve the recovery efficiency of heat energy. This waste heat recovery method has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.

[0058] Based on the aforementioned chip waste heat recovery method of the embodiment of the present disclosure, the embodiment of the present disclosure also proposes a computer-readable storage medium, on which a chip waste heat recovery program is stored. When the chip waste heat recovery program is executed by the processor, the chip waste heat recovery method of the aforementioned embodiment of the present disclosure is implemented.

[0059] In summary, according to the computer-readable storage medium of the above-mentioned embodiment of the present disclosure, the processor executes the waste heat recovery program of the chip stored thereon, which can improve the recovery efficiency of the heat energy generated during the operation of the chip, and the waste heat recovery method has strong versatility and feasibility, and can also realize waste heat recovery in winter and cooling in summer.

[0060] FIG5 is a block diagram of a vehicle system according to an embodiment of the present disclosure.

[0061] Furthermore, as shown in Figure 5, based on the waste heat recovery method of the chip of the aforementioned embodiment of the present disclosure, the embodiment of the present disclosure also proposes a whole vehicle system 1000, including a memory 1001, a processor 1002, and a waste heat recovery program of the chip stored in the memory 1001 and executable on the processor 1002. When the processor 1002 executes the waste heat recovery program, the waste heat recovery method of the chip of the aforementioned embodiment of the present disclosure is implemented.

[0062] In summary, according to the vehicle system of the embodiment of the present disclosure, the processor executes the waste heat recovery program stored in the chip on the memory, which can improve the recovery efficiency of the heat energy generated during the operation of the chip, and the waste heat recovery method is more versatile and feasible, and can also achieve waste heat recovery in winter and cooling in summer.

[0063] FIG6 is a block diagram of a waste heat recovery device for a chip according to an embodiment of the present disclosure.

[0064] As shown in Figure 6, the chip's waste heat recovery device 2000 includes an acquisition module 100 and a control module 200. The chip is arranged inside the shell. At least one heat pipe is arranged inside the shell. A heat exchanger is arranged through the shell. One end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit. A valve is provided in the external circulating water circuit.

[0065] Among them, the acquisition module 100 is used to obtain the temperature of the heat pipe, the temperature of the coolant in the external circulating water circuit and the ambient temperature; the control module 200 is used to control the valve to open when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

[0066] In some embodiments of the present disclosure, the ambient temperature meeting the preset temperature includes: the ambient temperature is less than or equal to a first preset temperature, or the ambient temperature is greater than or equal to a second preset temperature, wherein the first preset temperature is less than the second preset temperature.

[0067] In some embodiments of the present disclosure, the first preset temperature ranges from [5° C., 10° C.], and the second preset temperature ranges from [30° C., 40° C.].

[0068] In some embodiments of the present disclosure, a first heat conducting pipe and a second heat conducting pipe are disposed inside the housing. The first heat conducting pipe is used to carry the chip, and the second heat conducting pipe is disposed above the chip.

[0069] In some embodiments of the present disclosure, a groove is further provided on the first heat pipe, and the groove is used to place the chip.

[0070] In some embodiments of the present disclosure, a portion of the first heat pipe used to carry the chip is provided with at least one opening.

[0071] In some embodiments of the present disclosure, thermal insulation cotton is provided on the inner side of the shell.

[0072] It should be noted that other specific implementations of the chip waste heat recovery device proposed in the embodiment of the present disclosure can refer to the specific implementations of the chip waste heat recovery method in the aforementioned embodiment of the present disclosure. To reduce redundancy, they will not be repeated here.

[0073] In summary, according to the waste heat recovery device of the chip proposed in the embodiment of the present disclosure, the control module controls the heat exchanger and the coolant in the external circulation water circuit to recover the waste heat conducted to the heat pipe by the chip, which can improve the recovery efficiency of heat energy. The external circulation water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.

Claims

1. A method for recovering waste heat from a chip, wherein: The chip is arranged inside the shell, at least one heat conducting pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat conducting pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, and a valve is arranged in the external circulating water circuit, and the method includes: Obtaining the temperature of the heat transfer pipe, the temperature of the coolant in the external circulating water circuit, and the ambient temperature; When the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, the valve is controlled to open to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

2. The waste heat recovery method according to claim 1, wherein: The ambient temperature meets the preset temperature, including: The ambient temperature is less than or equal to a first preset temperature, or the ambient temperature is greater than or equal to a second preset temperature, wherein the first preset temperature is less than the second preset temperature.

3. The waste heat recovery method according to claim 2, wherein: The value range of the first preset temperature is [5°C, 10°C], and the value range of the second preset temperature is [30°C, 40°C].

4. The waste heat recovery method according to any one of claims 1 to 3, wherein: A first heat conducting pipe and a second heat conducting pipe are arranged inside the shell, the first heat conducting pipe is used to carry the chip, and the second heat conducting pipe is arranged above the chip.

5. The waste heat recovery method according to claim 4, wherein: The first heat conducting pipe is also provided with a groove, and the groove is used for placing the chip.

6. The waste heat recovery method according to claim 4 or 5, wherein: The portion of the first heat pipe used for supporting the chip is provided with at least one opening.

7. The waste heat recovery method according to any one of claims 1 to 6, wherein: Heat insulation cotton is arranged on the inner side of the shell.

8. A computer-readable storage medium having a waste heat recovery program for a chip stored thereon, wherein the waste heat recovery program for the chip, when executed by a processor, implements the waste heat recovery method for the chip according to any one of claims 1 to 7.

9. A whole vehicle system, comprising a memory, a processor, and a waste heat recovery program of a chip stored in the memory and executable on the processor, wherein when the processor executes the waste heat recovery program, a waste heat recovery method of a chip according to any one of claims 1 to 7 is implemented.

10. A waste heat recovery device for a chip, wherein: The chip is arranged inside the shell, at least one heat conducting pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat conducting pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, a valve is arranged in the external circulating water circuit, and the device comprises: An acquisition module, used for acquiring the temperature of the heat conducting pipe, the temperature of the coolant in the external circulating water circuit and the ambient temperature; The control module is used to control the valve to open when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.

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