Adjustable wafer loading and unloading stage

Abstract

Disclosed in the present invention is an adjustable wafer loading and unloading stage, comprising: a polishing head guide supporting base, which is provided with a positioning slot capable of fitting with a polishing head; a lifting platform, which is used for bearing a wafer and can move up and down relative to the polishing head guide supporting base, the lifting platform and the positioning slot being concentric and coaxial; and guide blocks, which are arranged in the circumferential direction of the polishing head guide supporting base. The guide blocks are optional or the positions of the guide blocks relative to the polishing head guide supporting base are optional, or both, so that the diameter of a space enclosed by the guide blocks can be changed. In the present invention, during the alignment of the polishing head and the loading and unloading stage, the concentricity and coaxiality of a wafer with respect to the lifting platform and the polishing head guide supporting base can be effectively ensured, so that the concentricity and coaxiality of a transferring wafer with respect to different transfer components can be ensured, thereby enabling a wafer handling process to be effective, facilitating subsequent wafer transfer, and increasing the success rate of a robotic arm in picking up wafers; and the loading and unloading stage can adapt to wafers of different sizes, providing a high degree of flexibility during use.

Description

Adjustable wafer loading and unloading platform Technical Field

[0001] The invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to an adjustable wafer loading and unloading platform. Background Art

[0002] Chemical Mechanical Planarization (CMP) equipment typically consists of a semiconductor front-end module (EFEM), a cleaning unit, and a polishing unit. The EFEM primarily includes a wafer cassette, a wafer transfer robot, and an air purification system. The cleaning unit primarily comprises a varying number of megasonic cleaning components, a roller brush cleaning unit, a drying unit, and a device for transferring wafers between components. The polishing unit primarily includes a polishing table, a polishing head, a polishing fluid supply system, and a polishing pad conditioning system.

[0003] In recent years, with the rapid development of the semiconductor industry, CMP has gradually been applied to the polishing of third-generation semiconductor wafers. As processing technology for third-generation semiconductor wafers continues to improve and wafer sizes expand from 6 inches to 8 inches, there is a demand for polishing wafers ranging in size from 6 inches to 12 inches. Therefore, loading and unloading platforms need to be compatible with a variety of wafer sizes.

[0004] Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the present invention provides an adjustable wafer loading and unloading platform, which can support and load and unload wafers of various diameters, and the loaded wafers are concentric and coaxial with the lifting platform and the polishing head.

[0006] The technical solution adopted by the present invention to solve the technical problem is: an adjustable wafer loading and unloading platform, comprising:

[0007] A polishing head guide support seat having a positioning slot that can cooperate with the polishing head;

[0008] A lifting platform, used to receive the wafer and move up and down relative to the polishing head guide support seat, the lifting platform being concentric and coaxial with the positioning slot;

[0009] A guide block is arranged along the circumference of the polishing head guide support seat;

[0010] The guide block is optional, or / and the relative position of the guide block and the polishing head guide support seat is optional, so as to change the diameter of the space formed by the guide block.

[0011] The present invention can change the diameter of the space formed by the guide block through the optional guide block, or through the optional positional relationship between the guide block and the center of the polishing head guide support seat, or a combination of the above two methods. When the polishing head carries the wafer to the loading and unloading platform, it is sufficient as long as the polishing head and the positioning slot cooperate to achieve concentricity and coaxiality between the two. Ultimately, the wafer and the lifting platform and the positioning slot can be concentric and coaxial. That is, wafers of different diameters can be accurately placed in the space enclosed by the guide block, ensuring the effectiveness of the next step of the wafer transmission action. The loading and unloading platform can adapt to wafers of different sizes and has high flexibility in use.

[0012] Furthermore, the guide block has an inclined guide surface on the side facing the wafer that can abut against the sidewall of the wafer. The inclined guide surface is tilted from top to bottom, toward the center axis of the lifting platform. When the lifting platform receives the wafer, the lifting platform and the wafer are not necessarily concentric and coaxial. As the wafer contacts the guide block, it can slide against the inclined guide surface, so that with the cooperation of the guide block, the wafer can be concentric and coaxial with the lifting platform.

[0013] Furthermore, the number of the inclined guide surfaces is one or two or more. When there are two or more inclined guide surfaces, the intersections of the wafer and adjacent inclined guide surfaces offset each other. When there are two inclined guide surfaces, the intersections of the wafer and the two inclined guide surfaces offset each other, thereby more firmly clamping the wafer, effectively ensuring that the wafer is located on a horizontal plane, and without adversely affecting the wafer surface.

[0014] Furthermore, the polishing head guide support seat is provided with a slide groove, which extends in the radial direction of the polishing head guide support seat, and the guide block can move relative to the slide groove. The setting of the slide groove defines the moving direction of the guide block, ensuring that the guide block translates in the radial direction.

[0015] Furthermore, the guide block is locked by a fastener after being moved relative to the slide groove to the target position. The guide block is fixedly connected to the polishing head guide support seat so that the space formed by the guide block will not be changed at will.

[0016] Furthermore, the bottom or side of the chute is provided with multiple radially arranged sockets, and the bottom or side of the guide block is provided with positioning posts that can be inserted into the sockets to achieve positioning and mating between the guide block and the polishing head guide support. The positioning posts can be selectively inserted into sockets of different diameters as needed, thereby varying the diameter of the space enclosed by the guide block, providing easy adjustment and relatively accurate position adjustment.

[0017] Furthermore, the chute or its corresponding area is marked with scale lines, so that the operator can adjust the installation position of the guide block intuitively.

[0018] Furthermore, the side wall of the polishing head guide support seat is formed with a notch for the guide block to extend out, thereby increasing the travel of the guide block and being able to accommodate wafers of various sizes.

[0019] Furthermore, the polishing head guide support seat has a limiting step, which is concentric and coaxial with the positioning slot, and the sliding slot is opened on the limiting step.

[0020] Furthermore, the limiting step and the positioning slot share a common surface. The limiting step not only forms the positioning slot, but also facilitates the formation of the slide slot, and the structural design is ingenious.

[0021] Furthermore, the guide blocks are of selectable sizes, and guide blocks of different sizes can be detachably connected to the chute to vary the diameter of the space enclosed by the guide blocks. When a larger guide block is selected, the diameter of the space enclosed is relatively small, suitable for small wafers. When a larger guide block is selected, the diameter of the space enclosed is relatively large, suitable for large wafers.

[0022] Furthermore, the number of the guide blocks is two or more.

[0023] Furthermore, the guide blocks move the same or different distances to limit the movement of the wafer.

[0024] Furthermore, a centering member is included, comprising a main body adapted to extend into the positioning slot and a centering portion concentric and coaxial with the main body. The guide block is moved relative to the polishing head guide support until it abuts against the centering portion and then positioned, whereupon the centering member is removed from the polishing head guide support. Using different centering members allows for quick adjustment of the guide block, convenient operation, and accurate position adjustment.

[0025] Furthermore, the centering piece is optional, and different centering pieces have the same main body but different centering parts.

[0026] Furthermore, the number of guide blocks is 4-6. By varying the sizes of the guide blocks or the relative positions of the guide blocks to the chute, the problem of wafers with cut edges can be solved. Even if the wafer has one or two cut edges, the wafer and the lifting platform can be aligned by cooperating with the centering member, thus achieving higher adaptability.

[0027] Furthermore, the number of the guide blocks is 6 or more. By providing 6 or more guide blocks, wafers of different sizes and with cut edges can be accommodated.

[0028] The beneficial effects of the present invention are: 1) during the docking process of the polishing head and the loading and unloading platform, the concentricity and coaxiality of the wafer, the lifting platform and the polishing head guide support seat can be effectively guaranteed, so that the wafer transmission process can ensure the concentricity and coaxiality with different transmission components, which is convenient for the effective implementation of the wafer processing process, beneficial to the subsequent wafer transmission, and improves the success rate of the robot arm to take the wafer; 2) the loading and unloading platform can adapt to wafers of different sizes and has high flexibility in use; 3) the guide block contacts the side wall of the wafer and will not affect the wafer surface, thereby minimizing wafer defects; 4) the guide block is easy to adjust and the adjustment position is relatively accurate; 5) using different centering parts, the guide block can be quickly adjusted, the operation is convenient, and the position adjustment is accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a top view of the present invention in cooperation with a polishing head.

[0030] FIG2 is a front view of the present invention in cooperation with a polishing head.

[0031] FIG3 is a cross-sectional view taken along line AA in FIG2 .

[0032] FIG4 is an enlarged view of the structure at point B in FIG3 .

[0033] FIG5 is a front view of the polishing head in the first embodiment of the present invention.

[0034] FIG6 is a CC cross-sectional view of FIG5 .

[0035] FIG7 is a top view of the first embodiment of the present invention, where a wafer is supported on the lifting platform.

[0036] FIG8 is a perspective view of the first embodiment of the present invention, where a wafer is supported on the lifting platform.

[0037] FIG9 is an enlarged view of the structure at point D in FIG8 .

[0038] FIG10 is a perspective view of the guide block in the first embodiment of the present invention.

[0039] FIG11 is an enlarged view of the structure at point F in FIG15 .

[0040] FIG12 is a schematic diagram of the three-dimensional structure of the first embodiment of the present invention.

[0041] FIG13 is an enlarged view of the structure at point G in FIG12 .

[0042] FIG14 is a top view of the second embodiment of the present invention.

[0043] FIG15 is a cross-sectional view taken along line EE in FIG14 .

[0044] FIG16 is a top view of the third embodiment of the present invention.

[0045] FIG17 is an enlarged view of the structure at point H in FIG16 .

[0046] FIG18 is a schematic diagram of the coordination structure of the guide block and the lifting platform in the third embodiment of the present invention.

[0047] FIG19 is a three-dimensional diagram of the guide block in the third embodiment of the present invention.

[0048] FIG20 is a schematic diagram of a partial structure of the fourth embodiment of the present invention.

[0049] FIG21 is a schematic diagram of the matching structure of the guide block and the wafer in the sixth embodiment of the present invention.

[0050] FIG22 is a schematic diagram of wafer edge cutting in the sixth embodiment of the present invention.

[0051] Among them, 1-polishing head guide support seat, 11-positioning slot, 12-slide groove, 13-jack, 14-notch, 15-limiting step, 16-travel slot, 2-lifting platform, 3-wafer, 31-wafer cutting edge, 4-guide block, 40-fixing hole, 41-inclined guide surface, 42-fastener, 43-positioning column, 5-centering piece, 51-main body, 52-centering part, 6-polishing head. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0053] As shown in Figures 1 to 4, an adjustable wafer loading and unloading platform includes a polishing head guide support seat 1, a lifting platform 2 for receiving wafers 3, and guide blocks 4 arranged along the circumference of the polishing head guide support seat 1. The polishing head guide support seat 1 has a positioning card slot 11 that can cooperate with the polishing head 6. The cooperation here means that the lower part of the polishing head 6 can be just clamped in the positioning card slot 11, and the two form a radial limit fit. The lifting platform 2 can move up and down relative to the polishing head guide support seat 1, and the lifting platform 2 is concentric and coaxial with the positioning card slot 11. In other words, the lifting platform 2 is concentric and coaxial with the polishing head guide support seat 1.

[0054] In the first form, the guide block 4 is optional, so that the diameter of the space enclosed by the guide block 4 changes.

[0055] In the second form, the relative positions of the guide block 4 and the center of the polishing head guide support seat 1 can be selected so that the diameter of the space enclosed by the guide block 4 changes.

[0056] The above two forms can be selected either one or both forms can exist at the same time, so as to adapt to the loading and unloading of wafers with different diameters.

[0057] Example 1

[0058] As shown in Figures 5-14, an adjustable wafer loading and unloading platform, based on the above structure, has a slide groove 12 extending radially along the polishing head guide support base 1. A notch 14 is formed in the sidewall of the polishing head guide support base 1, through which the guide block 4 extends. The guide block 4 can move relative to the slide groove 12, that is, the relative position of the guide block 4 and the polishing head guide support base 1 can change.

[0059] As shown in Figures 7-9, the polishing head guide support 1 has a stopper step 15, which is concentric and coaxial with the positioning slot 11. The slide slot 12 is located at this stopper step 15. In other words, the stopper step 15 is discontinuous, and the end surface of the discontinuity forms the sidewall of the slide slot 12. The stopper step 15 is formed on the lower surface of the positioning slot 11. In other words, the top surface of the stopper step 15 is the bottom surface of the positioning slot 11, and the stopper step 15 and the positioning slot 11 share a common surface.

[0060] The number of the guide blocks 4 is two or more. In this embodiment, the number of the guide blocks 4 is three, which are arranged at intervals along the circumference of the polishing head guide support seat 1.

[0061] The guide block 4 is provided with an inclined guide surface 41 on the side facing the wafer 3 that can abut against the side wall of the wafer 3. In this embodiment, as shown in FIG10 , there are two inclined guide surfaces 41, which form an obtuse angle. The inclined guide surfaces 41 are inclined from top to bottom, toward the central axis of the lifting platform 2, and the angle between the upper inclined guide surface 41 and the horizontal line is greater than the angle between the lower inclined guide surface and the horizontal line. The wafer 3 falls along the upper inclined guide surface 41 until it contacts the lower inclined guide surface, so that the intersection of the wafer 3 and the adjacent inclined guide surface 41 abuts, as shown in FIG11 , at which point the wafer 3 is firmly clamped. Of course, in other embodiments, the number of inclined guide surfaces 41 can also be multiple, and there is no specific limitation.

[0062] As shown in Figures 12-13, a travel slot 16 is defined at the bottom of the polishing head guide support 1. This travel slot 16 extends radially along the polishing head guide support 1 and is positioned vertically corresponding to the slide slot 12. A fixing hole 40 is defined at the bottom of the guide block 4. When the guide block 4 moves to the target position relative to the slide slot 12, it is locked by a fastener 42. Specifically, the fastener 42 can be a screw that passes through the travel slot 16 and is threadedly connected to the fixing hole 40.

[0063] Since the three guide blocks 4 need to move relative to the slide groove 12 to be located on the same circumferential surface, it is necessary to make the movement distance of the guide blocks 4 relative to the slide groove 12 consistent. In order to facilitate adjustment, scale lines can be marked on the side walls of the slide groove 12 or the area corresponding to the slide groove 12, such as marking scale lines at the position of the stroke groove 16. The sliding direction and distance of the guide blocks 4 can be intuitively judged through the scale lines.

[0064] The use process of the present invention is to move the guide block 4 to the target position according to the outer diameter of the wafer 3 to be loaded. The movement of the guide block 4 can be achieved manually or by an automatic mechanism, such as a motor or a cylinder driving it to move automatically, and the position is fixed by fasteners 42 respectively, so that the diameter of the space enclosed by the three guide blocks 4 is the diameter of the wafer 3 to be loaded. More specifically, the diameter of the space enclosed by the intersection of the two inclined guide surfaces 41 of the three guide blocks 4 is the diameter of the wafer 3 to be loaded, and the enclosed space is aligned with the lifting platform 2 and the positioning slot 1. 1 is concentric and coaxial; the polishing head 6 moves with the wafer 3 to the loading and unloading platform, and the polishing head 6 moves close to the polishing head guide support seat 1, and its lower part is locked in the positioning groove 11, thereby realizing the concentricity and coaxiality of the polishing head 6 and the positioning groove 11; the lifting platform 2 receives the wafer 3 on the polishing head 6 and descends. At this time, the wafer 3 is not sure whether it is concentric and coaxial with the lifting platform 2. When the wafer 3 contacts the guide block 4, it slides downward against the upper inclined guide surface 41 until it falls at the intersection of the two inclined guide surfaces. At this time, the wafer 3 is concentric and coaxial with the lifting platform 2 and the positioning groove 11, which is convenient for the next transmission action.

[0065] Example 2

[0066] As shown in Figures 14 and 15, this embodiment also includes a centering member 5, which includes a main body 51 that can be adapted to extend into the positioning slot 11, and a centering portion 52 that is concentric and coaxial with the main body 51. The centering member 5 is optional, that is, the centering portion 52 can be of multiple models. Each model has the same main body 51, but a different centering portion 52, that is, the outer diameter of the centering portion 52 is different.

[0067] During use, take the centering member 5 whose centering portion 52 is adapted to the diameter of the wafer 3 to be loaded, and position the centering member 52 below the main body 51. Insert the main body 51 of the centering member 5 into the positioning slot 11. Then move the guide block 4 relative to the polishing head guide support 1 until it abuts against the outer wall of the centering portion 52. Then, fix the guide block 4. At this time, multiple guide blocks 4 are located on the same circumferential surface and define a space with the same diameter as the wafer 3 to be loaded. Remove the centering member 52 from the polishing head guide support 1.

[0068] The polishing head 6 moves with the wafer 3 to the loading and unloading platform, and the polishing head 6 moves close to the polishing head guide support seat 1, and its lower part is locked in the positioning slot 11, thereby realizing the concentricity and coaxiality of the polishing head 6 and the positioning slot 11; the lifting platform 2 receives the wafer 3 on the polishing head 6 and descends. At this time, it is not sure whether the wafer 3 is concentric and coaxial with the lifting platform 2. When the wafer 3 contacts the guide block 4, it slides downward against the upper inclined guide surface 41 until it falls at the intersection of the two inclined guide surfaces. At this time, the wafer 3 is concentric and coaxial with the lifting platform 2 and the positioning slot 11, which is convenient for the next transmission action.

[0069] The other structures are the same as those in the first embodiment and will not be described in detail.

[0070] Example 3

[0071] As shown in Figures 16-19, the bottom of the chute 12 is provided with multiple groups of sockets 13 along the radial direction, and the bottom of the guide block 4 is provided with a positioning post 43, which can be inserted into the sockets 13, thereby achieving the positioning and matching of the guide block 4 and the polishing head guide support 1. If the diameter of the space enclosed by the guide block 4 needs to be changed, the positioning post 43 of the guide block 4 can be inserted into different sockets 13 to achieve this.

[0072] Of course, the above-mentioned insertion hole 13 can also be set on the side of the sliding groove 12. In this case, the positioning column 43 is located at the corresponding position on the side of the guide block 4.

[0073] The other structures are the same as those in the first embodiment and will not be described in detail.

[0074] Example 4

[0075] As shown in Figure 20, in this embodiment, the number of inclined guide surfaces 41 is one. At this time, the diameter of the space enclosed by the inner wall of the guide block 4 is adapted to the diameter of the wafer 3 to be loaded, and the wafer 3 is also clamped by the inner wall of the guide block 4.

[0076] The other structures are the same as those in the first embodiment and will not be described in detail.

[0077] Example 5

[0078] In this embodiment, instead of adjusting the relative position of the guide block 4 and the polishing head guide support 1, guide blocks 4 of different sizes are selected, that is, guide blocks 4 of different sizes are detachably connected to the same position of the slide 12. When the selected guide block 4 is larger, the diameter of the space enclosed by it is relatively small, which is suitable for small-sized wafers. When the selected guide block 4 is larger, the diameter of the space enclosed by it is relatively large, which is suitable for large-sized wafers.

[0079] Of course, it can also be detachably connected to different positions of the slide groove 12, and there is no specific limitation.

[0080] The other structures are the same as those in the first embodiment and will not be described in detail.

[0081] Example 6

[0082] As shown in FIG21 , in this embodiment, the guide block 4 may be provided with two or more sets of inclined guide surfaces 41. Adjacent sets of inclined guide surfaces 41 are arranged vertically along the inner sidewall of the guide block 4. Each set of inclined guide surfaces 41 includes an upper inclined guide surface and a lower inclined guide surface. Thus, a single guide block 4 can accommodate the positioning of wafers 3 of varying sizes.

[0083] Example 7

[0084] As shown in Figure 22, at this time, the wafer 3 has a cut edge 31, and the number of guide blocks 4 is 4-6. In this embodiment, the centering member 5 of Example 2 is required. When in use, the main body 51 of the centering member 5 is inserted into the positioning slot 11, and the guide block 4 is then moved relative to the polishing head guide support seat 1 until it contacts the outer wall of the centering portion 52, and the guide block 4 is fixed. At this time, if the guide block 4 is moved by an automatic mechanism, it will automatically stop moving after contacting the outer wall of the centering portion 52. Multiple guide blocks 4 are located on the same circumferential surface and define a space with the same diameter as the wafer 3 to be loaded. Since there are four or more guide blocks 4, they are evenly distributed around the circumference. Even if the wafer 3 has a cut edge 31, at least three guide blocks 4 can contact the arc surface of the wafer 3, and the central angle of the arc formed by the points where these three guide blocks 4 are located is equal to or greater than 180°, thereby accurately determining the position of the wafer 3. According to the relationship between the area of ​​the cutting edge 31 , the diameter of the wafer 3 and the distribution of the guide blocks 4 , preferably, the number of the guide blocks 4 is 6, which can adapt to the wafer 3 with one or two cutting edges 31 .

[0085] Different guide blocks 4 move the same or different distances, thereby limiting the movement of the wafer 3 and preventing the wafer 3 from translating or rotating.

[0086] Separate the centering piece 52 from the polishing head guide support 1. The polishing head 6 moves with the wafer 3 to the loading and unloading platform. The polishing head 6 moves close to the polishing head guide support 1, and its lower portion snaps into the positioning slot 11, thereby achieving concentricity and coaxiality between the polishing head 6 and the positioning slot 11. The lifting platform 2 receives the wafer 3 on the polishing head 6 and descends. At this time, the wafer 3 is uncertain whether it is concentric and coaxial with the lifting platform 2. When the wafer 3 contacts the guide block 4, it slides downward against the upper inclined guide surface 41 until it lands at the intersection of the two inclined guide surfaces. At this time, the wafer 3 is concentric and coaxial with the lifting platform 2 and the positioning slot 11, facilitating the next step of transmission.

[0087] According to the relationship between the area of ​​the cut edge of the wafer 3 , the diameter of the wafer 3 , and the distribution of the guide blocks 4 , it is inferred that when the number of guide blocks 4 is 6 or more, wafers of different sizes with cut edges can be accommodated.

[0088] The above specific embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. An adjustable wafer loading and unloading platform, characterized in that: include: A polishing head guide support seat (1) having a positioning slot (11) that can cooperate with the polishing head (6); A lifting platform (2) is used to receive the wafer (3) and move up and down relative to the polishing head guide support seat (1); the lifting platform (2) is coaxial with the positioning slot (11); A guide block (4) is arranged along the circumference of the polishing head guide support seat (1); The guide block (4) is optional, or / and the relative position of the guide block (4) and the polishing head guide support seat (1) is optional, so as to change the diameter of the space formed by the guide block (4).

2. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The guide block (4) is provided with an inclined guide surface (41) on the side facing the wafer (3) and capable of abutting against the side wall of the wafer (3).

3. The adjustable wafer loading and unloading platform according to claim 2, characterized in that: The number of the inclined guide surfaces (41) is one or two or more. When the number is two or more, the junctions between the wafer (3) and adjacent inclined guide surfaces (41) abut against each other.

4. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The polishing head guide support seat (1) is provided with a slide groove (12), and the slide groove (12) extends along the radial direction of the polishing head guide support seat (1), and the guide block (4) can move relative to the slide groove (12).

5. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: After the guide block (4) moves to a target position relative to the slide groove (12), it is locked by a fastener (42).

6. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: The bottom or side of the slide groove (12) is provided with a plurality of groups of insertion holes (13) in the radial direction, and the bottom or side of the guide block (4) is provided with a positioning column (43), and the positioning column (43) can be inserted into the insertion hole (13) to achieve positioning and matching between the guide block (4) and the polishing head guide support seat (1).

7. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: The slide groove (12) or its corresponding area is marked with scale lines.

8. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: The side wall of the polishing head guide support seat (1) forms a notch portion (14) for the guide block (4) to extend out.

9. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: The polishing head guide support seat (1) has a limiting step (15) which is coaxial with the positioning slot (11), and the sliding slot (12) is arranged on the limiting step (15).

10. The adjustable wafer loading and unloading platform according to claim 9, characterized in that: The limiting step (15) and the positioning slot (11) share a common surface.

11. The adjustable wafer loading and unloading platform according to claim 4, characterized in that: The size of the guide block (4) is optional, and guide blocks (4) of different sizes can be detachably connected to the slide groove (12) to change the diameter of the space formed by the guide block (4).

12. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The number of the guide blocks (4) is two or more.

13. The adjustable wafer loading and unloading platform according to claim 12, characterized in that: The guide blocks (4) move the same or different distances to limit the movement of the wafer (3).

14. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The invention also comprises a centering member (5), which comprises a main body (51) adapted to extend into the positioning slot (11), and a centering portion (52) coaxial with the main body (51); the guide block (4) is moved relative to the polishing head guide support seat (1) until it abuts against the centering portion (52) and is positioned, so that the centering member (5) is separated from the polishing head guide support seat (1).

15. The adjustable wafer loading and unloading platform according to claim 14, characterized in that: The centering piece (5) is optional, and the main body (51) of different centering pieces (5) is the same, while the centering part (52) is different.

16. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The number of the guide blocks (4) is 4-6.

17. The adjustable wafer loading and unloading platform according to claim 1, characterized in that: The number of the guide blocks (4) is 6 or more.

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