Method and apparatus for improving UPH of SMT mounting, and electronic device and storage medium

Abstract

Disclosed in the present invention is a method for improving the UPH of SMT mounting, the method comprising: on the basis of task information, determining information of a first component to be mounted; on the basis of the information of said first component and component information and nozzle information in a component database, analyzing parameters of influence factors, so as to determine efficiency-reducing influence factors on the basis of the parameters of the influence factors; on the basis of parameters of the efficiency-reducing influence factors, determining information of a second component to be mounted; on the basis of the information of said second component, filling an analysis report; and sending the analysis report to a user, and receiving information of a third component to be mounted that is determined on the basis of the analysis report. In the method provided in the present invention, parameters of influence factors that influence the UPH are automatically analyzed on the basis of component information of components to be mounted, so as to quickly determine efficiency-reducing influence factors, and an analysis report determined on the basis of parameters of the efficiency-reducing influence factors is sent to a user. The method can increase the speed of determining efficiency-reducing influencing factors, thereby improving the UPH and achieving the aims of energy conservation and emission reduction.

Description

Method, device, electronic device and storage medium for improving SMT placement UPH Technical Field

[0001] The present invention belongs to the field of electronic manufacturing technology, and particularly relates to a method, device, electronic equipment and storage medium for improving the UPH of SMT placement. Background Art

[0002] Currently, surface mount technology (SMT) is the main technology used in electronic assembly. The vast majority of printed circuit board assemblies (PCBAs) use SMT assembly technology to complete the placement of surface mount devices (SMDs) through SMT automated production lines.

[0003] SMT production lines are a major component of SMT assembly technology, and their production efficiency has a significant impact on a company's production costs and energy conservation and emission reduction efforts. Therefore, improving the production efficiency of SMT production lines has become a major concern for managers and engineering technicians.

[0004] In SMT production lines, the production efficiency of SMT equipment, specifically placement machines, is a key target for control and optimization. Units per hour (UPH) is a key metric for measuring SMT equipment efficiency, so improving UPH is crucial to improving SMT production line efficiency.

[0005] Currently, most methods for improving production efficiency involve technicians manually checking the parameters of the placement program to identify factors that reduce production efficiency and adjust them. This method of improving UPH is inefficient.

[0006] Summary of the Invention

[0007] The embodiment of the present invention provides a method for improving the UPH of SMT placement, which can solve the current problem of low UPH.

[0008] In a first aspect, an embodiment of the present invention provides a method for improving the SMT placement UPH, the method comprising: determining first component information to be mounted based on task information; analyzing parameters of an influencing factor based on the first component information to be mounted and component information and nozzle information in a component database to determine a degradation influencing factor based on the parameters of the influencing factor; determining second component information to be mounted based on the parameters of the degradation influencing factor; filling in an analysis report based on the second component information to be mounted; sending the analysis report to a user and receiving third component information to be mounted determined based on the analysis report.

[0009] Exemplarily, the task information is used to instruct the placement device to perform the placement task;

[0010] Exemplarily, the influencing factors include one or more of the following: the number of nozzle models, the component suction rate, the number of components to be mounted corresponding to the station, and the mounting angle of non-directional components.

[0011] Exemplarily, the third to-be-mounted component information is used to instruct the mounting device to perform a mounting task.

[0012] According to the method provided by the present invention, the parameters of the influencing factors affecting UPH are automatically analyzed based on the component information of the components to be mounted to quickly determine the efficiency reduction influencing factors, and an analysis report determined based on the parameters is sent to the user; the speed of determining the efficiency reduction influencing factors can be increased, thereby enhancing the efficiency of improving UPH, improving production efficiency, and achieving the purpose of energy conservation and emission reduction.

[0013] In a second aspect, an embodiment of the present invention provides a device for improving SMT placement UPH, the device comprising: a processing unit and a transceiver unit;

[0014] The processing unit is used to determine the first component to be mounted information according to the task information;

[0015] The processing unit is further configured to analyze the parameters of the influencing factor according to the task information, the first component to be mounted information, and the component information and nozzle information in the component database, so as to determine the efficiency reduction influencing factor according to the parameters of the influencing factor;

[0016] The processing unit is further configured to determine information of a second component to be mounted according to the parameters of the efficiency reduction factor;

[0017] The processing unit is further used to fill in the analysis report according to the information of the second component to be mounted;

[0018] The transceiver unit is used to send an analysis report to a user and receive information of a third component to be mounted determined according to the analysis report.

[0019] Exemplarily, the task information is used to instruct the placement device to perform the placement task;

[0020] Exemplarily, the influencing factors include one or more of the following: the number of nozzle models, the component suction rate, the number of components to be mounted corresponding to the station, and the mounting angle of non-directional components.

[0021] Exemplarily, the third to-be-mounted component information is used to instruct the mounting device to perform a mounting task.

[0022] In a third aspect, an embodiment of the present invention provides an electronic device comprising a processor and a memory, wherein the memory is used to store computer programs; the processor can be used to execute the computer program (instructions) stored in the memory to implement the method described in the first aspect above.

[0023] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program. When the computer program is executed, the method described in the first aspect above can be implemented.

[0024] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0025] Compared with the prior art, the embodiments of the present invention have the following advantages: by automatically analyzing the parameters of the influencing factors affecting UPH based on the component information of the components to be mounted, the efficiency reduction influencing factors can be quickly determined, and the analysis report determined based on the parameters can be sent to the user; the speed of determining the efficiency reduction influencing factors can be increased, thereby enhancing the efficiency of improving UPH, improving production efficiency, and achieving the purpose of energy conservation and emission reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a flow chart of a method for improving SMT placement UPH according to an embodiment of the present invention;

[0027] FIG2 is a schematic diagram of a program file of an SMT device provided by an embodiment of the present invention;

[0028] FIG3 is a schematic diagram of first component information to be mounted provided by an embodiment of the present invention;

[0029] FIG4 is a schematic diagram of a component database provided by an embodiment of the present invention;

[0030] FIG5 is a schematic diagram of a scenario for determining a second suction nozzle according to an embodiment of the present invention;

[0031] FIG6 is a schematic diagram of a scenario for determining a deceleration element according to an embodiment of the present invention;

[0032] FIG7 is a schematic diagram of split station location information provided by an embodiment of the present invention;

[0033] FIG8 is a schematic diagram of a scenario for determining a deceleration non-directional element according to an embodiment of the present invention;

[0034] FIG9 is a schematic diagram of information of a second component to be mounted provided by an embodiment of the present invention;

[0035] 10 is a schematic diagram of a second to-be-mounted component information provided by an embodiment of the present invention;

[0036] FIG11 is a schematic diagram of a pre-filling analysis report provided by an embodiment of the present invention

[0037] FIG12 is a schematic diagram of a filled analysis report provided by an embodiment of the present invention;

[0038] FIG13 is a schematic diagram of a device structure for improving SMT placement UPH according to an embodiment of the present invention;

[0039] FIG14 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0041] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0042] It will also be understood that the term "and / or" used in the present description and appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0043] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0044] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0045] References to "one embodiment" or "some embodiments" in the present specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present invention. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0046] The method for improving SMT placement UPH provided by the embodiment of the present invention can be applied to electronic devices such as supercomputers, laptops, servers, etc. The embodiment of the present invention does not impose any restrictions on the specific type of electronic devices.

[0047] Figure 1 shows a schematic flow chart of a method for improving the UPH of SMT placement, provided by an embodiment of the present invention. By way of example and not limitation, the method can be applied to the aforementioned electronic device. Method 100 may include steps S101-S106, each of which is described below.

[0048] S101, determining first component information to be mounted according to task information.

[0049] Exemplarily, the task information is used to instruct a placement device, such as an SMT device, to perform a placement task.

[0050] For example, the task information may be information in a mounting program file.

[0051] For example, SMT equipment is controlled by its corresponding placement program for automated placement. This placement program is determined by a placement program file. See Figure 2, which shows an SMT placement program file exported from a Panasonic DGS system. While placement programs for different brands of SMT equipment have different formats, they generally contain the same information, including component placement coordinates, placement angles, part numbers, component suction nozzle models, and feeder models.

[0052] In one example, the placement program file may be parsed, and the information of the first component to be placed may be determined according to the task information.

[0053] For example, the first component information to be mounted, as well as the second and third component information to be mounted mentioned below, can include at least: the material number of the component to be mounted, the coordinate position of the component to be mounted, the position number of the component to be mounted, the type of nozzle for picking up the component to be mounted, the suction rate for picking up the component to be mounted, and the placement angle of the component to be mounted, as shown in Figure 3 (a).

[0054] It should be understood that the first to-be-mounted component information and the second to-be-mounted component information and the third to-be-mounted component information mentioned below include the same type of information, but the specific content of each type of information is not exactly the same.

[0055] Optionally, the information of components to be mounted may also include information about MARK, panelization, size of components to be mounted, mounting quantity, feeder model, mounting module, etc., see (b) in FIG3 .

[0056] S102 : Analyze parameters of the influencing factors according to the first component to be mounted information and the component information and nozzle information in the component database, so as to determine a degradation influencing factor according to the parameters of the influencing factors.

[0057] Exemplarily, the component database is a database that stores component information and nozzle information.

[0058] Optionally, the relevant data in the component database can be revised by the user, or automatically updated according to the information of the components to be mounted for each task.

[0059] Exemplarily, the component information in the component database may include: material numbers of all components, the adsorption surface size of each component, and the direction label of each component.

[0060] For example, the nozzle information in the component database may include nozzle models of all nozzles and the size range of the suction surface of each nozzle.

[0061] For example, referring to FIG. 4 , the component information in the component database 401 may be stored in the form of tables 402 and 403 , and the nozzle information may be stored in the form of table 404 .

[0062] For example, influencing factors are factors that may affect the UPH (Uniform Performance) of SMT equipment. These factors may include one or more of the following: the number of nozzle types, component pickup rate, the number of components to be placed at each station, and the placement angle for non-directional components.

[0063] The influencing factors may also include other factors that may affect the UPH of SMT equipment.

[0064] It should be understood that the present invention is not limited to specific types of influencing factors.

[0065] In some embodiments, the parameters of the influencing factor may be analyzed based on the first component to be mounted information and the component information and nozzle information in the component database to determine the efficiency reduction influencing factor based on the parameters of the influencing factor.

[0066] SMT equipment can pick up components through suction nozzles, and an SMT equipment can include as many as a dozen to dozens of types of suction nozzles. The SMT equipment will assign different types of suction nozzles to the components according to the different sizes of the suction surfaces. Each suction nozzle corresponds to a range of adsorbable surface sizes, and this size range can be determined based on the specifications and engineering experience of the suction nozzle. The suction nozzle can adsorb components with adsorption surface sizes within the range of its adsorbable surface sizes. In a placement task, if there are too many types of suction nozzles, the suction nozzles of the SMT equipment need to be replaced frequently, resulting in longer processing time, which has a great impact on the UPH of the SMT equipment. Therefore, the UPH of the SMT equipment can be improved by reducing the number of suction nozzle models used.

[0067] In one possible implementation, the number of models of the first and second nozzles can be determined based on the information about the first component to be mounted and the component and nozzle information in the component database. The number of models of the first nozzle is then compared with the number of models of the second nozzle, and a degradation factor is determined based on the relative size of the two. If the number of models of the first nozzle is greater than the number of models of the second nozzle, the second nozzle is determined as the degradation factor.

[0068] Exemplarily, the first suction nozzle is a suction nozzle actually used when performing the placement task determined according to the task information.

[0069] For example, the number of second nozzle models is the minimum number of nozzle models that can absorb the components to be mounted when executing this placement task. That is, when the second nozzle is used to absorb the components to be mounted, the number of nozzle models is the minimum.

[0070] Exemplarily, the first suction nozzle and the second suction nozzle both include a plurality of suction nozzles of different models.

[0071] In an example, the number of models of the first suction nozzle may be determined according to the material number of the component to be mounted and the nozzle model of the suction nozzle for sucking the component to be mounted.

[0072] In one example, the size of the adsorption surface of the component to be mounted can be determined based on the material number of the component to be mounted and the component information in the component database.

[0073] In one example, the number of models of the second suction nozzle can be determined based on the suction surface size of the component to be mounted and the suction surface size range of the suction nozzle in the component database.

[0074] There can be multiple types of nozzles with a surface area that can cover the same component type, meaning that this component can be picked up by multiple nozzle types. By categorizing the nozzle surface area size ranges, you can determine the minimum number of nozzle models used in this placement task.

[0075] For example, the actual nozzle used, i.e., the first nozzle, can be obtained from the first component information to be mounted based on the component's material number (see 301 in FIG. 3(b) ) and the component's nozzle model (see 302 in FIG. 3(b) ). The first nozzle model #A is obtained as 14 (see 501 in FIG. 5 ). Then, based on the component's material number, the suction surface dimensions of the component to be mounted can be obtained from the component information in the component database 401 (see 403 in FIG. 4 ), see 502 in FIG. If the first component information to be mounted also includes the suction surface dimensions of the component to be mounted (see 303 in FIG. 3 ), the suction surface dimensions of the component to be mounted can also be obtained from the first component information to be mounted. Based on the suction surface dimensions of the component to be mounted and the nozzle's adsorbable surface size range (see 404 in FIG. 4 ), the nozzle model suitable for the component to be mounted can be determined (see 503 in FIG. 5 ). The second nozzle can be determined according to the nozzle model that is suitable for the component to be mounted. Referring to 504 in FIG. 5 , the number of second nozzle models #B is obtained to be 6. At this time, the second nozzle can be determined as an efficiency reduction factor.

[0076] In some embodiments, a speed reduction element may be determined based on the suction rate of the components to be mounted, and then the speed reduction element may be determined as a speed reduction influencing factor.

[0077] Exemplarily, the rate at which the placement device absorbs the slowed-down components is lower than the rate at which it absorbs normal components.

[0078] During the initial commissioning of a new SMT program, the first step should be to ensure placement quality, with placement speed being a secondary consideration. For example, if a component has an uneven surface, the pick-up speed will be reduced to ensure proper pickup, thereby ensuring placement quality.

[0079] For example, the speed reduction element (see 602 in FIG6 ) may be determined based on the suction speed of the components to be mounted in the first information to be mounted, ie, the speed parameter of the components to be mounted (see 601 in FIG6 ).

[0080] In some embodiments, the total number of components to be placed and the number of stations used can be determined based on the position numbers of the components to be placed and their corresponding stations. The average placement quantity can be determined based on the total number of placed components and the number of stations used. The number of components to be placed corresponding to each station can then be compared with a first placement threshold. Based on the relative magnitude of the two, a degradation factor can be determined.

[0081] The part of the SMT equipment where the feeder is installed is the station, and there can be dozens to hundreds of stations on one SMT equipment.

[0082] For example, average placement quantity = total number of components to be placed / number of stations used.

[0083] Exemplarily, the first placement threshold is determined based on the average placement quantity. For example, the first placement quantity is generally N times the average placement quantity, where N is a positive integer.

[0084] Optionally, the user can customize the specific value of N.

[0085] In one example, if the number of components to be mounted corresponding to a station is greater than a first mounting threshold, and the number of stations used is less than the total number of stations of the mounting device, the station is determined as a speed reduction station, and the speed reduction station is determined as an efficiency reduction impact factor.

[0086] When the number of components to be placed at a station is too large, it is not conducive to the efficiency of multiple placement heads. Efficiency can be improved by splitting the placement tasks of this station, but this can only be achieved when there are idle stations. If there are no idle stations, there is no room for splitting tasks.

[0087] Optionally, the user can set the maximum number of stations supported by the SMT equipment, that is, the total number of stations.

[0088] Optionally, the total number of stations of the SMT equipment may also be acquired according to the first information to be mounted.

[0089] For example, based on the position numbers of the components to be mounted and the corresponding stations in the first information of the components to be mounted, see (a) in Figure 7, it can be obtained that the total number of components to be mounted is 1152, the number of used stations is 64, and the number of empty stations is also 64, so the total number of stations of the mounting device is 128. The average number of mounts obtained is 1152 / 64=18. If the user sets N=4, then based on the position numbers of the components to be mounted, the stations with the corresponding position numbers of the components to be mounted greater than 72 are deleted, such as 701 in Figure 7. Because there are still unused stations, station 15 can be determined as a reduced-speed station.

[0090] In some embodiments, the orientation label of the component to be mounted can be determined from the component information in the component data based on the part number of the component to be mounted. Non-orientation components can then be identified based on the orientation label of the component to be mounted. Furthermore, speed-reducing non-orientation components can be identified based on the mounting angle of the non-orientation components, and the speed-reducing non-orientation components can be determined as efficiency reduction factors.

[0091] Since the effects of 0-degree and 180-degree placement of non-directional components are the same, when placing at 180 degrees, the equipment will rotate 180 degrees after picking up the component, resulting in unnecessary operations and affecting the UPH of the SMT equipment.

[0092] For example, increasing or decreasing the mounting angle of a non-directional component by 180 degrees does not affect the component's performance. However, increasing or decreasing the mounting angle of a directional component by 180 degrees may affect its performance, such as a diode.

[0093] Exemplarily, the mounting angle of the speed-reducing non-directional component is greater than or equal to 180 degrees.

[0094] For example, the direction label of a component may be set by the user or determined according to the component model.

[0095] For example, based on the part number of the component to be mounted, the component database (see 801 in FIG8 ) can be used to determine the orientation label of the component to be mounted (see 802 in FIG8 ). Then, based on the orientation label, components without orientation, such as the component with part number PN123456, can be determined (see 803 in FIG8 ).

[0096] S103 , determining information of a second component to be mounted according to the parameters of the efficiency reduction factor.

[0097] In a possible implementation, if the second nozzle is determined to be an efficiency reduction factor, the information of the second component to be mounted can be determined based on the nozzle model of the first nozzle, the model of the second nozzle, and the material number of the component to be mounted.

[0098] For example, the second information to be mounted may include the material numbers, positions, models of the first suction nozzles corresponding to the components, and models of the second suction nozzles corresponding to the components of all components to be mounted, see 901 in FIG. 9 .

[0099] In one possible implementation, if the speed reduction component is determined as the efficiency reduction factor, the second component to be mounted information can be determined based on the material number, station position, number of speed reduction components and absorption rate of the speed reduction component.

[0100] For example, the second to-be-mounted component information may include the station position, material number, and speed parameters of the speed reduction component, see 602 in FIG. 6 .

[0101] In one example, if the number of slow-down components is too large, a new dedicated nozzle can be customized according to the type of slow-down component to restore the placement speed.

[0102] In one possible implementation, if a deceleration station is determined as an efficiency-reducing factor, the placement tasks performed by the deceleration station can be split based on the number of components to be placed corresponding to the deceleration station and the first placement threshold, thereby obtaining corresponding station information after the split. The second pending placement information can then be determined based on the deceleration station before the split, the number of components to be placed and the component material numbers required before the deceleration station split, and the station information after the split, as shown in step 1001 in FIG. 10 .

[0103] Exemplarily, the station information after the splitting may include: the splitting station, the material number and quantity of the components to be mounted corresponding to the splitting station, see 702 in FIG. 7 .

[0104] Exemplarily, the splitting station includes a speed reduction station and a station for executing the speed-reduced split placement task.

[0105] For example, referring to 701 in Figure 7 , the number of components to be placed at decelerated station 15 is 120, far exceeding the first placement threshold of 72. The placement task for this station is split, and the resulting split station information is shown in Figure 7 (b). The task for station 15 is split and performed jointly by stations 15 and 16. Stations 15 and 16 are the split stations.

[0106] In an example, the placement tasks of the deceleration station can be split according to the position numbers of the components to be placed corresponding to the deceleration station and the first placement threshold value.

[0107] In another example, the placement tasks of the deceleration station can be split according to the coordinate position distribution area of ​​the components to be placed corresponding to the deceleration station based on the number of components to be placed corresponding to the deceleration station and the first placement threshold.

[0108] In one possible implementation, if the decelerating non-directional component is determined as the efficiency reduction factor, the second component to be mounted information can be determined based on the mounting angle, recommended mounting angle and corresponding position number of the decelerating non-directional component, see 804 in Figure 8.

[0109] Optionally, the second to-be-mounted information may further include a reverse label of the speed-reducing non-directional component.

[0110] Exemplarily, the difference between the recommended mounting angle of the speed-down non-directional component and the mounting angle of the speed-down non-directional component is 180 degrees.

[0111] S104: Fill in the analysis report based on the second component to be mounted information.

[0112] For example, the analysis report shown in FIG11 can be filled in according to the second component to be mounted information shown in 602 in FIG6, 804 in FIG8, 901 in FIG9 and 1001 in FIG10, and the final analysis report is shown in FIG12.

[0113] S105: Send an analysis report to the user.

[0114] Accordingly, the user receives an analysis report.

[0115] In one example, the user can determine whether to perform the placement task based on the model of the second nozzle, the split station information, or the relevant information of the slowed-down non-directional components according to the analysis report.

[0116] For example, the user can determine whether to use the second nozzle to pick up the components in this placement task, whether to split the placement task of station 15 and perform it jointly between stations 15 and 16. The user can also determine whether to place the slow-down non-directional components according to the recommended placement angle.

[0117] In one example, if there are too many decelerating components, the user can customize a new nozzle according to the model of the decelerating component to restore the suction speed of the decelerating components and thus improve the UPH of the SMT equipment.

[0118] In one example, the user can check the pickup rate of the decelerated components to determine whether the pickup rate of the decelerated components is incorrect, and improve the UPH of the SMT equipment by reducing unnecessary decelerated components.

[0119] S106, receiving information of a third component to be mounted.

[0120] Exemplarily, the third to-be-mounted component information is determined based on the first to-be-mounted component information and the second to-be-mounted component information.

[0121] For example, if the user customizes a new type of suction nozzle corresponding to the speed reduction component, the third to-be-mounted component information may also include information such as the specifications, model, and adsorbable surface size range of the new type of suction nozzle.

[0122] Optionally, method 100 may further include step S107.

[0123] S107: Update the component information and / or nozzle information in the component database according to the third to-be-mounted component information.

[0124] For example, if the third to-be-mounted component information includes relevant information of a new type of nozzle, the nozzle information in the component database may be updated according to the third to-be-mounted component information.

[0125] For example, if the user determines that the absorption speed settings of some components in the speed reduction component are incorrect and updates the absorption speed of these components, the component information in the component database can be updated according to the updated absorption speed of the components.

[0126] According to the method provided by the present invention, the parameters of the influencing factors affecting UPH are automatically analyzed based on the component information of the components to be mounted to quickly determine the efficiency reduction influencing factors, and an analysis report determined based on the parameters is sent to the user; the speed of determining the efficiency reduction influencing factors can be increased, thereby enhancing the efficiency of improving UPH, improving production efficiency, and achieving the purpose of energy conservation and emission reduction.

[0127] FIG13 is a schematic diagram showing the structure of a device for improving SMT placement UPH according to an embodiment of the present invention. The device 1300 may include a processing unit 1310 and a transceiver unit 1320.

[0128] The processing unit 1310 is configured to determine information of a first component to be mounted according to the task information;

[0129] The processing unit 1310 is further configured to analyze the parameters of the influencing factor according to the task information, the first component to be mounted information, and the component information and nozzle information in the component database, so as to determine the efficiency reduction influencing factor according to the parameters of the influencing factor;

[0130] The processing unit 1310 is further configured to determine information of a second component to be mounted according to the parameters of the efficiency reduction factor;

[0131] The processing unit 1310 is further configured to fill in an analysis report based on the second component to be mounted information;

[0132] The transceiver unit 1320 is configured to send an analysis report to a user and receive information of a third component to be mounted determined according to the analysis report.

[0133] Exemplarily, the task information is used to instruct the placement device to perform the placement task;

[0134] Exemplarily, the influencing factors include one or more of the following: the number of nozzle models, the component suction rate, the number of components to be mounted corresponding to the station, and the mounting angle of non-directional components.

[0135] Exemplarily, the third to-be-mounted component information is used to instruct the mounting device to perform a mounting task.

[0136] Figure 14 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. As shown in Figure 14, electronic device 1400 may include: at least one processor 1410 (only one processor is shown in Figure 14), memory 1420, and a computer program 1430 stored in the memory 1420 and executable on the at least one processor 1410. When the processor 1410 executes the computer program 1430, the steps of any of the above-described method embodiments are implemented.

[0137] The electronic device 1400 may be a processing device such as a robot that can implement the above method. The embodiment of the present invention does not impose any limitation on the specific type of the electronic device.

[0138] Those skilled in the art will appreciate that FIG14 is merely an example of an electronic device 1400 and does not limit the electronic device. The electronic device 1400 may include more or fewer components than shown, or may combine certain components or different components. For example, the electronic device 1400 may also include input and output interfaces.

[0139] The processor 1410 may be a central processing unit (CPU), or may be another general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gates, or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0140] In some embodiments, the memory 1420 may be an internal storage unit, such as a hard disk or a memory. In other embodiments, the memory 1420 may also be an external storage device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Furthermore, the memory 1420 may include both an internal storage unit and an external storage device. The memory 1420 is used to store an operating system, an application program, a boot loader, data, and other programs, such as the program code of the computer program. The memory 1420 may also be used to temporarily store data that has been output or is about to be output.

[0141] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0142] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0143] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned various method embodiments can be implemented.

[0144] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0145] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

Claims

1. A method for improving SMT placement UPH, characterized in that: include: Determine the first to-be-mounted component information according to the task information, wherein the task information is used to instruct the mounting device to perform the mounting task; Analyze the parameters of the influencing factors according to the first information of the components to be mounted and the component information and the nozzle information in the component database, so as to determine the efficiency reduction influencing factors according to the parameters of the influencing factors, wherein the influencing factors include one or more of the following: the number of nozzle models, the component suction rate, the number of the components to be mounted corresponding to the station, and the mounting angle of the non-directional components; Determining the second component to be mounted according to the parameters of the efficiency reduction influencing factor; Filling in an analysis report according to the second to-be-mounted component information; The analysis report is sent to a user and third to-be-mounted component information determined according to the analysis report is received, wherein the third to-be-mounted component information is used to instruct the mounting device to perform the mounting task.

2. The method according to claim 1, characterized in that The information of the components to be mounted includes at least: the material number of the components to be mounted, the coordinate position of the components to be mounted, the position number of the components to be mounted, the type of the suction nozzle for sucking the components to be mounted, the suction rate of sucking the components to be mounted and the mounting angle of the components to be mounted; Wherein, the information of components to be mounted is the information of the first components to be mounted or the information of the second components to be mounted or the information of the third components to be mounted; The component information includes: the material numbers of all components, the adsorption surface size of each component and the direction label of each component, and the nozzle information includes: the nozzle models of all nozzles and the adsorption surface size range of each nozzle model.

3. The method according to claim 2, characterized in that Analyzing the parameters of the influencing factors according to the first to-be-mounted component information and the component information and nozzle information in the component database to determine the degradation influencing factors according to the parameters of the influencing factors, and determining the second to-be-mounted component information according to the parameters of the degradation influencing factors, specifically includes: Determine the number of models of the first suction nozzle according to the material number of the component to be mounted and the model of the suction nozzle for sucking the component to be mounted, wherein the first suction nozzle is the suction nozzle actually used when executing the mounting task determined according to the task information, and the first suction nozzle includes a plurality of suction nozzles of different models; According to the material number of the component to be mounted, the size of the adsorption surface of the component to be mounted is determined from the component information; Determine the number of models of the second suction nozzle according to the size of the suction surface of the component to be mounted and the size range of the suction surface of the suction nozzle, the number of models of the second suction nozzle is the minimum number of models of suction nozzles that can adsorb the component to be mounted when performing the placement task, and the second suction nozzle includes a plurality of suction nozzles of different models; If the number of models of the first suction nozzle is greater than the number of models of the second suction nozzle, determining the second suction nozzle as the efficiency reduction factor; The information of the second component to be mounted is determined according to the nozzle model of the second nozzle, the nozzle model of the first nozzle and the material number of the component to be mounted.

4. The method according to claim 2, characterized in that: Analyzing the parameters of the influencing factors according to the first to-be-mounted component information and the component information and nozzle information in the component database to determine the degradation influencing factors according to the parameters of the influencing factors, and determining the second to-be-mounted component information according to the parameters of the degradation influencing factors, specifically includes: Determine a deceleration component according to the suction rate of the components to be mounted, wherein the rate at which the mounting device absorbs the deceleration component is lower than the rate at which normal components are absorbed; Determining the speed reduction element as the efficiency reduction influencing factor; The second component information to be mounted is determined according to the material number of the speed reduction component, the number of the speed reduction components and the absorption rate of the speed reduction component.

5. The method according to claim 2, characterized in that: Analyzing the parameters of the influencing factors according to the first to-be-mounted component information and the component information and nozzle information in the component database to determine the efficiency reduction influencing factors according to the parameters of the influencing factors, including: Determine the total number of components to be mounted and the number of stations used according to the position numbers of the components to be mounted and the stations corresponding to the components to be mounted; Determine an average placement quantity according to the total quantity of components to be placed and the number of stations used; If the number of components to be mounted corresponding to the station of the mounting device is greater than the first mounting threshold, and the number of used stations is less than the total number of stations of the mounting device, the station is determined as a speed reduction station, and the speed reduction station is determined as a reduction in efficiency factor, and the first mounting threshold is determined based on the average mounting number.

6. The method according to claim 5 is characterized in that Determining the second to-be-mounted component information according to the parameters of the efficiency reduction influencing factor includes: According to the number of components to be mounted corresponding to the deceleration station and the first mounting threshold, the mounting task performed by the deceleration station is split, and corresponding station information after splitting is obtained, the station information includes the splitting station, the number of components to be mounted corresponding to the splitting station, and the material number of the components to be mounted corresponding to the splitting station, and the splitting station includes the deceleration station and the station that performs the mounting task split by the deceleration station; The second component to be mounted information is determined according to the deceleration station before splitting, the number of the components to be mounted that need to be mounted at the deceleration station, the material number of the components to be mounted corresponding to the deceleration station before splitting, and the station information.

7. The method according to claim 6, characterized in that The step of splitting the placement tasks performed by the deceleration station according to the number of the components to be mounted corresponding to the deceleration station and the first placement threshold, and obtaining the station information after the splitting includes: According to the number of components to be mounted corresponding to the deceleration station and the first mounting threshold, the mounting tasks performed by the deceleration station are split through the position numbers of the components to be mounted corresponding to the deceleration station or the coordinate position distribution areas of the components to be mounted, and corresponding station information after the split is obtained.

8. The method according to any one of claims 2 to 7, characterized in that: Analyzing the parameters of the influencing factors according to the first to-be-mounted component information and the component information and nozzle information in the component database to determine the degradation influencing factors according to the parameters of the influencing factors, and determining the second to-be-mounted component information according to the parameters of the degradation influencing factors, specifically includes: According to the material number of the component to be mounted, determine the direction label of the component to be mounted from the component information; Determine the components without direction according to the direction labels of the components to be mounted; Determine the non-directional component with a mounting angle greater than or equal to 180 degrees as a speed-reducing non-directional component, and determine the speed-reducing non-directional component as the efficiency reduction impact factor; According to the material number of the speed-down directionless component, the mounting angle of the speed-down directionless component, the recommended mounting angle of the speed-down directionless component, and the position number corresponding to the speed-down directionless component, the information of the second component to be mounted is determined, and the difference between the mounting angle of the speed-down directionless component and the recommended mounting angle of the speed-down directionless component is 180 degrees.

9. The method according to claim 1, characterized in that: The method further comprises: The component information and / or the nozzle information in the component database is updated according to the third component information to be mounted.

10. A device for improving SMT placement UPH, characterized in that: including a processing unit and a transceiver unit; The processing unit is used to determine the first to-be-mounted component information according to the task information, and the task information is used to instruct the mounting device to perform the mounting task; The processing unit is further used to analyze the parameters of the influencing factors according to the task information, the first information of the components to be mounted, the component information and the nozzle information in the component database, so as to determine the efficiency reduction influencing factors according to the parameters of the influencing factors, wherein the influencing factors include one or more of the following: the number of nozzle models, the component suction rate, the number of components to be mounted corresponding to the station, and the mounting angle without components; The processing unit is further used to determine the second to-be-mounted component information according to the parameters of the efficiency reduction influencing factor; The processing unit is also used to fill in the analysis report according to the second to-be-mounted component information; The transceiver unit is used to send the analysis report to the user and receive third to-be-mounted component information determined according to the analysis report, and the third to-be-mounted component information is used to instruct the mounting device to perform the mounting task.

11. An electronic device comprising a memory, a processor and a computer program stored in the memory, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 9 is implemented.

12. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 9 is implemented.

Images