Electronic device and operation method of electronic device

Abstract

Disclosed is an operation method of an electronic device for performing a simulation of a memory interface. An operation method of an electronic device according to an embodiment of the present disclosure may comprise the operations of: separating a channel model and an I / O buffer information specification (IBIS) model; short-circuiting a transmission end of the IBIS model, and extracting a current profile for the entire logic circuit; identifying a logic circuit part, a power delivery network (PDN), and a signal path; performing modeling of electrical characteristics for the signal path and the power delivery network; and performing a simulation by applying a temporary current source to the power delivery network.

Description

Electronic devices and methods of operating electronic devices

[0001] Embodiments disclosed in this document relate to electronic devices and methods of operating electronic devices.

[0002] Various software solutions are being developed to analyze the signal integrity of memory interfaces. Memory can utilize high-speed data buses to support rapid data transfer and processing. However, high-speed data transfer can cause issues such as signal noise, sampling errors, and crosstalk. To address these issues, signal integrity analysis can be performed.

[0003] Signal integrity analysis can be performed through simulations that consider simultaneous switching noise (SSN) across the double data rate (DDR), power delivery network (PDN), and signal channels. Simulations can be time-consuming and computationally intensive.

[0004] Based on the discussion described above, the present disclosure provides a device and method for efficiently performing simulation on a memory interface.

[0005] An operating method of an electronic device for performing a simulation of a memory interface according to an embodiment of the present disclosure may include an operation of separating a channel model and an I / O buffer information specification (IBIS) model. An operating method of an electronic device according to an embodiment may include an operation of shorting a transmission terminal of the IBIS model and extracting a current profile for an entire logic circuit. An operating method of an electronic device according to an embodiment may include an operation of identifying a logic circuit portion, a power delivery network (PDN), and a signal path. An operating method of an electronic device according to an embodiment may include an operation of modeling electrical characteristics of the power delivery network and the signal path. An operating method of an electronic device according to an embodiment may include an operation of performing a simulation by applying a temporary current source to the power delivery network.

[0006] In one embodiment, the act of modeling the electrical characteristics of the power supply network and the signal path may be performed using a spice model or a scattering matrix.

[0007] In one embodiment, the act of performing a simulation by applying a temporary current source to the power supply network may include the act of identifying a ripple voltage.

[0008] A method of operating an electronic device according to one embodiment may include applying noise generated from the ripple voltage to the IBIS model.

[0009] A method of operating an electronic device according to one embodiment may include an operation of performing a simulation for the entire logic circuit.

[0010] A method of operating an electronic device according to one embodiment may include an operation of identifying a schematic for the IBIS model, the signal path, and the power supply network.

[0011] In one embodiment, the operation of extracting the current profile may include the operation of applying the IBIS model and the channel model to the entire logic circuit, and the operation of configuring the voltage of the power supply network.

[0012] An electronic device according to one embodiment of the present disclosure includes a memory and a processor connected to the memory, wherein the processor can separate a channel model and an I / O buffer information specification (IBIS) model. In one embodiment, the processor can extract a current profile for an entire logic circuit by terminating a transmitter of the IBIS model with a receiver of the IBIS model and a capacitor of a physical wiring. In one embodiment, the processor can identify a logic circuit portion, a power delivery network (PDN), and a signal path. In one embodiment, the processor can model electrical characteristics for the power delivery network and the signal path. In one embodiment, the processor can perform a simulation by applying a temporary current source to the power delivery network.

[0013] In one embodiment, the processor may model electrical characteristics for the power supply network and the signal path using a spice model or a scattering matrix.

[0014] In one embodiment, the processor can perform a simulation by applying a temporary current source to the power supply network to identify the ripple voltage.

[0015] In one embodiment, the processor can apply noise generated from the ripple voltage to the IBIS model.

[0016] In one embodiment, the processor can perform a simulation of the entire logic circuit.

[0017] In one embodiment, the processor can identify schematics for the IBIS model, the signal path, and the power supply network.

[0018] In one embodiment, the processor can apply the IBIS model and the channel model to the entire logic circuit and configure the voltage of the power supply network.

[0019] According to one embodiment, a storage medium storing at least one computer-readable instruction may be provided. The at least one instruction, when executed by at least a portion of at least one processor of an electronic device, may cause the electronic device to perform at least one operation. The at least one operation may include separating a channel model and an IBIS model, short-circuiting a transmitter end of the IBIS model and extracting a current profile for an entire logic circuit, identifying a logic circuit portion, a power supply network, and a signal path, modeling electrical characteristics of the power supply network and the signal path, and performing a simulation by applying a temporary current source to the power supply network.

[0020] Embodiments of the present disclosure provide an effect that can reduce the time and computing resources consumed for setting up a control chip, optimizing signal wiring, and designing memory power in a memory interface design.

[0021] Additionally, embodiments of the present disclosure provide an effect that allows simulation of a memory interface to be performed without performing a simulation for a full channel when a user changes the shape of the wiring or components (e.g., capacitors, resistors).

[0022] The effects that can be obtained from the present disclosure are not limited to the effects mentioned in the various embodiments, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0023] FIG. 1 illustrates a block diagram of an electronic device according to one embodiment.

[0024] FIG. 2 illustrates a block diagram of an electronic device according to one embodiment.

[0025] Figure 3 illustrates an operational flow of an electronic device according to one embodiment.

[0026] Figure 4 illustrates an operational flow of an electronic device according to one embodiment.

[0027] Figure 5 illustrates an operational flow of an electronic device according to one embodiment.

[0028] Figure 6 illustrates an operational flow of an electronic device according to one embodiment.

[0029] Figure 7 illustrates an operational flow of an electronic device according to one embodiment.

[0030] FIG. 8 illustrates an example of current profile extraction of an electronic device according to one embodiment.

[0031] FIG. 9 illustrates a power supply network portion, a logic circuit portion, and a signal path portion according to one embodiment.

[0032] FIG. 10 illustrates an example of an electronic device identifying a ripple voltage according to one embodiment.

[0033] Figure 11 illustrates an example of performing a simulation of an electronic device according to one embodiment.

[0034] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0035] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0036] Figure 1 illustrates a block diagram of an electronic device according to one embodiment. Furthermore, the electronic device (100) may be a wearable terminal, such as a watch or glasses, capable of performing various computing functions, such as video viewing and communication. The electronic device (100) may be a terminal of various forms without limitation to the above-described embodiments.

[0037] According to one embodiment, the memory (120) is a storage medium used by the electronic device (100) and can store data such as at least one command (121) or setting information corresponding to at least one program. The program can include an operating system (OS) program and various application programs.

[0038] In one embodiment, the memory (120) may store pairing information of an external electronic device positioned adjacent to the electronic device (100). In one embodiment, the pairing information may include device information of the external electronic device, information about other external electronic devices or remote control devices paired with the external electronic device, information about a method by which the external electronic device and the other external electronic devices or remote control devices are paired (e.g., Bluetooth, Wi-Fi), information about a pairing history between the external electronic device and the other external electronic devices or remote control devices, etc.

[0039] In one embodiment, the memory (120) may include at least one type of storage medium among a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (e.g., an SD or XD memory, etc.), a random access memory (RAM), a static random access memory (SRAM), a read only memory (ROM), an electrically erasable programmable ROM (EEPROM), a programmable ROM (PROM), a magnetic memory, a magnetic disk, and an optical disk.

[0040] According to one embodiment, the video input unit (130) can receive video and video information through a tuner (not shown), an input / output unit (not shown), or a communication unit (150). The video input unit (130) can include at least one of the tuner and the input / output unit. The tuner can select and tune only the frequency of a broadcast channel to be received by the electronic device (100) among many radio wave components through amplification, mixing, resonance, etc. of a broadcast signal received wirelessly or wiredly. The broadcast signal can include video, audio, and additional data (e.g., an Electronic Program Guide (EPG)). The tuner can receive real-time broadcast channels (or real-time viewing images) from various broadcast sources such as terrestrial broadcasting, cable broadcasting, satellite broadcasting, and Internet broadcasting. The tuner can be implemented as an integrated unit with the electronic device (100) or as a separate tuner electrically connected to the electronic device (100). The input / output unit may include at least one of an HDMI (High Definition Multimedia Interface) input port, a component input jack, a PC input port, and a USB input jack, which can receive images and image information from an external device of the electronic device (100) under the control of the processor (110). It is obvious to those skilled in the art that the input / output unit may be added, deleted, and / or changed depending on the performance and structure of the electronic device (100).

[0041] According to one embodiment, the display (140) may perform functions for outputting information in the form of numbers, characters, images, and / or graphics. The display (140) may include at least one hardware module for outputting. The at least one hardware module may include, for example, at least one of a Liquid Crystal Display (LCD), a Light Emitting Diode (LED), a Light Emitting Polymer Display (LPD), an Organic Light Emitting Diode (OLED), an Active Matrix Organic Light Emitting Diode (AMOLED), or a Flexible LED (FLED). The display (140) may display a screen corresponding to data received from the processor (110). The display (140) may be referred to as an 'output unit', a 'display unit', or other terms having an equivalent technical meaning thereto.

[0042] According to one embodiment, the communication unit (150) may provide a wired / wireless communication interface that enables communication with an external device. The communication unit (150) may include at least one of a wired Ethernet, a wireless LAN communication unit, and a short-range communication unit. The wireless LAN communication unit may include, for example, Wi-Fi, and may support the wireless LAN standard (IEEE802.11x) of the Institute of Electrical and Electronics Engineers (IEEE). The wireless LAN communication unit may be wirelessly connected to an AP (Access Point) under the control of the processor (110). The short-range communication unit may wirelessly perform short-range communication with an external device under the control of the processor (110). Short-range communication may include Bluetooth, Bluetooth Low Energy, infrared communication (IrDA: Infrared Data Association), Ultra Wide Band (UWB), and Near Field Communication (NFC). The above external devices may include server devices that provide video services, etc., and mobile terminals (e.g., phones, tablets, etc.).

[0043] According to one embodiment, the processor (110) may execute at least one instruction (121) stored in the memory (120) to perform calculations or data processing related to control and / or communication of at least one other component of the electronic device (100). The processor (110) may include at least one of a central processing unit (CPU), a graphics processing unit (GPU), a micro controller unit (MCU), a sensor hub, a supplementary processor, a communication processor, an application processor, an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA), and may have multiple cores.

[0044] In one embodiment, the processor (110) may control at least one other component (e.g., a hardware or software component) of the electronic device (100) connected to the processor (110), for example, by executing software, and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (110) may store commands or data received from other components in a volatile memory, process the commands or data stored in the volatile memory, and store result data in a non-volatile memory. According to one embodiment, the processor (110) may include a main processor (e.g., a central processing unit or an application processor) or an auxiliary processor (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, when the electronic device (100) includes a main processor and an auxiliary processor, the auxiliary processor may be configured to use lower power than the main processor or to be specialized for a given function. The auxiliary processor may be implemented separately from the main processor or as part of it.

[0045] In one embodiment, the processor (110) may obtain image frame data from at least one of the memory (120), the image input unit (130), or the communication unit (150). The image frame data may refer to data regarding frames constituting an image. For example, the image frame data may be stored in the memory (120) (e.g., recorded and stored image). For example, the image frame data may be obtained from the communication unit (150) or the image input unit (130) (e.g., real-time streaming image).

[0046] In the following description, the connection between the processor (110) and the memory (120) is described using a physical structure in which the processor (110) and a plurality of memory modules are arranged on a PCB (printed circuit board) and connected by wiring as an example. However, this is only an example, and in addition to the described structure, various physical connection forms may be included, such as a DIMM (dual in-line memory module) interface form of connection through a slot, a multi-chip module, and a multi-chip package.

[0047] FIG. 2 is a block diagram of an electronic device (201) within a network environment (200) according to various embodiments. Referring to FIG. 2, in the network environment (200), the electronic device (201) may communicate with the electronic device (202) via a first network (298) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (204) or the server (208) via a second network (299) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (201) may communicate with the electronic device (204) via the server (208). According to one embodiment, the electronic device (201) may include a processor (220), a memory (230), an input module (250), an audio output module (255), a display module (260), an audio module (270), a sensor module (276), an interface (277), a connection terminal (278), a haptic module (279), a camera module (280), a power management module (288), a battery (289), a communication module (290), a subscriber identification module (296), or an antenna module (297). In some embodiments, the electronic device (201) may omit at least one of these components (e.g., the connection terminal (278)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (276), the camera module (280), or the antenna module (297)) may be integrated into one component (e.g., the display module (260)).

[0048] The processor (220) may, for example, execute software (e.g., a program (240)) to control at least one other component (e.g., a hardware or software component) of the electronic device (201) connected to the processor (220) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (220) may store commands or data received from other components (e.g., a sensor module (276) or a communication module (290)) in a volatile memory (232), process the commands or data stored in the volatile memory (232), and store result data in a non-volatile memory (234). According to one embodiment, the processor (220) may include a main processor (221) (e.g., a central processing unit or an application processor) or an auxiliary processor (223) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (221). For example, when the electronic device (201) includes the main processor (221) and the auxiliary processor (223), the auxiliary processor (223) may be configured to use less power than the main processor (221) or to be specialized for a given function. The auxiliary processor (223) may be implemented separately from the main processor (221) or as a part thereof.

[0049] The auxiliary processor (223) may control at least a portion of functions or states associated with at least one component (e.g., a display module (260), a sensor module (276), or a communication module (290)) of the electronic device (201), for example, on behalf of the main processor (221) while the main processor (221) is in an inactive (e.g., sleep) state, or together with the main processor (221) while the main processor (221) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (223) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (280) or a communication module (290)). In one embodiment, the auxiliary processor (223) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (201) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (208)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0050] The memory (230) can store various data used by at least one component (e.g., the processor (220) or the sensor module (276)) of the electronic device (201). The data can include, for example, software (e.g., the program (240)) and input data or output data for commands related thereto. The memory (230) can include a volatile memory (232) or a non-volatile memory (234).

[0051] The program (240) may be stored as software in the memory (230) and may include, for example, an operating system (242), middleware (244), or an application (246).

[0052] The input module (250) can receive commands or data to be used in a component of the electronic device (201) (e.g., a processor (220)) from an external source (e.g., a user) of the electronic device (201). The input module (250) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0053] The audio output module (255) can output audio signals to the outside of the electronic device (201). The audio output module (255) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0054] The display module (260) can visually provide information to an external party (e.g., a user) of the electronic device (201). The display module (260) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0055] The audio module (270) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (270) can acquire sound through the input module (250), output sound through the sound output module (255), or an external electronic device (e.g., electronic device (202)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (201).

[0056] The sensor module (276) can detect the operating status (e.g., power or temperature) of the electronic device (201) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (276) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0057] The interface (277) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (201) to an external electronic device (e.g., the electronic device (202)). In one embodiment, the interface (277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0058] The connection terminal (278) may include a connector through which the electronic device (201) may be physically connected to an external electronic device (e.g., the electronic device (202)). According to one embodiment, the connection terminal (278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0059] A haptic module (279) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (279) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0060] The camera module (280) can capture still images and moving images. According to one embodiment, the camera module (280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0061] The power management module (288) can manage the power supplied to the electronic device (201). According to one embodiment, the power management module (288) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0062] A battery (289) may power at least one component of the electronic device (201). In one embodiment, the battery (289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0063] The communication module (290) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (201) and an external electronic device (e.g., electronic device (202), electronic device (204), or server (208)), and the performance of communication through the established communication channel. The communication module (290) may operate independently from the processor (220) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (290) may include a wireless communication module (292) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (294) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (204) via a first network (298) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (299) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (292) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (296) to verify or authenticate the electronic device (201) within a communication network such as the first network (298) or the second network (299).

[0064] The wireless communication module (292) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (292) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (292) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (292) can support various requirements specified in the electronic device (201), an external electronic device (e.g., the electronic device (204)), or a network system (e.g., the second network (299)). According to one embodiment, the wireless communication module (292) can support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0065] The antenna module (297) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (297) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (298) or the second network (299), may be selected from the plurality of antennas, for example, by the communication module (290). A signal or power may be transmitted or received between the communication module (290) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (297). According to various embodiments, the antenna module (297) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0066] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0067] According to one embodiment, commands or data may be transmitted or received between the electronic device (201) and an external electronic device (204) via a server (208) connected to a second network (299). Each of the external electronic devices (202 or 204) may be the same or a different type of device as the electronic device (201). According to one embodiment, all or part of the operations executed in the electronic device (201) may be executed in one or more of the external electronic devices (202, 204, or 208). For example, when the electronic device (201) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (201) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (201). The electronic device (201) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (201) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (204) may include an Internet of Things (IoT) device. The server (208) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (204) or the server (208) may be included in the second network (299).The electronic device (201) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0068] Simultaneously simulating DDR (double data rate) memory, power delivery network, and signal channels to analyze the signal integrity of a memory interface can be time-consuming and computationally resource-intensive. Consequently, the response speed to the results of computational analysis can be relatively slow, and there may be a delay in real-time judgment for a user or machine viewing and judging the results regarding the next step. When designing memory and a main SoC (system on chip) controller, or a main SoC controller and high-speed interface circuit on a PCB (printed circuit board), a user or circuit design device (e.g., an EDA (electronic design automation) application such as auto-routing software) needs to apply machine learning algorithms or perform low-latency analysis through fast response analysis in back-processing of a digital twin. The present disclosure relates to a method for separating the power delivery network and signal channels, performing simulations only for chip dynamic currents to extract voltage ripple, and performing simulations only for signal channels based on the extracted ripple voltage. According to embodiments of the present disclosure, an electronic device can extract ripple voltage through modeling of a power supply network, model a power supply network considering chip dynamic current, determine whether ripple voltage occurs through modeling of a signal channel, perform integrity analysis of a signal channel based on the modeling results, and analyze the signal integrity of an entire memory interface by integrating the PDN modeling results and the signal channel modeling results.

[0069] Fig. 3 illustrates an operational flow of an electronic device according to one embodiment. The electronic device of Fig. 3 may be a device corresponding to the electronic device (100) of Fig. 1 or the electronic device (200) of Fig. 2.

[0070] According to one embodiment, at operation 310, the electronic device may perform modeling of a circuit connected to a memory.

[0071] In one embodiment, the electronic device can perform modeling of the entire channel. The electronic device can model the entire signal path in a digital system. The electronic device can model the electrical characteristics of the system, including all components such as digital chips, traces, connections, packages, boards, and cables.

[0072] In one embodiment, at operation 320, the electronic device may model a power delivery network (PDN) of the memory. The electronic device may model a network through which power is provided in a digital system.

[0073] According to one embodiment, in operation 330, the electronic device may perform modeling of an input / output buffer of a memory.

[0074] In one embodiment, the electronic device may retrieve an Input / Output buffer information specification (IBIS) model.

[0075] According to one embodiment, at operation 340, the electronic device can perform a simulation of the memory based on a model of the power supply network, a model of the input / output buffer, and a model of the circuitry connected to the memory.

[0076] In one embodiment, an electronic device can simulate the behavior of a signal along the entire path. The electronic device can perform the simulation based on the electrical characteristics of modeled digital chips, traces, packages, PCBs, PDNs, and connections, as well as an IBIS model.

[0077] FIG. 4 illustrates an operational flow of an electronic device according to one embodiment. The electronic device of FIG. 4 may correspond to the electronic device (100) of FIG. 1, the electronic device (200) of FIG. 2, and the electronic device of FIG. 3. In the description of FIG. 4, any content that overlaps with that described in FIGS. 1 to 3 may be omitted.

[0078] According to one embodiment, at operation 410, the electronic device can identify a schematic along with an IBIS model and a channel model. The electronic device can create a circuit diagram for designing a digital system and retrieve the IBIS model and channel model to be used in the circuit. The circuit diagram can include logical elements such as devices and gates. The components included in the circuit diagram can operate based on the electrical characteristics defined in the IBIS model and the channel model.

[0079] According to one embodiment, in operation 420, the electronic device may model a power supply network. The electronic device may model a power supply network (PDN) within a digital system. A PDN is a system for stably providing power within an electronic product and may be used to evaluate and optimize the stability and performance of the power supply.

[0080] According to one embodiment, at operation 430, the electronic device may determine a power source. The power source may refer to a power source to be used when simulating the PDN. In the simulation, the operation of the circuit may be simulated by setting a power source that provides a specific voltage level or current.

[0081] In one embodiment, at operation 440, the electronic device may extract a current profile. The electronic device may extract characteristics of the current to assess the likelihood of damage occurring under certain conditions. The electronic device may model and evaluate characteristics of the current occurring under anticipated events or conditions.

[0082] According to one embodiment, at operation 450, the electronic device can perform a simulation based on the current profile.

[0083] In one embodiment, the electronic device can perform simulations that take into account simultaneous switching noise (SSN). SSN can refer to noise that occurs when multiple switches switch simultaneously. The electronic device can model the worst-case signal lines (worst nets) within the circuit and simulate SSN to analyze signal integrity.

[0084] Fig. 5 illustrates an operational flow of an electronic device according to one embodiment. The electronic device of Fig. 5 may correspond to the electronic device (100) of Fig. 1, the electronic device (200) of Fig. 2, and the electronic devices of Figs. 3 and 4. Fig. 5 may be an operation of the electronic device related to the operation content of operation 440 of Fig. 4, and in the description of Fig. 5, description of content that overlaps with the content described in Figs. 1 to 5 may be omitted.

[0085] According to one embodiment, at operation 510, the electronic device may identify an IBIS model. The IBIS model may describe the electrical characteristics of input / output buffers used in a digital system. The IBIS model may define voltage-current characteristics, application / release times, voltage levels, etc. for the input / output buffers of the device. The IBIS model may be used in a simulation tool to perform signal integrity analysis.

[0086] According to one embodiment, in operation 520, the electronic device can extract a current profile using an IBIS model. A current profile may refer to data that records current changes occurring in an electronic device or system over time. This allows a user to identify how current changes during operation of a PDN or electronic device. A current profile is data that captures dynamic current changes over time and may include information about the magnitude, direction, frequency, and pattern of current changes. PDN modeling can determine how much current is required in a power supply while the electronic device is operating, and how much voltage ripple or noise is generated. The electronic device can extract the current profile by performing a simulation using the IBIS model.

[0087] Fig. 6 illustrates an operational flow of an electronic device according to one embodiment. The electronic device of Fig. 6 may correspond to the electronic device (100) of Fig. 1, the electronic device (200) of Fig. 2, and the electronic devices of Figs. 3 to 5. Fig. 6 relates to the operation of the electronic device for performing operation 420 of Fig. 4. In the description of Fig. 6, any content that overlaps with the content described in Figs. 1 to 5 may be omitted.

[0088] According to one embodiment, at operation 610, the electronic device may identify a schematic for the entire circuit. The schematic for the entire circuit may include a printed circuit board (PCB), a package handling kit (PKG), and a circuit diagram for components.

[0089] According to one embodiment, in operation 620, the electronic device may perform a frequency domain simulation. Frequency domain simulation may refer to analyzing the electrical characteristics of the system in the frequency domain. The output of operation 620 is a result of modeling the physical wiring, including an equivalent model in a general SPICE format or a scattering matrix (S-parameters) model.

[0090] According to one embodiment, in operation 630, the electronic device may identify a first signal line. The first signal line may be a signal line that is most likely to experience a problem in the system, and the most vulnerable signal line in the system may be identified as the first signal line.

[0091] In one embodiment, at operation 640, the electronic device may identify at least one second signal line. The second signal line may refer to a signal line determined to be adjacent to the first signal line. The second signal line may refer to a line that may cause a problem due to interaction with the first signal line.

[0092] According to one embodiment, at operation 650, the electronic device may perform modeling for the first signal line and at least one second signal line. This may correspond to operation 420 of FIG. 4.

[0093] Fig. 7 illustrates an operational flow of an electronic device according to one embodiment. The electronic device of Fig. 7 may correspond to the electronic device (100) of Fig. 1, the electronic device (200) of Fig. 2, or the electronic devices of Figs. 3 to 6. Fig. 7 relates to an operational flow of an electronic device for performing a simulation of a memory interface based on the operations of Figs. 4 to 6.

[0094] According to one embodiment, at operation 710, the electronic device may split the channel model and the IBIS model.

[0095] In one embodiment, at operation 720, the electronic device may short the transmitter end of the IBIS model and extract a current profile for the entire logic circuit.

[0096] In one embodiment, the electronic device can temporarily short-circuit the transmit (Tx) side model among the IBIS models that model the operation of each input / output buffer to extract the current profile for the entire logic circuit. The electronic device can perform SPICE modeling or S-parameter modeling for each power supply network and signal path.

[0097] FIG. 8 illustrates an example of current profile extraction of an electronic device according to one embodiment.

[0098] Referring to Figure 8, an electronic device can obtain a current profile for the entire logic circuit using the IBIS model.

[0099] According to one embodiment, at operation 730, the electronic device can identify a logic circuit portion, a power supply network, and a signal path.

[0100] FIG. 9 illustrates a power supply network portion, a logic circuit portion, and a signal path portion according to one embodiment.

[0101] Referring to FIG. 9, the electronic device can identify a logic circuit portion (including an IBIS model), a power supply network portion (PDN), and a signal path portion, respectively, through operation 730.

[0102] In one embodiment, at operation 740, the electronic device may model electrical characteristics for a power supply network and signal paths.

[0103] In one embodiment, at operation 750, the electronic device may perform the simulation by applying a temporary current source to the power supply network.

[0104] In one embodiment, an electronic device can identify ripple voltage by applying a temporary current source to the power supply network. The electronic device can record noise signals, such as ripple voltage, in the power supply network to which the temporary current source is applied and perform simulations using these signals. This allows for analysis of the noise impact on the PDN and more accurately evaluating overall system-level operation.

[0105] FIG. 10 illustrates an example of an electronic device identifying a ripple voltage according to one embodiment.

[0106] Referring to Figure 10, a temporary current source can be applied to the power supply network to identify the ripple voltage from the current profile.

[0107] Figure 11 illustrates an example of performing a simulation of an electronic device according to one embodiment.

[0108] Referring to FIG. 11, the electronic device can identify the ripple voltage and simulate the data signal based on the current profile and ripple voltage to analyze the signal integrity.

[0109] Although not shown in the diagram, the electronic device can simulate the system's behavior using a voltage source (V DC) connected to the power supply network. "On-off switching" means that the voltage source turns on or off after a predetermined delay. This delay allows the system's behavior to be modeled by controlling the timing of power supply to the power supply network.

[0110] Electronic devices can simulate the behavior of a system using current sources connected to the power supply network. By "delay-switching," i.e., by allowing current sources to be turned on or off immediately without delay, the moment power is supplied to the PDN can be modeled. This allows electronic devices to perform long-term time-domain simulations. Electronic devices can analyze voltages, currents, and time-dependent behaviors that occur during system operation over a long period of time.

[0111] An operating method of an electronic device for performing a simulation of a memory interface according to an embodiment of the present disclosure may include an operation of separating a channel model and an I / O buffer information specification (IBIS) model. An operating method of an electronic device according to an embodiment may include an operation of shorting a transmission terminal of the IBIS model and extracting a current profile for an entire logic circuit. An operating method of an electronic device according to an embodiment may include an operation of identifying a logic circuit portion, a power delivery network (PDN), and a signal path. An operating method of an electronic device according to an embodiment may include an operation of modeling electrical characteristics of the power delivery network and the signal path. An operating method of an electronic device according to an embodiment may include an operation of performing a simulation by applying a temporary current source to the power delivery network.

[0112] In one embodiment, the act of modeling the electrical characteristics of the power supply network and the signal path may be performed using a spice model or a scattering matrix.

[0113] In one embodiment, the act of performing a simulation by applying a temporary current source to the power supply network may include the act of identifying a ripple voltage.

[0114] A method of operating an electronic device according to one embodiment may include applying noise generated from the ripple voltage to the IBIS model.

[0115] A method of operating an electronic device according to one embodiment may include an operation of performing a simulation for the entire logic circuit.

[0116] A method of operating an electronic device according to one embodiment may include an operation of identifying a schematic for the IBIS model, the signal path, and the power supply network.

[0117] In one embodiment, the operation of extracting the current profile may include the operation of applying the IBIS model and the channel model to the entire logic circuit, and the operation of configuring the voltage of the power supply network.

[0118] An electronic device according to one embodiment of the present disclosure includes a memory and a processor connected to the memory, wherein the processor can separate a channel model and an I / O buffer information specification (IBIS) model. In one embodiment, the processor can extract a current profile for an entire logic circuit by terminating a transmitter of the IBIS model with a receiver of the IBIS model and a capacitor of a physical wiring. In one embodiment, the processor can identify a logic circuit portion, a power delivery network (PDN), and a signal path. In one embodiment, the processor can model electrical characteristics for the power delivery network and the signal path. In one embodiment, the processor can perform a simulation by applying a temporary current source to the power delivery network.

[0119] In one embodiment, the processor may model electrical characteristics for the power supply network and the signal path using a spice model or a scattering matrix.

[0120] In one embodiment, the processor can perform a simulation by applying a temporary current source to the power supply network to identify the ripple voltage.

[0121] In one embodiment, the processor can apply noise generated from the ripple voltage to the IBIS model.

[0122] In one embodiment, the processor can perform a simulation of the entire logic circuit.

[0123] In one embodiment, the processor can identify schematics for the IBIS model, the signal path, and the power supply network.

[0124] In one embodiment, the processor can apply the IBIS model and the channel model to the entire logic circuit and configure the voltage of the power supply network.

[0125] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0126] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0127] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0128] Various embodiments of the present document may be implemented as software (e.g., a program (240)) including one or more instructions stored in a storage medium (e.g., an internal memory (236) or an external memory (238)) readable by a machine (e.g., an electronic device (201)). For example, a processor (e.g., a processor (220)) of the machine (e.g., an electronic device (201)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0129] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0130] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a method of operating an electronic device for performing simulation of a memory interface, The action of separating the channel model and the IBIS (I / O buffer information specification) model. An operation of shorting the transmitter end of the above IBIS model and extracting the current profile for the entire logic circuit. The operation of identifying the logic circuit portion, power delivery network (PDN) and signal path, An operation of modeling electrical characteristics of the above power supply network and the above signal path, and A method comprising the steps of performing a simulation by applying a temporary current source to the power supply network.

2. In claim 1, A method for modeling electrical characteristics of the power supply network and the signal path, wherein the method is performed using a spice model or a scattering matrix.

3. In claim 2, The operation of performing a simulation by applying a temporary current source to the above power supply network is as follows. A method comprising the action of identifying a ripple voltage.

4. In claim 3, the method: A method comprising applying noise generated from the above ripple voltage to the IBIS model.

5. In claim 4, the method: A method comprising the action of performing a simulation for the entire logic circuit.

6. In claim 5, the method: A method comprising the steps of: identifying a schematic for the IBIS model, the signal path, and the power supply network.

7. In claim 1, The operation of extracting the above current profile is as follows: An operation of applying the above IBIS model and the above channel model to the entire logic circuit, and A method comprising the operation of configuring the voltage of the above power supply network.

8. In electronic devices, memory; comprising a processor connected to said memory, The above processor: Separate the channel model and the IBIS (I / O buffer information specification) model, By terminating the transmitter of the above IBIS model with the receiver of the above IBIS model and the capacitor of the physical wiring, the current profile for the entire logic circuit is extracted. Identify logic circuit parts, power delivery network (PDN), and signal paths; Modeling the electrical characteristics of the above power supply network and the above signal path, A device configured to perform a simulation by applying a temporary current source to the above power supply network.

9. In claim 8, The above processor, A device configured to model electrical characteristics of said power supply network and said signal path using a spice model or a scattering matrix.

10. In claim 9, The above processor: A device configured to identify a ripple voltage by performing a simulation by applying a temporary current source to the above power supply network.

11. In claim 10, The above processor, A device configured to apply noise generated from the above ripple voltage to the above IBIS model.

12. In claim 11, The above processor: A device configured to perform a simulation of the entire logic circuit.

13. In claim 12, The above processor: A device configured to identify schematics for the IBIS model, the signal path and the power supply network.

14. In claim 8, The above processor: Applying the above IBIS model and the above channel model to the entire logic circuit, A device for configuring the voltage of the above power supply network.

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