Induction heating device having plurality of boards connected by connectors

Abstract

Disclosed is an induction heating device comprising a heating coil board on which a plurality of heating coil pattern layers having heating coils printed and patterned thereon are stacked. The induction heating device comprises: an intermediate board including a resonance capacitor, which resonates with a heating coil; and an inverter board, which includes a switching inverter for generating resonance, wherein the intermediate board includes a first connector, the inverter board includes a second connector, and the intermediate board and the inverter board are electrically connected on the basis of the first connector being vertically connected to the second connector.

Description

Induction heating device having multiple substrates connected by connectors

[0001] One embodiment of the present disclosure relates to an induction heating device having a plurality of boards, wherein the plurality of boards are connected by connectors.

[0002] A variety of cooking appliances are used to heat food in homes and restaurants. While gas-fueled stoves have traditionally been widely used, recent developments have seen the proliferation of cooking appliances that use electricity to heat objects, such as cooking pots, without relying on gas.

[0003] Methods for heating a subject using electricity are broadly divided into resistance heating and induction heating. Resistance heating is a method of heating a subject by transferring the heat generated when current is passed through a metallic resistance wire or a non-metallic heating element such as silicon carbide to the subject (e.g., a cooking vessel) through radiation or conduction. Induction heating is a method of generating eddy currents in a subject made of metallic components by utilizing the magnetic field generated around the coil when a certain amount of high-frequency power is applied to the coil, thereby heating the subject itself. Among these, induction ranges that apply the induction heating method typically have working coils (heating coils) in corresponding areas to heat each of a plurality of subjects (cooking vessels).

[0004] An induction range is a cooking appliance that utilizes the principle of induction heating. Commonly called induction, induction heating device, or induction cooking device, induction ranges do not consume oxygen and do not emit waste gases compared to gas ranges, which can reduce indoor air pollution and temperature increases. Furthermore, induction ranges utilize an indirect method of inducing heat to the heated object itself, resulting in high energy efficiency and stability. Furthermore, since heat is generated only within the heated object itself and not the contact surface, there is a low risk of burns, which has led to a continued increase in demand for induction ranges.

[0005] Recently, induction ranges have been developed that allow the heated object to be freely placed anywhere on the top plate (hereinafter referred to as "Any Place"). With these induction ranges, an object can be inductively heated regardless of its size or location within an area containing multiple heating coils.

[0006] Induction ranges can contain multiple circuit boards. Connecting these circuit boards with wires reduces assembly efficiency, leading to lower productivity, higher manufacturing costs, and reduced durability. Therefore, a structure that improves assembly efficiency when connecting multiple circuit boards is needed.

[0007] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a heating coil substrate having a plurality of heating coil pattern layers laminated by printing a heating coil. According to one embodiment, the induction heating device may include an intermediate substrate including a resonant capacitor resonating with the heating coil so as to generate a magnetic field in the heating coil under the heating coil substrate. According to one embodiment, the induction heating device may include an inverter substrate including an inverter for switching to generate resonance. According to one embodiment, the intermediate substrate may further include a first connector, and the inverter substrate may further include a second connector. According to one embodiment, an electrical connection may be made between the intermediate substrate and the inverter substrate based on the first connector and the second connector being connected in a vertical direction.

[0008] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a heating coil substrate having a plurality of heating coil pattern layers laminated by printing a heating coil. According to one embodiment, the heating coil substrate may further include at least one heating coil substrate connector. According to one embodiment, the induction heating device may include a resonant capacitor resonating with the heating coil, and at least one first inverter substrate connector vertically connected to the at least one heating coil substrate connector. According to one embodiment, the induction heating device may include an inverter substrate including an inverter that generates resonance between the heating coil and the resonant capacitor. According to one embodiment, the heating coil substrate and the inverter substrate may be electrically connected only by connecting the at least one heating coil substrate connector and the at least one first inverter substrate connector.

[0009] FIG. 1a is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0010] FIG. 1b is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0011] FIG. 2 is a cross-sectional view of a cooking vessel placed on an induction heating device according to one embodiment of the present disclosure.

[0012] FIG. 3 is an inverter circuit diagram of an induction heating device for operating a plurality of heating coils according to one embodiment of the present disclosure.

[0013] FIG. 4 illustrates an induction heating device using a square heating coil according to one embodiment of the present disclosure.

[0014] FIG. 5 is a drawing showing an induction heating device according to one embodiment of the present disclosure together with a heating coil.

[0015] Fig. 6 is a drawing showing a structure in which a heating coil is connected to an inverter board.

[0016] Fig. 7 is another drawing showing a structure in which a heating coil is connected to an inverter board.

[0017] FIG. 8 illustrates a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0018] FIG. 9 is a plan view of a heating coil substrate according to one embodiment of the present disclosure.

[0019] FIG. 10 is a pattern layer including a container detection coil according to one embodiment of the present disclosure.

[0020] FIG. 11 illustrates a structure in which each substrate of an induction heating device is connected according to one embodiment of the present disclosure.

[0021] Figure 12a is a drawing showing a structure in which a connector is connected in an induction heating device.

[0022] FIG. 12b is a drawing showing a structure in which a connector is connected in an induction heating device according to one embodiment of the present disclosure.

[0023] FIG. 13a is a drawing showing a structure in which a connector is connected to a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0024] FIG. 13b is a drawing showing a structure in which a connector is mounted on the back of a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0025] FIG. 14 is a drawing showing a structure in which a connector is connected to an intermediate substrate in an induction heating device according to one embodiment of the present disclosure.

[0026] FIG. 15 is a drawing showing a structure in which a connector is connected to an inverter substrate in an induction heating device according to one embodiment of the present disclosure.

[0027] FIG. 16 is a drawing showing a structure in which substrates are connected by connectors in an induction heating device according to one embodiment of the present disclosure.

[0028] FIG. 17 is a drawing showing a structure in which a heating coil substrate and an intermediate substrate are connected in an induction heating device according to one embodiment of the present disclosure.

[0029] Fig. 18 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0030] Fig. 19 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0031] The terms used in this disclosure will be briefly explained, and one embodiment of the present disclosure will be specifically described.

[0032] The terms used in this disclosure are selected from widely used, current terms, taking into account the functions of one embodiment of the disclosure. However, these terms may vary depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the description of the relevant embodiments of the disclosure. Therefore, the terms used in this disclosure should not be defined simply as names of terms, but rather based on the meanings of the terms and the overall content of the disclosure.

[0033] In this disclosure, the expression “at least one of a, b or c” may refer to “a”, “b”, “c”, “a and b”, “a and c”, “b and c”, “all of a, b and c”, or variations thereof.

[0034] Throughout this disclosure, when a part is said to "include" a certain component, this does not mean that other components are excluded, but rather that other components may be included, unless otherwise specifically stated. Furthermore, terms such as "part," "module," etc., used in this disclosure refer to a unit that processes at least one function or operation, and "part" and "module" may be implemented as hardware or software, or as a combination of hardware and software.

[0035] Below, with reference to the attached drawings, embodiments of the present disclosure are described in detail so that those skilled in the art can easily implement the present disclosure. However, one embodiment of the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, in the drawings, parts irrelevant to the description are omitted to clearly describe one embodiment of the present disclosure, and similar parts are designated with similar drawing reference numerals throughout the present disclosure.

[0036] An induction heating device can have multiple boards, and various methods can be used to electrically connect them. Connecting these boards with wires reduces assembly efficiency. This reduced assembly efficiency leads to decreased productivity and increased manufacturing costs, ultimately reducing the durability of the induction heating device. Therefore, a structure that connects multiple boards via connectors can be introduced to improve assembly efficiency, thereby increasing productivity, reducing manufacturing costs, and enhancing durability.

[0037] Accordingly, according to one embodiment of the present disclosure, a structure is disclosed in which a plurality of substrates are joined through vertical connectors in an induction heating device including a plurality of substrates.

[0038] In the present disclosure, the board may include a printed circuit board (PCB) substrate having a patterned circuit printed thereon. When multiple substrates are laminated, an insulating layer may be included therebetween.

[0039] FIG. 1a is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0040] Referring to FIG. 1A, an induction heating device (2000) according to one embodiment of the present disclosure may include a plurality of burners (201, 202, 203). Hereinafter, the induction heating device (2000) may be expressed as an induction heating device, an induction heating device, an induction cooking device, or simply a heating device. Not all of the components illustrated in FIG. 1A are essential components. The induction heating device (2000) may be implemented with more components than the illustrated components, or may be implemented with fewer components.

[0041] The cooking vessel (101) may be a device for heating the contents inside the cooking vessel (101). The contents inside the cooking vessel (101) may be liquids such as water, tea, coffee, soup, juice, wine, oil, etc., or solids such as butter, meat, vegetables, bread, rice, etc., but are not limited thereto.

[0042] According to one embodiment of the present disclosure, the cooking vessel (101) can wirelessly receive power from an induction heating device (2000) using electromagnetic induction. Therefore, the cooking vessel (101) according to one embodiment of the present disclosure may not include a power cord connected to a power outlet.

[0043] According to one embodiment of the present disclosure, the type of cooking vessel (101) that wirelessly receives power from the induction heating device (2000) may vary. The cooking vessel (101) may be a general induction heating (IH) vessel (hereinafter, “IH vessel”) containing a magnetic material. The cooking vessel (101) may have a magnetic field induced in the vessel itself containing the magnetic material.

[0044] The cooking vessel (101) may be a general IH vessel, such as a pot, a frying pan, or a steamer. The cooking vessel (101) may include a cooker device. The cooker device may be a device into which a general IH vessel may be inserted or removed. In one embodiment, the cooker device may be a device capable of automatically cooking contents according to a recipe. The cooker device may be referred to as a pot, a rice cooker, or a steamer depending on its use. For example, if an inner pot for cooking rice is inserted into the cooker device, the cooker device may be referred to as a rice cooker. Hereinafter, the cooker device may be defined as a smart pot (or smart pot).

[0045] According to one embodiment of the present disclosure, when the cooking vessel (101) includes a communication interface, the cooking vessel (101) can communicate with the induction heating device (2000). The communication interface may include a short-range communication unit, a long-range communication unit, etc. The short-range wireless communication interface may include, but is not limited to, a Bluetooth communication unit, a BLE (Bluetooth Low Energy) communication unit, an NFC (Near Field Communication interface), a WLAN (Wi-Fi) communication unit, a Zigbee communication unit, an IrDA (Infrared Data Association) communication unit, a WFD (Wi-Fi Direct) communication unit, an UWB (ultra wideband) communication unit, an ANT+ communication unit, etc. When the cooking vessel (101) is remotely controlled by a server device (not shown) in an IoT (Internet of Things) environment, the long-range communication unit may be used to communicate with a server device. The telecommunications unit may include the Internet, a computer network (e.g., a LAN or WAN), and a mobile communication unit. The mobile communication unit may include, but is not limited to, a 3G module, a 4G module, a 5G module, an LTE module, an NB-IoT module, an LTE-M module, and the like.

[0046] According to one embodiment of the present disclosure, the cooking vessel (101) can transmit information to a server device (not shown) via the induction heating device (2000). For example, the cooking vessel (101) can transmit information obtained from the cooking vessel (101) (e.g., temperature information of the contents, etc.) to the induction heating device (2000) via short-range wireless communication (e.g., Bluetooth, BLE, etc.). At this time, the induction heating device (2000) can transmit the information obtained from the cooking vessel (101) to the server device by connecting to the server device using a WLAN (Wi-Fi) communication unit or a long-distance communication unit (e.g., the Internet). Meanwhile, the server device can provide the information obtained from the cooking vessel (101) received from the induction heating device (2000) to a user via a mobile terminal (not shown) connected to the server device. According to another embodiment of the present disclosure, the induction heating device (2000) may directly transmit information obtained from the cooking vessel (101) to the user's mobile terminal through D2D (device to device) communication (e.g., WFD (Wi-Fi Direct) communication or BLE communication).

[0047] Meanwhile, according to one embodiment of the present disclosure, the cooking vessel (101) may directly transmit information of the cooking vessel (101) (e.g., temperature information of the contents, etc.) to a server device via a communication interface (e.g., WLAN (Wi-Fi) communication unit). In addition, the cooking vessel (101) may directly transmit information obtained from the cooking vessel (101) (e.g., temperature information of the contents, etc.) to a user's mobile terminal via short-range wireless communication (e.g., Bluetooth, BLE, etc.) or D2D (device to device) communication (e.g., WFD (Wi-Fi Direct) communication).

[0048] An induction heating device (2000) according to one embodiment of the present disclosure may be a device that wirelessly transmits power to a heated object (e.g., a cooking vessel (101)) positioned on a top plate of the induction heating device (2000) using electromagnetic induction. The induction heating device (2000) may include a working coil that generates a magnetic field for inductively heating the cooking vessel (101). The working coil is a coil that forms a magnetic field through an electric flow, and may also be referred to as a heating coil throughout the present disclosure.

[0049] The generation of a magnetic field by a heating coil may mean that power is transmitted by utilizing a magnetic field induced in an IH metal (e.g., iron component) through magnetic induction. For example, an induction heating device (2000) may generate an eddy current in a cooking vessel (101) by flowing a current through a heating coil to form a magnetic field, thereby heating the cooking vessel (101).

[0050] According to one embodiment of the present disclosure, the induction heating device (2000) may include a plurality of heating coils. For example, if the top plate of the induction heating device (2000) includes a plurality of cooking zones, the induction heating device (2000) may include a plurality of heating coils corresponding to each of the plurality of cooking zones. In addition, the induction heating device (2000) may include a high-power cooking zone in which a first heating coil is provided on the inside and a second heating coil is provided on the outside. The high-power cooking zone may include two or more heating coils.

[0051] The top plate of the induction heating device (2000) according to one embodiment of the present disclosure may be made of reinforced glass, such as ceramic glass, to prevent it from being easily damaged. In addition, the top plate of the induction heating device (2000) may include a guide mark to guide the cooking zone where the cooking vessel (101) should be positioned.

[0052] An induction heating device (2000) according to one embodiment of the present disclosure can detect that a cooking vessel (101) including a magnetic body is placed on a top plate. For example, the induction heating device (2000) can detect that the cooking vessel (101) is positioned on the top plate of the induction heating device (2000) based on a change in the current value (inductance) of a heating coil due to the approach of the cooking vessel (101). The induction heating device (2000) can detect the presence or absence of the cooking vessel (101) and / or the position of the cooking vessel (101) by including a vessel detection sensor or a vessel detection coil.

[0053] According to one embodiment of the present disclosure, the induction heating device (2000) may include a communication interface for communicating with an external device. For example, the induction heating device (2000) may communicate with a cooking vessel (101) or a server device through the communication interface. The communication interface may include a short-range communication unit (e.g., an NFC communication unit, a Bluetooth communication unit, a BLE communication unit, etc.), a mobile communication unit, etc.

[0054] According to one embodiment of the present disclosure, the induction heating device (2000) can detect a cooking vessel (101) positioned on the top plate through a communication interface. For example, the induction heating device (2000) can detect the cooking vessel (101) by receiving a packet transmitted from the cooking vessel (101) positioned on the top plate using short-range wireless communication (e.g., BLE mesh network, Bluetooth).

[0055] According to one embodiment of the present disclosure, the induction heating device (2000) can detect whether the cooking vessel (101) is placed on the top plate of the induction heating device (2000) through a vessel detection sensor (or vessel detection coil) even if the cooking vessel (101) does not have a communication interface.

[0056] According to one embodiment of the present disclosure, the induction heating device (2000) can display information related to the cooking vessel (101) through a user interface. For example, when the cooking vessel (101) is detected, the induction heating device (2000) can display identification information of the cooking vessel (101) and location information of the cooking vessel (101) on a display unit included in the user interface.

[0057] Referring to FIG. 1A, when a user places a cooking vessel (101) (e.g., a pot) on the top plate of an induction heating device (2000), the induction heating device (2000) can provide the user with identification information of the cooking vessel (101) (e.g., a pot), location information of the cooking vessel (101) (e.g., located on the right burner), and material information of the cooking vessel (101) (whether it is a quick-heating vessel) on a display (2411) as an output interface.

[0058] FIG. 1b is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0059] Fig. 1b is a bird's-eye view of the induction heating device (2000) according to Fig. 1a without a cooking vessel. The induction heating device (2000) according to Fig. 1b may include multiple burners (201, 202, 203), and thus may heat multiple cooking vessels simultaneously. When the induction heating device (2000) heats multiple cooking vessels simultaneously, a heating coil corresponding to each burner may operate. The induction heating device (2000) according to Figs. 1a and 1b is an induction heating device in which burners corresponding to cooking vessels are predetermined.

[0060] FIG. 2 is a cross-sectional view of a cooking vessel placed on an induction heating device according to one embodiment of the present disclosure.

[0061] Referring to FIG. 2, the cooking vessel (101) may include a magnetic material (e.g., IH metal) in which a magnetic field can be induced.

[0062] The cooking vessel (101) can be inductively heated by an induction heating device (2000) and can be a variety of containers including a magnetic material. Induction heating (IH) is a method of heating an IH metal using an electromagnetic induction phenomenon. For example, when an alternating current is supplied to a heating coil (2120) of an induction heating device (2000), a magnetic field that varies over time is induced inside the heating coil (2120). The magnetic field generated by the heating coil (2120) passes through the bottom of the cooking vessel (101). When the magnetic field that varies over time passes through the IH metal (e.g., iron, steel, nickel, or various types of alloys) included in the bottom of the cooking vessel (101), a current that rotates around the magnetic field is generated in the IH metal. The rotating current is called an eddy current, and the phenomenon in which a current is induced by a magnetic field that varies over time is called an electromagnetic induction phenomenon. In the case of a cooking vessel (101), heat is generated at the bottom of the cooking vessel (101) by eddy current and resistance of IH metal (e.g., iron). The contents of the cooking vessel (101) can be heated by the heat generated at this time.

[0063] FIG. 3 is an inverter circuit diagram of an induction heating device for operating a plurality of heating coils according to one embodiment of the present disclosure.

[0064] Referring to Fig. 3, the input power source (2211) is an AC power source. The AC voltage from the input power source (2211), which is an AC power source, passes through an EMI filter (2111) and is rectified by a rectifier circuit (2112). The rectifier circuit (2112) is a device for converting the AC voltage into a DC voltage. A diode may be used, but a thyristor or other type of switching device may also be used. The voltage converted into a DC voltage through the rectifier circuit (2112) may be smoothed by a DC link capacitor (2117_1, 2117_2).

[0065] In Fig. 3, two resonance circuits are illustrated assuming that there are two heating coils (2120_1, 2120_2), but if there are three craters and three heating coils are required, a resonance circuit can be added.

[0066] The DC voltage smoothed by the DC link capacitor (2117_1) resonates between the first heating coil (2120_1) and the resonant capacitor 1 (2114_1) and the resonant capacitor 2 (2114_2) by the switching operation of the two switch elements SW1 (2113_1) and SW2 (2113_2), and a magnetic field is generated in the first heating coil (2120_1) due to the resonance. The magnetic field generated in the first heating coil (2120_1) generates an eddy current in the IH cooking container placed on the top of the first heating coil (2120_1), thereby heating the contents of the cooking container. CT1 is a current sensor for detecting the current flowing in the first heating coil (2120_1).

[0067] As before, the DC voltage smoothed by the DC link capacitor (2117_2) at the bottom resonates between the second heating coil (2120_2) and the resonant capacitor 3 (2114_3) and the resonant capacitor 4 (2114_4) by the switching operation of the two switch elements SW3 (2113_3) and SW4 (2113_4). The resonance generates a magnetic field in the second heating coil (2120_2). The magnetic field generated in the second heating coil (2120_2) generates an eddy current in the IH cooking container placed on the top of the second heating coil (2120_2), thereby heating the contents of the cooking container. CT2 is a current sensor for detecting the current flowing in the second heating coil (2120_2).

[0068] FIG. 4 illustrates an induction heating device using a square heating coil according to one embodiment of the present disclosure.

[0069] Referring to FIG. 4, an induction heating device (2000) according to one embodiment of the present disclosure may include a circular first crater (201) operated by a circular heating coil and a square crater (204) formed by a square heating coil. The square may be rectangular, and the heating coil on the bottom of the square crater (204) may include a plurality of rectangular heating coils.

[0070] Using a square heating coil in an induction heating device (2000) has the advantage of eliminating a non-cooking zone, for example, when a square pot is placed on it. In addition, no matter where the user of the induction heating device (2000) places the cooking vessel on the square burner (204), the induction heating device (2000) recognizes the cooking vessel and operates the square heating coil necessary for heating the cooking vessel to heat the contents of the cooking vessel. Although FIG. 4 illustrates a case where the first burner (201), which is a circular burner, and the square burner (204) are present together, the induction heating device (2000) according to one embodiment of the present disclosure may include only the square burner. In this case, the induction heating device (2000) is also called an any-place induction heating device because the induction heating device (2000) detects and operates the heating coil no matter where the cooking vessel is placed.

[0071] In one embodiment, the heating coil for the square hole (204) may include more detailed heating coils rather than the multiple square-shaped heating coils as shown in FIG. 4. For example, the heating coil for the square hole (204) may have a form in which small circular heating coils are relatively densely arranged. For example, it may have a form in which small heating coils are densely arranged as shown in FIG. 11.

[0072] FIG. 5 is a drawing showing an induction heating device according to one embodiment of the present disclosure together with a heating coil.

[0073] FIG. 5 is a drawing showing the appearance of the heating coils inside the induction heating device (2000) wound together with the exterior of the induction heating device (2000), although it is not actually visible from the outside. As shown in FIG. 5, according to one embodiment, four square heating coils (2120_3, 2120_4, 2120_5, 2120_6) corresponding to the square craters (204) in the induction heating device (2000) are wound sequentially from the top of the induction heating device (2000). Of course, this is only one embodiment, and the number of square heating coils (2120_3, 2120_4, 2120_5, 2120_6) corresponding to the square craters (204) may be more than four or less than four. Additionally, if the induction heating device (2000) is an any place induction heating device as described above, the circular heating coil (2120_1) may also be replaced by one or more rectangular heating coils.

[0074] On the right side of the induction heating device (2000) according to FIG. 5, a circular heating coil (2120_1) corresponding to the first circular crater (201) is wound, as seen in FIG. 1.

[0075] Fig. 6 is a drawing showing a structure in which a heating coil is connected to an inverter board.

[0076] FIG. 6 shows that the first heating coil (2121), the second heating coil (2122), the third heating coil (2123), the n-th heating coil (2129) are connected to the first inverter connector (611), the second inverter connector (612), the third inverter connector (613), the n-th inverter connector (619) on the inverter substrate (30).

[0077] As illustrated in FIG. 6, the first heating coil (2121), the second heating coil (2122), the third heating coil (2123), the n-th heating coil (2129) can be driven by an inverter on the inverter substrate (30) through electrical connections via the first inverter connector (611), the second inverter connector (612), the third inverter connector (613), the n-th inverter connector (619) on the inverter substrate (30). Each heating coil resonates with a resonant capacitor (not illustrated) on the inverter substrate (30) by driving the inverter, thereby heating the cooking vessel. The inverter substrate may also be referred to as an inverter PBA (printed board assembly).

[0078] In FIG. 6, the first heating coil (2121) is connected to the inverter board (410) through the first inverter connector (611), and at this time, the first heating coil (2121) to the first inverter connector (611) can be connected with a wire (621). Similarly, the second heating coil (2122), the third heating coil (2123), the first, and the n-th heating coil (2129) can be connected to the second inverter connector (612), the third inverter connector (613), the first, and the n-th inverter connector (619) through wires, respectively. In this manner, when a plurality of heating coils are all extended and connected to the inverter connector through wires, a considerable length of wire is required, which increases the manufacturing cost, and also, when long wires become entangled with each other, wire damage may occur. This phenomenon can lead to poor wire quality, which in turn can lead to poor quality in the induction heating device. Furthermore, the difficulty of connecting and assembling the heating coil wires can hinder securing sufficient circuit layout space within the induction heating device. Furthermore, this difficulty in securing circuit layout space increases the difficulty of circuit design, potentially reducing the productivity of the device.

[0079] Fig. 7 is another drawing showing a structure in which a heating coil is connected to an inverter board.

[0080] Referring to FIG. 7, the heating coil (2120) is shown connected to the inverter substrate (30) via a wire (621). In one embodiment, the inverter substrate (30) may be installed on the bottom surface of the induction heating device (2000). The inverter substrate (30) may include an inverter connector to which the wire (621) may be connected. The heating coil (2120) may be wound with copper, and the end of each heating coil (2120) is connected to the inverter substrate (30) via a wire (621). As described in FIG. 6, if all of the heating coils (2120) are connected to the inverter substrate (30) via wires, a considerable length of wire is required, which increases the manufacturing cost. In addition, wire damage may occur as long wires become entangled with each other. This phenomenon may cause poor wire quality and poor quality of the induction heating device.

[0081] Therefore, to solve these problems, according to one embodiment of the present disclosure, a method of connecting a plurality of heating coils and inverter connectors between boards using fixed vertical connectors without connecting them with wires (board-to-board connection) may be used. Furthermore, according to one embodiment of the present disclosure, the heating coils may also be manufactured in the form of a board so as to be directly connected to an inverter board or intermediate board via a connector.

[0082] FIG. 8 illustrates a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0083] Referring to FIG. 8, a heating coil substrate (10) with a heating coil (2120) patterned on the substrate can be confirmed.

[0084] The heating coil can be manufactured in the form of a conductor printed on a heating coil substrate (10). In one embodiment, the heating coil substrate (10) may be a heating coil substrate (10) in which two or more heating coil pattern layers are laminated. In order to implement a high-power (maximum over 3 kW) induction heating device using a heating coil substrate (10) in which two or more heating coil pattern layers are laminated, the copper thickness of the first layer (the thickness of the coil pattern) needs to be approximately 500 μm. Doing so may increase the influence of the skin effect, which may increase coil loss. In order to implement high power while reducing the skin effect, a method may be considered in which the thickness and width of the heating coil pattern are reduced and a plurality of heating coil patterns are connected in parallel to secure current capacity. In this case, the number of interlayer connections for connecting a plurality of heating coils in parallel increases, and heating coil loss depending on the wiring length may also increase. Therefore, according to one embodiment of the present disclosure, a heating coil substrate (10) having multi-layer heating coil pattern layers that can reduce the number of interlayer connections while reducing heating coil loss may be employed. Here, multi-layers may mean four or more layers. In one embodiment, the heating coil (2120) pattern layer may be provided on the heating coil substrate (10) in a sheet shape. For example, the heating coil (2120) may be in the form of a printed circuit board formed on the heating coil substrate (10) by a patterning process using photoresist or the like. In one embodiment, each of the plurality of heating coils may have the same shape and size. The shapes and sizes of the plurality of heating coils do not need to be all the same.

[0085] FIG. 9 is a plan view of a heating coil substrate according to one embodiment of the present disclosure.

[0086] Referring to FIG. 9, the heating coil substrate (10) may be a printed circuit board made by laminating six or more heating coil pattern layers (PL) on which a coil pattern (CP; coil pattern) is formed. An insulating layer may be inserted between the heating coil pattern layers. According to the induction heating device (2000) having such a heating coil substrate (10), since the heating coil substrate (10) has a laminated structure of six or more layers, the thickness of one layer of the heating coil, for example, the thickness of the copper, can be thinned and the pattern width can be reduced, thereby reducing the influence of the skin effect and reducing coil loss. Of course, this is only one example, and the heating coil substrate (10) may have a laminated structure of three to five layers, which is less than six layers, or may have a laminated structure of seven or more layers, which is more than six layers.

[0087] In the heating coil substrate (10), at least one coil pattern (CP) is formed on each heating coil pattern layer. For example, the coil pattern (CP) may be spiral-shaped. In one embodiment, the coil pattern (CP) may be formed by a plurality of coil elements that are approximately rectangular when viewed in a plan view, as illustrated in FIG. 9. In one embodiment, the coil pattern (CP) may be formed by a plurality of coil elements that are circular when viewed in a plan view. The shape of the coil elements forming the coil pattern (CP) is not limited to the shape described above. The heating coil substrate (10) may include a plurality of serial pattern groups between the plurality of heating coil pattern layers. The plurality of serial pattern groups may be connected in parallel to each other. Each of the plurality of serial pattern groups may have a plurality of serially connected coil patterns (CP). The plurality of serial pattern groups may be formed such that coil patterns formed on adjacent pattern layers among the plurality of pattern layers are connected in parallel to each other. Hereby, coils formed on multiple pattern layers can form a parallel connection relationship, and the induction heating device (2000) can secure a large current capacity and also reduce heating coil loss. Multiple coil patterns (CP) forming each of multiple series pattern groups can be formed on four or more pattern layers. At least one of the multiple series pattern groups may have a different combination of multiple heating coil pattern layers from the remaining series pattern groups. Accordingly, the wiring structure between the multiple heating coil pattern layers can be simplified, thereby reducing the number of interlayer connections, and thus reducing power loss. That is, by lowering the impedance gap between the parallel-connected series pattern groups due to the mutual impedance effect in each heating coil pattern layer, efficiency characteristics equivalent to those of a theoretical entire layer (whole layer) series connection structure can be maintained. In addition, since the number of interlayer connections is reduced compared to the entire layer series connection structure, the interlayer wiring resistance is lowered, thereby enabling a low-loss design with less loss than the entire layer series connection structure.The plurality of serial pattern groups may include at least two serial pattern groups having the same combination of the plurality of heating coil pattern layers. This may reduce the number of interlayer connections.

[0088] In addition, as illustrated in FIG. 9, in the heating coil substrate (10), both terminals (input terminal (2a), output terminal (2b)) for parallel connection of a plurality of serial pattern groups included in each of the laminated layers can be formed on the outer periphery of the coil pattern (CP). And, electrical connection between the plurality of heating coil pattern layers can be made by a conductor (through hole (TH) or via hole) formed by penetrating the heating coil substrate (10). The through hole (TH) penetrates all of the heating coil pattern layers (PL) and enables electrical connection between the layers.

[0089] In addition, in the heating coil substrate (10) according to one embodiment of the present disclosure, the coil patterns (CP) may be provided such that the input terminal (2a) side is positioned on the uppermost layer among the plurality of pattern layers (PL), and the output terminal (2b) side is positioned on the lowermost layer among the plurality of pattern layers (PL). According to this configuration, when forming a plurality of heating coil pattern layers and mounting a low power sensor on the upper layer, the low power sensor can be easily formed in a thin film structure.

[0090] FIG. 10 is a pattern layer including a container detection coil according to one embodiment of the present disclosure.

[0091] Referring to FIG. 10, according to one embodiment of the present disclosure, a heating coil substrate (10) includes a container detection coil layer (33) including a container detection coil (2700).

[0092] The container detection coil layer (33) according to FIG. 10 includes eight container detection coils (2700) in a pattern. In addition, according to one embodiment, the container detection coil layer (33) includes a hole (15) through which a temperature sensor capable of detecting the temperature of the cooking vessel can pass. In some cases, the hole (15) through which the temperature sensor can pass in the container detection coil layer (33) may not be included. The pattern of the container detection coil (2700) in the container detection coil layer (33) according to FIG. 10 has a circular shape and may be patterned and provided in a space that does not vertically overlap with a heating coil patterned in another layer as much as possible. However, this is only one embodiment, and the pattern of the container detection coil (2700) may have a shape other than a circle.

[0093] The container detection coil (2700) may include a first stage (2701) that extends to the lowest layer through a via hole in the center of a patterned circle and a second stage (2703) for connection to a connector provided on the container detection coil layer (33). The induction heating device (2000) may detect whether a container is present on the top plate (5) through a change in inductance measured through the first stage (2701) and the second stage (2703).

[0094] FIG. 11 illustrates a structure in which each substrate of an induction heating device is connected according to one embodiment of the present disclosure.

[0095] Referring to FIG. 11, an induction heating device (2000) according to one embodiment of the present disclosure may include a top plate (5) on which a cooking vessel is placed, and a heating coil substrate (10) having a plurality of heating coils printed, patterned, and laminated under the top plate (5). An induction heating device (2000) according to one embodiment of the present disclosure may include an intermediate substrate (20) including a relay, a resonant capacitor, etc. under the heating coil substrate (10). In one embodiment, the intermediate substrate (20) may include a memory for storing a program for controlling the operation of the induction heating device (2000) and a processor for executing the program stored in the memory to control the induction heating device (2000).

[0096] An induction heating device (2000) according to one embodiment of the present disclosure may include an inverter substrate (30) including an inverter and a power converter under an intermediate substrate (20). A resonant capacitor may be included in the inverter substrate (30) according to one embodiment. In one embodiment, the intermediate substrate (20) and the inverter substrate (30) may be combined into a single inverter substrate depending on design specifications. The inverter substrate (30) may include a plurality of electronic switches constituting the inverter. The plurality of electronic switches perform PWM switching. The heating coil (2120) included in the heating coil substrate (10) may resonate with the resonant capacitor through PWM switching to induce an eddy current in the cooking vessel. The inverter substrate (30) may include a power converter for generating a low-voltage direct current used for a processor, memory, etc. included in the intermediate substrate (20). The power converter may also generate a voltage of 15 V or 12 V for switching the plurality of electronic switches of the inverter. In the present disclosure, the power conversion device may be referred to as a switched mode power supply (SMPS).

[0097] In one embodiment, the intermediate substrate (20) may be electrically connected to each other by vertically connecting a first connector (110) mounted vertically on the lower surface of the intermediate substrate (20) and a second connector (120) mounted vertically on the upper surface of the inverter substrate (30). In this case, in one embodiment, the electrical connection between the intermediate substrate (20) and the inverter substrate (30) may be made only by the connection between the first connector (110) and the second connector (120).

[0098] When the first connector (110) of the intermediate substrate (20) is coupled to the second connector (120) of the inverter substrate (30), a position guide may be included in the intermediate substrate (20) and / or the inverter substrate (30) so that coupling between the first connector (110) and the second connector (120) can be easily achieved.

[0099] In one embodiment, the first connector (110) mounted vertically on the lower surface of the intermediate substrate (20) may be a male connector, and the second connector (120) mounted vertically on the upper surface of the inverter substrate (30) may be a female connector. In one embodiment, conversely, the first connector (110) mounted vertically on the lower surface of the intermediate substrate (20) may be a female connector, and the second connector (120) mounted vertically on the upper surface of the inverter substrate (30) may be a male connector.

[0100] When the heating coil substrate (10), intermediate substrate (20), and inverter substrate (30) are connected as shown in Fig. 11, wires for inter-substrate connection are no longer required, thereby preventing product defects caused by wires. Furthermore, the inconvenience of assembly or increased manufacturing costs due to wires are eliminated. Therefore, the structure in which the substrates are connected via connectors as shown in Fig. 11 simplifies product assembly and minimizes product defects.

[0101] Figure 12a is a drawing showing a structure in which a connector is connected in an induction heating device.

[0102] Fig. 12a illustrates that the first switch (2113_1) and the second switch (2113_2) included in the inverter (2113) are connected to the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2). The point (A1) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) of the inverter (2113) is connected to the heating coil (2120). The first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) resonate with the heating coil (2120) by the operation of the first switch (2113_1) and the second switch (2113_2) included in the inverter (2113), and the induction heating device (2000) induces an eddy current in the cooking vessel through resonance.

[0103] In Fig. 12a, a point (A1) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) is connected to a heating coil (2120) through a screw terminal (190). The point (A1) is connected to the heating coil (2120) through a wire fastened to the screw terminal (190). As mentioned above, this method results in a complicated wire connection, which reduces the convenience of assembly, increases the possibility of product defects, and also increases the manufacturing cost.

[0104] FIG. 12b is a drawing showing a structure in which a connector is connected in an induction heating device according to one embodiment of the present disclosure.

[0105] FIG. 12b illustrates a circuit in which, similar to FIG. 12a, a first switch (2113_1) and a second switch (2113_2) included in an inverter (2113) are connected to a first resonant capacitor (2114_1) and a second resonant capacitor (2114_2). A point (A2) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) of the inverter (2113) is connected to a heating coil (2120). The first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) resonate with the heating coil (2120) by the operation of the first switch (2113_1) and the second switch (2113_2) included in the inverter (2113), and the induction heating device (2000) induces an eddy current in the cooking vessel through resonance.

[0106] In FIG. 12b, a point (A2) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) is connected to a heating coil (2120) via a connector (100). In one embodiment, the point (A2) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) may be connected to a female connector (102) on an inverter board (30) including an inverter (2113), and may be connected to the heating coil (2120) by being coupled with a male connector (101) mounted on the heating coil (2120). In one embodiment, a point (A2) connecting the first resonant capacitor (2114_1) and the second resonant capacitor (2114_2) may be connected to a male connector (101) on an inverter board (30) including an inverter (2113), and may be connected to a female connector (102) mounted on a heating coil (2120) to be connected to the heating coil (2120). As mentioned above, this method has high assembly convenience and reduces the possibility of product defects because there is no complicated wire connection, and can also reduce an increase in manufacturing costs.

[0107] FIG. 13a is a drawing showing a structure in which a connector is connected to a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0108] The heating coil substrate (10) is a substrate created by stacking a plurality of heating coil substrate sheets on which a plurality of heating coils are patterned.

[0109] The heating coil substrate (10) of FIG. 13a shows the lower surface on which the heating coil substrate connector (130) is mounted, not the upper surface on which the top plate (5) is placed. The heating coil substrate connector (130) is vertically mounted on the lower surface of the heating coil substrate (10) so that each heating coil (2120) is electrically connected to the inverter (2113). The heating coil substrate connector (130) may be a male connector or a female connector. In the present disclosure, the heating coil substrate connector (130) may be referred to as a third connector to distinguish it from the first connector (110) and the second connector (120) illustrated in FIG. 11. In one embodiment, the heating coil substrate connector (130) may have a structure in which it is directly connected to a connector vertically mounted on the inverter substrate (30) by penetrating a hole of the intermediate substrate (20) of FIG. 11, and may also be connected to a fourth connector (140) mounted on the intermediate substrate (20). In one embodiment, the case in which the heating coil substrate connector (130) is connected to the fourth connector (140) of the intermediate substrate (20) is when a resonant capacitor (2114) is mounted on the intermediate substrate (20).

[0110] FIG. 13b is a drawing showing a structure in which a connector is mounted on the back of a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0111] Fig. 13b shows the lower surface of the heating coil substrate (10) similarly to Fig. 13a. The heating coil substrate (10) of Fig. 13b may include a hole penetrating the entire heating coil substrate (10) in the central portion where the heating coil (2120) is printed and patterned. The hole does not necessarily have to be located in the center and may be provided in other locations. A temperature sensor (2600) may be mounted in this hole. The temperature sensor (2600) may be used to measure the temperature of a cooking vessel placed on the top plate (5) of the induction heating device (2000).

[0112] The temperature sensor (2600) may include a vertically fixed lead wire rather than a wire structure. The lead wire of the temperature sensor (2600) may be connected to a connector for a temperature sensor included in at least one substrate included in the heating coil substrate (10).

[0113] The heating coil substrate (10) may include a heating coil substrate connector (130) mounted vertically on the heating coil substrate (10) to be electrically connected to an intermediate substrate (20) and / or an inverter substrate (30) placed below the heating coil substrate (10).

[0114] FIG. 14 is a drawing showing a structure in which a connector is connected to an intermediate substrate in an induction heating device according to one embodiment of the present disclosure.

[0115] The intermediate substrate (20) according to FIG. 14 illustrates a lower surface when viewed from below. The intermediate substrate (20) according to FIG. 14 can be electrically connected to the heating coil substrate (10) according to FIG. 13a by a connector. In one embodiment, the fourth connector (140) of the intermediate substrate (20) can be connected to the heating coil substrate connector (130) of the heating coil substrate (10) according to FIG. 13a. In one embodiment, the fourth connector (140) of the intermediate substrate (20) can be mounted on the lower surface of the intermediate substrate (20). Alternatively, in one embodiment, depending on the design specifications, the fourth connector of the intermediate substrate (20) can be a connector mounted on the upper surface of the intermediate substrate (20). In one embodiment, the fourth connector (140) of the intermediate substrate (20) can be mounted on the lower surface of the intermediate substrate (20) to utilize the space between the intermediate substrate (20) and the inverter substrate (30). By mounting the fourth connector (140) on the lower surface of the intermediate substrate (20), the difficulty in adjusting the space between the heating coil substrate (10) and the intermediate substrate (20) can also be resolved.

[0116] If the heating coil substrate connector (130) of the heating coil substrate (10) according to Fig. 13a is a male connector, the fourth connector (140) according to Fig. 14 may be a female connector, and conversely, if the heating coil substrate connector (130) of the heating coil substrate (10) according to Fig. 13a is a female connector, the fourth connector (140) according to Fig. 14 may be a male connector. By accommodating the heating coil substrate connector (130) in the fourth connector, the heating coil (2120) may be electrically connected to the resonant capacitor (2114) of the intermediate substrate (20) without a wire.

[0117] In one embodiment, the intermediate substrate (20) may include a first connector (110) that may be electrically connected to the inverter substrate (30). In one embodiment, the first connector (110) may be vertically mounted on a lower surface of the intermediate substrate (20) and may be coupled with a second connector (120) mounted on an inverter substrate (30) positioned below the intermediate substrate (20) to electrically connect the intermediate substrate (20) to the inverter substrate (30). Although the first connector (110) is illustrated as a male connector in FIG. 14, the first connector (110) may be a female connector. If the first connector (110) is a male connector, the second connector (1200) on the inverter board (30) may be a female connector, and conversely, if the first connector (110) is a female connector, the second connector (120) on the inverter board (30) may be a male connector.

[0118] FIG. 15 is a drawing showing a structure in which a connector is connected to an inverter substrate in an induction heating device according to one embodiment of the present disclosure.

[0119] According to FIG. 15, a second connector (120) is mounted on the upper surface of the inverter substrate (30). In one embodiment, the second connector (120) is coupled with the first connector (110) of the intermediate substrate (20) in FIG. 14 to enable electrical connection between the intermediate substrate (20) and the inverter substrate (30).

[0120] In one embodiment, the inverter substrate (30) may include a resonant capacitor (2114). If the inverter substrate (30) needs to be directly connected to the heating coil substrate (10) for resonance, the second connector (120) may be directly connected to the heating coil substrate connector (130) as a first inverter substrate connector. In this case, the heating coil substrate connector (130) may be directly connected to the first inverter substrate connector of the inverter substrate (30) by penetrating the intermediate substrate (20) through a hole in the intermediate substrate (20). Alternatively, in one embodiment, the intermediate substrate (20) may be a substrate integrated into one with the inverter substrate (30).

[0121] In one embodiment, when the second connector (120) is directly connected to the heating coil substrate connector (130) as the first inverter substrate connector and there is an intermediate substrate (20), the intermediate substrate (20) can be electrically connected to the inverter substrate (30) by a coupling between an intermediate substrate connector (150) vertically mounted on the intermediate substrate (20) and a second inverter substrate connector (160) vertically mounted on the inverter substrate (30).

[0122] FIG. 16 is a drawing showing a structure in which substrates are connected by connectors in an induction heating device according to one embodiment of the present disclosure.

[0123] Fig. 16 shows that the intermediate substrate (20) and the inverter substrate (30) of the induction heating device (2000) are connected via a connector according to one embodiment of the present disclosure. The first connector (110) of the intermediate substrate (20) is vertically connected to the second connector (120) of the inverter substrate (30).

[0124] Since the intermediate substrate (20) and the inverter substrate (30) are connected to each other by connectors mounted vertically on the substrate without wires, the substrate connection efficiency of the induction heating device (2000) can be increased and the ease of assembly can also be increased.

[0125] In one embodiment, the intermediate substrate (20) and the inverter substrate (30) may be combined into one inverter substrate. In this case, the heating coil substrate (10) may be electrically connected to the one inverter substrate through a connector.

[0126] FIG. 17 is a drawing showing a structure in which a heating coil substrate and an intermediate substrate are connected in an induction heating device according to one embodiment of the present disclosure.

[0127] According to one embodiment of the present disclosure according to FIG. 17, the third connector (130) mounted on the lower surface of the heating coil substrate (10) is connected to the fourth connector (140) installed on the lower surface of the intermediate substrate (20), so that the heating coil substrate (10) and the intermediate substrate (20) can be electrically connected. According to this structure, the heating coil substrate (10) can be laminated in close contact with the intermediate substrate (20).

[0128] In one embodiment, the fourth connector (140) may be mounted on the upper surface of the intermediate substrate (20). At this time, the third connector (130) mounted on the lower surface of the heating coil substrate (10) may be coupled with the fourth connector (140) mounted on the upper surface of the intermediate substrate (20), so that the two substrates may be electrically coupled.

[0129] Fig. 18 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0130] As illustrated in FIG. 18, an induction heating device (2000) according to one embodiment of the present disclosure may include a top plate (5), a heating coil substrate (10), an intermediate substrate (20), and an inverter substrate (30).

[0131] In an induction heating device (2000) according to one embodiment of the present disclosure, the top plate (5) is a plate on which a cooking vessel is placed and is usually made of heat-resistant tempered glass. The top plate (5) may include a user interface (2400) including an output interface (2410) such as a display and an input interface (2420) such as a touch button. In one embodiment, the actual operation of the output interface (2410) such as a display and the input interface (2420) such as a touch button may be performed under the control of a processor (2200) to be described below. In one embodiment, the display or the actual touch button itself may be mounted on the intermediate substrate (20), and only the interface may be provided through the top plate (5).

[0132] The output interface (2410) is for outputting audio signals or video signals and may include a display and an audio output section, etc.

[0133] When the display and the touchpad are configured as a touch screen in a layered structure, the display can be used as an input interface (2420) in addition to the output interface (2410). The display can include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, a light-emitting diode (LED), an organic light-emitting diode, a flexible display, a 3D display, and an electrophoretic display. In addition, depending on the implementation form of the induction heating device (2000), the induction heating device (2000) can include two or more displays.

[0134] The audio output unit can output audio data received from the communication interface (2300) or stored in the memory (2500). In addition, the audio output unit can output audio signals related to functions performed in the induction heating device (2000). The audio output unit can include a speaker, a buzzer, etc.

[0135] According to one embodiment of the present disclosure, the output interface (2410) can display information regarding the cooking vessel (101). For example, the output interface (2410) can output a GUI (Graphical User Interface) corresponding to identification information or product type information of the cooking vessel (101). In addition, the output interface (2410) can output information regarding the current position of the cooking vessel (101) and / or material information of the cooking vessel (101).

[0136] The input interface (2420) is for receiving input from a user. The input interface (2420) may be at least one of a key pad, a dome switch, a touch pad (contact electrostatic capacitance type, pressure resistive film type, infrared detection type, surface ultrasonic conduction type, integral tension measurement type, piezo effect type, etc.), a jog wheel, and a jog switch, but is not limited thereto.

[0137] The input interface (2420) may include a voice recognition module. For example, the induction heating device (2000) may receive a voice signal, which is an analog signal, through a microphone, and convert the voice portion into computer-readable text using an Automatic Speech Recognition (ASR) model. The induction heating device (2000) may interpret the converted text using a Natural Language Understanding (NLU) model to obtain the user's speech intent. Here, the ASR model or the NLU model may be an artificial intelligence model. The artificial intelligence model may be processed by an artificial intelligence-dedicated processor designed with a hardware structure specialized for processing artificial intelligence models. The artificial intelligence model may be created through learning. Here, being created through learning means that a basic artificial intelligence model is learned using a plurality of learning data by a learning algorithm, thereby creating a predefined operation rule or artificial intelligence model set to perform a desired characteristic (or purpose). The artificial intelligence model may be composed of multiple neural network layers. Each of the multiple neural network layers has multiple weight values, and performs neural network operations through operations between the operation results of the previous layer and the multiple weight values.

[0138] Linguistic understanding is the technology of recognizing, applying, and processing human language / characters, including natural language processing, machine translation, dialog systems, question answering, and speech recognition / synthesis.

[0139] In an induction heating device (2000) according to one embodiment of the present disclosure, a heating coil substrate (10) may include a heating coil (2120) that is printed and patterned on a heating coil substrate sheet (11). The heating coil substrate (10) may have a structure in which a plurality of heating coil substrate sheets (11) are laminated. The heating coil (2120) may be a plurality of heating coils, and the heating coil (2120) may include a first heating coil (2120_1), a second heating coil (2120_2), an n-th heating coil (2120_9) (n is a natural number equal to or greater than 2). The heating coil substrate (10) may include a third connector (130) so as to be connected to the intermediate substrate (20) and / or the inverter substrate (30) without a wire.

[0140] The heating coil (2120) can generate a magnetic field for heating the cooking vessel (101). For example, when current is supplied to the heating coil (2120), a magnetic field can be induced around the heating coil (2120). When a current whose size and direction change over time, i.e., an alternating current, is supplied to the heating coil (2120), a magnetic field whose size and direction change over time can be induced around the heating coil (2120). The magnetic field around the heating coil (2120) can pass through the top plate (5) made of tempered glass and can reach the cooking vessel (101) placed on the top plate (5). Due to the magnetic field whose size and direction change over time, an eddy current that rotates around the magnetic field can be generated in the cooking vessel (101), and due to the eddy current, resistive heat can be generated in the cooking vessel (101). Resistance heat is heat generated in a resistor when current flows through the resistor, and is also called Joule heat. When the cooking vessel (101) is heated by electric resistance heat, the contents inside the cooking vessel (101) may be heated.

[0141] In an induction heating device (2000) according to one embodiment of the present disclosure, the heating coil substrate (10) may further include a temperature sensor (2600). The temperature sensor (2600) is a sensor that senses the temperature of the top plate (5) or the cooking vessel (101) placed on the top plate (5). Based on the temperature of the cooking vessel (101) sensed by the temperature sensor (2600), the processor (2200) may determine whether the cooking vessel (101) is being co-heated or overheated. In one embodiment, the temperature sensor (2600) may be installed in a hole penetrating the heating coil substrate (10). The temperature sensor (2600) may be fixed to the substrate by a fixed lead wire without being connected by a wire. In one embodiment, the temperature sensor (2600) may be accommodated in a connector with two leads mounted vertically on at least one substrate of the heating coil substrate (10) without wires. For example, a female connector may be mounted on at least one substrate of the heating coil substrate (10), and the lead wire of the temperature sensor (2600) may be directly connected to the female connector mounted on the at least one substrate without soldering.

[0142] In an induction heating device (2000) according to one embodiment of the present disclosure, the heating coil substrate (10) may further include a container detection coil (2700). In one embodiment, the container detection coil (2700) may be configured in the form of a pattern printed on the heating coil substrate sheet (11) together with the heating coil (2120). In one embodiment, the container detection coil (2700) may be printed on the uppermost layer of the heating coil substrate (10) that is closest to the top plate (5). In this case, the uppermost layer of the heating coil substrate (10) may be configured as a layer including only the container detection coil (2700) without the heating coil (2120). The processor (2200) of the induction heating device (2000) may detect whether the cooking vessel (101) is placed on the top plate (5) of the induction heating device (2000) through the container detection coil (2700).

[0143] The inverter substrate (30) may include a driving unit (2110). The driving unit (2110) may receive power from an input power source (2211) and supply current to a heating coil (2120) according to a driving control signal of a processor (2200). The driving unit (2110) may include, but is not limited to, an EMI (Electro Magnetic Interference) filter (2111), a rectifier circuit (2112), an inverter (2113), and a second connector (120). In one embodiment, the inverter substrate (30) may further include a resonant capacitor (2114).

[0144] The EMI filter (2111) blocks high-frequency noise contained in the AC power supplied from the input power source (2211) and can pass AC voltage and AC current of a predetermined frequency (e.g., 50 Hz or 60 Hz). A fuse and a relay for blocking overcurrent may be provided between the EMI filter (2111) and the input power source (2211). The AC power from which high-frequency noise has been blocked by the EMI filter (2111) is supplied to the rectifier circuit (2112).

[0145] The rectifier circuit (2112) can convert an AC voltage into a DC voltage. For example, the rectifier circuit (2112) can convert an AC voltage whose magnitude and polarity (positive voltage or negative voltage) change over time into a DC voltage whose magnitude and polarity are constant, and can convert an AC current whose magnitude and direction (positive current or negative current) change over time into a DC current whose polarity does not change over time. The rectifier circuit (2112) can include a diode as a rectification element. For example, the rectifier circuit (2112) can include four diodes. The diodes can convert an AC voltage whose polarity changes over time into a positive voltage whose polarity is constant, and can convert an AC current whose direction changes over time into a positive current whose direction is constant. The rectifier circuit (2112) can be connected to a DC link capacitor that smoothes the rectified DC voltage.

[0146] The inverter (2113) may include a switching circuit that supplies or blocks a driving current to the heating coil (2120). Resonance may occur between the heating coil (2120) and the resonant capacitor (2114) due to the switching operation of the switching circuit in the inverter (2113). In one embodiment, the resonant capacitor (2114) may be included in the inverter substrate (30) or the intermediate substrate (20). The switching circuit may include two switches for each burner, as illustrated in FIG. 12A. The first switch (2113_1) and the second switch (2113_2) illustrated in FIG. 12A may be turned on or off according to a driving control signal of the processor (2200). In one embodiment, the induction heating device (2000) may include a separate driving processor in addition to the processor (2200) to generate the driving control signal.

[0147] The inverter (2113) can control the current supplied to the heating coil (2120). For example, the magnitude and direction of the current flowing in the first heating coil (2120_1) can change depending on the turning on / off of the first switch (2113_1) and the second switch (2113_2) included in the inverter (2113). In addition, the magnitude and direction of the current flowing in the second heating coil (2120_2) can change depending on the turning on / off of another switch pair included in the inverter (2113). In this case, an alternating current can be supplied to the first heating coil (2120_1) and the second heating coil (2120_2).

[0148] When the induction heating device (2000) includes a plurality of heating coils (2120) - a first heating coil (2120_1), a second heating coil (2120_2), a third heating coil (2120_9), as in FIG. 18, the inverter substrate (30) may include a distribution circuit (not shown). The distribution circuit may include a plurality of switches that pass or block current supplied to the plurality of heating coils (2120), and the plurality of switches may be turned on or off according to a distribution control signal of the processor (2200).

[0149] The inverter substrate (30) may include a second connector (120) as a connector that can be connected to the intermediate substrate (20) between the substrates. The second connector (120) is connected to the first connector (110) of the intermediate substrate (20) to enable an electrical connection between the intermediate substrate (20) and the inverter substrate (30). Since the second connector (120) is a connector mounted on the inverter substrate (30), it may be referred to as an inverter substrate connector.

[0150] In an induction heating device (2000) according to one embodiment of the present disclosure, an intermediate substrate (20) may be positioned between a heating coil substrate (10) and an inverter substrate (30). The intermediate substrate (20) may be a first substrate when the inverter substrate (30) is a second substrate. According to one embodiment, the intermediate substrate (20) may include, but is not limited to, a processor (2200), a communication interface (2300), a memory (2500), a first connector (110), and a fourth connector (140). For example, the intermediate substrate (20) may further include a resonance capacitor (2114) such that the fourth connector (140) may be connected to the third connector (130) of the heating coil substrate (10) for resonance. Additionally, the components included in the intermediate substrate (20) can be electrically connected to the components included in the inverter substrate (30) by the first connector (110) being connected to the second connector (120) of the inverter substrate (30).

[0151] According to one embodiment, the intermediate substrate (20) may include a resonant capacitor (2114). Of course, this is one embodiment, and the resonant capacitor (2114) may also be included in the inverter substrate (30) according to design specifications. The resonant capacitor (2114) may induce an eddy current in the cooking vessel (101) placed on the top plate (5) of the induction heating device (2000) by resonating with the heating coil (2120) by switching of the inverter (2113). If there are multiple heating coils (2120), the number of resonant capacitors (2114) may be plural to correspond to the heating coils (2120). In order for the resonant capacitor (2114) to resonate with the heating coil (2120) of the heating coil substrate (10), an electrical connection between the two substrates is required, and the intermediate substrate (20) may include a fourth connector (140) connected to the third connector (130) of the heating coil substrate (10).

[0152] The processor (2200) of the intermediate substrate (20) can determine the switching frequency (turn-on / turn-off frequency) of the switching circuit included in the inverter (2113) based on the output strength (power level) of the induction heating device (2000). The processor (2200) can generate a driving control signal for turning the switching circuit on / off according to the determined switching frequency. The induction heating device (2000) can include a driving processor separate from the processor (2200) to control the operation of the driving unit (2110) including the inverter (2113) during the operation of the processor (2200).

[0153] The processor (2200) controls the overall operation of the induction heating device (2000).

[0154] The processor (2200) is a hardware device that controls the overall operation of the induction heating device (2000). The processor (2200) may include one processor or may include multiple processors. The processor (2200) according to one embodiment of the present disclosure may be a hardware processing circuit including at least one of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), an Accelerated Processing Unit (APU), a Many Integrated Core (MIC), a Digital Signal Processor (DSP), an integrated circuit, and a Neural Processing Unit (NPU). The processor (2200) may be implemented in the form of an integrated system-on-chip (SoC) including one or more electronic components. When the processor (2200) includes multiple processors, each processor may be implemented as a separate hardware (H / W). The processor (2200) may be expressed as a Microprocessor controller (MICOM), a Microprocessor unit (MPU), or a Micro Controller Unit (MCU). The processor (2200) according to one embodiment of the present disclosure is a hardware device that may be implemented as a single core processor or a multicore processor. The processor (2200) may control the driving unit (2110), the communication interface (2300), the user interface (2400), and the memory (2500) by executing programs stored in the memory (2500).

[0155] According to one embodiment of the present disclosure, the induction heating device (2000) may be equipped with an artificial intelligence (AI) processor. The AI ​​processor may be manufactured in the form of a dedicated hardware chip for artificial intelligence (AI), or may be manufactured as part of an existing general-purpose processor (e.g., CPU or application processor) or a graphics-only processor (e.g., GPU) and equipped in the induction heating device (2000).

[0156] The processor (2200) can establish a short-range wireless communication channel (e.g., a BLE communication channel) with the cooking vessel (101) through the communication interface (2300) when the unique identification information of the cooking vessel (101) is stored in the memory (2500).

[0157] The processor (2200) can perform asymmetric control between multiple heating coils (2120). In one embodiment, when the operating frequency of the first heating coil (2120_1) is f1 and the operating frequency of the second heating coil (2120_2) is f2 (f1 < f2), the processor (2200) can control the operating frequency of the second heating coil (2120_2) so that f2 = f1. At the same time, the processor (2200) can perform asymmetric control to set the turn-on / turn-off duty of the third switch (2113_3) and the fourth switch (2113_4) differently when the operating frequency is f1 so that the output from the burner corresponding to the second heating coil (2120_2) when the operating frequency of the second heating coil (2120_2) is f2 is the same as the output when the operating frequency of the second heating coil (2120_2) is f1.

[0158] The communication interface (2300) of the intermediate substrate (20) may include one or more components that enable communication between the induction heating device (2000) and the cooking vessel (101), the induction heating device (2000) and a server device (not shown), or the induction heating device (2000) and a user terminal (not shown). For example, the communication interface (2300) may include a short-range wireless communication interface (2310) and a long-range communication unit (2320). The short-range communication unit (2310) may include, but is not limited to, a Bluetooth communication unit, a BLE (Bluetooth Low Energy) communication unit, a near field communication interface, a WLAN (Wi-Fi) communication unit, a Zigbee communication unit, an IrDA (infrared Data Association) communication unit, a WFD (Wi-Fi Direct) communication unit, an UWB (Ultra Wideband) communication unit, an ANT+ communication unit, etc. The long-range communication unit (2320) may be used to communicate with a server device (not shown) when the cooking vessel (101) is remotely controlled by the server device in an IoT (Internet of Things) environment. The long-range communication unit (2320) may include the Internet, a computer network (e.g., LAN or WAN), and a mobile communication unit. The mobile communication unit transmits and receives a wireless signal with at least one of a base station, an external terminal, and a server on a mobile communication network. Here, the wireless signal may include various types of data, such as voice call signals, video call signals, or text / multimedia message transmission and reception. The mobile communication unit may include, but is not limited to, a 3G module, a 4G module, an LTE module, a 5G module, a 6G module, an NB-IoT module, an LTE-M module, etc.

[0159] The memory (2500) may store a program for the operation and control of the induction heating device (2000) of the processor (2200), and may store input / output data (e.g., unique identification information of the cooking vessel (101), variable identification information of the cooking vessel (101), multiple power transmission patterns, cooking progress information of the cooking vessel (101), material information of the cooking vessel (101), etc.). The memory (2500) may store a coded command regarding a switching operation for driving the inverter (2113). In addition, the memory (2500) may also store an artificial intelligence model.

[0160] The memory (2500) may include at least one type of storage medium among a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (e.g., SD or XD memory, etc.), a RAM (Random Access Memory), a SRAM (Static Random Access Memory), a ROM (Read-Only Memory), an EEPROM (Electrically Erasable Programmable Read-Only Memory), a PROM (Programmable Read-Only Memory), a magnetic memory, a magnetic disk, and an optical disk. In addition, the induction heating device (2000) may also operate a web storage or cloud server that performs a storage function on the Internet.

[0161] Fig. 19 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0162] The induction heating device (2000) of FIG. 19 differs from the induction heating device of FIG. 18 in that the resonant capacitor (2114) is located on the inverter substrate (30). Therefore, the heating coil substrate (10) including the heating coil (2120) resonating with the resonant capacitor (2114) needs to be connected to the inverter substrate (30) via a connector. In one embodiment, the heating coil substrate (10) can be electrically connected to the inverter substrate (30) by the coupling of the heating coil substrate connector (130) mounted on the heating coil substrate (10) with the first inverter substrate connector (120) mounted on the inverter substrate (30). All electrical connections between the heating coil substrate (10) and the inverter substrate (30) can be made by the coupling between the heating coil substrate connector (130) and the first inverter substrate connector (120). In one embodiment, the heating coil substrate connector (130) may be mounted vertically on the heating coil substrate (10), and the first inverter substrate connector (120) may also be mounted vertically on the inverter substrate (30).

[0163] In one embodiment, the heating coil substrate connector (130) can be coupled to the first inverter substrate connector (120) by passing through a hole in the intermediate substrate (20) if the intermediate substrate (20) is separate.

[0164] When the intermediate substrate (20) is separate from the inverter substrate (30), the intermediate substrate (20) can be electrically connected to the inverter substrate (30) by the intermediate substrate connector (150) mounted on the intermediate substrate (20) being coupled to the second inverter substrate connector (160) mounted on the inverter substrate (30).

[0165] All electrical connections between the intermediate substrate (20) and the inverter substrate (30) may be made by coupling between the intermediate substrate connector (150) and the second inverter substrate connector (160). In one embodiment, the intermediate substrate connector (150) may be mounted vertically to the intermediate substrate (20), and the second inverter substrate connector (160) may also be mounted vertically to the inverter substrate (30).

[0166] In one embodiment, the intermediate substrate (20) may be combined with the inverter substrate (30) to form a single substrate. In this case, the heating coil substrate (10) may be electrically connected to the single integrated inverter substrate by being coupled with the first inverter substrate connector (120) of the single integrated inverter substrate having the heating coil substrate connector (130).

[0167] One inverter substrate, in which an intermediate substrate (20) is integrated into an inverter substrate (30), may include a memory (2500) for storing a program for controlling the operation of an induction heating device (2000), a communication interface (2300), and a processor (2200) for controlling the induction heating device (2000) by driving the program stored in the memory. In addition, one integrated inverter substrate may further include a power converter for supplying power to the processor (2200) and the memory (2500).

[0168] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a heating coil substrate having a plurality of heating coil pattern layers laminated by printing a heating coil. According to one embodiment, the induction heating device may include an intermediate substrate including a resonant capacitor resonating with the heating coil so as to generate a magnetic field in the heating coil under the heating coil substrate. According to one embodiment, the induction heating device may include an inverter substrate including an inverter for switching to generate resonance. According to one embodiment, the intermediate substrate may further include a first connector, and the inverter substrate may further include a second connector. According to one embodiment, an electrical connection may be made between the intermediate substrate and the inverter substrate based on the first connector and the second connector being connected in a vertical direction.

[0169] According to one embodiment of the present disclosure, the heating coil substrate may include a third connector for electrically connecting to the intermediate substrate. According to one embodiment, the intermediate substrate may include a fourth connector for vertically connecting to the third connector. According to one embodiment, the heating coil substrate and the intermediate substrate may be electrically connected only by connecting the third connector and the fourth connector.

[0170] According to one embodiment of the present disclosure, a patterned heating coil included in a heating coil substrate resonates with a resonant capacitor of an intermediate substrate via a third connector.

[0171] According to one embodiment of the present disclosure, the third connector is mounted vertically on the lower surface of the heating coil substrate. According to one embodiment, the fourth connector is mounted vertically on the lower surface of the intermediate substrate.

[0172] According to one embodiment of the present disclosure, the third connector is mounted on the lower surface of the heating coil substrate. According to one embodiment, the fourth connector is mounted on the upper surface of the intermediate substrate.

[0173] According to one embodiment of the present disclosure, the third connector is a male connector mounted on the lower surface of the heating coil substrate, and the fourth connector is a female connector.

[0174] According to one embodiment of the present disclosure, the third connector is a female connector mounted on the lower surface of the heating coil substrate, and the fourth connector is a male connector.

[0175] According to one embodiment of the present disclosure, the first connector is a male connector mounted on a lower surface of the intermediate substrate, and the second connector is a female connector mounted on the inverter substrate.

[0176] According to one embodiment of the present disclosure, the first connector is a female connector mounted on a lower surface of the intermediate substrate, and the second connector is a male connector mounted on the inverter substrate.

[0177] According to one embodiment of the present disclosure, all electrical connections between the intermediate substrate and the inverter substrate are made solely by connecting the first connector and the second connector.

[0178] According to one embodiment of the present disclosure, a plurality of heating coil pattern layers are formed by stacking six or more pattern layers including an insulating layer, and an insulating layer is inserted between each heating coil pattern layer on which a heating coil is printed among the plurality of heating coil pattern layers.

[0179] According to one embodiment of the present disclosure, at least one heating coil pattern layer among a plurality of heating coil pattern layers included in the heating coil substrate may have a container detection coil printed thereon for detecting a cooking vessel.

[0180] According to one embodiment of the present disclosure, at least one heating coil pattern layer having a printed container detection coil may be a pattern layer closest to a top plate on which a cooking vessel is placed among a plurality of heating coil pattern layers.

[0181] According to one embodiment of the present disclosure, a temperature sensor for sensing the temperature of a cooking vessel placed on the top plate may be further included.

[0182] According to one embodiment of the present disclosure, the temperature sensor may be positioned vertically through the heating coil substrate.

[0183] According to one embodiment of the present disclosure, the temperature sensor may be connected to a temperature sensor connector having two lead wires mounted on at least one substrate of the heating coil substrate without wires.

[0184] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a heating coil substrate having a plurality of heating coil pattern layers laminated by printing a heating coil. According to one embodiment, the heating coil substrate may further include at least one heating coil substrate connector. According to one embodiment, the induction heating device may include a resonant capacitor resonating with the heating coil, and at least one first inverter substrate connector vertically connected to the at least one heating coil substrate connector. According to one embodiment, the induction heating device may include an inverter substrate including an inverter that generates resonance between the heating coil and the resonant capacitor. According to one embodiment, the heating coil substrate and the inverter substrate may be electrically connected only by connecting the at least one heating coil substrate connector and the at least one first inverter substrate connector.

[0185] According to one embodiment of the present disclosure, an intermediate substrate may further be provided between the heating coil substrate and the inverter substrate, the intermediate substrate including a memory storing a program for controlling the operation of the induction heating device and a processor for controlling the induction heating device by executing the program stored in the memory. According to one embodiment, the intermediate substrate may include a hole through which at least one heating coil substrate connector passes.

[0186] According to one embodiment of the present disclosure, the intermediate substrate may include at least one intermediate substrate connector for electrically connecting to the inverter substrate. According to one embodiment, the inverter substrate may further include at least one second inverter substrate connector vertically connected to the intermediate substrate connector. According to one embodiment, the intermediate substrate and the inverter substrate may be electrically connected only by connecting the at least one intermediate substrate connector and the at least one second inverter substrate connector.

[0187] According to one embodiment of the present disclosure, an inverter substrate may include a memory storing a program for controlling the operation of an induction heating device. According to one embodiment, the inverter substrate may include a processor for controlling the induction heating device by executing the stored program. According to one embodiment, the inverter substrate may include a power converter for supplying power to the processor and the memory.

[0188] A method according to an embodiment of the present disclosure may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the medium may be those specially designed and configured for the present disclosure or may be those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc.

[0189] Some embodiments of the present disclosure may also be implemented in the form of a recording medium containing computer-executable instructions, such as program modules, executed by a computer. Computer-readable media may be any available media that can be accessed by a computer, and include both volatile and nonvolatile media, removable and non-removable media. Furthermore, computer-readable media may include both computer storage media and communication media. Computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information, such as computer-readable instructions, data structures, program modules, or other data. Communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave, or other transport mechanism, and includes any information delivery media. Furthermore, some embodiments of the present disclosure may also be implemented as a computer program or computer program product containing computer-executable instructions, such as a computer program that is executed by a computer.

[0190] A device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory storage medium" simply means a tangible device that does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is permanently stored in the storage medium and cases where data is temporarily stored. For example, a "non-transitory storage medium" may include a buffer in which data is temporarily stored.

[0191] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable app) may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

Claims

1. A heating coil substrate (10) in which a plurality of heating coil pattern layers are laminated by printing a heating coil; An intermediate substrate (20) including a resonant capacitor that resonates with the heating coil so that a magnetic field is generated in the heating coil under the heating coil substrate; and Including an inverter substrate (30) including a switching inverter for generating the above resonance, The above intermediate substrate further includes a first connector (110), and the above inverter substrate further includes a second connector (120). An induction heating device (2000) in which an electrical connection is formed between the intermediate substrate and the inverter substrate based on the first connector (110) and the second connector (120) being connected in a vertical direction.

2. In paragraph 1, The above heating coil substrate includes a third connector for electrical connection with the intermediate substrate, The above intermediate substrate includes a fourth connector for vertically connecting with the third connector, An induction heating device in which the heating coil substrate and the intermediate substrate are electrically connected only by connecting the third connector and the fourth connector.

3. In paragraph 1 or 2, An induction heating device, wherein the patterned heating coil included in the heating coil substrate resonates with the resonant capacitor of the intermediate substrate through the third connector.

4. In paragraph 2, The third connector is mounted vertically on the lower surface of the heating coil substrate, and An induction heating device in which the fourth connector is mounted vertically on the lower surface of the intermediate substrate.

5. In paragraph 2, The above third connector is mounted on the lower surface of the heating coil substrate, and The above fourth connector is an induction heating device mounted on the upper surface of the intermediate substrate.

6. In any one of paragraphs 1 to 5, An induction heating device, wherein the third connector is a male connector mounted on the lower surface of the heating coil substrate, and the fourth connector is a female connector.

7. In any one of paragraphs 1 to 5, An induction heating device, wherein the third connector is a female connector mounted on the lower surface of the heating coil substrate, and the fourth connector is a male connector.

8. In any one of paragraphs 1 to 7, An induction heating device, wherein the first connector is a male connector mounted on the lower surface of the intermediate substrate, and the second connector is a female connector mounted on the inverter substrate.

9. In any one of paragraphs 1 to 7, An induction heating device, wherein the first connector is a female connector mounted on the lower surface of the intermediate substrate, and the second connector is a male connector mounted on the inverter substrate.

10. In any one of paragraphs 1 to 9, An induction heating device in which electrical connection between the intermediate substrate and the inverter substrate is entirely achieved by connecting only the first connector and the second connector.

11. In any one of paragraphs 1 to 10, The above plurality of heating coil pattern layers are formed by laminating six or more pattern layers including an insulating layer. An induction heating device, wherein an insulating layer is inserted between each of the plurality of heating coil pattern layers on which a heating coil is printed.

12. A heating coil substrate comprising a plurality of heating coil pattern layers laminated by printing a heating coil, wherein the heating coil substrate further comprises at least one heating coil substrate connector; and A resonant capacitor that resonates with the above heating coil, At least one first inverter substrate connector vertically connected to at least one heating coil substrate connector, and Including an inverter substrate including an inverter that generates resonance between the heating coil and the resonance capacitor, An induction heating device, wherein the heating coil substrate and the inverter substrate are electrically connected only by connection of the at least one heating coil substrate connector and the at least one first inverter substrate connector.

13. In paragraph 12, Further comprising an intermediate substrate between the heating coil substrate and the inverter substrate, the intermediate substrate including a memory storing a program for controlling the operation of the induction heating device and a processor for controlling the induction heating device by executing the program stored in the memory, An induction heating device, wherein the intermediate substrate includes a hole through which at least one heating coil substrate connector passes.

14. In paragraph 13, The above intermediate substrate includes at least one intermediate substrate connector for electrically connecting to the inverter substrate, The above inverter substrate further includes at least one second inverter substrate connector connected vertically with the intermediate substrate connector, An induction heating device in which the intermediate substrate and the inverter substrate are electrically connected only by connection of the at least one intermediate substrate connector and the at least one second inverter substrate connector.

15. In paragraph 12, The above inverter substrate, A memory storing a program for controlling the operation of the above induction heating device; A processor that controls the induction heating device by running the stored program, and An induction heating device further comprising a power converter for supplying power to the processor and the memory.

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