Optical module circuit board assembly and optical module

Abstract

The present application belongs to the technical field of photoelectric communications. Disclosed are an optical module circuit board assembly and an optical module. The optical module circuit board assembly comprises a multi-layer circuit board, the multi-layer circuit board having a first surface and a second surface which are arranged opposite to each other, an internal embedding cavity being formed in the multi-layer circuit board; an integrated circuit chip, the integrated circuit chip being embedded in the internal embedding cavity; a photoelectric chip, the photoelectric chip being a flip chip mounted on the first surface, and the photoelectric flip chip being electrically connected to the integrated circuit chip; and a heat conduction part, the heat conduction part being arranged in the multi-layer circuit board, the heat conduction part being located on the side of the integrated circuit chip facing away from the first surface, the heat conduction part being in contact with the integrated circuit chip, and the heat conduction part being at least partially exposed to the second surface. The present application helps to increase the integration density of the optical module circuit board assembly, reduce the impedance between the integrated circuit chip and the photoelectric chip, improve the high-frequency performance of the optical module circuit board assembly, and enhance the cooling effect on the optical module circuit board assembly by means of the heat conduction part.

Description

Optical module circuit board assembly and optical module

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 5, 2023, with application number 202322397902.0 and invention name “An optical module circuit board assembly and optical module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of optoelectronic communications, and specifically relates to an optical module circuit board assembly and an optical module. Background Art

[0003] With the development of the internet and artificial intelligence, optical communication speeds are rapidly increasing, and the speed of its core component, optical modules, is also increasing. Higher optical module speeds can be achieved by integrating more channels or by increasing the speed of each channel. Increasing the speed of each channel requires optoelectronic chips with corresponding speeds. Increasing the number of channels typically doubles the number of channels, but optical modules are constrained by standards and their dimensions cannot be changed. Doubling the number of components within a limited space poses significant challenges to circuit board layout and device placement, requiring solutions to address issues such as crosstalk between channels, high power consumption, and increased heat dissipation. Furthermore, both increasing the number of channels and increasing the speed of each channel place higher demands on the high-frequency performance of the circuitry.

[0004] In addition, to eliminate the power consumption and cost impact of digital signal processing (DSP) chips on optical modules, a solution has emerged to offload digital signal processing chips. This means that optical modules no longer use DSP chips, leaving only linear drivers (DRVs) and trans-impedance amplifiers (TIAs). This solution places higher demands on the high-frequency performance of circuit boards. Utility Model Content

[0005] Purpose of the utility model: The embodiment of the present application provides an optical module circuit board assembly, aiming to solve at least one of the above-mentioned technical problems; the embodiment of the present application also provides an optical module using the above-mentioned optical module circuit board assembly.

[0006] Technical solution: The optical module circuit board assembly described in the embodiment of the present application includes:

[0007] A multilayer circuit board having a first surface and a second surface disposed opposite to each other, and an internal buried cavity is provided in the multilayer circuit board;

[0008] an integrated circuit chip, wherein the integrated circuit chip is embedded in the internal embedding cavity;

[0009] an optoelectronic chip, the optoelectronic chip being flip-chip mounted on the first surface and electrically connected to the integrated circuit chip via the flip-chip;

[0010] A heat conducting portion is provided in the multilayer circuit board and is located on a side of the integrated circuit chip away from the first surface. The heat conducting portion contacts the integrated circuit chip and is at least partially exposed on the second surface.

[0011] In some embodiments, the integrated circuit chip includes a transimpedance amplifier chip, the optoelectronic chip includes a photodetector chip, and the photodetector chip is flip-chip mounted on the first surface relative to the transimpedance amplifier chip.

[0012] In some embodiments, the integrated circuit chip includes a laser driver chip, the optoelectronic chip includes a laser chip, and the laser chip is flip-chip mounted on the first surface relative to the laser driver chip.

[0013] In some embodiments, the integrated circuit chip includes a driver chip, the optoelectronic chip includes a photonic integrated chip, and the photonic integrated chip is flip-chip mounted on the first surface relative to the driver chip.

[0014] In some embodiments, the heat conducting portion includes a heat conducting metal block, which is embedded in the multilayer circuit board and thermally connected to the integrated circuit chip, and the side of the heat conducting metal block facing away from the integrated circuit chip is exposed on the second surface.

[0015] In some embodiments, the heat-conducting portion includes a laser-stacked hole provided in the multilayer circuit board and a heat-conducting layer provided on the second surface. The laser-stacked hole penetrates the second surface, and the laser-stacked hole is filled with a heat-conducting material. The heat-conducting material is heat-conductingly connected to the heat-conducting layer.

[0016] In some embodiments, a conductive via is provided in the multilayer circuit board between the integrated circuit chip and the optoelectronic chip, the integrated circuit chip is electrically connected to the optoelectronic chip through the conductive via, and the dimension of the conductive via of the optical module circuit board assembly in a direction perpendicular to the first surface is D, and satisfies D≤40μm.

[0017] In some embodiments, the multilayer circuit board is provided with an electrical connection portion for electrically connecting to an external device, and the electrical connection portion is electrically connected to the integrated circuit chip.

[0018] Accordingly, an optical module according to an embodiment of the present application includes the above-mentioned optical module circuit board assembly, and further includes:

[0019] A housing, wherein the housing has a placement cavity, and the optical module circuit board assembly is arranged in the placement cavity;

[0020] an optical path processing unit, the optical path processing unit being disposed in the placement cavity and having one end optically coupled to the optoelectronic chip;

[0021] An optical interface is provided at one end of the placement cavity, and the other end of the optical path processing unit is optically coupled to the optical interface, and the optical interface is used to transmit optical signals between the optical path processing unit and the outside of the optical module.

[0022] In some embodiments, the optical path processing unit includes:

[0023] a lens assembly, the lens assembly being disposed on one side of the first surface of the multilayer circuit board and optically coupled to the optoelectronic chip;

[0024] An optical fiber optically connects the optical interface and the lens assembly to transmit an optical signal between the lens assembly and the optical interface.

[0025] Beneficial effects: By burying the integrated circuit chip in the multi-layer circuit board, it is beneficial to reduce the surface layout area of ​​the multi-layer circuit board occupied by the integrated circuit chip, freeing up more layout space for the multi-layer circuit board, and facilitating the integration of more channel lines on the multi-layer circuit board to achieve a higher-speed optical module; in addition, the optoelectronic chip is flip-chip mounted on the first surface and electrically connected to the integrated circuit chip, which can form a shorter electrical connection between the optoelectronic chip and the integrated circuit chip, thereby helping to reduce the impedance between the integrated circuit chip and the optoelectronic chip, and improving the high-frequency performance of the optical module circuit board assembly. At the same time, a heat-conducting portion is provided between the integrated circuit chip and the surface of the multi-layer circuit board to improve the heat dissipation effect of the optical module circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0027] FIG1 is a schematic structural diagram of an optical module circuit board assembly according to Example 1 of the present application;

[0028] FIG2 is a schematic structural diagram of the optical module circuit board assembly facing the first surface in accordance with Example 1 of the present application;

[0029] FIG3 is a schematic structural diagram of an optical module according to Example 1 of the present application;

[0030] FIG4 is a schematic diagram of the exploded structure of the optical module according to Example 1 of the present application;

[0031] FIG5 is a schematic structural diagram of the optical fiber connector according to embodiment 1 of the present application viewed from the front along the length direction;

[0032] FIG6 is a schematic cross-sectional view of the structure along line AA in FIG5 ;

[0033] FIG7 is a partial enlarged view of portion B in FIG6;

[0034] FIG8 is a schematic structural diagram of an optical module circuit board assembly according to Example 2 of the present application;

[0035] FIG9 is a schematic structural diagram of the optical module circuit board assembly facing the first surface according to Example 2 of the present application;

[0036] FIG10 is a schematic structural diagram of a circuit board assembly of an optical module according to Example 3 of the present application;

[0037] FIG11 is a schematic structural diagram of the laser chip moved outward in Example 3 of the present application.

[0038] Figure numerals: 1. optical module circuit board assembly; 10. multi-layer circuit board; 100. internal buried cavity; 101. first surface; 102. second surface; 103. conductive via; 104. conductive circuit; 11. integrated circuit chip; 110. transimpedance amplifier chip; 111. laser driver chip; 112. driver chip; 12. optoelectronic chip; 120. photodetector chip; 121. laser chip; 122. photonic integrated chip; 13. filling glue; 14. heat conduction part; 140. heat conduction metal block; 141. laser stacking hole; 142. heat conduction material; 143. heat conduction layer; 15. electrical connection part; 16. lens assembly; 17. optical fiber; 18. optical fiber connector; 19. heat conduction pad; 2. shell; 20. placement cavity; 21. first shell; 22. second shell; 23. pull ring; 24. optical interface; X, thickness direction; Y, length direction; Z, width direction. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0040] In the description of this application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they cannot be understood as limiting this application. In the description of this application, "plurality" means two or more, and at least one means one, two, or more than two, unless otherwise clearly and specifically defined.

[0041] An embodiment of the present application discloses an optical module circuit board assembly.

[0042] Example 1

[0043] 1 and 2 , the optical module circuit board assembly 1 has a thickness direction X, a length direction Y, and a width direction Z. The optical module circuit board assembly 1 includes a multilayer circuit board 10. In this embodiment, the thickness direction X is parallel to the thickness direction X of the multilayer circuit board 10, the length direction Y is parallel to the extension direction of the longer side of the multilayer circuit board 10 as shown in FIG1 , and the width direction Z is parallel to the extension direction of the shorter side of the multilayer circuit board 10 as shown in FIG1 .

[0044] An internal embedded cavity 100 is provided within the multilayer circuit board 10. The multilayer circuit board 10 has a first surface 101 and a second surface 102 that are oppositely disposed in the thickness direction X. An integrated circuit chip 11 is embedded within the internal embedded cavity 100. An optoelectronic chip 12 is flip-chip mounted on the first surface 101. The optoelectronic chip 12 is electrically connected to the integrated circuit chip 11 via a flip-chip arrangement. In addition, a heat conducting portion 14 is provided within the multilayer circuit board 10 on a side of the integrated circuit chip 11 that faces away from the first surface 101. The heat conducting portion 14 contacts the integrated circuit chip 11, and the heat conducting portion 14 is at least partially exposed on the second surface 102.

[0045] It should be noted that, in this embodiment, the digital signal processing chip (DSP) is externalized as an example, that is, the digital signal processing chip (DSP) is not set in the multi-layer circuit board 10. In other embodiments, the digital signal processing chip (DSP) can also be set on the multi-layer circuit.

[0046] By burying the integrated circuit chip 11 in the multi-layer circuit board 10, it is beneficial to reduce the surface layout area of ​​the multi-layer circuit board 10 occupied by the integrated circuit chip 11, freeing up more layout space for the multi-layer circuit board 10, and facilitating the integration of more channel circuits on the multi-layer circuit board 10 to achieve a higher-speed optical module; in addition, the optoelectronic chip 12 is flip-chip mounted on the first surface 101 and electrically connected to the integrated circuit chip 11, so that a shorter electrical connection can be formed between the optoelectronic chip 12 and the integrated circuit chip 11, thereby helping to reduce the impedance between the integrated circuit chip 11 and the optoelectronic chip 12, and improve the high-frequency performance of the optical module circuit board assembly 1. At the same time, a heat conducting portion 14 is provided between the integrated circuit chip 11 and the surface of the multi-layer circuit board 10 to improve the heat dissipation effect of the optical module circuit board assembly 1.

[0047] In some embodiments, referring to FIG. 1 and FIG. 2 , the integrated circuit chip 11 includes a transimpedance amplifier chip 110 (TIA), and the optoelectronic chip 12 includes a photodetector chip 120 (PD). The photodetector chip 120 is flip-chip mounted on the first surface 101 relative to the transimpedance amplifier chip 110 .

[0048] 1 and 2 , in some embodiments, the integrated circuit chip 11 includes a laser driver chip 111 (DRV), and the optoelectronic chip 12 includes a laser chip 121 (LD). The laser chip 121 is flip-chip mounted on the first surface 101 relative to the laser driver chip 111 .

[0049] It should be noted that, in this embodiment, the integrated circuit chip 11 within the multilayer circuit board 10 includes a transimpedance amplifier chip 110 and a laser driver chip 111, which are embedded in the internal embedded cavity 100 of the multilayer circuit board 10. Correspondingly, the optoelectronic chip 12 on the first surface 101 includes a photodetector chip 120 and a laser chip 121, wherein the photodetector chip 120 is electrically connected to the transimpedance amplifier chip 110, and the laser driver chip 111 is electrically connected to the laser chip 121. It is understandable that the optoelectronic chip 12 on the multilayer circuit board 10 can be one or a combination of the photodetector chip 120 and the laser chip 121, and the corresponding integrated circuit chip 11 can be one or a combination of the transimpedance amplifier chip 110 and the laser driver chip 111, and can be flexibly configured to meet the functional requirements of the multilayer circuit board 10.

[0050] 1 and 2 , in this embodiment, the laser chip 121 and the photodetector chip 120 are spaced apart in sequence along the width direction Z. On the first surface 101, a lens is provided outside the laser chip 121 and the photodetector chip 120 to couple light. Because the laser driver chip 111 and the transimpedance amplifier chip 110 are both embedded within the multilayer circuit board 10, the lens structure only needs to cover the outside of the laser chip 121 and the photodetector chip 120. Compared to the existing solution in which the laser driver chip 111 and the transimpedance amplifier chip 110 are attached to the first surface 101, the solution of this embodiment reduces the size of the lens, thereby reducing the surface area occupied by the multilayer circuit board 10, which helps to leave more wiring space.

[0051] In order to further shorten the connection distance between the optoelectronic chip 12 and the transimpedance amplifier chip 110 and the laser driver chip 111, in some embodiments, referring to Figures 1 and 2, the laser chip 121 is flipped on the first surface of the multilayer circuit board relative to the laser driver chip 111 in the thickness direction X, and the photodetector chip 120 is flipped on the first surface 101 of the multilayer circuit board 10 relative to the transimpedance amplifier chip 110 in the thickness direction X. The electrodes of the transimpedance amplifier chip 110 and the laser driver chip 111 face the first surface 101. Conductive vias 103 are provided in the multilayer circuit board 10 between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120. The laser driver chip 111 and the laser chip 121, and the transimpedance amplifier chip 110 and the photodetector chip 120 are electrically connected through the conductive vias 103. That is, the conductive vias 103 lead the electrodes of the laser driver chip 111 and the transimpedance amplifier chip 110 to the first surface 101 and weld the corresponding pins of the laser chip 121 and the photodetector chip 120, so that there is a shortest conductive path between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120. In addition, a filling glue 13 is provided between the laser chip 121, the photodetector chip 120 and the first surface 101 of the multilayer circuit board 10 to protect the flip-chip pins and solder joints of the laser chip 121 and the photodetector chip 120 and to provide insulation protection.

[0052] Furthermore, after the laser driver chip 111 and the transimpedance amplifier 110 are embedded, the conductive vias 103 between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120, only need to pass through the circuit board stack between the internal embedded cavity 100 and the first surface 101. Compared to vias that pass through the entire first surface 101 and second surface 102 of the multilayer circuit board 10, the conductive vias 103 of this embodiment are shorter, and their dimension D in the thickness direction X satisfies D≤40μm. That is, within the multilayer circuit board 10 of the optical module, the length of the conductive vias 103 between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120 can be shortened to 40μm or less. Furthermore, in some embodiments, the size value of D can be controlled between 30μm and 40μm, that is, D can be any one of 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm or a range value composed of any two of them.

[0053] In addition, it should be noted that, referring to FIG. 1 , in addition to the conductive vias 103 , the multilayer circuit board 10 also needs to arrange conductive circuits 104 on each layer to cooperate with the conductive vias 103 to achieve electrical connection between various parts, which will not be described in detail here.

[0054] In some embodiments, referring to Figures 1 and 2, the heat-conducting portion 14 includes a heat-conducting metal block 140. The heat-conducting metal block 140 can be a heat-conducting copper block or a tungsten-copper alloy block. The heat-conducting metal block 140 is attached to the bottom large surface of the laser driver chip 111. In some embodiments, the heat-conducting metal block 140 can also be attached to the laser driver chip 111 and the transimpedance amplifier chip 110 at the same time. The surface of the heat-conducting metal block 140 facing away from the laser driver chip 111 is exposed to the second surface 102, which is conducive to quickly conducting heat to the optical module housing, thereby improving the heat dissipation effect and performance of the transimpedance amplifier chip 110 and the laser driver chip 111.

[0055] In some embodiments, multilayer circuit board 10 further includes an electrical connection portion 15 at one end in the length direction Y. Electrical connection portion 15 is used to electrically connect to an external device. In this embodiment, electrical connection portion 15 utilizes a gold finger, which may be located on first surface 101 and second surface 102. In other embodiments, electrical connection portion 15 may utilize an electrical contact pad. Laser driver chip 111 and transimpedance amplifier chip 110 are electrically connected to the gold finger via conductive traces 104 and conductive vias 103 within multilayer circuit board 10, and are then electrically connected to external devices such as servers and switches through the gold finger.

[0056] The implementation principle of Example 1 is:

[0057] An internal embedding cavity 100 is provided on the layer of the multilayer circuit board 10 where the laser driver chip 111 and the transimpedance amplifier chip 110 are to be embedded, and the laser driver chip 111 and the transimpedance amplifier chip 110 are embedded therein. A heat conducting portion 14 is provided on the layer where the heat conducting portion 14 is to be embedded therein.

[0058] Add more layers of the multilayer circuit board 10 as needed and press them together so that the heat conducting portion 14 is attached to the bottom large surface of the laser driver chip 111 and the transimpedance amplifier chip 110;

[0059] The pad positioning information of the embedded laser driver chip 111 and the transimpedance amplifier chip 110 can be captured by lithography technology, and then holes can be punched into the laser driver chip 111 and the transimpedance amplifier chip 110 to form conductive vias 103, that is, the electrodes of the laser driver chip 111 and the transimpedance amplifier chip 110 are led to the first surface 101 through the conductive vias 103;

[0060] The laser chip 121 and the photodetector chip 120 are flip-chip bonded on the first surface 101 , thereby electrically connecting the laser driver chip 111 and the transimpedance amplifier chip 110 through the conductive vias 103 to form a short-distance high-speed interconnection.

[0061] Correspondingly, an embodiment of the present application also discloses an optical module.

[0062] 1 to 7 , the optical module includes the optical module circuit board assembly 1 described above, a housing 2 , an optical processing unit, and an optical interface 24 . The housing 2 has a placement cavity 20 , and the optical module circuit board assembly 1 is disposed in the placement cavity 20 .

[0063] Specifically, referring to Figures 3 and 4 , the housing 2 is a split structure, comprising a first shell 21 and a second shell 22 arranged sequentially from bottom to top in the thickness direction X. The first shell 21 and the second shell 22 are arranged relative to each other to form a receiving cavity 20. Furthermore, a pull ring 23 is provided on the side of the first shell 21 away from the electrical connection portion 15 in the length direction Y, connecting the first shell 21 to facilitate insertion and removal of the entire optical module.

[0064] The optical processing unit is located within the housing cavity 20 of the housing 2. One end of the unit is optically coupled to the optoelectronic chip 12, and the other end is optically coupled to an optical interface 24. Optical interface 24 is located on the side of the optical processing unit facing away from the electrical connection portion 15. It is located at one end of the housing cavity 20 of the housing 2 and is used to transmit optical signals between the optical processing unit and the outside of the optical module.

[0065] Specifically, in some embodiments, referring to Figures 4, 6, and 7, the optical path processing unit includes a lens assembly 16 and an optical fiber 17. The lens assembly 16 is disposed on the first surface 101 of the multilayer circuit board 10 and optically coupled to the optoelectronic chip 12. It should be noted that in this embodiment, the optoelectronic chip 12 includes a plurality of arrayed photodetector chips 120 and a plurality of arrayed laser chips 121. Correspondingly, the lens assembly 16 includes a plurality of lenses corresponding one-to-one to the plurality of arrayed photodetector chips 120, and a plurality of lenses corresponding one-to-one to the plurality of arrayed laser chips 121. Similarly, a plurality of optical fibers 17 are also provided and arranged in a corresponding array to optically couple with the plurality of arrayed photodetector chips 120 and the plurality of arrayed laser chips 121 through the lens assembly 16. The other end of the optical fiber 17 is optically connected to the optical interface 24 via the optical fiber connector 18. The principle of optical module signal transmission is prior art and will not be described in detail here.

[0066] Furthermore, it should be noted that, in other embodiments, the optical fiber 17 can also be replaced with a wavelength division multiplexer / demultiplexer, and the lens assembly 16 is disposed between the wavelength division multiplexer / demultiplexer and the optoelectronic chip 12 to provide optical coupling between the wavelength division multiplexer / demultiplexer and the optoelectronic chip 12. The multiple optical signals emitted by the plurality of arrayed laser chips 121 are multiplexed and then output, and the received external composite optical signals are demultiplexed and then coupled to the respective photodetector chips 120 disposed in the array. The plurality of arrayed laser chips 121 and the plurality of arrayed photodetector chips 120 can be an array arrangement of a plurality of laser chips 121 and an array arrangement of a plurality of photodetector chips 120, or a laser array chip and a photodetector array chip, i.e., a plurality of lasers are arrayed on a single chip and a plurality of photodetectors are arrayed on a single chip.

[0067] The specific working process is as follows: the electrical connection part 15 (such as a gold finger) receives an external instruction and transmits it to the laser driver chip 111. The laser driver chip 111 drives the laser chip 121 to work and emit an optical signal. The optical signal is coupled to the optical fiber 17 through the lens assembly 16. The optical fiber 17 is coupled to the optical interface 24 through the optical fiber connector 18. The optical signal is transmitted to the external transmission optical fiber through the optical interface 24.

[0068] The external transmission optical fiber transmits the optical signal transmitted from the remote end through the optical interface 24 to the optical fiber connector 18 and the optical fiber 17. The optical signal is then coupled to the photodetector chip 120 through the lens assembly 16. The photodetector chip 120 converts the received optical signal into an electrical signal and transmits it to the transimpedance amplifier chip 110. After amplification by the transimpedance amplifier chip 110, the signal is transmitted to the electrical connection part 15 through the conductive line 104 and the conductive via 103 of the multi-layer circuit board 10, and is uploaded to an external device such as a server or switch by the gold finger.

[0069] Example 2

[0070] 8 and 9 , this embodiment differs from Embodiment 1 in that the optoelectronic chip 12 includes a photonic integrated circuit (PIC) 122 , and the integrated circuit chip 11 includes a driver chip 112 for driving the PIC. The photonic integrated circuit 122 has a wide bandwidth and low energy loss, fast data transmission speed, and is compact and low-cost.

[0071] It should be noted that the photonic integrated chip 122 integrates an optical modulator, and therefore the photonic integrated chip 122 needs to be electrically connected to the driver chip 112 so that the driver chip 112 drives the photonic integrated chip 122 .

[0072] In some embodiments, the photodetector can be integrated into the photonic integrated chip 122, as shown in FIG9 . In this case, the photonic integrated chip 122 also needs to be electrically connected to the transimpedance amplifier chip 110. The optical signal received by the optical fiber 17 of the array from the remote end is coupled into the photonic integrated chip 122 and transmitted to the photodetector portion of the photonic integrated chip 122. The photodetector portion of the photonic integrated chip 122 converts the signal into an electrical signal and then transmits it to the transimpedance amplifier chip 110. In other embodiments, the photodetector chip 120 can also be independently provided and electrically connected to the transimpedance amplifier chip 110, and the photonic integrated chip 122 only needs to be electrically connected to the driver chip 112. The optical signal emitted by the laser chip 121 is coupled into the photonic integrated chip 122, modulated by the photonic integrated chip 122, and then coupled into the optical fiber 17. The optical signal is transmitted to the optical interface 24 via the optical fiber 17 and outputted by the optical interface 24.

[0073] The photonic integrated chip 122 is flip-chip mounted on the first surface 101 of the multi-layer circuit board 10 and is opposite to the integrated circuit chip 11 (such as the driver chip 112) in the thickness direction X. The photonic integrated chip 122 is electrically connected to the driver chip 112 through the conductive via 103, thereby shortening the transmission line of the high-speed signal and improving the high-frequency performance of the optical module circuit board assembly 1.

[0074] Example 3

[0075] 10 , the difference between this embodiment and embodiment 1 is that the heat conducting portion 14 includes a laser stacked hole 141 provided in the multilayer circuit board 10 and a heat conducting layer 143 provided on the second surface 102. The laser stacked hole 141 is located on the side of the integrated circuit chip 11 away from the first surface 101, and the laser stacked hole 141 extends in the thickness direction X and penetrates the second surface 102. The laser stacked hole 141 is filled with a heat conducting material 142, and the heat conducting material 142 is heat-conductingly connected to the heat conducting layer 143. It should be noted that both the heat conducting material 142 and the heat conducting layer 143 can be made of metal heat conducting materials.

[0076] To improve the heat dissipation effect of the laser stacked vias 141 , the arrangement density of the laser stacked vias 141 relative to the integrated circuit chip 11 can be increased, that is, the contact area between the laser stacked vias 141 and the thermal conductive material 142 therein and the integrated circuit chip 11 can be increased.

[0077] In addition, referring to FIG11 , in some embodiments, the laser chip 121 can be removed from the multilayer circuit board 10 and electrically connected to the integrated circuit chip 11 within the multilayer circuit board 10 via bonding wires, leaving only the photodetector chip 120 flip-chip soldered to the first surface 101 of the multilayer circuit board, or the photonic integrated chip 122 flip-chip mounted on the first surface 101 of the multilayer circuit board 10. The optical signal emitted by the laser chip 121 is coupled into the photonic integrated chip 122, modulated by the photonic integrated chip 122, and then coupled into the optical fiber 17. The optical signal is transmitted via the optical fiber 17 to the optical interface 24 and outputted from the optical interface 24. A thermal pad 19 is provided below the laser chip 121 to improve the heat dissipation effect of the laser chip 121.

[0078] The above is a detailed introduction to an optical module circuit board assembly and an optical module provided in the embodiments of the present application, and specific examples are used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module circuit board assembly (1), characterized in that: include: A multilayer circuit board (10), the multilayer circuit board (10) having a first surface (101) and a second surface (102) arranged opposite to each other, and an internal buried cavity (100) is provided in the multilayer circuit board (10); An integrated circuit chip (11), the integrated circuit chip (11) being embedded in the internal embedding cavity (100); an optoelectronic chip (12), the optoelectronic chip (12) being flip-mounted on the first surface (101), and the optoelectronic chip (12) being electrically connected to the integrated circuit chip (11) through the flip-mounting; A heat conducting portion (14), the heat conducting portion (14) being arranged in the multilayer circuit board (10), and the heat conducting portion (14) being located on a side of the integrated circuit chip (11) facing away from the first surface (101), the heat conducting portion (14) being in contact with the integrated circuit chip (11), and the heat conducting portion (14) being at least partially exposed on the second surface (102).

2. The optical module circuit board assembly (1) according to claim 1, characterized in that: The integrated circuit chip (11) comprises a transimpedance amplifier chip (110), and the optoelectronic chip (12) comprises a photodetector chip (120). The photodetector chip (120) is flip-mounted on the first surface (101) relative to the transimpedance amplifier chip (110).

3. The optical module circuit board assembly (1) according to claim 1 or 2, characterized in that: The integrated circuit chip (11) comprises a laser driver chip (111), the optoelectronic chip (12) comprises a laser chip (121), and the laser chip (121) is flip-mounted on the first surface (101) relative to the laser driver chip (111).

4. The optical module circuit board assembly (1) according to claim 1, characterized in that: The integrated circuit chip (11) comprises a driver chip (112), the optoelectronic chip (12) comprises a photon integrated chip (122), and the photon integrated chip (122) is flip-mounted on the first surface (101) relative to the driver chip (112).

5. The optical module circuit board assembly (1) according to claim 1, characterized in that: The heat-conducting portion (14) comprises a heat-conducting metal block (140), the heat-conducting metal block (140) being embedded in the multi-layer circuit board (10) and heat-conductingly connected to the integrated circuit chip (11), and a side of the heat-conducting metal block (140) facing away from the integrated circuit chip (11) is exposed on the second surface (102).

6. The optical module circuit board assembly (1) according to claim 1, characterized in that: The heat conducting part (14) comprises a laser stacked hole (141) provided in the multilayer circuit board (10) and a heat conducting layer (143) provided on the second surface (102); the laser stacked hole (141) penetrates the second surface (102), and the laser stacked hole (141) is filled with a heat conducting material (142); the heat conducting material (142) is heat-conductingly connected to the heat conducting layer (143).

7. The optical module circuit board assembly (1) according to claim 1, characterized in that: A conductive via (103) is provided in the multilayer circuit board (10) between the integrated circuit chip (11) and the optoelectronic chip (12); the integrated circuit chip (11) is electrically connected to the optoelectronic chip (12) via the conductive via (103); a dimension of the conductive via (103) in a direction perpendicular to the first surface (101) is D, and satisfies D≤40 μm.

8. The optical module circuit board assembly (1) according to claim 1, characterized in that: The multilayer circuit board (10) is provided with an electrical connection portion (15) for electrically connecting to an external device, and the electrical connection portion (15) is electrically connected to the integrated circuit chip (11).

9. An optical module, characterized in that: The optical module circuit board assembly (1) according to any one of claims 1 to 8 further comprises: A housing (2), the housing (2) having a placement cavity (20), the optical module circuit board assembly (1) being arranged in the placement cavity (20); an optical path processing unit, the optical path processing unit being arranged in the placement cavity (20) and having one end optically coupled to the optoelectronic chip (12); An optical interface (24), the optical interface (24) being arranged at one end of the placement cavity (20), and the other end of the optical path processing unit being optically coupled to the optical interface (24), the optical interface (24) being used to transmit optical signals between the optical path processing unit and the outside of the optical module.

10. The optical module according to claim 9, characterized in that: The optical path processing unit comprises: A lens assembly (16), the lens assembly (16) being disposed on one side of the first surface (101) of the multilayer circuit board (10) and optically coupled to the optoelectronic chip (12); An optical fiber (17), wherein the optical fiber (17) optically connects the optical interface (24) and the lens assembly (16), and transmits an optical signal between the lens assembly (16) and the optical interface (24).

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