Flexible printed circuit assembly and battery pack

Abstract

Provided in the present application are a flexible printed circuit assembly and a battery pack. The flexible printed circuit assembly is used for connecting battery cells and a BMS board in a battery module. The flexible printed circuit assembly comprises a flexible printed circuit and a buffer member. One end of the flexible printed circuit is connected to the battery cells located on a first wall surface of the battery module, and the other end of the flexible printed circuit is connected to the BMS board located on a second wall surface of the battery module. The buffer member is arranged between the flexible printed circuit and the battery module, and supports the flexible printed circuit. The buffer member capable of supporting the flexible printed circuit is arranged between the flexible printed circuit and the battery module, such that when the flexible printed circuit undergoes a pulling force, the buffer member can extend and retract to be deformed, thereby providing an effect of protecting the flexible printed circuit.

Description

Flexible circuit board assemblies and battery packs Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a flexible circuit board assembly and a battery pack.

[0002] Background of the Invention

[0003] In current consumer batteries, flexible printed circuits (FPCs) are used in battery packs to connect the battery management system (BMS) board and the battery cells. The FPCs transmit information such as the battery cell's temperature and pressure to the BMS board, enabling the BMS board to detect and protect the battery cells. Generally, the BMS board's connection terminals and the battery cell's connection terminals are located on opposite sides of the battery pack. The FPCs need to be bent to connect the BMS board and the battery cells. However, vibrations and impacts may occur during use of the battery pack, potentially causing the FPCs to tear at the bends due to stress.

[0004] Summary of the Invention

[0005] In view of this, the present application provides a flexible circuit board assembly that solves the problem of the bending position of the flexible circuit board being torn due to stress. The present application also provides a battery pack including the above-mentioned flexible circuit board assembly.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A flexible circuit board assembly for connecting battery cells and a battery management system (BMS) board in a battery module. The assembly includes a flexible circuit board, one end of which is connected to the battery cells located on a first wall of the battery module, and the other end of which is connected to the BMS board located on a second wall of the battery module; and a buffer disposed between the flexible circuit board and the battery module to support the flexible circuit board.

[0008] Preferably, the flexible circuit board assembly further comprises a support member connected to the battery module and used to support the flexible circuit board, and the buffer member is arranged between the flexible circuit board and the support member.

[0009] Preferably, the buffer component is bonded to the flexible circuit board and to the support component.

[0010] Preferably, the support member is an L-shaped plate, the long side of the L-shaped plate is located on the first wall surface, and the short side of the L-shaped plate is located on the second wall surface.

[0011] Preferably, the support member is provided with a groove for accommodating the buffer member.

[0012] Preferably, the buffer member is arranged between the flexible circuit board and the BMS board.

[0013] Preferably, a groove for accommodating the buffer member is provided on the BMS board.

[0014] Preferably, the buffer member is provided on the first wall surface and / or the second wall surface.

[0015] Preferably, the buffer component is at least one of EVA foam, PU foam or silicone foam.

[0016] Preferably, the compression coefficient of the buffer is greater than 0 and less than or equal to 25%.

[0017] Preferably, the width of the buffer is M, and the width of the position where the flexible circuit board abuts the buffer is N, wherein 0.8N≤M≤1.2N.

[0018] Preferably, the buffer member has a thickness D, wherein 2.5 mm ≤ D ≤ 3.5 mm.

[0019] A battery pack comprises the flexible circuit board assembly described in any one of the above items and the battery module.

[0020] Preferably, the battery pack further includes a copper busbar, the battery module includes a busbar, the copper busbar is respectively connected to the busbar and the BMS board, and the copper busbar is vertically arranged on the BMS board.

[0021] Preferably, the busbar includes a first busbar and a second busbar, the copper busbar includes a first copper busbar and a second copper busbar, the positive pole of the battery cell is connected to the first copper busbar through the first busbar to converge the positive current to the BMS board, and the negative pole of the battery cell is connected to the second copper busbar through the second busbar to converge the negative current to the BMS board.

[0022] The present application provides a flexible circuit board assembly for connecting the battery cells and the BMS board in the battery module, including a flexible circuit board and a buffer. One end of the flexible circuit board is connected to the battery cells located on the first wall of the battery module, and the other end is connected to the BMS board located on the second wall of the battery module. The buffer is arranged between the flexible circuit board and the battery module and supports the flexible circuit board. Since the flexible circuit board usually connects the BMS board and the battery cells located on the two walls, the flexible circuit board needs to be bent. When vibration and impact occur during the use of the battery pack, the bent flexible circuit board may be pulled. By arranging a buffer that can support the flexible circuit board between the flexible circuit board and the battery module, the buffer can expand and contract when the flexible circuit board is subjected to pulling force, thereby protecting the flexible circuit board.

[0023] BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0025] FIG1 is a three-dimensional diagram of a battery pack provided in accordance with an embodiment of the present application.

[0026] FIG2 is a front view of a battery pack provided in accordance with an embodiment of the present application.

[0027] FIG3 is a cross-sectional view taken along line AA of FIG2 .

[0028] FIG4 is a partial enlarged view of FIG3 .

[0029] In Figures 1 to 4:

[0030] 1-battery module, 2-flexible circuit board assembly, 3-copper busbar;

[0031] 11-battery cell, 12-BMS board, 13-bus, 21-flexible circuit board, 22-buffer, 23-support.

[0032] Modes for Carrying Out the Invention

[0033] The present application provides a flexible circuit board assembly and a battery pack including the flexible circuit board assembly.

[0034] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] As shown in Figures 1 to 4, an embodiment of the present application provides a flexible circuit board assembly 2, which can be installed in a battery pack so that it connects the battery cell 11 and the BMS board 12 in the battery module 1. The temperature, pressure and other information of the battery cell 11 are transmitted to the BMS board 12 through the flexible circuit board assembly 2, thereby enabling the BMS board 12 to detect and protect the battery cell 11. The flexible circuit board assembly 2 includes a flexible circuit board 21 and a buffer 22. One end of the flexible circuit board 21 is connected to the battery cell 11 located on the first wall of the battery module 1, and the other end is connected to the BMS board 12 located on the second wall of the battery module 1. The buffer 22 is arranged between the flexible circuit board 21 and the battery module 1, and supports the flexible circuit board 21.

[0036] Specifically, in the battery pack, the battery cell 11 is located on the first wall of the battery module 1, and the BMS board 12 (the BMS board 12 refers to a circuit board that can monitor and protect lithium-ion batteries) is located on the second wall of the battery module 1. The first wall and the second wall are different walls, and the angle between the first wall and the second wall is not limited here. The angle between the first wall and the second wall can be greater than 0 degrees and less than or equal to 180 degrees, that is, the flexible circuit board 21 needs to be bent to a certain extent in order to connect the battery cell 11 and the BMS board 12 to achieve signal transmission. In the embodiment shown in Figure 1, the first wall and the second wall are arranged vertically. It should be noted that the first wall here refers to the lead-out end connected to the flexible circuit board 21 and the wall on which it is located, and the second wall refers to the wall on which the BMS board 12 is located. It should also be noted that the first wall and the second wall can be either flat or curved. Furthermore, a buffer member 22 is provided between the flexible circuit board 21 and the battery module 1. The buffer member 22 can be provided on either the first wall surface or the second wall surface, or on both the first wall surface and the second wall surface. The interconnection between the buffer member 22, the flexible circuit board 21, and the battery module 1 is not limited herein and may be achieved by adhesive bonding, snap-fitting, magnetic connection, or the like.

[0037] The flexible circuit board assembly 2 of the above structure is used to connect the battery cells 11 and the BMS board 12 in the battery module 1. The flexible circuit board assembly 2 includes a flexible circuit board 21 and a buffer 22. One end of the flexible circuit board 21 is connected to the battery cells 11 located on the first wall of the battery module 1, and the other end is connected to the BMS board 12 located on the second wall of the battery module 1. The buffer 22 is arranged between the flexible circuit board 21 and the battery module 1 to support the flexible circuit board 21. When vibration and impact occur during the use of the battery pack, the bent flexible circuit board 21 may be pulled. By providing the buffer 22 between the flexible circuit board and the battery module 1 to support the flexible circuit board 21, the buffer 22 plays a role in protecting the flexible circuit board 21 when the flexible circuit board 21 is subjected to pulling force.

[0038] In some embodiments, the flexible circuit board assembly 2 further includes a support member 23 connected to the battery module 1 and configured to support the flexible circuit board 21. A buffer member 22 is disposed between the flexible circuit board 21 and the support member 23. Exemplarily, the support member 23 is configured as an L-shaped plate, with the long side of the L-shaped plate located on the first wall and configured to provide support for the flexible circuit board 21. The short side of the L-shaped plate is located on the second wall, and the buffer member 22 is disposed between the flexible circuit board 21 and the short side of the L-shaped plate. In a preferred embodiment, the buffer member 22 is disposed on the second wall, with one end surface of the buffer member 22 connected to the flexible circuit board 21 and the other end surface connected to the short side of the L-shaped plate. The buffer member 22 is preferably attached to both ends by adhesive bonding. Alternatively, the buffer member 22 may be disposed between the flexible circuit board 21 and the long side of the L-shaped plate, or may be disposed on both the long side and the short side of the L-shaped plate. It should be noted that the shape of the support member 23 is not limited. The support member 23 is used to provide support for the flexible circuit board 21 on the one hand, and to provide a mounting position for the buffer member 22 on the other hand.

[0039] Based on the above settings, a plurality of battery cells 11 are usually arranged in the battery pack, and the plurality of battery cells 11 need to be connected to the flexible circuit board 21. Here, the long side of the L-shaped plate is located on the first wall surface, which can provide connection positions for more battery cells 11, and the buffer member 22 is arranged at the short side position in the support frame (such as the short side position of the L-shaped plate), which can make the long side of the L-shaped plate fit more closely with the flexible circuit board 21, thereby improving the stability of the support member 23 in supporting the flexible circuit board 21.

[0040] In some embodiments, the buffer 22 is disposed between the flexible circuit board 21 and the BMS board 12. Since the flexible circuit board 21 is used to connect the BMS board 12 and the battery cell 11 located on different walls, an embodiment is provided herein in which the buffer 22 is disposed between the flexible circuit board 21 and the BMS board 12 (this embodiment is not shown in the figure). The buffer 22 is provided to prevent the flexible circuit board 21 from being torn and broken when the battery pack shakes. The buffer 22 is disposed between the flexible circuit board 21 and the BMS board 12. In this arrangement, the BMS board 12 extends to the junction of the first wall and the second wall, and the buffer 22 is disposed at the bending position of the flexible circuit board 21. In other words, the junction of the first wall and the second wall is the bending position of the flexible circuit board 21. Compared with the above embodiment, this embodiment can omit part of the structure of the support member 23, or the support member 23 can be set to a straight-line structure, which makes the structural layout of the BMS board, support member, etc. more streamlined compared with the above embodiment, and when the flexible circuit board 21 is subjected to a pulling force, the buffer member 22 protects the flexible circuit board 21.

[0041] In some embodiments, the buffer 22 is bonded to the flexible circuit board 21 and to the support member 23. Specifically, double-sided adhesive is used to achieve the bonding of the buffer 22 to the flexible circuit board 21 and the support member 23 respectively. Such an arrangement can improve the convenience of bonding the buffer 22 to the flexible circuit board 21 and the support member 23, and can ensure the stability of the bonding of the buffer 22 to the flexible circuit board 21 and the support member 23. Of course, the buffer 22 can also be bonded to the flexible circuit board 21 and the support member 23 by glue pouring, but it is necessary to set a baffle (not shown in the figure) and other structures to block the position where glue is easily leaked. Although the glue pouring method is more cumbersome than the double-sided adhesive method, the glue pouring method has a good bonding effect, and the buffer 22 is more firmly bonded to the flexible circuit board 21 and the support member 23.

[0042] Furthermore, the buffer 22 and the flexible circuit board 21 can be connected in other ways. For example, the buffer 22 and the flexible circuit board 21 can be integrally formed, and the end of the buffer 22 facing away from the flexible circuit board 21 is bonded to the support 23. This arrangement simplifies the steps for installing the buffer 22 on the flexible circuit board 21 and the support 23, thereby improving the efficiency of installing the buffer 22. Of course, the buffer 22 can also be integrally formed with the support 23, and then the end of the buffer 22 facing away from the support 23 is bonded to the flexible circuit board 21, which can also achieve the above-mentioned function. The specific details are not elaborated here.

[0043] In some embodiments, the buffer 22 is disposed on the first wall surface and / or the second wall surface. The buffer 22 may be disposed on the first wall surface, the second wall surface, or both the first and second wall surfaces. Furthermore, when the buffer 22 is disposed on the first wall surface, the buffer 22 is disposed at a position where the first wall surface is close to the second wall surface; when the buffer 22 is disposed on the second wall surface, the buffer 22 is disposed at a position where the second wall surface is close to the first wall surface; and when the buffer 22 is disposed on both the first and second wall surfaces, the buffer 22 is disposed at a connecting position between the first and second wall surfaces. Since the bending position of the flexible circuit board 21 is subjected to the greatest pulling force when the battery pack is vibrated and impacted, whether the buffer member 22 is arranged on the first wall or the second wall, or the buffer member 22 is arranged on both the first wall and the second wall, the buffer member 22 is arranged near the intersection of the first wall and the second wall to further prevent the flexible circuit board 21 from being pulled apart, thereby further improving the protection effect of the flexible circuit board 21.

[0044] In some embodiments, the buffer member 22 is at least one of EVA foam, PU foam, or silicone foam.

[0045] In this embodiment, an optional implementation is provided in which the buffer member 22 is ethylene vinyl acetate copolymer (EVA) foam, which has good elasticity and cushioning properties and is used for cushioning, sound insulation, shock absorption, packaging, etc. EVA foam has the advantages of being water-resistant, acid- and alkali-resistant, and easy to process and shape.

[0046] In this embodiment, another optional implementation is provided in which the cushioning member 22 is made of polyurethane (PU) foam. PU foam (polyurethane foam material) is a polymer material foamed from a polyurethane prepolymer and a gas generating agent. PU foam has the characteristics of low density, good flexibility, oil and chemical resistance, sound insulation, heat insulation, good vibration absorption, waterproof and moisture-proof, and good shockproof performance.

[0047] In another alternative embodiment, the buffer member 22 is made of silicone foam. Silicone foam is a polymer foam material made of silicone. Silicone foam is resistant to high and low temperatures, moisture, water, shock, dust, radiation, and has good flexibility. Silicone foam decomposes when heated and is non-toxic, odorless, and pollution-free, thus meeting environmental requirements.

[0048] In some embodiments, the compression coefficient of the buffer 22 is greater than 0 and less than or equal to 25%. Specifically, the buffer 22 is preferably foam, and the compression coefficient of the foam refers to the amount of compression deformation of the foam under a certain pressure. The compression coefficient of foams of different materials will vary, and the compression coefficient is also affected by factors such as the density, thickness, and hardness of the foam. Generally speaking, the compression coefficient of foam can be determined through experiments. A common experimental method is to compress the foam under specified conditions for a certain period of time, and then measure the height change of the foam to determine the compression coefficient of the foam. The foam must have a certain compression coefficient to play a buffering role on the flexible circuit board 21.

[0049] Exemplarily, the compressibility of the buffer 22 may be 1%, 2%, 3%, 4%, 5%, 6%, 8%, 10%, 15%, 20%, or 25%.

[0050] In some embodiments, the width of the buffer 22 is M, and the width of the flexible circuit board 21 at the point of contact with the buffer 22 is N, where 0.8N ≤ M ≤ 1.2N. Specifically, the width of the buffer 22 refers to the dimension along the direction indicated by the double-headed arrow B in FIG2 . Accordingly, the width of the buffer 22 at the point of contact with the flexible circuit board 21 also refers to the dimension along the direction indicated by the double-headed arrow B in FIG2 . Within this range of 0.8N ≤ M ≤ 1.2N, a preferred embodiment is provided in which the width of the buffer 22 is equal to the width at the point of contact between the flexible circuit board 21 and the buffer 22, i.e., M = N. In this embodiment, the ends of the buffer 22 are flush with the points of contact with the flexible circuit board 21, maximizing the contact area between the buffer 22 and the flexible circuit board 21. This improves the support and protection provided by the buffer 22 for the flexible circuit board 21. It should be noted that when M = N, a 5% tolerance range exists between M and N, i.e., 0.95N ≤ M ≤ 1.05N. The width M of the buffer 22 can be 0.8N, 0.9N, 1N, 1.1N, or 1.2N, where N represents the width of the position where the flexible circuit board 21 abuts against the buffer 22 .

[0051] Furthermore, in some embodiments, the thickness of the buffer 22 is D, where 2.5 mm ≤ D ≤ 3.5 mm. Specifically, the thickness of the buffer 22 refers to the direction indicated by the double-headed arrow C in FIG3 . In this embodiment, on the basis that the compression coefficient of the buffer 22 is greater than 0 and less than or equal to 25%, the thickness of the buffer 22 is further ensured to be greater than or equal to 2.5 mm and less than or equal to 3.5 mm. This ensures that the buffer 22 has a certain buffering and decompression performance, while reducing the thickness of the buffer, thereby preventing the flexible circuit board 21 from breaking when subjected to external force, and playing a role in protecting the flexible circuit board 21. The specific thickness of the buffer 22 can be 2.5 mm, 2.7 mm, 3 mm, 3.2 mm, or 3.5 mm.

[0052] In some embodiments, a groove for accommodating the buffer 22 is provided on the support member 23, and the buffer 22 provided in the groove abuts against the flexible circuit board 21. Specifically, a preferred embodiment is provided, in which a groove for accommodating the buffer 22 is provided on the second wall surface of the support member 23 (not shown in the figure). The buffer 22 is placed in the groove, and the flexible circuit board 21 abuts against the buffer 22 placed in the groove, and ensures that the buffer 22 at least partially extends out of the groove and abuts against the flexible circuit board 21. Such a setting can improve the installation efficiency of connecting the buffer 22 to the flexible circuit board 21 and the support member 23, and the installation has good stability and is easy to operate. Of course, in order to further ensure that the buffer 22 is firmly connected to the support member 23 and the flexible circuit board 21, double-sided adhesive can also be provided between the buffer 22 and the inner wall of the groove and between the buffer 22 and the flexible circuit board 21.

[0053] In addition, when the buffer member 22 is disposed between the flexible circuit board 21 and the BMS board 12 , the groove may also be disposed on the BMS board 12 .

[0054] A battery pack includes the above-mentioned flexible circuit board assembly 2 and battery module 1. The beneficial effects of the battery pack brought by the flexible circuit board assembly 2 can be found in the above content and will not be repeated here.

[0055] In some embodiments, the battery pack further includes a copper busbar 3, the battery module 1 includes a busbar 13, the copper busbar 3 is respectively connected to the busbar 13 and the BMS board 12, and the copper busbar 3 is vertically arranged on the BMS board 12. Specifically, the copper busbar 3 is used to converge the current of the positive or negative pole on the battery to the BMS board 12, the busbar 13 includes a first busbar and a second busbar, and the corresponding copper busbar 3 includes a first copper busbar and a second copper busbar. The positive poles of the multiple battery cells 11 are connected to the first copper busbar through the first busbar to converge the positive current to the BMS board 12, and the negative poles of the multiple battery cells 11 are connected to the second copper busbar through the second busbar to converge the negative current to the BMS board 12. Here, the copper busbar 3 is bent and welded upright on the BMS board 12 to improve the welding strength of the overcurrent capacity.

[0056] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0057] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0058] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0059] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0060] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly illustrate the technical solutions and cannot be used to limit the scope of protection of the present application.

[0061] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A flexible circuit board assembly for connecting the battery cells in a battery module and a battery management system BMS board, characterized in that: include: A flexible circuit board, one end of which is connected to the battery cell located on the first wall of the battery module, and the other end of which is connected to the BMS board located on the second wall of the battery module; The buffer is arranged between the flexible circuit board and the battery module, and supports the flexible circuit board.

2. The flexible circuit board assembly according to claim 1, characterized in that: It also includes a support member connected to the battery module and used to support the flexible circuit board, and the buffer member is arranged between the flexible circuit board and the support member.

3. The flexible circuit board assembly according to claim 2, characterized in that: The buffer component is bonded to the flexible circuit board and to the support component.

4. The flexible circuit board assembly according to claim 2 or 3, characterized in that: The support member comprises an L-shaped plate, the long side of the L-shaped plate is located on the first wall surface, and the short side of the L-shaped plate is located on the second wall surface.

5. The flexible circuit board assembly according to any one of claims 2 to 4, characterized in that: The support member is provided with a groove for accommodating the buffer member.

6. The flexible circuit board assembly according to claim 1, characterized in that: The buffer is disposed between the flexible circuit board and the BMS board.

7. The flexible circuit board assembly according to claim 6, characterized in that: The BMS board is provided with a groove for accommodating the buffer member.

8. The flexible circuit board assembly according to any one of claims 1 to 7, characterized in that: The buffer member is disposed on the first wall surface and / or the second wall surface.

9. The flexible circuit board assembly according to any one of claims 1 to 8, characterized in that: The buffer is at least one of ethylene vinyl acetate copolymer (EVA) foam, polyurethane (PU) foam or silicone foam.

10. The flexible circuit board assembly according to any one of claims 1 to 9, characterized in that: The compression coefficient of the buffer is greater than 0 and less than or equal to 25%.

11. The flexible circuit board assembly according to any one of claims 1 to 10, characterized in that: The width of the buffer is M, and the width of the position where the flexible circuit board abuts against the buffer is N, wherein 0.8N≤M≤1.2N.

12. The flexible circuit board assembly according to any one of claims 1 to 11, characterized in that: The thickness of the buffer member is D, wherein 2.5 mm≤D≤3.5 mm.

13. A battery pack, characterized in that: It comprises the flexible circuit board assembly described in any one of claims 1 to 12 and the battery module.

14. The battery pack according to claim 13, characterized in that: It also includes a copper busbar, the battery module includes a busbar, the copper busbar is respectively connected to the busbar and the BMS board, and the copper busbar is vertically arranged on the BMS board.

15. The battery pack according to claim 14, characterized in that: The busbar includes a first busbar and a second busbar, the copper bar includes a first copper bar and a second copper bar, the positive electrode of the battery cell is connected to the first copper bar through the first busbar to converge the positive current to the BMS board, and the negative electrode of the battery cell is connected to the second copper bar through the second busbar to converge the negative current to the BMS board.

Images