Housing structure of optical module and optical module

Abstract

The present utility model relates to a housing structure of an optical module, and an optical module. The housing structure comprises a housing and a heat dissipation component; the heat dissipation component comprises a heat dissipation bottom plate and a plurality of cooling fins provided on the heat dissipation bottom plate; the housing is provided with two air guide openings which are oppositely arranged; the heat dissipation component is assembled on the inner side of the housing; the cooling fins are located between the two air guide openings; a heat dissipation channel is formed between every two adjacent cooling fins; a flow guide channel is further formed between the heat dissipation channel and the corresponding air guide opening; and the heat dissipation channel is communicated with the corresponding air guide opening by means of the flow guide channel. The housing structure is beneficial to achieving a better heat dissipation effect; additionally, during actual use, it is difficult for a solder paste to overflow to the outside of the housing through the air guide openings, so that the outside of the housing cannot be polluted, there is no need to clean the solder paste on the outer surface of the housing of the optical module, and the measurement precision and real-time monitoring of a temperature sensor are not affected. The use is more convenient, and the aesthetics of the entire housing and the optical module can be maintained.

Description

Optical module housing structure and optical module Technical Field

[0001] The utility model relates to the field of communications, and in particular to a housing structure of an optical module and the optical module. Background Art

[0002] Optical modules are crucial components in optical communications, enabling the conversion of optical and electrical signals. Functionally, they typically consist of an optical port, optical components, a PCBA, a base (one housing), and a top cover (another housing). The optical port, typically located in the base, is primarily used to connect fiber optic patch cables. The optical components are typically mounted on the base, corresponding to the optical port. The top cover is typically mounted on the base, enclosing the optical components and PCBA in the cavity between the top cover and base.

[0003] To improve thermal conductivity and EMI, more and more customers are seeking closed-top packaging, as shown in Figure 1. Traditionally, closed-top packaging has two main implementation methods. Method 1 involves separately forming a heat sink module containing multiple fins through welding, and then bonding or soldering the entire module to the outside of the optical module housing, as shown in Figure 1. Method 2 involves separately forming the heat sink module through aluminum extrusion, and then bonding or soldering the entire module to the outside of the optical module housing. Both implementations require bonding the heat sink module to the housing. However, the thermal conductivity of existing adhesive materials (such as the commonly used Sn42Bi58 adhesive, which has a thermal conductivity of less than 30 W / mK) is lower than that of the heat sink module and housing materials (typically zinc alloy), increasing thermal resistance and resulting in poor heat dissipation. Furthermore, adhesive coating can result in uneven coating due to process limitations, affecting heat dissipation and causing adhesive separation. To address this technical problem, the prior art discloses a high-speed, pluggable connector assembly with heat dissipation (Chinese Patent CN 219226717 U). This connector assembly includes an upper shell, a lower shell, and a heat dissipation assembly. The upper and lower shells are mounted together by snap fasteners, forming an internal heat dissipation cavity. The heat dissipation assembly includes a heat dissipation base plate and fins disposed on the heat dissipation base plate. The upper shell is constructed with two oppositely arranged openings. The heat dissipation assembly is disposed within the heat dissipation cavity, with the tops of the fins corresponding to the inner surface of the upper shell and the ends of the fins located directly at the openings (see Figure 3 of the patent for details). This allows the heat dissipation channels formed between adjacent fins to communicate with the outside world at the openings. During actual assembly, a thermally conductive filler is typically placed between the tops of the fins and the inner surface of the upper shell. A commonly used filler is solder paste, which not only provides thermal conductivity but also serves as a fixing mechanism. Furthermore, during actual use, temperature sensors are typically installed on the outer surface of the housing in the optical module to monitor the temperature of the optical module in real time. However, during actual operation, due to various reasons, the solder paste between the fins and the upper shell will usually overflow to a certain extent, and the overflowing solder paste can easily overflow to the outer surface of the shell, which will not only cause contamination of the outer surface of the optical module shell, but also be difficult to clean, affecting the aesthetics of the optical module, and will affect the measurement accuracy of the temperature sensor, and may even cause temperature monitoring failure, which needs to be solved urgently. Summary of the Invention

[0004] The first aspect of the present invention aims to solve the above technical problems and provide a housing structure for an optical module, which can effectively prevent solder paste from overflowing onto the outer surface of the housing while ensuring heat dissipation, thereby effectively solving the problems existing in the prior art. The main concepts are:

[0005] A housing structure for an optical module includes a housing and a heat dissipation component. The heat dissipation component includes a heat dissipation base plate and a plurality of heat dissipation fins disposed on the heat dissipation base plate. The housing is configured with two oppositely arranged air guide ports. The heat dissipation component is assembled on the inner side of the housing. The heat dissipation fins are located between the two air guide ports. A heat dissipation channel is formed between adjacent heat dissipation fins.

[0006] A guide channel is further provided between the heat dissipation channel and the air guide port, and the heat dissipation channel is connected to the corresponding air guide port through the guide channel. In this solution, by configuring the guide channel between the heat dissipation channel and the air guide port, the heat dissipation channel is connected to the air guide port through the guide channel. On the one hand, the guide channel can play a role in guiding and draining air, which is more conducive to guiding air into the heat dissipation channel so as to remove heat within the heat dissipation channel, thereby achieving a better heat dissipation effect. On the other hand, the guide channel is provided between the heat dissipation channel and the air guide port, which not only increases the distance between the end of the heat dissipation fin and the air guide port, but also separates the heat dissipation fin and the air guide port by the guide channel. In actual use, even if some solder paste overflows between the heat dissipation fin and the housing, the overflowed solder paste can only remain inside the housing and is unlikely to flow to the outside of the housing through the air guide port, thereby preventing contamination of the outside of the housing. There is no need to clean the solder paste on the outer surface of the optical module housing, and the measurement accuracy and real-time monitoring of the temperature sensor will not be affected, which is more convenient to use. In addition, due to the barrier effect of the guide channel, it is difficult to see the overflowing solder paste from the outside, so that the overflowing solder paste will not affect the aesthetics of the entire housing and the optical module.

[0007] Furthermore, the guide channel is provided with a plurality of guide vanes, which are arranged on the housing and divide the guide channel into at least two sub-channels. The configuration of the guide vanes in the guide channel not only allows the guide vanes to guide and divide the air flow, allowing the air to enter the heat dissipation channels more evenly, but also further increases the heat dissipation area, thereby further improving the heat dissipation effect.

[0008] To improve the heat dissipation effect, each guide vane corresponds to each heat dissipation fin, and the end of the heat dissipation fin abuts against the corresponding guide vane. This not only allows each heat dissipation channel to communicate with each sub-channel, making the air volume in each heat dissipation channel more uniform and facilitating air flow into the heat dissipation channel through the sub-channel on one side and out through the sub-channel on the other side, thereby achieving better heat dissipation effect; it also facilitates more efficient heat conduction between the guide vane and the heat dissipation fins, so that the guide vane not only serves as a guide but also enhances the heat dissipation effect, further facilitating heat dissipation.

[0009] Furthermore, the inner end surface of the guide plate is constructed as a first inclined surface facing the inner side of the shell, and the end surface of the heat dissipation fin is constructed as a second inclined surface adapted to the first inclined surface. When the heat dissipation component is assembled to the shell, the second inclined surface abuts against the corresponding first inclined surface. In this solution, by constructing the inner end surface of the guide plate as the first inclined surface facing the inner side of the shell, and constructing the end surface of the heat dissipation fin as the second inclined surface adapted to the first inclined surface, on the one hand, during assembly, the first inclined surface can play a positioning and guiding role for the heat dissipation component, so that the heat dissipation component can be quickly and conveniently assembled to the shell from the inner side of the shell. On the other hand, the heat dissipation fin abuts against the first inclined surface of the guide plate through the second inclined surface. The inclined surface structure makes the contact area larger, which is more conducive to heat transfer and thus more conducive to heat dissipation.

[0010] The second aspect of the present invention aims to further improve the heat dissipation effect of the optical module. Furthermore, the air guide port is configured as an inclined port. In this solution, by configuring the air guide port as an inclined port, on the one hand, the opening size of the air guide port can be effectively increased without increasing the cross-sectional area of ​​the guide channel, which is conducive to guiding more wind into the guide channel to carry away more heat. On the other hand, the direction of the air guide port can be effectively changed, so that the air guide port faces the outside of the housing, which is more conducive to guiding external wind into the guide channel, thereby further improving the heat dissipation effect of the optical module.

[0011] Furthermore, the outer end surface of the deflector is configured to fit the third inclined surface of the air guide port, so that the third inclined surface cooperates with the inclined air guide port to achieve a better air guide effect and a better heat dissipation effect.

[0012] To improve the heat dissipation effect, the thickness of the heat sink fins is gradually reduced in the direction away from the heat sink base. This not only increases the surface area of ​​the heat sink fins while maintaining a certain height, thus achieving better heat dissipation, but also further increases the cross-sectional area of ​​the heat dissipation channel, effectively increasing the flow rate of the heat dissipation channel and also achieving better heat dissipation effect.

[0013] In order to solve the problem of facilitating the formation of the air guide, preferably, the housing includes two side walls arranged opposite to each other, a heat dissipation wall connected between the two side walls, and a top wall located at both ends of the heat dissipation wall, the two sides of the top wall are respectively connected to the two side walls, and at both ends of the heat dissipation wall, the heat dissipation wall, the top wall and the two side walls together form the air guide.

[0014] The guide plate is at least connected to the heat dissipation wall,

[0015] The top of each heat dissipation fin corresponds to the heat dissipation wall, which not only facilitates the formation of an air guide port, but also makes it easier to guide air, thereby achieving a better heat dissipation effect.

[0016] In some solutions, the tops of the heat dissipating fins are against the inner surface of the heat dissipating wall, so that the heat on the heat dissipating fins can be transferred to the outer surface of the heat dissipating wall via the inner surface of the heat dissipating wall, thereby achieving a larger heat dissipation area and being more conducive to heat dissipation.

[0017] In some solutions, a heat-conducting filler is placed between the top of the fins and the inner surface of the heat sink wall. This effectively eliminates the gap between the fins and the heat sink wall and ensures that heat from the fins can be more efficiently transferred to the heat sink wall through the filler, achieving better heat dissipation.

[0018] Preferably, the guide plate is vertically connected to the heat dissipation wall and the top wall.

[0019] In order to solve the problem of facilitating the formation of the guide channel, in some solutions, the guide channel is constructed on the shell.

[0020] The third aspect of the present invention aims to further improve the heat dissipation effect of the optical module. In some solutions, the top wall and the heat dissipation wall are staggered, the outer ends of each guide plate are respectively connected to the ends of the top wall, the upper ends of each guide plate are respectively connected to the inner surface of the heat dissipation wall, and the lower ends of each guide plate are flush. When the heat dissipation component is assembled into the shell, the lower ends of each guide plate are respectively against the heat dissipation base plate of the heat dissipation component. The heat dissipation wall, the heat dissipation base plate and the two side walls together form the guide channel. In this solution, the heat dissipation component and the shell cooperate to form the guide channel, which not only effectively reduces the difficulty of forming the guide channel, but also makes it easier to form the guide channel; and through the contact between the guide plate and the heat dissipation base plate, the heat on the heat dissipation base plate can be transferred to the guide plate, so that the guide plate can play the role of a heat dissipation fin, thereby effectively increasing the heat dissipation effect.

[0021] The fourth aspect of this utility model addresses the issue of improving heat transfer efficiency. Furthermore, the heat sink base is constructed with grooves adapted to accommodate guide vanes, each groove corresponding to a respective heat sink fin. When the heat sink is assembled into the housing, the lower end of each guide vane is inserted into a respective groove. The grooves not only position the heat sink during assembly, allowing for quick and precise assembly, but also effectively increase the contact area between the heat sink base and the guide vanes, further facilitating heat transfer and dissipation.

[0022] Furthermore, the heat dissipation component further includes two outer walls constructed on both sides of the heat dissipation base plate, and the two outer walls are respectively adapted to the two side walls of the housing. When the heat dissipation component is assembled in the housing, the two outer walls are respectively connected to the two side walls, so that the side walls and the outer walls can together form the side walls of the housing in the existing optical module.

[0023] Furthermore, the outer walls are respectively constructed with lock groove structures adapted to unlocking mechanisms.

[0024] To ensure precise assembly, the heat sink base is further configured with a plurality of first positioning features, and the sidewalls and / or top wall of the housing are configured with second positioning features that adapt to the first positioning features. During assembly, the first and second positioning features cooperate to position the heat sink, allowing the heat sink to be quickly and accurately assembled within the housing.

[0025] Preferably, the heat dissipation fins are parallel to each other, which is convenient for processing and forming, and is beneficial for increasing the heat dissipation area and improving the heat dissipation effect.

[0026] To facilitate production and assembly, the shell is further constructed with several first assembly parts, and the heat dissipation component is constructed with first matching parts adapted to the first assembly parts. The heat dissipation component is detachably mounted on the shell by fasteners adapted to the first matching parts and the first matching parts.

[0027] Preferably, the first assembly portion is a threaded hole, the first matching portion is a through hole adapted to the threaded hole, and the fastener is a bolt or a screw adapted to the threaded hole.

[0028] To facilitate production and assembly, the housing and / or heat dissipation component is further configured with a second assembly portion to connect to the shell component of the adaptable housing, so that the housing structure and the shell component can together form an internal cavity for accommodating components such as circuit boards.

[0029] Preferably, the second assembly portion is a threaded hole or a through hole.

[0030] Furthermore, the shell also includes an optical port portion, one end of the two side walls and one of the top walls are respectively connected to the optical port portion, and the optical port portion is configured with an optical port.

[0031] An optical module includes the housing structure, a cover member, and a PCBA board. The cover member is detachably mounted on the housing structure and encloses an internal cavity. The PCBA board is disposed in the internal cavity and corresponds to a heat dissipation base plate. Heat generated by a heat source on the PCBA board can be transferred to the heat dissipation fins through the heat dissipation base plate and dissipated through the heat dissipation fins, thereby achieving heat dissipation.

[0032] Compared with the prior art, the shell structure and optical module of the optical module provided by the present invention are not only conducive to achieving a better heat dissipation effect, but also in actual use, even if part of the solder paste between the heat dissipation fins and the shell overflows, the overflowed solder paste is difficult to flow to the outside of the shell through the air guide port, thereby not causing pollution to the outside of the shell, and there is no problem of cleaning the solder paste on the outer surface of the optical module shell. It will not affect the measurement accuracy of the temperature sensor and real-time monitoring, which is conducive to more convenient use and helps to maintain the aesthetics of the entire shell and optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0034] FIG1 is a schematic diagram of a partial structure of a conventional optical module.

[0035] FIG2 is a front view of a shell structure provided in Example 1 of the present utility model.

[0036] FIG3 is a top view of FIG2 .

[0037] FIG4 is a cross-sectional view taken along line AA in FIG3 .

[0038] FIG5 is a cross-sectional view taken along line BB in FIG4 .

[0039] FIG6 is one of the partial structural schematic diagrams of a shell in a shell structure provided in Example 1 of the present utility model.

[0040] FIG7 is a second schematic diagram of a partial structure of a shell in a shell structure provided in Example 1 of the present utility model.

[0041] FIG8 is a front view of a heat dissipation component in a housing structure provided in Example 1 of the present utility model.

[0042] FIG. 9 is a top view of FIG. 8 .

[0043] FIG10 is one of the structural schematic diagrams of a heat dissipation component in a shell structure provided in Example 1 of the present utility model.

[0044] FIG11 is a schematic diagram of a partial structure of a housing structure provided in Example 1 of the present utility model, in which a heat dissipation component is assembled to the housing.

[0045] FIG12 is a schematic diagram of a partial structure of a shell in a shell structure provided in Example 2 of the present utility model.

[0046] FIG13 is a front view of a heat dissipation component in a shell structure provided in Example 2 of the present utility model.

[0047] FIG14 is a top view of a shell structure provided in Example 1 of the present utility model.

[0048] FIG15 is a cross-sectional view taken along line CC in FIG14 .

[0049] FIG16 is a schematic diagram of a partial structure of a shell in a shell structure provided in Example 4 of the present utility model.

[0050] FIG17 is a partial bottom view of FIG16 .

[0051] FIG18 is a schematic diagram of the local structure of a guide channel at one end of a shell provided in Example 4 of the present utility model.

[0052] FIG19 is a schematic diagram of the local structure of the guide channel at the other end of a shell provided in Example 4 of the present utility model.

[0053] FIG20 is a schematic diagram of the three-dimensional structure of a heat dissipation component in a shell structure provided in Example 4 of the present utility model.

[0054] FIG21 is a longitudinal cross-sectional view of a shell structure provided in Example 4 of the present invention, and the cross-sectional position is consistent with the position at CC in FIG14 .

[0055] FIG22 is a transverse cross-sectional view of a shell structure provided in Example 4 of the present invention, and the cutting position is consistent with the position at BB in FIG4 .

[0056] Description of the marks in the figure

[0057] Heat dissipation fin module 1, fin 11

[0058] Housing 2, side wall 21, heat dissipation wall 22, inner surface 221, top wall 23, air guide port 24, flow guide channel 25, sub-channel 251, first assembly portion 26, second assembly portion 27, optical port portion 28, optical port 281

[0059] Heat dissipation component 3, heat dissipation base plate 31, groove 311, heat dissipation fin 32, second inclined surface 321, heat dissipation channel 33, first matching portion 34, outer wall 35, locking groove structure 351, end wall 36

[0060] The first positioning portion 41 and the second positioning portion 42

[0061] Guide plate 5, first inclined surface 51, third inclined surface 52

[0062] Cover member 6

[0063] Internal cavity 7

[0064] PCBA board 8, heat source 81

[0065] Fastener 9. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention. Example 1

[0067] This embodiment provides a housing structure of an optical module, including a housing 2 and a heat dissipation component 3, as shown in FIG1 to FIG4 , wherein:

[0068] The heat sink 3 includes a heat sink base 31 and a plurality of heat sink fins 32 disposed on the heat sink base 31. As shown in Figures 8 and 9, the heat sink fins 32 can be parallel to each other and preferably perpendicular to the heat sink base 31. This facilitates processing and molding, increases the heat dissipation area, and improves the heat dissipation effect. The thickness, height, and spacing of the heat sink fins 32 can be determined according to actual heat dissipation requirements.

[0069] As shown in Figures 3, 4, and 6, the housing 2 is configured with two oppositely arranged air ducts 24 so as to dissipate heat through the two air ducts 24. For ease of description, in one embodiment, the housing 2 includes two oppositely arranged side walls 21, a heat dissipation wall 22 connected between the two side walls 21, and a top wall 23 located at both ends of the heat dissipation wall 22. As shown in Figures 3 to 7, the top wall 23 and the heat dissipation wall 22 are not coplanar. For example, as shown in Figure 4, the heat dissipation wall 22 is located further away from the inside of the housing 2 (for ease of description, in this embodiment, the outside of the outer surface of the heat dissipation wall 22 is the outside of the housing 2, and the inside of the inner surface 221 of the heat dissipation wall 22 is the inside of the housing 2). The top wall 23 and the heat dissipation wall 22 can be parallel to each other, and the two sides of the top wall 23 are respectively connected to the two side walls 21. As shown in Figures 3, 4, and 7, at both ends of the heat dissipation wall 22, the heat dissipation wall 22, the top wall 23, and the two side walls 21 together form an air duct 24. The two top walls 23 at both ends of the heat dissipation wall 22 are spaced apart, as shown in FIG3 and FIG4 , so that a gap for receiving the heat dissipation fins 32 of the heat dissipation component 3 can be formed between the two top walls 23 .

[0070] In this embodiment, the heat dissipation component 3 is assembled inside the housing 2, as shown in Figures 4, 5, and 11, so that the heat dissipation fins 32 are located exactly between the two air guide ports 24. The heat dissipation fins 32 can form a joint with the heat dissipation wall 22 of the housing 2, thereby forming a heat dissipation channel 33 between two adjacent heat dissipation fins 32, as shown in Figure 5. In this embodiment, the ends of the heat dissipation fins 32 do not extend to the air guide ports 24. In fact, in this embodiment, there is a guide channel 25 between the heat dissipation channel 33 and the air guide ports 24, and the heat dissipation channel 33 is connected to the corresponding air guide ports 24 through the guide channel 25.

[0071] During implementation, the outer surface of the heat dissipation fin 32 can have a certain slope, so that the thickness of the heat dissipation fin 32 gradually decreases in the direction away from the heat dissipation base plate 31, as shown in Figure 5. This not only can further increase the surface area of ​​the heat dissipation fin 32 when the height of the heat dissipation fin 32 is constant, thereby being more conducive to achieving a better heat dissipation effect, but also can further increase the cross-sectional area of ​​the heat dissipation channel 33, effectively increasing the flow rate of the heat dissipation channel 33, and also being conducive to achieving a better heat dissipation effect.

[0072] During implementation, the guide channel 25 has various implementations. For example, the guide channel 25 can be directly constructed on the housing 2. For example, the top wall 23 of the housing 2 can extend to the inner side of the heat dissipation arm, so that the top wall 23, the heat dissipation wall 22 and the two side walls 21 can together form the guide channel 25, as shown in Figures 3, 4, 6 and 7. During assembly, the heat dissipation fins 32 of the heat dissipation component 3 are inserted between the guide channels 25 on both sides, so that the heat dissipation channel 33 is connected to the corresponding air guide port 24 through the guide channel 25. During assembly, the end of the heat dissipation channel 33 can be against the end of the guide channel 25 for better heat dissipation.

[0073] To facilitate production and assembly, the housing 2 is configured with a plurality of first assembly portions 26, as shown in Figures 7 and 11. The heat sink 3 is configured with a first mating portion 34 that fits the first assembly portions 26, allowing the heat sink 3 to be removably mounted to the housing 2 via a fastener 9 that fits between the first mating portion 34 and the first assembly portion 26. In practice, the first assembly portions 26 and the first mating portion 34 can be mated in a variety of ways. For example, the first assembly portions 26 can be threaded holes, and the first mating portions 34 can be through holes that fit into the threaded holes. In this case, the fastener 9 can be a bolt or screw that fits into the threaded holes, allowing the heat sink 3 to be threadedly connected to the housing 2 using the fastener 9. For another example, the first assembly portions 26 can be through holes, and the first mating portions 34 can be threaded holes that fit into the through holes. In this case, the fastener 9 can be a bolt or screw that fits into the threaded holes, allowing the heat sink 3 to be threadedly connected to the housing 2 using the fastener 9. For example, the first assembly portion 26 and the first matching portion 34 can also be mutually matched snap-fit ​​structures to achieve a detachable connection, which will not be described in detail here. In implementation, the first matching portion 34 can be preferentially disposed on the heat dissipation base plate 31 .

[0074] After assembly is complete, the top of each heat sink fin 32 corresponds to the inner surface 221 of the heat sink wall 22, as shown in Figures 4 and 5. During implementation, the top of the heat sink fin 32 can be against the inner surface 221 of the heat sink wall 22, so that the heat on the heat sink fin 32 can be transferred to the outer surface of the heat sink wall 22 via the inner surface 221 of the heat sink wall 22, thereby achieving a larger heat dissipation area and more conducive to heat dissipation. In a preferred embodiment, a filler is provided between the top of the heat sink fin 32 and the inner surface 221 of the heat sink wall 22. The filler has at least a heat conduction function. During implementation, the filler can preferably be solder paste. Solder paste not only has good heat conduction function but also has a fixing function. By setting the filler, the gap between the heat sink fin 32 and the heat sink wall 22 can be effectively eliminated by the filler. Solder paste can play a fixing and heat conducting role, ensuring that the heat on the heat sink fin 32 can be more efficiently transferred to the heat sink wall 22, achieving a better heat dissipation effect.

[0075] In a more complete solution, the heat dissipation component 3 further includes two outer walls 35 constructed on both sides of the heat dissipation base plate 31, as shown in Figures 8-10. The two outer walls 35 are arranged relative to each other and respectively adapt to the two side walls 21 in the housing 2. When the heat dissipation component 3 is assembled into the housing 2, the two outer walls 35 are respectively docked with the two side walls 21, as shown in Figures 10 and 11, so that the side walls 21 and the outer walls 35 can together constitute the side walls 21 of the housing 2 in the existing optical module. In a more complete solution, the outer walls 35 are also respectively constructed with a lock slot structure 351 that adapts to the unlocking mechanism in the optical module, as shown in Figures 8 and 10. The lock slot structure 351 can be implemented using existing technology and will not be described in detail here. However, constructing the lock slot structure 351 into the heat dissipation component 3 makes it easier to process and assemble. To facilitate mating with the cover member 6 and enclosing a closed internal cavity 7, in a more advanced embodiment, the heat dissipation member 3 further includes end walls 36 connected to one end of each of the two outer walls 35, as shown in FIG10 , to mate with the cover member 6 in the optical module. As shown in FIG8 and FIG10 , the lower edge of the outer wall 35 can be configured as a tooth-like structure to better mate with the cover member 6 in the optical module.

[0076] In order to facilitate the precise assembly of the heat dissipation component 3, in a further embodiment, the heat dissipation base plate 31 is constructed with a plurality of first positioning portions 41, and correspondingly, the side wall 21 and / or the top arm of the housing 2 are constructed with a second positioning portion 42 adapted to the first positioning portion 41. During assembly, the heat dissipation component 3 can be quickly positioned by the cooperation of the first positioning portion 41 and the second positioning portion 42, so that the heat dissipation component 3 can be quickly and accurately assembled to the housing 2. In implementation, the first positioning portion 41 can be a positioning protrusion, and the second positioning portion 42 can be a positioning groove 311 adapted to the positioning protrusion. The first positioning portion 41 can be a positioning groove 311, as shown in Figures 8 and 9, and the second positioning portion 42 can be a positioning protrusion adapted to the positioning groove 311, as shown in Figures 7 and 11.

[0077] In a more complete solution, the housing 2 and / or heat sink 3 are further configured with a second assembly portion 27 for connecting to the cover 6, as shown in Figures 10 and 11. This allows the housing 2 structure and the cover 6 to collectively define an internal cavity 7 for accommodating components such as a circuit board, as shown in Figure 22. In practice, the second assembly portion 27 may preferably be a threaded hole, a through hole, a male snap in a snap-fit ​​mechanism, or a female snap in a snap-fit ​​structure. For example, in this embodiment, the second assembly portion 27 is a threaded hole, and the housing 2 and heat sink 3 are each configured with a plurality of such threaded holes to facilitate removable connection to the cover 6.

[0078] In a more complete solution, the shell 2 also includes an optical port portion 28, and one end of the two side walls 21 and one of the top arms are respectively connected to the optical port portion 28. As shown in Figures 2 and 3, the optical port portion 28 is constructed with an optical port 281 to connect the optical fiber jumper. Accordingly, the optical device required for the optical module can usually be installed at the position corresponding to the optical port 281 in the optical port portion 28.

[0079] During implementation, the housing 2 may be preferably made of zinc alloy, and accordingly, the heat dissipation component 3 may also be preferably made of zinc alloy. Example 2

[0080] To improve the heat dissipation effect, the main difference between this embodiment 2 and the above-mentioned embodiment 1 is that in the structure of the housing 2 provided in this embodiment, a plurality of guide vanes 5 are further provided within the guide channel 25, dividing the guide channel into at least two sub-channels 251, as shown in Figure 12. By disposing the guide vanes 5 within the guide channel 25, not only can the guide vanes 5 be used to guide and divide the air, allowing the air to enter each heat dissipation channel 33 more evenly, but the heat dissipation area can also be further increased, thereby further improving the heat dissipation effect.

[0081] During implementation, the guide plate 5 is arranged on the shell 2, as shown in Figure 12. For example, the guide plate 5 can be connected to the heat dissipation wall 22. In a preferred embodiment, the guide plate 5 can be connected to the heat dissipation wall 22 and the top wall 23 at the same time, and each guide plate 5 can be preferentially connected vertically to the heat dissipation wall 22 and the top wall 23, as shown in Figures 12 and 14.

[0082] During implementation, the number of sub-channels 251 can be greater than the number of heat dissipation channels 33, can be equal to the number of heat dissipation channels 33, or can be greater than the number of heat dissipation channels 33. To improve the heat dissipation effect, in the preferred embodiment provided in this embodiment, each guide vane 5 corresponds to each heat dissipation fin 32, that is, the number of guide vanes 5 can be equal to the number of heat dissipation fins 32, and the ends of the heat dissipation fins 32 can abut against the corresponding guide vane 5, as shown in FIG15. This not only allows each heat dissipation channel 33 to be connected to each sub-channel 251, making the air volume of each heat dissipation channel 33 more uniform, but also facilitates air entering the heat dissipation channel 33 through the sub-channel 251 on one side and being discharged through the sub-channel 251 on the other side, thereby achieving a better heat dissipation effect; it also facilitates more efficient heat conduction between the guide vane 5 and the heat dissipation fin 32, so that the guide vane 5 not only serves as a guide, but also serves to enhance the heat dissipation effect, equivalent to the heat dissipation fin 32, and is more conducive to heat dissipation.

[0083] Since the end of the heat dissipation fin 32 abuts against the guide plate 5, in a further embodiment, the inner end surface of the guide plate 5 (i.e., the end of the guide plate 5 facing the other side) can be constructed as a first inclined surface 51 facing the inner side of the shell 2, as shown in Figure 15. Correspondingly, the end surface of the heat dissipation fin 32 can be constructed as a second inclined surface 321 adapted to the first inclined surface 51, as shown in Figures 13 and 15, so that when the heat dissipation component 3 is assembled to the shell 2, the second inclined surface 321 abuts against the corresponding first inclined surface 51. In this way, on the one hand, during assembly, the first inclined surface 51 can play a role in positioning and guiding the heat dissipation component 3, so that the heat dissipation component 3 can be quickly and conveniently assembled to the shell 2 from the inner side of the shell 2. On the other hand, the heat dissipation fin 32 abuts against the first inclined surface 51 of the guide plate 5 through the second inclined surface 321. The inclined surface structure makes the contact area larger, which is more conducive to heat transfer and thus more conducive to heat dissipation. During implementation, the inclination angle of the first inclined surface 51 can be determined according to actual needs, and the inclination angle of the second inclined surface 321 can be adapted to the first inclined surface 51 . Example 3

[0084] In order to further improve the heat dissipation effect, the main difference between this embodiment 3 and the above-mentioned embodiment 1 or embodiment 2 is that, in the shell 2 structure provided in this embodiment, the air guide port 24 is constructed as an inclined port, as shown in the figure, that is, the angle between the central axis of the air guide port 24 and the top wall 23 is an acute angle, as shown in Figures 12, 14 and 15. By constructing the air guide port 24 as an inclined port, on the one hand, the opening size of the air guide port 24 can be effectively increased without increasing the cross-sectional area of ​​the guide channel 25, which is conducive to guiding more wind into the guide channel 25 so as to carry more heat. On the other hand, the direction of the air guide port 24 can be effectively changed so that the air guide port 24 faces the outside of the shell 2, which is more conducive to guiding the external wind into the guide channel 25, thereby further improving the heat dissipation effect of the optical module.

[0085] During implementation, the outer end surface of the deflector 5 can be configured to be perpendicular to the top wall 23. However, in a preferred embodiment, the outer end surface of the deflector 5 can be configured to adapt to the third inclined surface 52 of the air guide port 24, as shown in Figures 12 and 14. That is, the outer end surface of the deflector 5 can also be configured as an inclined surface, and the inclination angle can be consistent with the inclination angle of the air guide port 24, as shown in Figures 12 and 15. In this way, the cooperation between the third inclined surface 52 and the inclined air guide port 24 can play a better air guiding role and achieve a better heat dissipation effect. Example 4

[0086] In order to facilitate the formation of the guide channel 25 and achieve better heat dissipation effect, the main difference between this embodiment 4 and the above-mentioned embodiment 1 or embodiment 2 or embodiment 3 is that in the shell 2 structure provided in this embodiment, the guide channel 25 is formed in a different way. Specifically, in this embodiment, the top wall 23 and the heat dissipation wall 22 can be staggered with each other, that is, along the projection direction perpendicular to the top wall 23, the projection of the top wall 23 and the heat dissipation wall 22 may not overlap. At this time, the outer end of each guide plate 5 can be respectively connected to the end of the top wall 23, as shown in Figures 16 and 17. At the same time, the upper end of each guide plate 5 can be respectively connected to the inner surface 221 of the heat dissipation arm, and the lower end of each guide plate 5 is flush, as shown in Figures 18 and 19. The heat dissipation base plate 31 of the heat dissipation component 3 is reserved with a resting area adapted to the guide plate 5, and no heat dissipation fins 32 are set in the resting area, as shown in Figure 20, so that when the heat dissipation component 3 is assembled on the shell 2, the lower end of each guide plate 5 is just against the heat dissipation base plate 31 of the heat dissipation component 3, and the heat dissipation wall 22, the heat dissipation base plate 31 and the two side walls 21 together form the guide channel 25, as shown in Figure 21. In this embodiment, the heat dissipation component 3 and the shell 2 cooperate to form the guide channel 25, which not only effectively reduces the difficulty of forming the guide channel 25, but also makes it easier to form the guide channel 25; and through the direct contact between the guide plate 5 and the heat dissipation base plate 31, the heat on the heat dissipation base plate 31 can be transferred to the guide plate 5, so that the guide plate 5 can play the role of the heat dissipation fin 32, which is equivalent to the heat dissipation fin 32. Based on the inventive concept in this embodiment, it is equivalent to forming a multi-section spliced ​​fin (heat dissipation fin 32 and guide plate 5) between the two air guide ports 24, and each fin contacts the heat dissipation base plate 31, thereby effectively increasing the heat dissipation effect.

[0087] In a further embodiment, the heat dissipation base plate 31 is further configured with grooves 311 adapted to accommodate the guide vanes 5. As shown in FIG20 , each groove 311 corresponds to each heat dissipation fin 32, so that when the heat dissipation component 3 is assembled to the housing 2, the lower end of each guide vane 5 can be inserted into each groove 311. The configuration of the grooves 311 not only serves to position the heat dissipation component 3 during assembly, allowing for quick and precise assembly, but also effectively increases the contact area between the heat dissipation base plate 31 and the guide vanes 5, further facilitating heat transfer and heat dissipation. Example 5

[0088] This embodiment provides an optical module, comprising the housing 2 structure described in any one of Embodiments 1 to 4, and further comprising a cover component 6 and a PCBA board 8 adapted to the housing 2 structure. The cover component 6 can be detachably mounted on the housing 2 structure via fasteners 9 or a snap-fit ​​structure, and encloses an internal cavity 7. As an example, in a preferred embodiment, the housing 2, the heat dissipation component 3, and the cover component 6 together enclose the internal cavity 7, as shown in FIG22 . The PCBA board 8 can be disposed in the internal cavity 7, and the PCBA board 8 can correspond to the heat dissipation base plate 31. As shown in FIG22 , the heat source 81 in the optical module, including the heat source 81 on the PCBA board 8, can correspond to or contact the heat dissipation base plate 31, so that the heat generated by the heat source 81 can be transferred to the heat dissipation fins 32 via the heat dissipation base plate 31 and dissipated through the heat dissipation fins 32, thereby achieving the purpose of heat dissipation.

[0089] Of course, during implementation, a thermally conductive material can also be arranged between the heat source 81 and the heat dissipation base plate 31. The thermally conductive material can be solder paste, heat dissipation silicone, heat dissipation mud, etc., so that heat can be transferred to the heat dissipation base plate 31 more smoothly and efficiently. Examples will not be given here one by one.

[0090] The above is only a specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A housing structure of an optical module, characterized in that: The invention comprises a shell and a heat dissipation component, wherein the heat dissipation component comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged on the heat dissipation base plate, the shell is structured with two oppositely arranged air guide ports, the heat dissipation component is assembled on the inner side of the shell, the heat dissipation fins are located between the two air guide ports, and a heat dissipation channel is formed between adjacent heat dissipation fins. A guide channel is also provided between the heat dissipation channel and the air guide port, and the heat dissipation channel is connected with the corresponding air guide port through the guide channel.

2. The housing structure of the optical module according to claim 1, characterized in that: A plurality of guide plates are arranged in the guide channel, and the guide plates are arranged on the shell body and divide the guide channel into at least two sub-channels.

3. The housing structure of the optical module according to claim 2, characterized in that: Each guide plate corresponds to each heat dissipation fin, and the end of the heat dissipation fin abuts against the corresponding guide plate.

4. The housing structure of the optical module according to claim 3, characterized in that: The inner end surface of the guide plate is configured as a first inclined surface facing the inner side of the shell, and the end surface of the heat dissipation fin is configured as a second inclined surface adapted to the first inclined surface. When the heat dissipation component is assembled to the shell, the second inclined surface abuts against the corresponding first inclined surface.

5. The housing structure of the optical module according to claim 2, characterized in that: The air guide port is configured as an inclined port.

6. The housing structure of the optical module according to claim 6, characterized in that: The outer end surface of the guide plate is configured to be a third inclined surface adapted to the air guide port.

7. The housing structure of the optical module according to claim 1, characterized in that: The thickness of the heat dissipation fins gradually decreases in a direction away from the heat dissipation base plate.

8. The housing structure of the optical module according to any one of claims 2 to 7, characterized in that: The housing includes two side walls arranged opposite to each other, a heat dissipation wall connected between the two side walls, and a top wall located at both ends of the heat dissipation wall. The two sides of the top wall are respectively connected to the two side walls. At the two ends of the heat dissipation wall, the heat dissipation wall, the top wall and the two side walls jointly form the air guide port. The guide plate is at least connected to the heat dissipation wall, The top of each heat dissipation fin corresponds to the heat dissipation wall respectively.

9. The housing structure of the optical module according to claim 8, characterized in that: The top of the heat dissipation fin abuts against the inner surface of the heat dissipation wall; Alternatively, a filler with a heat-conducting function is arranged between the top of the heat dissipation fin and the inner surface of the heat dissipation wall.

10. The housing structure of the optical module according to claim 8, characterized in that: The guide plate is vertically connected to the heat dissipation wall and the top wall; And / or, the housing further comprises a light opening portion, one end of the two side walls and one of the top walls are respectively connected to the light opening portion, and the light opening portion is configured with a light opening.

11. The housing structure of the optical module according to claim 8, characterized in that: The flow guiding channel is configured on the shell.

12. The housing structure of the optical module according to claim 8, characterized in that: The top wall and the heat dissipation wall are staggered, the outer end of each guide plate is respectively connected to the end of the top wall, and the upper end of each guide plate is respectively connected to the inner surface of the heat dissipation wall. When the heat dissipation component is assembled on the shell, the lower end of each guide plate is respectively against the heat dissipation base plate of the heat dissipation component, and the heat dissipation wall, the heat dissipation base plate and the two side walls together form the guide channel.

13. The housing structure of the optical module according to claim 12, characterized in that: The heat dissipation bottom plate is also structured with grooves adapted for guide vanes, each groove corresponding to each heat dissipation fin. When the heat dissipation component is assembled on the housing, the lower end of each guide vane is inserted into each groove.

14. The housing structure of the optical module according to claim 8, characterized in that: The heat dissipation component also includes two outer walls constructed on both sides of the heat dissipation bottom plate, and the two outer walls are respectively adapted to the two side walls in the shell. When the heat dissipation component is assembled in the shell, the two outer walls are respectively connected to the two side walls.

15. The housing structure of the optical module according to claim 14, characterized in that: The outer walls are respectively configured with lock slot structures adapted to unlocking mechanisms; And / or, the heat dissipation base plate is configured with a plurality of first positioning portions, and the side walls and / or top wall of the housing are configured with second positioning portions adapted to the first positioning portions.

16. The housing structure of the optical module according to claim 8, characterized in that: The housing is configured with a plurality of first assembly parts, the heat dissipation component is configured with a first matching part adapted to the first assembly parts, and the heat dissipation component is detachably mounted on the housing by means of a fastener adapted to the first matching part and the first matching part.

17. The housing structure of the optical module according to claim 16, characterized in that: The housing and / or the heat dissipation component is also configured with a second mounting portion.

18. The housing structure of the optical module according to claim 17, characterized in that: The first assembly portion is a threaded hole, the first matching portion is a through hole adapted to the threaded hole, and the fastener is a bolt or a screw adapted to the threaded hole; The second assembly portion is a threaded hole or a through hole.

19. An optical module, comprising a cover component and a PCBA board, characterized in that: It also includes the shell structure described in any one of claims 1-18, the cover component is detachably mounted on the shell structure and surrounds an internal cavity, the PCBA board is arranged in the internal cavity, and the PCBA board corresponds to the heat dissipation base plate.

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