Optical module

Abstract

An optical module (200), comprising an upper housing (201), a circuit board (105), a base (900a), a light receiving component (500a), and a light emitting component (400a). Respectively arranging the light receiving component (500a) and the light emitting component (400a) on different surfaces of the same base (900a) can achieve light reception and light emission of multiple paths of signals. A base mounting portion (301) is formed on a surface of the circuit board (105), such that the base (900a) is fixed to the surface of the circuit board (105) by means of the base mounting portion (301). In order to improve the cooling effect of the base (900a), the light emitting component (400a) is arranged on the lower surface of the base (900a), and a protruding portion (910a) is formed on the upper surface of the base (900a), the protruding portion (910a) protruding towards the upper housing (201), and the protruding portion (910a) being in thermally-conductive connection to the upper housing (201), thereby allowing heat to be dissipated via the base (900a).

Description

An optical module

[0001] This disclosure claims the priority of application number 202311271735.3 filed with the China Patent Office on September 28, 2023; the priority of application number 202311776059.5 filed with the China Patent Office on December 21, 2023; the priority of application number 202311776082.4 filed with the China Patent Office on December 21, 2023; the priority of application number 202311771298.1 filed with the China Patent Office on December 21, 2023; and the priority of application number 202311771330.6 filed with the China Patent Office on December 21, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and are at the core of optical communication.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising an upper housing, a circuit board, a base, a light receiving component, and a light emitting component. A base mounting portion is formed on the surface of the circuit board. The base is fixed to the surface of the circuit board via the base mounting portion. A raised portion is formed on the upper surface of the base, the raised portion protruding toward the upper housing, and the raised portion is thermally connected to the upper housing. The light receiving component is located on the upper surface of the base and on the side of the raised portion, and the light receiving component is used to receive multiple optical signals; the light emitting component is located on the lower surface of the base, and the light emitting component is used to transmit multiple optical signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0009] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5A is a structural diagram 1 of a first base provided according to some embodiments of the present disclosure;

[0012] FIG5B is a second structural diagram of a first base provided according to some embodiments of the present disclosure;

[0013] FIG5C is a structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0014] FIG5D is a schematic diagram of the assembly of a first base and a circuit board according to some embodiments of the present disclosure;

[0015] FIG6A is a structural diagram 1 of a second base provided according to some embodiments of the present disclosure;

[0016] FIG6B is a second structural diagram of a second base provided according to some embodiments of the present disclosure;

[0017] FIG6C is a schematic diagram of the assembly of a second base and a circuit board according to some embodiments of the present disclosure;

[0018] FIG7A is a structural diagram 1 of a third base provided according to some embodiments of the present disclosure;

[0019] FIG7B is a second structural diagram of a third base provided according to some embodiments of the present disclosure;

[0020] FIG7C is a structural diagram of another circuit board provided according to some embodiments of the present disclosure;

[0021] FIG7D is an assembly diagram of a third base and a circuit board according to some embodiments of the present disclosure;

[0022] FIG8 is a structural diagram of a fourth base provided according to some embodiments of the present disclosure;

[0023] FIG9 is a structural diagram of a fifth base provided according to some embodiments of the present disclosure;

[0024] FIG10 is an assembly structure diagram of a light receiving component according to some embodiments of the present disclosure;

[0025] FIG11 is an exploded view of an optical receiving component according to some embodiments of the present disclosure;

[0026] FIG12 is a cross-sectional structural diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0027] FIG13 is a schematic diagram of electrical connection between an optical receiving chip and a transimpedance amplifier according to some embodiments of the present disclosure;

[0028] FIG14 is a structural diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0029] FIG15 is an exploded view of a light receiving component according to some embodiments of the present disclosure;

[0030] FIG16 is a structural diagram of a lens assembly according to some embodiments of the present disclosure;

[0031] FIG17 is a schematic diagram of an assembly of another light receiving component according to some embodiments of the present disclosure;

[0032] FIG18 is a schematic structural diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0033] FIG19 is an exploded schematic diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0034] FIG20 is an assembly structure diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0035] FIG21 is a schematic structural diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0036] FIG22 is an exploded schematic diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0037] FIG23 is a top view of another light receiving component provided according to some embodiments of the present disclosure;

[0038] FIG24 is a schematic structural diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0039] FIG25 is an exploded schematic diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0040] FIG26 is a schematic top view of another light receiving component provided according to some embodiments of the present disclosure;

[0041] FIG27 is a schematic diagram of assembling another light receiving component according to some embodiments of the present disclosure;

[0042] FIG28 is a schematic structural diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0043] FIG29 is a schematic diagram of assembling another light receiving component according to some embodiments of the present disclosure;

[0044] FIG30 is a schematic structural diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0045] FIG31 is a schematic diagram of an assembly of a light emitting component according to some embodiments of the present disclosure;

[0046] FIG32 is an assembled top view of a light emitting component according to some embodiments of the present disclosure;

[0047] FIG33 is an exploded view of an optical emission component according to some embodiments of the present disclosure;

[0048] FIG34 is a structural diagram of a second protective cover in a light emitting component according to some embodiments of the present disclosure;

[0049] FIG35 is an assembled side view of a light emitting component according to some embodiments of the present disclosure;

[0050] FIG36 is an exploded side view of an assembly of a light emitting component according to some embodiments of the present disclosure;

[0051] FIG37 is a cross-sectional structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0052] FIG38 is an exploded structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0053] FIG39 is an assembly cross-sectional view of another light emitting component according to some embodiments of the present disclosure;

[0054] FIG40 is a schematic diagram of assembling another light emitting component according to some embodiments of the present disclosure;

[0055] FIG41 is a schematic structural diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0056] FIG42 is a cross-sectional structural diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0057] FIG43 is a schematic diagram of a partial cross-sectional structure of an optical module according to some embodiments of the present application;

[0058] FIG44 is a second schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application;

[0059] FIG45 is a first assembly diagram of another light emitting component according to some embodiments of the present disclosure;

[0060] FIG46 is a second assembly diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0061] FIG47 is a schematic structural diagram of another light emitting component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0062] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0063] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0064] The conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. A first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal, which is then transmitted into the optical network terminal. A second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal, which is then transmitted into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and not all types of information processing devices need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0065] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system partially comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0066] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0067] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0068] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0069] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0070] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and data center servers are common host computers.

[0071] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0072] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0073] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0074] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0075] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed inside the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0076] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0077] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0078] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0079] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, which is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0080] In some embodiments, the lower shell 202 includes a base plate 2021 and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011, and the two upper side plates are combined with the two lower side plates to realize that the upper shell 201 is covered on the lower shell 202.

[0081] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical interface, from which the gold fingers of the circuit board 300 extend and are inserted into the electrical connector of the host computer; opening 205 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0082] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light-emitting component 400, and light-receiving component 500 within the housing. The upper and lower housings 201 and 202 provide a protective seal for these components. Furthermore, during assembly of the circuit board 300, light-emitting component 400, and light-receiving component 500, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily positioned, facilitating automated production. In some embodiments, the upper and lower housings 201 and 202 are constructed of metal to facilitate electromagnetic shielding and heat dissipation.

[0083] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0084] For example, the unlocking member 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes engaging components that mate with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the engaging components of the unlocking member 600 secure the optical module 200 within the cage 106. When the unlocking member 600 is pulled, the engaging components of the unlocking member 600 move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the fixed engagement between the optical module 200 and the host computer, allowing the optical module 200 to be removed from the cage 106.

[0085] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0086] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0087] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (such as the top surface shown in FIG4 ), or they can be provided on both the top and bottom surfaces of the circuit board 300 to provide more pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0088] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0089] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger. In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 via corresponding flexible circuit boards or electrical connectors. In some embodiments, the light emitting component and / or the light receiving component can be directly disposed on the circuit board 300, on the surface of the circuit board, or on the side of the circuit board. In some embodiments, the light emitting component 400 and the light receiving component 500 are located on the upper and lower surfaces of the circuit board, respectively.

[0090] In order to make full use of limited space, the existing 800G QSFPDD 2xFR4 is mainly hard-connected, that is, the optical emitting component 400 and the optical receiving component 500 are connected to the optical fiber adapter. In the OSFQ package, the optical emitting component 400 and the optical receiving component 500 need to be connected to the optical fiber first, and the optical fiber has an optical fiber adapter at the optical port position. The present application provides an optical module, in which the optical emitting component 400 and the optical receiving component 500 are arranged on both sides of the base, the base is embedded in the circuit board, and a coupling connection with the optical fiber is achieved, and then a soft connection is achieved through the optical fiber and the optical port of the optical module. Through this design, the same optical and module structure design is achieved, which can be applied to the QSFP-DD packaging method and the OSFP packaging method, and at the same time meet the loss and sensitivity requirements of FR4 and LR4 optical modules. Because the structure realizes the optical design of the transmitting and receiving ends as much as possible, and unifies different product packaging platforms (such as QSFP-DD and OSFP) and product standards (FR4 and LR4) in one optical and structural design, it simplifies the assembly process, reduces the cost of materials and components, and makes it easier to achieve batch and low-cost goals. By rationally arranging optical components and optimizing the assembly process, the overall assembly of the module is greatly simplified, and the production efficiency and maintenance efficiency are greatly improved, making it more suitable for mass production.

[0091] In the present disclosure, the optical module includes a base. A base mounting portion is formed on the surface of the circuit board 300. For example, the structure of the base mounting portion can be an opening or other structures. The base is embedded in the base mounting portion, thereby fixing the base to the surface of the circuit board 300. In some embodiments, one surface of the base is used to carry the light receiving component, and the other surface is used to carry the light emitting component, so that the light receiving component and the light emitting component are arranged in layers on the same structural member to achieve a reasonable layout of the optical components. In the present disclosure, the light receiving component and the light emitting component are arranged on different surfaces of the same base, and multiple groups of light receiving components or multiple groups of light emitting components are arranged on the same surface of the base, thereby realizing multi-channel reception and multi-channel transmission of the optical module, such as a 1.6T optical module, to improve the transmission rate of the optical module.

[0092] In the present disclosure, the upper shell 201 of the optical module can form a heat dissipation duct with the cage 106 of the host computer 100, so the upper shell 201 has a better heat dissipation effect than the lower shell 202. Since the heat generated by the light emitting component is large, the heat generated by it needs to be conducted away to ensure the normal operation of the light emitting component. In some embodiments, when the light emitting component is arranged on the lower surface of the base, the heat generated by the light emitting component is first transferred upward to the surface of the base, and then the heat is further transferred upward to the upper shell 201 through the thermal connection between the base and the upper shell 201, and then the heat is dissipated through the upper shell 201. In some embodiments, when the light emitting component is arranged on the upper surface of the base, the heat generated by the light emitting component is first transferred downward to the surface of the base, and then the heat is further transferred upward to the upper shell 201 through the thermal connection between the base and the upper shell 201, and then the heat is dissipated through the upper shell 201. In comparison, the heat dissipation path of arranging the light emitting component on the lower surface of the base is smoother than the heat dissipation path of arranging the light emitting component on the upper surface of the base. Therefore, in this disclosure, the light emitting component is arranged on the lower surface of the base and the light receiving component is arranged on the upper surface of the base.

[0093] In the present disclosure, in order to achieve a thermal connection between the base and the upper housing 201, the upper surface of the base protrudes upward to form a raised portion, which serves as a heat dissipation protrusion. The raised portion and the upper housing 201 can be thermally connected by means of a thermally conductive gel or a thermally conductive pad. At the same time, the larger spreading surface of the raised portion can increase the heat conduction area between the base and the upper housing 201, thereby improving the heat dissipation effect. In some embodiments, the light receiving component is located on the side of the raised portion. For example, a light receiving component is provided on both sides of the raised portion, and the surface on which the raised portion is located protrudes relative to the surface supporting the light receiving component.

[0094] In the present disclosure, a base mounting portion is formed on the surface of the circuit board 300, and the base is fixed to the surface of the circuit board via the base mounting portion. For example, the base mounting portion may have an opening or other structure. The base is embedded within the base mounting portion, thereby fixing the base to the surface of the circuit board 300. In some embodiments, the size of the base along the width of the circuit board 300 is larger than the size of the base mounting portion, so that the surfaces on both sides of the base mounting portion can support the base, thereby fixing the base to the surface of the circuit board 300.

[0095] In the present disclosure, in order to realize the transmission of multiple optical signals, the optical emitting component can emit multiple optical signals. In some embodiments, when emitting multiple optical signals, they can be emitted separately instead of being combined into a beam of optical signals for transmission. Exemplarily, multiple optical signals are emitted separately through an optical fiber array, and the laser has a corresponding optical fiber ribbon for transmitting the optical signal. In some embodiments, when emitting multiple optical signals, they can be combined into a beam of optical signals for transmission. Exemplarily, when combining, combining can be achieved through an optical multiplexing component. Exemplarily, when combining, combining can be achieved through a combination of different filters, and the transmission and reflection characteristics of the filters for specific wavelengths can be utilized to achieve combining by using a combination of multiple filters. Exemplarily, when combining, combining can also be achieved through a combination of different polarization state devices such as polarizers, and the polarization state devices have different transmission characteristics for light with different polarization directions, and the combination of multiple polarizers can be achieved. Exemplarily, when combining, combining can also be achieved through a combination of filters and polarizers.

[0096] In the present disclosure, in order to realize the reception of multiple optical signals, the optical receiving component may include multiple photodetectors to receive the multiple optical signals. In some embodiments, the multiple optical signals can be received by an optical fiber array, and then the optical path is turned by an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. When turning the optical path, the optical fiber end face can also be formed into a reflective surface by grinding, so as to realize the change of the optical path. For example, when the optical fiber end face is formed into a reflective surface by grinding, the optical fiber can be clamped up and down because the optical fiber is soft. At this time, the optical fiber may be extended or not extended. If the optical fiber is extended, the optical fiber end face can be polished separately. If the optical fiber is not extended, it can be polished together with the upper and lower clamping structures. In some embodiments, a received optical signal can be decomposed into multiple optical signals by an optical demultiplexing component, and then the optical path is turned by an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. In some embodiments, an arrayed waveguide grating (AWG) can be used to decompose a received optical signal into multiple optical signals, and then the optical path is turned so that the multiple optical signals are transmitted to the photodetector separately. The multiplexed signal light containing multiple wavelengths in the AWG is output through the central input channel waveguide, diffracted in the input slab waveguide, reaches the input concave grating for power distribution, and is coupled into the arrayed waveguide area. Because the arrayed waveguide end face is located on the circumference of the grating circle, the diffracted light arrives at the arrayed waveguide end face with the same phase. After transmission through the arrayed waveguide, because adjacent arrayed waveguides maintain the same length difference ΔL, the output light of a certain wavelength of adjacent arrayed waveguides on the output concave grating has the same phase difference. This phase difference is different for light of different wavelengths, so light of different wavelengths is diffracted in the output slab waveguide and focused to different output channel waveguide positions. After being output through the output channel waveguide, the wavelength distribution, i.e., demultiplexing function, is completed.

[0097] In the present disclosure, multiple light signals are emitted separately through an optical fiber array, the laser has corresponding optical fiber ribbons for transmitting the light signals, and when multiple light signals are received through the optical fiber array, since the light emitting component is located on the lower surface of the base and the light receiving component is located on the upper surface of the base, the optical fiber array for the light emitting component is located at the bottom and the optical fiber array for the light receiving component is located at the top.

[0098] In some embodiments of the present disclosure, bases of different structural forms are provided, and optical components of different structural combinations are provided, thereby forming optical modules of different structures. Figure 5A is a structural diagram of a first base provided according to some embodiments of the present disclosure, and Figure 5B is a structural diagram of a first base provided according to some embodiments of the present disclosure. As shown in Figures 5A and 5B, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base can be base 900a.

[0099] FIG5A shows the structure of one surface of the base 900a. As shown in FIG5A , in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the base 900a. The surface shown in FIG5A is regarded as the upper surface of the base 900a, and the other opposite surface is regarded as the lower surface of the base 900a. Exemplarily, the upper surface of the base 900a is used to carry the light receiving component, and the lower surface of the base 900a is used to carry the light emitting component. The light receiving component includes a light receiving passive device, which receives an externally transmitted optical signal through the light receiving passive device, thereby transmitting the optical signal to the interior of the light receiving component. Exemplarily, the light receiving passive device can be an optical fiber array, an optical demultiplexing component, or an AWG, etc. FIG5A shows the structure of the upper surface of the base 900a.

[0100] Because the optical emitting component is located on the lower surface of the base 900a, it generates a significant amount of heat. To dissipate heat from the optical emitting component, the surface of the base 900a protrudes upward to form a raised portion 910a. For example, the middle surface of the base 900a protrudes upward to form the raised portion 910a, while the surfaces on either side do not protrude upward to form a first bearing surface 911a and a second bearing surface 912a, respectively. The upper surface of the base 900a is divided into the raised portion 910a and the first bearing surface 911a and the second bearing surface 912a, respectively, located on either side of the raised portion 910a. The contact between the raised portion 910a and the upper housing transfers heat generated by the optical emitting component to the exterior of the optical module, achieving improved heat dissipation. To achieve multi-channel reception, a first optical receiving passive component is disposed on the first bearing surface 911a, and a second optical receiving passive component is disposed on the second bearing surface 912a.

[0101] In some embodiments, the optical receiving component further includes an optical receiving chip, which is disposed on the surface of the circuit board. The photosensitive surface of the optical receiving chip is perpendicular to the circuit board surface, and the optical signal received by the optical receiving passive device is transmitted in a direction parallel to the circuit board surface. Therefore, an optical path deflection device is provided in the light output direction of the optical receiving passive device to deflect the optical signal in a direction perpendicular to the circuit board surface. Exemplarily, the optical path deflection device can be a deflection prism, which deflects the optical signal in a direction perpendicular to the circuit board surface, thereby transmitting the optical signal to the optical receiving chip.

[0102] The base 900a also has an extension portion 913a extending from the first supporting surface 911a and the second supporting surface 912a. The extension portion 913a is used to support an optical path deflection device, which can be, for example, a deflection prism. To avoid electrical components on the circuit board surface and to correspond to optical passive components, the extension portion 913a includes a first extension portion 9131, a second extension portion 9133, and a notch 9132 located between the first and second extension portions 9131 and 9133. The notch 9132 is used to avoid electrical components on the circuit board, such as resistors or capacitors. The first extension portion 9131 is located at the end of the first supporting surface 911a and is used to accommodate a first optical path deflection device corresponding to the first optical passive component. The second extension portion 9133 is located at the end of the second supporting surface 912a and is used to accommodate a second optical path deflection device corresponding to the second optical passive component. The first extension portion 9131 is provided in the light-emitting direction of the first optical receiving passive device and extends relative to the first bearing surface 911a; the second extension portion 9133 is provided in the light-emitting direction of the second optical receiving passive device and extends relative to the second bearing surface 912a. Since the optical receiving chip array is provided on the surface of the circuit board, and the light receiving surface of the optical receiving chip array is perpendicular to the surface of the circuit board, a first optical path turning device and a second optical path turning device are required to respectively change the transmission direction of the multi-channel optical signal output by the first optical receiving passive device so as to transmit the multi-channel optical signal to the optical receiving chip array, and change the transmission direction of the multi-channel optical signal output by the second optical receiving passive device so as to transmit the multi-channel optical signal to the optical receiving chip array. Exemplarily, the first optical receiving passive device and the second optical receiving passive device can be a first optical fiber array and a second optical fiber array, respectively. In order to achieve optical path matching, the surfaces of the first extension portion 9131 and the second extension portion 9133 are lower than the surfaces of the first bearing surface 911a and the second bearing surface 912a, respectively.

[0103] In some embodiments, in order to limit the position of the optical receiving passive component, a limiting platform is formed between the corresponding extension and the supporting surface. For example, a first limiting platform 914a is formed between the first extension 9131 and the first supporting surface 911a, and a second limiting platform 915a is formed between the second extension 9133 and the second supporting surface 912a. The surface of the first limiting platform 914a is higher than the surface of the first supporting surface 911a to limit the first optical receiving passive component in the first direction; the surface of the second limiting platform 915a is higher than the surface of the second supporting surface 912a to limit the second optical receiving passive component in the first direction. The width of the first limiting platform 914a is the same as the width of the first optical receiving passive component, and the width of the second limiting platform 915a is the same as the width of the second optical receiving passive component, so as to limit the first optical receiving passive component and the second optical receiving passive component in the second direction, respectively. For example, the first direction may be along the length direction of the protruding portion 910 a , and the second direction may be along the width direction of the protruding portion 910 a .

[0104] In some embodiments, since the surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a, and the surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a, a chamfer is formed at the intersection of the limiting platform and the corresponding bearing surface when processing the base. The presence of the chamfer causes the end of the light receiving passive component to be tilted at the chamfer position when mounting the light receiving passive component, resulting in uneven mounting of the light receiving passive component, thereby reducing the stability of the receiving optical path. To this end, a first depression 916a is formed at the intersection of the first limiting platform 914a and the first bearing surface 911a, and a second depression 917a is formed at the intersection of the second limiting platform 915a and the second bearing surface 912a. The provision of the first depression 916a causes the end of the first light receiving passive component to horizontally abut against the wall surface of the first limiting platform 914a, thereby ensuring that the first light receiving passive component is mounted flatly. Similarly, the configuration of the second recessed portion 917a allows the end face of the second optical receiver passive component to horizontally abut the wall surface of the second limiting platform 915a, thereby ensuring that the second optical receiver passive component is mounted smoothly. For example, the surface of the first recessed portion 916a gradually tilts toward the wall surface of the first limiting platform 914a, and the surface of the second recessed portion 917a gradually tilts toward the wall surface of the second limiting platform 915a. This causes the first and second recessed portions 916a and 917a to be recessed near one end of the respective limiting platforms, thereby avoiding interference with the optical receiver passive component, ensuring smooth mounting of the optical receiver passive component, and thus ensuring the stability of the receiving optical path.

[0105] Figure 5B illustrates the structure of another surface of the base 900a, specifically the structure of the lower surface of the base 900a. As shown in Figure 5B, in some embodiments, the lower surface of the base 900a is formed with a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a. Exemplarily, the third bearing surface 921a is used to accommodate the laser assembly in the optical transmission component. A TEC is disposed below the laser assembly, and the TEC and laser assembly are stacked at a certain height. The recessed configuration of the third bearing surface 921a allows the laser assembly to sink until it is flush with the surface of the circuit board 300, thereby ensuring a short bonding distance between the laser assembly and the circuit board 300 surface. The fourth bearing surface 922a is used to accommodate optical transmission passive components. Exemplarily, the optical transmission passive components may be optical fiber arrays or optical multiplexing components. When the optical transmission passive components are optical fiber arrays, the surface of the fifth bearing surface 923a is used to accommodate fiber pigtails.

[0106] In some embodiments, to protect the light-emitting components, a protective cover may be provided on the lower surface of the base 900a. When the light-emitting passive device is an optical fiber array, to prevent the protective cover from pressing against the optical fiber surface and interfering with the optical fiber, a first support portion 924a is formed on both sides of the fifth bearing surface 923a. At the same time, a second support portion 925a may be formed on both sides of the fourth bearing surface 922a to support the protective cover to a certain height, maintaining a certain distance between the inner wall of the protective cover and the optical fiber. In the present disclosure, the first support portion 924a and the second support portion 925a allow the protective cover to be erected to a certain height, thereby creating a certain gap between the protective cover and the optical fiber, thereby preventing interference between the two.

[0107] In order to fix the protective cover on the base 900a, the surfaces of the first supporting parts 924a on both sides are provided with embedding parts 9241, and the protective cover is embedded in the embedding parts 9241, thereby fixing the protective cover on the base 900a. Of course, other structures can also be used to achieve the fixing of the protective cover.

[0108] In some embodiments, an isolator is provided to prevent the optical signal emitted by the laser group from returning to the laser group and affecting the optical signal quality. Exemplarily, the isolator is provided between the optical emitting passive component and the laser group. Accordingly, to accommodate the isolator, a fifth bearing surface 926a is formed between the fourth bearing surface 922a and the third bearing surface 921a. The fifth bearing surface 926a is used to accommodate the isolator.

[0109] In some embodiments, to achieve optical path matching, the surface of the fifth bearing surface 926a is higher than that of the fourth bearing surface 922a. Therefore, when processing the base, a chamfer is formed at the intersection of the fifth bearing surface 926a and the fourth bearing surface 922a. The presence of the chamfer causes the end of the light-emitting passive component to be tilted when mounting the light-emitting passive component, resulting in uneven mounting of the light-emitting passive component and reducing the stability of the emission light path. To this end, a notch 9251 is formed at the end of the second support portion 925a near the fifth bearing surface 926a. The provision of notch 9251 allows the end of the light-emitting passive component to horizontally abut against the wall surface of the fifth bearing surface 926a, thereby ensuring that the light-emitting passive component is mounted flatly and the emission light path is stable.

[0110] In some embodiments, a light-emitting passive component, such as an optical fiber array, can be attached to the fourth supporting surface 922a using glue. Excessive stress generated by the glue during bonding can cause the bottom surface of the light-emitting passive component, such as the optical fiber array, to fracture. Therefore, to prevent stress concentration, protrusions 927a are formed at intervals on the surface of the fourth supporting surface 922a. The spacing of the protrusions 927a disperses the stress generated by the glue, thereby preventing excessive glue stress concentration and ensuring that the light-emitting passive component, such as the optical fiber array, remains intact during attachment.

[0111] As described above, to ensure optical path matching, the surface of the fifth bearing surface 926a is higher than that of the fourth bearing surface 922a. This also serves to limit the position of the light-emitting passive component, such as the optical fiber array, in the first direction. To limit the position of the light-emitting passive component, such as the optical fiber array, in the second direction, the surfaces at both ends of the fifth bearing surface 926a can be recessed downward to form grooves 9261, so that the width of the protruding surface of the fifth bearing surface 926a is the same as the width of the light-emitting passive component, such as the optical fiber array, thereby limiting the position of the light-emitting passive component in the second direction. For example, the first direction can be the length direction of the protrusion 910a, and the second direction can be the width direction of the protrusion 910a.

[0112] Specific embodiments of providing a light receiving component or a light emitting component on the base 900 a will be described in detail in the subsequent description.

[0113] FIG5C is a structural diagram of a circuit board according to some embodiments of the present disclosure. As shown in FIG5C , the circuit board 300 includes a base mounting portion 301 , and the base 900a is embedded in the base mounting portion 301 , thereby fixing the base 900a to the surface of the circuit board 300 .

[0114] In some embodiments, the circuit board 300 is designed for compatibility with different types of optical emitting passive components. When the optical emitting passive component is an optical multiplexing component, multiple optical signals emitted by the laser group are combined into a single optical signal by the optical multiplexing component. This optical signal is converged by a lens and transmitted to a fiber collimator. A fiber pigtail is connected to the fiber collimator, through which the optical signal is transmitted. Because the fiber pigtail has a certain degree of rigidity, it exits horizontally from the port of the fiber collimator, and the exit position is relatively close to the circuit board surface. However, under the influence of gravity, the pigtail moves downward toward the circuit board until it contacts the circuit board, causing interference between the pigtail and the circuit board. To prevent interference between the pigtail and the circuit board, the pigtail can be raised to a certain height, creating a certain gap between the pigtail and the circuit board to prevent interference. When the pigtail is raised, interference between the pigtail and the circuit board surface can occur, and the lack of bending space during the lifting process may cause the pigtail to break. To this end, when there are two optical multiplexing components, the end surface of the base mounting portion 301 is respectively formed with a first notch portion 302 and a second notch portion 303a. For example, the first notch portion 302 and the second notch portion 303a are located at the end of the base mounting portion 301 away from the optical receiving chip. When the pigtail is lifted upward, the first notch portion 302 and the second notch portion 303a provide bending space for the pigtail, so that when the pigtail is lifted, the area of ​​the pigtail that interferes with the circuit board surface can bend downward into the first notch portion 302 and the second notch portion 303a, thereby preventing the pigtail from breaking. It is understandable that when the optical emitting passive device is a fiber array, the fiber output position is far from the circuit board surface, and the thread is sufficient for the pigtail to bend when it reaches the circuit board surface. Therefore, in this case, it is not necessary to form two notches on the end surface of the base mounting portion 301. In the present disclosure, a first notch portion 302 and a second notch portion 303 a are respectively formed on the end surface of the base mounting portion 301 , so that the circuit board 300 is compatible with different types of light emitting passive components.

[0115] Figure 5D is a schematic diagram illustrating the assembly of a first base and a circuit board according to some embodiments of the present disclosure. As shown in Figure 5D, a base mounting portion 301 is formed on the surface of the circuit board 300, and first support portions 924a are formed on both sides of the base 900a. In some embodiments, the first support portions 924a on both sides of the base 900a are embedded within the base mounting portion 301, and then the outward-facing surfaces of the first support portions 924a are respectively attached to the surface of the circuit board 300, thereby securing the base 900a to the surface of the circuit board 300 and achieving a fixed connection between the base 900a and the circuit board 300.

[0116] Figure 6A is a first structural diagram of a second base provided according to some embodiments of the present disclosure, and Figure 6B is a second structural diagram of a second base provided according to some embodiments of the present disclosure. As shown in Figures 6A and 6B, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base can be base 900b.

[0117] Figure 6A illustrates the structure of one surface of base 900b. As shown in Figure 6A , the light receiving component and the light emitting component are disposed on different surfaces of base 900b. For example, the upper surface of base 900b supports the light receiving component, while the lower surface supports the light emitting component. The surface shown in Figure 6A is the upper surface of base 900b, while the opposing surface is the lower surface of base 900b.

[0118] The upper surface of base 900b is raised to form a raised portion 914b. Raised portion 914b functions similarly to raised portion 910a, dissipating heat through contact with the upper housing. Similarly, passive optical receiver components are positioned on either side of raised portion 910a to enable multi-channel reception. These passive optical receiver components may include an optical fiber array, an optical demultiplexing assembly, or an AWG. In some embodiments, these passive optical receiver components also include a fiber collimator.

[0119] The upper surface of the raised portion 914b protrudes upward relative to the upper surface of the base 900b, and one end of the raised portion 914b protrudes from the sidewall of the base 900b. The first light receiving passive component is located on one side of the first sidewall 9141 of the raised portion 914b, and the second light receiving passive component is located on one side of the second sidewall 9142 of the raised portion 914b. The second sidewall 9142 is located opposite the first sidewall 9141.

[0120] The base 900b is provided with a first notch 911b, the edge of which limits the light receiving passive component in the length direction. The specific function of the first notch 911b will be elaborated in the subsequent description.

[0121] The base 900b is provided with a second notch 912b, the edge of which limits the light receiving passive component in the length direction. The specific function of the second notch 912b will be elaborated in the subsequent description.

[0122] The base 900 b is further provided with a third notch 913 b , and the provision of the third notch 913 b facilitates positioning and observation during the installation process of the base 900 b and the circuit board 300 .

[0123] Figure 6B illustrates the structure of the other surface of base 900b. As shown in Figure 6B, the lower surface of base 900b is recessed to form a first recessed portion 915b, which contacts and connects to the upper surface of the circuit board. The bottom surface of first recessed portion 915b is recessed relative to the lower surface of base 900b to minimize the electrical connection between the light-emitting component and the circuit board.

[0124] In some embodiments, the first recessed portion 915b is communicated with the third notch 913b, which facilitates observation and positioning through the third notch 913b during installation.

[0125] Figure 6C is a schematic diagram of the assembly of a second base and a circuit board according to some embodiments of the present disclosure. As shown in Figure 6C, in some embodiments of the present disclosure, the base mounting portion 303 is a hollow structure of the circuit board 300. The base mounting portion 303 includes a first mounting portion 3031 and a second mounting portion 3032. The width of the second mounting portion 3032 is greater than that of the first mounting portion 3031. The first mounting portion 3031 is adjacent to the optical port, and the second mounting portion 3032 is adjacent to the electrical port. A DSP chip is provided on the upper surface of the circuit board 300. The light receiving component is located on the upper surface of the base 900b, and the light emitting component is located on the lower surface of the base 900b.

[0126] The width of the base 900b is greater than the width of the second mounting portion 3032. The base 900b is located on the upper surface of the circuit board 300. The base 900b covers the second mounting portion 3032. The base 900b does not completely cover the first mounting portion 3031. A gap is left between the circuit board and the base 900b to facilitate clamping and installation of the optical fiber connector.

[0127] To shorten the connection between the light emitting assembly and the circuit board, the pins of the light emitting assembly are flush with the lower surface of the circuit board. To achieve avoidance installation of the light emitting assembly, the first recessed portion 915b is located at the second installation portion 3032.

[0128] Figure 7A is a first structural diagram of a third base provided according to some embodiments of the present disclosure, and Figure 7B is a second structural diagram of a third base provided according to some embodiments of the present disclosure. As shown in Figures 7A and 7B, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base can be base 900c.

[0129] Figure 7A illustrates the structure of one surface of base 900c. As shown in Figure 7A , the light receiving component and the light emitting component are disposed on different surfaces of base 900c. For example, the upper surface of base 900c supports the light receiving component, while the lower surface supports the light emitting component. The surface shown in Figure 7A is the upper surface of base 900c, while the opposing surface is the lower surface of base 900c.

[0130] As described above, the surface of the base 900c is formed with a raised portion 914c protruding upward. The contact between the raised portion 914c and the upper housing dissipates heat from the light-emitting component. The surface of the base 900c also includes a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c located on different sides of the raised portion 914c. For example, the first bearing surface 911c and the second bearing surface 912c are located on either side of the raised portion 914c in the longitudinal direction, while the third bearing surface 913c is located on one side of the raised portion 914c in the width direction. The surfaces of the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are all lower than the surface of the raised portion 914c. The second bearing surface 912c is located on the opposite side of the first bearing surface 911c, while the third bearing surface 913c is located adjacent to the first bearing surface 911c.

[0131] To receive multiple optical signals, a first light receiving component is provided on one side of the raised portion 914c, and a second light receiving component is provided on the other side. The light receiving chip in the first light receiving component is located on the surface of the circuit board, while the remaining optical components are located on one side of the base 900c. Similarly, the light receiving chip in the second light receiving component is located on the surface of the circuit board, while the remaining optical components are located on the other side of the base 900c.

[0132] Taking the optical receiving passive devices in the first optical receiving component and the second optical receiving component as arrayed waveguide gratings (AWG) as an example, the first optical receiving passive device arranged on the surface of the first bearing surface 911c is a first AWG, and the second optical receiving passive device arranged on the surface of the second bearing surface 912c is a second AWG.

[0133] Exemplarily, the first and second AWGs can be placed vertically on their respective supporting surfaces, i.e., the light-emitting end faces are upright on the circuit board surface, and the optical signals are arranged vertically, i.e., the plane formed by the optical signals is perpendicular to the circuit board surface. Exemplarily, the first and second AWGs can be placed horizontally on their respective supporting surfaces, i.e., the light-emitting end faces are placed horizontally on the circuit board surface, and the optical signals are arranged flatly, i.e., the plane formed by the optical signals is parallel to the circuit board surface. Exemplarily, the light-emitting ends of the first and second AWGs have a reflective surface. Exemplarily, the light-emitting ends of the first and second AWGs do not have a reflective surface.

[0134] For example, a first AWG and a second AWG can be placed vertically on their respective supporting surfaces, and the light-emitting ends of the first and second AWGs do not have a reflective surface. In this case, the light-emitting end face of the first AWG is vertically positioned on the surface of the first supporting surface 911c, and the light-emitting end face of the first AWG does not have a reflective surface; the light-emitting end face of the second AWG is vertically positioned on the surface of the second supporting surface 912c, and the light-emitting end face of the second AWG does not have a reflective surface. The light-emitting direction of the first and second AWGs is horizontal, that is, parallel to the surface of the circuit board, while the light-receiving direction of the light-receiving chip located on the surface of the circuit board is perpendicular to the surface of the circuit board. Therefore, the optical signals output by the first and second AWGs must pass through an optical path deflection device, such as a deflection prism, to deflect the optical path in order to change the optical path transmission direction, for example, to deflect the optical signal transmission direction from parallel to the circuit board surface to perpendicular to the circuit board surface. Based on this, a first reflective surface and a first optical path deflection device can be provided on the side of the third bearing surface 913C near the first AWG. The optical signal is output from the first AWG and transmitted to the first reflective surface. When output from the first reflective surface, the optical path propagation direction has changed relative to the optical path propagation direction from the first AWG. For example, the optical path propagation direction from the first reflective surface is perpendicular to the optical path propagation direction from the first AWG. The optical signal is reflected by the first reflective surface to the first optical path deflection device, and then deflected downward by the first optical path deflection device to the surface of the optical receiver chip array. Similarly, a second reflective surface and a second deflection prism can be provided on the side near the second AWG. The optical signal is output from the second AWG and transmitted to the second reflective surface. The optical path propagation direction from the second reflective surface has changed relative to the optical path propagation direction from the second AWG. For example, the optical path propagation direction from the second reflective surface is perpendicular to the optical path propagation direction from the second AWG. The optical signal is reflected by the second reflective surface to the second optical path deflection device, and then deflected downward by the second optical path deflection device to the surface of the optical receiver chip array. Exemplarily, the first reflective surface and the second reflective surface may be a first reflective mirror and a second reflective mirror, respectively.

[0135] Taking the example of a first AWG and a second AWG that can be placed vertically on corresponding supporting surfaces, and the light-emitting ends of the first AWG and the second AWG having a reflective surface, the light-emitting end face of the first AWG is upright on the surface of the first supporting surface 911c, and the light-emitting end of the first AWG has a reflective surface; the light-emitting end face of the second AWG is upright on the surface of the second supporting surface 912c, and the light-emitting end of the second AWG has a reflective surface. The light-emitting ends of the first AWG and the second AWG have inclined reflective surfaces, which can replace the functions of the first and second reflective surfaces respectively. Therefore, an optical path turning device such as a first turning prism and a second turning prism is provided in the light-emitting direction of the first AWG and the second AWG. The optical signals output by the first and second AWGs are turned toward the surface of the optical receiving chip through the first turning prism and the second turning prism. The present disclosure vertically arranges the AWGs on the corresponding supporting surfaces, which can reduce their occupied area and thus reduce the size of the base.

[0136] Taking the example that the first AWG and the second AWG can be placed horizontally on the corresponding supporting surfaces, and the light-emitting end faces of the first AWG and the second AWG are both horizontal end faces, optical path turning devices such as a first turning prism and a second turning prism are respectively arranged in the light-emitting directions of the first AWG and the second AWG. The transmission direction of the optical signal is changed by the first turning prism and the second turning prism, and the optical signals output by the first AWG and the second AWG are turned toward the surface of the optical receiving chip.

[0137] In some embodiments, the AWG includes an AWG chip and a capillary, wherein the AWG chip and the capillary are connected by a connecting component. Exemplarily, the connecting component may be glue. To avoid the glue, a first avoidance portion 9111 is formed on the surface of the first bearing surface 911c, and a second avoidance portion 9121 is formed on the surface of the second bearing surface 912c. In some embodiments, to limit the position of each optical device on the third bearing surface 913c, a first limiting groove 9131c is formed on the side of the third bearing surface 913c proximate to the first AWG, and a second limiting groove 9132c is formed on the side proximate to the second AWG.

[0138] Figure 7B illustrates another surface structure of the base 900c. As shown in Figure 7B , the other surface of the base 900c is the lower surface, which is used to mount the light-emitting component. The lower surface of the base 900c is formed with a fourth supporting surface 921c, a fifth supporting surface 922c, and a sixth supporting surface 923c. The fifth supporting surface 922c is located between the fourth supporting surface 921c and the sixth supporting surface 923c.

[0139] In some embodiments, the fourth bearing surface 921c is used to set a laser group for emitting multiple optical signals; the fifth bearing surface 922c is used to set an optical multiplexing component for combining multiple optical signals; and the sixth bearing surface 923c is used to set an optical fiber collimator for transmitting the combined optical signal.

[0140] To limit and secure the optical multiplexing assembly, limiting portions 924c are formed on both sides of the fifth bearing surface 922c. For example, the surfaces of the limiting portions 924c protrude relative to the surface of the fifth bearing surface 922c, and the limiting portions 924c can be structured as limiting bosses, thereby limiting and securing the optical multiplexing assembly.

[0141] Figure 7C is a structural diagram of another circuit board provided according to some embodiments of the present disclosure. As shown in Figure 7C, a light receiving chip 515c and a light receiving chip 525c are respectively provided on the surface of the circuit board 300. The light receiving directions of the two light receiving chips are perpendicular to the surface of the circuit board. Therefore, the light signal needs to be deflected by an optical path deflection device, such as the first deflection prism and the second deflection prism described above, so that the light signal is transmitted to the interior of the light receiving chip.

[0142] To secure the base 900c to the surface of the circuit board 300, a base mounting portion 301 is formed on the surface of the circuit board 300. For example, the base mounting portion 301 may be a through-hole structure. The base 900c is embedded in the base mounting portion 301, thereby achieving a fixed connection between the base 900c and the circuit board 300.

[0143] Figure 7D is a diagram illustrating a third base and circuit board assembly according to some embodiments of the present disclosure. As shown in Figure 7D , in some embodiments, a base mounting portion 301 is formed on the surface of the circuit board 300. For example, the base mounting portion 301 can be a through-hole structure. The retaining portion 924c of the base 900c is embedded within the base mounting portion 301, and the outward-facing surface of the retaining portion 924c is attached to the surface of the circuit board 300, thereby achieving a fixed connection between the base 900c and the circuit board 300.

[0144] FIG8 is a structural diagram of a fourth base provided according to some embodiments of the present disclosure. As shown in FIG8 , in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900d. FIG8 shows the upper surface structure of base 900d. The lower surface structure of base 900d can refer to the lower surface structure of base 900c described above. As with the aforementioned bases, the upper surface of base 900d protrudes upward to form a raised portion 914d. The contact between raised portion 914d and the upper housing achieves heat dissipation for the light emitting component.

[0145] A first bearing surface 911d and a second bearing surface 913d are formed on one side of the protrusion 914d, and the surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d to match the optical path between the optical components; a third bearing surface 912d and a fourth bearing surface 915d are formed on the other side, and the surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d to match the optical path between the optical components.

[0146] In some embodiments, AWGs can be placed horizontally on corresponding supporting surfaces. For example, a first AWG is placed horizontally on the first supporting surface 911d, and a second AWG is placed horizontally on the third supporting surface 912d. The first AWG is placed on the surface of the first supporting surface 911d, with its light-emitting end face placed horizontally on the surface of the first supporting surface 911d, and the light-emitting end face of the first AWG is set as a plane. The second AWG is placed on the surface of the third supporting surface 912d, with its light-emitting end face placed horizontally on the surface of the third supporting surface 912d, and the light-emitting end face of the second AWG is set as a plane.

[0147] Similarly, an optical path deflection device, such as a deflection prism, is required to deflect the optical path of the optical signal output by the AWG in order to transmit the optical signal to the surface of the optical receiving chip. To this end, a first optical path deflection device, such as a first deflection prism, is disposed on the second bearing surface 913d to deflect the optical path of the optical signal output by the first AWG; a second optical path deflection device, such as a second deflection prism, is disposed on the fourth bearing surface 915d to deflect the optical path of the optical signal output by the second AWG. To achieve optical path height matching, the surface of the second bearing surface 913d is lower than that of the first bearing surface 911d, and the surface of the fourth bearing surface 915d is lower than that of the third bearing surface 912d.

[0148] To transmit the optical signal output by the AWG to the surface of the optical receiver chip, a portion of the first turning prism is mounted on the surface of the circuit board 300, while the other portion is suspended in the air, allowing the optical signal to pass through the first turning prism and be transmitted to the surface of the optical receiver chip. The second turning prism is arranged similarly.

[0149] In order to facilitate the positioning of the corresponding turning prism, the end surface of the protrusion 914d is flush with the end surfaces of the second supporting surface 913d and the fourth supporting surface 915d respectively.

[0150] To avoid the connection components between the AWG chip and the capillary in the AWG, a first stopper 919d is formed on the surface of the first bearing surface 911d, and a second stopper 918d is formed on the surface of the third bearing surface 912d, respectively, to avoid the connection components. For example, the connection components can be glue.

[0151] In some embodiments, in order to limit and fix the AWG, a blocking portion 917d is formed on the side of the first supporting surface 911d, and a blocking portion 916d is formed on the side of the third supporting surface 912d, so as to respectively block the first AWG and the second AWG at a certain height, thereby limiting and fixing the AWG.

[0152] FIG9 is a structural diagram of a fifth base provided according to some embodiments of the present disclosure. As shown in FIG9 , in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900e. FIG9 shows the upper surface structure of base 900e. The lower surface structure of base 900e can refer to the lower surface structure of base 900c described above. As with the aforementioned bases, the upper surface of base 900e is formed with a protrusion 914e protruding upward. The contact between protrusion 914d and the upper housing achieves heat dissipation for the light emitting component.

[0153] A first supporting surface 911e and a second supporting surface 912e are formed on one side of the raised portion 914e. For example, to facilitate positioning of the optical device, the end surfaces of the first supporting surface 911e and the second supporting surface 912e may be flush with the end surface of the raised portion 914e. The surface of the raised portion 914e is relatively protruding from the first supporting surface 911e and the second supporting surface 912e.

[0154] To receive multiple optical signals, a first light receiving component is provided on the first bearing surface 911e, and a second light receiving component is provided on the second bearing surface 912e. In some embodiments, the first light receiving component may include a first fiber collimator, a first optical demultiplexer, and a first turning prism; the second light receiving component may include a second fiber collimator, a second optical demultiplexer, and a second turning prism.

[0155] The first fiber collimator, the first optical demultiplexing component, and the first turning prism are separately located on the surface of the first bearing surface 911e; the second fiber collimator, the second optical demultiplexing component, and the second turning prism are separately located on the surface of the second bearing surface 912e.

[0156] The first turning prism is arranged on the side of the first bearing surface 911e close to the optical receiving chip to turn the optical path of the multiple optical signals output by the first optical demultiplexing component to the surface of the optical receiving chip, and transmit the optical signals to the surface of the optical receiving chip; the second turning prism is arranged on the side of the second bearing surface 912e close to the optical receiving chip to turn the optical path of the multiple optical signals output by the second optical demultiplexing component to the surface of the optical receiving chip, and transmit the optical signals to the surface of the optical receiving chip.

[0157] Figure 10 is an assembly structure diagram of a light receiving component provided according to some embodiments of the present disclosure; Figure 11 is an assembly exploded view of a light receiving component provided according to some embodiments of the present disclosure. As shown in Figures 10 and 11, in some embodiments, taking the base as the base 900a as an example, the base 900a is embedded in the surface of the circuit board 300. Different surfaces of the base 900a are used to set the light receiving component and the light emitting component. For example, the upper surface of the base 900a is used to set the light receiving component 500a, and the lower surface is used to set the light emitting component 400a. Among them, the "upper surface" refers to the surface shown in Figure 10, and the "lower surface" is the surface opposite to the upper surface. The light receiving component 500a of the present disclosure can also be set on the lower surface of the base 900a, and the light emitting component 400a can also be set on the upper surface of the base 900a.

[0158] The surface of the base 900a is covered with a first protective cover 530a to protect the optical components of the light receiving component 500a provided on the surface of the base 900a. For example, when part of the optical components in the light receiving component are provided on the upper surface of the base 900a, the upper surface of the base 900a is covered with the first protective cover 530a.

[0159] Part of the surface of the base 900a protrudes upward to form a raised portion 910a. To receive multiple optical signals, a first light receiving component 510a is provided on one side of the raised portion 910a, and a second light receiving component 520a is provided on the other side of the raised portion 910a.

[0160] In some embodiments, the first protective cover 530a has a first notch 531a and a second notch 532a. The first notch 531a is used to avoid the protrusion 910a, and the second notch 532a is used to avoid electrical components on the surface of the circuit board 300, such as capacitors and resistors. Exemplarily, the first notch 531a faces the protrusion 910a and connects to the end of the protrusion 910a to avoid the protrusion 910a; the second notch 532a faces the circuit board to avoid electrical components on the surface of the circuit board 300.

[0161] Figure 12 is a cross-sectional structural diagram of an optical receiving component provided according to some embodiments of the present disclosure. As shown in Figure 12, as previously described, to achieve multi-path reception, a first optical receiving passive component is disposed on a first bearing surface 911a located on one side of a raised portion 910a, while a second optical receiving passive component is disposed on a second bearing surface 912a located on the other side of the raised portion 910a. A first extension 9131 is formed at the end of the first bearing surface 911a, and a second extension 9133 is formed at the end face of the second bearing surface 912a.

[0162] In some embodiments, the first light receiving passive component in the first light receiving component 510a may be an optical fiber array or other forms of optical receiving passive components. The optical fiber array in the first light receiving component 510a is described as a first optical fiber array 511a, and the optical fiber array in the second light receiving component 520a is described as a second optical fiber array 521a.

[0163] The first light receiving component 510a also includes a first turning prism to adjust the transmission direction of the optical signal received by the first optical fiber array from parallel to the surface of the circuit board to perpendicular to the surface of the circuit board. Similarly, the second light receiving component 520a also includes a second turning prism to adjust the transmission direction of the optical signal received by the second light receiving array from parallel to the surface of the circuit board to perpendicular to the surface of the circuit board. A lens, such as a converging lens, is provided in the light incident direction of the first turning prism or the second turning prism to improve the light coupling efficiency. The structural component including the lens and the first turning prism or the second turning prism is described as a lens assembly. Then a first lens assembly 512a is provided in the light emitting direction of the first optical fiber array, and a second lens assembly 522a is provided in the light emitting direction of the second optical fiber array.

[0164] The first optical fiber array 511a is disposed on the surface of the first supporting surface 911a, and the first lens assembly 512a is disposed on the surface of the first extension portion 9131; the second optical fiber array 521a is disposed on the surface of the second supporting surface 912a, and the second lens assembly 522a is disposed on the surface of the second extension portion 9133.

[0165] In some embodiments, the first light receiving component 510a also includes a light receiving chipset and a transimpedance amplifier provided on the surface of the circuit board. Exemplarily, the light receiving chipset includes a plurality of light receiving chips 513a, and the light receiving chips 513a are used to convert optical signals into electrical signals; the light receiving chips 513a are electrically connected to the transimpedance amplifier 514a to amplify the electrical signals through the transimpedance amplifier. Exemplarily, the light receiving chips 513a and the transimpedance amplifier 514a can be connected by wire bonding to achieve electrical connection between the two. The surface of the light receiving chip 513a has a first connecting pad, and the surface also has a photosensitive surface. Usually, the first connecting pad of the light receiving chip and the photosensitive surface are located on the same surface; the surface of the transimpedance amplifier has a second connecting pad, and the first connecting pad and the second connecting pad are connected by wire bonding to achieve electrical connection between the two. At this time, the photosensitive surface and the first connecting pad of the light receiving chip 513a are facing upward, and the photosensitive surface is exposed to the air. In order to reduce the reflection of the light signal into the air and allow more light signals to be absorbed into the photosensitive surface, the surface of the photosensitive surface will be coated with an anti-reflection film. The refractive index of the anti-reflection film is greater than the refractive index of the air, so that more light signals can be transmitted into the photosensitive surface, thereby ensuring the light receiving power.

[0166] FIG13 is a schematic diagram of an electrical connection between an optical receiving chip and a transimpedance amplifier provided according to some embodiments of the present disclosure. FIG13 shows another way of electrically connecting the optical receiving chip and the transimpedance amplifier. As shown in FIG13 , in some embodiments, the transimpedance amplifier 514a is provided on the surface of the circuit board 300, and the first connection pad on the surface of the optical receiving chip 513a is welded to the second connection pad on the surface of the transimpedance amplifier 514a, thereby electrically connecting the optical receiving chip 513a and the transimpedance amplifier 514a. That is, the optical receiving chip 513a is attached upside down to the surface of the transimpedance amplifier 514a, and the photosensitive surface of the optical receiving chip 513a is arranged facing downward. In order to transmit the light signal to the photosensitive surface, a lens is provided on the surface of the optical receiving chip 513a exposed to the air, and an optical through hole can be formed between the lens and the photosensitive surface, and the light signal is transmitted to the photosensitive surface through the optical through hole, thereby realizing the reception of the light signal. By flip-chip bonding the optical receiving chip 513a to the transimpedance amplifier 514a, parasitic effects caused by wire bonding can be avoided, thereby improving signal transmission performance. At the same time, since the photosensitive surface of the optical receiving chip 513a is not exposed to the air, the reflection of the optical signal into the air is reduced, thereby ensuring the optical receiving power.

[0167] In some embodiments, a second connecting pad is provided on the surface of the transimpedance amplifier 514a, the photosensitive surface of the light receiving chip 513a is set upward, and then bonded to the surface of the second connecting pad with glue, and the first connecting pad and the second connecting pad are electrically connected through metal vias, thereby realizing electrical connection between the light receiving chip 513a and the transimpedance amplifier 514a.

[0168] FIG14 is a structural diagram of an optical receiving component provided according to some embodiments of the present disclosure; FIG15 is an exploded view of an optical receiving component provided according to some embodiments of the present disclosure; and FIG16 is a structural diagram of a lens assembly provided according to some embodiments of the present disclosure. As shown in FIG14-16, the middle surface of the base 900a protrudes upward to form a raised portion 910a, and the surfaces on both sides respectively form a first bearing surface 911a and a second bearing surface 912a. One end of the first bearing surface 911a extends to form a first extension portion 9131, and one end of the second bearing surface 912a extends to form a second extension portion 9133. One side of the raised portion 910a is used to set the first optical receiving component, and the other side is used to set the second optical receiving component to achieve the reception of multiple optical signals.

[0169] The first bearing surface 911a and the first extension portion 9131 are respectively used to support the first optical fiber array 511a and the first lens assembly 512a. The first lens assembly 512a is used to redirect optical signals received by the first optical fiber array 511a toward the surface of the circuit board 300, thereby transmitting the optical signals to the surface of the optical receiving chip. The second bearing surface 912a and the second extension portion 9133 are respectively used to support the second optical fiber array 521a and the second lens assembly 522a. The second lens assembly 522a is used to redirect optical signals received by the second optical fiber array 521a toward the surface of the circuit board 300, thereby transmitting the optical signals to the surface of the optical receiving chip.

[0170] In some embodiments, to respectively limit the position of the first optical fiber array 511a and the second optical fiber array 521a, a first limiting platform 914a is formed between the first extension 9131 and the first supporting surface 911a, and a second limiting platform 915a is formed between the second extension 9133 and the second supporting surface 912a. The surface of the first limiting platform 914a is higher than the surface of the first supporting surface 911a to limit the position of the first optical fiber array 511a in a first direction; the surface of the second limiting platform 915a is higher than the surface of the second supporting surface 912a to limit the position of the second optical fiber array 521a in the first direction. Exemplarily, the first direction can be along the length of the raised portion 910a. The width of the two limiting platforms is the same as the width of the corresponding optical fiber array to limit the position of the first optical fiber array 511a and the second optical fiber array 521a in a second direction. Exemplarily, the second direction can be along the width of the raised portion 910a.

[0171] In some embodiments, since the surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a, and the surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a, a chamfer is formed at the intersection of the limiting platform and the corresponding bearing surface when processing the base. The presence of the chamfer causes the end of the light receiving passive component to be tilted at the chamfer position when mounting the light receiving passive component, resulting in uneven mounting of the light receiving passive component, thereby reducing the stability of the receiving optical path. To this end, a first depression 916a is formed at the intersection of the first limiting platform 914a and the first bearing surface 911a, and a second depression 917a is formed at the intersection of the second limiting platform 915a and the second bearing surface 912a. The provision of the first depression 916a causes the end of the first light receiving passive component to horizontally abut against the wall surface of the first limiting platform 914a, thereby ensuring that the first light receiving passive component is mounted flatly. Similarly, the configuration of the second recessed portion 917a allows the end face of the second optical receiver passive component to horizontally abut the wall surface of the second limiting platform 915a, thereby ensuring that the second optical receiver passive component is mounted smoothly. For example, the surface of the first recessed portion 916a gradually tilts toward the wall surface of the first limiting platform 914a, and the surface of the second recessed portion 917a gradually tilts toward the wall surface of the second limiting platform 915a. This causes the first and second recessed portions 916a and 917a to be recessed near one end of the respective limiting platforms, thereby avoiding interference with the optical receiver passive component, ensuring smooth mounting of the optical receiver passive component, and thus ensuring the stability of the receiving optical path.

[0172] As shown in Figure 15, the first lens assembly 512a is disposed on the surface of the first extension portion 9131, and the second lens assembly 522a is disposed on the surface of the second extension portion 9133. To ensure that the optical paths of the first lens assembly 512a and the first optical fiber array 511a are at the same height, the surface of the first extension portion 9131 is lower than the surface of the first supporting surface 911a; similarly, the surface of the second extension portion 9133 is lower than the surface of the second supporting surface 912a.

[0173] In the present disclosure, to facilitate mounting the optical receiver chip array on the surface of the circuit board 300, the extension lengths of the first extension portion 9131 and the second extension portion 9133 expose the optical receiver chip array. A first optical path deflection device is provided on the surface of the first extension portion 9131 via a first substrate; the extension length of the first substrate is longer than the extension length of the first extension portion 9131, thereby extending the first optical path deflection device to the surface of the optical receiver chip array. Similarly, a second optical path deflection device is provided on the surface of the second extension portion 9133 via a second substrate; the extension length of the second substrate is longer than the extension length of the second extension portion, thereby extending the second optical path deflection device to the surface of the optical receiver chip array.

[0174] As shown in Figures 15 and 16, the first lens assembly 512a includes a substrate 5121, a backing plate 5122, a converging lens 5123, and a turning prism 5124. Correspondingly, the second lens assembly 522a also includes the same optical components. The substrate 5121 is the first substrate mentioned above.

[0175] In the present disclosure, an optical receiver chip and a TIA are mounted on the surface of the circuit board 300 below the first and second extensions 9131 and 9133. To facilitate mounting of the optical receiver chip and the TIA, the first and second extensions 9131 and 9133 should be extended to a limited extent, as this would increase the difficulty of mounting the optical receiver chip and the TIA. For example, the extended lengths of the first and second extensions 9131 and 9133 expose the optical receiver chip and the TIA, facilitating mounting of the optical receiver chip and the TIA.

[0176] One end of the substrate 5121 supports a backing plate 5122, which in turn supports a converging lens 5123. The other end of the substrate 5121 supports a turning prism 5124. The substrate 5121 is longer than the first extension 9131 and the second extension, extending the turning prism 5124 above the optical receiver chip and the TIA.

[0177] To ensure that the light output by the turning prism 5124 is transmitted to the surface of the light receiving chip, the support surface of the substrate 5121 used to support the turning prism 5124 has a light-transmitting opening. This allows the light output by the turning prism 5124 to pass through the light-transmitting opening and reach the surface of the light receiving chip. For example, the support surface of the substrate 5121 used to support the turning prism 5124 is U-shaped. The arms on either side of the U-shaped support surface support the turning prism 5124. The opening in the center of the U-shaped support surface is the light-transmitting opening. This allows the light output by the turning prism 5124 to pass through the light-transmitting opening and reach the surface of the light receiving chip.

[0178] For example, the substrate 5121 supports the turning prism 5124, thereby extending the turning prism 5124 above the optical receiving chip and the TIA. The backing plate 5122 supports the converging lens 5123, so that the optical path of the converging lens 5123 matches the optical path of the turning prism 5124. The end surface of the backing plate 5122 facing the turning prism 5124 is supported and connected to the turning prism 5124, and the end surface of the backing plate 5122 facing the turning prism 5124 can be used to limit and fix the turning prism 5124.

[0179] Figure 17 is a schematic diagram of the assembly of another light receiving component provided according to some embodiments of the present disclosure; Figure 18 is a schematic diagram of the structure of another light receiving component provided according to some embodiments of the present disclosure; and Figure 19 is a schematic diagram of the exploded view of another light receiving component provided according to some embodiments of the present disclosure. As shown in Figures 17-19, in some embodiments, taking base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, and base 900b is located above base mounting portion 303. The light receiving component is located above base 900b, and the light emitting component is located below base 900b.

[0180] To enable reception of multiple optical signals, a first light receiving component 510b is provided on one side of the raised portion, and a second light receiving component 520b is provided on the other side. The first and second light receiving components 510b, 520b are disposed on the same surface of the base. For example, the first and second light receiving components 510b, 520b are disposed on the upper surface of the base. For example, a raised portion 914b is formed on the upper surface of the base 900b, protruding upward. The first and second light receiving components 510b, 520b are disposed on either side of the raised portion 914b, respectively.

[0181] In some embodiments, the first light receiving component 510b includes a first optical collimator 511b, a first demultiplexer 512b, a first lens assembly 513b, a first optical chipset 514b, and a first transimpedance amplifier 515b. The first optical collimator 511b and the first demultiplexer 512b are located on the upper surface of the base 900b, on one side of the first sidewall 9141 of the raised portion 914b. The first lens assembly 513b, the first optical chipset 514b, and the first transimpedance amplifier 515b are located on the upper surface of the circuit board 300.

[0182] To facilitate assembly, the first sidewall 9141 positions the first optical collimator 511b and the first demultiplexer 512b. These optical collimators 511b and 512b are connected to the top surface of the base 900b. The first lens assembly 513b includes a first coupling substrate, a first converging lens group, and a first reflective prism. The first coupling substrate, located on the top surface of the circuit board, provides an appropriate mounting height for the first converging lens group and the first reflective prism. This ensures that the central axes of the first converging lens group and the first reflective prism align with the height of the first optical collimator 511b and the first demultiplexer 512b, achieving optical path coupling.

[0183] The first optical collimator 511b is connected to the optical fiber adapter via an optical fiber, receiving and collimating external signal light. The first demultiplexer 512b demultiplexes the signal light from the first optical collimator 511b, forming signal lights with different wavelengths. The first converging lens group converges the demultiplexed signal light, and the first reflecting prism reflects the converged light to the first optical chipset 514b. The first optical chipset 514b converts the optical signal into an electrical signal and transmits it to the first transimpedance amplifier 515b.

[0184] The second light receiving component 520b includes a second optical collimator 521b, a second demultiplexer 522b, a second lens assembly 523b, a second optical chipset group 524b, and a second transimpedance amplifier 525b. The second optical collimator 521b and the second demultiplexer 522b are located on the top surface of the base 900b, on the side of the second sidewall 9142 of the raised portion 914b. The second lens assembly 523b, the second optical chipset group 524b, and the second transimpedance amplifier 525b are located on the top surface of the circuit board 300.

[0185] To facilitate assembly, the second sidewall 9142 positions the second demultiplexer 522b. The second optical collimator 521b and the second demultiplexer 522b are connected to the upper surface of the base 900b. To align the optical center axes of the second optical collimator 521b, the second demultiplexer 522b, and the second lens assembly, the second lens assembly 523b includes a second coupling substrate, a second converging lens group, and a second reflecting prism. The second coupling substrate is located on the upper surface of the circuit board and provides a mounting platform for the second converging lens group and the second reflecting prism. This ensures that the center axes of the second converging lens group and the second reflecting prism are aligned with the height of the second optical collimator 521b and the second demultiplexer 522b, achieving optical path coupling.

[0186] The second optical collimator 521b is connected to the optical fiber adapter via an optical fiber, receives signal light from the outside and collimates the signal light. The second demultiplexer 522b demultiplexes the signal light from the second optical collimator 521b to form signal light with different wavelengths. The second converging lens group converges the demultiplexed signal light, and the second reflecting prism reflects the converged light to the second optical chip group 524b. The second optical chip group 524b converts the optical signal into an electrical signal and transmits it to the second transimpedance amplifier 525b. The first converging lens group and the second converging lens group can be set on a base or on a circuit board.

[0187] The surface of the base 900b can also be covered with a first protective cover to protect the light receiving component provided on the surface of the base 900a. For example, when part of the optical components in the light receiving component are provided on the upper surface of the base 900b, the upper surface of the base 900b is covered with the first protective cover to protect the optical components.

[0188] Figure 20 is an assembly structure diagram of another light receiving component provided according to some embodiments of the present disclosure; Figure 21 is a structural schematic diagram of another light receiving component provided according to some embodiments of the present disclosure; Figure 22 is a decomposition schematic diagram of another light receiving component provided according to some embodiments of the present disclosure; as shown in Figures 20-22, in some embodiments, taking the base as the base 900c as an example, the light receiving component 500c and the light emitting component 400c are respectively located on different surfaces of the base 900c. Exemplarily, the light receiving component 500c is located on the upper surface of the base 900c, and the light emitting component 400c is located on the lower surface of the base 900c. The circuit board 300 is provided with a base mounting portion 303, and the base 900c is located above the base mounting portion 303.

[0189] In some embodiments, the light receiving component 500c and the light emitting component 400c are located on different surfaces of the base 900c. The upper surface of the base 900c is formed with a raised portion 914c protruding upward. The raised portion 914c contacts the upper housing to dissipate heat from the light emitting component. The upper surface of the base 900c also includes a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c located on different sides of the raised portion 914c. For example, the first bearing surface 911c and the second bearing surface 912c are located on either side of the raised portion 914c in the longitudinal direction, while the third bearing surface 913c is located on one side of the raised portion 914c in the width direction. The surfaces on which the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located are all lower than the surface of the raised portion 914c.

[0190] To achieve multi-path reception, a first light receiving component is provided on one side of the raised portion 914c, and a second light receiving component is provided on the other side of the raised portion 914c. Taking the example of the passive light receiving components in the first and second light receiving components being AWGs, a first light receiving passive component, such as a first AWG, is provided on the surface of the first bearing surface 911c, and a second light receiving passive component, such as a second AWG, is provided on the surface of the second bearing surface 912c. As shown in Figures 21 and 22, assuming that the first and second AWGs can be vertically placed on their respective bearing surfaces, and that the light emitting end faces of the first and second AWGs do not have a reflective surface, the first light receiving component is located on one side of the raised portion 914c, and the second light receiving component is located on the other side of the raised portion 914c, to achieve reception of multiple optical signals.

[0191] In some embodiments, the first light receiving component includes a first AWG 511c, a first reflective surface 513c, a first turning prism 514c, and a light receiving chip disposed on the surface of a circuit board. The first turning prism 514c serves as a first optical path turning device. To improve optical coupling efficiency, a first lens 512c is further disposed between the light-emitting end face of the first AWG 511c and the first reflective surface 513c. The optical signals demultiplexed by the first AWG 511c are converged by the first lens 512c and then reflected by the first reflective surface 513c into the first turning prism 514c. The first reflective surface 513c reflects the optical signals toward the light-entering end face of the first turning prism 514c. The first turning prism 514c bends the optical path of the received optical signals perpendicular to the circuit board surface to transmit the optical signals to the optical receiving chip on the surface of the circuit board 300. The light-entering end face and the light-emitting end face of the first turning prism 514c are located on adjacent sides. The first reflective surface 513c is provided at the light-entering end face of the first turning prism 514c, and the optical receiving chip is provided below the light-emitting end face. In some embodiments, the second optical receiving component includes a second AWG 521c, a second reflective surface 523c, a second turning prism 524c, and an optical receiving chip disposed on the circuit board surface. The second turning prism 524c serves as a second optical path deflection device. For example, to improve optical coupling efficiency, a second lens 522c is further provided between the light emitting end face of the second AWG 521c and the second reflective surface 523c. The optical path principle of the second light receiving component can refer to the optical path principle of the first light receiving component.

[0192] In the present disclosure, the first lens 512c is disposed between the light-emitting path of the first light-receiving passive component and the first reflective surface 513c. One end of the first lens 512c is disposed at one end of the third supporting surface, and the other end of the first lens 512c is used to support the first reflective surface 513c. The second lens 522c is disposed between the light-emitting path of the second light-receiving passive component and the second reflective surface 523c. One end of the second lens 522c is disposed at the other end of the third supporting surface, and the other end of the second lens 522c is used to support the second reflective surface 523c.

[0193] One end of the first optical path turning component is connected to the side wall of the raised portion, and the other end is suspended in the air. One end of the second optical path turning component is connected to the side wall of the raised portion, and the other end is suspended in the air. The light input end of the first turning prism faces the light output end face of the first reflective surface, and the light output end faces the light receiving chip array. The light input end of the second turning prism faces the light output end face of the second emitting surface, and the light output end faces the light receiving chip array.

[0194] The first lens 512c, the first reflective surface 513c, and the first turning prism 514c are respectively disposed on one side of the third supporting surface 913c; the second lens 522c, the second reflective surface 523c, and the second turning prism 524c are respectively disposed on the other side of the third supporting surface 913c. The first lens 512c and the first reflective surface 513c are fixed together using optical adhesive, and similarly, the second lens 522c and the second reflective surface 523c are fixed together using optical adhesive.

[0195] In some embodiments, the AWG includes an AWG chip and a capillary, wherein the AWG chip and the capillary are connected via a connecting component. Exemplarily, the connecting component may be glue. To avoid the glue, a first avoidance portion 9111 is formed on the surface of the first bearing surface 911c, and a second avoidance portion 9121 is formed on the surface of the second bearing surface 912c. Because the connecting component has a certain thickness, to further avoid the connecting component, the width of one end of the raised portion 910a near the third bearing surface 913c is greater than the width of the other end, thereby further avoiding the connecting component and providing sufficient space for the pigtails of the first AWG 511c and the second AWG 521c to prevent the pigtails from being bent.

[0196] In some embodiments, to limit the position of the optical element on the third supporting surface 913c, a first limiting groove 9131c is formed on the side of the third supporting surface 913c near the first AWG, and a second limiting groove 9132c is formed on the side near the second AWG. For example, the first lens 512c is disposed in the first limiting groove 9131c, and then the first reflective surface 513c is fixed to the light-emitting end surface of the first lens 512c; the second lens 522c is disposed in the second limiting groove 9132c, and then the second reflective surface 523c is fixed to the light-emitting end surface of the second lens 522c.

[0197] FIG23 is a top view of another optical receiving component provided according to some embodiments of the present disclosure. As shown in FIG23 , the first AWG 511c and the second AWG 521c are respectively arranged on both sides of the raised portion 914c. The first lens 512c is arranged on the first limiting groove 9131c, and then the first reflective surface 513c is fixed to the light-emitting end surface of the first lens 512c; the second lens 522c is arranged on the second limiting groove 9132c, and then the second reflective surface 523c is fixed to the light-emitting end surface of the second lens 522c. The first turning prism 514c and the second turning prism 524c are respectively fixed to the end surface of the raised portion 914c facing the third supporting surface 913c. The end surface of the raised portion 914c facing the third supporting surface 913c serves to limit and fix the first turning prism 514c and the second turning prism 524c.

[0198] In some embodiments, one end of the first turning prism 514c and the second turning prism 524c is disposed on the surface of the third supporting surface 913c, and the other end is suspended in the air to output the turned optical signal.

[0199] Figure 24 is a schematic diagram of the structure of another optical receiving component provided according to some embodiments of the present disclosure; Figure 25 is a schematic diagram of an exploded view of another optical receiving component provided according to some embodiments of the present disclosure; and Figure 26 is a schematic diagram of a top view of another optical receiving component provided according to some embodiments of the present disclosure. As shown in Figures 24-26, taking the example of a first AWG and a second AWG that can be vertically placed on corresponding supporting surfaces and the light-emitting ends of the first AWG and the second AWG having a reflective surface, the optical receiving component in this case is defined as an optical receiving component 500d. In order to achieve the reception of multiple optical signals, the optical receiving component 500d includes a first optical receiving component and a second optical receiving component. The first optical receiving component includes a first AWG 511d. The light-emitting end face of the first AWG 511d has a reflective surface that reflects the optical signal toward the light-incident end face of the first turning prism 513d. A light-receiving chip is disposed below the light-emitting end face of the first turning prism 513d. The optical signal is reflected from the light-emitting end face of the first AWG 511d and then incident on the first turning prism 513d. The turning of the first turning prism 513d then bends the optical signal downward, thereby transmitting the optical signal to the surface of the light-receiving chip. To improve optical coupling efficiency, a first converging lens 512d is fixedly attached to the light-emitting end face of the first AWG 511d to improve optical coupling efficiency. The second optical receiving component includes a second AWG 521d. The light-emitting end face of the second AWG 521d also has a reflective surface, which reflects the optical signal toward the light-incident end face of the second turning prism 523d. A light-receiving chip is disposed below the light-emitting end face of the second turning prism 523d. The second turning prism 523d ​​is used to deflect the optical signal toward the surface of the light-receiving chip below, thereby transmitting the optical signal to the surface of the light-receiving chip. Similarly, to improve optical coupling efficiency, a second converging lens 522d is fixedly connected to the light-emitting end face of the second AWG 521d to improve optical coupling efficiency.

[0200] Figure 27 is a schematic diagram of the assembly of another light receiving component provided according to some embodiments of the present disclosure; Figure 28 is a schematic diagram of the structure of another light receiving component provided according to some embodiments of the present disclosure. As shown in Figures 27 and 28, in some embodiments, taking base 900d as an example, the light receiving component 500e and the light emitting component are located on different surfaces of base 900d. For example, the light receiving component 500e is located on the upper surface of base 900d, and the light emitting component is located on the lower surface of base 900d. The upper surface of base 900d is formed with a raised portion 914d protruding upward. The contact between the raised portion 914d and the upper housing dissipates heat from the light emitting component. A first bearing surface 911d and a second bearing surface 913d are formed on one side of the raised portion 914d; a third bearing surface 912d and a fourth bearing surface 915d are formed on the other side of the raised portion 914d.

[0201] In some embodiments, the AWG can be placed horizontally on the corresponding supporting surface. For example, the first AWG 511e is placed horizontally on the first supporting surface 911d, and the second AWG 521e is placed horizontally on the third supporting surface 912d. Since the first AWG 511e and the second AWG 521e emit light horizontally, an optical path turning device such as a turning prism is required to turn the optical path of the optical signal output by the AWG so as to transmit the optical signal to the surface of the optical receiving chip. Based on this, a first turning prism 512e is set on the surface of the second supporting surface 913d to turn the optical path of the optical signal output by the first AWG 511e; and a second turning prism 522e is set on the surface of the fourth supporting surface 915d to turn the optical path of the optical signal output by the second AWG 521e. In order to achieve matching in optical path height, the surface of the second supporting surface 913d is lower than the surface of the first supporting surface 911d, and the surface of the fourth supporting surface 915d is lower than the surface of the third supporting surface 912d.

[0202] To transmit the optical signal output by the AWG to the surface of the optical receiving chip, a portion of the first turning prism 512e is mounted on the surface of the circuit board 300, while the remaining portion is suspended in the air, allowing the optical signal to pass through the first turning prism 512e and be transmitted to the surface of the optical receiving chip. The second turning prism 522e is similarly configured. In some embodiments, to facilitate positioning of the first turning prism 512e and the second turning prism 522e, the end faces of the raised portion 914d are flush with the end faces of the second bearing surface 913d and the fourth bearing surface 915d, respectively.

[0203] To avoid the connection components between the AWG chip and the capillary in the AWG, a first stopper 919d is formed on the surface of the first bearing surface 911d, and a second stopper 918d is formed on the surface of the third bearing surface 912d, respectively, to avoid the connection components. For example, the connection components can be glue.

[0204] In order to limit and fix the AWG, a blocking portion 917d is formed on the side of the first bearing surface 911d, and a blocking portion 916d is formed on the side of the third bearing surface 912d, so as to respectively block the first AWG 511e and the second AWG 521e at a certain height, thereby limiting and fixing the AWG.

[0205] Figure 29 is a schematic diagram of the assembly of another light receiving component according to some embodiments of the present disclosure; Figure 30 is a schematic diagram of the structure of another light receiving component according to some embodiments of the present disclosure. As shown in Figures 29 and 30, in some embodiments, taking base 900e as an example, base 900e is connected to circuit board 300, and a light receiving component 500f is provided on the surface of base 900e.

[0206] As described above, the upper surface of the base 900e protrudes upward to form a raised portion 914e. The contact between the raised portion 914d and the upper housing dissipates heat from the light-emitting component. A first bearing surface 911e and a second bearing surface 912e are formed on one side of the raised portion 914e. For example, to facilitate positioning of the optical device, the end surfaces of the first bearing surface 911e and the second bearing surface 912e may be flush with the end surface of the raised portion 914e. The surface of the raised portion 914e protrudes relatively beyond the first bearing surface 911e and the second bearing surface 912e.

[0207] To receive optical signals along the optical path, partial optical components of a first light receiving component are provided on the surface of the first bearing surface 911e, and partial optical components of a second light receiving component are provided on the surface of the second bearing surface 912e. In some embodiments, the partial optical components of the first light receiving component include a first fiber collimator 511f, a first converging lens 512f, a first optical demultiplexing assembly 513f, a first collimating lens 514f, and a first turning prism 515f. In addition to the aforementioned optical components, the first light receiving component also includes a light receiving chip provided on the surface of the circuit board 300. Exemplarily, the light receiving chips are provided on the surface of the circuit board 300 in an array. The external optical signal is transmitted into the first optical receiving component via the first optical fiber collimator 511f. After being converged by the first converging lens 512f, the optical signal is transmitted to the first optical demultiplexing component 513f. After wavelength demultiplexing by the first optical demultiplexing component 513f, the optical signal is divided into multiple optical signals. After being collimated by the first collimating lens 514f, the multiple optical signals are transmitted to the first turning prism 515f. The first turning prism 515f is used to adjust the optical path of each optical signal from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, thereby transmitting each optical signal to the optical receiving chip on the surface of the circuit board. Similarly, some optical components of the second optical receiving component include the second optical fiber collimator 521f, the second converging lens 522f, the second optical demultiplexing component 523f, the second collimating lens 524f, and the second turning prism 525f. In addition to the aforementioned optical components, the second light receiving component further includes light receiving chips disposed on the surface of the circuit board 300. For example, the light receiving chips are also disposed in an array on the surface of the circuit board 300. The optical path principle in the second light receiving component is similar to that of the first light receiving component and will not be further elaborated.

[0208] It is understandable that the technical features of the light receiving components disclosed in the above embodiments can be referenced from each other, and any incomplete information can be referred to the relevant content of other light receiving components.

[0209] Figure 31 is a schematic diagram of the assembly of a light-emitting component provided according to some embodiments of the present disclosure; Figure 32 is a top view of the assembly of a light-emitting component provided according to some embodiments of the present disclosure. As shown in Figures 31 and 32, in some embodiments, taking the base as base 900a as an example, the light-receiving component 500a is disposed on one surface of the base 900a, and the light-emitting component 400a is disposed on another surface of the base 900a. Exemplarily, the light-receiving component 500a and the light-emitting component 400a are arranged in an upper and lower arrangement. In some embodiments, the upper surface of the base 900a is covered with a first protective cover, and the lower surface is covered with a second protective cover. Exemplarily, the surface of the light-receiving component 500a is covered with a first protective cover 530a to protect the optical components in the light-receiving component 500a; the surface of the light-emitting component 400a is covered with a second protective cover 420a to protect the optical components in the light-emitting component 400a.

[0210] From a top-down perspective, the second protective cover 420a is divided into a first partition and a second partition. The first partition is shown as Area A in FIG32 , and the second partition is shown as Area B in FIG32 . Area A corresponds to a smaller circuit board width, so the width of Area A is smaller than that of Area B to ensure the relative distance between Area A and the circuit board, thereby ensuring the amount of glue adhered to the second protective cover 420a in Area A and increasing the firmness of the second protective cover 420a.

[0211] Figure 33 is an exploded view of an optical transmission component according to some embodiments of the present disclosure; Figure 34 is a structural diagram of a second protective cover in an optical transmission component according to some embodiments of the present disclosure. As shown in Figures 33 and 34, in some embodiments, the lower surface of the base 900a is formed with a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a, respectively. Exemplarily, the third bearing surface 921a is used to accommodate the laser assembly 412a in the optical transmission component. Below the laser assembly 412a is a TEC 411a. The TEC 411a and the laser assembly 412a are stacked at a certain height. The third bearing surface 921a allows the laser assembly 412a to sink until it is flush with the surface of the circuit board 300, thereby ensuring a short bonding distance between the laser assembly 412a and the circuit board 300 surface. The fourth bearing surface 922a is used to accommodate optical transmission passive components. Exemplarily, the optical transmission passive components may be an optical fiber array, an optical multiplexing assembly, an AWG, or the like. When the optical emitting passive component is an optical fiber array, the surface of the fifth bearing surface 923a is used to place the pigtail. Taking the fourth bearing surface 922a as an example of bearing the optical fiber array 415a, the surface of the fifth bearing surface 923a bears the pigtail.

[0212] In some embodiments, to improve optical coupling efficiency, a lens group 413a is provided between the optical fiber array 415a and the laser group 412a to converge the optical signals emitted by each laser and then transmit them out, thereby improving optical coupling efficiency.

[0213] In some embodiments, to prevent the second protective cover 420a from contacting the optical emitting component, particularly the pigtail, and potentially causing interference, first support portions 924a are formed on both sides of the fifth support surface 923a. Second support portions 925a may also be formed on both sides of the fourth support surface 922a. The first and second support portions 924a, 925a, allow the protective cover to be positioned at a certain height, creating a gap between the protective cover and the optical emitting component, thereby preventing interference between the two.

[0214] An inserting portion 421a is formed at one end of the second protective cover 420a, and an avoiding portion 424a is formed at the other end. A side wall 423a is formed in the middle of the second protective cover 420a, and a gap 422a is formed between the inserting portion 421a and the side wall 423a.

[0215] To securely connect the protective cover to the base 900a, a recessed portion 9241 is formed on the surface of the first support portion 924a. The protective cover is positioned within this recessed portion 9241, thereby securing the protective cover to the base 900a. Of course, other structures can also be used to secure the protective cover. For example, the second protective cover 420a is formed with an inserting portion 421a, which is inserted into the recessed portion 9241, thereby securing the protective cover to the base 900a.

[0216] The side walls 423a on both sides of the second protective cover 420a respectively wrap the first supporting portion 924a and the second supporting portion 925a, thereby buckling the second protective cover 420a onto the base 900a.

[0217] As can be seen from Figure 34, the dimension of the plug-in portion 421a along the width direction of the second protective cover 420a is smaller than the dimension of the side wall 423a along the width direction of the second protective cover 420a. Therefore, it is easy to form an inner chamfer at the intersection of the plug-in portion 421a and the side wall 423a during machining, and the inner chamfer interferes with the base 900a. Therefore, a notch 422a is formed between the plug-in portion 421a and the side wall 423a to remove the inner chamfer formed by machining, thereby avoiding interference between the second protective cover 420a and the base 900a.

[0218] A high-frequency signal line is provided between the laser group 412a and the DSP chip disposed on the surface of the circuit board 300 to transmit electrical signals from the DSP chip to the laser group 412a. The second protective cover 420a has a different dielectric constant than air, with the dielectric constant of the second protective cover 420a being greater than that of air. If the surface of the high-frequency signal line contacts the second protective cover 420a, the impedance of the high-frequency signal line at the intersection with the second protective cover 420a will decrease, due to the negative correlation between impedance and dielectric constant, thereby reducing the high-frequency signal transmission performance. Therefore, a relief portion 424a is formed at the other end of the second protective cover 420a to keep the second protective cover 420a as far away from the high-frequency signal line as possible, thereby reducing the impact on the impedance of the high-frequency signal line.

[0219] In some embodiments, an isolator is provided to prevent the optical signal emitted by laser group 412a from returning to laser group 412a and affecting the optical signal quality. For example, isolator 414a is provided between optical fiber array 415a and laser group 412a. Accordingly, to accommodate the isolator, a fifth bearing surface 926a is formed between fourth bearing surface 922a and third bearing surface 921a. Fifth bearing surface 926a is used to accommodate isolator 414a.

[0220] As described above, to ensure optical path matching, the surface of the fifth bearing surface 926a is higher than that of the fourth bearing surface 922a. This also serves to limit the position of the optical fiber array 415a in the first direction. For example, the first direction can be the length direction of the raised portion 910a. To limit the position of the optical fiber array 415a in the second direction, the surfaces at both ends of the fifth bearing surface 926a can be recessed downward so that the width of the raised surface of the fifth bearing surface 926a is the same as the width of the optical fiber array 415a, thereby limiting the position of the optical fiber array 415a in the second direction. For example, the second direction can be the width direction of the raised portion 910a.

[0221] Figure 35 is a side view of an assembled light emitting component according to some embodiments of the present disclosure; Figure 36 is an exploded side view of an assembled light emitting component according to some embodiments of the present disclosure. As shown in Figures 35 and 36, in some embodiments, a plug-in portion 421a is formed at one end of the second protective cover 420a, and a recessed portion 9241 is formed on the base 900a. The plug-in portion 421a is inserted into the recessed portion 9241, thereby securing the protective cover to the base 900a.

[0222] A avoiding portion 424a is formed at the other end of the second protective cover 420a to keep the second protective cover 420a as far away from the high-frequency signal line as possible, thereby reducing the impact on the impedance of the high-frequency signal line and ensuring the high-frequency signal transmission performance.

[0223] Figure 37 is a cross-sectional structural diagram of a light emitting component provided according to some embodiments of the present disclosure; Figure 38 is an exploded structural diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 37 and 38, in some embodiments, the lower surface of the base 900a is formed with a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a, respectively. For example, the third bearing surface 921a is used to accommodate the TEC 411a in the light emitting component, as well as the laser assembly 412a and lens assembly 413a located on the surface of the TEC 411a. The third bearing surface 921a allows the laser assembly to be lowered until the surface of each laser is flush with the surface of the circuit board 300, thereby ensuring a short bonding distance between each laser and the surface of the circuit board 300 and improving high-frequency transmission performance. For example, the fourth bearing surface 922a supports the optical fiber array 415a, while the fifth bearing surface 923a supports the pigtail. In some embodiments, the fifth bearing surface 923a, the fourth bearing surface 922a, and the third bearing surface 921a are arranged in steps, and the surface heights of the three decrease successively, thereby achieving matching in optical path height.

[0224] For example, a light-emitting passive component, such as an optical fiber array, can be attached to the fourth supporting surface 922a using glue. Excessive stress generated by the glue during bonding can cause the bottom surface of the optical fiber array 415a to fracture. Therefore, to prevent stress concentration, protrusions 927a are formed at intervals on the surface of the fourth supporting surface 922a. The spacing of the protrusions 927a disperses the stress generated by the glue, thereby preventing excessive glue stress concentration and ensuring that the optical fiber array 415a remains intact during attachment.

[0225] Figure 39 is a cross-sectional view of another light-emitting component assembly according to some embodiments of the present disclosure. As shown in Figure 39 , in some embodiments, taking base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, with base 900b positioned above base mounting portion 303. The light-receiving component 500b is positioned above base 900b, and the light-emitting component 400b is positioned below base 900b.

[0226] Figure 40 is a schematic diagram of the assembly of another optical transmission component provided according to some embodiments of the present disclosure; Figure 41 is a schematic diagram of the structure of another optical transmission component provided according to some embodiments of the present disclosure; Figure 42 is a cross-sectional structural diagram of another optical transmission component provided according to some embodiments of the present disclosure. As shown in Figures 40-42, in order to achieve the transmission of multiple optical signals, the optical transmission component 400b includes a first optical transmission component 410b and a second optical transmission component 420b. The first optical transmission component 410b includes: a first optical fiber connector 411b, a first converging lens 412b, a first multiplexer 413b, and a first optical transmission assembly 414b. The first optical fiber connector 411b, the first converging lens 412b, and the first multiplexer 413b are located on the lower surface of the base 900b. The first light emitting component 414b is located in the first recessed portion 915b. A semiconductor cooler 417 is provided above the first light emitting component 414b. The first recessed portion 915b allows the lower surface of the first light emitting component 414b to be flush with the lower surface of the circuit board 300, thereby shortening the bonding distance between the first light emitting component 414b and the circuit board 300.

[0227] The first optical transmitter assembly 414b is electrically connected to the circuit board 300 and converts multiple electrical signals into multiple optical signals, forming collimated light. The first multiplexer 413b multiplexes the multiple optical signals into a single multi-wavelength signal beam. The multi-wavelength signal beam is converged by the first converging lens 412b to the first optical fiber connector 411b, where it enters the optical fiber, establishing a flexible connection between the optical transmitter assembly and the optical fiber adapter at the module's optical port. The first optical fiber connector 411b is equipped with an internal optical isolator, simplifying assembly and reducing costs.

[0228] In some embodiments, the laser in the first light emitting assembly 414b of the first light emitting component emits scattered light of four different wavelengths, which are collimated by a collimating lens to form four parallel light beams. These are then combined into a single collimated light beam by a first wavelength division multiplexer. The collimated light beams then enter the first converging lens 412b to form a single converging light beam that enters the first optical fiber connector 411b. The distance between the first converging lens and the first optical fiber connector corresponds to the focal length of the converging lens.

[0229] In the optical receiving component, the light emitted by the first collimator is a collimated beam. This beam is decomposed into four beams by the first demultiplexer. These beams are then transformed into four converging beams by the first lens assembly, redirecting the light toward the circuit board surface. Therefore, the optical path length from the laser to the first optical fiber connector in the first optical transmitting component is greater than the optical path length from the optical receiving chip in the first optical receiving component to the first optical collimator.

[0230] In some embodiments of the present application, the area between the first notch 911b and the second notch 912b of the carrier plate 916b protrudes toward the optical port relative to the sidewall of the base 900b, and the carrier plate 916b is used to support the optical fiber connector. The first optical fiber connector is connected to the carrier plate 916b.

[0231] The second optical transmission component 420b includes a second optical fiber connector 421b, a second converging lens 422b, a second multiplexer 423b, and a second optical transmission assembly 424b. The second optical fiber connector 421b, second converging lens 422b, and second multiplexer 423b are located on the lower surface of the base 900b. The second optical transmission assembly 424b is located in a first recessed portion 915b. A semiconductor cooler 417 is positioned above the second optical transmission assembly 424b. The first recessed portion 915b ensures that the lower surface of the second optical transmission assembly 424b is flush with the lower surface of the circuit board 300, shortening the bonding distance between the second optical transmission assembly 424b and the circuit board 300. The second optical fiber connector is connected to the carrier plate 916b.

[0232] In some embodiments of the present application, the protrusion 914b is thermally connected to the upper housing. The first and second optical emitting components are the main heat sources of the optical module. The heat emitted by them is transferred to the upper housing through the protrusion 914b, thereby improving the heat dissipation effect of the optical module.

[0233] In some embodiments, the first fiber optic adapter is connected to the first fiber optic connector, the second fiber optic adapter is connected to the second fiber optic connector, the third fiber optic adapter is connected to the first optical collimator, and the fourth fiber optic adapter is connected to the second optical collimator.

[0234] The first optical emitting component includes four lasers, and the second optical emitting component includes four lasers. The first wavelength division multiplexer combines the light emitted by the four lasers in the first optical emitting component into a single beam and transmits it through the first optical fiber adapter. The second wavelength division multiplexer combines the light emitted by the four lasers in the second optical emitting component into a single beam and transmits it through the second optical fiber adapter.

[0235] The light beam carried in the third optical fiber adapter is split into four beams by the first demultiplexer and received by four optical receiving chips. The light beam carried in the fourth optical fiber adapter is split into four beams by the second demultiplexer and received by four optical receiving chips.

[0236] In some embodiments, the first fiber optic adapter, the third fiber optic adapter, the second fiber optic adapter, and the fourth fiber optic adapter may be arranged sequentially at the same height, or may be presented in two rows, such as the first fiber optic adapter and the third fiber optic adapter are located above the second fiber optic adapter and the fourth fiber optic adapter, respectively.

[0237] The base mounting portion 303 provides a space for mounting the light emitting component.

[0238] Figure 43 is a schematic diagram (I) of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application; Figure 44 is a schematic diagram (II) of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application. As shown in Figures 43 and 44, the hot surface of the semiconductor cooler 417 is connected to positive and negative power supply wires, which are led out from the third notch 913b. Conductive pins are provided on the upper surface of the circuit board, and the positive and negative power supply wires are connected to the conductive pins. In some embodiments, the conductive pins are located at the third notch 913b and above the power supply wires. The hot surface of the semiconductor cooler is the side adjacent to the light emitting chip.

[0239] A substrate 418 is provided between the semiconductor cooler 417 and the first recess 915b. The substrate includes circuitry electrically connected to the rest of the semiconductor cooler 417. One end of the substrate 418 extends into the third notch, located below the circuit board 300. The hot surface of the semiconductor cooler is connected to a positive power lead and a negative power lead. The top surface of the circuit board is provided with positive and negative pins. The third notch 913b allows positive and negative power leads 4181 and 4182 to be led out from below the circuit board. The positive pin is electrically connected to the positive power lead, and the negative pin is conductively connected to the negative power lead.

[0240] The present application provides an optical module, wherein a circuit board thereof is provided with a base mounting portion, and the base covering part of the base mounting portion. The base is provided on the lower surface of the circuit board. The upper surface of the base 900b is raised to form a raised portion 914b, and the first light receiving component and the second light receiving component are respectively located on both sides of the raised portion 914. The lower surface of the base 900b is recessed to form a first recessed portion 915b, and the lower surface of the base 900b is in contact with and connected to the upper surface of the circuit board. The bottom surface of the first recessed portion 915b is recessed relative to the lower surface of the base 900b so as to minimize the electrical connection line between the light emitting component and the circuit board. The base 900b is also provided with a third notch 913b, and the first recessed portion 915b is connected to the third notch 913b, so as to facilitate observation and positioning from the third notch 913b during installation.

[0241] In the present application, the first optical chipset 514b, the first transimpedance amplifier 515b, the second optical chipset 524b, and the second transimpedance amplifier 525b are fixed in position on the circuit board. During the installation process, the base, the first optical transmission assembly, and the second optical transmission assembly can be connected first, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer can be connected to the base to form a transceiver component. The base provides a mounting platform for the first optical transmission assembly, the second optical transmission assembly, the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer. The transceiver component is then positioned and connected to the circuit board, and the first lens assembly and the second lens assembly are installed according to the positional relationship between the base and the circuit board.

[0242] Connect the base, the first optical transmitter assembly, and the second optical transmitter assembly. Then, connect the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer to the base to form a transceiver. This integrated transceiver is easy to install and compatible with a variety of optical modules.

[0243] The optical transmitter is designed for reverse assembly, ensuring that the bonding surface of the optical transmitter is at the same height as the bottom surface of the circuit board during assembly. This minimizes the bonding distance between the two and ensures excellent high-frequency transmission performance. The optical transmitter is designed for reverse assembly, with the base acting as a heat sink for the laser and semiconductor cooler, directly contacting the upper cover of the optical module, creating a more direct and efficient heat transfer channel.

[0244] Figure 45 is a schematic diagram of the assembly of another light emitting component according to some embodiments of the present disclosure; Figure 46 is a schematic diagram of the assembly of another light emitting component according to some embodiments of the present disclosure. As shown in Figures 45 and 46, in some embodiments, taking the base as base 900c as an example, the light receiving component 500c is disposed on one surface of the base 900c, and the light emitting component 400c is disposed on another surface of the base 900c.

[0245] In some embodiments, the surface of the light-emitting component 400c is covered with a second protective cover 420c to protect the optical components within the light-emitting component 400c. The second protective cover 420c includes a first overlapping portion 421c, a first relief notch 422c, a second relief notch 423c, and a second overlapping portion 424c. The first overlapping portion 421c and the second overlapping portion 424c overlap the surface of the circuit board, thereby securing the second protective cover 420c to the surface of the circuit board 300.

[0246] In some embodiments, the optical transmission component 400c includes a laser group, a passive optical transmission device for combining wavelengths, and a passive optical transmission device for transmission. For example, the passive optical transmission device for combining wavelengths may be an optical multiplexing component, etc.; the passive optical transmission device for transmission may be a fiber collimator, etc.

[0247] In some embodiments, the optical emitting component 400c includes a laser group 411c, an optical multiplexing component 412c, and a fiber collimator 413c. The laser group 411c includes several lasers. The multiple optical signals generated by the laser group 411c are transmitted to the optical multiplexing component 412c. After the optical multiplexing component 412c undergoes beam combining processing, the multiple optical signals are emitted through the fiber collimator 413c. For example, the laser groups 411c correspond to two optical multiplexing components 412c, and one optical multiplexing component 412c corresponds to one fiber collimator 413c. The multiple optical signals emitted by the laser group 411c are synthesized into two optical signals by the two optical multiplexing components 412c, and then emitted through two fiber collimators 413c. In some embodiments, the surface of each laser in the laser group 411c is flush with the surface of the circuit board to shorten the wire bonding length between the two, thereby improving the high-frequency signal transmission performance.

[0248] Figure 47 is a schematic diagram of the structure of another light emitting component provided according to some embodiments of the present disclosure. As shown in Figure 47, in some embodiments, one surface of the base 900c is used to support the light receiving component, and the other surface is used to support the light emitting component. For example, the lower surface of the base 900c is used to mount the light emitting component. The lower surface of the base 900c is formed with a fourth supporting surface 921c, a fifth supporting surface 922c, and a sixth supporting surface 923c. The fifth supporting surface 922c is located between the fourth supporting surface 921c and the sixth supporting surface 923c.

[0249] Exemplarily, the fourth bearing surface 921c is used to set the laser group 411c for emitting multiple optical signals; the fifth bearing surface 922c is used to set the optical multiplexing component 412c for combining multiple optical signals; the sixth bearing surface 923c is used to set the optical fiber collimator 413c for transmitting the combined optical signal.

[0250] To limit and secure the optical multiplexing assembly 412c, limiting portions 924c are formed on both sides of the fifth bearing surface 922c. The surfaces of the limiting portions 924c protrude relative to the surface of the fifth bearing surface 922c and can be configured as limiting bosses, thereby limiting and securing the optical multiplexing assembly 412c.

[0251] In some embodiments, the circuit board 300 is embedded in the surface of the base 900a to be relatively close to the laser assembly 411c. The surface of the fourth bearing surface 921c is recessed relative to the surface of the fifth bearing surface 922c, so that the laser assembly 411c is lowered. This allows the surface of the laser assembly 411c to be flush with the surface of the circuit board 300, thereby shortening the bonding distance between the two and improving high-frequency transmission performance. In some embodiments, the height difference between the fifth bearing surface 922c and the sixth bearing surface 923c is sufficient to ensure that the optical paths of the optical multiplexing assembly 412c and the fiber collimator 413c are highly matched.

[0252] It is understandable that the light receiving component matched with the light emitting component 400c may be the light receiving component 500c mentioned above, or may be the light receiving component 500d, or the light receiving component 500e, or the light receiving component 500f.

[0253] The above-described embodiments of the present application do not constitute a limitation on the scope of protection of the present application.

Claims

1. An optical module, comprising: Upper shell; A circuit board having a base mounting portion formed on the surface; A base, fixed to the surface of the circuit board through the base mounting portion, a raised portion formed on the upper surface of the base, the raised portion protruding toward the upper housing, and the raised portion being thermally connected to the upper housing; A light receiving component is located on the upper surface of the base and on the side of the raised portion, and is used to receive multiple optical signals; The light emitting component is located on the lower surface of the base, and is used for emitting multi-path optical signals.

2. The optical module according to claim 1, wherein a light receiving chip array is disposed on the surface of the circuit board, and the light receiving components are disposed on both sides of the protruding portion; A first bearing surface and a first extension portion located at the end of the first bearing surface are formed on one side of the protrusion, and a second bearing surface and a second extension portion located at the end of the second bearing surface are formed on the other side of the protrusion; a third bearing surface and a fourth bearing surface are formed on the lower surface of the base; A first light receiving passive component, located on the surface of the first bearing surface, and used for receiving multiple optical signals; A second light receiving passive component, located on the surface of the second bearing surface, and used for receiving multiple optical signals; A first optical path turning device, located on the surface of the first extension portion, used to change the transmission direction of the multi-path optical signals output by the first optical receiving passive device, so as to transmit the multi-path optical signals to the optical receiving chip array; A second optical path turning device, located on the surface of the second extension portion, used to change the transmission direction of the multi-path optical signals output by the second optical receiving passive device, so as to transmit the multi-path optical signals to the optical receiving chip array; A laser group, located on the surface of the third bearing surface, for emitting multiple optical signals; The optical emitting passive component is located on the surface of the fourth bearing surface and is used for transmitting the multi-path optical signals emitted by the laser group.

3. The optical module according to claim 2, wherein the extension lengths of the first extension portion and the second extension portion are such that the light receiving chip array is exposed; The first optical path turning device is disposed on the surface of the first extension portion through the first substrate; the extension length of the first substrate is longer than the extension length of the first extension portion, so as to extend the first optical path turning device to the surface of the light receiving chip array; The second optical path deflection device is disposed on the surface of the second extension portion through a second substrate; the extension length of the second substrate is longer than the extension length of the second extension portion, so as to extend the second optical path deflection device to the surface of the light receiving chip array.

4. The optical module according to claim 1, wherein the upper surface of the base is covered with a first protective cover, and the lower surface of the base is covered with a second protective cover; The lower surface of the base protrudes downward to form a support portion, and the second protective cover is projected on the surface of the second protective cover; The second protective cover is formed with an inserting portion, and the support portion is formed with an embedding portion; The plug-in portion is plug-connected with the embedded portion to fix the second protective cover on the lower surface of the base.

5. According to the optical module of claim 2, a first limit platform is formed between the first bearing surface and the first extension portion, and the surface of the first limit platform is higher than the surface of the first bearing surface, so as to limit the first light receiving passive component; a second limit platform is formed between the second bearing surface and the second extension portion, and the surface of the second limit platform is higher than the surface of the second bearing surface, so as to limit the second light receiving passive component.

6. The optical module according to claim 2, wherein a transimpedance amplifier is provided on the surface of the circuit board, and a second connecting pad is formed on the surface of the transimpedance amplifier; The light receiving chip array includes a light receiving chip, a surface of which is formed with a photosensitive surface and a first connecting pad, and the first connecting pad is welded to the second connecting pad; a lens is provided on the other surface of the light receiving chip, and an optical through hole is formed between the two surfaces of the light receiving chip, so that the optical signal can reach the photosensitive surface through the lens and the optical through hole.

7. The optical module according to claim 2, wherein a first depression is formed on one end of the first bearing surface facing the first extension portion; and a second depression is formed on one end of the second bearing surface facing the second extension portion; The surface of the first extension portion is lower than the surface of the first bearing surface, the surface of the second extension portion is lower than the surface of the second bearing surface, and a gap is formed between the first extension portion and the second extension portion. 8 . The optical module according to claim 3 , wherein the first substrate and the second substrate are respectively formed with optical through holes to allow the light output by the first optical path turning device and the second optical path turning device to be transmitted to the corresponding light receiving chip array surface.

9. The optical module according to claim 1, wherein: The base comprises: A first recessed portion is located on the lower surface of the base, and the first recessed portion is recessed upward relative to the base; a semiconductor cooler is provided in the first recessed portion, and a power supply wire is provided on the hot surface of the semiconductor cooler; a conductive pin is provided on the upper surface of the circuit board, and the power supply wire is connected to the conductive pin wire; The third notch is located at one side of the base, and the first recessed portion is connected to the third notch.

10. The optical module according to claim 1, wherein: The light receiving component comprises: A first light collimator; A first demultiplexer, the first optical collimator and the first demultiplexer are located on the upper surface of the base, and the first optical collimator and the first demultiplexer are located on one side of the raised portion; a second light collimator; The second demultiplexer, the second optical collimator and the second demultiplexer are located on the upper surface of the base, and the second optical collimator and the second demultiplexer are located on the other side of the protruding portion.

11. The optical module according to claim 10, further comprising: a first lens assembly; One end of the protruding portion protrudes from the side wall of the base; and the first lens assembly is located at one side of the protruding portion.

12. The optical module according to claim 9, wherein: The light emitting component comprises: A first light emitting component is located below the semiconductor refrigerator; A first multiplexer, located on the lower surface of the base, multiplexes the light emitted by the first light emitting assembly; A first converging lens, located on the lower surface of the base and in the light emitting direction of the first multiplexer; A first optical fiber connector, having an optical isolator built therein, wherein the first optical fiber connector is connected to the optical fiber; The base is provided with a bearing plate, and the first optical fiber connector is connected to the bearing plate.

13. The optical module according to claim 12, wherein: The two sides of the bearing plate are respectively provided with a first notch and a second notch: The light receiving component comprises: a first light collimator and a second light collimator, the side edge of the first notch limits the first light collimator, and the side edge of the second notch limits the second light collimator.

14. The optical module according to claim 2, wherein: A first bearing surface, a second bearing surface, and a third bearing surface are respectively formed on different sides of the protrusion, the second bearing surface is on the opposite side to the first bearing surface, and the third bearing surface is on the adjacent side to the first bearing surface; a fourth bearing surface and a fifth bearing surface are respectively formed on the lower surface of the base; A first light receiving passive component is located on the surface of the first bearing surface, and a light emitting end surface of the first light receiving passive component is vertically disposed on the first bearing surface. The light output end of the first light receiving passive component does not have a reflective surface; A second light receiving passive component is located on the surface of the second bearing surface, a light emitting end face of the second light receiving passive component is vertically disposed on the surface of the second bearing surface, and a light emitting end of the second light receiving passive component does not have a reflecting surface; A first reflecting surface is provided on the light path of the first light receiving passive component and is used to reflect the light path; A second reflecting surface is provided on the light output path of the second light receiving passive device and is used to reflect the light path; A first optical path turning device, provided at one end of the third bearing surface, for changing the transmission direction of the optical signal reflected by the first reflecting surface so as to transmit the optical signal to the optical receiving chip array; A second optical path turning device, provided at the other end of the third bearing surface, for changing the transmission direction of the optical signal reflected by the second reflecting surface to transmit it to the optical receiving chip array; A laser group, located on the surface of the fourth bearing surface, for emitting multiple optical signals; The optical emitting passive component is located on the surface of the fifth bearing surface and is used for combining and transmitting the multi-path optical signals emitted by the laser group.

15. The optical module according to claim 14, wherein: A first lens is provided between the light output path of the first light receiving passive component and the first reflecting surface, one end of the first lens is provided at one end of the third bearing surface, and the other end of the first lens is used to bear the first reflecting surface; A second lens is provided between the light output path of the second light receiving passive device and the second reflecting surface, one end of the second lens is provided at the other end of the third bearing surface, and the other end of the second lens is used to bear the second reflecting surface.

16. The optical module according to claim 14, wherein: One end of the first optical path turning device is connected to the side wall of the protrusion, and the other end is suspended; one end of the second optical path turning device is connected to the side wall of the protrusion, and the other end is suspended.

17. The optical module according to claim 14, wherein: The first light receiving passive device includes a first AWG, and the second light receiving passive device includes a second AWG; the light emitting end faces of the first AWG and the second AWG are planes; The light emitting end faces of the first AWG and the second AWG face the first reflecting surface and the second reflecting surface respectively.

18. The optical module according to claim 14, wherein: The first optical path turning device includes a first turning prism, and the second optical path turning device includes a second turning prism; The light incident end of the first turning prism faces the light emitting end surface of the first reflecting surface, and the light emitting end faces the light receiving chip array; The light incident end of the second turning prism faces the light emitting end surface of the second reflecting surface, and the light emitting end faces the light receiving chip array.

19. The optical module according to claim 2, wherein: A first bearing surface, a second bearing surface, and a third bearing surface are respectively formed on different sides of the protrusion, the second bearing surface is on the opposite side to the first bearing surface, and the third bearing surface is on the adjacent side to the first bearing surface; a fourth bearing surface and a fifth bearing surface are respectively formed on the lower surface of the base; A first light receiving passive component is located on the surface of the first bearing surface, a light emitting end surface of the first light receiving passive component is erected on the surface of the first bearing surface, and a reflective surface is formed at the light emitting end of the first light receiving passive component; A second light receiving passive component is located on the surface of the second bearing surface, a light emitting end surface of the second light receiving passive component is vertically disposed on the surface of the second bearing surface, and a reflective surface is formed at the light emitting end of the second light receiving passive component; A first optical path turning device, provided at one end of the third bearing surface, for changing the transmission direction of the multi-path optical signals output by the first optical receiving passive device so as to transmit them to the optical receiving chip array; A second optical path turning device, provided at the other end of the third bearing surface, for changing the transmission direction of the multi-path optical signals output by the second optical receiving passive device so as to transmit them to the optical receiving chip array; A laser group, located on the surface of the fourth bearing surface, used for emitting multiple optical signals; The optical emitting passive component is located on the surface of the fifth bearing surface and is used for combining and transmitting the multi-path optical signals emitted by the laser group.

20. The optical module according to claim 19, wherein: The first light receiving passive component includes a first AWG, and the second light receiving passive component includes a second AWG; The reflection surfaces formed on the light-emitting ends of the first AWG and the second AWG are both inclined surfaces; The light emitting end faces of the first AWG and the second AWG face the first light path turning component and the second light path turning component respectively.

21. The optical module according to claim 19, wherein: The first optical path turning device includes a first turning prism, and the second optical path turning device includes a second turning prism; The light input end of the first turning prism faces the light output end face of the first light receiving passive component, and the light output end faces the light receiving chip array; The light incident end of the second turning prism faces the light emitting end face of the second light receiving passive component, and the light emitting end faces the light receiving chip array.

22. The optical module according to claim 20, wherein: A first lens is connected to the light emitting end face of the first AWG, and the first lens is located between the light emitting end face of the first AWG and the first optical path turning device; a second lens is connected to the light emitting end face of the second AWG, and the second lens is located between the light emitting end face of the second AWG and the second optical path turning device.

23. The optical module according to claim 1, wherein: The surface of the circuit board is provided with a light receiving chip array, and the light receiving components are respectively provided on both sides of the protrusion; The first and second bearing surfaces are formed on one side of the protrusion, and the third and fourth bearing surfaces are formed on the other side of the protrusion; wherein the side walls of the first and third bearing surfaces are respectively formed with a blocking portion; the surface of the second bearing surface is lower than the surface of the first bearing surface, and the surface of the fourth bearing surface is lower than the surface of the third bearing surface; the surface of the base is respectively provided with: A first AWG is disposed on the surface of the first bearing surface, a light-emitting end surface of the first AWG is horizontally placed on the surface of the first bearing surface, and the light-emitting end surface of the first AWG is set as a plane; A second AWG is disposed on the surface of the third bearing surface, the light-emitting end surface of the second AWG is horizontally placed on the surface of the first bearing surface, and the light-emitting end surface of the second AWG is set as a plane; A first optical path turning device, disposed on the surface of the second bearing surface, for changing the transmission direction of the multi-path optical signals output by the first AWG so as to transmit them to the optical receiving chip array; The second optical path turning device is disposed on the surface of the fourth bearing surface and is used to change the transmission direction of the multi-path optical signals output by the second AWG so as to transmit them to the optical receiving chip array.

24. The optical module according to claim 23, wherein: The surface of the circuit board is provided with a light receiving chip array, and the light receiving components are respectively provided on both sides of the protrusion; A first bearing surface is formed on one side of the protrusion to set the first light receiving component; and a second bearing surface is formed on the other side of the protrusion to set the second light receiving component.

25. The optical module according to claim 4, wherein: The optical module further includes: A first protective cover, covering the upper surface of the base, wherein a first notch is formed on one side of the first protective cover facing the protrusion to avoid the protrusion; both sides of the first notch are respectively used to protect the light receiving components on both sides of the protrusion; A second protective cover is covered on the supporting portion on the lower surface of the base to protect the light emitting component; a plug-in portion is formed on the side wall at one end of the second protective cover, and the plug-in portion is respectively plug-connected with the embedded portions on both sides to fix the second protective cover on the lower surface of the base; an avoidance portion is formed at the other end of the second protective cover to avoid the high-frequency signal line between the light emitting component and the circuit board.

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