Printed circuit board assembly, method for manufacturing printed circuit board assembly, and electronic device

Abstract

The present application provides a printed circuit board assembly, a method for manufacturing a printed circuit board assembly, and an electronic device. The printed circuit board assembly comprises a motherboard and a daughterboard; a chip is arranged on one side of the motherboard; the daughterboard is arranged on the side of the motherboard facing away from the chip; a power conversion module and a power supply module which are in signal connection are arranged on the daughterboard; the motherboard and the daughterboard are in signal connection; and the power supply module is used for supplying power to the chip.

Description

Printed circuit board assembly, method for manufacturing printed circuit board assembly, and electronic equipment

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202311282461.8 filed on September 28, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the fields of printed circuit board design and power supply, and in particular to a printed circuit board assembly, a method for manufacturing a printed circuit board assembly, and an electronic device. Background Art

[0004] The operation of each chip on a printed circuit board (PCB) depends on the power supply module. Currently, the industry typically utilizes a front-side power supply layout, supplying the chips through a low-resistance power layer. Power from the power supply module to the chip must pass through the PCB planes and vias, resulting in significant voltage drops and energy losses. With increasingly fierce competition in the electronics market, cost control requirements for PCBs are also increasing. The number of PCB layers is being reduced, which in turn leads to tighter wiring space. Especially for chips operating at high currents, the number of phases in the power module increases, further complicating power supply layout and wiring challenges.

[0005] In view of this, it is necessary to provide a new printed circuit board assembly, a method for manufacturing a printed circuit board assembly, and an electronic device to solve or at least alleviate the above technical defects.

[0006] Summary of the Invention

[0007] The main purpose of this application is to provide a printed circuit board assembly, a method for manufacturing a printed circuit board assembly, and an electronic device.

[0008] To achieve the above-mentioned purpose, according to one aspect of the present application, the present application provides a printed circuit board assembly, including a main board and a daughter board, a chip is provided on one side of the main board, and the daughter board is provided on the side of the main board facing away from the chip, a signal-connected power conversion module and a power supply module are provided on the daughter board, the main board and the daughter board are signal-connected, and the power supply module is used to supply power to the chip.

[0009] According to another embodiment of the present application, the present application also provides a method for manufacturing a printed circuit board assembly, which includes the following steps: providing a main board and a sub-board; wherein the sub-board is provided with a sub-power layer; arranging a chip and a main power via on the main board, and arranging a power conversion module, a power supply module and a sub-power via on the sub-board, and making the power supply module signal-connected to the power conversion module and the sub-power layer respectively; sintering copper paste to form a connecting column that connects the main power via and the sub-power via signals.

[0010] According to another embodiment of the present application, the present application further provides an electronic device, which includes the printed circuit board assembly described above; and / or the printed circuit board assembly is manufactured by the manufacturing method of the printed circuit board assembly described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the implementation methods or the description of the prior art. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0012] FIG1 is a top view of a printed circuit board assembly in the related art;

[0013] FIG2 is a schematic side cross-sectional view of a printed circuit board assembly in the related art;

[0014] FIG3 is an exploded view of a printed circuit board assembly according to an embodiment of the present application;

[0015] FIG4 is a top view of a mainboard of a printed circuit board assembly according to an embodiment of the present application;

[0016] FIG5 is a schematic structural diagram of each layer of a mainboard of a printed circuit board assembly according to an embodiment of the present application;

[0017] FIG6 is a bottom view of the mainboard of the printed circuit board assembly according to an embodiment of the present application;

[0018] FIG7 is a top view of a mainboard of a printed circuit board assembly according to an embodiment of the present application;

[0019] FIG8 is a schematic structural diagram of each layer of a mainboard of a printed circuit board assembly according to an embodiment of the present application;

[0020] FIG9 is a bottom view of the mainboard of the printed circuit board assembly according to an embodiment of the present application;

[0021] FIG10 is a schematic structural diagram of a printed circuit board assembly according to an embodiment of the present application;

[0022] FIG11 is a table comparing the measurement results of the printed circuit board assembly of the embodiment of the present application and the traditional board simulation case;

[0023] FIG12 is a flow chart of a method for manufacturing a printed circuit board assembly according to an embodiment of the present application.

[0024] Explanation of labels: 001, power conversion module; 101, power supply module; 201, chip; 301, power pin; 401, heat sink; 501, connector assembly; 601, main board; 701, daughter board; 801, signal layer; 901, signal reference ground plane; 1001, signal via; 1101, main power via; 1201, sub-power via; 1301, power plane layer; 1401, ground layer; 1501, connecting column; 1601, sub-power layer; 1702, sub-ground layer.

[0025] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] All directional indications (such as up, down, etc.) in the implementation mode of this application are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, the terms "first," "second," and so on, used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of these features.

[0029] Moreover, the technical solutions between the various implementation modes of the present application may be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0030] As shown in Figures 1 and 2, Figures 1 and 2 are schematic diagrams of the structure of a printed circuit board assembly in the related art, that is, a power supply module 101 and a chip 201 are on the same single board. The power supply module 101 may occupy all of the positions marked 101 in Figure 1, or may only occupy some of them. Among them, 301 is the power pin of the chip, 401 is the heat sink, 501 is the connector assembly of a high-speed signal optical module or cable, 001 is the power conversion module, 801 is the signal layer, 901 is the signal reference ground plane, 1301 is the power plane layer, and 1401 is the ground layer. The power plane layer 1301 and the signal layer 801 share a single board. Under this power supply structure, first, due to the influence of the heat sink 401, the optical module and the connector assembly 501, the power supply module 101 is placed relatively far away from the chip 201, and the voltage drop of the power supply network is relatively large; at the same time, the large number of signal via pads inside the package array will destroy the integrity of the power plane layer 1301, further increase the DC resistance, and increase the voltage drop; in addition, due to the influence of the above two factors, it is necessary to increase the number of layers of the power plane layer 1301 to compensate for the loss of voltage drop, resulting in an increase in the total number of PCB layers, thereby increasing costs and reducing product competitiveness; finally, there will be noise coupling between the power plane layer 1301 and the signal layer 801, which will reduce the signal transmission quality.

[0031] Referring to Figure 3, according to one aspect of the present application, the present application provides a printed circuit board assembly, including a main board 601 and a daughter board 701, a chip 201 is provided on one side of the main board 601, a daughter board 701 is provided on the side of the main board 601 facing away from the chip 201, a power conversion module 001 and a power supply module 101 with signal connection are provided on the daughter board 701, the main board 601 and the daughter board 701 are signal-connected, and the power supply module 101 is used to supply power to the chip 201.

[0032] In the above-described embodiment of the present application, a daughterboard 701 is added to the mainboard 601, and a power conversion module 001 and a power supply module 101 with signal connections are provided on the daughterboard 701. The power conversion module 001 and the power supply module 101 provided on the mainboard 601 in the related art are moved to the daughterboard 701. Furthermore, the mainboard 601 and the daughterboard 701 are signal-connected, and power can also be supplied to the chip 201 through the power supply module 101. By moving the power conversion module 001 and the power supply module 101 to the daughterboard 701, space on the mainboard 601 is saved, solving the problem of limited wiring space on the mainboard 601. Furthermore, in the related art, due to the influence of the heat sink 401 on the mainboard 601 and the connector assembly 501 of the high-speed signal optical module or cable, the power supply module 101 can only be set at a position far away from the chip 201. At the same time, because the solder balls and signal vias 1001 will destroy the integrity of the power plane, further increasing the resistance, the power supply module 101 has a relatively large voltage drop. This embodiment, by setting the power supply module 101 on the daughterboard 701, can set the power supply module 101 close to the chip 201, reducing the voltage drop and thus reducing power loss. This embodiment has the advantages of low voltage drop, low power loss, and ample wiring space.

[0033] Furthermore, this embodiment relocates the power supply module 101 outside the mainboard 601, reducing the number of power plane layers 1301 and the total number of layers, thereby lowering the cost of the printed circuit board. The mainboard 601 has a high-speed network signal layer 801, requiring a more expensive printed circuit board, while the daughterboard 701 can utilize a lower-cost, low-speed board. Referring to Figure 11 , a table comparing the voltage drop, board type, and number of layers for a conventional board and the printed circuit board assembly of this application is shown. The data in the chart shows that the voltage drop is 75mV using a conventional board, using only high-speed M8 board material with 30 layers. Using the printed circuit board assembly of this application, the voltage drop is 53mV, a 29.3% reduction. The board material has been reduced from all high-speed M8 board material to a mainboard made of high-speed M8 board material and a daughterboard made of low-speed, low-cost FR-4 board material, reducing board material costs. Furthermore, the total number of layers is reduced to 12 layers of M8 board material and 14 layers of FR-4 board material, for a total of 26 layers, a significant reduction of 4 layers, resulting in a significant benefit.

[0034] 6, 7, and 10, in some embodiments, a main power via 1101 and a signal via 1001 are provided on the main board 601, a main pad is provided at the position of the main power via 1101, a sub-power via 1201 is provided on the daughter board 701, and a sub-pad is provided at the position of the sub-power via 1201. The printed circuit board assembly further includes a connecting column 1501, which connects the main pad and the sub-pad to achieve signal connection and physical connection between the main board 601 and the daughter board 701. The connecting column 1501 here can be a metal column, such as a copper column. The connecting column 1501 connects the main power via 1101 and the sub-power via 1201 through the main pad and the sub-pad, not only serving as a signal connection to achieve signal connection between the main board 601 and the daughter board 701, but also serving as a physical support, connecting the main board 601 and the daughter board 701 through the physical strength of the connecting column 1501, thus achieving a physical connection. Through the connection of the connecting column 1501, there is no need to set up additional screws to connect the main board 601 and the sub-board 701. The same component realizes both signal connection and physical connection functions, which is convenient to manufacture and simplifies the process steps.

[0035] Referring to Figure 9 , in some embodiments, there is at least one power supply module 101, with at least one power supply module 101 disposed around the periphery of the main power via 1101. The number of power supply modules 101 can be one, two, three, four, or another number, with four being shown in Figure 9 . The specific location and distribution of the power supply modules 101 are not specifically limited, but they can be disposed near the periphery of the main power via 1101. This design allows the power supply modules 101 to be as close as possible to the chip 201, minimizing voltage drop. Referring to Figure 8 , in some embodiments, a sub-power layer 1601 is disposed within the daughterboard 701. The sub-power layer 1601 is connected to the power supply module 101 and the sub-power via 1201, respectively, and is physically and signal-connected to the mainboard 601 via connecting posts 1501. In other embodiments, the daughterboard 701 further comprises a sub-ground layer 1702, with the sub-power layers 1601 and the sub-ground layers 1702 alternately stacked, while the signal layer 801 is disposed on the mainboard 601. The specific number of sub-power layers 1601 and sub-ground layers 1702 can be determined based on actual needs. Since sub-board 701 only has a power network, the requirements for the sub-board 701 material are not high, and low-cost materials can be used. This application separates the sub-power layer 1601 from the signal layer 801, reducing noise coupling between the power supply and signal, ensuring the integrity of the sub-power plane, and improving the power supply efficiency of the power supply module 101.

[0036] 3 and 4 , in some embodiments, the chip 201 includes a power pin 301, and the power supply module 101 is disposed near the power pin 301. Placing the power supply module 101 near the power pin 301 of the chip 201 is also intended to bring the power supply module 101 closer to the chip 201, thereby reducing the voltage drop of the power supply link.

[0037] In some embodiments, the power conversion module 001 and the power supply module 101 are both located on the side of the daughterboard 701 facing away from the mainboard 601. Placing the power conversion module 001 and the power supply module 101 at the bottom of the daughterboard 701 prevents them from being too close to components on the mainboard 601 and causing signal interference. The power conversion module 001 primarily converts high voltages into low voltages. Specifically, multiple power conversion modules 001 can be used, such as 0.7V, 0.8V, and 1.0V.

[0038] 3 and 4 , in some embodiments, a heat sink 401 and a connector assembly 501 are further provided on the motherboard 601. The heat sink 401 is provided on the side of the chip 201 facing away from the motherboard 601 and is in contact with the chip 201. The connector assembly 501 is provided on the side of the motherboard 601 facing away from the ion plate 701. The heat sink 401 is used to accelerate the dissipation of heat generated by the chip 201 and is therefore generally provided near the chip 201 or around the periphery of the chip 201.

[0039] 12 is a flow chart of a method for manufacturing a printed circuit board assembly according to an embodiment of the present application. The method for manufacturing a printed circuit board assembly includes the following steps:

[0040] S100: Provide a mainboard 601 and a daughterboard 701. The daughterboard 701 is provided with a sub-power layer 1601. The mainboard 601 is used to mount the chip 201, the heat sink 401, and other components connected to the connector assembly. The daughterboard 701 is formed with a power layer for signal connection with the mainboard 601.

[0041] S200, set the chip 201 and the main power via 1101 on the main board 601, set the power conversion module 001, the power supply module 101 and the sub-power via 1201 on the sub-board 701, and make the power supply module 101 signal-connected to the power conversion module 001 and the sub-power layer 1601 respectively.

[0042] Setting both the power supply module 101 and the power conversion module 001 on the sub-board 701 can reduce the space occupied by the main board 601, and in order to reduce the voltage drop, the power supply module 101 can be set close to the sub-power via 1201.

[0043] S300 , forming a connection column 1501 for signal connection between the main power via 1101 and the sub-power via 1201 by sintering copper paste.

[0044] By pouring high-temperature copper plating paste on the main pad of the main board 601 and the sub-pad column of the sub-board 701, the copper connecting column 1501 is formed after the copper paste is cooled. Since the copper paste is conductive and has a certain strength and can conduct electricity, the connecting column 1501 formed after the copper paste is cooled can serve as both a signal connection and a physical support.

[0045] In the above-described embodiment of the present application, a daughterboard 701 is added to the mainboard 601, and a power conversion module 001 and a power supply module 101 with signal connections are provided on the daughterboard 701. The power conversion module 001 and the power supply module 101 provided on the mainboard 601 in the related art are moved to the daughterboard 701. Furthermore, the mainboard 601 and the daughterboard 701 are signal-connected, and power can also be supplied to the chip 201 through the power supply module 101. By moving the power conversion module 001 and the power supply module 101 to the daughterboard 701, space on the mainboard 601 is saved, solving the problem of limited wiring space on the mainboard 601. Moreover, in the related art, due to the influence of the heat sink 401 and the high-speed signal optical module or cable connector assembly 501 on the mainboard 601, the power supply module 101 can only be set at a position far away from the chip 201. At the same time, since the solder balls and signal vias 1001 will destroy the integrity of the power plane, further increasing the resistance, the power supply module 101 has a relatively large voltage drop. This embodiment can set the power supply module 101 on the daughterboard 701 to a position close to the chip 201, thereby reducing the voltage drop and thus reducing the power loss. This embodiment has the advantages of low voltage drop, low power loss and ample wiring space. In addition, this embodiment moves the power supply module 101 out of the mainboard 601, which can reduce the number of power plane layers 1301, thereby reducing the total number of layers and reducing the cost of the printed circuit board.

[0046] According to another embodiment of the present application, an electronic device is provided, comprising the aforementioned printed circuit board assembly; and / or the printed circuit board assembly is manufactured using the aforementioned printed circuit board assembly manufacturing method. Since the electronic device includes all technical solutions of all the aforementioned embodiments, it possesses at least all the beneficial effects of the aforementioned technical documentation, and therefore will not be further detailed here.

[0047] The above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the patent scope of the present application. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that, under the technical concept of the present application, the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents; or directly / indirectly applied to other related technical fields, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A printed circuit board assembly, comprising a main board and a sub-board, wherein: A chip is arranged on one side of the main board, and the sub-board is arranged on the side of the main board away from the chip. A signal-connected power conversion module and a power supply module are arranged on the sub-board. The main board and the sub-board are signal-connected, and the power supply module is used to supply power to the chip.

2. The printed circuit board assembly according to claim 1, wherein: The main board is provided with a main power via, a main pad is provided at the position of the main power via, the sub-board is provided with a sub-power via, a sub-pad is provided at the position of the sub-power via, and the printed circuit board assembly also includes a connecting column, which connects the main pad and the sub-pad to achieve signal connection and physical connection between the main board and the sub-board.

3. The printed circuit board assembly according to claim 2, wherein: The number of the power supply module is at least one, and at least one of the power supply modules is arranged on the periphery of the main power via.

4. The printed circuit board assembly according to claim 2, wherein: A sub-power layer is arranged in the sub-board, and the sub-power layer is respectively connected to the power supply module and the sub-power via, and is physically connected and signal-connected to the main board through the connection column.

5. The printed circuit board assembly according to claim 4, wherein: A sub-ground layer is also arranged in the sub-board, and the sub-power layer and the sub-ground layer are alternately stacked.

6. The printed circuit board assembly according to any one of claims 1 to 5, wherein: The chip comprises a power pin, and the power supply module is arranged close to the power pin.

7. The printed circuit board assembly according to any one of claims 1 to 5, wherein: The power conversion module and the power supply module are both arranged on a side of the sub-board away from the main board.

8. The printed circuit board assembly according to claim 1, wherein: The mainboard is also provided with a heat sink and a connector assembly. The heat sink is arranged on a side of the chip away from the mainboard and is in contact with the chip. The connector assembly is arranged on a side of the mainboard away from the daughterboard.

9. A method for manufacturing a printed circuit board assembly, wherein: The method for manufacturing the printed circuit board assembly comprises the following steps: A main board and a sub-board are provided; wherein the sub-board is provided with a sub-power supply layer; A chip and a main power via are arranged on the main board, a power conversion module, a power supply module and a sub-power via are arranged on the sub-board, and the power supply module is respectively connected to the power conversion module and the sub-power layer signal; A connection column for signal connection between the main power via hole and the sub-power via hole is formed by sintering copper paste.

10. An electronic device, wherein: The electronic device comprises the printed circuit board assembly according to any one of claims 1 to 8; and / or, The printed circuit board assembly is manufactured by the method for manufacturing a printed circuit board assembly according to claim 9.

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