Substrate work machine

Abstract

This substrate work machine comprises: a work execution unit that, on the basis of a planned work condition, executes prescribed substrate work on each of a plurality of substrates; a change timing acquisition unit that acquires a change timing at which the work conditions have been changed or modified; and an inspection execution unit that inspects the result of execution of the substrate work on the substrates after the change timing, and stops the substrate work on the next substrate if the result of execution is determined to be unsatisfactory.

Description

Substrate-related work machine

[0001] The present specification relates to a substrate-related operation apparatus that performs a predetermined substrate-related operation on a substrate.

[0002] Mass-production of circuit board products by performing substrate-related operations on boards with circuit patterns formed thereon has become widespread. Typical examples of substrate-related operations include solder printers that print solder paste and component placement machines that place components. It is also common to arrange multiple types of substrate-related operations in a line to form a substrate-related operation line. For example, a substrate-related operation line often includes a solder printer, a print inspection machine, multiple component placement machines, a substrate visual inspection machine, and a reflow machine. In this type of substrate-related operation line, changes in the operation conditions of the solder printer or component placement machine can lead to defects. To address this issue, Patent Documents 1 to 3 propose techniques for changing the inspection methods of downstream print inspection machines or substrate visual inspection machines to adapt to changes in operation conditions.

[0003] Patent Document 1 describes a board inspection management method that includes the steps of acquiring device configuration change information for a component mounting device, determining inspection items for an inspection device based on the acquired information, and inspecting a board using the inspection device based on the determined inspection items. This method is said to enable necessary inspections to be performed within a specified time without introducing expensive board appearance inspection equipment.

[0004] Furthermore, Patent Document 2 describes a substrate-related work result inspection device that determines the inspection procedure for a board based on work information for the substrate-related work performed on the board. Specifically, the work information for the substrate-related work includes history information for work devices such as suction nozzles, mounting heads, and component feeders, as well as defect history information, such as the rate of misplaced mounting positions for suction nozzles, the number of mounting defects for mounting heads, and the rate of pickup errors for each feeder group for component feeders. This allows the work procedure to be changed by selecting inspection targets and determining the inspection sequence, thereby achieving efficient and flexible inspection work.

[0005] Furthermore, Patent Document 3 describes a board visual inspection machine that, when a variable factor that could cause a board's appearance to be defective occurs in an upstream device, inspects the board's appearance using inspection standards that are updated based on the variable factor. Specific examples of variable factors include refilling solder paste and cleaning a screen mask in a solder printing machine, as well as changes in component vendors and production data in a component mounting machine. According to this, it is possible to provide a board visual inspection machine that can update inspection standards depending on the actual state of component mounting.

[0006] JP 2012-064831 A JP 2003-124699 A JP 2013-168538 A

[0007] The technical examples of Patent Documents 1 to 3 are advantageous in that they allow the inspection method of the board visual inspection machine to be changed in response to changes in the operating conditions of the component mounting machine. However, changes in the inspection method do not always match changes in the operating conditions, and the operating conditions themselves may not be changed properly. In such cases, defects may occur in the mounting work performed by the component mounting machine, and the results of the mounting work may be judged as defective by the board visual inspection machine, resulting in defective boards. In particular, when a board-mounting work line is configured including multiple component mounting machines, there is a risk of producing a large number of defective boards. It is also possible that changes in the operating conditions of the solder printing machine may cause defects in the printing work, which may then be judged as defective by the printing inspection machine, resulting in defective boards.

[0008] Therefore, the problem to be solved in this specification is to provide a substrate-related operation machine that can reduce the number of defective substrates even if a work defect occurs after the work conditions of the substrate-related operation machine are changed.

[0009] This specification discloses a substrate-related work machine that includes a work execution unit that executes a predetermined substrate-related work on each of a plurality of substrates based on set-up work conditions; a change time acquisition unit that acquires the time when the work conditions were changed or altered; and an inspection execution unit that inspects the results of the substrate-related work on the substrate after the change time and, if the execution result is determined to be defective, prevents the substrate-related work on the next substrate.

[0010] This specification also discloses a substrate-related work machine that includes a work execution unit that executes a specified substrate-related work on each of a plurality of substrates based on set-up work conditions, a change time acquisition unit that acquires the time when the work conditions were changed or altered, and an inspection execution unit that inspects the results of execution of the substrate-related work on each of a limited number of the substrates after the change time.

[0011] This specification discloses the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 3" in claim 4 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 4" in claim 5 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 5" in claim 6 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 6" in claim 7 as originally filed, and the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 7" in claim 8 as originally filed.

[0012] Furthermore, this specification discloses the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 8" in claim 9 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 9" to "the substrate-related operating machine according to claim 9 or 10" in claim 11 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 9" to "the substrate-related operating machine according to any one of claims 9 to 11" in claim 12 as originally filed, the technical idea of ​​changing "the substrate-related operating machine according to claim 9" to "the substrate-related operating machine according to any one of claims 9 to 12" in claim 13 as originally filed, and the technical idea of ​​changing "the substrate-related operating machine according to claim 1 or 2" to "the substrate-related operating machine according to any one of claims 1 to 8" in claim 14 as originally filed.

[0013] The disclosed substrate-related operation machine inspects the results of substrate-related operations within the machine after the operation conditions are changed, allowing for earlier detection of defective operations compared to a configuration in which inspection is performed by another downstream machine. Therefore, even if a defective operation occurs after the operation conditions of the substrate-related operation machine are changed, this defective operation can be detected early to prevent subsequent occurrence of defective boards, thereby reducing the number of defective boards.

[0014] 7 is a front view illustrating a substrate-related work line including a component mounting machine corresponding to the substrate-related work machine of an embodiment. FIG. 8 is a side view illustrating a configuration of a solder printer corresponding to the substrate-related work machine of an embodiment. FIG. 9 is a perspective view illustrating a configuration of a component mounting machine corresponding to the substrate-related work machine of an embodiment, and an automatic conveyance device. FIG. 10 is a plan view illustrating a configuration of a component mounting machine. FIG. 11 is a block diagram illustrating a configuration related to control of the substrate-related work line and the substrate-related work machine. FIG. 12 is a table illustrating five work conditions. FIG. 13 is an operation flow illustrating the operation of the component mounting machine. FIG. 14 is a defective operation flow illustrating subsequent operations when the inspection result is defective in the operation flow of FIG.

[0015] 1. Configuration of Board-to-Board Work Line 9 First, the board-to-board work line 9, which includes a solder printer 1 and a component placement machine 4 corresponding to the board-to-board work machine of the embodiment, will be described with reference to FIGS. 1 and 5 . The board-to-board work line 9 includes a solder printer 1, a print inspection machine 2, a component placement line 3, a board visual inspection machine 6, and a reflow machine 7. As indicated by the arrow in the upper left of FIG. 1 , the board transport direction in the component placement line 3 is the X-axis direction, the direction perpendicular to the X-axis direction in the horizontal plane is the Y-axis direction, and the vertical direction is the Z-axis direction. The component placement line 3 is configured with five component placement machines 4 and one component placement machine 5 of a different model than the component placement machines 4, lined up in the X-axis direction. The component placement line 3 also includes a common feeder storage device 31 and an automatic exchange device 32.

[0016] The solder printer 1 performs a printing operation to print solder paste on a circuit board in a predetermined pattern shape. The detailed configuration of the solder printer 1 will be described later. The print inspection machine 2 receives the circuit board from the solder printer 1 and performs an inspection operation to inspect the solder printing condition on the circuit board. The print inspection machine 2 is located near the upstream side of the component mounting line 3. A board transport device (not shown) connects the print inspection machine 2 to the component mounting machine 4, which is the most upstream of the component mounting line 3. The board transport device transports boards that have been determined to have a good printing condition by the print inspection machine 2 to the component mounting line 3.

[0017] The five component mounting machines 4 that make up the component mounting line 3 have the same configuration. Each component mounting machine 4 uses a tape feeder 41 to perform a mounting operation of mounting components on a board. As shown in FIG. 1 , the component mounting machine 4 has a component supply device 42 at approximately the mid-height on the front side in the Y-axis direction, and an internal feeder storage device 43 below the component supply device 42. The component supply device 42 has a plurality of slots (not shown) extending in the Y-axis direction. A tape feeder 41 is operably set in each of the plurality of slots. The internal feeder storage device 43 has the same configuration as the component supply device 42, and a tape feeder 41 is set in each of the plurality of slots.

[0018] The tape feeders 41 set in the component supply devices 42 supply components. Meanwhile, the internal feeder storage devices 43 temporarily store tape feeders 41 to be used subsequently and previously used tape feeders 41. In Figure 1, tape feeders 41 are set in the internal feeder storage devices 43 of the first to fourth component mounting machines 4 counting from the upstream side, and the internal feeder storage device 43 of the fifth component mounting machine 4 is empty. The detailed configuration of the component mounting machines 4 will be described later.

[0019] The different model component mounting machines 5 are arranged in a line downstream of the five component mounting machines 4. The component mounting machines 5 perform mounting work of mounting components onto the board using a tray-type component supply device (reference numeral omitted). After the component mounting machines 4 perform the mounting work of mainly small and medium-sized components, the component mounting machines 5 perform the mounting work of mainly large and odd-shaped components.

[0020] The common feeder storage device 31 is arranged in a line upstream of the five component mounting machines 4. The common feeder storage device 31 has a configuration similar to that of the component supply device 42, with a tape feeder 41 set in each of its multiple slots. However, the common feeder storage device 31 has more slots than the component supply device 42, and can store a larger number of tape feeders 41. Each of the multiple tape feeders 41 stored in the common feeder storage device 31 is compatible and can be used with any of the five component mounting machines 4.

[0021] The automatic exchanger 32 moves in the X-axis direction along guide rails provided in front of the five component mounting machines 4 and the common feeder storage device 31 in the Y-axis direction. The automatic exchanger 32 is supplied with power by a non-contact power supply mechanism (not shown). The automatic exchanger 32 moves between the component supply device 42 of each of the five component mounting machines 4 and the common feeder storage device 31 to automatically exchange the tape feeders 41. The automatic exchanger 32 also automatically exchanges the tape feeders 41 between the component supply device 42 and the internal feeder storage device 43 for each of the five component mounting machines 4. The configuration of the automatic exchanger 32 will be described in more detail later. Note that part of the tape feeder 41 exchange work may be performed by an operator.

[0022] The board visual inspection machine 6 is positioned downstream of and spaced apart from the component mounting machine 5. The board visual inspection machine 6 receives the board on which the component mounting operation has been completed from the component mounting machine 5 via the board transport device 61. The board visual inspection machine 6 performs an inspection operation on the results of the mounting operation by imaging the board and processing the image data obtained. In other words, the board visual inspection machine 6 inspects whether the component mounting state is good or bad. A repair station may be provided upstream or downstream of the board visual inspection machine 6 to repair boards determined to be defective. The repaired board is then transported back into the board visual inspection machine 6, where another inspection operation is performed.

[0023] The reflow machine 7 is disposed downstream of and spaced from the board visual inspection machine 6. The reflow machine 7 receives boards that have been judged to be good from the board visual inspection machine 6 via a board transport device 71. The reflow machine 7 heats and cools the solder paste to ensure the soldered state of the components. The line configuration of the board-to-board work line 9 may be other than that described above, and can be modified into various forms.

[0024] 2. Equipment Configuration of Solder Printer 1 Next, the equipment configuration of the solder printer 1 according to the embodiment will be described with reference to FIG. 2 . The solder printer 1 is configured by assembling a substrate transport device 11, a screen support device 12, a squeegee moving device 13, a camera 14, and a control device 19 on a base 10. The base 10 has a bottom surface, a front surface (left side of FIG. 2 ), and a rear surface (right side of FIG. 2 ). The substrate transport device 11 is provided on the bottom surface of the base 10. The substrate transport device 11 has a belt conveyor (not shown) and a substrate holding unit 111. The belt conveyor rotates to transport the substrate K to the substrate holding unit 111. The substrate holding unit 111 is positioned at a work position approximately in the center of the base 10 and is capable of rising and falling. The substrate holding unit 111 holds the transported substrate K, pushes it up to a predetermined height, and brings it into close contact with the underside of a screen 122 (described later). When the printing operation on the substrate K is completed, the substrate holding unit 111 lowers the substrate K. Thereafter, the belt conveyor rotates again to transport the substrate K outside the machine.

[0025] The screen support device 12 is disposed slightly above the substrate transport device 11. The screen support device 12 has a pair of support bases 121 provided on the front and rear surfaces of the base 10. The pair of support bases 121 support the screen 122 in a horizontal position so that it does not sag. The screen 122 is supported on the pair of support bases 121, for example, by frame members provided on the outer periphery. FIG. 2 shows a cross section of the screen 122, and in reality, the thickness of the screen 122 is thinner than the thickness of the substrate K. The screen 122 has a plurality of printing holes 123 formed therethrough in the vertical direction. The printing holes 123 are arranged in a predetermined pattern corresponding to lands (exposed electrodes) on the wiring pattern of the substrate K.

[0026] The squeegee moving device 13 is disposed above the screen support device 12. The squeegee moving device 13 is composed of a head driving device 131, a squeegee head 132, a pair of lifting and lowering drive units 133, and a pair of squeegees 134. The head driving device 131 is mounted across the top of the base 10 and extends in the Y-axis direction (front-to-back direction). The head driving device 131 moves the squeegee head 132 in the Y-axis direction by a linear motion mechanism such as a feed screw mechanism. The squeegee head 132 holds a pair of lifting and lowering drive units 133 aligned front to back in the Y-axis direction.

[0027] Each of the pair of lifting / lowering drive units 133 holds a squeegee 134 on its lower side. The pair of lifting / lowering drive units 133 operate independently of each other and raise and lower the squeegee 134 using an actuator such as an air cylinder. The pair of squeegees 134 are formed in the shape of horizontally elongated plates extending in the X-axis direction and are arranged facing each other. Each of the pair of squeegees 134 slides on the upper surface of the screen 122 in the Y-axis direction, moving the cream solder CS placed on the upper surface of the screen 122. As a result, the cream solder CS passes through the printing holes 123 of the screen 122 and is printed onto the lands of the substrate K.

[0028] Here, the pair of squeegees 134 are alternately driven downward to perform the printing operation. Specifically, the front squeegee 134 (left side in FIG. 2 ) performs the printing operation of moving the cream solder CS from the front side to the rear side. Next, the rear squeegee 134 (right side in FIG. 2 ) performs the printing operation of moving the cream solder CS from the rear side to the front side. FIG. 2 shows the state in which the front squeegee 134 rises and the rear squeegee 134 descends to perform the printing operation. Each of the pair of squeegees 134 is held by the lifting / lowering drive unit 133 at an inclination so that the front side facing the forward direction faces diagonally downward. The inclination angle of the squeegee 134 is adjusted by an adjustment mechanism (not shown) provided below the lifting / lowering drive unit 133. Furthermore, the screen 122 and the squeegee 134 are periodically cleaned to remove solder scum, etc.

[0029] The camera 14 is a digital imaging device having an imaging element. The camera 14 is disposed on the upper rear surface of the base 10, with its optical axis facing diagonally downward. The camera 14 captures an image within its imaging field of view and acquires image data based on a control signal from the control device 19 connected via communication. Specifically, the camera 14 captures images of tools such as the screen 122 and the squeegee 134, and the cream solder CS placed on the top surface of the screen 122. The camera 14 sends the image data acquired by the image capture to the control device 19. The control device 19 processes the image data to confirm the status and position of the tools and the cream solder CS. The camera 14 may also have an image processing unit and send the image processing results to the control device 19.

[0030] The control device 19 is configured using a computer device equipped with a CPU, various memories, input / output units, etc. The control device 19 is communicatively connected to a line management device 99 (see FIG. 5) via a network (not shown). The control device 19 controls the printing operation execution unit based on the printing operation data received from the line management device 99 to proceed with the printing operation. The printing operation execution unit operates based on the set up operation conditions, and specifically corresponds to the substrate transport device 11, screen support device 12, squeegee moving device 13, and camera 14.

[0031] Printing work data is created for each type of board K and is updated or changed as necessary. At least some of the creation, updating, and changes of the printing work data are performed by the operator. The printing work data includes board data related to the shape of the board K, etc., and data related to the type of cream solder CS. The printing work data also includes data related to the screen 122 and squeegee 134 to be used. The printing work data also includes data related to detailed work procedures for the printing work, such as the transport speed of the board K, the movement speed and number of movements and lifting speed of the squeegee 134 in the Y-axis direction, the imaging conditions and image processing method of the camera 14, and the method of replenishing and managing the cream solder CS.

[0032] 3 and 4, the configuration of the component mounting machine 4 according to the embodiment will be described. The component mounting machine 4 includes a component supply device 42, an internal feeder storage device 43, two sets of board transport devices 44, a head drive device 45, a component imaging camera 46, a board imaging camera 47, a height sensor 48, and a control device (not shown) mounted on a base 40.

[0033] As described above, component supply device 42 is arranged such that tape feeders 41 are set in each of a plurality of slots. Case 411 of tape feeder 41 is formed in the overall shape of a vertically long, thin rectangular box. Case 411 detachably holds tape reel 413 around which carrier tape 412 is wound. Carrier tape 412 stores components in each of a plurality of cavities formed at regular intervals along the tape length.

[0034] When the tape feeder 41 is set in a slot of the component supply device 42, power is supplied to the tape feeder 41 from the main body of the component mounting machine 4 via a connector. The tape feeder 41 is also capable of communicating with the control device. The tape feeder 41 controls the feeding operation of the carrier tape 412 based on control commands from the control device. As a result, the tape feeder 41 feeds the carrier tape 412 in a predetermined feeding direction and supplies components so that they can be picked up at a predetermined pick-up position.

[0035] The two sets of board transport devices 44 are arranged side by side in the Y-axis direction on the base 40, and each extends in the X-axis direction. The board transport devices 44 are composed of a belt conveyor and a positioning device, etc., the reference symbols of which are omitted. The belt conveyor transports the boards K sequentially in the transport direction. The positioning device positions the boards K at a predetermined work position. After the component mounting work is completed, the board transport devices 44 transport the boards K out of the machine. Note that the board transport device 44 may be configured as a single lane with only one set.

[0036] The head driving device 45 transfers the components supplied by the component supply device 42 to a predetermined mounting position on the board K, which has been positioned by the board transport device 44. The head driving device 45 moves the movable table 451 in two horizontal directions (X-axis direction and Y-axis direction) using two sets of linear motion mechanisms (not shown). A mounting head 452 is replaceably fixed to the movable table 451 by clamp members (not shown). The mounting head 452 is driven in two horizontal directions together with the movable table 451 by the head driving device 45. The mounting head 452 adjusts the vertical position and rotation angle of the picked component in the horizontal plane, and lowers the component to mount it on the board K.

[0037] Specifically, a holding member for holding a component is attached to the mounting head 452. The holding member uses a suction nozzle 453 that sucks the component by supplying negative pressure. Alternatively, a chuck that grips and holds the component may be used instead of the suction nozzle 453. The suction nozzle 453 held by the mounting head 452 is changed as appropriate depending on the size of the component to be mounted on the board K during the mounting operation. More specifically, a nozzle station 454 that houses multiple replaceable suction nozzles 453 is provided on the upper surface of the base 40. If the suction nozzle 453 to be used in the mounting operation is not held by the mounting head 452, the component mounting machine 4 causes the mounting head 452 to hold the suction nozzle 453 housed in the nozzle station 454 (automatic replacement). Note that in some models of the component mounting machine 4, the operator manually replaces the suction nozzle 453.

[0038] The component imaging camera 46 and the board imaging camera 47 are digital imaging devices having imaging elements such as CMOS. The component imaging camera 46 and the board imaging camera 47 capture images based on control signals from the control device and send the image data acquired by the imaging to the control device. The component imaging camera 46 captures an image of the component held by the suction nozzle 453 of the mounting head 452 from below. The image processing unit of the control device processes the acquired image data to confirm the holding state of the component. The board imaging camera 47 captures an image of the position mark affixed to the board K from above and sends the acquired image data to the control device. The image processing unit of the control device processes the image data to confirm the actual working position of the board K and reflects this in the position control of the mounting head 452.

[0039] The height sensor 48 is provided on the movable stage 451. The height sensor 48 measures the distance to an object located vertically below, thereby measuring the height from the object to the mounting head 452. For example, an optical sensor using a laser beam is used as the height sensor 48. The object includes the board K positioned by the board transport device 44, components supplied by the component supply device 42, and components mounted on the board K.

[0040] The control device is mounted on the base 40, and its location is not limited. The control device is configured using a computer device equipped with a CPU, various memories, input / output units, etc. Note that the control device may be configured by distributing multiple CPUs within the machine and communicating with each other. The control device is communicatively connected to the line management device 99 via a network (not shown). The control device controls the mounting operation execution unit based on the mounting operation data received from the line management device 99 to proceed with the component mounting operation. The mounting operation execution unit operates based on the set up operation conditions, and specifically corresponds to the component supply device 42, the two sets of board transport devices 44, the head drive device 45, the component imaging camera 46, the board imaging camera 47, and the height sensor 48.

[0041] The placement work data is created for each type of board K and is updated or changed as necessary. At least some of the creation, updating, and changes of the placement work data are performed by the worker. The placement work data includes board data related to the shape of the board K and component data related to the shapes of the components to be placed. Here, there are multiple pieces of component data that differ depending on the type and size of the components. The placement work data also includes data related to the type and arrangement of the tape feeder 41 to be used, the suction nozzle 453 to be used, and so on. The placement work data also includes coordinate data for the pick-up position of the tape feeder 41 and coordinate data for the placement position on the board K where the components are to be placed. The placement work data also includes detailed work procedures for the placement work, such as the transport speed of the board K, the movement speed and movement path of the placement head 452, the imaging conditions and image processing method for the component imaging camera 46 and the board imaging camera 47, and so on.

[0042] Next, the automatic exchanger 32 will be described with reference to FIG. 3 . The automatic exchanger 32 is composed of a device main body 321, a holding unit 322, and multiple movement mechanisms (not shown). The device main body 321 is formed in a vertically long box shape with an opening at the rear side in the Y-axis direction facing the component mounting machine 4. The holding unit 322 is formed in a small box shape with an opening at the rear side in the Y-axis direction and is disposed inside the device main body 321. The holding unit 322 is driven by an elevator mechanism (not shown) and moves up and down between an elevated position and a lowered position as indicated by arrow A1. The holding unit 322 has an internal space for holding multiple tape feeders 41 aligned in the X-axis direction. Multiple movement mechanisms are disposed within the holding unit 322 aligned in the X-axis direction. Each of the multiple movement mechanisms moves the tape feeder 41 in the Y-axis direction between the elevated position and the lowered position as indicated by arrows A2 and A3.

[0043] 3, when the holding unit 322 is located in the raised position, it can move the tape feeder 41 between it and the component supply device 42. Similarly, when the holding unit 322 is located in the raised position, it can move the tape feeder 41 between it and the common feeder storage device 31. On the other hand, when the holding unit 322 is located in the lowered position, it can move the tape feeder 41 between it and the in-machine feeder storage device 43.

[0044] 4. Details of changes or modifications to working conditions and examples of causes of defects In the solder printer 1 and component mounting machine 4 of the embodiment, changes or modifications to working conditions may result in work defects. That is, changes or modifications to working conditions in the solder printer 1 may result in boards K being determined to be defective by the print inspection machine 2. Changes or modifications to working conditions in the component mounting machine 4 may result in boards K being determined to be defective by the board visual inspection machine 6. Furthermore, changes or modifications to working conditions in the solder printer 1 may result in boards K being determined to be defective by the board visual inspection machine 6 even if they are not determined to be defective by the print inspection machine 2.

[0045] One example of this type of work condition is the 5Ms of quality control. That is, there are five work conditions: Man, Machine, Method, Material, and Measurement. Here, the work conditions for the solder printer 1 and the component mounting machine 4, the details of changes or variations in the work conditions, and examples of defect factors will be explained for each item with reference to FIG. 6.

[0046] (1) Setup Work Performed by an Operator (Man) Setup work performed by an operator includes creating and installing work data (printing work data, mounting work data) and installing and adjusting components (various tools) of the substrate-related operation machine. The details of these setup work operations are each considered work conditions. Setup work that updates or changes at least a portion of the work data corresponds to a change in work conditions. Installing components means changing the components that perform the substrate-related operation, and adjusting components may change the quality of the operation. Therefore, installing and adjusting components corresponds to a change in work conditions. An example of a case in which a change in work conditions can cause a defect is an operation error. For example, an error in the updated or changed work data can naturally result in a defect. Furthermore, in the solder printing machine 1, poor posture of the squeegee 134 adjusted by the operator or poor condition of the screen 122 installed by the operator can result in a defect. Meanwhile, in the component placement machine 4, poor positioning and posture of the tape feeder 41 set by the operator can result in a defect.

[0047] (2) Components of the Task Execution Unit or Maintenance Status of the Components (Machine) The components of the task execution unit of the substrate-related operation machine naturally constitute one task condition. Furthermore, the quality of the work may change depending on the maintenance status of the components, and the maintenance status constitutes one task condition. Replacing a component corresponds to a change in the task conditions. Furthermore, changes in the maintenance status of the components (adjustment, cleaning, maintenance, etc.) correspond to changes in the task conditions. Defects can be caused by individual differences in components and performance degradation. For example, even if the performance of a replaced component is within the normal range, a defect can occur if it is not well-matched with other components. Furthermore, defects can occur if the negative pressure supplied to the suction nozzle 453 of the component placement machine 4 decreases (a change point where the vacuum level decreases), or if the head drive device 45 is not well-maintained, resulting in a decrease in the position control accuracy of the placement head 452. Furthermore, image processing failures may occur due to a decrease in performance of the camera 14 of the solder printer 1, the component imaging camera 46 of the component mounting machine 4, and the board imaging camera 47.

[0048] Furthermore, for components for which periodic maintenance is recommended, the state of maintenance implementation corresponds to the maintenance state. The arrival of the maintenance due date can be considered a change in the work conditions. From another perspective, use of a component after its maintenance due date carries the risk of defects occurring. Furthermore, the implementation of maintenance on a component is one form of a change in the maintenance state and corresponds to a change in the work conditions. Examples of components for which periodic maintenance is recommended include, but are not limited to, the screen 122 and squeegee 134 of the solder printing machine 1, and the tape feeder 41 and mounting head 452 of the component mounting machine 4.

[0049] (3) Execution Method Set for Substrate-Related Work The execution method set for substrate-related work includes work conditions such as work speed and work sequence. Changes to these are equivalent to changes in work conditions. A defect may result from an inappropriate execution method after the change. For example, after changing the movement speed of the squeegee 134 of the solder printer 1, there is a risk of a decrease in the quality of the printing work. Furthermore, there is a risk of a decrease in the quality of the mounting work after changing the method of controlling the elevation and air pressure of the suction nozzle 453 of the component mounting machine 4 or the horizontal movement speed of the mounting head 452.

[0050] (4) Materials Used in Substrate-Related Operations. Components and materials used in substrate-related operations have attributes such as lot and vendor, and the materials themselves can be considered process conditions. Replenishing components or changing their lots constitutes changes in process conditions. Incompatibility due to changes in materials can result in defects. For example, the physical properties and composition of the cream solder CS replenished by the solder printer 1, such as viscosity, may be slightly different from the original cream solder CS, resulting in incompatibility and potentially reducing the quality of the printing process. Furthermore, a change in component lot or vendor due to replacement of the carrier tape 412 and tape reel 413 used in the component placement machine 4 may result in incompatibility with the component data in the placement operation data. Furthermore, a change in the lot of a substrate K may change the warpage of the substrate K.

[0051] (5) Measurements Associated with Substrate-Related Operations and Processing Based on the Measurement Results. Measurements associated with substrate-related operations and processing based on the measurement results are one type of operation condition that can affect operation quality. A change in the measurement and processing details corresponds to a change in the operation conditions. An abnormality in the measurement and processing details can lead to defects. For example, if an abnormality occurs in the thermal correction process related to the position control of the mounting head 452 of the component mounting machine 4, the accuracy of the component mounting position will decrease, resulting in a defect. Furthermore, because the components of the head drive unit 45 thermally expand over operating time, the accuracy of the position control of the mounting head 452 will decrease if left unchecked. To address this issue, a thermal correction process is periodically performed to thermally correct the scale of the X-Y coordinate system used for position control, and the correction details are updated accordingly. There is a risk of an abnormality occurring in this thermal correction process. Furthermore, if an abnormality occurs in the resolution correction process for image processing of the camera 14 of the solder printing machine 1, or the component imaging camera 46 and board imaging camera 47 of the component mounting machine 4, an image processing failure may occur, preventing image processing from being performed properly.

[0052] 5. Line Management Device 99 In order to reduce the number of defective boards K even if a work defect occurs after the work conditions are changed, the control device of the component mounting machine 4 and the control device 19 of the solder printer 1 are provided with multiple functional units. Prior to describing the functional units, the configuration related to the overall control of the board-related work line 9 will be described with reference to FIG. 5. As shown in the figure, each of the multiple board-related work machines that make up the board-related work line 9 is communicatively connected to the line management device 99. Furthermore, the line management device 99 is communicatively connected to the common feeder storage device 31 and is wirelessly connected to the automatic exchanger 32.

[0053] The line management device 99 is configured using a computer device. The line management device 99 has an input unit that accepts commands and selection operations from workers and the like, and a display unit that displays various information to workers and the like. The line management device 99 commands each of the substrate-related operation machines to perform a substrate-related operation by transmitting operation data. The line management device 99 also receives, in roughly real time, log data from each of the substrate-related operation machines that records a detailed history of the operation execution status, and manages the progress of the substrate-related operation. The line management device 99 also manages the inventory status of the tape feeders 41 in the common feeder storage device 31. The line management device 99 also transmits a command to replace the tape feeders 41 to the automatic exchanger 32 via wireless communication, receives progress information on the replacement operation, and manages the progress.

[0054] 6. Control Configuration Related to Operational Conditions of Component Mounting Machine 4 Next, the control configuration mainly related to operational conditions of the component mounting machine 4 will be described with reference to Fig. 5. The component mounting machine 4 has seven functional units, mainly composed of software, inside the control device. Specifically, the component mounting machine 4 has a mounting operation control unit 81, a change timing acquisition unit 82, a mounting inspection execution unit 83, a transport control unit 84, an automatic recovery unit 85, an automatic response unit 86, and a notification unit 87, as shown in Fig. 5.

[0055] The mounting operation control unit 81 controls the above-mentioned mounting operation execution units (component supply device 42, in-machine feeder storage device 43, board transport device 44, head drive device 45, component imaging camera 46, board imaging camera 47, and height sensor 48). The transport control unit 84 is responsible for controlling part of the operation of board transport device 44. Under normal circumstances, the transport control unit 84 operates board transport device 44 to carry each of the multiple boards K into the machine and position them at a predetermined work position so that the component mounting operation can be performed.

[0056] The change time acquisition unit 82 acquires the change time when the work conditions were changed or altered. The change time acquisition unit 82 can acquire information on many change times when the log data described above is created. The change time acquisition unit 82 can also acquire some change time information from the line management device 99 or other external devices. For example, the change time acquisition unit 82 can acquire change time information when a worker inputs the details of the setup work that has been performed. The change time acquisition unit 82 can also acquire information on the maintenance due date of each component part from operation information of various maintenance devices and input information from the worker who performed the maintenance.

[0057] Furthermore, the change time acquisition unit 82 receives a signal indicating the time when the working conditions were changed or altered in the solder printer 1. This signal is transmitted directly from the solder printer 1 to the component placement machine 4, or transmitted via the line management device 99. The change time acquisition unit 82 handles the time when the working conditions were changed in its own machine (component placement machine 4) in the same way as the time when the working conditions were changed in the solder printer 1. This makes it possible to deal with cases where a change in the working conditions in the solder printer 1 affects the placement work of the component placement machine 4 and causes defects.

[0058] The placement inspection execution unit 83 inspects the results of the component placement work on the boards K after the change time acquisition unit 82 acquires the change time. In other words, the placement inspection execution unit 83 inspects the placement status of components placed after the change time. It is preferable that the placement inspection execution unit 83 inspects the results of the placement work on each of the limited number of boards K after the change time. The limited number may be set to the minimum number necessary to determine whether or not the change in work conditions has affected the quality of the placement work, and can be set to, for example, three or ten boards K. Furthermore, the limited number may be determined using the number of components placed instead of the number of boards K.

[0059] The mounting inspection execution unit 83 uses the board imaging camera 47 to capture images of the mounted components and processes the acquired image data to inspect the mounting state. It is preferable that the mounting inspection execution unit 83 uses the same image processing method as the board visual inspection machine 6, or a more precise image processing method than the board visual inspection machine 6, and uses pass / fail criteria that are equivalent to or stricter than those of the board visual inspection machine 6. This allows the mounting inspection execution unit 83 to find in advance boards K that will be determined to be defective by the board visual inspection machine 6. In other words, a board K that is determined to be good by the mounting inspection execution unit 83 will not be determined to be defective by the board visual inspection machine 6.

[0060] In addition, if the imaging field of view of the board imaging camera 47 is narrower than that of the inspection camera of the board visual inspection machine 6, the board imaging camera 47 can capture images more times than the inspection camera. This allows the inspection target areas of the mounting inspection execution unit 83 and the board visual inspection machine 6 to be aligned. Furthermore, the target of image processing performed by the mounting inspection execution unit 83 may be image data with a narrow imaging field of view, or data obtained by combining multiple image data. As described above, since the existing board imaging camera 47 is used, there is no need to install a new inspection camera, and an increase in the manufacturing cost of the component mounting machine 4 is suppressed.

[0061] It is preferable that the placement inspection execution unit 83 inspects the placement state of only those components that may be affected by a change or modification of the work conditions. For example, if the tape feeder 41 or the tape reel 413 is replaced as an example of a change in work conditions, the placement inspection execution unit 83 can inspect only those components supplied from the replaced carrier tape 412. Furthermore, if the suction nozzle 453 is replaced, the placement inspection execution unit 83 can inspect only those components that will be placed by the replaced suction nozzle 453.

[0062] Furthermore, when multiple types of components are likely to be affected by a change or modification of the work conditions, the placement inspection execution unit 83 may perform a sampling inspection of the placement status of only some of the multiple types of components. For example, when maintenance work is performed on the head drive device 45 as an example of a change in work conditions, multiple types of components may be affected by the maintenance work. Therefore, the placement inspection execution unit 83 performs a sampling inspection of the placement status of the components. For example, the placement inspection execution unit 83 performs a sampling inspection of four components near the four corners of the board K. By sampling multiple components that are widely spaced from each other in this manner, the placement inspection execution unit 83 can accurately and efficiently inspect the presence or absence of the effects of the maintenance work using a small number of components.

[0063] Furthermore, the mounting inspection execution unit 83 may perform a sampling inspection of the boards K after the change timing. For example, after the maintenance due date of a component part arrives as an example of a change in working conditions, the mounting inspection execution unit 83 may perform a sampling inspection of the boards K at a fixed rate, such as one in ten or one in 100. In this case, the inspection may be terminated at the limited number mentioned above, or the inspection may be continued at a fixed rate.

[0064] When the mounting inspection execution unit 83 inspects the mounting state, the through rate of the component mounting machine 4 decreases, which inevitably reduces the through rate of the entire substrate-to-substrate work line 9. In other words, the production efficiency of the substrate K (substrate product) decreases. However, since the number of inspection targets is limited, the decrease in production efficiency is temporary, or the number of inspections can be reduced by sampling inspection. Therefore, the time-averaged production efficiency does not decrease significantly. On the other hand, compared to a configuration in which only the downstream substrate visual inspection machine 6 inspects the mounting state, there is a significant effect in that defects in the mounting work can be determined early.

[0065] When the placement inspection execution unit 83 determines that the placement work is defective, it stops the placement work for the next board K. Furthermore, when the placement inspection execution unit 83 determines that the placement work is defective, the transport control unit 84 restricts the removal of the board K from the machine. This prevents further work on a board K that has been determined to be defective from being carried out meaninglessly. Furthermore, repeated occurrence of defects is prevented. For example, if an improper change in the work conditions in the most upstream component placement machine 4 becomes a cause of a defect, there is a risk that seven defective boards K will occur in the component placement line 3 before the board visual inspection machine 6 finds the defect. Even so, by performing an inspection by the placement inspection execution unit 83, the number of defective boards K will be limited to one.

[0066] When the mounting inspection execution unit 83 determines a defect, it is easily assumed that the change in the working conditions that triggered the start of the inspection is the cause of the defect. Therefore, the notification unit 87 notifies the worker of association information that associates the defect determination result with the changed or modified working conditions. This enables the worker to quickly recognize the occurrence of a defect and take early countermeasures. Furthermore, because the worker is notified of the working conditions that are suspected to be the cause of the defect, the worker does not need the skills or know-how to investigate and determine the cause of the defect.

[0067] Here, it would be more preferable if the equipment could automatically deal with the defect rather than having the worker take countermeasures, as this would contribute to labor savings. However, the means of automatic response may change depending on the contents of the changed work conditions, and there may also be cases where automatic response is not possible. Specific means of automatic response include the automatic recovery unit 85, the automatic response unit 86, and the automatic exchange device 32.

[0068] If the execution result is determined to be defective, the automatic recovery unit 85 automatically restores the changed work conditions to their pre-change state. For example, if a defect occurs after the suction nozzle 453 is replaced in the nozzle station 454, the suction nozzle 453 currently held by the mounting head 452 is presumed to be the cause of the defect. In this case, the automatic recovery unit 85 returns the suction nozzle 453 currently held by the mounting head 452 to the nozzle station 454, and controls the mounting head 452 to retain the previously used suction nozzle 453 again. Also, if a defect occurs after the movement speed (component transport speed) of the mounting head 452 is changed, the current movement speed of the mounting head 452 is presumed to be the cause of the defect. In this case, the automatic recovery unit 85 retroactively examines the log data and controls the movement speed to be restored to the previous speed.

[0069] If the execution result is determined to be defective, the automatic corrective unit 86 automatically replaces the changed working conditions with other equivalent working conditions. For example, assume that a defect occurs after the above-mentioned replacement of the suction nozzle 453. In this case, the automatic corrective unit 86 may control the replacement of the suction nozzle 453 currently held by the mounting head 452 with a different suction nozzle 453 on the nozzle station 454, rather than replacing it with the suction nozzle 453 that was previously used.

[0070] In the embodiment, the automatic exchanger 32 handles the automatic replacement of the tape feeder 41. The automatic exchanger 32 cannot handle this automatically by itself, but handles it automatically in cooperation with the notification unit 87. That is, if a defect occurs after the tape feeder 41 or the tape reel 413 has been replaced, the notification unit 87 notifies the automatic exchanger 32 via the line management device 99 of association information that associates the defect determination result with the replaced tape feeder 41. This enables the automatic exchanger 32 to automatically replace the tape feeder 41. Note that the line management device 99 may instruct the automatic exchanger 32 to provide information regarding the individual tape feeder 41 to be automatically replaced and its storage location. Through the above-described automatic response by the automatic recovery unit 85, the automatic handling unit 86, and the automatic exchanger 32, the component mounting machine 4 returns to a state in which it can successfully perform mounting operations as before.

[0071] It should be noted that even a different model of component mounting machine 5 can be equipped with the above-mentioned mounting operation control unit 81, change time acquisition unit 82, mounting inspection execution unit 83, transport control unit 84, automatic recovery unit 85, automatic response unit 86, and notification unit 87. Furthermore, the above description of the operating conditions and the like related to the tape feeder 41 can be replaced with a description related to the tray-type component supply device, as appropriate.

[0072] 7. Operation of the Component Mounting Machine 4 Next, the operation of the component mounting machine 4 will be described with reference to FIGS. 7 and 8. In the following description, the mounting inspection execution unit 83 performs inspections on a board-by-board basis, with the number of inspected boards K indicated as the inspection count N and the limited number indicated as NE. In FIG. 7, immediately after the component mounting machine 4 starts operation, in step S1, the mounting inspection execution unit 83 clears the inspection count N as an initial condition. In the next step S2, the mounting operation control unit 81 executes mounting operations using the loaded board K as the operation target. In the next step S3, the change time acquisition unit 82 determines whether a change time for the operation conditions has been acquired before the start or during the mounting operation. While the change time has not been acquired, steps S2 and S3 are repeated, and the board K for which mounting operations have been completed is repeatedly carried out, and the next board K is repeatedly carried in.

[0073] When the change time is acquired, the operation flow proceeds to step S4. In step S4, the mounting inspection execution unit 83 inspects the mounting state of the components immediately after the mounting work is completed. In the next step S5, the mounting inspection execution unit 83 branches the operation flow based on the inspection results. In step S6, if the inspection results are good, the mounting inspection execution unit 83 counts up the number of inspections N. In the next step S7, the mounting inspection execution unit 83 determines whether the number of inspections N is smaller than the limit number NE, and branches the operation flow.

[0074] In step S8, if the inspection number N is smaller than the limit number NE, the board K is carried out and the next board K is carried in, and the mounting operation control unit 81 continues the mounting operation. After this, the operation flow returns to step S4, and the loop consisting of steps S4 to S8 is repeated. If no defects are found in the inspection results and the inspection number N reaches the limit number NE, the operation flow returns from step S7 to step S1. This means that the change in the work conditions has not affected the mounting operation and no defects have occurred. After this, steps S2 and S3 are repeated, and the mounting inspection execution unit 83 does not operate, as long as the change time is not acquired.

[0075] If the inspection result is a defect in step S5, the operation flow proceeds to the defect operation flow in Fig. 8. In step S11 of Fig. 8, the mounting inspection execution unit 83 stops the mounting work for the next board K. In the next step S12, the transport control unit 84 restricts the board K determined to be defective from being carried out of the machine. In the next step S13, the notification unit 87 notifies the worker of association information that associates the defect determination result with the changed work conditions. In the next step S14, it is determined whether the equipment can automatically respond to the defect. If automatic response is not possible, the defect operation flow ends.

[0076] If automatic response is possible, in step S15, a response method is selected based on the contents of the changed work conditions. The operation flow proceeds to step S16, step S17, or step S18 depending on the selected response method. In step S16, the automatic recovery unit 85 automatically restores the changed work conditions (work conditions corresponding to the change time acquired in step S3) to their pre-change state. In step S17, the automatic response unit 86 automatically replaces the changed work conditions with other equivalent work conditions.

[0077] In step S18, the notification unit 87 notifies the automatic exchanger 32 of the association information via the line management device 99. In the next step S19, the automatic exchanger 32 automatically replaces the tape feeder 41. The defective operation flow ends when any of steps S16, S17, and S19 is executed. Thereafter, the component mounting machine 4 resumes the mounting operation in accordance with the operator's confirmation of the situation and a restart command. Note that when the automatic device-side response is executed, the component mounting machine 4 may record the board K determined to be defective in log data, remove it from the machine, and automatically resume the mounting operation. This minimizes the decrease in production efficiency.

[0078] According to the component mounting machine 4 of the embodiment, the results of the mounting operation are inspected within the machine itself (component mounting machine 4) after the operating conditions are changed, so that defective operations can be determined earlier than in a configuration in which inspection is performed by the downstream board visual inspection machine 6. Therefore, even if a defective operation occurs after the operating conditions of the machine itself or the solder printing machine 1 are changed, this defective operation can be detected early, preventing the occurrence of subsequent defective boards and reducing the number of defective boards.

[0079] 8. Control Configuration Related to Work Conditions of Solder Printer 1 The solder printer 1 has seven functional units similar to those of the component placement machine 4 inside the control device 19. That is, the solder printer 1 has a printing operation control unit 8A, a change time acquisition unit 8B, a print inspection execution unit 8C, a transport control unit 8D, an automatic recovery unit 8E, an automatic response unit 8F, and a notification unit 8G. Below, we will mainly explain the differences with the functional units of the component placement machine 4, and will omit explanations of commonalities and similarities.

[0080] The printing operation control unit 8A controls the printing operation execution unit (substrate transport device 11, screen support device 12, squeegee moving device 13, and camera 14) described above. The change time acquisition unit 8B acquires the change time when the operation conditions were changed or altered within its own machine (solder printing machine 1). Unlike the change time acquisition unit 82, the change time acquisition unit 8B does not receive signals indicating the change time of other upstream machines.

[0081] The print inspection execution unit 8C operates after the change time to inspect the printing condition (the result of the printing work) of the cream solder CS printed on the board K. The print inspection execution unit 8C uses an inspection camera (not shown) different from the camera 14 to capture an image of the printed board K and processes the captured image data to inspect the printing condition. An inspection position is provided between the work position and the carry-out position of the board transport device 11, and the inspection camera captures an image of the printed board K positioned at the inspection position. The print inspection execution unit 8C preferably uses the same image processing method as the print inspection machine 2 or a more precise image processing method than the print inspection machine 2, and employs pass / fail criteria equivalent to or stricter than those of the print inspection machine 2. By inspecting the printing condition, the print inspection execution unit 8C can limit the number of defective boards K to one.

[0082] For example, if a defect occurs after changing the movement speed or tilt angle of the squeegee 134, the automatic recovery unit 8E returns it to the previous movement speed or tilt angle. The solder printing machine 1 does not have any components that are automatically replaced by the automatic replacement device 32. The solder printing machine 1 of the embodiment can determine work defects earlier than in a configuration in which the printing state is inspected only by the downstream print inspection machine 2, and can reduce the number of defective boards K produced.

[0083] 9. Applications and Modifications of the Embodiments The work conditions described in the embodiments can be appropriately selected and used. For example, the change time acquisition unit (82, 8B) may consider the performance of maintenance as a change in the work conditions, rather than the arrival of a maintenance due date. The change time acquisition unit (82, 8B) may also have a function to automatically determine whether to acquire a change time based on the nature of the change in the work conditions. For example, the change time acquisition unit 82 may not acquire change time information when the carrier tape 412 and tape reel 413 within the same lot are replaced, but may acquire change time information when the lot is changed or when the vendor is changed. By omitting work conditions with a relatively low risk of defects, the number of operations of the placement inspection execution unit 83 is reduced, and a decrease in the slew rate of the component placement machine 4 is suppressed. Various other applications and modifications of the embodiments are possible.

[0084] DESCRIPTION OF SYMBOLS 1: Solder printing machine 11: Board transport device 12: Screen support device 122: Screen 13: Squeegee moving device 134: Squeegee 14: Camera 2: Printing inspection machine 3: Component mounting line 31: Common feeder storage device 32: Automatic exchange device 4: Component mounting machine 41: Tape feeder 42: Component supply device 43: In-machine feeder storage device 44: Board transport device 45: Head drive device 452: Mounting head 453: Suction nozzle 46: Component imaging camera 47: Board imaging camera 5: Component mounting machine 6: Board appearance inspection machine 81: Mounting operation control unit 82: Change time acquisition unit 83: Mounting inspection execution unit 84: Transport control unit 85: Automatic recovery unit 86: Automatic response unit 87: Notification unit 8A: Printing operation control unit 8B: Change time acquisition unit 8C: Printing inspection execution unit 8D: Transport control unit 8E: Automatic recovery unit 8F: Automatic response unit 8G: Notification unit 9: Board work line 99: Line management device K: Board CS: Cream solder

Claims

1. A substrate-related operation machine comprising: an operation execution unit that executes a predetermined substrate-related operation on each of a plurality of substrates based on set-up operation conditions; a change time acquisition unit that acquires the time when the operation conditions were changed or altered; and an inspection execution unit that inspects the results of the substrate-related operation on the substrate after the change time, and prevents the substrate-related operation on the next substrate if the results are judged to be defective.

2. A substrate-related operation machine comprising: an operation execution unit that executes a predetermined substrate-related operation on each of a plurality of substrates based on set-up operation conditions; a change time acquisition unit that acquires the time when the operation conditions were changed or altered; and an inspection execution unit that inspects the results of execution of the substrate-related operation on each of a limited number of the substrates after the change time.

3. A substrate-related work machine as described in claim 1 or 2, comprising a substrate transport device as a control object that transports each of a plurality of substrates into the machine and positions them at a predetermined work position so that the work execution unit can perform the substrate-related work at the work position, and a transport control unit that allows the substrates whose execution results are determined to be good to be transported outside the machine and restricts the substrates whose execution results are determined to be bad from being transported outside the machine.

4. The substrate-related operation machine according to claim 1 or 2, wherein the operation conditions include at least one of the following: (1) the contents of the setup operation performed by an operator; (2) the components of the operation execution unit, or the maintenance state of the components; (3) the execution method set for the substrate-related operation; (4) the materials used for the substrate-related operation; and (5) the contents of measurements associated with the substrate-related operation and processing based on the measurement results.

5. The substrate-related operating machine according to claim 1 or 2, further comprising an automatic recovery unit that automatically restores the changed operating conditions to those before the change when the execution result is determined to be defective.

6. The substrate-related operating machine according to claim 1 or 2, further comprising an automatic corrective unit which automatically replaces the changed operating conditions with equivalent other operating conditions when the execution result is determined to be defective.

7. A substrate-related operation machine as described in claim 1 or 2, further comprising a notification unit that notifies an operator or an automatic exchange device of association information that associates the judgment result that the execution result is defective with the changed or altered operating conditions.

8. The substrate-related operation machine according to claim 7, wherein the automatic exchange device automatically exchanges the changed operation conditions with equivalent other operation conditions when the association information is received.

9. The substrate-related operation machine according to claim 1 or 2, wherein the operation execution unit is a mounting operation execution unit that mounts components on the substrate, and the inspection execution unit is a mounting inspection execution unit that inspects the mounting state of the components that have been mounted.

10. The substrate-related operation machine according to claim 9, wherein the mounting inspection execution unit inspects the mounting state of only those components that may be affected by the change or variation in the operation conditions.

11. The substrate-related operation machine of claim 9, wherein the mounting inspection execution unit randomly inspects the mounting state of some of the multiple types of components when multiple types of components are likely to be affected by a change or variation in the work conditions.

12. A substrate-related operation machine as described in claim 9, wherein the mounting inspection execution unit takes an image of the mounted component using a substrate imaging camera that images a position mark affixed to the substrate, and inspects the mounting state by image processing the acquired image data.

13. The substrate-related operation machine according to claim 9, wherein the change time acquisition unit receives a signal indicating the time when the work conditions were changed or altered in a solder printer provided upstream of the substrate-related operation machine, and the mounting inspection execution unit inspects the mounting state of the components that have been mounted after the time when the work conditions in the solder printer were changed.

14. The substrate-related operation machine according to claim 1 or 2, wherein the operation execution unit is a printing operation execution unit that prints cream solder on the substrate, and the inspection execution unit is a printing inspection execution unit that inspects the printing condition of the printed cream solder.

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