Method for producing electrodeposited copper foils from nonconventional solutions

Abstract

The invention relates to a method for producing electrodeposited copper foils from nonconventional copper-containing solutions in a wide range of concentrations and in the presence of impurities, which comprises: feeding to an electrolytic cell, a step of electrodepositing, and obtaining copper foils.

Description

[0001] A PROCESS FOR THE PRODUCTION OF ELECTROPLATED COPPER FOILS FROM NON-CONVENTIONAL SOLUTIONS.

[0002] Technical Sector

[0003] The present invention relates to the mining industry, more particularly, it corresponds to the production of electrodeposited copper sheets from non-conventional solutions.

[0004] Previous Technique

[0005] The rapid technological development of society requires increasingly sophisticated components for more sophisticated applications. One such application is copper foil, which is a high-purity, thin sheet of Cu (6 to 120 µm thick) manufactured by electrochemical or mechanical processes, depending on the application. Its most common applications are printed circuit boards (rigid and flexible), lithium-ion batteries, solar energy, and medicine as an electromagnetic shield. The main types of foil on the market are rolled foil and electrolytic foil. Their price depends on the thickness and application; in the case of higher-value electrolytic copper foil, they can reach 1.8 to 3.3 times the price of a grade A copper cathode on the London Stock Exchange (LME). This foil is used in the production of copper-clad plates, printed circuit boards, and lithium-ion batteries.

[0006] On the other hand, Cu foil consumption is expected to grow by 4-1.1% annually through 2029, due to its increasing use in batteries and high-tech applications. Global consumption is led by Asian countries, which account for 90% of the US$7 billion market for electrodeposited foils and a total of US$17 billion, including foils obtained by rolling. In particular, Chile currently produces 40% of the world's electroplated Cu cathodes, a significant portion of which is exported to produce Cu foils.

[0007] The global market for electrolytic copper foil production is based on the use of pure copper sulfate solutions, whether obtained by direct chemical dissolution of copper sulfate or by chemical / electrochemical dissolution of high purity copper cathodes or their scrap residues, which feed an electrolytic cell containing a cylindrical drum that rotates at variable speeds and whose surface represents the cathode, which may be stainless steel, titanium or other, facing a parallel anode structure (Ti-Ru, stainless steel, Pb-Ca-Sn alloy, or other) that follows the curvature of the drum, located at a certain distance from it. The electrolytic feed solution is composed of copper or copper sulfate and sulfuric acid in concentrations that fall within the following ranges: Copper, g / L: 30 - 100

[0008] Sulfuric acid, g / L: 40 - 150

[0009] Temperature, °C : 37.8 - 82.2

[0010] Current density, A / m 2 : 2,000 - 10,000

[0011] It is also common to incorporate additives into the feed solution to improve the physical quality of the deposit, minimizing, among other things, the formation of microporosities and nodulations, as well as giving the sheets specific properties such as rigidity, ductility, elongation, hardness, gloss, and roughness.

[0012] In the conventional process, both the purity of the electrolyte and its copper concentration (greater than 30 g / L) are determining factors for product quality. Indeed, the presence of dissolved species other than copper could be a source of contamination of the electrodeposited film, especially if the copper concentration is less than 30 g / L. In an electrolytic process, this contamination can occur through two mechanisms: electrochemical codeposition or mechanical trapping. The main mechanism of contamination depends on the nature and relative composition of the impurities, the temperature and acidity of the electrolyte solution, the electrochemical potential conditions, the kinetic control of the primary and secondary electrochemical reactions, the applied current density, and the electrode configuration in the electrolytic cell.

[0013] To achieve this, this cell operates at high temperatures, concentrations, and current densities, generating thin copper sheets in the micron range. However, these operating conditions limit the power supply to the use of very high-purity electrolytic solutions derived from refined copper materials.

[0014] In this regard, there is a persistent need to develop new alternatives for obtaining copper foils, using less refined raw materials or those obtained from stages prior to the production of grade A copper cathodes. Furthermore, these alternatives should operate with renewable energy and have a smaller environmental footprint.

[0015] Some patents related to this technology are detailed below:

[0016] 1. Application CN108559983A: mentions a copper foil production equipment using a longitudinal slitting machine and a multi-stage foil surface treatment device.

[0017] 2. Patent CN1 1 1394754B: reports a method for preparing copper sheets by adding additives to the electrolyte for copper electrodeposition and for the surface treatment of the produced sheet, which is carried out in various stages and under different conditions.

[0018] 3. Patent KR101262721 B1: describes a method for producing a low illuminance, high gloss copper foil with a surface roughness of 1.5 pm or less and a high gloss property of 40, using an electrolytic solution of copper sulfate with the addition of gelatin and chloride ions in a ratio of 3:1.

[0019] 4. Patent CN1 12226790A: reports a method of producing high-strength ultra-thin copper foil, using a substrate on the cathode consisting of a copper foil with a thickness of 18-35 pm and an insulation layer to facilitate separation of the deposit.

[0020] 5. Patent CN216006045: describes a method for the production of copper foils consisting of a cathode roller covered by a base copper foil and a graphene film, which replicates the topographical characteristics of the surface of the base copper foil.

[0021] 6. Patent KR100700799: discloses equipment for the continuous winding of copper sheets located at the outlet of the electrolytic cell.

[0022] 7. Patent CN214263708(11): describes a system for automatic wrapping of copper sheets that includes a copper sheet feeding mechanism, a wrapping mechanism and a copper sheet conveyor belt recovery mechanism.

[0023] 8. Patent CN1 1 1807108: mentions an automatic device for threading copper sheets.

[0024] 9. Patent CN217530962: describes a copper foil cutting machine that guarantees the quality of copper foil cutting, reduces the likelihood of waste products, and improves foil cutting efficiency. This machine comprises a support mechanism, a roller and winding assembly, and a copper foil storage mechanism.

[0025] 10. Patent EP0442187B1: describes a method for manufacturing a high-elongation, high-temperature electrodeposited copper foil with a matte side and low-profile surface characteristics. In this method, 0.1 to 10 ppm of water-soluble cellulose ether is added to the electrolyte solution.

[0026] 1 1. Patent US6,231,742(B1): reports the production of electrolytic copper foil with high hardness and excellent thermal stability; it also describes the use of additives that are incorporated into the electrolytic solution at different concentrations.

[0027] 12. Patent US3,151,048: discloses the use of a chrome-plated drum, also makes reference to the use of glue and goulac (gluthn, glutramine, gluten) each in the amount of one part per million and chloride in the amount of 0.035 g / L.

[0028] Based on the technologies mentioned, there is no information regarding procedures for the production of copper foils by electrodeposition from non-conventional electrolytic solutions.

[0029] Brief description of figures

[0030] Figure 1: Schematic view of the electrolytic cell for the production of copper sheets, where (1) corresponds to the electrolytic cell, (2) cathode drum with cylindrical geometry, (3) anode, (4) central solution feed duct, (5) solution injection nozzles, (6) nozzle line seal and (7) electrical connectors.

[0031] Figure 2: Schematic of the shape of the feed solution to the electrolytic cell as it exits the nozzle upon impacting the cathode drum surface, where Zone 1 corresponds to the core zone; Zone 2 to the developed flow region; Zone 3 to the stagnation region; and Zone 4 to the wall jet region.

[0032] Figure 3: Side view of the schematic configuration of the electrolytic cell with the feed solution distribution device located at an angle to the horizontal, where (1) corresponds to the electrolytic cell, (2) cathode drum with cylindrical geometry, (3) anode, (4) central solution feed duct and (5) solution injection nozzles.

[0033] Figure 4: Schematic view of the electrolytic cell with the feed solution distributor consisting of two lines of nozzles located in the lower area of ​​the cell where (1) corresponds to the electrolytic cell, (2) cathode drum with cylindrical geometry, (3) anode, (4) central solution feed duct, (5) solution injection nozzles, (6) nozzle line seal and (7) electrical connectors.

[0034] Figure 5: Schematic view of an electrolytic cell with the sheet being formed (A) and the copper sheet obtained (B).

[0035] Figure 6: Schematic view of an electrolytic cell with the sheet being formed (A) and the copper sheet obtained (B).

[0036] Disclosure of the Invention

[0037] This technology represents a process for producing electrodeposited copper foils from unconventional copper-bearing solutions across a wide range of copper concentrations and in the presence of certain impurity concentrations, based on the control of mass transfer processes. A nonconventional solution is defined as one that, in addition to copper, contains species other than copper across a wide range of concentrations, and also as solutions not obtained by dissolving metallic copper, for example, copper cathode solutions.

[0038] The chemical composition of the non-conventional copper-bearing solutions considered in this invention varies in concentration and element content. Depending on the source of this solution, the impurities may be primarily, but not exclusively, arsenic, antimony, bismuth, selenium, tellurium, silver, nickel, iron, lead, aluminum, zinc, sulfur, or phases containing these elements.

[0039] If these impurities are in solid form, they can be mechanically trapped during the electrodeposition of the copper foil and contaminate the product. Therefore, the process considers in a first stage a prior preparation of the feed solution, which consists of the removal of the solid by: a) a solid-liquid separation stage that can be by filtration of the solution using, for example, a bed filter to retain solid particles present in the solution and / or b) promote the sedimentation of solid particles using a flocculant to subsequently go through a solid-liquid separation stage as described in point a).

[0040] If the solution does not contain solid species, it is fed directly to an electrolytic cell for producing copper foil. The composition of the feed solution can range in terms of dissolved copper concentration from 5 to 80 g / L, preferably from 20 to 60 g / L, and sulfuric acid from 30 to 250 g / L, preferably from 100 to 210 g / L.

[0041] The solution fed to the electrolytic cell must have certain physicochemical characteristics that are relevant to ensure proper functioning of the process in terms of copper solubilization capacity, conductivity, density, and viscosity of the solution fed to the cell. These aspects are related to the copper / sulfuric acid ratio and the solution temperature. For this purpose, empirical models are used in terms of solution composition, temperature, and some impurities. The range of validity of the models is shown in Table 1, and the correlations are presented in equations (1 ), (2), and (3) for density, dynamic viscosity, and conductivity, respectively, where the concentrations C are expressed in g / L and the temperature T in °C.

[0042] Table 1. Concentration and temperature ranges considered in the empirical models for density, dynamic viscosity and conductivity.

[0043] Viscosity is a physicochemical property of a solution that depends, among other factors, on its composition and temperature. It affects ionic mobility in the solution and, therefore, the electrical conductivity of the solution and the mass transfer of the different ionic species in the electrolyte. This is important when determining the parameters and operating conditions of the electrodeposition process, taking into account the presence of impurities that can affect the behavior of the electroactive species in the electrolytic solution. To adapt non-conventional solutions as feedstock for copper foil production cells, the solution temperature must be controlled within the range of 15 to 80 °C, preferably between 35 and 65 °C.

[0044] If the solution contains silver in dissolved form, an optional preliminary stage of solution preparation is considered, which involves precipitating the silver with sodium chloride (NaCl). The ionic silver concentration range depending on temperature is 1.064x10'. 2 at 1,579x10' 2 M at 10 and 80 °C, respectively. Therefore, to precipitate silver in the form of silver chloride, Cl' must be added to the NaCl form in concentrations of at least 4.02x10' 9 at 5.70x10' 7 M at 10 and 80 °C, respectively.

[0045] If the solution contains arsenic and antimony, given the anodic overpotential conditions of the process, these species can be oxidized in the vicinity of the anode and then reduced as they approach the vicinity of the cathode; however, even in their trivalent state, both species remain dissolved and are therefore not feasible to be deposited together with the copper.

[0046] Under these considerations, the chemical and physical quality of the product, considering the use of non-conventional solutions, is controlled by current density, which must be no greater than 2 / 5 of the limiting current density value determined for each case. This value depends on the hydrodynamic conditions and the properties of the solution and is not a fixed value. Therefore, the process operates under mixed kinetic control conditions. This current value depends on the mass transfer conditions in the electrochemical system, where kinetic control is achieved through the speed and distribution of the feed flow of the non-conventional solution to the electrolytic cell.

[0047] The present invention defines a process and method of feeding the non-conventional copper solution in order to reduce the resistance to mass transfer and, through the applied current density, control the quality of the sheet obtained.

[0048] The mass transfer in the electrochemical system is given by the expression: i = -ZiUiFCtVc / ) - DiVCi F CtvJ (4) where -ZiUiFCiVtp refers to the mass transfer by migration effects, DtVCt to the mass transfer component by diffusion and C tvJ to the component associated with mass transfer by convective forces. Of these three components, the migration and convection processes can be neglected, since the solution operates under the action of an electric field and is sufficiently agitated such that the convective forces generated are high enough to maintain a constant and homogeneous copper concentration within the solution. In this sense, the mass transfer of the electroactive species of interest, in this case, cupric ions, is represented by the flow of this species / Cu 2+through the diffusion layer according to expression (5): where D Cu 2+ is the diffusion coefficient of the Cu species 2+ through the solution, Coo and C s are the concentrations of Cu 2+ within the solution and at the solution-cathodic electrode interface, 5 is the thickness of the diffusion layer and k mis the mass transfer coefficient of the Cu species 2+ . In terms of the variable electric current, expression (5) can be represented by equation (6) where A is the effective area of ​​the cathodic electrode:

[0049] / = nFAkm C", - C s ) (6)

[0050] The current / reaches a maximum value when C s is 0 (region of the electrolyte in which the concentration of the electroactive species is not affected by diffusive processes), called limit current I L , whose expression is given by: I L = nFD Cu2+ A^- (7) where in terms of the limiting current density i L , where i L = I L / TO L , takes the form:

[0051] According to expression (7), the limiting current is related to the diffusion coefficient of Cu 2+in the solution and the concentration gradient in the diffusion layer, therefore, for the same concentration condition within the solution (solution concentration far from the electrode surface or outside the diffusion layer), the limiting current can be modified by varying the thickness of the diffusion layer. In this process, a fluid-dynamic condition is maintained under a turbulent forced convection regime, increasing mass transfer and, thus, increasing the limiting current value. This is extremely relevant, particularly in the case of non-conventional solutions with low copper concentrations, in order to achieve operating currents of such magnitude that thin films are obtained under continuous operating conditions.

[0052] Turbulence is achieved in the system using a device comprising a central feed duct that distributes the solution to a series of injection nozzles. The injection nozzles are cylindrical ducts with a diameter of d, located at a distance H from the surface of the cathode drum (see Figure 1). The number of nozzles depends primarily on the length of the cathode drum, with at least three nozzles being immersed in the electrolytic cell to impact the surface of a cathode drum.

[0053] The feed solution is injected through the nozzles to directly impact the cathode cylinder in the form of a jet, so that the linear velocity of the solution corresponds to the exit velocity of the solution from the feed duct, u, which in terms of the feed flow rate through each nozzle Q¿, and the cross-sectional area of ​​the feed duct A d , will be: u = Qi ■ Ad (9)

[0054] The Albery and Bruchestein expression allows relating the limiting current density to the flow condition of the solution, also considering the physicochemical aspects of the feed solution, given by: i L = 0.62

[0055] Where n is the number of electrons transferred, F is the Faraday constant, and s el diffusion coefficient of cupric ions in the solution, v is the kinematic viscosity of the solution, H is the distance from the exit of the solution injection nozzle to the cathode surface, d is the diameter of the injection nozzle, C M is the concentration of cupric ions within the solution and Q is the feed flow of the solution through the injection nozzle.

[0056] The region where the solution directly impacts the cathode drum is called the stagnation region (see Figure 2) and in it, the thickness of the hydrodynamic boundary layer is practically independent of the position in the radius direction for the central position, where r = 0. In this region, the average mass transfer coefficient of the solution over the surface is equivalent to the mass transfer coefficient at the local level and independent of the radial position and, therefore, it is possible to maintain a constant concentration of the species that diffuses at the electrode surface, in this case, cupric ions.The extent of the stagnation region, which depends on the solution feed flow rate, the distance H and the injection nozzle diameter d, defines the effective electrode area which corresponds to a section of the drum in the submerged region, which in terms of d, lies in the range 1 , 6 d to 3 d in the radial direction and 1 , 6 d to 2.2 d in the axial direction. Therefore, the thickness of the diffusion layer 6 lying within the stagnation region reaches sufficiently small values ​​so that i. L increases to an extent that compensates for the negative effect of a low C concentration m . In this condition, the i L moves towards high values ​​or high enough so that the applied current i ap for the sheet thickness condition, it is in the mixed kinetic control regime.

[0057] This condition is reached when the dimensionless Reynolds number given by ud

[0058] Re = — , is greater than 3000, where u is the linear velocity of the solution impacting the drum and v is the kinematic viscosity of the solution.

[0059] The active cathode surface is located in the stagnation region of an incident jet perpendicular to the axial axis of the drum, therefore, the critical factor is the velocity of the solution impacting the electrode wall in the stagnation zone, which must comply with Re > 3000. To satisfy this condition along the entire length of the drum, a configuration of nozzles in series is considered such that the flow rate through each nozzle and the exit velocity of the solution through each nozzle satisfy the Re condition. The configuration of the injection nozzles is defined in terms of the dimensions of the cathode drum, the treatment capacity, the copper concentration in the feed solution, the impurity content in the solution and the thickness of the copper foil to be produced. Considering the total feed flow, Q and Q t to the partial flow of solution that is injected by each nozzle individually, we have that:

[0060] Q = n t Q t (1 1 ) where n t is the number of nozzles.

[0061] These can be arranged as

[0062] • a line of nozzles located in the lower area of ​​the cell (Figure 1 where (1) corresponds to the electrolytic cell, (2) cathode drum, (3) anode, (4) central feed duct; (5) solution injection nozzles, (6) nozzle line seal and (7) electrical connectors:);

[0063] • a line of nozzles located on the cell wall with an angle a in the range -45 to 45° (Figure 3);

[0064] • a distribution of nozzles located in the positions described in the previous points (Figure 4).

[0065] Based on the above considerations, to establish the process parameters for obtaining copper foils from non-conventional solutions, it is necessary to determine at least: a. solution identification, which includes elemental chemical analysis, conductivity measurement, density measurement, and kinematic viscosity; b. optionally, a silver removal stage by precipitation and conventional filtration; c. optionally, a solids removal stage by conventional filtration; and d. feeding the solution to the drum through the solution flow distribution device.

[0066] For cathode drums they have a diameter / length ratio of 1.5 and the feed solution distribution system is defined by a series of nozzles, at least 3, with a diameter less than 0.05 m located at a distance greater than 0.01 m from the surface of the cathode drum, with a feed solution velocity for each nozzle over 0.5 m / s and the Reynolds condition greater than 3000 at the exit of each nozzle is met. Once the electrodeposition is complete, the copper foil, which has a purity greater than 99.9% and variable thicknesses over 6 microns, must be removed.

[0067] Advantageously, this technology allows the production of copper foils for applications in the manufacture of electronic devices, using unconventional solutions, i.e., solutions with either low copper content; solutions with impurities; or solutions with low copper content and impurities. This allows:

[0068] 1. to exploit resources that constitute waste materials in copper electrowinning and electrorefining plants,

[0069] 2. treat solutions generated in intermediate stages in hydrometallurgical processes of copper production,

[0070] 3. reduce energy consumption compared to the production of copper sheets by the conventional route whose raw material is copper electrodeposited in the form of cathodes, and

[0071] 4. obtain a commercial product of greater economic value than a copper cathode, from a low-cost raw material.

[0072] These advantages represent an opportunity for copper-producing countries, as they allow for the expansion of the value chain by producing copper sheets using unconventional solutions generated from either mined copper or secondary copper as raw materials.

[0073] Application examples

[0074] Example 1: Unconventional solution with high dissolved copper content.

[0075] To verify the process of obtaining copper sheets from non-conventional solutions, a volume of 17 liters of an electrolytic solution from a copper refinery with a composition of 47.96 g / l of copper and 185 g / l of sulfuric acid with concentrations of 8.58 g / l of As, 0.51 g / l of Sb, 0.14 g / l of Zn, 47.8 mg / l of Ch, 7.4 mg / l of Bi, 0.61 g / l of Fe, 1.29 g / l of Ni, 0.10 mg / l of Se, 0.10 mg / l of Te, 0.61 g / l of Ca and 0.04 g / l of Mg was used.

[0076] This solution was heated to 40°C and fed into a recirculating electrolytic cell using a peristaltic pump. The cell consisted of a rotating cylindrical drum of high-purity titanium and two meshed anodes of titanium coated with iridium oxide. The drum rotation speed was controlled by a controller. Operation was monitored by measuring the redox potential and the anodic and cathodic potentials.

[0077] The applied current density was 2000 A / m 2 for a period of 810 seconds. A 0.3 m diameter and 0.2 m long cathode drum was used, in front of which, at a distance of 0.06 m longitudinally, a distributor consisting of seven injection nozzles of 0.002 m diameter and 0.0036 m apart on their axial axis was arranged. The flow condition was Re = 14000.

[0078] Once the sheet was produced, it was washed with distilled water and then manually removed from the cathode drum. An image of the produced sheet is presented in Figure 6. This sheet had a thickness of 30 microns, a mass of 38.09 grams, and 99.925% Cu. Example 2: Unconventional solution with low copper content.

[0079] A volume of 17 liters of an electrolytic solution from a copper refinery with a composition of 20.1 g / l copper and 184.6 g / l sulfuric acid with concentrations of 8.58 g / l As, 0.51 g / l Sb, 0.14 g / l Zn, 47.8 mg / l Cl', 7.4 mg / l Bi, 0.61 g / l Fe, 1.29 g / l Ni, 0.10 mg / l Se, 0.10 mg / l Te, 0.61 g / l Ca and 0.04 g / l Mg was used.

[0080] This solution was heated to 40°C and fed into a recirculating electrolytic cell using a peristaltic pump. The cell consisted of a rotating cylindrical drum of high-purity titanium and two meshed anodes of titanium coated with iridium oxide. The drum rotation speed was controlled by a controller. Operation was monitored by measuring the redox potential, anode potential, and cathode potentials.

[0081] The applied current density was 1960 A / m 2 for a period of 2040 seconds. A 0.3 m diameter and 0.2 m long cathode drum was used, in front of which, at a distance of 0.06 m longitudinally, a distributor consisting of seven injection nozzles of 0.002 m diameter and 0.0036 m apart on their axial axis was arranged. The flow condition was Re = 14000.

[0082] Once the film was produced, it was washed with distilled water and then manually removed from the cathode drum. An image of the produced film is presented in Figure 7. This film had a thickness of 60 microns, a mass of 77.90 grams, and 99.92% Cu.

Claims

Claims 1 A process for the production of electrodeposited copper sheets from non-conventional solutions, carrying copper in a wide range of concentrations and in the presence of impurities CHARACTERIZED in that it comprises at least the following stages: a. feeding to an electrolytic cell: feeding a solution free of solid species to an electrolytic cell for the production of copper sheets, where said solution must comprise at least a concentration of dissolved copper between 5 to 80 g / L and sulfuric acid between 30 to 250 g / L, among other species; b. electrodeposition stage: in the cell for the production of sheets that must operate between 15 - 80 eC. the solution is passed through a central duct that distributes the flow to a series of injection nozzles, at least 3, which are located immersed in the electrolytic cell to impact the surface of a cathode drum; arranged at a distance greater than 0.01 m from the drum surface, where the speed of the feed solution through each nozzle must be over 0.5 m / s and a Reynolds number greater than 3000 must be met at the exit of each nozzle; and c. obtaining copper sheets: once the electrodeposition stage is complete, the copper sheet with a purity greater than 99.9% and a thickness greater than 6 microns must be removed. 2.- A process for the production of electrodeposited copper sheets from non-conventional solutions, according to claim 1, CHARACTERIZED in that, optionally, if the solution contains solids, they must be removed prior to feeding into the electrolytic cell by means of a solid-liquid separation or by sedimentation of the solid particles using a flocculant / solid-liquid separation. 3.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claims 1 and 2, CHARACTERIZED in that the solid-liquid separation is by filtration of the solution using a bed filter. 4.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 1, CHARACTERIZED in that, optionally, if the solution contains silver it must be previously precipitated before being fed to the electrolytic cell. 5.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claims 1 and 4, CHARACTERIZED in that to precipitate the silver, NaCl must be added in concentrations of at least 4.02x10' 9 at 5.70x10' 7 M to 10 e C and 80°C, respectively. 6.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 1, CHARACTERIZED because in stage “b” the solution comprises at least a concentration of dissolved copper, preferably between 20 and 60 g / l and sulfuric acid, preferably between 100 and 210 g / l, among other species. 7.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 1, CHARACTERIZED in that in stage "b" it operates, preferably, between 35 - 65 e C.

8. An electrolytic cell for the production of electrodeposited copper sheets from non-conventional solutions CHARACTERIZED because in stage “b” the cathode drum has a diameter / length ratio of 1.

5. 9.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 1, CHARACTERIZED in that in stage “b” the nozzles directly impact the cathode drum in the form of a jet. 10.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 9, CHARACTERIZED in that the nozzles in series are located in the lower area of ​​the cell. 1 1.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 9, CHARACTERIZED in that the nozzles in series are located on the cell wall with an angle α in the range -45 to 45°. 12.- The process for producing electrodeposited copper sheets from non-conventional solutions according to claim 9, CHARACTERIZED in that the nozzles are distributed in the lower area and on the wall of the cell.

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