Coil component, production method for coil component, and electronic / electrical apparatus

Abstract

This coil component 100 comprises a coil conductor part 20 that includes a portion that has a spiral shape that has a plurality of turns that are aligned in a second direction that intersects a first direction that is a winding axis direction. The coil conductor part 20 has a first conductor part 11A that comprises a first conductive material and has a portion that extends along the extension direction of the turns and a second conductor part 11B that comprises a second conductive material and is provided to cover at least a portion of the first conductor part. In a first cross-section taken by cutting a turn along a plane that includes the first direction and the second direction, of the lines described by the outline of the first conductor part 11A, the two lines that are aligned in the second direction have a tapered region Rt at which the gap between the lines narrows toward the end on one side in the first direction and a straight region Rs on the other side in the first direction at which the gap is substantially constant, and of the lines described by the outline of the turn, the gap between the two lines that are aligned in the second direction widens toward the end on the one side in the first direction or is substantially constant, making it easier for the cross-section of the turn to achieve an ideal square shape and making it easier to reduce the direct-current resistance value of the coil component 100.

Description

Coil component, coil component manufacturing method, and electronic / electrical equipment

[0001] The present invention relates to a coil component, a method for manufacturing the same, and an electronic / electrical device in which the coil component is mounted.

[0002] Patent document 1 discloses a coil pattern formed on at least one surface of a substrate, the coil pattern comprising a first plating film formed on the substrate and a second plating film formed to cover the first plating film, the coil pattern being formed in a spiral shape on both sides of the substrate, at least a portion of the first plating film being connected via a conductive via formed in the substrate, and the first plating film being formed so as to narrow from the lower surface in contact with the substrate towards the upper surface.

[0003] Special table 2019-508905 publication

[0004] Recently, there has been an increasing demand for miniaturization of coil components, and in spiral coil patterns arranged inside coil components, the gaps between adjacent turns in a direction intersecting the spiral direction have become particularly small. For this reason, it has become difficult to make the cross section of the first plating film in Patent Document 1 square simply by narrowing its width from the lower surface that contacts the substrate to the upper surface.

[0005] Based on this current situation, the present invention aims to provide a coil component that can make the cross-sectional shape of the coil closer to a square even when the gap between adjacent turns is narrow. It also aims to provide a method for manufacturing such a coil component, and an electronic or electric device in which such a coil component is mounted.

[0006] In one aspect, the present invention, which is provided to solve the above-described problems, is a coil component including a coil conductor portion including a spiral portion having a winding axis in a first direction and a plurality of turns aligned in a second direction intersecting the first direction, wherein the coil conductor portion includes: a first conductor portion made of a first conductive material and having a portion extending along the extension direction of the turns; and a second conductor portion made of a second conductive material and provided so as to cover at least a portion of the first conductor portion; when the turns are cut along a plane including the first direction and the second direction to obtain a first cross section, of the lines drawn by the outline of the first conductor portion in the first cross section, two lines aligned in the second direction have a tapered region whose spacing becomes narrower as they approach a tip on one side in the first direction, and a straight region whose spacing is approximately equal on the other side in the first direction; and of the lines drawn by the outline of the turns in the first cross section, the two lines aligned in the second direction are wider or approximately equal to each other as they approach a tip on one side in the first direction.

[0007] By having the outer shape of the first conductor portion have a straight region and a tapered region in the cross section of the turn, the shape stability of the first conductor portion is increased, and as a result, the cross section of the turn can be more reliably realized as an ideal square shape.

[0008] In another aspect, the present invention provides a coil component including a coil conductor portion including a spiral portion having a first direction as a winding axis direction and a plurality of turns aligned in a second direction intersecting the first direction, wherein the coil conductor portion has a first conductor portion made of a first conductive material and having a portion extending along the extension direction of the turns, and a second conductor portion made of a second conductive material and provided so as to cover at least a portion of the first conductor portion, and wherein when the turns are cut along a plane including the first direction and the second direction to obtain a first cross section, the outline of the first conductor portion is such that the first conductor portion is aligned along the second direction among the lines drawn on the first cross section. two lines aligned in the second direction among the lines drawn by the outline of the turn on the first cross section are equally divided in the first direction to define a first region R1 and a second region R2 from one end side; two lines aligned in the second direction among the lines drawn by the outline of the turn on the first cross section are equally divided in the first direction to define a third region R3 and a fourth region R4 from one end side; and when the inclination of the direction in which the two lines approach each other is defined as positive for the average inclination angle of each region with respect to the first direction, the average inclination angle θ1 of the first region is larger than both the average inclination angle θ2 of the second region and the average inclination angle θ3 of the third region.

[0009] When the average inclination angles θ1 to θ3 in the cross section of the turn satisfy the above relationship, the shape stability of the first conductor portion is improved, and as a result, the cross section of the turn can be more stably realized as an ideal square shape.

[0010] In the above coil component, when the one of the two surfaces of the first conductor portion facing the first direction, which has a longer length in the second direction, is defined as a first bottom surface and the other as a first top surface, a width W1b that is the length in the second direction of the first bottom surface, a width W1t that is the length in the second direction of the first top surface, a width W2b that is the length in the second direction of the turn at the position of the first bottom surface, and a width W2t that is the length in the second direction of the surface of the turn closest to the first top surface, of the two surfaces facing the first direction, may satisfy the following formulas (1) and (2): W1b>W1t (1) (W1t / W1b) / (W2t / W2b)<0.93 (2)

[0011] In the above coil component, when the first conductive material includes a crystalline metallic material and the crystal growth direction of the crystalline metallic material is along the first direction, it is easy to achieve shape control of the cross section of the turn based on the shape control of the first conductive material as described above.

[0012] In the above coil component, the coil conductor portion may have, as the spiral-shaped portion, a first spiral conductor portion and a second spiral conductor portion aligned in the first direction, and may have a via portion electrically connecting the inner end portion of the first spiral conductor portion and the inner end portion of the second spiral conductor portion.

[0013] The above-mentioned coil component may further include a main body portion covering at least a portion of the coil conductor portion from both sides in the first direction and containing magnetic powder, and a pair of external electrodes in contact with the surface of the coil conductor portion exposed from the main body portion and electrically connected through the coil conductor portion, in which case at least a portion of the surface of the portion of the coil conductor portion located inside the main body portion may be covered by a coil insulating portion.

[0014] In another aspect, the present invention provides an electronic / electrical device incorporating the above-described coil component, wherein the coil component is connected to a substrate via the pair of external electrodes. Examples of such electronic / electrical devices include power supply units equipped with a power switching circuit, a voltage step-up / step-down circuit, a smoothing circuit, etc., and small portable communication devices. The electronic / electrical device according to the present invention includes the above-described coil component, and therefore has excellent overall characteristics as an inductance element.

[0015] In another aspect, the present invention provides a method for manufacturing a coil component, the method comprising: forming an insulating negative pattern on a conductive layer of a substrate having a conductive layer on a main surface normal to a first direction; forming a first conductor by electroplating the conductive layer; removing the negative pattern; removing the conductive layer exposed by removing the negative pattern; and forming a second conductor so as to cover the exposed portion of the first conductor. In this manufacturing method, the negative pattern has a stripe portion having a plurality of lines aligned in a second direction that is one of the in-plane directions of the main surface, and forming the stripe portion includes exposing a sheet-like negative resist provided on the main surface so that a portion remote from the substrate is positioned ahead of a depth of focus.

[0016] In the above-described method for manufacturing a coil component, the depth of focus may be 35% or more of the thickness of the first conductor portion.

[0017] In the above-mentioned method for manufacturing a coil component, a developed surface formed by development in the line of the stripe portion may have a negative tapered region inclined with respect to the first direction and a negative straight region aligned with the first direction.

[0018] According to the present invention, a coil component is provided that allows the cross-sectional shape of the coil to be closer to a square even when the gap between adjacent turns is narrow. Furthermore, according to the present invention, a coil component is provided that makes it easy to reduce the direct current resistance (DCR) of the coil component and has excellent electrical characteristics. Electronic and electrical devices incorporating this coil component can have improved performance and reduced dimensions. Furthermore, a method for manufacturing the above coil component is also provided.

[0019] 1 is a perspective view conceptually illustrating the shape of a coil component according to an embodiment of the present invention. FIG. 2 is a diagram illustrating the structure of a coil conductor included in a coil component according to an embodiment of the present invention. FIG. 3 is an XY plan view illustrating the structure of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 4 is an XZ sectional view taken along line A-A' in FIG. 2. FIG. 5 is an XZ sectional view illustrating the structure of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 6 is an XZ sectional view illustrating the structure of a first spiral conductor included in a coil component according to a conventional technique. FIG. 7 is an XZ sectional view illustrating the structure of a modified example (part 1) of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 8 is an XZ sectional view illustrating the structure of a modified example (part 2) of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 9 is an XZ sectional view illustrating the structure of a modified example (part 3) of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 10 is an XZ sectional view illustrating the structure of a turn included in a first spiral conductor included in a coil component according to an embodiment of the present invention. 8 is an XZ cross-sectional view illustrating the structure of a turn of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 9 is an XZ cross-sectional view illustrating the structure of a turn of a modified example (No. 4) of a first spiral conductor included in a coil component according to an embodiment of the present invention. FIG. 10 is a partial enlarged view of FIG. 4. FIG. 11 is a partial enlarged view of FIG. 8. FIG. 12 is an explanatory view (No. 1) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 13 is an explanatory view (No. 2) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 14 is an explanatory view (No. 3) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 15 is an explanatory view (No. 5) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 16 is a detailed explanatory view (exposure process) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 17 is a detailed explanatory view (after development process) of an example of a method for manufacturing a coil component according to an embodiment of the present invention. FIG. 18 is a detailed explanatory view (after first plating treatment) of an example of a method for manufacturing a coil component according to an embodiment of the present invention.FIG. 1 is a detailed explanatory diagram (exposure process) of an example of a manufacturing method according to prior art (Part 1); FIG. 2 is a detailed explanatory diagram (after development process) of an example of a manufacturing method for a coil component according to prior art (Part 1); FIG. 3 is a detailed explanatory diagram (after first plating process) of an example of a manufacturing method for a coil component according to prior art (Part 2); FIG. 4 is a detailed explanatory diagram (exposure process) of an example of a manufacturing method for a coil component according to prior art (Part 2); FIG. 5 is a detailed explanatory diagram (after development process) of an example of a manufacturing method for a coil component according to prior art (Part 2); FIG. 6 is a detailed explanatory diagram (after development process, when a defect occurs) of an example of a manufacturing method for a coil component according to prior art (Part 2);

[0020] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0021] Fig. 1 is a perspective view conceptually illustrating the shape of a coil component according to one embodiment of the present invention. Fig. 2 is a diagram illustrating the structure of a coil conductor provided in a coil component according to one embodiment of the present invention. For convenience of explanation, in Fig. 2, the coil conductor is depicted with a solid line, the main body is depicted with a dashed line, and other components are omitted from the illustration. Fig. 3 is an XY plan view (a view of the coil conductor from the Z1 side in the Z1-Z2 direction) illustrating the structure of a first spiral conductor provided in a coil component according to one embodiment of the present invention.

[0022] (Overall Configuration) A coil component 100 according to one embodiment of the present invention includes a coil portion 10 having a coil conductor portion 20 , a main body portion 30 , a first external electrode 41 , a second external electrode 42 , and exterior coatings 50 and 60 .

[0023] (Coil) As shown in Figures 2 and 3, the coil portion 10 has a coil conductor portion 20 including a first coil conductor portion 201 having a spiral-shaped first spiral conductor portion 11 that is wound around an axis O along a first direction (Z1-Z2 direction) from an inner peripheral end 12 of the first spiral conductor portion 11 toward an outer peripheral end 13 of the first spiral conductor portion 11, away from the axis O. That is, the first direction is the winding axis direction of the first spiral conductor portion 11. In Figure 2, the first spiral conductor portion 11 has conductors arranged in a spiral shape that is wound clockwise from the inner peripheral end 12 toward the outer peripheral end 13, away from the axis O, as viewed from the Z1 side in the Z1-Z2 direction. In this specification, the "spiral direction" of the spiral portion means the direction from the inner peripheral end 12 toward the outer peripheral end 13. The same definition is used for the second spiral conductor portion 21.

[0024] The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has appropriate conductivity. Specific examples of the conductor constituting the coil conductor portion 20 include metals such as copper, copper alloys, aluminum, and aluminum alloys. The coil conductor portion 20 can be manufactured using a film-forming technique such as plating. The coil portion 10 has an insulating coil insulation portion (not shown in FIGS. 1 to 3 ) on the surface of the coil conductor portion 20. This coil insulation portion ensures insulation between adjacent conductors in the coil conductor portion 20 (between the surfaces of the conductors facing each other). The coil insulation portion is made of, for example, a resin material. No coil insulation portion is provided at the ends of the two ends (first lead portion 14, second lead portion 24) of the coil conductor portion 20, and the coil portion 10 can be electrically connected to other members (first external electrode 41, second external electrode 42) at these ends.

[0025] As shown in FIG. 2 , the coil conductor portion 20 includes a second coil conductor portion 202 having a second spiral conductor portion 21 arranged alongside the first spiral conductor portion 11 in the first direction (Z1-Z2 direction). The second spiral conductor portion 21 has a spiral shape around an axis O along the first direction (Z1-Z2 direction), with the spiral shape moving away from the axis O from an inner circumferential end portion 22, which is the inner circumferential end of the second spiral conductor portion 21, to an outer circumferential end portion 23, which is the outer circumferential end of the second spiral conductor portion 21. That is, the first direction is the winding axis direction of the second spiral conductor portion 21. In the second spiral conductor portion 21, the conductor is arranged in a spiral shape moving away from the axis O in the opposite direction to the first spiral conductor portion 11 (counterclockwise in FIG. 2 ) when viewed from the Z1 side in the Z1-Z2 direction.

[0026] The average value of the separation distance in the first direction (Z1-Z2 direction) between the first spiral conductor portion 11 and the second spiral conductor portion 21 is not particularly limited. The smaller this separation distance, the easier it is to reduce the height (dimension in the Z1-Z2 direction) of the coil component 100; however, if the separation distance is excessively small, the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21 is likely to deteriorate. From the viewpoint of achieving both a low profile (low height) of the coil component 100 and high insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21, it may be preferable that the separation distance be 0.4 μm or more and 20 μm or less. In order to reduce variation in the separation distance and more reliably support the coil in the same plane during manufacturing, the separation distance is more preferably 1.0 μm or more, and even more preferably 5.0 μm or more.

[0027] The inner peripheral end 12 of the first spiral conductor portion 11 and the inner peripheral end 22 of the second spiral conductor portion 21 are electrically connected by a via portion VP. Starting from the connection portion to the via portion VP, the first spiral conductor portion 11 and the second spiral conductor portion 21 spiral in opposite directions. The via portion VP may be made of the same conductor as the coil conductor portion 20. In a specific example, the via portion VP is manufactured during the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the via portion VP is integrated with the inner peripheral end 12 of the first spiral conductor portion 11 and the inner peripheral end 22 of the second spiral conductor portion 21.

[0028] A first lead portion 14 is connected to the outer peripheral end 13 of the first spiral conductor portion 11 as a part of the first coil conductor portion 201, and a second lead portion 24 is connected to the outer peripheral end 23 of the second spiral conductor portion 21 as a part of the second coil conductor portion 202. Therefore, the outer peripheral end 13 of the first spiral conductor portion 11 is essentially an interface with the first lead portion 14, and the outer peripheral end 23 of the second spiral conductor portion 21 is essentially an interface with the second lead portion 24. In a specific example, the first lead portion 14 and the second lead portion 24 are manufactured together in the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the first lead-out portion 14 has a portion that is seamlessly integrated with the outer peripheral end portion 13 of the first spiral conductor portion 11, and the second lead-out portion 24 has a portion that is seamlessly integrated with the outer peripheral end portion 23 of the second spiral conductor portion 21.

[0029] That is, in this embodiment, the coil conductor portion 20 has a first coil conductor portion 201 having a first spiral conductor portion 11 and a first draw-out portion 14, a second coil conductor portion 202 having a second spiral conductor portion 21 and a second draw-out portion 24, and a via portion VP, which are manufactured so as to have integrated parts (specifically, parts made of a first conductive material) using a common manufacturing process.

[0030] FIG. 4 is an XZ cross-sectional view taken along line A-A' in FIG. 2. In FIG. 2, line A-A' is a line passing through the center of the first coil conductor portion 201 in the Z1-Z2 and Y1-Y2 directions and extending along the X1-X2 direction; FIG. 4 is a cross-sectional view taken along the XZ plane including this line. As shown in FIG. 4, the turns of the first spiral conductor portion 11 and the turns of the second spiral conductor portion 21 are aligned in a first direction (Z1-Z2 direction). The first spiral conductor portion 11 has a first inner turn 111 located at the innermost periphery, a first outer turn 113 located at the outermost periphery, and a first central turn 112 located between them. The second spiral conductor portion 21 has a second inner turn 211 located at the innermost periphery, a second outer turn 213 located at the outermost periphery, and a second central turn 212 located between them.

[0031] The second inner turn 211 is located on the Z2 side in the Z1-Z2 direction of the first inner turn 111, the second outer turn 213 is located on the Z2 side in the Z1-Z2 direction of the first outer turn 113, and the second central turn 212 is located on the Z2 side in the Z1-Z2 direction of the first central turn 112. In the coil portion 10 shown in Fig. 2, the second lead-out portion 24 is not present on the Z2 side in the Z1-Z2 direction of the outer peripheral end portion 13 of the first spiral conductor portion 11, and the first lead-out portion 14 is not present on the Z1 side in the Z1-Z2 direction of the outer peripheral end portion 23 of the second spiral conductor portion 21.

[0032] (First Conductor Portion, Second Conductor Portion) As shown in Figure 4, the first spiral conductor portion 11 includes a first conductor portion 11A extending along the extension direction of the turns, i.e., from the inner peripheral end portion 12 to the outer peripheral end portion 13 of the first spiral conductor portion 11, and made of a first conductive material; and a second conductor portion 11B electrically connected to the first conductor portion 11A at a first interface IF1 along the first direction (Z1-Z2 direction) and made of a second conductive material. As will be described later, in one example, the first conductor portion 11A and the second conductor portion 11B are manufactured by different manufacturing processes. In this case, even if the materials are the same (e.g., materials containing Cu, such as Cu, Cu alloys, etc.), their morphological characteristics, such as crystal structure, crystal orientation, and crystal growth direction, are different, and therefore they can be distinguished by cross-sectional observation, for example. In a specific example, the first conductor portion 11A is made of an electroplating deposit (electrolytic plating deposit), and the second conductor portion 11B is made of a plating deposit. In this case, the plating deposit may be an electroplating deposit or an electroless plating deposit. From the viewpoint of reducing the thickness of the second conductor portion 11B, it is preferable that the plating deposit be an electroplating deposit.

[0033] A third conductor 11C as shown in FIG. 4 may be provided at the end of the first conductor 11A facing the second spiral conductor 21 in the first direction (Z1-Z2 direction) (the Z2 side in the Z1-Z2 direction). The material constituting the third conductor 11C is not limited. It may be the same as or different from the material constituting the first conductor 11A (e.g., a material containing Cu, such as Cu or a Cu alloy). From a manufacturing perspective (as a base film for electroplating), it may be preferable for the third conductor 11C to be composed of a material containing at least one of Ni and Cr. It may be preferable for the material constituting the first conductor 11A and the material constituting the third conductor 11C to have different etching characteristics. For example, if the first conductor 11A is composed of Cu and the third conductor 11C is composed of Ni, Ni can be etched with high selectivity depending on the etching conditions. The third conductor portion 11C may be in the form of a film, or may be made up of a laminated film of different materials.

[0034] As shown in Figure 4, the second spiral conductor 21, like the first spiral conductor 11, has a second conductor 21B that covers the laminate of the first conductor 21A and the third conductor 21C. The first conductor 21A is made of the same material as the first conductor 11A, the second conductor 21B is made of the same material as the second conductor 11B, and the third conductor 21C is made of the same material as the third conductor 11C. Therefore, the first conductors 11A and 21A have portions that extend in the extension direction of the turns of the coil conductor 20. The coil insulating portions (first insulating portion 90, second insulating portion 80) will be described later.

[0035] Fig. 5A is an XZ cross-sectional view illustrating the structure of a first spiral conductor portion included in a coil component according to one embodiment of the present invention, specifically showing a portion of the XZ cross-sectional view taken along line BB' in Fig. 3. Fig. 5B is an XZ cross-sectional view illustrating the structure of a first spiral conductor portion included in a coil component according to a conventional technique. For ease of comparison, Fig. 5B also shows the structure of the first spiral conductor portion according to this embodiment shown in Fig. 5A.

[0036] Although shown simply in Fig. 4, the turns of the coil conductor portion of the coil component 100 according to this embodiment have a detailed structure as shown in Fig. 5A. Fig. 5A is an XZ cross-sectional view taken along line BB' in Fig. 3, and shows three turns of the first spiral conductor portion 11, specifically the first inner turn 111, the first central turn 112, and the first outer turn 113, together with insulating portions (second insulating portion 80, first insulating portion 90) that contact these turns.

[0037] Taking the first inner circumference turn 111 as a specific example, when the first inner circumference turn 111 is cut in a plane (XZ plane) including a first direction (Z1-Z2 direction) and a second direction that is a direction intersecting the first direction (X1-X2 direction in FIG. 5A ), to obtain a first cross section, of the lines drawn by the outline of the first conductor portion 11A in the first cross section, two lines aligned in the second direction (X1-X2 direction) have a tapered region Rt on one side in the first direction, specifically on the Z1-Z2 direction Z1 side where the first insulating portion 90 is not provided, the tapered region Rt having a spacing that narrows as it approaches the tip, and a straight region Rs having approximately equal spacing on the other side in the first direction, specifically on the Z1-Z2 direction Z2 side where the first insulating portion 90 is provided. In the example shown in FIG. 5A, the tapered region Rt is located on the Z1-Z2 direction Z1 side of the imaginary line L1 along the X1-X2 direction, and the straight region Rs is located on the Z2-Z1-Z2 direction Z2 side. FIG. 5A also shows the thickness of the straight region (straight region thickness Ts), the thickness of the first conductor portion 11A (first conductor portion thickness T1), and the thickness of the turns (turn thickness T2). This also applies to subsequent figures (FIGS. 5B to 5E). Note that the first cross section is typically a plane that includes the axis O and is perpendicular to the XY plane. In the specific example shown in FIG. 5A, the first cross section is an XZ cross section taken along line B-B' in FIG. 3. While the imaginary line L1 is used as the boundary between the straight region Rs and the tapered region Rt in this specific example, this boundary need not be clear. In other words, the degree of taper may gradually increase from the straight region Rs to the tapered region Rt.

[0038] 5A shows the average inclination angle θa1 of the tapered region Rt with respect to the first direction (Z1-Z2 direction). In this specification, the average inclination angle refers to the angle of the reference line with respect to the Z1-Z2 direction at which the sum of the area of ​​the region surrounded by the target line segment and the reference line (for example, the end point on the Z2 side in the Z1-Z2 direction) is the smallest when the area of ​​the region on the inside of the first conductor portion 11A from the reference line is positive and the area of ​​the region on the outside of the first conductor portion 11A from the reference line is negative. Here, the average tilt angle is defined as positive when tilting toward the inside of the first conductor portion 11A, and negative when tilting toward the outside.

[0039] The turns of the coil conductor portion of the coil component 100 according to this embodiment have a straight region Rs in addition to a tapered region Rt, which increases the shape stability of the first conductor portions 11A, 21A, and as a result, the cross section of the turns can be more reliably realized as an ideal square shape.

[0040] Among the lines drawn by the contour of the turn (first inner turn 111) in the first cross section, two lines aligned in the second direction (X1-X2 direction) have approximately equal spacing in one of the first directions. From the perspective of approaching the ideal shape of the cross section of the turn, it is preferable that the spacing between the two lines be approximately equal. In FIG. 5A , the average inclination angle θa1 of the tapered region Rt is positive, but the average inclination angle θa2 of the two lines aligned in the second direction (X1-X2 direction) among the lines drawn by the contour of the first inner turn 111 in the first cross section is close to 0 degrees. In this way, since the lines drawn by the contour of the first inner turn 111 in the first cross section approach the ideal rectangular shape, the gap Gt on one side in the first direction (Z1 side in the Z1-Z2 direction) of adjacent turns and the gap Gb on one side in the first direction (Z2 side in the Z1-Z2 direction) are approximately equal, and both can be set small.

[0041] 5B , in a conventional turn in which the first conductor portion 11A does not have a tapered region Rt, the average inclination angle θx1 corresponding to the average inclination angle θa1 of the coil component 100 according to the present embodiment is approximately 0 degrees. In this case, among the lines drawn by the outer shape of the first inner turn 111 in the first cross section, two lines aligned in the second direction (X1-X2 direction) tend to have a negative average inclination angle θx2, forming a taper (inverse taper) that moves away from each other, depending on the method of forming the second conductor portion 11B. In a plating process in which the second conductor portion 11B is formed by placing a substrate opposite the third conductor portion 11C in the Z1-Z2 direction, the plating solution circulation efficiency differs between the side where the substrate is located (Z2 side in the Z1-Z2 direction) and the opposite side (Z1 side in the Z1-Z2 direction). This results in a higher plating deposition rate as the distance from the substrate increases, making the above-mentioned inverse taper particularly likely to be formed.

[0042] When an inverse taper is formed, the gap Gt between adjacent turns on one side in the first direction (the Z1 side in the Z1-Z2 direction) becomes smaller than the gap Gb on the other side in the first direction (the Z2 side in the Z1-Z2 direction), and the cross-sectional shape of the turn deviates from an ideal rectangular shape. Therefore, the cross-sectional area of ​​the turn becomes smaller, and the direct current resistance (DCR) becomes larger. Comparing FIGS. 5A and 5B , the length (width W2b) of the turn on the other side in the first direction (the Z2 side in the Z1-Z2 direction) of the coil component 100 according to the present embodiment is wider than the length (width W2b) of the turn on the other side in the first direction (the Z2 side in the Z1-Z2 direction) of the coil component according to the prior art.

[0043] In the coil component 100 according to the present embodiment, when the first conductive material constituting the first conductor portion 11A includes a crystalline metallic material and the crystal growth direction of the crystalline metallic material is along the first direction, it is easy to achieve the above-described shape control of the cross section of the turn based on the shape control of the first conductor portion 11A. If the first conductor portion 11A is formed so as to grow in the first direction using a film formation technique such as plating or sputtering, the first conductor portion 11A is likely to have such crystalline characteristics.

[0044] 5C to 5E are XZ cross-sectional views illustrating the structure of modified examples (parts 1 to 3) of the first spiral conductor portion included in the coil component according to one embodiment of the present invention. In the modified example (part 1) shown in FIG. 5C , among the lines drawn by the contour of the turn (first inner turn 111) in the first cross section, two lines aligned in the second direction (X1-X2 direction) are spaced apart more widely as they approach the tip on one side of the first direction (the Z1 side in the Z1-Z2 direction). Therefore, the average inclination angle θb1 of the tapered region Rt of the first conductor portion 11A in this example is a positive value, similar to the average inclination angle θa1 of the structure shown in FIG. 5A , but the average inclination angle θb2 in the region where the width of the contour of the turn in the second direction increases is a negative value. The cross section of the turn in this example is further from the ideal square shape than the cross section of the turn shown in Figure 5A, but is closer to the ideal square shape than the cross section of the turn shown in Figure 5B, and the gap between adjacent turns is also narrower, so the direct current resistance (DCR) of the coil component 100 is likely to be low.

[0045] In the turn of the second modified example shown in Figure 5D, the imaginary line L1, which is the boundary between the tapered region Rt and the straight region Rs, is positioned on the other side of the first direction (the Z2 side in the Z1-Z2 direction), which is different from the turn shown in Figure 5A. Therefore, the straight region thickness Ts is relatively thinner. On the other hand, other shape characteristics of the first conductor portion 11A, specifically, the first conductor portion thickness T1, the width W1t in the X1-X2 direction of the surface on the Z1-Z2 direction Z1 side, and the width W1b in the X1-X2 direction of the surface on the Z2-Z1-Z2 direction Z2 side are substantially equal. Therefore, the average inclination angle θc1 of the tapered region Rt of the first conductor portion 11A in this example is a positive value but is smaller than the average inclination angle θa1 of the tapered region Rt of the first conductor portion 11A shown in Figure 5A.

[0046] On the other hand, in the turn of the third modified example shown in Figure 5E, compared to the turn shown in Figure 5A, the position of the imaginary line L1, which is the boundary between the tapered region Rt and the straight region Rs, is located on one side of the first direction (the Z1 side in the Z1-Z2 direction), and therefore the straight region thickness Ts is relatively thick. On the other hand, other shape characteristics of the first conductor portion 11A, specifically, the first conductor portion thickness T1, the width W1t in the X1-X2 direction of the surface on the Z1-Z2 direction Z1 side, and the width W1b in the X1-X2 direction of the surface on the Z2-Z1-Z2 direction Z2 side are approximately equal. Therefore, the average inclination angle θd1 of the tapered region Rt of the first conductor portion 11A in this example is a positive value and is larger than the average inclination angle θa1 of the tapered region Rt of the first conductor portion 11A shown in Figure 5A.

[0047] In both the turn of the modified example (2) shown in FIG. 5D and the turn of the modified example (3) shown in FIG. 5E, by adjusting the conditions for forming the second conductor portion 11B, the average inclination angles θc2 and θd2 of the two lines aligned in the second direction (X1-X2 direction) among the lines drawn by the outline of the first inner turn 111 in the first cross section are set to approximately 0 degrees, as in the turn shown in FIG. 5A.

[0048] 6A is an XZ cross-sectional view illustrating the structure of a turn of a first spiral conductor portion included in a coil component according to an embodiment of the present invention. As shown in FIG. 6A, when a first cross section is obtained by cutting a turn (first inner turn 111) along a plane including a first direction (Z1-Z2 direction) and a second direction (X1-X2 direction), two lines aligned in the second direction (X1-X2 direction) among lines drawn by the outline of the first conductor portion 11A on the first cross section are equally divided in the first direction (Z1-Z2 direction) to form a first region R The first and second regions R1 and R2 are defined as the first and second regions R1 and R2, respectively. Among the lines drawn by the outer shape of the turn (first inner turn 111) in the first cross section, two lines aligned in the second direction (X1-X2 direction) are equally divided in half in the first direction (Z1-Z2 direction). These regions are defined as a third region R3 and a fourth region R4 from one end side (the Z1 side in the Z1-Z2 direction). The average inclination angle of each region relative to the first direction is positive when the two lines approach each other. Based on the above definitions, the shape of the turns of the coil component 100 according to this embodiment can be explained from another perspective: the average inclination angle θ1 of the first region R1 is greater than both the average inclination angle θ2 of the second region R2 and the average inclination angle θ3 of the third region R3. In FIG. 6A , the average inclination angles θ2 to θ4 are all approximately 0 degrees. When the average inclination angles θ1 to θ3 satisfy θ1 > θ2 and θ1 > θ3, the cross section of the turn tends to have an ideal square shape, and the coil component 100 according to this embodiment, which has turns with such shape characteristics, can easily reduce the direct current resistance (DCR).

[0049] FIG. 6B is an XZ cross-sectional view illustrating the structure of a turn in a fourth modified example of the first spiral conductor included in a coil component according to an embodiment of the present invention. In comparison with the turn shown in FIG. 6A , the turn according to this example has the second conductor portion 11B wrapping around to the end on the other side in the first direction (the Z2 side in the Z1-Z2 direction) relative to the third conductor portion 11C. The turn having the structure of the fourth modified example shown in FIG. 6B can be manufactured by modifying some steps in the manufacturing method for the coil component 100 having the turn shown in FIG. 6A . While the turn shown in FIG. 6A can be obtained by forming the first conductor portion 11A on the sheet substrate 91 (see FIG. 10 ) and then forming the second conductor portion 11B while leaving the sheet substrate 91 in place, the turn according to this example can be obtained by forming the first conductor portion 11A on the sheet substrate 91, removing the sheet substrate 91, and then forming the second conductor portion 11B. In this example, the third region R3 and the fourth region R4 are defined to include the second conductor portion 11B located at the end on the other side in the first direction (the Z2 side in the Z1-Z2 direction).

[0050] Fig. 7A is an XZ cross-sectional view illustrating the structure of a turn in a first spiral conductor portion included in a coil component according to an embodiment of the present invention. The turn structure shown in Fig. 7A is the same as the turn structure shown in Fig. 6A, but the viewpoint of evaluating the shape features is different. In Fig. 6A, the first conductor portion 11A was divided into two in the first direction (Z1-Z2 direction) to evaluate the shape features, but in Fig. 7A, attention is focused on the lengths in the second direction (X1-X2 direction) of the two faces of the first conductor portion 11A facing the first direction (Z1-Z2 direction). Specifically, of the two surfaces of the first conductor portion 11A facing the first direction (Z1-Z2 direction), the one having a longer length in the second direction (X1-X2 direction) (specifically, the Z2 side in the Z1-Z2 direction) is designated as the first bottom surface 11Ab, and the other (specifically, the Z1 side in the Z1-Z2 direction) is designated as the first top surface 11At. The length in the second direction of the first bottom surface 11Ab is designated as width W1b, the length in the second direction of the first top surface 11At is designated as width W1t, the length in the second direction of the turn (first inner turn 111) at the position of the first bottom surface 11Ab is designated as width W2b, and the length in the second direction of the surface of the turn (first inner turn 111) facing the first direction that is closer to the first top surface 11At (designated as 111t in FIG. 7A) is designated as width W2t. In this case, the turns of the coil device 100 according to this embodiment satisfy the following formula (1) and formula (2): W1b>W1t (1) (W1t / W1b) / (W2t / W2b)<0.93 (2)

[0051] By satisfying the above formula (1) and formula (2), it becomes easier to realize an ideal rectangular cross section of the turn. The left side of formula (2) is preferably 0.86 or less, more preferably 0.8 or less, even more preferably 0.75 or less, and particularly preferably 0.71 or less.

[0052] The results of calculating the direct current resistance (DCR) for coil components having turns with the structures shown in Figures 5A to 5E are shown below. For each structure, in addition to the above definitions, the height of the first conductor portion 11A in the first direction is defined as T1, the height of the turn in the first direction relative to the first bottom surface 11Ab is defined as T2, and the height of the straight region Rs in the first direction is defined as Ts. The arrangement pitch between adjacent turns is also defined as Wp.

[0053] The dimensional information and calculation results of the DC resistance (DCR) of the structures according to each figure are shown in Table 1 below. The "Improvement Rate" in Table 1 indicates the rate of reduction in DC resistance (DCR) based on the DC resistance (DCR) of the structure of FIG. 5B according to the comparative example. For example, the DCR of the structure of FIG. 5A according to Example 1 is 26.6 mΩ, and the DC resistance (DCR) of the structure of FIG. 5B according to the comparative example is 28.0 mΩ, so the improvement rate is (28.0-26.6) / 28.0×100, or 5%.

[0054]

[0055] As shown in Table 1, the direct current resistance (DCR) of the structure according to the example was lower than that of the structure according to the comparative example, and the improvement rate was 3% to 5%.

[0056] 7B is an XZ cross-sectional view illustrating the structure of a turn in a fourth modification of the first spiral conductor included in a coil component according to an embodiment of the present invention. In comparison with the turn shown in FIG. 7A , the turn in this example has the second conductor portion 11B extending around the end on the other side in the first direction (the Z2 side in the Z1-Z2 direction) of the third conductor portion 11C. Even in this case, the width W2b is defined as the length in the second direction of the turn (first inner turn 111) at the position of the first bottom surface 11Ab. In the present example, when the second conductor portion 11B wraps around to the end portion on the other side in the first direction (the Z2 side in the Z1-Z2 direction) of the third conductor portion 11C, the surface of the end portion on the other side in the first direction (the Z2 side in the Z1-Z2 direction) of the wrapped-around second conductor portion 11B is continuously connected to the surface of the second conductor portion 11B facing the second direction (the X1-X2 direction), and as a result, the width of that surface in the second direction (the X1-X2 direction) tends to be narrower. Even with this tendency, the position for defining the width W2b is set away from the end portion on the other side in the first direction (the Z2 side in the Z1-Z2 direction) so that the shape characteristics of the cross section of the turn can be appropriately defined.

[0057] (First Insulating Portion) FIG. 8 is a partially enlarged view of FIG. 4 , showing an enlarged area surrounded by a dashed line in FIG. 4 . FIG. 9 is a partially enlarged view of FIG. 8 , showing an enlarged area circled by a dashed line in FIG. 8 . As shown in FIG. 9 , the coil insulating portion includes a first insulating portion 90 that contacts one of the ends of the first spiral conductor portion 11 on the first direction side, specifically, at least a part of the end on the side facing the second spiral conductor portion 21 (the Z2 side in the Z1-Z2 direction). The first insulating portion 90 shown in FIG. 9 contacts one of the ends of the second spiral conductor portion 21 on the first direction side, specifically, at least a part of the end on the side facing the first spiral conductor portion 11 (the Z1 side in the Z1-Z2 direction) on the side (the Z2 side in the Z1-Z2 direction) opposite to the side contacting the first spiral conductor portion 11 (the Z1 side in the Z1-Z2 direction). That is, the first insulating portion 90 is interposed between the first spiral conductor portion 11 and the second spiral conductor portion 21 arranged in the first direction and is in contact with both of them.

[0058] In this way, the first insulating portion 90 contacts the first spiral conductor portion 11, thereby reliably insulating the first spiral conductor portion 11. Furthermore, as shown in Fig. 9, the first insulating portion 90 contacts both the first spiral conductor portion 11 and the second spiral conductor portion 21, thereby reliably preventing a short circuit between the first spiral conductor portion 11 and the second spiral conductor portion 21.

[0059] The material constituting the first insulating portion 90 is not limited as long as it has appropriate insulating properties. The first insulating portion 90 has a volume resistivity of 1.0×10 14 In some cases, it is preferable that the volume resistivity is 1.0×10 Ωcm or more. 15 More preferably, it is 1.0×10 Ωcm or more. 16 The upper limit of the volume resistivity is not particularly limited. 20 The dielectric constant may be Ωcm or less. Furthermore, it is preferable that the first insulating portion 90 has excellent dielectric properties. Specifically, it may be preferable that the dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. This dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The upper limit of this dielectric constant is not particularly limited. The dielectric constant may be 1.0 or more. The method for measuring the volume resistivity and dielectric constant of the first insulating portion 90 is not limited as long as results equivalent to those obtained by ASTM D257 and D150 are expected. For example, a measurement sample is separately prepared by preparing a material corresponding to the first insulating portion 90 to the dimensions required for measurement, and this measurement sample is used to identify the constituent materials through analytical techniques such as component analysis and FT-IR, and the characteristics of the material, such as volume resistivity, are evaluated.

[0060] The material constituting the first insulating portion 90 may be an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. When the first insulating portion 90 is made of a composite material, the inorganic material may be in the form of particles dispersed in a matrix of an organic material. Specific examples of organic materials include polyimide resin, polyethylene resin, polypropylene resin, polyamide resin, polyester resin, polyamideimide resin, polysulfone resin, polycarbonate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, and polytetrafluoroethylene resin. Specific examples of inorganic materials, particularly inorganic materials in composite materials, include inorganic materials such as oxides, carbides, nitrides, and inorganic salts. Examples of oxides include silica, alumina, and zirconia. Examples of carbides and nitrides include inorganic materials such as silicon carbide and boron nitride, respectively. Examples of inorganic salts include minerals such as wollastonite, kaolin, and mica. Of these, oxide-based materials such as oxides, silicates, and phosphates are preferred in terms of cost and insulating properties. For example, the inorganic material preferably contains at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

[0061] 8, the first insulating portion 90 exists independently in three parts: a first insulating portion 901 located between the first inner periphery turn 111 and the second inner periphery turn 211, a first insulating portion 902 located between the first central turn 112 and the second central turn 212, and a first insulating portion 903 located between the first outer periphery turn 113 and the second outer periphery turn 213. The X1-X2 direction end of each of the first insulating portions 901, 902, and 903 is located further back than the X1-X2 direction end of the turn it contacts, and there are parts at the ends of the turns that are not in contact with the first insulating portion 90.

[0062] Specifically, the end of the first insulating portion 901 on the X1 side in the X1-X2 direction is located further back (toward the X2 side in the X1-X2 direction) than the end of the first inner turn 111 on the X1 side in the X1-X2 direction. Therefore, a portion of the first inner turn 111 facing the second inner turn 211 (first facing portion 11F) has a portion that is not in contact with the first insulating portion 901 (non-contact portion EP). Based on this non-contact portion EP, as shown in FIG. 9 , the envelope of the inner edge of the first insulating portion 90 that contacts the turn that forms the inner edge of the first spiral conductor portion 11, i.e., the innermost first inner turn 111, encompasses the inner edge of the first spiral conductor portion 11, as viewed in the first direction (Z1-Z2 direction). Similarly, in the portion of the second inner turn 211 facing the first inner turn 111 (second facing portion 21F), a non-contact portion EP exists on the X1 side in the X1-X2 direction, and the envelope of the inner edge of the first insulating portion 90 that contacts the second inner turn 211 located on the innermost periphery incorporates the inner edge of the second spiral conductor portion 21.

[0063] Furthermore, since the first insulating portion 902 is independent of the adjacent first insulating portions 901, 903 in the XZ cross section, the portion of the first central turn 112 facing the second central turn 212 (first facing portion 11F) has non-contact portions EP at both ends in the X1-X2 direction, and the portion of the second central turn 212 facing the first central turn 112 (second facing portion 21F) has non-contact portions EP at both ends in the X1-X2 direction. Furthermore, since the first insulating portion 903 exists independently from the first insulating portion 902 in the XZ cross section, a non-contact portion EP exists at both ends in the X1-X2 direction in a portion of the first outer periphery turn 113 facing the second outer periphery turn 213 (first facing portion 11F), and a non-contact portion EP exists at both ends in the X1-X2 direction in a portion of the second outer periphery turn 213 facing the first outer periphery turn 113 (second facing portion 21F). The first insulating portion 90 does not contact the end (first extension portion 14P) of the first lead-out portion 14 on the X2 side in the X1-X2 direction either, and a non-contact portion EP is formed.

[0064] (Second insulating portion) The coil insulating portion has a second insulating portion 80, and as shown in Figure 4, the second insulating portion 80 is provided on at least a portion of the surface of the first coil conductor portion 201 and the surface of the second coil conductor portion 202.

[0065] In this embodiment, the second insulating portion 80 is thermoplastic and contains a thermoplastic resin including a paraxylylene-based polymer. Other examples of the thermoplastic resin include polyethylene, polypropylene, polyamide, polyester, polyamideimide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, and polytetrafluoroethylene. The second insulating portion 80 as a whole is only required to have thermoplastic properties, and may contain, in addition to the above-mentioned thermoplastic resin, for example, inorganic insulating particles.

[0066] The second insulating portion 80 preferably has excellent insulating properties, specifically, a volume resistivity of 1.0×10 obtained by ASTM D257. 14 In some cases, it is preferable that the volume resistivity is 1.0×10 Ωcm or more. 15 More preferably, it is 1.0×10 Ωcm or more. 16 The upper limit of the volume resistivity is not particularly limited. 20 The dielectric constant may be Ωcm or less. Furthermore, it is preferable that the second insulating portion 80 has excellent dielectric properties. Specifically, it may be preferable that the dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. This dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The upper limit of this dielectric constant is not particularly limited. The dielectric constant may be 1.0 or more. To measure the volume resistivity and dielectric constant, a separately prepared material corresponding to the second insulating portion 80 is adjusted to the dimensions required for measurement and used. The material corresponding to the second insulating portion 80 can be identified, as in the case of the first insulating portion 90, through analytical techniques such as component analysis and FT-IR.

[0067] The second insulating portion 80 has a portion that contacts a portion of the first spiral conductor portion 11 opposite to the side facing the second spiral conductor portion 21, i.e., a portion (first opposite-direction portion 11FA) of the first spiral conductor portion 11 that is opposite to the second spiral conductor portion 21. In Fig. 8, the first inner circumferential turn 111, the first central turn 112, and the first outer circumferential turn 113, as well as the end portion Z1 of the first lead-out portion 14 connected to the first outer circumferential turn 113 on the Z1-Z2 direction Z1 side, constitute the first opposite-direction portion 11FA, and the second insulating portion 80 is provided on this first opposite-direction portion 11FA.

[0068] The second insulating portion 80 has a portion that contacts an opposite-direction portion (second opposite-direction portion 21FA) of the second spiral conductor portion 21 relative to the first spiral conductor portion 11. In Fig. 8, the ends of the second inner turn 211, the second central turn 212, and the second outer turn 213 on the Z2 side in the Z1-Z2 direction are the second opposite-direction portion 21FA, and the second insulating portion 80 has a portion that contacts this second opposite-direction portion 21FA.

[0069] The second insulating portion 80 has a portion that contacts a side portion of the first spiral conductor portion 11 along the spiral direction. Specifically, the side portion is explained using the first inner circumferential turn 111. The first inner circumferential turn 111 has a side portion facing the inner circumferential side (the X1 side in the X1-X2 direction) and a side portion facing the outer circumferential side (the X2 side in the X1-X2 direction) and facing the first central turn 112. The second insulating portion 80 has a portion that contacts these side portions. As shown in FIG. 4 , the second insulating portion 80 is not provided on the side portion (first lead portion end surface 14E) on the outer circumferential side (the X2 side in the X1-X2 direction) of the outer circumferential end portion 13 of the first spiral conductor portion 11 so that the outer circumferential side (the X2 side in the X1-X2 direction) can be electrically connected to another member (the first external electrode 41).

[0070] The second insulating portion 80 has a portion that contacts a side portion of the second spiral conductor portion 21 along the spiral direction. Specifically, the side portion is explained using the second inner circumferential turn 211. The second inner circumferential turn 211 has a side portion facing the inner circumferential side (the X1 side in the X1-X2 direction) and a side portion facing the outer circumferential side (the X2 side in the X1-X2 direction) and facing the second central turn 212. The second insulating portion 80 has a portion that contacts these side portions. As shown in FIG. 4 , the second insulating portion 80 is not provided on the side portion (the second lead portion end surface 24E) on the outer circumferential side (the X1 side in the X1-X2 direction) of the outer circumferential end portion 23 of the second spiral conductor portion 21 so that the second spiral conductor portion 21 can be electrically connected to another member (the second external electrode 42).

[0071] From the viewpoint of stably realizing the provision of the second insulating portion 80 on the side portion, it may be preferable that the average width of the gap between two turns aligned in a direction (XY in-plane direction) intersecting the first direction (Z1-Z2 direction) be 0.025 to 0.25 times the average width of the two turns aligned in the alignment direction.

[0072] In order to ensure good insulation properties of the second insulating portion 80, it is preferable that the average values ​​of the thickness of the portion of the second insulating portion 80 that contacts the first opposite-facing portion 11FA (the portion of the first spiral conductor portion 11 that faces the second spiral conductor portion 21), the thickness of the portion that contacts the second opposite-facing portion 21FA (the portion of the second spiral conductor portion 21 that faces the first spiral conductor portion 11), the thickness of the portion that contacts the side portion of the first spiral conductor portion 11, and the thickness of the portion that contacts the side portion of the second spiral conductor portion 21 are 0.2 μm or more and 10 μm or less. From the viewpoint of ensuring insulation properties more stably, this average value is more preferably 1.0 μm or more.

[0073] The second insulating portion 80 has a portion in contact with the portion of the first spiral conductor portion 11 facing the second spiral conductor portion 21 (first facing portion 11F), and a portion in contact with the portion of the second spiral conductor portion 21 facing the first spiral conductor portion 11 (second facing portion 21F). As described above, the first facing portion 11F and the second facing portion 21F have non-contact portions EP that do not contact the first insulating portion 90, and the first facing portion 11F and the second facing portion 21F contact the second insulating portion 80 at these non-contact portions EP.

[0074] The second insulating portion 80 has a first connecting portion 801 located so as to connect a portion contacting a side of at least one of the turns of the first spiral conductor portion 11 (in this embodiment, the first inner circumferential turn 111, the first central turn 112, and the first outer circumferential turn 113) to a portion contacting a side of the second turn of the second spiral conductor portion 21 that is closest to the side of the first turn. The presence of the first connecting portion 801 facilitates improving the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21. From the viewpoint of stably forming the first connecting portion 801, it may be preferable that the average value of the separation distance in the first direction (Z1-Z2 direction) between the first spiral conductor portion 11 and the second spiral conductor portion 21 be 0.4 μm or more and 20 μm or less.

[0075] Taking the case where the first turn is the first inner periphery turn 111 as a specific example, the second turn that is closest from the side of the first turn (first inner periphery turn 111) in the first spiral conductor part 11 is the second inner periphery turn 211. The second insulating part 80 that contacts the side of the first inner periphery turn 111 on the inner periphery side (X1 side in the X1-X2 direction) also contacts a non-contact part EP that is located at the end of the first opposing part 11F on the inner periphery side (X1 side in the X1-X2 direction) and is a part where the first insulating part 90 does not contact the first opposing part 11F. On the other hand, the second insulating portion 80 in contact with the side portion on the inner periphery (X1 side in the X1-X2 direction) of the second inner turn 211 also contacts a non-contact portion EP located at the end of the inner periphery (X1 side in the X1-X2 direction) of the second opposing portion 21F, where the first insulating portion 90 does not contact the second opposing portion 21F. The second insulating portion 80 located so as to connect the second insulating portion 80 in contact with the inner periphery (X1 side in the X1-X2 direction) of the first inner turn 111 and the second insulating portion 80 in contact with the inner periphery (X1 side in the X1-X2 direction) of the second inner turn 211 constitutes a first connecting portion 801.

[0076] 8 further includes a first connecting portion 801 connecting the second insulating portion 80 in contact with the outer circumferential side (X2 side in the X1-X2 direction) of the first inner turn 111 and the first opposing portion 11F to the second insulating portion 80 in contact with the outer circumferential side (X2 side in the X1-X2 direction) of the second inner turn 211 and the second opposing portion 21F; a first connecting portion 801 connecting the second insulating portion 80 in contact with the inner circumferential side (X1 side in the X1-X2 direction) of the first central turn 112 and the first opposing portion 11F to the second insulating portion 80 in contact with the inner circumferential side (X1 side in the X1-X2 direction) of the second central turn 212 and the second opposing portion 21F; The figure shows a first connecting portion 801 connecting the second insulating portion 80 in contact with the side portion on the outer periphery (X2 side in the X1-X2 direction) of the first central turn 112 and the first opposing portion 11F to the second insulating portion 80 in contact with the side portion on the outer periphery (X2 side in the X1-X2 direction) of the second central turn 212 and the second opposing portion 21F, and a first connecting portion 801 connecting the second insulating portion 80 in contact with the side portion on the inner periphery (X1 side in the X1-X2 direction) of the first outer periphery turn 113 and the first opposing portion 11F to the second insulating portion 80 in contact with the side portion on the inner periphery (X1 side in the X1-X2 direction) of the second outer periphery turn 213 and the second opposing portion 21F.

[0077] In this way, by having the first connection portion 801, it is possible to reduce the volume of the coil insulation portion, making it easier to improve the electrical characteristics of the coil component 100 and meet the demand for miniaturization of the coil component 100.

[0078] The second insulating portion 80 in contact with the side portion of the outer periphery (X2 side in the X1-X2 direction) of the second outer periphery turn 213 has a second connecting portion 802 that connects the second insulating portion 80 that is in contact with the first extending portion 14P, which is a portion of the first lead-out portion 14 on the Z2 side in the Z1-Z2 direction and extends from the first opposing portion 11F of the first outer periphery turn 113, to the side portion of the outer periphery (X2 side in the X1-X2 direction) of the second outer periphery turn 213 and the second opposing portion 21F. The second connecting portion 802 is also provided between the second insulating portion 80 that is in contact with the side portion of the outer periphery (X1 side in the X1-X2 direction) of the first outer periphery turn 113 and the second insulating portion 80 that is in contact with the portion of the second lead-out portion 24 on the Z1 side in the Z1-Z2 direction.

[0079] The second insulating portion 80 shown in FIG. 8 contacts a portion of the coil conductor portion 20 located inside the main body portion 30. Specifically, the second insulating portion 80 is provided so as to contact a portion of the coil conductor portion 20 other than the end portion (first lead-out end surface 14E) on the outer side (X2 side in the X1-X2 direction) of the first lead-out portion 14 and the end portion (second lead-out end surface 24E, not shown in FIG. 8) on the outer side (X1 side in the X1-X2 direction) of the second lead-out portion 24. This reliably prevents the coil conductor portion 20 from coming into contact with the magnetic powder, resulting in an unexpected short circuit within the coil conductor portion 20, even if the surface of the magnetic powder contained in the main body portion 30 is conductive. As will be described later, a first external electrode 41 is provided so as to be in electrical contact with the first lead-out end surface 14E, and a second external electrode 42 is provided so as to be in electrical contact with the second lead-out end surface 24E.

[0080] From the viewpoint of more reliably preventing short circuits within the coil conductor 20, it is preferable that the second insulating portion 80 in contact with the first spiral conductor 11 be such that the portion in contact with the portion facing the second spiral conductor 21 (first facing portion 11F), the portion in contact with the opposite portion relative to the second spiral conductor 21 (first opposite-facing portion 11FA), and the portion in contact with the side surface are in continuous contact with the turn without any connection boundary for all turns of the first spiral conductor 11. Similarly, it is preferable that the second insulating portion 80 in contact with the second spiral conductor 21 be such that the portion in contact with the portion facing the first spiral conductor 11 (second facing portion 21F), the portion in contact with the opposite portion relative to the first spiral conductor 11 (second opposite-facing portion 21FA), and the portion in contact with the side surface are in continuous contact with the turn without any connection boundary for all turns of the second spiral conductor 21.

[0081] (Main body portion) The main body portion 30 contains magnetic powder and contains a portion of the coil portion 10. In this embodiment, the main body portion 30 has a substantially rectangular parallelepiped shape and contains the portions of the coil portion 10 other than the outermost end face (X2 side in the X1-X2 direction) of the first lead portion 14 and the outermost end face (X1 side in the X1-X2 direction) of the second lead portion 24, which are located at the ends of the coil portion 10.

[0082] The structure of the magnetic powder is not limited. This structure may include a crystalline phase or an amorphous phase. Here, a crystalline material is defined as a material consisting of a crystalline phase, an amorphous material as a material consisting of an amorphous phase, and a composite material as a material consisting of a crystalline phase and an amorphous material. If the diffraction spectrum obtained by a general X-ray diffraction method includes a sharp diffraction peak that can identify the type of crystalline phase, the material contains a crystalline phase. Also, if the diffraction spectrum obtained by a general X-ray diffraction method includes a broad peak indicating an amorphous phase, the material contains an amorphous phase. If the DSC curve obtained by differential thermal analysis includes a peak indicating crystallization, i.e., heat generation associated with a phase change from an amorphous phase to a crystalline phase, the material also contains an amorphous phase.

[0083] The material system of the magnetic powder is not limited. Specific examples of crystalline materials include Fe—Si—Cr alloys, Fe—Ni alloys, Fe—Co alloys, Fe—V alloys, Fe—Al alloys, Fe—Si alloys, Fe—Si—Al alloys, pure iron, and ferrite. Carbonyl iron powder is preferred as pure iron powder. Specific examples of amorphous materials include Fe—Si—B alloys, Fe—P—C alloys, and Co—Fe—Si—B alloys. Specific examples of composite materials include Fe—Zr alloys, Fe—Zr—B alloys, Fe—Si—B—Nb—Cu alloys, and Fe—Si—B—P—Cu alloys. When the magnetic powder is a metal powder containing Fe, the synergistic effect of improving magnetic properties is particularly large.

[0084] The chemical composition of the magnetic powder is not limited. For example, an Fe—Si—Cr alloy may be composed of 1.0 to 10.0 mass% Si, 1.0 to 10.0 mass% Cr, and the balance consisting of Fe and impurities. Also, for example, an Fe—Ni alloy may be composed of 1.0 to 99.0 mass% Ni, and the balance consisting of Fe and impurities. Furthermore, for example, an Fe—P—C alloy may be composed of 1.0 to 13.0 atomic% P, 1.0 to 13.0 atomic% C, Fe, and impurities. This Fe—P—C alloy may contain one or more optional elements selected from the group consisting of Ni, Sn, Cr, B, and Si. In this case, for example, the amount of Ni may be 0 to 10.0 atomic %, the amount of Sn may be 0 to 3.0 atomic %, the amount of Cr may be 0 to 6.0 atomic %, the amount of B may be 0 to 9.0 atomic %, and the amount of Si may be 0 to 7.0 atomic %. The amount of Fe is preferably 65 atomic % or more. Furthermore, for example, the Fe-Si-B-Nb-Cu alloy may be composed of 1.0 to 16.0 atomic % Si, 1.0 to 15.0 atomic % B, 0.50 to 5.0 atomic % Nb, 0.50 to 5.0 atomic % Cu, and the balance consisting of Fe and impurities. In this case, the amount of Fe is preferably 65 atomic % or more.

[0085] The shape of the magnetic powder is not limited. The magnetic powder may be spherical, elliptical, scaly, or irregularly shaped. The manufacturing method for obtaining these shapes is also not limited.

[0086] The particle size distribution of the magnetic powder is not limited. The particle size distribution of the magnetic powder can be obtained, for example, by analyzing an image (secondary electron image) obtained by capturing an image of a cut surface of the main body 30 using a scanning electron microscope. For example, the average equivalent circle diameter of the magnetic powder may be 0.50 to 50.0 μm. The distribution of equivalent circle diameters may include multiple peaks.

[0087] The magnetic powder may be subjected to a surface insulating treatment. When the magnetic powder is subjected to a surface insulating treatment, the insulation resistance of the main body 30 is improved. The type of surface insulating treatment to be applied to the magnetic powder is not limited. Examples include phosphate treatment, phosphate salt treatment, and oxidation treatment. The magnetic powder may have an insulating coating on the surface of the magnetic particles. This insulating coating may contain at least one element selected from the group consisting of Si, P, and B, and O (oxygen).

[0088] The magnetic powder may be a mixture of a plurality of powder materials. The magnetic powder is preferably a ferromagnetic material, and more preferably a soft magnetic material.

[0089] The main body 30 may further contain an optional auxiliary material. The optional auxiliary material may be, for example, a binder material or a modifier. The binder material binds together particles of the magnetic powder and the like contained in the main body 30. This binder material is preferably an insulating material to impart insulation resistance to the main body 30.

[0090] The binder material may be an organic material or an inorganic material. The organic material may be a resin material. Examples of the resin material include acrylic resin, silicone resin, epoxy resin, phenol resin, urea resin, melamine resin, and polyester resin. The inorganic material may be a glass-based material such as water glass. The binder material may be a product of a reaction such as thermal decomposition, or may be a mixture of multiple materials.

[0091] The modifier improves the flowability of the powder, adjusts the hardening speed of the binder material, etc. The modifier may be a glass-based material.

[0092] There are no limitations on the dimensions of the main body 30. For example, the maximum dimension of the main body 30 may be 3.2 mm or less.

[0093] 2, the outermost end face (first lead-out portion end face 14E) of the first lead-out portion 14 (on the X2 side in the X1-X2 direction) and the outermost end face (second lead-out portion end face 24E) of the second lead-out portion 24 (on the X1 side in the X1-X2 direction), which are located at the ends of the coil portion 10, are exposed from the main body portion 30 at side faces of the main body portion 30 aligned in the X1-X2 direction. A first external electrode 41, which is one of a pair of external electrodes, is provided so as to be in electrical contact with the first lead-out portion end face 14E, and a second external electrode 42, which is the other of the pair of external electrodes, is provided so as to be in electrical contact with the second lead-out portion end face 24E.

[0094] 1, the first external electrode 41 has a side surface portion 41a covering the side surface of the main body 30 on the X2 side in the X1-X2 direction, and a bottom surface portion 41b provided so as to cover a portion of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30. The bottom surface portion 41b faces the substrate during use. The second external electrode 42 has a side surface portion 42a covering the side surface of the main body 30 on the X1 side in the X1-X2 direction, and a bottom surface portion 42b provided on the bottom surface of the main body 30 so as to cover a portion of the bottom surface while being spaced apart from the bottom surface portion 41b. The bottom surface portion 42b also faces the substrate during use.

[0095] The positions of the first external electrode 41 and the second external electrode 42 are not limited to the above positions. The first external electrode 41 and the second external electrode 42 may be formed so as to cover a portion of the top surface (the surface on the Z1 side in the Z1-Z2 direction) of the main body 30. Alternatively, the first external electrode 41 and the second external electrode 42 may be provided on only a portion of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30. In this case, the coil conductor 20 may have connection conductors (not shown) that connect the two ends of the coil 10 (the first lead-out end surface 14E and the second lead-out end surface 24E) to the bottom surface of the main body 30 through the inside of the main body 30. In this case, the two ends of the coil 10 (the first lead-out end surface 14E and the second lead-out end surface 24E) may not be exposed to the side surfaces of the main body 30, and the connection conductors may be exposed to the bottom surface of the main body 30.

[0096] The materials and configurations of the first external electrode 41 and the second external electrode 42 are not limited as long as they have appropriate conductivity. One non-limiting example of the first external electrode 41 and the second external electrode 42 is a layer having a Cu-plated / Ni-plated / Sn-plated structure from the side proximal to the surface of the main body 30. The first external electrode 41 and the second external electrode 42 may be formed as a coated electrode in which a conductive material such as silver is dispersed in a resin or the like. Alternatively, the first external electrode 41 and the second external electrode 42 may be a combination of a plated electrode and a coated electrode.

[0097] 1, insulating exterior coatings 50, 60 are provided on the top surface (the surface on the Z1 side in the Z1-Z2 direction) of the main body 30 and on the side surfaces aligned in the Y1-Y2 direction. An insulating exterior coating may also be provided on the bottom surface of the main body 30 in areas where the bottom surface portions 41b, 42b of the external electrodes are not provided. Furthermore, the coil device 100 may not be provided with the exterior coatings 50, 60. The exterior coatings 50, 60 can be formed at any position on the surface of the main body 30 depending on the purpose.

[0098] (Manufacturing Method) The manufacturing method of the coil component according to the present embodiment is not particularly limited. One non-limiting example of the manufacturing method is a manufacturing method that includes forming the first conductor portions 11A, 21A, 14A, and 24A by electroplating (electrolytic plating), as follows.

[0099] 10 to 14 are explanatory diagrams (Nos. 1 to 5) of an example of a method for manufacturing a coil component according to an embodiment of the present invention.

[0100] (a) Preparation of Sheet Base Material First, as shown in Figure 10(a), a sheet base material 91 is prepared, having base material through-holes 91H provided at positions corresponding to the via portions VP. There are no material restrictions on the sheet base material 91, as long as it has the mechanical properties necessary to function as a support when forming the first spiral conductor portion 11 and the second spiral conductor portion 21. It may be preferable for the sheet base material 91 to have appropriate insulating properties required as a raw material for the first insulating portion 90, and it is preferable for at least a portion of the sheet base material 91 to have appropriate removal properties when performing a removal process for the sheet base material 91, as described below.

[0101] The thickness of the sheet substrate 91 is set so that it functions appropriately as a support when forming the first spiral conductor portion 11 and the second spiral conductor portion 21, and, if necessary, taking into consideration the insulating properties of the first insulating portion 90 derived from the sheet substrate 91 and the removal characteristics of the sheet substrate 91. Non-limiting examples include a thickness of 0.4 μm or more and 20 μm or less. The thickness of the sheet substrate 91 may be 1.0 μm or more, or 5.0 μm or more. Furthermore, to further reduce the size of the coil component 100, the thickness of the sheet substrate 91 may be 14.0 μm or less.

[0102] Examples of materials constituting the sheet substrate 91 include organic materials, inorganic materials, and composite materials thereof. Specific examples of organic materials include thermoplastic resins such as polyimide resin and polyethylene resin, thermosetting resins such as epoxy resin and phenolic resin, and cellulose. Specific examples of inorganic materials include oxide-based materials such as glass and alumina, metal-based materials such as aluminum and magnesium, and inorganic salt-based materials such as calcium carbonate. Specific examples of composite materials include a structure in which inorganic powder is dispersed in an organic material matrix.

[0103] (b) Formation of conductive layer Next, the prepared sheet base material 91 is positioned so that the normal to its main surface faces in a first direction (Z1-Z2 direction), and a pattern 11CP of a third conductor portion 11C corresponding to the first conductor portion 11A is formed on one side of the main surface (the surface on the Z1 side in the Z1-Z2 direction), and a pattern 21CP of a third conductor portion 21C corresponding to the first conductor portion 21A is formed on the other side of the main surface of the sheet base material 91 (the surface on the Z2 side in the Z1-Z2 direction).

[0104] The specific method for forming the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C is not limited. For example, the methods shown in FIGS. 10(b) to 11(d) are exemplified. First, as shown in FIG. 10(b), a conductive layer 55 made of the same material as the third conductor portion 11C and the third conductor portion 21C is formed on both surfaces of the sheet substrate 91 (on both surfaces in the Z1-Z2 direction). The method for forming the conductive layer 55 is not limited. The conductive layer 55 may be formed by a dry process such as sputtering, or by a wet process such as electroless plating. From the viewpoint of reducing the thickness of the conductive layer 55, it is preferable that the conductive layer 55 be formed by sputtering.

[0105] 10(b), a conductive layer 55H is also formed on the inner surface of the substrate through hole 91H. Note that a member having conductive layers 55 pre-formed on both sides of the sheet substrate 91, such as a copper-clad laminate, may be prepared and the substrate through hole 91H may be formed in this. In this case, the material of the sheet substrate 91 may be exposed on the inner surface of the substrate through hole 91H, or a separate process may be performed to form the conductive layer 55H.

[0106] 10(c), an insulating layer 56 made of a patternable material such as a dry film resist is laminated on each of the conductive layers 55 provided on both sides of the sheet substrate 91. The thickness of the insulating layer 56 is formed to be thicker than the thickness of the first conductor portion 11A and the thickness of the first conductor portion 21A, respectively, thereby improving the shape controllability of the first conductor portion 11A and the first conductor portion 21A.

[0107] (d) Formation of Conductive Layer Pattern Subsequently, an exposure and development process is performed on the insulating layer 56 on both sides in the Z1-Z2 direction to remove a portion of the insulating layer 56, thereby forming a negative pattern 56P having an inverted shape of the pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A and the pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A. This exposes a portion of the conductive layer 55 on both sides in the Z1-Z2 direction, and forms the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C, as shown in FIG. 11(d).

[0108] When exposing and developing the insulating layer 56 on both sides in the Z1-Z2 direction, the portions corresponding to the third conductor portion 14C of the first draw-out portion 14 and the third conductor portion 24C of the second draw-out portion 24 are removed, so that the negative pattern 56P on the Z1 side in the Z1-Z2 direction forms the pattern 14CP of the third conductor portion 14C, and the negative pattern 56P on the Z2 side in the Z1-Z2 direction forms the pattern 24CP of the third conductor portion 24C. As a result, as shown in Figure 11 (d), the pattern 14CP of the third conductor portion 14C corresponding to the first conductor portion 14A is formed continuously with the pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A, and the pattern 24CP of the third conductor portion 24C corresponding to the first conductor portion 24A is formed continuously with the pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A.

[0109] (e) Formation of First Conductors After the patterns 11CP and 14CP of the third conductors 11C and 14C, and the patterns 21CP and 24CP of the third conductors 21C and 24C are formed in this manner, a first plating process is performed. In the first plating process, electricity is passed through the conductive layers 55 provided on both sides of the sheet base material 91, and first conductors 11A, 14A, 21A, and 24A are formed on the patterns of the conductive layers 55 by electroplating ( FIG. 11( e) ).

[0110] As described above, the negative pattern 56P formed from the insulating layer 56 is disposed around the periphery of the patterns 11CP, 14CP, 21CP, and 24CP of the conductive layer 55. Therefore, in the first plating process, electroplating is performed using the negative pattern 56P as a masking material, so that the first conductor portion 11A and the first conductor portion 14A are integrally formed, and the first conductor portion 21A and the first conductor portion 24A are integrally formed, corresponding to the patterns 11CP, 14CP, 21CP, and 24CP of the conductive layer 55. Furthermore, in the first plating process, a via conductor portion 11H is formed to fill the substrate through-hole 91H. Because this via conductor portion 11H constitutes the via portion VP, the via portion VP is formed integrally with both the first spiral conductor portion 11 and the second spiral conductor portion 21 in the first plating process.

[0111] The plating deposit formed by electroplating is not limited as long as it has suitable conductivity. As described above, non-limiting examples include materials containing Cu, such as Cu alloys.

[0112] (f) Removal of Negative Pattern After the first conductor portions 11A, 21A, 14A, and 24A are thus formed on both surfaces of the sheet base material 91, a peeling process is performed to peel off the negative pattern 56P made of the insulating layer 56. As a result, as shown in FIG. 11( f), a structure is obtained in which the conductive layer 55 is located on the entire surface of the sheet base material 91 except for the substrate through-holes 91H, and the first conductor portions 11A, 21A, 14A, and 24A are arranged on the conductive layer 55. As described above, the first conductor portion 11A and the first conductor portion 21A are electrically connected by the via conductor portion 11H that constitutes the via portion VP.

[0113] (g) Removal of Conductive Layer Next, as part of the peeling process, the portions of the conductive layer 55 on the sheet base material 91 that are exposed in the first direction (Z1-Z2 direction), specifically, the portions that are not covered by the first conductor portions 11A, 21A, 14A, and 24A, are removed. As a result, as shown in FIG. 12(g), the conductive layer 55 remaining on the sheet base material 91 becomes the third conductor portions 11C, 14C, 21C, and 24C as components of the coil portion 10.

[0114] The method for removing the conductive layer 55 is not limited. Any process capable of removing the material constituting the conductive layer 55 and having minimal impact on the first conductors 11A, 21A, 14A, and 24A may be appropriately selected. For example, if the first conductors 11A, 21A, 14A, and 24A are made of Cu and the conductive layer 55 is made of Ni, the portions of the conductive layer 55 that are not covered by the first conductors 11A, 21A, 14A, and 24A can be etched with high selectivity. Note that if the material constituting the conductive layer 55 is the same as that of the first conductors 11A, 21A, 14A, and 24A, the process capable of removing the material constituting the conductive layer 55 will also partially remove the first conductors 11A, 21A, 14A, and 24A. However, the shape of the electroplating deposit formed in the first plating process may be determined taking this removal into account.

[0115] (h) Formation of Second Conductor Portion By removing the conductive layer 55 as described above, the only conductive members exposed in the sheet base material 91 are substantially the first conductor portions 11A, 21A, 14A, and 24A. In this state, a second plating process is performed to form second conductor portions 11B and 21B on the surfaces of the first conductor portions 11A and 21A, and to form second conductor portions 14B and 24B on the surfaces of the first conductor portions 14A and 24A. The second plating process may be electroplating (electrolytic plating) or electroless plating.

[0116] (i) Removal of Sheet Base Material Next, a removal process is performed to remove exposed portions of the sheet base material 91 where no conductive member is provided. Specifically, as shown in FIG. 12(i), the sheet base material 91 is removed so as to include the region of the sheet base material 91 surrounded by the inner edge of the first spiral conductor portion 11 when viewed in the first direction (Z1-Z2 direction). In FIG. 12(i), the remaining portions of the sheet base material 91 are the portion between the first inner circumferential turn 111 and the second inner circumferential turn 211, the portion between the first central turn 112 and the second central turn 212, and the portion between the first outer circumferential turn 113 and the second outer circumferential turn 213, which are first insulating portions 901, 902, and 903, respectively.

[0117] The specific removal process for the sheet substrate 91 is appropriately determined depending on the constituent material of the sheet substrate 91. Removal processes are broadly classified into dry processes such as plasma etching and wet processes such as wet etching. Wet etching, which is an isotropic removal process, is preferred from the viewpoint of preventing the sheet substrate 91 from remaining in the region surrounded by the inner edge of the first spiral conductor portion 11 and properly forming the non-contact portion EP shown in FIG. 9 and the like. Furthermore, a wet process may be preferable from the viewpoint of increasing the removal efficiency of the sheet substrate 91. The removal process may remove a portion of the sheet substrate 91, while leaving a remaining portion unremoved. For example, the sheet substrate 91 may be made of a composite material of an organic material and an inorganic material, and only the organic material may be removed in the removal process.

[0118] (j) Formation of Second Insulating Portion After the sheet base material 91 has been removed in this manner, a second insulating portion 80 made of an insulating material is formed so as to cover at least a portion of the exposed portion of the coil conductor portion 20. In Fig. 13(j), the second insulating portion 80 is provided on the exposed surfaces of the first spiral conductor portion 11 and the second spiral conductor portion 21 constituting the coil conductor portion 20, as well as on exposed surfaces of the first lead portion 14 other than the surface facing the X1-X2 direction and on exposed surfaces of the second lead portion 24 other than the surface facing the X1-X2 direction. External electrodes (first external electrode 41, second external electrode 42) are provided on the surfaces not provided with the second insulating portion 80.

[0119] The formation process of the second insulating portion 80 is set appropriately depending on the constituent material of the second insulating portion 80. For example, when the second insulating portion 80 is made of a paraxylylene-based polymer, it is formed by a dry process (evaporation). When the second insulating portion 80 contains a curable resin material such as an epoxy resin, it can be formed by adhering a powder or liquid containing the constituent material of the second insulating portion 80 to the exposed surface and then solidifying the adhering material by heating or the like.

[0120] (k) Formation of Main Body After the coil 10 is formed by the above steps, as shown in FIG. 13(k), a portion of the first lead 14 and the second lead 24 of the coil 10 (specifically, in this embodiment, the portions other than the first lead end surface 14E and the second lead end surface 24E) is sealed with a material containing magnetic powder to form the main body 30. The method for forming the main body 30 is not limited, and a molding process is exemplified. Specific examples of the molding process include placing the product shown in FIG. 13(j) in a mold and forming it by compression molding a material containing magnetic powder, or transfer molding a material containing magnetic powder or a raw material for that material. When the product shown in Figure 13(j) is placed in a mold and compression molded to obtain the product shown in Figure 13(k), it is preferable to increase the uniformity of the thickness (height in the first direction) of the spiral conductor portion (first spiral conductor portion 11, second spiral conductor portion 21) in the coil portion 10 in the product shown in Figure 13(j) from the perspective of improving molding quality (the quality of the product shown in Figure 13(k), specifically the uniformity of its thickness, is exemplified).

[0121] There is no limitation on the method for forming the main body 30 so that the first lead-portion end face 14E and the second lead-portion end face 24E are exposed from the main body 30. For example, the main body 30 may be formed after masking the first lead-portion end face 14E and the second lead-portion end face 24E. Alternatively, the second insulating portion 80 may be formed by providing a dummy member in advance so as to cover or integrally connect the first lead-portion end face 14E and the second lead-portion end face 24E, forming the second insulating portion 80 on the surface of the dummy member, and then forming the main body 30 and cutting the dummy member to expose the first lead-portion end face 14E and the second lead-portion end face 24E.

[0122] (l) Formation of Exterior Coating Next, an exterior coating 50 is applied to a portion of the exposed portion of the main body 30, i.e., in FIG. 14(l), the upper surface (the surface on the Z1 side in the Z1-Z2 direction) and the lower surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30 where neither the first external electrode 41 nor the second external electrode 42 is formed, to protect the main body 30. Although not shown in FIG. 14(l), an exterior coating 60 is also applied along with the exterior coating 50. The main body 30 may be left as is, but if an external force is applied due to a collision with another component, the insulating coating on the surface of the magnetic powder constituting the main body 30 may be scraped off, reducing the surface resistance of the main body 30. Because a decrease in surface insulation may reduce the reliability of the coil component 100, it is preferable to provide the exterior coatings 50, 60 made of an insulating material. The method for forming the exterior coatings 50, 60 is not limited. Known methods such as printing and coating may be used. The constituent materials of the exterior coatings 50, 60 may be known materials such as epoxy resin, and from the viewpoint of improving impact resistance, a composite material in which an inorganic material such as glass fiber is dispersed in an organic material such as epoxy resin may be preferable. Furthermore, the exterior coatings 50, 60 may be formed not only to improve insulation reliability and impact resistance, but also to improve appearance quality and the positional accuracy of the external electrodes to be performed in the next process (for example, to prevent plating elongation). This exterior coating formation process may be repeated multiple times, in which case the exterior coatings 50 and 60 may be formed by different processes.

[0123] (m) Formation of External Electrodes Finally, one of the two terminals (first external electrode 41) is electrically connected to a portion (first external electrode end surface 14E) of the first lead portion 14 that was not sealed with the material containing magnetic powder when the main body 30 was formed, and the other of the two terminals (second external electrode 42) is electrically connected to a portion (second external electrode end surface 24E) of the second lead portion 24. The method for forming the first external electrode 41 and the second external electrode 42 is not limited, and examples include plating and printing processes. In FIG. 14( m), the first external electrode 41 and the second external electrode 42 are formed so as to extend not only to the side surfaces (surfaces facing the X1-X2 direction) of the main body 30 but also to a portion of the bottom surface (surface on the Z2 side in the Z1-Z2 direction) of the main body 30. As described above, by forming the external electrodes (first external electrode 41 and second external electrode 42) after forming the exterior coating 50, it is possible to prevent problems (plating elongation) such as reduced shape accuracy of the external electrodes and increased risk of short-circuiting of the external electrodes due to plating deposits being formed in unexpected areas of the exposed surface of the main body 30. From this perspective, it is preferable that the exterior coating 50 is also formed on the lower surface (Z2 side in the Z1-Z2 direction), which will be the mounting surface, in the process of forming the exterior coating, as in this embodiment.

[0124] Figure 15 is a detailed explanatory diagram (exposure process) of an example of a method for manufacturing a coil component according to one embodiment of the present invention, Figure 16 is a detailed explanatory diagram (after development process) of an example of a method for manufacturing a coil component according to one embodiment of the present invention, and Figure 17 is a detailed explanatory diagram (after first plating process) of an example of a method for manufacturing a coil component according to one embodiment of the present invention, and is a diagram for explaining in detail the manufacturing process described above in Figures 11(d) to 12(g).

[0125] In the manufacturing method of the coil component 100 according to this embodiment, the insulating layer 56 formed in FIG. 10( c) is formed from a negative resist (dry film resist) 56r, which hardens when exposed, as shown in FIG. 15. Then, a portion of the insulating layer 56 (negative resist 56r) distal from the sheet substrate 91, i.e., a portion on the Z1 side in the Z1-Z2 direction in FIG. 15, is exposed so as to be located in a region (front region Rff) in front of the focal depth Rf. While light passing through the focal depth Rf is generally oriented along the Z1-Z2 direction, light passing through the front region Rff has an optical path that converges toward the focal depth Rf located on the Z2 side in the Z1-Z2 direction. Note that the region behind the focal depth Rf (rear region Rfb) has an optical path that diverges from the focal depth Rf. In Figure 15, for ease of understanding, a virtual line L2 is shown as the boundary between the focal depth Rf and the forward region Rff, but the boundary between the focal depth Rf and the forward region Rff may also be composed of a continuous region in the Z1-Z2 direction.

[0126] As described above, in the portion of the insulating layer 56 (negative resist 56r) located in the front region Rff, exposure is achieved such that the exposure area narrows in the X1-X2 direction from the Z1 side in the Z1-Z2 direction toward the Z2 side in the Z1-Z2 direction. FIG. 15 shows that the end of the X1-X2 direction of the exposure area forms a predetermined angle φ1 with respect to the first direction. Meanwhile, in the portion of the insulating layer 56 (negative resist 56r) located at the focal depth Rf, exposure is achieved along the Z1-Z2 direction. Therefore, the width Web of the side of the exposure area closest to the sheet substrate 91 is narrower than the width Wet of the side distal to the sheet substrate 91.

[0127] 16, the negative pattern 56P obtained by development based on this exposure has a stripe portion in which a plurality of lines are arranged in a second direction (X1-X2 direction), which is one of the in-plane directions of the main surface of the sheet base material 91. As described above, this stripe portion is formed by exposing a portion of the sheet-like negative resist 56r provided on the main surface of the sheet base material 91 that is distal from the sheet base material 91 (a portion on the Z2 side in the Z1-Z2 direction) to light so that it is positioned in a front region Rff that is a region in front of the depth of focus Rf.

[0128] The negative pattern 56P has a developed surface formed by development in the lines of the stripe portion, i.e., a surface formed by development facing the X1-X2 direction, in a portion located in the front region Rff, which has a negative tapered region Rnt whose width in the X1-X2 direction increases in a direction away from the sheet substrate 91, and the average inclination angle θr1 of the negative tapered region Rnt based on the exposure angle φ1 is a positive value. Furthermore, the negative pattern 56P has a negative straight region Rns whose width in the X1-X2 direction is generally along the Z1-Z2 direction in a portion located at the focal depth Rf. Therefore, the width Wnb of the bottom surface 56b of the negative pattern 56P, which is close to the sheet substrate 91, is narrower than the width Wnt of the top surface 56t, which is far from the sheet substrate 91.

[0129] From the viewpoint of efficiently forming such a negative pattern 56P, the length of the depth of focus Rf in the first direction is preferably 35% or more, and more preferably 60% or more, of the first conductor thickness T1 shown in FIG. 5A. While there is no particular upper limit to the depth of focus Rf, an excessively long depth of focus Rf tends to shallow the inclination angle of the optical path of the front region Rff. Therefore, it may be preferable that the length of the depth of focus Rf in the first direction be 90% or less of the first conductor thickness T1. Note that, from the viewpoint of ensuring the shape stability of the first conductor 11A, the thickness of the negative pattern 56P is generally about 1.1 to 1.3 times the first conductor thickness T1.

[0130] After the negative pattern 56P is formed in this manner, a first plating process is performed to deposit a first conductive material on the conductive layer 55 exposed to the side (X1-X2 direction) of the negative pattern 56P. At this time, the deposited first conductive material grows in the Z1-Z2 direction, and the crystal growth direction of the metallic material of the first conductor portion 11A made of the first conductive material is along the Z1-Z2 direction. Furthermore, as the first conductive material grows, its growth in the X1-X2 direction is suppressed by the negative pattern 56P. As a result, the shape of the first conductor portion 11A in the X1-X2 direction is a shape that is a transcription of the shape of the negative pattern 56P in the X1-X2 direction. Therefore, the average inclination angle θa1 formed by the tapered region Rt of the first conductor portion 11A with respect to the first direction is equal to the average inclination angle θr1 formed by the negative pattern 56P with respect to the first direction. The width Wnb of the bottom surface 56b of the negative pattern 56P is narrower than the width Wnt of the top surface 56t, and accordingly the width W1b of the first bottom surface 11Ab is wider than the width W1t of the first top surface 11At. As described above, with the first conductor portion 11A having such a tapered region Rt and a straight region Rs, it is easy to make the cross section of the turn formed in the subsequent process including the second plating treatment have an ideal rectangular shape.

[0131] Figure 18 is a detailed explanatory diagram (exposure process) of an example of a method for manufacturing a coil component according to conventional technology (part 1), Figure 19 is a detailed explanatory diagram (after development process) of an example of a method for manufacturing a coil component according to conventional technology (part 1), and Figure 20 is a detailed explanatory diagram (after first plating process) of an example of a method for manufacturing a coil component according to conventional technology (part 1).

[0132] In the manufacturing method according to the prior art (part 1), the position of the focal depth Rf in the exposure process differs from the manufacturing method of the coil component 100 according to the present embodiment. Specifically, as shown in FIG. 18 , exposure is performed so that the entire area of ​​the insulating layer 56 (negative resist 56r) in the Z1-Z2 direction is located at the focal depth Rf. The two-dot chain line in FIG. 18 indicates the optical path of the exposure process in this embodiment. Because exposure is performed in this manner, the width Webx of the side proximal to the sheet substrate 91 in the exposure region is approximately equal to the width Wetx of the side distal to the sheet substrate 91.

[0133] The negative pattern 56P obtained by development based on this exposure becomes a negative straight region Rnsx whose width in the X1-X2 direction is roughly along the Z1-Z2 direction over the entire area in the Z1-Z2 direction, as shown in Fig. 19. Therefore, the width Wnbx of the bottom surface 56b of the negative pattern 56P is approximately equal to the width Wntx of the top surface 56t.

[0134] After the negative pattern 56P is formed in this manner, a first plating process is performed to deposit a first conductive material on the conductive layer 55 exposed to the side (X1-X2 direction) of the negative pattern 56P. Since the shape of the first conductor portion 11A in the X1-X2 direction is a shape that is a transcription of the shape of the negative pattern 56P in the X1-X2 direction, the average inclination angle θa1x of the straight region Rs of the first conductor portion 11A relative to the first direction is equal to the average inclination angle θr1x of the negative pattern 56P relative to the first direction, which is approximately 0 degrees. Since the width Wnbx of the bottom surface 56b of the negative pattern 56P is approximately equal to the width Wntx of the top surface 56t, the width W1b of the first bottom surface 11Ab is approximately equal to the width W1t of the first top surface 11At. As mentioned above, in the first conductor portion 11A having only such a straight region Rs, it is difficult to make the cross section of the turn formed by the subsequent process including the second plating treatment approximate an ideal square shape.

[0135] Figure 21 is a detailed explanatory diagram (exposure process) of an example of a method for manufacturing a coil component according to conventional technology (Part 2), Figure 22 is a detailed explanatory diagram (after development process) of an example of a method for manufacturing a coil component according to conventional technology (Part 2), Figure 23 is a detailed explanatory diagram (after development process, defect occurs) of an example of a method for manufacturing a coil component according to conventional technology (Part 2), and Figure 24 is a detailed explanatory diagram (after the first plating process when a defect occurs) of an example of a method for manufacturing a coil component according to conventional technology (Part 2).

[0136] In the manufacturing method according to the prior art (part 2), the position of the depth of focus Rf in the exposure process is different from the manufacturing method of the coil component 100 according to the present embodiment. Specifically, as shown in FIG. 21 , exposure is performed so that the entire area of ​​the insulating layer 56 (negative resist 56r) in the Z1-Z2 direction is located in the front region Rff. The two-dot chain line in FIG. 21 indicates the optical path of the exposure process in this embodiment. Because exposure is performed in this manner, the width Weby on the side proximal to the sheet substrate 91 in the exposure region is narrower than the width Wety on the side distal to the sheet substrate 91.

[0137] The negative pattern 56P obtained by development based on this exposure becomes a negative tapered region Rnty in which the width in the X1-X2 direction narrows toward the Z2 side in the Z1-Z2 direction over the entire area in the Z1-Z2 direction, as shown in Fig. 22. Therefore, the width Wnby of the bottom surface 56b of the negative pattern 56P is narrower than the width Wnty of the top surface 56t.

[0138] The width Wnty is narrower than the width Wnb of the negative pattern 56P formed by the manufacturing method according to the present embodiment shown in FIG. 16 on the side closer to the sheet substrate 91. For this reason, the negative pattern 56P according to the prior art (part 2) is more unstable than the negative pattern 56P according to the present embodiment, and may not be able to maintain an appropriate shape as shown in FIG. 22. Specifically, as shown in FIG. 23, the negative pattern 56P may tilt during development, or adjacent top surfaces 56t may not be properly separated in the X1-X2 direction.

[0139] Therefore, when the first plating process is performed to deposit the first conductive material on the conductive layer 55 exposed to the side of the negative pattern 56P (in the X1-X2 direction), the shape of the first conductor portion 11A may be such that the average inclination angle θa1y of the first conductor portion 11A deviates from the average inclination angle θr1y of the negative pattern 56P, as shown in FIG. 24. In this case, when the first plating process is performed, the variation in the average inclination angle of the negative pattern 56P is transferred, resulting in the formation of a first conductor portion 11A with a varying average inclination angle, as shown in FIG. 24. Therefore, the cross section of the turn formed by the subsequent second plating process deviates from the ideal rectangular shape. Furthermore, if the top surfaces 56t of adjacent negative patterns 56P are not properly separated as shown on the X1 side in the X1-X2 direction in Fig. 23, the first conductive material will not be properly deposited in the first plating process, and the shape of the first conductor portion 11A will deviate significantly from the shape based on the negative patterns 56P, as shown in Fig. 24. In this case, too, the cross section of the turn formed including the subsequent second plating process will deviate from the ideal rectangular shape.

[0140] As described above, the negative pattern 56P formed by the manufacturing method for the coil component 100 according to this embodiment has better shape stability than the negative pattern 56P according to the prior art (part 2), and therefore the shape stability of the first conductor portion 11A having the inverted shape of this negative pattern 56P is also better in the first conductor portion 11A according to this embodiment. This advantage becomes more pronounced as the coil component 100 becomes smaller and the gap between adjacent turns of the coil conductor portion 20 becomes smaller.

[0141] Furthermore, the fact that the cross-sectional shape of the first conductor portion 11A according to this embodiment has a straight region on the side contributes to improving the shape stability of the second conductive portion 11B formed on the first conductor portion 11A, as will be described below. The cross-sectional shape of the first conductor portion 11A formed from the negative pattern 56P according to the conventional technique (part 2) is a trapezoid with a base surface that is wider on the sheet substrate 91 side. Therefore, when the bottoms on the sheet substrate 91 side have the same length, when the cross-sectional shape of the first conductor portion 11A according to this embodiment is compared with the cross-sectional shape of the first conductor portion 11A according to the conventional technique (part 2), the length of the top portion that is away from the sheet substrate 91 is shorter in the cross-sectional shape of the first conductor portion 11A according to the conventional technique (part 2).

[0142] Therefore, when comparing the gaps between two adjacent first conductors 11A on the sheet substrate 91, the first conductor 11A according to the second conventional technology, which has a cross-sectional shape with a relatively shorter top length, is significantly wider near the top than the first conductor 11A according to the present embodiment. Therefore, in the second plating process performed on the first conductor 11A according to the second conventional technology, the difference between the circulation efficiency of the plating solution near the top and the circulation efficiency near the bottom tends to be large. The greater the difference in the circulation efficiency of the plating solution, the greater the difference in the deposition rate of the second conductive material constituting the second conductor 11B. Therefore, in the second conductor 11B formed on the first conductor 11A according to the second conventional technology, the deposition thickness at the top tends to be greater than the deposition thickness at the bottom. When the deposition thickness is large, the variation increases and the controllability of the deposition thickness decreases, so the second conductor portion 11B of conventional technology (part 2) has low controllability of the shape of the top, and therefore, using conventional technology (part 2), it is difficult to obtain a turn having an ideal square cross-sectional shape.

[0143] In contrast, the first conductor 11A according to this embodiment has a straight region on the side of its cross-sectional shape as described above, and therefore the difference in plating circulation efficiency between the top and bottom is relatively small. Therefore, the second conductor 11B formed on the first conductor 11A according to this embodiment has high shape stability, and as a result, the coil conductor 20 of the coil component 100 according to this embodiment is likely to have turns with an ideal rectangular cross-sectional shape.

[0144] (Electronic / Electrical Device) An electronic / electrical device according to one embodiment of the present invention is an electronic / electrical device in which the coil component 100 according to one embodiment of the present invention described above is mounted, and the coil component 100 is connected to a substrate at the first external electrode 41 and the second external electrode 42. The electronic / electrical device according to one embodiment of the present invention is easily miniaturized because it is mounted with the coil component 100 according to one embodiment of the present invention. Furthermore, even if a large current is passed through the device or a high frequency is applied, malfunctions caused by deterioration in the function of the coil component 100 or heat generation are unlikely to occur.

[0145] The above-described embodiments and examples have been described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0146] For example, in the present embodiment, the coil conductor portion 20 includes the second conductor portion 11B that covers the first conductor portion 11A, and most of the outer surface of the second conductor portion 11B constitutes the outer surface of the turn, but this is not limiting. Another conductor portion may be provided to cover the second conductor portion 11B. Furthermore, in the present embodiment, the third conductor portion 11C is positioned in the coil conductor portion 20 so as to cover a portion of the first conductor portion 11A, but the third conductor portion 11C does not necessarily have to be provided.

[0147] 6B and 7B , the structure in which the second conductor portion 11B wraps around to the Z2 side in the Z1-Z2 direction can be obtained by, in the manufacturing method, performing a process to remove the negative pattern 56P and the exposed conductive layer 55 following the first plating process, and then performing a second plating process to partially remove the sheet base material 91, but instead of performing the second plating process to substantially remove the sheet base material 91. As a result, the second conductor portions 11B, 21B, 14B, and 24B are formed so as to cover the third conductor portions 11C, 21C, 14C, and 24C made of the conductive layer 55 that were in contact with the first conductor portions 11A, 21A, 14A, and 24A.

[0148] Furthermore, when the second plating process is performed after substantially removing the sheet base material 91 as in the above-mentioned manufacturing method, if the sheet base material 91 is removed and then the process of removing the third conductor portions 11C, 21C, 14C, and 24C is performed before the second plating process is performed, the coil conductor portion 20 will have a structure that does not have the third conductor portions 11C, 21C, 14C, and 24C.

[0149] 100: Coil component 10: Coil portion 11: First spiral conductor portion 11A, 14A, 21A, 24A: First conductor portion 11Ab: First bottom surface 11At: First top surface 11B, 14B, 21B, 24B: Second conductor portion 11C, 14C, 21C, 24C: Third conductor portion 21: Second spiral conductor portion 11CP, 14CP, 21CP, 24CP: Pattern 11F: First opposing portion 11FA: First opposite portion 11H: Via conductor portion 12, 22: Inner peripheral end portion 13, 23: Outer peripheral end portion 14: First lead portion 14E: First lead portion end face 14P : first extension portion 20 : coil conductor portion 21F : second opposing portion 21FA : second opposite portion 24 : second lead portion 24E : second lead portion end surface 30 : main body portion 41 : first external electrode 42 : second external electrode 41a, 42a : side portion 41b, 42b : bottom surface portion 50, 60 : exterior coating 55, 55H : conductive layer 56 : insulating layer 56P : negative pattern 56b : bottom surface 56r : negative resist 56t : top surface 80 : second insulating portion 90 : first insulating portion 91 : sheet substrate 91H : substrate through-hole 111 : first inner circumferential turn 111t : surface proximal to first top surface 112: First central turn 113: First outer peripheral turn 201: First coil conductor portion 202: Second coil conductor portion 211: Second inner peripheral turn 212: Second central turn 213: Second outer peripheral turn 801: First connecting portion 802: Second connecting portion 901, 902, 903: First insulating portion EP: Non-contact portion Gb, Gt: Gap IF1: First interface L1, L2: Virtual lines O: Axis (winding axis) R1: First region R2: Second region R3: Third region R4: Fourth region Rf: Depth of focus Rfb: Rear region Rff: Front region Rnt, Rnty: Negative taper region Rns, Rnsx: negative straight region Rs: straight region Rt: tapered region T1: thickness of first conductor T2: turn thickness Ts: thickness of straight regionVP: Via portion W1b, W1t, W2b, W2t, Web, Wet, Webx, Wetx, Wnb, Wnt, Wnbx, Wntx, Wnby, Wnty: Width Wp: Arrangement pitch θ1 to θ4, θa1, θa1x, θa1y, θa2, θb1, θb2, θc1, θc2, θd1, θd2, θr1, θr1x, θr1y, θx1, θx2: Average tilt angle φ1: Angle

Claims

1. A coil component comprising a coil conductor portion including a spiral portion having a winding axis in a first direction and a plurality of turns aligned in a second direction intersecting the first direction, wherein the coil conductor portion comprises: a first conductor portion made of a first conductive material and having a portion extending in the extension direction of the turns; and a second conductor portion made of a second conductive material and provided so as to cover at least a portion of the first conductor portion; wherein, when the turns are cut along a plane including the first direction and the second direction to obtain a first cross section, of the lines drawn by the outline of the first conductor portion on the first cross section, two lines aligned in the second direction have a tapered region on one side in the first direction that becomes narrower the gap therebetween, and a straight region on the other side in the first direction that is approximately equal to the gap therebetween; and, of the lines drawn by the outline of the turns on the first cross section, the two lines aligned in the second direction have a wider gap therebetween or are approximately equal to the gap therebetween.

2. A coil component comprising a coil conductor portion including a spiral portion having a first direction as a winding axis direction and a plurality of turns aligned in a second direction intersecting the first direction, wherein the coil conductor portion comprises: a first conductor portion made of a first conductive material and having a portion extending along the extension direction of the turns; and a second conductor portion made of a second conductive material and provided so as to cover at least a portion of the first conductor portion, wherein when the turns are cut along a plane including the first direction and the second direction to obtain a first cross section, among the lines drawn by the outline of the first conductor portion on the first cross section, two lines aligned in the second direction are equally divided in the first direction to define a first region R1 and a second region R2 from one end side, and among the lines drawn by the outline of the turn on the first cross section, two lines aligned in the second direction are equally divided in the first direction to define a third region R3 and a fourth region R4 from the one end side, A coil component, characterized in that, regarding an average inclination angle of each region with respect to the first direction, when the inclination in the direction in which the two lines approach each other is taken as positive, the average inclination angle θ1 of the first region is greater than both the average inclination angle θ2 of the second region and the average inclination angle θ3 of the third region.

3. The coil component according to claim 1 or 2, characterized in that, when the two faces of the first conductor portion facing the first direction are such that the one having a longer length in the second direction is a first bottom face and the other is a first top face, a width W1b which is the length in the second direction of the first bottom face, a width W1t which is the length in the second direction of the first top face, a width W2b which is the length in the second direction of the turn at the position of the first bottom face, and a width W2t which is the length in the second direction of the face of the turn closest to the first top face out of the two faces facing the first direction, satisfy the following formulas (1) and (2): W1b>W1t (1) (W1t / W1b) / (W2t / W2b)<0.93 (2) 4. A coil component according to claim 1 or 2, wherein the first conductive material includes a crystalline metallic material, and the crystal growth direction of the crystalline metallic material is aligned with the first direction.

5. A coil component as described in claim 1 or claim 2, wherein the coil conductor portion has, as the spiral-shaped portion, a first spiral conductor portion and a second spiral conductor portion aligned in the first direction, and has a via portion electrically connecting an inner circumferential end portion of the first spiral conductor portion and an inner circumferential end portion of the second spiral conductor portion.

6. A coil component as described in claim 5, further comprising: a main body portion containing magnetic powder and covering at least a portion of the coil conductor portion from both sides in the first direction; and a pair of external electrodes in contact with a surface of the coil conductor portion exposed from the main body portion and electrically connected through the coil conductor portion, wherein at least a portion of the surface of the portion of the coil conductor portion located inside the main body portion is covered with a coil insulation portion.

7. An electronic or electrical device in which the coil component according to claim 6 is mounted, said coil component being connected to a substrate by said pair of external electrodes.

8. A method for manufacturing a coil component, comprising: forming an insulating negative pattern on a conductive layer of a substrate having a conductive layer on a main surface normal to a first direction; forming a first conductor by electroplating in which an electric current is passed through the conductive layer; removing the negative pattern; removing the conductive layer exposed by removing the negative pattern; and forming a second conductor so as to cover the exposed portion of the first conductor, wherein the negative pattern has a stripe portion having a plurality of lines aligned in a second direction which is one of the in-plane directions of the substrate; and forming the stripe portion includes exposing a sheet-like negative resist provided on the main surface so that a portion of the sheet-like negative resist provided on the main surface which is distal to the substrate is located in front of a depth of focus.

9. A method for manufacturing a coil component according to claim 8, wherein the depth of focus is 35% or more of the thickness of the first conductor portion.

10. A method for manufacturing a coil component as described in claim 8, wherein a developed surface formed by development in the lines of the stripe portion has a negative taper region inclined with respect to the first direction and a negative straight region aligned with the first direction.

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