Electroconductive member

Abstract

The present invention comprises a substrate (2) having a first layer (4) and a second layer (5) that is layered on the first layer (4), a first wiring portion (10) that is provided to the first layer (4), and a second wiring portion (20) that is provided to the second layer (5). The first layer (4) is provided with a first groove (6), and the second layer (5) is provided with a second groove (7). The first wiring portion (10) includes a first electroconductive layer composed of an electroconductive material that is embedded in the first groove (6), and the second wiring portion (20) includes a second electroconductive layer composed of an electroconductive material that is embedded in the second groove (7).　In a contact region (A) in which the first wiring portion (10) and the second wiring portion (20) overlap in top view and extend in a direction parallel to each other, the lower portion of the second wiring portion (20) includes a contact portion (Cp) that is in contact with the upper portion of the first wiring portion (10). The contact portion (Cp) of the second wiring portion (20) extends along the direction in which the first wiring portion (10) and the second wiring portion (20) extend in the contact region (A).

Description

Conductive material

[0001] The present disclosure relates to conductive members.

[0002] 2. Description of the Related Art Conventionally, a conductive member such as that shown in Patent Document 1 has been known.

[0003] Patent Document 1 discloses a conductive member (touch sensor) including a base and a plurality of electrodes formed by a plurality of wiring portions (thin metal wires). The base includes a substrate made of a film material and a single-layer resin layer laminated on the surface of the substrate. The resin layer has a plurality of grooves formed in a concave shape toward the substrate on the surface opposite to the surface facing the substrate. Each groove is filled with a conductive material such as copper or a copper alloy that forms each of the wiring portions.

[0004] WO2020 / 137178 publication

[0005] In a conductive member such as that disclosed in Patent Document 1, increasing the line width of each wiring portion is effective in reducing the electrical resistance of each wiring portion. That is, when the line width of each wiring portion is relatively large, the cross-sectional area of ​​the conductive material embedded in each groove increases. As a result, the electrical resistance of each wiring portion is reduced. However, when the line width of each wiring portion is increased, there is a problem in that the wiring portions constituting the conductive member become easily visible when viewed from above.

[0006] Another common method for reducing the electrical resistance of each wiring portion is to form each groove with a relatively large cross-sectional depth. That is, by setting the aspect ratio of each groove in a cross-sectional view so that the depth of each groove is large, the cross-sectional area of ​​the conductive material embedded in each groove increases. As a result, the electrical resistance of each wiring portion is reduced and the line width of each wiring portion can be reduced. However, in the conductive member of Patent Document 1, if the aspect ratio is set to prioritize the depth of each groove as described above, the length of each wiring portion in the thickness direction of the resin layer increases. That is, the thickness of each wiring portion increases. As a result, the design process for embedding a conductive material in each groove in a single-layer resin layer requires careful consideration of the optimal embedded amount and embedding conditions of the conductive material. Furthermore, the manufacturing process for embedding a conductive material in each groove in a single-layer resin layer has the problem of complicated management of the embedded amount of the conductive material.

[0007] The present disclosure has been made in view of the above points, and its purpose is to reduce the line width of the wiring portion and to reduce the electrical resistance of the wiring portion.

[0008] To achieve the above object, one embodiment of the present disclosure provides a conductive member comprising: a substrate having a first layer and a second layer stacked on the first layer; a first wiring portion provided in the first layer; and a second wiring portion provided in the second layer. The first layer has a first groove portion. The second layer has a second groove portion. The first wiring portion includes a first conductive layer made of a conductive material embedded in the first groove portion. The second wiring portion includes a second conductive layer made of a conductive material embedded in the second groove portion. In a contact region where the first wiring portion and the second wiring portion overlap in a top view and extend in parallel directions, a lower part of the second wiring portion includes a contact portion that contacts an upper part of the first wiring portion. The contact portion of the second wiring portion extends along the extension direction of the contact region of the first wiring portion and the second wiring portion.

[0009] According to the present disclosure, the first and second wiring portions can be made thinner, and the electrical resistance of the first and second wiring portions can be reduced.

[0010] FIG. 1 is a plan view showing the entire conductive member according to an embodiment of the present disclosure. FIG. 2 is a partially enlarged plan view showing an enlarged view of section II of FIG. 1. FIG. 3 is a view equivalent to FIG. 2, showing only a plurality of first wiring portions shown in FIG. 2. FIG. 4 is a view equivalent to FIG. 2, showing only a plurality of second wiring portions shown in FIG. 2. FIG. 5 is a cross-sectional view taken along line V-V of FIG. 2. FIG. 6 is a partially enlarged cross-sectional view showing an enlarged view of section VI of FIG. 5. FIG. 7 is a diagram schematically showing first and second wiring portions located in a contact region. FIG. 8 is a view equivalent to FIG. 2, showing a conductive member according to a modified embodiment.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following description of the embodiments is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses.

[0012] 1 shows the overall configuration of a conductive member 1 according to an embodiment of the present disclosure. In this embodiment, the conductive member 1 is formed by an imprinting method.

[0013] In this embodiment, for the sake of convenience, the direction from the left side to the right side of the paper in FIG. 1 is defined as the "X direction," while the direction from the bottom to the top of the paper in FIG. 1 is defined as the "Y direction."

[0014] 5 , in the thickness direction of the substrate 2 (described later), the side on which the film base 3 (described later) is located is defined as the "lower side" of the substrate 2, while the side on which the second layer 5 (described later) is located is defined as the "upper side" of the substrate 2. Note that this positional relationship is unrelated to the orientation of the conductive member 1 or a product to which the conductive member 1 is applied in actual use.

[0015] 1, the conductive member 1 has a plurality of contact areas A (four in the illustrated example) and one non-mounting area B when viewed from above. Each contact area A is an area where a predetermined electronic component (not shown) can be mounted. The non-mounting area B is an area other than the contact area A. Examples of the electronic component include an LED element and a diode. The plurality of electronic components are arranged on the upper surface side of the substrate 2 (the upper surface side of the second layer 5, which will be described later).

[0016] 5 and 6, the conductive member 1 includes a substrate 2. The substrate 2 is transparent and light-transmitting. The thickness of the substrate 2 is, for example, 25 μm to 250 μm. The substrate 2 includes a film base 3, a first layer 4, and a second layer 5.

[0017] (Film Base) The film base 3 is made of, for example, a flexible and light-transmitting resin material. Preferably, the film base 3 has a light transmittance of 85% or more. The thickness of the film base 3 is, for example, 25 μm to 250 μm. The film base 3 may also be transparent.

[0018] Examples of the resin material that constitutes the film substrate 3 include PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), and COC (cycloolefin copolymer).

[0019] 5 and 6, the first layer 4 is a layer for forming a plurality of first wiring portions 10, which will be described later. The first layer 4 is laminated on the upper side of the film substrate 3 (see FIG. 5).

[0020] The first layer 4 is made of a resin material having insulating properties and optical transparency. Examples of the resin material constituting the first layer 4 include a thermosetting resin and an ultraviolet-curable resin material. The thickness of the first layer 4 is set to, for example, 1.8 μm or more and 5.2 μm or less. The thickness of the first layer 4 is formed to be greater than the depth of the first groove portion 6 described below.

[0021] A plurality of first grooves 6 are provided in the first layer 4. The first grooves 6 are formed in a concave shape extending downward from the upper surface of the first layer 4. The distance between the side portions 6 a, 6 a of the first grooves 6 gradually increases from the lower portion 6 b toward the opening side (the upper surface side of the first layer 4).

[0022] The groove width W1 of the first groove portion 6 is set to be 0.3 μm or more and 30.0 μm or less, and the groove depth D1 of the first groove portion 6 is set to be, for example, 0.5 μm or more and 2.5 μm or less.

[0023] The angle formed between the side portion 6a and the lower portion 6b of the first groove portion 6 is set as a first angle θ1. The first angle θ1 is, for example, 116°.

[0024] 5 and 6 , the second layer 5 is a layer for forming the second wiring portion 20, which will be described later. The second layer 5 is laminated on the first layer 4. That is, the second layer 5 is disposed at a position corresponding to the upper side (front side) of the substrate 2 in the thickness direction of the substrate 2. In addition, in the contact region A, the upper surface (front surface) of the second layer 5 is a surface on which the above-mentioned electronic components can be placed.

[0025] The second layer 5 is made of an insulating and light-transmitting resin material, similar to the first layer 4. The thickness of the second layer 5 is set to, for example, 0.5 μm to 3.2 μm in order to ensure flexibility.

[0026] A plurality of second grooves 7 are provided in the second layer 5. Each second groove 7 is formed as a recess extending downward from the upper surface of the second layer 5. The distance between the side portions 7 a, 7 a in each second groove 7 gradually increases from the lower portion 7 b toward the opening (the second upper surface). Each second groove 7 curves downward from the lower portion of each side portion 7 a toward the center of the width of the lower portion 7 b (approximately the center of the lower portion 7 b in the X direction).

[0027] In this embodiment, the groove width dimension W2 of the second groove portion 7 is larger than the groove width dimension W1 of the first groove portion 6. Specifically, the groove width dimension W2 is set to, for example, 1.1 μm or more and 34.0 μm or less.

[0028] In this embodiment, the groove depth D2 of the second groove portion 7 is larger than the groove depth D1 of the first groove portion 6. Specifically, the groove depth D2 is set to, for example, 0.3 μm or more and 2.3 μm or less. The magnitude relationship between the groove depths D1 and D2 is not limited to the magnitude relationship exemplified in this embodiment. For example, although not shown, the groove depth D2 may be the same as the groove depth D1. Alternatively, the groove depth D2 may be smaller than the groove depth D1.

[0029] The angle between the side portion 7 a and the bottom portion 7 b of the second groove portion 7 is set as a second angle θ2. In this embodiment, the second angle θ2 is greater than the first angle θ1. The second angle θ2 is, for example, 135°.

[0030] 6 , in the second groove portion 7 located in the contact area A, a portion corresponding to a connection portion Cp described below penetrates in the thickness direction of the substrate 2. In addition, in the second groove portion 7 located in the contact area A, a lower portion 7b is partially recessed into the first layer 4 side.

[0031] 6, when the upper surface of the first wiring portion 10 is recessed, the lower surface of the second layer 5 bulges along the upper surface of the first wiring portion 10. The interface between the first layer 4 and the second layer 5 may have unevenness (not shown).

[0032] 2 and 3, the conductive member 1 includes a plurality of first wiring portions 10. For convenience of illustration, in Fig. 2, the portions where each first wiring portion 10 located in the contact region A overlaps with each second wiring portion 20 (described later) are shown by a "bold line."

[0033] The first wiring portions 10 extend linearly in the Y direction in top view. Each of the first wiring portions 10 is thinned. The line width of each of the first wiring portions 10 is, for example, 4.0 μm.

[0034] The plurality of first wiring parts 10 shown in this embodiment are divided into two groups Gp1 and Gp2 (see FIG. 3).

[0035] The plurality of first wiring portions 10 belonging to the group Gp1 are arranged so as to extend from the non-mounting area B toward the contact area A in a top view.

[0036] The plurality of first wiring parts 10 belonging to group Gp2 are arranged only in the non-mounting area B in top view. That is, the plurality of first wiring parts 10 belonging to group Gp2 are arranged so as not to enter from the non-mounting area B toward the contact area A in top view.

[0037] As shown in Fig. 5 , each first wiring portion 10 is provided on the first layer 4. As shown in Fig. 6 , each first wiring portion 10 includes a first adhesion layer 11, a first conductive layer 12, and a first blackening layer 13.

[0038] The first adhesive layer 11 is an element for ensuring adhesion of the first conductive layer 12 to the first groove portion 6. The first adhesive layer 11 has low reflectivity. That is, the first adhesive layer 11 has the function of making the first conductive layer 12 less visible when the conductive member 1 is viewed from the side where the first layer 4 is located (the lower side of the paper in FIG. 6 ).

[0039] The first adhesive layer 11 is a metal layer composed of, for example, a metal nitride containing at least one metal selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn, a metal oxide, or a metal oxynitride containing both a metal nitride and a metal oxide. The first adhesive layer 11 may be a single layer or a laminate of multiple layers with different compositions.

[0040] The first adhesive layer 11 is formed in the first groove portion 6. Specifically, the first adhesive layer 11 is laminated in the form of a thin film on the side portion 6a and the lower portion 6b of the first groove portion 6 by vapor deposition, sputtering, or the like.

[0041] The first conductive layer 12 is an element that ensures the conductivity of the first wiring portion 10. The first conductive layer 12 is laminated on the first adhesive layer 11. In this embodiment, the upper surface of the first conductive layer 12 is formed so as to be recessed downward from a position corresponding to the upper surface of the first layer 4 in a cross-sectional view. Although not shown, the upper surface of the first conductive layer 12 may be flush with the upper surface of the first layer 4. Alternatively, the upper surface of the first conductive layer 12 may be located slightly higher than the upper surface of the first layer 4.

[0042] The first conductive layer 12 is made of a conductive material embedded in the first groove portion 6. The conductive material is, for example, a conductive metal. Suitable conductive metals include, for example, copper, silver, gold, and alloys containing at least one of these metals. The first conductive layer 12 is formed by, for example, vapor deposition, sputtering, electroless plating, or electroplating.

[0043] The first blackening layer 13 has the function of making the first conductive layer 12 less visible when the conductive member 1 is viewed from the first layer 4 side. The first blackening layer 13 is located above the first wiring portion 10. Specifically, the first blackening layer 13 is laminated on the upper side of the first conductive layer 12 (the opening side of the first groove portion 6).

[0044] The first blackening layer 13 is formed by substituting, with palladium, copper crystal grains located at the boundaries between copper crystal grains located on the surface of the first conductive layer 12 (blackening treatment). The thickness of the first blackening layer 13 is, for example, 10 nm or more and 500 nm or less.

[0045] (Second Wiring Portion) As shown in FIGS. 2 and 4 , the conductive member 1 includes a plurality of second wiring portions 20 .

[0046] Each second wiring portion 20 is directly connected to an electronic component (not shown) disposed in the contact area A. Each second wiring portion 20 is thinned. The width dimension W2 of the second wiring portion 20 is larger than the width dimension W1 of the first wiring portion 10 (see FIG. 5). The line width dimension W2 of each second wiring portion 20 is, for example, 5.0 μm.

[0047] The plurality of second wiring parts 20 shown in this embodiment are divided into two groups Gp3 and Gp4 (see FIG. 4).

[0048] The second wiring parts 20 belonging to the group Gp3 are arranged so as to extend from the non-mounting area B toward the contact area A in a top view.

[0049] Each second wiring portion 20 belonging to the group Gp3 is composed of a first extending portion 20a, a second extending portion 20b, and a third extending portion 20c.

[0050] The first extension portion 20a is disposed in the non-mounting region B in top view. The first extension portion 20a does not overlap with the first wiring portion 10 adjacent to it in the X direction. Specifically, the first extension portion 20a is disposed at an interval from the first wiring portion 10 adjacent to it in the X direction (see FIG. 2). The first extension portion 20a extends linearly along the Y direction.

[0051] The second extending portion 20b is disposed in the non-mounting area B in top view. The second extending portion 20b is located in the non-mounting area B and near the boundary between the non-mounting area B and the contact area A. The second extending portion 20b extends in a direction oblique to the X direction and the Y direction. The second extending portion 20b is formed so as to connect the first extending portion 20a and the third extending portion 20c.

[0052] The third extending portion 20c is disposed in the contact area A in the top view. The third extending portion 20c overlaps with the first wiring portion 10 located in the contact area A in the top view. The third extending portion 20c extends linearly along the Y direction.

[0053] The second wiring parts 20 belonging to group Gp4 are arranged only in the non-mounting area B in top view. That is, the second wiring parts 20 belonging to group Gp4 are arranged so as not to extend from the non-mounting area B toward the contact area A in top view. The second wiring parts 20 belonging to group Gp4 extend linearly along the Y direction in top view.

[0054] As shown in Fig. 5 , each second wiring portion 20 is provided on the second layer 5. As shown in Fig. 6 , each second wiring portion 20 includes a second adhesion layer 21, a second conductive layer 22, and a second blackening layer 23.

[0055] The second adhesion layer 21 is an element for ensuring adhesion of the second conductive layer 22 to the second groove portion 7. The second adhesion layer 21 has low reflectivity. That is, the second adhesion layer 21 has the function of making the second conductive layer 22 less visible when the conductive member 1 is viewed from the side where the first layer 4 is located (the lower side of the paper in FIG. 6 ).

[0056] The second adhesive layer 21 is a metal layer composed of, for example, a metal nitride containing at least one metal selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn, a metal oxide, or a metal oxynitride containing both a metal nitride and a metal oxide. The second adhesive layer 21 may be a single layer or a laminate of multiple layers with different compositions.

[0057] The second adhesive layer 21 is formed in the second groove portion 7. Specifically, the second adhesive layer 21 is laminated in the form of a thin film on the side portion 7a and the lower portion 7b of the second groove portion 7 by vapor deposition, sputtering, or the like.

[0058] The second conductive layer 22 is an element for ensuring the conductivity of the second wiring portion 20. The second conductive layer 22 is laminated on the second adhesive layer 21. In this embodiment, the upper surface of the second conductive layer 22 is formed so as to be recessed downward from a position corresponding to the upper surface of the second layer 5 in a cross-sectional view. Although not shown, the upper surface of the second conductive layer 22 may be formed so as to be flush with the upper surface of the second layer 5.

[0059] The second conductive layer 22 is made of a conductive material embedded in the second groove portion 7. The conductive material is, for example, a conductive metal. Suitable conductive metals include, for example, copper, silver, gold, and alloys containing at least one of these metals. The second conductive layer 22 is formed by, for example, vapor deposition, sputtering, electroless plating, or electroplating.

[0060] The second blackening layer 23 has the function of making the second conductive layer 22 less visible when the conductive member 1 is viewed from the second layer 5 side. The second blackening layer 23 is located above the second wiring portion 20. Specifically, the second blackening layer 23 is laminated on the upper side of the second conductive layer 22 (the opening side of the second groove portion 7).

[0061] The second blackening layer 23 is formed by substituting, with palladium, copper crystal grains located at the boundaries between copper crystal grains located on the surface of the second conductive layer 22 (blackening treatment). The thickness of the second blackening layer 23 is, for example, 10 nm or more and 500 nm or less.

[0062] (Characteristic Configuration) In the contact region A, the first wiring portion 10 and the third extending portion 20c of the second wiring portion 20 overlap in a top view and extend in parallel directions (see FIG. 2).

[0063] 6 , in the contact region A, the lower part of the third extending portion 20 c of the second wiring portion 20 includes a contact portion Cp (see FIGS. 6 and 7 ) that contacts the upper part of the first wiring portion 10. Specifically, in the contact region A, the lower part (contact portion Cp) of the second wiring portion 20 contacts the first blackening layer 13. Note that the lower part (contact portion Cp) of the second wiring portion 20 (third extending portion 20 c) described above corresponds to the lower parts of the second adhesion layer 21 and the second conductive layer 22 shown in FIG.

[0064] As a characteristic configuration of an embodiment of the present disclosure, the contact portion Cp (see Figures 6 and 7) of the second wiring portion 20 extends along the extension direction (Y direction in the illustrated example) in the contact area A of the first wiring portion 10 and the second wiring portion 20.

[0065] [Operation and Effect of the Embodiment] As described above, in the contact region A, the first wiring portion 10 and the second wiring portion 20 (third extension portion 20c) overlap and extend in parallel in a top view. In this contact region A, the lower portion of the second wiring portion 20 (third extension portion 20c) includes a contact portion Cp that contacts the upper portion of the first wiring portion 10. This contact portion Cp integrates the first wiring portion 10 and the second wiring portion 20 (third extension portion 20c). In this state, the first and second groove portions 6, 7 have an aspect ratio determined by the sum of the depths of the first groove portion 6 and the second groove portion 7 in a cross-sectional view. As a result, the sum of the cross-sectional area of ​​the conductive material embedded in the first groove portion 6 (the cross-sectional area of ​​the first conductive layer 12) and the cross-sectional area of ​​the conductive material embedded in the second groove portion 7 (the cross-sectional area of ​​the second conductive layer 22) appears to increase. That is, the cross-sectional areas of the first and second wiring portions 10, 20 are substantially increased.

[0066] The contact portion Cp of the second wiring unit 20 extends along the extension direction of the first wiring unit 10 and the second wiring unit 20 in the contact region A. This configuration ensures the integrity of the first and second wiring units 10, 20 in the contact region A. That is, the cross-sectional areas of the first and second wiring units 10, 20 are substantially increased in the contact region A. Therefore, due to the general relationship between electrical resistance and cross-sectional area (a relationship based on the general formula that the electrical resistance of a conductor is inversely proportional to the cross-sectional area of ​​the conductor), the electrical resistance of the first and second wiring units 10, 20 is reduced in the contact region A without increasing the line width. Furthermore, the first and second wiring units 10, 20 can be thinned in the contact region A. As a result, it is possible to efficiently arrange multiple first wiring units 10 and multiple second wiring units 20 in a top view.

[0067] Therefore, in the conductive member 1 according to the embodiment of the present disclosure, the first and second wiring portions 10, 20 can be made thinner, and the electrical resistance of the first and second wiring portions 10, 20 can be reduced.

[0068] Furthermore, in the conductive member 1 according to the embodiment of the present disclosure, the amount of conductive material embedded in the first groove portion 6 and the amount of conductive material embedded in the second groove portion 7 can be managed separately during design and manufacturing. This makes it less likely that problems associated with conventional techniques such as those described in Patent Document 1 above will arise. As described above, the problems associated with conventional techniques include problems in the design process when embedding conductive material in each groove (the need to carefully consider the optimal amount and embedding conditions of conductive material) and problems in the manufacturing process (the tendency for management of the amount of embedded conductive material to become complicated).

[0069] Furthermore, in this embodiment, the width dimension W2 of the second wiring unit 20 in a top view is larger than the width dimension W1 of the first wiring unit 10. This makes the cross-sectional area of ​​the second conductive layer 22 constituting the second wiring unit 20 larger than the cross-sectional area of ​​the first conductive layer 12 constituting the first wiring unit 10. As a result, due to the general relationship between electrical resistance and cross-sectional area, it is possible to relatively reduce the wiring resistance of the second wiring unit 20. This therefore ensures the stability of the electrical connection between an electronic component (not shown) arranged in the contact region A and the second wiring unit 20 directly connected to the electronic component.

[0070] Furthermore, the second angle θ2 is larger than the first angle θ1. With this configuration, the cross-sectional area of ​​the second conductive layer 22 constituting the second wiring unit 20 is larger than the cross-sectional area of ​​the first conductive layer 12 constituting the first wiring unit 10. As a result, due to the general relationship between electrical resistance and cross-sectional area, it is possible to relatively reduce the wiring resistance of the second wiring unit 20. Therefore, it is possible to ensure the stability of the electrical connection between an electronic component (not shown) arranged in the contact region A and the second wiring unit 20 directly connected to the electronic component.

[0071] The first wiring portion 10 further includes a first blackening layer 13 laminated on the first conductive layer 12. This first blackening layer 13 provides an anti-corrosion effect to the first conductive layer 12. Furthermore, in the contact region A, the contact portion Cp of the second wiring portion 20 contacts the first blackening layer 13. This allows the lower portion of the second wiring portion 20 and the first blackening layer 13 to be firmly joined to each other by a so-called anchor effect. As a result, the connection stability between the first wiring portion 10 and the second wiring portion 20 is improved. Therefore, in the contact region A, the first wiring portion 10 and the second wiring portion 20 can be ensured to be integrated.

[0072] The second wiring portion 20 further includes a second blackening layer 23 laminated on the second conductive layer 22. This second blackening layer 23 makes it difficult to see the second conductive layer 22 that constitutes each second wiring portion 20 when the conductive member 1 is viewed from the side where the second layer 5 is located. In other words, the so-called "line visibility" of each second wiring portion 20 is prevented. This improves the appearance of the conductive member 1.

[0073] Furthermore, in the non-mounting area B where no electronic components are mounted, the plurality of first wiring portions 10 (plurality of first wirings) and the plurality of second wiring portions 20 (plurality of second wirings) do not overlap each other in a top view. This makes the integrity of the first wiring portion 10 and the second wiring portion 20 in the contact area A clearer in comparison with the non-mounting area B. That is, in the contact area A, the electrical resistance of the first and second wiring portions 10, 20 can be reduced compared with the non-mounting area B.

[0074] 8, a plurality of dummy wiring portions 30 may be arranged in the contact region A. Each dummy wiring portion 30 is made of a conductive material buried in a corresponding dummy groove portion (not shown) formed in the second layer 5.

[0075] The multiple dummy wiring portions 30 do not overlap with the multiple first wiring portions 10 and the multiple second wiring portions 20 in a top view. Specifically, the multiple dummy wiring portions 30 are arranged at intervals from the multiple first wiring portions 10 and the multiple second wiring portions 20 located in the contact area A in a top view. In this modified example, the distance in the X direction between the second wiring portion 20 (first wiring portion 10) located in the contact area A and the dummy wiring portion 30 is the same as the distance in the X direction between the first wiring portion 10 and the second wiring portion 20 located in the non-mounting area B.

[0076] 8, when viewed from above, there is less difference in appearance between the plurality of second wiring portions 20 and the plurality of dummy wiring portions 30 located in the contact area A and the plurality of first wiring portions 10 and the plurality of second wiring portions 20 located in the non-mounting area B. In other words, when viewed from above, the appearance of the contact area A and the non-mounting area B is unified. As a result, the appearance of the conductive member 1 when viewed from above can be improved.

[0077] [Other Embodiments] In the above embodiment, a configuration in which a plurality of first wiring portions 10 are provided on the first layer 4 has been described, but the present invention is not limited to this configuration. That is, it is sufficient that at least one first wiring portion 10 is provided on the first layer 4.

[0078] In the above embodiment, a configuration in which a plurality of second wiring portions 20 are provided on the second layer 5 has been described, but this is not limiting. That is, it is sufficient that at least one second wiring portion 20 is provided on the second layer 5.

[0079] In the above embodiment, the width dimension W2 of the second wiring portion 20 is larger than the width dimension W1 of the first wiring portion 10, but this is not limiting. For example, the width dimension W2 of the second wiring portion 20 may be the same as the width dimension W1 of the first wiring portion 10.

[0080] In the above embodiment, the second angle θ2 is greater than the first angle θ1, but this is not limiting. For example, the second angle θ2 may be the same as the first angle θ1.

[0081] In the above embodiment, multiple first wiring parts 10 belonging to group Gp2 and multiple second wiring parts 20 belonging to group Gp4 are exemplified, but the multiple first wiring parts 10 belonging to group Gp2 and the multiple second wiring parts 20 belonging to group Gp4 may be omitted as appropriate.

[0082] In the above embodiment, the first wiring portions 10 include the first blackening layer 13, but the present invention is not limited to this. That is, the first wiring portions 10 do not necessarily include the first blackening layer 13. If the first wiring portions 10 do not include the first blackening layer 13, the upper surface of the first conductive layer 21 comes into contact with the lower portion of the second wiring portion 20.

[0083] In the above embodiment, the second wiring portions 20 each include the second blackening layer 23, but the present invention is not limited to this. That is, the second wiring portions 20 do not necessarily need to include the second blackening layer 23.

[0084] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the present disclosure.

[0085] The present disclosure is industrially applicable as a conductive member.

[0086] 1: Conductive member 2: Substrate 3: Film base material 4: First layer 5: Second layer 6: First groove portion 7: Second groove portion 10: First wiring portion 11: First adhesive layer 12: First conductive layer 13: First blackened layer 20: Second wiring portion 20a: First extending portion 20b: Second extending portion 20c: Third extending portion 21: Second adhesive layer 22: Second conductive layer 23: Second blackened layer 30: Dummy wiring portion A: Contact area B: Non-mounting area θ1: First angle θ2: Second angle Cp: Contact portion

Claims

1. A conductive member comprising: a substrate having a first layer and a second layer laminated on the first layer; a first wiring portion provided on the first layer; and a second wiring portion provided on the second layer, wherein the first layer has a first groove portion and the second layer has a second groove portion, the first wiring portion includes a first conductive layer made of a conductive material embedded in the first groove portion, the second wiring portion includes a second conductive layer made of a conductive material embedded in the second groove portion, and in a contact region where the first wiring portion and the second wiring portion overlap in a top view and extend in directions parallel to each other, a lower portion of the second wiring portion includes a contact portion that contacts an upper portion of the first wiring portion, and the contact portion of the second wiring portion extends along the extension direction of the contact region of the first wiring portion and the second wiring portion.

2. A conductive member according to claim 1, wherein the width dimension of the second wiring portion in a top view is greater than the width dimension of the first wiring portion.

3. A conductive member as described in claim 1, wherein, when the angle between the lower portion and the side portion of the first groove portion is defined as a first angle and the angle between the lower portion and the side portion of the second groove portion is defined as a second angle, the second angle is larger than the first angle.

4. A conductive member as described in claim 1, wherein the first wiring portion further has a first blackening layer laminated on the first conductive layer, the first blackening layer being located on the upper portion of the first wiring portion, and in the contact region, the contact portion of the second wiring portion contacts the first blackening layer.

5. The conductive member according to claim 1, wherein the second wiring portion further includes a second blackening layer laminated on the second conductive layer.

6. A conductive member according to claim 1, further comprising a plurality of first wirings and a plurality of second wirings, each of the plurality of first wirings being the first wiring portion, and each of the plurality of second wirings being the second wiring portion, and in a non-mounting area where no electronic component is mounted, the plurality of first wiring portions and the plurality of second wiring portions do not overlap each other in a top view.

7. A conductive member according to claim 6, further comprising a dummy wiring portion, the dummy wiring portion not overlapping the plurality of first wirings and the plurality of second wirings in a top view.

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