Foldable electronic device comprising antenna module

Abstract

A foldable electronic device according to various embodiments of the present invention comprises: a first housing; a second housing; a first hinge module between the first housing and the second housing; a flexible display disposed on the first housing and the second housing; a first hinge cover for covering the first hinge module; a first flexible circuit board disposed between the first hinge module and the first hinge cover; and an antenna module which includes a plurality of patch antennas and which is disposed between the first flexible circuit board and the first hinge cover.

Description

Foldable electronic device including an antenna module

[0001] Various embodiments of the present invention disclose a foldable electronic device including an antenna module.

[0002] The use of foldable electronic devices that fold and unfold in either a horizontal or vertical direction is increasing.

[0003] The above foldable electronic device can be operated in a folded or unfolded state with the first housing and the second housing centered around the hinge module.

[0004] The above foldable electronic device can be operated, for example, in an in-folding and / or out-folding manner, by rotating the first housing and the second housing using a hinge module.

[0005] There is increasing user demand for expanded displays in foldable electronic devices. Foldable electronic devices may be implemented in the form of multi-foldable electronic devices comprising a first housing, a second housing, and a third housing.

[0006] The above multi-foldable electronic device can be operated in an in-folding and / or out-folding manner with the first housing, the second housing, and the third housing using the first hinge module and the second hinge module.

[0007] The multi-foldable electronic device may include a flexible display disposed at least partially across the first housing, the second housing, and the third housing.

[0008] The multi-foldable electronic device may include at least one antenna module to perform long-distance communication and / or short-distance communication with other electronic devices. For example, the multi-foldable electronic device may use at least one antenna module to perform 5G (5 thgeneration) communication (e.g. mmWave communication).

[0009] The multi-foldable electronic device may have limited space for arranging the antenna module. For example, when the first housing, the second housing, and the third housing are folded in an infolding manner while the antenna module is arranged on the outside (e.g., at the edge) of the second housing, the radiation performance of the antenna module arranged in the second housing may be degraded due to a portion of the first housing, the second hinge module, a portion of the third housing, and a conductive portion included in the flexible display.

[0010] Various embodiments of the present invention can provide a foldable electronic device including a first hinge module coupled between a first housing and a second housing, and an antenna module disposed between a first hinge cover covering the first hinge module.

[0011] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] According to one embodiment of the present invention, a foldable electronic device may include a first housing, a second housing, a first hinge module between the first housing and the second housing, a flexible display disposed on the first housing and the second housing, and a first hinge cover configured to cover the first hinge module. According to one embodiment, the foldable electronic device may include a first flexible circuit board disposed between the first hinge module and the first hinge cover, and a plurality of patch antennas, and may include an antenna module disposed between the first flexible circuit board and the first hinge cover.

[0013] According to various embodiments of the present invention, by arranging an antenna module (e.g., a patch array antenna or a mmWave antenna) between a first hinge module coupled between a first housing and a second housing and a first hinge cover covering the first hinge module, the deterioration of the radiation performance of the antenna module can be reduced.

[0014] In addition, various effects may be provided, either directly or indirectly, through this document.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0017] FIG. 2A is a schematic drawing of a foldable electronic device in an unfolded state viewed from the front according to one embodiment of the present invention.

[0018] FIG. 2b is a schematic diagram of a foldable electronic device in an unfolded state viewed from the rear according to one embodiment of the present invention.

[0019] FIG. 3 is a schematic drawing showing a folded state of a first housing and a third housing of a foldable electronic device according to one embodiment of the present invention.

[0020] FIG. 4 is a schematic drawing showing a folded state of a first housing, a second housing, and a third housing of a foldable electronic device according to one embodiment of the present invention.

[0021] FIG. 5 is a schematic diagram of a foldable electronic device according to one embodiment of the present invention, viewed from the rear with some components removed.

[0022] FIG. 6 is a drawing schematically illustrating a portion of the rear surface of a foldable electronic device according to one embodiment of the present invention.

[0023] FIG. 7 is a cross-sectional view schematically showing part AA' of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0024] FIG. 8 is a cross-sectional view schematically showing a part of the configuration of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0025] FIG. 9 is a cross-sectional view schematically showing various embodiments of a configuration of part AA' of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0026] FIG. 10 is a cross-sectional view schematically showing various embodiments of a configuration of a portion of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0027] FIG. 11 is a drawing schematically showing a first radiation area of ​​a foldable electronic device according to one embodiment of the present invention.

[0028] FIG. 12 is a drawing schematically showing a second radiation area of ​​a foldable electronic device according to one embodiment of the present invention.

[0029] FIG. 13 is a cross-sectional view schematically showing various embodiments of a configuration of a portion of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0030] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0054] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0055] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0056] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0057] FIG. 2a is a schematic drawing of a foldable electronic device in an unfolded state according to an embodiment of the present invention, viewed from the front. FIG. 2b is a schematic drawing of a foldable electronic device in an unfolded state according to an embodiment of the present invention, viewed from the rear.

[0058] According to various embodiments, the embodiments of the electronic device (101) disclosed in FIG. 1 may be included in the embodiments of the foldable electronic device (200) (e.g., multi-foldable electronic device) disclosed in FIGS. 2A and 2B. For example, the foldable electronic device (200) disclosed in FIGS. 2A and 2B may include the processor (120), the memory (130), the input module (150), the audio output module (155), the display module (160), the audio module (170), the sensor module (176), the interface (177), the connection terminal (178), the haptic module (179), the camera module (180), the antenna module (197), and / or the subscriber identification module (196) disclosed in FIG. 1.

[0059] Referring to FIGS. 2A and 2B, a foldable electronic device (200) (e.g., a multi-foldable electronic device) according to one embodiment of the present invention may include a first housing (210), a second housing (220), a third housing (230), a first hinge module (201), a second hinge module (202), and / or a flexible display (240).

[0060] In one embodiment, the first housing (210) may be disposed between the second housing (220) and the third housing (230). The second housing (220) may be operably coupled to a first side (e.g., in the -x-axis direction) of the first housing (210). The third housing (230) may be operably coupled to a second side (e.g., in the x-axis direction) of the first housing (210). For example, the first housing (210) may be operably coupled at a first side (e.g., in the -x-axis direction) with at least a portion of the second housing (220) via a first hinge module (201), and may be operably coupled at a second side (e.g., in the x-axis direction) with at least a portion of the third housing (230) via a second hinge module (202).

[0061] According to one embodiment, the second housing (220) can be foldably coupled to a first side (e.g., in the -x-axis direction) of the first housing (210). The first hinge module (201) can be foldably coupled between the first housing (210) and the second housing (220). The first hinge module (201) can be arranged such that the first housing (210) and the second housing (220) can be folded or unfolded with respect to each other. The first hinge module (201) can include a hinge device, a hinge member, a hinge plate, or a hinge assembly. The first housing (210) and the second housing (220) can be rotatably coupled about a first folding axis (A1) using the first hinge module (201).

[0062] According to one embodiment, the first hinge module (201) may be covered by a first hinge cover (201c) (e.g., a first hinge housing). The first hinge cover (201c) may be configured to cover the first hinge module (201). The first hinge cover (201c) may be disposed between the first housing (210) and the second housing (220). The first hinge cover (201c) may cover the first hinge module (201) and may make the first hinge module (201) visually invisible from the outside. The first hinge cover (201c) may be visually exposed to the outside or covered by at least a portion of the first housing (210) and the second housing (220), depending on whether the first housing (210) and the second housing (220) are in an unfolded or folded state. For example, when the first housing (210) and the second housing (220) are in an unfolded state, at least a portion of the first hinge cover (201) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed.

[0063] According to one embodiment, the third housing (230) can be foldably coupled to a second side (e.g., in the x-axis direction) of the first housing (210). The second hinge module (202) can be foldably coupled between the first housing (210) and the third housing (230). The second hinge module (202) can be arranged such that the first housing (210) and the third housing (230) can be folded or unfolded relative to each other. The second hinge module (202) can include a hinge device, a hinge member, a hinge plate, or a hinge assembly. The first housing (210) and the third housing (230) can be rotatably coupled about a second folding axis (A2) using the second hinge module (202).

[0064] According to one embodiment, the second hinge module (202) may be covered by a second hinge cover (202c) (e.g., a second hinge housing). The second hinge cover (202c) may be configured to cover the second hinge module (202). The second hinge cover (202c) may be disposed between the first housing (210) and the third housing (230). The second hinge cover (202c) may cover the second hinge module (202) and may make the second hinge module (202) visually invisible from the outside. The second hinge cover (202c) may be partially covered by or visually exposed to the outside by at least a portion of the first housing (210) and the third housing (220), depending on whether the first housing (210) and the third housing (220) are in an unfolded or folded state. For example, when the first housing (210) and the third housing (230) are in an unfolded state, the second hinge cover (202c) may be partially covered by or partially exposed to the first housing (210) and the third housing (230).

[0065] According to one embodiment, a foldable electronic device (200) (e.g., a multi-foldable electronic device) may be folded such that the third housing (230) is first folded relative to the first housing (210) via the second hinge module (202), and the second housing (230) is later folded relative to the first housing (210) via the first hinge module (201). For example, the third housing (230) may be folded relative to the first housing (210) via the second hinge module (202) in an in-folding manner. For example, the third housing (220) may be folded relative to the first housing (210) while rotating in the z-axis direction and the -x-axis direction via the second hinge module (202). For example, the second housing (220) can be folded in an in-folding manner relative to the first housing (210) via the first hinge module (201). For example, the second housing (220) can be folded relative to the first housing (210) while rotating in the z-axis direction and the x-axis direction via the first hinge module (201).

[0066] According to one embodiment, the width (W3) of the third housing (230) in the transverse direction (e.g., in the x-axis and -x-axis directions) may be configured to be smaller than the width (W1) of the first housing (210) in the transverse direction (e.g., in the x-axis and -x-axis directions). The width (W1) of the first housing (210) in the transverse direction (e.g., in the x-axis and -x-axis directions) may be configured to be substantially the same as the width (W2) of the second housing (220) in the transverse direction (e.g., in the x-axis and -x-axis directions). According to various embodiments, the width (W2) of the second housing (220) in the transverse direction (e.g., in the x-axis and -x-axis directions) may be configured to be larger than the width (W1) of the first housing (210) in the transverse direction (e.g., in the x-axis and -x-axis directions).

[0067] According to one embodiment, the first housing (210) and the third housing (230) are disposed on both sides of the second folding axis (A2) on which the second hinge module (202) is disposed, and may have an asymmetrical shape with respect to the second folding axis (A2). According to various embodiments, the first housing (210) and the third housing (230) may also have a symmetrical shape with respect to the second folding axis (A2). The angle or distance between the first housing (210) and the third housing (230) may vary depending on whether the foldable electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0068] According to one embodiment, the first housing (210) and the second housing (220) are disposed on both sides with respect to the first folding axis (A1) on which the first hinge module (201) is disposed, and may have a shape that is substantially symmetrical with respect to the first folding axis (A1). According to various embodiments, the first housing (210) and the second housing (220) may have an asymmetrical shape with respect to the first folding axis (A1). The angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the foldable electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0069] In one embodiment, the width of the first hinge module (201) may be configured to be wider than the width of the second hinge module (202). For example, when the third housing (230) is first folded with respect to the first housing (210), and the second housing (220) is folded with respect to the first housing (210), and the second housing (220) is placed on top of the third housing (230), the width of the first hinge module (201) may be configured to be wider than the width of the second hinge module (202). For example, the first hinge module (201) may be a first folding hinge, a wide hinge, or a big hinge having a width wider than the second hinge module (202). For example, the second hinge module (202) may be a second folding hinge, slim hinge, or small hinge that is narrower than the first hinge module (201). In one embodiment, the first hinge module (201) may have a larger radius of curvature than the second hinge module (202). The second hinge module (202) may have a smaller radius of curvature than the first hinge module (201). In one embodiment, the width of the first hinge module (201) is described as being wider than the width of the second hinge module (202), but is not limited thereto, and the width of the second hinge module (202) may be wider than the width of the first hinge module (201) depending on the type and / or operation of the foldable electronic device (200).

[0070] In one embodiment, the flexible display (240) may be disposed on the first housing (210), the second housing (220), and the third housing (230). For example, the flexible display (240) may be disposed across at least a portion of the front surfaces (e.g., in the z-axis direction) of the first housing (210), the second housing (220), and the third housing (230). The flexible display (240) may be a first display, a foldable display, or a main display. In various embodiments, a sub-display (250) may be disposed on the rear surface (e.g., in the -z-axis direction) of the second housing (220). The sub-display (250) may be a second display or an auxiliary display.

[0071] In this document, the surface on which the flexible display (240) is placed may be defined as the front side (e.g., in the z-axis direction) of the foldable electronic device (200), and the surface opposite the front side may be defined as the back side (e.g., in the -z-axis direction) of the foldable electronic device (200). The surface surrounding the space between the front side (e.g., in the z-axis direction) and the back side (e.g., in the -z-axis direction) may be defined as the side surface of the foldable electronic device (200).

[0072] According to one embodiment, the flexible display (240) may include a first display area (240a) disposed in the first housing (210), a second display area (240b) disposed in the second housing (220), and a third display area (240c) disposed in the third housing (230) (e.g., the front). The first display area (240a), the second display area (240b), and the third display area (240c) may be integrally formed to constitute the flexible display (240). According to various embodiments, when the foldable electronic device (200) is in an unfolded state, the flexible display (240) may be configured to be disposed on most of the front surface (e.g., in the z-axis direction) of the foldable electronic device (200). At least a portion of the flexible display (240) may be deformed into a flat surface or a curved surface. The division of the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be an exemplary physical division. The flexible display (240) may be formed as a seamless, single full screen. According to one embodiment, the sub-display (250) may include a fourth display area (250d). For example, the sub-display (250) may be arranged on the rear side (e.g., in the -z-axis direction) of the second housing (230).

[0073] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the first housing (210) may include a first side member (213) that is connected to at least a portion of the first hinge module (201) and the second hinge module (202), and is arranged to face the front side (e.g., in the z-axis direction) of the foldable electronic device (200), a second side member (212) that faces the opposite direction of the first side member (211), and / or surrounds at least a portion of a first space between the first side member (211) and the second side member (212).

[0074] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the second housing (220) may include a third side (221) that is connected to at least a portion of the first hinge module (201) and is arranged to face the front (e.g., in the z-axis direction) of the foldable electronic device (200), a fourth side (222) that faces in an opposite direction to the third side (221), and / or a second side member (223) that surrounds at least a portion of a second space between the third side (221) and the fourth side (222).

[0075] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the third housing (230) may include a fifth side (231) that is connected to at least a portion of the second hinge module (202) and arranged to face the front (e.g., in the z-axis direction) of the foldable electronic device (200), a sixth side (232) that faces in an opposite direction to the fifth side (231), and / or a third side member (233) that surrounds at least a portion of a third space between the fifth side (231) and the sixth side (232).

[0076] According to various embodiments, when the foldable electronic device (200) is in an unfolded state, the first side (211), the third side (221), and the fifth side (231) may face substantially the same direction (e.g., the z-axis direction). When the foldable electronic device (200) is in an unfolded state, the second side (212), the fourth side (222), and the sixth side (232) may face substantially the same direction (e.g., the -z-axis direction).

[0077] According to various embodiments, when the first housing (210) and the third housing (230) of the foldable electronic device (200) are in a folded state, the first side (211) and the fifth side (231) may be arranged to face each other. When the second housing (220) is arranged on top of the third housing (230) (e.g., in the z-axis direction) with respect to the first housing (210) of the foldable electronic device (200), the third side (221) of the second housing (220) and the sixth side (232) of the third housing (230) may be arranged to face each other.

[0078] According to various embodiments, the foldable electronic device (200) may include a recess (245) formed to accommodate a flexible display (240) through structural combination of the first housing (210), the second housing (220), and the third housing (230). The recess (245) may have substantially the same size as the flexible display (240).

[0079] According to various embodiments, when the foldable electronic device (200) is in an unfolded state, the first housing (210), the second housing (220), and the third housing (230) form an angle of about 180°, and the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) form substantially the same plane and may be arranged to face substantially the same direction (e.g., the z-axis direction). The fourth display area (250d) of the sub-display (250) may be arranged to face the opposite direction to the third display area (240c).

[0080] According to various embodiments, the first housing (210) and the second housing (220) may form an angle that allows them to stop at a designated folding angle between a folded state and an unfolded state (e.g., a free stop function) using the first hinge module (201). In various embodiments, the second housing (220) may also rotate to move toward a second side (212) (e.g., a rear side) of the first housing (210) while being pressed in an unfolding direction (e.g., a -z-axis direction) based on the designated inflection angle using the first hinge module (201).

[0081] According to various embodiments, the first housing (210) and the third housing (230) can form an angle that can be stopped at a designated folding angle between a folded state and an unfolded state using the second hinge module (202). In various embodiments, the third housing (230) can also be rotated to move toward a second side (212) (e.g., a rear side) of the first housing (210) while being pressed in an unfolding direction (e.g., a -z-axis direction) based on the designated inflection angle using the second hinge module (202).

[0082] According to various embodiments, the flexible display (240) may be arranged to be supported by the first side (211) of the first housing (210), the first hinge module (201), the third side (221) of the second housing (220), the second hinge module (202), and the fifth side (231) of the third housing (230). In one embodiment, the sub-display (250) (e.g., the fourth display area (250d)) may be arranged to be at least partially visible from the outside through the fourth side (222) in the interior space of the second housing (220). In various embodiments, the sub-display (250) may also be arranged to be visible from the outside through the sixth side (232) in the interior space of the third housing (230).

[0083] According to one embodiment, the flexible display (240) may be primarily used when the foldable electronic device (200) is in an unfolded state, and the sub-display (250) may be primarily used when the multi-foldable electronic device (200) is in a folded state.

[0084] According to one embodiment, the foldable electronic device (200) may include a first rear cover (270) disposed on a second side (212) of a first housing (210), a second rear cover (280) disposed on a fourth side (222) of a second housing (220), and / or a third rear cover (290) disposed on a sixth side (232) of a third housing (230). In various embodiments, at least a portion of the first rear cover (270) may be formed integrally with a portion of the first side member (213). In various embodiments, at least a portion of the second rear cover (280) may be formed integrally with a portion of the second side member (223). In various embodiments, at least a portion of the third rear cover (290) may be formed integrally with a portion of the third side member (233). According to one embodiment, at least one of the first rear cover (270), the second rear cover (280), and the third rear cover (290) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate.

[0085] According to various embodiments, the first rear cover (270) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. According to various embodiments, the second rear cover (280) may be formed by a substantially transparent plate, such as, for example, glass or polymer. According to various embodiments, the third rear cover (290) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The sub-display (250) (e.g., the fourth display area (250d)) may be arranged so as to be visible from the outside through the second rear cover (280) in the internal space of the second housing (220).

[0086] According to various embodiments, the foldable electronic device (200) may include at least one of an input module (261), an audio output module (263, 265), a sensor module (267a, 267b, 267c), a camera module (271a, 271b, 271c), a key input device (273), an indicator (not shown), or a connector port (275). In various embodiments, the foldable electronic device (200) may omit at least one of the above-described components or may additionally include at least one other component.

[0087] According to one embodiment, the input module (261) may include at least one microphone positioned to detect the direction of sound. The input module (261) may include the input module (150) disclosed in FIG. 1.

[0088] According to one embodiment, the audio output module (263, 265) may include at least one speaker. The audio output module (263, 265) may include a call receiver (263) disposed through the fourth side (222) of the second housing (220), and a speaker (265) disposed on a portion of an upper portion (e.g., in the y-axis direction) and a portion of a lower portion (e.g., in the -y-axis direction) of a second side member (223) of the second housing (220) and / or a portion of an upper portion (e.g., in the y-axis direction) and a portion of a lower portion (e.g., in the -y-axis direction) of a third side member (233) of the third housing (230). The audio output module (263, 265) may include the audio output module (155) disclosed in FIG. 1.

[0089] According to one embodiment, the input module (261), the audio output module (263, 265) and the connector port (275) are disposed in the space of the first housing (210), the second housing (220) and / or the third housing (230) and can be exposed to the external environment through at least one hole formed in the first housing (210), the second housing (220) and / or the third housing (230). In one embodiment, the holes formed in the first housing (210), the second housing (220) and / or the third housing (230) may be used in common for the input module (261) and the audio output module (263, 265). In one embodiment, the audio output module (263, 265) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the second housing (220) and / or the third housing (230).

[0090] According to various embodiments, the camera modules (271a, 271b, 271c) may include a first camera module (271a) disposed on a first side (211) of the first housing (210), a second camera module (271b) disposed on a second side (212) of the first housing (210), and / or a third camera module (271c) disposed on a fourth side (222) of the second housing (220). According to one embodiment, the foldable electronic device (200) may include a flash (295) disposed near the second camera module (271b). The flash (295) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, the camera modules (271a, 271b, 271c) may include one or more lenses, image sensors, and / or image signal processors. In one embodiment, at least one of the camera modules (271a, 271b, 271c) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on one side of the first housing (210), the second housing (220), and / or the third housing (230). For example, the camera modules (271a, 271b, 271c) may include the camera module (180) disclosed in FIG. 1.

[0091] According to one embodiment, the sensor modules (267a, 267b, 267c) may generate electrical signals or data values ​​corresponding to an internal operating state or an external environmental state of the foldable electronic device (200). According to various embodiments, the sensor modules (267a, 267b, 267c) may include a first sensor module (267a) disposed on a first surface (211) of the first housing (210), a second sensor module (267b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (267c) disposed on a fourth surface (222) of the second housing (220). For example, the sensor modules (267a, 267b, 267c) may include the sensor module (176) disclosed in FIG. 1.

[0092] According to various embodiments, the foldable electronic device (200) may further include at least one of a sensor module not shown, for example, a 6-axis sensor (e.g., an acceleration sensor and a gyro sensor), an angle detection sensor, a Hall sensor, an angular velocity sensor, a folding and unfolding detection sensor, a proximity sensor, a barometric pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illuminance sensor, an ultrasonic sensor, an iris recognition sensor, a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), and a fingerprint recognition sensor.

[0093] According to one embodiment, the key input device (273) may be arranged to be exposed to the outside through the third side member (233) of the third housing (230). In one embodiment, the key input device (273) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In one embodiment, the foldable electronic device (200) may not include some or all of the key input devices (273), and the key input devices (273) that are not included may be implemented in another form, such as a soft key, on the flexible display (240) and / or the sub-display (250). In various embodiments, the key input device (273) may be implemented using a pressure sensor and / or a touch sensor included in the flexible display (240) and / or the sub-display (250). In one embodiment, the key input device (273) may include a power button and / or a volume control button of the foldable electronic device (200).

[0094] According to one embodiment, the connector port (275) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device (e.g., the external electronic devices 102, 104, 108 of FIG. 1). In one embodiment, the connector port (275) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals. For example, the connector port (275) may be formed in a portion of the first side member (213) of the first housing (210). For example, the connector port (275) may include the connection terminal (178) disclosed in FIG. 1.

[0095] According to various embodiments, at least one of the camera modules (271a, 271b, 271c), at least one of the sensor modules (267a, 267b, 267c), and / or an indicator may be arranged to be exposed through at least one display (240, 250). For example, at least one camera module (271a, 271c), at least one sensor module (267a, 267c) and / or an indicator may be arranged in an interior space of at least one housing (210, 220, 230), below an active area (display area) of at least one display (240, 250), and may be arranged to be in contact with the external environment through a perforated opening or transparent area up to a cover member (e.g., a window layer (not shown) of the flexible display (240) and / or a second rear cover (280)).

[0096] FIG. 3 is a schematic diagram illustrating a folded state of a first housing and a third housing of a foldable electronic device according to an embodiment of the present invention. FIG. 4 is a schematic diagram illustrating a folded state of a first housing, a second housing, and a third housing of a multi-foldable electronic device according to an embodiment of the present invention.

[0097] According to one embodiment, FIG. 3 may be a drawing viewed from the -y-axis direction, showing a state in which a third housing (230) of a foldable electronic device (200) (e.g., a multi-foldable electronic device) is folded toward a first housing (210) and the first housing (210) and the second housing (220) are unfolded. According to one embodiment, FIG. 4 may be a drawing viewed from the -y-axis direction, showing a state in which a third housing (230) of a foldable electronic device (200) is first folded toward a first housing (210) and the second housing (220) is later folded toward the first housing (210), and the second housing (220) is disposed on an upper portion (e.g., in the z-axis direction) of the third housing (230). For example, the foldable electronic device (200) disclosed in FIGS. 3 and 4 may include a multi-foldable electronic device that folds in a G-type shape. According to various embodiments, the foldable electronic device (200) may be folded into various shapes, such as a Z type as well as a G type shape.

[0098] Referring to FIGS. 3 and 4, a foldable electronic device (200) (e.g., a multi-foldable electronic device) may include a first housing (210), a second housing (220), a third housing (230), a first hinge module (201), a first hinge cover (201c), a second hinge module (202), and / or a second hinge cover (202c).

[0099] According to one embodiment, the third housing (230) may first be folded onto the top (e.g., in the z-axis direction) of the first housing (210) via a second hinge module (202) (e.g., a second folding hinge).

[0100] In one embodiment, after the third housing (230) is folded toward the first housing (210) via the second hinge module (202), the second housing (220) can be folded toward the first housing (210) via the first hinge module (201) (e.g., the first in-folding hinge) and placed on the upper portion (e.g., in the z-axis direction) of the third housing (230).

[0101] In one embodiment, the first hinge module (201) can have a first width. The second hinge module (202) can have a second width. For example, the first width can be wider than the second width. In various embodiments, the third housing (230) is folded first with respect to the first housing (210), and the second housing (220) is folded later with respect to the first housing (210), so that the second housing (220) should be positioned on top (e.g., in the z-axis direction) of the third housing (230), and thus the first width of the first hinge module (201) can be configured to be wider than the second width of the second hinge module (202). For example, the first hinge module (201) may include a first in-folding hinge, slim hinge, or small hinge that is wider than the second hinge module (202). For example, the second hinge module (202) may include a second in-folding hinge, wide hinge, or big hinge that is narrower than the first hinge module (201). In one embodiment, the first hinge module (201) may have a larger radius of curvature than the second hinge module (202). The second hinge module (202) may have a smaller radius of curvature than the first hinge module (201).

[0102] According to one embodiment, a first hinge cover (201c) (e.g., a first hinge housing) may be disposed between a first housing (210) and a second housing (220). The first hinge cover (201c) may be disposed to cover at least a portion of the first hinge module (201). The first hinge cover (201c) may be covered by at least a portion of the first housing (210) and the second housing (220), or may be visually exposed to the outside, depending on whether the first housing (210) and the second housing (220) are in an unfolded or folded state. For example, when the first housing (210) and the second housing (220) are in an unfolded state, at least a portion of the first hinge cover (201) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed. For example, when the first housing (210) and the second housing (220) are in a folded state, at least a portion of the first hinge cover (201c) may be visually exposed to the outside between the first housing (210) and the second housing (220). The first hinge cover (201c) may include a curved surface at least partially. The first hinge cover (201c) may be formed of a conductive material (e.g., metal) and / or a non-conductive material (e.g., polymer).

[0103] According to one embodiment, a second hinge cover (202c) (e.g., a second hinge housing) may be disposed between the first housing (210) and the third housing (230). The second hinge cover (202c) may be disposed to cover at least a portion of the second hinge module (202). The second hinge cover (202c) may be partially covered by or partially exposed by at least a portion of the first housing (210) and the third housing (230), depending on whether the first housing (210) and the third housing (230) are in an unfolded or folded state. For example, when the first housing (210) and the third housing (230) are in an unfolded state, the second hinge cover (202c) may be partially covered by or partially exposed by the first housing (210) and the third housing (230). For example, when the first housing (210) and the third housing (230) are in a folded state, at least a portion of the second hinge cover (202c) may be visually exposed to the outside between the first housing (210) and the third housing (230). The second hinge cover (202c) may include at least a partially curved surface. The second hinge cover (202c) may be formed of a conductive material (e.g., metal) and / or a non-conductive material (e.g., polymer).

[0104] According to various embodiments, the width of the first hinge cover (201c) may be configured to be wider than the width of the second hinge cover (202c). For example, since the first width of the first hinge module (201) is wider than the second width of the second hinge module (202), the width of the first hinge cover (201c) may be formed to be wider than the width of the second hinge cover (202c).

[0105] According to various embodiments, the foldable electronic device (200) disclosed below (e.g., a multi-foldable electronic device) may include at least some of the embodiments described in FIGS. 1 to 4. Embodiments related to the foldable electronic device (200) disclosed below may be integrated and applied to, for example, the embodiments of the foldable electronic device (200) disclosed in FIGS. 2A to 4. In the description of the foldable electronic device (200) according to various embodiments of the present invention disclosed below, the same reference numerals are given to components that are substantially the same as those in the embodiments disclosed in FIGS. 1 to 4 described above, and redundant descriptions of their functions may be omitted.

[0106] FIG. 5 is a schematic diagram of a rear view of a foldable electronic device according to an embodiment of the present invention, with some components removed. FIG. 6 is a diagram schematically illustrating a portion of the rear surface of a foldable electronic device according to an embodiment of the present invention.

[0107] According to various embodiments, FIG. 5 may be a schematic drawing of the foldable electronic device (200) disclosed in FIG. 2B according to an embodiment of the present invention, viewed from the rear (e.g., in the -z-axis direction) with the first rear cover (270), the second rear cover (280), and the third rear cover (290) removed. FIG. 6 may be a schematic drawing for explaining the configuration of the first hinge cover (201c) in a part of the foldable electronic device (200) disclosed in FIG. 2B according to an embodiment of the present invention.

[0108] According to one embodiment, a foldable electronic device (200) may include a first housing (210), a second housing (220), and a third housing (230).

[0109] According to one embodiment, the first housing (210) may include a first printed circuit board (501). The second housing (220) may include a second printed circuit board (502). The third housing (230) may include a third printed circuit board (503).

[0110] According to one embodiment, the first printed circuit board (501) and the second printed circuit board (502) can be electrically connected using a first flexible printed circuit board (FPCB) (510) (e.g., a first conductive connecting member). The first flexible circuit board (510) can be disposed partially across the first housing (210) and the second housing (220). For example, the first flexible circuit board (510) can be disposed between the first housing (210) and the second housing (220) across a portion of the first hinge cover (201c).

[0111] According to one embodiment, the first printed circuit board (501) and the third printed circuit board (503) can be electrically connected using a third flexible circuit board (530) (e.g., a third conductive connecting member). The third flexible circuit board (530) can be disposed partially across the first housing (210) and the third housing (230). For example, the third flexible circuit board (530) can be disposed between the first housing (210) and the third housing (230) across a portion of the second hinge cover (202c).

[0112] According to one embodiment, a first hinge cover (201c) may be disposed between the first housing (210) and the second housing (220). A second hinge cover (202c) may be disposed between the first housing (210) and the third housing (230). An antenna module (500) may be disposed on at least a portion of the inner side (e.g., in the z-axis direction) of the first hinge cover (201c).

[0113] According to one embodiment, a first hinge module (201) may be arranged on the inner side (e.g., in the -z-axis direction) of a first hinge cover (201c). A second hinge module (202) may be arranged on the inner side (e.g., in the -z-axis direction) of a second hinge cover (202c). For example, the width of the first hinge module (201) may be configured to be wider than the width of the second hinge module (202). According to various embodiments, a first hinge module (201) having a wider width may be arranged on the inner side (e.g., in the -z-axis direction) of the second hinge cover (202c).

[0114] According to one embodiment, the antenna module (500) may include a plurality of patch antennas. The antenna module (500) may include at least one patch array antenna or mmWave antenna. The antenna module (500) may transmit or receive signals or power to or from an external source (e.g., an external electronic device (e.g., an external electronic device 102 or 104 of FIG. 1)). The antenna module (500) may include an antenna (e.g., a patch array antenna) that includes a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). The antenna module (500) may form a mmWave antenna module. A mmWave antenna module may include a printed circuit board, an RFIC positioned on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band. The antenna module (500) may include the antenna module (197) disclosed in FIG. 1.

[0115] According to one embodiment, the antenna module (500) may be electrically connected to a wireless communication module (192) (e.g., RFIC) disposed on a first printed circuit board (501) using a second flexible circuit board (520) (e.g., a second conductive connecting member). According to various embodiments, the antenna module (500) may also be electrically connected to a processor (e.g., processor (120) of FIG. 1) disposed on the first printed circuit board (501) using a second flexible circuit board (530). For example, the antenna module (500) may transmit and receive wireless signals using a frequency band ranging from about 3 GHz to 300 GHz.

[0116] Referring to FIG. 6, the first hinge cover (201c) may include at least a portion of a non-conductive portion (610). The non-conductive portion (610) may be partially formed on the first hinge cover (201c). The non-conductive portion (610) may include a non-conductive injection molded article formed of a polymer material. The non-conductive portion (610) may be positioned to overlap with the antenna module (500). For example, the antenna module (500) may be positioned to overlap with the non-conductive portion (610). For example, the non-conductive portion (610) may be formed at a position corresponding to the antenna module (500). The non-conductive portion (610) may be formed for radiation of a wireless signal of the antenna module (500). For example, the non-conductive portion (610) may include a radiation area of ​​the antenna module (500). According to various embodiments, the first hinge cover (501c) may be formed of a conductive material (e.g., metal) other than the non-conductive portion (610).

[0117] FIG. 7 is a cross-sectional view schematically showing part AA' of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0118] According to various embodiments, FIG. 7 may be a schematic drawing of a cross-section AA' of a part of a first housing (210), a first hinge cover (201c), and a part of a second housing (220) of the foldable electronic device (200) (e.g., a multi-foldable electronic device) disclosed in FIG. 6 as viewed in the -y-axis direction.

[0119] According to one embodiment, a first hinge cover (201c) (e.g., a first hinge housing) may be disposed between a first housing (210) and a second housing (220). The first hinge cover (201c) may be disposed to cover the first hinge module (201). The first hinge cover (201c) may be disposed to cover at least a portion of the first hinge module (201). The first hinge cover (201c) may include a non-conductive portion (610) at least in a portion. The non-conductive portion (610) may be partially formed on the first hinge cover (201c). For example, when the first housing (210) and the second housing (220) are in an unfolded state using the first hinge module (201), the non-conductive portion (610) may be formed in an area where the first hinge cover (201c) is partially exposed to the outside of the foldable electronic device (200). For example, the non-conductive portion (610) may be formed in a middle area of ​​the first hinge housing (201c). For example, the non-conductive portion (610) may be formed between the first part (701) (e.g., in the x-axis direction) and the second part (702) (e.g., in the -x-axis direction) of the first hinge cover (201c).

[0120] According to one embodiment, the foldable electronic device (200) may include a guide structure (700), an antenna module (500), and a first flexible circuit board (510). For example, at least a portion of the guide structure (700), the antenna module (500), and the first flexible circuit board (510) may be disposed between the first hinge module (201) and the first hinge cover (201c).

[0121] According to one embodiment, the guide structure (700) may be attached to the inner surface (e.g., in the z-axis direction) of the first hinge cover (201c), for example, using an adhesive. The guide structure (700) may include a first part (710) and a second part (720). At least a portion of the first part (710) and the second part (720) may be integrally connected. The first part (710) and the second part (720) may be arranged to be partially spaced apart from each other. For example, the first part (710) and the second part (720) may include a gap (715) formed in the partially spaced apart space. For example, at least a portion of the first flexible circuit board (510) may be arranged in the gap (715). For example, the first part (710) may be placed in the -z-axis direction with respect to the first flexible circuit board (510). The second part (720) may be placed in the z-axis direction with respect to the first flexible circuit board (510).

[0122] According to one embodiment, the first part (710) may be attached to the inner surface (e.g., in the z-axis direction) of the first hinge cover (201c). The guide structure (700) may include a storage space (705) configured to store the antenna module (500). For example, the guide structure (700) may include a storage space (705) configured to store the antenna module (500) in the first part (710).

[0123] According to one embodiment, the second part (720) may be disposed between the first hinge module (201) and the first hinge cover (201c). The second part (720) may be disposed between the first hinge module (201) and the first flexible circuit board (510). At least a portion of the second part (720) may be separated with respect to the position where the antenna module (500) is arranged. For example, at least a portion of the second part (720) may include a first portion (720a) and a second portion (720b) ​​separated with respect to the position where the antenna module (500) is arranged. For example, the second part (720) may be disposed spaced apart from the antenna module (500). For example, the first portion (720a) and the second portion (720b) ​​of the second part (720) may be disposed spaced apart from the antenna module (500).

[0124] In one embodiment, the guide structure (700) may be configured to guide at least a portion of the first flexible circuit board (510) extending across the first hinge cover (201c). For example, the guide structure (700) may guide at least a portion of the first flexible circuit board (510) inserted into the interior of the first part (710) and the second part (720) (e.g., the gap (715)) to bend flexibly or gradually without being abruptly bent. For example, the guide structure (700) may guide at least a portion of the first flexible circuit board (510) inserted into the interior of the first part (710) and the second part (720) (e.g., the gap (715)) to be deformed within a predetermined range.

[0125] According to one embodiment, at least a portion of the first part (710) may include a first inclined surface (711). For example, the first part (710) may include a first inclined surface (711) formed in the z-axis direction. For example, at least one first inclined surface (711) may be formed in the z-axis direction of the first part (710). At least a portion of the second part (720) may include a second inclined surface (712). For example, the second part (720) may include a second inclined surface (712) formed in the -z-axis direction. For example, at least one second inclined surface (712) may be formed in the -z-axis direction of the second part (720).

[0126] According to one embodiment, the first inclined plane (711) and the second inclined plane (712) may be formed at positions corresponding to each other. The first inclined plane (711) and the second inclined plane (712) may have substantially the same inclination. For example, the first inclined plane (711) and the second inclined plane (712) may allow the first flexible circuit board (510) disposed in the gap (715) between the first part (710) and the second part (720) to be flexible or to bend gradually. For example, the first inclined plane (711) and the second inclined plane (712) may allow the first flexible circuit board (510) disposed in the gap (715) between the first part (710) and the second part (720) to be partially bent.

[0127] According to various embodiments, the guide structure may include a guide member, a guide part, a guide structure, or a guide structure. For example, the guide structure may be replaced with names such as a guide member, a guide part, a guide structure, or a guide structure.

[0128] According to one embodiment, the antenna module (500) may be attached to the inner surface (e.g., in the z-axis direction) of the first hinge cover (201c) using, for example, an adhesive. The antenna module (500) may include a plurality of patch antennas. The antenna module (500) may be placed in a storage space (705) formed in a guide structure (700) (e.g., the first part (710)). The antenna module (500) may be placed between the first flexible circuit board (510) and the first hinge cover (201c). The antenna module (500) may be placed at a position overlapping the non-conductive portion (610).

[0129] According to one embodiment, the antenna module (500) may be placed in a storage space (705) formed in a guide structure (700) (e.g., a first part (710)) and may be supported by the guide structure (700). A first flexible circuit board (510) may be partially placed at a lower portion (e.g., in the z-axis direction) of the antenna module (500). For example, a shielding member (e.g., a shielding member (810 of FIG. 8)) may be placed between the antenna module (500) and the first flexible circuit board (510). The shielding member (e.g., a shielding member (810 of FIG. 8)) may shield noise generated from the first flexible circuit board (510) from being transmitted to the antenna module (500).

[0130] According to one embodiment, at least a portion of the first flexible circuit board (510) may be disposed between the first hinge module (201) and the first hinge cover (201c). At least a portion of the first flexible circuit board (510) may be disposed within a gap (715) formed between the first part (710) and the second part (720). At least a portion of the first flexible circuit board (510) may be disposed between the first part (710) and the first hinge module (201).

[0131] FIG. 8 is a cross-sectional view schematically showing a part of the configuration of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0132] According to various embodiments, FIG. 8 may be a schematic drawing of a portion of a cross-section of the foldable electronic device (200) (e.g., a multi-foldable electronic device) disclosed in FIG. 6 as viewed from the -y-axis direction. For example, FIG. 8 may be a schematic drawing of a configuration of the foldable electronic device (200) disclosed in FIG. 7 with the first housing (210) and the second housing (220) omitted.

[0133] According to various embodiments, the embodiments of the foldable electronic device (200) disclosed in FIG. 7 may be integrated and applied to the embodiments disclosed in FIG. 8. The embodiments of the foldable electronic device (200) disclosed in FIG. 8 may also be integrated and applied to the embodiments disclosed in FIG. 7.

[0134] According to various embodiments, the foldable electronic device (200) disclosed in FIG. 8 may be formed integrally with the second part (720) (e.g., the second part (200) of the guide structure (700) of FIG. 7) without being separated. The foldable electronic device (200) disclosed in FIG. 8 may have a shielding member (810) disposed between the antenna module (500) and a portion of the first flexible circuit board (510).

[0135] According to one embodiment, the first hinge cover (201c) may be positioned between the first housing (210) and the second housing (220). The first hinge cover (201c) may be positioned to cover at least a portion of the first hinge module (201). The first hinge cover (201c) may include a non-conductive portion (610) on at least a portion.

[0136] According to one embodiment, the foldable electronic device (200) may include a first part (710) and a second part (720) of the guide structure (700), an antenna module (500), a first flexible circuit board (510), and / or a shielding member (810). For example, the first part (710) and the second part (720) of the guide structure (700), the antenna module (500), the shielding member (810), and the first flexible circuit board (510) may be disposed between the first hinge module (201) and the first hinge cover (201c).

[0137] According to one embodiment, the first part (710) of the support structure (700) and the antenna module (500) may be coupled to the inner side (e.g., in the z-axis direction) of the first hinge cover (201c), for example, using an adhesive. At least a portion of the first part (710) and the second part (720) may be integrally connected.

[0138] According to one embodiment, the antenna module (500) may be placed in a storage space (705) formed in the first part (710). The antenna module (500) may be placed at a position overlapping the non-conductive portion (610) of the first hinge cover (201c). For example, the antenna module (500) and the non-conductive portion (610) may be partially spaced apart. For example, an air layer may be formed in the partially spaced apart space between the antenna module (500) and the non-conductive portion (610). For example, the non-conductive portion (610) may include a step shape, a step, and a slope formed in the partially spaced apart space. The antenna module (500) may be placed in the storage space (705) formed in the first part (710) and may be configured to be supported by at least a portion of the first part (710). A first flexible circuit board (510) may be partially disposed on the lower portion (e.g., in the z-axis direction) of the antenna module (500). A shielding member (810) may be disposed between the antenna module (500) and a portion of the first flexible circuit board (510). The shielding member (810) may shield noise generated from the first flexible circuit board (510) from being transmitted to the antenna module (500).

[0139] According to one embodiment, at least a portion of the first part (710) may include a first inclined surface (711). For example, the first part (710) may include at least one first inclined surface (711) formed in the z-axis direction. At least a portion of the second part (720) may include a second inclined surface (712). For example, the second part (720) may include at least one second inclined surface (712) formed in the -z-axis direction. The first inclined surface (711) and the second inclined surface (712) may be formed at positions corresponding to each other. The first inclined surface (711) and the second inclined surface (712) may include substantially the same slope. For example, the first inclined plane (711) and the second inclined plane (712) can cause the first flexible circuit board (510) disposed in the gap (715) between the first part (710) and the second part (720) to be flexibly or gradually bent. For example, the first inclined plane (711) and the second inclined plane (712) can cause the first flexible circuit board (510) disposed in the gap (715) between the first part (710) and the second part (720) to be partially bent.

[0140] According to one embodiment, the second part (720) can be disposed in the z-axis direction of the first flexible circuit board (510). The second part (720) can be partially spaced apart from and partially connected to the first part (710). The first part (720) can support at least a portion of the first flexible circuit board (510) disposed on the upper side (e.g., in the -z-axis direction). The first flexible circuit board (510) can be disposed between a portion of the first part (710), the shielding member (810), and the second part (720).

[0141] According to one embodiment, the second part (720) disclosed in FIG. 8 may be formed integrally, unlike the second part (720) disclosed in FIG. 7. For example, unlike the embodiment disclosed in FIG. 7, the second part (720) may not be separated into a first part (720a) and a second part (720b).

[0142] According to one embodiment, the second part (720) may include a first region (801), a second region (803), and a third region (803). For example, the first region (801) may be a portion corresponding to the x-axis direction of the second part (720). The second region (802) may be a portion corresponding to the -x-axis direction of the second part (720). The third region (803) may be a portion corresponding to the shielding member (810) between the x-axis direction and the -x-axis direction. In various embodiments, when the second part (720) is formed integrally, a portion of the first flexible circuit board (510) disposed on the lower side (e.g., in the z-axis direction) of the shielding member (810) may not be disposed to directly face the first hinge module (201). For example, when the second part (720) is formed integrally, at least a portion of the third region (803) of the second part (720) may be arranged to spatially face the first hinge module (201).

[0143] According to one embodiment, the second part (720) may include a hook (not shown) that prevents the first flexible circuit board (510) positioned on the upper side (e.g., in the -z-axis direction) from being detached. A curvature may be formed at designated locations (e.g., in the -z-axis direction) of the first region (801) and the second region (802) of the second part (720), so that the first flexible circuit board (510) may be gently or flexibly bent.

[0144] In one embodiment, the second part (720) may include a cushioning material. For example, when the first housing (210) and the second housing (220) are folded or unfolded using the first hinge module (201) and thus the first flexible circuit board (510) experiences movement, the second part (720) may include a cushioning material so as to be flexibly affected by the impact transmitted through the movement of the first flexible circuit board (510).

[0145] FIG. 9 is a cross-sectional view schematically showing various embodiments of a configuration of part AA' of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0146] According to various embodiments, FIG. 9 may be a schematic drawing of a part of a cross-section of the foldable electronic device (200) (e.g., a multi-foldable electronic device) disclosed in FIG. 6, as viewed in the -y-axis direction. For example, FIG. 9 may be a schematic drawing of a configuration of the foldable electronic device (200) disclosed in FIG. 7, with the first housing (210) and the second housing (220) omitted.

[0147] According to various embodiments, the embodiments of the foldable electronic device (200) disclosed in FIGS. 7 and 8 may be integrated and applied to the embodiment disclosed in FIG. 9. The embodiments of the foldable electronic device (200) disclosed in FIG. 9 may also be integrated and applied to the embodiment disclosed in FIG. 8.

[0148] According to various embodiments, the foldable electronic device (200) disclosed in FIG. 9 may be substantially the same as the foldable electronic device (200) disclosed in FIG. 8, except that the second part (720) has a configuration including a groove (910) formed at a designated location (e.g., in the z-axis direction). Hereinafter, only the different configurations in the foldable electronic device (200) disclosed in FIG. 9 compared to the foldable electronic device (200) disclosed in FIG. 8 will be described.

[0149] According to various embodiments, the second part (720) may include a groove (910) formed at a designated location. For example, the second part (720) may include a groove (910) formed in the z-axis direction. For example, the groove (910) may be formed in the third region (803) of the second part (720). For example, the groove (910) may be formed by removing a portion of the first region (801), the third region (803), and a portion of the second region (802) of the second part (720).

[0150] According to one embodiment, when the first housing (210) and the second housing (220) are folded, the groove (910) formed in the second part (720) may be formed at a position corresponding to the first hinge module (201). For example, when the groove (910) is formed at a position corresponding to the first hinge module (201), even if an impact occurs while the first housing (210) and the second housing (220) are folded, the impact may be mitigated from being transmitted to the entire foldable electronic device (200). In various embodiments, when the first housing (210) and the second housing (220) are folded or unfolded, the groove (910) formed in the second part (720) may secure the fluidity of the first hinge module (201).

[0151] FIG. 10 is a cross-sectional view schematically showing various embodiments of a configuration of a portion of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0152] According to various embodiments, FIG. 10 may be a schematic drawing of a portion of a cross-section of the foldable electronic device (200) (e.g., a multi-foldable electronic device) disclosed in FIG. 6 as viewed from the -y-axis direction. For example, FIG. 10 may be a schematic drawing of a configuration of the foldable electronic device (200) disclosed in FIG. 7 with the first housing (210) and the second housing (220) omitted.

[0153] According to various embodiments, the embodiments of the foldable electronic device (200) disclosed in FIGS. 8 and 9 may be integrated and applied to the embodiment disclosed in FIG. 10. The embodiments of the foldable electronic device (200) disclosed in FIG. 10 may also be integrated and applied to the embodiments disclosed in FIGS. 8 and 9.

[0154] According to various embodiments, the foldable electronic device (200) disclosed in FIG. 10 may be substantially the same as the foldable electronic device (200) disclosed in FIG. 8, except that the second part (720) has a configuration that includes an extension region (1010) at a designated location (e.g., in the z-axis direction). Hereinafter, only the configurations that are different from the foldable electronic device (200) disclosed in FIG. 8 will be described in the foldable electronic device (200) disclosed in FIG. 10.

[0155] According to various embodiments, the second part (720) may include an extension region (1010) formed at a designated location. For example, the second part (720) may include an extension region (1010) formed in the z-axis direction. For example, the extension region (1010) may be formed in the third region (803) of the second part (720). For example, the extension region (1010) may be formed by extending through a portion of the first region (801), the third region (803), and a portion of the second region (802) of the second part (720). For example, the extension region (1010) may be formed by extending integrally from the third region (803) of the second part (720).

[0156] In one embodiment, when the second part (720) includes an extension area (1010), at least a portion of the first hinge module (201) may be omitted or removed. The extension area (1010) of the second part (720) may partially support a portion of the flexible display (240).

[0157] FIG. 11 is a schematic diagram illustrating a first radiation area of ​​a foldable electronic device according to an embodiment of the present invention. FIG. 12 is a schematic diagram illustrating a second radiation area of ​​a foldable electronic device according to an embodiment of the present invention.

[0158] According to various embodiments, FIGS. 11 and 12 may be schematic drawings of a portion of a cross-section AA' of the foldable electronic device (200) (e.g., a multi-foldable electronic device) disclosed in FIG. 6 as viewed from the -y-axis direction.

[0159] According to various embodiments, the embodiments of the foldable electronic device (200) disclosed in FIGS. 11 and 12 may be integrated and applied to the embodiments disclosed in FIGS. 7 to 10. In one embodiment, the foldable electronic device (200) disclosed in FIGS. 11 and 12 may substantially identically include the embodiments disclosed in FIG. 8.

[0160] Referring to FIG. 11, the first hinge cover (201c) may include at least a portion of a non-conductive portion (610). The non-conductive portion (610) may be partially formed on the first hinge cover (201c). The non-conductive portion (610) may be positioned to overlap the antenna module (500). For example, the non-conductive portion (610) may be formed at a position corresponding to the antenna module (500). For example, the non-conductive portion (610) may be formed in a middle region of the first hinge cover (201c). For example, the non-conductive portion (610) may be formed between the first portion (701) (e.g., in the x-axis direction) and the second portion (702) (e.g., in the -x-axis direction) of the first hinge cover (202c). The first hinge cover (201c) may be formed of a conductive material (e.g., metal) other than the non-conductive portion (610).

[0161] According to one embodiment, the non-conductive portion (610) may be positioned at the center between the first portion (701) (e.g., in the x-axis direction) and the second portion (702) (e.g., in the -x-axis direction) of the first hinge cover (201c). For example, the non-conductive portion (610) may be positioned at the center between the first portion (701) and the second portion (702) of the first hinge cover (201c) and may overlap with the antenna module (500). For example, the antenna module (500) may be secured in a radiation area without being affected by the -x-axis direction end of the first portion (701) and the x-axis direction end of the second portion (702), which are conductive portions of the first hinge cover (201c). For example, when the non-conductive portion (610) is positioned at the center between the first portion (701) and the second portion (702) of the first hinge cover (201c) and is not affected by the -x-axis direction end of the first portion (701) and the x-axis direction end of the second portion (702), the antenna module (500) can perform radiation in the first radiation area (A11) (e.g., in the -z-axis direction).

[0162] Referring to FIG. 12, the non-conductive portion (610) can be formed and positioned at a position shifted in the -x-axis direction from the middle region of the first hinge cover (201c). For example, one end (e.g., in the x-axis direction) of the non-conductive portion (610) can be positioned adjacent to one end (e.g., in the x-axis direction) of the antenna module (500). When one end (e.g., in the x-axis direction) of the non-conductive portion (610) is positioned adjacent to one end (e.g., in the x-axis direction) of the antenna module (500), one end (e.g., in the x-axis direction) of the antenna module (500) can be adjacent to the -x-axis direction end of the first portion (701), which is a conductive portion of the first hinge cover (201c).

[0163] According to one embodiment, when the non-conductive portion (610) is positioned at a position shifted in the -x-axis direction from the middle region of the first hinge cover (201c), the antenna module (500) is influenced by the -x-axis direction end of the first portion (701), which is the conductive portion of the first hinge cover (201c), and thus the radiation area can be changed. For example, when the non-conductive portion (610) is positioned at a position shifted in the -x-axis direction from the middle region of the first hinge cover (201c) and is influenced by the -x-axis direction end of the first portion (701), the antenna module (500) can, for example, perform radiation in the second radiation area (A12) between the -z-axis direction and the -x-axis direction. For example, when the non-conductive portion (610) is at least partially misaligned with the antenna module (500), the radiation area of ​​the antenna module (500) can be changed. According to various embodiments, the first hinge cover (201c) can change the radiation area by moving and positioning the non-conductive portion (610) to various positions. For example, when the overlapping and / or alignment positions of the non-conductive portion (610) of the first hinge cover (501c) and the antenna module (500) are variously changed, the antenna module (500) can secure various radiation areas.

[0164] FIG. 13 is a cross-sectional view schematically showing various embodiments of a configuration of a portion of the AA' portion of the foldable electronic device of FIG. 6 according to one embodiment of the present invention.

[0165] According to various embodiments, FIG. 13 may be a schematic drawing of a part of the AA' cross-section of the foldable electronic device (200) (e.g., multi-foldable electronic device) disclosed in FIG. 6 as viewed from the -y-axis direction.

[0166] According to various embodiments, the embodiments of the foldable electronic device (200) disclosed in FIGS. 7 to 12 may be integrated and applied to the embodiments disclosed in FIG. 13. The embodiments of the foldable electronic device (200) disclosed in FIG. 13 may also be integrated and applied to the embodiments disclosed in FIGS. 7 to 12.

[0167] According to various embodiments, the foldable electronic device (200) disclosed in FIG. 13 may be substantially the same as the foldable electronic device (200) disclosed in FIG. 8, except that the second part (720) is omitted or removed and the configuration including the protective member (1310) (e.g., a thin film sheet or a thin film layer) is different. Hereinafter, only the different configurations of the foldable electronic device (200) disclosed in FIG. 13 compared to the foldable electronic device (200) disclosed in FIG. 8 will be described.

[0168] According to various embodiments, the foldable electronic device (200) may not include the second part (720). For example, in the foldable electronic device (200) disclosed in FIG. 13, the second part (720) may be omitted or removed. For example, a protective member (1310) may be disposed between a portion of the first flexible circuit board (510) and the first hinge module (201). The protective member (1310) may include a thin film sheet or a thin film layer. The protective member (1310) may prevent a portion of the first flexible circuit board (510) and the first hinge module (201) from making direct contact. The protective member (1310) may be applied when the space between the portion of the first flexible circuit board (510) and the first hinge module (201) is narrow. The protective member (1310) can be applied when the flow range of the first hinge module (201) is wide.

[0169] A foldable electronic device (200) according to one embodiment of the present invention may include a first housing (210), a second housing (220), a first hinge module (201) between the first housing (210) and the second housing (220), a flexible display (240) disposed on the first housing (210) and the second housing (220), and a first hinge cover (201c) configured to cover the first hinge module (201). According to one embodiment, the foldable electronic device (200) may include a first flexible circuit board (510) disposed between the first hinge module (201) and the first hinge cover (201c), and a plurality of patch antennas, and may include an antenna module (500) disposed between the first flexible circuit board (510) and the first hinge cover (201c).

[0170] According to one embodiment, the foldable electronic device (200) further includes a guide structure (700) attached to an inner surface of the first hinge cover (201c), the guide structure (700) having a storage space (705) configured to store the antenna module (500) and configured to guide a portion of the first flexible circuit board (510) extending across the first hinge cover (201c).

[0171] According to one embodiment, the guide structure (700) includes a first part (710) attached to the inner surface of the first hinge cover (201c), and the first flexible circuit board (510) can be disposed between the first part (710) and the first hinge module (201).

[0172] According to one embodiment, the guide structure (700) further includes a second part (720) disposed between the first hinge module (201) and the first flexible circuit board (510), and the first flexible circuit board (510) can be disposed within a gap (715) formed between the first part (710) and the second part (720).

[0173] According to one embodiment, at least a portion of the second part (720) may include a first part (720a) and a second part (720b) ​​separated about the position of the antenna module (500).

[0174] According to one embodiment, at least a portion of the first part (710) and the second part (720) may be integrally connected. According to one embodiment, the first hinge cover (201c) includes a non-conductive portion (610), and the antenna module (500) may be positioned to overlap the non-conductive portion (610).

[0175] According to one embodiment, at least a portion of the first part (710) may include a first inclined surface (711).

[0176] In one embodiment, at least a portion of the second part (720) may include a second slope (712).

[0177] According to one embodiment, the first slope (711) and the second slope (712) may have substantially the same slope.

[0178] According to one embodiment, the foldable electronic device (200) may further include a shielding member (810) disposed between the antenna module (500) and the first flexible circuit board (510).

[0179] According to one embodiment, the first housing (210) includes a first printed circuit board (501), the second housing (220) includes a second printed circuit board (502), and the first flexible circuit board (510) can be configured to electrically connect the first printed circuit board (501) and the second printed circuit board (502) across a portion of the first hinge cover (201c).

[0180] According to one embodiment, the antenna module (500) may be electrically connected to a wireless communication module (192) disposed on the first printed circuit board (501) using a second flexible circuit board (520).

[0181] According to one embodiment, the foldable electronic device (200) further includes a third housing (230), a second hinge module (202) between the first housing (210) and the third housing (230), and a second hinge cover (202c) configured to cover the second hinge module (202), wherein the width of the first hinge cover (201c) may be configured to be wider than the width of the second hinge cover (202c).

[0182] According to one embodiment, the first hinge module (201) may include an in-folding hinge that folds in an in-folding manner, and the second hinge module (202) may include an in-folding hinge that folds in an in-folding manner.

[0183] According to one embodiment, the second part (720) may include a cushioning material.

[0184] According to one embodiment, the second part (720) includes a first region (801), a second region (802), and a third region (803) formed integrally, and at least a portion of the third region (803) may be formed at a position facing the first hinge module (201).

[0185] According to one embodiment, the foldable electronic device (200) may include a groove (910) formed in the third area (803) of the second part (720).

[0186] According to one embodiment, the foldable electronic device (200) may include an extension region (1010) that extends integrally from the third region (803) of the second part (720).

[0187] According to one embodiment, the foldable electronic device (200) may be configured such that the radiation area of ​​the antenna module (500) changes when the antenna module (500) and the non-conductive portion (610) are arranged non-aligned.

[0188] Although the present invention has been described above according to various embodiments of the present invention, it is obvious that changes and modifications made by a person having ordinary skill in the art to which the present invention pertains within a scope that does not depart from the technical spirit of the present invention also belong to the present invention.

Claims

1. In a foldable electronic device (200), First housing (210); Second housing (220); A first hinge module (201) between the first housing (210) and the second housing (220); A flexible display (240) disposed on the first housing (210) and the second housing (220); A first hinge cover (201c) configured to cover the first hinge module (201); A first flexible circuit board (510) arranged between the first hinge module (201) and the first hinge cover (201c); and A foldable electronic device comprising an antenna module (500) including a plurality of patch antennas and positioned between the first flexible circuit board (510) and the first hinge cover (201c).

2. In paragraph 1, It further includes a guide structure (700) attached to the inner surface of the first hinge cover (201c). A foldable electronic device in which the above guide structure (700) has a storage space (705) configured to store the antenna module (500) and is configured to guide a portion of the first flexible circuit board (510) extending across the first hinge cover (201c).

3. In paragraph 2, The above guide structure (700) includes a first part (710) attached to the inner surface of the first hinge cover (201c), A foldable electronic device in which the first flexible circuit board (510) is positioned between the first part (710) and the first hinge module (201).

4. In paragraph 3, The above guide structure (700) further includes a second part (720) arranged between the first hinge module (201) and the first flexible circuit board (510), A foldable electronic device in which the first flexible circuit board (510) is positioned within a gap (715) formed between the first part (710) and the second part (720).

5. In paragraph 4, At least a portion of the second part (720) includes a first part (720a) and a second part (720b) ​​separated around the position of the antenna module (500), A foldable electronic device in which at least a portion of the first part (710) and the second part (720) are integrally connected.

6. In any one of paragraphs 1 to 5, The above first hinge cover (201c) includes a non-conductive portion (610), A foldable electronic device in which the antenna module (500) is positioned to overlap with the non-conductive portion (610).

7. In any one of paragraphs 3 to 5, At least a portion of the first part (710) includes a first inclined surface (711), A foldable electronic device, wherein at least a portion of the second part (720) includes a second inclined surface (712).

8. In any one of paragraphs 1 to 7, A foldable electronic device further comprising a shielding member (810) disposed between the antenna module (500) and the first flexible circuit board (510).

9. In any one of paragraphs 1 to 8, The above first housing (210) includes a first printed circuit board (501), The second housing (220) includes a second printed circuit board (502), A foldable electronic device in which the first flexible circuit board (510) is configured to electrically connect the first printed circuit board (501) and the second printed circuit board (502) across a portion of the first hinge cover (201c).

10. In paragraph 9, The above antenna module (500) is a foldable electronic device electrically connected to a wireless communication module (192) disposed on the first printed circuit board (501) using a second flexible circuit board (520).

11. In any one of paragraphs 1 to 10, Third housing (230); A second hinge module (202) between the first housing (210) and the third housing (230); and It further includes a second hinge cover (202c) configured to cover the second hinge module (202), A foldable electronic device in which the width of the first hinge cover (201c) is configured to be wider than the width of the second hinge cover (202c).

12. In paragraph 11, A foldable electronic device, wherein the first hinge module (201) includes an in-folding hinge that folds in an in-folding manner, and the second hinge module (202) includes an in-folding hinge that folds in an in-folding manner.

13. In paragraph 4, The above second part (720) includes a first region (801), a second region (802), and a third region (803) formed integrally, A foldable electronic device in which at least a portion of the third region (803) is formed at a position facing the first hinge module (201).

14. In paragraph 13, A groove (910) formed in the third area (803) of the second part (720); and A foldable electronic device further comprising an extension region (1010) extending integrally from the third region (803) of the second part (720).

15. In paragraph 6, A foldable electronic device configured such that the radiation area of ​​the antenna module (500) is changed when the antenna module (500) and the non-conductive portion (610) are arranged non-aligned.

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