Optoelectronic component and method for producing same

Abstract

The invention relates to an optoelectronic component comprising • - a main body (1), • - an optoelectronic semiconductor chip (2) on the main body (1), • - a cover (3) for the optoelectronic semiconductor chip (2), wherein • - the main body (1) and the cover (3) are in direct contact with one another in places, • - a recess (4) is arranged between main body (1) and cover (3) and laterally surrounds the optoelectronic semiconductor chip (2), and • - the recess (4) is filled with a closure material (5) which is free of organic material and which directly adjoins the main body (1) and the cover (3).

Description

[0001] Description

[0002] OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

[0003] An optoelectronic component is specified. Furthermore, a method for producing an optoelectronic component is specified.

[0004] One problem to be solved is to provide an optoelectronic component that is particularly stable to aging. Another problem to be solved is to provide a method for producing a particularly stable optoelectronic component.

[0005] According to at least one embodiment, the optoelectronic component comprises a base body. The base body can, in particular, represent the mechanically supporting component of the optoelectronic component. For example, the base body is the mechanically supporting component of the optoelectronic component, which at least indirectly mechanically supports and / or supports other components of the component, in particular all other components of the component.

[0006] In addition to its mechanical properties, the base body is particularly intended to externally contact one or more electronic components of the optoelectronic component. For this purpose, the base body can comprise, for example, conductor tracks and / or vias, via which components of the optoelectronic component can be electrically contacted. The base body is formed, for example, from an electrically insulating material, onto or into which electrically conductive material can be introduced.

[0007] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises an optoelectronic, in particular inorganic, semiconductor chip. The optoelectronic semiconductor chip is, for example, a radiation-emitting and / or radiation-receiving semiconductor chip.

[0008] In particular, the optoelectronic semiconductor chip can be a laser chip, for example a laser diode. The laser diode can be, for example, an edge-emitting laser diode or a surface-emitting laser diode. Furthermore, it is possible for the optoelectronic component to comprise further optoelectronic semiconductor chips, which can be designed to emit radiation and / or to receive radiation. For example, the optoelectronic component can comprise a plurality of optoelectronic semiconductor chips designed as laser diodes.

[0009] Alternatively or additionally, the optoelectronic semiconductor chip can be a light-emitting diode that emits visible light during operation. For example, the optoelectronic component can then comprise several light-emitting diodes that emit light of different colors. Alternatively or additionally, the optoelectronic semiconductor chip can be a photodiode that detects light or electromagnetic radiation.

[0010] In addition, it is possible for the optoelectronic component to comprise at least one further electronic component which is provided, for example, for controlling and / or operating the optoelectronic semiconductor chip.

[0011] The optoelectronic semiconductor chip is applied to the base body. In particular, the optoelectronic semiconductor chip is directly or indirectly attached to the base body. It is possible for the optoelectronic semiconductor chip to be electrically connected to the base body.

[0012] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises a cover for the optoelectronic semiconductor chip. The cover covers the optoelectronic semiconductor chip at least on its side facing away from the base body. It is possible for the cover not to be in direct contact with the optoelectronic semiconductor chip, but rather for a gap to be present between the cover and the optoelectronic semiconductor chip, which gap is filled, for example, with a potting material or an inert gas.

[0013] For example, the cover is designed to be permeable to the electromagnetic radiation emitted and / or received by the optoelectronic semiconductor chip during operation. The base body can then be designed to be opaque, absorbent, reflective, or permeable to this radiation.

[0014] According to at least one embodiment of the optoelectronic component, the base body and the cover are in direct contact with each other at certain points. This means that the base body and the cover are in direct physical contact with each other at certain points, without any additional material, such as a bonding material, being arranged at the contact points between the base body and the cover.

[0015] According to at least one embodiment of the optoelectronic component, a recess is arranged between the base body and the cover, which recess laterally surrounds the optoelectronic semiconductor chip. Between the base body and the cover, for example, a trench is formed, which laterally partially or preferably completely surrounds the semiconductor chip. Laterally refers to the lateral directions that run, for example, parallel to a main extension plane of the optoelectronic component and / or the base body and / or the cover. If the trench laterally completely surrounds the semiconductor chip, this means, for example, that the trench runs along a closed curve around the semiconductor chip in a plan view of the main extension plane.

[0016] According to at least one embodiment of the optoelectronic component, the recess is filled with a sealing material which is free of organic material and which borders directly on the base body and the cover. The sealing material creates a mechanical connection between the cover and the base body. It is particularly possible for the connecting material, i.e. the sealing material, to be solely responsible for the mechanical connection between the cover and the base body. Alternatively, it is possible for the cover to be additionally connected to the base body where it is in direct contact with the base body, for example using a method such as direct bonding. The sealing material and the cover are each independent components of the component, which can in particular consist of different materials from one another.

[0017] The recess is designed, for example, in such a way that it can accommodate a liquid sealing material when it is introduced into the recess, without the sealing material being able to leak out of the recess.

[0018] The sealing material surrounds the optoelectronic semiconductor chip completely, in particular laterally.

[0019] The sealing material also ensures that no moisture and / or gases from outside the optoelectronic component can penetrate to the optoelectronic semiconductor chip.

[0020] The sealing material is free of organic material. This means that the sealing material is not an epoxy resin, nor an adhesive, nor silicone.

[0021] According to at least one embodiment, an optoelectronic component is specified with a base body, an optoelectronic semiconductor chip on which

[0022] Base body, a cover for the optoelectronic

[0023] Semiconductor chip, where

[0024] - the base body and the cover are in direct contact with each other in places,

[0025] - a recess is arranged between the base body and the cover, which laterally surrounds the optoelectronic semiconductor chip, and

[0026] - the recess is filled with a sealing material which is free from organic material and which is directly adjacent to the base body and the cover.

[0027] One way to connect the base body to a cover of an optoelectronic component is to apply an AuSn solder material or an adhesive between the cover and the base body.

[0028] The use of solder is expensive and technically complex. The use of an adhesive carries the risk of organic contamination of the optoelectronic semiconductor chip.

[0029] The optoelectronic component described here is based, among other things, on the idea that introducing an organic-free sealing material into a recess between the base body and the cover allows for particularly tight encapsulation of the optoelectronic semiconductor chip between the base body and the cover at low cost. Furthermore, the sealing material can be introduced into the recess even at higher temperatures, since the optoelectronic semiconductor chip is spatially separated from the surrounding recess. This spatial separation is ensured, for example, by the contact point between the recess and the base body, where these two components can be in direct contact with one another.

[0030] According to at least one embodiment of the optoelectronic component, the recess is delimited laterally by the base body and the cover. The base body and cover together form the recess, which can surround the optoelectronic semiconductor chip in a trench-like manner. For this purpose, the base body has, for example, a projection which delimits the recess in the vertical direction by an inclined surface. The vertical direction runs perpendicular to the lateral directions. In particular, it is possible for the sealing material to be introduced into the recess in such a way that both a part of the base body and a part of the cover project beyond it in the vertical direction.

[0031] According to at least one embodiment of the optoelectronic component, a cavity is formed between the base body and the cover, which cavity is sealed by the base body and the cover as well as the sealing material. For this purpose, it is possible for the base body and / or the cover to have a corresponding recess. For example, the cover can also be designed in the form of a cap, which defines the cavity in its spatial extent.

[0032] According to at least one embodiment of the optoelectronic component, the optoelectronic semiconductor chip is arranged in the cavity. This means that the optoelectronic semiconductor chip is surrounded on all sides by the base body, the cover, and the sealing material and is protected by these components of the optoelectronic component from external influences such as moisture and / or gases. The cavity can comprise further optoelectronic semiconductor chips and / or electronic components of the optoelectronic component. Furthermore, it is possible for the cavity to be partially or completely filled with a further material such as a potting material or an inert gas.

[0033] According to at least one embodiment of the optoelectronic component, the base body has a first thermal expansion coefficient, and the cover has a second thermal expansion coefficient. The first thermal expansion coefficient is greater than the second thermal expansion coefficient. This can be achieved, for example, by appropriately selecting the materials for forming the base body and the cover.

[0034] According to at least one embodiment of the optoelectronic component, the sealing material has a third thermal expansion coefficient that is greater than the second thermal expansion coefficient. Thus, the sealing material is subjected to compressive stress under thermal stress, which increases the tightness of the connection between the sealing material, the base body, and the cover.

[0035] According to at least one embodiment of the optoelectronic component, the sealing material has a third thermal expansion coefficient that is greater than the first thermal expansion coefficient. In this embodiment, the sealing material has a thermal expansion coefficient that is greater than that of the base body. Furthermore, it is possible for the sealing material to have a thermal expansion coefficient that is greater than that of the cover. As a result, the sealing material is under compressive stress with respect to the two components, which leads to a particularly tight seal.

[0036] According to at least one embodiment of the optoelectronic component, the base body is formed from a ceramic material. In this case, the base body can, for example, comprise vias formed from a metal, which partially penetrate the ceramic material and are provided for connecting the optoelectronic semiconductor chip. In this case, the base body is designed to be particularly opaque to radiation, in particular opaque to light.

[0037] According to at least one embodiment of the optoelectronic component, the cover is formed from glass. The cover can be designed, for example, as a glass plate, which may be cuboid-shaped, or as a glass cap that defines the cavity. The cover is then particularly radiation-permeable, for example, translucent.

[0038] According to at least one embodiment of the optoelectronic component, the sealing material is formed with a glass solder. A glass solder is a particularly advantageous material for sealing the cavity, particularly compared to an AuSn solder material. It is characterized by increased resistance to thermal cycling stress because it is subjected to compressive stress. The glass solder can be heated and thus softened before being introduced into the recess, wherein the thermal input is reduced due to the fact that the cover and the base body delimit the recess and thus ensure distance from the optoelectronic semiconductor chip.

[0039] The thermal expansion coefficients for the base body, the cover and the sealing material can be selected in such a way that the connection is particularly crack-closing due to the compressive stress to which the sealing material is subjected.

[0040] The optoelectronic component described here is particularly suitable for industrial applications, in the automotive sector, and for use in consumer products, for example, in wearable devices such as mobile phones, smartwatches, and AR / VR applications. The optoelectronic components described here are particularly suitable as light sources for near-eye projection, for example, in AR / VR applications, for laser beam scanning, as light sources in (high-power) laser projection, for laser-based material processing, or as light sources in headlights.

[0041] Furthermore, a method for producing an optoelectronic component is specified. In particular, an optoelectronic component described here can be produced by means of the method. This means that all features described for the optoelectronic component are also disclosed for the method, and vice versa.

[0042] According to at least one embodiment of the method, the base body is first provided. For this purpose, the base body can, for example, also be present in a composite of base bodies, which is severed at the end of the method for producing individual optoelectronic components.

[0043] According to at least one embodiment of the method, the optoelectronic semiconductor chip is attached to the base body. This can be done, for example, by soldering. The semiconductor chip can thus be mechanically and electrically connected to the base body.

[0044] According to at least one embodiment of the method, the cover for the optoelectronic semiconductor chip is applied to the base body. The application can be carried out by bringing them into contact. Furthermore, it is possible for the cover and the optoelectronic semiconductor chip to be mechanically connected to one another, for example, via direct bonding.

[0045] According to at least one embodiment of the method, the base body and the cover are brought into direct contact with each other at certain points. This means that there are contact points where the base body and the cover directly adjoin each other. These contact points can be designed such that they completely enclose the optoelectronic semiconductor chip laterally.

[0046] According to at least one embodiment of the method, a recess is formed between the base body and the cover, which recess laterally surrounds the optoelectronic semiconductor chip. The recess can be formed, for example, when the base body and the cover are brought into contact. This can be achieved, for example, by the base body having a projection that projects vertically beyond the contact surface between the cover and the base body.

[0047] According to at least one embodiment of the method, the recess is filled with the sealing material which is free of organic material, and the recess is filled in such a way that the sealing material directly borders on the base body and the recess.

[0048] According to at least one embodiment of the method for producing an optoelectronic component, the method comprises the following steps:

[0049] Providing a base body,

[0050] Attaching an optoelectronic semiconductor chip to the base body,

[0051] Applying a cover for the optoelectronic semiconductor chip to the base body, whereby

[0052] - the base body and the cover are brought into direct contact with each other in places,

[0053] - a recess is formed between the base body and the cover, which laterally surrounds the optoelectronic semiconductor chip, and

[0054] - the recess is filled with a sealing material which is free of organic material and which borders directly on the base body and the recess.

[0055] According to at least one embodiment of the method, the recess is filled with the sealing material using a dispenser. This means that the sealing material, for example, a heated glass solder, is introduced into the recess using a dispenser. The sealing material is introduced into the recess, for example, as a paste that completely surrounds the sides of the optoelectronic semiconductor chip.

[0056] According to at least one embodiment of the method, the closure material hardens after application.

[0057] For example, the sealing material is softened glass solder material which solidifies upon cooling after application.

[0058] Further advantages, advantageous embodiments and further developments will become apparent from the following descriptions in conjunction with the figures.

[0059] From examples.

[0060] Figure 1 shows a schematic sectional view of a first embodiment of an optoelectronic component described here and of a method described here.

[0061] Figure 2 shows a schematic sectional view of a second embodiment of an optoelectronic component described here and of a method described here.

[0062] Figure 3 shows a schematic plan view of an embodiment of an optoelectronic component described here.

[0063] In the exemplary embodiments and figures, identical, similar, or similarly acting elements may be provided with the same reference numerals. The illustrated elements and their relative sizes are not to be considered true to scale; rather, individual elements, such as layers, components, structural elements, and regions, may be exaggerated for clarity and / or clarity.

[0064] Figure 1 shows a schematic sectional view of a first exemplary embodiment of an optoelectronic component described here. The optoelectronic component has a base body 1 which is formed, for example, from a ceramic material. The base body 1 defines a cavity 6 of the optoelectronic component, in which cavity an optoelectronic semiconductor chip 2 is applied to the base body. The optoelectronic semiconductor chip 2 is, for example, a light-emitting diode or, as shown in Figure 1, an edge-emitting laser diode. The optoelectronic semiconductor chip 2 can, for example, be mounted on a mounting body 8 which can also comprise a control device for operating the semiconductor chip 2. Mounting on such a mounting body 8 is, however, optional.

[0065] The optoelectronic component further comprises a cover 3 for the optoelectronic semiconductor chip 2. The cover 3 is designed to be permeable to the electromagnetic radiation generated by the optoelectronic semiconductor chip 2 during operation, in this case the laser radiation 21.

[0066] During operation, the laser radiation 21 leaves the optoelectronic component through the cover 3. This can be achieved, for example, by an optical deflection element 7 - for example a prism. The optical deflection element 7 can also be fastened to the base body 1. The base body 1 and the cover 3 are in direct contact with one another in places in a contact region 31. The contact region 31 between the base body 1 and the cover 3 completely surrounds the cavity 6 and the optoelectronic semiconductor chip 2 incorporated therein.

[0067] The base body 1 has a projection 1a which projects vertically beyond the contact region 31 between the base body 1 and the cover 3. As a result, a recess 4 is formed between the base body 1 and the cover 3, which recess laterally surrounds the optoelectronic semiconductor chip 2. A sealing material 5 which is free of organic material and which directly borders the base body and the cover is introduced into the recess 4.

[0068] The recess 4 is therefore laterally delimited by the base body 1 and the cover 3. The sealing material 5 is preferably introduced into the recess in such a way that it does not project vertically beyond either the base body 1 or the cover 3. The optoelectronic semiconductor chip 2 is preferably hermetically encapsulated by the sealing material 5, the cover 3, and the base body 1, so that no air or moisture from the outside can penetrate into the cavity 6 and thus reach the optoelectronic semiconductor chip.

[0069] The base body 1 is formed, for example, from a ceramic material, the cover 3 is formed, for example, from glass, and the sealing material 5 is formed, for example, from a glass solder. The cover 3 can be formed, for example, from a borosilicate glass such as the material BF33. The base body 1 is then formed, for example, from Al2O3 and / or aluminum.

[0070] The glass solder is selected such that its thermal expansion coefficient is greater than the thermal expansion coefficient of the cover 3 and / or the base body 1. The thermal expansion coefficient of the cover 3 is smaller than the thermal expansion coefficient of the base body.

[0071] Overall, this ensures that the closure material 5 is under compressive stress, which leads to a particularly tight connection between the closure material and the adjacent base body and the adjacent cover.

[0072] In the method described here, the sealing material 5 is introduced into the recess 4 between the base body 1 and the cover 3 by means of a dispenser 9. During the introduction, the sealing material 5 is softened and solidifies after being introduced into the recess 4.

[0073] In conjunction with the schematic sectional view of Figure 2, a further exemplary embodiment of the optoelectronic component described here is shown. In contrast to the exemplary embodiment of Figure 1, the cover 3 in this exemplary embodiment is designed as a cap. The cover 3 thus defines the cavity 6 in which the semiconductor chip 2 is arranged.

[0074] The optoelectronic component of Figure 2 emits electromagnetic radiation, for example, laterally in directions parallel to the main extension direction of the optoelectronic component. For this purpose, the optoelectronic semiconductor chip 2 can be mounted, for example, on a mounting body 8, which can also comprise a control device for operating the semiconductor chip 2. However, mounting on such a mounting body 8 is optional and can be carried out or omitted, as in the embodiment of Figure 1.

[0075] In the embodiment of Figure 2, the cover 3 projects vertically beyond the closure material 5 and the base body 1. The base body 1, in turn, has a projection 1a that projects vertically beyond the contact area 31 between the cover 3 and the base body 1.

[0076] The schematic plan view of Figure 3 shows an exemplary embodiment of an optoelectronic component described here from above, i.e., in a view of the main extension plane of the component. These may, for example, be exemplary embodiments such as those schematically illustrated in Figures 1 and 2. Figure 3 shows, for example, that the sealing material 5 completely surrounds the semiconductor chip 2 laterally.

[0077] The features and embodiments described in conjunction with the figures can be combined with one another according to further embodiments, even if not all combinations are explicitly described. Furthermore, the embodiments described in conjunction with the figures can alternatively or additionally comprise further features according to the description in the general part. This patent application claims priority from German patent application 102023131804.7, the disclosure of which is hereby incorporated by reference.

[0078] The invention is not limited to the embodiments by the description. Rather, the invention encompasses any novel feature and any combination of features, including, in particular, any combination of features in the patent claims, even if this feature or combination itself is not explicitly stated in the patent claims or embodiments.

[0079] Reference symbol list

[0080] 1 base body la projection 2 optoelectronic semiconductor chip

[0081] 21 Laser radiation

[0082] 3 Cover

[0083] 31 Contact area

[0084] 4 Recess 5 Closure material

[0085] 6 Cavity

[0086] 7 Deflection element

[0087] 8 mounting bodies

[0088] 9 dispensers

Claims

Patent claims 1. Optoelectronic component with a base body (1), an optoelectronic semiconductor chip (2) on the base body (1), a cover (3) for the optoelectronic semiconductor chip (2), wherein - the base body (1) and the cover (3) are in direct contact with each other in places, - a recess (4) is arranged between the base body (1) and the cover (3), which laterally surrounds the optoelectronic semiconductor chip (2), and - the recess (4) is filled with a sealing material (5) which is free of organic material and which directly borders the base body (1) and the cover (3).

2. Optoelectronic component according to the preceding claim, wherein the recess (4) is laterally delimited by the base body (1) and the cover (3).

3. Optoelectronic component according to at least one of the preceding claims, in which a cavity (6) is formed between the base body (1) and the cover (3), which cavity is sealed by the base body (1), the cover (3) and the sealing material (5).

4. Optoelectronic component according to the preceding claim, wherein the optoelectronic semiconductor chip (2) is arranged in the cavity (6).

5. Optoelectronic component according to at least one of the preceding claims, wherein the base body (1) has a first thermal expansion coefficient and the cover (3) has a second thermal expansion coefficient and the first thermal expansion coefficient is greater than the second thermal expansion coefficient.

6. Optoelectronic component according to the preceding claim, wherein the sealing material (5) has a third thermal expansion coefficient which is greater than the second thermal expansion coefficient.

7. Optoelectronic component according to at least one of the two preceding claims, wherein the sealing material (5) has a third thermal expansion coefficient which is greater than the first thermal expansion coefficient.

8. Optoelectronic component according to at least one of the preceding claims, wherein the base body (1) is formed with a ceramic material.

9. Optoelectronic component according to at least one of the preceding claims, wherein the cover (3) is formed with a glass.

10. Optoelectronic component according to at least one of the preceding claims, in which the sealing material (5) is formed with a glass solder.

11. A method for producing an optoelectronic component comprising the steps: Providing a base body (1), Attaching an optoelectronic semiconductor chip (2) to the base body (1), Applying a cover (3) for the optoelectronic semiconductor chip (2) to the base body (1), wherein - the base body (1) and the cover (3) are brought into direct contact with each other at certain points, - a recess (4) is formed between the base body (1) and the cover (3), which laterally surrounds the optoelectronic semiconductor chip (2), and - the recess (4) is filled with a sealing material (5) which is free of organic material and which directly borders the base body (1) and the recess (3).

12. Method according to the preceding claim, wherein the filling of the recess (4) with the sealing material (5) takes place by means of a dispenser (9).

13. Method according to the preceding claim, wherein the closure material (5) hardens after application.

14. Method according to one of the three preceding claims, wherein an optoelectronic component according to at least one of claims 1 to 10 is produced.

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