Electroplating method and electroplating apparatus

Abstract

An electroplating method and an electroplating apparatus, which relate to the technical field of semiconductor processing. The electroplating method comprises: S10, applying a positive voltage to an intermediate anode, and an edge electrode not operating; S20, acquiring a deposition rate v1 of a plating layer of an intermediate region, and acquiring a deposition rate v2 of a plating layer of an edge region; S30, determining the magnitudes of v1 and v2; S40, if v1 is greater than v2, applying the positive voltage to the edge electrode, and outputting a current I; S50, if v1 is less than v2, applying a negative voltage to the edge electrode, and outputting the current I; and S60, if v1 is equal to v2, keeping an operating state of the edge electrode unchanged. By means of respectively acquiring deposition rates of plating layers of an intermediate region and an edge region, and controlling the voltage and current of an edge electrode accordingly, the deposition rate of the edge region can be dynamically adjusted, such that the deposition rates of the edge region and the intermediate region can be balanced in real time, thereby improving the uniformity of electroplating.

Description

Electroplating method and electroplating device Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and more particularly, to an electroplating method and an electroplating device. Background Art

[0002] In the field of electroplating, a seed layer is a thin layer of metal formed on the surface of a substrate through chemical or physical methods. The seed layer is an essential step in the electroplating process, guiding and promoting metal deposition. To increase the effective plating area, existing electroplating equipment only makes electrical contact with the seed layer on the substrate at its edges, with no direct contact in the center.

[0003] The higher the resistivity of the seed layer material and the thinner the thickness, the greater the resistance and the greater the difference in current density distribution. Because the electrical contact is located at the edge of the substrate, the current density at the edge of the substrate is much greater than that in the center of the substrate. This uneven current density distribution can cause the coating to be thick at the edges and thin in the center, resulting in severe unevenness.

[0004] The current solution to this problem is to use electroplating equipment with multiple anodes, each of which is independently controlled. Based on the differences in coating thickness determined by pre-experimental experiments, a preset program controls the power of each anode during the electroplating process. However, this solution has poor adaptability and can only be used for specific seed layers. After the seed layer is replaced, the program must be reset.

[0005] Summary of the Invention

[0006] In order to solve the above problems existing in the prior art, the present invention provides an electroplating method and an electroplating device.

[0007] The present invention solves the above technical problems through the following technical solutions:

[0008] An electroplating method includes providing an electroplating device, the electroplating device including a central anode and an edge electrode, the central anode corresponding to the central region of a substrate, the edge electrode corresponding to the edge region of the substrate, and the electroplating method further comprising:

[0009] S10, applying a positive voltage to the middle anode, while the edge electrodes are not in operation;

[0010] S20, obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region;

[0011] S30, determining the sizes of v1 and v2;

[0012] S40, if v1>v2, applying a positive voltage to the edge electrode and outputting a current I;

[0013] S50, if v1 < v2, applying a negative voltage to the edge electrode and outputting a current I;

[0014] S60: If v1=v2, keep the working state of the edge electrode unchanged.

[0015] The above method first applies a positive voltage to the middle anode, and the edge electrodes do not work. By respectively obtaining the deposition rates of the coating in the middle area and the edge area, the difference in deposition rates between the edge area and the middle area can be known. Based on this difference, the voltage and output current of the edge electrode are controlled, so that the coating thickness in the middle area and the edge area of ​​the substrate are closer, thereby improving the uniformity of electroplating.

[0016] The present invention further provides an electroplating device, comprising: an electroplating tank for containing an electroplating solution; and

[0017] a middle anode disposed in the electroplating solution and corresponding to a middle region of the substrate;

[0018] a middle power supply connected to the edge region of the substrate and the middle anode, for applying a positive voltage to the middle anode and a negative voltage to the substrate;

[0019] an edge electrode, disposed around the periphery of the middle electrode and corresponding to an edge region of the substrate;

[0020] an edge power supply connected to the clamping area and the edge electrode of the substrate;

[0021] A middle rate detection module, used to obtain a coating deposition rate v1 in a middle area of ​​the substrate;

[0022] An edge rate detection module, configured to obtain a coating deposition rate v2 of an edge region of the substrate;

[0023] The control module is used to compare the magnitudes of v1 and v2, and control the positive and negative voltage and the magnitude of the current applied by the edge power supply to the edge electrode according to the comparison result.

[0024] The above-mentioned electroplating device is provided with a central power supply and an edge power supply. The central power supply can independently supply power to the central anode, and the edge power supply can independently supply power to the edge electrode. The control of the central anode and the edge electrode is relatively independent. By setting the central rate detection module and the edge rate detection module, the coating deposition rate of the central area and the edge area can be obtained in real time. Under the action of the control module, the output of the edge power supply can be intelligently controlled according to the size of v1 and v2, so that v2 always approaches v1 until it is the same as v1. This device can make the coating thickness of the substrate more uniform and can form a closed-loop control. It can also be applied after the resistance of the seed layer changes, and has wider adaptability.

[0025] The present invention further provides an electroplating method, including providing an electroplating device, the electroplating device including a central anode and an edge electrode, the central anode corresponding to the central region of the substrate, and the edge electrode corresponding to the edge region of the substrate, the electroplating method further comprising:

[0026] S1000, applying a positive voltage to the middle anode, applying a positive voltage to the edge electrodes, and outputting a current I;

[0027] S1100, obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region;

[0028] S1200, determine the size of v1 and v2;

[0029] S1300 , if v1>v2, applying a positive voltage to the edge electrode, increasing the output current I, and returning to step S1100 ;

[0030] S1400, if v1=v2, keep the working state of the edge electrode unchanged;

[0031] S1500 : If v1 < v2, apply a positive voltage to the edge electrode and reduce the output current I.

[0032] In the initial step S1000 of the above method, a positive voltage is applied to the edge electrode, and a current I is output. If the substrate seed layer resistance is relatively low, and only the central anode is in operation, v1 will be greater than v2. Therefore, using this method, v2 can be quickly adjusted so that v2 approaches v1 more quickly, thereby accelerating the adjustment speed.

[0033] The present invention further provides an electroplating method, comprising providing an electroplating device, the electroplating device comprising a central anode and an edge electrode, the central anode corresponding to the central region of the substrate, the edge electrode corresponding to the edge region of the substrate, the electroplating method further comprising:

[0034] S2000, applying a positive voltage to the middle anode, applying a negative voltage to the edge electrodes, and outputting a current I;

[0035] S2100, obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region;

[0036] S2200, determine the size of v1 and v2;

[0037] S2300, if v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100;

[0038] S2400, if v1=v2, keep the working state of the edge electrode unchanged;

[0039] S2500 : If v1>v2, apply a negative voltage to the edge electrode and reduce the output current I.

[0040] The method begins with step S2000, where a negative voltage is applied to the edge electrode and a current I is output. If the substrate's seed layer has a relatively high resistance, and only the central anode is operational, v2 will be greater than v1. Therefore, this method allows for rapid adjustment of v2, allowing it to more quickly approach v1, thereby accelerating the adjustment process.

[0041] Summary of the Figures

[0042] The features and properties of the present invention are further described by the following examples and accompanying drawings.

[0043] FIG1A is a schematic diagram of an electroplating device according to Example 1 of the present invention;

[0044] FIG1B is a schematic diagram of the division of different regions of a wafer according to Example 1 of the present invention;

[0045] FIG2 is a schematic diagram of the electric field when the edge electrode of Example 1 of the present invention is at a positive voltage;

[0046] FIG3 is a schematic diagram of the electric field when the edge electrodes of Example 1 of the present invention are turned off;

[0047] FIG4 is a schematic diagram of the electric field when the edge electrode is at a negative voltage according to Example 1 of the present invention;

[0048] FIG5 is a schematic diagram of a middle rate detection module according to Example 1 of the present invention;

[0049] FIG6 is a schematic diagram of a middle thickness detector according to Example 1 of the present invention;

[0050] FIG7 is a schematic diagram of an edge rate detection module according to Embodiment 1 of the present invention;

[0051] FIG8 is a schematic diagram of an edge thickness detector according to Example 1 of the present invention;

[0052] FIG9 is a schematic diagram of the distribution of the middle eddy current sensors and the edge eddy current sensors according to Example 1 of the present invention;

[0053] FIG10 is a flow chart of an electroplating method according to Example 2 of the present invention;

[0054] FIG11 is a flow chart of an electroplating method according to Example 3 of the present invention;

[0055] FIG12 is a flow chart of the electroplating method according to embodiment 4 of the present invention.

[0056] Preferred embodiments of the present invention

[0057] To illustrate the technical content, structural features, achieved objectives and effects of the present invention in detail, embodiments will be described below in conjunction with drawings, but the present invention is not limited to the scope of the embodiments.

[0058] Example 1

[0059] In electroplating equipment with multiple anodes, different anodes can be controlled independently or collectively. Current control methods are all open-loop control, lacking feedback capabilities. This makes it impossible to adjust the output power of different anodes in real time based on the coating thickness, and thus prevents closed-loop control. Therefore, when the seed layer is replaced, the control program needs to be adjusted to accommodate the new seed layer, resulting in poor adaptability. Furthermore, during the electroplating process, changes in coating thickness cannot be detected in real time, making coating uniformity uncontrollable.

[0060] As shown in Figures 1A, 1B, and 2, this embodiment provides an electroplating apparatus capable of adjusting the output power of an edge electrode 400 in real time based on the deposition rate of the coating. The apparatus comprises: an electroplating tank 150, a cathode fixture 100, a central anode 200, a central power supply 300, an edge electrode 400, an edge power supply 500, a central rate detection module 600, an edge rate detection module 700, and a control module 800. The electroplating tank 150 is used to contain the electroplating solution. The cathode fixture 100 is used to clamp a substrate 910. The substrate 910 includes a central region 913, an edge region 912, and a clamping region 911. The central anode 200 is disposed in the electroplating solution and corresponds to the central region 913 of the substrate 910. The negative electrode of the central power supply 300 is connected to the clamping region 911 of the substrate 910 via the cathode fixture 100, thereby applying a negative voltage to the substrate 910. The positive electrode of the central power supply 300 is connected to the central anode 200 for applying a positive voltage to the central anode 200. The edge electrode 400 is disposed around the periphery of the central anode 200 and corresponds to the edge region 912 of the substrate 910. The edge power supply 500 is connected to the clamping region 911 of the substrate 910 via the cathode fixture 100. Furthermore, the edge power supply 500 is also connected to the edge electrode 400 for applying a positive or negative voltage to the edge electrode 400. The central rate detection module 600 is used to obtain the coating deposition rate v1 in the central region 913 of the substrate 910. The edge rate detection module 700 is used to obtain the coating deposition rate v2 in the edge region 912 of the substrate 910. The control module 800 is used to compare v1 and v2 and, based on the comparison results, control the voltage and current applied by the edge power supply 500 to the edge electrode 400.

[0061] In other embodiments, the central power supply 300 and the edge power supply 500 may also be directly connected to the clamping area 911 of the substrate 910 .

[0062] The electroplating device is provided with a central power supply 300 and an edge power supply 500. The central power supply 300 can independently supply power to the central anode 200, and the edge power supply 500 can independently supply power to the edge electrode 400. The control of the central anode 200 and the edge electrode 400 is relatively independent. By setting the central rate detection module 600 and the edge rate detection module 700, the coating deposition rate of the central area 913 and the edge area 912 can be obtained in real time. Under the action of the control module 800, the output of the edge power supply 500 can be intelligently controlled according to the size of v1 and v2, so that v2 always approaches v1 until it is the same as v1. Through this control method, the electroplating device can make the coating thickness of the substrate 910 more uniform, and can form a closed-loop control. It can also be applied after the resistance of the seed layer changes, and has wider adaptability.

[0063] 1B and 2 , in order to increase the area of ​​the effective electroplating area, the middle power supply 300 and the edge power supply 500 of the electroplating device supply power to the seed layer 920 on the substrate 910 through the contact pin 930 of the cathode fixture 100. The contact position between the contact pin 930 and the seed layer 920 is located in the clamping area 911 of the substrate 910. The greater the resistance of the seed layer 920, the more severe the edge effect of the substrate 910. For example, when the seed layer is made of cobalt material, due to the poor conductivity of cobalt, the electric field strength in the edge area 912 of the substrate 910 will be much greater than that in the middle area 913, which will make the current density in the edge area 912 of the substrate 910 much greater than that in the middle area 913, resulting in the coating thickness in the edge area 912 of the substrate 910 being higher than the coating thickness in the middle area 913 of the substrate 910.

[0064] A positive voltage is typically applied to the edge electrode 400 to improve the edge effect by providing an appropriate current. However, as shown in FIG3 , when the resistance of the seed layer 920 is particularly large, even if the edge electrode 400 corresponding to the edge region 912 of the substrate 910 is not operating, that is, the output current of the edge power supply 500 is reduced to zero, the electric field strength in the edge region 912 of the substrate 910 will still be greater than the electric field strength in the central region 913 of the substrate 910, and the coating in the edge region 912 of the substrate 910 will still be thicker than the coating in the central region 913 of the substrate 910. To address this situation, the edge power supply 500 in this embodiment can also apply a negative voltage to the edge electrode 400. The voltages of the edge electrode 400 and the central anode 200 are both referenced to the substrate potential, for example, the substrate potential is considered to be zero.

[0065] The edge power supply 500 can apply positive and negative voltages to the edge electrode 400, and can adapt to seed layers with different resistance values. When the resistance of the seed layer 920 of the substrate 910 is small, the edge power supply 500 applies a positive voltage to the edge electrode 400, and the electric field lines are relatively evenly distributed in the edge region 912 and the middle region 913 of the substrate 910. Specifically, the electric field line density (i.e., the electric field strength) of the edge region 912 of the substrate 910 is slightly greater than that of the middle region 913. In this case, it is only necessary to reduce the output current of the edge power supply 500 to regulate the electric field line density of the edge region 912 and the middle region 913 of the substrate 910, so as to achieve the same coating deposition rate in the two regions. The greater the resistance of the seed layer 920 of the substrate 910, the greater the difference in the distribution of electric field lines between the central region 913 and the edge region 912 of the substrate 910. When the resistance of the seed layer 920 of the substrate 910 reaches a certain level, even if the edge power supply 500 stops outputting current when applying a positive voltage to the edge electrode 400, the difference in the deposition rate of the coating between the edge region 912 and the central region 913 cannot be balanced. In this case, as shown in FIG4 , the edge power supply 500 can apply a negative voltage to the edge electrode 400 to absorb a portion of the electric field lines emitted by the central anode 200 to the edge region 912 of the substrate 910, further reducing the deposition rate of the coating in the edge region 912, thereby making the coating more uniform in the central region 913 and the edge region 912 of the substrate 910.

[0066] It should be noted that FIG. 2 , FIG. 3 and FIG. 4 are only used to illustrate the distribution of electric field lines when the edge electrode 400 is in different states, and do not represent the actual electric field distribution.

[0067] As shown in Figure 5, the middle rate detection module 600 includes a middle thickness detector 610 and a middle rate calculation module 620. The middle thickness detector 610 is used to obtain the thickness value of the coating in the middle area of ​​the substrate 910, and the middle rate calculation module 620 is used to calculate the deposition rate of the coating in the middle area of ​​the substrate 910 based on the thickness value of the coating in the middle area of ​​the substrate 910 and the detection frequency of the middle thickness detector 610.

[0068] Further, as shown in Figures 6 and 9, the middle thickness detector 610 includes a plurality of middle eddy current sensors 611 and a middle thickness calculation module 612. The middle eddy current sensors 611 are spaced apart on the non-electroplated surface of the middle area 913 of the substrate 910. The middle thickness calculation module 612 is connected to the middle eddy current sensor 611. The middle thickness calculation module 612 is used to receive the electrical signal of the middle eddy current sensor 611 and output the average thickness value of the coating in the middle area 913 of the substrate 910.

[0069] As shown in Figure 7, the edge rate detection module 700 includes an edge thickness detector 710 and an edge rate calculation module 720. The edge thickness detector 710 is used to obtain the thickness value of the coating in the edge area of ​​the substrate 910, and the edge rate calculation module 720 is used to calculate the deposition rate of the coating in the edge area of ​​the substrate 910 based on the thickness value of the coating in the edge area of ​​the substrate 910 and the detection frequency of the edge thickness detector 710.

[0070] 8 and 9 , the edge thickness detector 710 includes a plurality of edge eddy current sensors 711 and an edge thickness calculation module 712. The edge eddy current sensors 711 are spaced apart on the non-electroplated surface of the edge region 912 of the substrate 910. The edge thickness calculation module 712 is connected to the edge eddy current sensors 711 and is configured to receive electrical signals from the edge eddy current sensors 711 and output an average thickness value of the plating layer in the edge region 912 of the substrate 910.

[0071] Specifically, the middle thickness detector 610 and the edge thickness detector 710 are both connected to a power supply via slip rings, and the power supply is used to supply power to the middle thickness detector 610 and the edge thickness detector 710 , thereby maintaining synchronous rotation with the substrate 910 .

[0072] The control module 800 , the middle thickness calculation module and the edge thickness calculation module 712 may be implemented by software, hardware or a combination of software and hardware.

[0073] In addition, the specific implementation of the middle rate detection module 600 and the edge rate detection module 700 is not limited to the solution in this embodiment, and a more mature solution in the existing technology can also be adopted.

[0074] Example 2

[0075] This embodiment also provides an electroplating method, using an electroplating apparatus including a central anode and an edge electrode, wherein the central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. An exemplary electroplating apparatus is shown in FIG1 , although the implementation environment of the electroplating method of this embodiment is not limited thereto.

[0076] 10 , the electroplating method of this embodiment specifically includes:

[0077] S10. A positive voltage is applied to the middle anode, and the edge electrodes are not working.

[0078] S20 , obtaining a deposition rate v1 of the coating in the middle region of the substrate, and obtaining a deposition rate v2 of the coating in the edge region of the substrate.

[0079] S30: Determine the sizes of v1 and v2.

[0080] S40 , if v1>v2, a positive voltage is applied to the edge electrode, and a current I is output.

[0081] S50 : If v1 < v2 , a negative voltage is applied to the edge electrode, and a current I is output.

[0082] S60: If v1 = v2, the working state of the edge electrode remains unchanged, that is, the voltage and output current I of the edge electrode are not adjusted.

[0083] The output current I in steps S40 and S50 is an initial preset value, which can be the same or different. The output current I in subsequent steps is a current value after changing based on the initial preset value.

[0084] The central anode and edge electrodes can be used to control the deposition rates of the coating in the central and edge regions of the substrate, respectively. In this method, a positive voltage is first applied to the central anode, while the edge electrodes are deactivated. By measuring the deposition rates of the coating in the central and edge regions, the difference in deposition rates between the edge and central regions can be determined. Based on this difference, the voltage and output current of the edge electrodes are controlled, bringing the coating thicknesses in the central and edge regions of the substrate closer together, thereby improving electroplating uniformity.

[0085] Among them, v1=v2 can be set with a deviation according to actual usage requirements, that is, the difference between v1 and v2 can be regarded as v1=v2 within a preset range.

[0086] After step S40, the following steps are also included:

[0087] S41. Get v1 and v2.

[0088] S42. Determine the sizes of v1 and v2.

[0089] S43. If v1 < v2, apply a positive voltage to the edge electrode and reduce the output current I.

[0090] S45. If v1=v2, the working state of the edge electrode remains unchanged.

[0091] S46 , if v1 > v2 , apply a positive voltage to the edge electrode, increase the output current I, and then return to step S41 .

[0092] After step S43, the method further includes:

[0093] S44. Determine whether the output current I is 0. If I is not equal to 0, return to step S41; if I is equal to 0, return to step S30.

[0094] By adopting a closed-loop control method, the voltage and output current I of the edge electrode can be dynamically adjusted according to the size of v1 and v2 until v1=v2, thereby further improving the uniformity of substrate electroplating. In step S43, v2 can be reduced by reducing the output current I. In step S44, if the output current I is not equal to 0, return to step S41, and when a positive voltage is applied to the edge electrode, change the size of v2 by controlling the size of the output current I until v1=v2. If the output current I is equal to 0, it means that the edge electrode has stopped working, and v1 may still be less than v2. In this case, it is necessary to return to step S30, and v2 can be further adjusted by changing the positive and negative voltage of the edge electrode.

[0095] After step S50, the following steps are also included:

[0096] S51. Obtain v1 and v2.

[0097] S52. Determine the sizes of v1 and v2.

[0098] S53 : If v1 < v2 , a negative voltage is applied to the edge electrode and the output current I is increased.

[0099] S54. If v1=v2, the working state of the edge electrode is kept unchanged.

[0100] S55 . If v1 > v2 , a negative voltage is applied to the edge electrode and the output current I is reduced.

[0101] In this embodiment, after step S55, the following steps are further included:

[0102] S56. Determine whether the output current I is 0. If I is not equal to 0, return to step S51; if I is equal to 0, return to step S30.

[0103] In step S50, by applying a negative voltage to the edge electrode, a portion of the electric field of the middle anode can be transferred, thereby reducing v2. After step S50, by obtaining the sizes of v1 and v2 again and adjusting the size of the output current I according to the sizes of v1 and v2, v2 can be dynamically adjusted so that v1 can be equal to v2. And, in step S56, if I is not equal to 0, then return to step S51 and re-dynamically adjust; if I is equal to 0, it means that the edge electrode has stopped working, and v1 may still be greater than v2. In this case, it is necessary to return to step S30 so that the edge electrode can be controlled to switch from a negative voltage to a positive voltage to further adjust v2.

[0104] In this embodiment, the step of obtaining the deposition rate v1 of the coating in the middle region in step S20 specifically includes:

[0105] S21, arranging a middle thickness detector on the non-electroplating surface in the middle area;

[0106] S22. Calculate v1 using the thickness value output by the middle thickness detector and the detection frequency of the middle thickness detector.

[0107] Specifically, the detection frequency refers to the number of thickness measurements per second performed by the central thickness detector. For example, a detection frequency of 10 Hz means the detector can perform 10 thickness measurements per second. v1 can be calculated by multiplying the difference between the two thickness outputs by the detection frequency.

[0108] Furthermore, the central thickness detector includes multiple central eddy current sensors and a central thickness calculation module. The central thickness calculation module uses a standard sample to obtain the corresponding relationship between the electrical signals output by the central eddy current sensors and the coating thickness. The central thickness calculation module receives the electrical signals output by the multiple central eddy current sensors and outputs a thickness value by averaging the corresponding relationship between the electrical signals output by the central eddy current sensors and the coating thickness.

[0109] In this embodiment, the step of obtaining the deposition rate v2 of the coating in the edge area in step S20 specifically includes:

[0110] S23. Arrange an edge thickness detector on the non-electroplating surface of the edge area.

[0111] S24. Calculate v2 using the thickness value output by the edge thickness detector and the detection frequency of the edge thickness detector.

[0112] The calculation principle of v2 is the same as that of v1.

[0113] Furthermore, the edge thickness detector includes multiple edge eddy current sensors and an edge thickness calculation module. The correspondence between the electrical signals output by the edge eddy current sensors and the coating thickness is obtained through standard samples. The edge thickness calculation module receives the electrical signals output by the multiple edge eddy current sensors and outputs the thickness value based on this correspondence and by taking the average value.

[0114] The method for obtaining the deposition rate v1 of the coating in the middle area and the deposition rate v2 of the coating in the edge area is not limited thereto, and a more mature electroplating deposition rate detection technology in the prior art may also be used.

[0115] Example 3

[0116] Referring to FIG11 , this embodiment provides an electroplating method, which includes:

[0117] S1000 , applying a positive voltage to the middle anode, applying a positive voltage to the edge electrodes, and outputting a current I.

[0118] S1100 , obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region.

[0119] S1200: Determine the sizes of v1 and v2.

[0120] S1300 , if v1>v2, apply a positive voltage to the edge electrode, increase the output current I, and return to step S1100 .

[0121] S1400 , if v1=v2, keep the working state of the edge electrode unchanged.

[0122] S1500 , if v1 < v2, apply a positive voltage to the edge electrode and reduce the output current I.

[0123] Unlike Example 2, in this embodiment, in the initial step S1000, a positive voltage is applied to the edge electrode and a current I is output. If the substrate seed layer resistance is relatively low, assuming only the central anode is in operation, v1 will be greater than v2. Therefore, using this method, v2 can be quickly adjusted so that v2 approaches v1 more quickly, thereby accelerating the adjustment speed.

[0124] The subsequent control logic is similar to that in Example 2 and will not be explained again here.

[0125] After step S1500, the following steps are also included:

[0126] S1600 , determining whether the output current I is 0; if I is not equal to 0, returning to step S1100 ; if I is equal to 0, executing step S1700 , applying a negative voltage to the edge electrode, and outputting current I.

[0127] After step S1700, the following steps are also included:

[0128] S1710. Obtain v1 and v2.

[0129] S1720: Determine the sizes of v1 and v2.

[0130] S1730 , if v1 < v2 , apply a negative voltage to the edge electrode and increase the output current I, then return to step S1710 .

[0131] S1740: If v1=v2, keep the working state of the edge electrode unchanged.

[0132] S1750: If v1>v2, apply a negative voltage to the edge electrode and reduce the output current I.

[0133] After step S1750, the method further includes:

[0134] S1760, determine whether the output current I is 0. If I is not equal to 0, return to step S1710; if I is equal to 0, return to step S1000.

[0135] Example 4

[0136] 12 , this embodiment provides an electroplating method, which includes:

[0137] S2000 , applying a positive voltage to the middle anode, applying a negative voltage to the edge electrodes, and outputting a current I.

[0138] S2100 , obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region.

[0139] S2200: Determine the sizes of v1 and v2.

[0140] S2300 , if v1 < v2 , apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100 .

[0141] S2400: If v1=v2, keep the working state of the edge electrode unchanged.

[0142] S2500 , if v1>v2, apply a negative voltage to the edge electrode and reduce the output current I.

[0143] Unlike Example 2, in this embodiment, in the initial step S2000, a negative voltage is applied to the edge electrode and a current I is output. If the substrate seed layer has a relatively high resistance, assuming only the central anode is in operation, v2 will be greater than v1. Therefore, using this method, v2 can be quickly adjusted so that v2 approaches v1 more quickly, thereby accelerating the adjustment speed.

[0144] The subsequent control logic is similar to that in Example 2 and will not be explained again here.

[0145] After step S2500, the method further includes:

[0146] S2600, determine whether the output current I is 0. If I is not equal to 0, return to step S2100; if I is equal to 0, execute step S2700, apply a positive voltage to the middle anode, apply a positive voltage to the edge electrode, and output current I.

[0147] After step 2700, the following steps are also included:

[0148] S2710. Obtain v1 and v2.

[0149] S2720: Determine the sizes of v1 and v2.

[0150] S2730: If v1>v2, apply a positive voltage to the edge electrode and increase the output current I, then return to step S2710.

[0151] S2740: If v1 = v2, keep the working state of the edge electrode unchanged.

[0152] S2750: If v1 < v2, apply a positive voltage to the edge electrode and reduce the output current I.

[0153] After step S2750, the method further includes:

[0154] S2760, determine whether the output current I is 0, if I=0, return to step S2000; if I is not equal to 0, return to step S2710.

[0155] Although the above describes specific embodiments of the present invention, it should be understood by those skilled in the art that these are merely illustrative and that various changes or modifications may be made to these embodiments without departing from the principles and essence of the present invention. Therefore, the scope of protection of the present invention is defined by the appended claims.

Claims

1. An electroplating method, characterized in that: Including providing an electroplating device, the electroplating device includes a central anode and an edge electrode, the central anode corresponds to the central region of the substrate, the edge electrode corresponds to the edge region of the substrate, and the electroplating method further includes: S10. Apply a positive voltage to the central anode, and the edge electrode is not working; S20. Obtain the deposition rate v1 of the coating in the central region, and obtain the deposition rate v2 of the coating in the edge region; S30. Judge the magnitudes of v1 and v2; S40. If v1 > v2, apply a positive voltage to the edge electrode and output a current I; S50. If v1 < v2, apply a negative voltage to the edge electrode and output a current I; S60. If v1 = v2, keep the working state of the edge electrode unchanged.

2. The electroplating method according to claim 1, characterized in that: After the step S40, it further includes: S41. Obtain v1 and v2; S42. Judge the magnitudes of v1 and v2; S43. If v1 < v2, apply a positive voltage to the edge electrode and reduce the output current I; S45. If v1 = v2, keep the working state of the edge electrode unchanged; S46. If v1 > v2, apply a positive voltage to the edge electrode and increase the output current I, and then return to step S41.

3. The electroplating method according to claim 2, characterized in that: After the step S43, it further includes: S44. Judge whether the output current I is 0. If I is not equal to 0, return to step S41. If I is equal to 0, return to step S30.

4. The electroplating method according to claim 1, wherein: After the step S50, it further includes: S51. Obtain v1 and v2; S52. Judge the magnitudes of v1 and v2; S53. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I; S54. If v1 = v2, keep the working state of the edge electrode unchanged; S55. If v1 > v2, apply a negative voltage to the edge electrode and reduce the output current I.

5. The electroplating method according to claim 4, characterized in that: After the step S55, it further includes: S56. Judge whether the output current I is 0. If I is not equal to 0, return to step S51. If I is equal to 0, return to step S30.

6. The electroplating method according to claim 1, wherein: The step S20 specifically includes: Arrange a central thickness detector on the non-electroplating surface of the central region; Calculate v1 through the thickness value output by the central thickness detector and the detection frequency of the central thickness detector; Arrange an edge thickness detector on the non-electroplating surface of the edge region; Calculate v2 through the thickness value output by the edge thickness detector and the detection frequency of the edge thickness detector.

7. The electroplating method according to claim 6, characterized in that: The central thickness detector includes a plurality of central eddy current sensors and a central thickness calculation module. The method includes: obtaining the correspondence between the electrical signal output by the central eddy current sensors and the coating thickness through a standard sample. The central thickness calculation module receives the electrical signals output by the plurality of central eddy current sensors and outputs a thickness value by taking the average according to the correspondence. The edge thickness detector includes multiple edge eddy current sensors and an edge thickness calculation module. The method includes: obtaining the correspondence between the electrical signal output by the edge eddy current sensor and the coating thickness through a standard sample, the edge thickness calculation module receives the electrical signals output by the multiple edge eddy current sensors and outputs the thickness value by taking the average value according to the correspondence.

8. An electroplating device, comprising an electroplating tank, the electroplating tank being used to contain an electroplating solution, characterized in that: The electroplating device also includes: A middle anode, disposed in the electroplating solution and corresponding to a middle region of the substrate; a middle power supply connected to the clamping area of ​​the substrate and the middle anode, for applying a positive voltage to the middle anode and a negative voltage to the substrate; an edge electrode, disposed around the periphery of the middle electrode and corresponding to an edge region of the substrate; an edge power supply connected to the clamping area and the edge electrode of the substrate; A middle rate detection module, used to obtain a coating deposition rate v1 in a middle area of ​​the substrate; An edge rate detection module, used to obtain a coating deposition rate v2 of an edge area of ​​the substrate; A control module is used to compare the magnitudes of v1 and v2 and control the edge power supply according to the comparison result. The voltage and current applied to the edge electrode are positive and negative.

9. The electroplating device according to claim 8, characterized in that: The middle rate detection module comprises: The middle thickness detector is used to obtain the thickness value of the coating; The middle rate calculation module is used to calculate the deposition rate of the coating in the middle area according to the thickness value and the detection frequency of the middle thickness detector.

10. The electroplating device according to claim 9, characterized in that: The middle thickness detector comprises: A plurality of middle eddy current sensors are spaced apart and distributed on the non-electroplated surface in the middle region of the substrate; The middle thickness calculation module is connected to the plurality of middle eddy current sensors, and is used to receive electrical signals from the plurality of middle eddy current sensors and output an average thickness value of the middle area.

11. The electroplating device according to claim 8, characterized in that: The edge rate detection module comprises: Edge thickness detector, used to obtain the thickness value of the coating; The edge rate calculation module is used to calculate the deposition rate of the coating in the edge area according to the thickness value and the detection frequency of the edge thickness detector.

12. The electroplating device according to claim 11, characterized in that: The edge thickness detector comprises: A plurality of edge eddy current sensors are spaced apart and distributed on the non-electroplated surface of the edge region of the substrate; The edge thickness calculation module is connected to the plurality of edge eddy current sensors and is used to receive electrical signals from the plurality of edge eddy current sensors and output an average thickness value of the edge area.

13. An electroplating method, characterized in that: The invention provides an electroplating device, wherein the electroplating device comprises a central anode and an edge electrode, wherein the central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. The electroplating method further comprises: S1000, applying a positive voltage to the middle anode, applying a positive voltage to the edge electrode, and outputting a current I; S1100, obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region; S1200, determine the size of v1 and v2; S1300, if v1>v2, apply a positive voltage to the edge electrode, increase the output current I, and return to step S1100; S1400. If v1 = v2, keep the operating state of the edge electrode unchanged; S1500. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

14. The electroplating method according to claim 13, wherein: After step S1500, it further includes: S1600. Determine whether the applied current I is 0. If I is not equal to 0, return to step S1100; If I is equal to 0, execute step S1700, apply a negative voltage to the edge electrode, and output the current I.

15. The electroplating method according to claim 14, characterized in that: After step S1700, it further includes: S1710. Obtain v1 and v2; S1720. Determine the magnitudes of v1 and v2; S1730. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S1710; S1740. If v1 = v2, keep the operating state of the edge electrode unchanged; S1750. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

16. The electroplating method according to claim 15, characterized in that: After step S1750, it further includes: S1760. Determine whether the output current I is 0. If I is not equal to 0, return to step S1710; If I is equal to 0, return to step S1000.

17. An electroplating method, characterized in that: It includes providing an electroplating device, the electroplating device includes a central anode and an edge electrode, the central anode corresponds to the central region of the substrate, the edge electrode corresponds to the edge region of the substrate, and the electroplating method further includes: S2000. Apply a positive voltage to the central anode, apply a negative voltage to the edge electrode, and output the current I; S2100. Obtain the deposition rate v1 of the coating in the central region and obtain the deposition rate v2 of the coating in the edge region; S2200. Determine the magnitudes of v1 and v2; S2300. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100; S2400. If v1 = v2, keep the operating state of the edge electrode unchanged; S2500. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

18. The electroplating method according to claim 17, characterized in that: After step S2500, it further includes: S2600. Determine whether the output current I is 0. If I is not equal to 0, return to step S2100; if I is equal to 0, execute step S2700, apply a positive voltage to the central anode, apply a positive voltage to the edge electrode, and output the current I.

19. The electroplating method according to claim 18, characterized in that: After step 2700, it further includes: S2710. Obtain v1 and v2; S2720. Determine the magnitudes of v1 and v2; S2730. If v1 > v2, apply a positive voltage to the edge electrode and increase the output current I, then return to step S2710; S2740. If v1 = v2, keep the operating state of the edge electrode unchanged; S2750. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

20. The electroplating method according to claim 19, characterized in that: After step 2750, it further includes: S2760. Determine whether the output current I is 0. If I = 0, return to step S2000; If I is not equal to 0, return to step S2710.

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