Probe card for power semiconductor for high voltage and high current

Abstract

Disclosed is a probe card for a power semiconductor for high voltage and high current, the probe card being capable of preventing uniform pin force and arc. According to one aspect of the present invention, the probe card for a power semiconductor for high voltage and high current may comprise: a PCB having a through-hole formed on one side thereof so that multiple probe pins pass therethrough and come into contact with a terminal of an object to be tested, thereby forming a test space in which a test is performed; and a pin insert block which is disposed in the through-hole of the PCB and in which some of the multiple probe pins are fixed and supported, wherein the multiple probe pins are fixed to the pin insert block such that each end of the multiple probe pins coming into contact with the terminal is disposed at the same height.

Description

Probe card for power semiconductors for high voltage and high current

[0001] The present invention relates to a probe card for high voltage and high current power semiconductors, and more particularly, to a probe card for high voltage and high current power semiconductors capable of preventing uniform pin force and arcing.

[0002] Typically, semiconductor products must undergo testing before shipment, and this testing is essential. Depending on the characteristics of the semiconductor product, testing is performed using a probe card appropriate for the product.

[0003] A test probe card is an essential component of semiconductor testing, used to establish electrical contact between the tester and the semiconductor device under test. It typically consists of an array of probes or pins that contact specific points on the semiconductor device.

[0004] Meanwhile, although it is common for tests to be conducted at normal voltage and current, there are power semiconductors that are tested under high voltage and high current, and there is a probe card for power semiconductors, that is, a high voltage-high current power semiconductor, to inspect them.

[0005] When conducting wafer-level testing of power semiconductors (SiC), the probe card currently being used is a cantilever type probe card.

[0006] The cantilever type power semiconductor probe card according to the prior art had a problem in that the pin force of the probe card was not the same, which caused cracks to occur in the semiconductor wafer pad (SiC wafer pad).

[0007] Additionally, there was a problem that the strong pin pressure could cause deep scrub marks, which could damage the pad layer.

[0008] Additionally, in the case of cantilever type products, there was a problem that it was very difficult to implement the same contact force for all pins assembled on the PCB.

[0009] In addition, due to the nature of cantilever type products, the probe needles must be manufactured in a layered structure, and the thickness of the probes for each layer is configured differently, so there was a problem in that the contact force was applied differently when conducting wafer testing.

[0010] In conventional cantilever-type wafers, the thickness of the probes increases with each layer, and the probe marks applied upon contact with the wafer are all different. Consequently, there was a problem in which the pins in the first layer were strongly probed, while those in the third layer were weakly probed.

[0011] Conventionally, it was difficult to achieve the same contact force across all probes during testing. Therefore, even with the appropriate amount of overdrive applied, certain pins were often over-probed, resulting in cracks on the wafer. This problem stems from the limitations of the cantilever-type stacked structure.

[0012] Conventional power semiconductor testing is performed under high voltage and current conditions. The high voltage and current flow during power semiconductor testing can cause arcs (ARCs) to form when probes on a probe card come into contact with wafer pads. If left unaddressed, this can lead to burnout or damage to the wafer's circuitry and the probe card's pins.

[0013] The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a probe card for high-voltage and high-current power semiconductors, which can perform testing with an overall uniform contact force by attaching probe needles to individual plates and applying them for probing.

[0014] Another object of the present invention is to provide a probe card for power semiconductors for high voltage and high current, which can perform testing with uniform contact force by eliminating the laminated structure of the needles by applying a vertical probe to the probe needle as a whole.

[0015] Another object of the present invention is to provide a probe card for power semiconductors for high voltage and high current, which can fundamentally block arc generation by placing the test part in an inert gas atmosphere by a gas flow immediately before probing is performed.

[0016] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0017] According to one aspect of the present invention, a probe card for a power semiconductor for high voltage and high current is provided, comprising: a PCB having a through hole formed therein so as to form a test space in which a plurality of probe pins pass through one side to contact a terminal of a test object, thereby performing a test; a pin insert block disposed in the through hole of the PCB and to which a portion of the plurality of probe pins is fixed and supported; wherein the plurality of probe pins are fixed to the pin insert block such that each end that comes into contact with the terminal is disposed at the same height.

[0018] According to another aspect of the present invention, a probe card for power semiconductors for high voltage and high current is provided, comprising: a PCB having a through hole formed therein so as to form a test space in which a plurality of probe pins pass through one side to contact terminals of a test object and thereby perform a test; a plurality of pin plates arranged in the through holes of the PCB and to which some of the plurality of probe pins are fixed; and a main block in which the plurality of pin plates are received and fixed; wherein the plurality of probe pins are fixed to the plurality of pin plates such that each end that comes into contact with the terminal is arranged at the same height.

[0019] At this time, the plurality of probe pins can be arranged at the same size and height so as to have the same contact pin pressure.

[0020] At this time, the plurality of probe pins may be formed in a form that is bent two or more times.

[0021] At this time, the ends of the plurality of probe pins connected to the terminals of the inspection object can be vertically erected.

[0022] At this time, some of the plurality of probe pins may be fixed to the plurality of pin plates or pin insert blocks by a soldering process.

[0023] At this time, the plurality of probe pins may be MEMS pins, pogo pins, or wire pins.

[0024] At this time, a gas supply passage may be formed in the pin insert block so that gas can be supplied to the test space.

[0025] At this time, a moving block may be installed to surround a test space formed at the bottom of the pin insert block, and may be elevated so that gas passing through the gas supply passage of the pin insert block is supplied to the periphery of the test space, descends, and is then transported to the test space, and is pushed up by the pressure thereof.

[0026] At this time, the moving block may have a slope formed at its lower end so that it can be raised or lowered by the pressure of the moving gas.

[0027] At this time, the main block is formed in a frame shape, and the plurality of pin plates can be inserted and fixed at regular intervals.

[0028] At this time, a plurality of MEMS pins can be vertically fixed to the lower portion of each pin plate by soldering.

[0029] At this time, a fixing groove is formed in the main block, and the plurality of pin plates can be fixed by having both ends inserted into the fixing groove.

[0030] At this time, the plurality of pin plates may have round cutouts formed on the sides to allow gas to pass through.

[0031] At this time, the main block may be provided with a gas inlet / outlet in a vertical direction with respect to the plurality of pin plates so that gas can be pressed in and discharged.

[0032] According to the above configuration, a probe card for a high-voltage-high-current power semiconductor according to one aspect of the present invention can perform testing with an overall uniform contact force by attaching probe needles to individual plates and applying them to probing.

[0033] According to another aspect of the present invention, a probe card for high voltage and high current power semiconductors can be tested with uniform contact force by eliminating the stacked structure of the needles by applying a vertical probe to the probe needles as a whole.

[0034] According to another aspect of the present invention, a probe card for high voltage and high current power semiconductors can fundamentally block arc generation by placing the test portion in an inert gas atmosphere by a gas flow immediately before probing is performed.

[0035] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0036] FIG. 1 is a plan view of a probe card for high-voltage-high-current power semiconductors according to one embodiment of the present invention.

[0037] FIG. 2 is an exploded perspective view of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0038] Figure 3 is an enlarged view of the main part of Figure 2.

[0039] FIG. 4 is a plan view of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention with a stiffener removed.

[0040] FIG. 5 is a partial cutaway perspective view of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0041] Figure 6 is an enlarged view of the main part of Figure 5.

[0042] FIG. 7 is a cross-sectional view along the longitudinal direction of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0043] FIG. 8 is a cross-sectional view perpendicular to the longitudinal direction of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0044] FIG. 9 is a partial cutaway perspective view of a pin insert block and a moving block, which are some components of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0045] FIG. 10 is an operation diagram before the rise of a moving block, which is a component of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0046] FIG. 11 is an operation diagram after the rise of a moving block, which is a component of a probe card for a high-voltage-high-current power semiconductor according to one embodiment of the present invention.

[0047] FIG. 12 is a configuration diagram of a pin plate and a probe needle, which are some components of a probe card for a high-voltage-high-current power semiconductor according to another embodiment of the present invention.

[0048] FIG. 13 is a perspective view of a main block and a pin plate, which are some components of a probe card for a high-voltage-high-current power semiconductor according to another embodiment of the present invention.

[0049] Fig. 14 is an operational diagram after the main block and pin plate are combined according to the embodiment illustrated in Fig. 13.

[0050] FIG. 15 is another embodiment of the embodiment illustrated in FIG. 13, and is another embodiment of a pin plate.

[0051] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0052] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0053] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0054] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0055] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0056] Hereinafter, a probe card (1) for a high-voltage-high-current power semiconductor according to an embodiment of the present invention will be described with reference to the drawings.

[0057] A probe card (1) for a high voltage-high current power semiconductor according to one embodiment of the present invention may include a PCB, a pin insert block (30), a plurality of probe pins (32), a stiffener, a cover block (40), a moving block (50), and a fitting block (60), as shown in FIGS. 1 to 11.

[0058] Referring to FIGS. 1 to 7, the above PCB (10) may have a through hole formed on one side to form a test space through which a plurality of probe pins (32) pass to contact the terminals of the inspection object, thereby performing a test.

[0059] At this time, the PCB (10) is connected to a power source and supplies current to a plurality of probe pins (32) to inspect the inspection target.

[0060] At this time, the inspection target is positioned at the location of the through hole of the PCB (10), and the probe pins (32) pass through the through hole and come into contact with the inspection target so that inspection can be performed.

[0061] At this time, the PCB (10) is formed in a plate shape and, due to the material properties, does not support other components, but instead, a stiffener (20) can support it.

[0062] The above pin insert block (30), referring to FIGS. 2 to 4, can be placed in the through hole of the PCB (10) and some of the plurality of probe pins (32) can be fixed and supported.

[0063] At this time, the plurality of probe pins (32) can be fixed to the pin insert block (30) so that each end that comes into contact with the terminal is placed at the same height.

[0064] At this time, a plurality of holes through which probe pins (32) pass are formed in the pin insert block (30), and the probe pins (32) can pass through these holes and then be fixed by soldering or the like.

[0065] At this time, the plurality of probe pins (32) may be mounted on the pin insert block (30) with a pin plate, and the plurality of probe pins (32) may be fixed to the pin plate by soldering.

[0066] At this time, the plurality of probe pins (32) can be arranged at the same size and height to have the same contact pin pressure.

[0067] At this time, the plurality of probe pins (32) may be formed in a form that is bent more than twice. In this case, the lower portion that is to be connected to the terminal is formed vertically, and the upper portion of the lower portion is bent to have an angle, and then bent again to be fixed by vertically penetrating the hole of the pin insert block (30). Of course, the upper portions of each probe pin (32) at this time can then be electrically connected to the PCB (10).

[0068] At this time, some of the plurality of probe pins (32) can be fixed to the plurality of pin plates or pin insert blocks (30) by a soldering process.

[0069] At this time, the plurality of probe pins (32) are fixed in a state of being bent twice, so that, referring to Fig. 9, they can be formed as a single inclined portion connecting the vertical portions at the upper and lower ends and the upper and lower ends.

[0070] At this time, a gas supply passage (30a) may be formed in the pin insert block (30) so that gas can be supplied to the test space. An inert gas such as nitrogen gas may be supplied through the gas supply passage (30a). By providing an inert gas atmosphere in the test space where a plurality of probe pins (32) and the terminals of the inspection object are connected in this way, arc generation can be prevented in advance.

[0071] The above stiffener (20) is finally fastened and fixed to the PCB (10), and blocks having different weights, including pin insert blocks (30), can be fastened and fixed to the stiffener (20). The stiffener (20) can also serve as a frame that supports other components while preventing deformation and maintaining its shape.

[0072] At this time, a pin insert block (30) may be fastened and supported from the bottom of the stiffener (20), and a cover block (40) may be fastened and supported from the bottom of the pin insert block (30). In addition, a groove for raising and lowering is formed in the cover block (40), and a moving block (50) is inserted into the groove for raising and lowering so as to be able to raise and lower.

[0073] Accordingly, the stiffener (20) supports the pin insert block (30), the cover block (40), the moving block (50), and the fitting block (60).

[0074] Referring to FIGS. 2 to 9, the cover block (40) has a through hole formed in the center so that multiple probe pins (32) can pass through it.

[0075] At this time, the cover block (40) can be fastened and fixed to the pin insert block (30). Therefore, the cover block (40) can be supported by the stiffener (20).

[0076] At this time, the cover block (40) is positioned closest to the wafer, which is the inspection object, as described above, and a lifting groove is formed to accommodate the moving block (50) that is raised and lowered.

[0077] At this time, the moving block (50) that is inserted into the lifting groove of the cover block (40) and guided to be lifted is formed so that a portion thereof is spaced apart from the lifting groove so that gas can pass therethrough. Of course, this portion through which the gas passes is arranged at the bottom of the gas supply passage (30a) of the pin insert block (30). Therefore, the gas supplied to the fitting member (61) and the fitting block (60) flows into the upper portion of the pin insert block (30) and then descends through the gas supply passage (30a). Then, it descends toward the outer side of the moving block (50) arranged at the bottom of the gas supply passage (30a) and can be exhausted to the outside via the test space.

[0078] The above-mentioned moving block (50), with reference to FIGS. 3, 9 to 11, is installed to surround a test space formed at the bottom of the pin insert block (30), and can be raised and lowered so that gas passing through the gas supply passage (30a) of the pin insert block (30) is supplied to the periphery of the test space, descends, and is then transported to the test space, where it is pushed up by the pressure thereof.

[0079] At this time, the moving block (50) may have an inclined surface (50a) formed at its lower end so that it can be raised or lowered by the moving gas pressure.

[0080] At this time, the moving block (50) may have an inclined surface (50b) formed on its upper end so as to guide the moving gas to the outside.

[0081] Accordingly, the gas provided to the outer side of the moving block (50) moves to the lower part and then to the test space. At this time, the moving block (50) receives pressure that increases in proportion to the strength of the pressure due to the pressure of the gas moving from the outer side to the inner side of the test space at the lower part and the inclined surface, and as a result, if the pressure of the gas is above a certain pressure, it rises, and if it is below that pressure, it descends due to its own weight. Ultimately, the flow of the gas provided by the inclined surface structure of the moving block (50) can be improved.

[0082] The above fitting block (60), with reference to FIGS. 1 to 11, is fixed by being fastened to the stiffener (20) and can be positioned on the upper side of the pin insert block (30).

[0083] At this time, the fitting block (60) includes a fitting member (61), and a fitting pipe for supplying gas can be connected to the fitting member (61).

[0084] At this time, the fitting block (60) can be formed with a horizontal flow path (60a) connected to the fitting member (61) and a vertical flow path (60b) connected to the end of the horizontal flow path (60a).

[0085] At this time, the gas passing through the horizontal passage (60a) and the vertical passage (60b) can be supplied to the upper surface of the pin insert block (30). The gas supplied to the upper surface of the pin insert block (30) moves to the outside of the moving block (50) through the gas supply passage (30a) as described above.

[0086] Referring to FIG. 1, a plan view of a probe card (1) for a high-voltage-high-current power semiconductor according to one embodiment of the present invention is illustrated.

[0087] In the illustrated embodiment, a stiffener (20) is fixed to the upper side of the PCB (10), a through hole is formed in the center of the stiffener (20), and a fitting block (60) is assembled and supported on the upper portion of the through hole.

[0088] At this time, a fitting member (61) is provided on one side of the fitting block (60), and can be connected so that gas can be supplied from the outside.

[0089] Referring to FIG. 2, an exploded perspective view of a probe card (1) for a high-voltage-high-current power semiconductor according to one embodiment of the present invention is shown.

[0090] In the illustrated embodiment, a fitting block (60), a stiffener (20), a pin insert block (30), and a cover block (40) can be assembled from the top.

[0091] At this time, the fitting block (60) can be fastened to the stiffener (20) by being fastened from the upper portion of the through hole of the stiffener (20).

[0092] At this time, a pin insert block (30) can be fastened and fixed to the lower side of the through hole of the stiffener (20).

[0093] At this time, a cover block (40) can be fastened and fixed to the lower side of the pin insert block (30).

[0094] At this time, the stiffener (20) can be fastened to the PCB (10) as described above and fixed to each other. Since the PCB (10) is not strong enough to support and accommodate all blocks due to its material properties, the stiffener (20) can be introduced as a frame.

[0095] Referring to Figure 3, an enlarged view of the main part of Figure 2 is shown.

[0096] In the illustrated embodiment, a pin insert block (30) can be fastened and fixed to the lower portion of the stiffener (20) by a plurality of bolts.

[0097] At this time, a cover block (40) can also be fastened and fixed to the lower part of the pin insert block (30) by a plurality of bolts.

[0098] At this time, a moving block (50) is inserted into the elevation groove of the cover block (40) so that it can be guided upward and downward. Therefore, the moving block (50) can only be guided upward and downward by following the guidance of the elevation groove, that is, only in a set arrangement.

[0099] At this time, a plurality of probe pins (32) can be installed through the holes of the pin insert block (30).

[0100] At this time, the plurality of probe pins (32) may be formed in a double-folded form and may be formed with vertical portions at the upper and lower ends and an inclined portion in the middle.

[0101] At this time, the vertical portions of the plurality of probe pins (32) may be completely vertical or may have a slight incline. Of course, the angle may be significantly different from that of the inclined portion.

[0102] At this time, the lower portions of the plurality of probe pins (32) are positioned slightly lower than the lower portions of the through holes of the cover block (40), and the test is performed by electrically connecting to the terminals of the inspection object at that portion. Therefore, that portion forms a test space.

[0103] At this time, in the test space, gas is supplied through the outside of the moving block (50), thereby preventing arcs that may occur during connection.

[0104] Referring to FIG. 4, a plan view of a probe card (1) for a high-voltage-high-current power semiconductor according to one embodiment of the present invention with the stiffener (20) deleted is shown.

[0105] In the illustrated embodiment, a pin insert block (30) is positioned on the upper side of the PCB (10), and a plurality of pin probes are installed through each through hole, and each probe pin (32) is connected to the PCB (10) so that testing can be performed.

[0106] At this time, a gas supply passage (30a) through which gas is supplied is formed in the form of a hole on one side of the pin insert block (30). Gas supplied from the fitting block (60) can pass through the gas supply passage (30a) and be supplied to the outer side of the moving block (50) inserted into the elevation groove of the cover block (40).

[0107] Referring to FIG. 5, a partial cutaway perspective view of a probe card (1) for a high-voltage-high-current power semiconductor according to one embodiment of the present invention is illustrated, and referring to FIG. 6, an enlarged view of a main part of FIG. 5 is illustrated.

[0108] In the illustrated embodiment, a fitting block (60), a stiffener (20), a pin insert block (30), and a cover block (40) can be sequentially assembled from the top and fixed and supported by the stiffener (20).

[0109] At this time, the PCB (10) is positioned at a similar height to the pin insert block (30). A portion of the pin insert block (30) can be installed in close contact with the upper surface of the PCB (10).

[0110] At this time, the lower part of the probe pin (32) that penetrates the pin insert block (30) is positioned near the penetration hole of the cover block (40), which is the test space, and is connected to the terminal of the inspection object.

[0111] Referring to FIG. 7, a cross-sectional view along the longitudinal direction of a probe card (1) for a high-voltage-high-current power semiconductor according to an embodiment of the present invention is illustrated, and referring to FIG. 8, a cross-sectional view perpendicular to the longitudinal direction of a probe card (1) for a high-voltage-high-current power semiconductor according to an embodiment of the present invention is illustrated.

[0112] In the illustrated embodiment, when gas is supplied through the fitting member (61), the gas descends through the horizontal and vertical passages of the fitting block (60). The gas passes through the gas supply passage (30a) of the pin insert block (30) and is supplied to the periphery of the moving block (50), and is supplied to the test space through the lower portion of the moving block (50) and then can be exhausted.

[0113] At this time, a plurality of probe pins (32) are installed in the pin insert block (30), and the lower part of the probe pin (32) is positioned in the test space and connected to the terminal of the inspection object.

[0114] At this time, the lower portions of the plurality of probe pins (32) are connected to the terminals of the inspection object, and the lower portions to which they are connected are connected to the terminals in a state where they are almost vertically erected.

[0115] At this time, each probe pin (32) is positioned at almost the same position as the terminal, and its shape and thickness are also similar, so that it can be connected to the terminal with the same pin pressure to achieve a uniform contact force.

[0116] Referring to FIG. 9, a partial cutaway perspective view of a pin insert block (30) and a moving block (50), which are some components of a probe card (1) for a high-voltage-high-current power semiconductor according to one embodiment of the present invention, is illustrated.

[0117] In the illustrated embodiment, the moving block (50) is inserted into the lifting groove of the cover block (40) and can be raised or lowered depending on the gas pressure.

[0118] At this time, inclined surfaces (50a, 50b) are formed on the upper and lower sides of the moving block (50), and the gas supplied to the outside of the moving block (50) by the guidance of the upper inclined surface (50b) is supplied to the test space along the lower inclined surface (50a), and the moving block (50) is raised and lowered depending on the degree of the gas pressure.

[0119] At this time, a part of the moving block (50) is inserted to fill the elevation groove, and a part formed with an inclined surface (50a, 50b) is installed to have a space between it and the cover block (40) so that gas can pass through it.

[0120] Referring to FIG. 10, an operation diagram before the rise of a moving block (50), which is a component of a probe card (1) for a high-voltage-high-current power semiconductor according to an embodiment of the present invention, is illustrated, and referring to FIG. 11, an operation diagram after the rise of a moving block (50), which is a component of a probe card (1) for a high-voltage-high-current power semiconductor according to an embodiment of the present invention, is illustrated.

[0121] In the illustrated embodiment, referring to FIG. 10, gas can be supplied through the fitting member (61). The gas passes through the horizontal passage (60a) and the vertical passage (60b) of the fitting block (60) and is supplied to the upper portion of the pin insert block (30). The gas is supplied downwardly toward the cover block (40) and the moving block (50) through the gas supply passage (30a) of the pin insert block (30). The gas supplied to the outside of the moving block (50) applies pressure to the inclined surface (50a) of the moving block (50) due to the gas pressure, and the moving block (50) rises according to the magnitude of the pressure, and passes through the space between the lower end of the moving block (50) and the cover block (40) and is supplied to the test space where the lower ends of the plurality of probe pins (32) are arranged, and then can be exhausted to the outside.

[0122] In the illustrated embodiment, referring to FIG. 11, as the supply pressure of the gas increases, the moving block (50) rises to a higher position, and a larger amount of gas can be supplied to the test space.

[0123] Therefore, the elevation height of the moving block (50) can be varied depending on the pressure of the supplied gas.

[0124] By increasing the pressure of the gas supplied in this manner at the moment the probe pin (32) connects to the terminal, the test space can be filled with an inert gas atmosphere, thereby preventing arcs that may occur at that moment. As a result, burning or damage to the probe pin (32) or components due to arc generation can be prevented.

[0125] Meanwhile, referring to FIG. 12, a configuration diagram of a pin plate (330) and a probe needle, which are some components of a probe card (1) for a high-voltage-high-current power semiconductor according to another embodiment of the present invention, is illustrated.

[0126] In the illustrated embodiment, a pin plate (330) having a probe pin (332) can be manufactured by fixing at least one probe pin (332) bent twice to the pin plate (330).

[0127] At this time, a part of the probe pin (332) can be fixed to the pin plate (330) by soldering and can be placed at almost the same height as the part connected to the terminal of the probe pin (332).

[0128] At this time, the probe pins (332) are manufactured with the same shape, size, and thickness, so that when connected to the terminal, testing can be performed with uniform pin pressure.

[0129] At this time, the pin plates (330) can be installed so that they are each fixed via a separate block such as a pin insert block (30).

[0130] Meanwhile, a probe card (1) for a high-voltage-high-current power semiconductor according to another embodiment of the present invention is illustrated in FIGS. 13 to 15.

[0131] A probe card (1) for a power semiconductor for high voltage and high current may include a PCB (10) having a through hole formed therein so as to form a test space in which a plurality of probe pins pass through one side to contact a terminal of a test object to perform a test, a plurality of pin plates (130) arranged in the through hole of the PCB (10) and to which some of the plurality of probe pins are fixed, and a main block (140) in which the plurality of pin plates (130) are received and fixed.

[0132] Here, the plurality of probe pins can be fixed to the plurality of pin plates (130) so that each end that comes into contact with the terminal is placed at the same height.

[0133] At this time, the plurality of probe pins can be arranged at the same size and height so as to have the same contact pin pressure.

[0134] At this time, multiple probe pins may be applied in a form that is bent more than twice as described above.

[0135] At this time, the ends of the plurality of probe pins connected to the terminals of the inspection object can be vertically erected.

[0136] At this time, some of the plurality of probe pins can be fixed to the plurality of pin plates (130) by a soldering process.

[0137] At this time, the plurality of probe pins may be MEMS pins (132), pogo pins, or wire pins.

[0138] At this time, the main block (140) is formed in a frame shape, and the plurality of pin plates (130) can be inserted and fixed at regular intervals.

[0139] At this time, a plurality of MEMS pins (132) can be vertically fixed to the lower part of each pin plate (130) by soldering.

[0140] At this time, a fixing groove (140a) is formed in the main block (140), and the plurality of pin plates (130) can be fixed by having both ends inserted into the fixing groove (140a).

[0141] At this time, the plurality of pin plates (130) may have a round cutout (130a) formed on the side to allow gas to pass through.

[0142] At this time, the main block (140) may be provided with a gas inlet / outlet (141) in a vertical direction with respect to the plurality of pin plates (130) so that gas can be pressed in and discharged.

[0143] Referring to FIG. 13, a perspective view of a main block (140) and a pin plate (130), which are some components of a probe card (1) for a high-voltage-high-current power semiconductor according to another embodiment of the present invention, is shown.

[0144] In the illustrated embodiment, the main block (140) is formed in the form of a frame with a center opening, and a mounting groove (140a) is formed so that a pin plate (130) can be inserted and mounted therein. Accordingly, the pin plate (130) can be fixed by being inserted into the mounting grooves (140a) on both sides.

[0145] At this time, the main block (140) can be installed so as to be placed and fixed in the through hole of the PCB, and since the MEMS pin (132) is placed on the lower part of the pin plate (130) installed on the main block (140), that part forms a test space.

[0146] At this time, with the pin plate (130) assembled and fixed to the main block (140), gas can be supplied so that an inert gas atmosphere can be formed inside, as in the embodiment described above.

[0147] At this time, round-shaped bends (130a) are formed on both sides of the pin plate (130) so that gas can flow through those parts.

[0148] At this time, the upper part of the pin plate (130) is formed to be longer than the lower part so that it can be fully inserted into the fixing groove (140a).

[0149] At this time, a plurality of MEMS pins (132) of the same height are fixed to the lower part of the pin plate (130) by soldering. Therefore, connection can be made with the same pin pressure as the terminal.

[0150] Referring to FIG. 14, an operation diagram is shown after the main block (140) and pin plate (130) are combined according to the embodiment illustrated in FIG. 13.

[0151] In the illustrated embodiment, gas inlets (141) are formed so that gas can be supplied to both sides, and gas can be supplied at a constant pressure to both inlets (141). The supplied gas can move to the lower test space and then be exhausted to the outside.

[0152] At this time, since a round cutout (130a) is formed in each pin plate (130), the test space can be used for testing under a gas atmosphere of constant pressure, and even when the MEMS pin (132) is connected to the terminal, arc generation can be prevented by the inert gas atmosphere.

[0153] Referring to FIG. 15, another embodiment of the pin plate (230) is illustrated as another embodiment of the embodiment illustrated in FIG. 13.

[0154] In the illustrated embodiment, the lower portion of the pin plate (230) is provided with a plurality of MEMS pins (232) and a round cutout (230a) is formed, but the upper and lower portions are formed with the same length. This manufacturing method may make it difficult to address the occurrence of play in the mounting groove during assembly, but has the advantage of enabling very solid assembly.

[0155] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0156] The present invention can be applied to a probe card for inspecting high-voltage, high-current power semiconductors.

Claims

1. A PCB having a through hole formed on one side to form a test space through which a plurality of probe pins pass to contact the terminals of the test object to perform testing; A pin insert block is disposed in the through hole of the PCB and a portion of the plurality of probe pins is fixed and supported; The above plurality of probe pins are fixed to the pin insert block so that each end that comes into contact with the terminal is positioned at the same height. Probe card for power semiconductors for high voltage and high current.

2. A PCB having a through hole formed so that a test space can be formed where a test is performed by allowing multiple probe pins to pass through one side to contact the terminal of the test object; A plurality of pin plates arranged in the through holes of the PCB and to which some of the plurality of probe pins are fixed; and A main block in which the plurality of pin plates are received and fixed; The above plurality of probe pins are fixed to the above plurality of pin plates so that each end that comes into contact with the terminal is positioned at the same height. Probe card for power semiconductors for high voltage and high current.

3. In paragraph 1 or 2, The above multiple probe pins are arranged at the same size and height so as to have the same contact pin pressure. Probe card for power semiconductors for high voltage and high current.

4. In paragraph 1 or 2, The above plurality of probe pins are formed in a form that is bent more than twice. Probe card for power semiconductors for high voltage and high current.

5. In paragraph 1 or 2, The above multiple probe pins have ends that are vertically connected to the terminals of the inspection object. Probe card for power semiconductors for high voltage and high current.

6. In paragraph 1, The above plurality of probe pins are fixed, some of which are fixed to the pin insert block by a soldering process. Probe card for power semiconductors for high voltage and high current.

7. In paragraph 1 or 2, The above multiple probe pins are MEMS pins, pogo pins, or wire pins. Probe card for power semiconductors for high voltage and high current.

8. In paragraph 1, The above pin insert block has a gas supply passage formed therein so that gas can be supplied to the test space. Probe card for power semiconductors for high voltage and high current.

9. In paragraph 8, A moving block is installed to surround a test space formed at the bottom of the pin insert block, and includes an ascending moving block so that gas passing through the gas supply passage of the pin insert block is supplied to the outside of the test space, descends, and is then transported to the test space, and is pushed up by the pressure thereof. Probe card for power semiconductors for high voltage and high current.

10. In paragraph 9, The above moving block has a slope formed at its lower end so that it can be raised by the pressure of the moving gas. Probe card for power semiconductors for high voltage and high current.

11. In paragraph 2, The above main block is formed in the shape of a frame, and the plurality of pin plates are inserted and fixed at regular intervals. Probe card for power semiconductors for high voltage and high current.

12. In paragraph 11, In the above multiple pin plates, multiple MEMS pins are vertically soldered to the lower part of each pin plate. Probe card for power semiconductors for high voltage and high current.

13. In paragraph 11, A fixing groove is formed in the above main block, and the plurality of pin plates are fixed by inserting both ends into the fixing groove. Probe card for power semiconductors for high voltage and high current.

14. In paragraph 11, The above plurality of fin plates have round cutouts formed on the sides to allow gas to pass through. Probe card for power semiconductors for high voltage and high current.

15. In Article 11, The above main block is provided with a gas inlet and outlet in a vertical direction with respect to the plurality of pin plates so that gas can be pressurized and discharged. Probe card for power semiconductors for high voltage and high current.

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