Method for configuring a chip module with a profile, chip module, and device comprising such a chip module

Abstract

The invention relates to a method (200) for configuring a chip module (10) with a profile, the method comprising the following steps: transmitting (201) an initial profile to the chip module (10); storing (202) the initial profile in a memory (14) of the chip module (10); transmitting (203) profile type information to the chip module (10) and linking the profile type information with the initial profile in order to generate a typified profile; requesting (204) profile data (53) from a profile provisioning unit (30); transmitting (205) the profile data (53) to a profile management unit (20) using the profile provisioning unit (30); transferring (206) the profile data (53) to the chip module (10) using the profile management unit (20); linking (207) the profile data (53) with the typified profile in order to generate a modified profile.

Description

[0001] Method for configuring a chip module with a profile, chip module and device with such a chip module

[0002] Technical area

[0003] The invention relates to a method for configuring a chip module with a profile, a chip module for maintaining several selectively activatable profiles, and a device with a communication module and said chip module.

[0004] background

[0005] Chip modules, for example in the form of chip cards or integrated circuits, are used in many areas to grant or deny authorization to access services. A chip module contains data that can uniquely identify a person or device. A chip module also contains a processor that can perform computational steps.

[0006] If a chip module is designed as a chip card, it comprises, for example, a card body and an integrated circuit embedded in the card body, for example, in the form of a chip module with a chip. The chip module is inserted into a cavity or module opening in the card body.

[0007] A chip module can also be designed as an integrated electronic circuit. In this respect, it should be understood that references to a chip card and explanations relating to a chip card in the context of this description always also generally apply to a chip module and its implementation as an integrated electronic circuit.

[0008] Before chip cards can be used to access services, they typically need to be assigned a profile. One or more profiles can be stored on a chip card, with each profile allowing or requiring different access rights or different operating modes for the chip card and the device containing the chip card.

[0009] When accessing mobile communication services, chip modules are often used as so-called SIM cards (subscriber identity modules) or eSIMs (embedded SIMs) to grant a device or user appropriate access rights. A profile is stored on a chip module to configure access to a communication service.

[0010] Configurations exist in which a device can use different profiles to transmit data over a communications network. For example, a device could contain multiple chip modules, for example, to transmit a user's data with a first profile and to exchange data between the device and the manufacturer for maintenance or other purposes with a second profile.

[0011] It is also conceivable that a device should be operated with different profile types at different times or in different environments.

[0012] In the consumer sector, the relevant GSMA standard is SGP.22, and in the IoT sector, SGP.32. SGP.22 and SGP.32 differ in the way profiles are transmitted to a chip module and also in the way profiles are managed. Currently, this requires that a separate chip module be used for SGP.22 and SGP.32.

[0013] To customize a chip module or a device with a chip module for a user—that is, to provide it with a profile that uniquely identifies the user and defines their rights within a communications network—a profile must be transferred to the chip module. This transfer process can require a large number of exchanged messages, which can make the process complex and error-prone.

[0014] Description of the invention

[0015] It can be considered a task to reduce the effort for generating a profile in a chip module.

[0016] This object is achieved by a method for configuring a chip module with a profile, a chip module for maintaining multiple selectively activatable profiles, and a device comprising a communication module and a chip module according to the independent claims. Further embodiments emerge from the dependent claims and the following description.

[0017] According to one aspect, a method for configuring a chip module with a profile is provided. The method comprises the steps of: transmitting an initial profile to the chip module; storing the initial profile in a memory of the chip module; transmitting profile type information to the chip module and linking the profile type information to the initial profile to generate a typed profile; requesting profile data from a profile provision unit; transmitting the profile data by the profile provision unit to a profile management unit; transferring the profile data by the profile management unit to the chip module; linking the profile data to the typed profile to generate a modified profile. The modified profile can then be used, among other profiles, as a profile for the chip module.

[0018] A profile is used to identify a device and / or person to a service provider and to assign access rights and / or roles to the device and / or person. Using the profile, a service provider can grant or deny access to a service with specific rights.

[0019] Before a device accesses a service for the first time, it must be prepared for this access. This includes, among other things, storing a profile. In the case described here, these are specifically profiles for accessing communication networks, such as wireless mobile communication networks.

[0020] The device initially receives an initial profile that allows it to access communication networks. This initial profile can then be typed and modified as described below.

[0021] The initial profile that is initially transmitted to the chip module is, for example, a generic profile. The chip module or a device containing the chip module is generally functional with the initial profile, meaning that the chip module or device can establish a connection to a network, in particular a wireless communications network, using the initial profile.

[0022] The initial profile is preferably transmitted to the chip module during a manufacturing process of a device containing the chip module and stored in the chip module's memory. Thus, the chip module receives a configuration during the device's manufacture, for example, in one of the final manufacturing steps, to establish basic functionality for connecting to a communications network and enabling the exchange of information via the communications network.

[0023] The profile type information is transmitted to the chip module if the chip module already contains the initial profile. Based on the initial profile and the profile type information, a typed profile is generated. This means that the initial profile is provided with other parameters to behave according to specific specifications and to fulfill certain requirements placed on the typed profile regarding connectivity to a communication network. By transmitting profile type information and linking this profile type information to the initial profile, the initial profile becomes a profile with a different profile type.

[0024] The profile type information defines the profile type of a profile. A profile type can particularly influence how a profile is managed and how the chip module behaves when the corresponding profile is activated.

[0025] The profile type information indicates which profile type a profile belongs to. The profile type information can be a data field or a value that is uniquely assigned to a specific profile type. For example, a first value for the profile type information can point to an initial profile, a second value to an SGP.22 profile, and a third value to an SGP.32 profile.

[0026] Storing the initial profile in the memory of the chip module and transmitting the profile type information to the chip module preferably takes place in separate steps. This has the advantage that the step of storing the initial profile in the chip module and the subsequent transmission of the profile type information to the chip module can be carried out at different times and by different units. For example, the initial profile can be stored in the device's chip module as part of the manufacture of a device, whereas the profile type information can be transmitted to the chip module after manufacture and linked to the initial profile. Linking the transmitted profile type information to the initial profile means, for example, that the value for the profile type in the initial profile is replaced, whereby the profile type changes from "initial profile" to another profile type, for example SGP.22 or SGP.32.The step of transmitting and linking the profile type information to the initial profile can also be performed by the device manufacturer, a distributor, or even the device user. For example, a profile type can indicate whether a profile is a profile of a natural person's device in their capacity as a consumer (so-called consumer devices) or a profile of a networked device (so-called IoT devices) used in an IoT environment. The process for deploying and using a profile for consumer devices is defined in the GSMA SGP.22 specification family. The process for deploying and using a profile for IoT devices is defined in the SGP.32 specification family. SGP.22 and SGP.32 describe how a profile is transferred to a chip module and how a device behaves when using a corresponding profile.

[0027] After a standardized profile has been created, individual profile data can be transferred to the chip module to create a modified profile as specified. It should be noted that the initial profile may already contain a standard set of profile data that enables registration and login to a communications network. However, this standard set of profile data is typically not assigned to an individual user. Therefore, to modify the profile, it is usually necessary to replace this standard set of profile data with individual profile data or to assign the profile data of the initial profile to a user.

[0028] Even though the initial profile was described above as a generic profile, an SGP.22, SGP.32, or a profile of another type can also be loaded onto the chip module as the first or initial profile in a first step and then converted to a different profile type. Furthermore, it is possible to load multiple profiles, e.g., an initial profile and an SGP.22 or SGP.32 profile, onto the chip module in a first step, and then convert one or both profiles to a different profile type (the same or different target profile types).

[0029] In one embodiment, the initial profile is stored in the chip module's memory before the chip module is put into operation. This approach has the advantage that a chip module or a device containing the chip module can be provided with a functional initial profile before the chip module or device is put into operation. Thus, such a chip module can be used to exchange data over a network before the chip module is linked to a user's individual profile.

[0030] In a further embodiment, the storage of the initial profile in the memory of the chip module and the transmission of the profile type information to the chip module are carried out separately.

[0031] This means, for example, that these steps are carried out one after the other and / or at a distance from each other, i.e. with a time gap.

[0032] In a further embodiment, the profile type information is transmitted to the chip module after the chip module is put into operation.

[0033] This means that the chip module is initially put into operation using the initial profile and typing, i.e. the creation of a typed profile, only takes place after the chip module has been put into operation.

[0034] Typically, the remaining profile data is only transferred to the chip module after commissioning of the chip module in order to create a modified profile.

[0035] The approach described here, starting with the transmission of an initial profile, through the creation of a typed profile and the subsequent creation of a modified profile, makes it possible to shift some of the process steps described here into the manufacturing process of a chip module or a device containing the chip module. This reduces the effort required to transfer the information required for a fully modified profile to a chip module, because a manufacturer or provider of a device can already incorporate part of the profile into the chip module. This is explained in more detail below with reference to the transfer of profiles “offline” or “online”. The number of steps required to commission a device, the amount of information transmitted to the device orThe data to be transmitted to the chip module and the effort required to securely transmit the data are significantly reduced by this design of the method.

[0036] In a further embodiment, the initial profile is transmitted to the chip module via a wired connection.

[0037] For example, during a device manufacturing process, a wired connection is established to a communication interface of the chip module, and the initial profile is transmitted to the chip module along with other data and stored in the chip module's memory. However, the initial profile can also be transferred wirelessly to the device via the chip module. The crucial point is that the initial profile is transferred to the chip module in offline mode before the device is put into operation by a user.

[0038] In a further embodiment, the profile data is transmitted by the profile provision unit to the profile management unit via a wireless connection.

[0039] This variant allows the profile data used to generate a modified profile to be transmitted wirelessly to a device containing the chip module. Thus, the profile data is transmitted to the device, particularly after it has been commissioned, i.e., in a so-called online mode. In a further embodiment, the method further comprises removing the profile type information from the modified profile to generate a reset profile.

[0040] During this step, the profile data preferably remains in the profile, and only the profile type is removed in preparation for changing the profile type of a profile. For example, if the profile type information is removed from a modified profile, the "Initial Profile" profile type can be set as the default value.

[0041] From the initial state, the chip module can be subjected to a new typing and the profile type of a profile can be changed, for example from initial profile to SGP.22 or SGP.32 or from SGP.22 to SGP.32 or initial profile or from SGP.32 to SGP.22 or initial profile.

[0042] In a further embodiment, the method further comprises the following step: transmitting a changed profile type information to the chip module and linking the changed profile type information with the reset profile in order to generate a typed profile again.

[0043] It is conceivable that when the profile type information is removed, the profile data of a profile is also removed. In this case, profile data is also required to regenerate a profile. This is obtained by performing the following steps: Requesting profile data from the profile provision unit; Transmitting the profile data by the profile provision unit to the profile management unit; Transferring the profile data by the profile management unit to the chip module; Linking the profile data with the typed profile to generate a modified profile. However, it is also possible that the profile data is not removed when the profile type information is removed and remains in the profile, so that only the profile type information of the profile is replaced. After the chip module has been reset to its initial state, retyping and modification can take place.During this re-typing, the initial profile can take on the properties of a different profile type than during the first typing. The profile data of another user can also be linked to the profile during this process.

[0044] In a further embodiment, the method further comprises the following steps: transmitting an instruction to the chip module to create a second profile; transmitting second profile type information to the chip module and linking the second profile type information to the initial profile to generate a second typed profile; requesting second profile data from the profile provision unit; transmitting the second profile data by the profile provision unit to the profile management unit; transferring the second profile data by the profile management unit to the chip module; linking the second profile data to the second typed profile to generate a second modified profile.

[0045] The second modified profile is created based on the same initial profile by first instructing the chip module to create a second profile and then transmitting both the second profile type information and the second profile data that define the second profile.

[0046] A chip module described here can store a plurality of profiles, whereby these profiles can be of different profile types, meaning that each profile has a profile type and several different profile types are available for selection. The profile type of a profile is determined by the transmitted profile type information.

[0047] In a further embodiment, the method further comprises the following steps: selecting a profile from a profile memory location of the chip module; operating the chip module according to the selected profile. The chip module can contain multiple profiles in its profile memory location. The number of profiles is limited only by the size of the profile memory location.

[0048] Preferably, new profiles can be created in the chip module at any time by transmitting a corresponding instruction along with the profile type information and profile data to the chip module, even after the chip module already contains one or more profiles. One of the profiles contained in the profile memory location can be selected to operate the chip module with the corresponding profile. The selected profile can also be referred to as the active profile.

[0049] According to a further aspect, a chip module is specified. The chip module is configured to store a plurality of selectively usable profiles. The chip module has a processor, a memory, and a communication interface. The chip module is configured to receive an initial profile, profile type information, and profile data via the communication interface. The processor is configured to store the initial profile, the profile type information, and the profile data as a profile in the memory and to generate a modified profile based on the initial profile, the profile type information, and the profile data. The memory is configured to contain a plurality of modified profiles (the at least two modified profiles can be of the same profile type or of a different profile type).The chip module is designed to be operated in a first operating mode with the initial profile, to be operated in a second operating mode with a first modified profile, or to be operated in a third operating mode with a second modified profile.

[0050] The chip module described here is configured using the method described herein. The chip module can be operated either with the initial profile or with one of several modified profiles contained in the memory. According to a further aspect, a device comprising a communication module and a chip module is specified, wherein the chip module is a chip module according to an embodiment of the chip module described herein. The chip module is assigned to the communication module and enables the communication module to access a communication service via at least one profile. The device has a profile management unit configured to receive profile type information and profile data from a profile provision unit.The profile management unit is configured to forward the profile type information and the profile data in such a way that a modified profile is generated and stored in the memory of the chip module based on the initial profile, the profile type information and the profile data.

[0051] This aspect describes the chip module explained above in the context of a device with a communication module. The chip module is used in the communication module to obtain or generate one or more profiles and to enable the use of communication services via the communication module.

[0052] The device can be, for example, a smartphone or other personal device used by a human user to access communication services. However, the device can also be another networked device, such as a sensor, a medical device, a controller, an entertainment device, etc., that uses the communication module to receive and send data.

[0053] For details regarding the chip module and the method for configuring it, reference is made to the corresponding description. The features and functions of the chip module and the method for configuring the chip module are not repeated here, but nevertheless also apply to the chip module in the context of the device described here. The device is particularly configured to carry out the method described herein or steps of this method. The steps of the mentioned method can be implemented as functions of the device, even without these steps being explicitly repeated here.

[0054] The initial profile can be transmitted to the chip module without involving the profile management unit. The profile management unit receives the profile type information and the profile data and then generates a modified profile based on this and the initial profile.

[0055] In one embodiment, the profile management unit comprises a first sub-module and a second sub-module, wherein the first sub-module is configured to process a profile of a first profile type and the second sub-module is configured to process a profile of a second profile type.

[0056] However, the profile management unit can also have more than two sub-modules, each sub-module being designed to process a specific profile type. One sub-module can process profiles of a first profile type, for example, an initial profile, an SGP.22 profile, or an SGP.32 profile. Another sub-module can process profiles of a second profile type (for example, an initial profile, SGP.22, or SGP.32).

[0057] The first sub-module is a so-called FPA (Factory Profile Assistant), the second sub-module is a so-called LPA (Local Profile Assistant), and the third sub-module is a so-called IPA (loT Profile Assistant).

[0058] The profile management unit implements two submodules and can therefore handle two different profile types. Depending on the profile type, either the first submodule or the second submodule executes the corresponding steps when a profile of the first or second profile type is written to the chip module. Likewise, the first submodule or the second submodule, depending on the profile type, requests the profile data from the profile provision unit, receives the profile data, prepares it, and transfers it to the memory in the chip module. In terms of basic functionality, the first submodule and the second submodule operate in the same way, although the first submodule is accessed via a local activation module and the second submodule via a remote access unit.

[0059] In a further embodiment, the profile management unit is a functional module which is executed in the device or on the chip module.

[0060] Depending on the available computing power in the chip module, the profile management unit can be a software-implemented module executed by the chip module's processor. However, it is also conceivable to provide the profile management unit as a functional module in the device, separate from the chip module.

[0061] In a further embodiment, the device comprises an activation module. The activation module is a local functional module executed on the device and is configured to receive an input from a user and, based on the input, send a message to the first submodule, thereby triggering the transmission of the profile data of a profile of a first profile type to the chip card. Alternatively, the second submodule is configured to receive a message from a remote access unit, thereby triggering the transmission of the profile data of a profile of a second profile type to the chip card.

[0062] The activation module is, for example, an application or program that runs on the device. The activation module enables a user of the device to load the profile data of a profile of the first profile type, for example, according to SGP.22, onto the chip module. The activation module outputs information that the profile to be loaded is a profile of the first profile type, so that the chip module links the profile to the appropriate profile type. When the profile is activated, the chip module and the device are operated in the corresponding operating mode. If the profile data of a profile of the second profile type, for example, according to SGP.32, is to be loaded onto the chip module, this is initiated by a remote access unit by sending a corresponding command to the second sub-module of the profile management unit.The second submodule generates and outputs a corresponding message to prepare the chip module for transmitting the profile data of a profile of the second profile type. Furthermore, the second submodule can retrieve the profile data from the profile provision unit and forward this profile data to the chip module's memory. In the chip module, the corresponding data is marked so that it is linked to the profile type, and the chip module and the device operate in the second operating mode when the profile of the second profile type is activated.

[0063] In summary, the method, chip module, and device described here enable a chip module to initially be provided with an initial profile, with which the chip module enables basic connectivity to a communications network. The typing and modification of the chip module can take place in subsequent steps that are temporally and spatially separated from the first step in which the initial profile is transferred to the chip module. After typing and modification, the chip module can be reset to the initial profile and receive profile type information for a different profile type as well as individual profile data for a different user, and can thus be typed and modified again. Multiple profiles of different profile types can be stored on a single physical chip module, and these can be selectively activated.The chip module and the device can operate either with the initial profile in a first operating mode or, depending on the profile type of the activated profile (or profiles), in a second operating mode or a third operating mode. This allows the steps required to modify a chip module with a profile to be performed at different times. In particular, all data of a profile no longer needs to be transferred over a wireless connection at the same time, simplifying the process of transferring the information required for a profile.

[0064] Reference to SGP.22 and SGP.32 is merely exemplary. It should be understood that the method, chip module, and device described here can also be operated with profiles according to other standards.

[0065] Short description of the characters

[0066] Some details are described in more detail below using the attached drawings. The illustrations are schematic and not to scale. Like reference numerals refer to like or similar elements. They show:

[0067] Fig. 1 is a schematic diagram of a chip module;

[0068] Fig. 2 is a schematic representation of the components involved in transmitting profiles to a chip module;

[0069] Fig. 3 is a schematic representation of the message exchange when receiving profile data for different profile types;

[0070] Fig. 4 is a schematic diagram of a chip module;

[0071] Fig. 5 is a schematic representation of a device with a

[0072] Communication module and a chip module, which are configured by a device management unit;

[0073] Fig. 6 is a schematic representation of the steps of a method for configuring a chip module with a profile. Detailed description

[0074] Fig. 1 shows a chip module 10. The chip module 10 contains a processor 12 and a memory 14. The memory 14 is, for example, a non-volatile memory. The processor 12 is configured to execute instructions, in particular those instructions stored in the memory 14. The chip module 10 also has a communication interface 16. Data can be written to the memory 14 via the communication interface 16.

[0075] Fig. 2 schematically shows the components involved in configuring a chip module with a profile and in transmitting the data for a profile to a chip module 10.

[0076] Each profile is initially provided by the profile provision unit 30 and can reach the chip module 10 via various paths. For example, the profile provision unit 30 provides an initial profile or a plurality of initial profiles to a device management unit 110 of a manufacturer of devices with chip modules. The device management unit 110 then transfers an initial profile to a chip module, as described further below.

[0077] Profile type information and / or profile data are transmitted from the profile providing unit 30 to the profile managing unit 20, and the profile managing unit 20 then transmits them to the chip module.

[0078] A device management unit 110 transmits an initial profile to the chip module 10, and the initial profile is stored in a profile storage location 50 in the memory 14. The initial profile may, for example, be written into the memory 14 via wired communication as part of the manufacture of the chip module 10 or a device 100 (see Fig. 5) containing the chip module 10, for example, using a wired connection between the device management unit 110, which may, for example, be a configuration computer.

[0079] The device management unit 110 can retrieve the initial profile or multiple initial profiles from the profile provision unit 30 and use one initial profile for each chip module. The device management unit 110 can also determine in one step which profile type a profile will receive, although this can also be determined at a later time.

[0080] Following the transmission of the initial profile to the chip module, modified profiles can be created by transmitting profile type information and profile data from the profile provision unit 30 via the profile management unit 20 to the chip module 10, which are then used to create a modified profile based on the initial profile. The transmission of the profile type information to the chip module can, for example, also be carried out by the device management unit or initiated by the device management unit, or initiated by a user of the device when commissioning the device. The step of transmitting the profile type information can, in particular, take place after the device has already been delivered to a user or organization, for example, after the device's manufacturing process has been completed.

[0081] After the profile type information has been linked to the initial profile, a profile activation unit 40, for example, an application operated by a user or a remote access unit, sends a message to the profile management unit 20. The profile management unit 20 queries the profile provision unit 30 for profile data. In this query, the profile management unit 20 can transmit information to the profile provision unit 30 that identifies the profile data to be provided. The profile provision unit 30 sends profile data to the profile management unit 20. The profile data can be protected against unauthorized access using cryptographic mechanisms during transmission to the chip module 10. The chip module 10 is placed into receive mode by the message from the profile management unit 20.After the profile management unit 20 has received the profile data from the profile provision unit 30, the profile management unit 20 can perform certain processing steps or preparation steps on the profile data. The profile management unit 20 then transmits the profile data to the chip module 10.

[0082] The chip module 10 links the initial profile, the profile type information and the profile data that it has received from the profile management unit 20 and forms a modified profile therefrom, which is stored in a profile storage location 50 in the memory 14.

[0083] The profile provisioning unit 30 is, for example, a central entity of a service provider, such as a mobile network operator. The profile provisioning unit 30 can, for example, be a so-called SM-DP+ unit (Subscription Manager - Data Preparation - Unit), which is defined in the GSMA protocols. An SM-DP+ typically transmits profiles to a chip module after the chip module has been delivered to a user together with a device in which the chip module is installed or into which the chip module can be installed. In this case, the profiles are transferred to the chip module "online" because the profiles are transferred to the chip module after the device is delivered and during commissioning.

[0084] In another embodiment, the profile provision unit 30 can also be a so-called SM-DPf unit (Subscription Manager - Data Preparation Factory), which provides profiles to a manufacturer of devices and / or chip modules so that these profiles are stored on the chip module during a manufacturing phase of the device and / or chip module. In this case, the profiles are transferred to the chip module "offline" because the profiles are transferred to the chip module during the manufacturing process, i.e., before commissioning. In the scenario described here, the initial profile is transferred to the chip module offline, whereas the data for the modified profiles is transferred to the chip module online.

[0085] While Fig. 2 shows a single profile provisioning unit 30 that can implement the online and offline profile transfer functions, the online and offline profile transfer functions can also be divided into separate profile provisioning units, where a first profile transfer unit provides the initial profiles (offline) and a second profile transfer unit provides the profile type information and profile data for the modified profiles (online). The modified profiles can, for example, be profiles according to SGP.22 or SPG.32.

[0086] The profile management unit 20 is a local module executing on the decentralized device 100 or the chip module 10. The profile management unit 20 receives the profile data from the profile provision unit 30 when the profile type information and profile data are transmitted online and transfers them to the chip module 10.

[0087] The profile management unit 20 implements, in particular, the function of an FPA (Factory Profile Assistant), an LPA (Local Profile Assistant), and / or an IPA (IoT Profile Assistant, where IoT refers to the Internet of Things). The profile management unit 20 also serves, in particular, to handle the transmission of profile data from the profile provision unit 30 to the chip module 10. For example, the profile management unit 20 can temporarily store the profile data and convert it into a format in which the profile data is then transmitted to the chip module 10.

[0088] The function of the profile management unit 20 during the transmission of profiles from the profile provision unit 30 to the profile management unit 20 and to the chip module 10 can be taken over by the device management unit 110 during the transmission of initial profiles in offline mode. Fig. 3 schematically shows the exchange of some of the messages and information for different profile types, whereby the transmission of the initial profile to the chip module is not shown in the illustration in Fig. 3; the transmission of the initial profile to the chip module is evident from Fig. 2. Fig. 3 shows, in particular, the steps for transmitting the profile data for profiles of different profile types to the chip module.

[0089] Fig. 3 shows two branches for different profile types. The left side shows the process for a first profile type (e.g., SGP.22, designated by the letter A next to the reference symbols), and the right side shows the process for a second profile type (e.g., SGP.32, designated by the letter B next to the reference symbols).

[0090] Generating a modified profile of the first profile type involves an activation module 40A, which requests the profile data for a profile of the first profile type from the first sub-module 20A of the profile management unit 20 using a message 61A. The first sub-module 20A then sends a message 62A to the chip module 10. The message 62A indicates a profile of the first profile type (for example, SGP.22) and instructs the chip module 10 to create a first profile 50A in the memory 14 based on the initial profile, the profile type information, and the profile data. The first sub-module 20A requests profile data from the profile provision unit 30 using message 63A. The profile provision unit 30 sends profile data to the chip module 10 using message 64A. This profile data from message 64A is assigned to the first profile 50A.

[0091] The transmission and generation of a profile of the second profile type is triggered by a remote access unit 40B, which requests the profile data for a profile of the second profile type from the second sub-module 20B of the profile management unit 20 using a message 61B. The second sub-module 20B then sends a message 62B to the chip module 10. The message 62B indicates a profile of the second profile type (for example, SGP.32) and instructs the chip module 10 to create a second profile 50B in the memory 14 based on the initial profile, the profile type information, and the profile data. The second sub-module 20B requests profile data from the profile provision unit 30 using message 63B. The profile provision unit 30 sends profile data to the chip module 10 using message 64B. This profile data from message 64B is assigned to the second profile 50B.

[0092] Chip module 10 now contains two profiles 50A, 50B of different profile types. Chip module 10 can be operated with profiles of different profile types because profile management unit 20 can handle different profile types accordingly, and the profiles are stored in memory 14 of chip module 10 in such a way that each profile type is included. Profiles 50A, 50B can be selectively activated, and chip module 10 can be operated in the corresponding operating mode.

[0093] It is also conceivable that the chip module 10 contains only one profile, and that for each change in the profile type and / or profile data, the typing and / or modification process is performed anew in order to generate a suitable modified profile for the respective desired use of a device. This modified profile is generated based on the initial profile and the respectively requested profile type information and profile data, with the initial profile preferably remaining permanently in the chip module and forming the basis for the typing and modification of future profiles.

[0094] The arrows 61A / B, 62A / B, 63A / B, 64A / B are not necessarily to be understood as representing the direct path of a message exchange. Rather, these arrows indicate the entity from which a message is sent and the entity that receives the message. The path taken by a message can also deviate from the schematic representation in Fig. 3. For example, the profile data that the profile provision unit 30 sends to the chip module 10 can be transmitted via different paths. In a first variant, the profile data is sent from the profile provision unit 30 to the profile management unit 20, which receives the profile data, temporarily stores it, and prepares it for further transmission to the chip module 10, e.g., transmits it using a different protocol. In a second variant, the profile data is sent from the profile provision unit 30 directly to the chip module 10.In the second variant, the functionality of the profile management unit 20 with the first sub-module 20A and the second sub-module 20B can be implemented on the chip module 10 and essentially fulfill the same task as in the first variant. In a third variant, the profile data is sent from the profile provision unit 30 to the profile activation unit 40, from there to the profile management unit 20, and then from the profile management unit 20 to the chip module 10. In a fourth variant, the profile data is sent from the profile provision unit 30 to the profile activation unit 40 and from there to the chip module 10. In some or all of these four variants, the profile data can be transmitted between the profile provision unit 30 and the chip module 10 via an end-to-end encrypted data transmission connection.

[0095] Fig. 4 shows a chip module 10 with a memory 14 and three profiles 50I, 50A, 50B stored therein. Each profile is fundamentally structured identically and contains at least the following information: a unique profile number 51, profile type information 52, and profile data 53. Profile 50I corresponds to the initial profile, 50A schematically shows a first modified profile, and 50B shows a second modified profile. Profiles 50A, 50B are based on an initial profile 50I, but differ from initial profile 50I, for example, in the profile type information 52 and the profile data 53. This means that the modified profiles 50A, 50B can be a different profile type and can also contain different profile data. Each profile 50I, 50A, 50B can have a unique profile number 51. A profile can be selected and activated using this unique profile number.The second modified profile 50B is fundamentally similar in structure to the first modified profile 50A. The second profile 50B is also based on the initial profile 50I, on which the first modified profile 50A was created. For example, different profile type information and different profile data were used for both the first modified profile 50A and the second modified profile 50B.

[0096] Even though an initial profile 501 and only two modified profiles 50A, 50B are shown in Fig. 4, it should be understood that the number of profiles stored in the memory 14 is limited solely by the available storage space in the memory 14.

[0097] The initial profile 50I can be stored in a separate memory area.

[0098] The initial profile 50I forms the standard profile with which the chip module is configured before it is typed and modified. This initial profile can then be used as a basis for further profiles. When individual profiles are generated based on the initial profile, information in fields 52 (profile type information) and 53 (profile data) is typically replaced or overwritten.

[0099] Fig. 5 shows a schematic representation of a device 100 with a communication module 105, wherein the device 100 is in communicative connection with the device management unit 110.

[0100] A chip module 10 according to one of the examples described above is assigned to the communication module 105 in order to transmit the initial profile to the chip module 10. The chip module 10 enables the communication module 105 to register in a communication network and to receive and send data via the communication network.

[0101] The device 100 can be a user's personal device, such as a smartphone, or a networked device without direct interaction with a user, for example an IoT device. The IoT device can perform any function and transmit detected values ​​or receive values ​​in order to then execute an action based on the received values. The chip module and method described here make it possible to carry out some steps of transferring the profile to a chip module during the manufacture of a chip module or a device with a chip module in order to reduce the complexity, effort, and scope of transferring the data for a profile during its commissioning. The device can thus initially be operated with an initial profile and already access a communications network before this profile is typed with a selectable profile type (for example, according to SGP.22 and / or according to SGP.32) and modified for a specific user.

[0102] Fig. 6 schematically shows a method 200 with steps 201 to 207. This method represents the functions described in connection with Figs. 1 to 5.

[0103] In step 201, an initial profile is transmitted to the chip module. In step 202, the initial profile is stored in a memory of the chip module. In step 203, profile type information is transmitted to the chip module and linked to the profile type information with the initial profile to generate a typed profile. In step 204, profile data is requested from a profile provision unit. In step 205, the profile provision unit transmits the profile data to a profile management unit. In step 206, the profile management unit transfers the profile data to the chip module. In step 207, the profile data is linked to the typed profile to generate a modified profile.

[0104] Additionally, it should be noted that "comprising" or "having" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, it should be noted that features or steps described with reference to one of the above embodiments may also be used in combination with other features or steps of other embodiments described above. Reference signs in the claims are not to be considered as limitations.

[0105] List of reference symbols

[0106] 10 Chip module (card or electronic component)

[0107] 12 processors

[0108] 14 storage

[0109] 16 Communication interface

[0110] 20 Profile Management Unit (FPA, LPA, IPA)

[0111] 20A first sub-module (FPA, LPA, or IPA)

[0112] 20B second sub-module (FPA, LPA, or IPA)

[0113] 30 Profile Provisioning Unit (SM-DP)

[0114] 40 Profile activation unit (end user, elM)

[0115] 40A activation module

[0116] 40B Remote Access Unit

[0117] 50 profile storage space

[0118] 50I Initial profile

[0119] 50A first profile

[0120] 50B second profile

[0121] 51 Profile number

[0122] 52 Profile type information

[0123] 53 profile data

[0124] 61 Request profile data

[0125] 62 Create profile space

[0126] 63 Request profile data

[0127] 64 Submit profile data

[0128] 100 devices

[0129] 105 Communication module

[0130] 110 Device Management Unit

[0131] 200 procedures

[0132] 201-207 Procedural steps

Claims

Patent claims 1. A method (200) for configuring a chip module (10) with a profile, the method comprising the following steps: Transmitting (201) an initial profile (50I) to the chip module (10); Storing (202) the initial profile (50I) in a memory (14) of the chip module (10); Transmitting (203) profile type information (52) to the chip module (10) and linking the profile type information (52) with the initial profile (50I) to generate a typed profile; Requesting (204) profile data (53) from a profile provision unit (30); Transmitting (205) the profile data (53) by the profile provision unit (30) to a profile management unit (20); Transferring (206) the profile data (53) by the profile management unit (20) to the chip module (10); Linking (207) the profile data (53) with the typed profile to create a modified profile.

2. The method (200) according to claim 1, wherein the initial profile (50I) is stored in the memory (14) of the chip module (10) before the chip module (10) is put into operation.

3. The method (200) according to claim 1 or 2, wherein the storing of the initial profile (50I) in the memory (14) of the chip module (10) and the transmission of the profile type information (52) to the chip module (10) are carried out separately from one another.

4. The method (200) according to any one of the preceding claims, wherein the transmission of the profile type information (52) to the chip module (10) occurs after the chip module (10) is put into operation.

5. Method (200) according to one of the preceding claims, wherein the transmission of the initial profile (501) to the chip module (10) takes place via a wired connection.

6. Method (200) according to one of the preceding claims, wherein the transmission of the profile data (53) by the Profile provision unit (30) to the profile management unit (20) via a wireless connection.

7. The method (200) according to any one of the preceding claims, further comprising: Removing the profile type information (52) from the modified profile to create a reset profile.

8. The method (200) of claim 7, further comprising: Transmitting a changed profile type information (52) to the chip module (10) and linking the changed profile type information with the reset profile in order to generate a typed profile again.

9. Method (200) according to one of the preceding claims, further comprising: transmitting an instruction to the chip module (10) to create a second profile; Transmitting second profile type information to the chip module (10) and linking the second profile type information to the initial profile (50I) to generate a second typed profile; Requesting second profile data (53) from the profile provision unit (30); Transmitting the second profile data (53) by the profile provision unit (30) to the profile management unit (20); Transferring the second profile data (53) by the profile management unit (20) to the chip module (10); Linking the second profile data (53) to the second typed profile to create a second modified profile.

10. The method (200) of claim 9, further comprising: Selecting a profile (50A, 50B) from a profile memory location (50) of the chip module (10); Operating the chip module (10) according to the selected profile (50A, 50B).

11. Chip module (10) for maintaining a plurality of selectively usable profiles (50A, 50B), the chip module (10) comprising: a processor (12); a memory (14); a communication interface (16); wherein the chip module (10) is configured to receive an initial profile (50I), profile type information (52), and profile data (53) via the communication interface (16); wherein the processor (12) is configured to store the initial profile (50I), the profile type information (52), and the profile data (53) as a profile (50A, 50B) in the memory (14) and to generate a modified profile based on the initial profile, the profile type information, and the profile data; wherein the memory (14) is configured to contain a plurality of modified profiles (50A, 50B);wherein the chip module (10) is designed to be operated in a first operating mode with the initial profile (50I), to be operated in a second operating mode with a first modified profile (50A) or to be operated in a third operating mode with a second modified profile (50B); 12. Device (100) with a communication module (105) and a chip module (10) according to claim 11, wherein the chip module (10) is assigned to the communication module (105) and enables the communication module (105) to access a communication service via at least one profile; wherein the device (100) has a profile management unit (20) which is designed to receive profile type information and profile data (53) from a Profile provision unit (30) to receive; wherein the profile management unit (20) is designed to forward the profile type information (52) and the profile data (53) such that a modified profile (50A, 50B) is generated and stored in the memory (14) of the chip module (10) based on the initial profile, the profile type information and the profile data.

13. The device (100) according to claim 12, wherein the profile management unit (20) comprises a first sub-module (20A) and a second sub-module (20B); wherein the first sub-module (20A) is configured to process a profile of a first profile type; wherein the second sub-module (20B) is configured to process a profile of a second profile type.

14. Device (100) according to claim 12 or 13, wherein the profile management unit (20) is a functional module which is executed in the device (100) or on the chip module (10).

15. Device (100) according to one of claims 12 to 14, comprising an activation module (40A), which is a local function module executed on the device (100) and is designed to receive an input from a user and, based on the input, to send a message to the first sub-module (20A), thereby triggering the transmission of the profile data of a profile of a first profile type to the chip card; or wherein the second sub-module (20B) is designed to receive a message from a remote access unit (40B) and thereby triggering the transmission of the profile data of a profile of a second profile type to the chip card.

Images