Printed circuit board apparatus, electronic device, and assembly method

Abstract

The present application relates to the field of electronic assembly, and discloses a printed circuit board apparatus, an electronic device, and an assembly method. The printed circuit board apparatus comprises a target assembly and a printed circuit board. The target assembly comprises a magnetic device, and the magnetic device is connected to the printed circuit board by means of a magnetic material part arranged outside the magnetic device. The magnetic material part and the magnetic device attract each other.

Description

Printed circuit board device, electronic device and assembly method

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 6, 2023, with application number 202311665353.9 and invention name “Printed circuit board device, electronic device and assembly method”. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application belongs to the field of electronic assembly, and specifically relates to a printed circuit board device, an electronic device, and an assembly method. Background Art

[0004] With the rapid development of network technology, miniaturization has become a key competitive advantage for 5G and even future information technology products, and it is a topic worthy of attention. Miniaturization means that many information technology products need to reduce the size of printed circuit boards to maintain their competitiveness.

[0005] However, compressing the size of printed circuit boards will result in smaller and smaller areas of printed circuit boards, but more and more devices are currently installed on the printed circuit boards. As a result, adjacent devices often shift due to magnetic attraction or repulsion.

[0006] Summary of the Invention

[0007] In a first aspect, an embodiment of the present application proposes a printed circuit board device, comprising: a target component and a printed circuit board; the target component includes a magnetic device; the magnetic device is connected to the printed circuit board via a magnetic material portion arranged outside the magnetic device; the magnetic material portion and the magnetic device attract each other.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, comprising the printed circuit board device described in the first aspect.

[0009] In a third aspect, an embodiment of the present application proposes an assembly method for a printed circuit board device, comprising: partially embedding a magnetic material into a target position of a printed circuit board and fixing it, the target position corresponding to a magnetic device, so that the magnetic material portion and the magnetic device attract each other; attaching the magnetic device to the target position of the printed circuit board through a fixing agent; and sending the magnetic device and the printed circuit board into a soldering furnace for soldering to obtain a printed circuit board device.

[0010] In a fourth aspect, an embodiment of the present application further proposes an assembly method for a printed circuit board device, comprising: partially burying a magnetic material in a target position of the printed circuit board and fixing it, the target position corresponding to the magnetic device, so that the magnetic material portion and the magnetic device attract each other; fixing the printed circuit board and the first sub-board together; attaching the magnetic device to a designated position on the first sub-board through a fixing agent, the designated position corresponding to the target position; sending the first sub-board on which the magnetic device is set and the printed circuit board into a soldering furnace for soldering to obtain a printed circuit board device.

[0011] In a fifth aspect, an embodiment of the present application further proposes an assembly method for a printed circuit board device, comprising: partially burying a magnetic material in a target position of a second sub-board and fixing it, the target position corresponding to a magnetic device, so that the magnetic material portion and the magnetic device attract each other; fixing and combining the printed circuit board and the second sub-board together; attaching the magnetic device to the target position of the second sub-board through a fixing agent; and sending the second sub-board with the magnetic device and the printed circuit board into a soldering furnace for soldering to obtain a printed circuit board device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] FIG1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0014] FIG2-1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0015] FIG2-2 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0016] FIG3-1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0017] FIG3-2 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0018] FIG3-3 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0019] 3-4 are schematic diagrams of a printed circuit board device provided in an embodiment of the present application;

[0020] FIG4 is a schematic diagram of a printed circuit board device with a first daughter board provided in an embodiment of the present application;

[0021] FIG5-1 is a schematic diagram of a printed circuit board device with a second daughter board provided in an embodiment of the present application;

[0022] FIG5-2 is a schematic diagram of a printed circuit board device with a second daughter board provided in an embodiment of the present application;

[0023] FIG5-3 is a schematic diagram of a printed circuit board device with a second daughter board provided in an embodiment of the present application;

[0024] FIG5-4 is a schematic diagram of a printed circuit board device with a second daughter board provided in an embodiment of the present application;

[0025] FIG6-1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0026] FIG6-2 is a schematic diagram of a printed circuit board device with a tray provided in an embodiment of the present application;

[0027] FIG6-3 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application;

[0028] FIG7-1 is a schematic diagram of an example of a printed circuit board device provided in an embodiment of the present application;

[0029] FIG7-2 is a schematic diagram of an example of a printed circuit board device provided in an embodiment of the present application;

[0030] FIG7-3 is a schematic diagram of an example of a printed circuit board device provided in an embodiment of the present application;

[0031] FIG8 is a flow chart of a method for assembling a printed circuit board device provided in an embodiment of the present application;

[0032] FIG9 is a flow chart of a method for assembling a printed circuit board device according to an embodiment of the present application;

[0033] FIG10 is a flow chart of a method for assembling a printed circuit board device according to an embodiment of the present application;

[0034] FIG11 is a structural block diagram of an electronic device provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100-target component; 200-printed circuit board; 300-magnetic material portion; 400-tray; 110-magnetic device; 112-circulator; 120-power amplifier (PA) component; 201-first surface; 202-second surface; 210-first sub-board; 220-second sub-board; 221-fifth surface; 222-sixth surface; 301-third surface; 302-fourth surface; 310-magnet. DETAILED DESCRIPTION

[0037] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0039] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connected" should be understood in a broad sense. For example, they can refer to direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application.

[0040] The printed circuit board device provided in the embodiments of the present application can be applied to various fields, such as the communications field. In the communications field, with the rapid development of 5G technology, the miniaturization of the entire device means that the product needs to maintain its competitiveness by compressing the product size. Taking the base station (such as a 5G base station) that is often involved in the communications field as an example, the base station often deploys a single board (the single board is an important component of the base station), such as an active antenna unit (AAU) board. The following description takes the AAU board as an example. For the construction of miniaturization of base stations, compressing the size of the AAU board is a consideration for maintaining the competitiveness of base station products. The AAU board uses a printed circuit board (PCB). The AAU board can contain various components, such as a power amplifier (PA) component, and the PA component contains a magnetic device (such as a circulator). Since various magnetic devices (such as a circulator) are often provided on the printed circuit board, once the size of the printed circuit board is compressed, the layout density of the magnetic device on the printed circuit board will be higher, and as the performance requirements for the product become higher and higher, the magnetism of the magnetic device will also be enhanced. As a result, while the size of the printed circuit board is compressed, the distance between the magnetic components is shortened, and the magnetic force between the magnetic components becomes stronger and stronger. During the connection process (such as welding), the magnetic force between adjacent magnetic components will cause the two adjacent magnetic components to attract or repel each other, thereby causing the magnetic components to shift.

[0041] Based on this, the present application provides a printed circuit board device. A magnetic material portion is used in the printed circuit board device. The magnetic material portion and the magnetic device are attracted to each other, thereby connecting the magnetic device to the printed circuit board. This increases the attractive force between the magnetic material portion and the magnetic device, thereby increasing the positive pressure of the magnetic device on the printed circuit board, further increasing the friction between the magnetic device and the printed circuit board, and thus offsetting the forces between adjacent magnetic devices. Without changing the product's miniaturized layout or affecting product performance, the printed circuit board design is optimized to solve the problem of device displacement caused by magnetic attraction or repulsion between adjacent devices, while achieving an ultra-dense layout of magnetic devices on the printed circuit board.

[0042] Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings.

[0043] The printed circuit board device provided in an embodiment of the present application may include: a target component and a printed circuit board; the target component includes a magnetic device; the magnetic device is connected to the printed circuit board via a magnetic material portion arranged outside the magnetic device; the magnetic material portion and the magnetic device attract each other.

[0044] In the embodiment of the present application, the target component may be a component including multiple magnetic devices, such as a PA component, etc., and there may be multiple target components.

[0045] In an embodiment of the present application, the magnetic material portion may be a component having a magnetic material, and the printed circuit board and the magnetic device are connected via the magnetic material portion, and the magnetic material portion is not the magnetic portion of the magnetic device, but a newly added component having a magnetic material. The magnetic material used in the magnetic material portion may include at least one of metals such as iron, nickel, and cobalt that can be attracted by magnetic force. At the same time, the magnetic force between the magnetic material portion and the magnetic device is an attractive force, that is, the magnetic material portion and the magnetic device attract each other. Furthermore, the printed circuit board and the magnetic device are connected by the attractive force between the magnetic material portion and the magnetic device.

[0046] For example, FIG1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application. As shown in FIG1 , the target component 100 includes a magnetic device 110, and the magnetic device 110 can be multiple. The target component 100 in FIG1 includes two magnetic devices 110 for the purpose of example only, and is not limited here. The magnetic device 110 can be a magnetic device, and the magnetic device 110 can be selected according to the target component 100. For example, when a power amplifier (PA) component is selected as the target component, since the circulator is an important component of the PA component and the circulator itself also has certain magnetism, the circulator can be selected as the magnetic device. It should be understood that the provision of a target component 100 in FIG1 is only an example and is not limited here.

[0047] Referring to Figure 1 , the magnetic device 110 and the magnetic material portion 300 can be disposed on both sides of the printed circuit board 200. However, it is worth noting that the magnetic material portion does not necessarily need to be disposed outside the printed circuit board; it can also be disposed within the printed circuit board, or a portion can be disposed outside the printed circuit board and another portion within the printed circuit board. Furthermore, the rectangular shape of the magnetic material portion in Figure 1 is merely an example, and the shape of the magnetic material portion is not limited, such as a spherical magnetic material portion, a conical magnetic material portion, or an irregular magnetic material portion.

[0048] According to an embodiment of the present application, a printed circuit board device is provided, comprising a target component and a printed circuit board; the target component includes a magnetic device; the magnetic device is connected to the printed circuit board via a magnetic material portion disposed outside the magnetic device; and the magnetic material portion and the magnetic device attract each other. Thus, connecting the magnetic device and the printed circuit board via the magnetic material portion increases the attractive force between the magnetic material portion and the magnetic device, thereby increasing the positive pressure of the magnetic device on the printed circuit board and further increasing the friction between the magnetic device and the printed circuit board, thereby offsetting the forces between adjacent magnetic devices and resolving the problem of device displacement caused by magnetic attraction or repulsion between adjacent devices.

[0049] In addition, in order to better describe the situation where the magnetic material portion is disposed in the printed circuit board, in one embodiment of the present application, the magnetic material portion is disposed in the printed circuit board; and the magnetic device is disposed on the surface of the magnetic material portion.

[0050] For example, please refer to FIG2-1, which is a schematic diagram of a printed circuit board device provided in an embodiment of the present application.

[0051] In an embodiment of the present application, the magnetic material portion is arranged in the printed circuit board, and the magnetic device is arranged on the surface of the magnetic material portion. It is worth noting that the magnetic device is not necessarily in contact with the surface of the magnetic material portion, and the magnetic device can be indirectly connected to the magnetic material portion through a certain component. As shown in Figure 2-1, the target component 100 includes a magnetic device 110, and the magnetic material portion 300 is arranged in the printed circuit board 200. The magnetic device 110 is indirectly connected to the magnetic material portion 300 through the printed circuit board 200. At the same time, the magnetic device 110 can also be indirectly connected to the magnetic material portion 300 by adding a component, which is not limited here.

[0052] In the embodiment of the present application, the magnetic material portion is arranged in the printed circuit board, which can shorten the distance between the magnetic material portion and the magnetic device, enhance the attraction between the magnetic material portion and the magnetic device, and better avoid the attraction or repulsion of adjacent magnetic devices.

[0053] In one embodiment of the present application, the magnetic material portion is not necessarily entirely disposed within the printed circuit board. For example, as shown in FIG2-2 , the target component 100 includes a magnetic device 110, and the magnetic material portion 300 may be partially disposed within the printed circuit board 200, with the remaining portion exposed to air. It is worth noting that the remaining portion may be disposed within other components, which is not a limitation herein.

[0054] In the embodiment of the present application, a groove may be cut between the magnetic material portion and the magnetic device to enhance the attractive force between the magnetic material portion and the magnetic device. This can be applied to the printed circuit board assembly shown in Figures 2-1 and 2-2. Taking the printed circuit board assembly shown in Figure 2-1 as an example, a groove may be cut in the printed circuit board 200 between the magnetic material portion 300 and the magnetic device 110.

[0055] In the embodiment of the present application, there is no restriction on whether the magnetic material portion is entirely disposed within the printed circuit board. The position of the magnetic material portion can be adjusted according to specific circumstances, so as to be better adapted to different devices.

[0056] In one embodiment of the present application, the magnetic device and the magnetic material portion may also be in at least partial contact. For example, as shown in FIG3-1 , the target component 100 includes a magnetic device 110, and the magnetic material portion 300 is disposed in a printed circuit board 200. A portion of the magnetic material portion 300 is in contact with the magnetic device 110, while another portion is not in contact with the magnetic device 110.

[0057] In an embodiment of the present application, by making the magnetic device at least partially contact with the magnetic material portion, the distance between the magnetic material portion and the magnetic device is further shortened, and the attractive force between the magnetic material portion and the magnetic device is further enhanced, thereby improving the effect of avoiding attraction or repulsion between adjacent magnetic devices.

[0058] In one embodiment of the present application, the printed circuit board has a first surface and a second surface opposite to the first surface; the magnetic device is arranged on the first surface of the printed circuit board; the magnetic material portion has a third surface and a fourth surface, the third surface of the magnetic material portion is flush with the first surface of the printed circuit board, and the fourth surface of the magnetic material portion is flush with the second surface of the printed circuit board.

[0059] In an embodiment of the present application, illustratively, as shown in FIG3-2 , the target component 100 includes a magnetic device 110, and a magnetic material portion 300 is disposed in a printed circuit board 200. The third surface 301 of the magnetic material portion 300 is flush with the first surface 201 of the printed circuit board 200, and the fourth surface 302 of the magnetic material portion 300 is flush with the second surface 202 of the printed circuit board 200. In this way, the magnetic material portion 300 is buried in the printed circuit board 200 in a straight-through manner, which is simpler and more convenient to operate than burying the magnetic material inside the printed circuit board. At the same time, in order to fix the magnetic material portion and the printed circuit board, a fixing agent (such as insulating glue, etc.) can be used to bury the magnetic material inside the printed circuit board.

[0060] In one embodiment of the present application, a vertical projection of the magnetic device on the first surface of the printed circuit board coincides with the third surface of the magnetic material portion.

[0061] In an embodiment of the present application, illustratively, as shown in FIG3-3 , a target component 100 includes a magnetic device 110, and a magnetic material portion 300 is disposed in a printed circuit board 200, wherein the printed circuit board has a first surface 201 and a second surface 202 opposite to the first surface 201. Based on the apparatus shown in FIG3-2 , the vertical projection of the magnetic device 110 on the first surface 201 of the printed circuit board 200 is further configured to coincide with the third surface 301 of the magnetic material portion 300. In this way, to a certain extent, the attractive force between the magnetic device and the magnetic material portion can be relatively large, and the effect of preventing adjacent magnetic devices from attracting or repelling each other is also relatively good.

[0062] In an embodiment of the present application, when the vertical projection of the magnetic device 110 on the first surface 201 of the printed circuit board coincides with the third surface 301 of the magnetic material portion 300, there is no restriction on whether the fourth surface 302 of the magnetic material portion 300 is flush with the second surface 202 of the printed circuit board 200. As shown in FIG3-3, the fourth surface 302 of the magnetic material portion 300 is flush with the second surface 202 of the printed circuit board 200. As shown in FIG3-4, the target assembly 100 includes a magnetic device 110, and the magnetic material portion 300 is disposed in a printed circuit board 200. The printed circuit board 200 has a first surface 201 and a second surface 202 opposite to the first surface 201. Unlike the printed circuit board device in FIG3-3, the fourth surface 302 of the magnetic material portion 300 is not flush with the second surface 202 of the printed circuit board 200.

[0063] In one embodiment of the present application, the attractive force between the magnetic device and the magnetic material portion may be further increased by further increasing the volume of the magnetic material portion buried in the printed circuit board, which is not limited here.

[0064] In one embodiment of the present application, the target component is a PA component, and the magnetic device is a circulator.

[0065] For example, FIG4 is a schematic diagram of a printed circuit board device with a first daughter board provided in an embodiment of the present application.

[0066] As shown in Figure 4, the printed circuit board device provided in an embodiment of the present application includes a target component 100, a printed circuit board 200 and a first sub-board 210; the magnetic device 110 is arranged on the first sub-board 210, and the first sub-board 210 is connected to the printed circuit board 200; the magnetic device 110 is connected to the magnetic material part 300 through the first sub-board 210.

[0067] In an embodiment of the present application, the magnetic device 110 may be in contact with the first sub-board 210, and the first sub-board 210 may be in contact with the printed circuit board 200. The first sub-board 210 may be disposed between the printed circuit board 200 and the magnetic device 110. The first sub-board 210 may also be a printed circuit board smaller than the printed circuit board 200. By disposing the first sub-board 210 in the printed circuit board device, the magnetic device 110 is connected to the magnetic material portion 300 via the first sub-board 210. There may be multiple first sub-boards, and multiple magnetic devices may be disposed on one first sub-board. There is no restriction on the position of the magnetic devices on the first sub-board. In this way, when there are multiple magnetic devices on the printed circuit board, and the multiple magnetic devices belong to different components, the magnetic devices of the different components can be distinguished by the first sub-board. The magnetic device on the first sub-board can be mounted on the printed circuit board via the first sub-board, or the magnetic device on the first sub-board can be removed from the printed circuit board by disassembling the first sub-board. At the same time, if multiple magnetic components are already provided on the first sub-board, the printed circuit board device provided in this application can also be used directly.

[0068] For example, FIG5-1 is a schematic diagram of a printed circuit board device with a second daughter board provided in an embodiment of the present application.

[0069] As shown in Figure 5-1, the printed circuit board device provided in an embodiment of the present application includes a target component 100, a printed circuit board 200 and a second sub-board 220; the target component 100 includes a magnetic device 110, the magnetic device 110 is arranged on the second sub-board 220, and the second sub-board 220 is connected to the printed circuit board 200; the magnetic material part 300 is arranged in the second sub-board 220, and the magnetic device 110 is arranged on the surface of the magnetic material part 300.

[0070] In an embodiment of the present application, the second sub-board can be a printed circuit board. By disposing the second sub-board within the printed circuit board assembly, the magnetic device is disposed on the second sub-board. Furthermore, the magnetic material portion is disposed within the second sub-board, and the magnetic material portion and the magnetic device are mutually attracted to each other. It is worth noting that there are no restrictions on the location and size of the magnetic material portion within the second sub-board, and the magnetic material portion need not be entirely disposed within the second sub-board; the arrangement can be tailored to the specific circumstances.

[0071] In the embodiment of the present application, the provision of one second sub-board 220 in FIG5-1 is merely an example. In actual applications, there may be multiple second sub-boards 220, and multiple magnetic devices 110 may be provided on the second sub-board 220. The specific number of the second sub-boards 220 may be set according to actual conditions.

[0072] In the embodiment of the present application, the magnetic material portion is disposed in the second sub-board, and the magnetic device is disposed on the second sub-board. Thus, while shortening the distance between the magnetic material portion and the magnetic device, the magnetic device on the second sub-board can be directly mounted on the printed circuit board by disposing the second sub-board, or the magnetic device on the second sub-board can be removed from the printed circuit board by disassembling the second sub-board, thereby making it easier to install and remove the magnetic device.

[0073] In one embodiment of the present application, the magnetic device is at least partially in contact with the magnetic material portion.

[0074] In the embodiment of the present application, as shown in FIG5-2 , for example, unlike the printed circuit board assembly in FIG5-1 , the magnetic material portion 300 is in contact with the magnetic device 110. However, since the magnetic material portion can have different shapes, the magnetic material portion 300 can be in at least partial contact with the magnetic device 110. The printed circuit board assembly in FIG5-2 is merely an example and may be configured specifically according to actual circumstances.

[0075] In the embodiment of the present application, based on the printed circuit board apparatus described in FIG. 5-1 , the magnetic material portion is in contact with the magnetic device. This can further shorten the distance between the magnetic device and the magnetic material portion, thereby increasing the attractive force between the magnetic device and the magnetic material portion and further enhancing the effect of preventing attraction or repulsion between adjacent magnetic devices.

[0076] In one embodiment of the present application, the second sub-board has a fifth surface and a sixth surface opposite to the fifth surface; the fifth surface of the second sub-board is in contact with the magnetic device, and the sixth surface of the second sub-board is in contact with the printed circuit board; the magnetic material portion has a third surface and a fourth surface, the third surface of the magnetic material portion is flush with the fifth surface of the second sub-board, and the fourth surface of the magnetic material portion is flush with the sixth surface of the second sub-board.

[0077] In an embodiment of the present application, as shown in FIG5-3 , for example, the target assembly 100 includes a magnetic device 110, a magnetic material portion 300 disposed in a second sub-board 220, the second sub-board 220 having a fifth surface 221 and a sixth surface 222 opposite the fifth surface 221, and the magnetic material portion 300 having a third surface 301 and a fourth surface 302. Based on the printed circuit board device shown in FIG5-2 , the third surface 301 of the magnetic material portion 300 is aligned with the fifth surface 221 of the second sub-board 220, and the fourth surface 302 of the magnetic material portion 300 is aligned with the sixth surface 222 of the second sub-board 220. Thus, the magnetic material portion is embedded in the second sub-board in a straight-through manner, which is simpler and more convenient to operate than embedding the magnetic material within the second sub-board.

[0078] In one embodiment of the present application, a vertical projection of the magnetic device on the fifth surface of the second sub-plate coincides with the third surface of the magnetic material portion.

[0079] In the embodiment of the present application, as shown in FIG5-4 , based on the printed circuit board apparatus of FIG5-3 , the vertical projection of the magnetic device 110 on the fifth surface 221 of the second sub-board 220 is made to coincide with the third surface 301 of the magnetic material portion 300. This further increases the attractive force between the magnetic device and the magnetic material portion, thereby further improving the effect of preventing magnetic attraction or repulsion between adjacent magnetic devices.

[0080] In one embodiment of the present application, the magnetic material portion may have only one surface (for example, a spherical magnetic material portion). In this embodiment of the present application, the magnetic material portion can be made as close to the magnetic device as possible to enhance the attraction between the magnetic material portion and the magnetic device.

[0081] In one embodiment of the present application, the sub-boards can be arranged in a fortress-like manner. For example, a third sub-board can be arranged on the second sub-board, and the magnetic material portion can be arranged in the third sub-board. It is worth noting that there is no limit on the number of sub-boards provided, nor on the location of the magnetic material portion. This allows for reasonable adjustments based on the device requirements of specific implementation scenarios.

[0082] For example, FIG6-1 is a schematic diagram of a printed circuit board device provided in an embodiment of the present application.

[0083] As shown in Figure 6-1, the printed circuit board device provided in an embodiment of the present application includes a target component 100 and a printed circuit board 200; the target component 100 includes a magnetic device 110; the magnetic device 110 is connected to the printed circuit board 200 through a magnetic material portion 300 arranged outside the magnetic device 110; the magnetic material portion 300 and the magnetic device 110 attract each other; the printed circuit board 200 has a first surface 201 and a second surface 202 opposite to the first surface 201; the magnetic device 110 is arranged on the first surface 201, and the magnetic material portion 300 is arranged on the second surface 202 of the printed circuit board 200; the setting position of the magnetic material portion 300 on the second surface 202 corresponds to the setting position of the magnetic device 110 on the first surface 201.

[0084] In the embodiment of the present application, as shown in FIG6-1 , the printed circuit board 200 has a first surface 201 and a second surface 202 opposite to the first surface 201. Based on the printed circuit board device shown in FIG1 , the magnetic material portion 300 is disposed on the second surface 202 of the printed circuit board 200. Meanwhile, the location of the magnetic material portion 300 on the second surface 202 corresponds to the location of the magnetic device 110 on the first surface 201. It should be understood that the location of the magnetic material portion 300 on the second surface 202 corresponding to the location of the magnetic device 110 on the first surface 201 may include that a vertical projection of the magnetic material portion 300 on the second surface 202 at least partially overlaps with a vertical projection of the magnetic device 110 on the first surface 201, for example, completely overlaps as shown in FIG6-1 .

[0085] In the embodiment of the present application, by making the magnetic device correspond to the magnetic material portion, the attraction between the magnetic device and the magnetic material portion can be enhanced, so as to better avoid the magnetic force between adjacent magnetic devices causing attraction or repulsion.

[0086] In one embodiment of the present application, the magnetic material portion includes a magnet; the printed circuit board device further includes a tray; and the tray is used to support the magnet.

[0087] In an embodiment of the present application, as shown in FIG6-2 , based on the printed circuit board device of FIG6-1 , the printed circuit board device further includes a tray 400 , and the magnetic material portion may be a magnet 310 . The tray 400 is used to support the magnet 310 and may be of any material, shape, and size, with the figure being used only as an example. Thus, by placing a magnet on the tray, the friction between the magnetic device and the printed circuit board is increased through the attraction between the magnet and the magnetic device, further preventing adjacent magnetic devices from attracting or repelling each other due to magnetic forces.

[0088] In one embodiment of the present application, the target component is a PA component, and the magnetic device is a circulator.

[0089] In the embodiment of the present application, a plurality of target components may be provided on the printed circuit board device. For example, as shown in FIG6-3 , the target component may be a PA component 120 , and the magnetic device may be a circulator 112 .

[0090] In the embodiment of the present application, FIG. 7-1 , FIG. 7-2 and FIG. 7-3 are example schematic diagrams in the embodiment of the present application, and the printed circuit board device in the embodiment of the present application is further described through specific examples.

[0091] In Example 1, as shown in Figure 7-1 , a magnetic material portion 300 is disposed within a printed circuit board 200. Two PA assemblies 120 are disposed on the printed circuit board 200, each of which includes two circulators 112. The printed circuit board can have a length of 300-500 mm, a width of 200-400 mm, and a thickness of 2.4 mm. The circulators 112 are positioned relatively centrally within the printed circuit board 200, enabling reliable reflow soldering.

[0092] Example 2, as shown in FIG7-2 , a magnetic material portion 300 is disposed within a printed circuit board 200. Four PA assemblies 120 (only two PA assemblies 120 are shown in FIG7-2 ) and four first sub-boards 210 (only two first sub-boards 210 are shown in FIG7-2 ) may be disposed on the printed circuit board 200. Each PA assembly 120 may include four circulators 112 (only two circulators 112 are shown in FIG7-2 ), with one first sub-board 210 being used to accommodate one PA assembly 120. The printed circuit board has a length of 300-700 mm, a width of 200-500 mm, and a thickness of 3.0 mm. The first sub-board has a length of 50-80 mm, a width of 40-60 mm, and a thickness of 0.65 mm. The circulator 112 is positioned relatively centrally within the first sub-board 210, enabling reliable reflow soldering.

[0093] Example 3, as shown in FIG7-3 , a magnetic material portion 300 is disposed within a printed circuit board 200. Four PA assemblies 120 (only two PA assemblies 120 are shown in FIG7-3 ) and four second sub-boards 220 (only two second sub-boards 220 are shown in FIG7-3 ) may be disposed on the printed circuit board 200. Each PA assembly 120 includes four circulators 112 , and one second sub-board 220 is used to accommodate one PA assembly 120. The printed circuit board has a length of 300-700 mm, a width of 200-500 mm, and a thickness of 3.0 mm; the second sub-board has a length of 50-80 mm, a width of 40-60 mm, and a thickness of 0.95 mm. The circulator 112 is positioned relatively centrally within the second sub-board 220, enabling reliable reflow soldering.

[0094] Please refer to FIG8 , which is a flow chart of a method for assembling a printed circuit board device according to an embodiment of the present application. As shown in FIG8 , the method includes the following steps:

[0095] Step 810: embedding a magnetic material portion into a target position of a printed circuit board and fixing the target position to correspond to the magnetic device, so that the magnetic material portion and the magnetic device attract each other.

[0096] In an embodiment of the present application, the magnetic material portion can be buried in a target position of a printed circuit board, and the target position can be an internal position of the printed circuit board. The magnetic device can be a circulator. The methods of burying the magnetic material portion include but are not limited to a straight-through type, a T-shaped structure method, and a blind groove method. Specifically, the straight-through type can be used to dig through the target position of the printed circuit board, and the magnetic material portion can be fixed by using insulating glue. The T-shaped structure method can bury magnetic material portions of various structures in the printed circuit board, and the various structures include T-shaped magnetic material portions, and the magnetic material portion can be partially buried in the printed circuit board. The blind groove method can bury the magnetic material portion inside the printed circuit board, and the magnetic material portion cannot be seen from the outside of the printed circuit board.

[0097] Step 820: attaching the magnetic component to a target position on the printed circuit board using a fixing agent.

[0098] In an embodiment of the present application, the fixing agent can be solder paste. By setting the solder paste at the target position of the printed circuit board, and then patching the magnetic device to the solder paste position, due to the attraction between the magnetic device and the magnetic material part, the magnetic device and the printed circuit board are fixed by magnetic force.

[0099] Step 830: Place the magnetic device and the printed circuit board into a soldering furnace for soldering to obtain a printed circuit board assembly.

[0100] In the embodiment of the present application, the fixed magnetic device and the printed circuit board can be placed in a reflow oven for welding. After welding, a stable solder joint is formed between the magnetic device and the printed circuit board to obtain a final printed circuit board device.

[0101] In an embodiment of the present application, a magnetic material portion is embedded in a target position on a printed circuit board and fixed, the target position corresponding to a magnetic device, so that the magnetic material portion and the magnetic device attract each other; the magnetic device is mechanically attached to the target position on the printed circuit board using a fixing agent; the magnetic device and the printed circuit board are placed in a soldering furnace for soldering, thereby obtaining a printed circuit board assembly. Thus, by embedding the magnetic material portion in the printed circuit board at a position corresponding to the magnetic device, the magnetic material portion and the magnetic device attract each other, thereby increasing the positive pressure of the magnetic device on the printed circuit board, further increasing the friction between the magnetic device and the printed circuit board, and fixing the magnetic device using the fixing agent, thereby preventing adjacent magnetic devices from attracting or repelling each other before and during soldering of the printed circuit board, thereby preventing displacement of the magnetic devices.

[0102] Please refer to FIG9 , which is a flow chart of a method for assembling a printed circuit board device according to an embodiment of the present application. As shown in FIG9 , the method includes the following steps:

[0103] Step 910: embedding a magnetic material portion into a target position of a printed circuit board and fixing the target position to correspond to the magnetic device, so that the magnetic material portion and the magnetic device attract each other.

[0104] In an embodiment of the present application, the magnetic material portion can be buried in a target position of a printed circuit board, the target position can be an internal position of the printed circuit board, the magnetic device can be a circulator, and the manner of burying the magnetic material portion includes but is not limited to a straight-through type, a T-shaped structure method, and a blind groove method. Specifically, the target position of the printed circuit board can be dug through by the straight-through type, and the magnetic material portion can be fixed by using insulating glue. The T-shaped structure method can bury magnetic material portions of various structures in the printed circuit board, and the various structures include T-shaped magnetic material portions. The blind groove can bury the magnetic material portion inside the printed circuit board, and the magnetic material portion cannot be seen from the outside of the printed circuit board.

[0105] Step 920: Fix the printed circuit board and the first daughter board together.

[0106] In the embodiment of the present application, a fixing agent (such as solder paste) can be used to fix the printed circuit board and the first sub-board together. Specifically, the printed circuit board and the first sub-board can be tinned separately, and then the printed circuit board and the first sub-board can be assembled together after tinning.

[0107] Step 930: attaching the magnetic device to a designated position on the first sub-board by a fixing agent, where the designated position corresponds to the target position.

[0108] In the embodiment of the present application, the fixing agent may be solder paste, and solder paste may be printed on a designated position of the first sub-board, and then the magnetic component may be machine-attached to the designated position of the first sub-board.

[0109] Step 940: Place the first sub-board on which the magnetic device is provided and the printed circuit board into a welding furnace for welding to obtain a printed circuit board assembly.

[0110] In an embodiment of the present application, after the magnetic device is machine-mounted, the magnetic device and the printed circuit board are attracted to each other by magnetic force and gravity and are combined together. The combined device is then placed in a reflow oven for soldering. After soldering, stable solder joints are formed between the magnetic device, the first sub-board, and the printed circuit board, thereby obtaining a final printed circuit board device.

[0111] In an embodiment of the present application, a magnetic material portion is embedded in a target position of a printed circuit board and fixed, the target position corresponding to the magnetic device, so that the magnetic material portion and the magnetic device attract each other; the printed circuit board and a first sub-board are fixedly assembled together; the magnetic device is attached to a designated position on the first sub-board using a fixing agent, the designated position corresponding to the target position; the first sub-board with the magnetic device and the printed circuit board are placed in a soldering furnace for soldering, thereby obtaining a printed circuit board device. In this way, by embedding the magnetic material portion in a position of the printed circuit board corresponding to the magnetic device and then placing the magnetic device on the first sub-board, the magnetic material portion and the magnetic device attract each other through the first sub-board, thereby increasing the positive pressure of the magnetic device on the first sub-board, further increasing the friction between the magnetic device and the first sub-board, and fixing the magnetic device using the fixing agent, thereby preventing adjacent magnetic devices from attracting or repelling each other before and during soldering of the printed circuit board, thereby preventing the magnetic devices from shifting.

[0112] Please refer to FIG10 , which is a flow chart of a method for assembling a printed circuit board device according to an embodiment of the present application. As shown in FIG10 , the method includes the following steps:

[0113] Step 1010: embed a magnetic material portion into a target position of the second daughter board and fix it, wherein the target position corresponds to the magnetic device, so that the magnetic material portion and the magnetic device attract each other.

[0114] In an embodiment of the present application, the magnetic material portion can be buried in the target position of the second sub-board, the target position can be an internal position of the second sub-board, the magnetic device can be a circulator, and the method of burying the magnetic material portion includes but is not limited to a straight-through type, a T-shaped structure method and a blind groove method. Specifically, the target position of the second sub-board can be dug through by the straight-through type, and the magnetic material portion can be fixed by using insulating glue. The T-shaped structure method can bury magnetic material portions of various structures in the second sub-board, and the various structures include T-shaped magnetic material portions. The blind groove can bury the magnetic material portion inside the second sub-board, and the magnetic material portion cannot be seen from the outside of the second sub-board.

[0115] Step 1020: Fix and combine the printed circuit board and the second sub-board together.

[0116] In the embodiment of the present application, a fixing agent (such as solder paste) can be used to fix the printed circuit board and the second sub-board together. Specifically, the printed circuit board and the second sub-board can be tinned separately, and then the printed circuit board and the second sub-board can be assembled together after tinning.

[0117] Step 1030: attaching the magnetic device to the target position of the second sub-board using a fixing agent.

[0118] In the embodiment of the present application, the fixing agent may be solder paste, and the solder paste may be printed on the target position of the second sub-board, and then the magnetic component may be machine-attached to the target position of the second sub-board.

[0119] Step 1040: sending the second sub-board provided with the magnetic device and the printed circuit board into a welding furnace for welding to obtain a printed circuit board assembly.

[0120] In an embodiment of the present application, after the magnetic device is machine-mounted, the magnetic device and the printed circuit board are attracted to each other by magnetic force and gravity and are combined together. The combined device is then placed in a reflow oven for soldering. After soldering, stable solder joints are formed between the magnetic device, the first sub-board, and the printed circuit board, thereby obtaining a final printed circuit board device.

[0121] In an embodiment of the present application, a magnetic material portion is embedded in a target position of a second sub-board and fixed, the target position corresponding to a magnetic device, so that the magnetic material portion and the magnetic device attract each other; the printed circuit board and the second sub-board are fixedly assembled together; the magnetic device is attached to the target position of the second sub-board via a fixing agent; the second sub-board with the magnetic device and the printed circuit board are placed in a soldering furnace for soldering, thereby obtaining a printed circuit board assembly. In this way, by embedding the magnetic material portion in the second sub-board at a position corresponding to the magnetic device, the magnetic material portion and the magnetic device attract each other via the second sub-board, thereby increasing the positive pressure of the magnetic device on the second sub-board, further increasing the friction between the magnetic device and the second sub-board, and fixing the magnetic device via the fixing agent, thereby preventing adjacent magnetic devices from attracting or repelling each other and causing displacement of the magnetic devices before and during soldering of the printed circuit board.

[0122] At the same time, it should be understood that a printed circuit board device provided in an embodiment of the present application can have the following beneficial effects: First, it is simple to operate and low in cost. The printed circuit board device can ensure product miniaturization, improve product competitiveness, meet product performance indicators, and has broad application prospects in castle board welding in the field of electronic assembly; Second, the method provided in the present application can optimize the design of the printed circuit board device without changing the miniaturization layout of the product and affecting the performance of the product. The magnetic material part is buried at the PCB position at the bottom of the middle pad of the magnetic device to achieve product miniaturization, which is also conducive to processing and disassembly, and can be recycled.

[0123] In addition, as shown in FIG11 , an embodiment of the present application may further provide an electronic device 1100, which may include the printed circuit board assembly 1110 mentioned in any of the above embodiments. The electronic device 1100 may be a base station (e.g., a 4G base station, a 5G base station, or a 6G base station), and the printed circuit board assembly 1110 may be installed in the base station.

[0124] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0125] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A printed circuit board device, wherein: include: target components and printed circuit boards; The target component includes a magnetic device; the magnetic device is connected to the printed circuit board through a magnetic material portion arranged outside the magnetic device; the magnetic material portion and the magnetic device attract each other.

2. The printed circuit board arrangement according to claim 1, wherein: The magnetic material portion is disposed in the printed circuit board; The magnetic device is disposed on a surface of the magnetic material portion.

3. The printed circuit board arrangement according to claim 2, wherein: The magnetic device is at least partially in contact with the magnetic material portion.

4. The printed circuit board arrangement according to claim 2, wherein: The printed circuit board has a first surface and a second surface opposite to the first surface; the magnetic device is arranged on the first surface of the printed circuit board; The magnetic material portion has a third surface and a fourth surface. The third surface of the magnetic material portion is flush with the first surface of the printed circuit board, and the fourth surface of the magnetic material portion is flush with the second surface of the printed circuit board.

5. The printed circuit board arrangement according to claim 4, wherein: A vertical projection of the magnetic device on the first surface of the printed circuit board coincides with the third surface of the magnetic material portion.

6. The printed circuit board arrangement according to claim 2, wherein: The printed circuit board device further comprises a first sub-board; the magnetic device is arranged on the first sub-board, and the first sub-board is connected to the printed circuit board; The magnetic device is connected to the magnetic material portion through the first sub-plate.

7. The printed circuit board arrangement according to claim 1, wherein: The printed circuit board device further comprises a second sub-board; the magnetic device is arranged on the second sub-board, and the second sub-board is connected to the printed circuit board; The magnetic material portion is disposed in the second sub-plate, and the magnetic device is disposed on a surface of the magnetic material portion.

8. The printed circuit board arrangement according to claim 7, wherein: The magnetic device is at least partially in contact with the magnetic material portion.

9. The printed circuit board arrangement according to claim 7, wherein: The second sub-board has a fifth surface and a sixth surface opposite to the fifth surface; the fifth surface of the second sub-board is in contact with the magnetic device, and the sixth surface of the second sub-board is in contact with the printed circuit board; The magnetic material portion has a third surface and a fourth surface. The third surface of the magnetic material portion is flush with the fifth surface of the second sub-plate, and the fourth surface of the magnetic material portion is flush with the sixth surface of the second sub-plate.

10. The printed circuit board arrangement according to claim 9, wherein: A vertical projection of the magnetic device on the fifth surface of the second sub-plate coincides with the third surface of the magnetic material portion.

11. The printed circuit board arrangement according to claim 1, wherein: The printed circuit board has a first surface and a second surface opposite to the first surface; the magnetic device is arranged on the first surface, and the magnetic material part is arranged on the second surface of the printed circuit board; The arrangement position of the magnetic material portion on the second surface corresponds to the arrangement position of the magnetic device on the first surface.

12. The printed circuit board arrangement according to claim 11, wherein: The magnetic material portion includes a magnet; the printed circuit board device also includes a tray; and the tray is used to support the magnet.

13. The printed circuit board arrangement according to any one of claims 1 to 12, wherein: The target component is a power amplifier component, and the magnetic device is a circulator.

14. An electronic device, wherein: Comprising a printed circuit board arrangement according to any one of claims 1-13.

15. A method for assembling a printed circuit board device, wherein: include: Embedding a magnetic material portion in a target position of a printed circuit board and fixing the target position corresponding to a magnetic device so that the magnetic material portion and the magnetic device attract each other; affixing the magnetic device to a target position of the printed circuit board by a fixing agent; The magnetic device and the printed circuit board are sent into a welding furnace for welding to obtain a printed circuit board device.

16. A method for assembling a printed circuit board device, wherein: include: Embedding a magnetic material portion in a target position of a printed circuit board and fixing the target position corresponding to a magnetic device so that the magnetic material portion and the magnetic device attract each other; The printed circuit board and the first sub-board are fixedly assembled together; affixing the magnetic device to a designated position on the first sub-board by a fixing agent, wherein the designated position corresponds to the target position; The first sub-board on which the magnetic device is arranged and the printed circuit board are sent into a welding furnace for welding to obtain a printed circuit board device.

17. A method for assembling a printed circuit board device, wherein: include: Embedding the magnetic material portion in a target position of the second sub-board and fixing it, the target position corresponds to the magnetic device, so that the magnetic material portion and the magnetic device attract each other; Fixing and combining the printed circuit board and the second sub-board together; affixing the magnetic device to the target position of the second sub-board by a fixing agent; The second sub-board on which the magnetic device is arranged and the printed circuit board are sent into a welding furnace for welding to obtain a printed circuit board device.

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