Processing platform and coating apparatus

Abstract

Disclosed in the present invention are a processing platform and a coating apparatus. One side of the processing platform in a first direction is provided with a bearing side, and the bearing side is provided with a bearing face, the bearing face being used for coming into contact with a base material; and the processing platform is provided with an air output channel, the air output channel comprising an air outlet, which is located on a circumferential outer side of the bearing face, and the air output channel being used for introducing isolation gas. The air outlet being disposed on the circumferential outer side of the bearing face enables the isolation gas introduced through the air output channel to flow to a circumferential edge of the base material, thereby limiting the distribution of precursors and reactants by means of the isolation gas; thus, the precursors and the reactants may fall onto a coating surface, such that the probability of warp plating is reduced, ensuring the coating uniformity, improving the production yield.

Description

Processing platform and coating equipment Technical Field

[0001] The present invention relates to the technical field of deposition coating, and in particular to a processing platform and coating equipment. Background Art

[0002] The vacuum coating process using atomic layer deposition (ALD) enables uniform and dense deposition on complex devices. In related technologies, ALD equipment is used alternately, allowing precursors and reactants to pass through a vacuum chamber for deposition on the substrate. During the deposition process, the non-coated surface of the substrate is prone to wrap-around deposition, resulting in deposition on the non-coated surface. This wrap-around deposition also affects the uniformity of the edges of the coated surface, impacting production yield. Therefore, it is necessary to research and address this issue.

[0003] Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a processing platform that can reduce the probability of the occurrence of the plating wrap phenomenon and improve the production yield.

[0005] The present invention also provides a coating device having the processing platform.

[0006] According to the processing platform of an embodiment of the present invention, the processing platform is provided with a bearing side on one side of the first direction, the bearing side has a bearing surface, and the bearing surface is used to contact with the substrate. The processing platform is provided with an air outlet channel, and the air outlet channel includes an air outlet port, and the air outlet port is located on the circumferential outside of the bearing surface. The air outlet channel is used to allow isolation gas to pass through.

[0007] The processing platform according to the embodiment of the present invention has at least the following beneficial effects: the gas outlet is arranged on the circumferential outside of the supporting surface, so that the isolation gas introduced into the gas outlet channel can flow to the circumferential edge of the substrate, so as to limit the distribution of the precursor and the reactant through the isolation gas, so that the precursor and the reactant fall on the coating surface, reducing the probability of the wrap-around plating phenomenon, ensuring the uniformity of the coating, and improving the production yield.

[0008] According to some embodiments of the present invention, the processing platform includes a base and a first air guide member, the base is provided with an air inlet hole, and the air inlet hole is used to pass the insulating gas; the first air guide member and the base are stacked in sequence along the first direction, the bearing surface is provided on the surface of the first air guide member facing away from the base, the first air guide member is provided with an air guide groove on the side facing the base, the air guide groove and the air inlet hole are connected to each other, and the air guide groove and the air inlet hole jointly define an air outlet channel, and the air guide groove extends in a direction perpendicular to the first direction to the circumferential surface of the first air guide member and forms the air outlet.

[0009] According to some embodiments of the present invention, the base is provided with a plurality of air inlet holes, the processing platform includes a plurality of the first air guide members, each of the first air guide members is arranged at intervals on the base, the air guide groove of each of the first air guide members is respectively interconnected with at least one of the air inlet holes, and each of the air inlet holes and the correspondingly connected air guide grooves respectively define the air outlet channel.

[0010] According to some embodiments of the present invention, the processing platform also includes a second air guide, the first air guide and the base are stacked in sequence along the first direction, the second air guide is spaced apart on the circumferential outside of the first air guide, the projection of the second air guide in the first direction can have at least a portion falling on the coating surface of the substrate, the end face of the second air guide facing away from the base has a distance H1 from the base, the end face of the first air guide facing away from the base has a distance H2 from the base, satisfying: H1<H2.

[0011] According to some embodiments of the present invention, a second air guide is further included, the first air guide and the base are stacked in sequence along the first direction, the second air guide is spaced apart on the circumferential outside of the first air guide, the second air guide is provided with a continuous first step and a second step on the side facing the first air guide, the first step and the second step are arranged in sequence along the direction facing the first air guide, the projection of the second step in the first direction can have at least a part falling on the coating surface of the substrate, the end face of the first step facing away from the base has a distance L1 from the base, the end face of the second step facing away from the base has a distance L2 from the base, the end face of the first air guide facing away from the base has a distance L3 from the base, satisfying: L1>L2, L3>L2.

[0012] According to some embodiments of the present invention, a sealing groove is provided on the side of the base and / or the first air guide member facing each other, and the sealing groove is arranged around the circumference of the first air guide member. The sealing groove is located on the inner side of the first air guide member perpendicular to the first direction relative to the air guide groove, and the processing platform also includes a sealing member, which is filled in the sealing groove.

[0013] According to some embodiments of the present invention, the processing platform is also provided with an air suction hole, which extends to the surface of the first air guide member facing away from the base and forms an opening, and the opening of the air suction hole is located on the supporting surface, and the air suction hole is located on the inner side of the supporting surface relative to the sealing groove, and the air suction hole is used to connect to a negative pressure source.

[0014] According to some embodiments of the present invention, the opening direction of the air outlet is co-directional with the first direction, and the air outlet is extended around the supporting surface; or, the air outlet channel includes a plurality of the air outlets, and each of the air outlets is arranged around the supporting surface.

[0015] According to some embodiments of the present invention, the processing platform is provided with a heating element, and the heating element is used to heat the substrate.

[0016] According to some embodiments of the present invention, the processing platform is further provided with an air suction hole, which extends to the surface of the bearing side of the processing platform and forms an opening. The opening of the air suction hole is located on the bearing surface, and the air suction hole is used to connect to a negative pressure source.

[0017] According to an embodiment of the present invention, the coating equipment includes a coating component, a gas source and a processing platform of any of the above embodiments, the coating component is arranged at intervals on the carrying side of the processing platform, and the coating component is used to coat the substrate carried by the processing platform; the gas source is connected to the gas outlet channel, and the gas source is used to output isolation gas.

[0018] The coating equipment according to the embodiment of the present invention has at least the following beneficial effects: by applying the processing platform of the embodiment of the present application, the probability of the coating wrap phenomenon occurring during the coating operation of the coating component can be reduced, thereby improving the production yield.

[0019] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0021] FIG1 is an exploded schematic diagram of a processing platform according to an embodiment of the present invention;

[0022] FIG2 is a schematic diagram of a processing platform according to an embodiment of the present invention;

[0023] FIG3 is a cross-sectional view of a processing platform according to an embodiment of the present invention;

[0024] FIG4 is an enlarged schematic diagram of point a in FIG3 ;

[0025] FIG5 is an exploded schematic diagram of a processing platform according to another embodiment of the present invention;

[0026] FIG6 is a schematic diagram of a processing platform according to another embodiment of the present invention;

[0027] FIG7 is a cross-sectional view of a processing platform according to another embodiment of the present invention;

[0028] FIG8 is an enlarged schematic diagram of point b in FIG7 .

[0029] Reference numerals:

[0030] Base 100, air inlet 101, sealing groove 102, sealing member 110, first air guide member 120, bearing surface 121, air guide groove 122, air outlet channel 130, air outlet 131, second air guide member 140, first step 141, second step 142, air guide channel 143, air intake hole 150, substrate 200, and coating surface 210. DETAILED DESCRIPTION

[0031] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0032] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0033] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0034] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0035] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0036] In response to the problem that coating equipment in related technologies is prone to the phenomenon of wrap-around plating, the present application provides an air outlet channel on the processing platform and introduces an isolation gas into the air outlet channel so that the isolation gas can be distributed along the circumferential outer side of the substrate, thereby limiting the distribution of precursors and reactants during the coating process and effectively reducing the probability of the wrap-around plating phenomenon.

[0037] The following describes the processing platform and coating equipment of the present application with reference to the accompanying drawings. It should be noted that the first direction is shown in the drawings as an up-down direction, with the upside being the direction of the load-bearing side of the processing platform. In Figures 3 and 7 , the circumferential outward direction is shown as a left-right direction. In this application, the circumferential direction refers to the direction perpendicular to the first direction.

[0038] 1 to 4 , according to a processing platform of an embodiment of the present invention, a supporting side is provided on one side of the processing platform in the first direction, the supporting side having a supporting surface 121, the supporting surface 121 being used to contact the substrate 200, and the processing platform being provided with an air outlet channel 130, the air outlet channel 130 including an air outlet port 131, the air outlet port 131 being located on the circumferential outside of the supporting surface 121, and the air outlet channel 130 being used to introduce an isolation gas. The air outlet port 131 is arranged on the circumferential outside of the supporting surface 121, so that the isolation gas introduced by the air outlet channel 130 can flow to the circumferential edge of the substrate 200, so as to limit the distribution of the precursor and the reactant through the isolation gas, so that the precursor and the reactant fall on the coating surface 210, reduce the probability of the occurrence of the wrap-around plating phenomenon, ensure the uniformity of the coating, and improve the production yield. Among them, the isolation gas can reduce the aggregation of the precursor and the reactant on the circumferential side of the substrate 200, avoid the edge film layer of the substrate 200 being too thick, thereby improving the uniformity of the coating.

[0039] The supporting surface 121 of the processing platform may be in contact with a portion of the surface of the substrate 200 facing the processing platform, or may be in contact with the entire surface of the substrate 200 facing the processing platform. The supporting surface 121 is the portion of the surface of the processing platform on the supporting side that contacts the substrate, that is, the supporting surface 121 may be only a portion of the surface of the processing platform on the supporting side.

[0040] 4 , in some embodiments, the opening direction of the gas outlet 131 is co-directional with the first direction, and the gas outlet 131 is extended around the bearing surface 121 so that when the gas outlet 131 blows out the isolation gas, the isolation gas moves upward to form a vertical gas wall in the circumferential direction of the substrate 200, thereby limiting the precursors and reactants to the range surrounded by the gas outlet 131 and reducing the probability of the plating phenomenon. The gas outlet 131 can be extended into an annular opening connected end to end. Alternatively, in other embodiments, the gas outlet channel 130 includes a plurality of gas outlets 131, each gas outlet 131 is arranged around the bearing surface 121, and a surrounding gas wall can also be formed by the arrangement of the plurality of gas outlets 131. The plurality of gas outlets 131 can be point-shaped openings or strip-shaped openings with a certain extension length along the circumference of the bearing surface 121.

[0041] 3 and 4 , in some embodiments, the processing platform includes a base 100 and a first air guide 120 , wherein the base 100 is provided with an air inlet 101 for introducing an isolation gas. The first air guide 120 and the base 100 are stacked in sequence along a first direction, a bearing surface 121 is provided on a surface of the first air guide 120 facing away from the base 100 , and an air guide groove 122 is provided on a side of the first air guide 120 facing the base 100 . The air guide groove 122 and the air inlet 101 are interconnected, and the air guide groove 122 and the air inlet 101 jointly define an air outlet channel 130 . The air guide groove 122 extends in a direction perpendicular to the first direction to the circumferential surface of the first air guide 120 and forms an air outlet 131 . The air guide groove 122 of the first air guide 120 can guide the air from the air inlet 101, so that the air is emitted in a direction perpendicular to the first direction when it is discharged from the air outlet 131, so that the isolation gas is emitted along the circumference of the substrate 200, thereby reducing the probability of the precursor and reactant being blown in the opposite direction toward the first direction, so that the precursor and reactant can fall more evenly on the coating surface 210. In addition, after entering the air outlet channel 130, the inert gas first contacts the first air guide 120 to slow down the wind speed through the first air guide 120. Compared with direct contact between the inert gas and the substrate 200, the probability of the inert gas blowing the substrate 200 toward the first direction to cause it to move can be reduced, thereby ensuring processing stability.

[0042] It should be noted that when the air outlet is located at the outer edge of the bearing surface 121, it should also be regarded as being located circumferentially outside the bearing surface 121 in this application, that is, the position of the air outlet can coincide with the outer edge of the bearing surface 121.

[0043] Specifically, the air inlet 101 can be configured to extend along a first direction, with the air inlet of the air inlet 101 formed on the underside of the base 100 to facilitate pipe connection to the gas source. In embodiments where multiple air inlet holes 101 are provided, the air inlet 101 can be positioned near the outer edge of the support surface 121 to reduce the movement path of the isolation gas and reduce wind resistance. In embodiments where only a single air inlet 101 is provided, the air inlet 101 can be positioned at the center of the support surface 121 to ensure uniform discharge of the isolation gas around the support surface 121.

[0044] The first air guide 120 can be integrally formed with the base 100 to improve integrity and reduce assembly steps. Alternatively, the first air guide 120 can be detachably connected to the base 100, or connected in abutting fashion. When dealing with substrates 200 of varying sizes, the first air guide 120 of varying sizes can be replaced to ensure the anti-circular plating effect for substrates 200 of varying sizes, thereby improving applicability.

[0045] 3 and 4 , in some embodiments, the processing platform further includes a second air guide 140 , the first air guide 120 and the base 100 are stacked in sequence along a first direction, the second air guide 140 is spaced apart on the circumferential outside of the first air guide 120 , and the projection of the second air guide 140 in the first direction can have at least a portion falling on the coating surface 210 of the substrate 200 , the end surface of the second air guide 140 facing away from the base 100 is spaced apart from the base 100 by a distance H1 , and the end surface of the first air guide 120 facing away from the base 100 is spaced apart from the base 100 by a distance H2 , satisfying: H1 < H2 . When the substrate 200 is placed on the load-bearing side, the load-bearing surface 121 contacts a portion of the substrate 200 , and a portion of the second air guide 140 is located on the lower side of the substrate 200 . Since the second air guide member 140 and the first air guide member 120 have a distance in the first direction, and H1<H2, an air guide channel 143 is defined between the first air guide member 120, the second air guide member 140 and the substrate 200, so that after the isolation gas is ejected from the air outlet, it will enter the air guide channel 143, and first move toward the upper side, and then move toward the left side to be ejected from the circumferential edge of the substrate 200.

[0046] Among them, in order to ensure the anti-coating effect of the isolation gas, it is necessary to make the isolation gas adhere to the substrate 200 as much as possible for emission to ensure the anti-coating effect. If the isolation gas is finally emitted from the air outlet 131, the thickness of the first air guide 120 in the first direction is required to have a smaller size. After the first air guide 120 is reduced in size, it is easy to be blown by the gas incident from the air inlet 101, and the strength is low, the life is poor, and the requirements for processing accuracy will also increase accordingly. By setting the second air guide 140 for further air guidance, it is possible to achieve the cross-sectional area and position of the isolation gas when it is finally discharged through the height difference between the end face of the second air guide 140 and the first air guide 120 in the first direction relative to the base 100, under the premise that the first air guide 120 has a certain thickness, so that the isolation gas can be attached to the substrate 200 as much as possible for discharge.

[0047] Among them, by replacing the second air guide 140 of different sizes, the first air guide 120 can be matched to adapt to the processing of substrates 200 of different sizes, and the applicability is strong.

[0048] 7 and 8 , in other embodiments where the processing platform includes a second air guide 140, the first air guide 120 and the base 100 are stacked in sequence along a first direction, the second air guide 140 is spaced apart on the circumferential outside of the first air guide 120, the second air guide 140 is provided with a continuous first step 141 and a second step 142 on the side facing the first air guide 120, the first step 141 and the second step 142 are sequentially arranged in the direction toward the first air guide 120, the projection of the second step 142 in the first direction can have at least a portion falling on the coating surface 210 of the substrate 200, the end face of the first step 141 facing away from the side of the base 100 has a spacing L1 with the base 100, the end face of the second step 142 facing away from the side of the base 100 has a spacing L2 with the base 100, the end face of the first air guide 120 facing away from the side of the base 100 has a spacing L3 with the base 100, satisfying: L1>L2, L3>L2. Similarly, when the substrate 200 is placed on the supporting side, the supporting surface 121 contacts a portion of the substrate 200, and a portion of the first step 141 is located below the substrate 200. Because the first step 141 and the second step 142 are spaced apart from the first air guide 120 in the first direction, and L1>L2 and L3>L2, an air guide channel 143 is defined between the first air guide 120, the first step 141, the second step 142, and the substrate 200, so that after the isolation gas is emitted from the air outlet, it enters the air guide channel 143, moves first upward, then to the left, and then moves upward again to be emitted from the circumferential edge of the substrate 200 in the first direction.

[0049] Similarly, the second air guide 140 can, under the premise that the first air guide 120 has a certain thickness, achieve the desired cross-sectional area and position of the isolation gas when it is finally discharged through the height difference between the first step 141 and the end surface of the first air guide 120 in the first direction relative to the base 100, and through the height difference between the second step 142 and the end surface of the first air guide 120 in the first direction relative to the base 100, so that the isolation gas can be discharged as close to the substrate 200 as possible. The first step 141 can also be provided to allow the isolation gas to be discharged along the first direction, thereby achieving an anti-circular plating effect.

[0050] Referring to Figure 4, as another improvement of the above-mentioned scheme, a sealing groove 102 is provided on the side where the base 100 and the first air guide 120 face each other. The sealing groove 102 is arranged around the circumference of the first air guide 120. The sealing groove 102 is located on the inner side of the first air guide 120 perpendicular to the first direction relative to the air guide groove 122. The processing platform also includes a sealing member 110, which is filled in the sealing groove 102 to achieve a sealing effect, ensuring that the isolation gas flows toward the circumferential outside of the first air guide 120, reducing part of the gas from flowing toward the inner side of the first air guide 120 from the gap between the first air guide 120 and the base 100 due to errors such as processing errors, thereby affecting the anti-plating effect.

[0051] In other embodiments, a sealing groove 102 is provided on the side of the first air guide 120 and the base 100 facing each other to achieve a sealing effect in cooperation with the sealing member 110. Alternatively, in other embodiments, a sealing groove 102 is provided on both the side of the first air guide 120 and the base 100 facing each other to accommodate the sealing member 110.

[0052] 3 and 7 , in some embodiments, the processing platform is further provided with an air intake hole 150 , which extends to the surface of the supporting side of the processing platform and forms an opening. The opening of the air intake hole 150 is located on the supporting surface 121 . The air intake hole 150 is used to connect to a negative pressure source, so that when the substrate 200 is placed on the supporting surface 121 , the substrate 200 can be adsorbed through the air intake hole 150 , thereby temporarily positioning the substrate 200 on the processing platform, reducing the probability of the substrate 200 running off the track, and ensuring production yield. Compared to the method of using a fixture for temporary positioning, this method can reduce wear on the surface of the substrate 200 and reduce the space requirement on the side of the coating surface 210 of the substrate 200, so that the coating surface 210 of the substrate 200 and the coating assembly can be set closer.

[0053] In an embodiment where the processing platform includes a base 100 and a first air guide 120, the air intake hole 150 extends to the surface of the first air guide 120 facing away from the base 100 to achieve adsorption of the substrate 200. The air intake hole 150 can be configured to extend entirely along the first direction to form an opening on the underside of the base 100, facilitating continued pipe connection to the negative pressure source.

[0054] Further, referring to Figures 3 and 4, in an embodiment in which a sealing groove 102 is provided on the processing platform, the suction hole 150 is located on the inner side of the bearing surface 121 relative to the sealing groove 102, so as to utilize the sealing groove 102 and the seal 110 to isolate the outlet gas of the outlet channel 130 and the intake gas of the suction hole 150, thereby reducing the probability of the isolation gas being sucked away by the suction hole 150 and ensuring that the processing is carried out correctly.

[0055] In some embodiments, the processing platform is provided with a heating element (not shown in the figure), which can heat the substrate 200 through heat conduction to improve heating efficiency and ensure correct processing. The heating element can be a conventional heating device such as a resistance wire or an electric heating tube disposed inside the processing platform. Specifically, the heating element can be disposed inside the base 100 or inside the first air guide 120.

[0056] 5 to 8 , in some embodiments, the base 100 is provided with a plurality of air inlet holes 101, and the processing platform includes a plurality of first air guides 120, each of which is spaced apart on the base 100, and the air guide groove 122 of each first air guide 120 is respectively connected to at least one air inlet hole 101, and each air inlet hole 101 and the corresponding connected air guide groove 122 respectively define an air outlet channel 130. The provision of the plurality of first air guides 120 enables the processing platform to have a plurality of bearing surfaces 121 for respectively carrying a plurality of substrates 200, and the air guide groove 122 of each first air guide 120 is respectively connected to at least one air inlet hole 101, so that the substrates 200 carried by each first air guide 120 can all use the isolation gas to achieve the effect of preventing plating, thereby realizing batch processing.

[0057] The outer circumference of each first air guide 120 may be correspondingly provided with a second air guide 140 for guiding air. The outer circumference of each first air guide 120 may be correspondingly provided with a single second air guide 140. Alternatively, a single second air guide 140 may be provided with multiple through holes to enclose multiple first air guides 120, thereby improving the integrity and facilitating the positioning and assembly of the second air guide 140 on the base 100.

[0058] 1 to 8 , a coating apparatus according to an embodiment of the present invention includes a coating assembly (not shown in the figures), a gas source (not shown in the figures), and a processing platform of any of the above-described embodiments. The coating assembly is spaced apart on the supporting side of the processing platform, and the coating assembly is used to coat the substrate 200 carried by the processing platform. The gas source is connected to the gas outlet channel 130, and the gas source is used to output isolation gas. By applying the processing platform of the embodiment of the present application, the probability of the coating assembly being subjected to the coating operation can be reduced and the coating uniformity can be improved, thereby improving the production yield.

[0059] Among them, the coating component can be selected as a conventional coating deposition component in this field, and the gas source can be selected as a high-pressure container storing isolation gas, so as to provide isolation gas when connected to the gas outlet channel 130. The isolation gas can be selected as an ordinary gas such as nitrogen that does not react with the precursor and reactant, or it can be selected as an inert gas with stable properties such as helium.

[0060] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. Processing platform, characterized in that, The processing platform is provided with a bearing side on one side of the first direction, the bearing side has a bearing surface, and the bearing surface is used to contact the substrate. The processing platform is provided with an air outlet channel, and the air outlet channel includes an air outlet, and the air outlet is located on the circumferential outer side of the bearing surface. The air outlet channel is used to allow an isolation gas to pass through.

2. The processing platform according to claim 1, characterized in that: include: The base is provided with an air inlet hole, and the air inlet hole is used to introduce the isolation gas; A first air guide member, the first air guide member and the base are stacked in sequence along the first direction, the bearing surface is arranged on the surface of the first air guide member on the side facing away from the base, an air guide groove is arranged on the side of the first air guide member facing the base, the air guide groove and the air inlet hole are connected to each other, the air guide groove and the air inlet hole jointly define an air outlet channel, the air guide groove extends along a direction perpendicular to the first direction to the circumferential surface of the first air guide member and forms the air outlet.

3. The processing platform according to claim 2, characterized in that: The base is provided with a plurality of air inlet holes, and the processing platform includes a plurality of the first air guide members, each of which is arranged at intervals on the base, and the air guide groove of each of the first air guide members is respectively interconnected with at least one of the air inlet holes, and each of the air inlet holes and the correspondingly connected air guide grooves respectively define the air outlet channel.

4. The processing platform according to claim 2 or 3, characterized in that: It also includes a second air guide member, the first air guide member and the base are stacked in sequence along the first direction, the second air guide member is spaced apart on the circumferential outer side of the first air guide member, the projection of the second air guide member in the first direction can have at least a portion falling on the coating surface of the substrate, the end surface of the second air guide member facing away from the base has a spacing H1 with the base, the end surface of the first air guide member facing away from the base has a spacing H2 with the base, satisfying: H1<H2.

5. The processing platform according to claim 2 or 3, characterized in that: It also includes a second air guide member, the first air guide member and the base are stacked in sequence along the first direction, the second air guide member is arranged at intervals on the circumferential outer side of the first air guide member, the second air guide member is provided with a continuous first step and a second step on the side facing the first air guide member, the first step and the second step are arranged in sequence along the direction facing the first air guide member, the projection of the second step in the first direction can have at least a part falling on the coating surface of the substrate, the end face of the first step facing away from the base has a spacing L1 with the base, the end face of the second step facing away from the base has a spacing L2 with the base, the end face of the first air guide facing away from the base has a spacing L3 with the base, satisfying: L1>L2, L3>L2.

6. The processing platform according to claim 2 or 3, characterized in that: A sealing groove is provided on the side where the base and / or the first air guide member face each other, and the sealing groove is arranged around the circumference of the first air guide member. The sealing groove is located on the inner side of the first air guide member perpendicular to the first direction relative to the air guide groove, and the processing platform also includes a sealing member, which is filled in the sealing groove.

7. The processing platform according to claim 6, characterized in that: The processing platform is also provided with an air suction hole, which extends to the surface of the first air guide member facing away from the base and forms an opening. The opening of the air suction hole is located on the bearing surface. The air suction hole is located on the inner side of the bearing surface relative to the sealing groove. The air suction hole is used to connect to a negative pressure source.

8. The processing platform according to claim 1, characterized in that: The opening direction of the air outlet is co-directional with the first direction, and the air outlet is extended around the bearing surface; or, the air outlet channel includes a plurality of the air outlets, and each of the air outlets is arranged around the bearing surface.

9. The processing platform according to claim 1, characterized in that: The processing platform is provided with a heating element, and the heating element is used to heat the substrate.

10. The processing platform according to claim 1, characterized in that: The processing platform is also provided with an air suction hole, which extends to the surface of the bearing side of the processing platform and forms an opening. The opening of the air suction hole is located on the bearing surface, and the air suction hole is used to connect to a negative pressure source.

11. A coating device, characterized in that: include: The processing platform according to any one of claims 1 to 10; A coating assembly, arranged at intervals on the carrying side of the processing platform, for coating the substrate carried by the processing platform; A gas source is connected to the gas outlet channel and is used to output the isolation gas.

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