A cooling plate

Abstract

The present invention relates to a cooling plate (1) which enables high temperatures generated particularly in the modules of electronic devices to be cooled by means of a liquid.

Description

[0001] A COOLING PLATE

[0002] Technical Field

[0003] The present invention relates to a cooling plate which enables high temperatures generated particularly in the modules of electronic devices to be cooled by means of a liquid.

[0004] Background of the Invention

[0005] Electronic modules are included in electronic devices and large power losses occur in the said modules. Large power losses occurring in the modules cause the high heat to be released. High temperature causes the electronic modules to heat up and become inoperable by burning out or to shorten their operating life due to high temperature. For this reason, the heat generated in the electronic modules is required to be removed. In the state of art, even though methods such as conduction cooling and air cooling are used for cooling the electronic modules and rapidly removing the generated heat from the environment, the known methods are insufficient in high-voltage power supplies. For this reason, today, there is a need for solutions which enable the module to be directly cooled for electronic modules with high power consumption.

[0006] The European patent document no. EP4178087A1, an application included in the state of the art, discloses a structure that enables liquid cooling to be performed on the motor electronic device in electric vehicles. In the said invention, there is a liquid cooling channel placed on the control unit in order to enable liquid cooling to be performed on the electronic device, and there is an inlet and outlet end in order to enable liquid flow through the channel. The cooling liquid enables the heat generated on the electronic device to be dissipated by entering from the inlet end. For example, the electronic device mentioned in the invention is a motor control unit. It is enabled to dissipate the heat generated on the control unit by means of the liquid passing through the liquid-cooled channel in contact with the motor control unit. In addition, the liquid cooling channel placed on the control unit is formed by welding a plurality of parts together and has an inlet and outlet opening to allow the cooling liquid to pass through it.

[0007] Summary of the Invention

[0008] An object of the present invention is to realize a cooling plate which enables the module to be cooled by directly contacting the cooling liquid, for the electronic modules that are located in electronic devices and have large power consumption.

[0009] Another object of the present invention is to realize a cooling plate which enables the high heat generated in high-voltage power electronics modules to be rapidly and efficiently removed from the environment and enables the electronic device to have a long lifespan by performing its functions without any problems.

[0010] A further object of the present invention is to realize a cooling plate which consists of a single piece; is in a leak-proof structure due to being a single piece; and operates independently from the device mechanics in which it is used.

[0011] Detailed Description of the Invention

[0012] “A Cooling Plate” realized to fulfd the objectives of the present invention is shown in the figures attached, in which:

[0013] Figure 1 is a perspective view of the body in an inventive cooling plate.

[0014] Figure 2 is a view of the body in an inventive cooling plate wherein the cover is welded on. Figure 3 is a perspective view of an inventive cooling plate wherein it comprises an opening.

[0015] Figure 4 is a sectioned view of an inventive cooling plate.

[0016] Figure 5 is an exploded view of the motor drive wherein an inventive cooling plate is used.

[0017] The components illustrated in the figures are individually numbered, where the numbers refer to the following:

[0018] 1. Cooling Plate

[0019] 2. Body

[0020] 3. Hole

[0021] 4. Gap

[0022] 5. Cover

[0023] 6. Opening

[0024] 7. Seal groove

[0025] E: Electronic Module

[0026] M: Motor Drive

[0027] An inventive cooling plate (1) which enables the electronic modules that are located in electronic devices and have large power consumption to be cooled by directly contacting the cooling liquid comprises at least one body (2) which has at least two holes (3) wherein the cooling liquid enters and exits and at least one gap (4) wherein the cooling liquid circulates between the two holes (3); at least one cover (5) which enables the water to flow in a closed channel by covering the top of the gap (4) located on the body (2) and has at least one opening (6) that enables the cooling liquid to directly contact the electronic module (E) by means of placing the electronic module (E) thereon. The body (2) included in the inventive cooling plate (1) comprises two holes (3) wherein the cooling liquid enters and exits, and a gap (4) formed by draining in the body (2) between the two holes (3). The gap (4) enables the cooling channel wherein the cooling fluid creates a flow by entering and exiting to be formed upon placing the cover (5) thereon. While the surface of the body (2) comprising the gap (4) provides cooling by direct water contact, the other surface provides cooling by conduction. For this reason, electronic modules (E) that will be cooled are placed on both surfaces of the body (2).

[0028] The cover (5) included in the inventive cooling plate (1) is fixed to the body (2) by means of a friction stir welding assembly. For this, the body (2) and the cover (5) are coupled to each other after being brought together by means of a fixture. The body (2) and the cover (5) are welded to each other under high temperature and pressure. The welding marks are removed from the surface of the body (2) by performing a skin-pass after the welding process.

[0029] In the preferred embodiment of the invention, the opening (6) is formed by performing a draining operation on the cover (5) surface after the cover (5) has been welded to the body (2). The seal groove (7) is located at the edges of the opening (6). The cooling liquid directly contacts the electronic module (E) without any leakage by placing the sealing element in the seal groove (7) and the electronic module (E) thereon. In this way, it is enabled to rapidly and efficiently remove the high heat generated in high-voltage power electronics modules (E) from the environment and to ensure that the electronic device continues to perform its functions without any problems.

[0030] The inventive cooling plate (1) is used inside a motor driver (M) and comprises an electronic module (E) wherein the liquid directly contacts and an electronic module (E) which is cooled by contacting the surface wherein the opening is not present thereon. (Figure 5) Industrial Application of the Invention

[0031] The inventive cooling plate (1) provides a cooling solution for one or more components independent from the mechanics of the electronic device. On the other hand, it can resist high pressures and does not require maintenance and repair as it consists of a single piece. On another hand, the invention allows the production of complex geometries as it is not produced by methods such as casting and injection.

[0032] Within these basic concepts; it is possible to develop various embodiments of the inventive “A Cooling Plate (1)”; the invention cannot be limited to examples disclosed herein and it is essentially according to claims.

Claims

CLAIMS1. An inventive cooling plate (1) which enables the electronic modules that are located in electronic devices and have large power consumption to be cooled by directly contacting the cooling liquid; characterized by at least one body (2) which has at least two holes (3) wherein the cooling liquid enters and exits and at least one gap (4) wherein the cooling liquid circulates between the two holes (3); at least one cover (5) which enables the water to flow in a closed channel by covering the top of the gap (4) located on the body (2) and has at least one opening (6) that enables the cooling liquid to directly contact the electronic module (E) by means of placing the electronic module (E) thereon.

2. A cooling plate (1) according to Claim 1; characterized by the body (2) which comprises two holes (3) wherein the cooling liquid enters and exits, and a gap (4) formed by draining in the body (2) between the two holes (3).

3. A cooling plate (1) according to Claim 1 or 2; characterized by the gap (4) which enables the cooling channel wherein the cooling fluid creates a flow by entering and exiting to be formed upon placing the cover (5) thereon.

4. A cooling plate (1) according to any one of the preceding claims; characterized by the body (2) whose surface comprising the gap (4) provides cooling by direct water contact, while the other surface provides cooling by conduction.

5. A cooling plate (1) according to any one of the preceding claims; characterized by the cover (5) which is fixed to the body (2) by means of a friction stir welding assembly.

6. A cooling plate (1) according to any one of the preceding claims; characterized by the opening (6) which is formed by performing a draining operation on the cover (5) surface after the cover (5) has been welded to the body (2).

7. A cooling plate (1) according to any one of the preceding claims; characterized by the opening (6) which has the seal groove (7) located at the edges thereof.

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