Liquid cooled ceramic window for inductively coupled plasma processing systems

Abstract

A liquid cooled ceramic window includes a first plate made of ceramic, comprising a cylindrical body, and including a first surface with at least one cooling channel. A second plate is made of ceramic and bonded to the first surface of the first plate to enclose the at least one cooling channel.

Description

LIQUID COOLED CERAMIC WINDOW FOR INDUCTIVELY COUPLED PLASMA PROCESSING SYSTEMSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 606,033 filed on December 4, 2023. The entire disclosure of the above application is incorporated herein by reference.FIELD

[0002] The present disclosure relates to substrate processing systems, and more particularly to a liquid cooled ceramic window for a substrate processing system.BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] During manufacturing of substrates such as semiconductor wafers, treatments such as deposition, etching and / or cleaning are performed on the substrate. The substrate is typically delivered by a robot onto a substrate support such as an electrostatic chuck (ESC) or a pedestal in a processing chamber. Process gases are introduced into the processing chamber via a gas distribution device and plasma may be struck in the processing chamber to enhance chemical reactions.

[0005] In inductively coupled plasma (ICP) processes, one or more inductive coils are arranged outside of the processing chamber adjacent to a ceramic window enclosing one side of the processing chamber. RF power is supplied to the inductive coils while the process gases are being supplied inside of the processing chamber. The inductive coils generate magnetic fields inside of the processing chamber to ignite plasma. The plasma heats the ceramic window during plasma processing. In some substrate processing systems, cooling fans or air amplifiers including a gas plenum are used to supply cooling gas (e.g., clean dry air (CDA)) to cool a non-plasma-facing surface of the ceramic window during plasma processing. The cooling fans create noise and consumea significant amount of CDA. Further, the cooling fans do not provide sufficient cooling for higher power processes.SUMMARY

[0006] A liquid cooled ceramic window includes a first plate made of ceramic, comprising a cylindrical body, and including a first surface with at least one cooling channel. A second plate is made of ceramic and bonded to the first surface of the first plate to enclose the at least one cooling channel.

[0007] In other features, the second plate further comprises a set of ports aligned with the at least one cooling channel. The at least one cooling channel defines a single cooling zone. The at least one cooling channel defines two or more cooling zones.

[0008] In other features, the first plate and the second plate are made of a material selected from a group consisting of alumina, aluminum nitride, zirconium oxide, yttrium oxide, lanthanum oxide, and combinations thereof. A coating layer is arranged on at least one of the first plate and the second plate. The coating layer is made of a material selected from a group consisting of yttrium oxide, lanthanum oxide, and combinations thereof. The first plate and the second plate are diffusion bonded. The first plate and the second plate are glass bonded.

[0009] In other features, the first plate and the second plate are bonded by epoxy. The first surface including the at least one cooling channel is arranged adjacent to a plasma-facing surface of the liquid cooled ceramic window. The first surface including the at least one cooling channel is arranged adjacent to a non-plasma-facing surface of the liquid cooled ceramic window. The first surface including the at least one cooling channel is arranged in a middle portion of the liquid cooled ceramic window.

[0010] In other features, a first interlocking portion and a second interlocking portion are arranged on abutting surfaces of the first plate and the second plate, respectively. The first interlocking portion of the first plate includes a notch and the second interlocking portion of the second plate includes a projection arranged in the notch.

[0011] In other features, the first plate and the second plate further comprise a center port to receive a gas injector.

[0012] A plasma processing system includes the liquid cooled ceramic window. A processing chamber includes at least one side enclosed by the liquid cooled ceramic window. A first inductive coil is arranged adjacent to the liquid cooled ceramic window.A coolant supply system is configured to supply a liquid to the at least one cooling channel.

[0013] In other features, the liquid supplied by the coolant supply system comprises a dielectric liquid. The liquid supplied by the coolant supply system comprises Fluorinert.

[0014] In other features, the first plate and the second plate are laminated. The first plate and the second plate are co-fired.

[0015] In other features, a first interlocking portion and a second interlocking portion are arranged on abutting surfaces of the first plate and the second plate, respectively. The first plate and the second plate further comprise a center port to receive a gas injector. The first interlocking portion and the second interlocking portion are arranged adjacent to the center port.

[0016] In other features, a first interlocking portion and a second interlocking portion are arranged on abutting surfaces of the first plate and the second plate, respectively. The first plate and the second plate do not include a center port. The first interlocking portion and the second interlocking portion are arranged adjacent to a peripheral edge of the liquid cooled ceramic window.

[0017] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0019] FIG. 1 is a functional block diagram of an example of a substrate processing system including a processing chamber including a liquid cooled ceramic window according to the present disclosure;

[0020] FIG. 2 is an example of an inductive coil including a set of inner coils and a set of outer coils;

[0021] FIG. 3A is a side cross sectional view of an example of a first plate of a liquid cooled ceramic window according to the present disclosure;

[0022] FIG. 3B is a side cross sectional view of an example of a second plate of a liquid cooled ceramic window according to the present disclosure;

[0023] FIG. 3C is a side cross sectional view of an example of a first plate attached or bonded to a second plate of a liquid cooled ceramic window according to the present disclosure;

[0024] FIG. 4A is a side cross sectional view of another example of a first plate attached or bonded to a second plate of a liquid cooled ceramic window according to the present disclosure;

[0025] FIG. 4B is an enlarged side cross sectional view of an example of an interlocking portion on the first plate and the second plate according to the present disclosure;

[0026] FIGS. 5A and 5B are side cross sectional views of examples of cooling channels formed in a middle portion of a liquid cooled ceramic window according to the present disclosure; and

[0027] FIGS. 6A to 8 are plan views of examples of single and multi-zone cooling channels in the liquid cooled ceramic window according to the present disclosure.

[0028] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION

[0029] During plasma processing, the ceramic window is heated by plasma in the processing chamber. High temperature gradients or temperature non-uniformity in the ceramic window cause high thermal stress that may lead to cracking. Fans may be used to blow hot or cold air into gas plenums that guide air flow paths on a surface of the ceramic window. However, the efficiency of the air-cooling systems is limited. For example, these systems require very high flow rates and consume significant amounts of clean dry air (CDA). The fans also generate excessive noise in a fab room.

[0030] Window temperature uniformity is difficult to manage within a predetermined temperature range using this approach. As a result, cracking of the ceramic window may occur due to temperature gradient variations that cause high thermal stress. As the temperature of the ceramic window increases (due to insufficient and / or nonuniform cooling), surrounding materials or components may also fail.

[0031] A liquid cooled ceramic window according to the present disclosure includes a first plate and a second plate. One surface of the first plate includes a pattern of integrated liquid cooling channels. The second plate is attached to the first plate to enclose the liquid cooling channels. The temperature profile of the liquid cooled ceramic window is controlled by the liquid coolant such as a dielectric liquid circulating inside the cooling channels. The liquid cooled ceramic window supports a wider range of plasma power levels and temperature requirements for different etch applications.

[0032] In some examples, the cooling channels are formed by lamination (e.g., a cofiring process) or using a bonding technology such as epoxy bonding, glass bonding, and / or diffusion bonding. In some examples, the liquid coolant includes a dielectric liquid, such as deionized (DI) water, a perfluorinated fluid (e.g., Fluorinert FC-3283 from 3M) or another suitable dielectric liquid (e.g., with reduced impact on the RF magnetic fields passing through the liquid). The pattern of cooling channels and / or the number of zones are selected to provide a predetermined level of cooling for a particular application.

[0033] Referring now to FIGS. 1 and 2, an example of a substrate processing system 100 including a liquid cooled ceramic window 126 is shown. The substrate processing system 100 includes a coil driving circuit 112. As shown, the coil driving circuit 112 includes an RF source 114 and a matching / tuning circuit 116. The matching / tuning circuit 116 may be directly connected to one or more inductive coils 118. The matching / tuning circuit 116 tunes an output of the RF source 114 to a desired frequency and / or a desired phase, matches an impedance of the inductive coils 118 and optionally splits power between two or more sets of the inductive coils 118 (if used).

[0034] The liquid cooled ceramic window 126 includes integrated liquid channels to provide uniform cooling of the liquid cooled ceramic window 126. The substrate processing system 100 includes a gas injector 124 arranged in a central port of a liquid cooled ceramic window 126. The gas injector 124 injects gas into the processing chamber. The substrate support 132 may include an electrostatic chuck (ESC), a mechanical chuck, or another types of pedestal.

[0035] During operation, a process gas is supplied to the processing chamber 128 via the gas injector 124 and plasma 140 is generated inside of the processing chamber 128. For example, a magnetic field generated by the inductive coils 118 passes throughthe liquid cooled ceramic window 126 into the interior of the processing chamber 128. The magnetic field excites gas molecules within the processing chamber 128 to generate plasma 140. The plasma 140 etches an exposed surface of the substrate 134. An RF source 150 and a bias matching circuit 152 may be used to bias the substrate support 132 during operation to control ion energy.

[0036] A gas delivery system 154 may be used to supply a process gas mixture to the processing chamber 128. The gas delivery system 154 may include process and inert gas sources 156 (e.g., including deposition gases, etch gases, carrier gases, inert gases, etc.), valves 157, mass flow controllers 158, valves 159 and a manifold 160. A heater / cooler 162 may be used to heat / cool the substrate support 132 to a predetermined temperature. An exhaust system 164 includes a valve 166 and pump 168 to remove reactants from the processing chamber 128 by purging or evacuation and / or to control pressure in the processing chamber.

[0037] A controller 170 may be used to control the process. The controller 170 monitors system parameters and controls delivery of the gas mixture, striking, maintaining, and extinguishing the plasma, removal of reactants, and so on. Additionally, the controller 170 may control various aspects of the coil driving circuit 112, the RF source 150, etc. A temperature controller 172 may be used to control a temperature of the substrate 134 using resistive heaters 174 arranged in a top ceramic plate of the substrate support 132.

[0038] A coolant supply system 190 includes a pump 192 to circulate the coolant through cooling channels of the liquid cooled ceramic window 126 via one or more sets of ports 127. The coolant supply system 190 may further include a heat exchanger 194 and / or a heater 196 to cool and / or heat the coolant, respectively. A pressure relief valve 198 may be arranged in coolant supply lines to cut off flow in the event that pressure in the coolant supply lines exceeds a predetermined pressure threshold.

[0039] In FIG. 2, an example of the inductive coil 118 including a set of inner coils 210 and a set of outer coils 212 is shown. While two sets of coils are shown, a single coil, a single set of coils, or additional sets coils can be used.

[0040] Referring now to FIGS. 3A to 3C, a liquid cooled ceramic window 300 for an ICP process is shown. In FIG. 3A, a first plate 310 of the liquid cooled ceramic window 300 is shown. In some examples, the first plate 310 has a cylindrical shape and includes one or more cooling channels 314 formed on one side. For example in FIG.3A, the cooling channels 314 are formed on a first surface (e.g., a top or non-plasmafacing surface). In FIG. 3B, an example of a second plate 320 is shown. The second plate 320 includes one or more sets of ports that align with the cooling channels to allow liquid to be delivered from the top. Alternately, sides of the first plate can include ports that communicate with the cooling channels. In some examples, the second plate 320 comprises a flat cylindrical plate. In other examples, the second plate 320 can have a more complex shape with additional features. In FIG. 3C, the second plate 320 is shown bonded or attached to the first plate 310.

[0041] In some examples, the first plate and the second plate are made of ceramic selected from a group consisting of alumina, aluminum nitride, zirconium oxide, yttrium oxide, lanthanum oxide, and combinations thereof. In some examples, an outer diameter of the first plate 310 in a plane parallel to a plane including the substate is in a range from 40 mm to 850 mm. In some examples, a thickness of the first plate 310 and the second plate 320 (in a plane transverse to the plane including the substrate) is in a range from 5 mm to 40 mm.

[0042] In some examples, the second plate 320 is bonded to the first plate 310 using a high-temperature bonding technique. For example, the second plate 320 can be bonded to the first plate 310 using a high-temperature epoxy bonding process. In other examples, a glass bonding process is used. The first plate and second plate are heated to a bonding temperature (and the glass bonding layer joins the first plate and the second plate). In other examples, diffusion bonding, lamination, or co-firing is used to bond the first plate and the second plate with or without an intervening layer.

[0043] In other examples, ceramic sheets (e.g., green sheets) are patterned, stacked, and co-fired to form the liquid cooled ceramic window. In other words, selected ones of the ceramic sheets are patterned or cut to define different layers. For example, some layers are cut to define slices or layers of the coolant channel pattern. Other layers are solid and do not need to be cut to form cooling channels. The layers are stacked and fired. Ceramic paste may be used between the ceramic layers to enhance bonding.

[0044] In some examples, the cooling channels 314 are arranged in one or more zones adjacent to a plasma-facing side of the liquid cooled ceramic window, a nonplasma-facing side of the liquid cooled ceramic window surface, or in a middle portion of the ceramic window. In some examples, the liquid cooled ceramic window 300 further includes a protective coating layer 322 arranged on a plasma-facing surface. Insome examples, the protective coating layer 322 has a thickness in a range from 1 pm to 5mm and is made of a material that is resistant to plasma attack. In some examples, the protective coating layer 322 is made of a material selected from a group consisting of yttrium oxide (Y2O3), lanthanum oxide (La2Oa), or other suitable coating materials.

[0045] In some examples, the cooling liquid includes DI water, a perfluorinated fluid (e.g., 3M Fluorinert) or another dielectric liquid that remains in a liquid state over the required temperature range.

[0046] Referring now to FIGS. 4A and 4B, another example of a liquid cooled ceramic window 350 for an ICP process is shown. The liquid cooled ceramic window 350 includes a first plate 352 and a second plate 364. In some examples, the first plate 352 has a cylindrical shape and includes one or more cooling channels 354 formed on an outer surface thereof. For example in FIG. 4A, the cooling channels 354 are formed on a second surface 358 (e.g., a top or non-plasma-facing surface) of the first plate 352.

[0047] The first plate 352 and the second plate 364 define an interlocking portion 356 to enhance the strength of a bond between the second plate 364 and the first plate 352. In some examples, the interlocking portion 356 includes a first projection 366 extending transversely from one end of the second plate 364 and a notch 370 arranged adjacent thereto. In some examples, the notch 370 and the first projection 366 are rectangularshaped with or without a corner radius. A projection 372 of the first plate 352 is complementary to a shape of the notch 370 and is received in the notch 370. In some examples, a bonding layer 380 such as epoxy or a glass layer bonds the second plate 364 to the first plate 352. In other examples, a solid-state bond is created between the first plate and the second plate.

[0048] In some examples, the window 350 includes a center hole 371 (shown adjacent to a center line CL) to receive the gas injector. When the window 350 includes the center hole 371 , the interlocking portion 356 is arranged adjacent to the center hole 371. When the window 350 does not include the center hole 371 , the interlocking portions 356 are arranged adjacent to a radially outer edge of the window 350.

[0049] Referring now to FIGS. 5A and 5B, examples of channels formed in the middle portion of the liquid cooled ceramic window are shown. In FIG. 5A, a liquid cooled ceramic window 390 includes a first plate 392 including a cooling channel 394 on one side thereof and a second plate 393 including a cooling channel 394 on one side thereof. A central port 415 (e.g., as shown in FIGS. 6A-8) is provided through the firstplate 392 and the second plate 393 and is configured to receive a gas injector. Sides of the first plate 392 and the second plate 393 that include the cooling channels 394 are arranged adjacent to one another and bonded together as described above.

[0050] In FIG. 5B, a liquid cooled ceramic window 395 includes a first plate 396 and a second plate 397. In this example, the first plate 396 includes a cooling channel 398 on one side thereof and the second plate 397 does not include cooling channels (or vice versa). The first plate 396 and the second plate 397 are bonded together as described above.

[0051] Referring now to FIGS. 6A to 8, various example patterns of cooling channels in one or both of the plates are shown. In FIG. 6A, a liquid cooled ceramic window 400 includes a first plate 404 comprising a channel 420 including ports 412 and 414 corresponding to an inlet and outlet (or vice versa). In some examples, the channel 420 is defined by a peripheral wall 422 extending around a periphery of the first plate 404 and inner dividing walls 424. In this example, the ports 412 and 414 are arranged along a peripheral edge. However, the ports 412 and 414 can be located inwardly from the peripheral edge such as the middle of the liquid cooled ceramic window. In some examples, the channel 420 extends inwardly from one edge, wraps around the central port 415, reverses direction and passes around the central port 415 (multiple times), and then extends adjacent to a peripheral edge of the window. The dividing walls 424 separate adjacent paths. In FIG. 6B, a plan view of a second plate 426 is shown with ports 428 and 430 aligned with the ports 412 and 414 of the first plate 404.

[0052] In FIG. 7, a liquid cooled ceramic window 450 comprises a channel 470 including first and second sets of ports 462 and 466 and 464 and 468 corresponding to inlets and outlets (or vice versa) of channels 475 and 477 (e.g., defining two zones). In this example, the ports 462 and 466 and 464 and 468 are arranged at a peripheral edge of the liquid cooled ceramic window. The ports 462 and 466 correspond to an inner zone and the ports 464 and 468 correspond to an outer zone.

[0053] In FIG. 8, a liquid cooled ceramic window 500 comprises a channel 520 including sets of ports 512 and 514 and 516 and 518 corresponding to inlets and outlets (or vice versa) of two coolant paths through the liquid cooled ceramic window 500. In this example, the ports 512 and 514 are arranged at a peripheral edge of the liquid cooled ceramic window 500 and the ports 516 and 518 are arranged at a middle of theliquid cooled ceramic window 500. The ports 516 and 518 correspond to an inner zone and the ports 512 and 514 correspond to an outer zone.

[0054] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0055] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0056] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform, or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controllingtheir operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0057] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0058] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to a system over anetwork, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0059] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0060] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

CLAIMSWhat is claimed is:1 . A liquid cooled ceramic window comprising: a first plate made of ceramic, comprising a cylindrical body, and including a first surface with at least one cooling channel; and a second plate made of ceramic and bonded to the first surface of the first plate to enclose the at least one cooling channel.

2. The liquid cooled ceramic window of claim 1 , wherein the second plate further comprises a set of ports aligned with the at least one cooling channel.

3. The liquid cooled ceramic window of claim 1 , wherein the at least one cooling channel defines a single cooling zone.

4. The liquid cooled ceramic window of claim 1 , wherein the at least one cooling channel defines two or more cooling zones.

5. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are made of a material selected from a group consisting of alumina, aluminum nitride, zirconium oxide, yttrium oxide, lanthanum oxide, and combinations thereof.

6. The liquid cooled ceramic window of claim 1 , further comprising a coating layer arranged on at least one of the first plate and the second plate.

7. The liquid cooled ceramic window of claim 6, wherein the coating layer is made of a material selected from a group consisting of yttrium oxide, lanthanum oxide, and combinations thereof.

8. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are diffusion bonded.

9. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are glass bonded.

10. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are bonded by epoxy.11 . The liquid cooled ceramic window of claim 1 , wherein the first surface including the at least one cooling channel is arranged adjacent to a plasma-facing surface of the liquid cooled ceramic window.

12. The liquid cooled ceramic window of claim 1 , wherein the first surface including the at least one cooling channel is arranged adjacent to a non-plasma-facing surface of the liquid cooled ceramic window.

13. The liquid cooled ceramic window of claim 1 , wherein the first surface including the at least one cooling channel is arranged in a middle portion of the liquid cooled ceramic window.

14. The liquid cooled ceramic window of claim 1 , further comprising a first interlocking portion and a second interlocking portion arranged on abutting surfaces of the first plate and the second plate, respectively.

15. The liquid cooled ceramic window of claim 14, wherein the first interlocking portion of the first plate includes a notch and the second interlocking portion of the second plate includes a projection arranged in the notch.

16. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate further comprise a center port to receive a gas injector.

17. A plasma processing system comprising: the liquid cooled ceramic window of claim 1 ; a processing chamber including at least one side enclosed by the liquid cooled ceramic window; a first inductive coil arranged adjacent to the liquid cooled ceramic window; and a coolant supply system configured to supply a liquid to the at least one cooling channel.

18. The plasma processing system of claim 17, wherein the liquid supplied by the coolant supply system comprises a dielectric liquid.

19. The plasma processing system of claim 17, wherein the liquid supplied by the coolant supply system comprises Fluorinert.

20. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are laminated.

21. The liquid cooled ceramic window of claim 1 , wherein the first plate and the second plate are co-fired.

22. The liquid cooled ceramic window of claim 1 , further comprising: a first interlocking portion and a second interlocking portion arranged on abutting surfaces of the first plate and the second plate, respectively, wherein the first plate and the second plate further comprise a center port to receive a gas injector, and wherein the first interlocking portion and the second interlocking portion are arranged adjacent to the center port.

23. The liquid cooled ceramic window of claim 1 , further comprising: a first interlocking portion and a second interlocking portion arranged on abutting surfaces of the first plate and the second plate, respectively, wherein the first plate and the second plate do not include a center port, and wherein the first interlocking portion and the second interlocking portion are arranged adjacent to a peripheral edge of the liquid cooled ceramic window.

Images