Power isolation module and method based on functional safety

Abstract

The present application relates to a power isolation module and method based on functional safety. The power isolation module according to one aspect of the present application comprises: a power domain (210) arranged on a first layer, wherein the power domain (210) comprises a first power supply (2103) and a second power supply (2104) of a first power domain, and a first power supply (2101) and a second power supply (2102) of a second power domain; a first logic processing unit (110) arranged on the first layer, wherein the first logic processing unit (110) is connected between the first power supply (2103) of the first power domain and the second power supply (2104) of the first power domain; and a first connection unit (230) arranged on a second layer, wherein the first connection unit (230) is used for establishing an electrical connection between the first power supply (2103) of the first power domain connected to the first logic processing unit (110), and the first power supply (2101) of the second power domain, and used for establishing an electrical connection between the second power supply (2104) of the first power domain connected to the first logic processing unit (110) and the second power supply (2102) of the second power domain.

Description

Power isolation module and power isolation method based on functional safety Technical Field

[0001] The present application generally relates to integrated circuit technology, and more particularly to a power isolation module and a power isolation method based on functional safety. Background Art

[0002] Multi-module redundancy technology is a highly reliable and fault-tolerant technology that uses multiple completely independent processing modules to simultaneously perform the same calculations and operations on the same input data, and sends the processing results to the output voter at the same time. The voter uses the majority of the same calculation results of each processing module as the voting output, thereby improving reliability and stability.

[0003] However, current multi-mode redundancy technology cannot avoid the risk of common-mode failures. Specifically, two or more processing modules could fail simultaneously due to a single power failure, resulting in erroneous voter outputs and reduced reliability and stability. For example, two processing modules could be affected by power supply fluctuations, noise, or interference, leading to inconsistent or erroneous processing results. To mitigate the risk of common-mode failures, additional monitoring circuitry is typically required between multiple processing modules to detect power failures, increasing system design complexity and cost.

[0004] Summary of the Invention

[0005] According to a first aspect of the present application, a power isolation module is provided, which includes: a power domain arranged on a first layer, the power domain including a first power supply and a second power supply of the first power domain and a first power supply and a second power supply of the second power domain; a first logic processing unit arranged on the first layer, the first logic processing unit being connected between the first power supply of the first power domain and the second power supply of the first power domain; and a first connection unit arranged on the second layer, the first connection unit being used to establish an electrical connection between the first power supply of the first power domain connected to the first logic processing unit and the first power supply of the second power domain, and being used to establish an electrical connection between the second power supply of the first power domain connected to the first logic processing unit and the second power supply of the second power domain.

[0006] According to the power isolation module described in one embodiment of the present application, the first connection unit includes: a first connector and a second connector, each of the first connector and the second connector is used to establish an electrical connection between the first power supply of the first power domain connected to the first logic processing unit and the first power supply of the second power domain; and a third connector and a fourth connector, each of the third connector and the fourth connector is used to establish an electrical connection between the second power supply of the first power domain connected to the first logic processing unit and the second power supply of the second power domain.

[0007] According to the power isolation module according to one embodiment of the present application or any one of the above embodiments, the power isolation module further includes: a second logic processing unit arranged in the first layer, the second logic processing unit being connected between the first power supply of the second power domain and the second power supply of the second power domain; and a second connection unit arranged in the second layer, the second connection unit being used to establish an electrical connection between the first power supply of the second power domain connected to the second logic processing unit and the first power supply of the first power domain, and being used to establish an electrical connection between the second power supply of the second power domain connected to the second logic processing unit and the second power supply of the first power domain.

[0008] According to the power isolation module according to one embodiment of the present application or any one of the above embodiments, the second connection unit includes: a first connector and a second connector, each of the first connector and the second connector is used to establish an electrical connection between the first power supply of the second power domain connected to the second logic processing unit and the first power supply of the first power domain; and a third connector and a fourth connector, each of the third connector and the fourth connector is used to establish an electrical connection between the second power supply of the second power domain connected to the second logic processing unit and the second power supply of the first power domain.

[0009] According to the power isolation module of one embodiment or any one of the above embodiments of the present application, the first logic processing unit and the second logic processing unit are constructed in a multiple redundancy form, and the multiple redundancy form includes one or more of the following: dual redundancy, triple redundancy, and quadruple redundancy.

[0010] According to the power isolation module of one embodiment of the present application or any one of the above embodiments, the first power supply of the first power domain and the first power supply of the second power domain are Vdd, and the second power supply of the first power domain and the second power supply of the second power domain are Vss.

[0011] According to the power isolation module described in one embodiment of the present application or any one of the above embodiments, the power isolation module further includes: a third connecting unit arranged on the third layer, the third connecting unit being used to establish an electrical connection between the first connecting member and the second connecting member of the first connecting unit, and being used to establish an electrical connection between the third connecting member and the fourth connecting member of the first connecting unit.

[0012] According to the power isolation module described in one embodiment of the present application or any one of the above embodiments, the power isolation module further includes: a fourth connecting unit arranged on the third layer, the fourth connecting unit being used to establish an electrical connection between the first connecting member and the second connecting member of the second connecting unit, and being used to establish an electrical connection between the third connecting member and the fourth connecting member of the second connecting unit.

[0013] According to a second aspect of the present application, a power isolation method is provided, which includes: setting a power domain at a first layer, the power domain including a first power supply and a second power supply of the first power domain and a first power supply and a second power supply of the second power domain; setting a first logic processing unit at the first layer, the first logic processing unit being connected between the first power supply of the first power domain and the second power supply of the first power domain; and setting a first connection unit at the second layer, the first connection unit being used to establish an electrical connection between the first power supply of the first power domain connected to the first logic processing unit and the first power supply of the second power domain, and being used to establish an electrical connection between the second power supply of the first power domain connected to the first logic processing unit and the second power supply of the second power domain.

[0014] According to the power isolation method described in an embodiment of the present application, setting a first connection unit in the second layer includes setting the first connection unit to include: a first connector and a second connector, each of the first connector and the second connector is used to establish an electrical connection between the first power supply of the first power domain connected to the first logic processing unit and the first power supply of the second power domain; and a third connector and a fourth connector, each of the third connector and the fourth connector is used to establish an electrical connection between the second power supply of the first power domain connected to the first logic processing unit and the second power supply of the second power domain.

[0015] A power supply isolation method according to one embodiment of the present application or any of the above embodiments, wherein the power supply isolation method further includes: setting a second logic processing unit at the first layer, the second logic processing unit being connected between the first power supply of the second power domain and the second power supply of the second power domain; and setting a second connection unit at the second layer, the second connection unit being used to establish an electrical connection between the first power supply of the second power domain connected to the second logic processing unit and the first power supply of the first power domain, and being used to establish an electrical connection between the second power supply of the second power domain connected to the second logic processing unit and the second power supply of the first power domain.

[0016] A power isolation method according to one embodiment of the present application or any one of the above embodiments, wherein setting a second connection unit in the second layer includes setting the second connection unit to include: a first connector and a second connector, each of the first connector and the second connector being used to establish an electrical connection between a first power supply of the second power domain connected to the second logic processing unit and a first power supply of the first power domain; and a third connector and a fourth connector, each of the third connector and the fourth connector being used to establish an electrical connection between a second power supply of the second power domain connected to the second logic processing unit and a second power supply of the first power domain.

[0017] According to the power supply isolation method of one embodiment or any one of the above embodiments of the present application, the first logic processing unit and the second logic processing unit are constructed in a multiple redundancy form, and the multiple redundancy form includes one or more of the following: dual redundancy, triple redundancy, and quadruple redundancy.

[0018] According to an embodiment of the present application or any one of the above embodiments of the power isolation method, the first power supply of the first power domain and the first power supply of the second power domain are Vdd, and the second power supply of the first power domain and the second power supply of the second power domain are Vss.

[0019] A power supply isolation method according to one embodiment of the present application or any one of the above embodiments, wherein the power supply isolation method further includes: setting a third connection unit on the third layer, the third connection unit being used to establish an electrical connection between the first connection member and the second connection member of the first connection unit, and being used to establish an electrical connection between the third connection member and the fourth connection member of the first connection unit.

[0020] A power supply isolation method according to one embodiment of the present application or any one of the above embodiments, wherein the power supply isolation method further includes: setting a fourth connection unit on the third layer, the fourth connection unit being used to establish an electrical connection between the first connection member and the second connection member of the second connection unit, and being used to establish an electrical connection between the third connection member and the fourth connection member of the second connection unit.

[0021] According to one or more embodiments of the present application, the power isolation scheme performs power isolation on the logic processing unit through a connection unit set on the second layer, thereby ensuring the normal operation of the power isolation module when a power supply in the power domain fails, reducing the risk of common mode failure, and improving the reliability and stability of the power isolation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or other aspects and advantages of the present application will become clearer and easier to understand through the following description of various aspects in conjunction with the accompanying drawings, in which the same or similar elements are represented by the same reference numerals. In the drawings:

[0023] FIG1 shows a schematic diagram of a typical triple modular redundancy (TMR) system.

[0024] FIG2 shows a schematic structural diagram of a power isolation module according to one or more embodiments of the present application.

[0025] FIG3 shows a flow chart of a power isolation method according to one or more embodiments of the present application. DETAILED DESCRIPTION

[0026] The present application is described more fully below with reference to the accompanying drawings, which illustrate exemplary embodiments of the present application. However, the present application may be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. The foregoing embodiments are provided to make the disclosure herein comprehensive and complete, so as to more fully convey the scope of protection of the present application to those skilled in the art.

[0027] In the context of this application, terms such as "comprise" and "include" indicate that in addition to the units and steps directly and clearly stated in the specification and claims, the technical solution of this application does not exclude the situation where it has other units and steps that are not directly or clearly stated.

[0028] In the context of this application, unless otherwise specified, terms such as "first" and "second" do not indicate the order of units in terms of time, space, size, etc., but are only used to distinguish between units.

[0029] In the context of this application, “coupling” should be understood to include a situation where electric energy or electric signals are directly transmitted between two units, or a situation where electric energy or electric signals are indirectly transmitted via one or more intermediate units.

[0030] Hereinafter, various exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings.

[0031] FIG1 shows a schematic diagram of a typical triple modular redundancy system.

[0032] As shown in FIG. 1 , triple modular redundancy system 100 includes logic processing unit 110 , logic processing unit 120 , logic processing unit 130 , and voter 140 .

[0033] Logic processing units 110, 120, and 130 can simultaneously perform the same calculations and operations on the same input, sending the processing results to voter 140. Voter 140 uses the majority of identical processing results as the correct output. As long as no two identical errors occur simultaneously in logic processing units 110, 120, or 130, these errors can be masked, ensuring the correct output of triple-module redundant system 100. Because logic processing units 110, 120, and 130 are independent of each other, the probability of two logic processing units simultaneously experiencing errors is extremely low, significantly improving system reliability.

[0034] FIG2 shows a schematic structural diagram of a power isolation module according to one or more embodiments of the present application.

[0035] As shown in FIG2 , the power isolation module 200 includes a power domain 210, a logic processing unit 220, and a connection unit 230 (shown in the shaded portion of the figure), wherein the power domain 210 and the logic processing unit 220 are arranged on the first layer, and the connection unit 230 is arranged on the second layer. Optionally, the first layer can be implemented as the M0 layer (e.g., the silicon substrate layer) in the chip package, and the second layer can be implemented as the M1 layer in the chip package.

[0036] The power domain 210 includes a first power supply 2103 and a second power supply 2104 of the first power domain, and a first power supply 2101 and a second power supply 2102 of the second power domain. Optionally, the first power supply 2103 of the first power domain can be implemented as Vdd, the second power supply 2104 of the first power domain can be implemented as Vss, the first power supply 2101 of the second power domain can be implemented as Vdd, and the second power supply 2102 of the second power domain can be implemented as Vss.

[0037] The logic processing unit 220 is connected between the first power supply 2103 of the first power domain and the second power supply 2104 of the first power domain. Alternatively, the logic processing unit 220 can be implemented as an independent processing unit in a multi-redundant system, such as one of the logic processing units 110, 120, and 130 shown in FIG1 . Alternatively, the multi-redundant system can include a dual-redundant system, a triple-redundant system, a quad-redundant system, and the like.

[0038] The connection unit 230 is used to establish an electrical connection between the first power supply 2103 of the first power domain connected to the logic processing unit 220 and the first power supply 2101 of the second power domain, and to establish an electrical connection between the second power supply 2104 of the first power domain connected to the logic processing unit 220 and the second power supply 2102 of the second power domain.

[0039] As shown in FIG2 , the connection unit 230 may include a first connector 2301, a second connector 2302, a third connector 2303, and a fourth connector 2304. The first connector 2301 and the second connector 2302 are used to establish an electrical connection between the first power supply 2103 of the first power domain and the first power supply 2101 of the second power domain, and the third connector 2303 and the fourth connector 2304 are used to establish an electrical connection between the second power supply 2104 of the first power domain and the second power supply 2102 of the second power domain. In one embodiment, the connection unit 230 may be implemented using various metal materials, such as copper, aluminum, and the like. In one embodiment, the intersections of the first connector 2301, the second connector 2302, the third connector 2303, and the fourth connector 2304 of the M1 layer and the first power supply 2103, the second power supply 2104 of the first power domain, and the first power supply 2101 and the second power supply 2102 of the second power domain of the M0 layer may be electrically connected via vias. By setting up a connection unit 230 in the M1 layer, power isolation of the logic processing unit 220 of the M0 layer can be achieved, so that when the first power supply 2103 of the first power domain fails, the first power supply 2101 of the second power domain can ensure the normal operation of the power isolation module 200.

[0040] It should be noted that, for the sake of simplicity, although only one logic processing unit 220 and its corresponding connection unit 230 are shown in Figure 2, without departing from the spirit and scope of the present application, the power isolation module 200 may include multiple logic processing units and their corresponding connection units, and each logic processing unit can be implemented as an independent processing unit in a multiple redundant system, such as one of the logic processing units 110, 120, and 130 shown in Figure 1.

[0041] In one embodiment, in order to further improve the power independence of the logic processing unit 220, the power isolation module 200 may also include a third connection unit (not shown in Figure 2) arranged on a third layer (for example, the M2 layer in the chip package). The third connection unit can be used to establish an electrical connection between the first connector 2301 and the second connector 2302, and to establish an electrical connection between the third connector 2303 and the fourth connector 2304.

[0042] According to one or more embodiments of the present application, the power isolation module isolates the power supply of the logic processing unit through the connection unit provided in the second layer, thereby ensuring the normal operation of the power isolation module in the event of a power failure in the power domain, reducing the risk of common-mode failure, and improving the reliability and stability of the power isolation module. According to one or more embodiments of the present application, the power isolation module can be implemented as an on-board chip to enhance the independence of multiple redundant power supplies, thereby meeting the ASIL automotive regulations, such as the functional safety (Functional Safety) standard of ISO 26262, reducing the probability of common-mode failures, and improving the single-point faults metric (SPFM) coverage.

[0043] FIG3 shows a flow chart of a power isolation method according to one or more embodiments of the present application.

[0044] As shown in FIG3 , in step S301, power domains are set in the first layer, and the power domains include a first power supply and a second power supply of the first power domain and a first power supply and a second power supply of the second power domain. Optionally, the first power supply of the first power domain and the first power supply of the second power domain can be implemented as Vdd, and the second power supply of the first power domain and the second power supply of the second power domain can be implemented as Vss.

[0045] In step S303 , a first logic processing unit is provided in the first layer, and the first logic processing unit is connected between a first power supply of the first power domain and a second power supply of the first power domain.

[0046] In step S305, a first connection unit is set in the second layer, and the first connection unit is used to establish an electrical connection between a first power supply of a first power domain connected to the first logic processing unit and a first power supply of a second power domain, and to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

[0047] Optionally, in step S305, the first connection unit may be configured to include a first connector, a second connector, a third connector, and a fourth connector, wherein each of the first connector and the second connector is used to establish an electrical connection between a first power supply of a first power domain connected to the first logic processing unit and a first power supply of a second power domain, and each of the third connector and the fourth connector is used to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

[0048] In one embodiment, a second logic processing unit may be provided at the first layer, the second logic processing unit being connected between the first power supply of the second power domain and the second power supply of the second power domain, and a second connection unit may be provided at the second layer, the second connection unit being used to establish an electrical connection between the first power supply of the second power domain connected to the second logic processing unit and the first power supply of the first power domain, and to establish an electrical connection between the second power supply of the second power domain connected to the second logic processing unit and the second power supply of the first power domain. Optionally, the second connection unit may be provided to include a first connection member, a second connection member, a third connection member, and a fourth connection member, wherein each of the first connection member and the second connection member is used to establish an electrical connection between the first power supply of the second power domain connected to the second logic processing unit and the first power supply of the first power domain, and each of the third connection member and the fourth connection member is used to establish an electrical connection between the second power supply of the second power domain connected to the second logic processing unit and the second power supply of the first power domain.

[0049] In one embodiment, a third connection unit may be further provided on the third layer, the third connection unit being used to establish an electrical connection between the first connection member and the second connection member of the first connection unit, and between the third connection member and the fourth connection member of the first connection unit. Optionally, a fourth connection unit may be further provided on the third layer, the fourth connection unit being used to establish an electrical connection between the first connection member and the second connection member of the second connection unit, and between the third connection member and the fourth connection member of the second connection unit.

[0050] Optionally, the first logic processing unit and the second logic processing unit may be constructed in a multiple redundancy form, and the multiple redundancy form may include dual redundancy, triple redundancy, quadruple redundancy, etc.

[0051] The power isolation method according to one or more embodiments of the present application isolates the power supply of the logic processing unit through a connection unit provided at the second layer, thereby ensuring the normal operation of the power isolation in the event of a power failure in a power domain, reducing the risk of common-mode failures, and improving the reliability and stability of the power isolation. The power isolation method according to one or more embodiments of the present application can be applied to automotive chips to enhance the independence of multiple redundant power supplies, thereby meeting ASIL automotive regulations, reducing the probability of common-mode failures, and improving SPFM coverage.

[0052] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Those skilled in the art may conceive of other feasible variations or substitutions based on the technical scope disclosed in this application, and such variations or substitutions are all included in the scope of protection of this application. In the absence of conflict, the embodiments of the present application and the features in the embodiments may also be combined with each other.

Claims

1. A power isolation module, characterized in that: The power isolation module comprises: A power domain is provided in the first layer, wherein the power domain includes a first power supply and a second power supply of the first power domain and a first power supply and a second power supply of the second power domain; A first logic processing unit disposed in the first layer, the first logic processing unit being connected between a first power supply of the first power domain and a second power supply of the first power domain; and A first connection unit is arranged on the second layer, and the first connection unit is used to establish an electrical connection between a first power supply of the first power domain connected to the first logic processing unit and a first power supply of the second power domain, and to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

2. The power isolation module according to claim 1, wherein the first connection unit comprises: a first connector and a second connector, each of the first connector and the second connector being used to establish an electrical connection between a first power supply of the first power domain connected to the first logic processing unit and a first power supply of the second power domain; as well as A third connector and a fourth connector, each of which is used to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

3. The power isolation module according to claim 1, wherein the power isolation module further comprises: A second logic processing unit is provided in the first layer, the second logic processing unit is connected between a first power supply of the second power domain and a second power supply of the second power domain; as well as A second connection unit is provided on the second layer, the second connection unit is used to establish an electrical connection between a first power supply of the second power domain connected to the second logic processing unit and a first power supply of the first power domain, and to connect a second power supply of the second power domain connected to the second logic processing unit to the first power domain. An electrical connection is established between the power source and the second power source of the first power domain, The second connection unit comprises: a first connector and a second connector, each of the first connector and the second connector being used to establish an electrical connection between a first power supply of the second power domain connected to the second logic processing unit and a first power supply of the first power domain; as well as a third connector and a fourth connector, each of which is used to establish an electrical connection between a second power supply of the second power domain connected to the second logic processing unit and a second power supply of the first power domain, The first logic processing unit and the second logic processing unit are constructed in a multiple redundancy form, and the multiple redundancy form includes one or more of the following: double redundancy, triple redundancy, quadruple redundancy, The first power supply of the first power domain and the first power supply of the second power domain are Vdd, and the second power supply of the first power domain and the second power supply of the second power domain are Vss.

4. The power isolation module according to claim 2, wherein the power isolation module further comprises: A third connection unit is provided on the third layer, and is used to establish an electrical connection between the first connection member and the second connection member of the first connection unit, and is used to establish an electrical connection between the third connection member and the fourth connection member of the first connection unit.

5. The power isolation module according to claim 3, wherein the power isolation module further comprises: A fourth connection unit is provided on the third layer, and is used to establish an electrical connection between the first connection member and the second connection member of the second connection unit, and is used to establish an electrical connection between the third connection member and the fourth connection member of the second connection unit.

6. A power isolation method, characterized in that: The power isolation method comprises: Setting a power domain in the first layer, the power domain comprising a first power supply and a second power supply in the first power domain and a first power supply and a second power supply in the second power domain; A first logic processing unit is provided at the first layer, and the first logic processing unit is connected to the first between a first power supply of a power domain and a second power supply of the first power domain; and A first connection unit is set in the second layer, and the first connection unit is used to establish an electrical connection between a first power supply of the first power domain connected to the first logic processing unit and a first power supply of the second power domain, and to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

7. The power isolation method according to claim 6, wherein providing the first connection unit at the second layer comprises providing the first connection unit to include: a first connector and a second connector, each of the first connector and the second connector being used to establish an electrical connection between a first power supply of the first power domain connected to the first logic processing unit and a first power supply of the second power domain; as well as A third connector and a fourth connector, each of which is used to establish an electrical connection between a second power supply of the first power domain connected to the first logic processing unit and a second power supply of the second power domain.

8. The power isolation method according to claim 6, wherein the power isolation method further comprises: A second logic processing unit is arranged in the first layer, and the second logic processing unit is connected between a first power supply of the second power domain and a second power supply of the second power domain; as well as A second connection unit is provided in the second layer, the second connection unit is used to establish an electrical connection between a first power supply of the second power domain connected to the second logic processing unit and a first power supply of the first power domain, and is used to establish an electrical connection between a second power supply of the second power domain connected to the second logic processing unit and a second power supply of the first power domain, Wherein setting the second connection unit at the second layer includes setting the second connection unit to include: a first connector and a second connector, each of the first connector and the second connector being used to establish an electrical connection between a first power supply of the second power domain connected to the second logic processing unit and a first power supply of the first power domain; as well as A third connecting member and a fourth connecting member, each of the third connecting member and the fourth connecting member is used establishing an electrical connection between a second power supply of the second power domain connected to the second logic processing unit and a second power supply of the first power domain, The first logic processing unit and the second logic processing unit are constructed in a multiple redundancy form, and the multiple redundancy form includes one or more of the following: double redundancy, triple redundancy, quadruple redundancy, The first power supply of the first power domain and the first power supply of the second power domain are Vdd, and the second power supply of the first power domain and the second power supply of the second power domain are Vss.

9. The power isolation method according to claim 7, wherein the power isolation method further comprises: A third connection unit is provided on the third layer, and the third connection unit is used to establish an electrical connection between the first connection member and the second connection member of the first connection unit, and to establish an electrical connection between the third connection member and the fourth connection member of the first connection unit.

10. The power isolation method according to claim 8, wherein the power isolation method further comprises: A fourth connection unit is provided on the third layer, and the fourth connection unit is used to establish an electrical connection between the first connection member and the second connection member of the second connection unit, and to establish an electrical connection between the third connection member and the fourth connection member of the second connection unit.

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