Base layer, inner electrode layer, lower lead layer, substrate and inductor

Abstract

Provided in the embodiments of the present disclosure are a base layer, an inner electrode layer, a lower lead layer, a substrate and an inductor. The base layer comprises an insulating layer and an electrode, wherein the electrode is arranged on the insulating layer; and the electrode comprises a coil, a first connecting disk and an extension portion, the coil having a first end, the first connecting disk being arranged at the first end, the extension portion being arranged on the first connecting disk, and the extension portion extending in a direction away from the first end from the side of the first connecting disk facing away from the first end.

Description

Base layer, inner electrode layer, lower lead layer, substrate and inductor

[0001] Related cross-references

[0002] This disclosure claims priority to the Chinese patent application filed with the China Patent Office on December 27, 2023, with application number 2023118334805 and invention name “Base layer, inner electrode layer, lower lead layer, substrate and inductor”, the entire contents of which are incorporated by reference in this disclosure. Technical Field

[0003] The present disclosure relates to a base layer, an inner electrode layer, a lower lead layer, a substrate and an inductor. Background Art

[0004] With the rapid development of automotive electronics and other fields, the market's performance requirements for inductors are becoming increasingly higher. To achieve a balance between miniaturization and high current, the aspect ratio of electrodes is increasing, resulting in smaller widths and larger thicknesses.

[0005] However, when the electrode has a larger aspect ratio, the connection pad is easily covered by the filling paste during printing, resulting in failure of the electrical connection between two adjacent layers of electrodes and a low yield rate of inductor preparation.

[0006] Summary of the Invention

[0007] (1) Technical issues to be resolved

[0008] In the prior art, when printing the filling paste, the connection pads of electrodes with larger aspect ratios are easily covered by the filling paste, resulting in failure of the electrical connection between two adjacent layers of electrodes and a low yield rate of inductor production.

[0009] (2) Technical solution

[0010] According to various embodiments disclosed in the present disclosure, a base layer, an inner electrode layer, a lower lead layer, a substrate, and an inductor are provided.

[0011] A base layer, comprising:

[0012] Insulation layer; and

[0013] An electrode, wherein the electrode is provided on the insulating layer, and the electrode comprises:

[0014] a coil having a first end;

[0015] a first connection disk, the first connection disk being provided at the first end; and

[0016] an extension portion, the extension portion being provided on the first connecting plate and extending from a side of the first connecting plate away from the first end in a direction away from the first end;

[0017] In which, the projection of the first connecting plate on the surface of the insulating layer along the thickness direction of the base layer has a first connection point and a second connection point, the extended part has a contour line, the contour line is constructed in an arc shape, and the two ends of the contour line are respectively connected to the first connection point and the second connection point, or the contour line includes a first side, a second side and a third side connected in sequence, the end of the first side facing away from the second side is connected to the first connection point, the end of the third side facing away from the second side is connected to the second connection point, and the second side is perpendicular to the first side and the third side.

[0018] An inner electrode layer includes the base layer, the coil further has a second end, the electrode of the base layer further includes a second connecting disk, and the second connecting disk is arranged at the second end.

[0019] A lower lead layer is applied to an inductor. The inductor includes an external electrode. The lower lead layer includes the base layer. The coil further has a third end. The electrode of the base layer further includes a lead portion. The lead portion is provided at the third end and is located at an edge of the insulating layer. The lead portion is used to electrically connect to the external electrode.

[0020] A substrate comprises an upper lead layer, an inner electrode layer and a lower lead layer, wherein the upper lead layer, a plurality of the inner electrode layers and the lower lead layer are stacked in sequence, the upper lead layer has a lead electrode, the first connecting plate of the inner electrode layer adjacent to the upper lead layer is electrically connected to one end of the lead electrode, the second connecting plate of one of any two adjacent inner electrode layers close to the upper lead layer is electrically connected to the first connecting plate of the other inner electrode layer, and the second connecting plate of the inner electrode layer adjacent to the lower lead layer is electrically connected to the first connecting plate of the lower lead layer.

[0021] An inductor includes a first external electrode, a second external electrode, and the base, wherein the first external electrode is provided at one end of the base and electrically connected to the other end of the lead electrode, and the second external electrode is provided at an end of the base facing away from the first external electrode and electrically connected to the lead portion.

[0022] Other features and advantages of the present disclosure will be described in the following description and, in part, will become apparent from the description or be learned through practice of the present disclosure. The objectives and other advantages of the present disclosure are realized and obtained by the structures particularly pointed out in the description, claims, and drawings. Details of one or more embodiments of the present disclosure are set forth in the following drawings and description.

[0023] In order to make the above-mentioned objects, features and advantages of the present disclosure more obvious and easy to understand, optional embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0025] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] FIG1 is a schematic structural diagram of a base layer disclosed in one or more embodiments of the present disclosure;

[0027] FIG2 is a schematic diagram of a cross-sectional structure of an electrode disclosed in one or more embodiments of the present disclosure;

[0028] FIG3 is a schematic structural diagram of a transition section of an electrode disclosed in one or more embodiments of the present disclosure;

[0029] FIG4 is a schematic structural diagram of an electrode disclosed in one or more embodiments of the present disclosure;

[0030] FIG5 is a schematic structural diagram of an extension portion disclosed in one or more embodiments of the present disclosure;

[0031] FIG6 is a schematic structural diagram of an inner electrode layer disclosed in one or more embodiments of the present disclosure;

[0032] FIG7 is a schematic structural diagram of a lower lead layer disclosed in one or more embodiments of the present disclosure;

[0033] FIG8 is a schematic structural diagram of a substrate disclosed in one or more embodiments of the present disclosure;

[0034] FIG9 is a schematic diagram of an exploded structure of a substrate disclosed in one or more embodiments of the present disclosure;

[0035] FIG10 is a schematic structural diagram of an inductor disclosed in one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0036] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other in the absence of conflict.

[0037] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0038] The terms "first" and "second" in the specification and claims of this disclosure are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first camera" and "second camera" are used to distinguish different cameras, rather than to describe a specific order of cameras.

[0039] In the embodiments of the present disclosure, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present disclosure should not be interpreted as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner. In addition, in the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" refers to two or more.

[0040] Please refer to Figure 1, which is a structural schematic diagram of a base layer 100 provided in one or more embodiments of the present disclosure. The base layer 100 includes an insulating layer 10 and an electrode 11. The electrode 11 is arranged on the insulating layer 10. The electrode 11 includes a coil 111, a first connecting plate 112 and an extension portion 113. The coil 111 has a first end 111a, the first connecting plate 112 is arranged on the first end 111a, and the extension portion 113 is arranged on the first connecting plate 112. The extension portion 113 extends from the side of the first connecting plate 112 away from the first end 111a in a direction away from the first end 111a.

[0041] Among them, Figure 1 is a top view of the base layer 100 along the thickness direction of the base layer 100, and the thickness direction is perpendicular to the paper surface of Figure 1. In Figure 1, the dotted circle is used as the dividing line between the first connecting disk 112 and the coil 111 and the extension part 113, then the dotted circle and its interior can represent the first connecting disk 112. Figure 1 only shows the structure of the first end of the coil 111, and omits the structure of the end of the coil 111 opposite to the first end, which is not specifically shown in Figure 1.

[0042] As shown in Figures 2 and 3, both are schematic cross-sectional views of electrode 11. Figure 3 shows that during the formation of electrode 11, transition sections 11a are formed on both sides of the upper surface of electrode 11. As shown in Figure 2, the aspect ratio of electrode 11 refers to the ratio of its thickness h to its width w. Given the same width w, the greater the aspect ratio, the greater the thickness h. As shown in Figure 3, since transition sections 11a are formed during the formation of electrode 11, the widths of the upper and lower surfaces of electrode 11 are inconsistent. Therefore, given the same width w (the width of the lower surface), the greater the aspect ratio, the greater the thickness h. To ensure a consistent cross-sectional area of ​​electrode 11, the smaller the width w1 of the upper surface of electrode 11, the greater the length t of transition sections 11a. During printing of filler paste, transition sections 11a are easily covered by the filler paste, especially when the printing blade moves directly toward transition sections 11a (i.e., from right to left in Figure 3). That is, under the condition of the same width, the larger the aspect ratio and the greater the thickness, the larger the area of ​​the electrode 11 covered by the filling paste (ie, the transition section 11 a ) and the smaller the width of the exposed upper surface of the electrode 11 .

[0043] Therefore, in order to avoid the risk of the electrode 11 being covered by the filling paste, especially the position of the connecting pad. In this embodiment, the electrode 11 layer is provided through the insulating layer 10, and the coil 111 of the electrode 11 layer has a first end 111a. The first end 111a is used to provide the first connecting pad 112 of the coil 111, so that the electrical connection of the electrode 11 layer can be achieved through the first connecting pad 112. At the same time, an extension portion 113 is provided on the first connecting pad 112, and the extension portion 113 is used to extend from the side of the first connecting pad 112 away from the first end 111a in a direction away from the first end 111a. Therefore, when the filling paste is printed on the base layer 100 to fill the area outside the insulating layer 10 where the electrode 11 layer is provided, the extension portion 113 can effectively prevent the filling paste from spreading to the first connecting pad 112 during filling, thereby reducing the risk of the first connecting pad 112 being covered by the filling paste. Furthermore, when the base layer 100 is applied to an inductor, by stacking multiple layers of base layers 100, the first connection pads 112 will not be covered by the filling paste, thereby ensuring electrical connection between the electrodes 11 of two adjacent base layers 100 and improving the manufacturing yield of the inductor.

[0044] In some embodiments, along the projection of the thickness direction of the base layer 100 onto the surface of the insulating layer 10 , the outer contour of the first connection pad 112 has a first connection point 112 a and a second connection point 112 b , and the extension portion 113 has a contour line.

[0045] Alternatively, the contour line is configured as an arc, with its ends connected to the first connection point 112a and the second connection point 112b, respectively. Alternatively, the contour line includes a first side 113a, a second side 113b, and a third side 113c, which are connected in sequence. The end of the first side 113a facing away from the second side 113b is connected to the first connection point 112a, the end of the third side 113c facing away from the second side 113b is connected to the second connection point 112b, and the second side 113b is perpendicular to the first side 113a and the second side 113b. This embodiment provides contour lines of various shapes, and the shape of the extension portion 113 can be selected according to actual conditions and is not specifically limited in this embodiment.

[0046] When the contour line is designed to include a first side 113a, a second side 113b, and a third side 113c, the contour line of the extension portion 113 forms a half-rectangular shape. Compared with the arc-shaped contour line, when the extension length is the same, the length t of the transition section 11a of the extension portion 113 is smaller, the area of ​​the extension portion 113 covered by the filling paste (i.e., the transition section 11a of the extension portion 113) is smaller, and the projection of the extension portion 113 on the surface of the insulating layer 10 (i.e., the upper surface of the extension portion 113) is larger. When the filling paste spreads to the upper surface of the electrode 11, due to the limited extent of the filling paste spreading, the larger upper surface area of ​​the extension portion 113 is sufficient to provide a coverage area for the filling paste, and the filling paste will not further spread to the first connection pad 112. This ensures that the upper surface of the first connection pad 112 has a larger exposed area, thereby ensuring the reliability of the first connection pad 112 for electrical connection.

[0047] Optionally, the extending direction of the first side 113 a and the third side 113 c is the same as the length direction y of the base layer 100 .

[0048] In some other embodiments, the outline of the extension portion 113 may also be other regular shapes or irregular shapes, which is not specifically limited in this embodiment.

[0049] Illustratively, a line connecting the first connection point 112a and the second connection point 112b passes through the center of the first connection pad 112, and the extending direction of the line is the same as the width direction x of the base layer 100. The projection of the electrode 11 on the surface of the insulating layer 10 along the thickness direction of the base layer 100 is shown in FIG1 . In this way, the two ends of the outline of the extension part 113 are respectively connected to the first connection point 112a and the second connection point 112b. Along the direction from right to left in Figure 1 (that is, the printing direction of the filling paste and the length direction y of the base layer 100), the outline of the extension part 113 can completely cover the first connection pad 112. When the filling paste is printed along the printing direction, if the filling paste is to spread to the first connection pad 112, the filling paste must pass through the extension part 113. The extension part 113 can fully exert its obstruction effect and can prevent the filling paste from spreading to various positions of the first connection pad 112 along the width direction x (the extension direction of the line connecting the first connection point 112a and the second connection point 112b), further reducing the risk of the first connection pad 112 being covered by the filling paste, thereby ensuring the reliability of the first connection pad 112 for electrical connection.

[0050] For example, as shown in FIG4 , the diameter of the first connection pad 112 is d1, and the extension length of the extension portion 113 is L, where 0.1d1≤L≤d1. If L<0.1d1, the extension length L of the extension portion 113 is relatively short, and the extension portion 113 has a poor barrier effect on the filling paste. There is a higher risk of the filling paste spreading to the first connection pad 112, and the first connection pad 112 is easily covered by the filling paste, resulting in electrical connection failure. If L>d1, the extension length of the extension portion 113 is relatively long, and the volume of the extension portion 113 is relatively high. The distance between the extension portion 113 and other parts of the electrode 11 is easily too close, resulting in a short circuit and the generation of parasitic capacitance, which affects the performance of the base layer 100. Therefore, the extension length L of the extension portion 113 can be 0.1d1≤L≤d1, which can improve the blocking effect of the extension portion 113 on the filling paste, reduce the risk of the filling paste spreading to the first connection pad 112, and prevent the first connection pad 112 from being covered by the filling paste, resulting in electrical connection failure. It can also prevent short circuits and the generation of parasitic capacitance, thereby improving the performance of the base layer 100. The extension length L of the extension portion 113 can be 0.1d1, 0.3d1, 0.5d1, 0.7d1, 0.9d1, d1, etc., and this embodiment does not specifically limit this.

[0051] Considering that when the extension portion 113 is extended to a large length, parasitic capacitance is easily generated, affecting the performance of the base layer 100, especially when the aspect ratio of the electrode 11 is small, this problem is more obvious. Based on this, this embodiment further designs the extension portion 113 to overcome the above problem under specific aspect ratio conditions.

[0052] In some embodiments, as shown in Figures 2 and 5 , the thickness of the coil 111 is h, the width of the coil 111 is w, and when h / w ≤ 1 / 3, a first rounded corner 113d is provided at the junction of the first side 113a and the second side 113b, and / or a second rounded corner 113e is provided at the junction of the third side 113c and the second side 113b. Thus, by utilizing the design of the first rounded corner 113d and the second rounded corner 113e, while maintaining the same extension length of the extension portion 113, the area of ​​the extension portion 113 can be reduced to a certain extent, thereby reducing the impact of the extension portion 113 on the performance of the base layer 100.

[0053] However, considering that the rounded corner design will affect the printing effect of the filling paste, when the performance of the base layer 100 and the printing effect of the filling paste are balanced, when h / w>1 / 3, the extended portion 113 does not need to have rounded corners, and the performance of the base layer 100 and the printing effect of the filling paste are both better. When h / w≤1 / 3, the rounded corner design is adopted, which ensures the performance of the base layer 100 while only slightly sacrificing the printing effect of the filling paste.

[0054] For example, as shown in Figures 4 and 5 , the diameter of the first connecting pad 112 is d1, the radius of the first fillet 113d is r1, where r1 ≤ 1 / 3 d1, and the radius of the second fillet 113e is r2, where r2 ≤ 1 / 3 d1. Taking the radius r1 of the first fillet 113d as an example, if r1 > 1 / 3 d1, the radius r1 of the first fillet 113d is larger, significantly impacting the printing effect of the filler paste. Therefore, the radius r1 of the first fillet 113d can be r1 ≤ 1 / 3 d1. While utilizing the first fillet 113d to reduce the area of ​​the extension 113, thereby reducing the impact of the extension 113 on the performance of the base layer 100, the impact of the first fillet 113d on the printing effect of the filler paste is also reduced. Similarly, the radius r2 of the second fillet 113e can refer to the first fillet 113d and will not be further described here.

[0055] Preferably, to further reduce the sacrifice in the printing effect of the filling paste, when h / w < 1 / 5, r1 = 1 / 3d1, r2 = 1 / 3d1; and when 1 / 5 ≤ h / w ≤ 1 / 3, r1 < 1 / 3d1, r2 < 1 / 3d1. Provided that the performance of the base layer 100 meets the requirements, the radii of the first fillet 113d and the second fillet 113e should be as small as possible to ensure the printing effect of the filling paste and, therefore, ensure the connection between the adjacent upper and lower electrodes 11 of the inductor when the base layer 100 is applied to the inductor, thereby reducing the risk of open circuit in the inductor.

[0056] Optionally, as shown in Figures 2 and 4, the width of the coil 111 is w, and the diameter of the first connection pad 112 is d1, 1.1w≤d1≤1.5w. If d1 < 1.1w, the area of ​​the first connection pad 112 is small. When the filling paste accidentally spreads to the first connection pad 112, the effective connection area 112c of the first connection pad 112 (i.e., as shown in Figure 2, the area for electrically connecting to the electrode 11 of the adjacent upper base layer 100) is easily covered by the filling paste, affecting the connection between the adjacent upper and lower electrodes 11 of the inductor, and the risk of the inductor being open is high. If d1 > 1.5w, the area of ​​the first connection pad 112 is large, which easily generates parasitic capacitance, affecting the performance of the base layer 100. Therefore, the diameter d1 of the first connection pad 112 can be 1.1w ≤ d1 ≤ 1.5w, which can reduce the risk of the effective connection area 112c of the first connection pad 112 being covered by the filling paste, ensure the connection between the adjacent upper and lower electrodes 11 of the inductor, reduce the risk of the inductor open circuit, reduce parasitic capacitance, and improve the performance of the base layer 100. The diameter d1 of the first connection pad 112 can be 1.1w, 1.2w, 1.3w, 1.4w, 1.5w, etc., and this embodiment does not specifically limit this.

[0057] One or more embodiments of the present disclosure provide a base layer 100, in which an electrode layer 11 is provided through an insulating layer 10, and a coil 111 of the electrode layer 11 has a first end 111a, and a first connecting plate 112 of the coil 111 is provided using the first end 111a, so that electrical connection of the electrode layer 11 can be achieved through the first connecting plate 112, and an extension portion 113 is provided on the first connecting plate 112, and the extension portion 113 is extended from a side of the first connecting plate 112 away from the first end 111a in a direction away from the first end 111a, so that when the base layer 100 is printed with filling paste to fill the area outside the insulating layer 10 where the electrode layer 11 is provided, the extension portion 113 can effectively prevent the filling paste from spreading toward the first connecting plate 112 during filling, thereby reducing the risk of the first connecting plate 112 being covered by the filling paste. Furthermore, when the base layer 100 is applied to an inductor, by stacking multiple layers of base layers 100, the first connection pads 112 will not be covered by the filling paste, thereby ensuring electrical connection between the electrodes 11 of two adjacent base layers 100 and improving the manufacturing yield of the inductor.

[0058] Furthermore, the contour of the extension portion 113 can have a variety of different shapes. The shape of the extension portion 113 can be selected based on actual circumstances and is not specifically limited in this embodiment. Furthermore, when the contour is designed with a first side 113a, a second side 113b, and a third side 113c, the filler can be minimized from spreading onto the first connection pad 112, thereby ensuring a larger exposed area on the top surface of the first connection pad 112 and ensuring the reliability of the electrical connection of the first connection pad 112.

[0059] Please refer to Figure 6, which is a structural schematic diagram of an internal electrode layer 200 provided in one or more embodiments of the present disclosure. The internal electrode layer 200 includes the base layer 100 of Example 1, the coil 111 also has a second end 111b, and the electrode of the base layer 100 also includes a second connecting plate 114, and the second connecting plate 114 is arranged at the second end 111b.

[0060] Among them, when the internal electrode layer 200 is applied to the inductor, multiple internal electrode layers 200 are stacked in sequence, and from top to bottom along the stacking direction, in two adjacent internal electrode layers 200, the second connecting plate 114 of the upper internal electrode layer 200 is electrically connected to the first connecting plate 112 of the lower internal electrode layer 200.

[0061] Thus, the base layer 100 of the first embodiment can prevent the first connection pads 112 of the inner electrode layers 200 from being covered by the filling paste, thereby effectively ensuring that two adjacent inner electrode layers 200 can be electrically connected through the lower first connection pad 112 and the upper second connection pad 114.

[0062] For example, as shown in Figures 2 and 6 , the second end 111b is positioned opposite the first end 111a, the coil width is w, and the spacing between the extension portion 113 and the second connection pad 114 is d2, where d2 ≥ w. If d2 < w, the spacing d2 between the extension portion 113 and the second connection pad 114 is small, making it more likely that conduction between the extension portion 113 and the second connection pad 114 could cause a short circuit, and parasitic capacitance could be generated, affecting the performance of the inner electrode layer 200. Therefore, the spacing d2 between the extension portion 113 and the second connection pad 114 can be d2 ≥ w, which can reduce the risk of conduction between the extension portion 113 and the second connection pad 114 causing a short circuit, avoid the generation of parasitic capacitance, and improve the performance of the inner electrode layer 200.

[0063] One or more embodiments of the present disclosure provide an inner electrode layer 200 that can reduce the risk of the first connection pad 112 being covered by the filling paste, ensure electrical connection between two adjacent inner electrode layers 200 , and improve the manufacturing yield of the inductor.

[0064] Please refer to Figure 7, which is a structural schematic diagram of a lower lead layer 300 provided in one or more embodiments of the present disclosure. The lower lead layer 300 is applied to an inductor, and the inductor includes an external electrode. The lower lead layer 300 includes the base layer 100 of Example 1. The coil 111 also has a third end 111c. The electrode of the base layer 100 also includes a lead portion 115. The lead portion 115 is provided at the third end 111c and is located at the edge of the insulating layer 10. The lead portion 115 is used to be electrically connected to the external electrode.

[0065] When the lower lead layer 300 is applied to the inductor, the lower lead layer 300 is stacked below the inner electrode layer, and the first connection pad 112 of the lower lead layer 300 is used to electrically connect to the second connection pad of the adjacent inner electrode layer.

[0066] One or more embodiments of the present disclosure provide a lower lead layer 300 that can reduce the risk of the first connection pad 112 being covered by filling paste, ensure electrical connection between the lower lead layer 300 and the inner electrode layer, and improve the manufacturing yield of the inductor.

[0067] Please refer to Figures 8 to 9, which are schematic structural diagrams of a substrate 400 provided in one or more embodiments of the present disclosure. The substrate 400 includes an upper lead layer 40, an internal electrode layer 200 of Example 2, and a lower lead layer 300 of Example 3. The upper lead layer 40, multiple internal electrode layers 200, and the lower lead layer 300 are stacked in sequence. The upper lead layer 40 has a lead electrode 41. The first connecting pad 112 of the internal electrode layer 200 adjacent to the upper lead layer 40 is electrically connected to one end of the lead electrode 41. The second connecting pad 114 of an internal electrode layer 200 close to the upper lead layer 40 of any two adjacent internal electrode layers 200 is electrically connected to the first connecting pad 112 of the other internal electrode layer 200. The second connecting pad 114 of the internal electrode layer 200 adjacent to the lower lead layer 300 is electrically connected to the first connecting pad 112 of the lower lead layer 300.

[0068] The lead-out electrode 41 includes a third connection pad 41 a and a lead-out coil 41 b , and the base 400 has four internal electrode layers 200 .

[0069] One or more embodiments of the present disclosure provide a substrate 400 that can reduce the risk of the first connection pad 112 being covered by the filling paste, ensure electrical connection between the upper lead layer 40, multiple inner electrode layers 200 and the lower lead layer 300, and improve the production yield of the inductor.

[0070] Please refer to Figure 10, which is a schematic diagram of the structure of an inductor 500 provided in one or more embodiments of the present disclosure. The inductor 500 includes a first external electrode 50, a second external electrode 51, and the substrate 400 of the fourth embodiment. The first external electrode 50 is provided at one end of the substrate 400 and is electrically connected to the other end of the lead-out electrode. The second external electrode 51 is provided at an end of the substrate 400 away from the first external electrode 50 and is electrically connected to the lead-out portion.

[0071] One or more embodiments of the present disclosure provide an inductor 500 , which has a high manufacturing yield.

[0072] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above embodiments merely illustrate several implementations of the present disclosure, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the patent disclosed herein shall be determined by the appended claims. Industrial Applicability

[0074] The base layer, inner electrode layer, lower lead layer, substrate, and inductor provided by the present disclosure can effectively reduce the risk of the first connection pad being covered by the filling paste, ensure the electrical connection between two adjacent layers of electrodes, improve the preparation yield of the inductor, and have strong industrial applicability.

Claims

1. A base layer, comprising: Insulation layer; as well as An electrode, wherein the electrode is disposed on the insulating layer, and the electrode comprises: a coil having a first end; A first connection disk, the first connection disk is disposed at the first end; and An extension portion, the extension portion is disposed on the first connection plate, and the extension portion extends from a side of the first connection plate away from the first end toward a direction away from the first end; Among them, the projection of the first connecting plate on the surface of the insulating layer along the thickness direction of the base layer has an outer contour with a first connection point and a second connection point, the extending portion has a contour line, the contour line is constructed in an arc shape, and the two ends of the contour line are respectively connected to the first connection point and the second connection point, or the contour line includes a first side, a second side and a third side connected in sequence, an end of the first side facing away from the second side is connected to the first connection point, an end of the third side facing away from the second side is connected to the second connection point, and the second side is perpendicular to the first side and the third side.

2. The base layer according to claim 1, wherein, The diameter of the first connecting plate is d1, the extending length of the extending portion is L, and 0.1d1≤L≤d1.

3. The base layer according to claim 1, wherein, A line connecting the first connection point and the second connection point passes through the center of the first connection plate, and an extending direction of the line is the same as a width direction of the base layer.

4. The base layer according to any one of claims 1 to 3, wherein, The thickness of the coil is h, the width of the coil is w, and when h / w≤1 / 3, a first rounded corner is provided at a connection between the first side and the second side, and / or a second rounded corner is provided at a connection between the third side and the second side.

5. The base layer according to claim 4, wherein, The diameter of the first connecting plate is d1, the radius of the first fillet is r1, r1≤1 / 3d1, and the radius of the second fillet is r2, r2≤1 / 3d1.

6. The base layer according to claim 5, wherein When h / w<1 / 5, r1=1 / 3d1, r2=1 / 3d1; when 1 / 5≤h / w≤1 / 3, r1<1 / 3d1, r2<1 / 3d1.

7. The base layer according to any one of claims 1 to 3, wherein, The width of the coil is w, the diameter of the first connecting plate is d1, and 1.1w≤d1≤1.5w.

8. An inner electrode layer, comprising the base layer according to any one of claims 1 to 7, the coil further having a second end, the electrode of the base layer further comprising a second connection disk, and the second connection disk is arranged at the second end.

9. The inner electrode layer according to claim 8, wherein, The second end is arranged opposite to the first end, the width of the coil is w, and the distance between the extending portion and the second connecting plate is d2, d2≥w.

10. A lower lead layer, applied to an inductor, the inductor comprising an external electrode, the lower lead layer comprising the base layer according to any one of claims 1 to 7, the coil further comprising a third end, the electrode of the base layer further comprising a lead-out portion, the lead-out portion being arranged at the third end and the lead-out portion being located at an edge of the insulating layer, the lead-out portion being used to be electrically connected to the external electrode.

11. A substrate includes an upper lead layer, a plurality of inner electrode layers as described in claim 8 or 9, and a lower lead layer as described in claim 10. The upper lead layer, the plurality of inner electrode layers, and the lower lead layer are sequentially stacked. The upper lead layer has a lead-out electrode, and the first connection pad of the inner electrode layer adjacent to the upper lead layer is electrically connected to one end of the lead-out electrode. The second connection pad of the inner electrode layer close to the upper lead layer among any two adjacent inner electrode layers is electrically connected to the first connection pad of the other inner electrode layer. The second connection pad of the inner electrode layer adjacent to the lower lead layer is electrically connected to the first connection pad of the lower lead layer.

12. An inductor includes a first external electrode, a second external electrode, and a substrate as described in claim 11. The first external electrode is disposed at one end of the substrate and is electrically connected to the other end of the lead-out electrode. The second external electrode is disposed at the end of the substrate opposite to the first external electrode and is electrically connected to the lead-out portion.

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