Three-dimensional mounting device and three-dimensional mounting method

Abstract

This three-dimensional mounting device (10) comprises: a stage (20) which supports a three-dimensional substrate (1); a mounting head (24) which mounts a component (2) onto the surface of the three-dimensional substrate (1) so as to come into contact with cream solder (60) applied to the surface of the three-dimensional substrate (1); a laser head (20) which irradiates the cream solder (60) with a laser beam after the component (2) is mounted; and a controller (16). The controller (16) has: an angle calculation unit (37) that calculates the inclination angle of the three-dimensional substrate (1) in order to prevent an object in the periphery of the component (2) from being irradiated by the laser beam when the cream solder (60) in contact with the component (2) is irradiated with the laser beam; and a stage control unit (32) that controls the stage (20) such that the three-dimensional substrate (1) is inclined on the basis of the inclination angle of the three-dimensional substrate (1).

Description

Three-dimensional mounting device and three-dimensional mounting method

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

[0002] In the technical field relating to three-dimensional mounting devices, a three-dimensional mounting device that mounts components on a three-dimensional substrate, such as that disclosed in Patent Document 1, is known.

[0003] International Patent Application Publication No. 2018 / 207313

[0004] Components are mounted on the surface of the three-dimensional substrate so that they come into contact with the cream solder applied to the surface of the three-dimensional substrate. After the components are mounted, a laser beam is irradiated onto the cream solder, causing it to melt. The melted cream solder cools, soldering the components to the three-dimensional substrate. When irradiating the laser beam, the tilt angle of the three-dimensional substrate is adjusted so that the mounting area on the surface of the three-dimensional substrate on which the components are mounted is horizontal. When irradiating the laser beam onto the cream solder, there is a possibility that the laser beam will be blocked by objects around the components.

[0005] The technology disclosed in this specification aims to irradiate cream solder with laser light without being blocked by obstacles.

[0006] This specification discloses a three-dimensional mounting device that includes a stage that supports a three-dimensional substrate, a mounting head that mounts components on the surface of the three-dimensional substrate so that the components come into contact with cream solder applied to the surface of the three-dimensional substrate, a laser head that irradiates the cream solder with a laser beam after the components are mounted, and a controller. The controller has an angle calculation unit that calculates the tilt angle of the three-dimensional substrate so that the laser beam is not blocked by objects around the components when irradiating the cream solder that comes into contact with the components, and a stage control unit that controls the stage so that the three-dimensional substrate is tilted based on the tilt angle of the three-dimensional substrate.

[0007] According to the technology disclosed in this specification, it is possible to avoid obstructions on an intricate three-dimensional substrate and irradiate the cream solder with laser light to perform soldering.

[0008] FIG. 1 is a perspective view showing a substrate and a component according to the first embodiment. FIG. 2 is a perspective view showing a pallet that holds a substrate according to the first embodiment. FIG. 3 is an exploded perspective view showing a substrate and a pallet according to the first embodiment. FIG. 4 is a side view schematically showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 5 is a plan view schematically showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to the first embodiment. FIG. 7 is an exploded perspective view showing a pallet and a stage according to the first embodiment. FIG. 8 is a diagram schematically showing a mounting head according to the first embodiment. FIG. 9 is a hardware configuration diagram of a controller according to the first embodiment. FIG. 10 is a functional block diagram showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 11 is a plan view schematically showing a substrate according to the first embodiment. FIG. 12 is a diagram explaining the operation of a stage and a mounting head according to the first embodiment. FIG. 13 is a diagram explaining the operation of a stage and a mounting head according to the first embodiment. FIG. 14 is a diagram explaining the operation of a laser head according to the first embodiment. FIG. 15 is a diagram explaining positional deviation of a component according to the first embodiment. FIG. 16 is a flowchart showing a method for calculating an allowable angle according to the first embodiment. FIG. 17 is a diagram schematically illustrating an allowable angle storage unit according to the first embodiment. FIG. 18 is a flowchart illustrating a method for determining laser light irradiation conditions according to the first embodiment. FIG. 19 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the first embodiment. FIG. 20 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the first embodiment. FIG. 21 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the first embodiment. FIG. 22 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the first embodiment. FIG. 23 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the second embodiment. FIG. 24 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates laser light onto cream solder that contacts a component that is an allowable component according to the second embodiment.Fig. 25 is a diagram illustrating the operation of a three-dimensional mounting device that irradiates a laser beam onto cream solder that contacts a component that is an allowable component according to the second embodiment. Fig. 26 is a plan view showing a component according to the embodiment.

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of the predetermined plane, which is perpendicular to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is perpendicular to the predetermined plane, is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis direction is defined as the θX direction. The direction of rotation or tilt around the Y-axis direction is defined as the θY direction. The direction of rotation or tilt around the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. In the embodiments, the predetermined plane including the X axis and the Y axis is referred to as the XY plane as appropriate.

[0010] First Embodiment A first embodiment will be described.

[0011] <Substrate> Fig. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In this embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes the electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Pallet> Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to an embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0016] The base portion 4A is a plate-like member having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the top and bottom surfaces of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart in the Y-axis direction. One guard portion 4B protrudes toward the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B protrudes toward the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0018] Each of the multiple pin portions 4C protrudes from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the +Y side of the substrate 1. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the -Y side of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, thereby sandwiching the substrate 1 between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0020] <Three-dimensional mounting apparatus> Fig. 4 is a side view schematically showing a three-dimensional mounting apparatus 10 according to an embodiment. Fig. 5 is a plan view schematically showing the three-dimensional mounting apparatus 10 according to an embodiment. The three-dimensional mounting apparatus 10 mounts a component 2 on a substrate 1.

[0021] The three-dimensional mounting device 10 includes a base member 18, a conveying device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a chamber 29, and a controller 16.

[0022] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , the dispenser 11 , the laser head 12 , and the head moving device 27 .

[0023] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the three-dimensional mounting device 10. The processing position is defined by the transport path of the transport device 19.

[0024] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0026] The conveyor belt 19A is circular. A pair of conveyor belts 19A is provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are looped around the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0027] Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0028] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0029] Fig. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. Fig. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side when it is transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the +Y side guide member 19B moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. When the +Y side guide member 19B moves in the Y axis direction away from the other guide member 19B, support of the pallet 3 by the transport belt 19A is released. When support of the pallet 3 by the transport belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. With the pallet 3 supported on the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is centered between the two guide members 19B, making it possible to move the stage 20 in each of the Z axis direction, the θX direction, and the θY direction.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A, and the guide member 19B on the +Y side moves in the -Y side until the other side of the pallet 3 is on the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from fixation, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the component supply devices 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0035] The mounting head 24 mounts components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in both the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. Operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. Operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby moving the mounting head 24 in the Y-axis direction.

[0037] FIG. 8 is a schematic diagram showing a mounting head 24 according to an embodiment. As shown in FIG. 8 , the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact, a suction operation is performed through the opening provided at the lower end of the nozzle 23, thereby suction-holding the component 2 at the lower end of the nozzle 23. When the suction operation through the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to the plurality of shafts 23A, respectively. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to the plurality of shafts 23A, respectively. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0039] The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the component 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0040] The camera 25 captures an image of the board 1. In this embodiment, the camera 25 captures an image of the surface of the board 1 from the +Z side of the board 1. The camera 25 is provided on the mounting head 24. The camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The camera 25 can capture an image of an alignment mark provided on the surface of the board 1. The camera 25 can capture an image of the component 2 after it has been mounted on the board 1.

[0041] The dispenser 11 applies cream solder to the board 1. The dispenser 11 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 19. The dispenser 11 and the mounting head 24 can move separately. After the dispenser 11 applies cream solder to the surface of the board 1, the mounting head 24 mounts the components 2 on the board 1. The mounting head 24 mounts the components 2 on the board 1 to which the cream solder has been applied.

[0042] The laser head 12 irradiates the cream solder with laser light so that the cream solder melts. After the component 2 is mounted on the board 1 via the cream solder, the laser head 12 irradiates the cream solder with laser light. The laser head 12 irradiates the cream solder with laser light to melt the cream solder. The laser head 12 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 19. The laser head 12, the dispenser 11, and the mounting head 24 can move separately.

[0043] The chamber 29 has an internal space that accommodates the base member 18, the conveying device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, and the laser head 12.

[0044] <Controller> FIG. 9 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 includes a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 16C, and an interface 16D including an input / output circuit. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C, loads it into the main memory 16B, and executes predetermined processing in accordance with the computer program. The computer program may be distributed to the controller 16 via a network.

[0045] 10 is a functional block diagram showing the three-dimensional mounting apparatus 10 according to the embodiment. As shown in FIG. 10, the controller 16 has an allowable angle storage unit 30, a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a positional deviation amount calculation unit 35, an allowable angle acquisition unit 36, an angle calculation unit 37, a determination unit 38, and a three-dimensional shape data storage unit 39.

[0046] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to the surface of the substrate 1.

[0047] Fig. 11 is a plan view schematically showing a substrate 1 according to an embodiment. As shown in Fig. 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting areas 50 are areas where components 2 are mounted. A component 2 is mounted in each of the plurality of mounting areas 50. A dispenser control unit 31 applies cream solder 60 to each of the plurality of mounting areas 50.

[0048] The stage control unit 32 controls the stage 20. The head control unit 33 controls the mounting head 24 so that the components 2 are mounted on the substrate 1 supported by the stage 20.

[0049] 12 and 13 are diagrams illustrating the operation of the stage 20 and mounting head 24 according to the embodiment. A plurality of mounting areas 50 are set on the surface of the substrate 1. In the example shown in FIGS. 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include mounting areas 50A, 50B, and 50C. Cream solder 60 is applied to each of the plurality of mounting areas 50. The components 2 include a component 2A mounted in mounting area 50A, a component 2B mounted in mounting area 50B, and a component 2C mounted in mounting area 50C.

[0050] When mounting components 2 in mounting areas 50 set on the surface of substrate 1, the tilt angle of substrate 1 is adjusted so that mounting areas 50 are horizontal. Stage control unit 32 controls stage 20 so that multiple mounting areas 50 are successively made horizontal. Head control unit 33 controls mounting head 24 so that components 2 are successively mounted in mounting areas 50 that are horizontal. Mounting head 24 mounts components 2 on the surface of substrate 1 so that components 2 come into contact with cream solder 60 applied to the surface of substrate 1.

[0051] 12 , when mounting a component 2A on a mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is horizontal. The head control unit 33 controls the mounting head 24 so that the component 2A is mounted on the horizontal mounting area 50A. The component 2A is mounted on the mounting area 50A via the cream solder 60 that has been applied to the mounting area 50A.

[0052] 13 , after component 2A is mounted in mounting area 50A, component 2B is mounted in mounting area 50B. When mounting component 2B in mounting area 50B, stage control unit 32 controls stage 20 so that mounting area 50B is in a horizontal position. Head control unit 33 controls mounting head 24 so that component 2B is mounted in mounting area 50B in a horizontal position. Component 2B is mounted in mounting area 50B via cream solder 60 that has been applied to mounting area 50B.

[0053] After component 2B is mounted in mounting area 50B, component 2C is mounted in mounting area 50C. When mounting component 2C in mounting area 50C, stage control unit 32 controls stage 20 so that mounting area 50C is in a horizontal position. Head control unit 33 controls mounting head 24 so that component 2C is mounted in mounting area 50C in a horizontal position. Component 2C is mounted in mounting area 50C via cream solder 60 applied to mounting area 50C.

[0054] The laser control unit 34 controls the laser head 12. After the component 2 is mounted in the mounting area 50 via the cream solder 60, the laser control unit 34 controls the laser head 12 so that the cream solder 60 is irradiated with laser light. After the component 2 is mounted, the laser head 12 irradiates the cream solder 60 with laser light. The cream solder 60 is melted by being irradiated with laser light. The melted cream solder 60 cools, and the component 2 is soldered to the board 1.

[0055] 14 is a diagram illustrating the operation of the laser head 12 according to the embodiment. As shown in FIG. 14 , the laser head 12 irradiates the cream solder 60 with laser light after mounting the components 2 on the mounting areas 50. When irradiating the cream solder 60 in the mounting areas 50 on which the components 2 have been mounted with laser light, the tilt angle of the board 1 is adjusted so that the mounting areas 50 are horizontal. The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively brought into a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting areas 50 is successively irradiated with laser light.

[0056] 14 , when irradiating the cream solder 60 in the mounting area 50A on which the component 2A has been mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50A. The cream solder 60 in the mounting area 50A is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50A is cooled, thereby soldering the component 2A to the mounting area 50A.

[0057] When irradiating the cream solder 60 in the mounting area 50B on which the component 2B is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50B. The cream solder 60 in the mounting area 50B is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50B is cooled, thereby soldering the component 2B to the mounting area 50B.

[0058] When irradiating the cream solder 60 in the mounting area 50C on which the component 2C is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50C is horizontal. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50C. The cream solder 60 in the mounting area 50C is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50C is cooled, thereby soldering the component 2C to the mounting area 50C.

[0059] <Allowable Angle> The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting relative to the mounting area 50. The component 2 after mounting on the board 1 is imaged by the camera 25. The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting based on the image data of the component 2 after mounting imaged by the camera 25.

[0060] 15 is a diagram illustrating misalignment of the component 2 according to the embodiment. After the component 2 is mounted on the mounting area 50 via the cream solder 60, the component 2 is not soldered to the mounting area 50 before the cream solder 60 is irradiated with laser light. Therefore, as shown in FIG. 15 , if the mounting area 50 is tilted with respect to the horizontal plane, the component 2 may be misaligned with respect to the mounting area 50 due to the effect of gravity.

[0061] 13, when a component 2A is mounted on a mounting area 50A and then a component 2B is mounted on a mounting area 50B, the mounting area 50A is tilted with respect to the horizontal plane. When the mounting area 50A is tilted with respect to the horizontal plane, the component 2A may be misaligned due to the action of gravity.

[0062] When calculating the misalignment amount ΔD of the component 2, the component 2 is mounted on the mounting area 50 via the cream solder 60, and then the camera 25 captures an image of the component 2 before the cream solder 60 is irradiated with laser light. The misalignment amount calculation unit 35 can calculate the misalignment amount ΔD of the component 2 based on the image data of the component 2 captured by the camera 25.

[0063] The allowable angle acquisition unit 36 ​​acquires an allowable angle θ indicating the maximum tilt angle of the component 2 at which the amount of misalignment ΔD of the component 2 after mounting is suppressed to a predetermined specified amount or less. The tilt angle of the component 2 is equal to the tilt angle of the mounting area 50 on which the component 2 is mounted. The tilt angles of the component 2 and the mounting area 50 are tilt angles with respect to the horizontal plane. The specified amount is a value close to zero. In the embodiment, the allowable angle θ is the maximum tilt angle at which the component 2 does not substantially misalign.

[0064] 15 , when the misalignment amount calculation unit 35 calculates the misalignment amount ΔD, the stage control unit 32 tilts the mounting area 50 to an arbitrary tilt angle. The stage control unit 32 gradually increases the tilt angle of the mounting area 50 relative to the horizontal plane from 0 degrees. The camera 25 captures images of the components 2 mounted in the mounting area 50 at gradually increasing tilt angles. Based on the image data of the components 2 mounted in the mounting area 50 at gradually increasing tilt angles, the misalignment amount calculation unit 35 can calculate the maximum tilt angle of the components 2 at which the misalignment amount ΔD is equal to or less than a specified value. In the embodiment, based on the image data of the components 2, the misalignment amount calculation unit 35 can calculate the maximum tilt angle of the components 2 at which the components 2 are not substantially misaligned.

[0065] The allowable angle acquisition unit 36 ​​acquires, as the allowable angle θ, the maximum value of the tilt angle of the component 2 at which the positional deviation ΔD of the component 2 calculated by the positional deviation calculation unit 35 is equal to or less than a specified amount. The positional deviation calculation unit 35 calculates the allowable angle θ of each of the multiple components 2 mounted on the board 1. The allowable angle acquisition unit 36 ​​acquires the allowable angle θ of each of the multiple components 2 mounted on the board 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 ​​is stored in the allowable angle storage unit 30.

[0066] The angle calculation unit 37 calculates the tilt angle α of the substrate 1 so that, when the cream solder 60 in contact with the component 2 is irradiated with laser light, objects around the component 2 are not irradiated with the laser light. The objects around the component 2 include other components that exist around the component 2 after mounting. The objects around the component 2 include parts of the substrate 1 that exist around the component 2 after mounting. The surrounding objects here also include all obstructions that become an obstacle when the cream solder is irradiated with laser light.

[0067] The three-dimensional shape data storage unit 39 stores three-dimensional shape data for the substrate 1, the component 2, and objects surrounding the component 2. The angle calculation unit 37 calculates the tilt angle α of the substrate 1 based on the three-dimensional shape data for the substrate 1, the component 2, and objects surrounding the component 2.

[0068] When laser light is irradiated onto the cream solder 60 in contact with the component 2, the stage control unit 32 controls the stage 20 so that the substrate 1 is tilted based on the tilt angle α of the substrate 1 calculated by the angle calculation unit 37.

[0069] The determination unit 38 determines whether the tilt angle β of the component 2 (mounting area 50) when the board 1 is tilted at the tilt angle α is equal to or less than the allowable angle θ. If the stage control unit 32 determines that the tilt angle β of the component 2 (mounting area 50) is equal to or less than the allowable angle θ, it tilts the board 1 to the tilt angle α of the board 1.

[0070] 16 is a flowchart showing a method for calculating the allowable angle θ according to the embodiment. When calculating the allowable angle θ, a test board 1 and a test component 2 are used.

[0071] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are successively brought into a horizontal state. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SA1).

[0072] The head control unit 33 controls the mounting head 24 so that the components 2 are sequentially mounted on the horizontal mounting area 50 (step SA2).

[0073] The positional deviation calculation unit 35 causes the camera 25 to capture an image of the component 2 in the mounting area 50 (step SA3).

[0074] The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of each component 2 based on the image data of the component 2 captured in step SA3 (step SA4). It is determined whether the misalignment amount ΔD calculated by the misalignment amount calculation unit 35 is equal to or less than a specified amount (step SA5).

[0075] In step SA5, if it is determined that the positional deviation amount ΔD is less than the specified amount (step SA5: Yes), the stage control unit 32 increases the inclination angle of the mounting area 50, and the positional deviation amount calculation unit 35 repeats imaging and calculation of the positional deviation amount ΔD (step SA6).

[0076] In step SA5, if it is determined that the positional deviation amount ΔD exceeds the specified amount (step SA5: No), the tilt angle before the positional deviation amount ΔD exceeds the specified amount is stored in the allowable angle memory unit 30 as the allowable angle θ of the tilt angle of the part 2 (step SA7).

[0077] This operation is performed for each component 2 to be mounted on the board 1. The allowable angle θ stored in the allowable angle storage unit 30 can be applied to other boards 1 as long as the components 2 are the same.

[0078] 17 is a diagram schematically illustrating the allowable angle storage unit 30 according to the embodiment. As shown in FIG. 17 , correlation data (allowable angle table) between the part 2 and the allowable angle θ is stored in the allowable angle storage unit 30. The allowable angle acquisition unit 36 ​​stores the allowable angle θ in the allowable angle storage unit 30.

[0079] The allowable angle θ of the component 2 may be measured by a measuring device separate from the three-dimensional mounting device 10. The allowable angle θ may be calculated, for example, based on the weight of the component 2. The allowable angle θ may be calculated taking into consideration not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60.

[0080] In the following description, a component 2 whose inclination angle β after mounting is suppressed to be equal to or less than the allowable angle θ will be referred to as an allowable component, and a component 2 whose inclination angle β after mounting exceeds the allowable angle θ will be referred to as a non-allowable component.

[0081] <Determining Irradiation Conditions> Figure 18 is a flowchart showing a method for determining irradiation conditions for laser light according to an embodiment. In the following description, the component 2 that comes into contact with the cream solder 60 irradiated with laser light will be referred to as the target component, as appropriate. Also, it is assumed that objects around the component 2 (target component) are components separate from the target component. Components present around the target component will be referred to as peripheral components, as appropriate.

[0082] The three-dimensional shape data of the board 1, the target component, and the peripheral components is stored in the three-dimensional shape data storage unit 39. The angle calculation unit 37 creates a three-dimensional model based on the three-dimensional shape data of the board 1, the target component, and the peripheral components, and determines whether there is a target component where the laser light is blocked by a peripheral component when the mounting area 50 of the target component is horizontal and the cream solder 60 of the target component is irradiated with the laser light (step SB1).

[0083] If it is determined in step SB1 that there is no target component that is blocked by a peripheral component (step SB1: No), the angle calculation unit 37 determines the irradiation conditions of the laser light so that the cream solder 60 is irradiated with the laser light without tilting the mounting area 50 of the target component (step SB5). That is, as described with reference to FIG. 14 , the cream solder 60 in the horizontal mounting area 50 is irradiated with the laser light.

[0084] In step SB1, if it is determined that there is a target component that is blocked by a surrounding component (step SB1: Yes), the angle calculation unit 37 calculates the inclination angle α of the substrate 1 for each target component that is blocked by the surrounding component so that the laser light is not irradiated onto the surrounding component (step SB2).

[0085] The determination unit 38 determines whether the inclination angle β of the component 2 (mounting area 50) when the board 1 is inclined at the inclination angle α is equal to or smaller than the allowable angle θ (step SB3).

[0086] In step SB3, if it is determined that the inclination angle β of the component 2 is less than or equal to the allowable angle θ (step SB3: Yes), the angle calculation unit 37 determines the irradiation conditions for the laser light so that the mounting area 50 of the target component (allowable component) is inclined and the laser light is irradiated onto the cream solder 60 (step SB4).

[0087] In step SB3, if it is determined that the inclination angle β of component 2 exceeds the allowable angle θ (step SB3: No Yes), the angle calculation unit 37 determines the mounting conditions of component 2 and the laser light irradiation conditions so that the target component (non-allowable component) is mounted on the board 1 before the allowable component, and so that the cream solder 60 in contact with the non-allowable component is irradiated with laser light (step SB6).

[0088] <Laser Light Irradiation on Permissible Components> The following describes the operation of the three-dimensional mounting device 10 when irradiating laser light on the cream solder 60 in contact with the permissible components. That is, the three-dimensional mounting device 10 operates based on the irradiation conditions determined in step SB4 of FIG.

[0089] 19, 20, 21, and 22 are diagrams illustrating the operation of a three-dimensional mounting device 10 that irradiates laser light onto cream solder 60 that contacts a component 2, which is an acceptable component according to the embodiment.

[0090] 19 , component 2D is the target component, and component 2E is the peripheral component. When the mounting area 50 of component 2D is horizontal and a laser beam is irradiated onto the cream solder 60 of component 2D, the laser beam is blocked by component 2E. Components 2D and 2E are each allowable components. Even if the board 1 is tilted at an angle α so that the laser beam is not irradiated onto component 2E, neither component 2D nor component 2E is substantially misaligned.

[0091] 19, the laser head 12 has an optical system 12A. The optical axis AX of the optical system 12A is parallel to the Z axis. In the example shown in Fig. 19, the height Hf of the focal point Fp of the laser light (optical system 12A) coincides with the height of the mounting area 50 of the component 2D.

[0092] 20, the stage control unit 32 controls the stage 20 so that the substrate 1 is tilted based on the tilt angle α of the substrate 1 calculated by the angle calculation unit 37. As shown in Fig. 20, by tilting the substrate 1, the laser light emitted from the laser head 12 is irradiated onto the cream solder 60 of the component 2D without being blocked by the component 2E.

[0093] 21 , the stage control unit 32 adjusts the height of the substrate 1 so that the cream solder 60 is positioned at the focal point Fp of the laser light when the substrate 1 is tilted. In the example shown in Fig. 21 , the stage control unit 32 raises the stage 20 in the +Z direction from the state shown in Fig. 20 .

[0094] 22, the stage control unit 32 moves the stage 20 so that the cream solder 60 in contact with the component 2D is evenly irradiated with the laser light. As shown in FIG. 22, if the laser light is not blocked by the component 2E, the stage 20 may be controlled so that the mounting area 50 of the component 2D is parallel to the horizontal plane.

[0095] <Effects> As described above, when a laser beam is irradiated onto the cream solder 60 in contact with the component 2D, if the mounting area 50 of the component 2D is horizontal, the laser beam may be blocked by the component 2E. In the embodiment, the tilt angle α of the substrate 1 is calculated so that the component 2E surrounding the component 2D is not irradiated with the laser beam when the cream solder 60 in contact with the component 2D is irradiated with the laser beam. Based on the tilt angle α of the substrate 1, the stage 20 is controlled so that the substrate 1 is tilted, and therefore the laser head 12 can irradiate the cream solder 60 in contact with the component 2D with the laser beam.

[0096] Second Embodiment A second embodiment will be described below. In the following description, the same or equivalent components as those in the above-described embodiment will be denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0097] 23, 24, and 25 are diagrams illustrating the operation of the three-dimensional mounting device 10 that irradiates laser light onto cream solder 60 that contacts the component 2D, which is an allowable component according to the embodiment.

[0098] In this embodiment, the laser head 120 is an area-irradiation type laser head. As shown in Fig. 23, the optical system 120A of the laser head 120 forms an irradiation area that is larger than the outer shape of the component 2D. The irradiation area at the focal position of the laser light from the laser head 120 is rectangular. The height Hf of the image plane of the laser light (optical system 120A) coincides with the height of the mounting area 50 of the component 2D.

[0099] 24, the stage control unit 32 controls the stage 20 so that the substrate 1 is tilted based on the tilt angle α of the substrate 1 calculated by the angle calculation unit 37. As shown in Fig. 24, by tilting the substrate 1, the laser light emitted from the laser head 120 is irradiated onto the cream solder 60 of the component 2D without being blocked by the component 2E.

[0100] 25, the stage control unit 32 adjusts the height of the substrate 1 so that the cream solder 60 is positioned on the image plane of the laser light when the substrate 1 is tilted. In the example shown in Fig. 25, the stage control unit 32 raises the stage 20 in the +Z direction from the state shown in Fig. 24.

[0101] Fig. 26 is a plan view showing a component 2D according to an embodiment. As shown in Fig. 26, the component 2D has a plurality of electrodes 220. The component 2D is mounted on the substrate 1 so that each of the plurality of electrodes 220 contacts the cream solder 60. The electrodes 220 and the substrate 1 are joined by the cream solder 60.

[0102] When adjusting the height of the stage 20, the stage control unit 32 adjusts the height of the substrate 1 so that the average height of the plurality of electrodes 220 is located on the image plane of the laser light when the substrate 1 is tilted. That is, when changing the stage 20 from the state shown in Fig. 24 to the state shown in Fig. 25, the stage control unit 32 controls the stage 20 so that the height of the image plane of the laser light and the average height of the plurality of electrodes 220 coincide with each other.

[0103] As described above, in this embodiment as well, the cream solder 60 in contact with the component 2D is irradiated with laser light.

[0104] The present disclosure includes the following aspects: (1) A three-dimensional mounting device comprising: a stage that supports a three-dimensional substrate; a mounting head that mounts components on a surface of the three-dimensional substrate so that the components come into contact with cream solder applied to the surface of the three-dimensional substrate; a laser head that irradiates the cream solder with laser light after the components are mounted; and a controller, wherein the controller has: an angle calculation unit that calculates a tilt angle of the three-dimensional substrate so that, when the laser light is irradiated onto the cream solder in contact with the components, an object around the components is not irradiated with the laser light; and a stage control unit that controls the stage so that the three-dimensional substrate is tilted based on the tilt angle of the three-dimensional substrate. (2) The three-dimensional mounting device described in (1), wherein the controller has a three-dimensional shape data storage unit that stores three-dimensional shape data of the three-dimensional substrate, the components, and the objects, and the angle calculation unit calculates the tilt angle of the three-dimensional substrate based on the three-dimensional shape data. (3) The three-dimensional mounting device according to (1), wherein the controller includes: an allowable angle acquisition unit that acquires an allowable angle indicating a maximum value of the tilt angle of the component at which the amount of positional deviation after mounting is suppressed to a specified amount or less; and a determination unit that determines whether the tilt angle of the component is equal to or less than the allowable angle, and the stage control unit tilts the three-dimensional substrate to the tilt angle of the three-dimensional substrate when it is determined that the tilt angle of the component is equal to or less than the allowable angle. (4) The three-dimensional mounting device according to (1), wherein the object is another component present in the vicinity of the component. (5) The three-dimensional mounting device according to (1), wherein the stage control unit adjusts the height of the three-dimensional substrate so that the cream solder is located at the focus of the laser light when the three-dimensional substrate is tilted. (6) The three-dimensional mounting device according to (5), wherein the component includes a plurality of electrodes, and the component is mounted so that each of the plurality of electrodes is in contact with the cream solder, and the stage control unit adjusts the height of the three-dimensional substrate so that the average height of the plurality of electrodes is located on the image plane of the laser light when the three-dimensional substrate is tilted.(7) A three-dimensional mounting method comprising: mounting a component on a surface of a three-dimensional substrate so that the component comes into contact with cream solder applied to the surface of the three-dimensional substrate; calculating an inclination angle of the three-dimensional substrate so that, when irradiating the cream solder in contact with the component with a laser beam, an object around the component is not irradiated with the laser beam; and tilting the three-dimensional substrate based on the inclination angle of the three-dimensional substrate.

[0105] This application is based on Japanese Patent Application No. 2023-223347, filed on December 28, 2023, the contents of which are incorporated herein by reference.

Claims

1. A three-dimensional mounting apparatus comprising: a stage for supporting a three-dimensional substrate; a mounting head for mounting components on the surface of the three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate; a laser head for irradiating the cream solder with a laser beam after mounting the components; and a controller, wherein the controller has an angle calculation unit for calculating an inclination angle of the three-dimensional substrate so that the laser beam is not irradiated onto an object around the component when irradiating the cream solder in contact with the component with the laser beam, and a stage control unit for controlling the stage so that the three-dimensional substrate is inclined based on the inclination angle of the three-dimensional substrate.

2. The three-dimensional mounting apparatus according to claim 1, wherein the controller has a three-dimensional shape data storage unit for storing three-dimensional shape data of each of the three-dimensional substrate, the component, and the object, and the angle calculation unit calculates the inclination angle of the three-dimensional substrate based on the three-dimensional shape data.

3. The three-dimensional mounting apparatus according to claim 1, wherein the controller includes a tolerance angle acquisition unit for acquiring a tolerance angle indicating a maximum value of an inclination angle of the component such that a displacement amount after mounting is suppressed to be equal to or less than a specified amount, and a determination unit for determining whether or not the inclination angle of the component is equal to or less than the tolerance angle, and the stage control unit inclines the three-dimensional substrate at the inclination angle of the three-dimensional substrate when it is determined that the inclination angle of the component is equal to or less than the tolerance angle.

4. The three-dimensional mounting apparatus according to claim 1, wherein the object is another component existing around the component.

5. The three-dimensional mounting apparatus according to claim 1, wherein the stage control unit adjusts the height of the three-dimensional substrate so that the cream solder is disposed at the focal point of the laser beam when the three-dimensional substrate is inclined.

6. The component includes a plurality of electrodes, the component is mounted such that each of the plurality of electrodes contacts the cream solder, and the stage control unit adjusts the height of the three-dimensional substrate so that the average height of the plurality of electrodes is disposed on the image plane of the laser beam when the three-dimensional substrate is inclined. The three-dimensional mounting apparatus according to claim 5.

7. Mounting components on the surface of the three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate; calculating an inclination angle of the three-dimensional substrate for preventing the laser light from irradiating an object around the component when irradiating the cream solder contacting the component with the laser light; and inclining the three-dimensional substrate based on the inclination angle of the three-dimensional substrate. A three-dimensional mounting method comprising the above steps.

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