Printed circuit board module and electronic device comprising same

Abstract

This printed circuit board module comprises: a first printed circuit board including a first hole, a second hole, and a third hole; a second printed circuit board coupled to the third hole; electronic components disposed on one surface of the second printed circuit board; and a bracket disposed at the first hole and coupled to ends of the electronic components, wherein the second printed circuit board is perpendicular to the first printed circuit board.

Description

Printed circuit board module and electronic device including the same

[0001] The present embodiment relates to a printed circuit board module and an electronic device including the same.

[0002]

[0003] Electronic devices typically include a housing, a printed circuit board (PCB) positioned within the housing, and a number of electronic components positioned on the PCB. Electronic components positioned on the PCB vary in size depending on their function and type. Therefore, placing electronic components of different sizes on a single PCB presents a challenge in efficiently utilizing the space within the housing.

[0004] Recently, electronic devices are becoming more miniaturized, but considering the narrow space within the housing and the occurrence of electrical noise between multiple electronic components, it is difficult to arrange electronic components, including printed circuit boards, within the housing.

[0005]

[0006] The present invention provides a printed circuit board module capable of compactly arranging a plurality of electronic components within a main printed circuit board to secure a wider space for arranging components within a housing, and physically and electrically firmly connecting a sub-printed circuit board within a main printed circuit board, and an electronic device including the same.

[0007]

[0008] A printed circuit board module according to the present embodiment comprises: a first printed circuit board including a first hole, a second hole, and a third hole; a second printed circuit board coupled to the third hole; an electronic component disposed on one surface of the second printed circuit board; and a bracket disposed in the first hole and coupled to one end of the electronic component, wherein the second printed circuit board is perpendicular to the first printed circuit board.

[0009] The above bracket includes a front portion and a plurality of side portions arranged at both ends of the front portion, and an electronic component joining groove for joining the electronic component can be formed between the plurality of side portions.

[0010] The electronic component and the electronic component joining groove may be provided in plurality, and may include a partition portion that protrudes from the rear surface of the front portion and divides a plurality of adjacent electronic component joining grooves.

[0011] The side surface of the above-mentioned compartment or the side surface of the side surface may have a rounded shape corresponding to the outer curvature of the electronic component.

[0012] The above bracket can be soldered on the first printed circuit board.

[0013] A flange having a shape that protrudes outward from other areas is arranged on a side of the above bracket, a lower surface of the flange is in contact with an upper surface of the first printed circuit board, and a lower area of ​​the flange can be arranged within the first hole.

[0014] The first to third holes are interconnected, the second hole is disposed between the first hole and the third hole, and at least a portion of the electronic component can be disposed within the second hole.

[0015] The first direction length of the third hole is longer than the first direction thickness of the second printed circuit board, and a gap may be formed between the back surface of the second printed circuit board and the inner surface of the third hole.

[0016] A terminal may be arranged on the first printed circuit board, and a connector coupled to the terminal may be arranged on the second printed circuit board.

[0017] An electronic device according to the present embodiment comprises a housing; and a printed circuit board module disposed within the housing, wherein the printed circuit board module comprises: a first printed circuit board including a first hole, a second hole, and a third hole; a second printed circuit board coupled to the third hole; an electronic component disposed on one surface of the second printed circuit board; and a bracket disposed in the first hole and coupled to one end of the electronic component, wherein the second printed circuit board is perpendicular to the first printed circuit board.

[0018]

[0019] According to this embodiment, since relatively tall electronic components are arranged vertically in the height direction through the sub-printed circuit board, there is an advantage in that the vertical height of the printed circuit board module can be reduced.

[0020] In addition, since multiple electronic components are supported through brackets fixed on the main printed circuit board, there is an advantage in that the electronic components can be more firmly maintained in their combined state.

[0021]

[0022] Figure 1 is a perspective view of a printed circuit board module according to an embodiment of the present invention.

[0023] Figure 2 is a drawing showing Figure 1 from a different angle.

[0024] Figure 3 is an exploded perspective view of a printed circuit board module according to an embodiment of the present invention.

[0025] Figure 4 is a drawing showing Figure 3 from a different angle.

[0026] FIG. 5 is a plan view showing the upper surface of a printed circuit board module according to an embodiment of the present invention.

[0027]

[0028] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0029] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0030] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0031] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and / or at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0032] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0033] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0034] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0035] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0036] The electronic device according to the present embodiment may include a TV, a mobile terminal, an electrical component installed in a vehicle, etc., but this is exemplary, and the electronic device may include various devices whose exterior is formed by a housing and which include a printed circuit board module placed within the housing.

[0037] FIG. 1 is a perspective view of a printed circuit board module according to an embodiment of the present invention, FIG. 2 is a view showing FIG. 1 from a different angle, FIG. 3 is an exploded perspective view of a printed circuit board module according to an embodiment of the present invention, FIG. 4 is a view showing FIG. 3 from a different angle, and FIG. 5 is a plan view showing an upper surface of a printed circuit board module according to an embodiment of the present invention.

[0038] Referring to FIGS. 1 to 5, a printed circuit board module (10) according to an embodiment of the present invention can be placed in a space within a housing that forms the exterior of an electronic device.

[0039] The above printed circuit board module (10) may include a first printed circuit board (100), a second printed circuit board (200), an electronic component (250), and a bracket (300).

[0040] The first printed circuit board (100) may be referred to as a main printed circuit board. The first printed circuit board (100) may be formed in a plate shape. The first printed circuit board (100) may have a rectangular cross-sectional shape. A plurality of electronic components may be arranged on the upper or lower surface of the first printed circuit board (100). The plurality of electronic components may be mounted on the surface of the first printed circuit board (100). The vertical height of each of the plurality of electronic components in the printed circuit board module (10), excluding the electronic components (250) arranged on the second printed circuit board (200), may be smaller than the vertical height of the second printed circuit board (200).

[0041] The first printed circuit board (100) may include a hole. The hole may be formed to penetrate from the upper surface to the lower surface of the first printed circuit board (100).

[0042] In detail, the holes of the first printed circuit board (100) may include a first hole (110), a second hole (120), and a third hole (130). As illustrated in FIG. 3, the first hole (110), the second hole (120), and the third hole (130) may be arranged along a first direction (X). The first hole (110), the second hole (120), and the third hole (130) may be interconnected. The length of the second hole (120) in the first direction (X) may be formed to be longer than the length of the first hole (110) in the first direction (X) or the length of the third hole (130) in the first direction (X). The first hole (110), the second hole (120), and the third hole (130) may each have a rectangular cross-sectional shape.

[0043] With respect to the second direction (Y) perpendicular to the first direction (X), the length (L1) of the first hole (110) may be formed to be longer than the length (L2) of the second hole (120). With respect to the second direction (Y), the length (L1) of the first hole (110) may be formed to be shorter than the length (L3) of the third hole (130).

[0044] The bracket (300) can be coupled to the first hole (110). The cross-sectional shape of the first hole (110) can be formed to correspond to the cross-sectional shape of the body (310) of the bracket (300) described later.

[0045] The electronic component (250) can be placed in the second hole (120).

[0046] The second printed circuit board (200) may be placed in the third hole (130). The first direction width (t, see FIG. 3) of the third hole (130) may be greater than the thickness of the second printed circuit board (200).

[0047] A pad (150) may be arranged on the surface of the first printed circuit board (100) to which the bracket (300) is coupled. The pad (150) may be an area where the copper foil of the first printed circuit board (100) is exposed. Alternatively, the pad (150) may be a metal plate attached to the first printed circuit board (100). The pad (150) may be an area having a ground power supply. The pads (150) may be provided in plurality and arranged on the outside of the area where the first hole (110) is formed. The plurality of pads (150) may be arranged to be spaced apart from each other along the edge of the first hole (110). A coupling portion (380) of the bracket (300), which will be described later, may be coupled to the pad (150). The above-mentioned connecting portion (380) can be soldered to the above-mentioned pad (150).

[0048] The printed circuit board module (10) may include a second printed circuit board (200). The second printed circuit board (200) may be referred to as a sub-printed circuit board. The second printed circuit board (200) may have a rectangular cross-sectional shape. The second printed circuit board (200) may be coupled to the first printed circuit board (100). The second printed circuit board (200) may be arranged perpendicularly to the first printed circuit board (100). The second printed circuit board (200) may be coupled to the third hole (130).

[0049] A protrusion (204) having a shape that protrudes downwards more than other regions may be arranged at the lower portion of the second printed circuit board (200). The protrusion (204) may be arranged at the lower portion of the upper region (202) of the second printed circuit board (200). The second direction (Y) length of the protrusion (204) may be shorter than the second direction (Y) length of the upper region (202). The second direction (Y) length of the protrusion (204) may correspond to the second direction (Y) length of the third hole (130). The second direction (Y) length of the upper region (202) may be longer than the second direction (Y) length of the third hole (130). The vertical length of the protrusion (204) may correspond to the thickness of the first printed circuit board (100). Accordingly, when the second printed circuit board (200) is bonded to the first printed circuit board (100), the protrusion (204) may be placed within the third hole (130), and the upper region (202) of the second printed circuit board (200) may be placed on the first printed circuit board (100).

[0050] The thickness of the second printed circuit board (200) may be smaller than the first direction (X) width (t) of the third hole (130). Accordingly, when the second printed circuit board (200) is coupled to the third hole (130), a gap (g, see FIG. 2) may be formed between the rear surface of the second printed circuit board (200) and the inner surface of the third hole (130) facing the rear surface. Through the gap (g), an assembly space for the second printed circuit board (200) within the third hole (130) may be secured. A support member (not shown) that supports the rear surface of the second printed circuit board (200) may be arranged in the gap (g). The above support member is positioned between the inner surface of the third hole (130) and the rear surface of the second printed circuit board (200), and can support the rear surface of the second printed circuit board (200).

[0051] The electronic component (250) may be arranged on the front surface of the second printed circuit board (200). The electronic component (250) may be a capacitor. The electronic component (250) may be mounted on the surface of the second printed circuit board (200). The electronic component (250) may be soldered to the surface of the second printed circuit board (200). The electronic component (250) may be provided in plurality and arranged to be spaced apart from each other along the second direction (Y). The electronic component (250) may have a length direction in the first direction (X). The length of the electronic component (250) in the first direction (X) may be longer than the vertical length of the second printed circuit board (200).

[0052] The electronic component (250) may be coupled to the second hole (120). The first direction (X) length of the electronic component (250) may be formed to be longer than the first direction (X) length of the second hole (120).

[0053] A connector may be arranged on the outside of the arrangement area of ​​the electronic component (250) on the front surface of the second printed circuit board (200). A terminal (190, see FIG. 1) may be arranged on the upper surface of the first printed circuit board (100) facing the connector. When the second printed circuit board (200) is coupled to the first printed circuit board (100), the connector may be coupled to the terminal (190). Accordingly, the first printed circuit board (100) and the second printed circuit board (200) may be electrically connected.

[0054] The printed circuit board module (10) may include a bracket (300). One end of the electronic component (250) may be coupled to the bracket (300). It may be understood that one end of the electronic component (250) is coupled to the bracket (300), and the other end is coupled to the second printed circuit board (200). The bracket (300) may be coupled to the first printed circuit board (100). The bracket (300) may be coupled to the first hole (110).

[0055] The bracket (300) may include a body portion (310). The body portion (310) may have a cross-sectional shape that is approximately in the shape of the letter “ㄷ”. The body portion (310) may include a front portion (302) arranged in a second direction (Y), and a plurality of side portions (304) extending rearward from both ends of the front portion (302) in a first direction (X). The body portion (310) may be formed to correspond to the cross-sectional shape of the first hole (110). At least a portion of the body portion (310) may be coupled within the first hole (110). A flange portion (320) having a shape that protrudes outward more than other regions may be formed on a side surface of the body portion (310). A lower surface of the flange portion (320) may be in contact with an upper surface of the first printed circuit board (100). Based on the flange portion (320), the lower region of the flange portion (320) may be placed within the first hole (110), and the upper region of the flange portion (320) may be placed on the first printed circuit board (100). The lower region of the flange portion (320) may be press-fitted into the first hole (110). The cross-sectional shape of the lower region of the flange portion (320) may correspond to the cross-sectional shape of the first hole (110).

[0056] A coupling portion (380) may be arranged on a side surface of the body portion (310). The coupling portion (380) may have a shape that protrudes outward from the side surface of the flange portion (320). A plurality of coupling portions (380) may be provided and arranged to be spaced apart from each other along the perimeter of the body portion (310). The coupling portions (380) may be soldered to the pad (150) of the first printed circuit board (100) described above. Accordingly, the bracket (300) may be firmly coupled to the first printed circuit board (100).

[0057] The above body part (310) may include a through hole (315, see FIG. 2) having a shape that penetrates the lower surface from the upper surface. The through holes (315) may be provided in multiple numbers corresponding to the number of electronic components (250) and may be arranged to be spaced apart from each other along the second direction (Y).

[0058] The above bracket (300) may include an electronic component joining groove (340). The electronic component joining groove (340) may be formed between a plurality of side portions (304). The electronic component joining groove (340) may be provided in multiple numbers to correspond to the number of electronic components (250) and may be arranged along the second direction (Y).

[0059] The bracket (300) may include a partition (330) that mutually partitions two adjacent joining grooves (340). The partition (330) may have a shape that protrudes rearward from the rear surface of the front portion (302) facing the electronic component (250). The partition (330) may be provided in multiple numbers and may be arranged to be spaced apart from each other along the second direction (Y). Accordingly, the electronic component joining groove (340) may be formed between the multiple partitions (330), between the partition (330) and the side portion (304).

[0060] The side surface of the partition (330) forming the inner surface of the electronic component joining groove (340) or the side surface of the side surface portion (304) may be formed to be round. When the electronic component (250) has a circular cross-sectional shape, the side surface of the partition (330) or the side surface of the side surface portion (304) may be curved to correspond to the curvature of the outer surface of the electronic component (250). Accordingly, by increasing the contact area with the electronic component (250), the joining state of the electronic component (250) within the electronic component joining groove (340) can be maintained more firmly.

[0061] According to the structure described above, since relatively tall electronic components are arranged vertically in the height direction through the sub-printed circuit board, there is an advantage in that the vertical height of the printed circuit board module can be reduced.

[0062] In addition, since multiple electronic components are supported through brackets fixed on the main printed circuit board, there is an advantage in that the electronic components can be more firmly maintained in their combined state.

[0063] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0064] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A first printed circuit board including a first hole, a second hole, and a third hole; A second printed circuit board coupled to the third hole; Electronic components arranged on one side of the second printed circuit board; and A bracket is disposed in the first hole and is coupled to one end of the electronic component. The above second printed circuit board is a printed circuit board module which is perpendicular to the above first printed circuit board.

2. In paragraph 1, The above bracket includes a front portion and a plurality of side portions arranged at both ends of the front portion, A printed circuit board module in which an electronic component joining groove for joining the electronic components is formed between the plurality of side portions.

3. In paragraph 2, The above electronic components and the above electronic component joining home are provided in multiples, A printed circuit board module including a partition portion protruding from the rear surface of the front portion and defining a plurality of adjacent electronic component joining grooves.

4. In paragraph 3, A printed circuit board module in which the side surface of the above-mentioned compartment or the side surface of the above-mentioned side portion has a rounded shape corresponding to the outer curvature of the above-mentioned electronic component.

5. In paragraph 1, The above bracket is a printed circuit board module soldered on the first printed circuit board.

6. In paragraph 2, On the side of the above bracket, a flange having a shape that protrudes outward more than other areas is arranged, The lower surface of the above flange is in contact with the upper surface of the first printed circuit board, The lower region of the above flange is a printed circuit board module arranged within the first hole.

7. In paragraph 1, The first to third holes are interconnected, The second hole is positioned between the first hole and the third hole, A printed circuit board module wherein at least a portion of the electronic components are placed within the second hole.

8. In paragraph 1, The first direction length of the third hole is longer than the first direction thickness of the second printed circuit board, A printed circuit board module in which a gap is formed between the back surface of the second printed circuit board and the inner surface of the third hole.

9. In paragraph 1, Terminals are arranged on the above first printed circuit board, A printed circuit board module in which a connector coupled with the terminal is arranged on the second printed circuit board.

10. Housing; and A printed circuit board module is included that is arranged within the housing, The above printed circuit board module, A first printed circuit board including a first hole, a second hole, and a third hole; A second printed circuit board coupled to the third hole; Electronic components arranged on one side of the second printed circuit board; and A bracket is disposed in the first hole and is coupled to one end of the electronic component. The above second printed circuit board is an electronic device perpendicular to the above first printed circuit board.

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