Glass assembly in which antenna assembly is disposed, and vehicle having same

Abstract

This glass assembly comprises: a glass panel; a first flexible circuit board disposed in a first area of the glass panel and comprising a first substrate layer made of a transparent material and a first conductive pattern layer formed on one side of the first substrate layer; and a second flexible circuit board disposed in a second area of the glass panel, forming a second dielectric substrate, and having a second conductive pattern layer on a first side surface of the second dielectric substrate and a third conductive pattern layer on a second side surface of the second dielectric substrate. The second conductive pattern layer comprises a ground pattern and a feed pattern. The ground pattern includes a protruding pattern part.

Description

Glass assembly having an antenna assembly and a vehicle having the same

[0001] The present disclosure relates to a glass assembly having an antenna assembly disposed thereon. Particular embodiments relate to a glass assembly having a transparent antenna assembly disposed thereon and a vehicle having the same.

[0002] Vehicles can perform wireless communication services with other vehicles, surrounding objects, infrastructure, or base stations. In this regard, various communication services can be provided through wireless communication systems utilizing LTE or 5G communication technologies. Meanwhile, some LTE frequency bands may be allocated to provide 5G communication services.

[0003] Meanwhile, the vehicle body and roof are made of metal, which poses a problem of radio wave blocking. Therefore, a separate antenna structure can be placed on the upper portion of the vehicle body or roof. Alternatively, if the antenna structure is placed on the lower portion of the vehicle body or roof, the portion of the vehicle body or roof corresponding to the antenna placement area can be formed of a non-metallic material.

[0004] However, from a design perspective, the vehicle body or roof needs to be formed as one piece. In such cases, the exterior of the vehicle body or roof may be formed of metal. Consequently, there is a risk that the vehicle body or roof may significantly reduce antenna efficiency.

[0005] In this regard, transparent antennas can be placed on the glass corresponding to the vehicle's window to increase communication capacity without changing the vehicle's exterior design. However, there is a problem in that the antenna radiation efficiency and impedance bandwidth characteristics deteriorate due to the electrical loss of the transparent material antenna.

[0006] In this regard, PCT / KR2022 / 010240 and PCT / KR2022 / 010223 disclose a transparent antenna assembly comprising multiple radiating structures. The transparent antenna assembly comprising multiple conductive patterns operating in multiple frequency bands can be applied to a vehicle.

[0007] Meanwhile, a glass panel of a vehicle on which a transparent antenna assembly is disposed may be mounted on a metal frame. In this regard, a portion of the current on the conductive patterns constituting the transparent antenna assembly may leak into the glass panel. The leakage current on the glass panel may leak along the metal frame. The distance between the conductive patterns and the metal frame has a small value in wavelength units in the low band (LB). Accordingly, the influence of the leakage current due to the metal frame in the low band (LB) may increase, thereby reducing antenna efficiency.

[0008] An object of the present specification is to provide a glass assembly having a transparent antenna assembly disposed thereon and a vehicle having the same.

[0009] The purpose of this specification is to increase antenna efficiency in the low band (LB) in an antenna structure operating in multiple frequency bands.

[0010] The purpose of this specification is to reduce leakage current when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame.

[0011] The purpose of this specification is to increase antenna efficiency in the low band (LB) when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame.

[0012] According to one aspect of the present disclosure for achieving the above or other purposes, a glass assembly comprises: a glass panel; a first flexible circuit board disposed in a first region of the glass panel, the first flexible circuit board comprising a first substrate layer made of a transparent material and a first conductive pattern layer formed on one side of the first substrate layer; and a second flexible circuit board disposed in a second region of the glass panel, the second flexible circuit board comprising a second dielectric substrate and having a second conductive pattern layer on a first side of the second dielectric substrate and a third conductive pattern layer on a second side. The second conductive pattern layer has a ground pattern and a feed pattern. The ground pattern has a protruding pattern part.

[0013] In an embodiment, the first conductive pattern layer includes a first conductive pattern including a first portion and a second portion, the first portion being perpendicular to the second portion, and a second conductive pattern; and a third conductive pattern. The second conductive pattern has a smaller size than the third conductive pattern. The second conductive pattern is disposed between the first portion of the first conductive pattern and the second portion of the first conductive pattern. The first portion of the first conductive pattern and the third conductive pattern are disposed on opposite sides with respect to the second portion of the first conductive pattern. The second conductive pattern layer includes a ground pattern and a feed pattern. The feed pattern is connected to the first conductive pattern. An end portion of a first sub-pattern of the ground pattern is connected to the second conductive pattern. An end portion of a second sub-pattern of the ground pattern is connected to the third conductive pattern. The feed pattern is disposed in a space between the first sub-pattern and the second sub-pattern. The first side of the second sub-pattern is arranged to face the power supply pattern. The second side of the second sub-pattern forms the outer peripheral surface of the second substrate. The second side of the second sub-pattern has a protruding pattern portion.

[0014] According to another aspect of the present disclosure, a vehicle includes a frame; a glass panel mounted on the frame; a first flexible circuit board disposed on a first area of ​​the glass panel, the first flexible circuit board comprising a first substrate layer made of a transparent material and a first conductive pattern layer formed on one side of the first substrate layer; and a second flexible circuit board disposed on a second area of ​​the glass panel, the second flexible circuit board comprising a second dielectric substrate and having a second conductive pattern layer on a first side of the second dielectric substrate and a third conductive pattern layer on the second side.

[0015] In an embodiment, the first conductive pattern layer includes a first conductive pattern including a first portion and a second portion, the first portion being perpendicular to the second portion, and a second conductive pattern; and a third conductive pattern. The second conductive pattern has a smaller size than the third conductive pattern. The second conductive pattern is disposed between the first portion of the first conductive pattern and the second portion of the first conductive pattern. The first portion of the first conductive pattern and the third conductive pattern are disposed on opposite sides with respect to the second portion of the first conductive pattern. The second conductive pattern layer includes a ground pattern and a feed pattern. The feed pattern is connected to the first conductive pattern. An end portion of a first sub-pattern of the ground pattern is connected to the second conductive pattern. An end portion of a second sub-pattern of the ground pattern is connected to the third conductive pattern. The feed pattern is disposed in a space between the first sub-pattern and the second sub-pattern. The first side of the second sub-pattern is arranged to face the power supply pattern. The second side of the second sub-pattern forms the outer peripheral surface of the second substrate. The second side of the second sub-pattern has a protruding pattern portion.

[0016] In an embodiment of the glass assembly or the vehicle, the vertical axis direction size of the protruding second side of the protruding pattern portion may be formed in a predetermined range of 10 to 15 mm based on a wavelength (λg) of 0.08 of the first frequency band. The horizontal axis direction size of the protruding second side of the protruding pattern portion may be formed in a predetermined range of 5 to 8 mm based on a wavelength (λg) of 0.05 of the first frequency band. The first frequency band may be 750 to 960 MHz.

[0017] As an example, the protruding pattern portion and the metal frame that is combined with the second flexible circuit board may be arranged at a distance of 5 mm or more in the vertical axis direction.

[0018] In an embodiment, a first end portion of the power supply pattern may be connected to a third power supply pattern of the CPW pattern, and a second end portion of the power supply pattern may be connected to an end portion of the second portion of the first conductive pattern. The second end portion of the power supply pattern may be formed to have a predetermined length or more in the vertical axis direction.

[0019] As an example, the second interval of the horizontal axis direction end portion of the second sub-pattern may be formed longer than the first interval of the horizontal axis direction end portion of the first sub-pattern.

[0020] In an embodiment, the fourth interval in the horizontal axis direction of the second sub-pattern may be formed longer than the third interval in the horizontal axis direction of the first sub-pattern based on the other end of the protruding pattern portion. The fifth interval in the horizontal axis direction of the first sub-pattern and the sixth interval in the horizontal axis direction of the second sub-pattern may be formed to have the same length based on the point overlapping with the end portion of the second flexible circuit board.

[0021] In an embodiment, the third interval of the first sub-pattern may be formed longer than the first interval, and the fifth interval may be formed longer than the third interval. The second interval of the second sub-pattern may be formed longer than the sixth interval, and the fourth interval may be formed longer than the second interval.

[0022] In an embodiment, the upper portion of the first sub-pattern may be connected to the second conductive pattern. The first interval of the first sub-pattern may be formed to be the same as the length of the second conductive pattern in the horizontal axis direction. The upper portion of the second sub-pattern may be connected to the third conductive pattern. An end point of the upper portion of the second sub-pattern may be arranged at a point further to one side than an end point of the lower portion of the third conductive pattern.

[0023] In an embodiment, a first end portion among the end portions of the second sub-pattern may be configured to be connected to the third conductive pattern. A second end portion among the end portions of the second sub-pattern may not be connected to the third conductive pattern. The second end portion not connected to the third conductive pattern may be arranged adjacent to the power supply pattern and spaced apart from the power supply pattern in the horizontal axis direction.

[0024] In an embodiment, a first gap, a second gap, and a third gap may be formed between a side surface of the second portion of the first conductive pattern and a side surface of the third conductive pattern disposed near the second portion. The second gap may be formed between the first gap and the third gap. The second gap may be formed to be narrower than the first gap, and the first gap may be formed to be narrower than the third gap. By utilizing three different parallel capacitance components by the first gap to the third gap, a wideband impedance matching in a band of 1.7 to 3.5 GHz may be implemented.

[0025] In an embodiment, the first portion of the first conductive pattern may be configured with a first radiation area and a second radiation area, and the second radiation area may be configured to connect the first radiation area and the second portion. Radiation of a signal in a first frequency band may be performed in the first portion, and radiation of a signal in a second frequency band higher than the first frequency band may be performed in the second portion. A first size in the vertical axis direction of the first radiation area may be formed to be larger than a second size in the vertical axis direction of the second radiation area. A boundary line of an upper portion of the second radiation area may be formed diagonally so that the second size of the second radiation area increases toward the first radiation area.

[0026] In an embodiment, the glass panel may include a first glass as an inner glass and a second glass as an outer glass. The first conductive pattern layer, the second conductive pattern layer, and the third conductive pattern layer may be disposed between the first glass and the second glass. The first region may be disposed in a transparent region of the glass panel, and the second region may be disposed in an opaque region of the glass panel.

[0027] The technical effects of a glass assembly having an antenna assembly according to the present specification and a vehicle having the same are described as follows.

[0028] According to this specification, a glass assembly with a transparent antenna assembly is applied to a vehicle, enabling wireless communication across multiple frequency bands. In particular, by optimizing the structure of the ground pattern adjacent to the feed pattern in the transparent antenna assembly, antenna performance can be secured even in the low-band (LB) band.

[0029] According to the present specification, the shape of the ground pattern can be optimized to increase antenna efficiency in the low band (LB) in an antenna structure operating in multiple frequency bands.

[0030] According to the present specification, the horizontal and vertical lengths of the protruding ground pattern can be optimized to reduce leakage current when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame.

[0031] The purpose of this specification is to increase antenna efficiency in the low band (LB) when a glass panel of a vehicle having a transparent antenna assembly mounted on a metal frame is mounted. In particular, the antenna efficiency in the low band (LB) can be increased in a vehicle having a transparent antenna assembly mounted on the vehicle by optimizing the horizontal and vertical lengths of a protruding ground pattern in consideration of leakage current on the frame.

[0032] Further scope of the applicability of this specification will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this specification will be apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments, are given by way of example only.

[0033] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0034] Figure 2 is a configuration diagram of a vehicle according to an embodiment of the present specification.

[0035] Figure 3 shows a perspective view of a vehicle glass that can be joined or attached to the frame of the vehicle.

[0036] Figures 4a and 4b show cross-sectional views of the glass of Figure 3 and the frame of the vehicle combined.

[0037] Figure 5a shows an antenna assembly and connector structure arranged in a transparent area and an opaque area of ​​a vehicle's glass.

[0038] Figure 5b shows a soldering structure in which an antenna assembly disposed in a transparent area and an opaque area of ​​a vehicle's glass is soldered via a cable.

[0039] FIGS. 6A and 6B illustrate perspective and exploded views of a structure in which a glass panel having an antenna assembly according to the present disclosure is coupled to a frame of a vehicle.

[0040] Fig. 7a shows a cross-sectional view of a connector connection structure in a structure in which the glass panel of Figs. 6a and 6b is coupled to the frame of a vehicle.

[0041] Fig. 7b shows a cross-sectional view of a cable connection structure in a structure in which the glass panel of Figs. 6a and 6b is coupled to the frame of the vehicle.

[0042] Figure 8 shows a first structure having a limited ground area of ​​a flexible circuit board and a second structure having an extended ground area.

[0043] Figure 9 shows the current distribution in the flexible circuit board in the first structure having a limited ground area and the second structure having an extended ground area.

[0044] Figure 10 shows the electric field distribution of the first structure having a limited ground area of ​​the flexible circuit board in an antenna assembly having first and second radiating structures.

[0045] Figure 11 shows the electric field distribution of the second structure having an extended ground area of ​​the flexible circuit board in the antenna assembly having the first and second radiating structures.

[0046] Figure 12 is a diagram comparing the reflection coefficient due to leakage current through the vehicle frame and the reflection coefficient due to an extended ground area.

[0047] FIG. 13a illustrates a front view of a glass assembly according to an embodiment of the present disclosure.

[0048] FIG. 13b shows a front view of a structure in which a glass assembly is coupled to a frame according to another embodiment of the present disclosure.

[0049] FIG. 14 shows an area where a ground pattern having a protruding pattern portion is formed in the antenna assembly of FIG. 11, FIG. 13a, and FIG. 13b.

[0050] FIG. 15 shows an area where a ground pattern having a protruding second pattern portion is formed in the antenna assembly of FIGS. 11, 13a and 13b.

[0051] Fig. 16 shows a structure in which the conductive patterns are spaced apart at different intervals in the antenna assembly of Fig. 11.

[0052] Figures 17 and 18 illustrate a flexible printed circuit board having power supply patterns formed thereon for supplying a transparent antenna assembly according to the present specification.

[0053] Figure 19 shows a perspective view and a front view of a structure in which the flexible circuit board of Figures 17 and 18 is combined with a transparent antenna assembly.

[0054] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.

[0055] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0056] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0057] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0058] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0059] Below, a transparent antenna module according to the present specification and a method for manufacturing the same are described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0060] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).

[0061] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.

[0062] The above antenna may be disposed on the dielectric of the vehicle (1). The above antenna may be disposed on the glass of the vehicle (1). The above antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the above antenna may be a transparent antenna.

[0063] FIG. 2 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 2, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.

[0064] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).

[0065] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).

[0066] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).

[0067] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).

[0068] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0069] Meanwhile, the vehicle glass in which the transparent antenna module according to the present specification is implemented can be combined with the vehicle frame. In this regard, FIG. 3 illustrates a perspective view of vehicle glass that can be combined or attached to the vehicle frame. FIGS. 4A and 4B illustrate cross-sectional views of the glass of FIG. 3 combined with the vehicle frame. FIG. 4A illustrates a structure in which an antenna (20) is connected via a connection module (100) including a connector (100c). FIG. 4B illustrates a structure in which an antenna (20) is connected via an RF cable (110c) and a soldering structure (112s).

[0070] Referring to FIGS. 3 to 4b, the glass (10, 10') can be coupled or attached to the frame (9) of the vehicle and can cover the opening (9h) of the frame (9). For example, the glass (10, 10') can be glass of the vehicle (1), such as the front windshield (101), door glass (102, 103), quarter glass (104), rear windshield, side mirror, sunroof (105), or lamp glass (106) of FIG. 1.

[0071] The groove (9g) of the frame (9) may extend along the edge of the glass (10, 10') and define the boundary of the opening (9h). For example, the frame (9) may include a metal material, and a sealant (7, sealant) may be filled between the groove (9g) and the glass (10, 10'). The groove (9g) may be formed to have a step with respect to the inner boundary of the frame (9). The glass (10) having an opaque area (12) formed therein may be placed in the groove (9g) formed to have a step with respect to the inner end of the frame (9). As the glass (10) is placed in the groove (9g), the step of the groove (9g) may be regarded as non-existent from the outside of the vehicle.

[0072] The antenna (20, 1000) may be positioned on one surface of the glass (10) or inside the glass (10). The antenna (20, 1000) may be transparent. The antenna (20, 1000) may be flexible.

[0073] A connection module (100) including a connector (100c) can be disposed between an edge of a glass (10, 10') and an antenna (20), and can be located on one surface of the glass (10, 10'). The connector (100c) of the connection module (100) can be electrically connected to the antenna (20) through a substrate (30). An inner cover (8) can be opposite the glass (10) with respect to the frame (9) and can cover the connection module. The inner cover (8) can be referred to as an interior cover (8). The connection module can be referred to as a connector device, a Parkra jack portion, or a connector assembly.

[0074] A first region (1100a) in which an antenna (1000) is arranged may be formed in a transparent region (11) of glass (10). A second region (1100b), such as a flexible circuit board, may be formed in an opaque region (12) of glass (10). The RF cable (110c) may include a signal line (111c) in an inner region, a ground (112c) in an outer region, and a dielectric region (110d) formed between the signal line (111c) and the ground (112c). The signal line (111c) of the RF cable (110c) may be connected to a feed line formed in the second region (1100b) through a soldering structure (112s). The signal line (111c) of the RF cable (110c) can be electrically connected to the antenna (1000) of the first region (1100a) through a soldering structure (112s).

[0075] Meanwhile, a vehicle antenna assembly implementing a transparent antenna module according to the present specification can be placed in transparent and opaque areas of a vehicle's glass. In this regard, FIG. 5a illustrates an antenna assembly and a connector structure placed in the transparent and opaque areas of a vehicle's glass. FIG. 5b illustrates a soldering structure in which an antenna assembly placed in the transparent and opaque areas of a vehicle's glass is soldered via a cable.

[0076] Referring to FIG. 5A, the glass (10) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region. For example, the transparent region (11) may occupy most of the glass (10), and the opaque region (12) may be adjacent to one edge of the glass (10). The transparent region (11) and the opaque region (12) may be formed with the same width (W10), and the height (H11) of the transparent region (11) may be greater than the height (H12) of the opaque region (12).

[0077] The antenna (20) may be positioned on the transparent area (11) adjacent to the boundary between the transparent area (11) and the opaque area (12). A connection module including a connector (100c) may be positioned on the opaque area (12), and the connector (100c) of the connection module may be connected to the antenna (20) through the housing lower plate (111). The housing lower plate (111) may be fastened to the housing upper plate (112) to form a housing (110). The connector (100c) may be accommodated inside the housing (110). The housing (110) in which the connector (100c) is accommodated may be placed in the opaque area (12). Meanwhile, at least a part of the connection module may be positioned in the transparent area (11).

[0078] Referring to FIG. 5b, the glass (10) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region. For example, the transparent region (11) may occupy most of the glass (10), and the opaque region (12) may be adjacent to one edge of the glass (10). The glass (10) may be formed as a double-laminated glass structure including a first glass (10a) as an inner glass and a second glass (10b) as an outer glass.

[0079] The antenna (20) may be positioned on the transparent region (11) adjacent to the boundary between the transparent region (11) and the opaque region (12). The antenna (20) may be disposed between the first glass (10a) and the second glass (10b). One end of the flexible circuit board (1200) may be connected to the end of the antenna (20). A connection pad (100cp) may be formed at the other end of the flexible circuit board (1200). A first portion of the flexible circuit board (1200) connected to the antenna (20) may be disposed between the first glass (10a) and the second glass (10b). A second portion of the flexible circuit board (1200) connected to the connection pad (100cp) may be disposed on the first glass (10a).

[0080] A connection module including a connection pad (100cp) can be positioned on an opaque area (12), and the connection pad (100cp) of the connection module can be connected to an antenna (20) via a flexible circuit board (1200). The flexible circuit board (1200) can be connected to an RF cable (110c) via the connection pad (100cp). The flexible circuit board (1200) can be accommodated in a folded structure in the opaque area (12) of the glass (10).

[0081] Hereinafter, a glass assembly having an antenna assembly disposed thereon according to the present specification and a vehicle having the glass assembly will be described. An object of the present specification is to provide a glass assembly having a transparent antenna assembly disposed thereon and a vehicle having the same. An object of the present specification is to increase antenna efficiency in the low band (LB) in an antenna structure operating in multiple frequency bands. An object of the present specification is to reduce leakage current when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame. An object of the present specification is to increase antenna efficiency in the low band (LB) when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame.

[0082] In this regard, FIGS. 6A and 6B illustrate perspective views and exploded views of a structure in which a glass panel having an antenna assembly according to the present specification is coupled to a vehicle frame. FIG. 7A illustrates a cross-sectional view of a connector connection structure in a structure in which the glass panel of FIGS. 6A and 6B is coupled to a vehicle frame. FIG. 7B illustrates a cross-sectional view of a cable connection structure in a structure in which the glass panel of FIGS. 6A and 6B is coupled to a vehicle frame.

[0083] Fig. 6a shows a perspective view of a structure in which a glass panel (10) on which an antenna assembly (1000) is arranged is coupled to a frame (9) of a vehicle. Fig. 6b shows an exploded view of a structure in which a glass panel (10) on which an antenna assembly (1000) is arranged can be coupled to a frame (9) of a vehicle. The antenna assembly (1000) can be arranged between a double-laminated glass structure of a first glass (10a) as an inner glass and a second glass (10b) as an outer glass.

[0084] The first glass (10a) and the second glass (10b) can form a double-laminated glass structure bonded by a film layer (1030). The film layer (1030) can be formed of a PVB (Polyvinyl butyral) layer, but is not limited thereto and can be changed depending on the application. The film layer (1030) can include a first film layer (1030a) and a second film layer (1030b). The first film layer (1030a) can be disposed on the lower surface of the first glass (10a). The second film layer (1030b) can be disposed on the upper surface of the second glass (10b). The antenna assembly (1000) can be disposed between the first film layer (1030a) and the second film layer (1030b).

[0085] Referring to FIGS. 6A to 7B, the glass panel (10) may form a double-laminated glass structure. In this regard, the glass panel (10) may be formed into a multi-layer glass panel structure including a first glass (10a) and a second glass (10b).

[0086] An antenna assembly (1000) in the form of a transparent electrode may be placed between a first glass (10a) and a second glass (10b). The first glass (10a) and the second glass (10b) may be formed of laminated glass, but are not limited thereto and may be changed depending on the application. The first glass (10a) and the second glass (10b) may form a double-laminated glass structure bonded by a film layer (1030). The film layer (1030) may be formed of a PVB (Polyvinyl butyral) layer, but are not limited thereto and may be changed depending on the application.

[0087] A flexible circuit board (1200) having power supply patterns formed on the inside of a glass panel (10) of a double-laminated glass structure may be arranged to surround the outer area of ​​the glass panel (10). In addition, the flexible circuit board (1200) may be connected to a connector (100c) or RF cable (110c) that may be connected to a TCU on the first glass (10a), which is the inner glass.

[0088] The RF cable (110c) may be configured to include a signal line (111c) on the inner side, a ground (112c) on the outer side, and a dielectric region (110d) between the signal line (111c) and the ground (112c). The RF cable (110c) may be implemented as a coaxial cable or a pakra cable and may be connected to a connection pad (100cp). The signal line (111c) on the inner side of the RF cable (110c) may be connected to a feed line of a connection pad (100cp) of a flexible circuit board (1200) through a soldering structure (112s). The dielectric region (110d) and the ground (112c) may be partially removed at the corresponding portion so that the signal line (111c) and the feed line of the connection pad (100cp) are connected through the soldering structure (112s).

[0089] The frame (9) may include a metal material, and a sealant (7) may be filled between the groove (9g) and the glass (10). The groove (9g) may be formed to have a step with respect to the inner boundary of the frame (9). Glass (10) having an opaque area (12) formed therein may be placed in the groove (9g) formed to have a step with respect to the inner end of the frame (9). As the glass (10) is placed in the groove (9g), the step of the groove (9g) may be regarded as non-existent from the outside of the vehicle.

[0090] A glass panel (10) may be coupled or attached to a frame (9) of a vehicle. The frame (9) of the vehicle may be formed of a metal material. The glass panel (10) may be configured to include a first glass (10a), a second glass (10b), and a film layer (1030). The glass panel (10) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region.

[0091] An opaque area (12) may be formed on the first glass (10a). The vehicle frame (9) may be extended to correspond to the opaque area (12). In this regard, radio interference may occur between the vehicle frame (9) made of a metal material and the flexible printed circuit board (1200) on which the feeding pattern is formed. A signal applied to the transparent antenna module by the feeding pattern of the flexible printed circuit board (1200) may be subject to radio interference by the vehicle frame (9) made of a metal material. In particular, interference may occur in a low-band (LB) signal by the vehicle frame (9), resulting in a degradation of antenna performance in the first frequency band, which is the low-band (LB).

[0092] Hereinafter, the low-band (LB) performance degradation due to the vehicle frame and the extended ground area that prevents the same in an antenna assembly associated with a wideband transparent antenna structure according to the present specification will be described. In this regard, FIG. 8 illustrates a first structure having a limited ground area of ​​a flexible circuit board and a second structure having an extended ground area. FIG. 8(a) illustrates the first structure having a limited ground area of ​​a flexible circuit board (1200). FIG. 8(b) illustrates the second structure having a protruding pattern part (1210d) that is an extended ground area of ​​the flexible circuit board (1200).

[0093] Meanwhile, Fig. 9 shows the current distribution in the flexible circuit board in the first structure having a limited ground area and the second structure having an extended ground area. Fig. 9(a) shows the current distribution in the flexible circuit board (1200) in the first structure having a limited ground area. Fig. 9(b) shows the current distribution in the flexible circuit board (1200) in the second structure having a ground area of ​​a protruding pattern portion (1210d) which is an extended ground area.

[0094] Referring to Fig. 8(a), a first current distribution (Ic1) may be formed along a boundary region of a flexible circuit board (1200) having a limited ground area. In addition, first and second leakage current distributions (Ia1, Ia2) may be formed as the lower portion of the glass panel (10) on which the glass assembly (1000) is arranged is joined to a frame (9) made of a metal material of the vehicle. A first leakage current distribution (Ia1) is formed in one area of ​​the flexible circuit board (1200) along the upper portion of the frame (9). A second leakage current distribution (Ia2) is formed in the other area of ​​the flexible circuit board (1200) along the upper portion of the frame (9). The value of the second leakage current distribution (Ia2) is maintained at a level substantially equal to the value of the first leakage current distribution (Ia1) by the flexible circuit board (1200) having a limited ground area.

[0095] Referring to Fig. 8(b), a second current distribution (Ic2) may be formed along the boundary region of the flexible circuit board (1200) having the ground region of the protruding pattern portion (1210d). In addition, third and fourth leakage current distributions (Ib1, Ib2) may be formed as the lower portion of the glass panel (10) on which the glass assembly (1000) is arranged is joined to the metal frame (9) of the vehicle.

[0096] A third leakage current distribution (Ib1) is formed in one side region of the flexible circuit board (1200) along the upper part of the frame (9). A fourth leakage current distribution (Ib2) is formed in the other side region of the flexible circuit board (1200) along the upper part of the frame (9). The value of the fourth leakage current distribution (Ib2) is reduced compared to the value of the third leakage current distribution (Ib1) by the flexible circuit board (1200) having the protruding pattern portion (1210d).

[0097] The current component in the boundary region of the flexible circuit board (1200) is strengthened by the second current distribution (Ic2) due to the protruding pattern portion (1210d). As the current component in the boundary region of the flexible circuit board (1200) is strengthened, the fourth leakage current distribution (Ib2) in the other side region of the frame (9) is reduced. Accordingly, the antenna efficiency of the antenna assembly (1000), particularly the antenna efficiency in the low band (LB), is increased.

[0098] Referring to Fig. 9(a), the current of the power supply pattern (1210f) leaks along the first boundary region (Rb1) at the bottom of one side and the second boundary region (Rb2) at the bottom of the other side of the flexible circuit board (1200) having a limited ground area, thereby forming a leakage current distribution.

[0099] Referring to FIG. 9(b), the leakage current distribution of the flexible circuit board (1200) having the ground region of the protruding pattern portion (1210d) of the current supply pattern (1210f) can be formed along the boundary of the protruding pattern portion (1210d). The leakage current distribution of the flexible circuit board (1200) is formed along the first boundary region (Rc1), the second boundary region (Rc2), and the third boundary region (Rc3) of the protruding pattern portion (1210d). As the leakage current distribution is concentrated in the ground region of the protruding pattern portion (1210d), the leakage current distribution is greatly reduced in the first boundary region (Rb1) at the bottom of one side and the second boundary region (Rb2) at the bottom of the other side.

[0100] Meanwhile, in the antenna assembly having the first and second radiating structures according to the present specification, the first structure having a limited ground area of ​​the flexible circuit board and the second structure having an extended ground area are described. In this regard, Fig. 10 shows the electric field distribution of the first structure having a limited ground area of ​​the flexible circuit board in the antenna assembly having the first and second radiating structures. Fig. 11 shows the electric field distribution of the second structure having an extended ground area of ​​the flexible circuit board in the antenna assembly having the first and second radiating structures.

[0101] Referring to Fig. 10, when a signal is applied to the first radiation structure (1100-1), a leakage current appears high in a specific area (Rpa) including the upper portion of the frame (9) due to the flexible circuit board (1200) having a limited ground area. Accordingly, the leakage current in the specific area (Rpa) including the upper portion of the frame (9) appears to be greater than the leakage current in other surrounding areas.

[0102] Accordingly, when a signal is applied to the first radiating structure (1100-1) of the antenna assembly (1000) combined with the metal frame (9), the electric field distribution appears high in a specific area (Rpa) including the upper part of the frame (9). The electric field distribution in the specific area (Rpa) appears higher than in other surrounding areas due to coupling between the frame (9) and the flexible circuit board (1200) that supplies power to the first radiating structure (1100-1). The interference level between the first and second radiating structures may increase due to coupling to the second flexible circuit board (1200-2) of the second radiating structure (1100-2) by the electric field induced by the frame (9).

[0103] In this regard, since the ground pattern size of the grounded GCPW-fed FPCB is not sufficiently large, radiation occurs due to leakage current on the FPCB. When the antenna assembly (1000) is placed close to a frame (9) larger than the antenna due to radiation in the FPCB area, unwanted radiation may occur in the low band (LB). Accordingly, interference between MIMO antennas in the low band (LB) (700-960 MHz band) may increase due to leakage current generated in the metal frame (9) of the vehicle.

[0104] Referring to Fig. 11, when a signal is applied to the first radiating structure (1100-1), the leakage current is reduced in a specific region (Rpb) including the upper portion of the frame (9) by the flexible circuit board (1200) having the ground area of ​​the protruding pattern portion (1210d). Therefore, in the second structure having the protruding pattern portion (1210d), the leakage current is reduced compared to the leakage current in the first structure having the limited ground area, so that the antenna efficiency can be increased.

[0105] In order to prevent degradation of antenna performance, the flexible printed circuit board (1200) may be configured not to be placed in an area where the vehicle frame (9) extends. Meanwhile, this specification describes a transparent antenna structure that can prevent degradation of antenna performance even in a structure where the flexible printed circuit board (1200) overlaps an area where the vehicle frame (9) extends.

[0106] In order to prevent antenna performance degradation even in a structure where a flexible printed circuit board (1200) overlaps with an extended area of ​​a vehicle frame (9), a transparent antenna structure of an in-glass structure is described with reference to FIGS. 6A to 11. A transparent electrode radiating structure of a broadband dipole structure with a length of half a wavelength (λg / 2) based on a first frequency band, which is a low band (LB), can be applied. When assembling to a vehicle glass panel (10), the influence of the vehicle's metal frame (9), which comes into close proximity to the feeding patterns, must be reduced.

[0107] To this end, a feed pattern may be formed in a grounded coplanar waveguide (GCPW) structure in an area close to the frame (9). The GCPW structure is a structure in which an additional ground pattern is arranged in an upper area in the Z-axis direction in a coplanar waveguide (CPW) structure in which ground patterns are arranged on one side and the other side of the same plane as the feed patterns. Meanwhile, the area around the transparent electrode-feed FPCB bonding portion may be implemented in a hybrid form of a CPW structure.

[0108] Meanwhile, Fig. 12 is a diagram comparing the reflection coefficient due to leakage current by the vehicle frame and the reflection coefficient due to the extended ground area. Fig. 12(a) compares the reflection coefficient of (i) a structure not coupled to the frame and (ii) a structure coupled to the frame in the entire frequency band from 0.62 to 6 GHz. Fig. 12(b) shows the reflection coefficient of (i) a structure not coupled to the frame, (ii) a structure coupled to the frame, and (iii) a structure with an extended ground area in the low band (LB).

[0109] Referring to Fig. 12(a), the reflection coefficient characteristics in the low band (LB) are degraded in the structure (ii) coupled with the frame compared to (i) the structure not coupled with the frame. The reflection coefficient characteristic of approximately -13 dB in the 700-960 MHz band within the low band (LB) is degraded to approximately -10 dB or more when coupled with the frame. Accordingly, the antenna efficiency in the low band (LB) is reduced due to leakage current from the vehicle frame.

[0110] Referring to Fig. 12(b), the reflection coefficient characteristics in the low band (LB) are deteriorated in the structure (ii) coupled with the frame compared to (i) the structure not coupled with the frame. Referring to Figs. 10 and 12(b), as the leakage current increases due to the limited ground area, the reflection coefficient value increases to more than -10 dB, deteriorating the reflection coefficient characteristics. Accordingly, the antenna efficiency in the low band (LB) is reduced due to the leakage current caused by the vehicle frame.

[0111] Referring to FIGS. 10, 11, and 12(b), (iii) the second structure having the ground area of ​​the protruding pattern portion (1210d) has improved reflection coefficient characteristics in the low band (LB) compared to (ii) the first structure having the limited ground area. The first structure having the limited ground area has a deterioration in reflection coefficient characteristics of -10 dB or more, but the reflection coefficient characteristics are improved because the leakage current is reduced by the protruding pattern portion (1210d). Accordingly, the antenna efficiency is improved by the extended ground area of ​​the protruding pattern portion (1210d).

[0112] Hereinafter, an antenna assembly associated with a wideband transparent antenna structure according to the present specification will be described. In this regard, FIG. 13a illustrates a front view of a glass assembly according to an embodiment of the present specification. FIG. 13b illustrates a front view of a structure in which a glass assembly is coupled to a frame according to another embodiment of the present specification. FIG. 14 illustrates an area in which a ground pattern having a protruding pattern portion is formed in the antenna assembly of FIGS. 11, 13a, and 13b. FIG. 15 illustrates an area in which a ground pattern having a protruding second pattern portion is formed in the antenna assembly of FIGS. 11, 13a, and 13b.

[0113] FIG. 14 shows the structure of the protruding pattern part (1210d) in the first radiation structure (1100-1) of FIG. 11. FIG. 14(a) is an enlarged view of the area where the ground pattern (1210) is formed in the antenna assembly (1000) of FIGS. 13a and 13b. In this regard, FIG. 14(a) is an enlarged view of area (A) in the antenna assembly (1000) of FIGS. 13a and 13b. FIG. 14(b) shows an antenna assembly (1000) having a structure in which the terminal portion of the second flexible circuit board (1200) to which the cable is connected is folded. It shows a structure in which the antenna assembly (1000) is arranged adjacent to a metal frame (9) of a vehicle.

[0114] Referring to FIG. 7b, FIG. 9, and FIG. 11 to FIG. 14, the end portion of the second flexible circuit board (1200) may be formed in a folded structure so as to overlap with another portion of the second flexible circuit board (1200) on the Z-axis. A connection pad (100cp) may be arranged at the end portion of the second flexible circuit board (1200), and an RF cable (110c) may be connected to the connection pad (100cp).

[0115] The power supply pattern (1210f) may be connected to the first conductive pattern (1110). An end portion of the first sub-pattern (1211g) of the ground pattern (1210g) may be connected to the second conductive pattern (1120). An end portion of the second sub-pattern (1212g) of the ground pattern (1210g) may be connected to the third conductive pattern (1120). The power supply pattern (1210f) may be arranged in a space between the first sub-pattern (1211g) and the second sub-pattern (1212g) of the ground pattern (1210g).

[0116] The first side (S1g) of the second sub-pattern (1212g) may be arranged to face the power supply pattern (1210f). The second side (S2g) of the second sub-pattern (1212g) may form an outer surface of the second substrate (1010b). The second side (S2g) of the second sub-pattern (1212g) may have a protruding pattern part (1210d).

[0117] The vertical axis direction size (VL) of the protruding second side surface (S2g) of the protruding pattern portion (1210d) can be formed in a predetermined range of 10 to 15 mm based on a wavelength (λg) of 0.08 of the first frequency band. The horizontal axis direction size (HL) of the protruding second side surface (S2g) of the protruding pattern portion (1210d) can be formed in a predetermined range of 5 to 8 mm based on a wavelength (λg) of 0.05 of the first frequency band. The vertical axis direction can correspond to the X-axis direction, and the horizontal axis direction can correspond to the Y-axis direction.

[0118] In this regard, the first frequency band may be set to 750 to 960 MHz, but is not limited thereto and may be changed depending on the application. Meanwhile, the distance (DL) between the protruding pattern portion (1210d) and the metal frame (9) coupled to the second flexible circuit board (1200) may be formed to be spaced apart by 5 mm or more in the vertical axis direction.

[0119] Meanwhile, a first slit structure (SL1) is formed on the first ground pattern (1210g), thereby improving impedance matching characteristics and antenna efficiency in the third frequency band, which is an ultra-high band (UHB). In this regard, the first slit structure (SL1) may be formed so that the third conductive pattern (1130) operates as a radiator in the third frequency band, thereby improving antenna efficiency.

[0120] The first slit structure (SL1) may be formed by a first side (Sa1) and a second side (Sa2) in one axial direction and a third side (Sa3) in the other axial direction to form a dielectric region in the first ground pattern (1210g). The first side (Sa1) may be formed to have a first slit length in the one axial direction. The second side (Sa2) may be formed to have a second slit length in the one axial direction. The third side (Sa3) may be formed to have a third slit length in the other axial direction perpendicular to the one axial direction. In this regard, the one axial direction may be the X-axis direction, which is a horizontal axial direction, and the other axial direction may be the Y-axis direction, which is a vertical axial direction.

[0121] The second slit length of the second side (Sa2) may be formed to be longer than the first slit length of the first side (Sa1). The second slit length of the second side (Sa2) may be formed in a range of 4 mm to 6 mm, so that the resonance frequency of the second conductive pattern (1120) may be formed to be 5 GHz or higher. The third slit length of the third side (Sa3) may be formed to be shorter than the first slit length of the first side (Sa1). The third slit length of the third side (Sa3) may be formed in a range of 1 mm to 2 mm, so that the resonance frequency of the second conductive pattern (1120) may be formed to be 5 GHz or higher.

[0122] FIG. 15 shows the structure of the second pattern part (1220d) protruding from the second radiating structure (1100-2) of FIG. 11. FIG. 15(a) is an enlarged view of an area where a ground pattern (1240) is formed in the antenna assembly (1000) of FIGS. 13a and 13b. In this regard, FIG. 15(a) is an enlarged view of an area where a ground pattern (1240) is formed in the second radiating structure (1100-2) of FIG. 11. FIG. 15(b) is an antenna assembly (1000) having a structure in which the terminal portion of the second flexible circuit board (1200-2) to which the cable of FIGS. 13a and 13b is connected is folded. It shows a structure in which the antenna assembly (1000) is arranged adjacent to a metal frame (9) of a vehicle.

[0123] Referring to FIGS. 7b, 9, 11 to 15, the power supply pattern (1240f) may be connected to the fourth conductive pattern (1140). An end portion of the first sub-pattern (1241g) of the ground pattern (1240g) may be connected to the fifth conductive pattern (1150). An end portion of the second sub-pattern (1242g) of the ground pattern (1240g) may be connected to the sixth conductive pattern (1160). The power supply pattern (1240f) may be arranged in a space between the first sub-pattern (1241g) and the second sub-pattern (1242g) of the ground pattern (1240g).

[0124] The first side (S1g) of the second sub-pattern (1242g) may be positioned to face the power supply pattern (1240f). The second side (S2g) of the second sub-pattern (1242g) may form an outer surface of the second substrate (1010b). The second side (S2g) of the second sub-pattern (1212g) may have a protruding second pattern portion (1220d).

[0125] The vertical axis direction size (VL) of the protruding second side surface (S2g) of the second pattern portion (1220d) can be formed in a predetermined range of 10 to 15 mm based on a wavelength (λg) of 0.08 of the first frequency band. The horizontal axis direction size (HL) of the protruding second side surface (S2g) of the second pattern portion (1220d) can be formed in a predetermined range of 5 to 8 mm based on a wavelength (λg) of 0.05 of the first frequency band. The vertical axis direction can correspond to the X-axis direction, and the horizontal axis direction can correspond to the Y-axis direction.

[0126] In this regard, the first frequency band may be set to 750 to 960 MHz, but is not limited thereto and may be changed depending on the application. Meanwhile, the distance (DL) between the second pattern portion (1220d) and the metal frame (9) coupled to the second flexible circuit board (1200-2) may be formed to be spaced apart by 5 mm or more in the vertical axis direction.

[0127] Meanwhile, a second slit structure (SL2) is formed on the second ground pattern (1240g), thereby improving impedance matching characteristics and antenna efficiency in the third frequency band, which is an ultra-high band (UHB). In this regard, the second slit structure (SL2) may be formed so that the antenna efficiency is improved while the sixth conductive pattern (1160) operates as a radiator in the third frequency band.

[0128] The second slit structure (SL2) may be formed by a first side (Sb1) and a second side (Sb2) in one axial direction and a third side (Sb3) in the other axial direction to form a dielectric region in the second ground pattern (1240g). The first side (Sb1) may be formed to have a first slit length in the one axial direction. The second side (Sb2) may be formed to have a second slit length in the one axial direction. The third side (Sb3) may be formed to have a third slit length in the other axial direction perpendicular to the one axial direction. In this regard, the one axial direction may be the X-axis direction, which is a horizontal axial direction, and the other axial direction may be the Y-axis direction, which is a vertical axial direction.

[0129] The second slit length of the second side (Sb2) may be formed to be longer than the first slit length of the first side (Sb1). The second slit length of the second side (Sb2) may be formed in a range of 4 mm to 6 mm, so that the resonance frequency of the fifth conductive pattern (1120) may be formed to be 5 GHz or higher. The third slit length of the third side (Sb3) may be formed to be shorter than the first slit length of the first side (Sb1). The third slit length of the third side (Sb3) may be formed in a range of 1 mm to 2 mm, so that the resonance frequency of the fifth conductive pattern (1120) may be formed to be 5 GHz or higher.

[0130] Meanwhile, since the third conductive pattern (1130) and the sixth conductive pattern (1160) operate as radiators in the first frequency band, interference between the first and second radiating structures (1100-1, 1100-2) can be determined according to the distance between the third conductive pattern (1130) and the sixth conductive pattern (1160). It is necessary to maintain the interference between the first and second radiating structures (1100-1, 1100-2) below a certain level without increasing the overall size of the antenna assembly (1000). Interference with the sixth conductive pattern (1160) can be reduced by removing the corner of the upper area of ​​the first surface (S1) of the third conductive pattern (1130). Interference with the third conductive pattern (1130) can be reduced by removing the corner of the upper area of ​​the second surface (S2) of the sixth conductive pattern (1160).

[0131] The horizontal length (HL1) and the vertical length (VL1) of the edge of the upper region of the first side (S1) of the third conductive pattern (1130) operating in the first frequency band may be formed to have the same length. The horizontal length (HL1) and the vertical length (VL1) of the edge of the upper region of the first side (S1) may be formed to have a range between 0.1 and 0.2 wavelengths (λg). The horizontal length (HL1) and the vertical length (VL1) of the second gap region (GR2) of the first side (S1) of the third conductive pattern (1130) operating in the first frequency band may be formed to have the same length. The horizontal length (HL1) and the vertical length (VL1) of the second gap region (GR2) of the first side (S1) may be formed to have a range between 0.1 and 0.2 wavelengths (λg).

[0132] The horizontal length (HL2) and the vertical length (VL2) of the edge of the upper region of the second surface (S2) of the sixth conductive pattern (1130) operating in the first frequency band may be formed to have the same length. The horizontal length (HL2) and the vertical length (VL2) of the edge of the second gap region (GR2) of the second surface (S2) may be formed to have a range between 0.1 and 0.2 wavelengths (λg). The horizontal length (HL2) and the vertical length (VL2) of the second gap region (GR2) of the second surface (S2) of the sixth conductive pattern (1130) operating in the first frequency band may be formed to have the same length. The horizontal length (HL2) and the vertical length (VL2) of the edge of the upper region of the second surface (S2) may be formed to have a range between 0.1 and 0.2 wavelengths (λg).

[0133] Meanwhile, the terminal portion of the second flexible circuit board (1200-2) may be formed in a folded structure so as to overlap with another portion of the second flexible circuit board (1200-2) on the Z-axis. A connection pad (100cp) may be arranged at the terminal portion of the second flexible circuit board (1200-2), and an RF cable (110c2) may be connected to the connection pad (100cp).

[0134] Meanwhile, Fig. 16 shows a structure in which conductive patterns are arranged at different intervals in the antenna assembly of Fig. 11. Specifically, Fig. 16 is an enlarged view of an area where a side portion of a first conductive pattern (1110) and a side portion of a third conductive pattern (1130) are formed in the antenna assembly (1000) of Figs. 13a and 13b.

[0135] Fig. 16(a) shows a structure in which the first and third conductive patterns (1110, 1130) of the first radiating structure (1100-1) are arranged at different intervals. Fig. 16(a) shows a structure in which the fourth and sixth conductive patterns (1140, 1160) of the second radiating structure (1100-2) are arranged at different intervals.

[0136] Referring to Fig. 16(a), the second portion (1112) of the first conductive pattern (1110) and the third conductive pattern (1130) may be spaced apart from each other at different intervals for each region, so that wideband impedance matching performance can be implemented. In this regard, a first interval (Ga1), a second interval (Ga2), and a third interval (Ga3) may be formed between the side portion of the second portion (1112) of the first conductive pattern (1110) and the side portion of the third conductive pattern (1130) arranged near the second portion (1112). The second interval (Ga2) may be formed between the first interval (Ga1) and the third interval (Ga3).

[0137] The second gap (Ga2) may be formed narrower than the first gap (Ga1). The first gap (Ga1) may be formed narrower than the third gap (Ga3). Accordingly, wideband impedance matching in the 1.7 to 3.5 GHz band may be implemented by utilizing three different parallel capacitance components formed by the first to third gaps (Ga1) to (Ga3) formed at different gaps.

[0138] Referring to FIG. 16(b), the second part (1142) of the fourth conductive pattern (1140) and the sixth conductive pattern (1160) may be spaced apart from each other at different intervals for each region, so that wideband impedance matching performance may be implemented. In this regard, a fourth interval (Ga4), a fifth interval (Ga5), and a sixth interval (Ga6) may be formed between the side portion of the second part (1142) of the fourth conductive pattern (1140) and the side portion of the sixth conductive pattern (1160) arranged near the second portion (1142). The fifth interval (Ga5) may be formed between the fourth interval (Ga4) and the sixth interval (Ga6).

[0139] The fifth gap (Ga5) can be formed narrower than the fourth gap (Ga4). The fourth gap (Ga4) can be formed narrower than the sixth gap (Ga6). Accordingly, wideband impedance matching in the 1.7 to 3.5 GHz band can be implemented by utilizing three different parallel capacitance components formed by the fourth gap (Ga4) to the sixth gap (Ga6) with different gaps.

[0140] Hereinafter, a glass assembly (200) according to the present specification will be described with reference to FIGS. 7a to 9, 13a, and 14 to 16.

[0141] A glass assembly (200) may be configured to include a glass panel (10), a first flexible circuit board (1100a), and a second flexible circuit board (1200). The first flexible circuit board (1100a) may be disposed in a first region (1100a) of the glass panel (10). The second flexible circuit board (1200) may be disposed in a second region (1100b) of the glass panel (10).

[0142] The glass assembly (200) may be configured to further include a first region (1100a) and a second region (1100b). The antenna assembly (1000) may be disposed on the glass panel (10). Conductive patterns (1100) may be disposed inside the glass panel (10). Accordingly, the antenna assembly (1000) including the conductive patterns (1100) may be formed as an in-glass antenna structure, but is not limited thereto and may be changed depending on the application.

[0143] The first flexible circuit board (1100a) may be composed of a first substrate layer (1010a) made of a transparent material and a first conductive pattern layer (1100) formed on one side of the first substrate layer (1010a). The second flexible circuit board (1200) may be composed of a second dielectric substrate (1010b) and may have a second conductive pattern layer (1210) on a first side of the second dielectric substrate (1010b) and a third conductive pattern layer (1230g) on ​​a second side.

[0144] The first conductive pattern layer (1100) may be configured to include a plurality of conductive patterns. The first conductive pattern layer (1100) may be configured to include a first conductive pattern (1110), a second conductive pattern (1120), and a third conductive pattern (1130).

[0145] The first conductive pattern (1110) may be composed of a plurality of sub-patterns, i.e., a plurality of conductive portions. The first conductive pattern (1110) may be configured to include a first portion (1111) and a second portion (1112). The first portion (1111) may be formed perpendicularly to the second portion (1112). The second portion (1112) may be electrically connected to the first power supply pattern (1110f). In this regard, the meaning of "electrically connected" may include that the respective conductive portions are directly connected or coupled and spaced apart at a certain interval.

[0146] The second conductive pattern (1120) may be arranged on one side or lower region of the first conductive pattern (1110). The second conductive pattern (1120) may be electrically connected to the first portion (1211g) of the ground pattern (1210g).

[0147] The third challenge pattern (1130) may be placed on the other side area of ​​the first challenge pattern (1110). The third challenge pattern (1130) may be electrically connected to the second portion (1212g) of the first ground pattern (1210g).

[0148] The size of the second conductive pattern (1120) may be formed smaller than the size of the third conductive pattern (1130). Accordingly, the antenna assembly (1000) may operate as a radiator in a higher frequency band due to the second conductive pattern (1120).

[0149] The second challenge pattern (1120) may be positioned between the first part (1111) of the first challenge pattern (1110) and the second part (1111) of the first challenge pattern (1110). The first part (1111) of the first challenge pattern (1110) and the third challenge pattern (1130) may be positioned on opposite sides with respect to the second part (1112) of the first challenge pattern (1110).

[0150] The second conductive pattern layer (1210) may include a ground pattern (1210g) and a feed pattern (1210f). The feed pattern (1210f) may be connected to the first conductive pattern (1110) of the first conductive pattern layer (1100). An end portion of the first sub-pattern (1211g) of the ground pattern (1210g) may be connected to the second conductive pattern (1120). An end portion of the second sub-pattern (1212g) of the ground pattern (1210g) may be connected to the third conductive pattern (1120). The feed pattern (1210f) may be arranged in a space between the first sub-pattern (1211g) and the second sub-pattern (1212g) of the ground pattern (1210g).

[0151] The first side (S1g) of the second sub-pattern (1212g) may be arranged to face the power supply pattern (1210f). The second side (S2g) of the second sub-pattern (1212g) may form an outer surface of the second substrate (1010b). The second side (S2g) of the second sub-pattern (1212g) may have a protruding pattern part (1210d).

[0152] The glass panel (200) may be configured to include a first glass (10a) as an inner glass and a second glass (10b) as an outer glass. The antenna assembly (1000) may be disposed between the first glass (10a) and the second glass (10b). The first region (1100a) may be disposed in a transparent region (11) of the glass (10) forming the glass panel (200). The second region (1100b) may be disposed in an opaque region (12) of the glass (10) forming the glass panel (200).

[0153] Hereinafter, a vehicle according to another aspect of the present specification will be described. In this regard, a vehicle (1) according to the present specification will be described with reference to FIGS. 1 to 8, FIGS. 11, 12, and FIGS. 13b to 16.

[0154] A vehicle (1) may be configured to include a frame (9) made of a metal material, a glass panel (10), a first flexible circuit board (1100a), and a second flexible circuit board (1200). The glass panel (10) may be formed to be mounted on the frame (9) made of a metal material. The first flexible circuit board (1100a) may be arranged in a first area (1100a) of the glass panel (10). The second flexible circuit board (1200) may be arranged in a second area (1100b) of the glass panel (10).

[0155] The first flexible circuit board (1100a) may be composed of a first substrate layer (1010a) made of a transparent material and a first conductive pattern layer (1100) formed on one side of the first substrate layer (1010a). The second flexible circuit board (1200) may be composed of a second dielectric substrate (1010b) and may have a second conductive pattern layer (1210) on a first side of the second dielectric substrate (1010b) and a third conductive pattern layer (1230g) on ​​a second side.

[0156] The first conductive pattern layer (1100) may be configured to include a plurality of conductive patterns. The first conductive pattern layer (1100) may be configured to include a first conductive pattern (1110), a second conductive pattern (1120), and a third conductive pattern (1130).

[0157] The first conductive pattern (1110) may be composed of a plurality of sub-patterns, i.e., a plurality of conductive portions. The first conductive pattern (1110) may be configured to include a first portion (1111) and a second portion (1112). The first portion (1111) may be formed perpendicularly to the second portion (1112). The second portion (1112) may be electrically connected to the first power supply pattern (1110f). In this regard, the meaning of "electrically connected" may include that the respective conductive portions are directly connected or coupled and spaced apart at a certain interval.

[0158] The second conductive pattern (1120) may be arranged on one side or lower region of the first conductive pattern (1110). The second conductive pattern (1120) may be electrically connected to the first portion (1211g) of the ground pattern (1210g).

[0159] The third challenge pattern (1130) may be placed on the other side area of ​​the first challenge pattern (1110). The third challenge pattern (1130) may be electrically connected to the second portion (1212g) of the first ground pattern (1210g).

[0160] The size of the second conductive pattern (1120) may be formed smaller than the size of the third conductive pattern (1130). Accordingly, the antenna assembly (1000) may operate as a radiator in a higher frequency band due to the second conductive pattern (1120).

[0161] The second challenge pattern (1120) may be positioned between the first part (1111) of the first challenge pattern (1110) and the second part (1111) of the first challenge pattern (1110). The first part (1111) of the first challenge pattern (1110) and the third challenge pattern (1130) may be positioned on opposite sides with respect to the second part (1112) of the first challenge pattern (1110).

[0162] The second conductive pattern layer (1210) may include a ground pattern (1210g) and a feed pattern (1210f). The feed pattern (1210f) may be connected to the first conductive pattern (1110) of the first conductive pattern layer (1100). An end portion of the first sub-pattern (1211g) of the ground pattern (1210g) may be connected to the second conductive pattern (1120). An end portion of the second sub-pattern (1212g) of the ground pattern (1210g) may be connected to the third conductive pattern (1120). The feed pattern (1210f) may be arranged in a space between the first sub-pattern (1211g) and the second sub-pattern (1212g) of the ground pattern (1210g).

[0163] The first side (S1g) of the second sub-pattern (1212g) may be arranged to face the power supply pattern (1210f). The second side (S2g) of the second sub-pattern (1212g) may form an outer surface of the second substrate (1010b). The second side (S2g) of the second sub-pattern (1212g) may have a protruding pattern part (1210d).

[0164] The frame (9) of the vehicle can be combined with an opaque region (12) of glass (10) forming a glass panel (200). The glass panel (200) combined with the frame (9) of the vehicle can be configured to include a first glass (10a) which is an inner glass and a second glass (10b) which is an outer glass. The antenna assembly (1000) can be disposed between the first glass (10a) and the second glass (10b). The first region (1100a) can be disposed in a transparent region (11) of the glass (10) forming the glass panel (200). The second region (1100b) can be disposed in an opaque region (12) of the glass (10) forming the glass panel (200). The lower portion of the second region (1100b) in the Y-axis direction can be combined with a frame (9) made of a metal material.

[0165] In the above, a glass assembly (20) and a vehicle (1) having an antenna assembly (1000) according to embodiments of the present specification have been described. In the glass assembly (20), the leakage current leaking from the opaque region of the glass assembly (20) can be reduced by the protruding pattern portion (1210d) of the antenna assembly (1000). In addition, in the vehicle (1), the leakage current leaking from the opaque region of the glass assembly (20) coupled to the frame (9) made of a metal material can be reduced by the protruding pattern portion (1210d) of the antenna assembly (1000).

[0166] Hereinafter, the detailed structure and technical characteristics of a glass assembly (20) having an antenna assembly (1000) according to embodiments of the present specification and a pattern portion (1210d) protruding from a vehicle (1) will be described with reference to FIGS. 1 to 15.

[0167] The vertical axis direction size (VL) of the protruding second side surface (S2g) of the protruding pattern portion (1210d) can be formed in a predetermined range of 10 to 15 mm based on a wavelength (λg) of 0.08 of the first frequency band. The horizontal axis direction size (HL) of the protruding second side surface (S2g) of the protruding pattern portion (1210d) can be formed in a predetermined range of 5 to 8 mm based on a wavelength (λg) of 0.05 of the first frequency band. The vertical axis direction can correspond to the X-axis direction, and the horizontal axis direction can correspond to the Y-axis direction.

[0168] In this regard, the first frequency band may be set to 750 to 960 MHz, but is not limited thereto and may be changed depending on the application. Meanwhile, the distance (DL) between the protruding pattern portion (1210d) and the metal frame (9) coupled to the second flexible circuit board (1200) may be formed to be spaced apart by 5 mm or more in the vertical axis direction.

[0169] A first end portion of the feed pattern (1210f) may be connected to a third feed pattern (1230f) of a co-planar waveguide (CPW) pattern. A second end portion of the feed pattern (1210f) may be connected to an end portion of a second portion (1112) of a first conductive pattern (1110). The second end portion of the feed pattern (1210f) may be formed to have a predetermined length or longer in the vertical axis direction (Y-axis direction). The second end portion of the feed pattern (1210f) may be formed to have a length or longer than a minimum gap for bonding with lower portions of the first to third conductive patterns (1110, 1120, 1130). The second end of the power supply pattern (1210f) can be formed with a length greater than the minimum gap for bonding the lower portions of the first to third conductive patterns (1110, 1120, 1130) and ACF (Anisotropic Conductive Film).

[0170] Meanwhile, the ground pattern (1210g) may be formed with an asymmetrical structure with different intervals to prevent performance degradation caused by the metal frame (9) of the vehicle. In this regard, the second interval (G2a) of the horizontal axis direction end portion of the second sub-pattern (1211g) of the ground pattern (1210g) may be formed longer than the first interval (G1a) of the horizontal axis direction end portion of the first sub-pattern (1211g).

[0171] The fourth interval (G4a) in the horizontal axis direction of the second sub-pattern (1212g) may be formed longer than the third interval (G3a) in the horizontal axis direction of the first sub-pattern (1211g) based on the other end (EP3) of the protruding pattern portion (1210d). The second sub-pattern (1212g) on ​​the other side of the ground pattern (1210g) is formed with wider intervals in the horizontal axis direction by the protruding pattern portion (1210d). Therefore, the protruding pattern portion (1210d) increases the current component according to the horizontal axis direction size (HL) and vertical axis direction size (VL) of the second side (S2g). The leakage current in the metal frame (9) is reduced due to the increased current component in the protruding pattern portion (1210d).

[0172] The fifth interval (G5a) in the horizontal axis direction of the first sub-pattern (1211g) and the sixth interval (G6a) in the horizontal axis direction of the second sub-pattern (1212g) can be formed to have the same length based on the point overlapping with the end portion of the second flexible circuit board (1200). Accordingly, the protruding pattern portion (1210d) can be formed only in the necessary area, thereby minimizing leakage current by the protruding pattern portion (1210d). In addition, it is possible to prevent unwanted radiation from being generated through the end portion of the second flexible circuit board (1200) formed in a folded structure and the adjacent side area thereto.

[0173] The third interval (G3a) of the first sub-pattern (1211g) may be formed longer than the first interval (G1a). The fifth interval (G5a) of the first sub-pattern (1211g) may be formed longer than the third interval (G3a). In this regard, as the width of the horizontal axis of the power supply pattern (1210f) decreases, the first interval (G1a), the third interval (G3a), and the fifth interval (G5a) of the first sub-pattern (1211g) may be formed to increase. Accordingly, as the width of the horizontal axis of the power supply pattern (1210f) decreases, the intervals of the first sub-pattern (1211g) may also be optimally formed to correspond to the impedance change. In addition, the upper end of the first sub-pattern (1211g) may be connected to the second conductive pattern (1120). Accordingly, the first gap (G1a) of the first sub-pattern (1211g) can be formed to be the same as the length in the horizontal axis direction of the second challenge pattern (1120).

[0174] The second interval (G2a) of the second sub-pattern (1212g) may be formed longer than the sixth interval (G6a). The fourth interval (G4a) of the second sub-pattern (1212g) may be formed longer than the second interval (G2a). In this regard, the upper end of the second sub-pattern (1212g) may be connected to the third conductive pattern (1130). Depending on the second interval (G2a) of the second sub-pattern (1212g), the end point of the upper end of the second sub-pattern (1212g) may be positioned at a point further to one side than the end point of the lower end of the third conductive pattern (1130). In consideration of the impedance matching of the power supply pattern (1210f), the end point of the second sub-pattern (1212g) may be further to one side. As the width of the horizontal axis of the power supply pattern (1210f) decreases, the fourth gap (G4a) of the second sub-pattern (1212g) can be formed longer than the second gap (G2a).

[0175] Meanwhile, the second sub-pattern (1212g) of the ground pattern (1210g) having a protruding pattern portion (1210d) may have a length in the horizontal axis direction of the end portions determined to be an optimal length to prevent performance degradation due to the frame (9) made of metal material.

[0176] In this regard, among the end portions of the second sub-pattern (1212g) of the ground pattern (1210g), the first end portion (EP1) may be configured to be connected to the third conductive pattern (1130). Among the end portions of the second sub-pattern (1212g), the second end portion (EP2) may be configured not to be connected to the third conductive pattern (1130). The second end portion (EP2) not connected to the third conductive pattern (1130) may be arranged in the vicinity of the power supply pattern (1210f) and spaced apart from the power supply pattern (1210f) in the horizontal axis direction.

[0177] Meanwhile, the second portion (1112) and the third conductive pattern (1130) of the first conductive pattern (1110) may be spaced apart from each other at different intervals for each region, so that wideband impedance matching performance can be implemented. In this regard, a first interval (Ga1), a second interval (Ga2), and a third interval (Ga3) may be formed between the side portion of the second portion (1112) of the first conductive pattern (1110) and the side portion of the third conductive pattern (1130) arranged near the second portion (1112). The second interval (Ga2) may be formed between the first interval (Ga1) and the third interval (Ga3).

[0178] The second gap (Ga2) may be formed narrower than the first gap (Ga1). The first gap (Ga1) may be formed narrower than the third gap (Ga3). Accordingly, wideband impedance matching in the 1.7 to 3.5 GHz band may be implemented by utilizing three different parallel capacitance components formed by the first to third gaps (Ga1) to (Ga3) formed at different gaps.

[0179] Meanwhile, the first conductive pattern (1110) may be combined with the second conductive pattern (1120) to operate as a radiator in the first frequency band or may operate as a radiator in the second frequency band on its own. In this regard, the first portion (1111) of the first conductive pattern (1110) may be configured with a first radiation region (RR1) and a second radiation region (RR2). The second radiation region (RR2) may be configured to connect the first radiation region (RR1) and the second portion (1112).

[0180] In a first portion (1111) including a first radiation region (RR1) and a second radiation region (RR2), a signal of a first frequency band may be mainly emitted. In a second portion (1112), a signal of a second frequency band higher than the first frequency band may be mainly emitted. The first frequency band may correspond to a low band (LB) of 4G / 5G wireless communication. The second frequency band may correspond to a mid band (MB) and a high band (HB) of 4G / 5G wireless communication.

[0181] Meanwhile, the first size (LR1) in the vertical axis direction of the first radiation region (RR1) may be formed larger than the second size (LR2) in the vertical axis direction of the second radiation region (RR2). The boundary line of the upper part of the second radiation region (RR2) may be formed diagonally so that the second size (LR2) of the second radiation region (RR2) increases toward the first radiation region (RR1). In this regard, a structure in which the impedance changes slowly in a diagonal shape is more advantageous for wideband matching than a structure in which the impedance changes rapidly. Accordingly, the gap between the two ends of the first conductive pattern (1110) of the second radiation region (RR2) has a gap structure that widens toward the first radiation region (RR1).

[0182] Meanwhile, the flexible printed circuit board (1200) of the antenna assembly (1000) may be configured to include a plurality of feed patterns and a plurality of ground patterns. The flexible printed circuit board (1200) may be formed of a plurality of layers. The flexible printed circuit board of the glass substrate module according to the present specification may be formed in a folded structure. In this regard, FIGS. 17 and 18 illustrate a flexible printed circuit board having feed patterns formed thereon for feeding the transparent antenna assembly according to the present specification. FIG. 18(a) illustrates a conductive pattern (feed pattern) formed on a first layer (1200a) of the flexible circuit board (1200). FIG. 18(b) illustrates a conductive pattern (ground pattern) formed on a second layer (1200b) of the flexible circuit board (1200). Figure 19 shows a perspective view and a front view of a structure in which the flexible circuit board of Figures 17 and 18 is combined with a transparent antenna assembly.

[0183] Referring to FIGS. 17 to 19, a flexible printed circuit board of a glass substrate module according to the present specification will be described. The flexible printed circuit board of FIGS. 17 to 19 can be applied to a vehicle in which the glass assembly (200) of FIG. 13a and the glass assembly (200) of FIG. 13b are combined with a frame (9). In addition, the flexible printed circuit board of FIGS. 17 to 19 can be applied to the first and second radiating structures (1100-1, 1100-2) of FIGS. 10 and 11.

[0184] Referring to FIGS. 11 to 19, one end (1211) of the first CPW pattern (1210p) of the first layer (1200a) may be connected to the first antenna pattern portion (1100-1). In this regard, the connection of the first CPW pattern (1210p) to the first radiating structure (1100-1) is not limited. The fourth CPW pattern (1240p) may be connected to the second radiating structure (1100-2). For convenience of explanation below, a structure in which the first CPW pattern (1210p) is connected to the first radiating structure (1100-1) will be described.

[0185] The first CPW pattern (1210p) may be connected to the first antenna pattern portion (1100-1) by applying a low-temperature bonding method. One end of the first feed pattern (1210f) of the first CPW pattern (1210p) may be connected to one end of the first conductive pattern (1110) of the first antenna pattern portion (1100-1). One end of the first ground patterns (1211g, 1212g) of the first feed pattern (1210f) may be connected to one end of the second conductive pattern (1120) and the third conductive pattern (1130) of the first antenna pattern portion (1100-1), respectively.

[0186] At least one of the first ground patterns (1211g, 1212g) of the first CPW pattern (1210p) may have a protruding pattern portion (1210d). The size of the protruding pattern portion (1210d) in the vertical axis direction may be formed in a predetermined range of 10 to 15 mm based on a wavelength (λg) of 0.08 of the first frequency band. The size of the protruding pattern portion (1210d) in the horizontal axis direction may be formed in a predetermined range of 5 to 8 mm based on a wavelength (λg) of 0.05 of the first frequency band. The vertical axis direction may correspond to the X-axis direction, and the horizontal axis direction may correspond to the Y-axis direction. The first frequency band may be set to 750 to 960 MHz, but is not limited thereto and may be changed depending on the application. The distance between the protruding pattern portion (1210d) and the metal frame that is combined with the second flexible circuit board (1200) can be formed to be at least 5 mm apart in the vertical axis direction.

[0187] The first feed pattern (1210f) may include at least one slit pattern. The slit pattern may refer to a pattern formed by a portion of the edge of the ground pattern being inwardly recessed. As the area of ​​the slit pattern increases, the area of ​​the ground pattern may decrease. The slit pattern may be formed at a predetermined location and in a predetermined shape to increase antenna efficiency.

[0188] The first power supply pattern (1210f) may include a first slit pattern (1211s) in which the upper portion of the first ground pattern (1211g) is formed in a triangular shape. The first slit pattern (1211s) may include a first slit structure (SL1) formed by recessing a portion of an edge inward. The first slit structure (SL1) of the first slit pattern (1211s) may be formed by recessing a portion of an edge of the first ground pattern (1211g) adjacent to the transparent antenna region along the -x-axis direction.

[0189] The first power supply pattern (1210f) may include a second slit pattern (1212s) formed at a predetermined distance from the second sub-pattern (1212g) of the ground pattern. As the width of the first power supply pattern (1210f) decreases, the second sub-pattern (1212g) of the ground pattern may be formed such that the lower region protrudes along the -x-axis direction compared to the upper region. Accordingly, the second slit pattern (1212s) may be formed such that the lower region protrudes along the -x-axis direction compared to the upper region.

[0190] The other end (1212) of the first ground patterns (1211g, 1212g) of the first CPW pattern (1210p) may overlap with one end (1231) of the third ground pattern (1230g) of the second layer (1200b) in a predetermined area (1213). The other end (1212) of the first ground patterns (1211g, 1212g) may be electrically connected to one end (1231) of the third ground pattern (1230g) through at least one via.

[0191] The second ground patterns (1221g, 1222g) of the second CPW pattern (1220p) of the first layer (1200a) may overlap the other end (1232) of the third ground pattern (1230g) of the second layer (1200b) in a predetermined area (1233). The other end (1232) of the third ground pattern (1230g) may be formed in a shape corresponding to the second ground patterns (1221g, 1222g). A first slot (1231s) with a pattern removed may be formed at the other end (1232) of the third ground pattern (1230g) corresponding to the shape of the first connection pattern (1220f) of the second CPW pattern (1220p). The area of ​​the first slot (1231s) may be greater than or equal to the area of ​​the first connection pattern (1220f).

[0192] The second connection pattern (1230f) of the first layer (1200a) may be formed as a microstrip line or CPW pattern. When the second connection pattern (1230f) is formed as a CPW pattern, ground patterns may be arranged on both sides of the second connection pattern (1230f). One end of the second connection pattern (1230f) may be connected to the first power supply pattern (1210f) of the first CPW pattern (1210p). The other end of the second connection pattern (1230f) may be connected to the first connection pattern (1220f) of the second CPW pattern (1220p).

[0193] The second connection pattern (1230f) may include a first line portion (1231f), a second line portion (1232f), and / or an end portion (1233f). The end portion (1233f) of the second connection pattern (1230f) may correspond to the other end of the second connection pattern (1230f).

[0194] A second slot (1232s) with a pattern removed may be formed at the other end (1232) of the third ground pattern (1230g) corresponding to the shape of the end (1233f) of the second connection pattern (1230f). The area of ​​the second slot (1232s) may be greater than or equal to the area of ​​the end (1233f) of the second connection pattern (1230f).

[0195] Meanwhile, the flexible printed circuit board (1200) may be formed in a folded structure. The flexible printed circuit board (1200) may be formed in a folded structure in a third connection substrate portion (1230b) on which a third ground pattern (1230g) and a second connection pattern (1230f) are formed. The flexible printed circuit board (1200) may be formed in a folded structure based on the AA' line and the BB' line.

[0196] A flexible printed circuit board (1200) may have a first cable connection portion (1210c) having a second CPW pattern (1220p) formed thereon and may overlap a first antenna connection portion (1210) having a first CPW pattern (1210p) formed thereon. The first cable connection portion (1210c) of the flexible printed circuit board (1200) forms a connection pad (100cp). A feed line of the connection pad (100cp) of the flexible printed circuit board (1200) and a signal line (111c) of an RF cable (110c) may be connected through soldering. A ground of the connection pad (100cp) of the flexible printed circuit board (1200) may be connected to a ground (112c) of the RF cable (110c).

[0197] The overlapping region (1234) may be formed so that the ground pattern is removed so that the ground pattern is not placed in the upper region of the first feed pattern (1210f) of the first CPW pattern (1210p). Since the third ground pattern (1230g) of the second layer (1220b) does not overlap the first feed pattern (1210f), the deterioration of the radiation performance of an antenna operating in a wideband can be prevented, and the antenna efficiency can be improved.

[0198] Meanwhile, the first line portion (1231f) of the second connection pattern (1230f) may extend from one end of the second connection pattern (1230f) in the y-axis direction by a length that avoids the overlapping area (1234). The second line portion (1232f) may extend from the end of the first line portion (1231f) by a predetermined angle that avoids the overlapping area (1234) in the -x-axis direction. The third line portion (1233f) may extend from the end of the second line portion (1232f) in the y-axis direction by a length corresponding to the position of the first connection pattern (1220f) of the second CPW pattern (1220p). The end of the third line portion (1233f) may be connected to the end (1233f) of the second connection pattern (1230f).

[0199] It may be configured to include power supply patterns for each of a plurality of regions formed on a flexible printed circuit board (1200). In this regard, the flexible printed circuit board (1200) may include first to third power supply patterns (1210f, 1220f, 1230f) and first to third ground patterns (1211g, 1212g, 1221g, 1222g, 1230g).

[0200] The above describes a glass assembly having an antenna assembly disposed thereon and a vehicle equipped with the same. The technical effects of the glass assembly having an antenna assembly disposed thereon according to the present specification and the vehicle equipped with the same are as follows.

[0201] The technical effects of a glass assembly having an antenna assembly according to the present specification and a vehicle having the same are described as follows.

[0202] According to this specification, a glass assembly with a transparent antenna assembly is applied to a vehicle, enabling wireless communication across multiple frequency bands. In particular, by optimizing the structure of the ground pattern adjacent to the feed pattern in the transparent antenna assembly, antenna performance can be secured even in the low-band (LB) band.

[0203] According to the present specification, the shape of the ground pattern can be optimized to increase antenna efficiency in the low band (LB) in an antenna structure operating in multiple frequency bands.

[0204] According to the present specification, the horizontal and vertical lengths of the protruding ground pattern can be optimized to reduce leakage current when a glass panel of a vehicle having a transparent antenna assembly disposed thereon is mounted on a metal frame.

[0205] The purpose of this specification is to increase antenna efficiency in the low band (LB) when a glass panel of a vehicle having a transparent antenna assembly mounted on a metal frame is mounted. In particular, the antenna efficiency in the low band (LB) can be increased in a vehicle having a transparent antenna assembly mounted on the vehicle by optimizing the horizontal and vertical lengths of a protruding ground pattern in consideration of leakage current on the frame.

[0206] Further scope of the applicability of this specification will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this specification will be apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments, are given by way of example only.

Claims

1. In glass assembly, glass panel; A first flexible circuit board disposed on a first area of ​​the glass panel and comprising a first substrate layer made of a transparent material and a first conductive pattern layer formed on one side of the first substrate layer; and A second flexible circuit board is disposed in a second region of the glass panel, and comprises a second dielectric substrate and has a second conductive pattern layer on a first side of the second dielectric substrate and a third conductive pattern layer on a second side thereof. The above first challenge pattern layer is, A first challenge pattern comprising a first portion and a second portion, wherein the first portion is perpendicular to the second portion, Second challenge pattern; and Includes a third challenge pattern, The size of the above second challenge pattern is smaller than the size of the above third challenge pattern, The second challenge pattern is positioned between the first portion of the first challenge pattern and the second portion of the first challenge pattern, The first part of the first challenge pattern and the third challenge pattern are arranged on opposite sides with respect to the second part of the first challenge pattern, The above second challenge pattern layer has a ground pattern and a power supply pattern, The above power supply pattern is connected to the first challenge pattern, The end portion of the first sub-pattern of the above ground pattern is connected to the second challenge pattern, The end of the second sub-pattern of the above ground pattern is connected to the third challenge pattern, The above power supply pattern is arranged in the space between the first sub-pattern and the second sub-pattern, The first side of the second sub-pattern faces the power supply pattern, The second side of the second sub-pattern forms the outer surface of the second substrate, A glass assembly, wherein the second side of the second sub-pattern has a protruding pattern part.

2. In paragraph 1, The vertical axis direction size of the protruding second side of the protruding pattern portion is formed in a predetermined range of 10 to 15 mm based on 0.08 wavelength (λg) of the first frequency band, The size of the horizontal axis direction of the protruding second side of the protruding pattern portion is formed in a predetermined range of 5 to 8 mm based on 0.05 wavelength (λg) of the first frequency band, A glass assembly, characterized in that the first frequency band is 750 to 960 MHz.

3. In paragraph 2, A glass assembly, which is arranged so as to be spaced apart by at least 5 mm in the vertical axis direction from a metal frame that is combined with the above-mentioned protruding pattern portion and the second flexible circuit board.

4. In paragraph 1, The first end of the above power supply pattern is connected to the third power supply pattern of the CPW pattern, and the second end of the above power supply pattern is connected to the end of the second part of the first conductive pattern. A glass assembly, wherein the second end of the above-mentioned power supply pattern is formed to a length greater than a predetermined length in the vertical axis direction.

5. In paragraph 1, A glass assembly, wherein a second interval of an end portion of the second sub-pattern in the horizontal axis direction is longer than a first interval of an end portion of the first sub-pattern in the horizontal axis direction.

6. In paragraph 5, Based on the other end of the protruding pattern portion, the fourth interval in the horizontal axis direction of the second sub-pattern is formed longer than the third interval in the horizontal axis direction of the first sub-pattern, A glass assembly, wherein the fifth interval in the horizontal axis direction of the first sub-pattern and the sixth interval in the horizontal axis direction of the second sub-pattern are formed with the same length based on the point overlapping with the end portion of the second flexible circuit board.

7. In paragraph 6, The third interval of the first sub-pattern is formed longer than the first interval, and the fifth interval is formed longer than the third interval. A glass assembly, wherein the second interval of the second sub-pattern is formed longer than the sixth interval, and the fourth interval is formed longer than the second interval.

8. In paragraph 5, The upper part of the first sub-pattern is connected to the second challenge pattern, The first interval of the first sub-pattern is formed to be equal to the length in the horizontal axis direction of the second challenge pattern, The upper part of the second sub-pattern is connected to the third challenge pattern, A glass assembly, wherein the end point of the upper portion of the second sub-pattern is positioned at a point further to one side than the end point of the lower portion of the third challenge pattern.

9. In paragraph 1, The first end of the end portion of the second sub-pattern is configured to be connected to the third challenge pattern, The second end of the end portion of the second sub-pattern is configured not to be connected to the third challenge pattern, A glass assembly, wherein the second end portion, which is not connected to the third challenge pattern, is arranged in the vicinity of the power supply pattern and is spaced apart from the power supply pattern in the horizontal axis direction.

10. In paragraph 1, A first gap, a second gap, and a third gap are formed between the side portion of the second portion of the first challenge pattern and the side portion of the third challenge pattern arranged near the second portion. The second gap is formed between the first gap and the third gap, The second interval is formed narrower than the first interval, and the first interval is formed narrower than the third interval, A glass assembly, wherein wideband impedance matching in the 1.7 to 3.5 GHz band is implemented by using three different parallel capacitance components by the first to third intervals.

11. In paragraph 1, The first part of the first challenge pattern is composed of a first radiation area and a second radiation area, and the second radiation area is configured to connect the first radiation area and the second part. In the first part, a signal of a first frequency band is radiated, and in the second part, a signal of a second frequency band higher than the first frequency band is radiated. The first size in the vertical axis direction of the first radiation area is larger than the second size in the vertical axis direction of the second radiation area, A glass assembly, wherein the boundary line of the upper portion of the second radiation area is formed diagonally so that the second size of the second radiation area increases toward the first radiation area.

12. In paragraph 1, The above glass panel comprises a first glass which is an inner glass and a second glass which is an outer glass, The first challenge pattern layer, the second challenge pattern layer and the third challenge pattern layer are disposed between the first glass and the second glass, A glass assembly, wherein the first region is disposed in a transparent region of the glass panel, and the second region is disposed in an opaque region of the glass panel.

13. In vehicles, frame; A glass panel mounted on the above frame; A first flexible circuit board disposed on a first area of ​​the glass panel and comprising a first substrate layer made of a transparent material and a first conductive pattern layer formed on one side of the first substrate layer; and A second flexible circuit board is disposed in a second region of the glass panel, and comprises a second dielectric substrate and has a second conductive pattern layer on a first side of the second dielectric substrate and a third conductive pattern layer on a second side thereof. The above first challenge pattern layer is, A first challenge pattern comprising a first portion and a second portion, wherein the first portion is perpendicular to the second portion, Second challenge pattern; and Includes a third challenge pattern, The size of the above second challenge pattern is smaller than the size of the above third challenge pattern, The second challenge pattern is positioned between the first portion of the first challenge pattern and the second portion of the first challenge pattern, The first part of the first challenge pattern and the third challenge pattern are arranged on opposite sides with respect to the second part of the first challenge pattern, The above second challenge pattern layer has a ground pattern and a power supply pattern, The above power supply pattern is connected to the first challenge pattern, The end portion of the first sub-pattern of the above ground pattern is connected to the second challenge pattern, The end of the second sub-pattern of the above ground pattern is connected to the third challenge pattern, The above power supply pattern is arranged in the space between the first sub-pattern and the second sub-pattern, The first side of the second sub-pattern faces the power supply pattern, The second side of the second sub-pattern forms the outer surface of the second substrate, A vehicle, wherein the second side of the second sub-pattern has a protruding pattern part.

14. In paragraph 13, The vertical axis direction size of the protruding second side of the protruding pattern portion is formed in a predetermined range of 10 to 15 mm based on 0.08 wavelength (λg) of the first frequency band, The size of the horizontal axis direction of the protruding second side of the protruding pattern portion is formed in a predetermined range of 5 to 8 mm based on 0.05 wavelength (λg) of the first frequency band, The above protruding pattern portion and the metal frame that is combined with the second flexible circuit board are arranged at a distance of 5 mm or more in the vertical axis direction, A vehicle, characterized in that the first frequency band is 750 to 960 MHz.

15. In paragraph 13, The first end of the above power supply pattern is connected to the third power supply pattern of the CPW pattern, and the second end of the above power supply pattern is connected to the end of the second part of the first conductive pattern. A vehicle in which the second end of the above power supply pattern is formed to a length greater than a predetermined length in the vertical axis direction.

16. In paragraph 13, The second interval of the end portion of the second sub-pattern in the horizontal axis direction is formed longer than the first interval of the end portion of the first sub-pattern in the horizontal axis direction, Based on the other end of the protruding pattern portion, the fourth interval in the horizontal axis direction of the second sub-pattern is formed longer than the third interval in the horizontal axis direction of the first sub-pattern, A vehicle in which the fifth interval in the horizontal axis direction of the first sub-pattern and the sixth interval in the horizontal axis direction of the second sub-pattern are formed with the same length based on the point overlapping with the end portion of the second flexible circuit board.

17. In paragraph 13, The first end of the end portion of the second sub-pattern is configured to be connected to the third challenge pattern, The second end of the end portion of the second sub-pattern is configured not to be connected to the third challenge pattern, A vehicle wherein the second end portion, which is not connected to the third challenge pattern, is arranged in the vicinity of the power supply pattern and is spaced apart from the power supply pattern in the horizontal axis direction.

18. In paragraph 13, A first gap, a second gap, and a third gap are formed between the side portion of the second portion of the first challenge pattern and the side portion of the third challenge pattern arranged near the second portion. The second gap is formed between the first gap and the third gap, The second interval is formed narrower than the first interval, and the first interval is formed narrower than the third interval, Wideband impedance matching in the 1.7 to 3.5 GHz band is implemented by using three different parallel capacitance components according to the first to third intervals. The first part of the first challenge pattern is composed of a first radiation area and a second radiation area, and the second radiation area is configured to connect the first radiation area and the second part. In the first part, a signal of a first frequency band is radiated, and in the second part, a signal of a second frequency band higher than the first frequency band is radiated. The first size in the vertical axis direction of the first radiation area is larger than the second size in the vertical axis direction of the second radiation area, A vehicle in which the boundary line of the upper part of the second radiation area is formed diagonally so that the second size of the second radiation area increases toward the first radiation area.

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