Display assembly and electronic device comprising same

Abstract

A display assembly according to one embodiment of the present invention may comprise: a display panel; a polymer layer disposed on the rear surface of the display panel; a flexible circuit board electrically connected to the display panel and disposed outside the edge of the display panel; a display driving chip mounted on the flexible circuit board; and a resin layer configured to surround the flexible circuit board. At least a portion of the edge of the polymer layer may include a flat or curved first inclined surface that forms a substantially obtuse angle with respect to the rear surface of the display panel.

Description

Display assembly and electronic device including the same

[0001] Various embodiments of the present disclosure relate to a display assembly and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, ranging from home appliances to electronic organizers, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] A display assembly according to one embodiment of the present disclosure may include a display panel, a polymer layer disposed on a back surface of the display panel, a flexible circuit board electrically connected to the display panel and disposed on an outer edge of the display panel, a display driving chip mounted on the flexible circuit board, and a resin layer configured to surround the flexible circuit board. The polymer layer may include a first inclined surface, which is a plane or curved surface, at least a portion of an edge of the polymer layer forming a substantially obtuse angle with respect to the back surface of the display panel.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing and a display assembly disposed on the housing. The display assembly may include a display panel, a polymer layer disposed on a rear surface of the display panel, a flexible circuit board electrically connected to the display panel and disposed on an outer edge of the display panel, a display driving chip mounted on the flexible circuit board, and a resin layer configured to surround the flexible circuit board. The polymer layer may include a first inclined surface, which is a plane or a curved surface, at least a portion of an edge of which forms a substantially obtuse angle with respect to a rear surface of the display panel.

[0007] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment.

[0010] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment.

[0011] FIG. 4A is an exploded perspective view of the electronic device illustrated in FIG. 2, showing the front side, according to one embodiment.

[0012] FIG. 4b is an exploded perspective view of the electronic device illustrated in FIG. 2, showing the rear side, according to one embodiment.

[0013] FIG. 5 is a rear view of a display assembly according to one embodiment.

[0014] FIG. 6a is an enlarged view of a portion of FIG. 5 according to one embodiment, in which the resin layer is omitted.

[0015] FIG. 6b is an enlarged view of a portion of FIG. 5 according to one embodiment.

[0016] FIG. 7 is a cross-sectional side view taken along line AA of FIG. 6a according to one embodiment.

[0017] FIG. 8 is an exploded perspective view of a jig device provided for filling a resin layer into a display assembly according to one embodiment.

[0018] FIG. 9 is a schematic drawing showing the coupling relationship between a display assembly and a mold cap according to one embodiment.

[0019] FIG. 10 is a schematic drawing for explaining a process of filling a molding liquid using the jig device of FIG. 8 according to one embodiment.

[0020] FIG. 11 is a schematic drawing showing two resin layers with different hardnesses according to one embodiment.

[0021] FIG. 12 is a partial perspective view of a display assembly according to one embodiment, with the resin layer omitted.

[0022] FIG. 13 is a partial perspective view of a display assembly according to one embodiment.

[0023] FIG. 14 is an enlarged rear view of a portion of a display assembly according to one embodiment.

[0024] The following description refers to the attached drawings, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0025] The various embodiments used to illustrate the principles of the present disclosure, as illustrated in FIGS. 1 through 14 below and in this patent document, are for illustrative purposes only and should not be construed as limiting the scope of the present disclosure in any way. Those skilled in the art will appreciate that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0026] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0027] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197). According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment disclosed in the present document. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment disclosed in the present document.

[0050] Any of the features, components, and / or arrangement relationships between components illustrated in FIGS. 2 and 3 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings herein. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIG. 1 and FIGS. 4A through 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIGS. 2 and 3.

[0051] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0052] In one embodiment, the first side (110A) may be formed by a front plate (110E) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (110E) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0053] In one embodiment, the front plate (110E) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (110E) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (110E)) at one edge of the first side (110A). In one embodiment, the front plate (110E) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (110E) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0054] According to one embodiment, the electronic device (101) may include at least one of a display (230), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (119A), a second sensor module (not shown), a third sensor module (119B)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (109A), a second connector hole (109B)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0055] The display (230) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (110E)). In one embodiment, at least a portion of the display (230) may be visually exposed through the front plate (110E) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the corners of the display (230) may be formed to be substantially the same as the adjacent outer shape of the front plate (110E). In one embodiment (not shown), in order to expand the area where the display (230) is visually exposed, the gap between the outer edge of the display (230) and the outer edge of the front plate (110E) may be formed to be substantially the same.

[0056] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (230), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (119A)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (119A)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on a back surface of the screen display area of ​​the display (230). In one embodiment (not shown), the display (230) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0057] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0058] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (119A) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119B) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on the first surface (110A) (e.g., the display (230)) of the housing (110), as well as the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0059] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119B). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time at which the infrared light is received by the third sensor module (119B).

[0060] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (230). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0061] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0062] According to one embodiment, the connector hole (e.g., the first connector hole (109A), the second connector hole (109B)) may include a first connector hole (109A) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (102) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0063] FIG. 4A is an exploded perspective view of the electronic device illustrated in FIG. 2, showing a front side, according to one embodiment disclosed in the present document. FIG. 4B is an exploded perspective view of the electronic device illustrated in FIG. 2, showing a rear side, according to one embodiment disclosed in the present document.

[0064] Any of the features, components, and / or arrangement relationships between components illustrated in FIGS. 4A and 4B may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings herein. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1 to 3 and FIGS. 5 to 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIGS. 4A and 4B.

[0065] Referring to FIGS. 4A and 4B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 , or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (110E) of FIG. 2 ), a display (230) (e.g., the display (230) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0066] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0067] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0068] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0069] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0070] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0071] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0072] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114))) or a connector hole (e.g., a first connector hole (109A), a second connector hole (109B)) of FIG. 2.

[0073] According to one embodiment, it can be positioned corresponding to the audio module (207) or connector hole (108, 109).

[0074] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0075] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) via a connecting member such as a connecting flexible board or cable. The sub-circuit board (290) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (250) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit signals and power.

[0076] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0077] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0078] Below, the structure of the display (230) will be described in detail.

[0079] FIG. 5 is a rear view of a display assembly according to one embodiment. FIG. 6a is an enlarged view of a portion of FIG. 5 according to one embodiment, wherein the resin layer is omitted. FIG. 6b is an enlarged view of a portion of FIG. 5 according to one embodiment.

[0080] Any of the features, components, and / or arrangement relationships between components depicted in FIGS. 5, 6a, and 6b may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings of this specification. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1 to 4b, and FIGS. 7 to 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIGS. 5, 6a, and 6b.

[0081] The display assembly (500) illustrated in FIGS. 5 to 6B may be substantially identical to or similar to the display illustrated in FIGS. 4A and 4B (e.g., the display (230) of FIG. 4A). The display assembly (500) of FIGS. 5 to 6B may be included in the electronic device of FIGS. 2 to 4B (e.g., the electronic device (101) of FIG. 2).

[0082] Referring to FIGS. 5 to 6b, the display assembly (500) may include at least one of a connector (510), a flexible circuit board (520), or a resin layer (530).

[0083] According to one embodiment, the connector (510) may be connected to an external power source. For example, the connector (510) may be electrically connected to a battery (e.g., battery (250) of FIG. 4A). Power transmitted through the connector (510) may be supplied to various electronic components, such as a display driving chip (e.g., display driving chip (521) of FIG. 7) of a printed circuit board and a flexible circuit board (520).

[0084] According to one embodiment, a portion of the flexible circuit board (520) may extend from a display panel (e.g., the display panel (540) of FIG. 7). The flexible circuit board (520) may be arranged such that it extends from the display panel (540) and folds into at least a portion of a rear surface of the display assembly (500). A portion of the flexible circuit board (520) extending from the display panel (540) may be formed by bending. The flexible circuit board (520) may be electrically connected to the display panel (540). A portion of the flexible circuit board (520) may extend from an outer edge of the display panel (540). The flexible circuit board (520) may include a display driver IC (DDI) or a touch display driver IC (TDDI). The flexible circuit board (520) may have a COF (chip on film) or COP (chip on panel or chip on plastic) structure, and a DDI or TDDI may be placed on one side.

[0085] According to one embodiment, various elements related to driving the display panel (540) may be arranged on the flexible circuit board (520). For example, flash memory for a display, an ESD prevention diode, a pressure sensor, and / or passive elements may be arranged on the flexible circuit board (520).

[0086] According to one embodiment, the resin layer (530) may be arranged to surround at least a portion of the flexible circuit board (520). The resin layer (530) may be arranged to surround the flexible circuit board (520) folded on the outside of the display panel (540). The resin layer (530) may protect the flexible circuit board (520), which is a portion vulnerable to damage when the display assembly (500) mounted on the electronic device (101) receives an external impact.

[0087] By protecting the flexible circuit board (520) with the resin layer (530), damage to the flexible circuit board (520) due to contact or collision with the housing (110) of the electronic device (101) can be improved or reduced. Additionally, by strongly fixing the flexible circuit board (520) with the resin layer (530), the size of the safety space provided as an empty space for protecting the flexible circuit board (520) inside the electronic device (101) can be reduced, thereby securing more space for accommodating electronic components inside the electronic device (101).

[0088] In one embodiment, the resin layer (530) may be formed to extend along one edge of the display assembly (500).

[0089] According to one embodiment, the resin layer (530) can be formed by filling a molding liquid around the flexible circuit board (520) using a jig device. A detailed description thereof will be provided later.

[0090] According to one embodiment, the display assembly (500) may further include a sealing member (590). The sealing member (590) may be positioned to prevent the molding liquid from leaking into the surroundings during the process of injecting the molding liquid for forming the resin layer (530). The position of the sealing member (590) is not limited to that illustrated, and may be positioned anywhere in the stepped space around the resin layer (530) where the molding liquid is likely to leak, depending on the shape of the display assembly (500).

[0091] According to one embodiment, the sealing member (590) may include a first sealing member (591) and a second sealing member (592). The first sealing member (591) may be disposed near the first inclined surface (551) or the second inclined surface (561) to reduce leakage of the molding liquid along the edge of the display assembly (500). The first sealing member (591) may be disposed to reduce leakage of the molding liquid between, for example, a step formed by the metal layer (560) and the polymer layer (550) or a step formed by the polymer layer (550) and the display panel (540). The second sealing member (592) may be disposed in a stepped portion formed by a configuration such as a printed circuit board around the resin layer (530) to reduce leakage of the molding liquid in a plane-inward direction of the display assembly (500).

[0092] FIG. 7 is a cross-sectional side view taken along line AA of FIG. 6a according to one embodiment.

[0093] Any of the features, components, and / or arrangement relationships between components illustrated in FIG. 7 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings of this specification. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1 to 6b and FIGS. 8 to 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIG. 7.

[0094] Referring to FIG. 7, the display assembly (500) may include at least one of a display panel (540), a polymer layer (550), a metal layer (560), a polarizing layer (570), or a protective layer (580). However, this is merely exemplary, and other layers may be added or existing layers may be excluded.

[0095] According to one embodiment, the display panel (540) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). According to one embodiment, the display panel (540) may include a touch panel (not shown). The display panel (540) may be, for example, a deformable or bendable flexible display.

[0096] According to one embodiment, the polymer layer (550) may be disposed on the back surface of the display panel (540). The polymer layer (550) may be bonded or attached to the display panel (540) by an adhesive member (P). The polymer layer (550) may provide a dark background to ensure visibility of the display panel (540). The polymer layer (550) may be formed of a buffering material that acts as a buffer to protect the display panel (540). In some embodiments, the polymer layer (550) may be omitted or disposed on the back surface of the metal layer (560) to ensure waterproofing of the display panel (540).

[0097] According to one embodiment, the polymer layer (550) may include a plastic film as a base layer. The polymer layer (550) may include a plastic film including any one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or a combination thereof.

[0098] The material constituting the polymer layer (550) is not limited to plastic resins and may include organic / inorganic composite materials. The polymer layer (550) may include a porous organic layer and an inorganic material filled in the pores of the organic layer.

[0099] According to one embodiment, the metal layer (560) may be disposed on the back surface of the polymer layer (550). The metal layer (560) may be disposed to alleviate impact applied from the rear of the display panel (540). The metal layer (560) may be disposed to diffuse or dissipate heat inside the electronic device (101). The metal layer (560) may be bonded or attached to the polymer layer (550) by an adhesive member (P). The metal layer (560) may include at least one of STS (stainless steel), Cu, Al, or metal CLAD. However, the present invention is not limited thereto, and the metal layer (560) may also include other alloy materials. For example, the metal layer (560) may help reinforce the rigidity of the display assembly (500), shield ambient noise, and may be used to disperse heat emitted from surrounding heat-emitting components.

[0100] In one embodiment, the metal layer (560) may help reinforce the rigidity of the electronic device. In one embodiment, the metal layer (560) may be used to shield ambient noise and disperse heat emitted from surrounding heat-dissipating components. The metal layer (560) may include at least one of stainless steel (STS), copper (Cu), aluminum (Al), or other alloy materials. The metal layer (560) may be omitted in some form factors of the electronic device.

[0101] According to one embodiment, the display assembly (500) may include a digitizer panel (not shown) disposed on the back surface of the metal layer (560) and configured to detect input from an electronic pen (e.g., a stylus pen).

[0102] According to various embodiments, the display assembly (500) may include other types of functional members in addition to the illustrated configuration. For example, the display assembly (500) may include at least one functional member disposed between the polymer layer (550) and the metal layer (560), or on the back surface of the metal layer (560). According to one embodiment, the functional member may include at least one of a graphite sheet for heat dissipation, a touch sensor supporting a touch function of the display assembly (500), a fingerprint sensor FPCB, a communication antenna radiator, or a conductive / non-conductive tape.

[0103] According to one embodiment, a polarizing layer (570) (POL, polarizer) (e.g., a polarizing film) may be disposed on the upper surface of the display panel (540). The polarizing layer (570) may be bonded or attached to the display panel (540) by an adhesive member (P). The polarizing layer (570) may selectively transmit light generated from a light source of the display panel (540) and vibrating in a certain direction. According to one embodiment, the polarizing layer (570) may be formed integrally with the display panel (540).

[0104] According to one embodiment, the protective layer (580) may be disposed on the front surface of the polarizing layer (570). The protective layer (580) may be bonded or attached to the polarizing layer (570) by an adhesive member (P). The protective layer (580) may be referred to as a window layer. The protective layer (580) may include, for example, ultra-thin glass (UTG). The protective layer (580) may include, for example, a polymer. The protective layer (580) may include, for example, polyethylene terephthalate (PET) or polyimide (PI). The protective layer (580) may be composed of a plurality of layers, for example, including a glass layer and a polymer.

[0105] According to one embodiment, the display assembly (500) may include an adhesive member (P). The adhesive member (P) may include, for example, at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

[0106] In one embodiment, the display assembly (500) may be formed such that at least a portion of the edge is beveled. For example, the display assembly (500) may be etched such that a portion of the edge is beveled.

[0107] According to one embodiment, the polymer layer (550) may include a first inclined surface (551) formed such that at least a portion of the edge thereof is inclined in a direction outward from the plane of the polymer layer (550) along the direction toward the display panel (540). The first inclined surface (551) may be formed such that at least a portion of the edge of the polymer layer (550) forms a substantially obtuse angle with respect to the back surface of the display panel (540). The first inclined surface (551) may be a flat surface or a curved surface. For example, the first inclined surface (551) may have a shape of a curved surface that is convex outwardly. For example, the first inclined surface (551) may be formed such that the inclination thereof decreases as it moves away from the display panel (540). The area of ​​the polymer layer (550) may be smaller than the area of ​​the display panel (540). The edge of the display panel (540) may be arranged to protrude outward with respect to the polymer layer (550).

[0108] The first inclined surface (551) can reduce the leakage of the molding liquid when injecting the molding liquid into the area around the flexible circuit board (520) of the display assembly (500) accommodated in the jig device for forming the resin layer (530). The first inclined surface (551) can reduce the leakage of the molding liquid by bringing the display assembly (500) into close contact with the molding cap (e.g., the molding cap (820) of FIG. 8). A detailed description will be provided later.

[0109] According to one embodiment, the edge of the adhesive member (P) corresponding to the first inclined surface (551) as illustrated may also have a shape that is inclined so as to face outward as it faces the display panel (540). According to one embodiment, in the process of etching to form the first inclined surface (551) on a portion of the edge of the polymer layer (550), the adhesive member (P) applied to the front and / or back surface of the polymer layer (550) may also be etched together.

[0110] In one embodiment, the metal layer (560) may be disposed on the back surface of the polymer layer (550) such that its edge is formed to step inwardly relative to the polymer layer (550). The area of ​​the metal layer (560) may be smaller than the area of ​​the polymer layer (550). The edge of the polymer layer (550) may be disposed to protrude outwardly relative to the metal layer (560).

[0111] According to one embodiment, the metal layer (560) may include a second inclined surface (561) formed such that at least a portion of an edge thereof is inclined in a direction outward from the plane of the metal layer (560) along a direction toward the polymer layer (550). The second inclined surface (561) may be formed such that at least a portion of an edge of the metal layer (560) forms a substantially obtuse angle with respect to a back surface of the polymer layer (550). The second inclined surface (561) may be formed such that, for example, the edge thereof is inclined in a direction outward from the plane of the metal layer (560) along a direction toward the display panel (540). The second inclined surface (561) may be a flat surface or a curved surface. For example, the second inclined surface (561) may have a shape of an outwardly convex curved surface. For example, the second inclined surface (561) may be formed such that the slope thereof decreases as it moves away from the polymer layer (550) (or the display panel (540)).

[0112] According to one embodiment, the second inclined surface (561) may be disposed at a longitudinal end of the resin layer (530). A portion of the second inclined surface (561) may be positioned to overlap the resin layer (530). A portion of the second inclined surface (561) may be formed in an area within a predetermined distance from the longitudinal end of the resin layer (530). For example, the second inclined surface may be formed in an area R shown in FIG. 6A. The second inclined surface (561) may reduce leakage of the molding liquid when injecting the molding liquid into an area around the flexible circuit board (520) of the display assembly (500) accommodated in the jig device for forming the resin layer (530). The second inclined surface (561) may reduce leakage of the molding liquid by bringing the display assembly (500) into close contact with the molding cap (e.g., the molding cap (820) of FIG. 8). A detailed description will be given later.

[0113] According to one embodiment, the edge of the adhesive member (P) corresponding to the second inclined surface (561) as illustrated may also have a shape that is inclined so as to face outward as it faces the polymer layer (550) side (or the display panel (540) side). According to one embodiment, in the process of etching to form the second inclined surface (561) on a portion of the edge of the metal layer (560), the adhesive member (P) applied to the front and / or back surface of the metal layer (560) may also be etched together.

[0114] In one embodiment, the second inclined surface (561) may be positioned to correspond to the first inclined surface (551). The second inclined surface (561) may be positioned behind the first inclined surface (551).

[0115] According to one embodiment, the average slope (562) of the second slope (561) may be greater than the average slope (552) of the first slope (551). Here, the average slope (562) of the second slope (561) may refer to the slope of a straight line connecting the lower point of the second slope (561) and the upper point of the second slope (561). Here, the average slope (552) of the first slope (551) may refer to the slope of a straight line connecting the lower point of the first slope (551) and the upper point of the first slope (551).

[0116] According to one embodiment, the second inclined surface (561) may have a protruding shape facing outward from the metal layer (560), unlike as illustrated. For example, the second inclined surface (561) may have a pattern shape in which protrusions and concave portions are alternately arranged along the edge of the metal layer (560). The protruding and concave shape may be the same as or similar to the shape illustrated in FIG. 12. That is, the second inclined surface (561) may have a protruding and concave shape on the inclined surface.

[0117] Referring to FIGS. 6A, 6B, and 7, the first inclined surface (551) may be positioned at a longitudinal end of the resin layer (530). A portion of the first inclined surface (551) may be positioned to overlap the resin layer (530). A portion of the first inclined surface (551) may be formed in an area within a predetermined distance from the longitudinal end of the resin layer (530). For example, the first inclined surface may be formed in an area R shown in FIG. 6A.

[0118] FIG. 8 is an exploded perspective view of a jig device provided for filling a resin layer into a display assembly according to one embodiment. FIG. 9 is a schematic diagram illustrating a coupling relationship between a display assembly and a mold cap according to one embodiment. FIG. 10 is a schematic diagram illustrating a process of filling a molding liquid using the jig device of FIG. 8 according to one embodiment.

[0119] Any of the features, components, and / or arrangement relationships between components illustrated in FIGS. 8 through 10 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings of this specification. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1 through 7 and FIGS. 11 through 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIGS. 8 through 10.

[0120] Referring to FIGS. 8 to 10, a jig device (800) for filling a resin layer (530) into a display assembly (500) may include a base jig (810), a molding cap (820), and an upper jig (830). The molding cap (820) may be made of silicone, but is not limited thereto.

[0121] As shown in Fig. 6a, the display assembly (500) before the resin layer (530) is formed can be mounted or fitted into the molding cap (820). When the display assembly (500) is fitted into the molding cap (820), the molding force or adhesive force between the molding cap (820) and the display assembly (500) is improved by the first inclined surface (551) and the second inclined surface (561), thereby minimizing leakage of the molding liquid.

[0122] FIG. 9 is a cross-sectional view of a portion where the molding cap (820) is in contact with the inclined surfaces (the first inclined surface (551) and the second inclined surface (561)) of the display assembly (500). As illustrated in FIG. 9, the molding cap (820) may include a third inclined surface (821) facing the first inclined surface (551) and a fourth inclined surface (822) facing the second inclined surface (561). By applying a force in the downward direction of the drawing of the molding cap (820), the third inclined surface (821) may be brought into close contact with the first inclined surface (551), and the fourth inclined surface (822) may be brought into close contact with the second inclined surface (561). For example, due to the outwardly convex curved shapes of the first inclined surface (551) and the second inclined surface (561), the first inclined surface (551) and the second inclined surface (561) can be pressed against each other more efficiently while being pressed against each other by the third inclined surface (821) and the fourth inclined surface (822). Due to the structure of the first inclined surface (551) and the second inclined surface (561) of the display assembly (500), molding liquid leakage can be minimized when filling the molding liquid. That is, the first inclined surface (551) and the second inclined surface (561) can improve the molding force or the sealing force with the molding cap (820), thereby reducing the amount of molding liquid leakage when filling the molding liquid.

[0123] When the display assembly (500) is seated or fitted into the molding cap (820), a force is applied downward as shown in FIG. 9 by the molding cap (820). However, in the case of a conventional display assembly (500) in which the edge is a vertical surface that is not etched, sufficient sealing between the molding cap (820) and the display assembly (500) may not be achieved despite the force applied downward by the molding cap (820). As a result, a gap may be generated, causing the molding liquid to leak. In the present disclosure, by forming a sloped surface on a portion of the edge of the display assembly (500), the molding force or sealing force between the molding cap (820) and the display assembly (500) can be improved.

[0124] After the display assembly (500) is mounted or fitted onto the molding cap (820), the molding cap (820) can be placed on the base jig (810). An upper jig (830) can be coupled to the upper portion of the base jig (810). The position of the molding cap (820) can be fixed by coupling the base jig (810) and the upper jig (830).

[0125] After fixing the molding cap (820), molding liquid can be injected into the injection port (823) of the molding cap (820) as illustrated in FIG. 10. The molding liquid may be, but is not limited to, epoxy molding liquid. Any leaks from the injected molding liquid can be prevented from spreading by the sealing member (590).

[0126] The molding liquid injected through the injection port (823) of the molding cap (820) can be filled not only on the outside but also on the inside of the flexible circuit board (520). That is, the molding liquid can be filled so as to surround the inner and outer surfaces of the flexible circuit board (520).

[0127] After the injection of the molding liquid is completed, the molding liquid can be cured into a resin layer (530) while removing air bubbles inside the molding liquid through a heat curing process.

[0128] After the heat curing process is completed, the base jig (810) and the upper jig (830) can be cooled to separate the assembled molding cap (820).

[0129] FIG. 11 is a schematic drawing showing two resin layers with different hardnesses according to one embodiment.

[0130] Any of the features, components, and / or arrangement relationships between components illustrated in FIG. 11 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings of this specification. Likewise, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1 to 10 and FIGS. 12 to 14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIG. 11.

[0131] The resin layer (1100) illustrated in FIG. 11 may be a modified embodiment of the resin layer of FIG. 5 (e.g., the resin layer (530) of FIG. 5). The resin layer (1100) illustrated in FIG. 11 may be included in the display assembly of FIG. 5 (e.g., the display assembly (500) of FIG. 5) in place of the resin layer (530) of FIG. 5. In FIG. 11, the same reference numerals are used for configurations other than the resin layer (1100) that are substantially the same or similar to the configuration described above.

[0132] According to one embodiment, the resin layer (1100) may include a first resin layer (1110) and a second resin layer (1120). Through the injection port (823) of the molding cap (820), a first molding liquid for forming the first resin layer (1110) is injected and cured, and then a second molding liquid for forming the second resin layer (1120) is injected and cured to fill the remaining portion, thereby forming the resin layer (1100). The second resin layer (1120) may be disposed on the outside relative to the first resin layer (1110). The first resin layer (1110) and the second resin layer (1120) may be formed integrally.

[0133] According to one embodiment, the first resin layer (1110) may have a lower hardness than the second resin layer (1120). By filling the first molding liquid with a relatively low hardness, the molding liquid can also be filled into the gaps between the flexible circuit boards (520). In addition, by filling the surface with the second molding liquid with a relatively high hardness, the impact resistance performance can be improved.

[0134] FIG. 12 is a partial perspective view of a display assembly according to one embodiment, with the resin layer omitted. FIG. 13 is a partial perspective view of a display assembly according to one embodiment. FIG. 14 is an enlarged rear view of a portion of a display assembly according to one embodiment.

[0135] Any of the features, components, and / or arrangement relationships between components illustrated in FIGS. 12-14 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in other drawings of this specification. Similarly, any of the features, components, and / or arrangement relationships between components described with respect to FIGS. 1-11 may be incorporated, alone or in combination, into the features, components, and arrangement relationships between components described in FIGS. 12-14.

[0136] Among the configurations of the display assembly (1200) illustrated in FIGS. 12 to 14, the same reference numbers are used for configurations that are substantially the same or similar to the display assembly (500) described in FIGS. 5 to 10.

[0137] Referring to FIGS. 12 to 14, the display assembly (1200) may have a protruding structure formed on some of the edges.

[0138] According to one embodiment, at least a portion of the edge of the metal layer (1210) may have a protruding structure (1211) (or a protruding shape) facing outward of the metal layer (1210). For example, the metal layer (1210) may have a pattern shape in which convex portions (1211a) and concave portions (1211b) are alternately arranged along the edge. Here, an area of ​​the edge of the metal layer (1210) having the protruding structure (1211) or the pattern shape in which convex portions (1211a) and concave portions (1211b) are alternately arranged may be referred to as a 'protruding area'.

[0139] According to one embodiment, the uneven region may be positioned so that a portion overlaps a longitudinal end of the resin layer (530). The uneven region may be formed in an area within a predetermined distance from the longitudinal end of the resin layer (530). The uneven region may correspond, for example, to the R region of FIG. 6A.

[0140] According to one embodiment, the adhesive material applied to the front and / or back surface of the metal layer (1210) may also be etched together with the metal layer (1210) to have a rough shape.

[0141] In the display assembly (1200), leakage of the molding liquid can be reduced by forming a recessed structure around the edge of the resin layer (530). When the molding liquid leaks through the stepped space formed between the metal layer (1210) and the polymer layer (550), the molding liquid forms a vortex (T) in the concave portion (1211b) of the recessed structure (1211), thereby suppressing the molding liquid from leaking along the edge.

[0142] A display assembly (500) according to one embodiment of the present disclosure may include a display panel (540), a polymer layer (550) disposed on a back surface of the display panel (540), a flexible circuit board (520) electrically connected to the display panel (540) and having a portion disposed outside an edge of the display panel (540), a display driving chip (521) mounted on the flexible circuit board (520), and a resin layer (530) configured to surround the flexible circuit board (520). The polymer layer (550) may include a first inclined surface (551) that is flat or curved, at least a portion of an edge of which forms a substantially obtuse angle with respect to the back surface of the display panel (540).

[0143] According to one embodiment, the first inclined surface (551) may be formed so that the slope decreases as it moves away from the display panel (540).

[0144] According to one embodiment, the display assembly (500) may further include a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly with respect to the polymer layer (550). The metal layer (560) may include a second inclined surface (561) that is planar or curved, at least a portion of the edge forming a substantially obtuse angle with respect to the back surface of the polymer layer (550).

[0145] According to one embodiment, the average slope of the second slope (561) may be greater than the average slope of the first slope (551).

[0146] According to one embodiment, the second inclined surface (561) may have a rough shape facing outward of the metal layer (560).

[0147] According to one embodiment, the second inclined surface (561) may have a pattern shape in which protrusions and concave portions are alternately arranged along the edge of the metal layer (560).

[0148] According to one embodiment, the second inclined surface (561) may be positioned to correspond to the first inclined surface (551).

[0149] According to one embodiment, the first inclined surface (551) may be positioned so that a portion thereof overlaps a longitudinal end of the resin layer (530).

[0150] According to one embodiment, the display assembly (500) may further include a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly relative to the polymer layer (550). The metal layer (560) may have a protruding shape with at least a portion of the edge facing outwardly of the metal layer (560).

[0151] According to one embodiment, the first inclined surface (551) may be formed in a region within a predetermined distance from a longitudinal end of the resin layer (530).

[0152] According to one embodiment, the resin layer (530) may include a first resin layer that surrounds the flexible circuit board (520) and a second resin layer that surrounds at least a portion of the first resin layer and has a higher hardness than the first resin layer.

[0153] According to one embodiment, the display assembly (500) may further include a sealing member (590) positioned to block leakage of the molding liquid around at least a portion of the periphery of the resin layer (530).

[0154] An electronic device (101) according to one embodiment of the present disclosure may include a housing (110) and a display assembly (500) disposed on the housing. The display assembly (500) may include a display panel (540), a polymer layer (550) disposed on a rear surface of the display panel (540), a flexible circuit board (520) electrically connected to the display panel (540) and having a portion disposed outside an edge of the display panel (540), a display driving chip (521) mounted on the flexible circuit board (520), and a resin layer (530) configured to surround the flexible circuit board (520). The polymer layer (550) may include a first inclined surface (551) that is flat or curved, at least a portion of an edge of which forms a substantially obtuse angle with respect to the rear surface of the display panel (540).

[0155] According to one embodiment, the first inclined surface (551) may be formed so that the slope decreases as it goes upward.

[0156] According to one embodiment, the display assembly (500) may further include a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly relative to the polymer layer (550). The metal layer (560) may include a second inclined surface (561) that is flat or curved and formed such that at least a portion of the edge is inclined in a direction outward from the plane of the metal layer (560) along the direction toward the polymer layer (550).

[0157] According to one embodiment, the average slope of the second slope (561) may be greater than the average slope of the first slope (551).

[0158] According to one embodiment, the second inclined surface (561) may have a rough shape facing outward of the metal layer (560).

[0159] According to one embodiment, the second inclined surface (561) may be positioned to correspond to the first inclined surface (551).

[0160] According to one embodiment, the first inclined surface (551) may be positioned so that a portion thereof overlaps a longitudinal end of the resin layer (530).

[0161] According to one embodiment, the display assembly (500) may further include a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly relative to the polymer layer (550). The metal layer (560) may have a protruding shape with at least a portion of the edge facing outwardly of the metal layer (560).

[0162] According to one embodiment, the first inclined surface (551) may be formed in an area within a predetermined distance from the longitudinal end of the resin layer (530).

[0163] According to one embodiment, the resin layer (530) may include a first resin layer (530) that surrounds the flexible circuit board (520) and a second resin layer (530) that surrounds at least a portion of the first resin layer (530) and has a higher hardness than the first resin layer (530).

[0164] According to one embodiment, the display assembly (500) may further include a sealing member (590) positioned to block leakage of the molding liquid around at least a portion of the periphery of the resin layer (530).

[0165] Various embodiments of the present disclosure may include a resin layer that protects a flexible circuit board extending from a display panel from external impact.

[0166] Various embodiments of the present disclosure can reduce leakage of molding liquid to surrounding components during molding liquid filling.

[0167] According to various embodiments proposed in the present disclosure, a display assembly can protect a flexible circuit board from external impact by adding a resin layer that wraps the flexible circuit board extending from the display panel.

[0168] According to various embodiments proposed in the present disclosure, the display assembly can reduce the defect rate by reducing the leakage of the molding liquid during filling of the molding liquid to form a resin layer.

[0169] The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present disclosure. For example, a singular element should be understood to include plural elements unless the context clearly indicates only a singular element. As used herein, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. It should be understood that the term "and / or" as used herein encompasses any and all possible combinations of one or more of the listed items. The terms "include," "have," "comprise," and the like used in this disclosure are intended to specify only the presence of a feature, component, part, or combination thereof described in this disclosure, and the use of these terms does not exclude the possibility of the presence or addition of one or more other features, components, parts, or combinations thereof. The expressions "first," "second," and the like used in this disclosure can modify various components regardless of order and / or importance, and are only used to distinguish one component from another, without limiting the components.

[0170] The expression "configured to" used in the present disclosure can be appropriately used interchangeably with, for example, "suitable for," "capable of," "designed to," "modified to," "made to," or "capable of." The term "configured to" may not necessarily mean only something "specially designed" in terms of hardware. Instead, in some situations, the expression "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a device configured (or set) to perform A, B, and C" may mean a dedicated device for performing the corresponding operations, or a general-purpose device that can perform various operations including the corresponding operations.

[0171] Meanwhile, the terms “upper side,” “lower side,” and “front-rear direction” used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0172] Although the foregoing description in this disclosure has focused on specific embodiments, it should be understood that this disclosure is not limited to such specific embodiments, but rather encompasses various modifications, equivalents, and / or alternatives of the various embodiments.

Claims

1. In the display assembly, Display panel (540); A polymer layer (550) disposed on the back surface of the above display panel (540); A flexible circuit board (520) electrically connected to the display panel (540) and having a portion disposed on the outer edge of the display panel (540); A display driving chip (521) mounted on the above flexible circuit board (520); and It includes a resin layer (530) configured to surround the above flexible circuit board (520), The above polymer layer (550) is A first inclined surface (551) comprising a plane or curved surface having at least a portion of an edge forming a substantially obtuse angle with respect to the back surface of the display panel (540), Display assembly.

2. In paragraph 1, The above first slope (551) is A display assembly formed so that the inclination decreases as it moves away from the display panel (540).

3. In paragraph 1 or 2, It further includes a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly with respect to the polymer layer (550). The above metal layer (560) is At least a portion of the edge comprises a second inclined surface (561) that is planar or curved and forms a substantially obtuse angle with respect to the back surface of the polymer layer (550); The average slope of the second slope (561) is greater than the average slope of the first slope (551). Display assembly.

4. In paragraph 3, The above second slope (561) is A display assembly having a protruding shape facing outward of the metal layer (560).

5. In paragraph 3, The above second slope (561) is A display assembly having a pattern shape in which protrusions and concave portions are alternately arranged along the edge of the metal layer (560).

6. In one of paragraphs 1 to 5, The above first slope (551) is Some of them are positioned so as to overlap the longitudinal end of the resin layer (530), A display assembly, wherein another part is formed in an area within a predetermined distance from a longitudinal end of the resin layer (530).

7. In paragraph 1 or 2, A metal layer (560) is further included, which is arranged on the back surface of the polymer layer (550) and has an edge stepped inwardly relative to the polymer layer (550). The above metal layer (560) is A display assembly, wherein at least a portion of an edge has a recessed shape facing outwardly of the metal layer (560).

8. In one of paragraphs 1 to 7, The above resin layer (530) is A first resin layer covering the above flexible circuit board (520) and A display assembly comprising a second resin layer surrounding at least a portion of the first resin layer and having a hardness higher than that of the first resin layer.

9. In electronic devices, Housing; and It includes a display assembly (500) placed on the housing, The above display assembly (500) is Display panel (540); A polymer layer (550) disposed on the back surface of the above display panel (540); A flexible circuit board (520) electrically connected to the display panel (540) and having a portion disposed on the outer edge of the display panel (540); A display driving chip (521) mounted on the above flexible circuit board (520); and It includes a resin layer (530) configured to surround the above flexible circuit board (520), The above polymer layer (550) is A first inclined surface (551) comprising a plane or curved surface having at least a portion of an edge forming a substantially obtuse angle with respect to the back surface of the display panel (540), Electronic devices.

10. In paragraph 9, The above first slope (551) is An electronic device formed so that the slope decreases as it goes upward.

11. In clause 9 or 10, The above display assembly (500) is It further includes a metal layer (560) disposed on the back surface of the polymer layer (550) and having an edge stepped inwardly with respect to the polymer layer (550). The above metal layer (560) is It includes a second inclined surface (561) of a plane or curved surface formed so that at least a part of the edge is inclined in the direction of the outer surface of the plane of the metal layer (560) along the direction of the polymer layer (550), An electronic device wherein the average slope of the second inclined surface (561) is greater than the average slope of the first inclined surface (551).

12. In paragraph 11, The above second slope (561) is An electronic device having a protruding shape facing outward of the metal layer (560).

13. In one of the clauses 9 to 12, The above first slope (551) is A portion is positioned so as to overlap the longitudinal end of the resin layer (530), Another part is formed in an area within a predetermined distance from the longitudinal end of the resin layer (530). Electronic devices.

14. In paragraph 9 or 10, The above display assembly (500) is A metal layer (560) is further included, which is arranged on the back surface of the polymer layer (550) and has an edge stepped inwardly relative to the polymer layer (550). The above metal layer (560) is An electronic device having a protruding shape with at least a portion of an edge facing outwardly of the metal layer (560).

15. In one of the clauses 9 to 14, The above resin layer (530) is A first resin layer (530) surrounding the above flexible circuit board (520) and An electronic device comprising a second resin layer (530) that surrounds at least a portion of the first resin layer (530) and has a higher hardness than the first resin layer (530).

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