Electronic device comprising printed circuit board including thermal interface material

Abstract

An electronic device, according to one embodiment, comprises: a housing; a first printed circuit board; a second printed circuit board; an interposer forming a space between the first printed circuit board and the second printed circuit board; a first electronic component disposed on the first printed circuit board; a plurality of second electronic components disposed on the first printed circuit board and positioned in the space; and a thermal interface material (TIM) included within the space. The thermal interface material is spaced apart from at least one of the plurality of second electronic components.

Description

Electronic device comprising a printed circuit board comprising a heat transfer material

[0001] The present disclosure relates to an electronic device including a printed circuit board including a heat transfer material.

[0002] Electronic devices may include multiple electronic components to implement various functions. These electronic components may generate heat when operating by consuming power. The heat generated from these electronic components may increase their temperature, thereby degrading the functionality of the electronic device. Electronic devices may include components for dissipating the heat generated from these electronic components. For example, the electronic device may include a thermal interface material (TIM) configured to transfer heat. The heat generated from the electronic components may diffuse through the TIM.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a first printed circuit board having a first surface and a second surface opposite the first surface. The electronic device may include a second printed circuit board having a third surface facing the second surface and a fourth surface opposite the third surface, and spaced apart from the first printed circuit board. The electronic device may include an interposer disposed between the first printed circuit board and the second printed circuit board, the interposer forming a space between the first printed circuit board and the second printed circuit board. The electronic device may include a first electronic component disposed on the first surface. The electronic device may include a plurality of second electronic components disposed on the second surface and positioned within the space. The electronic device may include a thermal interface material (TIM) included within the space. The thermal interface material may be spaced apart from at least one electronic component among the plurality of second electronic components.

[0005] An electronic device is provided. The electronic device may include a display facing a first direction. The electronic device may include a housing including a first plate supporting the display and a second plate facing a second direction opposite to the first direction. The electronic device may include a first printed circuit board having a first side facing the first direction and a second side facing the second direction, and disposed within the housing. The electronic device may include a second printed circuit board having a third side facing the first direction and a fourth side facing the second direction, and spaced apart from the first printed circuit board in the second direction. The electronic device may include an interposer disposed between the first printed circuit board and the second printed circuit board, the interposer forming a space between the first printed circuit board and the second printed circuit board. The electronic device may include a first electronic component disposed on the first side. The electronic device may include a plurality of second electronic components disposed on the second side and positioned within the space. The electronic device may include a thermal interface material (TIM) contained within the space. The thermal interface material may include at least one of a recessed portion or an opening corresponding to the plurality of second electronic components, such that the thermal interface material is spaced apart from the plurality of second electronic components.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an exemplary electronic device.

[0008] Figure 3 is an exploded perspective view of an exemplary electronic device.

[0009] Figure 4 illustrates a printed circuit board according to one embodiment.

[0010] FIG. 5 is a cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 2.

[0011] Figure 6 is a flowchart showing a manufacturing process of a printed circuit board according to one embodiment.

[0012] Figures 7a, 7b, and 7c illustrate a manufacturing process of a printed circuit board according to one embodiment.

[0013] Figure 8 illustrates a manufacturing process of a printed circuit board according to one embodiment.

[0014] Figure 9 illustrates a manufacturing process of a printed circuit board according to a comparative example.

[0015] Figure 10a is a front view of the third side of the second printed circuit board.

[0016] Figure 10b schematically illustrates a printed circuit board including a heat transfer material having an opening formed therein.

[0017] Figure 10c schematically illustrates a printed circuit board including a heat transfer material having a recessed portion formed therein.

[0018] Figure 11 illustrates a heat transfer material having a shape corresponding to the outer surface of a plurality of second electronic components.

[0019] Figure 12a illustrates a printed circuit board before a heat transfer material is placed on it.

[0020] Figure 12b illustrates a printed circuit board with a heat transfer material applied thereto.

[0021] Figure 12c illustrates a printed circuit board after the bonding process has been completed.

[0022] Figure 13 illustrates a manufacturing process of a printed circuit board according to one embodiment.

[0023] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] Figure 2 illustrates an exemplary electronic device.

[0047] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0048] An electronic device (101) according to one embodiment may include a substantially transparent first plate (202). According to one embodiment, the first plate (202) may form at least a portion of the first surface (200A). According to one embodiment, the first plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0049] An electronic device (101) according to one embodiment may include a substantially opaque second plate (211). According to one embodiment, the second plate (211) may form at least a portion of the second surface (200B). According to one embodiment, the second plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0050] An electronic device (101) according to one embodiment may include a side frame (218). According to one embodiment, the side frame (218) may be combined with the first plate (202) and / or the second plate (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the side frame (218) may form the entire third side (200C) of the electronic device (101). For example, the side frame (218) may form the third side (200C) of the electronic device (101) together with the first plate (202) and / or the second plate (211).

[0051] An electronic device (101) according to one embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0052] In one embodiment, at least a portion of the display (201) (e.g., the display module (160) of FIG. 1) may be visible through a first plate (202) forming a first surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the first plate (202).

[0053] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the first plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the first plate (202) may be formed to be substantially the same.

[0054] According to one embodiment, the display (201) (or the first surface (200A) of the electronic device (101)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. According to one embodiment, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the first plate (202)).

[0055] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0056] In one embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0057] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0058] According to one embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0059] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0060] According to one embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (212, 213). However, the present invention is not limited thereto.

[0061] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). In one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the first plate (202) (or, the display (201)) and the side frame (218).

[0062] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0063] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0065] According to one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0066] According to one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0067] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0068] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0069] According to one embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0070] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0071] Figure 3 is an exploded perspective view of an exemplary electronic device.

[0072] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0073] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a display (201), a first plate (202), a second plate (211), a side frame (218), a support member (243), a printed circuit board (400), a sub-printed circuit board (255), a cover plate (260), a battery (270), and / or a shield can (320).

[0074] An electronic device (101) according to one embodiment may include a side frame (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a support member (243) extending inwardly from the side frame (218). According to one embodiment, the side frame (218) and the support member (243) may be disposed between a display (201) and a second plate (211). For example, the side frame (218) may surround a space between the second plate (211) and the first plate (202) (and / or the display (201)). For example, the support member (243) may extend from the side frame (218) within the space.

[0075] In one embodiment, the support member (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the support member (243) facing one direction (e.g., +z direction), and the display (201) may be supported by the support member (243). For example, a printed circuit board (400), a battery (270), and a second camera module (212) may be disposed on the other side of the support member (243) facing the opposite direction (e.g., -z direction). For example, the printed circuit board (400), the battery (270), and the second camera module (212) may be respectively mounted in recesses defined by the side frame (218) and / or the support member (243).

[0076] According to one embodiment, the printed circuit board (400) and the battery (270) may be respectively coupled to the support member (243). For example, the printed circuit board (400) may be fixedly arranged to the support member (243) via a coupling member such as a screw. For example, the battery (270) may be fixedly arranged to the support member (243) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0077] In one embodiment, the cover plate (260) may be disposed between the printed circuit board (400) and the second plate (211). In one embodiment, the cover plate (260) may be disposed on the printed circuit board (400). For example, the cover plate (260) may be disposed on a surface of the printed circuit board (400) facing the -z direction.

[0078] In one embodiment, the cover plate (260) may at least partially overlap the printed circuit board (400) with respect to the z-axis. In one embodiment, the cover plate (260) may cover at least a portion of the printed circuit board (400). In this way, the cover plate (260) may protect the printed circuit board (400) from physical impact or prevent detachment of a connector coupled to the printed circuit board (400).

[0079] According to one embodiment, the cover plate (260) may be fixedly positioned on the printed circuit board (400) via a joining member (e.g., a screw), or may be joined to the support member (243) together with the printed circuit board (400) via the joining member.

[0080] According to one embodiment, the display (201) may be disposed between a support member (243) and a first plate (202). For example, the first plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the support member (243) may be disposed on the other side (e.g., in the -z direction).

[0081] According to one embodiment, the first plate (202) can be coupled with the display (201). For example, the first plate (202) and the display (201) can be bonded to each other through an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0082] According to one embodiment, the first plate (202) may be coupled with the side frame (218). For example, the first plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the side frame (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the first plate (202) and the side frame (218). However, the present invention is not limited to the above-described example.

[0083] According to one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on a printed circuit board (400). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the electronic device (101) may include a sub-printed circuit board (255). The printed circuit board (400) and the sub-printed circuit board (255) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0084] In one embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the printed circuit board (400) and / or the sub-printed circuit board (255).

[0085] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be disposed between a second plate (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0086] According to one embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the support member (243) such that the lens can receive external light through a portion (e.g., a camera area (237)) of the first plate (202) (e.g., the front (200A) of FIG. 2).

[0087] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the support member (243) and the second plate (211). In one embodiment, the second camera module (212) may be electrically connected to the printed circuit board (400) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the second plate (211) of the electronic device (101).

[0088] According to one embodiment, the camera area (284) may be formed on a surface of the second plate (211) (e.g., the rear surface (200B) of FIG. 2). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the second plate (211) by a predetermined height. However, the present invention is not limited thereto, and according to one embodiment, the camera area (284) may form a plane that is substantially the same as the surface of the second plate (211).

[0089] According to one embodiment, the housing (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the first plate (202), the side frame (218), and / or the second plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0090] An electronic device (101) according to one embodiment may include electronic components for implementing various functions of the electronic device (101). For example, the electronic device (101) may include a first electronic component (440) disposed on a printed circuit board (400). For example, the first electronic component (440) may include an AP (application processor) for controlling the overall operation of the electronic device (101), but is not limited thereto.

[0091] According to one embodiment, the printed circuit board (400) may be a laminated board. The printed circuit board (400) may include a first printed circuit board (410), a second printed circuit board (420), and an interposer (430). A plurality of second electronic components (450) may be positioned within an internal space formed by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430). For example, the first electronic components (440) may be exposed to the outside of the printed circuit board (400), and the plurality of second electronic components (450) may be positioned within the printed circuit board (400). The first electronic components (440) may be disposed on a surface of the printed circuit board (400) facing the display (201). The electronic device (101) may include a first shield can (471) for covering the first electronic component (440). According to one embodiment, the first shield can (471) may include an opening (471a) facing the AP.

[0092] An electronic device (101) according to one embodiment may include a thermal interface material (TIM, thermal interface material) (e.g., a thermal interface material (510) of FIG. 4). For example, the thermal interface material (510) may include a polymer composite material, a thermally conductive filler, and a dispersant. The thermally conductive filler may be referred to as a heat dissipation particle. For example, the thermally conductive filler may include at least one of aluminum oxide (Al2O3), aluminum nitride (AlN), magnesium oxide (MgO), or boron nitride (BN).

[0093] In one embodiment, the heat transfer material (510) may include a phase change material (PCM). For example, the phase change material may include, but is not limited to, paraffin, salt hydrate, and / or polylactic acid (PLA)-based composites. For example, the heat transfer material (510) may include, but is not limited to, a matrix including rubber and a phase change material. At a glass transition temperature, the phase of the phase change material may change.

[0094] The heat transfer material (510) can suppress an increase in the internal temperature of the electronic device (101) by diffusing heat. As the number of electronic components integrated into the printed circuit board (400) increases to implement various functions of the electronic device (101), more heat may be generated. For example, heat generated from the first electronic component (440) arranged to face the display (201) may be conducted toward the display (201). The heat causes a temperature increase in the first electronic component (440), and the first electronic component (440) may limit the performance of the display (201) to reduce damage caused by the temperature increase. For example, the first electronic component (440) may reduce heat generation by lowering the clock and voltage through throttling. According to one embodiment, by including a heat transfer material (510) within the internal space of the laminated substrate, a portion of the heat generated from the first electronic component (440) can be conducted toward the second plate (211). As the heat generated from the first electronic component (440) is conducted in different directions, the temperature rise of the electronic device (101) can be reduced, and the performance degradation of the display (201) can be reduced. The electronic device (101) according to one embodiment can have a structure for effectively conducting the heat generated from the first electronic component (440) toward the second plate (211). Hereinafter, the electronic device (101) according to one embodiment will be described.

[0095] Figure 4 illustrates a printed circuit board according to one embodiment.

[0096] Referring to FIG. 4, a printed circuit board (400) according to one embodiment may provide electrical connections for electronic components of an electronic device (101). For example, the printed circuit board (400) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. For example, the printed circuit board (400) may provide electrical connections for electronic components by using wires and conductive vias formed on the conductive layers.

[0097] According to one embodiment, the printed circuit board (400) may be referred to as a laminated substrate in which a plurality of printed circuit boards (400) are laminated. For example, the printed circuit board (400) may be referred to as a circuit board assembly in which a plurality of printed circuit boards (400) are laminated.

[0098] According to one embodiment, the printed circuit board (400) may include a first printed circuit board (410), a second printed circuit board (420), and an interposer (430).

[0099] In one embodiment, the second printed circuit board (420) may be spaced apart from the first printed circuit board (410). For example, the gap between the first printed circuit board (410) and the second printed circuit board (420) may be, but is not limited to, about 0.7 mm to about 0.9 mm. An interposer (430) may be disposed between the first printed circuit board (410) and the second printed circuit board (420). For example, the interposer (430) may be disposed along an edge between the first printed circuit board (410) and the second printed circuit board (420). The interposer (430) may be connected between the first printed circuit board (410) and the second printed circuit board (420). The interposer (430) may provide an electrical connection between the first printed circuit board (410) and the second printed circuit board (420). The interposer (430) can provide an electromagnetic shielding function for electronic components disposed between the first printed circuit board (410) and the second printed circuit board (420). For example, the interposer (430) can shield electromagnetic noise transmitted to electronic components disposed between the first printed circuit board (410) and the second printed circuit board (420) by including a conductive material for shielding electromagnetic waves emitted from other electronic components of the electronic device (101).

[0100] A space surrounded by a first printed circuit board (410), a second printed circuit board (420), and an interposer (430) can be formed. The space can be referred to as an internal space of the printed circuit board (400). The printed circuit board (400) having a structure in which the first printed circuit board (410) and the second printed circuit board (420) are laminated can have a high degree of integration because various electronic components can be arranged thereon.

[0101] According to one embodiment, a first electronic component (440) and a first shield can (471) may be placed on a first printed circuit board (410). For example, the first electronic component (440) may include, but is not limited to, an application processor (AP) for controlling the overall operation of the electronic device (101). For example, the AP may include a central processing unit (CPU) and / or a graphics processing unit (GPU). Since the transistors integrated inside the CPU and / or GPU perform various operations, the AP may generate a relatively large amount of heat.

[0102] According to one embodiment, a plurality of second electronic components (450) may be positioned within a space formed by a first printed circuit board (410), a second printed circuit board (420), and an interposer (430). For example, the plurality of second electronic components (450) may be disposed on a second surface (412) of the first printed circuit board (410). For example, the plurality of second electronic components (450) may be plural. The plurality of second electronic components (450) may include a power-related IC (e.g., a power management integrated circuit (PMIC)) and passive components (e.g., a resistor, an inductor, a capacitor).

[0103] In one embodiment, a heat transfer material (510) may be included within the space. By filling at least a portion of the space with the heat transfer material (510), heat generated from the first electronic component (440) and / or the plurality of second electronic components (450) may be diffused through the heat transfer material (510). The heat transfer material (510) may be placed within the space during the process of manufacturing the printed circuit board (400).

[0104] According to one embodiment, a third electronic component (e.g., the third electronic component (460) of FIG. 5) and a second shield can (472) may be placed on a second printed circuit board (420). For example, the third electronic component (460) may include an RF (radio frequency) module (e.g., an RF transceiver). The second shield can (472) may cover the third electronic component (460) to shield electromagnetic waves generated when the third electronic component (460) operates. For example, the third electronic component (460) may be covered to prevent electromagnetic waves emitted from the third electronic component (460) from affecting other electronic components, or to prevent electromagnetic waves emitted from other electronic components from affecting the third electronic component (460). Since the third electronic component (460) is covered by the second shield can (472), interference by the electromagnetic waves can be reduced.

[0105] Hereinafter, a structure for placing a heat transfer material (510) in the internal space of the printed circuit board (400) is described with reference to the internal structure of the printed circuit board (400) and the structure of the housing (210) of the electronic device (101).

[0106] FIG. 5 is a cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 2.

[0107] Referring to FIG. 5, the electronic device (101) may include a display (201) and a housing (210).

[0108] According to one embodiment, the display (201) may be configured to display visual information. The display (201) may form at least a portion of the front surface of the electronic device (101) so that the visual information may be displayed by controlling pixels and the displayed visual information may be conveyed to the user. For example, a portion of the front surface of the electronic device (101) may be formed by the display (201). The display (201) may be arranged to face the exterior of the electronic device (101). Within the present disclosure, the direction in which the display (201) faces may be referred to as a first direction, and the second direction may be referred to as a direction opposite to the first direction.

[0109] According to one embodiment, the housing (210) may form at least a portion of the exterior of the electronic device (101). For example, the housing (210) may include a first plate (202), a second plate (211), and a side frame (218). At least a portion of the first plate (202) may support the display (201). The first plate (202) may face a first direction. The first plate (202) facing the first direction may refer to a direction in which an outer surface of the first plate (202) faces substantially corresponds to the first direction. The first plate (202) may be referred to as a front plate or a front cover in that it forms the front of the housing (210). The second plate (211) may form at least a portion of the back surface of the electronic device (101). The second plate (211) may form at least a portion of the back surface of the electronic device (101). For example, at least a portion of the second plate (211) may be opposite the display (201) forming at least a portion of the front surface of the electronic device (101). The second plate (211) may face a second direction. The second plate (211) facing the second direction may be referred to as a direction in which an outer surface of the second plate (211) faces substantially corresponding to the second direction. The second plate (211) may be referred to as a rear plate or rear cover in that it forms the rear surface of the housing (210). The side frame (218) may be disposed between the first plate (202) and the second plate (211) to form an internal space of the housing (210). The side frame (218) may be formed integrally with the first plate (202) and / or the second plate (211).

[0110] According to one embodiment, components of the electronic device (101) may be disposed inside the housing (210). For example, a camera, a printed circuit board (400), a first electronic component (440), a plurality of second electronic components (450), and / or a third electronic component (460) may be disposed inside the housing (210).

[0111] According to one embodiment, the printed circuit board (400) may be a laminated board and include a first printed circuit board (410), a second printed circuit board (420), and an interposer (430). According to one embodiment, the first printed circuit board (410) may include a first side (411) and a second side (412). For example, the first side (411) may be a side of the first printed circuit board (410) facing a first direction. For example, the second side (412) may be a side of the first printed circuit board (410) facing a second direction. The second side (412) may be opposite to the first side (411). The first electronic component (440) may be electrically connected to the first printed circuit board (410) by being disposed on the first side (411). A plurality of second electronic components (450) may be electrically connected to the first printed circuit board (410) by being disposed on the second surface (412). The plurality of second electronic components (450) may be positioned within a space between the first printed circuit board (410) and the second printed circuit board (420). For example, the first electronic component (440) may include, but is not limited to, at least one of an AP, a universal flash storage (UFS), or a socket. For example, the plurality of second electronic components (450) may include, but are not limited to, a passive component.

[0112] According to one embodiment, the second printed circuit board (420) may be spaced apart from the first printed circuit board (410) in a second direction. The second printed circuit board (420) may be electrically connected to the first printed circuit board (410) via an interposer (430). The height of the interposer (430) may be about 0.8 mm, but is not limited thereto.

[0113] According to one embodiment, the second printed circuit board (420) may include a third side (421) and a fourth side (422). For example, the third side (421) may be a side of the second printed circuit board (420) facing the first direction. For example, the fourth side (422) may be a side of the second printed circuit board (420) facing the second direction. The fourth side (422) may be opposite to the third side (421). The third electronic component (460) may be electrically connected to the second printed circuit board (420) by being disposed on the fourth side (422). For example, the third electronic component (460) may include, but is not limited to, at least one of an RF module or a connector.

[0114] According to one embodiment, the first shield can (471) may be disposed on the first surface (411) of the first printed circuit board (410). The first shield can (471) may cover at least a portion of the first electronic component (440) disposed on the first surface (411). According to one embodiment, the first shield can (471) may include an opening (471a) facing the AP. For example, when the first shield can (471) is viewed from above, the opening (471a) and the first electronic component (440) may at least partially overlap. The opening (471a) may provide a path (e.g., a first heat transfer path) through which heat generated from the first electronic component (440) is discharged to the outside of the first shield can (471). If the first shield can (471) does not include the opening (471a), the heat generated from the first electronic component (440) may not be discharged to the outside of the first shield can (471) and may remain inside the first shield can (471). If the heat remains inside the first shield can (471), a temperature increase of the first electronic component (440) may occur. The opening (471a) may provide a first heat transfer path so that the heat generated from the first electronic component (440) can be substantially transferred in the first direction. Another heat transfer material (520a) may be disposed on the upper surface of the AP so that the heat generated from the first electronic component (440) can be transferred. A shielding sheet (540) may be disposed to cover the opening (471a) to block electromagnetic waves. A heat transfer material (520b) may be additionally placed between the shielding sheet (540) and the first plate (201).

[0115] When heat generated from the first electronic component (440) (e.g., AP) is transferred along the first heat transfer path facing the first direction, a temperature increase may occur in the display (201) positioned in the first direction with respect to the first electronic component (440). To reduce damage caused by the temperature increase, the clock of the GPU may be reduced. For example, when the temperature of the display (201) exceeds a critical temperature, the clock of the GPU may be reduced, thereby degrading the quality of visual information displayed on the display (201).

[0116] According to one embodiment, a heat transfer material (510) may be included in a space between a first printed circuit board (410) and a second printed circuit board (420), thereby forming a second heat transfer path through which heat generated from a first electronic component (440) (e.g., AP) is transferred in a second direction. For example, since the first electronic component (440) is in contact with the first printed circuit board (410), heat generated from the first electronic component (440) may be transferred to the first printed circuit board (410). As the heat transfer material (510) included in the space is in contact with the first printed circuit board (410), the heat may be transferred in the second direction by the heat transfer material (510). According to one embodiment, the heat transfer material (510) may form a second heat transfer path through which heat generated from the first electronic component (440) is transferred in the second direction. According to one embodiment, since the heat generated from the first electronic component (440) can spread along the first heat transfer path and the second heat transfer path, the heat can be spread relatively evenly without being concentrated in a specific area. According to one embodiment, the heat dissipation effect of the first electronic component (440) can be enhanced, and performance degradation of the first electronic component (440) (e.g., AP) can be reduced. For example, when the first electronic component (440) is in operation, the time for the temperature of the display (201) to reach a critical temperature is delayed, thereby improving the performance of the display (201).

[0117] According to one embodiment, the heat transfer material (510) may include a phase change material. The heat transfer material (510) including the phase change material may be disposed in a solid phase during the manufacturing process of the printed circuit board (400). For example, after the solid-phase heat transfer material (510) is disposed on the second printed circuit board (420), a hot press process may be performed. In order to change the phase change material included in the heat transfer material (510), the hot press process may be performed at a temperature higher than the glass transition temperature of the phase change material. Through the hot press process, the phase change material included in the heat transfer material (510) may be changed into a semi-solid (or quasi-solid) phase (e.g., gel). As the phase change material changes into a semi-solid phase with fluidity, at least a portion of the heat transfer material (510) may diffuse into the internal space of the printed circuit board (400).

[0118] In one embodiment, the phase change material can absorb useful enthalpy when changing phase from a solid phase to a liquid phase or a semi-solid phase. When heat is generated from the first electronic component (440) and / or the plurality of second electronic components (450), the phase change material can reach a melting point by absorbing the heat. The phase change material can absorb thermal energy corresponding to the melting enthalpy by changing phase at the melting point. As the phase change material absorbs the heat generated from the first electronic component (440) and / or the plurality of second electronic components (450), the heat dissipation effect can be enhanced. In terms of including the phase change material, the heat transfer material (510) can be referred to as a heat-responsive heat transfer material.

[0119] According to one embodiment, the heat transfer material (510) may be disposed in a space within the printed circuit board (400) during the SMD (surface mount technology) process of the printed circuit board (400). For example, when the heat transfer material (510) is injected by inserting a nozzle into the second printed circuit board (420), openings (e.g., injection holes, inspection holes) for injecting the heat transfer material (510) and members (e.g., sealing members, films) for reducing leakage of the heat transfer material (510) during injection may be required. Since a separate process is required to form the openings, the manufacturing process of the printed circuit board (400) may become complicated and the manufacturing time may increase. In order to place the members, the mounting space within the electronic device (101) may be insufficient. When the heat transfer material (510) includes a phase change material, the particle size of the phase change material must be smaller than the gap between the plurality of second electronic components (450), so it may be difficult to design the heat transfer material (510) to overlap the plurality of second electronic components (450). The heat transfer effect may be reduced by reducing the contact area between the phase change material and the plurality of second electronic components (450) due to a difference in thickness of the plurality of second electronic components (450) or warpage of the printed circuit board (400). When a solid-phase heat transfer material (510) of the pad type is used, it may be difficult to attach the heat transfer material (510) on the printed circuit board (400), and since the temperature of the bonding process of the printed circuit board (400) must be lower than the vaporization temperature of the phase change material (e.g., about 120°C), if the bonding process is performed at a conventional soldering temperature (e.g., about 200°C to about 250°C), a problem of the phase change material vaporizing may occur.

[0120] According to one embodiment, a heat transfer material (510) is disposed during a bonding process of a printed circuit board (400), and the heat transfer material (510) is diffused into the internal space of the printed circuit board (400) by utilizing a phase change at a reflow process temperature, thereby manufacturing the printed circuit board (400). When the first printed circuit board (410) is bonded to the second printed circuit board (420), the heat transfer material (510) overlapped within the space is pressed by utilizing the weight of the first electronic component (440), and the heat transfer material (510) is diffused during the reflow process, thereby enhancing the heat dissipation effect. Hereinafter, a manufacturing process of the printed circuit board (400) will be described.

[0121] Figure 6 is a flowchart illustrating a manufacturing process of a printed circuit board according to one embodiment. Figures 7a, 7b, and 7c illustrate a manufacturing process of a printed circuit board according to one embodiment.

[0122] Referring to FIG. 6, in operation 601, a heat transfer material (510) may be placed on a second printed circuit board (420).

[0123] Referring to FIG. 7A, the heat transfer material (510) may be placed on the third side (421) of the second printed circuit board (420). For example, the heat transfer material (510) may be picked up by a pickup device and placed on the third side (421). The heat transfer material (510) may be a pad type and may be in a solid state before the bonding process.

[0124] According to one embodiment, the pickup device can move the heat transfer material (510) while absorbing or mounting the heat transfer material (510) and place it on the third side (421) of the second printed circuit board (420). The heat transfer material (510) can be rigid so that it can be picked up by the pickup device. If the heat transfer material (510) is soft, it is difficult to move by the pickup device and may cause bending or damage. The heat transfer material (510) can be manufactured by a molten casting method of high molecular weight paraffin wax. For example, a liquid or semi-solid heat transfer material (510) can be formed into a certain shape through a mold and, after being hardened, can be moved by the pickup device. The heat transfer material (510) can be placed on the third side (421) of the second printed circuit board (420) by having rigidity through a molten casting method.

[0125] In one embodiment, the heat transfer material (510) can be attached to at least one adhesive layer (530) attached to the third surface (421). For example, the at least one adhesive layer (530) can include a first adhesive layer (531) and a second adhesive layer (532). The first adhesive layer (531) can be attached to the third surface (421), and the second adhesive layer (532) can be interposed between the first adhesive layer (531) and the heat transfer material (510). For example, when the heat transfer material (510) is disposed on the third surface (421), the first adhesive layer (531) can reduce distortion of the heat transfer material (510) and secure the heat transfer material (510) so that it does not move during the bonding process. For example, the first adhesive layer (531) can include, but is not limited to, acrylic. For example, the second adhesive layer (532) may be attached to each of the heat transfer material (510) and the first adhesive layer (531), thereby fixing the heat transfer material (510) onto the first adhesive layer (531). For example, the second adhesive layer (532) may be referred to as a hot melt layer. As described below, during the bonding process, the second adhesive layer (532) may be vaporized.

[0126] In one embodiment, the heat transfer material (510) may include a matrix (511) comprising rubber and a thermally conductive filler (512). For example, the heat transfer material (510) may include, but is not limited to, about 80 wt% of the thermally conductive filler (512), about 12 wt% of the matrix (511) comprising rubber, about 4 wt% of the phase change material, and about 4 wt% of the additive. For example, a pure phase change material may cause a rapid weight change and vaporization by a one-step phase change. By including the matrix (511) comprising rubber in the heat transfer material (510), a sequential weight change and vaporization may be caused by the attractive force between the rubber and the phase change material. For example, when the phase change material undergoes a phase change, a two-step phase change may be caused, thereby reducing a rapid change in physical properties. For example, rubber may contain SEBS (styrene ethylene butylene styrene). The chemical formula of SEBS is [CH2=CH(CH3)] n -[CH2-CH(CH3)-CH2] m -[CH2=CH(CH3)] n It can be, and the chemical formula of the phase change material is C 16 H 34 (hexadecane). Styrene ([CH2=CH(CH3)] contained in SEBS n ) can provide stability to the semi-solid phase heat transfer material (510) as a rigid domain. Ethylene and butylene ([CH2-CH(CH3)-CH2] contained in SEBS m -[CH2=CH(CH3)] n ) is a soft domain and has a chemical structure similar to that of the heat transfer material (510), so it can provide an attractive force between the heat transfer material (510) and SEBS.

[0127] In operation 603, a first printed circuit board (410) may be placed on top of a second printed circuit board (420).

[0128] Referring to FIG. 7B, a first printed circuit board (410) may be placed on a second printed circuit board (420). A first electronic component (440) may be placed on a first surface (411) of the first printed circuit board (410). Since the first electronic component (440) has a relatively large size, it may cause an increase in the weight of the first printed circuit board (410). An interposer (430) may be bonded to a second surface (412) of the first printed circuit board (410). A solder paste (470) for bonding the interposer (430) may be placed on a third surface (421) of the second printed circuit board (420).

[0129] According to one embodiment, a plurality of second electronic components (450) may be disposed on the second surface (412). When the first printed circuit board (410) is disposed on top of the second printed circuit board (420), the plurality of second electronic components (450) may protrude from the second surface (412) toward the third surface (421). According to one embodiment, the heat transfer material (510) may overlap at least one of the plurality of second electronic components (450). The overlapping structure is described below with reference to FIGS. 12A, 12B, and 12C.

[0130] In operation 605, bonding between the first printed circuit board (410) and the second printed circuit board (420) can be performed.

[0131] Referring to FIG. 7c, the first printed circuit board (410) and the second printed circuit board (420) can be joined by soldering the interposer (430) to the solder paste (470). A reflow process for joining can be performed. In the reflow process, high-temperature thermal energy is provided, thereby joining the first printed circuit board (410) and the second printed circuit board (420). The reflow process may include, but is not limited to, a preheating operation in which the printed circuit board (400) is preheated in an oven, a heating operation in which the solder paste (470) is heated to a melting temperature after the preheating, a melting operation in which the solder paste (470) is melted at the melting temperature of the solder paste (470) to thereby bond the first printed circuit board (410) and the second printed circuit board (420), and a cooling operation in which the solder paste (470) is solidified. For example, the preheating operation may be performed at about 100° C. to about 150° C., and the heating operation may be performed at about 170° C. to about 240° C. Since the temperature is higher than the glass transition temperature of the phase change material, the phase change material included in the heat transfer material (510) may be phase-changed from a solid phase to a semi-solid phase or a liquid phase. A semi-solid or liquid phase heat transfer material (510) can be brought into contact with a plurality of second electronic components (450) by penetrating between the plurality of second electronic components (450).

[0132] As described above, the heat transfer material (510) may be pressed by the plurality of second electronic components (450) because it overlaps with at least one of the plurality of second electronic components (450). Since the first electronic component (440) is disposed on the first surface (411) of the first printed circuit board (410), the plurality of second electronic components (450) may pressurize the heat transfer material (510) in a semi-solid or liquid phase by the weight of the first printed circuit board (410). By the pressing, the heat transfer material (510) may spread between the plurality of second electronic components (450). Since the weight of the first printed circuit board (410) by the first electronic component (440) may increase, a separate member (e.g., a weight, a jig) for pressing the heat transfer material (510) may not be required.

[0133] According to one embodiment, the size of the first printed circuit board (410) on which the first electronic component (440) is arranged may be smaller than the size of the second printed circuit board (420). The bonding process of the printed circuit board (400) is a process of bonding a sub-board (or secondary board) to a main board (or master board), and the first printed circuit board (410) on which the first electronic component (440) is arranged may be referred to as a sub-board, and the second printed circuit board (420) may be referred to as a main board. When the first electronic component (440) is arranged on the main board, a separate member for pressurizing the heat transfer material (510) may be required. According to one embodiment, the weight of the first electronic component (440) may be used to cause a relatively small weight increase of the first printed circuit board (410), so that the manufacturing equipment and manufacturing process of the printed circuit board (400) may be simplified.

[0134] Fig. 8 illustrates a manufacturing process of a printed circuit board according to one embodiment. Fig. 9 illustrates a manufacturing process of a printed circuit board according to a comparative example.

[0135] Figures 8 and 9 illustrate a two-sided mounting structure or a three-sided mounting structure in which electronic components are arranged on the first side (411), the second side (412), and / or the fourth side (422). The process illustrated in Figure 8 may be substantially the same as the processes illustrated in Figures 7a, 7b, and 7c.

[0136] A first state (801) of FIG. 8 illustrates a state of a printed circuit board (400) according to one embodiment before a heat transfer material (510) is disposed. Referring to FIG. 8, in a printed circuit board (400) according to one embodiment, a first electronic component (440) may be disposed on a first surface (411) of a first printed circuit board (410) having a relatively small size. For electrical connection with the first printed circuit board (410) through the first printed circuit board (410), a plurality of second electronic components (450) may be disposed on a second surface (412) of the first printed circuit board (410). A third electronic component (460) may be disposed on a fourth surface (422) of a second printed circuit board (420) having a relatively large size. The third electronic component (460) may be omitted. In the case of a two-sided mounting structure, electronic components may not be placed on the third side (421).

[0137] A second state (802) of FIG. 8 illustrates a state of a printed circuit board (400) according to one embodiment, in which a heat transfer material (510) is disposed. The solid heat transfer material (510) may be disposed on a third surface (421) of a second printed circuit board (420). The heat transfer material (510) may be disposed on an area of ​​the third surface (421) facing a plurality of second electronic components (450) so as to be in contact with the plurality of second electronic components (450). As described above, the heat transfer material (510) may include a matrix including a phase change material and rubber. Since no electronic components are disposed on the third surface (421), a solder paste (470) for electrical connection of the electronic components may not be disposed on the area of ​​the third surface (421) facing the plurality of second electronic components (450).

[0138] A third state (803) of FIG. 8 illustrates a state of a printed circuit board (400) according to one embodiment after a bonding process is performed. As the bonding process is performed, the solder paste (470) is melted, so that the interposer (430) and the second printed circuit board (420) can be bonded. The heat transfer material (510) can penetrate between the plurality of second electronic components (450) by changing its phase from a solid phase to a semi-solid phase or a liquid phase. The plurality of second electronic components (450) can pressurize the heat transfer material (510). When the heat transfer material (510) is pressurized, the solder paste (470) may not be pressurized because the solder paste (470) is not present under the heat transfer material (510).

[0139] Referring to FIG. 9, a printed circuit board (900) according to a comparative example may have a first electronic component (940) placed on a second printed circuit board (920) having a relatively large size.

[0140] A first state (901) of FIG. 9 illustrates a state of a printed circuit board (900) according to a comparative example before a heat transfer material (904) is disposed. Referring to FIG. 9, in a printed circuit board (900) according to a comparative example, a first electronic component (940) may be disposed on a fourth surface (922) of a second printed circuit board (920) having a relatively large size. For electrical connection with the first printed circuit board (910) through the printed circuit board (900), a plurality of second electronic components (950) may be connected to a third surface (921) of the second printed circuit board (920). A third electronic component (960) may be disposed on the first surface (911) of the first printed circuit board (910) having a relatively small size. In the case of a two-surface mounting structure, the third electronic component (960) may be omitted.

[0141] A second state (902) of FIG. 9 illustrates a state of a printed circuit board (900) according to a comparative example, on which a heat transfer material (904) is disposed. A plurality of second electronic components (950) may be connected on a second surface (912). The second printed circuit board (920) may include solder paste (970) corresponding to the plurality of second electronic components (950) for electrical connection with the plurality of second electronic components (950). The solder paste (970) may be disposed on a third surface (921). A solid-phase heat transfer material (904) may be disposed on the plurality of second electronic components (950) disposed on the third surface (921).

[0142] The third state (903) of FIG. 9 illustrates the state of the printed circuit board (900) according to the comparative example after the bonding process is performed. The first printed circuit board (910) can pressurize a heat transfer material (904) placed on a plurality of second electronic components (950). By the pressurization, the solder paste (970) for electrical connection of the plurality of second electronic components (950) can be pressurized. As the solder paste (970) is pressurized, a short circuit may occur. The overcurrent caused by the short circuit may cause heat generation in the electronic components, thereby causing damage or malfunction of the electronic device (101).

[0143] According to one embodiment, a structure in which the first electronic component (440) is placed on the first printed circuit board (410) can prevent a short circuit due to pressurization of the solder paste (470). As illustrated in FIG. 8, when a plurality of second electronic components (450) pressurize the heat transfer material (510), a short circuit may not occur because the solder paste (470) does not exist under the heat transfer material (510).

[0144] Figure 10a is a front view of the third side of the second printed circuit board. Figure 10b schematically illustrates a printed circuit board including a thermal transfer material having an opening formed therein. Figure 10c schematically illustrates a printed circuit board including a thermal transfer material having a recessed portion formed therein.

[0145] According to one embodiment, a plurality of second electronic components (e.g., a plurality of second electronic components (450) of FIG. 8) disposed on a second surface (e.g., a second surface (412) of FIG. 8) of a first printed circuit board (e.g., a first printed circuit board (410) of FIG. 8) may be passive components. For example, the passive components may be, but are not limited to, capacitors and / or inductors included in a FEMid (front end module including duplexers), a PAMid (power amplifier (PA) and FEMid), and / or a LPAMid (low noise amplifier (LNA) and PAMid). When the passive components operate, the passive components may vibrate. For example, since a capacitor is a component having electric capacity and stores charge, when voltage is applied or current flows, the capacitor may vibrate.

[0146] According to one embodiment, in order to diffuse heat generated from a plurality of second electronic components (450), a heat transfer material (510) may be in contact with the plurality of second electronic components (450). When the plurality of second electronic components (450) vibrate while the heat transfer material (510) is in contact with the plurality of second electronic components, noise may be caused by repeated contact between the heat transfer material (510) and the plurality of second electronic components (450). The noise may reduce the audio quality of the electronic device (101). For example, the electronic device (101) may include a speaker. The speaker may generate an audio signal based on the vibration of a diaphragm. An audio signal provided from a speaker inside the electronic device may be provided to the outside of the electronic device (101) through an audio duct. When noise is generated when a plurality of second electronic components (450) vibrate, the audio signal provided through the audio duct may be distorted, or the quality of the audio signal may deteriorate as the audio signal is provided together with the noise.

[0147] In one embodiment, the heat transfer material (510) may be spaced from at least one electronic component among the plurality of second electronic components (450) that generates vibration to reduce degradation of the quality of the audio signal. For example, the heat transfer material (510) may not be in contact with at least one electronic component among the plurality of second electronic components (450).

[0148] Referring to FIG. 10A, the heat transfer material (510) may be separated into a plurality of portions so as not to come into contact with at least one of the plurality of second electronic components (450). For example, the heat transfer material (510) may include a first portion (510a) and a second portion (510b). The second portion (510b) may be spaced apart from the first portion (510a). The heat transfer material (510) may come into contact with at least a portion of an area (1001) on a third surface (421) that overlaps an area on a first surface (411) where the first electronic component (440) is disposed, in order to diffuse heat generated from the first electronic component (440). For example, the first electronic component (440) may include an AP including a CPU and a GPU. The CPU and the GPU may be implemented as logically distinct circuits within the AP. Since a lot of heat is generated from the CPU and GPU, the heat transfer material (510) can be in contact with at least a portion of an area (1002) on the third surface (421) corresponding to the CPU and an area (1003) on the third surface (421) corresponding to the GPU. The spaced portion between the first portion (510a) and the second portion (510b) can correspond to an electronic component that generates vibration during operation among the plurality of second electronic components (450). Since the heat transfer material (510) is separated into a plurality of portions (e.g., the first portion (510a) and the second portion (510b)), and the space between the plurality of portions corresponds to an electronic component that generates vibration among the plurality of second electronic components (450), the heat transfer material (510) can be spaced apart from the electronic component that generates vibration. Since the heat transfer material (510) is separated from the electronic component, even if the electronic component vibrates, noise caused by contact between the heat transfer material (510) and the electronic component can be reduced. As the noise is reduced, deterioration of the audio signal provided from the electronic device (101) can be reduced.

[0149] According to one embodiment, the heat transfer material (510) may include an opening (513). The opening (513) may correspond to an electronic component that generates vibration among the second electronic components (450). For example, when it is difficult for the heat transfer material (510) to be separated from the electronic component, the opening (513) may be formed by removing a portion of the heat transfer material (510) that overlaps the electronic component. The electronic component may be positioned within the opening (513). Referring to FIG. 10B, the opening (513) may be formed by removing a portion of the heat transfer material (510). The opening (513) may correspond to each of the plurality of second electronic components (450), or may correspond to at least one electronic component that generates vibration among the plurality of second electronic components (450). At least one of the plurality of second electronic components (450) may be disposed within the opening (513) so as not to come into contact with the heat transfer material (510). Since the heat transfer material (510) is separated from the electronic component through the opening (513), even if the electronic component vibrates, noise caused by contact between the heat transfer material (510) and the electronic component may be reduced. As the noise is reduced, deterioration of an audio signal provided from the electronic device (101) may be reduced.

[0150] Referring to FIG. 10C, the heat transfer material (510) may include a recessed portion (514) to be spaced apart from the plurality of second electronic components (450). For example, the recessed portion (514) may correspond to each of the plurality of second electronic components (450) or may correspond to an electronic component that generates vibration among the plurality of second electronic components (450). The plurality of second electronic components (450) may be spaced apart from the heat transfer material (510) by the recessed portion (514) without coming into contact with the heat transfer material (510). Since the heat transfer material (510) is spaced apart from the electronic component through the recessed portion (514), even if the electronic component vibrates, noise caused by contact between the heat transfer material (510) and the electronic component may be reduced. As the noise is reduced, deterioration of an audio signal provided from the electronic device (101) may be reduced.

[0151] Figure 11 illustrates a heat transfer material having a shape corresponding to the outer surface of a plurality of second electronic components.

[0152] Referring to FIG. 11, each of the plurality of second electronic components (450) may have a different thickness. For example, the thicknesses of the plurality of second electronic components (450) may not be constant and may be independent. The plurality of second electronic components (450) disposed on the second surface (412) may be positioned within a space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430).

[0153] According to one embodiment, the heat transfer material (510) may be manufactured in a shape corresponding to the outer surfaces of the plurality of second electronic components (450). For example, in the case of a four-sided mounting structure, the fourth electronic component (1110) may be placed on the third surface (421) of the second printed circuit board (420). When the thicknesses of each of the plurality of second electronic components (450) are different, a step may be formed on the outer surfaces of the plurality of second electronic components (450).

[0154] According to one embodiment, the heat transfer material (510) may be manufactured in a shape corresponding to the outer surfaces of the second electronic components (450) in order to increase the contact area with the plurality of second electronic components (450). For example, the outer surface of the heat transfer material (510) facing the plurality of second electronic components (450) may correspond to the outer surfaces of the plurality of second electronic components (450). When the heat transfer material (510) is disposed between the first printed circuit board (410) and the second printed circuit board (420), if it has a shape corresponding to the outer surfaces of the plurality of second electronic components (450), the contact area between the plurality of second electronic components (450) and the heat transfer material (510) may increase. By increasing the contact area, heat diffusion may be improved, thereby enhancing the heat dissipation effect.

[0155] Figure 12a illustrates a printed circuit board before a thermal interface material is applied. Figure 12b illustrates a printed circuit board with a thermal interface material applied. Figure 12c illustrates a printed circuit board after the bonding process is completed.

[0156] Referring to FIG. 12A, the thickness (T1) of the interposer (430) may be about 0.79 mm. The thickness (T2) of the solder paste (470) may be about 0.08 mm. The thickness (T3) of the plurality of second electronic components (450) disposed on the second surface (412) of the first printed circuit board (410) may be about 0.8 mm. The above-described numerical values ​​are merely exemplary and are not limited thereto. In order for the heat transfer material (e.g., the heat transfer material (510) of FIG. 12B) disposed between the first printed circuit board (410) and the second printed circuit board (420) to come into contact with the plurality of second electronic components (450), the thickness of the heat transfer material (510) may be about 0.07 mm (0.79 mm + 0.08 mm - 0.8 mm) or more.

[0157] Referring to FIG. 12B, the maximum thickness of the heat transfer material (510) may be greater than the minimum distance between the plurality of second electronic components (450) from the third surface (421). For example, the thickness (T1) of the interposer (430) may be about 0.79 mm, and the thickness (T2) of the solder paste (470) may be about 0.08 mm. The thickness (T4) of the heat transfer material (510) may be thicker than the distance (D) between the thickest electronic component among the plurality of second electronic components (450) and the third surface (421) when the interposer (430) and the solder paste (470) are in contact. For example, when the thickness (T3) of the thickest electronic component among the plurality of second electronic components (450) is about 0.8 mm, the thickness (T4) of the heat transfer material (510) can be in contact with the plurality of second electronic components (450) when it is about 0.07 mm (0.79 mm + 0.08 mm - 0.8 mm) or more, but the heat transfer material (510) can overlap with at least one of the plurality of second electronic components (450) by having a thickness of about 0.18 mm. If the thickness (T4) of the heat transfer material (510) exceeds about 0.18 mm (e.g., about 0.22 mm), the interposer (430) may not be properly bonded or the first printed circuit board (410) may become warped due to the repulsive force of the heat transfer material (510) during the process of bonding the first printed circuit board (410) to the second printed circuit board (420). According to one embodiment, the thickness (T5) of the heat transfer material (510) overlapping the plurality of second electronic components (450) may be limited to a thickness at which the bonding of the printed circuit board (400) is stably performed. For example, the overlapping thickness (T5) may be about 90 μm to about 130 μm, and may be less than 150 μm.

[0158] Referring to FIG. 12C, the thickness (T5) at which the heat transfer material (510) overlaps with the thickest electronic component among the plurality of second electronic components (450) may be about 0.11 mm (0.18 mm - 0.07 mm). As the heat transfer material (510) overlaps with the plurality of second electronic components (450), the plurality of second electronic components (450) may pressurize the heat transfer material (510) during the bonding process. The heat transfer material (510), which is in a semi-solid phase or a liquid phase at the temperature of the reflow process, may penetrate between the plurality of second electronic components (450) by being pressed by the plurality of second electronic components (450).

[0159] If the heat transfer material (510) is positioned too close to the interposer (430), the bonding of the interposer (430) may not be properly performed due to the repulsive force of the heat transfer material (510) pushing the first printed circuit board (410) during the bonding process, and some of the phase-changed heat transfer material (510) may leak between the first printed circuit board (410) and the second printed circuit board (420). To reduce the leakage, the heat transfer material (510) may be spaced apart from the interposer (430) or the electronic component (451) that is positioned closest to the interposer (430) among the plurality of second electronic components (450). According to one embodiment, the heat transfer material (510) may be spaced apart from the interposer (430) by a first distance (1201) or more. For example, the first distance (1201) may be, but is not limited to, about 3 mm. In one embodiment, the heat transfer material (510) may be spaced apart from the electronic component (451) that is positioned closest to the interposer (430) among the plurality of second electronic components (450) by a second distance (1202). For example, the second distance (1202) may be, but is not limited to, about 1.5 mm.

[0160] Figure 13 illustrates a manufacturing process of a printed circuit board according to one embodiment.

[0161] A first state (1301) of FIG. 13 illustrates a state of a printed circuit board (400) according to one embodiment before a heat transfer material (510) is disposed. Referring to FIG. 13, a printed circuit board (400) according to one embodiment may have a four-sided mounting structure. For example, a first electronic component (440) may be disposed on a first surface (411) of a first printed circuit board (410). A plurality of second electronic components (450) may be disposed on a second surface (412) of the first printed circuit board (410). A third electronic component (460) may be disposed on a third surface (421) of a second printed circuit board (420). A fourth electronic component (1110) may be disposed on a fourth surface (422) of the second printed circuit board (420). A plurality of second electronic components (450) and fourth electronic components (1110) can be placed in the internal space of the printed circuit board (400) surrounded by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430).

[0162] According to one embodiment, in order to reduce short circuit due to pressurization of the heat transfer material (510), the plurality of second electronic components (450) may be arranged so as to be misaligned with the fourth electronic component (1110). For example, the plurality of second electronic components (450) and the fourth electronic component (1110) may be arranged at positions that do not face each other.

[0163] A second state (1302) of FIG. 13 illustrates a state of a printed circuit board (400) according to one embodiment, on which a heat transfer material (510) is disposed. The solid heat transfer material (510) may be disposed on a third surface (421) of a second printed circuit board (420). The heat transfer material (510) may be disposed on an area of ​​the third surface (421) facing a plurality of second electronic components (450) so as to be in contact with the plurality of second electronic components (450). Since no electronic components are disposed on the third surface (421), a solder paste (470) for electrical connection of the electronic components may not be disposed on an area of ​​the third surface (421) facing the plurality of second electronic components (450).

[0164] When one of the plurality of second electronic components (450) and the fourth electronic component (1110) face each other, a short circuit may occur due to pressing of the solder paste (470). For example, the force of at least one of the plurality of second electronic components (450) pressing the heat transfer material (510) may be transmitted to the fourth electronic component (1110). By the force, the solder paste (470) for connecting the fourth electronic component (1110) to the second printed circuit board (420) may be pressed, thereby causing a short circuit.

[0165] According to one embodiment, the plurality of second electronic components (450) and the fourth electronic component (1110) are arranged so as to be misaligned with each other, so that the plurality of second electronic components (450) may not overlap with the fourth electronic component (1110). Referring to the second state (1302), even if the plurality of second electronic components (450) pressurize the heat transfer material (510), a short circuit may not occur because the solder paste (470) is not positioned under the heat transfer material (510). The heat transfer material (510) may spread between the first printed circuit board (410) and the second printed circuit board (420) by being pressed by the plurality of second electronic components (450).

[0166] A third state (1303) of FIG. 13 illustrates a state of a printed circuit board (400) according to one embodiment after a bonding process is performed. As the bonding process is performed, the solder paste (470) is melted, so that the interposer (430) and the second printed circuit board (420) can be bonded. The heat transfer material (510) can spread to the plurality of second electronic components (450) and the third electronic component (460) by changing its phase from a solid phase to a semi-solid phase or a liquid phase. When the heat transfer material (510) is pressurized, a short circuit may not occur because the solder paste (470) is not present under the heat transfer material (510). The solder paste (470) for connecting the third electronic component (460) to the second printed circuit board (420) may not be pressurized, so a short circuit may not occur. According to one embodiment, even if the fourth electronic component (1110) is placed on the third side (421) of the second printed circuit board (420), a four-side mounting structure may be possible as the plurality of second electronic components (450) and the fourth electronic component (1110) are placed out of alignment.

[0167] According to one embodiment, in order to reduce a short circuit when at least one electronic component among the plurality of second electronic components (450) and the fourth electronic component (1110) are at least partially facing each other, the heat transfer material (510) may include an opening (513) in which the at least one electronic component and the fourth electronic component (1110) are included. By positioning the at least one electronic component and the fourth electronic component (1110) within the opening (513), force may not be transmitted to the solder paste (470) through the heat transfer material (510). According to one embodiment, in order to reduce a short circuit, an electronic component having a relatively thin thickness among the plurality of second electronic components (450) may be positioned at a position facing the fourth electronic component (1110).

[0168] An electronic device (101) is provided. The electronic device (101) may include a first printed circuit board (410) including a first side (411) and a second side (412) opposite the first side (411). The electronic device (101) may include a second printed circuit board (420) including a third side (421) facing the second side (412) and a fourth side (422) opposite the third side (421), and spaced apart from the first printed circuit board (410). The electronic device (101) may include an interposer (430) disposed between the first printed circuit board (410) and the second printed circuit board (420), and forming a space between the first printed circuit board (410) and the second printed circuit board (420). The electronic device (101) may include a first electronic component (440) disposed on the first surface (411). The electronic device (101) may include a plurality of second electronic components (450) disposed on the second surface (412) and positioned within the space. The electronic device (101) may include a thermal interface material (TIM) (510) included within the space. The thermal interface material (510) may be spaced apart from at least one of the second electronic components (450).

[0169] For example, the heat transfer material (510) may include at least one of a recessed portion (514) or an opening (513) corresponding to the at least one electronic component.

[0170] For example, the heat transfer material (510) may include a first portion (510a) and a second portion (510b) spaced apart from the first portion (510a). The at least one electronic component may correspond to the space between the first portion (510a) and the second portion (510b).

[0171] For example, the at least one electronic component may include a passive element that generates vibrations when in operation. The heat transfer material (510) may be spaced from the passive element when the passive element vibrates.

[0172] For example, the size of the first printed circuit board (410) may be smaller than the size of the second printed circuit board (420).

[0173] For example, the electronic device (101) may include a display (201). The electronic device (101) may include a housing (210) including a first plate (202) supporting the display (201) and a second plate (211) opposite to the first plate (202). The printed circuit board (400) may be disposed within the housing (210). The first surface (411) may face a first direction (D1) toward the display (201). The second surface (412) may face a second direction (D2) toward the second plate (211).

[0174] For example, the heat transfer material (510) can form a heat transfer path for transferring heat emitted from the first electronic component (440) in the second direction (D2).

[0175] For example, the electronic device (101) may further include another heat transfer material (520a) disposed on the first electronic component (440). The other heat transfer material (520a) may form another heat transfer path for transferring heat emitted from the first electronic component (440) in the first direction (D1).

[0176] For example, the electronic device (101) may include a third electronic component (460) disposed on the fourth surface (422). The electronic device (101) may also include a fourth electronic component (1110) disposed on the third surface (421) and positioned within the space. The plurality of second electronic components (450) may be disposed to be misaligned with the fourth electronic component (1110).

[0177] For example, the electronic device (101) may include a third electronic component (460) disposed on the fourth surface (422). The electronic device (101) may include a fourth electronic component (1110) disposed on the third surface (421) and positioned within the space. The heat transfer material (510) may include an opening (513) formed in a portion of the space occupied by the plurality of second electronic components (450) and the fourth electronic component (1110).

[0178] For example, the heat transfer material (510) may include a phase change material.

[0179] For example, the heat transfer material (510) may be attached to at least one adhesive layer (530) attached on the third surface (421).

[0180] For example, the outer surface of the heat transfer material (510) may be formed to correspond to the outer surfaces of the plurality of second electronic components (450).

[0181] For example, the heat transfer material (510) may be spaced apart from the interposer (430) by a first distance (1201) or more.

[0182] For example, the heat transfer material (510) may be spaced apart from the electronic component (451) that is positioned closest to the interposer (430) among the plurality of second electronic components (450) by a second distance (1202) or more.

[0183] For example, the maximum thickness of the heat transfer material (510) may be greater than the minimum distance between the plurality of second electronic components (450) from the third surface (421).

[0184] An electronic device (101) is provided. The electronic device (101) may include a display (201) facing a first direction (D1). The electronic device (101) may include a housing (210) including a first plate (202) supporting the display (201) and a second plate (211) facing a second direction (D2) opposite to the first direction (D1). The electronic device (101) may include a first printed circuit board (410) disposed within the housing (210), the first printed circuit board (410) including a first surface (411) facing the first direction (D1) and a second surface (412) facing the second direction (D2). The electronic device (101) may include a third surface (421) facing the first direction (D1) and a fourth surface (422) facing the second direction (D2), and may include a second printed circuit board (420) spaced apart from the first printed circuit board (410) in the second direction (D2). The electronic device (101) may include an interposer (430) disposed between the first printed circuit board (410) and the second printed circuit board (420) and forming a space between the first printed circuit board (410) and the second printed circuit board (420). The electronic device (101) may include a first electronic component (440) disposed on the first surface (411). The electronic device (101) may include a plurality of second electronic components (450) disposed on the second surface (412) and positioned within the space. The electronic device (101) may include a thermal interface material (TIM) (510) contained within the space. The thermal interface material (510) may include at least one of a recessed portion (514) or an opening portion (513) corresponding to the plurality of second electronic components (450) so as to be spaced apart from the plurality of second electronic components (450).

[0185] For example, the size of the first printed circuit board (410) may be smaller than the size of the second printed circuit board (420).

[0186] For example, the heat transfer material (510) can form a heat transfer path for transferring heat emitted from the first electronic component (440) in the second direction (D2).

[0187] For example, the electronic device (101) may further include a fourth electronic component (1110) disposed on the third surface (421) and positioned within the space. The plurality of second electronic components (450) may be disposed to be misaligned with the fourth electronic component (1110).

[0188] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0189] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0190] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0191] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0192] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0193] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A first printed circuit board comprising a first side and a second side opposite to the first side; A second printed circuit board comprising a third side facing the second side and a fourth side opposite the third side, the second printed circuit board being spaced apart from the first printed circuit board; An interposer disposed between the first printed circuit board and the second printed circuit board and forming a space between the first printed circuit board and the second printed circuit board; A first electronic component arranged on the first surface; A plurality of second electronic components arranged on the second surface and positioned within the space; and Including a thermal interface material (TIM) contained within the above space, The above heat transfer material is, Separated from at least one of the plurality of second electronic components, Electronic devices.

2. In paragraph 1, The above heat transfer material is, comprising at least one of a recess or an opening corresponding to at least one electronic component; Electronic devices.

3. In paragraph 1 or 2, The above heat transfer material is, Part 1, and comprising a second portion spaced apart from the first portion; At least one electronic component of the above, Corresponding to the space between the first part and the second part, Electronic devices.

4. In any one of paragraphs 1 to 3, At least one electronic component of the above, Contains a passive component that generates vibration when operated; The above heat transfer material is, When the above passive element vibrates, it is separated from the above passive element, Electronic devices.

5. In any one of paragraphs 1 to 4, The size of the above first printed circuit board is: Smaller than the size of the above second printed circuit board, Electronic devices.

6. In any one of paragraphs 1 to 5, display; and Further comprising a housing including a first plate supporting the display and a second plate opposite to the first plate, The above printed circuit board, is placed within the above housing, The first side above, Facing the first direction toward the above display, The second side above, Facing the second direction toward the second plate, Electronic devices.

7. In paragraph 6, The above heat transfer material is, Forming a heat transfer path for transferring heat emitted from the first electronic component in the second direction; Electronic devices.

8. In paragraph 6 or 7, Further comprising another heat transfer material disposed on the first electronic component; The above other heat transfer materials are, Forming another heat transfer path for transferring heat emitted from the first electronic component in the first direction; Electronic devices.

9. In any one of paragraphs 1 to 8, A third electronic component arranged on the fourth surface; and Further comprising a fourth electronic component disposed on the third surface and positioned within the space, The above plurality of second electronic components are, Positioned so as to be misaligned with the above fourth electronic component, Electronic devices.

10. In any one of paragraphs 1 to 9, A third electronic component arranged on the fourth surface; and Further comprising a fourth electronic component disposed on the third surface and positioned within the space, The above heat transfer material is, Including an opening formed in a part of the space occupied by the plurality of second electronic components and the fourth electronic component. Electronic devices.

11. In any one of paragraphs 1 to 10, The above heat transfer material is, Containing a phase change material, Electronic devices.

12. In any one of paragraphs 1 to 11, The above heat transfer material is, Attached to at least one adhesive layer attached on the third surface, Electronic devices.

13. In any one of paragraphs 1 to 12, The outer surface of the above heat transfer material is, Formed to correspond to the outer surface of the above plurality of second electronic components, Electronic devices.

14. In any one of paragraphs 1 to 13, The above heat transfer material is, From the above interposer, spaced apart by a first distance or more, Electronic devices.

15. In any one of paragraphs 1 to 14, The above heat transfer material is, Among the above plurality of second electronic components, A second distance or more away from an electronic component positioned closest to the interposer, Electronic devices.

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