Optoelectronic module, appliance and method of producing an optoelectronic module

Abstract

An optoelectronic module (1) is specified, comprising an optoelectronic semiconductor chip (2) configured to emit electromagnetic radiation and comprising a radiation exit side (20), a carrier (3) arranged on a side of the optoelectronic semiconductor chip (2) that faces away from the radiation exit side (20), and a circuit board (4) with a front side (41) and a rear side (42) opposite the front side (41),wherein - electrical contacts (33) of the carrier (3) are arranged on a first main face (31) of the carrier (3) facing the optoelectronic semiconductor chip (2); - the circuit board (4) comprises a cutout (44) with a stepped side face (45), so that the circuit board (4) comprises an intermediate surface (49) extending in parallel to and spaced apart from the rear side (42) and the front side (41) of the circuit board (4); - the circuit board (4) comprises electrical terminals (43) arranged on the intermediate surface; and - the electrical contacts (33) of the carrier (3) are electrically connected to the electrical terminals (43) of the circuit board (4). Further, an appliance (10) and a method of producing an optoelectronic module (1) are specified.

Description

[0001] Description

[0002] OPTOELECTRONIC MODULE , APPLIANCE AND METHOD OF PRODUCING AN OPTOELECTRONIC MODULE

[0003] The present application relates to an optoelectronic module , to an appliance and to a method of producing an optoelectronic module .

[0004] High-power optoelectronic devices such as light-emitting diodes ( LEDs ) , LED arrays or lasers require a thermal connection to a heatsink with a very low thermal resistance . To reduce the thermal resistance , the optoelectronic devices may be mounted to a circuit board with a metal core or metal inlays . Such circuit boards , however, are very expensive .

[0005] An obj ect to be achieved is to provide a way of obtaining a connection to a heatsink with a low thermal resistance at low costs .

[0006] This obj ect is achieved inter alia by an optoelectronic module , an appliance , and a method according to the independent claims . Further configurations and developments are the subj ect of the dependent claims .

[0007] An optoelectronic module is speci fied .

[0008] According to at least one embodiment of the optoelectronic module , the optoelectronic module comprises an optoelectronic semiconductor chip configured to emit electromagnetic radiation . The semiconductor chip comprises a radiation exit side . For example , the optoelectronic semiconductor chip is configured to emit radiation in the ultraviolet , visible or infrared spectral range .

[0009] For example , the optoelectronic semiconductor chip, in particular an active region thereof , may comprise a I I I-V compound semiconductor material .

[0010] I I I-V compound semiconductor materials are particularly suitable for radiation generation in the ultraviolet (AlxInyGai-x-y N) via the visible (AlxInyGai-X-yN, in particular for blue to green radiation, or AlxInyGai-X-yP, in particular for yellow to red radiation) to the infrared (AlxInyGai-x-yAs ) spectral range . Here , 0 < x < 1 , 0 < y < 1 and x + y < 1 apply in each case , in particular with x V 1 , y V I , x V 0 and / or y V 0 . With I I I-V compound semiconductor materials , in particular from the material systems mentioned, high internal quantum ef ficiencies can be achieved in radiation generation .

[0011] For example , the optoelectronic semiconductor chip comprises a plurality of emission regions . At least some of the emission regions or groups of the emission regions may be electrically addressable independently from one another . For example , the emission regions comprise partial regions of the active region .

[0012] The optoelectronic module may also comprise more than one optoelectronic semiconductor chip .

[0013] According to at least one embodiment of the optoelectronic module , the optoelectronic module comprises a carrier arranged on a side of the optoelectronic semiconductor chip that faces away from the radiation exit side . For example , the carrier includes an electrical circuit configured to electrically contact the one or more emission regions of the optoelectronic semiconductor chip . In particular, the carrier extends laterally, i . e . in a direction parallel to the radiation exit side , beyond the optoelectronic semiconductor chip .

[0014] For example , the at least one optoelectronic semiconductor chip is soldered to the carrier . For example , two or more optoelectronic semiconductor chips are arranged laterally beside one another on the carrier .

[0015] According to at least one embodiment of the optoelectronic module , the optoelectronic module comprises a circuit board with a front side and a rear side opposite to the front side . For example , the circuit board comprises a fiber-glass- reinforced epoxy material . For example , the circuit board is a printed circuit board ( PCB ) such as an FR-4 printed circuit board .

[0016] According to at least one embodiment of the optoelectronic module , electrical contacts of the carrier are arranged on a first main face of the carrier facing the optoelectronic semiconductor chip . For example , the electrical contacts are provided for an external electrical connection of the carrier to the circuit board . In particular, the carrier may provide all the necessary electrical contacts to the circuit board on the first main face . Thus , a second main face of the carrier opposite the first main face may be completely free from electrical contacts . The number of electrical contacts may vary in wide ranges depending on the application of the optoelectronic semiconductor chip . For example , the carrier comprises at least 2 or at least 10 or at least 50 or at least 100 and / or or at most 10 , 000 or at most 1 , 000 electrical contacts to be connected to electrical terminals of the circuit board .

[0017] Further, the carrier may provide all electrical connections between the optoelectronic semiconductor chip and the circuit board . Thus , there is no direct electrical connection between the optoelectronic semiconductor chip and the circuit board that bypasses the carrier .

[0018] According to at least one embodiment of the optoelectronic module , the circuit board comprises a cutout with a stepped side face . In other words , a lateral extent of the cutout abruptly decreases at a step in a direction towards the front side . For example , the circuit board comprises an intermediate surface extending in parallel to and spaced apart from the rear side and the front side of the circuit board . The term "parallel" also includes minor deviations , for example deviations of at most 10 ° or at most 5 ° . In other words , the intermediate surface is arranged between the rear side and the front side in a cross-sectional view .

[0019] According to at least one embodiment of the optoelectronic module , the circuit board comprises electrical terminals arranged on the intermediate surface . In other words , the intermediate surface within the cutout provides electrical terminals to be connected to electrical contacts of the carrier . Thus , the electrical terminals on the intermediate surface are arranged on a side of the circuit board that faces away from the front side of the circuit board . According to at least one embodiment of the optoelectronic module , the electrical contacts of the carrier are electrically connected to the electrical terminals of the circuit board .

[0020] In at least one embodiment , an optoelectronic module comprises an optoelectronic semiconductor chip configured to emit electromagnetic radiation and comprising a radiation exit side . The optoelectronic module further comprises a carrier arranged on a side of the optoelectronic semiconductor chip that faces away from the radiation exit side , and a circuit board with a front side and a rear side opposite to the front side . Electrical contacts of the carrier are arranged on a first main face of the carrier facing the optoelectronic semiconductor chip . The circuit board comprises a cutout with a stepped side face , so that the circuit board comprises an intermediate surface extending in parallel to and spaced apart from the rear side and the front side of the circuit board . The circuit board comprises electrical terminals arranged on the intermediate surface , wherein the electrical contacts of the carrier are electrically connected to the electrical terminals of the circuit board .

[0021] By means of the cutout with the stepped side face , the optoelectronic semiconductor chip and the carrier can be electrically connected to the intermediate surface of the circuit board arranged between the front side and the rear side .

[0022] The circuit board can be arranged outside of a heat conduction path from the semiconductor chip to a heatsink . Consequently, a standard printed circuit board without any metal inlays or metal cores can be used . This helps to signi ficantly reduce the costs of the optoelectronic module .

[0023] Furthermore , the number of thermal interfaces between the optoelectronic semiconductor chip and a heatsink can be reduced as the second main face of the carrier may be directly connected to a heatsink located underneath the circuit board .

[0024] This results in a reduced thermal resistance from the optoelectronic semiconductor chip to the heatsink .

[0025] According to at least one embodiment of the optoelectronic module , a second main face of the carrier arranged opposite to the first main face of the carrier terminates flush with the rear side of the circuit board with a tolerance of at most 200 pm . In other words , the circuit board together with the carrier of the optoelectronic semiconductor chip mounted to the circuit board provides a substantially planar mounting surface to a heatsink .

[0026] Further, the carrier may be arranged completely within the cutout of the circuit board so that the carrier does not extend beyond the rear side of the circuit board in a vertical direction, i . e . in a direction perpendicular to the radiation exit side .

[0027] According to at least one embodiment of the optoelectronic module , the optoelectronic semiconductor chip is arranged in the cutout laterally beside the intermediate surface . Thus , in a top view onto the radiation exit side of the optoelectronic module , the optoelectronic semiconductor chip does not overlap with the intermediate surface of the circuit board . In particular, there is no overlap between the optoelectronic semiconductor chip and the circuit board .

[0028] According to at least one embodiment of the optoelectronic module , the optoelectronic semiconductor chip is arranged completely within the cutout . Thus , the optoelectronic semiconductor chip neither extends beyond the front side of the circuit board nor beyond the rear side of the circuit board .

[0029] According to at least one embodiment of the optoelectronic module , the electrical contacts of the carrier are electrically connected to the electrical terminals of the circuit board by means of a solder material .

[0030] According to at least one embodiment of the optoelectronic module , a spacer is arranged between the first main side of the carrier and the intermediate surface of the circuit board . The spacer may extend along a circumference of the cutout . Alternatively or in addition two or more spacers may be provided . By means of the spacer, a distance between the carrier and the circuit board in the finished optoelectronic module can be defined . Likewise , an of fset between the rear side of the circuit board and the second main face of the carrier can be adapted by the spacer .

[0031] According to at least one embodiment of the optoelectronic module , the spacer is arranged laterally beside the solder material . For example , the spacer comprises a solid material attached to or formed on the first main face of the carrier or attached to or formed on the intermediate surface of the circuit board . The spacer may further provide a mechanical connection between the carrier and the circuit board in addition to the solder material . This may reduce the mechanical load on the electrical connection between the electrical contacts of the carrier and the electrical terminals of the circuit board when mounting the optoelectronic module to a heatsink .

[0032] Further, an appliance is speci fied .

[0033] According to at least one embodiment of the appliance , the appliance comprises an optoelectronic module as described above and a heatsink . For example , the heatsink comprises a metal such as aluminum or copper or another material having a high thermal conductivity such as a ceramic .

[0034] According to at least one embodiment of the appliance , the optoelectronic module is pressed against the heatsink . For example , the optoelectronic module is mounted to the heatsink by a screwing or clamping connection .

[0035] According to at least one embodiment of the appliance , a thermally conductive material is arranged between the heatsink and the optoelectronic module . For example , the thermally conductive material comprises a thermally conductive paste such as a heatsink grease or a sheet of a thermal interface material ( TIM) .

[0036] According to at least one embodiment of the appliance , the thermally conductive material directly adj oins the heatsink and the second main face of the carrier . Thus , the thermally conductive material is the only material arranged between the carrier and the heatsink . This helps to obtain a particularly low thermal resistance . In particular, the circuit board is not required for the heat trans fer from the optoelectronic semiconductor chip to the heatsink, so that a conventional circuit board such as an FR-4 printed circuit board is suf ficient .

[0037] Further, a method of producing an optoelectronic module is speci fied .

[0038] According to at least one embodiment of the method, the method comprises the steps of providing an optoelectronic semiconductor chip configured to emit electromagnetic radiation on a carrier, wherein electrical contacts of the carrier are arranged on a first main face of the carrier facing the optoelectronic semiconductor chip . The method further comprises a step of providing a circuit board with a front side and a rear side opposite to the front side , wherein the circuit board comprises a cutout with a stepped side face , so that the circuit board comprises an intermediate surface extending in parallel to and spaced apart from the rear side and the front side of the circuit board, wherein the circuit board comprises electrical terminals arranged on the intermediate surface . The method further comprises a step of electrically connecting the electrical contacts of the carrier to the electrical terminals of the circuit board .

[0039] The cutout in the circuit board may be formed by a milling process , for example . Alternatively or in addition, cutouts of di f ferent si zes may be produced in sublayers of the printed circuit board before these sublayers are compressed to form the printed circuit board . The sublayers with their cutouts taken together may result in a circuit board with a cutout having a stepped side face . For mounting the optoelectronic semiconductor chip with the carrier to the circuit board, the semiconductor chip can be placed within the cutout of the circuit board . The stepped side face of the cutout provides one or more intermediate surfaces with electrical terminals .

[0040] In particular, the carrier for the semiconductor chip is exposed at the rear side of the circuit board, so that the carrier can be directly connected to a heatsink without the circuit board being arranged in a heat path from the semiconductor chip to the heatsink .

[0041] According to at least one embodiment of the method, at least part of a solder material for the step of connecting the electrical contacts of the carrier to the electrical terminals of the circuit board is provided on the carrier . For example , the solder material is provided in the form of solder balls formed on the first main face of the carrier .

[0042] According to at least one embodiment of the method, a spacer defines a distance between the intermediate surface and the first main face of the carrier during the step of electrically connecting the electrical contacts of the carrier to the electrical terminals of the circuit board . The spacer may be provided at the carrier or at the intermediate surface .

[0043] The method is particularly suited to produce an optoelectronic module as described above . The features disclosed in connection with the optoelectronic module may also apply for the method and vice versa . Features described above in connection with at least one embodiment of the method or the optoelectronic module or the appliance can be combined with other features described in connection with at least one embodiment of the method or the optoelectronic module or the appliance unless they are contradictory .

[0044] In the exemplary embodiments and figures similar or similarly acting constituent parts are provided with the same reference signs . Generally, only the di f ferences with respect to the individual exemplary embodiments are described . Unless speci fied otherwise , the description of a part or feature in one exemplary embodiment applies to a corresponding part or feature in another exemplary embodiment as well .

[0045] In the Figures :

[0046] Figure 1 shows an exemplary embodiment of an optoelectronic module in a schematic sectional view;

[0047] Figure 2 shows an exemplary embodiment of an appliance in a sectional view; and

[0048] Figures 3A to 3C show an exemplary embodiment of a method of producing an optoelectronic module by way of intermediate steps shown in a sectional view .

[0049] The elements illustrated in the figures and their si ze relationships among one another are not necessarily true to scale . Rather, individual elements or layer thicknesses may be represented with an exaggerated si ze for the sake of better representability and / or for the sake of better understanding . Figure 1 illustrates an optoelectronic module 1 comprising an optoelectronic semiconductor chip 2 configured to emit electromagnetic radiation . For example , the optoelectronic semiconductor chip 2 is an LED or an LED array or a laser or a laser array . In particular, the optoelectronic semiconductor chip 2 may provide a plurality of emission regions that are controllable independently from one another . For example , the optoelectronic semiconductor chip 2 is configured as a light source for a head light , for example as an adaptive head light for a vehicle .

[0050] On a side of the semiconductor chip 2 that faces away from a radiation exit side 20 of the semiconductor chip 2 , the semiconductor chip 2 is arranged on a carrier 3 . The semiconductor chip 2 is electrically connected to the carrier 3 . In the exemplary embodiment shown, the electrical connections 23 are embodied as wire bonds . However, other types of electrical connections such as planar connections using electrically conductive layers may also be used .

[0051] In a vertical direction perpendicular to the radiation exit side 20 , the carrier 3 extends between a first main face 31 facing the semiconductor chip and a second main face 32 opposite to the first main face 31 . Electrical contacts 33 for energi zing the semiconductor chip 2 are formed on the first main face 31 of the carrier 3 . In particular, the electrical contacts 33 are arranged laterally beside the semiconductor chip 2 on the first main face 31 .

[0052] The electrical contacts 33 surround the radiation exit side 20 of the semiconductor chip 2 in a top view onto the first main face 31 of the carrier 3 . The optoelectronic module 1 further comprises a circuit board 4 with a front side 41 and a rear side 42 opposite to the front side 41 . The circuit board 4 comprises a cutout 44 with a stepped side face 45 . The stepped side face 45 comprises an intermediate surface 49 that extends in parallel to the front side 41 and to the rear side 42 of the circuit board 4 .

[0053] For example , an electrically conductive layer of the circuit board 4 is exposed at the intermediate surface 49 .

[0054] At the intermediate surface 49 the circuit board 4 comprises electrical terminals 43 . Thus , the electrical terminals 43 are arranged on a side of the circuit board that faces away from the front side 41 of the circuit board 4 .

[0055] The electrical terminals 43 are arranged on a portion of the circuit board 4 where the thickness , i . e . the extent in the vertical direction, of the circuit board 4 is reduced compared the thickness laterally beside the cutout 44 .

[0056] In a top view of the optoelectronic module 1 , electrical terminals 43 of the circuit board 4 overlap with electrical contacts 33 of the carrier . The electrical terminals 43 of the circuit board 4 are electrically connected to the electrical contacts 33 of the carrier 3 by means of a solder material 5 , for example .

[0057] In a view onto the rear side 42 of the circuit board 4 , the second main face 32 of the carrier 3 is exposed . Thus , the carrier 3 can be directly connected to a heatsink when mounting the circuit board 4 to the heatsink . The circuit board 4 is , for example , an FR-4 circuit board comprising a fiber-enforced resin material and one or a plurality of electrically conductive layers .

[0058] In a top view onto the front side 41 of the circuit board 4 , the circuit board 4 overlaps with the carrier 3 but not with the optoelectronic semiconductor chip 2 . Thus , the radiation produced in the optoelectronic semiconductor chip 2 and emitted through the radiation exit side 20 is not impeded by the circuit board 4 . The optoelectronic semiconductor chip 2 may be arranged completely within the cutout 44 .

[0059] The second main face of the carrier 3 and the rear side 42 of the circuit board 4 may terminate flush, for example with a tolerance of at most 200 pm or at most 100 pm . Consequently, the optoelectronic module 1 provides a substantially planar surface for mounting the optoelectronic module to a heatsink .

[0060] The second main face 32 of the carrier 3 may be completely free of electrical contacts 33 in the exemplary embodiment of Figure 1 .

[0061] Optionally, a spacer 35 is arranged between the first main side 31 of the carrier 3 and the intermediate surface 49 of the circuit board 4 . For example , the spacer 35 is arranged laterally beside the electrical contacts 33 .

[0062] For example , the carrier 3 is configured to electrically contact and / or control individual emission regions of the optoelectronic semiconductor chip 2 . For example , the carrier 3 comprises an integrated circuit and / or active or passive electronic components arranged on or integrated in the carrier 3 . For example , the optoelectronic semiconductor chip 2 together with the carrier 3 is embodied as a system on a chip ( SOC ) .

[0063] In Figure 1 only one spacer 35 is visible . However, the optoelectronic module 1 may comprise several spacers extending along a circumference of the cutout 44 or a single spacer 35 extending along the circumference of the cutout 44 .

[0064] In other embodiments the spacer 35 may be omitted .

[0065] Figure 2 illustrates an exemplary embodiment of an appliance 10 comprising an optoelectronic module 1 . In particular, the optoelectronic module 1 may be embodied as described in connection with Figure 1 .

[0066] The optoelectronic module 1 is mounted to a heatsink 6 . For example , the optoelectronic module 1 is pressed against the heatsink 6 by means of a mechanical connector 65 such as a screw .

[0067] A thermally conductive material 69 may be arranged between the optoelectronic module 1 and the heatsink 6 , for example the thermally conductive material 69 is provided by a thermally conductive paste or a thermally conductive sheet material . When mounted to the heatsink 6 , the only material between the carrier 3 with the optoelectronic semiconductor chip 2 of the optoelectronic module 1 and the heatsink 6 is the thermally conductive material 69 .

[0068] The circuit board 4 , in contrast , is not in the heat path from the optoelectronic semiconductor chip 2 to the heatsink 6 . Consequently, there is only one thermal interface between the carrier 3 and the heatsink 6 . The circuit board 4 does not have a high thermal conductivity as the circuit board 4 is not required for the heat trans fer from the optoelectronic semiconductor chip 2 to the heatsink 6 .

[0069] When pressing the circuit board 4 against the heatsink 6 using the mechanical connectors 65 , the spacer 35 may help to press the carrier 3 against the heatsink 6 . This helps to reduce the mechanical load on the solder material 5 .

[0070] Figures 3A to 3C illustrate a method of producing an optoelectronic module according to an exemplary embodiment .

[0071] As illustrated in Figure 3A, an optoelectronic semiconductor chip 2 arranged on a carrier 3 is provided . Electrical contacts 33 of the carrier 3 are arranged on a first main face 31 of the carrier 3 facing the optoelectronic semiconductor chip 2 . For example , electrical connections 23 between the optoelectronic semiconductor chip 2 and the carrier 3 are embodied as wire bond connections .

[0072] The electrical contacts 33 may be provided with at least part of a solder material 5 which is to be used for an electrical connection of the electrical contacts 33 of the carrier 3 in a subsequent method step . For example , solder balls comprising the solder material 5 are arranged on the electrical contacts 33 .

[0073] As illustrated in Figure 3B, a circuit board 4 with a front side 41 and a rear side 42 opposite to the front side 41 is provided, wherein the circuit board 4 comprises a cutout 44 with a stepped side face 45 , so that the circuit board 4 comprises an intermediate surface 49 extending in parallel to and spaced apart from the rear side 42 and the front side 41 of the circuit board 4 . Electrical terminals 43 of the circuit board 4 are arranged on the intermediate surface 49 .

[0074] The cutout 44 with the stepped side face 45 may be formed by milling, for example . Alternatively or in addition, the circuit board 4 may be formed by compressing sublayers which are provided with cutouts of di f ferent lateral extensions , such that the cutout 44 with the stepped side face 45 is formed when compressing the sublayers to form the circuit board 4 .

[0075] As illustrated in Figure 3C, the optoelectronic semiconductor chip 2 with the carrier 3 may be inserted from the rear side 42 of the circuit board 4 into the cutout 44 so that the electrical contacts 33 of the carrier 3 overlap with the electrical terminals 43 of the circuit board 4 . The spacer 35 may be used to define the correct distance between the first main face 31 of the carrier 3 and the intermediate surface 49 of the carrier 4 . Consequently, the spacer 35 may be used to define the vertical distance between the second main face 32 and the rear side 42 of the circuit board during the soldering process .

[0076] For example , the rear side 42 of the circuit board 4 and the second main face 32 of the carrier 3 may terminate substantially flush with a tolerance of at most 200 pm or at most 100 pm, for example .

[0077] The finished optoelectronic module 1 can be mounted on a heatsink as illustrated in Figure 2 , so that heat produced in the semiconductor chip 2 during operation can be trans ferred directly to the heatsink 6 without having to pass through the circuit board 4 . Thus , even an inexpensive standard printed circuit board without any metal inlays and without a metal core can be used for the circuit board 4 . This patent application claims the priority of German patent application 10 2024 100 632 . 3 , the disclosure content of which is hereby incorporated by reference .

[0078] The invention described herein is not restricted by the description given with reference to the exemplary embodiments . Rather, the invention encompasses any novel feature and any combination of features , including in particular any combination of features in the claims , even i f this feature or this combination is not itsel f explicitly indicated in the claims or exemplary embodiments .

[0079] References

[0080] 1 optoelectronic module

[0081] 10 appliance

[0082] 2 optoelectronic semiconductor chip

[0083] 20 radiation exit side

[0084] 23 electrical connection

[0085] 3 carrier

[0086] 31 first main face

[0087] 32 second main face

[0088] 33 electrical contact

[0089] 35 spacer

[0090] 4 circuit board

[0091] 41 front side

[0092] 42 rear side

[0093] 43 electrical terminal

[0094] 44 cutout

[0095] 45 stepped side face

[0096] 49 intermediate surface

[0097] 5 solder material

[0098] 6 heatsink

[0099] 65 mechanical connector

[0100] 69 thermally conductive material

Claims

Claims1. An optoelectronic module (1) comprising:- an optoelectronic semiconductor chip (2) configured to emit electromagnetic radiation and comprising a radiation exit side (20) ;- a carrier (3) arranged on a side of the optoelectronic semiconductor chip (2) that faces away from the radiation exit side (20) ; and- a circuit board (4) with a front side (41) and a rear side (42) opposite to the front side (41) ; wherein- electrical contacts (33) of the carrier (3) are arranged on a first main face (31) of the carrier (3) facing the optoelectronic semiconductor chip (2) ;- the circuit board (4) comprises a cutout (44) with a stepped side face (45) , so that the circuit board (4) comprises an intermediate surface (49) extending in parallel to and spaced apart from the rear side (42) and the front side (41) of the circuit board (4) ;- the circuit board (4) comprises electrical terminals (43) arranged on the intermediate surface (49) ; and- the electrical contacts (33) of the carrier (3) are electrically connected to the electrical terminals (43) of the circuit board (4) .

2. The optoelectronic module according to claim 1, wherein a second main face (32) of the carrier (3) arranged opposite to the first main face (31) of the carrier (3) terminates flush with the rear side (42) of the circuit board (4) with a tolerance of at most 200 pm.

3. The optoelectronic module according to claim 1 or 2,wherein the optoelectronic semiconductor chip (2) is arranged in the cutout (44) laterally beside the intermediate surface (49) .

4. The optoelectronic module according to any one of the preceding claims, wherein the optoelectronic semiconductor chip (2) is arranged completely within the cutout (44) .

5. The optoelectronic module according to any one of the preceding claims, wherein the electrical contacts (33) of the carrier (3) are electrically connected to the electrical terminals (43) of the circuit board (4) by means of a solder material (5) .

6. The optoelectronic module according to any one of the preceding claims, wherein a spacer (35) is arranged between the first main side (31) of the carrier (3) and the intermediate surface (49) of the circuit board (4) .

7. The optoelectronic module according to claims 5 and 6, wherein the spacer (35) is arranged laterally beside the solder material (5) .

8. An appliance (10) comprising an optoelectronic module (1) according to any one of the preceding claims and a heatsink (6) .

9. The appliance according to claim 8, wherein the optoelectronic module (1) is pressed against the heatsink ( 6 ) .

10. The appliance according to claim 8 or 9, wherein a thermally conductive material (69) is arranged between the heatsink (6) and the optoelectronic module (1) .

11. The appliance according to claim 10, the thermally conductive material directly adjoins the heatsink and the second main face of the carrier.

12. A method of producing an optoelectronic module (1) , comprising the steps of: a) providing an optoelectronic semiconductor chip (2) configured to emit electromagnetic radiation on a carrier (3) , wherein electrical contacts (33) of the carrier (3) are arranged on a first main face (31) of the carrier (3) facing the optoelectronic semiconductor chip (2) ; b) providing a circuit board (4) with a front side (41) and a rear side (42) opposite to the front side (41) , wherein the circuit board (4) comprises a cutout (44) with a stepped side face (45) , so that the circuit board (4) comprises an intermediate surface (49) extending in parallel to and spaced apart from the rear side (42) and the front side (41) of the circuit board (4) , wherein the circuit board (4) comprises electrical terminals (43) arranged on the intermediate surface (49) ; and c) electrically connecting the electrical contacts (33) of the carrier (3) to the electrical terminals (43) of the circuit board (4) .

13. The method according to claim 12, wherein at least part of a solder material (5) for step c) is provided on the carrier (3) .

14. The method according to claim 12 or 13, wherein a spacer defines a distance between the intermediate surface (49) and the first main face (31) of the carrier (3) during step c) .

15. The method according to any one of claims 12 to 14, wherein an optoelectronic module (1) according to any one of claims 1 to 7 is produced.

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