Electronic assembly, electronic device and chip structure

Abstract

The present application relates to the technical field of packaging, and provides an electronic assembly, an electronic device and a chip structure, used for improving the heat dissipation capability of an electronic assembly. The electronic assembly comprises: a circuit board, a first chip, a second chip, and a heat transfer plate. The heat transfer plate is located at one side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, and the first chip is connected to the heat transfer plate. The second chip is located at the side of the heat transfer plate away from the circuit board, and the second chip is connected to the heat transfer plate. The chip structure can be applied to the electronic assembly, and the electronic assembly can be applied to the electronic device.

Description

Electronic component, electronic equipment and chip structure

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on January 23, 2024, with application number 202410099181.1 and application name “An electronic component, electronic device and chip structure”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of packaging technology, and in particular to an electronic component, an electronic device, and a chip structure. Background Art

[0003] Package on package (POP) is an integrated circuit packaging method, generally used to combine vertically discrete system-on-chip (SOC) and memory chips. For example, two or more chips are installed on top of each other, that is, stacked, to form a POP packaged device. At this time, signal interconnection can be provided between chips through a standard interface, which has the advantages of high bandwidth and short signal transmission path. POP packaged devices are often used in electronic devices such as mobile phones, personal digital assistants (PDAs) and digital cameras to achieve higher-density device layout. However, as the performance of electronic devices improves generation by generation, the thermal power consumption of the chip itself is also increasing. Therefore, the challenges brought by the heat dissipation of POP packaged devices have become increasingly prominent.

[0004] Summary of the Invention

[0005] The present application provides an electronic component, an electronic device, and a chip structure for enhancing the heat dissipation capability of the electronic component.

[0006] In one aspect, an electronic assembly is provided, comprising: a circuit board, a first chip, a second chip, and a heat transfer plate. The heat transfer plate is located on one side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, connected to the circuit board and the heat transfer plate. The second chip is located on a side of the heat transfer plate facing away from the circuit board and connected to the heat transfer plate.

[0007] In the electronic assembly provided by the embodiment of the present application, since a heat transfer plate is provided between the first chip and the second chip, the heat of the first chip and the second chip can be respectively conducted outwardly through the heat transfer plate, for example, can be conducted outwardly to an external heat dissipation structure, where the external heat dissipation structure can be, for example, an air-cooled radiator, a liquid cooling plate, a vapor chamber (VC), etc. In this way, the problem of large thermal resistance of the heat dissipation path of the first chip caused by the heat of the first chip needing to pass through the second chip upward before dissipating is improved, and / or the problem of large thermal resistance of the heat dissipation path of the second chip caused by the heat of the second chip needing to pass through the first chip downward before dissipating is improved. Therefore, the electronic assembly provided by the embodiment of the present application has the advantage of high heat dissipation efficiency of the first chip and the second chip, can be applied to use scenarios with greater heat power consumption, and improve the performance of electronic devices using the electronic assembly.

[0008] In some embodiments, the first chip includes a plurality of first contacts on a surface adjacent to the heat transfer plate. The electronic component further includes a plurality of first solder balls located between the heat transfer plate and the first chip. The heat transfer plate is connected to the plurality of first contacts via the plurality of first solder balls.

[0009] Illustratively, the plurality of first solder balls between the heat transfer plate and the first chip may all be used to transmit electrical signals (eg, for transmitting data signals, control signals, etc. required during operation of the first chip).

[0010] For example, at least one first solder ball may not be used to transmit power signals (e.g., data signals or control signals required for the operation of the first chip), but may instead be used to enhance heat transfer and reliability, thereby improving the heat transfer efficiency between the first chip and the heat transfer plate. In this case, the gaps between the multiple first solder balls may be filled with filler to further enhance the heat transfer efficiency between the first chip and the heat transfer plate.

[0011] For example, for a first contact connected to a first solder ball that is not used to transmit an electrical signal, a signal line connected to the first contact may not be provided inside the first chip.

[0012] For example, for a contact on the heat transfer plate connected to the first solder ball that is not used for transmitting an electrical signal, it is also possible to configure the heat transfer plate without providing a signal line connected to the contact.

[0013] In some embodiments, the second chip includes a plurality of second contacts on a surface adjacent to the heat transfer plate. The electronic assembly further includes a plurality of second solder balls located between the heat transfer plate and the second chip. The heat transfer plate is connected to the plurality of second contacts via the plurality of second solder balls.

[0014] Illustratively, all of the plurality of second solder balls between the heat transfer plate and the second chip may be used to transmit electrical signals (eg, for transmitting data signals, control signals, etc. required during operation of the second chip).

[0015] For example, at least one second solder ball may not be used to transmit electrical signals (e.g., data signals or control signals required for the operation of the second chip), but may be used to enhance heat transfer and reliability, thereby improving the heat transfer efficiency between the second chip and the heat transfer plate. In this case, the gaps between the second solder balls may be filled with filler to further enhance the heat transfer efficiency between the second chip and the heat transfer plate.

[0016] For example, for a second contact connected to a second solder ball that is not used to transmit an electrical signal, a signal line connected to the second contact may not be provided inside the second chip.

[0017] For example, for a contact on the heat transfer plate connected to a second solder ball that is not used for transmitting an electrical signal, it is also possible to configure the heat transfer plate without providing a signal line connected to the contact.

[0018] In some embodiments, the electronic component further includes a filler filled between the heat transfer plate and the first chip. In this embodiment, the heat transfer efficiency between the first chip and the heat transfer plate can be further improved.

[0019] In some embodiments, the electronic component further includes a filler filled between the heat transfer plate and the second chip. In this embodiment, the heat transfer efficiency between the second chip and the heat transfer plate can be further improved.

[0020] In some embodiments, the first chip includes a first die and a first protective portion; the heat transfer plate is stacked on the side of the first die facing away from the circuit board; the surface of the heat transfer plate facing away from the circuit board includes a heat dissipation surface and multiple third contacts, the heat dissipation surface being electrically insulated from the multiple third contacts; the first protective portion surrounds the first die and the heat transfer plate, with the heat dissipation surface and the third contacts exposed by the first protective portion; and the multiple third contacts are connected to the second chip. This arrangement allows heat in the first chip to be more easily dissipated through the heat dissipation surface of the heat transfer plate, thereby improving the heat dissipation effect of the first chip.

[0021] In some embodiments, the first protective portion includes a first packaging substrate and a first plastic portion; the surface of the first die facing away from the heat transfer plate is connected to the first packaging substrate; the first plastic portion is connected to the first packaging substrate and surrounds at least the side surfaces of the first die and all or part of the surface of the heat transfer plate closest to the first die. The first chip also includes a heat conducting portion located within the first plastic portion and connecting the first packaging substrate and the heat transfer plate. In this embodiment, by providing a heat conducting portion connecting the first packaging substrate and the heat transfer plate, heat from the first chip is more easily transferred to the heat transfer plate, thereby being conducted through the heat dissipation surface of the heat transfer plate to the first heat conducting structure and the first heat sink, thereby improving heat dissipation efficiency.

[0022] In some embodiments, the first chip further includes a connecting plate, which is stacked between the first die and the heat transfer plate and contacts both the first die and the heat transfer plate. In this embodiment, the addition of the connecting plate allows for better heat transfer from the first die to the heat transfer plate, resulting in higher heat transfer efficiency. Heat is then transferred to the first heat-conducting structure and the first heat sink via the heat transfer plate's heat dissipation surface, improving heat dissipation efficiency.

[0023] In some embodiments, the surface of the heat transfer plate facing away from the circuit board includes a heat dissipation surface and a plurality of third contacts. The heat dissipation surface is electrically insulated from the plurality of third contacts, and the plurality of third contacts are connected to the second chip. In this embodiment, the third contacts can be used for both heat conduction and signal transmission. The heat dissipation surface can be used to transfer heat to an external heat dissipation structure. Exemplarily, the heat dissipation surface includes a metal surface, which has a high heat dissipation efficiency.

[0024] In some embodiments, the plurality of third contacts form at least one third contact group; the heat dissipation surface includes a first heat dissipation surface, which is disposed around at least one side of the third contact group. A third contact group herein can be used to electrically connect to a second chip. In this case, the heat dissipation surface includes the first heat dissipation surface, which is disposed around at least one side of the third contact group. For example, for a rectangular third contact group, the first heat dissipation surface can be disposed around one, two, three, or four sides of the third contact group.

[0025] In some embodiments, the area of ​​the first heat dissipation surface is larger than the area of ​​each of the third contacts, which is beneficial for improving the heat dissipation efficiency of the first heat dissipation surface.

[0026] In some embodiments, the heat dissipation surface further includes a second heat dissipation surface; a heat transfer portion specifically adapted for the second heat dissipation surface is formed within the heat transfer plate. This arrangement effectively reduces the thermal resistance along the transfer path, which refers to the heat transferred from the first chip through the heat transfer portion within the heat transfer plate to the heat dissipation surface, where it is then transferred to the first heat sink via the first heat conductive structure outside the heat transfer plate, thereby improving heat dissipation efficiency. For example, a hole can be drilled within the PCB and filled with a material (i.e., the heat transfer portion) having a higher thermal conductivity than the insulating dielectric layer, such as copper, to improve heat dissipation efficiency.

[0027] In some embodiments, the heat dissipation surface comprises a metal surface. This arrangement helps improve the heat transfer efficiency of the heat transfer plate. In some embodiments, the electronic assembly further comprises a first heat sink and a first heat conductive structure. The first heat sink is located on the side of the second chip facing away from the heat transfer plate; the first heat conductive structure connects the heat dissipation surface of the heat transfer plate and the first heat sink. The first heat sink can be an air-cooled radiator, a liquid cooling plate, a temperature distribution plate, etc., and the first heat sink can be used directly to dissipate heat from the second chip. In this embodiment, since the first heat conductive structure is further provided to connect the heat dissipation surface of the heat transfer plate (such as the first heat dissipation surface) and the first heat sink, heat from the first chip can be transferred both through the heat transfer plate and the second chip to the first heat sink (a path with a higher thermal resistance), and can also be transferred through the heat transfer plate and the first heat conductive structure to the first heat sink (a path with a lower thermal resistance), significantly improving heat dissipation efficiency. In some embodiments, the first heat conductive structure comprises at least one of metal, alloy, graphite, pure silicon, cobalt copper, and electronic components. Among them, metals include but are not limited to one of the elements such as copper, silver, and aluminum, and alloys include but are not limited to a combination of multiple elements such as copper, silver, and aluminum. Metals, alloys, graphite, and pure silicon all have high heat transfer efficiency. Diamond copper, also known as diamond copper, is a composite material of metallic copper and diamond, which has higher heat transfer efficiency than copper. In addition, it should be noted that the electronic components can be devices with certain functions such as capacitors, inductors, and resistors. When the first heat-conducting structure includes electronic components, while having a heat transfer function, it can also meet some electrical functional requirements, and is more practical.

[0028] In some embodiments, the first heat-conducting structure is welded to the heat dissipation surface of the heat transfer plate or a thermal interface material (TIM) is added. For example, the first heat-conducting structure can be welded to the first heat dissipation surface of the heat transfer plate. This can reduce the thermal resistance between the first heat-conducting structure and the heat transfer plate, thereby improving heat transfer efficiency.

[0029] In some embodiments, a thermal interface material is filled between the first heat sink and the first thermally conductive structure. The thermal interface material has the characteristics of bridging micro-gaps at the contact interface and reducing the thermal resistance of the interface. This can increase the heat transfer efficiency between the first thermally conductive structure and the first heat sink, thereby improving the heat dissipation effect of the first chip.

[0030] The first heat sink and the first heat conducting structure may be an integrated structure. This configuration can further reduce the contact thermal resistance and lower the thermal resistance on the heat transfer path (the thermal resistance from the first chip to the first heat sink).

[0031] In some embodiments, the heat transfer plate and the first heat-conducting structure can be integrated. This arrangement can reduce the contact thermal resistance between the first heat-conducting structure and the heat transfer plate, thereby lowering the thermal resistance in the heat transfer path (the thermal resistance from the first chip to the first heat sink). The heat transfer plate can have a dedicated heat transfer portion internally adapted to the second heat dissipation surface. This arrangement can effectively reduce the thermal resistance in the heat transfer path. The thermal resistance refers to the heat transferred from the first chip to the second heat dissipation surface via the heat transfer portion internally within the heat transfer plate, which is then transferred to the first heat sink via the first heat-conducting structure externally within the heat transfer plate, thereby improving heat dissipation efficiency. For example, holes can be drilled internally in the PCB, particularly at locations corresponding to the first heat-conducting structure, and filled with a material (i.e., the heat transfer portion) having a higher thermal conductivity than the insulating dielectric layer, such as copper, to improve heat dissipation efficiency. For example, using a PCB as an example, the "integrated structure" herein can be achieved by, after forming a relatively thick PCB, milling out the remaining areas except for the first heat-conducting structure area to form an integrated heat transfer plate and first heat-conducting structure. In this case, the first heat-conducting structure can include both the conductive pillars and the surrounding insulating material.

[0032] In some embodiments, a thermal interface material (TIM) is placed between the first heat sink and the second chip. The TIM bridges microgaps at the interface and reduces thermal resistance, increasing heat transfer efficiency between the second chip and the first heat sink, thereby enhancing the heat dissipation of the second chip.

[0033] In some embodiments, the first thermally conductive structure is located between the heat transfer plate and the first heat sink, and the first thermally conductive structure is located on at least one side of the second chip. In this embodiment, the first thermally conductive structure can be located on one or more sides of the second chip. For example, when the second chip is rectangular, the first thermally conductive structure can be arranged around the second chip.

[0034] In some embodiments, the first heat-conducting structure includes a first heat-conducting portion extending along a first direction parallel to the plane of the heat transfer plate. A plurality of second chips are provided; the plurality of second chips are arranged along the first direction and are located on the same side of the first heat-conducting portion.

[0035] Based on the above embodiment, the first heat-conducting structure may further include a second heat-conducting portion, the second heat-conducting portion extending along the first direction. In the second direction, the plurality of second chips are located between the first heat-conducting portion and the second heat-conducting portion; the second direction intersects the first direction;

[0036] In some embodiments, there are multiple second chips; and the first heat conducting structure is located between at least two of the second chips.

[0037] Based on the above embodiment, the heat transfer plate further includes an opening. The first heat-conducting structure is connected to the first chip through the opening. In this example, the first heat-conducting structure can be directly connected to the first chip, which is beneficial to further reduce the thermal resistance between the first chip and the first heat sink and improve the heat dissipation efficiency. At least one first heat-conducting structure is added between the heat transfer plate and the circuit board to increase the reliability of the electronic components, while also increasing the thermal interaction characteristics between the heat transfer plate and the circuit board, thereby enhancing heat dissipation; the support structure is not limited to metal, non-metallic materials, or certain functional devices, and the connection with the heat transfer plate is not limited to adhesive bonding, welding, and direct physical contact; the connection between the first heat-conducting structure and the circuit board is not limited to adhesive bonding, welding, and direct physical contact.

[0038] In some embodiments, a thermal interface material is filled between the first heat-conducting structure and the first chip. The thermal interface material has the characteristic of reducing interface contact thermal resistance, thereby increasing the heat transfer efficiency between the first chip and the first heat-conducting structure and improving the heat dissipation effect of the first chip.

[0039] In some embodiments, the heat transfer plate includes a first contact surface and a second contact surface. The first contact surface is the inner wall surface of the opening, and the second contact surface is located on the side of the heat transfer plate facing away from the first chip, and the second contact surface surrounds the opening. The first heat-conducting structure is connected to at least one of the first and second contact surfaces. In this embodiment, when the first heat-conducting structure is connected to the first and / or second contact surfaces, the thermal resistance between the first heat-conducting structure and the heat transfer plate can be reduced, thereby improving heat transfer efficiency.

[0040] In some embodiments, the electronic assembly further comprises a support structure positioned between the heat transfer plate and the circuit board, and connecting the heat transfer plate and the circuit board. In this embodiment, the support structure can be used to support the heat transfer plate, thereby increasing the reliability of the electronic assembly. The support structure herein is not limited to metal, non-metallic materials, or functional components. The connection between the support structure and the heat transfer plate is not limited to adhesive bonding, welding, or direct physical contact. The connection between the support structure and the circuit board is not limited to adhesive bonding, welding, or direct physical contact.

[0041] In some embodiments, the support structure is configured as a second heat-conducting structure, thereby increasing the thermal interaction between the heat transfer plate and the circuit board, thereby enhancing heat dissipation.

[0042] In some embodiments, the support structure is disposed around the first chip, thereby improving the support effect of the support structure on the heat transfer plate, and increasing stability and reliability.

[0043] In some embodiments, the heat transfer plate and the second heat-conducting structure can be an integrated structure. This arrangement can reduce the contact thermal resistance between the second heat-conducting structure and the heat transfer plate, thereby lowering the thermal resistance in the heat transfer path (the thermal resistance from the first chip to the second heat-conducting structure). The heat transfer plate includes a heat transfer portion specifically adapted to the heat dissipation surface in contact with the second heat-conducting structure. This arrangement can effectively reduce the thermal resistance in the transfer path. The thermal resistance refers to the heat transferred from the first chip to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, so that it can be transferred to the circuit board or other heat dissipation structure through the second heat-conducting structure outside the heat transfer plate, thereby improving heat dissipation efficiency. For example, holes can be drilled inside the PCB board, particularly at the location corresponding to the first heat-conducting structure, and filled with a material (i.e., the heat transfer portion) with a higher thermal conductivity than the insulating dielectric layer, such as metallic copper, to improve heat dissipation efficiency. For example, taking the PCB board as an example, the "integrated structure" here can be that after forming a thicker PCB board, other positions except the second heat-conducting structure area are milled thin to form an integrated heat transfer plate and the second heat-conducting structure. At this time, the second heat-conducting structure can also include the conductive column and the insulating material around it.

[0044] In some embodiments, the electronic assembly further comprises: a third heat-conducting structure and a second heat sink; the second heat sink is located on a side of the circuit board facing away from the heat transfer plate; the third heat-conducting structure is located between the heat transfer plate and the second heat sink, and the third heat-conducting structure passes through an opening in the circuit board, with one end of the third heat-conducting structure connected to the heat transfer plate and the other end connected to the second heat sink. In this embodiment, the third heat-conducting structure can pass through the circuit board and directly thermally connect to the second heat sink on the side of the circuit board facing away from the first chip, thereby achieving efficient heat transfer from the heat transfer plate to the second heat sink on the side of the circuit board facing away from the first chip, thereby achieving a heat dissipation effect. The third heat-conducting structure herein is not limited to metals, non-metals, and alloys.

[0045] In some embodiments, the third heat-conducting structure is disposed around the first chip. Here, the third heat-conducting structure can also play a good role in supporting the heat transfer plate.

[0046] In some embodiments, the third heat-conducting structure and the heat transfer plate are thermally connected by means of a thermal interface material or welding. In this way, the heat transfer plate and the third heat-conducting structure have a higher heat transfer efficiency. The heat transfer plate includes a third heat dissipation surface on the side close to the third heat-conducting structure, and a heat transfer portion is specially made inside to adapt to the third heat dissipation surface. Such a configuration can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, so as to be transferred to the first heat sink through the first heat-conducting structure outside the heat transfer plate, thereby improving the heat dissipation efficiency. For example, a hole can be drilled inside the PCB board and filled with a material with a higher thermal conductivity than the insulating medium layer (i.e., the heat transfer portion), such as metal copper, to improve the heat dissipation efficiency.

[0047] In some embodiments, the third heat-conducting structure and the second heat sink are welded or connected via a thermal interface material, so that the third heat-conducting structure and the second heat sink have a higher heat transfer efficiency.

[0048] In some embodiments, the third heat-conducting structure and the second heat sink are integrated into one structure, so that the third heat-conducting structure and the second heat sink have higher heat transfer efficiency.

[0049] In some embodiments, the heat transfer plate and the third heat-conducting structure can be an integrated structure. This arrangement can reduce the contact thermal resistance between the third heat-conducting structure and the heat transfer plate, thereby lowering the thermal resistance in the heat transfer path (the thermal resistance from the first chip to the first heat sink). The heat transfer plate includes a heat transfer portion specifically adapted to the heat dissipation surface in contact with the third heat-conducting structure. This arrangement can effectively reduce the thermal resistance in the transfer path. The thermal resistance refers to the heat transferred from the first chip to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, thereby facilitating heat transfer to the first heat sink through the first heat-conducting structure outside the heat transfer plate, thereby improving heat dissipation efficiency. For example, holes can be drilled inside the PCB, particularly at locations corresponding to the first heat-conducting structure, and filled with a material (i.e., the heat transfer portion) having a higher thermal conductivity than the insulating dielectric layer, such as copper, to improve heat dissipation efficiency. For example, taking the PCB board as an example, the "integrated structure" here can be that after forming a thicker PCB board, other positions except the third heat-conducting structure area are milled thin to form an integrated heat transfer plate and the third heat-conducting structure. At this time, the third heat-conducting structure can also include the conductive column and the insulating material around it.

[0050] In another aspect, a chip structure is provided, comprising a first die, a heat transfer plate, and a first protective portion. The heat transfer plate is stacked on one side of the first die. The surface of the heat transfer plate facing away from the first die includes a heat dissipation surface and a plurality of third contacts, the heat dissipation surface being electrically insulated from the plurality of third contacts. The first protective portion surrounds the first die and all or part of a side of the heat transfer plate proximal to the first die (for example, in a direction parallel to the circuit board, the first protective portion and the heat transfer plate may be larger, smaller, or equal in size, or larger or smaller in one direction, without limitation). The first protective portion exposes the heat dissipation surface and the third contacts. This arrangement allows heat in the first chip to be more easily dissipated from the heat transfer plate's heat dissipation surface, thereby improving the heat dissipation efficiency of the first chip.

[0051] In some embodiments, the first protective portion includes a first packaging substrate and a first plastic portion; the surface of the first die facing away from the heat transfer plate is connected to the first packaging substrate; the first plastic portion is connected to the first packaging substrate and at least surrounds the side surfaces of the first die and all or part of the surface of the heat transfer plate adjacent to the first die. The first chip also includes a heat conducting portion, which is located within the first plastic portion and connects the first packaging substrate and the heat transfer plate. In this embodiment, by providing a heat conducting portion connecting the first packaging substrate and the heat transfer plate, heat in the first chip is more easily transferred to the heat transfer plate, thereby improving heat dissipation efficiency. The number of heat conducting portions here can be one or more, and is not limited to some or all of the heat conducting portions having both signal transmission and heat transfer functions.

[0052] In some embodiments, the first chip further includes a connecting plate, which is stacked between the first die and the heat transfer plate and connects both the first die and the heat transfer plate. In this embodiment, the addition of the connecting plate allows for better heat transfer from the first die to the heat transfer plate, resulting in higher heat transfer efficiency and a lowering of the junction temperature of the first chip.

[0053] In some embodiments, the first die is directly connected to the heat transfer plate within the first chip. In this embodiment, the heat of the first die can be better transferred to the heat transfer plate, resulting in higher heat transfer efficiency and better reduction of the junction temperature of the first chip.

[0054] Based on some of the above embodiments, the connections between the first bare chip and the heat transfer plate, the first bare chip and the connecting plate, and the connecting plate and the heat transfer plate can be fixed into a specific relative structure by filling glue, welding, solder points or plastic sealing, so that heat can be better transferred from the first bare chip to the heat transfer plate.

[0055] In some embodiments, the chip structure can be configured with at least one of the first, second, and third heat-conducting structures, as described in the previous embodiments. Furthermore, the heat transfer plate and at least one of the first, second, and third heat-conducting structures can be integrated into an integrated structure (refer to the previous description and will not be repeated here) to further reduce thermal resistance and improve heat transfer performance.

[0056] In yet another aspect, an electronic device is provided, comprising: a housing; and an electronic component as described in any of the preceding embodiments, located within the housing. The electronic device provided in this embodiment, because it includes the electronic component described in any of the preceding embodiments, has the same beneficial effects as the electronic components described in any of the preceding embodiments, and thus is not further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] FIG1 is a structural diagram of an electronic device provided in an embodiment of the present application;

[0058] FIG2 is a structural diagram of an electronic component provided in an embodiment of the present application;

[0059] FIG3 is a top view of a heat transfer plate provided in an embodiment of the present application;

[0060] FIG4 is a top view showing the positional relationship among the heat transfer plate, the second chip and the first heat conducting structure in FIG2 ;

[0061] FIG5 is another top view showing the positional relationship among the heat transfer plate, the second chip and the first heat conducting structure in FIG2 ;

[0062] FIG6 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0063] FIG7 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0064] FIG8 is a top view showing the positional relationship among the heat transfer plate, the second chip and the first heat conducting structure in FIG6 or FIG7;

[0065] FIG9 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0066] FIG10 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0067] FIG11 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0068] FIG12 is a top view showing the positional relationship among the first chip, the second chip and the first heat conducting structure in FIG9, FIG10 or FIG11;

[0069] FIG13 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0070] FIG14 is a top view showing the positional relationship among the first chip, the second chip and the first heat conducting structure in FIG13 ;

[0071] FIG15 is a structural diagram of another electronic component provided in an embodiment of the present application;

[0072] FIG16 is a structural diagram of another electronic component provided in an embodiment of the present application. DETAILED DESCRIPTION

[0073] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0074] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0075] In the embodiments of this application, unless otherwise specified or limited, the term "connection" may refer to a direct mechanical or electrical connection, or an indirect mechanical or electrical connection through an intermediate medium. The mechanical connection herein is not limited to whether it is used to transmit electrical signals, and the electrical connection is used to transmit electrical signals.

[0076] In the embodiments of the present application, "thermal connection" and "heat transfer connection" refer to any connection method that can achieve heat transfer, such as direct mechanical connection or indirect mechanical connection through an intermediate medium (such as thermal interface material).

[0077] In the embodiment of the present application, "welding" includes any welding method, such as welding through a ball grid array package (BGA) or a land grid array package (LGA), or welding by adding solder to the entire surface.

[0078] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0079] In the embodiments of the present application, "and / or" describes the association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0080] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, used to explain the structure and movement of various components of the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0081] The embodiments of the present application provide an electronic device. The electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a digital camera, a personal computer, a notebook computer, a smart watch, an in-vehicle device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, a VR helmet, a server, a switch, a network bridge (also known as a bridge), a repeater, a router, or a gateway (also known as a protocol converter), etc. It is understandable that the embodiments of the present application do not place any particular restrictions on the specific form of the electronic device 1000.

[0082] Figure 1 is a structural diagram of an electronic device 1000 provided in an embodiment of the present application. As shown in Figure 1, the electronic device 1000 may include a housing 1001 and an electronic component 100. Here, there is no restriction on the specific shape and material of the housing 1001. That is, for different types of electronic devices 1000, housings 1001 with different shapes and different materials can be used according to their own needs. The electronic component 100 is located in the housing 1001. For example, the electronic component 100 can be connected to the inner wall structure of the housing 1001. The connection method here includes but is not limited to at least one of snap-on, screw connection, bonding, etc. The electronic component 100 here can also be called a POP packaging device.

[0083] FIG2 is a structural diagram of an electronic component 100 provided in an embodiment of the present application. As shown in FIG2 , the electronic component 100 includes a circuit board 110 , a first chip 10 , a second chip 20 , and a heat transfer plate 120 .

[0084] Circuit board 110 may be a printed circuit board (PCB). Circuit board 110 may be the mainboard of electronic device 1000. In some examples, circuit board 110 includes a stacked conductive layer and an insulating layer. The front and / or back of circuit board 110 may be used to connect chips or other electronic components, such as capacitors, resistors, and inductors.

[0085] The heat transfer plate 120 is located on one side of the circuit board 110. For example, along the thickness direction Z of the circuit board 110, the heat transfer plate 120 can be arranged face to face with the circuit board 110. Face to face arrangement can be understood as: along the thickness direction Z, the orthographic projection of the heat transfer plate 120 and the orthographic projection of the circuit board 110 overlap.

[0086] The first chip 10 is located between the heat transfer plate 120 and the circuit board 110. The first chip 10 is connected to the circuit board 110, and the first chip 10 is connected to the heat transfer plate 120. In some examples, the first chip 10 can be a system on chip (SOC). Exemplarily, the first chip 10 and the circuit board 110 can be connected by a ball grid array (BGA) or a land grid array (LGA). Among them, the BGA packaging method mainly uses solder balls for connection, and the LGA packaging method mainly uses solder joints for connection. The solder joints here are flat and the volume of the solder joints is smaller than the volume of the solder balls. On this basis, the remaining gap between the first chip 10 and the circuit board 110 can also be filled with underfill. The material of the underfill includes but is not limited to silicone, etc. In this way, electrical signals can be transmitted between the first chip 10 and the circuit board 110.

[0087] The connection between the first chip 10 and the heat transfer plate 120 can, for example, be entirely electrical connections capable of transmitting electrical signals, or partially electrical connections capable of transmitting electrical signals and partially heat transfer connections capable of not transmitting electrical signals. This embodiment uses the connection between the heat transfer plate 120 and the first chip 10 as an example of a connection that is partially electrical connections capable of transmitting electrical signals and partially heat transfer connections capable of not transmitting electrical signals. For example, the first chip 10 and the heat transfer plate 120 can also utilize the aforementioned BGA or LGA packaging method and be filled with adhesive to further enhance the heat transfer efficiency between the first chip 10 and the heat transfer plate 120.

[0088] The second chip 20 is located on the side of the heat transfer plate 120 facing away from the circuit board 110 and is connected to the heat transfer plate 120. In some examples, the second chip 20 may be a double data rate synchronous dynamic random access memory (DDR SDRAM). For example, the second chip 20 and the heat transfer plate 120 may also utilize the aforementioned BGA or LGA packaging method, and may also be filled with filler to further enhance heat transfer efficiency between the second chip 20 and the heat transfer plate 120. Furthermore, the connection between the heat transfer plate 120 and the second chip 20 can be entirely an electrical connection capable of transmitting electrical signals, or it can be partially an electrical connection capable of transmitting electrical signals and partially a heat transfer connection capable of not transmitting electrical signals. This is not a limitation in the present application. In the embodiments of the present application, the connection between the heat transfer plate 120 and the second chip 20 is used as an example in which the connection is partially an electrical connection capable of transmitting electrical signals and partially a heat transfer connection capable of not transmitting electrical signals. This allows the second chip 20 to be electrically connected to the first chip 10 via the heat transfer plate 120, enabling electrical signal transmission between the first and second chips 10, 20, without requiring additional external leads to connect the first and second chips 10, 20. Furthermore, the heat transfer plate 120 has both heat and signal conduction functions.

[0089] The first chip 10 and the second chip 20 may be of the same or different types. Furthermore, in addition to the above examples, the first chip 10 and the second chip 20 may also be other chips, such as a central processing unit (CPU), a graphics processing unit (GPU), or a low-power double-data-rate synchronous dynamic random access memory. The embodiments of the present application do not further limit the types of the first chip 10 and the second chip 20.

[0090] In the electronic component 100 provided in the embodiment of the present application, since a heat transfer plate 120 is provided between the first chip 10 and the second chip 20, the heat of the first chip 10 and the second chip 20 can be respectively conducted outwardly through the heat transfer plate 120, for example, can be conducted outwardly to an external heat dissipation structure, where the external heat dissipation structure can be, for example, an air-cooled radiator, a liquid cooling plate, a temperature equalizing plate, etc. In this way, the problem of high thermal resistance of the heat dissipation path of the first chip 10 caused by the heat of the first chip 10 needing to pass through the second chip 20 upward before dissipating is improved, and / or the problem of high thermal resistance of the heat dissipation path of the second chip 20 caused by the heat of the second chip 20 needing to pass through the first chip 10 downward before dissipating is improved. Therefore, the electronic component 100 provided in the embodiment of the present application has high heat dissipation efficiency for the first chip 10 and the second chip 20, and can be applied to usage scenarios with greater heat power consumption, thereby improving the performance of the electronic device 1000 using the electronic component 100.

[0091] The first chip 10 may include a plurality of first contacts on a surface adjacent to the heat transfer plate 120. For example, when the first chip 10 and the heat transfer plate 120 are connected via a BGA package, as shown in FIG2 , the electronic assembly 100 may further include a plurality of first solder balls 91 located between the heat transfer plate 120 and the first chip 10; the heat transfer plate 120 is connected to the plurality of first contacts via the plurality of first solder balls 91.

[0092] Illustratively, the plurality of first solder balls 91 between the heat transfer plate 120 and the first chip 10 may all be used to transmit electrical signals, such as data signals and control signals required during operation of the first chip 10 .

[0093] For example, at least one first solder ball 91 may not be used to transmit electrical signals, such as data signals or control signals required for the operation of the first chip 10, but may be used to increase heat transfer and reliability, thereby improving the heat transfer efficiency between the first chip 10 and the heat transfer plate 120. In this case, the gaps between the first solder balls 91 may be filled with a filler to further improve the heat transfer efficiency between the first chip 10 and the heat transfer plate 120.

[0094] The second chip 20 may include a plurality of second contacts on a surface adjacent to the heat transfer plate 120. For example, when the second chip 20 and the heat transfer plate 120 are connected via a BGA package, as shown in FIG2 , the electronic assembly 100 may further include a plurality of second solder balls 92 located between the heat transfer plate 120 and the second chip 20. The heat transfer plate 120 is connected to the plurality of second contacts via the plurality of second solder balls 92.

[0095] For example, the plurality of second solder balls 92 between the heat transfer plate 120 and the second chip 20 may all be used to transmit electrical signals, such as data signals and control signals required during the operation of the second chip 20 .

[0096] For example, at least one second solder ball 92 may not be used to transmit electrical signals, such as data signals or control signals required for the operation of the second chip 20, but may be used to increase heat transfer and reliability, thereby improving the heat transfer efficiency between the second chip 20 and the heat transfer plate 120. In this case, the gaps between the second solder balls 92 may be filled with a filler to further improve the heat transfer efficiency between the second chip 20 and the heat transfer plate 120.

[0097] Figure 3 is a top view of a heat transfer plate 120 provided in an embodiment of the present application. Referring to Figure 3, in some embodiments, the surface of the heat transfer plate 120 facing away from the circuit board 110 includes a heat dissipation surface 1210 and a plurality of third contacts 1220. The heat dissipation surface 1210 is electrically insulated from the plurality of third contacts 1220. The plurality of third contacts 1220 can be connected to the second chip via a plurality of second solder balls 92. In this embodiment, the third contacts 1220 can be used for both heat conduction and signal transmission. The heat dissipation surface 1210 can be used to transfer heat to an external heat dissipation structure. Exemplarily, the heat dissipation surface 1210 comprises a metal surface, which has high heat dissipation efficiency.

[0098] The heat transfer plate 120 provided in the embodiment of the present application has various structural forms, including but not limited to the following two examples.

[0099] Heat transfer plate example 1: Heat transfer plate 120 includes a PCB, which comprises a stacked metal layer and an insulating layer. Heat dissipation surface 1210 and third contact 1220 can be metal surfaces, such as copper, exposed at openings in the insulating layer. The metal layer containing the heat dissipation surface and the metal layer containing the third contact can be separated by an insulating layer to achieve electrical isolation.

[0100] Heat transfer plate example 2: Heat transfer plate 120 is a metal plate, such as a copper plate. By drilling a hole in the copper plate, providing an insulating sidewall on the inner wall of the hole, and then placing a conductive post within the insulating sidewall, a third contact capable of conducting electrical signals can be formed. The remaining surface of the copper plate can be used as a heat sink, thus achieving higher heat transfer efficiency for heat transfer plate 120.

[0101] Among them, multiple third contacts 1220 can form at least one third contact group 1230 (i.e., all third contacts 1220 in the dotted box in Figure 3 constitute one third contact group 1230). Here, one third contact group 1230 can be used to electrically connect to one second chip 20. The heat dissipation surface 1210 may include a first heat dissipation surface 1211, which can be disposed on at least one side of the third contact group 1230. For example, for a rectangular third contact group 1230, the first heat dissipation surface 1211 can be disposed on one side, two sides, three sides, or four sides of the third contact group. Figure 3 illustrates an example in which the first heat dissipation surface 1211 is disposed in a circle around the third contact group 1230.

[0102] Illustratively, the area of ​​the first heat dissipation surface 1211 is larger than the area of ​​each third contact 1220 , which is beneficial to improving the heat dissipation efficiency of the first heat dissipation surface 1211 .

[0103] Exemplarily, the heat dissipation surface 1210 may further include a second heat dissipation surface 1212. The heat transfer plate 120 may include a via, and the heat transfer plate 120 may further include a heat transfer portion disposed within the via, with the surface of the heat transfer portion facing away from the circuit board 110 serving as the second heat dissipation surface 1212. For example, a via may be drilled on the surface of the PCB board and filled with a heat transfer portion having a higher heat transfer efficiency than the insulating layer, such as copper metal, to improve heat dissipation efficiency. The heat transfer portion may be located around the third contact group 1230 or between any two third contacts 1220. There is no restriction on the size relationship between the area of ​​the second heat dissipation surface 1212 and the area of ​​the third contacts 1220; however, the electrical connection between the third contacts 1220 and the second chip 20 must not be affected.

[0104] In the embodiments of the present application, there are multiple ways to set up the external heat dissipation structure: for example, the external heat dissipation structure can be set up independently of the electronic component 100 and directly connected to the heat transfer plate 120 to quickly dissipate heat for the first chip 10 and the second chip 20 at the same time. For another example, the external heat dissipation structure can be integrated into the film layer of the circuit board 110 and then connected to the heat transfer plate 120 through a connection portion. Since the heat can pass through the first chip 10, the thermal resistance of the second chip 20 can be reduced, and the first chip 10 and the second chip 20 can be quickly dissipated at the same time. For another example, the external heat dissipation structure can be set up on the side of the second chip 20 facing away from the first chip 10 and then connected to the heat transfer plate 120 through a connection portion. Since the heat can pass through the second chip 20, the thermal resistance of the first chip 10 can be reduced, and the first chip 10 and the second chip 20 can be quickly dissipated at the same time. Below, an example of an external heat dissipation structure is provided by way of example.

[0105] Referring back to FIG. 2 and in conjunction with FIG. 3 , in some embodiments, the external heat dissipation structure may include a first heat sink 130 and a first heat conductive structure 30. The first heat sink 130 is located on the side of the second chip 20 facing away from the heat transfer plate 120. The first heat conductive structure 30 connects the heat dissipation surface 1210 of the heat transfer plate 120 and the first heat sink 130. The first heat sink 130 may be an air-cooled radiator, a liquid cooling plate, a temperature vapor chamber, or the like, and may be used to directly dissipate heat from the second chip 20. In this embodiment, since a first heat-conducting structure 30 is further provided to connect the heat dissipation surface 1210 (such as the first heat dissipation surface 1211) of the heat transfer plate 120 and the first heat sink 130, the heat of the first chip 10 can be transferred to the first heat sink 130 through the heat transfer plate 120 and the second chip 20 (the thermal resistance of this path is relatively large), and can also be transferred to the first heat sink 130 through the heat transfer plate 120 and the first heat-conducting structure 30 (the thermal resistance of this path is relatively small), thereby greatly improving the heat dissipation efficiency.

[0106] It is worth noting that, without the heat transfer plate 120 and the first heat conducting structure 30, when the power consumption of the first chip 10 is high, the heat has not yet been transferred to the first heat sink, and the junction temperature of the first chip 10 has exceeded the temperature. Therefore, it is not suitable for high power consumption scenarios. For example, a certain type of first chip 10 has a power consumption of 4W. After the heat dissipation solution is determined, the temperature of the upper first heat sink is about 35°C, while the junction temperature of the first chip 10 has exceeded 115°C, indicating that the thermal resistance between the top of the first chip 10 and the first heat sink 130 is large. Further reducing the temperature of the first heat sink 130 may further reduce the junction temperature of the first chip 10, but the cost-effectiveness is not high. In the embodiment of the present application, due to the provision of the heat transfer plate 120 and the first heat conducting structure 30, the heat of the first chip 10 can be quickly transferred to the first heat sink 130, reducing the junction temperature of the first chip 10, thereby significantly improving the working performance of the first chip 10, so that it can meet the use requirements of higher power consumption scenarios.

[0107] Exemplarily, the first heat-conducting structure 30 may include at least one of metal, alloy, graphite, pure silicon, cobalt copper and electronic components. Among them, the metal includes but is not limited to one of the elements such as copper, silver, aluminum, etc., and the alloy includes but is not limited to a combination of multiple elements such as copper, silver, aluminum, etc. Metal, alloy, graphite, pure silicon, all have high heat transfer efficiency. Cobalt copper, also known as diamond copper, is a composite material of metallic copper and diamond, which has higher heat transfer efficiency than copper. In addition, it should be noted that the electronic components can be devices with certain functions such as capacitors, inductors, resistors, etc. When the first heat-conducting structure 30 includes electronic components, while having a heat transfer function, it can also meet some electrical functional requirements, and is more practical.

[0108] In some embodiments, the first heat-conducting structure 30 can be welded to the heat dissipation surface 1210 of the heat transfer plate 120. For example, the first heat-conducting structure 30 can be welded to the first heat dissipation surface 1211 of the heat transfer plate 120. This can reduce the thermal resistance between the first heat-conducting structure 30 and the heat transfer plate 120 and improve the heat transfer efficiency.

[0109] In some embodiments, the first heat conducting structure 30 may further cover the second heat dissipation surface 1212 of the heat transfer plate 120 . For example, the first heat conducting structure 30 may further be welded to the second heat dissipation surface 1212 to further improve heat transfer efficiency.

[0110] In some embodiments, a thermal interface material (TIM) may be filled between the first heat sink 130 and the first thermally conductive structure 30. The TIM bridges microgaps at the contact interface and reduces the thermal resistance of the interface. This increases the heat transfer efficiency between the first thermally conductive structure 30 and the first heat sink 130, thereby improving the heat dissipation of the first chip 10.

[0111] In some embodiments, a thermal interface material (TIM) may be filled between the first heat sink 130 and the second chip 20. The TIM bridges microgaps at the interface and reduces thermal resistance, increasing heat transfer efficiency between the second chip 20 and the first heat sink 130 and improving the heat dissipation of the second chip.

[0112] For example, the thermal interface material between the first heat sink 130 and the first heat conducting structure 30 and the thermal interface material between the first heat sink 130 and the second chip 20 may be independent structures or integrated structures.

[0113] Figure 4 is a top view illustrating the positional relationship between the heat transfer plate 120, the second chip 20, and the first heat conductive structure 30 in Figure 2. As shown in Figure 2, in some embodiments, the first heat conductive structure 30 is located between the heat transfer plate 120 and the first heat sink 130, and the first heat conductive structure 30 is located on at least one side of the second chip 20. In this embodiment, the first heat conductive structure 30 can be located on one or more sides of the second chip 20. For example, in the example of Figure 4, if the second chip 20 is rectangular, the first heat conductive structure 30 can be disposed around the second chip 20.

[0114] In addition to the configuration of the first heat-conducting structure 30 in FIG. 4 , the configuration also includes but is not limited to the following several examples of the first heat-conducting structure 30 .

[0115] Example 1 of the First Heat-Conducting Structure: Please refer to Figure 5, which is another top view illustrating the positional relationship between the heat transfer plate 120, the second chip 20, and the first heat-conducting structure 30 in Figure 2. The first heat-conducting structure 30 includes a first heat-conducting portion 301 extending along a first direction parallel to the plane of the heat transfer plate 120. There are multiple second chips 20, and Figure 5 illustrates two second chips 20 as an example. The multiple second chips 20 are arranged along the first direction and are located on the same side of the first heat-conducting portion 301.

[0116] Based on the first example of the first heat-conducting structure 30, as shown in Figure 5, the first heat-conducting structure 30 further includes a second heat-conducting portion 302. The second heat-conducting portion 302 extends along the first direction. In the second direction, the plurality of second chips 20 are located between the first heat-conducting portion 301 and the second heat-conducting portion 302; the second direction intersects the first direction.

[0117] Figure 6 is a structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 7 is a structural diagram of yet another electronic component 100 provided in an embodiment of the present application, and Figure 8 is a top view of the positional relationship among the heat transfer plate 120, the second chip 20, and the first heat conducting structure 30 in Figure 6 or Figure 7.

[0118] Example 2 of the first heat-conducting structure: Please refer to FIG. 6 and FIG. 8 . There are multiple second chips 20 . The first heat-conducting structure 30 may be located between at least two second chips 20 .

[0119] Based on the second example of the first heat-conducting structure, as shown in Figure 7 , heat transfer plate 120 includes an opening; first heat-conducting structure 30 is connected to first chip 10 through the opening. In this example, first heat-conducting structure 30 can be directly connected to first chip 10, further reducing the thermal resistance between first chip 10 and first heat sink 130 and improving heat dissipation efficiency.

[0120] For example, a thermal interface material is filled between the first heat conducting structure 30 and the first chip 10. The thermal interface material has a high heat transfer coefficient, which can increase the heat transfer efficiency between the first chip 10 and the first heat conducting structure 30 and improve the heat dissipation effect of the first chip 10.

[0121] Exemplarily, the heat transfer plate 120 includes a first contact surface a1 and a second contact surface a2. The first contact surface a1 is the inner wall surface of the opening, and the second contact surface a2 is located on the side of the heat transfer plate 120 facing away from the first chip 10, and the second contact surface a2 may surround the opening. The first heat-conducting structure 30 may be connected to at least one of the first contact surface a1 and the second contact surface a2. Connection methods include, but are not limited to, direct contact, gluing, welding, and the like. In this example, when the first heat-conducting structure 30 is connected to the first contact surface a1 and / or the second contact surface a2, the thermal resistance between the first heat-conducting structure 30 and the heat transfer plate 120 may be reduced, thereby improving heat transfer efficiency.

[0122] In the above description, the heat transfer plate 120 is designed to be independent of the first chip 10 as an example. In the following, a solution of integrating the heat transfer plate 120 into the first chip 10 is introduced.

[0123] Figure 9 is a structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 10 is a structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 11 is a structural diagram of another electronic component 100 provided in an embodiment of the present application, and Figure 12 is a top view of the positional relationship of the first chip 10, the second chip 20, and the first heat-conducting structure 30 in Figure 9, Figure 10, or Figure 11. Figure 13 is a structural diagram of another electronic component 100 provided in an embodiment of the present application, and Figure 14 is a top view of the positional relationship of the first chip 10, the second chip 20, and the first heat-conducting structure 30 in Figure 13.

[0124] 9 and 13 , an embodiment of the present application provides a chip structure 200 , specifically, integrating the heat transfer plate 120 described above into the chip structure 200 . This chip structure 200 can serve as the first chip 10 and be implemented in the electronic component 100 . The following description uses the chip structure 200 as the first chip 10 as an example.

[0125] The first chip 10 can expose the heat dissipation surface 1210 (referring to FIG. 3 ) and multiple third contacts 1230 (referring to FIG. 3 ) of the heat transfer plate 120. That is, the surface of the first chip 10 facing away from the circuit board 110 includes the heat dissipation surface 1210 of the heat transfer plate 120 and the multiple third contacts 1230. The heat dissipation surface 1210 can be used to connect to the first thermal conductive structure 30, and the multiple third contacts 1230 can be used to connect to the second chip 20. In this embodiment, the heat transfer plate 120 is integrated into the chip structure 200, making it easier for heat in the first chip 10 to be dissipated from the heat dissipation surface 1210 of the heat transfer plate 120, thereby improving the heat dissipation effect of the first chip 10.

[0126] Referring to Figures 12 and 14 , for solutions in which the heat transfer plate 120 is integrated into the first chip 10, the arrangement of the first heat-conducting structure 30 can still refer to any of the previous embodiments. For example, as shown in Figure 12 , the first heat-conducting structure 30 can still be arranged in a circle around the second chip 20. For another example, as shown in Figure 14 , the first heat-conducting structure 30 can still be arranged on one side of the second chip 20. In other embodiments, the first heat-conducting structure 30 can also be arranged on any one or more sides of the second chip 20, and this application is not limited to this.

[0127] Referring to FIG. 10 , in some embodiments, a chip structure 200 may include a first die 101, a heat transfer plate 120, and a first protective portion 102. The heat transfer plate 120 is disposed on one side of the first die 101. The surface of the heat transfer plate 120 facing away from the first die 101 includes a heat dissipation surface 1210 (referring back to FIG. 3 ) and a plurality of third contacts 1230 (referring back to FIG. 3 ). The heat dissipation surface 1210 is electrically insulated from the plurality of third contacts 1230. The first protective portion 102 surrounds the first die 101 and the heat transfer plate 120, with the heat dissipation surface 1210 and the third contacts 1230 exposed by the first protective portion 102. This arrangement allows heat in the first chip 10 to be more easily dissipated through the heat dissipation surface 1210 of the heat transfer plate 120, thereby improving the heat dissipation efficiency of the first chip 10.

[0128] In some embodiments, as shown in FIG10 , the first protection portion 102 includes a first packaging substrate 1021 and a first molding portion 1022 ; the surface of the first die 101 facing away from the heat transfer plate 120 is connected to the first packaging substrate 1021 ; the first molding portion 1022 is connected to the first packaging substrate 1021 and at least surrounds all or part of the side surfaces of the first die 101 and the surface of the heat transfer plate 120 facing away from the first die 101 .

[0129] Exemplarily, the heat transfer plate 120 and the first packaging substrate 1021 may be connected via the aforementioned BGA packaging method or LGA packaging method.

[0130] Exemplarily, the chip structure 200 further includes a heat conducting portion 103, which is located within the first plastic encapsulation portion 1022 and connects the first packaging substrate 1021 and the heat transfer plate 120. The heat conducting portion 103 may be a third solder ball 1031, and the number of third solder balls 1031 may be multiple, for example, at least one circle of third solder balls 1031 is arranged around the first die 101, with the third solder balls 1031 in each circle being spaced apart.

[0131] In this embodiment, by providing a heat conducting portion 103 to connect the first packaging substrate 1021 and the heat transfer plate 120, the heat in the first chip 10 is more easily transferred to the heat transfer plate 120, so that the heat is conducted to the above-mentioned first heat conducting structure 30 and the first heat sink 130 through the heat dissipation surface of the heat transfer plate 120, thereby improving the heat dissipation efficiency.

[0132] Exemplarily, as shown in FIG. 11 , the chip structure 200 further includes a connecting plate 104 . The connecting plate 104 is stacked between the first die 101 and the heat transfer plate 120 , and the connecting plate 104 contacts both the first die 101 and the heat transfer plate 120 .

[0133] In this example, by adding the connecting plate 104 , the heat of the first die 101 can be better transferred to the heat transfer plate 120 , resulting in higher heat transfer efficiency and making it less likely for the first die 101 to overheat.

[0134] The chip structure 200 provided in the embodiment of the present application can be used as the first chip 10 in the aforementioned electronic component 100. When forming the electronic component 100, there is no need to assemble a separate heat transfer plate 120 again, and the assembly process is simpler.

[0135] Figure 15 is a structural diagram of another electronic component 100 provided in an embodiment of the present application. In some embodiments, as shown in Figure 15, the electronic component 100 further includes: a support structure 81, which is located between the heat transfer plate 120 and the circuit board 110, and simultaneously connects the heat transfer plate 120 and the circuit board 110. In this embodiment, the support structure 81 can be used to support the heat transfer plate 120 to increase the reliability of the electronic component 100. The support structure 81 here is not limited to metal, non-metallic materials, and certain functional devices. The connection between the support structure 81 and the heat transfer plate 120 is not limited to adhesive bonding, welding, and direct physical contact. The connection between the support structure 81 and the circuit board 110 is not limited to adhesive bonding, welding, and direct physical contact.

[0136] For example, the support structure 81 can be configured as a second heat-conducting structure, so as to simultaneously increase the thermal interaction characteristics between the heat transfer plate 120 and the circuit board 110 , thereby enhancing heat dissipation.

[0137] For example, the support structure 81 may be disposed around the first chip 10. In this way, the support effect of the support structure 81 on the heat transfer plate 120 may be enhanced, with high stability and reliability.

[0138] Figure 16 is a structural diagram of another electronic component 100 provided in an embodiment of the present application. In some embodiments, as shown in Figure 16, the electronic component 100 further includes: a third heat-conducting structure 82 and a second heat sink 83. The second heat sink 83 is located on the side of the circuit board 110 facing away from the heat transfer plate 120; the third heat-conducting structure 82 is located between the heat transfer plate 120 and the second heat sink 83. The third heat-conducting structure 82 passes through an opening in the circuit board 110, with one end of the third heat-conducting structure 82 connected to the heat transfer plate 120 and the other end connected to the second heat sink 83. In this embodiment, the third heat-conducting structure 82 can pass through the circuit board 110 and directly thermally connect to the second heat sink 83 on the side of the circuit board 110 facing away from the first chip 10, thereby achieving efficient heat transfer from the heat transfer plate 120 to the second heat sink 83 on the side of the circuit board 110 facing away from the first chip 10, thereby achieving a heat dissipation effect. The third heat-conducting structure 82 herein is not limited to metal, non-metal, or alloy.

[0139] Exemplarily, the third heat conducting structure 82 is disposed around the first chip 10. Here, the third heat conducting structure 82 can also play a role in supporting the heat transfer plate 120.

[0140] For example, the third heat-conducting structure 82 and the second heat sink 83 are connected by welding or by a thermal interface material, so that the third heat-conducting structure 82 and the second heat sink 83 have a higher heat transfer efficiency.

[0141] For example, the third heat conducting structure 82 and the second heat sink 83 are an integrated structure, so that the third heat conducting structure 82 and the second heat sink 83 have a higher heat transfer efficiency.

[0142] In some embodiments, with respect to the chip structure 200, reference can be made to any one or more of the preceding embodiments, and at least one of the first heat-conducting structure 30, the support structure 81, and the third heat-conducting structure 82 can be provided on the chip structure 200. It should be noted that the solutions in all embodiments of the first heat-conducting structure 30, the support structure 81, and the third heat-conducting structure 82 can be provided separately or simultaneously, that is, the embodiments can be combined, and the technical solutions formed by the combination should be covered by the protection scope of this application.

[0143] For the chip structure 200 and the electronic component 100, for example, the heat transfer plate 120 and at least one of the first heat conducting structure 30, the support structure 81 and the third heat conducting structure 82 can also be made into an integrated structure (see the above text, which will not be repeated here) to further reduce thermal resistance and improve heat transfer performance.

[0144] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic component, characterized in that, Comprising: A circuit board, a first chip, a second chip, and a heat transfer plate; the heat transfer plate is located on one side of the circuit board; The first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, and the first chip is connected to the heat transfer plate; the second chip is located on the side of the heat transfer plate away from the circuit board, and the second chip is connected to the heat transfer plate.

2. The electronic component according to claim 1, wherein One side surface of the first chip close to the heat transfer plate includes a plurality of first contacts; The electronic component further includes a plurality of first solder balls located between the heat transfer plate and the first chip; the heat transfer plate is connected to the plurality of first contacts through the plurality of first solder balls, and at least one of the plurality of first solder balls is not used for transmitting electrical signals.

3. The electronic component according to claim 1 or 2, characterized in that, One side surface of the second chip close to the heat transfer plate includes a plurality of second contacts; The electronic component further includes a plurality of second solder balls located between the heat transfer plate and the second chip; the heat transfer plate is connected to the plurality of second contacts through the plurality of second solder balls, and at least one of the plurality of second solder balls is not used for transmitting electrical signals.

4. The electronic component according to any one of claims 1 to 3, characterized in that The electronic component further includes a filling adhesive filled between the heat transfer plate and the first chip, and / or filled between the heat transfer plate and the second chip.

5. The electronic component according to claim 1, characterized in that, The first chip includes a first die and a first protection part; the heat transfer plate is disposed on the side of the first die away from the circuit board; the surface of the heat transfer plate away from the circuit board includes a heat dissipation surface and a plurality of third contacts, and the heat dissipation surface is electrically insulated from the plurality of third contacts; the first protection part surrounds the first die and the heat transfer plate, and the first protection part exposes the heat dissipation surface and the third contacts; the plurality of third contacts are connected to the second chip.

6. The electronic component according to claim 5, characterized in that The first protection part includes a first encapsulation substrate and a first plastic sealing part; the surface of the first die away from the heat transfer plate is connected to the first encapsulation substrate; the first plastic sealing part is connected to the first encapsulation substrate and at least surrounds the side surface of the first die, all or part of the surface of the heat transfer plate close to the first die; The first chip further includes a heat conduction part located within the first plastic sealing part, and the heat conduction part is connected to the first encapsulation substrate and the heat transfer plate.

7. The electronic component according to claim 6, wherein The number of the heat conduction parts is one or more, and at least one of the heat conduction parts is configured to be capable of conducting electrical signals.

8. The electronic component according to any one of claims 5-7, wherein The first die is connected to the heat transfer plate; Or, the first chip further includes a connection board stacked between the first die and the heat transfer plate, and the connection board is simultaneously connected to the first die and the heat transfer plate.

9. The electronic component according to any one of claims 1-4, characterized in that, The surface of the heat transfer plate away from the circuit board includes a heat dissipation surface and a plurality of third contacts, the heat dissipation surface is electrically insulated from the plurality of third contacts, and the plurality of third contacts are connected to the second chip.

10. The electronic component according to any one of claims 5-9, characterized in that, The plurality of third contacts form at least one third contact group; the heat dissipation surface includes a first heat dissipation surface surrounding at least one side of the third contact group.

11. The electronic component according to any one of claims 5-10, characterized in that, The heat dissipation surface further includes a second heat dissipation surface; The heat transfer plate includes a through hole; the heat transfer plate includes a heat transfer portion located in the through hole, and the heat transfer portion includes the second heat dissipation surface.

12. The electronic component according to any one of claims 5-11, characterized in that, Also includes a first heat sink and a first heat conducting structure; The first heat sink is located on a side of the second chip away from the heat transfer plate; The first heat-conducting structure connects the heat dissipation surface of the heat transfer plate and the first heat sink.

13. The electronic component according to claim 12, characterized in that, The first heat-conducting structure is connected to the heat dissipation surface of the heat transfer plate by welding or thermal interface material; or, The first heat-conducting structure and the heat transfer plate are an integrated structure.

14. The electronic component according to claim 12 or 13, characterized in that: A thermal interface material is filled between the first heat sink and the first heat conductive structure, or the first heat sink and the first heat conductive structure are an integrated structure; and / or, A thermal interface material is filled between the first heat sink and the second chip.

15. The electronic component according to any one of claims 12 to 14, characterized in that: The first heat-conducting structure is located between the heat transfer plate and the first heat sink, and the first heat-conducting structure is located on at least one side of the second chip.

16. The electronic component according to claim 15, wherein: The first heat-conducting structure includes a first heat-conducting portion, the first heat-conducting portion extends along a first direction, and the first direction is parallel to the plane where the heat transfer plate is located; There are multiple second chips; the multiple second chips are arranged along the first direction, and the multiple second chips are located on the same side of the first heat conducting portion.

17. The electronic component according to claim 16, wherein The first heat-conducting structure further includes a second heat-conducting portion, and the second heat-conducting portion extends along the first direction; Along a second direction, the plurality of second chips are located between the first heat conducting portion and the second heat conducting portion; the second direction intersects the first direction.

18. The electronic component according to claim 17, wherein: There are multiple second chips; and the first heat-conducting structure is located between at least two of the second chips.

19. The electronic component according to claim 18, wherein: The heat transfer plate includes an opening; The first heat conducting structure is connected to the first chip through the opening.

20. The electronic component according to claim 19, wherein A thermal interface material is filled between the first heat-conducting structure and the first chip.

21. The electronic component according to claim 19 or 20, characterized in that The heat transfer plate includes a first contact surface and a second contact surface; The first contact surface is an inner wall surface of the opening, the second contact surface is located on a side of the heat transfer plate facing away from the first chip, and the second contact surface surrounds the opening; The first heat conducting structure is connected to at least one of the first contact surface and the second contact surface.

22. The electronic component according to any one of claims 1-21, characterized in that, Also includes: The supporting structure is located between the heat transfer plate and the circuit board, and simultaneously connects the heat transfer plate and the circuit board.

23. The electronic component according to claim 22, wherein: The support structure is configured as a second heat-conducting structure, and the second heat-conducting structure and the heat transfer plate are an integrated structure; And / or, the support structure is arranged around the first chip.

24. The electronic component according to any one of claims 1-23, characterized in that, Also includes: a third heat conducting structure and a second heat sink; The second heat sink is located on a side of the circuit board away from the heat transfer plate; The third heat conducting structure is located between the heat transfer plate and the second heat sink. The third heat conducting structure passes through the opening on the circuit board. One end of the third heat conducting structure is connected to the heat transfer plate, and the other end is connected to the second heat sink.

25. The electronic component according to claim 24, characterized in that, The third heat-conducting structure is configured in at least one of the following ways: The third heat conducting structure is arranged around the first chip; Alternatively, the third heat-conducting structure is connected to the second heat sink by welding or thermal interface material, or the third The heat conducting structure and the second heat sink are an integrated structure; Alternatively, the third heat conducting structure and the heat transfer plate are an integrated structure.

26. A chip structure, characterized in that, The device comprises a first die, a heat transfer plate, and a first protective portion; the heat transfer plate is disposed on one side of the first die; a surface of the heat transfer plate facing away from the first die comprises a heat dissipation surface and a plurality of third contacts, the heat dissipation surface being electrically insulated from the plurality of third contacts; the first protective portion surrounds the first die and all or part of a side of the heat transfer plate close to the first die, and the first protective portion exposes the heat dissipation surface and the third contacts.

27. The chip structure according to claim 26, wherein The first protection portion includes a first packaging substrate and a first plastic sealing portion; the surface of the first die facing away from the heat transfer plate is connected to the first packaging substrate; the first plastic sealing portion is connected to the first packaging substrate and at least surrounds the side surfaces of the first die and all or part of the surface of the heat transfer plate close to the first die; The first chip further includes a heat conducting portion, which is located in the first plastic packaging portion and connects the first packaging substrate and the heat transfer plate.

28. The chip structure according to claim 27, characterized in that: There are one or more heat conducting parts, wherein at least one heat conducting part is configured to conduct electrical signals.

29. The chip structure according to any one of claims 26 to 28, characterized in that: The first die is connected to the heat transfer plate; Alternatively, the first chip further includes a connecting plate, the connecting plate is stacked between the first die and the heat transfer plate, and the connecting plate simultaneously connects the first die and the heat transfer plate.

30. The chip structure according to any one of claims 26 to 29, characterized in that: The invention also includes: a first heat-conducting structure, located on a side of the heat transfer plate facing away from the first die; the first heat-conducting structure and the heat transfer plate are an integrated structure; or, It also includes a second heat-conducting structure, located on a side of the heat transfer plate facing the first die; the second heat-conducting structure and the heat transfer plate are an integrated structure; or, It also includes a third heat-conducting structure, which is located on a side of the heat-conducting plate facing the first bare chip; the third heat-conducting structure and the heat-conducting plate are an integrated structure.

31. An electronic device, characterized in that, Comprising the electronic component according to any one of claims 1-25, or the chip structure according to any one of claims 26-30.

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