Support, incline-mounted module, circuit module, electronic device, and method for manufacturing circuit module

Abstract

A support (1) is mounted on a circuit board (3) to support an electronic component (2) and at least comprises: at least one first mounting surface (1a), which is a surface on which a mounting surface (2a) of the electronic component (2) is mounted; a second mounting surface (1b), which is a surface with which the support (1) is mounted on the circuit board (3); a first electrode (11) and a second electrode (12), each of which is exposed on each of the first mounting surface (1a) and the second mounting surface (1b) and is formed from a metallic material; and a receiving portion (20) that receives a surface of the electronic component (2) different from the mounting surface (2a), wherein the first mounting surface (1a) is inclined with respect to the second mounting surface (1b) at an inclination angle θ between 5° and 85° inclusive, and the first electrode (11) and the second electrode (12) function as primary heat conduction elements in the support (1) and conduct heat from the first mounting surface (1a) to the second mounting surface (1b).

Description

Support, tilt-mounted module, circuit module, electronic device, and method of manufacturing circuit module

[0001] The present invention relates to an inclined mounting technology for mounting electronic components at an angle and its application technology. Specifically, the present invention relates to a support for inclined mounting on which electronic components are mounted, an inclined mounting module including the support, a circuit module including the inclined mounting module, an electronic device including the support, and a method for manufacturing the circuit module.

[0002] 2. Description of the Related Art Conventionally, tilted mounting techniques have been known in which electronic components such as solid-state light emitting elements or detector elements are mounted at an angle relative to a substrate (see, for example, Patent Documents 1, 2, and 3).

[0003] When mounting electronic components on a substrate at an incline, it is possible to use a support for inclined mounting having an inclined surface. In this case, by mounting the electronic components on the inclined surface formed on the support, an inclined mounting module can be obtained in which the electronic components are mounted on the support in an inclined position. Furthermore, by mounting this inclined mounting module on a circuit board, a circuit module can be obtained in which the electronic components mounted on the support are inclined relative to the circuit board. Note that surface-mounted electronic components are now mainstream, and electrode materials primarily composed of copper are used for mounting them.

[0004] JP 2013-143319 A Japanese Patent No. 5007395 A International Publication No. 2011 / 102335

[0005] However, a support for inclined mounting has two mounting surfaces: a first mounting surface (inclined surface) on which electronic components are mounted and a second mounting surface for mounting the support itself on a substrate. However, these two mounting surfaces are not parallel. This complicates the manufacturing process of the circuit module, particularly when surface-mount electronic components are mounted in an inclined manner.

[0006] Specifically, when manufacturing a circuit module in which electronic components are mounted at an angle relative to a circuit board using a support for inclined mounting, a first mounting process is performed in which the first mounting surface of the support on which the electronic components are mounted is made horizontal, and the electronic components are mounted by soldering, followed by a second mounting process in which the orientation of the support on which the electronic components are mounted is changed so that the second mounting surface of the support (the surface that is mounted on the board) is made horizontal, and the support is mounted on the circuit board by soldering. However, this type of circuit module manufacturing method has the following problems.

[0007] When manufacturing a circuit module having the above structure, in the first mounting step of mounting electronic components on a support, a solder paste is applied to the support in advance, the electronic components are placed on the support, and the support is heated in a furnace and cooled to solder-bond the electronic components to the support. Similarly, in the second mounting step of mounting the support on a circuit board, a solder paste is applied to the circuit board in advance, the support is placed on the circuit board, and the support is heated in a furnace and cooled to solder-bond the support to the circuit board.

[0008] Thus, when manufacturing a circuit module having the above structure, a solder mounting process (e.g., a reflow process) must be performed at least twice. However, if the same type of solder is used in the first and second mounting processes, the solder that solidified in the first mounting process will melt in the second mounting process, causing electronic components that were supposed to be fixed to the inclined first mounting surface to slide down the inclined surface and become displaced from their predetermined positions.

[0009] Therefore, it is conceivable to use different types of solder with different melting points in the first and second mounting processes, but doing so would require the use of two solder mounting devices (e.g., reflow devices) with different heating temperatures, which would inevitably complicate the manufacturing process and increase the number of items that must be managed during the manufacturing process.

[0010] It is also possible to use the same type of solder in the first and second mounting steps, but to lower the heating temperature in the second mounting step to prevent the solder from melting in the first mounting step, but doing so may result in a decrease in the mounting quality in the second mounting step.

[0011] The present invention has been made to solve such problems, and aims to provide a support or the like that allows for manufacturing an inclined mounting module using a simple construction method without using advanced technology.

[0012] In order to achieve the above-mentioned object, one aspect of the support according to the present invention is a support that supports an electronic component and is mounted on a substrate, the support having at least one or more first mounting surfaces that are surfaces on which the mounting surfaces of the electronic components are mounted, a second mounting surface that is the surface on which the support is mounted on the substrate, a first electrode and a second electrode that are exposed on the first mounting surface and the second mounting surface, respectively, and that are made of a metal material, and a receiving portion that receives a surface of the electronic component that is different from the mounting surface, wherein the first mounting surface is inclined with respect to the second mounting surface at an inclination angle of 5° to 85°, and the first electrode and the second electrode function as primary heat conductors in the support, conducting heat from the first mounting surface to the second mounting surface.

[0013] Moreover, one aspect of an angled mounting module according to the present invention includes the support body described above, and an electronic component mounted on the first mounting surface of the support body.

[0014] Furthermore, one aspect of the circuit module according to the present invention comprises the above-mentioned inclined mounting module and a substrate on which the support body in the inclined mounting module is mounted, wherein the support body is mounted to the substrate via the second mounting surface, and the substrate is a circuit board.

[0015] An aspect of the present invention is an electronic device including at least one of the above-described angle-mounted module and the above-described circuit module.

[0016] Furthermore, one aspect of the method for manufacturing a circuit module according to the present invention is the method for manufacturing the above-mentioned circuit module, including a first mounting step of mounting an electronic component on the first mounting surface of the support via a first mounting agent; a second mounting step of mounting the support on an electrode of the circuit board via a second mounting agent; and a mounting step of mounting the electronic component to the support using the first mounting agent and mounting the support to the circuit board using the second mounting agent, wherein the mounting step is performed after the first and second mounting steps.

[0017] Another aspect of the method for manufacturing a circuit module according to the present invention is the method for manufacturing the above-mentioned circuit module, comprising: a first mounting step of mounting an electronic component on the first mounting surface of the support; a tilting step of tilting the support on which the electronic component is mounted after the first mounting step; and a second mounting step of mounting the support on which the electronic component is mounted on an electrode of the circuit board on the second mounting surface after the tilting step, wherein the first mounting direction in which the electronic component is mounted on the support in the first mounting step and the second mounting direction in which the support is mounted on the electrode of the circuit board in the second mounting step are the same direction.

[0018] According to the present invention, it is possible to provide a support that enables manufacturing of an inclined mounting module by a simple method without using advanced technology.

[0019] Furthermore, according to the present invention, it is possible to provide an inclined mounting module, a circuit module, an electronic device, etc., which have good utilization efficiency of the active characteristics of electronic components in diagonal directions relative to the main surface of the substrate, and good utilization efficiency of the passive characteristics of electronic components relative to physical characteristics reaching the main surface of the substrate from diagonal directions.

[0020] Furthermore, the present invention can provide a method for manufacturing a circuit module that can manufacture the circuit module using a simple process.

[0021] FIG. 1 is a perspective view of a support body according to the first embodiment. FIG. 2 is a side view of the support body according to the first embodiment. FIG. 3 is a front view of the support body according to the first embodiment. FIG. 4 is a perspective view of an inclined mounting module according to the first embodiment. FIG. 5 is a side view of the inclined mounting module according to the first embodiment. FIG. 6 is a perspective view showing a portion of a circuit module according to the first embodiment. FIG. 7 is a side view showing a portion of a circuit module according to the first embodiment. FIG. 8 is a diagram for explaining an example of a manufacturing method of a circuit module according to the first embodiment. FIG. 9 is a diagram for explaining another example of a manufacturing method of a circuit module according to the first embodiment. FIG. 10 is a perspective view of a circuit module according to a first modification of the first embodiment. FIG. 11 is a perspective view of a circuit module according to a second modification of the first embodiment. FIG. 12 is a perspective view of a circuit module according to a third modification of the first embodiment. FIG. 13 is a perspective view of a circuit module according to a fourth modification of the first embodiment. FIG. 14 is a side view of a circuit module according to the fourth modification of the first embodiment. FIG. 15 is a perspective view of an inclined mounting module used in a circuit module according to the fourth modification of the first embodiment. FIG. 16 is a perspective view of a circuit module according to a fifth modification of the first embodiment. FIG. 17 is a perspective view of an electronic device according to the first embodiment. FIG. 18 is a schematic diagram of another example of an electronic device according to the first embodiment. FIG. 19 is a perspective view of a support according to the second embodiment. FIG. 20 is a perspective view of a circuit module according to the second embodiment. FIG. 21 is a perspective view of a support according to the third embodiment. FIG. 22 is a perspective view of a support according to the fourth embodiment. FIG. 23 is a perspective view of a support according to a modification of the fourth embodiment. FIG. 24 is a perspective view of a support according to the fifth embodiment. FIG. 25 is a diagram showing the configuration of a support according to the fifth embodiment. FIG. 26 is a perspective view of a plurality of metal blocks (first electrode, second electrode, fixed body) used in the support according to the fifth embodiment. FIG. 27 is a diagram showing the configuration of a plurality of metal blocks used in the support according to the fifth embodiment. FIG. 28 is a perspective view of a resin block in the support according to the fifth embodiment. FIG. 29 is a diagram showing the configuration of a resin block in the support according to the fifth embodiment. FIG. 30 is a perspective view of a support according to the sixth embodiment.Fig. 31 is a perspective view of an inclined mounting module according to embodiment 6. Fig. 32 is a perspective view showing a modified example of a first electrode in the support according to embodiment 6. Fig. 33 is a perspective view of a support according to a modified example of embodiment 7. Fig. 34 is a perspective view of a support according to embodiment 7. Fig. 35 is a diagram showing the configuration of the support according to embodiment 7. Fig. 36 is a perspective view of a laminated substrate used when fabricating a modified example of the support according to embodiment 3. Fig. 37 is a cross-sectional view of a laminated substrate used when fabricating a modified example of the support according to embodiment 3. Fig. 38 is a diagram showing an electrode pattern of an electronic component.

[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concept of the present invention will be described as optional components.

[0023] Note that each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, in each figure, substantially identical components are assigned the same reference numerals, and redundant explanations are omitted or simplified. Furthermore, in each figure, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. In this embodiment, the Z-axis direction is the vertical direction, and the direction perpendicular to the Z-axis (the direction parallel to the XY plane) is the horizontal direction. The X-axis and Y-axis are axes that are mutually orthogonal and are both orthogonal to the Z-axis. Note that in this specification, the terms "up" and "down" do not necessarily refer to the upward direction (vertically upward) and downward direction (vertically downward) in absolute spatial recognition.

[0024] (Embodiment 1) First, the configuration of a support body 1 according to embodiment 1 will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a perspective view of the support body 1 according to embodiment 1. Fig. 2 is a side view of the support body 1 according to embodiment 1. Fig. 3 is a front view of the support body 1 according to embodiment 1.

[0025] The support body 1 is a support member on which electronic components (not shown) are mounted, thereby supporting the electronic components. The support body 1 that supports the electronic components is mounted on a substrate (not shown), such as a circuit board. Therefore, as shown in FIGS. 1 to 3 , the support body 1 has at least a first mounting surface 1a on which the electronic components are mounted, and a second mounting surface 1b on which the support body 1 is mounted on the substrate.

[0026] The first mounting surface 1a and the second mounting surface 1b are exposed surfaces of the support body 1. Specifically, the first mounting surface 1a is the upper surface (top surface) of the support body 1, and the second mounting surface 1b is the lower surface (bottom surface) of the support body 1. Both the first mounting surface 1a and the second mounting surface 1b are flat planes (for example, surface irregularities of ±0.25 mm or less). Note that each of the first mounting surface 1a and the second mounting surface 1b may be divided into multiple surfaces. In other words, each of the first mounting surface 1a and the second mounting surface 1b may be composed of multiple separate surfaces.

[0027] The first mounting surface 1a is an inclined surface inclined with respect to the second mounting surface 1b. Specifically, the first mounting surface 1a is inclined with respect to the second mounting surface 1b at an inclination angle θ (see FIG. 2) of 5° to 85°. Therefore, the first mounting surface 1a and the second mounting surface 1b are not parallel. The inclination angle θ of the first mounting surface 1a is preferably 10° to 60°, and more preferably 20° to 50°. In this embodiment, the first mounting surface 1a is the entire inclined surface formed on the support body 1. In other words, the first mounting surface 1a is the area indicated by dotted hatching in FIGS. 1 and 3. In this embodiment, the second mounting surface 1b is the entire lower surface of the support body 1. The first mounting surface 1a may be a part of the inclined surface of the support body 1, and the second mounting surface 1b may be a part of the lower surface of the support body 1. For example, the first mounting surface 1a and the second mounting surface 1b can be regions where solder is formed.

[0028] Furthermore, in this embodiment, the number of first mounting surfaces 1 a is only one, but this is not limited thereto. Specifically, the support body 1 may have multiple first mounting surfaces 1 a with different inclination angles θ. That is, the support body 1 may have one or more first mounting surfaces 1 a. Note that, when multiple first mounting surfaces 1 a with different inclination angles are formed on the support body 1, the vectors in the parallel plane direction of each of the multiple first mounting surfaces 1 a may be oriented in one direction. In this case, the multiple first mounting surfaces 1 a with different inclination angles may be arranged vertically (up and down) or horizontally (left and right) facing in one direction.

[0029] In addition, in this embodiment, one first mounting surface 1a is configured by one surface, but this is not limited to this. For example, the first mounting surface 1a may be divided into multiple surfaces. In other words, the first mounting surface 1a may be configured by multiple surfaces with the same inclination angle θ. Similarly, the second mounting surface 1b may also be divided into multiple surfaces.

[0030] 1 to 3, the support 1 has a first electrode 11, a second electrode 12, and an insulator 13. The support 1 further has a first protector 14 and a second protector 15. Adjacent two of the first electrode 11, the second electrode 12, the insulator 13, the first protector 14, and the second protector 15 are joined to each other.

[0031] The first electrode 11 and the second electrode 12 are electrodes for supplying power to electronic components mounted on the first mounting surface 1 a. For example, one of the first electrode 11 and the second electrode 12 is a positive electrode and the other is a negative electrode. Note that if the electronic components mounted on the support 1 are driven by an AC voltage rather than a DC voltage, the first electrode 11 and the second electrode 12 do not need to be distinguished as a positive electrode or a negative electrode.

[0032] Each of the first electrode 11 and the second electrode 12 is exposed on the first mounting surface 1a. Each of the first electrode 11 and the second electrode 12 is also exposed on the second mounting surface 1b. Therefore, power can be supplied from the second mounting surface 1b to an electronic component mounted on the first mounting surface 1a. Specifically, by mounting the support 1 on the second mounting surface 1b on a circuit board, power can be supplied to the positive and negative electrodes of the electronic component mounted on the first mounting surface 1a via the pair of first electrode 11 and second electrode 12. In other words, the first electrode 11 and the second electrode 12 function as electrical conductors.

[0033] Furthermore, the first electrode 11 and the second electrode 12 not only function as electrical conductors but also as thermal conductors. Specifically, the first electrode 11 and the second electrode 12 conduct heat from the first mounting surface 1a to the second mounting surface 1b. In this embodiment, the first electrode 11 and the second electrode 12 function as the main heat conductors in the support 1. That is, although the support 1 has several thermally conductive members that conduct heat from the first mounting surface 1a to the second mounting surface 1b, the first electrode 11 and the second electrode 12 are the members that conduct the most heat from the first mounting surface 1a to the second mounting surface 1b among these thermally conductive members. Therefore, heat generated by an electronic component mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b via the first electrode 11 and the second electrode 12 and dissipated.

[0034] The electrode material used for the first electrode 11 and the second electrode 12 is a conductive material. The electrode material used for the first electrode 11 and the second electrode 12 is not particularly limited as long as it is a conductive material, but from the viewpoints of processing surface and thermal conductivity, it is preferable that it contains a metal. In this embodiment, the first electrode 11 and the second electrode 12 are made of a metal material. As an example, the first electrode 11 and the second electrode 12 are at least one selected from aluminum, gold, silver, copper, or alloys containing these. These metal materials have a thermal conductivity of greater than 200 W / m·K at room temperature. In particular, since the thermal conductivity of gold, silver, or copper exceeds 300 W / m·K, by making the first electrode 11 and the second electrode 12 out of gold, silver, or copper, a support 1 with excellent thermal conductivity from the first mounting surface 1a to the second mounting surface 1b can be obtained. Furthermore, considering manufacturing costs, it is preferable that the first electrode 11 and the second electrode 12 be copper electrodes whose main component is copper. In this case, the first electrode 11 and the second electrode 12 are preferably made of a metal material (for example, brass, bronze, or copper) containing 30 wt % or more, preferably 40 wt % or more of copper.

[0035] In this embodiment, the first electrode 11 and the second electrode 12 are formed from plate-shaped metal blocks, and the end faces of the metal blocks serve as the first mounting surface 1a and the second mounting surface 1b. In this manner, partial surfaces of the first electrode 11 and the second electrode 12 serve as the first mounting surface 1a and the second mounting surface 1b. Specifically, the first electrode 11 and the second electrode 12 are plate-shaped metal blocks with a constant thickness. The first electrode 11 and the second electrode 12 are arranged in parallel.

[0036] The volume ratio of metal in the support 1 (for example, the volume ratio of the first electrode 11 and the second electrode 12 in the support 1) is preferably 30% or more, and more preferably more than 50%. This allows the support 1 to have excellent thermal conductivity from the first mounting surface 1a to the second mounting surface 1b.

[0037] Because the first electrode 11 and the second electrode 12 are exposed on the first mounting surface 1a and the second mounting surface 1b, it is possible to increase the envelope volume of the first electrode 11 and the second electrode 12. This allows the first electrode 11 and the second electrode 12 to function as thermal conductors, enabling heat generated by electronic components mounted on the first mounting surface 1a to be efficiently conducted and dissipated to the second mounting surface 1b via the first electrode 11 and the second electrode 12.

[0038] Each of the first electrode 11 and the second electrode 12 extends at least on the first mounting surface 1a in the inclined direction of the first mounting surface 1a. That is, the exposed portions of each of the first electrode 11 and the second electrode 12 on the first mounting surface 1a extend along the inclined direction of the first mounting surface 1a. Note that each of the first electrode 11 and the second electrode 12 also extends on the second mounting surface 1b. Specifically, on the second mounting surface 1b, each of the first electrode 11 and the second electrode 12 extends along the X-axis direction.

[0039] The first electrode 11 and the second electrode 12 have different electrode widths on the first mounting surface 1a and the second mounting surface 1b. Specifically, on each of the first mounting surface 1a and the second mounting surface 1b, the electrode width of the second electrode 12 is larger than the electrode width of the first electrode 11. Note that the electrode width of the first electrode 11 and the electrode width of the second electrode 12 may be the same.

[0040] The insulator 13 is located between the first electrode 11 and the second electrode 12. The insulator 13 is an insulating member for insulating the first electrode 11 from the second electrode 12. The insulator 13 is made of an insulating material having insulating properties. The insulating material that makes up the insulator 13 is, for example, a resin or a ceramic.

[0041] The insulator 13 is exposed on each of the first mounting surface 1a and the second mounting surface 1b. In this embodiment, the insulator 13 is a plate-shaped insulating member, and end faces of the insulator 13 form the first mounting surface 1a and the second mounting surface 1b. In this manner, partial surfaces of the insulator 13 form the first mounting surface 1a and the second mounting surface 1b. Specifically, the insulator 13 is a plate-shaped insulating member with a constant thickness.

[0042] The plate-shaped insulator 13 is sandwiched between the first electrode 11 and the second electrode 12. Therefore, one side of the insulator 13 is in contact with the side of the first electrode 11, and the other side of the insulator 13 is in contact with the side of the second electrode 12. Therefore, the first electrode 11 and the second electrode 12 are separated by the width of the insulator 13. Note that the insulator 13 does not have to be a tangible object, and may simply be a gap (air layer). In other words, the first electrode 11 and the second electrode 12 may be insulated and separated by a gap.

[0043] The first protector 14 covers the side surface of the first electrode 11 opposite to the insulator 13 side. The second protector 15 covers the side surface of the second electrode 12 opposite to the insulator 13 side. The first protector 14 and the second protector 15 form part of the outer periphery of the support 1.

[0044] In this embodiment, the first protector 14 and the second protector 15 are protective films or plates thinner than the first electrode 11 and the second electrode 12. The first protector 14 and the second protector 15 are made of, for example, a metal material or a resin material. That is, the first protector 14 and the second protector 15 are metal films or resin films, or metal plates or resin plates. The first protector 14 and the second protector 15 may be made of a material other than a metal material or a resin material. The first protector 14 and the second protector 15 may be made of a conductive material such as a metal material, but are preferably made of an insulating material such as an insulating resin material. This allows the outer periphery of the support 1 to be an insulating portion rather than a live portion. The support 1 does not necessarily have to have the first protector 14 and the second protector 15. That is, the side surfaces of the first electrode 11 and the second electrode 12 may be exposed.

[0045] Although not shown, the support 1 may also include a fixing body for the purpose of ensuring the mechanical strength of the support 1 against vibration. The support 1 may also include a heat sink for dissipating heat from heat-generating electronic components. In this case, the fixing body may also serve as the heat sink, or the heat sink may also serve as the fixing body. The first electrode 11 may also serve as the fixing body and / or the heat sink, or the second electrode 12 may also serve as the fixing body and / or the heat sink.

[0046] The support body 1 has a receiving portion 20 that receives a surface of the electronic component other than the mounting surface (the surface that is bonded to the first mounting surface 1a). The receiving portion 20 has a receiving surface 20a that receives a surface of the electronic component other than the mounting surface.

[0047] When the mounting surface of an electronic component is the back surface of the electronic component, the receiving portion 20 receives the side surface of the electronic component. In other words, when the mounting surface of the electronic component is placed on the first mounting surface 1a of the support 1, the receiving surface 20a of the receiving portion 20 receives the side surface of the electronic component. In this case, the receiving portion 20 may receive the entire side surface of the electronic component, or may receive only a portion of the side surface of the electronic component. The receiving portion 20 functions as a displacement prevention portion that prevents the electronic component placed on the first mounting surface 1a from moving in a direction that reduces the distance between the first mounting surface 1a and the second mounting surface 1b (i.e., downward from the first mounting surface 1a). In other words, the electronic component abuts against the receiving surface 20a of the receiving portion 20, thereby restricting movement of the electronic component. In this embodiment, the receiving portion 20 is a protrusion that protrudes from the first mounting surface 1a. In this case, the receiving surface 20a of the receiving portion 20 forms a side wall surface of the protrusion.

[0048] The support 1 also has a suction portion 30, which is a portion that is suctioned by a suction nozzle when the support 1 is mounted on a substrate. The suction portion 30 is located on the rear side of the second mounting surface 1b and is a plane parallel to the second mounting surface 1b. Therefore, the plane that forms the suction portion 30 is inclined with respect to the first mounting surface 1a. In this embodiment, the plane that forms the suction portion 30 is formed continuously with the first mounting surface 1a. Specifically, the suction portion 30 is an exposed surface of the first electrode 11, the second electrode 12, and the insulator 13.

[0049] By providing the suction portion 30 on the support 1 in this manner, the support 1 can be easily attached and detached in a direction perpendicular to the second mounting surface 1b using a mounting machine or the like equipped with a suction nozzle. This makes it possible to handle the support 1 and easily place the support 1 on a substrate using a mounting machine for industrial production. Specifically, the suction portion 30 of the support 1 is sucked by a suction nozzle, and the support 1 is moved in the vertical direction, and the support 1 can be placed on a substrate arranged so as to be parallel to a horizontal plane extending perpendicular to the direction of gravity, thereby easily mounting the support 1 on the substrate.

[0050] In the present embodiment, the suction unit 30 is provided on the top surface of the support 1, but the position of the suction unit 30 on the support 1 is not particularly limited. For example, the suction unit 30 may be provided on the bottom of the support 1 or in the middle in the height direction.

[0051] The envelope volume of the support 1 configured in this manner is, for example, 25 mm ３ (0.025 cm ３ ) or more 30cm ３ It is preferable that the value is equal to or less than 30 mm. ３ (0.030 cm ３ ) or more than 8000 mm ３ (8cm ３ ) or less, and particularly preferably 30 mm ３ (0.030 cm ３ ) or more than 1000 mm ３ (1 cm ３ By providing the support body 1 with such an envelope volume, the support body 1 becomes preferable for mounting electronic components such as LEDs at an angle on the first mounting surface 1a, which is an inclined surface.

[0052] As shown in Figures 4 and 5, an inclined mounting module 100 can be obtained by mounting an electronic component 2 on the first mounting surface 1a of the support body 1. That is, the inclined mounting module 100 includes the support body 1 and the electronic component 2 mounted on the first mounting surface 1a of the support body 1. Figure 4 is a perspective view of the inclined mounting module 100 according to the first embodiment. Figure 5 is a side view of the inclined mounting module 100 according to the first embodiment.

[0053] The electronic component 2 mounted on the support 1 is, for example, a solid-state light-emitting element such as an LED (Light Emitting Diode) or a semiconductor laser. In this embodiment, the electronic component 2 is an LED. Specifically, the electronic component 2 is an individually packaged surface mount device (SMD) type LED element. For example, a white LED package (package size: 3.5 mm × 3.5 mm × 2.35 mm) can be used as the electronic component 2.

[0054] When the electronic component 2 is a solid-state light-emitting element, the type of light emitted by the solid-state light-emitting element is not particularly limited. For example, the electronic component 2 may be a solid-state light-emitting element that emits one electromagnetic wave selected from ultraviolet light, visible light, and infrared light.

[0055] Here, the ultraviolet light can be at least one selected from UV-A rays (315 nm to 400 nm), UV-B rays (280 nm to 315 nm), and UV-C rays (100 nm to 280 nm).

[0056] The visible light can be at least one selected from purple light (380 nm to 430 nm), blue light (430 nm to 490 nm), green light (490 nm to 550 nm), yellow light (550 nm to 590 nm), orange light (590 nm to 640 nm), red light (640 nm to 780 nm), and white light.

[0057] In this case, the white light can be at least one selected from, for example, incandescent light (correlated color temperature: 2600K to 3250K), warm white (3250K to 3800K), white (3800K to 4500K), daylight white (4600K to 5500K), and daylight (5700K to 7100K).

[0058] The infrared ray may be at least one selected from IR-A waves (0.78 μm to 1.4 μm), IR-B waves (1.4 μm to 3 μm), and IR-C waves (3 μm to 1000 μm).

[0059] The electronic component 2 may have a passive characteristic of receiving a physical characteristic, rather than an active characteristic such as outputting light like a solid-state light-emitting element. For example, the electronic component 2 may be a detection element (sensor) such as a semiconductor detection element that receives physical characteristics such as light, sound, temperature, pressure, and odor. Examples of the detection element that can be used include a light detection element that detects light, a sound detection element that detects sound, a temperature detection element that detects temperature, a pressure detection element that detects pressure, and an odor detection element that detects odors.

[0060] Examples of light detection elements that can be used include photodiodes, CCDs (Charge Coupled Devices), and CMOS (Complementary Metal-Oxide-Semiconductor) image sensors. Examples of sound detection elements that can be used include piezoelectric elements and condenser microphones. Examples of temperature detection elements that can be used include thermoelectric elements and thermistors. Examples of pressure detection elements that can be used include semiconductor pressure sensors. Examples of odor detection elements that can be used include semiconductor gas sensors. Note that the types of detection targets detected by the detection elements are not limited to light, sound, temperature, pressure, and odors.

[0061] Furthermore, the electronic component 2 may be something other than a solid-state light-emitting element or a detector. In either case, the electronic component 2 is preferably a surface-mount type. This eliminates the need for additional processing to mount the electronic component 2 on the first mounting surface 1a of the support body 1, and the electronic component 2 can be mounted on the support body 1 simply by placing the electronic component 2 on the first mounting surface 1a via a bonding agent such as solder. This makes it possible to obtain an angle-mounted module 100 with excellent industrial productivity.

[0062] When mounting the electronic component 2 on the support 1, the electronic component 2 can be mounted on the first mounting surface 1a of the support 1 by a mounting technique using a bonding agent. Therefore, although not shown, a bonding agent is present between the first mounting surface 1a of the support 1 and the electronic component 2. For example, solder can be used as the bonding agent for bonding the support 1 and the electronic component 2. In this case, the electronic component 2 can be mounted on the support 1 by a solder mounting technique using solder.

[0063] The electronic component 2 is mounted on the first mounting surface 1a of the support 1. The electronic component 2 mounted on the support 1 abuts against a receiving portion 20 of the support 1. In this embodiment, the side surface 2b of the electronic component 2 abuts against the receiving surface 20a of the receiving portion 20. Specifically, when the mounting surface 2a of the electronic component 2 is placed on the first mounting surface 1a of the support 1, the receiving surface 20a of the receiving portion 20 abuts against the side surface 2b of the electronic component 2.

[0064] Furthermore, since the first mounting surface 1a of the support body 1 is an inclined surface that is inclined with respect to the second mounting surface 1b, the electronic component 2 mounted on the first mounting surface 1a is mounted in an inclined position on the support body 1. As a result, when the inclined mounting module 100 is mounted on a substrate, the electronic component 2 is inclined with respect to the main surface of the substrate.

[0065] For example, when the electronic component 2 is a solid-state light-emitting element, a lighting module that can output light from the solid-state light-emitting element in a direction oblique to the main surface of the substrate can be obtained as the inclined mounting module 100. When the electronic component 2 is a detecting element, a sensor module that can detect a physical property (such as light) that is incident obliquely to the main surface of the substrate can be obtained as the inclined mounting module 100.

[0066] In this way, the inclined mounting module 100 of this embodiment can improve the efficiency of utilization of the active characteristics of the electronic component 2 in diagonal directions relative to the main surface of the substrate, and can improve the efficiency of utilization of the passive characteristics of the electronic component 2 relative to physical characteristics that reach the main surface of the substrate from diagonal directions.

[0067] The outer shape of at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a of the support 1 may be the same or substantially the same as the outer shape of either one of the first electrode and the second electrode exposed on the mounting surface of the electronic component 2 to be joined via solder. This allows either the first electrode or the second electrode exposed on the mounting surface of the electronic component 2 to be joined by molten solder to one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a so that their outer shapes match. In other words, when the molten solder solidifies, it is possible to prevent the electronic component 2 mounted on the first mounting surface 1a from rotating and becoming misaligned. This allows for an inclined mounting module 100 that is convenient for precise control of the mounting position of the electronic component 2.

[0068] Furthermore, rather than just one of them, it is even more preferable if the outer shape of the first electrode 11 of the support 1 exposed on the first mounting surface 1a is the same or approximately the same as the outer shape of the first electrode exposed on the mounting surface of the electronic component 2, and the outer shape of the second electrode 12 of the support 1 exposed on the first mounting surface 1a is the same or approximately the same as the outer shape of the second electrode exposed on the mounting surface of the electronic component 2. In this way, both the first electrode and the second electrode exposed on the mounting surface of the electronic component 2 are joined by molten solder so that their outer shapes match those of the first electrode 11 and the second electrode 12 of the support 1 exposed on the first mounting surface 1a, respectively. This makes it possible to obtain an inclined mounting module 100 that is more convenient for precise control of the mounting position of the electronic component 2.

[0069] As shown in Figures 6 and 7, a circuit module 200 can be obtained by mounting the inclined mounting module 100 on a circuit board 3. That is, the circuit module 200 includes the inclined mounting module 100 and the circuit board 3 on which the support body 1 of the inclined mounting module 100 is mounted. Figure 6 is a perspective view showing a portion of the circuit module 200 according to the first embodiment. Figure 7 is a side view showing a portion of the circuit module 200 according to the first embodiment.

[0070] 6 and 7 , in the circuit module 200, the support 1 of the inclined mounting module 100 is mounted on the circuit board 3 via the second mounting surface 1b of the support 1. The support 1 that supports the electronic component 2 is mounted by placing the second mounting surface 1b of the support 1 on the circuit board 3. In this way, the support 1 is a support member that supports the electronic component 2 and is mounted on the circuit board 3.

[0071] When mounting the support 1 on the circuit board 3, the support 1 can be mounted on the circuit board 3 by a mounting technique using a bonding agent. Therefore, although not shown, a bonding agent is present between the second mounting surface 1b of the support 1 and the circuit board 3. For example, solder can be used as the bonding agent that bonds the support 1 and the circuit board 3. In this case, the support 1 can be mounted on the circuit board 3 by a solder mounting technique using solder.

[0072] In this embodiment, the bonding agent used when mounting the support 1 on the circuit board 3 and the bonding agent used when mounting the electronic component 2 on the support 1 are the same type of solder with the same melting point. Specifically, the solder used when mounting the support 1 on the circuit board 3 and the solder used when mounting the electronic component 2 on the support 1 are the same.

[0073] At least one tilt-mounted module 100 is mounted on the circuit board 3. The circuit board 3 is an example of a substrate. The circuit board 3 is a mounting board for mounting the support body 1. The circuit board 3 has a first surface which is the main surface on which the support body 1 is mounted, and a second surface which is the main surface opposite to the first surface.

[0074] In this embodiment, the circuit board 3 is a printed wiring board on which electrodes 3a (electrode pattern) of a predetermined pattern are formed. The electrodes 3a are formed on a first surface, which is one of the main surfaces of the circuit board 3. The circuit board 3 may be a double-sided wiring board on which wiring is formed on both sides. The circuit board 3 may be a resin board based on an insulating resin material, a ceramic board based on a ceramic material such as alumina, or a metal-based board based on a metal material such as aluminum or copper. The circuit board 3 is a rigid board, but may also be a flexible board. In this embodiment, the shape of the circuit board 3 in a plan view is rectangular, but is not limited thereto. The shape of the circuit board 3 in a plan view may be a polygon such as a rectangle, a circle, or another shape. The thickness of the circuit board 3 is not particularly limited.

[0075] Furthermore, since the support 1 on which the electronic components 2 are arranged in an inclined position is mounted on the circuit board 3, the electronic components 2 are inclined with respect to the main surface of the circuit board 3. Therefore, the circuit module 200 is a module in a form in which the electronic components 2 are mounted on the first mounting surface 1a which is inclined with respect to the second mounting surface 1b which is the mounting surface on the circuit board 3.

[0076] Therefore, when the electronic component 2 has an active characteristic, it is possible to realize a circuit module 200 that can utilize this active characteristic in a direction oblique to the main surface of the circuit board 3. Furthermore, when the electronic component 2 has a passive characteristic, it is possible to realize a circuit module 200 that can receive, at the electronic component 2, a physical characteristic that arrives from a direction oblique to the main surface of the circuit board 3.

[0077] For example, when the electronic component 2 is a solid-state light-emitting element, it is possible to obtain a circuit module 200 having an active function that is convenient for outputting light in an oblique direction relative to the main surface (mounting surface) of the circuit board 3. Furthermore, when the electronic component 2 is a sensing element, it is possible to obtain a circuit module 200 having a passive function that is convenient for detecting a physical property that reaches the main surface (mounting surface) of the circuit board 3 from an oblique direction.

[0078] In this way, the circuit module 200 according to this embodiment can improve the efficiency of utilization of the active characteristics of the electronic component 2 in diagonal directions relative to the main surface of the circuit board 3, and can improve the efficiency of utilization of the passive characteristics of the electronic component 2 relative to physical characteristics that reach the main surface of the circuit board 3 from diagonal directions.

[0079] Furthermore, as described above, the first electrode 11 and the second electrode 12 of the support 1 are exposed on the first mounting surface 1a and the second mounting surface 1b, respectively. This allows heat generated by the electronic component 2 mounted on the first mounting surface 1a of the support 1 to be efficiently conducted through the first electrode 11 and the second electrode 12 and then to the circuit board 3 via the second mounting surface 1b of the support 1. In this manner, the first electrode 11 and the second electrode 12, which are metal structures with a height relative to the circuit board 3, serve as the positive and negative electrodes of the electronic component 2 and can be used as a heat conduction path perpendicular to the main surface of the circuit board 3. This facilitates heat dissipation design using the metal structures with a height, enabling both high-density mounting and suppression of performance degradation due to temperature rise of the tilted-mounted electronic component 2. In other words, the support 1 of this embodiment effectively suppresses performance degradation of tilted-mounted electronic components 2 during high-density mounting.

[0080] Next, an example of a method for manufacturing the circuit module 200 shown in Figures 6 and 7 will be described with reference to Figure 8. Figure 8 is a diagram for explaining an example of a method for manufacturing the circuit module 200 according to the first embodiment.

[0081] The manufacturing method of the circuit module 200 shown in Figure 8 includes a first placement step shown in (a) of Figure 8, a second placement step shown in (b) of Figure 8, and an implementation step shown in (c) of Figure 8.

[0082] As shown in FIG. 8A , in the first mounting step, the electronic component 2 is mounted on the first mounting surface 1 a of the support 1 via a first mounting agent (not shown). The first mounting agent is a bonding agent that bonds the support 1 and the electronic component 2. In this embodiment, the first mounting agent is solder. For example, lead-free solder paste (product number: SN97C P603 D4, composition: 96.5% Sn-3% Ag-0.5% Cu, manufactured by Nippon Superior Co., Ltd.) can be used as the solder. This solder paste can also be used for the solders described below. Note that the solder paste is typically applied only to the metal portions (first electrode 11, second electrode 12) on the first mounting surface 1 a of the support 1.

[0083] In the first placing step, a dispenser device is used to apply solder paste to the first mounting surface 1a of the support 1, and the electronic component 2 is placed on the solder paste. If the electronic component 2 is a white LED package, the LED package is placed on the support 1 so that the positive and negative electrodes of the white LED package align with the first and second electrodes 11 and 12 of the support 1. At this time, the electronic component 2 is placed on the support 1 so that the electronic component 2 abuts against the receiving portion 20 of the support 1. Specifically, the side surface 2b of the electronic component 2 abuts against the receiving surface 20a of the receiving portion 20.

[0084] 8(b), in the second mounting step, the support 1 is mounted on the electrodes 3a of the circuit board 3 via a second mounting agent (not shown). The second mounting agent is a bonding agent that bonds the support 1 and the circuit board 3. In this embodiment, the second mounting agent is solder. The solder used in the second mounting step is the same as the solder used in the first mounting step.

[0085] In the second placing step, solder paste is applied onto the electrodes 3a of the circuit board 3 by a dispenser device, and the suction nozzle sucks the suction portion 30 of the support 1 to place the support 1 on the solder paste.

[0086] As shown in (c) of Figure 8, in the mounting process, the electronic component 2 is mounted on the support 1 using a first mounting agent that bonds the support 1 and the electronic component 2, and the support 1 is mounted on the circuit board 3 using a second mounting agent that bonds the support 1 and the circuit board 3.

[0087] Specifically, the structure in which the electronic component 2 is mounted on the support 1 via the solder paste and the support 1 is mounted on the circuit board 3 via the solder paste is placed in a reflow device and heated under a temperature condition that melts the solder paste to melt the solder paste, and then the solder paste is solidified. This allows the electronic component 2 to be bonded to the first mounting surface 1a of the support 1 via solder, and the support 1 to be bonded to the circuit board 3 via the solder on the second mounting surface 1b. This bonds the first electrode 11 and the second electrode 12 on the support 1 to the positive electrode and the negative electrode of the electronic component 2, which is a white LED package, and also bonds the first electrode 11 and the second electrode 12 on the support 1 to the pair of electrodes 3a on the circuit board 3.

[0088] The mounting step shown in FIG. 8C is performed after the first mounting step shown in FIG. 8A and the second mounting step shown in FIG. 8B. In this case, the order of the first and second mounting steps is not particularly limited. For example, in this embodiment, the second mounting step is performed after the first mounting step. However, the first mounting step may be performed after the second mounting step, or the first and second mounting steps may be performed simultaneously. That is, the support 1 on which the electronic component 2 is mounted via solder (first mounting agent) may be mounted on the circuit board 3 via solder (second mounting agent). Alternatively, the electronic component 2 may be mounted via solder (first mounting agent) on the support 1 mounted on the circuit board 3 via solder (second mounting agent). Alternatively, the electronic component 2 may be mounted via solder (first mounting agent) and the support 1 may be mounted on the circuit board 3 via solder (second mounting agent) at the same time.

[0089] 8(c), not only does the solder (second mounting agent) between the circuit board 3 and the support 1 melt, but the solder (first mounting agent) between the electronic component 2 and the support 1 also melt. At this time, the electronic component 2 placed on the inclined first mounting surface 1a may slide down in the direction in which the distance between the first mounting surface 1a and the second mounting surface 1b decreases (i.e., downward from the first mounting surface 1a). However, because the electronic component 2 abuts against the receiving portion 20 of the support 1, the electronic component 2 does not slide down the first mounting surface 1a. This prevents the electronic component 2 placed on the inclined first mounting surface 1a from sliding down along the first mounting surface 1a, which would otherwise cause the electronic component 2 to become misaligned.

[0090] As a result, electronic component 2 placed on first mounting surface 1 a of support body 1 can be mounted on support body 1 in an inclined state without shifting from a predetermined position, and support body 1 can be mounted on circuit board 3. In this way, according to the manufacturing method of circuit module 200 in this embodiment, circuit module 200 can be manufactured using a simple process.

[0091] Furthermore, according to the manufacturing method shown in FIG. 8 , by simply placing the circuit board 3 on which the support 1 for supporting the electronic components 2 is mounted into a reflow device once, it is possible to manufacture the circuit module 200 in which the electronic components 2 are mounted at an angle relative to the circuit board 3.

[0092] 8, the circuit module 200 is manufactured by mounting the electronic component 2 on the support 1 and then mounting the support 1 on the circuit board 3 in a single mounting step, but this is not limiting. That is, the circuit module 200 may be manufactured by separately performing the step of mounting the electronic component 2 on the support 1 and the step of mounting the support 1 on the circuit board 3. This manufacturing method will be described with reference to FIG. 9. FIG. 9 is a diagram for explaining another example of the manufacturing method for the circuit module 200 according to the first embodiment.

[0093] The manufacturing method of the circuit module 200 shown in FIG. 9 includes a first mounting step shown in FIG. 9(a), a tilting step shown in FIG. 9(b), and a second mounting step shown in FIG. 9(c).

[0094] As shown in FIG. 9A , in the first mounting step, an electronic component 2 is mounted on a first mounting surface 1 a of a support 1. Specifically, in the first mounting step, solder paste is applied to the first mounting surface 1 a of the support 1, which is positioned so that the first mounting surface 1 a is horizontal (parallel to the XY plane), and the electronic component 2 is placed on the solder paste. At this time, the electronic component 2 is placed on the support 1 so that the electronic component 2 abuts against the receiving portion 20 of the support 1. Specifically, the side surface 2 b of the electronic component 2 abuts against the receiving surface 20 a of the receiving portion 20. The support 1 on which the electronic component 2 is placed is then inserted into a reflow machine to melt the solder paste, which is then solidified. This allows the electronic component 2 to be joined to the first mounting surface 1 a of the support 1 via the solder.

[0095] 9B, in the tilting step, the support 1 on which the electronic components 2 are mounted is tilted. Specifically, the support 1 on which the electronic components 2 are mounted is rotated so that the second mounting surface 1b is in a horizontal plane (parallel to the XY plane), thereby tilting the support 1.

[0096] As shown in FIG. 9C , in the second mounting process, the support 1 on which the electronic component 2 is mounted is mounted on the electrodes 3a of the circuit board 3 via the second mounting surface 1b. Specifically, in the second mounting process, solder paste is applied to the electrodes 3a of the circuit board 3, which is arranged so that its main surface is horizontal (parallel to the XY plane). The suction portion 30 of the support 1 on which the electronic component 2 is mounted is sucked with a suction nozzle, the support 1 on which the electronic component 2 is mounted is placed on the solder paste, and the circuit board 3 on which the support 1 on which the electronic component 2 is mounted is placed is inserted into a reflow device to melt the solder paste, which is then solidified. This allows the support 1 supporting the electronic component 2 to be joined to the electrodes 3a of the circuit board 3 via the solder. The solder used in the second mounting process is the same as the solder used in the first mounting process.

[0097] In the manufacturing method of the circuit module 200 according to the present embodiment, the tilting step is performed after the first mounting step, and the second mounting step is performed after the tilting step, i.e., the tilting step is performed between the first mounting step and the second mounting step.

[0098] The first mounting direction (the direction of arrow A in FIG. 9A) in which the electronic component 2 is mounted on the support 1 in the first mounting step and the second mounting direction (the direction of arrow B in FIG. 9C) in which the support 1 is mounted on the electrodes 3 a of the circuit board 3 in the second mounting step are the same direction. In this embodiment, the first mounting direction (the direction of arrow A) and the second mounting direction (the direction of arrow B) are the direction of gravity (Z-axis direction).

[0099] In the second mounting process shown in FIG. 9C , not only does the solder (second mounting agent) between the circuit board 3 and the support 1 melt, but also the solder (first mounting agent) between the electronic component 2 and the support 1 melt. At this time, the electronic component 2 placed on the inclined first mounting surface 1a may slide down in a direction that reduces the distance between the first mounting surface 1a and the second mounting surface 1b (i.e., downward from the first mounting surface 1a). However, because the electronic component 2 abuts against the receiving portion 20 of the support 1, the electronic component 2 does not slide down the first mounting surface 1a. This prevents the electronic component 2 placed on the inclined first mounting surface 1a from sliding down along the first mounting surface 1a, which would otherwise cause the electronic component 2 to become misaligned. In other words, the mounting position of the electronic component 2 mounted on the support 1 in the first mounting process remains almost unchanged. Therefore, using the same type of mounting machine, the electronic component 2 can be mounted on the support 1 and the support 1 can be mounted on the circuit board 3 with a minimum number of mounting flows without changing the type of solder or the reflow temperature.

[0100] 9 also allows the electronic component 2 placed on the first mounting surface 1 a of the support 1 to be mounted on the support 1 in an inclined state without being displaced from a predetermined position, and also allows the support 1 to be mounted on the circuit board 3. Therefore, the manufacturing method for the circuit module 200 shown in FIG. 9 also allows the circuit module 200 to be manufactured using a simple process.

[0101] The circuit module 200 according to this embodiment has an envelope volume of, for example, 1 cm ３ More than 1m ３ It is good that it is less than 3 cm, and preferably ３More than 30000cm ３ More preferably, it is 1000 cm or less. ３ More than 10000cm ３ The circuit module 200 having such an envelope volume is preferable for configuring an LED lighting device or a detection device, for example.

[0102] 6 and 7, one obliquely mounted module 100 is arranged on one circuit board 3, but this is not limiting. Specifically, as in the circuit module 201 shown in FIG. 10, a plurality of obliquely mounted modules 100 may be arranged on one circuit board 3. In this case, as shown in FIG. 10, a plurality of the same obliquely mounted modules 100 may be mounted on the circuit board 3. Note that in FIG. 10, the electrodes 3a of the circuit board 3 are omitted. This point is the same hereinafter.

[0103] 10, the inclined mounting modules 100 are mounted so that the first mounting surfaces 1a (inclined surfaces) of the supports 1 face in the same direction, thereby achieving a uniform mounting density. In this manner, the multiple electronic components 2 mounted on each of the multiple supports 1 face in one direction, thereby providing the circuit module 201 with active or passive characteristics that are highly directional.

[0104] 10 illustrates a case where the inclined mounting modules 100 are mounted at the intersections of a lattice. Therefore, the front row of inclined mounting modules 100 tends to block the view in front of the electronic components 2 mounted obliquely on the support 1. To avoid this adverse effect, the inclined mounting modules 100 may be arranged at the intersections of a diagonal lattice. This results in the front row of inclined mounting modules 100 being mounted at positions offset from the front of the electronic components 2 mounted obliquely on the support 1, and the inclined mounting modules 100 in the row before the front are positioned forward. This allows space to be secured in front of the inclined-mounted electronic components 2, making it possible to achieve both high-density mounting and highly directional active or passive characteristics.

[0105] Although FIG. 10 illustrates a case in which the inclined-mounted modules 100 are mounted in a plane, the inclined-mounted modules 100 may also be mounted in a line depending on the application. In this case, the first mounting surfaces 1a of the support body 1 may be arranged in a vertical or horizontal row. The direction of output light emitted from the multiple inclined-mounted modules 100 mounted on the circuit board 3 may be the same or different directions. The inclined-mounted modules 100 may also be arranged so that output light is emitted in two or more different directions with regularity. In this case, the two or more different directions may be directions that have different vertical angles with respect to the board surface of the circuit board 3, or directions that have different rotation angles on the board surface of the circuit board 3. Various modifications may be possible, such as an arrangement in which the vertical angles or rotation angles are alternately arranged.

[0106] 11 , similar to the circuit module 201 shown in FIG. 10 , a plurality of identical inclined-mounted modules 100 are mounted on a single circuit board 3, but the first mounting surface 1 a (inclined surface) of the support body 1 in each inclined-mounted module 100 faces a different direction. Specifically, the inclined-mounted modules 100 are arranged such that the first mounting surface 1 a of the support body 1 faces the outer periphery of the circuit board 3. Furthermore, in the circuit module 202 shown in FIG. 11 , a plurality of electronic components 2 that are not inclined-mounted are arranged in the center of the circuit board 3. That is, a plurality of inclined-mounted electronic components 2 and a plurality of non-inclined-mounted electronic components 2 are mixed. The plurality of inclined-mounted modules 100 and the plurality of non-inclined-mounted electronic components 2 are mounted on the circuit board 3 so as to achieve a uniform mounting density overall.

[0107] 12 uses a disk-shaped circuit board 3A, and a plurality of angled-mounted modules 100 and non-angled-mounted electronic components 2 are mounted on the circuit board 3A. The plurality of angled-mounted modules 100 are arranged such that the first mounting surface 1a (inclined surface) of the support 1 faces the outer periphery of the circuit board 3A. The electronic component 2 is arranged in the center of the circuit board 3A and is surrounded by the plurality of angled-mounted modules 100. The plurality of angled-mounted modules 100 and the non-angled-mounted electronic components 2 are mounted on the circuit board 3A so that the overall mounting density is uniform.

[0108] 12, when all electronic components 2 are solid-state light-emitting elements, the circuit module 203 can efficiently illuminate a direction perpendicular to the main surface (mounting surface) of the circuit board 3A and an area diagonally upward from the outer periphery of the circuit board 3A. This makes it possible to obtain a circuit module 203 that functions as a surface light source that can emit strong output light even in diagonal directions without the need for optical components such as lenses or reflectors, thereby enabling the lighting fixture to be made more resource-efficient and more compact.

[0109] 12, if all of the electronic components 2 are sensing elements, it is possible to realize a circuit module 203 that can simultaneously detect physical properties (such as light) incident in a direction perpendicular to the main surface (mounting surface) of the circuit board 3A and from diagonally above the outer periphery of the circuit board 3A. This makes it possible to obtain a circuit module 203 that can monitor physical properties 360°.

[0110] 13 and 14 , a circuit module 204 includes a plurality of inclined mounting modules having first mounting surfaces 1 a (inclined surfaces) with different inclination angles mounted on a circuit board 3. Specifically, as shown in FIGS. 13 to 15 , the circuit module 204 includes an inclined mounting module 100 (first inclined mounting module) having the support body 1 in the first embodiment, an inclined mounting module 100A (second inclined mounting module) having a support body 1A whose first mounting surface 1 a is larger than that of the support body 1, and an inclined mounting module 100B (third inclined mounting module) having a support body 1B whose first mounting surface 1 a is smaller than that of the support body 1.

[0111] A plurality of each of the inclined mounting modules 100, 100A, and 100B are mounted, and the plurality of inclined mounting modules 100, 100A, and 100B are arranged so that their first mounting surfaces 1a (inclined surfaces) face in a straight line. The inclined mounting modules 100, 100A, and 100B are mounted such that the greater the inclination angle of the first mounting surface 1a, the larger the non-mounting space in front of them. Specifically, the non-mounting space in front of the inclined mounting module 100A is larger than the non-mounting space in front of the inclined mounting module 100, and the non-mounting space in front of the inclined mounting module 100 is larger than the non-mounting space in front of the inclined mounting module 100B.

[0112] 13 and 14, when the electronic component 2 is a solid-state light-emitting element, it can emit a physical property (light, etc.) in a straight line. When the electronic component 2 is a detector element, it can detect a physical property (light, etc.) emitted in a straight line. This makes it possible to realize a compact, high-density mounted circuit module 204.

[0113] 13, the inclined mounting modules 100, 100A, and 100B are arranged so that the first mounting surfaces 1a (inclined surfaces) face in a straight line, but this is not limiting. For example, the inclined mounting modules 100, 100A, and 100B may be arranged so that the first mounting surfaces 1a face in a single point.

[0114] 16 , a circuit module 205 includes a plurality of inclined mounting modules having different areas of the first mounting surface 1 a mounted on a circuit board 3. Specifically, as shown in FIG. 16 , the circuit module 205 includes an inclined mounting module 100 (first inclined mounting module) having the support 1 of the first embodiment and an inclined mounting module 100C (fourth inclined mounting module) having a support 1C having a first mounting surface 1 a larger in area than the support 1. In this modification, a plurality of inclined mounting modules 100C are mounted. In this case, a plurality of types of inclined mounting modules 100C having different areas of the first mounting surface 1 a are mounted. Furthermore, a plurality of electronic components 2 are mounted on each support 1C in each inclined mounting module 100C. Specifically, there is an inclined mounting module 100C having two electronic components 2 mounted on the support 1C, an inclined mounting module 100C having three electronic components 2 mounted on the support 1C, and an inclined mounting module 100C having four electronic components 2 mounted on the support 1C. Each inclined mounting module 100C is provided with a plurality of first electrodes 11 and a plurality of second electrodes 12 corresponding to a plurality of electronic components 2. In this modification, the inclination angle of the first mounting surface 1 a of the support body 1 in the inclined mounting module 100 and the inclination angle of the first mounting surface 1 a of the support body 1C in the inclined mounting module 100C are the same, but may be different.

[0115] 16 , a plurality of electronic components 2 are mounted on one inclined mounting module 100C, thereby reducing the number of times the inclined mounting module 100 is mounted. In addition, since it is easy to design the mounting distribution on the circuit board 3 of the inclined mounting module 100C according to the application, it is possible to realize a circuit module 205 that is excellent in industrial productivity or in response to customer requests.

[0116] Furthermore, the circuit board 3 is generally made of an insulating resin material in order to prevent electrical short circuits of the electronic components 2. However, since resin materials generally have poorer thermal conductivity than metal materials, heat dissipation design for the heat-generating electronic components 2 can be an issue. On the other hand, since the circuit board 3 is generally flat, when multiple electronic components 2 are mounted on the circuit board 3, heat is less likely to be conducted in the horizontal direction of the main surface of the circuit board 3, and there are restrictions on the distance that the electronic components 2 can be brought close to each other. In contrast, the tilted mounting module 100 of this embodiment uses a support 1 that can achieve both high-density mounting and suppression of performance degradation due to temperature rise of the tilted-mounted electronic components 2, which is advantageous for high-density mounting. For example, the mounting density of the electronic components 2 can be set to 1 component / 1 cm. ２ and more than 3 pieces / 1 cm ２ This allows the electronic components 2 to be mounted at high density, making it possible to obtain a small-sized circuit module 205 that can realize miniaturization of electronic devices.

[0117] 10 to 16, the electronic components 2 are all the same, but this is not limiting. For example, the circuit modules shown in FIGS. 10 to 16 may include a mixture of inclined mounting modules in which the electronic components 2 are solid-state light-emitting elements and inclined mounting modules in which the electronic components 2 are detector elements. In the circuit modules shown in FIGS. 10 to 16, the mounting density of the inclined mounting modules and the electronic components 2 can be high or low depending on the application or customer requirements. The inclined mounting modules and the electronic components 2 may be mounted so that their in-plane distribution is uniform or non-uniform across the main surface of the circuit board.

[0118] Next, electronic device 300 according to the present embodiment will be described with reference to Fig. 17. Fig. 17 is a perspective view of electronic device 300 according to the first embodiment.

[0119] 17 , an electronic device 300 according to the present embodiment includes the circuit module 201 shown in FIG. 10 . The circuit module 201 includes a plurality of angled-mounted modules 100 mounted on a circuit board 3. Therefore, the electronic device 300 includes the angled-mounted modules 100.

[0120] This configuration makes it possible to obtain electronic device 300 having electronic components 2 mounted at an angle with respect to the main surface of circuit board 3. This makes it possible to realize electronic device 300 that efficiently utilizes the active characteristics of electronic components 2 in directions oblique to the main surface of circuit board 3, and efficiently utilizes the passive characteristics of electronic components 2 with respect to physical characteristics reaching the main surface of circuit board 3 from oblique directions.

[0121] For example, the electronic device 300 shown in FIG. 17 is a lighting device in which the electronic component 2 is a solid-state light-emitting element (e.g., an LED or semiconductor laser). The circuit module 201 is fixed to a base 4 that serves as a heat sink. The circuit module 201 may also be configured to include a lighting circuit (not shown) for the solid-state light-emitting element. Although not shown, the circuit module 201 has a translucent cover that covers it. Power is supplied to the circuit module 201 through a power supply line 5. This allows the electronic component 2 (solid-state light-emitting element) to be illuminated. The electronic device 300 also includes a mounting bracket 6 for fixing the electronic device 300 to a building.

[0122] In the electronic device 300 configured in this manner, the electronic components 2, which are solid-state light-emitting elements in the circuit module 201, are mounted at an angle with respect to the main surface of the circuit board 3, so that the electronic components 2, which are solid-state light-emitting elements, emit light in an oblique direction with respect to the main surface of the circuit board 3. This light then serves as illumination light for the electronic device 300, which is a lighting device. Therefore, a lighting device that can emit strong illumination light in an oblique direction can be realized.

[0123] Another example of electronic device 300 according to the present embodiment will be described with reference to Fig. 18. Fig. 18 is a schematic diagram of electronic device 300X according to another example of embodiment 1.

[0124] The electronic device 300X shown in Fig. 18 is a detection device or evaluation device that combines a solid-state light-emitting element and a photodetector as electronic components. Specifically, the electronic device 300X includes an inclined mounting module 100 (first inclined mounting module) in which the electronic component 2 mounted on the support 1 is a solid-state light-emitting element, an inclined mounting module 100X (second inclined mounting module) in which the electronic component 2X mounted on the support 1 is a photodetector, and a housing 7 that houses the inclined mounting modules 100 and 100X. The housing 7 contains a substance 8 that exists between the electronic component 2 (solid-state light-emitting element) and the electronic component 2X (photodetector). The substance 8 is, for example, at least one substance selected from a gas, a liquid, and a solid.

[0125] 18 , light emitted from the electronic component 2 (solid-state light-emitting element) is received by the electronic component 2X (photodetector) via the substance 8 and converted into an electrical signal. At this time, the electronic component 2X (photodetector) detects light that is light from the electronic component 2 (solid-state light-emitting element) scattered by the substance 8 or light that is at least partially light from the electronic component 2 (solid-state light-emitting element) absorbed by the substance 8. Therefore, by analyzing the light detected by the electronic component 2X (photodetector), it is possible to detect the presence of the substance 8 and evaluate the state, etc., of the substance 8.

[0126] Second Embodiment Next, a support 1F according to a second embodiment will be described with reference to Fig. 19. Fig. 19 is a perspective view of the support 1F according to the second embodiment.

[0127] As shown in Figure 19, the support body 1F of this embodiment is configured such that, in the support body 1 of the above-mentioned embodiment 1, the insulator 13 is divided into a first insulator 13a and a second insulator 13b, and further includes a fixed body 16.

[0128] By including the fixed body 16 in the support body 1F, the mechanical strength of the support body 1F against vibration can be easily ensured. The fixed body 16 is disposed between the first insulator 13a and the second insulator 13b. In this embodiment, the fixed body 16 also serves as a heat sink. That is, the fixed body 16 not only ensures the mechanical strength of the support body 1F but also dissipates heat generated by the electronic component 2 (not shown) mounted on the support body 1F. Therefore, the fixed body 16 is preferably made of a metal material for both mounting the electronic component 2 on the support body 1F and dissipating heat generated by the electronic component 2. The fixed body 16 is, for example, a plate-shaped metal block made of a metal material with high thermal conductivity, such as copper or aluminum. Specifically, the fixed body 16 is a flat metal block with a constant thickness.

[0129] The shape of the fixed body 16 is not limited to this, and may be a mesh shape. By making the fixed body 16 a mesh-shaped metal member, a mesh surface is formed in which the proportion of hard metal portions is small, so that the fixed body 16 can be easily produced by punching out a predetermined shape.

[0130] In this embodiment as well, the support 1F has a first electrode 11, a second electrode 12, a first protector 14, and a second protector 15. A first insulator 13a is disposed between the fixed body 16 and the first electrode 11. A second insulator 13b is disposed between the fixed body 16 and the second electrode 12.

[0131] When the support 1F is viewed from the side (Y-axis direction), the projections (side views) of the first electrode 11 and the second electrode 12 preferably have the same shape. This allows the first electrode 11 and the second electrode 12 to be produced by punching a metal plate. This makes it possible to realize a support 1F with excellent industrial productivity. In this embodiment, the first electrode 11 and the second electrode 12 have the same shape and size.

[0132] Similarly to the first embodiment, the first protector 14 covers the side surface of the first electrode 11, and the second protector 15 covers the side surface of the second electrode 12. The thicknesses of the first protector 14 and the second protector 15 in this embodiment are greater than the thicknesses of the first protector 14 and the second protector 15 in the first embodiment.

[0133] Like the support 1 in the first embodiment, the support 1F has a first mounting surface 1a and a second mounting surface 1b. Each of the first mounting surface 1a and the second mounting surface 1b exposes not only the first electrode 11, the second electrode 12, the insulator 13 (the first insulator 13a and the second insulator 13b), the first protector 14, and the second protector 15, but also the fixing body 16. Therefore, heat generated by the electronic component 2 mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b not only via the first electrode 11 and the second electrode 12 but also via the fixing body 16. This allows the heat generated by the electronic component 2 mounted on the first mounting surface 1a to be efficiently dissipated.

[0134] In this embodiment, the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15 are integrally configured. Specifically, the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15 are resin molded products integrally formed from a resin material.

[0135] The metal members of the first electrode 11, the second electrode 12, and the fixed body 16 are embedded in the resin that constitutes the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15. This not only makes it easy to ensure insulation between the first electrode 11 and the second electrode 12, but also allows the support 1F to be fabricated by insert molding. Specifically, the metal members of the first electrode 11, the second electrode 12, and the fixed body 16 are set in a mold, and resin is injected into the mold and allowed to solidify, thereby fabricating the support 1F in which these metal members are embedded and fixed in the resin. This allows the support 1F to be obtained with excellent electrical reliability and industrial productivity.

[0136] Like the support 1 in the first embodiment, the support 1F configured in this manner has a receiving portion 20 that receives the electronic component 2 mounted on the inclined first mounting surface 1a. This prevents the electronic component 2 from sliding down along the first mounting surface 1a, causing misalignment of the electronic component 2, as with the support 1 in the first embodiment, when the support 1F on which the electronic component 2 is arranged is mounted on a substrate such as a circuit board 3. In this embodiment, the receiving portion 20 is part of the resin molded product that forms the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15. Therefore, while in the first embodiment, part of the receiving portion 20 constituted the first electrode 11 and the second electrode 12, the receiving portion 20 in this embodiment is not constituted by the first electrode 11 or the second electrode 12.

[0137] Note that, like the support 1 in the above-described embodiment 1, the support 1F has a suction portion 30 that is a portion to which a suction nozzle is attached. This allows the support 1F to be easily attached by a suction nozzle, like the support 1 in the above-described embodiment 1.

[0138] For the support body 1F configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1F, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1F on which the electronic components 2 are mounted on the circuit board 3.

[0139] In this case, for example, as in the circuit module 206 shown in FIG. 20 , multiple inclined mounting modules having different areas of the first mounting surface 1a may be mounted on the circuit board 3. Specifically, as shown in FIG. 20 , the circuit module 206 includes an inclined mounting module 100F having one electronic component 2 mounted on a support 1F, and an inclined mounting module 100F' having a support 1F' whose first mounting surface 1a has a larger area than the support 1F. In this modification, multiple inclined mounting modules 100F' are mounted. In this case, multiple types of inclined mounting modules 100F' having different areas of the first mounting surface 1a are mounted. Furthermore, multiple electronic components 2 are mounted on one support 1F' in each inclined mounting module 100F'.

[0140] Third Embodiment Next, a support 1G according to a third embodiment will be described with reference to Fig. 21. Fig. 21 is a perspective view of the support 1G according to the third embodiment.

[0141] As shown in Figure 21, the support 1G of this embodiment, similar to the above-mentioned embodiment 2, includes a first electrode 11, a second electrode 12, a first insulator 13a, a second insulator 13b, a first protector 14, a second protector 15, and a fixing body 16 that also serves as a heat sink.

[0142] Furthermore, the support body 1G has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1F in the above-described embodiment 2. Furthermore, similar to the above-described embodiment 2, not only the first electrode 11, the second electrode 12, the insulator 13 (first insulator 13a, second insulator 13b), the first protector 14, and the second protector 15 are exposed on each of the first mounting surface 1a and the second mounting surface 1b, but also the fixing body 16.

[0143] In this embodiment, unlike the second embodiment, the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15 are not integrally configured. In other words, the first electrode 11, the second electrode 12, the first insulator 13a, the second insulator 13b, the first protector 14, the second protector 15, and the fixed body 16 are each separate flat plate-shaped members that are laminated together. These members are joined to each other.

[0144] This configuration ensures sufficient insulation between the first electrode 11 and the second electrode 12, resulting in a support 1G with high electrical reliability. Furthermore, the first electrode 11 and the second electrode 12 have height and thickness, resulting in electrodes with a large envelope volume. This allows heat generated by the electronic component 2 mounted on the first mounting surface 1a of the support 1G to be efficiently transferred to the second mounting surface 1b and further to the circuit board 3.

[0145] Like the support 1 in the above-described embodiment 1, the support 1G has receiving portions 20 that receive electronic components 2 mounted on the first mounting surface 1a, which is an inclined surface. This prevents the electronic components 2 from sliding down along the first mounting surface 1a, causing misalignment of the electronic components 2, when the support 1G on which the electronic components 2 are arranged is mounted on a substrate such as the circuit board 3, like the support 1 in the above-described embodiment 1.

[0146] Furthermore, a groove 40 is provided in the support body 1G in this embodiment. The groove 40 is formed at the boundary between the first mounting surface 1a and the receiving portion 20. Specifically, the groove 40 is formed at the lower end of the first mounting surface 1a. The groove 40 is formed along the Y-axis direction. Specifically, the groove 40 is formed so as to penetrate the support body 1G in the Y-axis direction. By providing the groove 40 in the support body 1G in this manner, even if there is excess solder flowing down the first mounting surface 1a when the electronic component 2 is solder-mounted on the first mounting surface 1a and then the support body 1G is mounted on the circuit board 3, the melted solder enters the groove 40 and is stored in the groove 40. In other words, the groove 40 is an escape recess for allowing the molten solder to escape from the first mounting surface 1a. This can somewhat prevent the solder from flowing down the first mounting surface 1a and spreading laterally across the first mounting surface 1a, causing an electrical short circuit between the first electrode 11 and the second electrode 12. It can also somewhat prevent the solder that has flowed down the first mounting surface 1a from spilling out of the support body 1G.

[0147] Note that, like the support 1 in the above-described embodiment 1, the support 1G has a suction portion 30 that is a portion to which a suction nozzle is attached. This allows the support 1G to be easily attached by a suction nozzle, like the support 1 in the above-described embodiment 1.

[0148] For the support body 1G configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1G, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1G on which the electronic components 2 are mounted on the circuit board 3.

[0149] In this embodiment, the shortest distance between either the first electrode 11 or the second electrode 12 and the receiving portion 20 is preferably smaller than 1 / 3 of the maximum distance in the inclination direction of the first mounting surface 1a, which is inclined relative to the second mounting surface 1b.

[0150] With this configuration, when the solder melts and the electronic component 2 slides down along the slope of the first mounting surface 1 a, the receiving portion 20 can reliably prevent the electronic component 2 from moving, thereby improving the positioning accuracy of the electronic component 2 at the predetermined mounting position.

[0151] (Fourth embodiment) Next, a support 1H according to a fourth embodiment will be described with reference to Fig. 22. Fig. 22 is a perspective view of the support 1H according to the fourth embodiment.

[0152] As shown in FIG. 22 , the support 1H according to this embodiment has a first electrode 11, a second electrode 12, and a fixed body 16, similar to the support 1G according to the third embodiment. However, unlike the support 1G according to the third embodiment, the support 1H does not have an insulator 13. That is, in the support 1H according to this embodiment, the first electrode 11 and the second electrode 12 are arranged with a gap (air layer) between them. The first electrode 11, the second electrode 12, and the fixed body 16 may be fixed to a holding member (not shown). Note that the support 1H according to this embodiment does not have a first protector 14 and a second protector 15, but may have the first protector 14 and the second protector 15.

[0153] Furthermore, the support body 1H has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1G in the above-described embodiment 3. The first electrode 11, the second electrode 12, and the fixed body 16 are exposed on each of the first mounting surface 1a and the second mounting surface 1b.

[0154] Like the support 1G in the above-described embodiment 3, the support 1H has receiving portions 20 that receive the electronic components 2 mounted on the inclined first mounting surface 1a. This prevents the electronic components 2 from sliding down along the first mounting surface 1a and causing misalignment of the electronic components 2 when the support 1H on which the electronic components 2 are arranged is mounted on a circuit board 3 or the like, like the support 1G in the above-described embodiment 3.

[0155] For the support body 1H configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1H, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1H on which the electronic components 2 are mounted on the circuit board 3.

[0156] In the support 1H shown in Fig. 22, the first electrode 11, the second electrode 12, and the fixed body 16 are plate-shaped metal blocks, but this is not limiting. For example, as in the support 1I shown in Fig. 23, the first electrode 11, the second electrode 12, and the fixed body 16 may be formed from a frame-shaped metal member with a portion of the electrode missing.

[0157] (Fifth Embodiment) Next, a support 1J according to a fifth embodiment will be described with reference to FIGS. 24 to 29. FIG. 24 is a perspective view of the support 1J according to the fifth embodiment, and FIG. 25 is a diagram showing the configuration of the support 1J. FIG. 26 is a perspective view of a plurality of metal blocks (first electrode 11, second electrode 12, fixed body 16) used in the support 1J, and FIG. 27 is a diagram showing the configuration of the plurality of metal blocks. FIG. 28 is a perspective view of a resin block 17 in the support 1J, and FIG. 29 is a diagram showing the configuration of the resin block 17. In FIGS. 25, 27, and 29, (a) is a side view, and (b) is a top view.

[0158] 24 and 25 , the support 1J according to this embodiment has a first electrode 11, a second electrode 12, and a fixed body 16, similar to the support 1G according to the third embodiment. As shown in FIGS. 26 and 27 , the first electrode 11, the second electrode 12, and the fixed body 16 are plate-shaped metal blocks. Specifically, the first electrode 11, the second electrode 12, and the fixed body 16 are plate-shaped metal blocks with a constant thickness.

[0159] The first electrode 11, the second electrode 12, and the fixing body 16 can be produced by machining a copper block using a router. As an example, the size of one first metal molded body as the first electrode 11 or the second electrode 12 is 0.5 mm in width, 3.5 mm in height, 4.35 mm in depth, and 5.5 mm in volume. ３The size of the second metal molded body as the fixed body 16 is 1.3 mm in width, 3.5 mm in height, 4.35 mm in depth, and 14.5 mm in volume. ３ is.

[0160] 24 and 25, the support 1J has a resin block 17 made of an insulating resin material. The resin material for the resin block 17 may be, for example, epoxy resin.

[0161] 28 and 29 , the resin block 17 has a first insulating portion 17a (first resin portion) corresponding to the first insulator 13a, a second insulating portion 17b (second resin portion) corresponding to the second insulator 13b, a first protective portion 17c (third resin portion) corresponding to the first protective body 14, and a second protective portion 17d (fourth resin portion) corresponding to the second protective body 15. The first insulating portion 17a, the second insulating portion 17b, the first protective portion 17c, and the second protective portion 17d are connected to one another.

[0162] 28 and 29 can be produced by machining an epoxy resin block using a router. As an example, the size of the resin block 17 is 4 mm in width, 3.5 mm in height, 5.28 mm in depth, and 24 mm in volume. ３ is.

[0163] The support 1J can be produced by combining a resin block 17 with a metal block (first electrode 11, second electrode 12, and fixed body 16). For example, the support 1J can be produced by combining the resin block 17 with a metal block. In this case, the resin block 17 and the metal block can be bonded together using a bonding agent. The support 1J in this embodiment can also be produced by insert molding.

[0164] Furthermore, the support body 1J has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1G in the above-described embodiment 3. The first electrode 11, the second electrode 12, the fixing body 16, and the resin block 17 are exposed on each of the first mounting surface 1a and the second mounting surface 1b.

[0165] Like the support 1G in the third embodiment, the support 1J has receiving portions 20 that receive the electronic components 2 mounted on the first mounting surface 1a, which is an inclined surface. This prevents the electronic components 2 from sliding down along the first mounting surface 1a, causing misalignment of the electronic components 2, as with the support 1G in the third embodiment, when the support 1J on which the electronic components 2 are arranged is mounted on a circuit board 3 or the like. In the present embodiment, the receiving portions 20 are provided on a resin block 17. Specifically, two receiving portions 20, which are protrusions, are provided on the resin block 17. The two resin blocks 17 are formed to be spaced apart in the Y-axis direction, and are each formed to extend in the X-axis direction.

[0166] Furthermore, the support 1J in this embodiment is provided with recesses 50. The recesses 50 are formed at the boundary between the first mounting surface 1a and the receiving portion 20. Specifically, the recesses 50 are formed at the lower end of the first mounting surface 1a. Three recesses 50 are formed. Specifically, the bottom surfaces of the recesses 50 are the surfaces of the first electrode 11, the second electrode 12, and the fixing body 16. By providing the recesses 50 in the support 1J in this manner, even if there is excess solder flowing down the first mounting surface 1a when the electronic component 2 is solder-mounted on the first mounting surface 1a and then the support 1J is mounted on the circuit board 3, the molten solder can enter the recesses 50 and accumulate therein. In other words, the recesses 50 are escape recesses for escaping the molten solder. This prevents the molten solder from flowing down the first mounting surface 1a and spreading laterally, thereby preventing an electrical short circuit between the first electrode 11 and the second electrode 12. Furthermore, the solder that has flowed down the first mounting surface 1a can be prevented from spilling out from the support body 1J.

[0167] A partition wall is formed between two adjacent recesses 50 among the three recesses 50. This partition wall separates at least the recess 50 located below the inclined surface of the first electrode 11 from the recess 50 located below the inclined surface of the second electrode 12. The partition wall is made of a non-metallic material. In this embodiment, the partition wall is part of the resin block 17 and is made of a resin material.

[0168] Furthermore, support body 1J has suction portion 30, which is a portion to which a suction nozzle is attached, similar to support body 1G in embodiment 3. This allows support body 1J to be easily attached by a suction nozzle, similar to support body 1G in embodiment 3.

[0169] For the support body 1J configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1J, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1J on which the electronic components 2 are mounted on a circuit board 3.

[0170] Sixth Embodiment Next, a support 1K according to a sixth embodiment will be described with reference to Fig. 30. Fig. 30 is a perspective view of the support 1K according to the sixth embodiment.

[0171] As shown in FIG. 30 , the support 1K according to the present embodiment has a first electrode 11 and a second electrode 12, similar to the support 1 according to the first embodiment. However, unlike the support 1 according to the first embodiment, the support 1K does not have an insulator 13. That is, in the support 1K according to the present embodiment, the first electrode 11 and the second electrode 12 are arranged with a gap (air layer) between them. The first electrode 11 and the second electrode 12 may be fixed to a holding member (not shown). Note that the support 1K according to the present embodiment does not have a first protector 14 or a second protector 15. Specifically, the support 1K according to the present embodiment is composed only of the first electrode 11 and the second electrode 12.

[0172] Furthermore, while the first electrode 11 and the second electrode 12 in the first embodiment are formed from flat metal plates, the first electrode 11 and the second electrode 12 in the present embodiment are formed from folded metal plates. It is also possible to form folded electrodes (first electrode 11 and second electrode 12) as shown in Fig. 30 by punching a thick metal plate in the Y direction. In the support 1K, the first electrode 11 and the second electrode 12 have the same shape and size.

[0173] The first electrode 11 and the second electrode 12 having the shape shown in FIG. 30 can be produced by bending a long metal plate. The first electrode 11 and the second electrode 12 can be easily produced by general sheet metal processing. This makes it possible to obtain a support 1K that is excellent in industrial productivity and easy to design for heat dissipation. As an example, the first electrode 11 and the second electrode 12 can be produced by bending a copper plate (thickness 1 mm, width 3 mm, length 19 mm) using a machine tool or by hand.

[0174] The support body 1K has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1 in the first embodiment. A first electrode 11 and a second electrode 12 are exposed on the first mounting surface 1a and the second mounting surface 1b, respectively. Specifically, the first electrode 11 and the second electrode 12 are formed with the first mounting surface 1a and the second mounting surface 1b, respectively.

[0175] Furthermore, like the support 1 in the first embodiment, the support 1K has receiving portions 20 for receiving the electronic components 2 mounted on the first mounting surface 1a, which is an inclined surface. The receiving portions 20 are provided on the first electrode 11 and the second electrode 12, respectively.

[0176] That is, the first electrode 11 and the second electrode 12 are both bent so as to have an inclined surface that becomes the first mounting surface 1a, a bottom surface that becomes the second mounting surface 1b, and a receiving portion 20. The first electrode 11 and the second electrode 12 are arranged in parallel with a gap between them so that the first mounting surface 1a of the first electrode 11 and the first mounting surface 1a of the second electrode 12 are located on a single plane, and the second mounting surface 1b of the first electrode 11 and the second mounting surface 1b of the second electrode 12 are also located on a single plane. This makes it possible to obtain a support 1K composed of a pair of first electrodes 11 and second electrodes 12, each of which has a receiving portion 20.

[0177] For the support body 1K configured in this manner, as shown in FIG. 31 , an inclined mounting module 100K can be obtained by mounting an electronic component 2 on the first mounting surface 1a of the support body 1K. In this case, since the support body 1K has the receiving portion 20, as in the first embodiment, when the support body 1K on which the electronic component 2 is arranged is mounted on a circuit board 3 or the like, it is possible to prevent the electronic component 2 from sliding down along the first mounting surface 1a, causing misalignment of the electronic component 2, as in the first embodiment. FIG. 31 is a diagram showing the configuration of an inclined mounting module 100K according to a sixth embodiment. In FIG. 31 , (a) is a perspective view, (b) is a side view, and (c) is a top view.

[0178] Although not shown, a circuit module can be obtained by mounting the support 1K on a circuit board 3. For example, a first electrode 11 and a second electrode 12 are soldered to each of a pair of electrodes 3a formed on the circuit board 3 so as to have a predetermined gap (e.g., 0.65 mm), and an electronic component 2 is mounted on the support 1K consisting of this pair of first and second electrodes 11 and 12, thereby obtaining a circuit module. In this case, the first electrode 11 and the second electrode 12 function as a pair of positive and negative electrodes that supply power from the circuit board 3 to the electronic component 2 mounted on the first mounting surface 1a.

[0179] 32 , a part of the metal plate constituting the first electrode 11A (second electrode 12A) may be extended to provide a suction portion 30 on a part of the first electrode 11A (second electrode 12A). In other words, the suction portion 30 may be formed on a part constituting the bottom of the support 1K made up of a pair of the first electrode 11A and the second electrode 12A. This causes the flat surface that becomes the suction portion 30 to be exposed from the receiving portion 20 in a top view, allowing the first electrode 11A (second electrode 12A) to be easily suctioned by a suction nozzle.

[0180] Furthermore, when the support is configured only by the first electrode 11 and the second electrode 12, the support 1K' may have the first electrode 11 and the second electrode 12 in the shape shown in Fig. 33. In the support 1K' shown in Fig. 33, the metal plate that configures the first electrode 11 and the second electrode 12 is bent to form a receiving portion 20 that receives the electronic component 2 mounted on the inclined first mounting surface 1a.

[0181] (Seventh Embodiment) Next, a support 1L according to a seventh embodiment will be described with reference to Fig. 34 and Fig. 35. Fig. 34 is a perspective view of the support 1L according to the seventh embodiment. Fig. 35 is a diagram showing the configuration of the support 1L according to the seventh embodiment. In Fig. 35, (a) is a side view, (b) is a top view, and (c) is a rear view.

[0182] As shown in Figures 34 and 35, the support 1L has a first electrode 11 and a second electrode 12. In this embodiment, the support 1L includes a base 18, and the first electrode 11 and the second electrode 12 are thin metal films formed in a predetermined pattern on the surface of the base 18. The base 18 has an inclined surface 18a having the same inclination angle as the first mounting surface 1a, and the first electrode 11 and the second electrode 12 are formed at least on the inclined surface 18a. In this embodiment, the first electrode 11 and the second electrode 12 are formed from the inclined surface 18a, which is the upper surface of the base 18, to the back surface of the base 18. In this embodiment, the back surface of the base 18 becomes the lower surface of the support 1L.

[0183] In addition, a metal film 19 is formed on the surface of the base 18. The metal film 19 is formed between the first electrode 11 and the second electrode 12 so as to be spaced apart from the first electrode 11 and the second electrode 12. The metal film 19 can be used as a heat dissipation member for dissipating heat generated in the electronic component 2, or as a third electrode. The metal film 19 can be formed simultaneously with the first electrode 11 and the second electrode 12. The metal film 19 is also formed from the inclined surface 18a, which is the upper surface of the base 18, to the back surface of the base 18.

[0184] The base 18 is composed of a metal block made of a metal material such as aluminum or copper, and an insulating film (not shown) that covers the entire metal block. The envelope volume of the metal block is, for example, 48.3 cm. ３ The insulating film covering the metal block is a resin film made of a resin material such as polyimide resin. The resin film can be formed using a dip coating method. For example, by immersing the metal block in polyimide varnish and then drying it for several hours at a temperature of 300 to 400°C using a heating dryer, this coating and drying process is repeated several times to form an insulating film (resin coating film) made of polyimide resin with a thickness of approximately 20 μm over the entire surface of the metal block.

[0185] When the substrate 18 is a metal block covered with an insulating film, the first electrode 11 and the second electrode 12 are formed on the insulating film. For example, the first electrode 11 and the second electrode 12 can be formed by a plating technique for stacking gold and nickel. As an example, the thickness and width of the first electrode 11 and the second electrode 12 are 3.5 μm and 0.5 mm, respectively. Furthermore, the length of each of the first electrode 11 and the second electrode 12 formed so as to span from the inclined surface 18a of the substrate 18 to the back surface of the substrate 18 is 12 mm. Furthermore, the gold-nickel layered structure constituting the first electrode 11 and the second electrode 12 is, for example, a three-layer structure (Au / Ni / Au) consisting of a gold layer (0.5 μm), a nickel layer (3.0 μm) formed on the gold layer, and a gold layer (0.05 μm) formed on the nickel layer.

[0186] The support body 1L has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1 in the first embodiment. The first electrode 11, the second electrode 12, and the metal film 19 are exposed on the first mounting surface 1a and the second mounting surface 1b, respectively. Specifically, the surfaces of the first electrode 11, the second electrode 12, and the metal film 19 form the first mounting surface 1a and the second mounting surface 1b, respectively.

[0187] Furthermore, like the support 1 in the first embodiment, the support 1L has a receiving portion 20 that receives the electronic component 2 mounted on the first mounting surface 1a, which is an inclined surface. This prevents the electronic component 2 from sliding down along the first mounting surface 1a and causing misalignment of the electronic component 2, like the support 1 in the first embodiment, when the support 1L on which the electronic component 2 is arranged is mounted on a circuit board 3 or the like. In the present embodiment, the receiving portion 20 is provided on the base 18.

[0188] In this embodiment, the base 18 of the support 1L has a metal block. By making the base 18 from metal in this way, the support 1L can have excellent thermal conductivity.

[0189] The base 18 is not limited to being made of metal, but may also be made of resin. In this case, the material of the base 18 may be, for example, LCP (Liquid Crystal Polymer), and the resin base 18 (enveloped volume 48.3 cm) may be molded by a general injection molding technique. ３ ) can be produced. In addition, after modifying the surface of the electrode formation portion of the inclined surface 18a and the back surface of the resin base 18 by light irradiation, the first electrode 11 and the second electrode 12 can be formed so as to straddle the inclined surface 18a and the back surface of the base 18 by the same plating technique as above. In this way, by making the base 18 from resin, the support 1L can be produced at low cost.

[0190] (Modifications) Although the support and the like according to the present invention have been described above based on the first to seventh embodiments, the present invention is not limited to the first to seventh embodiments.

[0191] For example, in the fabrication of the support 1G in the third embodiment, the first electrode 11, the second electrode 12, the first insulator 13a, the second insulator 13b, the first protector 14, the second protector 15, and the fixed body 16 were fabricated separately and then bonded together, but this is not limited thereto. For example, the support 1G can also be fabricated by cutting out a portion of the laminated substrate 400 shown in FIGS. 36 and 37 . As shown in FIG. 37 , the laminated substrate 400 has a laminated structure including a metal layer 401, insulating layers 402, 403, and 404 stacked in sequence on one side of the metal layer 401, and insulating layers 405, 406, and 407 stacked in sequence on the other side of the metal layer 401. The metal layers 401, 403, and 406 are, for example, copper layers and correspond to the fixed body 16, the first electrode 11, and the second electrode 12, respectively. The insulating layers 402, 404, 405, and 407 are, for example, resin layers such as prepreg (carbon fiber sheets pre-impregnated with resin) or glass epoxy substrates, and correspond to the first insulator 13a, the first protector 14, the second insulator 13b, and the second protector 15, respectively. Then, by subjecting this laminated substrate 400 to router processing using a router processing machine, it is possible to produce the support body 1G having the shape shown in Fig. 21. Note that the support body 1G can also be produced by subjecting the laminated substrate 400 to punching or the like instead of router processing.

[0192] Furthermore, in the above-described first embodiment and the like, a surface-mount electronic component having a plurality of electrodes on its back surface is used as the electronic component 2. In this case, the electrodes of the electronic component 2 may have a pattern as shown in Fig. 38. In Fig. 38, (a) shows an electrode pattern in which a pair of electrodes, a positive electrode and a negative electrode, have the same shape and size, (b) shows an electrode pattern in which the positive electrode and the negative electrode are different in size (in the figure, the negative electrode is larger than the positive electrode), and (c) shows an electrode pattern in which a heat dissipation electrode for heat dissipation is added between the positive electrode and the negative electrode.

[0193] Furthermore, when using such a surface-mount electronic component 2, it is preferable that at least one of the pair of electrodes on the back surface of the electronic component 2 has a linear shape on the side facing the other electrode or a linear tip of its convex portion. Similarly, it is preferable that at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a has a linear shape on the side facing the other electrode on the first mounting surface 1a or a linear tip of its convex portion. In a more preferred embodiment, it is preferable that both the first electrode 11 and the second electrode 12 and the pair of electrodes of the electronic component 2 are configured as described above.

[0194] By configuring the first electrode 11 and the second electrode 12 or a pair of electrodes of the electronic component 2 in this manner, the melted and solidified solder acts to align the linear electrode edge portion of at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a with the linear electrode edge portion of the electrode of the electronic component 2 to be joined thereto, thereby obtaining an inclined mounting module with little mounting misalignment in the rotational direction on the first mounting surface 1a (inclined surface) of the electronic component 2 to be mounted.

[0195] In this case, the length of the linear electrode edge portion of either the first electrode 11 or the second electrode 12 on the first mounting surface 1a may be the same as the linear electrode edge portion of the electronic component 2 to be joined via solder. In a more preferred embodiment, the lengths of the electrode edges of the opposing first and second electrodes 11 and 12 formed as a pair of electrodes on the electronic component 2 may be the same. This configuration allows the molten and solidified solder to adjust the length of the linear electrode edge portion of at least one of the first and second electrodes 11 and 12 exposed on the first mounting surface 1a to the length of the linear electrode edge portion of the electrode of the electronic component 2 to be joined thereto, thereby reducing mounting misalignment in both the rotational and tilting directions on the first mounting surface 1a of the electronic component 2 to be mounted. This allows for a tilted mounting module that is convenient for precise control of the mounting position. Furthermore, by making the inter-electrode distance between the first electrode 11 and the second electrode 12 on the first mounting surface 1a equal to the inter-electrode distance between a pair of electrodes on the back surface of the electronic component 2, the mounting misalignment of the electronic component 2 can be further reduced.

[0196] Furthermore, in the above-mentioned first embodiment, the electronic devices using the inclined mounting module and the circuit module have been described using the electronic device 300 shown in FIG. 17 and the electronic device 300X shown in FIG. 18 as examples, but are not limited to these forms.

[0197] For example, the electronic device 300 (lighting device) shown in Fig. 17 uses the circuit module 201 shown in Fig. 10, but is not limited to this. Specifically, the circuit modules or angled mounting modules shown in Figs. 11 to 16 may also be used.

[0198] 10 to 16 may also be used in the electronic device 300X as a detection device or evaluation device. When combining a solid-state light-emitting element with a photodetector, the solid-state light-emitting element and the photodetector may be positioned so that the primary light emitted by the solid-state light-emitting element is directly incident on the light-receiving surface of the photodetector, or the solid-state light-emitting element and the photodetector may be positioned so that the primary light is not directly incident on the light-receiving surface of the photodetector. In the latter case, when a substance 8 is present in front of the light-extraction surface of the solid-state light-emitting element, the photodetector may detect the reflected or diffused light component by the substance 8. This configuration effectively suppresses detection of stray light from the primary light emitted by the solid-state light-emitting element.

[0199] The concept of "electronic device" in the present invention broadly encompasses electronic device systems. For example, electronic device systems that combine various software including machine learning or a control system including a robot are also included in the electronic device of the present invention. This allows for the realization of electronic devices that can be applied to automation, etc.

[0200] In addition, the present invention also includes forms obtained by applying various modifications to the above-mentioned embodiments that would occur to a person skilled in the art, and forms realized by arbitrarily combining the components and functions of the above-mentioned embodiments within the scope of the present invention. Furthermore, the present invention also includes any combination of one or more components in each of the multiple claims described in the claims at the time of filing. Furthermore, when the dependent claims described in the claims at the time of filing are made into a multiple claim or multiple multiple claim that cites any multiple claims (for example, when a multiple claim or multiple multiple claim is made so that each claim cites all of its parent claims), all forms obtained by combining all claims included in the multiple claim or multiple multiple claim are also included in the present invention.

[0201] 1, 1A, 1B, 1C, 1F, 1F', 1G, 1H, 1I, 1J, 1K, 1L Support 1a First mounting surface 1b Second mounting surface 2, 2X Electronic component 2a Mounting surface 3, 3A Circuit board 11, 11A First electrode 12, 12A Second electrode 20 Receiving portion 30 Adsorption portion 100, 100A, 100B, 100C, 100F, 100F', 100K, 100X Inclined mounting module 200, 201, 202, 203, 204, 205, 206 Circuit module 300, 300X Electronic device

Claims

1. A support for supporting an electronic component and mounting it on a substrate, comprising: one or more first mounting surfaces on which the mounting surface of the electronic component is mounted; a second mounting surface on which the support is mounted on the substrate; first and second electrodes each exposed on each of the first mounting surface and the second mounting surface and made of a metal material; and a receiving portion for receiving a surface of the electronic component different from the mounting surface, wherein the first mounting surface is inclined with respect to the second mounting surface at an inclination angle of 5° or more and 85° or less, and the first electrode and the second electrode function as main heat conductors in the support and conduct heat from the first mounting surface to the second mounting surface.

2. The support according to claim 1, wherein the metal material has a thermal conductivity at room temperature of 200 W / m·K or more.

3. The support according to claim 1, wherein the metal material contains 30 wt% or more of copper.

4. The support according to claim 3, wherein the volume ratio of the metal material in the support is 30% or more.

5. The support according to claim 1, wherein the receiving portion prevents the electronic component disposed on the first mounting surface from moving in a direction in which the distance between the first mounting surface and the second mounting surface becomes smaller.

6. The support according to claim 5, wherein the receiving portion is a protruding portion protruding from the first mounting surface.

7. The support according to any one of claims 1 to 6, wherein the support has a suction portion which is a portion where a suction nozzle for mounting the support on the substrate is suctioned, and the suction portion is located on the back side of the second mounting surface and is a plane parallel to the second mounting surface.

8. An inclined mounting module comprising the support according to claim 1 and an electronic component mounted on the first mounting surface of the support.

9. The inclined mounting module according to claim 8, wherein the electronic component is a solid-state light-emitting element or a sensing element.

10. A circuit module comprising the inclined mounting module according to claim 8 and a substrate on which the support in the inclined mounting module is mounted, wherein the support is mounted on the substrate via the second mounting surface, and the substrate is a circuit board.

11. An electronic device comprising at least one of the inclined mounting module according to claim 8 and the circuit module according to claim 8.

12. A method for manufacturing a circuit module according to claim 10, comprising: a first mounting step of mounting an electronic component on the first mounting surface of the support via a first mounting agent; a second mounting step of mounting the support on the electrodes of the circuit board via a second mounting agent; and a mounting step of mounting the electronic component on the support by the first mounting agent and mounting the support on the circuit board by the second mounting agent, wherein the mounting step is performed after the first mounting step and the second mounting step.

13. A method for manufacturing a circuit module according to claim 10, comprising: a first mounting step of mounting an electronic component on the first mounting surface of the support; an inclination step of inclining the support on which the electronic component is mounted after the first mounting step; and a second mounting step of mounting the support on which the electronic component is mounted on the electrodes of the circuit board at the second mounting surface after the inclination step, wherein a first mounting direction of mounting the electronic component on the support in the first mounting step and a second mounting direction of mounting the support on the electrodes of the circuit board in the second mounting step are the same direction.

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