Support, inclined mounting module, circuit module, electronic apparatus, and method for manufacturing circuit module

Abstract

A support (1) comprises a first mounting surface (1a), a second mounting surface (1b), a first electrode (11) that is exposed at each of the first mounting surface (1a) and the second mounting surface (1b), and a second electrode (12) that is exposed at each of the first mounting surface (1a) and the second mounting surface (1b). The first mounting surface (1a) is inclined with respect to the second mounting surface (1b). A first electrode and a second electrode of an electronic component are connected to the first electrode (11) and the second electrode (12) with solder (3) interposed therebetween. A first electrode edge (11S) of the first electrode (11) on the lower side of the inclination exposed at the first mounting surface (1a) and a second electrode edge (12S) of the second electrode (12) on the lower side of the inclination exposed at the first mounting surface (1a) constitute an alignment reference when the electronic component is mounted on the support (1) using the solder (3), and the electrode edges are present at a distance from the second mounting surface (1b) in a direction orthogonal to the second mounting surface (1b).

Description

Support, tilt-mounted module, circuit module, electronic device, and method of manufacturing circuit module

[0001] The present invention relates to an inclined mounting technology for mounting electronic components at an angle and its application technology. Specifically, the present invention relates to a support for inclined mounting on which electronic components are mounted, an inclined mounting module including the support, a circuit module including the inclined mounting module, an electronic device including the support, and a method for manufacturing the circuit module.

[0002] 2. Description of the Related Art Conventionally, tilted mounting techniques have been known in which electronic components such as solid-state light emitting elements or detector elements are mounted at an angle relative to a substrate (see, for example, Patent Documents 1, 2, and 3).

[0003] When mounting electronic components on a substrate at an incline, it is possible to use a support for inclined mounting having an inclined surface. In this case, by mounting the electronic components on the inclined surface formed on the support, an inclined mounting module can be obtained in which the electronic components are mounted on the support in an inclined position. Furthermore, by mounting this inclined mounting module on a circuit board, a circuit module can be obtained in which the electronic components mounted on the support are inclined relative to the circuit board. Note that surface-mounted electronic components are now mainstream, and electrode materials primarily composed of copper are used for mounting them.

[0004] JP 2013-143319 A Japanese Patent No. 5007395 A International Publication No. 2011 / 102335

[0005] However, the conventional support structure for inclined mounting has a problem in that electronic components mounted on the support are displaced from their predetermined mounting positions, particularly when surface-mount electronic components are mounted.

[0006] The present invention has been made to solve such problems, and aims to provide a support or the like that allows easy alignment of electronic components without deviation from their predetermined mounting positions on the support.

[0007] In order to achieve the above object, one aspect of the support according to the present invention is a support that supports an electronic component and is mounted on a substrate, the support having at least one or more first mounting surfaces on which the mounting surface of the electronic component is mounted, a second mounting surface on which the support is mounted on the substrate, a first electrode exposed on each of the first mounting surface and the second mounting surface, and a second electrode exposed on each of the first mounting surface and the second mounting surface, the first mounting surface being inclined with respect to the second mounting surface, and the first electrode and the second electrode conducting heat from the first mounting surface to the second mounting surface. a first electrode of the electronic component connected to the first electrode via solder, and a second electrode of the electronic component connected to the second electrode via solder; a first electrode edge on a sloping downward side of the first electrode exposed on the first mounting surface and a second electrode edge on a sloping downward side of the second electrode exposed on the first mounting surface serve as alignment references for aligning the electronic component when mounting the electronic component on the support by soldering, and are located at a distance from the second mounting surface in a direction perpendicular to the second mounting surface.

[0008] Moreover, one aspect of an angled mounting module according to the present invention includes the support body described above, and an electronic component mounted on the first mounting surface of the support body via solder.

[0009] Furthermore, one aspect of the circuit module according to the present invention comprises the above-mentioned inclined mounting module and a circuit board on which the inclined mounting module is mounted, and the inclined mounting module is mounted on the circuit board via the second mounting surface of the support body.

[0010] An aspect of the present invention is an electronic device including at least one of the above-described angle-mounted module and the above-described circuit module.

[0011] Furthermore, one aspect of the method for manufacturing a circuit module according to the present invention is the method for manufacturing the above-mentioned circuit module, which includes a first mounting step of mounting an electronic component on the first mounting surface of the support via a first solder, a second mounting step of mounting the support on an electrode of the circuit board via a second solder, and a mounting step of mounting the electronic component to the support via the first solder and mounting the support to the circuit board via the second solder, wherein the mounting step is performed after the first mounting step and the second mounting step.

[0012] Another aspect of the method for manufacturing a circuit module according to the present invention is the method for manufacturing the above-mentioned circuit module, comprising: a first mounting step of mounting an electronic component on the first mounting surface of the support via solder; a tilting step of tilting the support on which the electronic component is mounted after the first mounting step; and a second mounting step of mounting the support on which the electronic component is mounted onto an electrode of the circuit board via solder on the second mounting surface after the tilting step, wherein the first mounting direction in which the electronic component is mounted on the support in the first mounting step and the second mounting direction in which the support is mounted on the electrode of the circuit board in the second mounting step are the same direction.

[0013] According to the present invention, it is possible to provide a support that allows easy alignment of electronic components without deviation from their predetermined mounting positions on the support, an inclined mounting module that includes the support, a circuit module that includes the inclined mounting module, and an electronic device that includes the inclined mounting module or the circuit module.

[0014] Furthermore, the present invention can provide a method for manufacturing a circuit module that can easily align electronic components without causing deviation from their predetermined mounting positions on the support body.

[0015] FIG. 1 is a perspective view of a support body according to the first embodiment. FIG. 2 is a diagram illustrating the configuration of the support body according to the first embodiment. FIG. 3 is a perspective view of an inclined mounting module according to the first embodiment. FIG. 4 is a side view of the inclined mounting module according to the first embodiment. FIG. 5 is a diagram illustrating an example of a manufacturing method for the inclined mounting module according to the first embodiment. FIG. 6 is an optical photograph of an actually manufactured inclined mounting module according to the first embodiment, viewed from the side. FIG. 7 is a diagram illustrating another example of a manufacturing method for the inclined mounting module according to the first embodiment. FIG. 8 is a perspective view of a part of a circuit module according to the first embodiment. FIG. 9 is a side view of a part of a circuit module according to the first embodiment. FIG. 10 is a diagram illustrating an example of a manufacturing method for the circuit module according to the first embodiment. FIG. 11 is a diagram illustrating another example of a manufacturing method for the circuit module according to the first embodiment. FIG. 12 is a perspective view of a circuit module according to a first modification of the first embodiment. FIG. 13 is a perspective view of a circuit module according to a second modification of the first embodiment. FIG. 14 is a perspective view of a circuit module according to a third modification of the first embodiment. FIG. 15 is a perspective view of a circuit module according to a fourth modification of the first embodiment. FIG. 16 is a side view of a circuit module according to the fourth modification of the first embodiment. FIG. 17 is a perspective view of an inclined mounting module used in a circuit module according to a fourth modification of the first embodiment. FIG. 18 is a perspective view of a circuit module according to a fifth modification of the first embodiment. FIG. 19 is a perspective view of an electronic device according to the first embodiment. FIG. 20 is a schematic diagram of another example of an electronic device according to the first embodiment. FIG. 21 is a perspective view of a support according to the second embodiment. FIG. 22 is a diagram showing the configuration of a support according to the second embodiment. FIG. 23 is a perspective view of an inclined mounting module according to the second embodiment. FIG. 24 is a side view of an inclined mounting module according to the second embodiment. FIG. 25 is a perspective view of a support according to the third embodiment. FIG. 26 is an optical photograph of an actually fabricated inclined mounting module according to the third embodiment, viewed from the side. FIG. 27 is a perspective view of a support according to a modification of the third embodiment. FIG. 28 is an optical photograph of an actually fabricated inclined mounting module according to a modification of the third embodiment, viewed from the side. FIG. 29 is a perspective view of a support according to the fourth embodiment.FIG. 30 is an optical photograph of an actually fabricated inclined mounting module according to a modification of the fourth embodiment, viewed from the side. FIG. 31 is a perspective view of a support according to the fifth embodiment. FIG. 32 is an optical photograph of an actually fabricated inclined mounting module according to the fifth embodiment, viewed from the side. FIG. 33 is a perspective view of a support according to the sixth embodiment. FIG. 34 is an optical photograph of an actually fabricated inclined mounting module according to the sixth embodiment, viewed from the side. FIG. 35 is an optical photograph of an actually fabricated inclined mounting module according to a modification of the sixth embodiment, viewed from the side. FIG. 36 is a perspective view of a support according to the seventh embodiment. FIG. 37 is a perspective view of a support according to a first modification of the seventh embodiment. FIG. 38 is a perspective view of a support according to a second modification of the seventh embodiment. FIG. 39 is a perspective view of a support according to the eighth embodiment. FIG. 40 is an optical photograph of an actually fabricated inclined mounting module according to the eighth embodiment, viewed from the side. FIG. 41 is a perspective view of a support according to the ninth embodiment. FIG. 42 is a perspective view of a support according to the tenth embodiment. FIG. 43 is a perspective view of an inclined mounting module according to the tenth embodiment. Fig. 44 is a perspective view of a support according to Modification 1 of Embodiment 10. Fig. 45 is a perspective view of a support according to Modification 2 of Embodiment 10. Fig. 46 is a perspective view showing the configuration of a modification of the inclined mounting module according to Embodiment 10. Fig. 47 is a perspective view of a support according to Modification 3 of Embodiment 10. Fig. 48 is a perspective view of a laminated substrate used when fabricating a modification of the support according to Embodiment 3. Fig. 49 is a cross-sectional view of a laminated substrate used when fabricating a modification of the support according to Embodiment 3. Fig. 50 is a diagram showing the configuration of an inclined mounting module according to a modification. Fig. 51 is a diagram showing electrode patterns of electronic components.

[0016] (How One Aspect of the Present Invention Was Obtained) Before describing embodiments of the present invention, how one aspect of the present invention was obtained will be described.

[0017] The present inventors conducted various experiments to address the problem of electronic components sliding down the inclined surface of the support when fabricating an inclined mounting module including an inclined mounting support and an electronic component mounted on the inclined surface of the support, resulting in displacement of the electronic component from its predetermined position. The inventors discovered that a phenomenon can occur in which the electronic component is automatically aligned without being displaced from its predetermined mounting position on the support. Specifically, the inventors discovered that by leaving the electrodes of the support exposed in a certain state on the mounting surface (inclined surface) of the support on which the electronic component is mounted, solder is applied to the electrodes of the support, and when the electronic component is placed on the electrodes and reflowed, the molten solder acts to minimize its volume, thereby automatically aligning the electrodes on the mounting surface of the support with the electrodes of the electronic component. Taking advantage of this phenomenon, the inventors investigated various support structures and various methods of manufacturing an inclined mounting module, resulting in one aspect of the present invention.

[0018] Specific embodiments of the present invention will be described below with reference to the drawings. Each of the embodiments described below represents a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps (processes), and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concept of the present invention will be described as optional components.

[0019] Note that each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, in each figure, substantially identical components are assigned the same reference numerals, and redundant explanations are omitted or simplified. Furthermore, in each figure, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. In this embodiment, the Z-axis direction is the vertical direction, and the direction perpendicular to the Z-axis (the direction parallel to the XY plane) is the horizontal direction. The X-axis and Y-axis are axes that are mutually orthogonal and are both orthogonal to the Z-axis. Note that in this specification, the terms "up" and "down" do not necessarily refer to the upward direction (vertically upward) and downward direction (vertically downward) in absolute spatial recognition.

[0020] (Embodiment 1) First, the configuration of a support 1 according to embodiment 1 will be described with reference to Figures 1 and 2. Figure 1 is a perspective view of the support 1 according to embodiment 1. Figure 2 is a diagram showing the configuration of the support 1 according to embodiment 1. In Figure 2, (a) is a side view of the support 1, (b) is a front view of the support 1, and (c) is a top view of the support 1.

[0021] The support body 1 is a support member on which electronic components (not shown) are mounted, thereby supporting the electronic components. The support body 1 supporting the electronic components is mounted on a substrate (not shown), such as a circuit board. Therefore, as shown in Figures 1 and 2, the support body 1 has at least a first mounting surface 1a on which the mounting surface of the electronic components is mounted, and a second mounting surface 1b on which the support body 1 is mounted on the substrate. The first mounting surface 1a is a support surface that supports the electronic components.

[0022] The first mounting surface 1a and the second mounting surface 1b are exposed surfaces of the electrodes of the support body 1. Specifically, the first mounting surface 1a is the upper surface (top surface) of the support body 1, and the second mounting surface 1b is the lower surface (bottom surface) of the support body 1. Both the first mounting surface 1a and the second mounting surface 1b are flat planes (for example, surface irregularities of ±0.25 mm or less).

[0023] The first mounting surface 1a is an inclined surface inclined with respect to the second mounting surface 1b. Specifically, the first mounting surface 1a is inclined with respect to the second mounting surface 1b at an inclination angle θ (see FIG. 2) of 5° to 85°. Therefore, the first mounting surface 1a and the second mounting surface 1b are not parallel. The inclination angle θ of the first mounting surface 1a is preferably 10° to 60°, more preferably 20° to 50°, and even more preferably 45° or less. In this embodiment, the first mounting surface 1a is the entire inclined surface formed on the support body 1. In other words, the first mounting surface 1a is the area indicated by dotted hatching in FIGS. 1 and 2. As shown in FIG. 2B, when the entire first mounting surface 1a is viewed from a direction horizontal to the second mounting surface 1b, the maximum width of the upper half of the first mounting surface 1a of the support body 1 is equal to the maximum width of the lower half. Specifically, the width of the first mounting surface 1a (inclined surface) is uniform from the top to the bottom. In this embodiment, the second mounting surface 1b is the entire bottom surface of the support body 1. The width of the second mounting surface 1b is also uniform from one end to the other.

[0024] The first mounting surface 1a may be part of an inclined surface of the support body 1, and the second mounting surface 1b may be part of the lower surface of the support body 1. In addition, in the present embodiment, the first mounting surface 1a is configured by a single surface, but this is not limited to this. For example, the first mounting surface 1a may be divided into multiple surfaces. Similarly, the second mounting surface 1b may also be divided into multiple surfaces. In other words, each of the first mounting surface 1a and the second mounting surface 1b may be configured by multiple separate surfaces.

[0025] 1 and 2 , the support 1 has a first electrode 11, a second electrode 12, and an insulator 13. The support 1 further has a first protector 14 and a second protector 15. Adjacent two of the first electrode 11, the second electrode 12, the insulator 13, the first protector 14, and the second protector 15 are joined to each other.

[0026] The first electrode 11 and the second electrode 12 are electrical conductors for supplying power to electronic components mounted on the first mounting surface 1a. That is, a first electrode of an electronic component is connected to the first electrode 11 via solder, and a second electrode of the electronic component is connected to the second electrode 12 via solder. For example, one of the first electrode 11 and the second electrode 12 on the support 1 is a positive electrode and the other is a negative electrode. Note that when electronic components mounted on the support 1 are driven by an AC voltage rather than a DC voltage, the first electrode 11 and the second electrode 12 do not need to be distinguished as positive and negative electrodes.

[0027] Each of the first electrode 11 and the second electrode 12 is exposed on the first mounting surface 1a. Each of the first electrode 11 and the second electrode 12 is also exposed on the second mounting surface 1b. Therefore, power can be supplied from the second mounting surface 1b to an electronic component mounted on the first mounting surface 1a. Specifically, by mounting the support 1 on the second mounting surface 1b on a circuit board, power can be supplied to a pair of first and second electrodes (positive and negative electrodes) of an electronic component mounted on the first mounting surface 1a via the pair of first and second electrodes 11 and 12. In other words, the first electrode 11 and the second electrode 12 function as electrical conductors.

[0028] Furthermore, the first electrode 11 and the second electrode 12 not only function as electrical conductors but also as thermal conductors. Specifically, the first electrode 11 and the second electrode 12 conduct heat from the first mounting surface 1a to the second mounting surface 1b. In this embodiment, the first electrode 11 and the second electrode 12 function as the main heat conductors in the support 1. That is, although the support 1 has several thermally conductive members that conduct heat from the first mounting surface 1a to the second mounting surface 1b, the first electrode 11 and the second electrode 12 are the members that conduct the most heat from the first mounting surface 1a to the second mounting surface 1b among these thermally conductive members. Therefore, heat generated by an electronic component mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b via the first electrode 11 and the second electrode 12 and dissipated.

[0029] In this embodiment, the first electrode 11 and the second electrode 12 are exposed on the first mounting surface 1a and the second mounting surface 1b, respectively, which increases the envelope volume of the first electrode 11 and the second electrode 12. This makes the first electrode 11 and the second electrode 12 good thermal conductors, allowing heat generated by an electronic component mounted on the first mounting surface 1a to be efficiently conducted to the second mounting surface 1b via the first electrode 11 and the second electrode 12.

[0030] The electrode material used for the first electrode 11 and the second electrode 12 is a conductive material. The electrode material used for the first electrode 11 and the second electrode 12 is not particularly limited as long as it is a conductive material, but from the viewpoints of processing surface and heat conduction, it is preferable that it contains a metal. In this embodiment, the first electrode 11 and the second electrode 12 are made of a metal material. As an example, the first electrode 11 and the second electrode 12 are at least one selected from aluminum, gold, silver, copper, or alloys containing these. These metal materials have a thermal conductivity of greater than 200 W / m·K at room temperature. In particular, since the thermal conductivity of gold, silver, or copper exceeds 300 W / m·K, by making the first electrode 11 and the second electrode 12 out of gold, silver, or copper, a support 1 with excellent thermal conductivity from the first mounting surface 1a to the second mounting surface 1b can be obtained. Furthermore, considering manufacturing costs, it is preferable that the first electrode 11 and the second electrode 12 be copper electrodes whose main component is copper. In this case, the first electrode 11 and the second electrode 12 are preferably made of a metal material (for example, brass, bronze, or copper) containing 30 wt % or more, preferably 40 wt % or more of copper.

[0031] In this embodiment, the first electrode 11 and the second electrode 12 are formed from plate-shaped metal blocks, and the end faces of the metal blocks serve as the first mounting surface 1a and the second mounting surface 1b. In this manner, partial surfaces of the first electrode 11 and the second electrode 12 serve as the first mounting surface 1a and the second mounting surface 1b. Specifically, the first electrode 11 and the second electrode 12 are plate-shaped metal blocks with a constant thickness. The first electrode 11 and the second electrode 12 are arranged in parallel.

[0032] The volume ratio of metal in the support 1 (for example, the volume ratio of the first electrode 11 and the second electrode 12 in the support 1) is preferably 30% or more, and more preferably more than 50%. This allows the support 1 to have excellent thermal conductivity from the first mounting surface 1a to the second mounting surface 1b.

[0033] Each of the first electrode 11 and the second electrode 12 extends at least on the first mounting surface 1a in the inclined direction of the first mounting surface 1a. That is, the exposed portions of each of the first electrode 11 and the second electrode 12 on the first mounting surface 1a extend along the inclined direction of the first mounting surface 1a. Note that each of the first electrode 11 and the second electrode 12 also extends on the second mounting surface 1b. Specifically, on the second mounting surface 1b, each of the first electrode 11 and the second electrode 12 extends along the X-axis direction.

[0034] The first electrode 11 and the second electrode 12 have different electrode widths on the first mounting surface 1a and the second mounting surface 1b. Specifically, on each of the first mounting surface 1a and the second mounting surface 1b, the electrode width of the second electrode 12 is larger than the electrode width of the first electrode 11. Note that the electrode width of the first electrode 11 and the electrode width of the second electrode 12 may be the same.

[0035] The insulator 13 is located between the first electrode 11 and the second electrode 12. In other words, the support 1 has a laminated structure in which the first electrode 11, the insulator 13, and the second electrode 12 are laminated. The insulator 13 is an insulating member for insulating the first electrode 11 and the second electrode 12, and is made of an insulating material having insulating properties. The insulating material that makes up the insulator 13 is, for example, an insulating resin or ceramics.

[0036] The insulator 13 is exposed on each of the first mounting surface 1a and the second mounting surface 1b. In this embodiment, the insulator 13 is a plate-shaped insulating member, and end faces of the insulator 13 form the first mounting surface 1a and the second mounting surface 1b. In this manner, partial surfaces of the insulator 13 form the first mounting surface 1a and the second mounting surface 1b. Specifically, the insulator 13 is a plate-shaped insulating member with a constant thickness.

[0037] The plate-shaped insulator 13 is sandwiched between the first electrode 11 and the second electrode 12. Therefore, one side of the insulator 13 is in contact with the side of the first electrode 11, and the other side of the insulator 13 is in contact with the side of the second electrode 12. Therefore, the first electrode 11 and the second electrode 12 are separated by the width of the insulator 13. Note that the insulator 13 does not have to be a tangible object, and may simply be a gap (air layer). In other words, the first electrode 11 and the second electrode 12 may be insulated and separated by a gap.

[0038] The first protector 14 covers the side surface of the first electrode 11 opposite to the insulator 13 side. The second protector 15 covers the side surface of the second electrode 12 opposite to the insulator 13 side. The first protector 14 and the second protector 15 form part of the outer periphery of the support 1.

[0039] In this embodiment, the first protector 14 and the second protector 15 are protective films or plates thinner than the first electrode 11 and the second electrode 12. The first protector 14 and the second protector 15 are made of, for example, a metal material or a resin material. That is, the first protector 14 and the second protector 15 are metal films or resin films, or metal plates or resin plates. The first protector 14 and the second protector 15 may be made of a material other than a metal material or a resin material. The first protector 14 and the second protector 15 may be made of a conductive material such as a metal material, but are preferably made of an insulating material such as an insulating resin material. This allows the outer periphery of the support 1 to be an insulating portion rather than a live portion. The support 1 does not necessarily have to have the first protector 14 and the second protector 15. That is, the side surfaces of the first electrode 11 and the second electrode 12 may be exposed.

[0040] Although not shown, the support 1 may also include a fixing body for the purpose of ensuring the mechanical strength of the support 1 against vibration. The support 1 may also include a heat sink for dissipating heat from heat-generating electronic components. In this case, the fixing body may also serve as the heat sink, or the heat sink may also serve as the fixing body. The first electrode 11 may also serve as the fixing body and / or the heat sink, or the second electrode 12 may also serve as the fixing body and / or the heat sink.

[0041] Electronic components are mounted by solder on the first mounting surface 1a of the support 1 configured in this manner. That is, the first mounting surface 1a is a solder region where solder is formed when mounting the electronic components. In this embodiment, the first electrode 11 and the second electrode 12 are exposed on the first mounting surface 1a, and the insulator 13 is also exposed. However, since solder is not formed on the insulator 13, the first electrode 11 and the second electrode 12 exposed from the first mounting surface 1a are the solder region.

[0042] The second mounting surface 1b is a solder region where solder is formed when the support 1 is mounted on a circuit board or the like by soldering. Specifically, the first electrode 11 and the second electrode 12 exposed from the second mounting surface 1b are the solder region.

[0043] In the support 1, a first electrode edge 11S, which is the electrode edge on the inclined lower side (thinner side of the support 1) of the first electrode 11 exposed on the first mounting surface 1a, and a second electrode edge 12S, which is the electrode edge on the inclined lower side (thinner side of the support 1) of the second electrode 12 exposed on the first mounting surface 1a, serve as alignment references for aligning an electronic component when mounting the electronic component on the support 1 by soldering. Therefore, the electrode edges on the inclined lower side of the electrodes of the electronic component are located at the first electrode edge 11S and the second electrode edge 12S.

[0044] Specifically, the first electrode edge 11S of the first electrode 11 is an alignment reference for aligning the first electrode of the electronic component, and the first electrode edge on the inclined lower side of the first electrode of the electronic component is located at the first electrode edge 11S. Also, the second electrode edge 12S of the second electrode 12 is an alignment reference for aligning the second electrode of the electronic component, and the second electrode edge on the inclined lower side of the second electrode of the electronic component is located at the second electrode edge 12S.

[0045] The first electrode edge 11S is an edge portion of the first electrode 11, and the second electrode edge 12S is an edge portion of the second electrode 12. In this embodiment, the first electrode edge 11S is an electrode end that is an end portion of the first electrode 11, and the second electrode edge 12S is an electrode end that is an end portion of the second electrode 12. Furthermore, in this embodiment, the first electrode edge 11S and the second electrode edge 12S are edge portions of the support body 1. Specifically, the first electrode edge 11S and the second electrode edge 12S are edge portions on the lower side of the slope of the first mounting surface 1a (i.e., the bottom end of the sloped surface).

[0046] The first electrode edge 11S and the second electrode edge 12S are spaced apart from the second mounting surface 1b in the direction perpendicular to the second mounting surface 1b (the Z-axis direction). That is, the first electrode edge 11S and the second electrode edge 12S are spaced apart from the second mounting surface 1b at a fixed distance.

[0047] In this way, in the support 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 serve as alignment references for aligning an electronic component when mounting the electronic component on the support 1, and the first electrode edge 11S and the second electrode edge 12S are spaced a certain distance from the second mounting surface 1b. As a result, when mounting an electronic component on the support 1 with solder, the electronic component placed on the solder applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component can be easily aligned without being displaced from its predetermined mounting position on the support 1. Details of the alignment behavior of the electronic component will be described later.

[0048] The support 1 also has a suction portion 20, which is a portion that is suctioned by a suction nozzle when the support 1 is mounted on a substrate. The suction portion 20 is located on the rear side of the second mounting surface 1b and is a plane parallel to the second mounting surface 1b. Therefore, the plane that forms the suction portion 20 is inclined with respect to the first mounting surface 1a. In this embodiment, the plane that forms the suction portion 20 is formed continuously with the first mounting surface 1a. Specifically, the suction portion 20 is an exposed surface of the first electrode 11, the second electrode 12, and the insulator 13.

[0049] By providing the suction portion 20 on the support 1 in this manner, the support 1 can be easily attached and detached in a direction perpendicular to the second mounting surface 1b using a mounting machine or the like equipped with a suction nozzle. This makes it possible to handle the support 1 and easily place the support 1 on a substrate using a mounting machine for industrial production. Specifically, the suction portion 20 of the support 1 is sucked by a suction nozzle, and the support 1 is moved in the vertical direction, and the support 1 can be placed on a substrate arranged so as to be parallel to a horizontal plane extending perpendicular to the direction of gravity, thereby easily mounting the support 1 on the substrate.

[0050] In the present embodiment, the suction unit 20 is provided on the top surface of the support 1, but the position of the suction unit 20 on the support 1 is not particularly limited. For example, the suction unit 20 may be provided on the bottom of the support 1 or in the middle in the height direction.

[0051] The envelope volume of the support 1 configured in this manner is, for example, 25 mm ３ (0.025 cm ３ ) or more 30cm ３ It is preferable that the value is equal to or less than 30 mm. ３ (0.030 cm ３ ) or more than 8000 mm ３ (8cm ３ ) or less, and particularly preferably 30 mm ３ (0.030 cm ３ ) or more than 1000 mm ３ (1 cm ３) or less. By providing the support 1 with such an envelope volume, the support 1 becomes preferable for mounting electronic components such as LEDs at an angle on the first mounting surface 1a, which is an inclined surface. This not only enables the electronic components to be aligned to predetermined mounting positions, but also provides a support 1 that is excellent in dissipating heat generated by the electronic components.

[0052] Next, an inclined mounting module 100 using the support body 1 configured in this manner will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a perspective view of the inclined mounting module 100 according to the first embodiment. Fig. 4 is a side view of the inclined mounting module 100 according to the first embodiment.

[0053] 3 and 4 , the tilted mounting module 100 includes a support 1 and an electronic component 2 mounted on a first mounting surface 1a of the support 1. The electronic component 2 is mounted on the first mounting surface 1a of the support 1 via solder 3. In other words, the solder 3 is interposed between the support 1 and the electronic component 2. The solder 3 is a bonding agent that bonds a first electrode 11 and a second electrode 12 exposed on the first mounting surface 1a of the support 1 to electrodes (not shown) of the electronic component 2.

[0054] Although not shown, the electronic component 2 has a first electrode and a second electrode. The first electrode of the electronic component 2 has a first electrode edge 2aS located on the inclined lower side of the first mounting surface 1a. The second electrode of the electronic component 2 has a second electrode edge 2bS located on the inclined lower side of the first mounting surface 1a.

[0055] The electronic component 2 is, for example, a solid-state light-emitting element such as an LED (Light Emitting Diode) or a semiconductor laser. When the electronic component 2 is a solid-state light-emitting element, the light output surface of the solid-state light-emitting element faces the same direction as the perpendicular direction of the first mounting surface 1 a. This makes it easy to perform optical design for light emitted from the solid-state light-emitting element when the inclined mounting module 100 is mounted on a circuit board.

[0056] In this embodiment, the electronic component 2 is an LED. Specifically, the electronic component 2 is an individually packaged surface mount device (SMD) type LED element. For example, a white LED package (package size: 3.5 mm × 3.5 mm × 2.35 mm) can be used as the electronic component 2.

[0057] When the electronic component 2 is a solid-state light-emitting element, the type of light emitted by the solid-state light-emitting element is not particularly limited. For example, the electronic component 2 may be a solid-state light-emitting element that emits one electromagnetic wave selected from ultraviolet light, visible light, and infrared light.

[0058] Here, the ultraviolet light can be at least one selected from UV-A rays (315 nm to 400 nm), UV-B rays (280 nm to 315 nm), and UV-C rays (100 nm to 280 nm).

[0059] The visible light can be at least one selected from purple light (380 nm to 430 nm), blue light (430 nm to 490 nm), green light (490 nm to 550 nm), yellow light (550 nm to 590 nm), orange light (590 to 640 nm), red light (640 nm to 780 nm), and white light.

[0060] In this case, the white light can be at least one selected from, for example, incandescent light (correlated color temperature: 2600K to 3250K), warm white (3250K to 3800K), white (3800K to 4500K), daylight white (4600K to 5500K), and daylight (5700K to 7100K).

[0061] The infrared ray may be at least one selected from IR-A waves (0.78 μm to 1.4 μm), IR-B waves (1.4 μm to 3 μm), and IR-C waves (3 μm to 1000 μm).

[0062] The electronic component 2 may have a passive characteristic of receiving a physical characteristic, rather than an active characteristic such as outputting light like a solid-state light-emitting element. For example, the electronic component 2 may be a detection element (sensor) such as a semiconductor detection element that receives physical characteristics such as light, sound, temperature, pressure, and odor. Examples of the detection element that can be used include a light detection element that detects light, a sound detection element that detects sound, a temperature detection element that detects temperature, a pressure detection element that detects pressure, and an odor detection element that detects odors.

[0063] When the electronic component 2 is a sensing element, the sensing surface of the sensing element preferably faces in the same direction as the perpendicular direction of the first mounting surface 1 a. This makes it easy to perform optical design for the light to be detected by the sensing element when the inclined mounting module 100 is mounted on a circuit board.

[0064] Examples of light detection elements that can be used include photodiodes, CCDs (Charge Coupled Devices), and CMOS (Complementary Metal-Oxide-Semiconductor) image sensors. Examples of sound detection elements that can be used include piezoelectric elements and condenser microphones. Examples of temperature detection elements that can be used include thermoelectric elements and thermistors. Examples of pressure detection elements that can be used include semiconductor pressure sensors. Examples of odor detection elements that can be used include semiconductor gas sensors. Note that the types of detection targets detected by the detection elements are not limited to light, sound, temperature, pressure, and odors.

[0065] Furthermore, the electronic component 2 may be something other than a solid-state light-emitting element or a detector. In either case, the electronic component 2 is preferably a surface-mount type. This eliminates the need for additional processing to mount the electronic component 2 on the first mounting surface 1a of the support body 1, and the electronic component 2 can be mounted on the support body 1 simply by placing the electronic component 2 on the first mounting surface 1a via a bonding agent such as solder. This makes it possible to obtain an angle-mounted module 100 with excellent industrial productivity.

[0066] When mounting the electronic component 2 on the support 1, the electronic component 2 can be mounted on the first mounting surface 1a of the support 1 by a solder mounting technique using solder. Therefore, as shown in FIGS. 3 and 4 , solder 3 exists between the first mounting surface 1a of the support 1 and the electrodes of the electronic component 2. For example, cream solder can be used as the solder 3 that joins the support 1 and the electronic component 2. Specifically, Sn—Ag—Cu-based cream solder can be used as the solder 3. In this embodiment, lead-free solder paste (product number: SN97C (composition: Sn 96.5%, Ag 3%, Cu 0.5%, melting point: 218°C to 219°C) manufactured by Nippon Superior Co., Ltd. was used as the Sn—Ag—Cu-based cream solder.

[0067] The electronic component 2 is mounted on the first mounting surface 1a of the support body 1 via solder 3. At this time, since the first mounting surface 1a of the support body 1 is an inclined surface inclined with respect to the second mounting surface 1b, the electronic component 2 mounted on the first mounting surface 1a is mounted in an inclined position on the support body 1. As a result, when the inclined mounting module 100 is mounted on a substrate, the electronic component 2 is inclined with respect to the main surface of the substrate.

[0068] For example, when the electronic component 2 is a solid-state light-emitting element, a lighting module that can output light from the solid-state light-emitting element in a direction oblique to the main surface of the substrate can be obtained as the inclined mounting module 100. When the electronic component 2 is a detecting element, a sensor module that can detect a physical property (such as light) that is incident obliquely to the main surface of the substrate can be obtained as the inclined mounting module 100.

[0069] In this way, the inclined mounting module 100 of this embodiment can improve the efficiency of utilization of the active characteristics of the electronic component 2 in diagonal directions relative to the main surface of the substrate, and can improve the efficiency of utilization of the passive characteristics of the electronic component 2 relative to physical characteristics that reach the main surface of the substrate from diagonal directions.

[0070] The outer shape of at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a of the support 1 may be the same or substantially the same as the outer shape of either the first electrode or the second electrode exposed on the mounting surface of the electronic component 2 to be joined via the solder 3. This allows either the first electrode or the second electrode exposed on the mounting surface of the electronic component 2 to be joined by the molten solder 3 to one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a so that their outer shapes match. In other words, when the molten solder 3 solidifies, it is possible to prevent the electronic component 2 mounted on the first mounting surface 1a from rotating and becoming misaligned on the first mounting surface 1a. This allows for an inclined mounting module 100 that is convenient for precise control of the mounting position of the electronic component 2.

[0071] Furthermore, rather than just one of them, it is even more preferable if the outer shape of the first electrode 11 of the support 1 exposed on the first mounting surface 1a is the same or approximately the same as the outer shape of the first electrode exposed on the mounting surface of the electronic component 2, and the outer shape of the second electrode 12 of the support 1 exposed on the first mounting surface 1a is the same or approximately the same as the outer shape of the second electrode exposed on the mounting surface of the electronic component 2. In this way, both the first electrode and the second electrode exposed on the mounting surface of the electronic component 2 are joined by the molten solder 3 so that their outer shapes match those of the first electrode 11 and the second electrode 12 of the support 1 exposed on the first mounting surface 1a, respectively. This makes it possible to obtain an inclined mounting module 100 that is more convenient for precise control of the mounting position of the electronic component 2.

[0072] Here, an example of a method for manufacturing the inclined mounting module 100 will be described with reference to Fig. 5. Fig. 5 is a diagram for explaining an example of a method for manufacturing the inclined mounting module 100 according to the first embodiment.

[0073] First, as shown in FIG. 5A, the support 1 is tilted and positioned so that the first mounting surface 1a is horizontal.

[0074] Next, as shown in FIG. 5B, solder 3 is applied to the first mounting surface 1a of the support 1 using a dispenser. The amount of solder 3 applied is, for example, an amount that results in a thickness of approximately 80 μm after reflow. Solder paste (solder paste) can be used as the solder 3. The solder 3 is applied to the metal portions (first electrode 11, second electrode 12) exposed on the first mounting surface 1a of the support 1. In this case, the solder 3 is applied separately to the first electrode 11 and the second electrode 12. That is, the solder 3 is applied to two locations on the first mounting surface 1a so that the solder 3 on the first electrode 11 and the solder 3 on the second electrode 12 do not become integrated. Note that the solder 3 is applied only to the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a, but it may also be applied to locations on the first mounting surface 1a other than the first electrode 11 and the second electrode 12.

[0075] 5(c), the electronic component 2 is placed on the solder 3 applied to the support 1. At this time, the electronic component 2 adheres to the first mounting surface 1a of the support 1 via the solder 3 due to the adhesive strength of the solder 3. Furthermore, if the electronic component 2 is a white LED package, the electronic component 2 (LED package) is placed on the support 1 so that the first electrode (e.g., a positive electrode) and the second electrode (e.g., a negative electrode) of the white LED package face the first electrode 11 and the second electrode 12 of the support 1.

[0076] 5(d), the support 1 is rotated so that the second mounting surface 1b is horizontal. At this time, the first mounting surface 1a is inclined with respect to the horizontal plane (XY plane), but the electronic component 2 does not slip off because it is adhered to the solder 3.

[0077] 5(d), the support 1 is placed in a reflow device (reflow furnace) and heated under a temperature condition that melts the solder 3 to melt the solder 3, and then the solder 3 is solidified. This allows the electronic component 2 to be joined to the first mounting surface 1a of the support 1 via the solder 3.

[0078] 5(e), because the first mounting surface 1a of the support 1 is inclined with respect to the horizontal plane (XY plane), the heat during reflow causes the solder 3 to melt and spread over the first mounting surface 1a (specifically, the exposed surfaces of the first electrode 11 and second electrode 12), causing the electronic component 2 to temporarily slide down along the inclination of the first mounting surface 1a in a direction in which the distance between the first mounting surface 1a and the second mounting surface 1b decreases (i.e., below the first mounting surface 1a). Specifically, because the first electrode edge 11S and the second electrode edge 12S of the support 1 are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b, the electronic component 2 slides down such that its lower end (e.g., the first electrode edge 2aS, the second electrode edge 2bS) protrudes from the first electrode edge 11S and the second electrode edge 12S of the support 1. In this way, the electronic component 2 initially slides down along the first mounting surface 1a, but the molten solder 3 acts to minimize its volume, so that this action causes the electronic component 2 to slide up along the slope of the first mounting surface 1a and be mounted at a predetermined mounting position on the support 1, as shown in Figure 5(f) . In other words, using the first electrode edge 11S and the second electrode edge 12S as alignment references, the electrodes of the electronic component 2 are automatically aligned with the first electrode 11 and the second electrode 12 of the support 1. Specifically, the first electrode edge 11S of the support 1 is aligned with the first electrode edge 2aS on the lower side of the slope of the first electrode of the electronic component 2, and the second electrode edge 12S of the support 1 is aligned with the second electrode edge 2bS on the lower side of the slope of the second electrode of the electronic component 2.

[0079] In this embodiment, the predetermined mounting position of the electronic component 2 on the support 1 is a position where the lower end of the inclined first mounting surface 1a substantially coincides with the lower end of the inclined electronic component 2. In other words, the predetermined mounting position of the electronic component 2 is a position where each end of the first electrode edge 11S and the second electrode edge 12S of the support 1 substantially coincides with each end of the first electrode edge 2aS and the second electrode edge 2bS of the electronic component 2.

[0080] Furthermore, on the first mounting surface 1 a of the support 1, the first electrode 11 and the second electrode 12 each extend in the inclined direction of the first mounting surface 1 a. This can encourage the electronic component 2 to move along the inclined direction, as shown in Fig. 5(e), and can prevent the electronic component 2 from moving in a direction other than the inclined direction, causing misalignment of the electronic component 2. For example, it can prevent the position of the electronic component 2 from being misaligned in a direction perpendicular to the inclined direction.

[0081] 5(e), although there is a risk that the electronic component 2 may fall off the first mounting surface 1a when the solder 3 melts, the solder 3 acts to stop the electronic component 2 at the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references, so the electronic component 2 does not fall off the first mounting surface 1a. This prevents the electronic component 2 placed on the inclined first mounting surface 1a from falling off the first mounting surface 1a, causing misalignment of the electronic component 2. The electronic component 2 can be mounted on the support 1 in an inclined state without being displaced from its predetermined mounting position on the support 1. In this way, the mounting position of the electronic component 2 bonded to the support 1 is automatically aligned to the position determined by the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references.

[0082] In this manner, an inclined mounting module 100 can be fabricated in which the electronic component 2 is mounted on the support 1 via the solder 3. Specifically, the first electrode 11 and the second electrode 12 of the support 1 are connected to the first electrode and the second electrode of the electronic component 2, which is a white LED package. When an inclined mounting module 100 was actually fabricated using this method, the inclined mounting module 100 shown in FIG. 6 was obtained. FIG. 6 is an optical photograph taken from the side of the actually fabricated inclined mounting module 100. As shown in FIG. 6, it can be seen that the electronic component 2 was successfully mounted in a predetermined mounting position on the first mounting surface 1a of the support 1.

[0083] 5, the support body 1 is initially tilted so that the first mounting surface 1a is horizontal, but this is not limiting. Specifically, as shown in (a) of FIG. 7, the first mounting surface 1a may initially be inclined with respect to the horizontal plane (XY plane). FIG. 7 is a diagram for explaining another example of the manufacturing method for the tilted mounting module 100 according to the first embodiment.

[0084] In this method, first, as shown in FIG. 7A, the support 1 is positioned so that the second mounting surface 1b is horizontal. At this time, the first mounting surface 1a is inclined with respect to the horizontal plane (XY plane). Next, as shown in FIG. 7B, solder 3 is applied to the first mounting surface 1a of the support 1 in the same manner as in FIG. 5B. Next, as shown in FIG. 7C, the electronic component 2 is placed on the solder 3 applied to the support 1. At this time, the electronic component 2 adheres to the first mounting surface 1a of the support 1 due to the adhesive strength of the solder 3, so it does not slip off. The support 1 is then placed in a reflow device, and the solder 3 is melted and solidified, thereby joining the electronic component 2 to the support 1. At this time, as shown in (d) and (e) of Figure 7, similar to (e) and (f) of Figure 5, the solder 3 melts and spreads over the first mounting surface 1a, causing the electronic component 2 to slide down along the slope of the first mounting surface 1a. However, due to the action of the molten solder 3 trying to make its volume as small as possible, the electronic component 2 slides up along the slope of the first mounting surface 1a and is mounted at a predetermined mounting position on the support 1.

[0085] Next, a circuit module 200 using the inclined mounting module 100 will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a perspective view showing a part of the circuit module 200 according to the first embodiment. Fig. 9 is a side view showing a part of the circuit module 200 according to the first embodiment.

[0086] 8 and 9 , a circuit module 200 can be obtained by mounting the inclined mounting module 100 on a circuit board 4. That is, the circuit module 200 includes the inclined mounting module 100 and the circuit board 4 on which the support 1 of the inclined mounting module 100 is mounted.

[0087] 8 and 9 , in the circuit module 200, the support 1 of the inclined mounting module 100 is mounted on the circuit board 4 via the second mounting surface 1b of the support 1. The support 1 that supports the electronic component 2 is mounted by placing the second mounting surface 1b of the support 1 on the circuit board 4. In this way, the support 1 is a support member that supports the electronic component 2 and is mounted on the circuit board 4.

[0088] When mounting the tilt-mounted module 100 on the circuit board 4, the support 1 of the tilt-mounted module 100 is mounted on the circuit board 4 by a solder mounting technique using solder. Therefore, as shown in Fig. 9, solder 5 is present between the second mounting surface 1b of the support 1 and the circuit board 4. The solder 5 is a bonding material that bonds the first electrode 11 and the second electrode 12 exposed on the second mounting surface 1b of the support 1 to the electrodes 4a of the pattern on the circuit board 4. Note that the solder 5 is omitted in Fig. 8.

[0089] In this embodiment, the solder 5 used when mounting the support 1 on the circuit board 4 and the solder 3 used when mounting the electronic component 2 on the support 1 are the same type of solder with the same melting point. Specifically, the solder 5 used when mounting the support 1 on the circuit board 4 and the solder 3 used when mounting the electronic component 2 on the support 1 are the same.

[0090] At least one tilt-mounted module 100 is mounted on the circuit board 4. The circuit board 4 is an example of a board. The circuit board 4 is a mounting board for mounting the support body 1. The circuit board 4 has a first surface which is the main surface on which the support body 1 is mounted, and a second surface which is the main surface opposite to the first surface.

[0091] In this embodiment, the circuit board 4 is a printed wiring board on which electrodes 4a (electrode patterns) of a predetermined pattern are formed. The electrodes 4a are formed on a first surface, which is one of the main surfaces of the circuit board 4. The circuit board 4 may be a double-sided wiring board on which wiring is formed on both sides. The circuit board 4 may be a resin board based on an insulating resin material, a ceramic board based on a ceramic material such as alumina, or a metal-based board based on a metal material such as aluminum or copper. The circuit board 4 is a rigid board, but may also be a flexible board. In this embodiment, the shape of the circuit board 4 in a plan view is rectangular, but is not limited thereto. The shape of the circuit board 4 in a plan view may be a polygonal shape such as a rectangle, a circle, or another shape. The thickness of the circuit board 4 is not particularly limited.

[0092] Furthermore, since the support 1 on which the electronic components 2 are arranged in an inclined position is mounted on the circuit board 4, the electronic components 2 are inclined with respect to the main surface of the circuit board 4. Therefore, the circuit module 200 is a module in a form in which the electronic components 2 are mounted on the first mounting surface 1a which is inclined with respect to the second mounting surface 1b which is the mounting surface on the circuit board 4.

[0093] Therefore, when the electronic component 2 has an active characteristic, it is possible to realize a circuit module 200 that can utilize this active characteristic in a direction oblique to the main surface of the circuit board 4. Furthermore, when the electronic component 2 has a passive characteristic, it is possible to realize a circuit module 200 that can receive, at the electronic component 2, a physical characteristic that arrives from a direction oblique to the main surface of the circuit board 4.

[0094] For example, when the electronic component 2 is a solid-state light-emitting element, it is possible to obtain a circuit module 200 having an active function that is convenient for outputting light in an oblique direction relative to the main surface (mounting surface) of the circuit board 4. Furthermore, when the electronic component 2 is a sensing element, it is possible to obtain a circuit module 200 having a passive function that is convenient for detecting a physical property that reaches the main surface (mounting surface) of the circuit board 4 from an oblique direction.

[0095] In this way, the circuit module 200 according to this embodiment can improve the efficiency of utilization of the active characteristics of the electronic component 2 in diagonal directions relative to the main surface of the circuit board 4, and can improve the efficiency of utilization of the passive characteristics of the electronic component 2 relative to physical characteristics that reach the main surface of the circuit board 4 from diagonal directions.

[0096] Furthermore, as described above, the first electrode 11 and the second electrode 12 of the support 1 are exposed on the first mounting surface 1a and the second mounting surface 1b, respectively. This allows heat generated by the electronic component 2 mounted on the first mounting surface 1a of the support 1 to be efficiently conducted through the first electrode 11 and the second electrode 12 and then to the circuit board 4 via the second mounting surface 1b of the support 1. In this manner, the first electrode 11 and the second electrode 12, which are metal structures with a height relative to the circuit board 4, serve as the positive and negative electrodes of the electronic component 2 and can be used as a heat conduction path perpendicular to the main surface of the circuit board 4. This facilitates heat dissipation design using the metal structures with a height, enabling both high-density mounting and suppression of performance degradation due to temperature rise of the tilted-mounted electronic component 2. In other words, the support 1 of this embodiment effectively suppresses performance degradation of tilted-mounted electronic components 2 during high-density mounting.

[0097] An example of a method for manufacturing the circuit module 200 shown in Figures 8 and 9 will now be described with reference to Figure 10. Figure 10 is a diagram for explaining an example of a method for manufacturing the circuit module 200 according to the first embodiment.

[0098] The manufacturing method of the circuit module 200 shown in Figure 10 includes a first placement process shown in (a) and (b) of Figure 10, a second placement process shown in (c) and (d) of Figure 10, and an implementation process shown in (e) and (f) of Figure 10.

[0099] In the first mounting step, the electronic component 2 is mounted on the first mounting surface 1a of the support 1 via solder 3 (first solder). Specifically, as shown in FIG. 10A, first, the solder 3 is applied to the first mounting surface 1a of the support 1 using a dispenser device. At this time, the solder 3 is applied only to the metal portions (first electrode 11, second electrode 12) on the first mounting surface 1a of the support 1, but may also be applied to portions on the first mounting surface 1a other than the first electrode 11 and the second electrode 12. Next, as shown in FIG. 10B, the electronic component 2 is mounted on the solder 3 applied to the support 1. At this time, the electronic component 2 adheres to the first mounting surface 1a of the support 1 via the solder 3 due to the adhesive force of the solder 3. Furthermore, when the electronic component 2 is a white LED package, the electronic component 2 (LED package) is placed on the support 1 so that the first electrode (e.g., a positive electrode) and the second electrode (e.g., a negative electrode) of the white LED package face the first electrode 11 and the second electrode 12 of the support 1.

[0100] In the second placing step, the support 1 is placed on the electrodes 4a of the circuit board 4 via solder 5 (second solder). Specifically, first, as shown in FIG. 10(c), solder 5 is applied to the electrodes 4a of the circuit board 4 using a dispenser device. The solder 5 may be the same as the solder 3 used in the first placing step. Next, although not shown, the suction portion 20 of the support 1 is sucked with a suction nozzle, and the support 1 with the electronic component 2 placed thereon is placed on the solder 5 applied to the circuit board 4, as shown in FIG. 10(d).

[0101] In the mounting process, the electronic component 2 is mounted on the support 1 via the solder 3, and the support 1 is mounted on the circuit board 4 via the solder 5. Specifically, first, the structure in which the electronic component 2 is placed on the support 1 via the solder 3 and the support 1 is placed on the circuit board 4 via the solder 5 is placed in a reflow device (reflow furnace), and heated under temperature conditions that melt the solders 3 and 5 to melt them, and then the solders 3 and 5 are solidified. This allows the electronic component 2 to be joined to the first mounting surface 1a of the support 1 via the solder 3, and the support 1 to be joined to the circuit board 4 via the solder 5 on the second mounting surface 1b.

[0102] 10(e), because the first mounting surface 1a of the support 1 is inclined with respect to the horizontal plane (XY plane), the heat during reflow melts the solder 3 and causes it to spread over the first mounting surface 1a (specifically, the exposed surfaces of the first electrodes 11 and second electrodes 12), causing the electronic component 2 to temporarily slide down along the inclination of the first mounting surface 1a. Specifically, because the first electrode edge 11S and the second electrode edge 12S of the support 1 are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b, the electronic component 2 slides down such that its lower end (e.g., the first electrode edge 2aS, the second electrode edge 2bS) protrudes beyond the first electrode edge 11S and the second electrode edge 12S of the support 1. In this way, the electronic component 2 initially slides down along the first mounting surface 1a, but the molten solder 3 acts to minimize its volume, so that this action causes the electronic component 2 to slide up along the slope of the first mounting surface 1a and be mounted at a predetermined mounting position on the support 1, as shown in Figure 10(f) . In other words, using the first electrode edge 11S and the second electrode edge 12S as alignment references, the electrodes of the electronic component 2 are automatically aligned with the first electrode 11 and the second electrode 12 of the support 1. Specifically, the first electrode edge 11S of the support 1 is aligned with the first electrode edge 2aS on the lower side of the slope of the first electrode of the electronic component 2, and the second electrode edge 12S of the support 1 is aligned with the second electrode edge 2bS on the lower side of the slope of the second electrode of the electronic component 2.

[0103] Since the second mounting surface 1b of the support 1 is parallel to the horizontal plane (XY plane), the support 1 does not move even if the solder 5 melts due to the heat during reflow and spreads between the second mounting surface 1b and the circuit board 4.

[0104] In this manner, it is possible to fabricate circuit module 200 in which electronic component 2 is mounted on support 1 via solder 3 and support 1 is mounted on circuit board 4 via solder 5. Specifically, first electrode 11 and second electrode 12 on support 1 are connected to the first electrode and second electrode of electronic component 2, which is a white LED package, and first electrode 11 and second electrode 12 on support 1 are connected to a pair of electrodes 4 a on circuit board 4.

[0105] In this embodiment, the mounting process shown in FIGS. 10E and 10F is performed after the first mounting process shown in FIGS. 10A and 10B and the second mounting process shown in FIGS. 10C and 10D. In this case, the order of the first and second mounting processes is not particularly limited. For example, in this embodiment, the second mounting process is performed after the first mounting process. However, the first mounting process may be performed after the second mounting process, or the first and second mounting processes may be performed simultaneously. That is, the support 1 on which the electronic component 2 is mounted via the solder 3 may be mounted on the circuit board 4 via the solder 5. Alternatively, the electronic component 2 may be mounted via the solder 3 on the support 1 mounted on the circuit board 4 via the solder 5. Alternatively, the electronic component 2 may be mounted via the solder 3 and the support 1 may be mounted on the circuit board 4 via the solder 5 at the same time.

[0106] 10(e) and 10(f), there is a risk that the electronic component 2 will fall off the first mounting surface 1a when the solder 3 melts. However, the solder 3 acts to hold the electronic component 2 in place on the first mounting surface 1a by the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references. Therefore, the electronic component 2 will not fall off the first mounting surface 1a. This prevents the electronic component 2 placed on the inclined first mounting surface 1a from falling off the first mounting surface 1a, resulting in misalignment of the electronic component 2. The electronic component 2 can be mounted on the support 1 in an inclined state without being displaced from its predetermined mounting position on the support 1, and the support 1 can be mounted on the circuit board 4. In this way, the mounting position of the electronic component 2 bonded to the support 1 is automatically aligned with the position determined by the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references. Thus, the manufacturing method for the circuit module 200 according to this embodiment allows the circuit module 200, in which the electronic component 2 is mounted on the support 1, to be manufactured using a simple process with high mounting accuracy.

[0107] Furthermore, according to the manufacturing method shown in FIG. 10 , by simply placing the circuit board 4 on which the support 1 supporting the electronic component 2 is mounted in a reflow device once, it is possible to manufacture the circuit module 200 in which the electronic component 2 is mounted at an angle relative to the circuit board 4.

[0108] Furthermore, in this embodiment, when the entire first mounting surface 1a is viewed from a direction horizontal to the second mounting surface 1b, the maximum width of the upper half of the support body 1 is equal to the maximum width of the lower half of the first mounting surface 1a. This makes it possible to increase the proportion of the mounting area of ​​the electronic components 2 to the mounting area of ​​the inclined mounting modules 100 on the circuit board 4 when multiple inclined mounting modules 100, each having electronic components 2 mounted on the support body 1, are mounted at high density on the circuit board 4.

[0109] 10, the circuit module 200 is manufactured by mounting the electronic component 2 on the support 1 and then mounting the support 1 on the circuit board 4 in a single mounting step, but this is not limiting. That is, the circuit module 200 may be manufactured by separately performing the step of mounting the electronic component 2 on the support 1 and the step of mounting the support 1 on the circuit board 4. This manufacturing method will be described with reference to FIG. 11. FIG. 11 is a diagram for explaining another example of the manufacturing method for the circuit module 200 according to the first embodiment.

[0110] The manufacturing method of the circuit module 200 shown in FIG. 11 includes a first mounting step shown in FIG. 11(a), a tilting step shown in FIG. 11(b), and a second mounting step shown in FIG. 11(c).

[0111] The first mounting step shown in FIG. 11A is a step of mounting an electronic component 2 on a first mounting surface 1a of a support 1 via solder 3, and is the same as the steps shown in FIGS. 5A to 5F. Specifically, in the first mounting step, solder 3 is applied to the first mounting surface 1a of the support 1, which is arranged so that the first mounting surface 1a is parallel to the horizontal plane (XY plane), and the electronic component 2 is placed on the solder 3. Then, the support 1 on which the electronic component 2 is mounted via the solder 3 is placed in a reflow device to melt the solder 3, and then the solder 3 is solidified. This allows the electronic component 2 to be joined to the first mounting surface 1a of the support 1 via the solder 3.

[0112] 11B, in the tilting step, the support 1 on which the electronic components 2 are mounted is tilted. Specifically, the support 1 on which the electronic components 2 are mounted is rotated so that the second mounting surface 1b is parallel to the horizontal plane (XY plane), thereby tilting the support 1.

[0113] As shown in FIG. 11C , in the second mounting process, the support 1 on which the electronic component 2 is mounted is mounted on the electrodes 4a of the circuit board 4 via the second mounting surface 1b. Specifically, in the second mounting process, solder 5 is applied to the electrodes 4a of the circuit board 4, which is arranged so that its main surface is parallel to the horizontal plane (XY plane). The suction portion 20 of the support 1 on which the electronic component 2 is mounted is sucked with a suction nozzle, the support 1 on which the electronic component 2 is mounted is placed on the solder 5, and the circuit board 4 on which the support 1 on which the electronic component 2 is mounted is placed is inserted into a reflow device to melt the solder 5, and then the solder 5 is solidified. This allows the support 1 supporting the electronic component 2 to be joined to the electrodes 4a of the circuit board 4 via the solder 5. The solder 5 used in the second mounting process is the same as the solder 3 used in the first mounting process, but is not limited thereto.

[0114] In the manufacturing method of the circuit module 200 according to the present embodiment, the tilting step is performed after the first mounting step, and the second mounting step is performed after the tilting step, i.e., the tilting step is performed between the first mounting step and the second mounting step.

[0115] The first mounting direction (the direction of arrow A in FIG. 11A) in which the electronic component 2 is mounted on the support 1 in the first mounting step and the second mounting direction (the direction of arrow B in FIG. 11C) in which the support 1 is mounted on the electrodes 4a of the circuit board 4 in the second mounting step are the same direction. In this embodiment, the first mounting direction (the direction of arrow A) and the second mounting direction (the direction of arrow B) are the direction of gravity (Z-axis direction).

[0116] In the second mounting step shown in FIG. 11C , not only does the solder 5 between the circuit board 4 and the support 1 melt, but the solder 3 between the electronic component 2 and the support 1 also melts. At this time, the electronic component 2 mounted on the inclined first mounting surface 1a may fall in a direction that reduces the distance between the first mounting surface 1a and the second mounting surface 1b (i.e., downward from the first mounting surface 1a). However, the solder 3 acts to hold the electronic component 2 in place with the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references, so the electronic component 2 does not fall from the first mounting surface 1a. This prevents the electronic component 2 from falling off the inclined first mounting surface 1a, resulting in misalignment of the electronic component 2. In this way, the mounting position of the electronic component 2 bonded to the support 1 is automatically aligned to the position determined by the first electrode edge 11S and the second electrode edge 12S, which serve as alignment references. Therefore, using the same type of mounting machine, the electronic component 2 can be mounted on the support 1 and the support 1 can be mounted on the circuit board 4 with a minimum number of mounting flows without changing the type of solder and the reflow temperature.

[0117] 11 also allows the electronic component 2 placed on the first mounting surface 1a of the support 1 to be mounted on the support 1 in an inclined state without being displaced from a predetermined position, and the support 1 can be mounted on the circuit board 4. Therefore, the manufacturing method for the circuit module 200 shown in FIG. 11 also allows the circuit module 200 in which the electronic component 2 is mounted on the support 1 to be manufactured using a simple process with high mounting accuracy.

[0118] The circuit module 200 according to this embodiment has an envelope volume of, for example, 1 cm ３ More than 1m ３ It is good that it is less than 3 cm, and preferably ３ More than 30000cm ３ More preferably, it is 1000 cm or less. ３ More than 10000cm ３The circuit module 200 having such an envelope volume is preferable for configuring an LED lighting device or a detection device, for example.

[0119] 8 and 9, one obliquely mounted module 100 is arranged on one circuit board 4, but this is not limiting. Specifically, as in the circuit module 201 shown in FIG. 12, a plurality of obliquely mounted modules 100 may be arranged on one circuit board 4. In this case, as shown in FIG. 12, a plurality of the same obliquely mounted modules 100 may be mounted on the circuit board 4. Note that in FIG. 12, the electrodes 4a of the circuit board 4 are omitted. This point is the same hereinafter.

[0120] 12, the inclined mounting modules 100 are mounted so that the first mounting surfaces 1a (inclined surfaces) of the supports 1 face in the same direction, thereby achieving a uniform mounting density. In this manner, the multiple electronic components 2 mounted on each of the multiple supports 1 face in one direction, thereby providing the circuit module 201 with active or passive characteristics that are highly directional.

[0121] 12 illustrates a case where the inclined mounting modules 100 are mounted at the intersections of a lattice. Therefore, the front row of inclined mounting modules 100 tends to block the view in front of the electronic components 2 mounted obliquely on the support 1. To avoid this adverse effect, the inclined mounting modules 100 may be arranged at the intersections of a diagonal lattice. This results in the front row of inclined mounting modules 100 being mounted at positions offset from the front of the electronic components 2 mounted obliquely on the support 1, and the inclined mounting modules 100 in the row before the front are positioned forward. This allows space to be secured in front of the inclined-mounted electronic components 2, making it possible to achieve both high-density mounting and highly directional active or passive characteristics.

[0122] Although FIG. 12 shows the inclined-mounted modules 100 mounted in a planar configuration, the inclined-mounted modules 100 may be mounted in a linear configuration depending on the application. In this case, the first mounting surfaces 1a of the support body 1 may be arranged in a vertical or horizontal row. The direction of output light emitted from the multiple inclined-mounted modules 100 mounted on the circuit board 4 may be the same or different directions. The inclined-mounted modules 100 may also be arranged so that output light is emitted in two or more different directions with regularity. In this case, the two or more different directions may be directions having different vertical angles with respect to the surface of the circuit board 4, or directions having different rotation angles on the surface of the circuit board 4. Various modifications may be possible, such as an arrangement in which the vertical angles or rotation angles are alternately arranged.

[0123] 12 , a circuit module 202 shown in FIG. 13 has a plurality of identical inclined-mounted modules 100 mounted on a single circuit board 4, but the first mounting surface 1 a (inclined surface) of the support body 1 in each inclined-mounted module 100 faces a different direction. Specifically, the inclined-mounted modules 100 are arranged such that the first mounting surface 1 a of the support body 1 faces the outer periphery of the circuit board 4. In addition, in the circuit module 202 shown in FIG. 13 , a plurality of electronic components 2 that are not inclined-mounted are arranged in the center of the circuit board 4. That is, a plurality of inclined-mounted electronic components 2 and a plurality of non-inclined-mounted electronic components 2 are mixed. The plurality of inclined-mounted modules 100 and the plurality of non-inclined-mounted electronic components 2 are mounted on the circuit board 4 so as to achieve a uniform mounting density overall.

[0124] 14 uses a disk-shaped circuit board 4A, and a plurality of angled-mounted modules 100 and non-angled-mounted electronic components 2 are mounted on the circuit board 4A. The plurality of angled-mounted modules 100 are arranged such that the first mounting surface 1a (inclined surface) of the support 1 faces the outer periphery of the circuit board 4A. The non-angled-mounted electronic components 2 are arranged in the center of the circuit board 4A and are surrounded by the plurality of angled-mounted modules 100. The plurality of angled-mounted modules 100 and the non-angled-mounted electronic components 2 are mounted on the circuit board 4A so that the overall mounting density is uniform.

[0125] 14, when all electronic components 2 are solid-state light-emitting elements, the circuit module 203 can efficiently illuminate a direction perpendicular to the main surface (mounting surface) of the circuit board 4A and an area diagonally above the outer periphery of the circuit board 4A. This makes it possible to obtain a circuit module 203 that functions as a surface light source that can emit strong output light even in diagonal directions without using optical components such as lenses or reflectors, thereby enabling the lighting fixture to be made more resource-efficient and more compact.

[0126] 14, if all of the electronic components 2 are sensing elements, it is possible to realize a circuit module 203 that can simultaneously detect physical properties (such as light) incident in a direction perpendicular to the main surface (mounting surface) of the circuit board 4A and from diagonally above the outer periphery of the circuit board 4A. This makes it possible to obtain a circuit module 203 that can monitor physical properties 360°.

[0127] 15 and 16 , a circuit module 204 has a plurality of inclined mounting modules with different inclination angles of the first mounting surface 1 a (inclined surface) mounted on the circuit board 4. Specifically, as shown in FIGS. 15 to 17 , the circuit module 204 includes an inclined mounting module 100 (first inclined mounting module) having the support body 1 in the first embodiment, an inclined mounting module 100A (second inclined mounting module) having a support body 1A whose first mounting surface 1 a has a larger inclination angle than the inclined mounting module 100 (first inclined mounting module), and an inclined mounting module 100B (third inclined mounting module) having a support body 1B whose first mounting surface 1 a has a smaller inclination angle than the inclined mounting module 100 (first inclined mounting module).

[0128] A plurality of each of the inclined mounting modules 100, 100A, and 100B are mounted, and the plurality of inclined mounting modules 100, 100A, and 100B are arranged so that their first mounting surfaces 1a (inclined surfaces) face in a straight line. The inclined mounting modules 100, 100A, and 100B are mounted such that the greater the inclination angle of the first mounting surface 1a, the larger the non-mounting space in front of them. Specifically, the non-mounting space in front of the inclined mounting module 100A is larger than the non-mounting space in front of the inclined mounting module 100.

[0129] 15 and 16, when the electronic component 2 is a solid-state light-emitting element, it can emit a physical property (such as light) in a straight line. When the electronic component 2 is a detector element, it can detect a physical property (such as light) emitted in a straight line. This makes it possible to realize a compact, high-density mounted circuit module 204.

[0130] 15, the inclined mounting modules 100, 100A, and 100B are arranged so that the first mounting surfaces 1a (inclined surfaces) face in a straight line, but this is not limiting. For example, the inclined mounting modules 100, 100A, and 100B may be arranged so that the first mounting surfaces 1a face in a single point.

[0131] 18 , a circuit module 205 includes a plurality of inclined mounting modules having different areas of the first mounting surface 1 a mounted on a circuit board 4. Specifically, as shown in FIG. 18 , the circuit module 205 includes an inclined mounting module 100 (first inclined mounting module) having the support 1 of the first embodiment and an inclined mounting module 100C (fourth inclined mounting module) having a support 1C having a first mounting surface 1 a larger in area than the support 1. In this modification, a plurality of inclined mounting modules 100C are mounted. In this case, a plurality of types of inclined mounting modules 100C having different areas of the first mounting surface 1 a are mounted. Furthermore, a plurality of electronic components 2 are mounted on each support 1C in each inclined mounting module 100C. Specifically, there is an inclined mounting module 100C having two electronic components 2 mounted on the support 1C, an inclined mounting module 100C having three electronic components 2 mounted on the support 1C, and an inclined mounting module 100C having four electronic components 2 mounted on the support 1C. Each inclined mounting module 100C is provided with a plurality of first electrodes 11 and a plurality of second electrodes 12 corresponding to a plurality of electronic components 2. In this modification, the inclination angle of the first mounting surface 1 a of the support body 1 in the inclined mounting module 100 and the inclination angle of the first mounting surface 1 a of the support body 1C in the inclined mounting module 100C are the same, but may be different.

[0132] 18 , a plurality of electronic components 2 are mounted on one inclined mounting module 100C, thereby reducing the number of times the inclined mounting module 100 is mounted. In addition, since it is easy to design the mounting distribution on the circuit board 4 of the inclined mounting module 100C according to the application, it is possible to realize a circuit module 205 that is excellent in industrial productivity or in response to customer requests.

[0133] Furthermore, the circuit board 4 is generally made of an insulating resin material to prevent electrical short circuits of the electronic components 2. However, since resin materials generally have poorer thermal conductivity than metal materials, heat dissipation design for the heat-generating electronic components 2 can be an issue. On the other hand, since the circuit board 4 is generally flat, when multiple electronic components 2 are mounted on the circuit board 4, heat is less likely to be conducted in the horizontal direction of the main surface of the circuit board 4, and there are restrictions on the distance that the electronic components 2 can be brought close to each other. In contrast, the tilted mounting module 100 of this embodiment uses a support 1 that can achieve both high-density mounting and suppression of performance degradation due to temperature rise of the tilted-mounted electronic components 2, which is advantageous for high-density mounting. For example, the mounting density of the electronic components 2 can be set to 1 component / 1 cm. ２ and more than 3 pieces / 1 cm ２ This allows the electronic components 2 to be mounted at high density, making it possible to obtain a small-sized circuit module 205 that can realize miniaturization of electronic devices.

[0134] 12 to 18, the electronic components 2 are all the same, but this is not limited thereto. For example, the circuit modules shown in FIGS. 12 to 18 may include a mixture of inclined mounting modules in which the electronic components 2 are solid-state light-emitting elements and inclined mounting modules in which the electronic components 2 are detector elements. Furthermore, in the circuit modules shown in FIGS. 12 to 18, the mounting density of the inclined mounting modules and the electronic components 2 can be high or low depending on the application or customer requirements. Furthermore, the inclined mounting modules and the electronic components 2 may be mounted so that their in-plane distribution is uniform or non-uniform across the main surface of the circuit board.

[0135] Next, electronic device 300 according to the present embodiment will be described with reference to Fig. 19. Fig. 19 is a perspective view of electronic device 300 according to the first embodiment.

[0136] 19 , electronic device 300 according to the present embodiment includes circuit module 201 shown in FIG. 12 . Circuit module 201 includes a plurality of angled-mounted modules 100 mounted on circuit board 4. Therefore, electronic device 300 includes angled-mounted modules 100.

[0137] This configuration makes it possible to obtain electronic device 300 having electronic components 2 mounted at an angle with respect to the main surface of circuit board 4. This makes it possible to realize electronic device 300 that efficiently utilizes the active characteristics of electronic components 2 in directions oblique to the main surface of circuit board 4, and efficiently utilizes the passive characteristics of electronic components 2 with respect to physical characteristics reaching the main surface of circuit board 4 from oblique directions.

[0138] For example, the electronic device 300 shown in FIG. 19 is a lighting device in which the electronic component 2 is a solid-state light-emitting element (e.g., an LED or semiconductor laser). The circuit module 201 is fixed to a base 6a that serves as a heat sink. The circuit module 201 may also be configured to include a lighting circuit (not shown) for the solid-state light-emitting element. Although not shown, the circuit module 201 has a translucent cover that covers it. Power is supplied to the circuit module 201 via a power supply line 6b. This allows the electronic component 2 (solid-state light-emitting element) to be illuminated. The electronic device 300 also includes a mounting bracket 6c for fixing the electronic device 300 to a building.

[0139] In the electronic device 300 configured in this manner, the electronic component 2, which is a solid-state light-emitting element in the circuit module 201, is mounted at an angle with respect to the main surface of the circuit board 4, and therefore the electronic component 2, which is a solid-state light-emitting element, emits light in an oblique direction with respect to the main surface of the circuit board 4. This light then serves as illumination light for the electronic device 300, which is a lighting device. Therefore, an illumination device that can emit strong illumination light in an oblique direction can be realized.

[0140] Another example of electronic device 300 according to the present embodiment will be described with reference to Fig. 20. Fig. 20 is a schematic diagram of electronic device 300X according to another example of embodiment 1.

[0141] The electronic device 300X shown in Figure 20 is a detection device or evaluation device that combines a solid-state light-emitting element and a photodetector element as electronic components. Specifically, the electronic device 300X includes an inclined mounting module 100 (first inclined mounting module) in which the electronic component 2 mounted on the support 1 is a solid-state light-emitting element, an inclined mounting module 100X (second inclined mounting module) in which the electronic component 2X mounted on the support 1 is a photodetector element, and a housing 7 that houses the inclined mounting modules 100 and 100X. The housing 7 contains a substance 8 that exists between the electronic component 2 (solid-state light-emitting element) and the electronic component 2X (photodetector element). The substance 8 is, for example, at least one substance selected from a gas, a liquid, and a solid.

[0142] 20 , light emitted from the electronic component 2 (solid-state light-emitting element) is received by the electronic component 2X (photodetector) via the substance 8 and converted into an electrical signal. At this time, the electronic component 2X (photodetector) detects light that is light from the electronic component 2 (solid-state light-emitting element) scattered by the substance 8 or light that is at least partially absorbed by the substance 8. Therefore, by analyzing the light detected by the electronic component 2X (photodetector), it is possible to detect the presence of the substance 8 and evaluate the state, etc., of the substance 8.

[0143] (Embodiment 2) Next, a support body 1D and an inclined mounting module 100D according to embodiment 2 will be described with reference to Figs. 21 to 24. Fig. 21 is a perspective view of the support body 1D according to embodiment 2. Fig. 22 is a diagram showing the configuration of the support body 1D according to embodiment 2. In Fig. 22, (a) is a side view of the support body 1D, (b) is a front view of the support body 1D, and (c) is a top view of the support body 1D. Fig. 23 is a perspective view of the inclined mounting module 100D according to embodiment 2. Fig. 24 is a side view of the inclined mounting module 100D according to embodiment 2.

[0144] 21 and 22 , support body 1D according to the present embodiment has first mounting surface 1a and second mounting surface 1b, similar to embodiment 1. Support body 1D also includes first electrode 11, second electrode 12, insulator 13, and fixing body 16. Note that support body 1D in the present embodiment does not include first protector 14 and second protector 15, but may include first protector 14 and second protector 15, similar to embodiment 1.

[0145] The fixed body 16 is disposed between the first electrode 11 and the second electrode 12 via the insulator 13. That is, the insulator 13 is provided between the first electrode 11 and the fixed body 16 and between the second electrode 12 and the fixed body 16.

[0146] By providing the support body 1D with the fixing body 16, the mechanical strength of the support body 1D against vibration can be easily ensured. In this embodiment, the fixing body 16 also serves as a heat sink. In other words, the fixing body 16 not only has the function of ensuring the mechanical strength of the support body 1D, but also has the function of dissipating heat generated by the electronic components 2 mounted on the support body 1D. Therefore, the fixing body 16 is preferably made of a metal material both for mounting the electronic components 2 on the support body 1D and for dissipating heat generated by the electronic components 2. The fixing body 16 is, for example, a plate-shaped metal block made of a metal material with high thermal conductivity, such as copper or aluminum. Specifically, the fixing body 16 is a flat metal block with a constant thickness.

[0147] The shape of the fixed body 16 is not limited to this, and may be a mesh shape. By making the fixed body 16 a mesh-shaped metal member, a mesh surface is formed in which the proportion of hard metal portions is small, so that the fixed body 16 can be easily produced by punching out a predetermined shape.

[0148] 23 and 24 , an inclined mounting module 100D according to this embodiment includes a support body 1D and an electronic component 2 mounted on a first mounting surface 1a of the support body 1D. The electronic component 2 is mounted on the first mounting surface 1a of the support body 1D via solder 3.

[0149] Not only are the first electrode 11 and the second electrode 12 exposed on each of the first mounting surface 1a and the second mounting surface 1b of the support 1D, but the fixing body 16 is also exposed. Therefore, heat generated by the electronic component 2 mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b not only via the first electrode 11 and the second electrode 12 but also via the fixing body 16. This allows the heat generated by the electronic component 2 mounted on the first mounting surface 1a to be efficiently dissipated.

[0150] In this embodiment, the insulator 13 is provided not only on the inner side (fixed body 16 side) of the first electrode 11 and the inner side (fixed body 16 side) of the second electrode 12, but also on the outer side of the first electrode 11 and the outer side of the second electrode 12. Furthermore, the insulator 13 is also provided on a sloped lower side than the first electrode 11 and the second electrode 12. Specifically, the insulator 13 is also located on a sloped lower side than the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12. The portion of the insulator 13 located on a sloped lower side than the first electrode 11 and the second electrode 12 is an auxiliary portion 30. The auxiliary portion 30 is exposed on the first mounting surface 1a, and the surfaces of the first electrode 11 and the second electrode 12 are flush with the surfaces of the auxiliary portion 30. Providing such an auxiliary portion 30 can improve the design of the support body 1D. The auxiliary portion 30 may be a resin portion made of a resin material. That is, in this embodiment, the insulator 13 is preferably made of a resin material.

[0151] For the support body 1D configured in this manner, an electronic component 2 can be mounted on the first mounting surface 1a of the support body 1D via solder 3, as in the first embodiment, to obtain an inclined mounting module 100D shown in Figures 23 and 24. Furthermore, a circuit module can be obtained by mounting the support body 1D on which the electronic component 2 is mounted on a circuit board.

[0152] In this case, in the support 1D of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1D with solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0153] As a result, similar to the support body 1 in the first embodiment, when the electronic component 2 is mounted on the support body 1D via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support body 1D.

[0154] Furthermore, in this embodiment, the metal members of the first electrode 11, the second electrode 12, and the fixed body 16 are embedded in the resin that constitutes the insulator 13. That is, the support body 1D of this embodiment is a composite of metal and resin. This not only makes it easy to ensure insulation between the first electrode 11 and the second electrode 12, but also allows the support body 1D to be fabricated by insert molding. Specifically, the first electrode 11, the second electrode 12, and the fixed body 16, which are metal members, are set in a mold, and resin is injected into the mold and solidified, thereby fabricating the support body 1D in which these metal members are embedded and fixed in the resin. This allows the support body 1D to be constructed using inexpensive materials that are easy to process, thereby enabling the support body 1D to be fabricated inexpensively and also providing a support body 1D with excellent shape controllability.

[0155] Third Embodiment Next, a support 1E according to a third embodiment will be described with reference to Fig. 25. Fig. 25 is a perspective view of the support 1E according to the third embodiment.

[0156] 25 , the support body 1E according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the above-described embodiment 1. Also, the support body 1E includes a first electrode 11, a second electrode 12, an insulator 13, a first protector 14, and a second protector 15, similar to the above-described embodiment 1. The support body 1E is configured such that the insulator 13 in the support body 1 according to the above-described embodiment 1 is divided into a first insulator 13a and a second insulator 13b, and further includes a fixing body 16.

[0157] By including the fixed body 16 in the support body 1E, it is possible to easily ensure the mechanical strength of the support body 1E against vibration, as in the second embodiment. Furthermore, the fixed body 16 also functions as a heat sink, and therefore has the function of dissipating heat generated by the electronic component 2 (not shown) mounted on the support body 1E. In this embodiment, the fixed body 16 is disposed between the first insulator 13a and the second insulator 13b. The first insulator 13a is disposed between the fixed body 16 and the first electrode 11. The second insulator 13b is disposed between the fixed body 16 and the second electrode 12.

[0158] On each of the first mounting surface 1a and the second mounting surface 1b of the support 1E, not only are the first electrode 11, the second electrode 12, the insulator 13 (first insulator 13a, second insulator 13b), the first protector 14, and the second protector 15 exposed, but also the fixing body 16. Therefore, heat generated by the electronic component 2 (not shown) mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b not only via the first electrode 11 and the second electrode 12 but also via the fixing body 16. This allows the heat generated by the electronic component 2 mounted on the first mounting surface 1a to be efficiently dissipated.

[0159] When the support 1E is viewed from the side (Y-axis direction), the first electrode 11 and the second electrode 12 have the same projection (side view) shape. This allows the first electrode 11 and the second electrode 12 to be produced by punching a metal plate. This makes it possible to realize a support 1E with excellent industrial productivity. In this embodiment, the first electrode 11 and the second electrode 12 have the same shape and size.

[0160] Similarly to the first embodiment, the first protector 14 covers the side surface of the first electrode 11, and the second protector 15 covers the side surface of the second electrode 12. The thicknesses of the first protector 14 and the second protector 15 in this embodiment are greater than the thicknesses of the first protector 14 and the second protector 15 in the first embodiment.

[0161] In this embodiment, the first insulator 13a, the second insulator 13b, the first protector 14, and the second protector 15 are not integrally configured. In other words, the first electrode 11, the second electrode 12, the first insulator 13a, the second insulator 13b, the first protector 14, the second protector 15, and the fixed body 16 are each separate flat plate-shaped members that are stacked together. These members are joined to each other.

[0162] This configuration ensures sufficient insulation between the first electrode 11 and the second electrode 12, resulting in a support 1E with high electrical reliability. Furthermore, the first electrode 11 and the second electrode 12 have height and thickness, resulting in electrodes with a large envelope volume. This allows heat generated by the electronic component 2 mounted on the first mounting surface 1a of the support 1E to be efficiently transferred to the second mounting surface 1b and further to the circuit board.

[0163] At least one selected from the first electrode 11, the second electrode 12, and the fixed body 16 may have a multi-layer structure. In this way, a structure using multiple thin metal plates can be formed, resulting in a support 1E that is convenient for punching. For example, in Figure 25, a structure is conceivable in which the second electrode 12 is divided into two parts and composed of two metal plates, and the insulator 13 is composed of a first insulator 13a, a second insulator 13b, and a third insulator, with the third insulator sandwiched between the two divided second electrodes 12.

[0164] With the support body 1E configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1E, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1E on which the electronic components 2 are mounted on a circuit board.

[0165] In this case, in the support 1E of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1E with solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0166] As a result, similar to the support 1 in the first embodiment, when the electronic component 2 is mounted on the support 1E via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support 1E.

[0167] When an electronic component 2 was actually mounted using the support 1E of this embodiment, an inclined mounting module 100E shown in Fig. 26 was obtained. Fig. 26 is an optical photograph of the actually manufactured inclined mounting module 100E viewed from the side. As shown in Fig. 26, it can be seen that the electronic component 2 was successfully mounted in a predetermined mounting position on the first mounting surface 1a of the support 1E.

[0168] Furthermore, even when an inclined mounting module 100E' was manufactured by actually mounting an electronic component 2 using a support 1E' in which the height of the support 1E was increased, as shown in Figure 27, the electronic component 2 could be mounted at a predetermined mounting position on the first mounting surface 1a of the support 1E', as shown in Figure 28.

[0169] (Fourth embodiment) Next, a support 1F according to a fourth embodiment will be described with reference to Fig. 29. Fig. 29 is a perspective view of the support 1F according to the fourth embodiment.

[0170] 29 , the support member 1F according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the above-described embodiment 1. Also, the support member 1F includes a first electrode 11, a second electrode 12, an insulator 13 (first insulator 13a, second insulator 13b), a first protector 14, a second protector 15, and a fixing body 16, similar to the above-described embodiment 3.

[0171] In the above-described first to third embodiments, the support body 1F has only one first mounting surface 1a, but in this embodiment, the support body 1F has multiple first mounting surfaces 1a. This allows multiple electronic components 2 to be easily mounted on the support body 1F. In this embodiment, the support body 1F has two first mounting surfaces 1a. The two first mounting surfaces 1a are provided on different surfaces and are positioned back to back. In this embodiment, the inclination angle θ of the two first mounting surfaces 1a is the same, but the inclination angles θ of the two first mounting surfaces 1a may be different.

[0172] For the support body 1F configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1F, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1F on which the electronic components 2 are mounted on a circuit board.

[0173] In this case, in the support 1F of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1F with solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0174] As a result, similar to the support body 1 in the first embodiment, when the electronic component 2 is mounted on the support body 1F via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support body 1F.

[0175] When an electronic component 2 was actually mounted using the support body 1F of this embodiment, an inclined mounting module 100F shown in Fig. 30 was obtained. Fig. 30 is an optical photograph of the actually fabricated inclined mounting module 100F viewed from the side. As shown in Fig. 30, it can be seen that the electronic component 2 was successfully mounted in a predetermined mounting position on the first mounting surface 1a of the support body 1F.

[0176] 30, the electronic component 2 is mounted on only one of the two first mounting surfaces 1a, but this is not limiting. That is, the electronic component 2 may be mounted on each of the two first mounting surfaces 1a.

[0177] Furthermore, in this embodiment, the vectors in the parallel plane direction of each of the multiple first mounting surfaces 1a do not point in one direction (in FIG. 29, they are in 180-degree opposite directions), but this is not limited to this. For example, the vectors in the parallel plane direction of each of the multiple first mounting surfaces 1a may point in one direction. That is, this is the case when multiple first mounting surfaces 1a with different inclination angles are formed on one surface on one side of the support body. In this case, the multiple first mounting surfaces 1a may be arranged vertically (top and bottom) or horizontally (left and right) so as to face in one direction.

[0178] Fifth Embodiment Next, a support 1G according to a fifth embodiment will be described with reference to Fig. 31. Fig. 31 is a perspective view of the support 1G according to the fifth embodiment.

[0179] 31 , the support 1G according to this embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the above-described embodiment 1. Furthermore, the support 1G includes a first electrode 11, a second electrode 12, an insulator 13 (first insulator 13a, second insulator 13b), a first protector 14, a second protector 15, and a fixing body 16, similar to the above-described embodiment 3.

[0180] The support body 1G in this embodiment further has a receiving portion 40. The receiving portion 40 has a receiving surface 40a that can receive a surface of the electronic component 2 that is different from the mounting surface (the surface that is bonded to the first mounting surface 1a). When the mounting surface of the electronic component 2 is the back surface of the electronic component, the receiving surface 40a of the receiving portion 40 can receive the side surface of the electronic component 2. The receiving portion 40 is a protruding portion that protrudes from the end of the support body 1G on the sloping lower side. The receiving portion 40 also protrudes from a plane that includes the first mounting surface 1a.

[0181] Furthermore, a groove 50 is provided in the support body 1G in this embodiment. The groove 50 is formed at the boundary between the first mounting surface 1a and the receiving portion 40. Specifically, the groove 50 is formed at the lower end of the first mounting surface 1a. The groove 50 is formed so as to extend along the Y-axis direction. Specifically, the groove 50 is formed so as to penetrate the support body 1G in the Y-axis direction.

[0182] For the support body 1G configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1G, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1G on which the electronic components 2 are mounted on a circuit board.

[0183] In this case, in the support 1G of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1G with solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0184] As a result, similar to the support 1 in the first embodiment, when the electronic component 2 is mounted on the support 1G via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support 1G.

[0185] Furthermore, the support 1G in this embodiment has a receiving portion 40 capable of receiving the electronic component 2.

[0186] With this configuration, even if the electronic component 2 significantly slides down along the slope of the first mounting surface 1a when the support 1G, with the electronic component 2 placed on the solder 3 applied to the first mounting surface 1a, is inserted into a reflow device to melt the solder 3, the receiving portion 40 can receive the side of the electronic component 2. In other words, the electronic component 2 can be prevented from falling off the first mounting surface 1a. In this case, the receiving portion 40 may receive the entire side of the electronic component 2, or may receive only a portion of the side of the electronic component 2. In this case, the receiving surface 40a of the receiving portion 40 becomes the side wall surface of the protrusion. Note that the electronic component 2 does not need to abut against the receiving portion 40 during reflow. Furthermore, even if the electronic component 2 abuts against the receiving portion 40 during reflow, the molten solder 3 acts to minimize its volume, causing the electronic component 2 to slide up along the slope of the first mounting surface 1a and be mounted at the desired mounting position on the support 1G.

[0187] In addition, in this embodiment, the shortest distance between either the first electrode 11 or the second electrode 12 and the receiving portion 40 is preferably smaller than 1 / 3 of the maximum distance in the inclination direction of the first mounting surface 1a, which is inclined relative to the second mounting surface 1b.

[0188] With this configuration, when the solder 3 melts and the electronic component 2 slides down along the slope of the first mounting surface 1a, the receiving portion 40 can reliably prevent the electronic component 2 from moving, thereby improving the positioning accuracy of the electronic component 2 at the predetermined mounting position.

[0189] Furthermore, in the support body 1G of this embodiment, a groove 50 is provided at the boundary between the first mounting surface 1a and the receiving portion 40.

[0190] This configuration forms the first electrode edge 11S and the second electrode edge 12S that serve as alignment references, and the electronic component 2 is mounted at a predetermined mounting position on the support 1G.

[0191] When an electronic component 2 was actually mounted using the support 1G of this embodiment, an inclined mounting module 100G shown in Fig. 32 was obtained. Fig. 32 is an optical photograph of the actually manufactured inclined mounting module 100G viewed from the side. As shown in Fig. 32, it can be seen that the electronic component 2 was successfully mounted in a predetermined mounting position on the first mounting surface 1a of the support 1G.

[0192] Sixth Embodiment Next, a support 1H according to a sixth embodiment will be described with reference to Fig. 33. Fig. 33 is a perspective view of the support 1H according to the sixth embodiment.

[0193] 33, like the support member 1 according to the first embodiment, the support member 1H according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, and is provided with a first electrode 11 and a second electrode 12. However, unlike the support member 1 according to the first embodiment, the support member 1H according to the present embodiment does not include a first protector 14 and a second protector 15. Furthermore, unlike the support member 1 according to the second to fifth embodiments, the support member 1H according to the present embodiment does not include a fixing body 16. In other words, the support member 1H according to the present embodiment is mainly made of metal.

[0194] In this embodiment, the first electrode 11 and the second electrode 12 are formed from folded metal plates. The first electrode 11 and the second electrode 12 can be fabricated by bending a long metal plate. The first electrode 11 and the second electrode 12 are both folded to have an inclined surface that serves as the first mounting surface 1a and a bottom surface that serves as the second mounting surface 1b. The first mounting surface 1a is formed only from the surfaces of the first electrode 11 and the second electrode 12. Similarly, the second mounting surface 1b is formed only from the surfaces of the first electrode 11 and the second electrode 12.

[0195] The first electrode 11 and the second electrode 12 can be easily fabricated by general sheet metal processing. Therefore, a support 1H can be obtained that is excellent in industrial productivity and easy to design for heat dissipation. As an example, the first electrode 11 and the second electrode 12 can be fabricated by bending a copper plate (thickness 1 mm, width 3 mm, length 19 mm) using a machine tool or by hand. In the support 1H, the first electrode 11 and the second electrode 12 have the same shape and size. Furthermore, electrodes (first electrode 11 and second electrode 12) with a bent shape as shown in FIG. 33 can also be formed by punching a thick metal plate in the Y direction.

[0196] The first electrode 11 and the second electrode 12 are disposed with a gap (air layer) between them. Specifically, the first electrode 11 and the second electrode 12 are disposed in parallel with a gap between them so that the first mounting surface 1 a of the first electrode 11 and the first mounting surface 1 a of the second electrode 12 are located on a single plane, and the second mounting surface 1 b of the first electrode 11 and the second mounting surface 1 b of the second electrode 12 are located on a single plane.

[0197] In this embodiment, the first electrode 11 and the second electrode 12 are fixed to an insulating resin member 17. This allows the first electrode 11 and the second electrode 12 to be integrated via the resin member 17. The resin member 17 functions as a holding member that maintains the gap between the first electrode 11 and the second electrode 12. The first electrode 11 and the second electrode 12 are molded products at least partially embedded in the resin member 17. The resin member 17 is a resin block made of an insulating resin material.

[0198] For the support body 1H configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1H, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1H on which the electronic components 2 are mounted on a circuit board.

[0199] In this case, in the support 1H of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1H with the solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0200] As a result, similar to the support 1 in the first embodiment, when the electronic component 2 is mounted on the support 1H via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support 1H.

[0201] When an electronic component 2 was actually mounted using the support 1H of this embodiment, an inclined mounting module 100H shown in Fig. 34 was obtained. Fig. 34 is an optical photograph of the actually fabricated inclined mounting module 100H viewed from the side. As shown in Fig. 34, it can be seen that the electronic component 2 was successfully mounted in a predetermined mounting position on the first mounting surface 1a of the support 1H.

[0202] 35, when an inclined mounting module 100H' was manufactured by actually mounting an electronic component 2 using a support 1H' in which the inclination angle of the first mounting surface 1a of the support 1H was increased, the electronic component 2 was successfully mounted in the predetermined mounting position on the first mounting surface 1a of the support 1H', as shown in FIG. 35. In this case, there were traces of molten solder adhering to the electrodes of the electronic component 2 when the electronic component 2 abutted against the surface of the resin member 17. In other words, it is thought that when the solder 3 melted during reflow, the electronic component 2 initially slid down along the first mounting surface 1a and abutted against the first electrode 11 and the second electrode 12, and then, as the volume of the solder 3 decreased, the electronic component 2 slid up along the first mounting surface 1a.

[0203] Seventh Embodiment Next, a support 1I according to a seventh embodiment will be described with reference to Fig. 36. Fig. 36 is a perspective view of the support 1I according to the seventh embodiment.

[0204] 36 , the support body 1I according to this embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1 according to the above-described embodiment 1. Furthermore, the support body 1I according to this embodiment does not include the first protector 14, the second protector 15, and the fixing body 16, similar to the above-described embodiment 6.

[0205] The support 1I according to this embodiment has a structure similar to that of the sixth embodiment, but does not include the resin member 17. In other words, the support 1I is composed only of a first electrode 11 and a second electrode 12. In other words, the support 1I is composed only of metal. Specifically, in this embodiment, the first electrode 11 and the second electrode 12 are composed of folded metal plates, similar to the sixth embodiment. The first electrode 11 and the second electrode 12 can be fabricated by bending a long metal plate. In this way, the support 1I can be fabricated only by metal processing, which allows the support 1I to be fabricated inexpensively. The first electrode 11 and the second electrode 12 in this embodiment are the same as the first electrode 11 and the second electrode 12 in the sixth embodiment.

[0206] With the support 1I configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support 1I. Furthermore, a circuit module can be obtained by mounting the support 1I on which the electronic components 2 are mounted on a circuit board.

[0207] In this case, in the support 1I of this embodiment, as in the above-mentioned embodiment 1, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 are alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1I with the solder 3, and are located at a distance from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0208] As a result, similar to the support 1 in the first embodiment, when the electronic component 2 is mounted on the support 1I via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support 1I.

[0209] In this embodiment, the first electrode 11 and the second electrode 12 are not fixed with the resin member 17. Therefore, when fabricating a circuit module, the first electrode 11 and the second electrode 12 are soldered to the circuit board so as to leave a gap between them, and the electronic component 2 is mounted on the support 1I consisting of this pair of first electrode 11 and second electrode 12, thereby fabricating the circuit module.

[0210] Furthermore, like the support 1I' shown in Figure 37, the support may be provided with a first electrode 11 and a second electrode 12 that are thicker than the first electrode 11 and the second electrode 12 of the support 1I shown in Figure 36.

[0211] Alternatively, the support 1J may have the first electrode 11 and the second electrode 12 having the shape shown in Fig. 38. In the support 1J shown in Fig. 38, a stopper is formed below the first mounting surface 1a by bending the metal plate that constitutes the first electrode 11 and the second electrode 12.

[0212] Eighth Embodiment Next, a support 1K according to an eighth embodiment will be described with reference to Fig. 39. Fig. 39 is a perspective view of the support 1K according to the eighth embodiment.

[0213] 39 , the support body 1K according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the above-described embodiment 1. Furthermore, the support body 1K includes a first electrode 11, a second electrode 12, an insulator 13 (first insulator 13a, second insulator 13b), a first protector 14, a second protector 15, and a fixing body 16, similar to the above-described embodiment 3.

[0214] Furthermore, the support body 1K in this embodiment has a receiving portion 40, similar to the fifth embodiment. The receiving portion 40 has a receiving surface 40a that can receive a surface different from the mounting surface of the electronic component (the surface that is bonded to the first mounting surface 1a). When the mounting surface of the electronic component is the back surface of the electronic component, the receiving surface 40a of the receiving portion 40 receives the side surface of the electronic component 2. In this embodiment as well, the receiving portion 40 is a protruding portion that protrudes from the end portion of the support body 1K below the first mounting surface 1a.

[0215] Furthermore, the support body 1K in this embodiment is provided with a groove 50, similar to the support body 1G in the fifth embodiment. The groove 50 is formed at the boundary between the first mounting surface 1a and the receiving portion 40. Specifically, the groove 50 is formed at the lower end of the first mounting surface 1a. The groove 50 is formed so as to extend along the Y-axis direction. Specifically, the groove 50 is formed so as to penetrate the support body 1K in the Y-axis direction.

[0216] The support body 1K in this embodiment differs from the support body 1 in the above-described embodiment 1 in that the angle between the first mounting surface 1a and the second mounting surface 1b is 90°. That is, in the above-described embodiment 1, the inclination angle θ of the first mounting surface 1a with respect to the second mounting surface 1b was 0°<θ<90°, but in the support body 1K in this embodiment, the inclination angle θ of the first mounting surface 1a with respect to the second mounting surface 1b is θ=90°.

[0217] For the support body 1K configured in this manner, as in the first embodiment, an inclined mounting module can be obtained by mounting an electronic component 2 on the first mounting surface 1a of the support body 1K. That is, even if the angle (inclination angle) between the first mounting surface 1a and the second mounting surface 1b is 90°, an inclined mounting module in which the electronic component 2 is mounted at a predetermined position can be obtained. The inclined mounting module obtained in this manner is a vertical mounting module in which the first mounting surface 1a and the second mounting surface 1b are perpendicular. Furthermore, a circuit module can be obtained by mounting the support body 1K on which the electronic component 2 is mounted on a circuit board.

[0218] At this time, in the support 1K according to the present embodiment, as in the first embodiment, the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 serve as alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support 1K with the solder 3. Furthermore, the first electrode edge 11S and the second electrode edge 12Sg are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0219] As a result, similar to the support body 1 in the first embodiment, when the electronic component 2 is mounted on the support body 1K via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support body 1K.

[0220] Furthermore, the support 1K in this embodiment has a receiving portion 40 capable of receiving the electronic component 2.

[0221] With this configuration, when the support 1K, with the electronic component 2 adhered to the cream-like solder 3 applied to the first mounting surface 1a, is placed in a reflow device to melt the solder 3, even if the electronic component 2 slides significantly down the first mounting surface 1a in the minus Z direction, the receiving portion 40 can receive the side of the electronic component 2. In other words, the electronic component 2 can be prevented from falling off the first mounting surface 1a. In this case, the receiving portion 40 may receive the entire side of the electronic component 2, or may receive only a portion of the side of the electronic component 2. In this case, the receiving surface 40a of the receiving portion 40 becomes the side wall surface of the protrusion. Note that the electronic component 2 does not have to abut against the receiving portion 40 during reflow. Furthermore, even when the electronic component 2 comes into contact with the receiving portion 40 during reflow, the molten solder 3 acts to reduce its volume as much as possible, causing the electronic component 2 to slide up along the slope of the first mounting surface 1a and be mounted at a predetermined mounting position on the support 1K, that is, at a predetermined position on the first mounting surface 1a that is perpendicular to the second mounting surface 1b.

[0222] In addition, in this embodiment, the shortest distance between either the first electrode 11 or the second electrode 12 and the receiving portion 40 is preferably smaller than 1 / 3 of the maximum distance in the inclination direction of the first mounting surface 1a, which is inclined perpendicularly to the second mounting surface 1b.

[0223] With this configuration, when the solder 3 melts and the electronic component 2 slides down in the minus Z direction along the first mounting surface 1a, the receiving portion 40 can reliably prevent the electronic component 2 from moving, thereby improving the positioning accuracy of the electronic component 2 at the predetermined mounting position.

[0224] Furthermore, in the support body 1K of this embodiment, a groove 50 is provided at the boundary between the first mounting surface 1a and the receiving portion 40.

[0225] This configuration forms the first electrode edge 11S and the second electrode edge 12S that serve as alignment references, and the electronic component 2 is mounted at a predetermined mounting position on the support body 1K.

[0226] When an electronic component 2 was actually mounted using the support body 1K of this embodiment, an inclined mounting module 100K (vertical mounting module) shown in Fig. 40 was obtained. Fig. 40 is an optical photograph of the actually fabricated inclined mounting module 100K viewed from the side. As shown in Fig. 40, it can be seen that the electronic component 2 was successfully mounted on the first mounting surface 1a located directly above the groove 50 provided in the support body 1K.

[0227] Ninth Embodiment Next, a support 1L according to a ninth embodiment will be described with reference to Fig. 41. Fig. 41 is a perspective view of the support 1L according to the ninth embodiment.

[0228] 41 , the support body 1L according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the above-described embodiment 1. Also, the support body 1L includes a first electrode 11, a second electrode 12, and an insulator 13, similar to the above-described embodiment 1.

[0229] The support 1L in this embodiment and the support 1 in the first embodiment differ in the extension direction of the first electrode 11 and the second electrode 12 on the first mounting surface 1a. Specifically, in the first embodiment, the first electrode 11 and the second electrode 12 extend on the first mounting surface 1a in the inclined direction of the first mounting surface 1a. However, in the present embodiment, the first electrode 11 and the second electrode 12 extend on the first mounting surface 1a in a direction intersecting the inclined direction of the first mounting surface 1a. In other words, the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a and the second mounting surface 1b are disposed so as to cross the first mounting surface 1a and the second mounting surface 1b, respectively, and extend along the Y-axis direction on the first mounting surface 1a. The first electrode 11 and the second electrode 12 are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0230] Furthermore, in the support 1L of this embodiment, the insulator 13 is divided into a first insulator 13a, a second insulator 13b, and a third insulator 13c. The first electrode 11 is disposed between the first insulator 13a and the second insulator 13b, and the second electrode 12 is disposed between the second insulator 13b and the third insulator 13c. Specifically, the first insulator 13a is disposed so as to be in contact with only the first electrode 11. The second insulator 13b is disposed so as to be in contact with both the first electrode 11 and the second electrode 12. The third insulator 13c is disposed so as to be in contact with only the second electrode 12.

[0231] When the support 1L is viewed from the side (Y-axis direction), the first electrode 11 and the second electrode 12 have different shapes and sizes in projection views (side views).

[0232] A first electrode 11, a second electrode 12, and an insulator 13 (first insulator 13a, second insulator 13b, third insulator 13c) are exposed on each of the first mounting surface 1a and the second mounting surface 1b of the support 1L. Therefore, heat generated by an electronic component 2 (not shown) mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b via the first electrode 11 and the second electrode 12. This allows the heat generated by the electronic component 2 mounted on the first mounting surface 1a to be efficiently dissipated.

[0233] Note that the support 1L in this embodiment may include a first protector 14 and / or a second protector 15, similar to the above-described embodiment 1. That is, the support 1L may have a structure in which the first protector 14 and / or the second protector 15 cover the side surfaces of both the first electrode 11 and the second electrode 12.

[0234] 41, the first insulator 13a, the second insulator 13b, and the third insulator 13c are not integrally formed, but this is not limiting. For example, the first insulator 13a, the second insulator 13b, and the third insulator 13c may be formed as an integrally molded product in which at least two of them are integrated, or may be formed as an integrally molded product in which all of them are integrated.

[0235] In addition, while FIG. 41 illustrates the first electrode 11 and the second electrode 12 both having a trapezoidal prism-like flat plate shape, this is not limiting. For example, at least one of the first electrode 11 and the second electrode 12 may have a partially missing flat plate shape, with the missing portion serving as an insulator and the insulators adjacent to the missing portion connected to form an integrated structure. This configuration ensures sufficient insulation between the first electrode 11 and the second electrode 12, thereby achieving a support 1L with high electrical reliability. Furthermore, the first electrode 11 and the second electrode 12 have height and thickness, resulting in electrodes with a large envelope volume. This allows heat generated by the electronic component 2 mounted on the first mounting surface 1a of the support 1L to be efficiently transferred to the second mounting surface 1b and further to the circuit board.

[0236] For the support body 1L configured in this manner, an inclined mounting module can be obtained by mounting electronic components 2 on the first mounting surface 1a of the support body 1L, as in the above-described embodiment 1. Furthermore, a circuit module can be obtained by mounting the support body 1L on which the electronic components 2 are mounted on a circuit board.

[0237] At this time, in the support 1L according to this embodiment, at least one of the first electrode edge 11S of the first electrode 11 and the second electrode edge 12S of the second electrode 12 serves as an alignment reference for aligning the electronic component 2 when mounting the electronic component 2 on the support 1L with the solder 3, as in the first embodiment. Specifically, in this embodiment, the second electrode 12 is located below the first electrode 11 on the first mounting surface 1a, and therefore the second electrode edge 12S below the second electrode 12 serves as the alignment reference. The first electrode edge 11S and the second electrode edge 12S are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0238] As a result, similar to the support 1 in the first embodiment, when the electronic component 2 is mounted on the support 1L via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support 1L. Note that instead of using either the first electrode edge 11S or the second electrode edge 12S as the alignment reference, both the first electrode edge 11S and the second electrode edge 12S can also be used as the alignment reference.

[0239] Tenth Embodiment Next, a supporting body 1M and an inclined mounting module 100M according to a tenth embodiment will be described with reference to Fig. 42 and Fig. 43. Fig. 42 is a perspective view of the supporting body 1M according to the tenth embodiment. Fig. 43 is a perspective view of the inclined mounting module 100M according to the tenth embodiment.

[0240] 42 , the support body 1M according to the present embodiment has a first mounting surface 1a and a second mounting surface 1b, similar to the support body 1 according to the above-described embodiment 1. Furthermore, similar to the support body 1I according to the above-described embodiment 7, the support body 1M according to the present embodiment does not include a first protector 14, a second protector 15, or a fixing body 16, and is composed only of a first electrode 11 and a second electrode 12.

[0241] The first electrode 11 and the second electrode 12 in this embodiment are made of folded metal plates, similar to the seventh embodiment. The first electrode 11 and the second electrode 12 can be fabricated by folding a long metal plate. Furthermore, the first electrode 11 and the second electrode 12 are both folded so as to have an inclined surface that serves as the first mounting surface 1a and a bottom surface that serves as the second mounting surface 1b.

[0242] Specifically, each of the first electrode 11 and the second electrode 12 is formed by bending a single elongated metal plate into a V-shape. That is, the metal plate is bent at only one location in each of the first electrode 11 and the second electrode 12. This allows the bending process to be performed only once, and also minimizes the amount (length) of the metal plate used as the electrode, thereby reducing manufacturing costs.

[0243] The V-shaped first electrode 11 includes an elongated first metal plate 11a including a first mounting surface 1a and an elongated second metal plate 11b including a second mounting surface 1b. Similarly, the V-shaped second electrode 12 includes an elongated first metal plate 12a including the first mounting surface 1a and an elongated second metal plate 12b including the second mounting surface 1b.

[0244] As shown in FIG. 42 , a first cutout portion 11a1 is formed in the first metal plate 11a of the first electrode 11. The first cutout portion 11a1 is formed so as to cut out a side portion of the first metal plate 11a. Specifically, the first cutout portion 11a1 is formed in a portion of the first metal plate 11a facing the first metal plate 12a of the second electrode 12. The first cutout portion 11a1 also extends in a direction perpendicular to the longitudinal direction of the first metal plate 11a. In this embodiment, the first cutout portion 11a1 extends in the Y-axis direction. The first cutout portion 11a1 may cut out more than half of the width of the first metal plate 11a. The first cutout portion 11a1 may be formed above the longitudinal center of the first metal plate 11a, but is not limited to this.

[0245] A second cutout 12a1 is formed in the first metal plate 12a of the second electrode 12. The second cutout 12a1 is formed so as to cut out a side portion of the first metal plate 12a. Specifically, the second cutout 12a1 is formed in a portion of the first metal plate 12a facing the first metal plate 11a of the first electrode 11. In this embodiment, the second cutout 12a1 faces the first cutout 11a1. That is, the first cutout 11a1 and the second cutout 12a1 are positioned on a straight line with a gap between them. The second cutout 12a1 extends in a direction perpendicular to the longitudinal direction of the first metal plate 12a. In this embodiment, the second cutout 12a1 extends in the Y-axis direction. The second cutout portion 12a1 may be formed by cutting out at least half of the width of the first metal plate 12a. The second cutout portion 12a1 may be formed above the center of the first metal plate 12a in the longitudinal direction, but is not limited to this.

[0246] The first mounting surface 1a is composed only of the surfaces of the first electrode 11 and the second electrode 12. Specifically, the first mounting surface 1a is the portion of the first electrode 11 and the second electrode 12 that is above the first cutout 11a1 and the second cutout 12a1. In other words, the portion of the surface of the first metal plate 11a of the first electrode 11 that is above the first cutout 11a1 and the portion of the surface of the first metal plate 12a of the second electrode 12 that is above the second cutout 12a1 form the first mounting surface 1a on which the electronic component 2 is mounted.

[0247] The portion below the first cutout portion 11a1 on the surface of the first metal plate 11a of the first electrode 11 and the portion below the second cutout portion 12a1 on the surface of the first metal plate 12a of the second electrode 12 constitute non-mounting surfaces 1c on which the electronic component 2 is not mounted.

[0248] The second mounting surface 1b is also composed of only the surfaces of the first electrode 11 and the second electrode 12. Specifically, the second mounting surface 1b is a surface formed by joining the entire lower surface of the second metal plate 11b of the first electrode 11 and the entire lower surface of the second metal plate 12b of the second electrode 12.

[0249] In this embodiment, the first electrode edge 11S is not the electrode end of the first electrode 11 but the edge of the first cutout portion 11a1. Similarly, the second electrode edge 12S is not the electrode end of the second electrode 12 but the edge of the second cutout portion 12a1. Specifically, the first electrode edge 11S is the upper edge of the first cutout portion 11a1, and the second electrode edge 12S is the upper edge of the second cutout portion 12a1.

[0250] For the support body 1M configured in this manner, as in the first embodiment, an electronic component 2 can be mounted on the first mounting surface 1a of the support body 1M via solder 3 to obtain the inclined mounting module 100M shown in FIG. 43 . Furthermore, a circuit module can be obtained by mounting the support body 1M on which the electronic component 2 is mounted on a circuit board. Note that in this embodiment as well, the electronic component 2 is a surface-mount white LED package, but does not have a lens.

[0251] At this time, in the support body 1M according to the present embodiment, as in the first embodiment, the first electrode edge 11S and the second electrode edge 12S exposed on the first mounting surface 1a serve as alignment references for aligning the electronic component 2 when mounting the electronic component 2 on the support body 1M with the solder 3. Furthermore, the first electrode edge 11S and the second electrode edge 12S are spaced apart from the second mounting surface 1b in a direction perpendicular to the second mounting surface 1b.

[0252] As a result, similar to the support body 1 in the first embodiment, when the electronic component 2 is mounted on the support body 1M via the solder 3, the electronic component 2 placed on the solder 3 applied to the first electrode 11 and the second electrode 12 is automatically aligned. In other words, the electronic component 2 can be easily aligned without being displaced from its predetermined mounting position on the support body 1M.

[0253] In this embodiment, the first electrode 11 and the second electrode 12 are not fixed with the resin member 17. Therefore, when fabricating a circuit module, the first electrode 11 and the second electrode 12 are soldered to the circuit board so as to leave a gap between them, and the electronic component 2 is mounted on the support 1M consisting of this pair of first electrode 11 and second electrode 12, thereby fabricating the circuit module.

[0254] Also in this embodiment, heat generated by the electronic components 2 mounted on the first mounting surface 1a is conducted from the first mounting surface 1a to the second mounting surface 1b via the first electrode 11 and the second electrode 12. This allows the heat generated by the electronic components 2 mounted on the first mounting surface 1a to be efficiently dissipated.

[0255] In the present embodiment, the first cutout portion 11a1 of the first electrode 11 and the second cutout portion 12a1 of the second electrode 12 are formed in a slit shape, but this is not limiting. For example, as in the support 1M' shown in FIG. 44 , the first cutout portion 11a1 may be formed so as to cut out the entire lower portion of the first metal plate 11a of the first electrode 11. Similarly, the second cutout portion 12a1 may be formed so as to cut out the entire lower portion of the first metal plate 12a of the second electrode 12.

[0256] Furthermore, in the present embodiment, each of the first electrode 11 and the second electrode 12 is formed by bending a single elongated metal plate into a V-shape. However, this is not limited thereto. For example, as in the support 1N shown in FIG. 45 , each of the first electrode 11 and the second electrode 12 may be formed by bending a single elongated metal plate into an L-shape. In this case, the first mounting surface 1a and the second mounting surface 1b are perpendicular. That is, the angle (inclination angle) between the first mounting surface 1a and the second mounting surface 1b is 90°. Therefore, the inclined mounting module obtained by mounting an electronic component 2 on the support 1N shown in FIG. 45 is a vertical mounting module in which the first mounting surface 1a and the second mounting surface 1b are perpendicular, as shown in FIG. 46 . Note that, as in the support 1N′ shown in FIG. 47 , in this modification, the first cutout portion 11a1 may not be slit-shaped, but may be formed so as to cut out the entire lower portion of the first metal plate 11a of the first electrode 11. Similarly, the second cutout portion 12a1 may also be formed so as to cut out the entire lower portion of the first metal plate 12a of the second electrode 12, rather than being slit-shaped.

[0257] (Modifications) Although the support and the like according to the present invention have been described above based on the first to seventh embodiments, the present invention is not limited to the first to seventh embodiments.

[0258] For example, in fabricating the support 1E in the third embodiment, the first electrode 11, the second electrode 12, the first insulator 13a, the second insulator 13b, the first protector 14, the second protector 15, and the fixed body 16 were fabricated separately and then bonded together, but this is not limited to this. For example, the support 1E can also be fabricated by cutting out a portion of the laminated substrate 400 shown in FIGS. 48 and 49 . As shown in FIG. 48 , the laminated substrate 400 has a laminated structure including a metal layer 401, insulating layers 402, 403, and 404 stacked in sequence on one side of the metal layer 401, and insulating layers 405, 406, and 407 stacked in sequence on the other side of the metal layer 401. The metal layers 401, 403, and 406 are, for example, copper layers and correspond to the fixed body 16, the first electrode 11, and the second electrode 12, respectively. The insulating layers 402, 404, 405, and 407 are, for example, resin layers such as prepreg (carbon fiber sheets pre-impregnated with resin) or glass epoxy substrates, and correspond to the first insulator 13a, the first protector 14, the second insulator 13b, and the second protector 15, respectively. Then, by subjecting this laminated substrate 400 to router processing using a router processing machine, it is possible to produce the support body 1E having the shape shown in Fig. 25. Note that it is also possible to produce the support body 1G by subjecting the laminated substrate 400 to punching or the like instead of router processing.

[0259] Furthermore, in the above-described eighth embodiment, the inclination angle θ of the first mounting surface 1a relative to the second mounting surface 1b is set to θ = 90°. In this case, as in the inclined mounting module 100P shown in (a) of FIG. 50, a support 1P having an inclination angle θ of 90° may be configured to be supported on the inclined surface of the base 9. Furthermore, as in the inclined mounting module 100P' shown in (b) of FIG. 50, when a support 1K' is supported on the inclined surface of the base 9', the inclination angle θ of the first mounting surface 1a of the support 1K' may be greater than 90°. In this manner, the inclination angle θ of the first mounting surface 1a relative to the second mounting surface 1b may be θ ≧ 90°. Note that when mounting an electronic component 2 on a support having an inclination angle θ ≧ 90°, the electronic component 2 can be easily mounted on the first mounting surface 1a by adjusting the inclination of the support to make the first mounting surface 1a horizontal. Furthermore, when a circuit module is fabricated in a single process using a support body having a first mounting surface 1a with an inclination angle θ of θ≧90°, it is preferable to use a circuit board with an inclined base. Note that, although the bases 9 and 9′ used have a cross-sectional shape of a right-angled triangle, this is not limiting.

[0260] Furthermore, in the above-mentioned first embodiment, the electronic devices using the inclined mounting module and the circuit module have been described using the electronic device 300 shown in FIG. 19 and the electronic device 300X shown in FIG. 20 as examples, but are not limited to these forms.

[0261] For example, the electronic device 300 (lighting device) shown in Fig. 19 uses the circuit module 201 shown in Fig. 12, but is not limited to this. Specifically, the circuit modules or angled mounting modules shown in Figs. 13 to 18 may also be used.

[0262] 12 to 18 may also be used in the electronic device 300X as a detection device or evaluation device. When combining a solid-state light-emitting element with a photodetector, the solid-state light-emitting element and the photodetector may be positioned so that the primary light emitted by the solid-state light-emitting element is directly incident on the light-receiving surface of the photodetector, or the solid-state light-emitting element and the photodetector may be positioned so that the primary light is not directly incident on the light-receiving surface of the photodetector. In the latter case, when a substance 8 is present in front of the light-extraction surface of the solid-state light-emitting element, the photodetector may detect the reflected or diffused light component by the substance 8. This configuration effectively suppresses detection of stray light from the primary light emitted by the solid-state light-emitting element.

[0263] Furthermore, in the above-described first embodiment and the like, a surface-mount electronic component having a plurality of electrodes on its back surface is used as the electronic component 2. In this case, the electrodes of the electronic component 2 may have a pattern as shown in Fig. 51. In Fig. 51, (a) shows an electrode pattern in which a pair of electrodes, a positive electrode and a negative electrode, have the same shape and size, (b) shows an electrode pattern in which the positive electrode and the negative electrode are different in size (in the figure, the negative electrode is larger than the positive electrode), and (c) shows an electrode pattern in which a heat dissipation electrode for heat dissipation is added between the positive electrode and the negative electrode.

[0264] Furthermore, when using such a surface-mount electronic component 2, it is preferable that at least one of the pair of electrodes on the back surface of the electronic component 2 has a linear shape on the side facing the other electrode or a linear tip of its convex portion. Similarly, it is preferable that at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a has a linear shape on the side facing the other electrode on the first mounting surface 1a or a linear tip of its convex portion. In a more preferred embodiment, it is preferable that both the first electrode 11 and the second electrode 12 and the pair of electrodes of the electronic component 2 are configured as described above.

[0265] By configuring the first electrode 11 and the second electrode 12 or a pair of electrodes of the electronic component 2 in this manner, the melted and solidified solder acts to align the linear electrode edge portion of at least one of the first electrode 11 and the second electrode 12 exposed on the first mounting surface 1a with the linear electrode edge portion of the electrode of the electronic component 2 to be joined thereto, thereby obtaining an inclined mounting module with little mounting misalignment in the rotational direction on the first mounting surface 1a (inclined surface) of the electronic component 2 to be mounted.

[0266] In this case, the length of the linear electrode edge portion of either the first electrode 11 or the second electrode 12 on the first mounting surface 1a may be the same as the linear electrode edge portion of the electronic component 2 to be joined via solder. In a more preferred embodiment, the lengths of the electrode edges of the opposing first and second electrodes 11 and 12 formed as a pair of electrodes on the electronic component 2 may be the same. This configuration allows the molten and solidified solder to adjust the length of the linear electrode edge portion of at least one of the first and second electrodes 11 and 12 exposed on the first mounting surface 1a to the length of the linear electrode edge portion of the electrode of the electronic component 2 to be joined thereto, thereby reducing mounting misalignment in both the rotational and tilting directions on the first mounting surface 1a of the electronic component 2 to be mounted. This allows for a tilted mounting module that is convenient for precise control of the mounting position. Furthermore, by making the inter-electrode distance between the first electrode 11 and the second electrode 12 on the first mounting surface 1a equal to the inter-electrode distance between a pair of electrodes on the back surface of the electronic component 2, the mounting misalignment of the electronic component 2 can be further reduced.

[0267] Furthermore, in the present invention, the concept of an "inclined mounting module" includes a vertically mounted module such as that of the eighth embodiment, but the concept of an "inclined mounting module" may not include a vertically mounted module.

[0268] The concept of "electronic device" in the present invention broadly encompasses electronic device systems. For example, electronic device systems that combine various software including machine learning or a control system including a robot are also included in the electronic device of the present invention. This allows for the realization of electronic devices that can be applied to automation, etc.

[0269] The circuit module manufacturing method according to the above embodiment can also be applied as a method for aligning structures. Specifically, the method for manufacturing the circuit module 200 shown in FIGS. 10 and 11 can be viewed as a method for aligning a structure A including a metal A and a structure B including a metal B on an inclined surface. That is, the method for aligning structures includes at least an adhesive-substance application step of applying a fusible or molten adhesive substance to both metal A and metal B, an adhesive-substance contact step of contacting the adhesive substance applied to metal A with the adhesive substance applied to metal B, a heating step of integrating the adhesive substances applied to metal A and metal B in a molten state, and a cooling step of cooling and solidifying the molten adhesive substance. Note that during this process, the surfaces of metal A and metal B are parallel to each other.

[0270] By using a method including such a step, it is possible to utilize the natural phenomenon that the molten adhesive substance tries to reduce its volume as much as possible, and the force that acts to bring closer the metal A and metal B to which the adhesive substance is attached. Therefore, it is possible to realize a method for aligning structures that are convenient for aligning structures that include metals such as electrodes.

[0271] It should be noted that this method can also be used as a method for aligning structures in which, upon alignment, either the structure A or the structure B moves on the inclined surface in a direction against gravity.

[0272] In this case, the molten adhesive material can be solder, and either structure A or structure B has a weight of, for example, 0.005 g or more and less than 0.1 g, particularly 0.01 g or more and less than 0.05 g. If structure A and structure B weigh less than this amount, they will be made smaller, making it difficult to form electrodes, and if structure A and structure B weigh more than this amount, it will be difficult to move the structure due to the force of the molten solder trying to integrate them. The metal is, for example, a metal structure containing copper.

[0273] Furthermore, the area ratio of the smaller area to the larger area of ​​the metal A and metal B to which the adhesive material is applied is preferably not less than 50%, and the patterns of both metals are preferably similar in shape, which makes it possible to reduce deviations (misalignments) in the front-to-back and left-to-right alignment.

[0274] In addition, the present invention also includes forms obtained by applying various modifications to the above-mentioned embodiments that would occur to a person skilled in the art, and forms realized by arbitrarily combining the components and functions of the above-mentioned embodiments within the scope of the present invention. Furthermore, the present invention also includes any combination of one or more components in each of the multiple claims described in the claims at the time of filing. Furthermore, when the dependent claims described in the claims at the time of filing are made into a multiple claim or multiple multiple claim that cites any multiple claims (for example, when a multiple claim or multiple multiple claim is made so that each claim cites all of its parent claims), all forms obtained by combining all claims included in the multiple claim or multiple multiple claim are also included in the present invention.

[0275] 1, 1A, 1B, 1C, 1D, 1E, 1E', 1F, 1G, 1H, 1H', 1I, 1I', 1J, 1K, 1L, 1M, 1M', 1N, 1N', 1P, 1P' Support 1a First mounting surface 1b Second mounting surface 2, 2X Electronic component 2aS First electrode edge 2bS Second electrode edge 3, 5 Solder 4, 4A Circuit board 11 First electrode 11S First electrode edge 12 Second electrode 12S Second electrode edge 13 Insulator 17 Resin member 20 Adsorption portion 30 Auxiliary portion 40 Receiving portion 100, 100A, 100B, 100C, 100D, 100E, 100E', 100F, 100G, 100H, 100H', 100K, 100M, 100N, 100P, 100P', 100X Inclined mounting module 200, 201, 202, 203, 204, 205 Circuit module 300, 300X Electronic device

Claims

1. A support for supporting an electronic component and mounting it on a substrate, comprising: one or more first mounting surfaces on which the mounting surface of the electronic component is mounted; a second mounting surface on which the support is mounted on the substrate; first electrodes exposed on each of the first mounting surface and the second mounting surface; and second electrodes exposed on each of the first mounting surface and the second mounting surface. The first mounting surface is inclined with respect to the second mounting surface. The first electrodes and the second electrodes are heat conductors that conduct heat from the first mounting surface to the second mounting surface. The first electrode of the electronic component is connected to the first electrode via solder, and the second electrode of the electronic component is connected to the second electrode via solder. The first electrode edge on the inclined lower side of the first electrode exposed on the first mounting surface and the second electrode edge on the inclined lower side of the second electrode exposed on the first mounting surface are alignment references for aligning the electronic component when mounting the electronic component on the support with solder, and are spaced apart from the second mounting surface in a direction orthogonal to the second mounting surface. Support.

2. The support according to claim 1, wherein the first electrode and the second electrode are made of a metal material having a thermal conductivity of 200 W / m·K or more at room temperature.

3. The support according to claim 1, wherein the first electrode and the second electrode are made of a metal material containing 30 wt% or more of copper.

4. The support according to claim 2 or 3, further comprising an insulator located between the first electrode and the second electrode, wherein the insulator is exposed on each of the first mounting surface and the second mounting surface.

5. The support according to claim 4, wherein the volume ratio of the metal material in the support is 30% or more.

6. The support according to claim 2 or 3, wherein the first electrode and the second electrode are formed by a bent metal plate.

7. The support according to claim 6, wherein the first electrode and the second electrode are insert molded products in which at least a part is embedded in a resin member.

8. The support according to any one of claims 1 to 3, having an auxiliary portion located on the inclined lower side of the first electrode edge and the second electrode edge, the auxiliary portion being exposed on the first mounting surface, and the surfaces of the first electrode and the second electrode and the surface of the auxiliary portion being flush.

9. Further, the support according to any one of claims 1 to 3, having a receiving portion for receiving a surface different from the mounting surface in the electronic component, the receiving portion protruding from the end portion on the inclined lower side of the support, and the shortest distance between either one of the first electrode and the second electrode and the receiving portion being smaller than 1 / 3 of the maximum distance in the inclined direction of the first mounting surface inclined with respect to the second mounting surface.

10. On the first mounting surface, each of the first electrode and the second electrode extends in the inclined direction of the first mounting surface, the support according to any one of claims 1 to 3.

11. The support according to any one of claims 1 to 3, having a suction portion which is a portion where a suction nozzle is suctioned when the support is mounted on the substrate, the suction portion being located on the back side of the second mounting surface and being a plane parallel to the second mounting surface.

12. The support according to any one of claims 1 to 3, wherein the maximum width of the upper half and the maximum width of the lower half on the first mounting surface are equal.

13. The first electrode edge and the second electrode edge are the edge of the support, the support according to any one of claims 1 to 3.

14. An inclined mounting module comprising the support according to claim 1 and an electronic component mounted on the first mounting surface of the support via solder.

15. On the first electrode edge, the first electrode edge on the inclined lower side of the first electrode of the electronic component is located, and on the second electrode edge, the second electrode edge on the inclined lower side of the second electrode of the electronic component is located, the inclined mounting module according to claim 14.

16. The electronic component is a solid-state light-emitting element or a detection element, the inclined mounting module according to claim 14.

17. The light output surface of the solid-state light-emitting element or the detection surface of the detection element faces the same direction as the perpendicular direction of the first mounting surface, the inclined mounting module according to claim 16.

18. The inclined mounting module according to claim 14 and a circuit board on which the inclined mounting module is mounted, wherein the inclined mounting module is a circuit module mounted on the circuit board via the second mounting surface of the support.

19. An electronic device comprising at least one of the inclined mounting module according to claim 14 and the circuit module according to claim 18.

20. A method for manufacturing the circuit module according to claim 18, the method including: a first placing step of placing an electronic component on the first mounting surface of the support via a first solder; a second placing step of placing the support on electrodes of the circuit board via a second solder; and a mounting step of mounting the electronic component on the support by the first solder and mounting the support on the circuit board by the second solder, the mounting step being performed after the first placing step and the second placing step.

21. A method for manufacturing the circuit module according to claim 18, the method including: a first mounting step of mounting an electronic component on the first mounting surface of the support via solder; an inclination step of inclining the support on which the electronic component is mounted after the first mounting step; and a second mounting step of mounting the support on which the electronic component is mounted on electrodes of the circuit board via solder on the second mounting surface after the inclination step, wherein a first mounting direction of mounting the electronic component on the support in the first mounting step and a second mounting direction of mounting the support on the electrodes of the circuit board in the second mounting step are the same direction.

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