System and method for detecting motion of a heated object

Abstract

An automatic soldering tool cleaning device may include a housing, a brush assembly enclosed within the housing, a motor operably coupled to the brush assembly, a single-point infrared sensor, and processing circuitry operably coupled to the single-point infrared sensor and the motor. The processing circuitry may be configured to detect a soldering tool within a field of view of the sensor, measure an instantaneous temperature value of the soldering tool, determine a moving average temperature value of the soldering tool, compare the instantaneous temperature value to the moving average temperature value, and generate a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value.

Description

[0001]AttyDktNo: 717745-00931-P4231PCT01 SYSTEM AND METHOD FOR DETECTING MOTION OF A HEATED OBJECT TECHNICAL FIELD Example embodiments generally relate to a method for detecting motion of a heated object, and, in particular, relate to a soldering tool cleaning device configured to be controlled according to the method. BACKGROUND Soldering tools, which are sometimes referred to as soldering irons or soldering guns, are commonly used in electronics manufacturing and repair activities along with other crafts and industries that involve metalwork. Soldering tools are typically used to join metallic items together at a joint by melting a filler metal (i.e., solder) into the joint. The solder has a lower melting point than the items being joined together at the joint, so the soldering tool needs to apply heat sufficient to melt the solder, but not hot enough to melt the items being joined. Although a number of soldering tool designs have been proposed, a basic soldering tool design includes at least a tip portion that is operably coupled to a heater. The tip portion may, due to operation of the heater, become hot enough to melt the solder that contacts the tip portion. The tip portion may, in some cases, be removable / interchangeable so that a number of different geometries (e.g., sizes and / or shapes) of tips or bits can be substituted for respective different jobs. Despite the various tip geometries soldering tools may include, many soldering tool tips may still be susceptible to the buildup of excess filler material. Filler material building up on the tip of the soldering tool may have negative effects on the precision and performance of the soldering tool in use, and as such, many soldering tools may need to be cleaned before, during and / or after use. In some cases, the devices used to clean soldering tools may not only be power operated, but may also be automatic. As can be appreciated from the limitations described above, it may be desirable to improve the device for cleaning soldering tools. For example, soldering tool cleaning devices may be controlled according algorithms that improve the overall cleaning operation. AttyDktNo: 717745-00931-P4231PCT01 BRIEF SUMMARY OF SOME EXAMPLES Some example embodiments may provide for a method for detecting motion of a heated object using a single-point infrared sensor may be provided. The method may include detecting the heated object within a field of view of the sensor, measuring an instantaneous temperature value of the heated object, determining a moving average temperature value of the heated object, comparing the instantaneous temperature value to the moving average temperature value, and generating a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value. Some example embodiments may provide for an automatic soldering tool cleaning device. The device may include a housing, a brush assembly enclosed within the housing, a motor operably coupled to the brush assembly, a single-point infrared sensor, and processing circuitry operably coupled to the single-point infrared sensor and the motor. The processing circuitry may be configured to detect a soldering tool within a field of view of the sensor, measure an instantaneous temperature value of the soldering tool, determine a moving average temperature value of the soldering tool, compare the instantaneous temperature value to the moving average temperature value, and generate a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value. In another example embodiment, a method for detecting motion of a heated object using a single-point infrared sensor may be provided. The method may include the steps of entering the single-point infrared sensor into an undefined state, in which processing circuitry initializes the single-point infrared sensor, transitioning, responsive to the single-point infrared sensor being initialized, the single-point infrared sensor into a waiting state in which the single-point infrared sensor waits to detect the heated object to generate a trigger signal, transitioning, responsive to the processing circuitry receiving the trigger signal, the single- point infrared sensor into an active state in which the single-point infrared sensor records an instantaneous temperature and the processing circuitry determines a moving average temperature, alternating the single-point infrared sensor between the waiting state and the active state based on whether or not the single-point infrared sensor detects the heated object, and calculating the difference between the instantaneous temperature and the moving average temperature. The difference between the instantaneous temperature and the moving average temperature is indicative of motion of the heated object. AttyDktNo: 717745-00931-P4231PCT01 BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S) Having thus described some example embodiments in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein: FIG.1 illustrates a block diagram of a soldering tool cleaning device according to an example embodiment; FIG.2 illustrates a flow chart of the algorithm controlling the soldering tool cleaning device in accordance with an example embodiment; FIG.3 illustrates a flow chart of the waiting state of the algorithm controlling the soldering tool cleaning device in accordance with an example embodiment; FIG.4 illustrates a flow chart of the active state of the algorithm controlling the soldering tool cleaning device in accordance with an example embodiment; FIG.5 illustrates a plot comparing the instantaneous temperature value to the moving average temperature value over time when the heated object moves towards the sensor; FIG.6 illustrates a plot comparing the instantaneous temperature value to the moving average temperature value over time when the heated object moves away from the sensor; and FIG.7 illustrates a block diagram of a method in accordance with an example embodiment. DETAILED DESCRIPTION Some example embodiments now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all example embodiments are shown. Indeed, the examples described and pictured herein should not be construed as being limiting as to the scope, applicability or configuration of the present disclosure. Rather, these example embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout. Furthermore, as used herein, the term “or” is to be interpreted as a logical operator that results in true whenever one or more of its operands are true. As used herein, operable coupling should be understood to relate to direct or indirect connection that, in either case, enables functional interconnection of components that are operably coupled to each other. FIG.1 illustrates a block diagram of a device 100 for cleaning soldering tools according to an example embodiment. In some embodiments, the device 100 may include a housing 110, an infrared sensor 120, a motor 130 that may be enclosed within the housing AttyDktNo: 717745-00931-P4231PCT01 110, and a brush assembly 140 that may be operably coupled to the motor 130. In this regard, a soldering tool 150 may be inserted into the housing 110 in order to access the brush assembly 140 for cleaning a tip of the soldering tool 150. In some cases, the device 100 may be automatic, meaning the operator 160 may not need to take any further action besides inserting the soldering tool 150 into the brush assembly 140 to clean the soldering tool 150. In this regard, the infrared sensor 120 may be configured to detect the soldering tool 150 as it approaches the housing 110, and may accordingly generate a trigger signal that may activate the motor 130 which may drive the brush assembly 140. Similarly, the infrared sensor 120 may be configured to detect the soldering tool 150 as it leaves the housing 110 and may accordingly generate a trigger signal that may deactivate the motor 130 to stop the brush assembly 140 responsive to the soldering tool 150 moving away from the housing 110. The device 100 may further include processing circuitry 170 which, in some embodiments may be operably coupled to both the infrared sensor 120 and the motor 130. In some embodiments, the processing circuitry 170 may also control more particular settings of the automatic soldering tool cleaning device 100, such as the rotational speed of the brush assembly 140, the direction of rotation of the brush assembly 140 and / or apply a vibration function to the brush assembly 140 to further aid in cleaning the soldering tool 150. In some embodiments, the device 100 may include more than one motor 130 and more than one brush assembly 140. In such cases, the brush assemblies 140 may be configured to operate in a complimentary manner to efficiently clean the tips of one or more soldering tools 150. The processing circuitry 170 may be configured to provide electronic control inputs to one or more functional units of the automatic soldering tool cleaning device 100 and to process data received at or generated by the one or more functional units of the automatic soldering tool cleaning device 100, such as the infrared sensor 120 and the motor 130. Thus, the processing circuitry 170 may be configured to perform data processing, control function execution and / or other processing and management services according to an example embodiment. In some embodiments, the processing circuitry 170 may be embodied as a chip or chip set. In other words, the processing circuitry 170 may comprise one or more physical packages (e.g., chips) including materials, components and / or wires on a structural assembly (e.g., a baseboard). The structural assembly may provide physical strength, conservation of size, and / or limitation of electrical interaction for component circuitry included thereon. The processing circuitry 170 may therefore, in some cases, be configured to implement an embodiment of the present invention on a single chip or as a single “system on a chip.” As AttyDktNo: 717745-00931-P4231PCT01 such, in some cases, a chip or chipset may constitute means for performing one or more operations for providing the functionalities described herein. In an example embodiment, the processing circuitry 170 may include one or more instances of a processor 172 and memory 174 that may be in communication with or otherwise control other components or modules that interface with the processing circuitry 170. As such, the processing circuitry 170 may be embodied as a circuit chip (e.g., an integrated circuit chip) configured (e.g., with hardware, software or a combination of hardware and software) to perform operations described herein. In some embodiments, the processing circuitry 170 may be embodied as a portion of an onboard computer housed in the housing 110 of the automatic soldering tool cleaning device 100 to control operation of the device 100. In an example embodiment, the memory 174 may include an algorithm 180 for controlling the automatic soldering tool cleaning device 100. The algorithm 180, as will be discussed below, may utilize the sensor 120 to detect motion of a heated object, such as the soldering tool 150, and operate the motor 130 accordingly. In some cases, the infrared sensor 120 may be a single-point infrared sensor 120. In this regard, the single-point infrared sensor 120 may only generate one input signal to the processing circuitry 170, as opposed to say a grid array infrared sensor that may comprise a plurality of single-point infrared sensors and may generate input signals corresponding to each individual sensor in the grid array infrared sensor. Grid array infrared sensors may rely on a differential signal between the individual sensor signals to detect motion of a heated object, such as a soldering tool 150. Generally, grid array infrared sensors are more expensive and complicated to implement than a single-point infrared sensor 120, but single-point infrared sensors are not without their own shortcomings. For instance, it may be difficult to detect motion using a single-point infrared sensor due to the lack of a differential signal, as described above in relation to grid array infrared sensors. Thus, it may be an object of the present invention to develop an algorithm 180 for, and a method of, controlling the single- point infrared sensor 120 to detect motion of a heated object, such as a soldering tool 150 approaching the housing 110 of an automatic soldering tool cleaning device 100. In some cases, the algorithm 180 may be stored in the memory 174 of the processing circuitry and may be accessible by the processor 172 for appropriate control of the device 100 according to the algorithm 180. As will be described in more detail below in reference to FIGS.2-7, the algorithm 180 may, in a general sense, be directed to a method of detecting motion of a heated object using a single-point infrared sensor 120. In this regard, the method of the algorithm 180 may AttyDktNo: 717745-00931-P4231PCT01 include detecting the heated object within a field of view of the sensor 120, measuring an instantaneous temperature value 190 of the heated object, determining a moving average temperature value 200 of the heated object, comparing the instantaneous temperature value 190 to the moving average temperature value 200, and generating a trigger signal based on a result of comparing the instantaneous temperature value 190 to the moving average temperature value 200. In some cases, the single-point infrared sensor 120 may be operably coupled to the automatic soldering tool cleaning device 100, and the heated object may be the soldering tool 150. FIG.2 illustrates a flow chart of the algorithm for controlling the soldering tool cleaning device 100 in accordance with an example embodiment. FIG.2 depicts an overview of the different states, steps and decisions that may be included in the algorithm 180. For instance, the algorithm 180 may start with the sensor 120 in an undefined state 210 after the device 100 has been powered on. The undefined state 210, in an example embodiment, may be a start-up state for the sensor 120, and as such, in the undefined state 210 the processing circuitry 170 may execute a startup sequence that may initialize the sensor 120 at step 212. In this regard, initializing the sensor 120 may include defining initial values for a plurality of variables that may be used throughout the execution of the algorithm 180. For example, the processing circuitry 170 may initialize the variables used to store recorded values of both the instantaneous temperature value 190 and the moving average temperature value 200 to be zero, indicating that no values have been recorded by the sensor 120 yet. Responsive to the completion of the startup sequence / the initialization of the sensor 120 at step 212, the sensor 120 may transition from the undefined state 210 into a waiting state 220. In the waiting state 220, the sensor 120 may be operational and may essentially be “waiting” to detect the heated object within the field of view of the sensor 120 to generate a trigger signal that turns on the motor 130 and switches the sensor 120 to an active state 230. Thus, at decision 222, if the sensor 120 does not detect the heated object moving towards the sensor 120, then the sensor 120 may not generate the trigger signal and it may remain in the waiting state 220 with the motor 130 turned off. However, if the sensor 120 does detect the heated object moving towards the sensor 120, then the sensor 120 may generate the trigger signal, which may indicate to the processing circuitry 170 to turn on the motor 130 and transition the sensor 120 into the active state 230 at step 224. In some cases, the active state 230 may be the inverse of the waiting state 220 in some regards. For example, in the active state 230, the sensor 120 may be operational and may essentially be monitoring the heated object within the field of view of the sensor 120 to AttyDktNo: 717745-00931-P4231PCT01 determine when to turn off the motor 130 and switch the sensor 120 back to the waiting state 220. Thus, at decision 232, if the sensor 120 does not detect the heated object moving away from the sensor 120, then the sensor 120 may not turn off the motor 130 and it may remain in the active state 230 with the motor 130 turned on. However, if the sensor 120 does detect the heated object moving away from the sensor 120, then the sensor 120 may turn off the motor 130 and transition the sensor 120 into the waiting state 220 at step 234. In some cases, the motor 130 may be turned off in the waiting state 220 and turned on in the active state 230. In both the waiting state 220 and the active state 230, the sensor 120 may record the instantaneous temperature value 190 and the processing circuitry 170 may determine the moving average temperature value 200. The instantaneous temperature value 190 may be stored in the memory 174 in a continuous loop type method, where the oldest instantaneous temperature values 190 are overwritten by the newest instantaneous temperature values 190 when the capacity of the memory 174 is exceeded. In some cases, the instantaneous temperature value 190 may be used by the processor 172 in determining the moving average temperature value 200. In this regard, the processor 172 may calculate a simple moving average of the instantaneous temperature values 190 over time. For example, the processor 172 may calculate the simple moving average using the equation ^^^^^^^ൌ where k may be the total number of data points (i.e. the number of instantaneous temperature values 190) used to calculate the moving average temperature value 200, p may be each individual instantaneous temperature value 190, n may be the index number corresponding to each instantaneous temperature value 190, and ^^^^^^^may be the moving average temperature value 200 of k number of instantaneous temperature values 190. As will be described in further detail below in reference to FIGS.3 and 4, in the waiting state 220, the processing circuitry 170 may use the measured instantaneous temperature values 190 and the calculated moving average temperature value 200 to determine if the heated object may be moving towards the sensor 120, whereas in the active state 230, the processing circuitry 170 may use the measured instantaneous temperature values 190 and the calculated moving average temperature value 200 to determine if the heated object may be moving away from the sensor 120. If the processing circuitry 170 determines that the heated object may be moving towards the sensor 120 while in the waiting state 220, then the processing circuitry 170 may activate the motor 130 of the automatic soldering tool cleaning device 100 since motion towards the sensor 120 may be indicative of the operator 160 moving the soldering tool 150 to the housing 110 to clean the soldering tool AttyDktNo: 717745-00931-P4231PCT01 150, in which case the brush assembly 140 should be driven. Responsive to the motor 130 being turned on at step 224, the sensor 120 may switch to the active state 230 and may record the instantaneous temperature values 190, and the processing circuitry 170 may calculate the moving average temperature value 200 to monitor the motion of the soldering tool 150 as mentioned above. If the processing circuitry 170 determines that the heated object may be moving away from the sensor 120, then the processing circuitry 170 may deactivate the motor 130 of the automatic soldering tool cleaning device 100 since motion away from the sensor 120 may be indicative of the operator 160 moving the soldering tool 150 out of the housing 110, in which case the brush assembly 140 may be stopped. Responsive to the motor 130 being turned off at step 234, the sensor 120 may transition into the waiting state 220 again, where it will yet again wait to detect the heated object moving towards the sensor 120. Thus, the algorithm 180 may alternate the single-point infrared sensor 120 between the waiting state 220 and the active state 230 based on whether or not the single-point infrared sensor 120 detects the heated object moving towards or away from the sensor 120. One way in which the processing circuitry 170 may determine the direction of motion of the heated object relative to the sensor 120 may be to calculate the difference between the instantaneous temperature values 190 and the moving average temperature value 200 recorded at a same time interval (e.g. for each ‘n’ value). In this regard, the difference between the instantaneous temperature value 190 and the moving average temperature value 200 may be indicative of the motion of the heated object, and more particularly, the direction of motion of the heated object. FIG.3 illustrates a flow chart representing the process that occurs in between the waiting state 220 and the decision 222 shown in FIG.2, and FIG.4 illustrates a flow chart representing the process that occurs in between the active state 230 and the decision 232 shown in FIG.2. According to FIG.3, at step 240, while the sensor 120 records instantaneous temperature values 190, the processing circuitry may be reading the instantaneous temperature values 190, calculating the moving average temperature value 200, and taking the difference between the instantaneous temperature values 190 and the moving average temperature value 200 continuously. At decision 250, the processing circuitry 170 determines whether the instantaneous temperature value 190 is above, below or equal to the moving average temperature value 200. If the instantaneous temperature value 190 is determined to be above the moving average temperature value 200 (i.e. the difference is a positive value), then the processing circuitry 170 may add the difference to a waiting state count at step 260. If the waiting state count is determined to exceed a predetermined waiting state count AttyDktNo: 717745-00931-P4231PCT01 threshold value at decision 270, then the processing circuitry 170 determines that the heated object is moving towards the sensor 120 at step 280, and the trigger signal is generated to activate the motor 130 and switch the sensor 120 to the active state 230 at step 224. If the waiting state count is determined to not exceed the predetermined waiting state count threshold at decision 270, then the trigger signal is not generated yet, and the processing circuitry 170 returns to step 240 to continue to read and record the instantaneous temperature value 190 and calculate the moving average temperature value 200 until the cumulative difference indicated by the waiting state count exceeds the predetermined waiting state count threshold. Similarly, at decision 250, if the instantaneous temperature value 190 is below or equal to the moving average temperature value 200 (i.e. the difference is a negative value or zero), then the processing circuitry 170 may reset the waiting state count at step 290 and may also return to step 240 to restart the process of reading and recording the instantaneous temperature value 190 and calculating the moving average temperature value 200. According to FIG.4, while the sensor 120 records instantaneous temperature values 190, the processing circuitry may be reading the instantaneous temperature values 190, calculating the moving average temperature value 200, and taking the difference between the instantaneous temperature values 190 and the moving average temperature value 200 continuously at step 300. At decision 310, the processing circuitry 170 determines whether the instantaneous temperature value 190 is above, below or equal to the moving average temperature value 200. If the instantaneous temperature value 190 is determined to be below or equal to the moving average temperature value 200 (i.e. the difference is a negative value or zero), then the processing circuitry 170 may add the difference to an active state count at step 320. If the active state count is determined to exceed a predetermined active state count threshold value at decision 330, then the processing circuitry 170 determines that the heated object is moving away from the sensor 120 at step 340, then the motor 130 is deactivated and the sensor 120 is switched to the waiting state 220 at step 234. If the active state count is determined to not exceed the predetermined active state count threshold at decision 330, then the motor 130 is not deactivated yet, and the processing circuitry 170 returns to step 300 to continue to read and record the instantaneous temperature value 190 and calculate the moving average temperature value 200 until the cumulative difference indicated by the active state count exceeds the predetermined active state count threshold. Similarly, at decision 310, if the instantaneous temperature value 190 is above the moving average temperature value 200 (i.e. the difference is a positive value), then the processing circuitry 170 may reset the waiting state count at step 350 and may also return to step 300 to restart the process of reading and AttyDktNo: 717745-00931-P4231PCT01 recording the instantaneous temperature value 190 and calculating the moving average temperature value 200. FIGS.5 and 6 illustrate plots comparing the instantaneous temperature value to the moving average temperature value over time when the heated object moves towards the sensor (FIG.5), and away from the sensor (FIG.6). The plots shown in FIG.5 and 6 simply depict examples of data recorded by the sensor 120. For instance, in FIG.5, the instantaneous temperature value 190 recorded by the sensor 120 over time exceeds the moving average temperature value 200 calculated by the processing circuitry 170 over time. The moving average temperature value 200 lagging behind the instantaneous temperature value 190 may be indicative of the heated object moving towards the sensor 120. In other words, when the difference between the instantaneous temperature value 190 and the moving average temperature value 200 is positive, the heated object may be determined to be moving towards the sensor 120. On the other hand, in FIG.6, the instantaneous temperature value 190 recorded by the sensor 120 over time does not exceed the moving average temperature value 200 calculated by the processing circuitry 170 over time. The moving average temperature value 200 being ahead of the instantaneous temperature value 190 may be indicative of the heated object moving away from the sensor 120. In other words, when the difference between the instantaneous temperature value 190 and the moving average temperature value 200 is negative, the heated object may be determined to be moving towards the sensor 120. Another way to use the plots for the instantaneous temperature value 190 and the moving average temperature value 200 is to use the area between the curves corresponding to the instantaneous temperature value 190 and the moving average temperature value 200 in each of FIGS.5 and 6 (e.g. the integral of the two curves) to determine when to switch between the waiting state 220 and the active state 230. However, this method may generate some false trigger signals that the counter method described above in relation to FIGS.3 and 4 may not. Thus, the count method described above may be an alternative option to taking the integral of the instantaneous temperature value 190 and the moving average temperature value 200. For example, say the soldering tool 150 were to pass inadvertently by the sensor 120 very quickly. The plot of the instantaneous temperature value 190 for this event may resemble a very tall and narrow spike in temperature, while the plot of the moving average temperature value 200 may resemble a mostly flat line close to zero. If the integral method was used to determine when to switch states, then the processing circuitry 170 may very quickly switch into the active state 230 and then back into the waiting state 220 as the soldering tool 150 moves by the sensor 120. This may be because the tall and narrow spike in AttyDktNo: 717745-00931-P4231PCT01 the instantaneous temperature value 190 plot may have a large enough area between the instantaneous temperature value 190 curve and the moving average temperature value 200 curve to generate the trigger signal and change states between the waiting state 220 and the active state 230. However, by using the counter method described above in relation to FIGS. 3 and 4, the false trigger signal may be avoided. While the sensor 120 may detect the rapid rise and fall of the instantaneous temperature value 190, the processing circuitry 170 may not change the state until the count threshold is exceeded, which may not occur with the inadvertent motion of the soldering tool 150 in this example. Thus, the processing circuitry 170, and therefore the algorithm 180, may filter the instantaneous temperature value 190 to avoid generating false trigger signals, which may better improve the functionality of the device 100. In both FIGS.5 and 6, the instantaneous temperature value 190 and the moving average temperature value 200 curves may also appear to converge as time approaches infinity. This may be indicative of the moving average temperature value 200 approaching the instantaneous temperature value 190 of the soldering tool 150 in the case where the tool may be approaching the device 100, and of the moving average temperature value 200 and the instantaneous temperature value 190 both approaching zero as the heated object leaves the device 100. In some cases, a magnitude of the difference between the instantaneous temperature value 190 and the moving average temperature value 200 may correspond to the motion of the soldering tool 150. In this regard, as the absolute value of the difference may increase, so too may the velocity of the soldering tool 150. Thus, for example, a large positive difference may indicate that the soldering tool 150 may be moving at a high velocity towards the sensor 120, whereas a small positive difference may indicate that the soldering tool 150 may be moving at a low velocity towards the sensor 120. The algorithm 180 containing the method implemented in the system described herein may provide many benefits over traditional methods of detecting motion using passive infrared sensors, or perhaps more than one single-point infrared sensor 120 in a grid array having a specialized refraction lens, and even other types of sensors such as time-of-flight type sensors. Primarily, the algorithm 180 shown and described herein has a low cost of implementation, both in hardware by only requiring a single-point infrared sensor 120 without a specialized lens, and also in coding time. Automatic soldering tool cleaning devices 100 having time-of-flight sensors may take longer to implement code due to system complexity. For example, the implementation time for the time-of-flight sensors has been approximately 9 months compared to one week of development using the algorithm 180 AttyDktNo: 717745-00931-P4231PCT01 described herein. Additionally, the algorithm 180 removes the factor of the ambient room temperature from consideration, as well as the size of the heated object. For example, it doesn’t matter if the room is 70º F or 100º F, the processing circuitry is only going to consider the instantaneous temperature value 190 of the heated object and the moving average temperature value 200 of the heated object to detect motion of the heated object since the ambient room temperature is not considered. It should be appreciated that although the method for detecting motion of a heated object using a single-point infrared sensor has herein been described in reference to an automatic soldering tool cleaning device 100, the method may be applied to other motion detection situations. For instance, the method of for detecting motion of a heated object using a single-point infrared sensor could be applied to motion detection security devices, motion activated lighting solutions, or other motion detecting systems. FIG.7 shows a block diagram of a method of detecting motion of a heated object using a single-point infrared sensor 120. The method may include detecting the heated object within a field of view of the sensor 120 at operation 700, and measuring an instantaneous temperature value 190 of the heated object at operation 710. The method may further include determining a moving average temperature value 200 of the heated object at operation 720, and comparing the instantaneous temperature value 190 to the moving average temperature value 200 at operation 730. Finally, the method may also include generating a trigger signal based on a result of comparing the instantaneous temperature value 190 to the moving average temperature value 200 at operation 740. The trigger signal may activate or deactivate a motor 130 of the automatic soldering tool cleaning device 100. According to an example embodiment, the algorithm 180 may be a written program for the processing circuitry 170 to execute. The algorithm 180 may be as follows: #define MAX_SENSOR_READS 100    #define ACTIVE_PEAK_TIME_START  10  #define ACTIVE_PEAK_DIFF_START  40  #define ACTIVE_PEAK_TIME_STOP   30  #define ACTIVE_PEAK_DIFF_STOP  ‐50        static uint16_t temp_sensor_read = 0;  AttyDktNo: 717745-00931-P4231PCT01 static uint16_t average_temperature = 0;  static uint16_t sensor_values[MAX_SENSOR_READS];  static uint16_t sensor_index = 0;  static int16_t  diff_temperature = 0;    typedef enum TEMP_ACTION_STATE  {      TA_UNDEFINED,      TA_WAITING,      TA_ACTIVE  }TempActionState;    static TempActionState current_state = TA_UNDEFINED;  static uint16_t peak_time_up = 0;  static uint16_t peak_time_down = 0;      void temp_sensor_init()  {      ADC1_start();      DAC1DATL = MIN_DAC_VALUE;      DAC1DATH = MAX_DAC_VALUE;        }  void ReadTempSensor()  {        if (ADSTATLbits.AN0RDY)    {               temp_sensor_read = ADCBUF0;              / /  and process LPF params.          ADSTATLbits.AN0RDY = 0;          ADCON3Lbits.CNVRTCH = 1;    / /  start a new conversion          sensor_values[sensor_index] = temp_sensor_read;          sensor_index++;     if (sensor_index > MAX_SENSOR_READS)  AttyDktNo: 717745-00931-P4231PCT01    {         sensor_index = 0;     }   }      / /  calculate average       uint32_t sum = 0;      for (int i=0; i<MAX_SENSOR_READS; i++)      {          sum += sensor_values[i];      }      average_temperature = sum  /  MAX_SENSOR_READS;      diff_temperature = temp_sensor_read ‐ average_temperature;        }  / /  first pass at detecting motion through the temperature  / /  sensor.  Look at the differential of the current temperature  / /  and the average temperature.   void ActionTempSensor()  {      switch (current_state)      {          case TA_UNDEFINED:              peak_time_up = 0;              peak_time_down = 0;              current_state = TA_WAITING;              break;          case TA_WAITING:                            if (peak_time_up < ACTIVE_PEAK_TIME_START)              {                  if (diff_temperature > ACTIVE_PEAK_DIFF_START)                  {                      peak_time_up++;                  }                  else  AttyDktNo: 717745-00931-P4231PCT01         {              peak_time_up = 0;          }      }      else      {           / /  motion detected          publish_control(CONTROL_TEMP_SENS_ON, 0);          peak_time_up = 0;          current_state = TA_ACTIVE;          start_timer( CONTROL_TIMER_SENSOR_OFF );      }      break;        case TA_ACTIVE:      if (peak_time_up < ACTIVE_PEAK_DIFF_START)      {             if (diff_temperature > ACTIVE_PEAK_DIFF_START)         {              peak_time_up++;          }          else          {              peak_time_up = 0;          }      }            if (peak_time_down < ACTIVE_PEAK_TIME_STOP)      {          if (diff_temperature < ACTIVE_PEAK_DIFF_STOP)         {              peak_time_down++;          }      }      else  AttyDktNo: 717745-00931-P4231PCT01             {                   / /  motion detected                  publish_control(CONTROL_TEMP_SENS_OFF, 0);                  peak_time_down = 0;                  peak_time_up = 0;                  current_state = TA_WAITING;                  cancel_timer( CONTROL_TIMER_SENSOR_OFF );              }              break;          default:              break;      }  } Some example embodiments may provide for an automatic soldering tool cleaning device. The device may include a housing, a brush assembly enclosed within the housing, a motor operably coupled to the brush assembly, a single-point infrared sensor, and processing circuitry operably coupled to the single-point infrared sensor and the motor. The processing circuitry may be configured to detect a soldering tool within a field of view of the sensor, measure an instantaneous temperature value of the soldering tool, determine a moving average temperature value of the soldering tool, compare the instantaneous temperature value to the moving average temperature value, and generate a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value. The device of some embodiments may include additional features, modifications, augmentations and / or the like to achieve further objectives or enhance performance of the device. The additional features, modifications, augmentations and / or the like may be added in any combination with each other. Below is a list of various additional features, modifications, and augmentations that can each be added individually or in any combination with each other. For example, comparing the instantaneous temperature value to the moving average temperature value may include taking the difference of the instantaneous temperature value and the moving average temperature value, both values recorded at a same time interval. In an example embodiment, when the difference between the instantaneous temperature and the moving average temperature may be a positive value, then the soldering tool may be determined to be moving towards the single-point infrared sensor. In some cases, responsive to determining the soldering tool may be moving towards the single-point infrared AttyDktNo: 717745-00931-P4231PCT01 sensor, the trigger signal may activate the automatic soldering tool cleaning device. In an example embodiment, when the difference between the instantaneous temperature and the moving average temperature may be a negative value, then the soldering tool may be determined to be moving away from the single-point infrared sensor. In some cases, responsive to determining the soldering tool is moving away from the single-point infrared sensor, the trigger signal deactivates the automatic soldering tool cleaning device. In an example embodiment, the magnitude of the difference between the instantaneous temperature and the moving average temperature may correspond to motion of the soldering tool. Some example embodiments may provide for a method for detecting motion of a heated object using a single-point infrared sensor. The method may include detecting the heated object within a field of view of the sensor, measuring an instantaneous temperature value of the heated object, determining a moving average temperature value of the heated object, comparing the instantaneous temperature value to the moving average temperature value, and generating a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value. Some example embodiments may provide for a method for detecting motion of a heated object using a single-point infrared sensor. The method may include the steps of entering the single-point infrared sensor into an undefined state, in which processing circuitry initializes the single-point infrared sensor, transitioning, responsive to the single-point infrared sensor being initialized, the single-point infrared sensor into a waiting state in which the single-point infrared sensor waits to detect the heated object to generate a trigger signal, transitioning, responsive to the processing circuitry receiving the trigger signal, the single- point infrared sensor into an active state in which the single-point infrared sensor records an instantaneous temperature and the processing circuitry determines a moving average temperature, alternating the single-point infrared sensor between the waiting state and the active state based on whether or not the single-point infrared sensor detects the heated object, and calculating the difference between the instantaneous temperature and the moving average temperature. The difference between the instantaneous temperature and the moving average temperature is indicative of motion of the heated object. Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the inventions are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within AttyDktNo: 717745-00931-P4231PCT01 the scope of the appended claims. Moreover, although the foregoing descriptions and the associated drawings describe exemplary embodiments in the context of certain exemplary combinations of elements and / or functions, it should be appreciated that different combinations of elements and / or functions may be provided by alternative embodiments without departing from the scope of the appended claims. In this regard, for example, different combinations of elements and / or functions than those explicitly described above are also contemplated as may be set forth in some of the appended claims. In cases where advantages, benefits or solutions to problems are described herein, it should be appreciated that such advantages, benefits and / or solutions may be applicable to some example embodiments, but not necessarily all example embodiments. Thus, any advantages, benefits or solutions described herein should not be thought of as being critical, required or essential to all embodiments or to that which is claimed herein. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

AttyDktNo: 717745-00931-P4231PCT01 WHAT IS CLAIMED:

1. A method for detecting motion of a heated object using a single-point infrared sensor, the method comprising: detecting the heated object within a field of view of the sensor; measuring an instantaneous temperature value of the heated object; determining a moving average temperature value of the heated object; comparing the instantaneous temperature value to the moving average temperature value; and generating a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value.

2. The method of claim 1, wherein comparing the instantaneous temperature value to the moving average temperature value comprises taking a difference of the instantaneous temperature value and the moving average temperature value, both values recorded at a same time interval.

3. The method of claim 2, wherein the single-point infrared sensor is operably coupled to an automatic soldering tool cleaning device, and wherein the heated object is a soldering tool.

4. The method of claim 3, wherein when the difference between the instantaneous temperature and the moving average temperature is a positive value, then the soldering tool is determined to be moving towards the single-point infrared sensor.

5. The method of claim 4, wherein responsive to determining the soldering tool is moving towards the single-point infrared sensor, the trigger signal activates the automatic soldering tool cleaning device.

6. The method of claim 3, wherein when the difference between the instantaneous temperature and the moving average temperature is a negative value, then the soldering tool is determined to be moving away from the single-point infrared sensor, andAttyDktNo: 717745-00931-P4231PCT01 wherein responsive to determining the soldering tool is moving away from the single- point infrared sensor, the trigger signal deactivates the automatic soldering tool cleaning device.

7. The method of claim 2, wherein comparing the instantaneous temperature value to the moving average temperature value further comprises filtering the instantaneous temperature value to avoid generating a false trigger signal.

8. An automatic soldering tool cleaning device, the cleaning device comprising: a housing; a brush assembly enclosed within the housing; a motor operably coupled to the brush assembly; a single-point infrared sensor; and processing circuitry operably coupled to the single-point infrared sensor and the motor, wherein the processing circuitry is configured to: detect a soldering tool within a field of view of the sensor; measure an instantaneous temperature value of the soldering tool; determine a moving average temperature value of the soldering tool; compare the instantaneous temperature value to the moving average temperature value; and generate a trigger signal based on a result of comparing the instantaneous temperature value to the moving average temperature value.

9. The cleaning device of claim 8, wherein comparing the instantaneous temperature value to the moving average temperature value comprises taking a difference of the instantaneous temperature value and the moving average temperature value, both values recorded at a same time interval.

10. The cleaning device of claim 9, wherein a magnitude of the difference between the instantaneous temperature and the moving average temperature corresponds to motion of the soldering tool.AttyDktNo: 717745-00931-P4231PCT01 11. The cleaning device of claim 9, wherein when the difference between the instantaneous temperature and the moving average temperature is a positive value, then the soldering tool is determined to be moving towards the housing.

12. The cleaning device of claim 11, wherein responsive to determining the soldering tool is moving towards the single-point infrared sensor, the processing circuitry activates the motor to rotate the brush assembly.

13. The cleaning device of claim 9, wherein when the difference between the instantaneous temperature and the moving average temperature is a negative value, then the soldering tool is determined to be moving away from the housing, and wherein responsive to determining the soldering tool is moving away from the single- point infrared sensor, the processing circuitry deactivates the motor to stop rotating the brush assembly.

14. The cleaning device of claim 9, wherein comparing the instantaneous temperature value to the moving average temperature value further comprises filtering the instantaneous temperature value to avoid generating a false trigger signal.

15. A method for detecting motion of a heated object using a single-point infrared sensor, the method comprising: entering the single-point infrared sensor into an undefined state, in which processing circuitry initializes the single-point infrared sensor; transitioning, responsive to the single-point infrared sensor being initialized, the single-point infrared sensor into a waiting state in which the single-point infrared sensor waits to detect the heated object to generate a trigger signal; transitioning, responsive to the processing circuitry receiving the trigger signal, the single-point infrared sensor into an active state in which the single-point infrared sensor records an instantaneous temperature and the processing circuitry determines a moving average temperature; alternating the single-point infrared sensor between the waiting state and the active state based on whether or not the single-point infrared sensor detects the heated object; andAttyDktNo: 717745-00931-P4231PCT01 calculating a difference between the instantaneous temperature and the moving average temperature, wherein the difference between the instantaneous temperature and the moving average temperature is indicative of motion of the heated object.

16. The method of claim 15, wherein the single-point infrared sensor is operably coupled to an automatic soldering tool cleaning device, and wherein the heated object is a soldering tool.

17. The method of claim 16, wherein when the difference between the instantaneous temperature and the moving average temperature is a positive value, then the soldering tool is determined to be moving towards the single-point infrared sensor.

18. The method of claim 17, wherein responsive to determining the soldering tool is moving towards the single-point infrared sensor, the processing circuitry activates the automatic soldering tool cleaning device.

19. The method of claim 16, wherein when the difference between the instantaneous temperature and the moving average temperature is a negative value, then the soldering tool is determined to be moving away from the single-point infrared sensor, and wherein responsive to determining the soldering tool is moving away from the single- point infrared sensor, the processing circuitry deactivates the automatic soldering tool cleaning device.

20. The method of claim 15, wherein calculating a difference between the instantaneous temperature and the moving average temperature further comprises filtering the instantaneous temperature value to avoid generating a false trigger signal.

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