Notebook computer heat dissipation assembly

Abstract

The present invention provides a notebook computer heat dissipation assembly, comprising: a heat conduction interface member (2) having a hollow structure, wherein the heat conduction interface member (2) is configured to be in heat conduction contact with heat dissipation fins of a notebook computer; a cooling device (3); and a cooling circuit (4), configured such that a cooling medium flows therethrough, wherein the cooling circuit (4) is in fluid connection to the hollow structure of the heat conduction interface member (2), and at least a part of the cooling circuit (4) is in heat conduction contact with the cooling device (3) so as to lead heat generated by the notebook computer to the cooling device (3) by means of the cooling medium of the cooling circuit (4).

Description

Laptop cooling components

[0001] This application claims priority to Chinese Patent Application No. 202420292140.X filed on February 8, 2024. The contents of the above-mentioned Chinese patent application disclosure are hereby incorporated by reference in their entirety as a part of this application. Technical Field

[0002] The present disclosure relates to a notebook computer heat dissipation assembly, and in particular to a notebook computer heat dissipation assembly having a heat-conducting interface component with a hollow structure and a cooling circuit. Background Art

[0003] As laptop performance improves, heat dissipation has become a major concern for users. Long-term operation of laptops can lead to performance degradation and even shorten the life of the hardware due to high temperatures.

[0004] Currently, the built-in cooling device of laptop computers uses the heat conduction effect to gather heat on the cooling fins inside the laptop computer, and then uses the fan to generate airflow to carry the temperature on the fins, thereby reducing the temperature of the fins. However, this cooling method is inefficient, and the more heat is gathered, the greater the air volume required and the faster the fan speed. When the laptop computer is running at high load, it is easy to generate a lot of noise.

[0005] External heat sinks are known to assist laptop computers in dissipating heat. These heat sinks provide additional cooling space at the bottom of the laptop, increasing air circulation and lowering the laptop's temperature. However, these heat sinks have limited cooling effects on high-performance laptops.

[0006] Therefore, a new type of notebook computer heat dissipation component is needed, which can achieve effective heat dissipation, low noise and easy installation. Summary of the Invention

[0007] In response to the above-mentioned problems and needs, the present disclosure proposes a novel notebook computer heat dissipation assembly, which solves the above-mentioned problems and brings other technical effects by adopting the following technical features.

[0008] On the one hand, the present disclosure provides a laptop computer heat dissipation assembly, comprising: a thermally conductive interface member having a hollow structure, the thermally conductive interface member being configured to be in thermal contact with the heat dissipation fins of the laptop computer; a cooling device; and a cooling circuit configured to allow a cooling medium to flow through the cooling circuit, the cooling circuit being fluidly connected to the hollow structure of the thermally conductive interface member, and at least a portion of the cooling circuit being in thermal contact with the cooling device to conduct heat generated by the laptop computer to the cooling device via the cooling medium of the cooling circuit.

[0009] In some examples, the thermal interface component includes: a main body, including an inner cavity and a first side surface and a second side surface opposite to each other in a longitudinal direction, the inner cavity being fluidically connected to the first side surface and the second side surface, respectively, the first side surface being provided with a fluid interface, configured to be fluidically connected to the cooling circuit; and at least one heat sink fin extending from the second side surface of the main body in a longitudinal direction, the at least one heat sink fin including a fluid channel arranged inside, the fluid channel being fluidically connected to the inner cavity, and the at least one heat sink fin being configured to be in thermal contact with the heat sink fins of the laptop computer.

[0010] In some examples, the inner cavity is provided with a partition wall, which divides the inner cavity into a first cavity and a second cavity distributed in a transverse direction. The first cavity and the second cavity are connected in series to the cooling circuit.

[0011] In some examples, the partition wall extends at least partially into the fluid channel.

[0012] In some examples, a partition wall is provided in the fluid channel to divide the fluid channel into a first chamber and a second chamber, and the first chamber and the second chamber are connected in series to the cooling circuit.

[0013] In some examples, an inclined portion is provided at one end of the at least one heat dissipating fin away from the main body, and a thickness of the inclined portion gradually decreases along the longitudinal direction.

[0014] In some examples, the thermal interface component includes a plurality of heat sinks spaced apart from each other, and the gaps between the plurality of heat sinks are configured so that the heat sink fins of a laptop computer can be plugged between two adjacent heat sinks, wherein the cooling circuit includes a water divider, which is fluidically connected to the first cavity, the second cavity, and the cooling device, respectively, to transport the cooling medium collected from the first cavity of the plurality of heat sinks to the cooling device, and to distribute the cooled cooling medium recovered from the cooling device to the second cavity of the plurality of heat sinks.

[0015] In some examples, the laptop computer heat dissipation assembly further includes: a bracket body, comprising a support surface for supporting the laptop computer, the cooling device being disposed in the bracket body; a connecting pipe, the connecting pipe connecting the thermally conductive interface part with the cooling circuit, and connecting the thermally conductive interface part with the cooling circuit fluid; an intermediate shell, comprising a straight section and an inclined section inclined relative to the straight section, the straight section being provided with a groove extending along the length direction, the connecting pipe and the thermally conductive interface part being accommodated in the groove and being capable of sliding along the groove, the inclined section being provided with a non-circular through hole; and a connecting rod movably disposed in the bracket body, wherein the connecting rod has a cross-section matching the through hole of the intermediate shell, the connecting rod passing through the intermediate shell and being rotationally fixedly connected to the intermediate shell.

[0016] In some examples, the bracket body is provided with a guide rail, and the bracket body includes a support surface for supporting a laptop computer, and the connecting rod is movably provided in the guide rail, wherein the guide rail includes a first section parallel to the support surface and a second section inclined downward relative to the first section, and the connecting rod is capable of sliding along the first section and the second section between an installation position and a retracted position, wherein in the installation position, the connecting rod is located at a first end of the first section away from the second section, and wherein in the retracted position, the connecting rod is located at a second end of the second section away from the first section.

[0017] In some examples, a height adjustment bolt is provided at the first end portion, which is capable of rotating along a rotation axis parallel to the connecting rod and has multiple supporting planes perpendicular to the rotation axis for supporting the end portion of the connecting rod, each supporting plane having a different distance from the rotation axis.

[0018] In some examples, the cooling circuit further includes a fluid pump to drive the flow of a cooling medium in the cooling circuit, and wherein the cooling device is a semiconductor refrigeration plate including a cold end and a hot end, the cold end being in thermal contact with at least a portion of the cooling circuit, and the hot end being in thermal contact with a heat sink, or the cooling device is a heat sink.

[0019] In some examples, the heat dissipation device is a fan heat dissipation component, a liquid cooling heat dissipation component, or a heat sink.

[0020] In some examples, the thermal interface component is provided with a temperature sensor for detecting the temperature of the thermal interface component. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0022] FIG1 shows a perspective view of a notebook computer heat dissipation assembly according to at least one embodiment of the present disclosure;

[0023] FIG2 shows another perspective view of a notebook computer heat dissipation assembly according to at least one embodiment of the present disclosure;

[0024] FIG3 shows another perspective view of a notebook computer heat dissipation assembly according to at least one embodiment of the present disclosure, wherein the bracket body and the pipe are omitted;

[0025] FIG4 shows a perspective view of a notebook computer heat dissipation assembly according to another embodiment of the present disclosure;

[0026] FIG5 shows a partial cross-sectional perspective view of a thermal interface component according to at least one embodiment of the present disclosure;

[0027] FIG6 illustrates a side view of a thermally conductive interface member according to at least one embodiment of the present disclosure;

[0028] FIG7 shows a cross-sectional view of the thermal interface member taken along line BB of FIG6 ;

[0029] FIG8 shows a perspective view of a cooling device according to at least one embodiment of the present disclosure;

[0030] FIG9 shows a schematic diagram of a fluid circuit according to at least one embodiment of the present disclosure;

[0031] FIG10 shows a side view of the connecting pipe, the intermediate housing, and the thermal interface member according to at least one embodiment of the present disclosure;

[0032] FIG11 shows a top view of FIG10 ;

[0033] FIG12 shows a perspective view of a connecting pipe and a thermal interface member according to at least one embodiment of the present disclosure;

[0034] FIG13 shows a perspective view of an intermediate housing according to at least one embodiment of the present disclosure;

[0035] FIG14 shows a perspective view of a notebook computer heat dissipation assembly according to another embodiment of the present disclosure, wherein only one thermal interface component is shown for the sake of simplicity, and the connecting rod is in the installed position;

[0036] FIG15 is a schematic diagram showing the connecting rod in the installed position, wherein the bracket body is omitted;

[0037] FIG16 shows a perspective view of a notebook computer heat dissipation assembly according to another embodiment of the present disclosure, wherein only one thermal interface component is shown for the sake of simplicity, and the connecting rod is in a retracted position;

[0038] FIG17 is a schematic diagram showing a connecting rod in a retracted position, wherein the bracket body is omitted;

[0039] FIG18 shows a schematic diagram of the connecting rod in the installed position and the retracted position;

[0040] FIG19 shows a partial broken away cross-sectional view of a thermally conductive interface member according to another embodiment of the present disclosure;

[0041] FIG20 shows a partial broken-away cross-sectional view of a thermally conductive interface member according to yet another embodiment of the present disclosure;

[0042] FIG21A shows a side view of a thermal interface member according to yet another embodiment of the present disclosure;

[0043] FIG21B shows a cross-sectional view of the thermal interface member taken along line CC of FIG21A;

[0044] FIG. 22 shows a perspective view of a thermal interface according to yet another embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the technical solution of the present disclosure clearer, the technical solution of the embodiment of the present disclosure will be clearly and completely described below in conjunction with the drawings of the specific embodiments of the present disclosure. The same figure marks in the drawings represent the same parts. It should be noted that the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the present disclosure belongs. The words "first", "second" and similar terms used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "a" do not necessarily indicate a quantity limitation. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0047] It should be noted that the term "rotationally fixed connection" as used herein means that the two parts cannot rotate relative to each other along the rotational axis, but does not restrict relative motion between the two parts along the rotational axis. Common methods for achieving rotationally fixed connections include keyway connections or non-circular shaft hole connections. Of course, fixed connections are also included within the scope of rotationally fixed connections, as when two parts are completely fixedly connected, relative rotation is also prohibited.

[0048] It should be noted that the term "fluid connection" as used herein refers to the ability for fluid exchange and flow between two components, and the fluid is sealed, preventing leakage from between the two components to the external environment. A fluid connection is not limited to the number of components between the two components, as long as fluid exchange can be achieved.

[0049] It should be noted that the “thermal contact” or “heat transfer connection” referred to in this disclosure means that heat can be transferred between two parts, for example, they are connected or contacted by direct contact or through a heat transfer medium.

[0050] Heat dissipation is a key concern for laptops, especially for high-performance laptops. When the laptop is running for extended periods or under high load, the hardware inside, such as the CPU, graphics card, and memory, generates significant heat, causing the laptop's internal temperature to rise. High temperatures can degrade the laptop's performance and even shorten the lifespan of these hardware components.

[0051] Whether it is a built-in cooling device or an external cooling bracket of a laptop computer, it is difficult to meet the cooling needs of a high-performance laptop computer, and it is easy to generate a lot of noise during cooling.

[0052] Therefore, there is a need for a notebook computer heat dissipation component that can achieve effective heat dissipation, improve the performance of the notebook computer, and extend the service life of the notebook computer. While achieving effective heat dissipation, it is quiet and easy to install.

[0053] The following describes a preferred embodiment of a notebook computer heat dissipation assembly according to the present disclosure in conjunction with the accompanying drawings. The present disclosure provides a notebook computer heat dissipation assembly having a hollow structured heat-conducting interface and a cooling circuit, which has excellent heat dissipation performance, low noise, and is easy to install.

[0054] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of protection of the present disclosure may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, without departing from the concept of the present disclosure, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0055] Figures 1 to 3 illustrate a laptop computer cooling assembly according to at least one embodiment of the present disclosure. For the sake of simplicity, some piping connections are omitted. Those skilled in the art will appreciate how to connect these components to form a fluid circuit. In this embodiment, the laptop computer cooling assembly includes a bracket body 1, a thermal interface component 2, a cooling device 3, a cooling circuit 4, a connecting pipe 7, and a connecting rod 9. The bracket body 1 is generally a trapezoidal polyhedron and includes a support surface 11 for supporting the laptop computer. Support surface 11 is angled with the horizontal plane to provide a comfortable typing and viewing experience for the user.

[0056] The thermal interface component 2 has a hollow structure and is configured to be in thermal contact with the heat sink fins (not shown) of the laptop computer 100. Heat sink fins are a common heat dissipation structure in laptop computers. These fins are thermally connected to the heat-generating components within the laptop computer and are exposed to the outside world through openings in the laptop computer to conduct heat to the environment. However, when the temperature of the heat-generating components within the laptop computer is very high, the heat sink fins cannot achieve effective heat dissipation through passive heat dissipation alone.

[0057] The thermal interface component 2 provided in the present disclosure is in direct thermal contact with the heat sink fins, and can directly conduct the heat of the heat sink fins to the cooling medium inside the thermal interface component 2 and then conduct it to the cooling device 3 through the cooling circuit 4.

[0058] The number of the heat-conducting interface components 2 can be one or more, and is adjusted according to the required heat dissipation performance. In this embodiment, multiple heat-conducting interface components 2 are shown.

[0059] In this embodiment, a cooling device 3 is disposed within the support body 1 and may be, for example, a semiconductor refrigeration plate. The cooling device 3 is in thermal contact with at least a portion of the cooling circuit 4. The cooling device 3 may include a cold end 31 and a hot end 32. For details, see the fluid circuit schematic diagram shown in FIG9 . For example, the cooling circuit 4 may include a heat exchange element 42 at the cold end 31, which is thermally connected to the cold end 31, as shown in FIG3 . The hot end 32 is in thermal contact with the heat sink 20.

[0060] The semiconductor refrigeration chip is a thermoelectric cooling device based on the Peltier effect. The Peltier effect refers to the fact that in a thermocouple formed by two materials with different electrical conductivities, when an electric current passes through the couple, heat absorption or release occurs at the contact point. This allows the semiconductor refrigeration chip to transfer heat from one side (cold end) to the other side (hot end) under the action of the electric field, thereby achieving a cooling effect. If the heat generated by the hot end 32 is dissipated in time, the cooling effect of the semiconductor refrigeration chip can be improved. Therefore, it is necessary to dissipate heat from the hot end 32, and the heat dissipation device 20 includes but is not limited to a fan heat dissipation component, a liquid cooling heat dissipation component or a heat sink. The present disclosure is not limited to this, and those skilled in the art can select a heat dissipation device commonly used in the field according to actual needs.

[0061] This disclosure exemplifies two optional heat dissipation devices. For example, in the embodiments shown in Figures 2 and 3, heat dissipation device 20 is a fan heat dissipation assembly, including heat sinks and a fan connected thereto. In the embodiment shown in Figure 8, heat dissipation device 20 may be a liquid cooling heat dissipation assembly, which shows a portion of the interface of the liquid cooling heat dissipation assembly. Alternatively, in embodiments not shown, heat dissipation device 20 may simply be a heat sink.

[0062] The cooling circuit 4 is configured to allow a cooling medium to flow therethrough. The cooling circuit 4 is fluidically connected to the hollow structure of the thermally conductive interface component 2, so that the cooling medium can flow in the hollow structure of the thermally conductive interface component 2 via the cooling circuit 4 to conduct heat within the thermally conductive interface component 2 to the cooling device 3 for cooling. The cooled cooling medium then returns to the thermally conductive interface component 2 via the cooling circuit 4. Multiple thermally conductive interface components 2 can be fluidically connected to the cooling circuit 4 in parallel.

[0063] Alternatively, the cooling medium may be a fluid with a high specific heat capacity, such as water, oil, ethylene glycol, or air. The cooling medium may also be a refrigerant, such as Freon, ammonia, propane, etc. In this embodiment, the cooling medium may be water.

[0064] Exemplarily, for an embodiment of multiple heat-conducting interface parts 2, the cooling circuit 4 may include a water separator 41, which may be a multi-way connector that is fluidically connected to the multiple heat-conducting interface parts 2 and the cooling device 3 to transport the cooling medium collected from the multiple heat-conducting interface parts 2 to the cooling device 3, and to distribute the cooled cooling medium recovered from the cooling device 3 to the multiple heat-conducting interface parts 2. The provision of the water separator 41 can simplify the pipe connection. As shown in Figures 3 and 4, two water separators 41 can be provided, each connected to the two interfaces of the heat exchanger 42. A fluid channel can be provided inside the heat exchanger 42 to fluidly connect the two interfaces to allow the cooling medium entering from one interface to flow out from the other interface.

[0065] Optionally, the cooling circuit 4 may further include a fluid pump 40 to drive the flow of the cooling medium in the cooling circuit 4. The fluid pump 40 is connected in series to the cooling circuit 40. The semiconductor cooling chip does not generate noise during operation, and the fluid pump 40 also generates relatively low noise during operation. Therefore, the laptop computer heat dissipation assembly proposed in the present disclosure is quiet, providing a better working and learning environment and improving concentration levels.

[0066] In this embodiment, the connecting pipe 7 connects the heat-conducting interface part 2 and the cooling circuit 4, and connects the heat-conducting interface part 2 to the cooling circuit 4 fluid. Figure 1 shows an exemplary connecting pipe 7. It should be noted that for each heat-conducting interface part 2, a connecting pipe 7 can be separately provided. A fluid interface 5 is provided on one side of the heat-conducting interface part 2, and the fluid interface 5 is used to connect the connecting pipe 7. It can be seen from Figures 1 and 3 that the fluid interface 5 can include two joints, and the corresponding connecting pipe 7 also has two nozzles corresponding to each other, so that the cooling medium can circulate in the hollow structure of the heat-conducting interface part 2.

[0067] 1 and 4 , the bracket body 1 may be provided with a guide rail 12, and the connecting rod 9 is movably provided in the guide rail 12 of the bracket body 1. The specific structure of the guide rail 12 and the different positions of the connecting rod 9 will be described in detail below with reference to the accompanying drawings.

[0068] Figure 4 shows another embodiment of a notebook computer heat dissipation assembly. Unlike the previous embodiment, the bracket body 1 of the embodiment shown in this disclosure is further provided with a baffle 13 at the bottom of the support surface 11 to prevent the notebook computer from sliding off the support surface 11.

[0069] The hollow thermal interface component 2 is a key component of the present disclosure and can be implemented in a variety of ways. The concept protected by the present disclosure is the use of the hollow thermal interface component 2 to conduct heat to the laptop's heat sink fins and dissipate heat through the cooling circuit 4. The following describes the thermal interface component 2 according to at least one embodiment of the present disclosure, with reference to Figures 5 to 7.

[0070] First, referring to Figures 5 to 7 , the thermal interface component 2 may include a main body 21 and at least one heat dissipation fin 22. To clearly illustrate the structure of the main body 21, Figure 5 cuts through the main body 21 along the first side surface S1 to reveal its internal structure. The main body 21 includes an inner cavity 211 and first and second side surfaces S1 and S2 that oppose each other along the longitudinal direction L. The inner cavity 211 is fluidically connected to the first and second side surfaces S1 and S2, respectively. The heat dissipation fin 22 extends from the second side surface S2 of the main body 21 along the longitudinal direction L.

[0071] As described above, the first side surface S1 is provided with a fluid interface 5 configured to be fluidically connected to the cooling circuit 4 .

[0072] The heat dissipation fin 22 includes a fluid channel 23 disposed therein. The fluid channel 23 is fluidically connected to the inner cavity 211 , and the heat dissipation fin 22 is configured to be in thermal contact with the heat dissipation fins of the laptop computer 100 .

[0073] The thermal interface component 2 is made of metal, and is preferably formed by metal 3D printing.

[0074] The thermal interface member 2 shown in this embodiment is fluidically connected to the cooling circuit 4 via hollow heat sink fins 22. It is conceivable that the thermal interface member 2 may also employ other hollow structures, such as a tubular hollow structure, and the heat sink fins 22 may not be limited to the shapes shown in the drawings of this disclosure, as long as they can achieve a heat conduction effect.

[0075] Furthermore, in order to better facilitate the formation of an internal fluid circuit of a hollow structure, the inner cavity 211 can be provided with a partition wall 6 that at least partially extends into the fluid channel 23, and the partition wall 6 divides the inner cavity 211 into a first cavity 212 and a second cavity 213 distributed along the transverse direction T, and the first cavity 212 and the second cavity 213 are connected in series to the cooling circuit 4.

[0076] Alternatively, the partition wall 6 may be curved, or the thermal interface component 2 may even lack a partition wall 6. For example, as shown in FIG19 , the thermal interface component 2 may not include a partition wall 6, and after the cooling medium enters the inner cavity 211 and the fluid channel 23, it can freely flow to achieve a heat exchange cycle.

[0077] Alternatively, the partition wall 6 may be provided only in the inner cavity 211 and not extend into the fluid channel 23 , as shown in FIG. 20 .

[0078] Alternatively, the partition wall may be provided in the fluid channel 23 instead of in the inner cavity 211. As shown in Figures 21A and 21B, the partition wall 6 extends parallel to the inner wall of the heat dissipation fin 22, dividing the fluid channel 23 into a first cavity 212 and a second cavity 213. The first cavity 212 and the second cavity 213 are connected in series to the cooling circuit 4.

[0079] Alternatively, the main body 21 can be integrally formed with a heat sink fin 22, such that the surface of the main body 21 and the surface of the heat sink fin 22 are in the same plane. Furthermore, the laptop computer heat sink assembly can include multiple parallelly arranged thermal interface components 2, with the gaps between the multiple thermal interface components 2 being configured to allow the heat sink fin of the laptop computer 100 to be plugged in between two adjacent heat sink fins 22. This arrangement facilitates the maintenance and replacement of the thermal interface components 2.

[0080] Furthermore, in order to facilitate the insertion of the heat dissipation fins, an inclined portion 221 is provided at one end of at least one heat dissipation fin 22 away from the main body 21 , and the thickness of the inclined portion 221 gradually decreases along the longitudinal direction L.

[0081] Furthermore, the thermal interface component 2 may include a plurality of heat dissipating fins 22 spaced apart from one another, with the gaps between the plurality of heat dissipating fins 22 being configured such that a heat dissipating fin of the laptop computer 100 can be inserted between two adjacent heat dissipating fins 22. Alternatively, the thermal interface component 2 may include only one heat dissipating fin 22, with the thickness of the heat dissipating fin 22 being configured such that it can be inserted between two adjacent heat dissipating fins of the laptop computer 100.

[0082] Optionally, the first chamber 212 and the second chamber 213 can be arranged in the following manner: the water separator 41 is fluidically connected to the first chamber 212, the second chamber 213 and the cooling device 3 respectively, so as to transport the cooling medium collected from the first chamber 212 of the multiple heat dissipating fins 22 to the cooling device 3, and distribute the cooled cooling medium recovered from the cooling device 3 to the second chamber 213 of the multiple heat dissipating fins 22.

[0083] Optionally, the thermal interface component 2 may be provided with a temperature sensor for detecting the temperature of the thermal interface component 2 or the heat sink fins. When the temperature of the thermal interface component 2 or the heat sink fins is detected to be higher than a set value, the cooling circuit 4 is activated, and the laptop cooling component begins operation. For example, when a laptop computer is restarted from sleep mode, the laptop cooling component may automatically start up.

[0084] Figure 9 shows a schematic diagram of a fluid circuit according to at least one embodiment of the present disclosure. In Figure 9, solid arrows represent cooling fluid with a higher temperature, and dashed arrows represent cooling fluid with a lower temperature.

[0085] Multiple thermally conductive interface components 2 in thermal contact with the heat sink fins absorb heat and conduct it to the cooling fluid. The higher temperature cooling fluid is collected in the water distributor 41 through the connecting pipe 7. The downstream of the water distributor 41 is connected to the fluid pump 40 as the driving source of the cooling circuit 4, and then transported to the cold end 31 of the cooling device 3. After being cooled by the cold end 31, it becomes a cooling fluid with a lower temperature, returns to the water distributor 41, and is then distributed to multiple thermally conductive interface components 2 through the connecting pipe 7, thereby forming a cooling circuit 4 circulation.

[0086] At the hot end 32 of the cooling device 3 , cooling can be performed by the heat sink 20 .

[0087] Figures 10 to 13 illustrate a connecting pipe 7, an intermediate housing 8, and a thermal interface member 2 according to at least one embodiment of the present disclosure. In this embodiment, the notebook computer cooling assembly may further include an intermediate housing 8 for supporting the connecting pipe 7 and the thermal interface member 2 and for connecting to the connecting rod 9.

[0088] As shown in Figures 10, 11, and 13, the intermediate housing 8 can include a straight segment 81 and an inclined segment 82 that is inclined relative to the straight segment 81. The straight segment 81 is provided with a groove 83 extending along its length. The connecting tube 7 and the thermal interface member 2 are accommodated in the groove 83 and can slide along the groove 83. To facilitate the user's insertion of the thermal interface member 2 into the heat sink fins, the thermal interface member 2 can also be provided with a protrusion 24. The connecting tube 7 can be guided out of the hole defined in the intermediate housing 8.

[0089] The inclined section 82 of the intermediate housing 8 may be provided with a non-circular through-hole 84. Accordingly, the connecting rod 9 has a cross-section that matches the through-hole 84 of the intermediate housing 8, so that the connecting rod 9 can pass through the intermediate housing 8 and be rotationally fixedly connected to the intermediate housing 8. Therefore, when the connecting rod 9 rotates or moves, the intermediate housing 8 and the thermal interface member 2 and connecting pipe 7 it carries can rotate or move together.

[0090] Figures 14 to 18 show a notebook computer heat dissipation assembly according to another embodiment of the present disclosure. The specific structure of the guide rail 12 and the different positions of the connecting rod 9 will be described below in conjunction with Figures 14 to 18 .

[0091] First, referring to Figures 14, 16, and 18, the guide rail 12 may include a first section 121 parallel to the support surface 11 and a second section 122 inclined downward relative to the first section 121. The connecting rod 9 can slide along the first section 121 and the second section 122 between an installed position and a retracted position. The first section 121 and the second section 122 of the guide rail 12 generally form a "7" shape.

[0092] Figures 14, 15, and 18 illustrate the installed position. In the installed position, the connecting rod 9 is located at a first end 911 of the first section 121, away from the second section 122. A height adjustment bolt 10 may be provided at the first end 911. The height adjustment bolt 10 is rotatable along a rotation axis A parallel to the connecting rod 9 and has multiple support planes perpendicular to the rotation axis A for supporting the ends of the connecting rod 9, each support plane having a different distance from the rotation axis A. Accordingly, the ends of the connecting rod 9 may also be configured to have planar structures 91, 92 that engage the support planes of the height adjustment bolt 10. Height adjustment bolts 10 may be provided at both ends of the connecting rod 9.

[0093] When in the installed position, the straight section 81 of the intermediate housing 8 is parallel to the support surface 11 of the bracket body 1, allowing the thermal interface 2 to be inserted parallel to the heat sink fins. The heat sink fins of different laptop models may have different heights. Therefore, to accommodate different laptop models, the height of the thermal interface 2 needs to be adjusted. In this embodiment, this can be achieved by rotating the height adjustment bolt 10.

[0094] Since the distance between each supporting plane of the height adjustment bolt 10 and the rotation axis A is different, the user can rotate the height adjustment bolt 10 to adjust the height of the appropriate thermal interface component 2 .

[0095] Figures 16, 17, and 18 illustrate the retracted position. In this position, the connecting rod 9 is located at the second end 921 of the second section 122, away from the first section 121. At this point, the intermediate housing 8 and the thermal interface component 2 and connecting tube 7 it carries rotate clockwise due to gravity, allowing the thermal interface component 2 to be completely accommodated within the bracket body 1, making it easy to store and the overall structure aesthetically pleasing and simple.

[0096] In addition to the preferred embodiments described above, the laptop computer heat dissipation assembly proposed in the present disclosure may also have multiple alternative embodiments. For example, the laptop computer heat dissipation assembly may not include the bracket body 1. In this case, the laptop computer can be placed directly on the desktop, and the laptop computer heat dissipation assembly (such as the thermal interface 2, the cooling device 3, and the cooling circuit 4) is directly arranged in an external manner near the laptop computer. For another example, the cooling device 3 may not use a semiconductor refrigeration plate, but may directly be a heat dissipation device 20 such as a fan heat dissipation assembly, a liquid cooling heat dissipation assembly, or a heat sink.

[0097] The present invention innovatively proposes a notebook computer heat dissipation assembly with a hollow structured heat-conducting interface and a cooling circuit. The structure and principle are different from those of traditional notebook computer heat dissipation brackets. It has excellent heat dissipation effect, low noise, and very high scalability.

[0098] While exemplary implementations of the laptop computer heat dissipation assembly proposed in the present disclosure have been described in detail with reference to preferred embodiments, those skilled in the art will appreciate that various modifications and variations may be made to the aforementioned specific embodiments without departing from the principles of the present disclosure. Furthermore, various combinations of the various technical features and structures proposed in various aspects of the present disclosure may be made without departing from the scope of protection of the present disclosure, which is determined by the appended claims.

Claims

1. A notebook computer heat dissipation component, characterized in that: include: A heat-conducting interface component (2) having a hollow structure, wherein the heat-conducting interface component (2) is configured to be in heat-conducting contact with a heat dissipation fin of a notebook computer (100); a cooling device (3); and A cooling circuit (4) is configured to allow a cooling medium to flow through it, the cooling circuit (4) is fluidly connected to the hollow structure of the heat-conducting interface component (2), and at least a portion of the cooling circuit (4) is in thermal contact with the cooling device (3) to conduct heat generated by the laptop computer (100) to the cooling device (3) via the cooling medium in the cooling circuit (4).

2. The notebook computer heat dissipation assembly according to claim 1, wherein: The heat-conducting interface component (2) comprises: A main body (21) comprising an inner cavity (211) and a first side surface (S1) and a second side surface (S2) opposite to each other in a longitudinal direction (L), wherein the inner cavity (211) is fluidically connected to the first side surface (S1) and the second side surface (S2), respectively, and the first side surface (S1) is provided with a fluid interface (5) configured to be fluidically connected to the cooling circuit (4); and At least one heat dissipation fin (22) extends from the second side surface (S2) of the main body (21) along the longitudinal direction (L), the at least one heat dissipation fin (22) includes a fluid channel (23) arranged inside, the fluid channel (23) is fluidically connected to the inner cavity (211), and the at least one heat dissipation fin (22) is configured to be in thermal contact with the heat dissipation fin of the laptop computer (100).

3. The notebook computer heat dissipation assembly according to claim 2, wherein: The inner cavity (211) is provided with a partition wall (6) for dividing the inner cavity (211) into a first cavity (212) and a second cavity (213) distributed along a transverse direction (T), wherein the first cavity (212) and the second cavity (213) are connected in series to the cooling circuit (4).

4. The notebook computer heat dissipation assembly according to claim 3, wherein: The partition wall (6) extends at least partially into the fluid channel (23).

5. The notebook computer heat dissipation assembly according to claim 2, wherein: A partition wall (6) is provided in the fluid channel (23) to divide the fluid channel (23) into a first chamber (212) and a second chamber (213); the first chamber (212) and the second chamber (213) are connected in series to the cooling circuit (4).

6. The notebook computer heat dissipation assembly according to claim 2, wherein: An inclined portion (221) is provided at one end of the at least one heat dissipation fin (22) away from the main body (21), and the thickness of the inclined portion (221) gradually decreases along the longitudinal direction (L).

7. The notebook computer heat dissipation assembly according to any one of claims 3 to 5, wherein: The heat-conducting interface component (2) comprises a plurality of heat-dissipating fins (22) spaced apart from each other, wherein the gaps between the plurality of heat-dissipating fins (22) are set so that the heat-dissipating fins of the notebook computer (100) can be plugged into between two adjacent heat-dissipating fins (22). The cooling circuit (4) includes a water separator (41), which is fluidically connected to the first cavity (212), the second cavity (213) and the cooling device (3) respectively, so as to transport the cooling medium collected from the first cavity (212) of the plurality of heat dissipating fins (22) to the cooling device (3), and distribute the cooled cooling medium recovered from the cooling device (3) to the second cavity (213) of the plurality of heat dissipating fins (22).

8. The notebook computer heat dissipation assembly according to any one of claims 1 to 6, wherein: Also includes: A support body (1) comprising a support surface (11) for supporting a laptop computer, wherein the cooling device (3) is arranged in the support body (1); a connecting pipe (7), the connecting pipe (7) connecting the heat-conducting interface component (2) and the cooling circuit (4), and fluidically connecting the heat-conducting interface component (2) and the cooling circuit (4); The intermediate housing (8) comprises a straight section (81) and an inclined section (82) inclined relative to the straight section (81); the straight section (81) is provided with a groove (83) extending along the length direction; the connecting pipe (7) and the heat-conducting interface member (2) are accommodated in the groove (83) and can slide along the groove (83); the inclined section (82) is provided with a non-circular through hole (84); as well as A connecting rod (9) is movably arranged in the bracket body (1), wherein the connecting rod (9) has a cross-section that matches the through hole (84) of the intermediate shell (8), and the connecting rod (9) passes through the intermediate shell (8) and is rotationally fixedly connected to the intermediate shell (8).

9. The notebook computer heat dissipation assembly according to claim 8, wherein: The bracket body (1) is provided with a guide rail (12), and the connecting rod (9) is movably arranged in the guide rail (12). The guide rail (12) comprises a first section (121) parallel to the support surface (11) and a second section (122) inclined downward relative to the first section (121); the connecting rod (9) is capable of sliding along the first section (121) and the second section (122) between an installed position and a retracted position. Wherein, in the installed position, the connecting rod (9) is located at a first end (911) of the first section (121) away from the second section (122), Wherein, in the retracted position, the connecting rod (9) is located at the second end (921) of the second section (122) away from the first section (121).

10. The notebook computer heat dissipation assembly according to claim 9, wherein: A height adjustment bolt (10) is provided at the first end portion (911), and the height adjustment bolt (10) is capable of rotating along a rotation axis (A) parallel to the connecting rod (9), and has a plurality of supporting planes perpendicular to the rotation axis (A) for supporting the end portion of the connecting rod (9), and each supporting plane has a different distance from the rotation axis (A).

11. The notebook computer heat dissipation assembly according to claim 1, wherein: The cooling circuit (4) further comprises a fluid pump (40) for driving the flow of the cooling medium in the cooling circuit (4). And wherein the cooling device (3) is a semiconductor refrigeration plate, comprising a cold end (31) and a hot end (32), the cold end (31) is in thermal contact with at least a portion of the cooling circuit (4), and the hot end (32) is in thermal contact with the heat dissipation device (20); Alternatively, the cooling device (3) is a heat dissipation device (20), Wherein, the heat dissipation device (20) is a fan heat dissipation component, a liquid cooling heat dissipation component or a heat sink.

12. The notebook computer heat dissipation assembly according to claim 1, wherein: The heat-conducting interface component (2) is provided with a temperature sensor, and when the temperature of the heat-conducting interface component (2) is higher than a set value, the cooling circuit (4) is started.

13. The notebook computer heat dissipation assembly according to any one of claims 2 to 5, wherein: The main body (21) and one of the heat dissipation fins (22) are formed as one body.

14. The notebook computer heat dissipation assembly according to claim 13, wherein: The notebook computer heat dissipation assembly comprises a plurality of heat-conducting interface components (2) arranged in parallel, and the gaps between the plurality of heat-conducting interface components (2) are set so that the heat dissipation fins of the notebook computer (100) can be plugged between two adjacent heat dissipation fins (22).

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