Raw material thermoelectric member capable of being three-dimensionally processed, three-dimensional thermoelectric member to which same is applied, and manufacturing method therefor

Abstract

A three-dimensional thermoelectric member manufactured by compression molding using a mold is disclosed. The three-dimensional thermoelectric member comprises a binder resin, a thermally conductive powder and an additive, is soft and self-adhesive at room temperature in correspondence to a raw material thermoelectric member, and holds a processed shape and then is pressed by an object to hold a deformed shape.

Description

A raw material thermoelectric element capable of three-dimensional processing, a three-dimensional thermoelectric element using the same, and a manufacturing method thereof

[0001] The present invention relates to a raw material thermoelectric member and a three-dimensional thermoelectric member using the same, and more particularly, to a raw material thermoelectric member suitable for economically and reliably manufacturing a thermoelectric member having a three-dimensional shape by compression molding using a mold, and to a three-dimensional thermoelectric member using the same.

[0002] As electronic and information and communication devices become increasingly miniaturized and integrated, they are increasingly exposed to heat, static electricity, and electromagnetic waves. In particular, semiconductor chips such as microprocessors and CPUs generate significant heat as their speeds increase and their capacity and integration levels increase.

[0003] Therefore, in order to quickly and in large quantities release heat generated from these semiconductor chips to the outside, various materials and structures of thermal conductive elements, such as solid thermal conductive silicone rubber pads or liquid thermal conductive silicone rubber, are being used.

[0004] These high-temperature thermally conductive silicone rubber pads are usually in the form of sheets with a uniform thickness and are mounted on the surface of a semiconductor chip to effectively transfer heat generated on the surface of the semiconductor chip to an opposing cold plate. However, they have difficulty contacting the side of the semiconductor chip, and thus have limitations in effectively transferring heat generated on the side to the cold plate.

[0005] Moreover, when two or more semiconductor chips with different heights are mounted on a single circuit board so that a three-dimensional outline is formed by the semiconductor chips and a single cooling plate covers all of the semiconductor chips having the three-dimensional outline, there is a disadvantage in that the cooling plate itself must be three-dimensionally processed to have different heights depending on the difference in the heights of the semiconductor chips, or solid thermally conductive silicone rubber pads with different heights must be applied to each.

[0006] Meanwhile, a liquid thermally conductive silicone rubber in the form of grease or gel is dispensed onto the surface of a semiconductor chip using a dispenser and then covered by a cooling plate to spread the liquid thermally conductive silicone rubber sideways, thereby transferring heat generated in the semiconductor chip to the cooling plate through the liquid thermally conductive silicone rubber.

[0007] Such liquid thermally conductive silicone rubber usually has relatively low hardness and viscosity, so it can spread laterally with a small external force, and can spread on the surface of a semiconductor chip with a small force. However, because it is supplied in liquid form, it has the disadvantage of being difficult to form with uniform dimensions and shape, especially on the side of a semiconductor chip.

[0008] In addition, liquid thermally conductive silicone rubber can be processed into a thermoelectric member having a three-dimensional shape by forcing it under pressure into a mold having a three-dimensional shape corresponding to a semiconductor chip, but since liquid thermally conductive silicone rubber has low hardness and stickiness due to viscosity, when the three-dimensionally processed thermoelectric member is taken out from the mold, the three-dimensional shape is easily damaged by force applied during taking it out, so there is a disadvantage in that it is difficult to provide a three-dimensional shape.

[0009] Moreover, when repairing electronic devices coated with liquid thermally conductive silicone rubber, the liquid thermally conductive silicone rubber has the disadvantage of being difficult to remove easily due to its low hardness and stickiness due to viscosity.

[0010] As another example to overcome such conventional technology, the heat transfer member of Korean Patent No. 1425785 by the applicant of the present invention is composed of a base sheet and a step correction sheet, and a liquid thermally conductive silicone rubber is cast on a release film, cured, and then a three-dimensional shape is formed by cutting with a blade and laminating.

[0011] According to these conventional technologies, since a three-dimensional shape is created through a cutting and laminating process, the number of processes increases and material loss may increase, and in cases where the base sheet and the step correction sheet are soft and self-adhesive so that they spread well with little force, there is a limit to providing a three-dimensional shape with a precise and diverse structure due to the tolerance of the base sheet and the step correction sheet and the difficulty of processing.

[0012] Meanwhile, when a conventional thermoelectric element is composed of a typical thermosetting silicone rubber, it does not soften or become soft due to the heat provided by the semiconductor chip, so there is a limit to optimal heat transfer, and when pressed by an object, the elastic restoring force of the thermosetting silicone rubber is transmitted to the object.

[0013] The purpose of the present invention is to provide a soft, self-adhesive raw material thermoelectric element having properties suitable for processing a three-dimensional thermoelectric element that can easily correspond to a three-dimensional contour formed by the surface and side surfaces of a heat source or by a plurality of heat sources.

[0014] Another object of the present invention is to provide a raw material thermoelectric member that is easily spread laterally and crushed in the thickness direction by a small force applied in the vertical direction when compression molded in a mold at room temperature, and is then easily extracted from the mold into a three-dimensional shape by compression molding.

[0015] Another object of the present invention is to provide a three-dimensional thermoelectric element having precise dimensions and shape that is well aligned with the heat source, is soft enough to be pressed and spread by a small force at room temperature, and can quickly transfer a large amount of heat generated from the side of the heat source.

[0016] Another object of the present invention is to provide a three-dimensional thermoelectric element having better thermal conductivity by heat provided from a heat source.

[0017] Another object of the present invention is to provide a three-dimensional thermoelectric member that is pressed and spread at room temperature by an external force and then maintains the shape in which it was spread and pressed at room temperature, thereby transmitting elastic restoring force to an object with a minimum.

[0018] Another object of the present invention is to provide a three-dimensional thermoelectric member that can be easily separated from a heat source during repair.

[0019] Another object of the present invention is to provide a method for reliably and economically manufacturing the above-mentioned raw material thermoelectric element and three-dimensional thermoelectric element.

[0020] According to one aspect of the present invention, a raw material thermoelectric member constituting a thermoelectric member interposed between an object including a heat generating source and a cooling source, wherein the raw material thermoelectric member comprises a binder resin, a thermally conductive powder, and an additive, the raw material thermoelectric member is soft and has self-adhesiveness, and can be processed into a three-dimensional shape provided by the object at room temperature, and when the raw material thermoelectric member is compressed vertically in a mold at room temperature, the raw material thermoelectric member spreads out laterally and is crushed in a thickness direction to be processed into a three-dimensional thermoelectric member having the three-dimensional shape, is provided.

[0021] Preferably, the binder resin is a thermoplastic resin or a thermoplastic rubber, and the additive includes a liquid plasticizer, so that when the mold compressively molds the raw material thermoelectric member, the liquid plasticizer contained in the raw material thermoelectric member is exposed to the outer surface of the raw material thermoelectric member, thereby improving the self-adhesiveness of the raw material thermoelectric member.

[0022] Preferably, the raw material thermoelectric member has a property of spreading laterally and collapsing in the thickness direction in response to the three-dimensional shape of the object when pressed vertically by the object at room temperature, and the raw material thermoelectric member maintains a solid state at room temperature, and can be softened and become soft by heat provided from the heat generating source and change phase.

[0023] Preferably, the raw material thermoelectric element may be a single body or a laminate formed by stacking two or more layers of individual thermoelectric sheets having a magnetic adhesive force corresponding to the raw material thermoelectric element and then pressing them together under pressure and self-adhesion by the magnetic adhesive force of the individual thermoelectric sheets.

[0024] Preferably, in the above raw material thermoelectric element, the thickness of the individual thermoelectric sheets is 0.05 mm to 0.3 mm, and the hardness and self-adhesiveness of the individual thermoelectric sheets may be such that the individual thermoelectric sheets are torn without being separated from each other along the boundary between the individual thermoelectric sheets by an external force.

[0025] Preferably, in the above raw material thermoelectric member, the individual thermoelectric sheets have thermal conductivity or electrical conductivity, and at least one of the individual thermoelectric sheets may include a carbon fiber having thermal conductivity oriented in the plane direction.

[0026] Preferably, a metal mesh or other thermal sheet may be further installed on the outer side or adjacent inner side of at least one surface of the above-mentioned raw material thermal element.

[0027] Preferably, the hardness of the raw material thermoelectric element is Shore 00 35 to 80, the thermal conductivity is 2 W / mK to 15 W / mK, and the raw material thermoelectric element can be stretched by 10% or more in the length or width direction.

[0028] Preferably, the raw material thermoelectric element is flat, has a thickness of 0.1 mm to 3 mm, and can be supplied in roll units.

[0029] According to another aspect of the present invention, there is provided a three-dimensional thermoelectric member interposed between an object including a heat source and a cooling source, wherein the three-dimensional thermoelectric member has a receiving portion formed on one side to receive an upper surface and a side surface of the heat source and has a three-dimensional shape corresponding to a lower surface of the cooling source on the other side, and wherein the three-dimensional thermoelectric member is formed by compression molding the raw material thermoelectric member by the mold, and the three-dimensional thermoelectric member is soft at room temperature and has self-adhesiveness corresponding to the raw material thermoelectric member, and maintains the processed shape at room temperature, and then spreads laterally and is deformed in a thickness direction by a pressing force of the object.

[0030] Preferably, the three-dimensional thermoelectric material can be deformed by spreading and collapsing, and then softened by heat provided from the heat source to become softer and change phase.

[0031] Preferably, the other side of the three-dimensional thermoelectric member is flat, and a cut line or cut mark communicating with the outside is formed in the receiving portion, so that air generated at the boundary surface in contact with the heat source can be removed.

[0032] Preferably, the hardness of the three-dimensional thermoelectric member is Shore 00 35 to 80, the thermal conductivity is 2 W / mK to 15 W / mK, and the three-dimensional thermoelectric member can be stretched by 10% or more in the length or width direction.

[0033] According to another aspect of the present invention, there is provided a method for manufacturing a three-dimensional thermoelectric member interposed between an object including a heat generating source and a cooling source, the method comprising the steps of: providing a raw material thermoelectric member, which is soft at room temperature and has self-adhesive properties, and has properties of spreading laterally and collapsing in a thickness direction by an external force applied in an up-and-down direction at room temperature, on a transfer support member; wherein the raw material thermoelectric member includes a binder resin, a thermally conductive powder, and an additive; and processing the raw material thermoelectric member, which is self-adhesive to the transfer support member by the self-adhesive properties, by compression molding the raw material thermoelectric member on the transfer support member with a mold to form a three-dimensional thermoelectric member having a receiving portion on one surface for receiving the heat generating source; And a step of extracting the three-dimensional thermoelectric member from the mold is included, wherein the three-dimensional thermoelectric member is soft at room temperature and has self-adhesiveness corresponding to the raw material, and maintains the processed shape and then maintains a shape deformed by pressing the object. A method for manufacturing a three-dimensional thermoelectric member is provided.

[0034] Preferably, a liquid slurry comprising the binder resin made of a thermoplastic resin or thermoplastic rubber dissolved in a solvent and the additives including a plasticizer and a bonding agent is cast, and heat is applied to dry and volatilize the solvent, so that an individual thermoelectric sheet formed can be provided as a part of the raw material thermoelectric member.

[0035] Preferably, the above raw material thermoelectric element can be provided by calendering a solid gum having the binder resin made of a thermoplastic resin or a thermoplastic rubber and the additives including a plasticizer and a binding agent.

[0036] Preferably, the raw material thermoelectric element may be formed as a single body, or may be formed as a laminate in which individual thermoelectric sheets corresponding to the raw material thermoelectric element are laminated in two or more layers and pressed against each other by pressure and self-adhesively formed by the self-adhesive force of the individual thermoelectric sheets.

[0037] Preferably, after the compression molding, scrap of the raw material thermoelectric member that is not included in the three-dimensional thermoelectric member is maintained in a state of being connected to the compression molded three-dimensional thermoelectric member, so that the extraction is easily performed, and the edge of the extracted three-dimensional thermoelectric member is cut with a converting blade and the scrap is removed to provide the three-dimensional thermoelectric member.

[0038] Preferably, the transfer support member is a flat sheet, and the other side of the three-dimensional thermoelectric member in contact with the transfer support member is flat, and the receiving portion can be formed on the opposite side of the other side.

[0039] Preferably, the raw material thermoelectric member may be provided in a continuous flat shape on the transfer support member, in a flat block shape spaced at regular intervals, or in a lump shape having no uniform thickness.

[0040] According to the present invention, a three-dimensional thermoelectric member corresponding to a heat source, for example, the surface and side surfaces of a semiconductor chip, or a three-dimensional outline formed by a plurality of semiconductor chips, is provided, so that heat generated from the surface and side surfaces of the semiconductor chip or the three-dimensional outline can be quickly and in large quantities transferred to a cooling member.

[0041] In addition, a raw material thermoelectric element that is soft and has self-adhesive properties at room temperature is compressed by a mold in a vertical direction toward the ground on a flat transfer support member, and is well spread and well crushed to easily form a three-dimensional shape. After compression molding, the raw material thermoelectric element is easily pulled out from the mold in a vertical direction toward the ground on the transfer support member to maintain the three-dimensional shape.

[0042] In addition, it has properties that allow it to be pressed and spread well at room temperature and maintain the shape that has been pressed and spread at room temperature, thereby providing less elastic restoring force to the object after being pressed by the object.

[0043] In addition, by applying thermoplastic resin or thermoplastic rubber, it is softened more softly by the heat provided from the heat source, so that heat transfer is improved, and by including paraffin as an additive, the phase is changed by the heat provided from the heat source, so that heat transfer is even better.

[0044] In addition, the three-dimensional thermoelectric element is solid and can be easily separated from the heat source during repair.

[0045] In addition, a raw material thermoelectric element can be formed by stacking a plurality of individual thermoelectric sheets having a thickness thinner than the thickness of the three-dimensional thermoelectric element, thereby providing more uniform and better thermal conductivity, and a three-dimensional thermoelectric element can be provided reliably and economically using various materials and manufacturing methods.

[0046] In addition, a soft, self-adhesive raw material thermoelectric element is continuously compressed and molded with a mold on a flat roll-shaped transfer support member and continuously cut with a blade, thereby providing a three-dimensional thermoelectric element reliably and economically.

[0047] Fig. 1(a) shows an example of a three-dimensional thermoelectric member using the raw material thermoelectric member of the present invention, and Figs. 1(b) and 1(c) each show a cross-section cut along line bb of Fig. 1(a).

[0048] Figures 2(a) and 2(b) show before and after a three-dimensional thermoelectric element is applied to a semiconductor chip, respectively.

[0049] Figure 3 shows an example of a raw material thermoelectric element of the present invention.

[0050] Figures 4(a) and 4(b) show different examples of raw material thermoelectric elements, respectively.

[0051] Figures 5(a) to 5(c) show a manufacturing device for a three-dimensional thermoelectric element and a supply form of raw thermoelectric elements.

[0052] Figures 6(a) to 6(c) each show the manufacturing process of a three-dimensional thermoelectric element.

[0053] It should be noted that the technical terms used in the present invention are used merely to describe specific embodiments and are not intended to limit the present invention. Furthermore, unless specifically defined otherwise herein, the technical terms used herein should be interpreted in the sense generally understood by those skilled in the art to which the present invention pertains, and should not be interpreted in an overly comprehensive or overly narrow sense. Furthermore, if a technical term used herein is incorrect and fails to accurately express the spirit of the present invention, it should be replaced with a technical term that can be correctly understood by those skilled in the art. Furthermore, general terms used herein should be interpreted according to their dictionary definitions or according to the context, and should not be interpreted in an overly narrow sense.

[0054] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0055] Fig. 1(a) shows a three-dimensional thermoelectric element according to an embodiment of the present invention, Figs. 1(b) and 1(c) show cross-sections cut along line bb of Fig. 1(a), respectively, and Figs. 2(a) and 2(b) show before and after application of the three-dimensional thermoelectric element, respectively.

[0056] The three-dimensional thermoelectric member (100) is basically soft and has self-adhesiveness and thermal conductivity, and is interposed between a cooling source such as a heat sink (20) having one flat surface and at least one heat generating source such as a semiconductor chip (10, 12) protrudingly mounted on a circuit board (30) to transfer and release heat generated from the heat generating source to the cooling source.

[0057] In addition, the three-dimensional thermoelectric element has electromagnetic wave absorption or electrical conductivity, and can absorb or shield electromagnetic waves flowing into or flowing out from the heat source.

[0058] In particular, the side and bottom surfaces of the receiving portion of the three-dimensional thermoelectric member are in thermal contact with the outer surface formed three-dimensionally, including the top and side surfaces of the semiconductor chip, which is a heat source, so that heat generated from all of the outer surfaces of the semiconductor chip can be quickly and in large quantities transferred, and if the three-dimensional thermoelectric member is electromagnetic wave absorbent or electrically conductive, it can efficiently absorb or shield electromagnetic waves generated from the semiconductor chip while simultaneously releasing heat.

[0059] In particular, the receiving portion of the three-dimensional thermoelectric element is structurally aligned with at least a portion of the side surface of the semiconductor chip and reliably makes thermal contact, thereby allowing the heat generated at the side surface of the semiconductor chip to be quickly and in large quantities released.

[0060] The three-dimensional thermoelectric member of the present invention is provided by processing a soft and spreadable raw material thermoelectric member that is self-adhered by self-adhesion on a flat transfer support member such as a release film or release paper by pressing it up and down with a mold having a three-dimensional cavity corresponding to the three-dimensional shape of a heat generating source, compressing it, and then taking it out from the mold while maintaining the three-dimensional shape.

[0061] In the three-dimensional thermoelectric member provided in this manner, the surface that contacts the transfer support member is formed flat and makes thermal contact with the cooling source, and the receiving portion formed by three-dimensional compression molding by a mold on the opposite surface covers the upper surface and side surface of the heat generating source and makes thermal contact.

[0062] Here, 'three-dimensional' means a shape having a three-dimensional volume including a Z direction where the thickness is not uniform, corresponding to a shape having two-dimensional surfaces in the X and Y directions, such as a sheet with uniform thickness, and a receiving portion of a three-dimensional thermoelectric member is formed in the Z direction corresponding to the thickness of a heat source, such as a semiconductor chip. For example, a three-dimensional shape means a shape with different thicknesses in the Z direction, such as the vertical direction.

[0063] Preferably, the three-dimensional thermoelectric material maintains a solid shape at room temperature, is soft and has self-adhesiveness, spreads well laterally and is deformed in the thickness direction by an external force applied in the vertical direction at room temperature, and maintains the deformed shape at room temperature.

[0064] Referring to Fig. 1(a), the three-dimensional thermoelectric member (100) is composed of a single body (110), and a square groove receiving portion (111, 112, 113) is formed on one side (101) of the body (110) to receive a semiconductor chip (10, 12).

[0065] In this embodiment, a structure in which three receiving portions are formed in a three-dimensional thermoelectric element is exemplified, but more than one receiving portion may be formed, and the receiving portion may not have a closed structure shape completely surrounded by a border, but may have a partially open shape in which part of the border is removed.

[0066] The receiving portions (111, 112, 113) are formed at various depths and are in thermal contact with the upper and side surfaces of the semiconductor chip, which is a heat source.

[0067] The depth of the receiving portion (111, 112, 113) is formed corresponding to the thickness of the semiconductor chip to which the three-dimensional thermoelectric member (100) is applied, and may be the same as or similar to the thickness of the semiconductor chip.

[0068] The surface of the three-dimensional thermoelectric member (100) that comes into contact with the cooling source is a flat surface, enabling thermal contact over a wide area. As described below, since the raw material thermoelectric member is self-adhered to a flat transfer support member and compression-molded by a mold to produce a structure as shown in Fig. 1(a), the lower surface of the three-dimensional thermoelectric member (100) becomes flat like the surface of the flat transfer support member, thereby making wide contact with the opposing cooling source and achieving good heat transfer.

[0069] Referring to Fig. 1(b), the receiving portions (112, 113) of the three-dimensional thermoelectric member (100) are formed at different depths to receive semiconductor chips (10, 12) having different thicknesses, and the bottom surfaces (112a, 113a) of the receiving portions (112, 113) may have different thicknesses.

[0070] On the other hand, as shown in Fig. 1(c), the receiving portions (112, 113) of the three-dimensional thermoelectric member (100) are formed at different depths to receive semiconductor chips (10, 12) having different thicknesses, and the bottom surfaces (112a, 113a) of the receiving portions (112, 113) can have the same thickness.

[0071] According to this structure, by making the thickness of the bottom surface of the receiving portion uniform, heat transfer between different semiconductor chips can be made uniform.

[0072] In this embodiment, the receiving portion (111, 112, 113) is in the form of a square groove, but is not limited thereto and may have a different shape, and may be formed by removing the bottom and penetrating in the thickness direction to accommodate a semiconductor chip or other object, if necessary.

[0073] Preferably, the bottom surface of the receiving portion (111, 112, 113) is in contact with the surface of the semiconductor chip, and in order to remove air generated at the contacting interface, a small-sized cut line or cut mark that penetrates the bottom surface of the receiving portion (111, 112, 113) and communicates with the outside can be formed by a blade.

[0074] The incision line or incision mark can be formed during the compression molding process, or can be formed using a knife or pin in a separate process after the product is removed from the mold after compression molding.

[0075] Figures 2(a) and 2(b) show an example in which a three-dimensional thermoelectric element (100) is pressed and used between two semiconductor chips (10, 12) and one heat sink (20).

[0076] Semiconductor chips (10, 12) having different heights are each inserted into the receiving portions (112, 113) of the three-dimensional thermoelectric member (100), and the upper and side surfaces of the semiconductor chips (10, 12) are in close thermal contact with the bottom surface (112a, 113a) and the inner surface (112b, 113b) of the receiving portions (112, 113), and the opposite surface (102) of the three-dimensional thermoelectric member (100) is flat and is in thermal contact with the flat heat sink (20).

[0077] According to this structure, the heat transfer area increases by an area corresponding to the inner surface (112b, 113b) of the receiving portion (112, 113) of the three-dimensional thermoelectric member (100) in thermal contact with the side surface of the semiconductor chip (10, 12), so that heat can be released quickly and in large quantities.

[0078] That is, the heat generated on the side of the semiconductor chip (10, 12) can be released quickly and in large quantities by directly contacting the inner surface (112b, 113b) of the receiving portion (112, 113).

[0079] Here, when the heat sink (20) presses the three-dimensional thermoelectric member (100) while the three-dimensional thermoelectric member (100) covers the semiconductor chip (10, 12), the bottom surface (112a, 113a) of the receiving portion (112, 113) can be brought into closer thermal contact with the top surface of the semiconductor chip (10, 12) due to the pressure applied.

[0080] In addition, when the height of the semiconductor chip (10, 12) mounted on the circuit board is lower than the height of the inner surface (112b, 113b) of the receiving portion (112, 113), the inner surface (112b, 113b) of the receiving portion (112, 113) can be brought into closer thermal contact with the side surface of the semiconductor chip (10, 12) by the pressure applied when pressing the three-dimensional thermoelectric member (100) as an object.

[0081] The raw material thermoelectric member of the present invention comprises a binder resin, a thermally conductive powder, and an additive.

[0082] As is well known, binder resins are commonly classified into various materials such as thermoset resins, thermoplastic resins, thermoplastic rubbers, and thermoplastic rubbers, or are sometimes referred to interchangeably. Thermoplastic resins have the property of melting again with heat, while thermoset resins do not melt again with heat, and resins and rubbers are distinguished as being separated or not depending on the molecular structure, molecular weight, or elasticity.

[0083] Although binder resin is referred to by various terms, the name or material composition of the binder resin is not particularly limited as long as it has the technical characteristics of the present invention and achieves the purpose of the invention.

[0084] In order to manufacture the three-dimensional thermoelectric member of the present invention, the raw material thermoelectric member must be soft and have self-adhesive properties, maintain a solid state at room temperature, and be easily deformed by spreading laterally and crushing in the thickness direction by an external force applied in the vertical direction at room temperature during compression molding, and have properties of maintaining the deformed shape at room temperature.

[0085] Preferably, the binder resin of the raw material thermoelectric element providing the three-dimensional thermoelectric element may be a thermoplastic resin that softens and becomes soft by heat, and more preferably, a thermoplastic rubber that softens and becomes soft by heat.

[0086] Additionally, optionally, it may have a phase change characteristic in which the phase changes due to heat provided from a heat source.

[0087] Since the raw material thermoelectric element maintains a solid state at room temperature and has stickiness due to self-adhesion, the three-dimensional thermoelectric element provided by compression molding also has stickiness due to corresponding self-adhesion.

[0088] Here, the meaning that the raw material thermoelectric element has stickiness due to magnetic adhesion at room temperature includes both cases where a part of the raw material thermoelectric element has no magnetic adhesion or has different magnetic adhesion compared to another part.

[0089] For example, even if some of the stickiness due to self-adhesion on the surface of the raw thermoelectric element is lost during the manufacturing process of providing the raw thermoelectric element, the stickiness due to self-adhesion can be restored by the liquid plasticizer and tackifier contained inside the raw thermoelectric element through subsequent compression molding, thereby resulting in the thermoelectric element having a similar self-adhesion overall.

[0090] Therefore, in the following, the raw material thermoelectric element, including these cases, is defined as having stickiness due to self-adhesion at room temperature.

[0091] The hardness, self-adhesion, and weight of the raw material thermoelectric element may be such that the raw material thermoelectric element is not immediately separated when the raw material thermoelectric element is self-adhesive to an object, such as a transfer support element, a heating source, or a cooling source, and then turned 180 degrees in the opposite direction at room temperature. This includes cases where the area of ​​the bottom surface is small compared to the overall volume of the raw material thermoelectric element, or where a large amount of heavy thermally conductive ceramic powder is included to increase thermal conductivity, and where the raw material thermoelectric element may fall off from the transfer support element due to its own weight when turned over.

[0092] For example, it is desirable that the hardness, self-adhesiveness, and weight of the raw material thermoelectric element be such that the three-dimensional thermoelectric element can be easily taken out of the mold after the raw material thermoelectric element is compression-molded, as described below.

[0093] When the raw material thermoelectric element is compressed into a mold at room temperature, it spreads out laterally and is crushed in the thickness direction, so that a three-dimensional thermoelectric element can be processed economically and reliably. Preferably, the raw material thermoelectric element can have a spreadability that, when pulled laterally, stretches and spreads out by, for example, 10% or more than its original length or width at room temperature, and it stretches and spreads out better as the temperature increases.

[0094] In terms of hardness, the raw material thermoelectric element maintains a solid state at room temperature, and when the raw material thermoelectric element is compression-molded into a mold having a three-dimensional cavity at room temperature and then taken out of the mold, the three-dimensional shape formed by compression molding is maintained at room temperature, and when a cooling source is subsequently applied to deform the three-dimensional thermoelectric element, the hardness can be such that the deformed shape is maintained at room temperature.

[0095] The hardness of the raw material thermoelectric element may be approximately Shore 00 35 to 80 at room temperature, preferably Shore 00 45 to 70, but may be slightly smaller or larger than this in consideration of the dimensions or thermal conductivity of the three-dimensional thermoelectric element.

[0096] If the hardness of the raw material thermoelectric element is lower than this, it is too soft and difficult to economically process into a three-dimensional shape with precise dimensions and shape, and it is difficult to easily separate the compression-molded three-dimensional thermoelectric element from the semiconductor chip. On the other hand, if the hardness is higher than this, a great deal of force is required for compression-molding, and it is difficult for the object to press the compression-molded three-dimensional thermoelectric element with little force.

[0097] The thermal conductivity of the raw material thermoelectric element can be preferably 2 W / mK to 15 W / mK when measured according to ASTM D5470. If the thermal conductivity is greater than this, the hardness of the compression-molded three-dimensional thermoelectric element is too high, so there is a disadvantage in that it spreads little with a small force and requires a lot of pressing force.

[0098] As described above, the raw material thermoelectric member of the present invention is composed of a binder resin, a thermally conductive powder, and an additive. When the binder resin is a thermoplastic resin or a thermoplastic rubber, a plasticizer, a tackifier, a bonding agent, and the like may be further included as additives in the binder resin, thereby increasing the self-adhesiveness of the raw material thermoelectric member and making it softer.

[0099] The plasticizer may preferably be a liquid plasticizer, in which case the liquid plasticizer remaining in the raw material thermoelectric element may serve to make the raw material thermoelectric element more sticky and to include more thermally conductive powder.

[0100] Plasticizers are well-known materials that improve processability by making thermoplastic rubber more flexible and softer when heat is applied. Examples include environmentally friendly plasticizers such as dibenzoate or citrate.

[0101] By further including paraffin as an additive in the raw material thermoelectric element to further have a phase change characteristic that becomes softer due to the heat of the heating source, and as a result, the three-dimensional thermoelectric element has a phase change characteristic, so that the three-dimensional thermoelectric element maintains a solid first state at room temperature when interposed between a cooling source and a heating source, and when the temperature of the three-dimensional thermoelectric element rises due to the heat generated from the heating source, it changes to a second state that is softer than the first state, thereby improving adhesion to the heating source and increasing the contact area, so that heat transfer can be improved.

[0102] In other words, the area of ​​contact between the three-dimensional thermoelectric member processed from the raw material thermoelectric member having phase change characteristics and the contact surface of the semiconductor chip (10, 12) or the heat sink (20) increases due to the heat provided by the semiconductor chip (10, 12) and the adhesion improves, resulting in a lower thermal resistance with respect to the semiconductor chip (10, 12) or the heat sink (20). Therefore, it is natural that the three-dimensional thermoelectric member having phase change conducts heat better than the three-dimensional thermoelectric member having little or no phase change.

[0103] Preferably, the temperature at which the phase change begins may be the temperature provided by the heat source, for example, 40°C or higher.

[0104] When paraffin is included as an additive in the raw material thermoelectric element, the weight-wise mixing ratio of paraffin may be 1 to 15 wt% depending on the phase change start temperature of the three-dimensional thermoelectric element, but is not limited thereto.

[0105] The raw material thermoelectric element may be composed of, for example, 5 to 20 wt% of thermoplastic rubber, 40 to 90 wt% of thermally conductive powder, and 5 to 40 wt% of other additives such as plasticizers and tackifiers, based on the weight of the raw material thermoelectric element, depending on thermal conductivity, hardness, spreadability, and self-adhesiveness, but is not limited thereto.

[0106] Thermoplastic rubber is a material that softens and becomes softer by heat provided from a heat source, such as isobutylene-isoprene rubber (IIR), styrene butadiene rubber (SBR), styrene ethylene butylene styrene (SEBS), or a mixed material thereof, and may include a portion of a thermoplastic elastomer (TPE) such as a styrene block copolymer (SBC) to improve mechanical strength or to adjust the softening temperature, or may be, but is not limited to, a thermoplastic acrylic resin or thermoplastic acrylic rubber that is easy to impart self-adhesiveness.

[0107] When a 3D thermoelectric element is applied to a heat source, such as a semiconductor chip, it is preferable that the material of the raw thermoelectric element be a rubber material that does not generate siloxane gas so that the gas generated from the 3D thermoelectric element does not have a negative effect on the semiconductor chip.

[0108] Thermally conductive powder is a material provided to enable the raw material thermal element to conduct heat well, and may be an electrically insulating ceramic powder such as alumina, boron, or aluminum nitride, a metal alloy powder including a soft magnetic metal, copper powder, electrically conductive graphite, or a mixture thereof.

[0109] In addition to thermally conductive powder, graphite fibers, which have a length much larger than the diameter and thus a significantly different aspect ratio, can be added to further impart thermal conductivity to the raw material thermoelectric element.

[0110] Although the above raw material thermoelectric element is an example in which a single raw material thermoelectric element is applied, the raw material thermoelectric element of the present invention is not limited thereto, and different thermally conductive materials may be applied to a single raw material.

[0111] Figure 3 shows an example of a raw material thermoelectric element of the present invention.

[0112] Basically, the raw material thermoelectric element (50) can be composed of a single raw material, which is basically soft and has magnetic adhesion and thermal conductivity, and can optionally have electromagnetic wave absorption or electrical conductivity. For this purpose, a powder having electromagnetic wave absorption or an electrically conductive powder can be added to the thermally conductive powder.

[0113] In addition, the raw material thermoelectric member (50) may be configured as a laminate in which individual thermoelectric sheets (61) corresponding to two or more raw material thermoelectric members of the same type or different types as described below are laminated. In this case, the raw material thermoelectric members each have thermal conductivity, and one of the two may have electromagnetic wave absorption or electrical conductivity.

[0114] Additionally, at least one of the raw material thermoelectric elements of the laminate may be a raw material thermoelectric element having phase change characteristics.

[0115] Referring to Fig. 3, a metal mesh (51) may be installed on the bottom surface of the raw material thermoelectric element (50), or a metal mesh (52) may be embedded inside adjacent to the bottom surface.

[0116] The metal mesh (51, 52) can be included in the raw material thermoelectric member and processed into a three-dimensional thermoelectric member by compression molding together with the raw material thermoelectric member using a mold.

[0117] Here, in the case where the raw material thermoelectric element (50) is a laminate in which individual thermoelectric sheets (61) are laminated, it goes without saying that the laminate can be provided after a metal mesh (52) is installed on at least one of the individual thermoelectric sheets (61).

[0118] When a metal mesh (51) is installed on the bottom surface, during the process of compressing and molding the raw material thermoelectric member, a part of the raw material thermoelectric member can protrude through the grid holes of the metal mesh (51) so that the metal mesh (51) can be relatively stably fixed.

[0119] Additionally, another thermoelectric element (53) can be laminated on the opposite side of the raw material thermoelectric element (50).

[0120] Other thermoelectric materials (53) may include metal foil, metal mesh, graphite, or other thermoelectric sheets, and if electrically conductive, may shield electromagnetic waves.

[0121] When a thermoelectric sheet without self-adhesion is laminated with another thermoelectric element (53), when vacuum-picking up another thermoelectric element (53) part of a three-dimensional thermoelectric element processed with a raw thermoelectric element, it is easy to handle without stickiness and does not stick to the nozzle.

[0122] Preferably, the other thermoelectric member (53) can serve as a mechanical reinforcement member by increasing the mechanical strength by making the hardness greater than that of the raw thermoelectric member at the same thickness.

[0123] Preferably, the thickness of the other thermoelectric member (53) may be thinner than the average thickness of the raw material thermoelectric member, and the thermal conductivity of the other thermoelectric member (53) may be greater than the thermal conductivity of the raw material thermoelectric member.

[0124] Preferably, the other thermoelectric element (53) is less spread out and less crushed by the force provided by the object than the raw thermoelectric element (50).

[0125] Another thermoelectric element (53) can be manufactured by continuously attaching or casting on a raw thermoelectric element in the form of a roll to form a laminate, and then pressing the laminate from top to bottom during a compression molding process using a mold to bond it.

[0126] The three-dimensional thermoelectric element manufactured in this way can have different thermal and mechanical properties depending on the other thermoelectric element applied.

[0127] Figure 4 shows another example of a raw material thermoelectric element of the present invention.

[0128] Referring to Fig. 4(a), individual thermoelectric sheets (61) composed of a material corresponding to a raw material thermoelectric element are laminated in multiple layers in the thickness direction, and are pressed against each other by pressure and self-adhesively formed by the self-adhesive force provided by the individual thermoelectric sheets (61) to form a laminate of raw material thermoelectric elements (60).

[0129] In the raw material thermoelectric member (60) forming the laminate, the hardness and self-adhesiveness of the individual thermoelectric sheets (61) may be such that the individual thermoelectric sheets (61) are torn without being separated from each other along the boundary between the individual thermoelectric sheets (61) by an external force.

[0130] The individual thermoelectric sheet (61) has properties such as maintaining a solid state at room temperature, being soft and having self-adhesiveness, and being easily deformed by spreading sideways and crushing in the thickness direction by an external force applied in the vertical direction at room temperature during compression molding, and maintaining the deformed shape at room temperature.

[0131] Preferably, the thickness of the individual thermal sheets (61) may be 0.05 mm to 0.3 mm. If the thickness of the individual thermal sheets (61) is thinner than 0.05 mm, the number of laminates becomes too large to create a laminate of the desired thickness, and if the casting material that provides the individual thermal sheets (61) is a liquid slurry, the viscosity is low, making it difficult to provide a thickness of 0.3 mm or more.

[0132] Here, if the thickness of the individual thermal sheet (61) is reduced, a more uniform raw material thermal element (60) with high thermal conductivity can be provided, and as a result, a uniform three-dimensional thermal element (100) with high thermal conductivity can be provided.

[0133] The individual thermal sheet (61) includes thermoplastic rubber and thermally conductive powder, and may further include a plasticizer and a tackifier as additives.

[0134] Here, in the process of manufacturing an individual thermoelectric sheet (61) with a slurry corresponding to the raw material thermoelectric member (60), the solvent contained in the slurry is evaporated and dried, so that the upper surface of the individual thermoelectric sheet (61) exposed to the outside may have little or no magnetic adhesion, but the lower surface where the raw material thermoelectric member (60) comes into contact with the transfer support member has a greater magnetic adhesion than the upper surface, so that it can stably self-adhere on the transfer support member.

[0135] As shown in Fig. 4(b), in addition to the thermal conductive powder on the individual thermal sheet (71), carbon fibers are oriented in the plane direction of the individual thermal sheet (71) indicated by the arrow.

[0136] Individual thermoelectric sheets (71) are laminated in the thickness direction to form a laminate, and are cut vertically along the cutting line indicated by the dotted line (72) to form a laminate (73) to be used as a raw material thermoelectric member.

[0137] Next, the cut laminate (73) is rotated 90° so that the carbon fibers oriented in the plane direction of the individual thermoelectric sheets (71) are aligned in the direction in which they will be compression-molded into a mold, i.e., in the Z direction, thereby forming a raw material thermoelectric member (70).

[0138] According to this structure, the carbon fibers are aligned in the height direction of the three-dimensional thermoelectric member manufactured by compression molding the raw material thermoelectric member (70), so there is an advantage that the heat conduction between objects is greatly increased by the carbon fibers. However, in order to provide the thickness of the three-dimensional shape, a large number of individual thermoelectric sheets (71) must be laminated and the laminated body must be cut in the vertical direction, so the manufacturing process is complicated and automation is difficult, so there is a disadvantage that the manufacturing cost increases.

[0139] Accordingly, the cut laminate (73) can be provided as a raw material thermoelectric member and manufactured by compression molding into a three-dimensional thermoelectric member. In this case, since there is no cutting process, manufacturing is simple and the manufacturing cost is low, and during compression molding, some of the carbon fibers oriented in the plane direction can be oriented in the thickness direction, so that thermal conductivity can be partially increased.

[0140] The above individual thermal sheets can be manufactured and provided in various ways.

[0141] First, a liquid slurry containing a volatile solvent such as toluene or alcohol, a thermoplastic rubber, and a thermally conductive powder is cast on a support member to a certain thickness, and then the solvent is volatilized by heat and dried to manufacture individual thermal sheets that are soft, self-adhesive, and spreadable, and the individual thermal sheets are laminated to manufacture a raw material thermal member.

[0142] Here, the thermoplastic rubber can be provided by dissolving it in a solvent to facilitate casting in a thin thickness, and individual thermoelectric sheets are manufactured by continuously casting them in a constant thickness to ensure good productivity and uniformity.

[0143] Second, individual thermal sheets can be manufactured by calendering solid gum containing thermoplastic rubber and thermally conductive powder on a support member.

[0144] In this case, there is an advantage in that it is easy to provide a thicker thickness than the first case, and there is an advantage in that one individual thermal sheet itself can be provided as a raw material thermal element, or individual thermal sheets can be laminated to a minimum, but there is a limit to reliably and economically providing uniform and high thermal conductivity compared to the manufacturing method by casting.

[0145] The first and second individual thermoelectric sheets corresponding to the raw material thermoelectric element are laminated in multiple layers, and are brought into close contact with each other by continuous pressure from a roller, and are self-adhesive to each other by the self-adhesive force provided by the individual thermoelectric sheets, so that a laminate of the raw material thermoelectric element can be provided.

[0146] Figures 5(a) to 5(c) show a manufacturing device for a three-dimensional thermoelectric element and a supply form of a raw thermoelectric element, and Figures 6(a) to 6(c) show a manufacturing process for a three-dimensional thermoelectric element, respectively.

[0147] As shown in Fig. 5(a), a liquid slurry containing thermoplastic rubber, thermally conductive powder, and additives dissolved in a volatile solvent is continuously discharged in a certain amount onto a transfer support member (40) that is continuously supplied by a roll by a casting machine (81).

[0148] The discharged liquid slurry is made to have a uniform thickness by a doctor blade (82) or the like, and as it passes through a drying device (83), the solvent is dried and volatilized by heat to form a raw material thermoelectric element (50).

[0149] When a liquid plasticizer is included as an additive, the liquid plasticizer may also partially dry and evaporate, and the self-adhesiveness of the surface and back of the raw material thermoelectric element (50) exposed to the outside may be different.

[0150] The amount of plasticizer included as an additive in the raw material thermoelectric member (55) decreases as it goes through a subsequent drying process or compression molding process, so the amount of plasticizer remaining in the three-dimensional thermoelectric member (100) decreases, and therefore, a large amount of plasticizer can be included in the raw material thermoelectric member (55).

[0151] Although the raw material thermoelectric element manufactured by the casting method is easy to manufacture, it has a disadvantage in that it is difficult to provide a thickness greater than a certain level due to the low viscosity of the liquid slurry caused by the solvent, etc. In this case, a raw material thermoelectric element (50) of a desired thickness can be provided by stacking a plurality of raw material thermoelectric elements of thin thickness.

[0152] On the other hand, a thermoplastic rubber, a thermally conductive powder, and an additive that do not contain a volatile solvent or contain a small amount of a solvent are sequentially or suitably mixed to make a relatively high viscosity solid gum that can be calendered, and then the solid gum is placed between two rolls and continuously calendered on a transfer support member to provide a raw material thermoelectric member (50) in the form of a roll having a uniform thickness.

[0153] In this case, there is an advantage in that the gum does not contain a solvent or contains a small amount of solvent, so there is no need for a drying process to remove the solvent, or it is more convenient than removing it by a calender, so a raw material thermoelectric element can be manufactured in an environmentally friendly manner.

[0154] The manufacturing method of calendaring using a solid gum has the advantage of being able to provide a thicker raw material thermoelectric member than the manufacturing method of casting using a solvent, but in order to provide a raw material thermoelectric member with high thermal conductivity, a large amount of high-strength thermally conductive ceramic powder such as alumina powder is mixed in, so the viscosity of the gum is high, and the life of the screw of the extruder is shortened.

[0155] In addition, if the magnetic adhesiveness of the raw material thermoelectric element is high, it is difficult to manufacture due to stickiness.

[0156] The raw material thermoelectric element can be supplied in various forms. As shown in Fig. 5(b), the raw material thermoelectric element (50) can be continuously supplied as a roll on a transfer support member (40) in the form of a sheet having a uniform thickness.

[0157] Afterwards, the raw material thermoelectric element can be cut into sheets having a certain length.

[0158] As shown in Fig. 5(c), a block-shaped raw material thermoelectric member (55) having a flat thickness spaced at regular intervals on a transfer support member (40) may be provided, or a lump-shaped raw material thermoelectric member having a dimension that does not have a uniform thickness spaced at regular intervals may be provided.

[0159] A block-shaped raw material thermoelectric member is provided by cutting a raw material thermoelectric member provided by casting or calendaring with a blade in a preset pattern and removing a portion thereof to provide a predetermined interval, and a lump-shaped raw material thermoelectric member can be provided by sequentially dispensing the raw material thermoelectric member with a dispenser.

[0160] Providing block-shaped raw material thermoelectric members (55) spaced apart at regular intervals is done in consideration of the spreading of the raw material thermoelectric members (55) when compression-molding the raw material thermoelectric members (55) with a mold, and the three-dimensional thermoelectric members compression-molded by spacing out at regular intervals can have more precise dimensions and shapes. That is, if block-shaped raw material thermoelectric members (55) are continuously supplied without spacing out, the raw material thermoelectric members (55) to be compression-molded with a mold are repeatedly pushed out, so it is inconvenient to economically provide three-dimensional thermoelectric members having precise dimensions and shapes.

[0161] In this case, the production yield can be increased by minimizing the occurrence of waste from the raw material thermoelectric member (55) or increasing the amount that can be recycled, but since the raw material thermoelectric member (55) is provided individually, there is a disadvantage in that it is difficult to take out the raw material thermoelectric member (55) extruded into a mold from the mold.

[0162] In addition, there is an advantage in that the amount of raw material can be minimized when it is provided in lumps only to the necessary areas by dispensing, etc. on the transfer support member (40), but even in this case, since the raw material thermoelectric member (55) is provided individually, there is a disadvantage in that it is difficult to take out the raw material thermoelectric member (55) extruded into the mold from the mold.

[0163] As shown in Fig. 6(a), the raw material thermoelectric material (50) is continuously supplied as a roll onto the transfer support material (40) in the form of a sheet with a uniform thickness.

[0164] The raw material thermoelectric member (50) has stickiness due to self-adhesion, and is self-adhesive on the transfer support member (40) due to this stickiness.

[0165] The transfer support member (40) may be a polymer film or paper having a flat surface and a release treatment on at least one side, and the raw material thermoelectric member (50) may be placed on the release treatment side of the transfer support member (40).

[0166] Additionally, the transfer support member (40) may be composed of a flat metal sheet or a thermally conductive material including graphite, and as described below, the transfer support member (40) may constitute a part of a three-dimensional thermoelectric member (100).

[0167] Next, when a compression mold (84) having a cavity having an internal space corresponding to a three-dimensional shape formed in a mold portion (85) is lowered and pressurized in the vertical direction on a raw material thermoelectric member (50) on a transfer support member (40), the raw material thermoelectric member (50) is spread laterally by the compression mold (84) on the transfer support member (40) and crushed in the thickness direction, thereby creating a three-dimensional thermoelectric member (100) having a receiving portion (111) corresponding to the three-dimensional shape of the cavity of the compression mold (84).

[0168] Here, the transfer support member (40) and the raw material thermoelectric member (50) are provided in a horizontal direction with respect to the ground, as indicated by the arrow, and the mold (84) compressively forms the raw material thermoelectric member (50) by pressing the raw material thermoelectric member (50) from top to bottom in the vertical direction.

[0169] Since compression molding by a compression mold (84) is performed on a transfer support member (40), the transfer support member (40) acts as a support for compression molding.

[0170] The inner surface including the cavity of the compression mold (84) is smoothly coated with a material that is good at releasing, such as Teflon or DLC (Diamond-Like Carbon), so that the raw material thermoelectric member (50) can be compressed and molded by the mold (84), and the processed three-dimensional thermoelectric member can be easily taken out from the mold (84).

[0171] The shape of the cavity of the mold (84) corresponds to the shape of the three-dimensional thermoelectric member to be manufactured, and is formed so that it can be easily extracted from the cavity with little force. For example, since the cavity has a three-dimensional shape with different heights in the vertical direction, and the mold (84) moves up and down with respect to the ground, the cavity has a structure in which the lower part facing the ground is open, and preferably, the open entrance edge can have a curve.

[0172] As shown in Fig. 6(b), the raw material thermoelectric element (50) is continuously supplied in a roll state, is compression-molded using a compression-molding mold (84), and then is taken out from the mold (84).

[0173] At this time, since the three-dimensional thermoelectric member compression-molded by the mold (84) is continuously connected to the supplied raw material thermoelectric member (50), the three-dimensional thermoelectric member can be easily taken out of the mold.

[0174] Specifically, since the scrap (51) of the raw material thermoelectric member (50) that is not included in the three-dimensional thermoelectric member (100) after compression molding and is rolled up remains connected to the compression molded three-dimensional thermoelectric member (100), the three-dimensional thermoelectric member (100) can be easily taken out from the mold (84).

[0175] In addition, since the structurally transfer support member (40) and the raw material thermoelectric member (50) are provided horizontally with respect to the ground, and the mold (84) moves up and down, if the raw material thermoelectric member (50) contains a lot of heavy thermally conductive ceramic powder, the weight of the compression-molded three-dimensional thermoelectric member (100) also becomes heavy, so that it can be easily pulled out downward from the mold (84).

[0176] In addition, when the raw material thermoelectric member (50) is self-adhesive on the transfer support member (40), the raw material thermoelectric member (50) is pressed onto the transfer support member (40) by compression molding using the mold (84), so that the self-adhesive force further increases, so that the three-dimensional thermoelectric member (100) can be easily taken out from the mold (84).

[0177] Next, the three-dimensional thermoelectric member (100) is easily extracted from the mold (84), and then the edge of the three-dimensional thermoelectric member (100) is cut with a converting blade to provide the three-dimensional thermoelectric member continuously and economically.

[0178] To help understanding, Fig. 6(c) shows a state in which scrap (51) of the raw material thermoelectric member (50) on the transfer support member (40) has been removed.

[0179] The raw material thermoelectric element (50) may be provided at room temperature before being pressed by the compression mold (84) or when being pressed by the compression mold (84), but if the temperature is higher than this, it can be pressed with less force and the amount of plasticizer and tackifier that come out when pressed is greater, so that the self-adhesiveness is greater.

[0180] As shown in Fig. 5(c), when the raw material thermoelectric member (55) is provided in the form of a block or lump, when the three-dimensional thermoelectric member (100) is formed and discharged from the mold section (85) on the transfer support member (40), a burr is formed on the edge of the three-dimensional thermoelectric member (100), which can be cut using a separately formed blade cutter.

[0181] Of course, the burr can be cut and removed simultaneously with the compression molding by a cutting means integrally formed in the compression mold (84).

[0182] In addition, as described above, when the transfer support member (40) is made of a thermally conductive material including metal or graphite, the transfer support member (40) may be cut together during converting to form a part of the three-dimensional thermoelectric member (100).

[0183] As described above, a three-dimensional thermoelectric member that is continuously provided on a transfer support member (40) by compression molding and drawing out the raw material thermoelectric member (50) with a mold can be easily separated from the transfer support member that has undergone a mold release process to provide a three-dimensional thermoelectric member.

[0184] Here, it goes without saying that the final product can be constructed without separating the 3D thermoelectric member from the transfer support member, and then the final customer can use the 3D thermoelectric member by interposing it between the heating source and the cooling source after removing the transfer support member.

[0185] If necessary, the transfer support member (40) on which the three-dimensional thermoelectric member (100) is placed can be wound around a winding roll (82), or the transfer support member (40) can be cut into a sheet shape and provided without being wound around a winding roll (82).

[0186] According to the above embodiment, the three-dimensional thermoelectric member is formed in a three-dimensional shape by forming a flat state on the lower surface by a flat transfer support member (40), while having a receiving portion on the opposite surface.

[0187] In the above description, it was mainly described that the binder resin was a thermoplastic rubber, but the binder resin of the present invention may include a thermoplastic resin that is soft at room temperature, has self-adhesiveness, and has spreadability that spreads well by a small force of an object at room temperature.

[0188] In this way, the three-dimensional thermoelectric member of the present invention can be provided by various materials and manufacturing processes that can implement the purpose of the present invention.

[0189] While the above description focuses on specific embodiments of the present invention, it is readily apparent that various modifications can be made by those skilled in the art. Therefore, the scope of the present invention should not be construed as limited to the above-described embodiments, but rather should be interpreted in accordance with the claims set forth below.

Claims

1. A raw material thermoelectric element that constitutes a thermoelectric element interposed between an object including a heating source and a cooling source, The above raw material thermoelectric material comprises a binder resin, a thermally conductive powder, and an additive. The above raw material thermoelectric element is soft and has self-adhesiveness, and can be processed into a three-dimensional shape provided by the object at room temperature. A raw material thermoelectric member characterized in that when the above raw material thermoelectric member is compressed vertically in a mold at room temperature, it spreads laterally and is crushed in the thickness direction to be processed into a three-dimensional thermoelectric member having the three-dimensional shape.

2. In claim 1, The above binder resin is a thermoplastic resin or thermoplastic rubber, A raw material thermoelectric member characterized in that the additive includes a liquid plasticizer, and when the mold compressively molds the raw material thermoelectric member, the liquid plasticizer contained in the raw material thermoelectric member is exposed to the outer surface of the raw material thermoelectric member, thereby improving the self-adhesiveness of the raw material thermoelectric member.

3. In claim 1, The above raw material thermoelectric member has a property of spreading laterally and squishing in the thickness direction in response to the three-dimensional shape of the object when pressed vertically by the object at room temperature. The above raw material thermoelectric element is characterized in that it maintains a solid state at room temperature and becomes soft and changes phase by heat provided from the heat generating source.

4. In claim 1, A raw material thermoelectric element characterized in that the above raw material thermoelectric element is a single body or a laminate formed by stacking two or more layers of individual thermoelectric sheets having a magnetic adhesive force corresponding to the raw material thermoelectric element and being pressed against each other by pressure and being self-adhesive by the magnetic adhesive force of the individual thermoelectric sheets.

5. In claim 4, In the above raw material thermoelectric element, the thickness of the individual thermoelectric sheets is 0.05 mm to 0.3 mm, A raw material thermoelectric element characterized in that the hardness and self-adhesiveness of the individual thermoelectric sheets are such that the individual thermoelectric sheets are torn without being separated from each other along the boundary between the individual thermoelectric sheets by an external force.

6. In claim 4, A raw material thermoelectric member characterized in that in the above raw material thermoelectric member, the individual thermoelectric sheets have thermal conductivity or electrical conductivity, and at least one of the individual thermoelectric sheets includes a carbon fiber having thermal conductivity oriented in the plane direction.

7. In claim 1, A raw material thermoelectric element characterized in that a metal mesh or other thermoelectric sheet is further installed on the outer side or adjacent inner side of at least one surface of the raw material thermoelectric element.

8. In claim 1, A raw material thermoelectric element characterized in that the hardness of the above raw material thermoelectric element is Shore 00 35 to 80, the thermal conductivity is 2 W / mK to 15 W / mK, and the raw material thermoelectric element is elongated by 10% or more in the length or width direction.

9. In claim 1, A raw material thermoelectric element characterized in that the above raw material thermoelectric element is flat, has a thickness of 0.1 mm to 3 mm, and is supplied in roll units.

10. A three-dimensional thermoelectric element interposed between an object including a heating source and a cooling source, The above three-dimensional thermoelectric member has a three-dimensional shape in which a receiving portion is formed on one side to receive the upper surface and side surface of the heat generating source and corresponds to the lower surface of the cooling source on the other side. The above three-dimensional thermoelectric member is formed by compression molding the raw material thermoelectric member of claim 1 using the mold, The above three-dimensional thermoelectric member is characterized in that it is soft at room temperature and has self-adhesiveness corresponding to the above raw material thermoelectric member, and maintains the processed shape at room temperature, and then spreads laterally and is deformed in a thickness direction by the pressing force of the object.

11. In claim 10, The above three-dimensional thermoelectric element is characterized in that the three-dimensional thermoelectric element is deformed by spreading and collapsing, and then softened by heat provided from the heat source to become softer and change phase.

12. In claim 10, The other side of the above three-dimensional thermoelectric element is flat, A three-dimensional thermoelectric element characterized in that a cut line or cut mark communicating with the outside is formed in the above-mentioned receiving portion, so that air generated at the boundary surface in contact with the heat source is removed.

13. In claim 10, A three-dimensional thermoelectric member having a hardness of Shore 00 35 to 80, a thermal conductivity of 2 W / mK to 15 W / mK, and characterized in that the three-dimensional thermoelectric member is elongated by 10% or more in the length or width direction.

14. A method for manufacturing a three-dimensional thermoelectric member interposed between an object including a heating source and a cooling source, A step of providing a raw material thermoelectric material having a property of being soft and having self-adhesiveness at room temperature and of being able to spread laterally and be crushed in the thickness direction by an external force applied in the vertical direction at room temperature on a transfer support material; Here, the raw material thermoelectric material includes a binder resin, a thermally conductive powder, and an additive, A step of processing a three-dimensional thermoelectric member having a receiving portion for receiving the heat source on one side by compressing the raw material thermoelectric member self-adhered to the transfer support member by the self-adhesive force into a mold on the transfer support member; and A step of extracting the above three-dimensional thermoelectric member from the mold is included. A method for manufacturing a three-dimensional thermoelectric member, characterized in that the three-dimensional thermoelectric member is soft at room temperature and has self-adhesiveness corresponding to the raw material, and maintains the processed shape and then maintains a shape deformed by pressing the object.

15. In claim 14, A method for manufacturing a three-dimensional thermoelectric member, characterized in that a liquid slurry containing the binder resin made of a thermoplastic resin or thermoplastic rubber dissolved in a solvent and the additives including a plasticizer and a bonding agent is cast, and the individual thermoelectric sheets formed by applying heat to dry and volatilize the solvent are provided as part of the raw material thermoelectric member.

16. In claim 14, The above raw material thermoelectric element is, A method for manufacturing a three-dimensional thermoelectric member, characterized in that it is provided by calendering a solid gum having the above binder resin made of a thermoplastic resin or a thermoplastic rubber and the above additives including a plasticizer and a binding agent.

17. In claim 14, A method for manufacturing a three-dimensional thermoelectric member, characterized in that the above-mentioned raw material thermoelectric member is formed as a single body, or is formed as a laminate in which individual thermoelectric sheets corresponding to the above-mentioned raw material thermoelectric member are laminated in two or more layers and pressed against each other by pressure and self-adhesively formed by the self-adhesive force of the individual thermoelectric sheets.

18. In claim 14, After the compression molding, the scrap of the raw material thermoelectric member that is not included in the three-dimensional thermoelectric member is maintained in a state of being connected to the compression molded three-dimensional thermoelectric member, so that the extraction is easily achieved. A method for manufacturing a three-dimensional thermoelectric member, characterized in that the edge of the extracted three-dimensional thermoelectric member is cut with a converting blade and the scrap is removed to provide a three-dimensional thermoelectric member.

19. In claim 14, The above-mentioned transfer support member is a flat sheet, A method for manufacturing a three-dimensional thermoelectric member, characterized in that the other surface of the three-dimensional thermoelectric member in contact with the transfer support member is flat and the receiving portion is formed on the opposite surface of the other surface.

20. In claim 14, A method for manufacturing a three-dimensional thermoelectric member, characterized in that the above-mentioned raw material thermoelectric member is provided in a continuous flat shape on the transfer support member, in a flat block shape spaced at regular intervals, or in a lump shape having an uneven thickness.

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