Method for manufacturing device

Abstract

A method for manufacturing a device according to the present invention comprises: a step 1 for forming a plurality of elements on an element substrate in a laminate including a support substrate, an adhesion layer, and the element substrate, and obtaining a laminate substrate in which the support substrate, the adhesion layer, the element substrate, and an element member including the plurality of elements are laminated in the stated order; a step 2 for implementing a first process in which the support substrate, the adhesion layer, and the element member are cut in an edge region of the laminate substrate, and a second process in which continuous or intermittent notches that reach the adhesion layer are provided penetrating through the element substrate in a region where the elements are not present in the laminate substrate to divide the plurality of elements; a step 3 for providing a protective layer on the element member of the laminate substrate; a step 4 for separating a laminated member including the element member and the protective layer through use of mechanical peeling between the adhesion layer and the element member; and a step 5 for peeling the protective layer from the element member in the laminated member to obtain an individualized device for each element from the element member.

Description

Device manufacturing methods

[0001] The present invention relates to a method for manufacturing a device.

[0002] Currently, electronic devices include solar cells (PV), liquid crystal panels (LCDs), organic light-emitting diode (OLED) panels, and communication modules. Furthermore, devices include receiving sensors that detect electromagnetic waves, X-rays, ultraviolet rays, visible light, infrared rays, and other light. In addition, there are various electronic devices that detect acceleration, sound, contact, and the like. A method for manufacturing an electronic device has been proposed (Patent Document 1).

[0003] Patent Document 1 discloses a method for manufacturing an electronic device using a laminate. The laminate includes, in this order, a support substrate having hydroxy groups on its surface, the support substrate being a glass plate or a silicon wafer; a silicone resin layer having hydroxy groups; and a substrate. The substrate is a polyimide resin substrate or a laminate substrate having at least one polyimide resin substrate and at least one gas barrier film. In this laminate, the peel strength between the silicone resin layer and the substrate is greater than the peel strength between the support substrate and the silicone resin layer. The method for manufacturing an electronic device described in Patent Document 1 more specifically includes a member-forming step of forming an electronic device member on the surface of the substrate of the laminate to obtain a laminate with electronic device members; and a separation step of removing the support substrate and the silicone resin layer-containing support substrate from the laminate with electronic device members to obtain an electronic device having the substrate and electronic device members.

[0004] International Publication No. 2019 / 142750

[0005] In Patent Document 1, when forming electronic device components on a laminate substrate, the edge of the laminate comes into contact with a resin solution (e.g., resist solution) or inorganic material used in the manufacture of the electronic device, resulting in the formation of a film that spans the edge of the support substrate, the edge of the silicone resin layer, and the edge of the substrate. This film makes mechanical peeling between the substrate and the silicone resin layer difficult, resulting in difficulty in manufacturing the electronic device. Furthermore, substrates for devices such as electronic devices are becoming thinner. Thinner substrates are more susceptible to damage, making it difficult to singulate devices formed on the substrate after peeling between the substrate and the silicone resin layer. Furthermore, singulating devices before peeling between the substrate and the silicone resin layer and then peeling between the substrate and the silicone resin layer reduces production efficiency because the substrate must be peeled from the silicone resin layer for each individual device. Furthermore, thinner substrates are even more difficult because they are more susceptible to damage. When substrates are thinned in this way, it is difficult to efficiently manufacture singulated devices, and currently, there is no effective method for manufacturing devices. The present invention aims to provide a device manufacturing method that can produce singulated devices even when the substrate is thinned.

[0006] As a result of extensive investigations, the present inventors have found that the above-mentioned problems can be solved by the following configuration: (1) A method for manufacturing a device, comprising: step 1 of forming a plurality of elements on an element substrate in a laminate including a support substrate, an adhesion layer, and an element substrate, thereby obtaining a laminated substrate in which the support substrate, the adhesion layer, and an element member including the element substrate and a plurality of elements are laminated in this order; step 2 of performing a first process of cutting the support substrate, the adhesion layer, and the element member in an edge region of the laminated substrate, and a second process of providing continuous or intermittent cuts that penetrate the element substrate and reach the adhesion layer in an element-free region of the laminated substrate, thereby separating the plurality of elements; step 3 of providing a protective layer on the element member of the laminated substrate; step 4 of separating the laminated member including the element member and the protective layer by mechanical peeling between the adhesion layer and the element member; and step 5 of peeling the protective layer from the element member in the laminated member to obtain individual devices each consisting of an element from the element member.

[0007] (2) The method for manufacturing a device according to (1), further comprising, before step 1, a step of reducing the thickness of the glass substrate in a laminated base material including a support substrate, an adhesion layer, and a glass substrate to obtain a laminate including a support substrate, an adhesion layer, and an element substrate. (3) The method for manufacturing a device according to (1), further comprising, before step 1, a step of reducing the thicknesses of the first glass substrate and the second glass substrate in a laminated base material including a first glass substrate, an adhesion layer, and a second glass substrate to obtain a laminate including a support substrate, an adhesion layer, and an element substrate, wherein the thickness of the support substrate is greater than the thickness of the element substrate. (4) The method for manufacturing a device according to any one of (1) to (3), wherein, in step 2, the incisions are formed by laser irradiation. (5) The method for manufacturing a device according to any one of (1) to (4), wherein the thickness of the element substrate is 250 μm or less. (6) The method for manufacturing a device according to any one of (1) to (5), wherein the adhesion layer contains a silicone resin. (7) The method for manufacturing a device according to any one of (1) to (6), wherein the first treatment and the second treatment are simultaneously performed by laser irradiation in step 2. (8) The method for manufacturing a device according to any one of (1) to (7), further comprising, between step 4 and step 5, a step of performing a treatment to reduce the adhesive strength between the protective layer and the element member.

[0008] According to the present invention, it is possible to provide a device manufacturing method that can manufacture individualized devices even when the substrate is thinned.

[0009] FIG. 1 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view showing one step of an example of a method for manufacturing a device according to an embodiment of the present invention. FIG. 8 is a schematic plan view showing one example of an arrangement of elements according to an embodiment of the present invention. FIG. 9 is a schematic cross-sectional view showing a first example of a method for manufacturing a laminate used in the method for manufacturing a device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view showing a second example of a method for manufacturing a laminate used in the method for manufacturing a device according to an embodiment of the present invention.

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are merely illustrative for explaining the present invention, and the present invention is not limited to the following embodiments. Various modifications and substitutions can be made to the following embodiments without departing from the scope of the present invention. Hereinafter, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits.

[0011] The device manufacturing method of the present invention is characterized by the following steps: Step 1: forming a plurality of elements on an element substrate in a laminate including a support substrate, an adhesion layer, and an element substrate, thereby obtaining a laminated substrate in which the support substrate, the adhesion layer, the element substrate, and an element member including a plurality of elements are laminated in this order; Step 2: performing a first process of cutting the support substrate, the adhesion layer, and the element member at the edge region of the laminated substrate, and a second process of providing continuous or intermittent cuts that penetrate the element substrate and reach the adhesion layer in an element-free region of the laminated substrate, thereby separating the plurality of elements; Step 3: providing a protective layer on the element member of the laminated substrate; Step 4: separating the laminated member including the element member and the protective layer by mechanical peeling between the adhesion layer and the element member; and Step 5: peeling the protective layer from the laminated member to obtain individual devices each consisting of an element from the element member. As a result, even if a resin solution (e.g., resist solution) or inorganic material used in forming the elements contacts the edge surface of the laminate when forming multiple elements on the element substrate, forming a film across the edge surfaces of the support substrate, the adhesion layer, and the element substrate, the film can be removed by cutting the support substrate, the adhesion layer, and the element members at the edge region of the laminate substrate. This allows for unhindered mechanical peeling between the adhesion layer and the element members, achieving the desired effect. Furthermore, element substrates in devices are becoming thinner. Thin element substrates are prone to damage, making it difficult to separate elements formed on the element substrate after peeling them from the adhesion layer. Separating elements before peeling them from the adhesion layer and then peeling them from the adhesion layer reduces production efficiency because the adhesion layer must be peeled off for each individual element. Thin element substrates are also more prone to damage, making them even more difficult. However, by dividing multiple elements in areas of the laminated substrate where no elements are present by providing continuous or intermittent cuts that penetrate the element substrate and reach the adhesive layer, the elements can be separated into individual elements regardless of the thickness of the element substrate, and individualized devices can be efficiently manufactured without having to peel off the adhesive layer for each individual element.

[0012] 1 to 9 are schematic cross-sectional views showing an example of a device manufacturing method according to an embodiment of the present invention in the order of steps. FIG. 10 is a schematic plan view showing an example of an element arrangement according to an embodiment of the present invention. In the device manufacturing method according to this embodiment, a laminate 15 including a support substrate 10, an adhesion layer 12, and an element substrate 14 shown in FIG. 1 is prepared. In the laminate 15, the adhesion layer 12 is disposed on the surface 10a of the support substrate 10, and the element substrate 14 is disposed on the surface 12a of the adhesion layer 12, and the support substrate 10, the adhesion layer 12, and the element substrate 14 are laminated in a stacking direction Ds.

[0013] Next, as shown in Fig. 2, a plurality of elements 16 are formed on the element substrate 14 in the laminate 15. This results in a laminated substrate 18 in which the support substrate 10, the adhesive layer 12, and an element member 17 including the element substrate 14 and a plurality of elements 16 are laminated in this order (step 1). The element member 17 has a plurality of elements 16 arranged on the surface 14a of the element substrate 14. For example, as shown in Fig. 10, the laminated substrate 18 has a plurality of elements 16 arranged two-dimensionally at intervals on the surface 14a of the element substrate 14. The cross section shown in Fig. 2 corresponds to the cross section taken along line A-A in Fig. 10.

[0014] Next, as shown in FIG. 3 , a first process is performed in which the support substrate 10, the adhesive layer 12, and the element member 17 are cut along the stacking direction Ds in the edge region 18d of the laminated substrate 18. A second process is performed in which continuous or intermittent incisions 19b are made in the region 18b of the laminated substrate 18 where no elements 16 are present, penetrating the element substrate 14 along the stacking direction Ds and reaching the adhesive layer 12 to separate the multiple elements 16 (step 2). In step 2, in the first process described above, incisions 19a shown in FIG. 3 are made along the first incision lines Lf shown in FIG. 10 . The incisions 19a are continuous or intermittent and penetrate the element substrate 14 to the support substrate 10, fully cutting the support substrate 10, the adhesive layer 12, and the element member 17. The edge region 18d outside the first incision lines Lf shown in FIG. 10 is the cut portion. The edge region 18d outside the first incision lines Lf is removed as unnecessary portion. As a result, a new end surface 18e shown in FIG. 4 is formed on the laminated substrate 18.

[0015] In step 2, in the second process described above, the incisions 19b shown in FIG. 3 are formed along the second incision lines Lh shown in FIG. 10. The second incision lines Lh are set in regions 18b in the laminate substrate 18 where no elements 16 are present. The incisions 19b are continuous or intermittent and penetrate the element substrate 14 to the adhesion layer 12, and are half-cuts that do not cut the support substrate 10. The incisions 19b separate one element substrate 14 into multiple substrates 14d, and the element substrate 14 is divided with the elements 16 provided on each substrate 14d. For example, as shown in FIG. 3, one element 16 is disposed on one substrate 14d obtained by separating the element substrate 14.

[0016] The above-mentioned incisions 19a and incisions 19b can be formed by, for example, laser irradiation or blade dicing. The above-mentioned "continuous incisions 19a" refers to a state in which the incisions 19a are formed without interruptions along the first incision line Lf. The above-mentioned "intermittent incisions 19a" refers to a state in which the incisions 19a are formed along the first incision line Lf with regions where the incisions 19a are not formed being provided at predetermined intervals. The above-mentioned "continuous incisions 19b" refers to a state in which the incisions 19b are formed without interruptions along the second incision line Lh. The above-mentioned "intermittent incisions 19b" refers to a state in which the incisions 19b are formed along the second incision line Lh with regions where the incisions 19b are not formed being provided at predetermined intervals.

[0017] Next, as shown in FIG. 4 , a protective layer 20 for protecting the element members 17 is provided on the element members 17 of the laminated substrate 18 (step 3). The protective layer 20 is attached to the element members 17 of the laminated substrate 18 using a known laminator, more specifically, to the surface 14a of the element substrate 14, covering the plurality of elements 16. The protective layer 20 can also be formed by applying a protective layer precursor liquid to the element members 17 and then curing it by ultraviolet irradiation or heat treatment. A configuration including the element members 17 and the protective layer 20 is called a laminated member 24. Next, as shown in FIG. 5 , an adsorption pad 22 is adsorbed to the surface 20a of the protective layer 20 using, for example, a vacuum. Note that the adsorption pad 22 is not limited to a vacuum-assisted adsorption pad, and an electrostatic chuck may also be used.

[0018] Next, as shown in FIG. 6 , with the suction pad 22 adsorbed to the surface 20a of the protective layer 20, mechanical peeling is performed between the adhesion layer 12 and the element member 17 to separate the laminated member 24 including the element member 17 and the protective layer 20 (step 4). In step 4, the adhesion layer 12 and the element member 17 are mechanically peeled using the surface 12a of the adhesion layer 12 as the peeling interface, separating the laminated member 24 and the support substrate 10. A known peeling device is used for mechanical peeling between the adhesion layer 12 and the element member 17. Here, examples of mechanical peeling include bending the support substrate 10 or the element substrate 14 to peel the element substrate 14 from the adhesion layer 12. Other examples include peeling methods that apply physical force (such as bending) to the interface between the element substrate 14 and the adhesion layer 12. In this case, peeling can also be performed by pressing a scraper against the edge of the element substrate 14 to apply shear force (physical force) to the interface between the element substrate 14 and the adhesion layer 12. In addition, in the case of mechanical peeling, for example, a blade may be inserted into the adhesive layer 12 to provide a peeling starting point in the adhesive layer 12 .

[0019] Next, for example, suction by the suction pad 22 is stopped, and the suction pad 22 is removed from the surface 20a of the protective layer 20 as shown in Fig. 7. Next, as shown in Fig. 8, the protective layer 20 is peeled off from the element members 17 in the laminated member 24. When the protective layer 20 is peeled off from the element members 17 in the laminated member 24, one element substrate 14 is separated into multiple substrates 14d by the notches 19b, and as shown in Fig. 9, a device 26 is obtained in which each element 16 is singulated from the element member 17 (step 5). The device 26 has a configuration in which, for example, one element 16 is provided on one substrate 14d obtained by separating the element substrate 14.

[0020] Furthermore, the device manufacturing method preferably further includes a step of performing a treatment to reduce the adhesion between the protective layer 20 and the element component 17 between the above-described steps 4 and 5. More specifically, as shown in FIG. 8 , when peeling the protective layer 20 from the element component 17 in the laminated member 24, if the adhesiveness of the protective layer 20 decreases within a specific temperature range, a cooling treatment or a heating treatment is performed according to the characteristics of the protective layer 20 as the treatment to reduce the adhesion. If the adhesiveness of the protective layer 20 decreases due to ultraviolet light, an ultraviolet light exposure treatment is performed as the treatment to reduce the adhesion. This reduces the adhesion between the protective layer 20 and the element component 17, allowing the protective layer 20 to be easily peeled from the surface 14 a of the element substrate 14.

[0021] In a device manufacturing method, when elements 16 are formed on an element substrate 14 as shown in FIG. 2 , a resin solution (e.g., resist solution) or inorganic material used to form the elements 16 comes into contact with the end surface 14c of the element substrate 14, the end surface 12c of the adhesion layer 12, and the end surface 10c of the support substrate 10, resulting in the formation of a film (not shown) on the laminated substrate 18 across the end surface 14c of the element substrate 14, the end surface 12c of the adhesion layer 12, and the end surface 10c of the support substrate 10. However, by forming a notch 19a as shown in FIG. 3 in the first process, the edge region 18d of the laminated substrate 18 is removed as an unnecessary portion. As a result, even if the film is formed on the laminated substrate 18, the film is removed, and therefore does not interfere with mechanical peeling between the adhesion layer 12 and the element component 17 (step 4), which separates the laminated component 24 including the element component 17 and the protective layer 20, as shown in FIG. 6 .

[0022] In the device manufacturing method, in step 2, a first process is performed in which the support substrate 10, the adhesion layer 12, and the element member 17 are cut at an edge region 18d of the laminated substrate 18, and a second process is performed in which incisions 19b are formed through the element substrate 14 and reaching the adhesion layer 12 in an area of ​​the laminated substrate 18 where no elements 16 are present, thereby dividing the plurality of elements 16. Before mechanically peeling the adhesion layer 12 from the element substrate 14, the elements 16 are divided, a protective layer 20 is provided, and the mechanical peeling is performed. By peeling off the protective layer 20, the divided plurality of elements 16 are individually separated, resulting in a plurality of singulated devices 26. After the element substrate 14 is singulated by the incisions 19b and the protective layer 20 is provided in the state where the plurality of elements 16 are separated, the adhesion layer is mechanically peeled off and the protective layer 20 is peeled off to obtain a plurality of devices 26. Because the singulated element substrates 14 are not handled individually, a plurality of devices 26 can be obtained even when the element substrate 14 is as thin as about 250 μm. For this reason, although it is difficult to separate the elements 16 formed on the element substrate 14 after peeling between the element substrate 14 and the adhesion layer 12, such a step is unnecessary. Furthermore, separating the elements 16 before peeling between the element substrate 14 and the adhesion layer 12 and then peeling between the element substrate 14 and the adhesion layer 12 would result in low production efficiency because the adhesion layer would need to be peeled off for each individual element, and in addition, if the element substrate is thin, it would be more likely to be damaged, making it even more difficult, but such a step is also unnecessary.

[0023] In the device manufacturing method, in step 2, the notch 19a is formed by the first process and the notch 19b is formed by the second process. However, the first and second processes described above may be performed before providing the protective layer 20 that protects the element component 17 (step 3), and the order of the first and second processes is not particularly limited. Therefore, the first and second processes may be performed in this order, or the second and first processes may be performed in this order, or the first and second processes may be performed simultaneously. Performing the first and second processes simultaneously can shorten the manufacturing time. Note that performing the first and second processes simultaneously means performing the first process to form the notch 19a and the second process to form the notch 19b in one step. Performing the second process to form the notch 19b after performing the first process to form the notch 19a does not constitute performing the first and second processes simultaneously.

[0024] After the step (step 4) of separating the laminated member 24 including the element component 17 and the protective layer 20 by mechanical peeling between the adhesive layer 12 and the element component 17, the laminated member 24 may be immersed in a solution that dissolves the element substrate 14 to thin the element substrate 14 or smooth the shape of the incisions 19b. Thinning the element substrate 14 allows the device 26 to be made even thinner. Furthermore, although a thin element substrate is prone to damage, smoothing the shape of the incisions 19b improves the edge strength of the substrate 14d after being broken into small pieces, thereby suppressing damage to the substrate 14d. In addition to hydrofluoric acid, a strong alkaline aqueous solution such as a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution can be used as the solution for dissolving the element substrate 14. When immersing the laminated member 24 in a solution for dissolving the element substrate 14, it is preferable to rock or vibrate the laminated member 24 or to agitate the solution for dissolving the element substrate 14 in order to penetrate the incisions 19b. Furthermore, stress may be applied to the laminated member 24 before immersing it in the liquid that dissolves the element substrate 14, thereby widening the cuts 19b and allowing the liquid that dissolves the element substrate 14 to penetrate more easily.

[0025] Here, FIG. 11 is a schematic cross-sectional view showing a first example of a method for manufacturing a laminate used in the device manufacturing method of the embodiment of the present invention, and FIG. 12 is a schematic cross-sectional view showing a second example of a method for manufacturing a laminate used in the device manufacturing method of the embodiment of the present invention. In FIGS. 11 and 12, components identical to those shown in FIGS. 1 to 10 are designated by the same reference numerals, and detailed descriptions thereof will be omitted. The device manufacturing method may further include, before the above-described step 1, a step of thinning the thickness of the glass substrate 28 in the laminated base material 29 including the support substrate 10, the adhesion layer 12, and the glass substrate 28 shown in FIG. 11 to obtain the laminated base material 15 including the support substrate 10, the adhesion layer 12, and the element substrate 14 shown in FIG. 1. In this case, the adhesion layer 12 is formed on the surface 10a of the support substrate 10 using, for example, spin coating or die coating, and then the glass substrate 28 is bonded to the surface 12a of the adhesion layer 12 to form the laminated base material 29. The thickness d of the glass substrate 28 ０ is thicker than the thickness d of the element substrate 14 of the laminate 15 shown in Fig. 1. The thickness dc of the support substrate 10 is the same as the thickness dc of the support substrate 10 of the laminate 15 shown in Fig. 1. The thickness of the glass substrate 28 is reduced by etching or grinding.

[0026] 12 , a step of reducing the thicknesses of the first glass substrate 30 and the second glass substrate 32 in the laminated base material 33 including the first glass substrate 30, the adhesion layer 12, and the second glass substrate 32 to obtain a laminated body 15 including the support substrate 10, the adhesion layer 12, and the element substrate 14, wherein the thickness dc of the element substrate 14 is greater than the thickness d of the element substrate 14. In this case, the adhesion layer 12 is formed on the surface 30a of the first glass substrate 30 by, for example, spin coating or die coating, and then the second glass substrate 32 is bonded to the surface 12a of the adhesion layer 12 to form the laminated base material 33. １ is greater than the thickness dc of the support substrate 10 of the laminate 15 shown in FIG. ２ is greater than the thickness d of the element substrate 14 of the laminate 15 shown in Fig. 1. The thickness of the first glass substrate 30 and the second glass substrate 32 are reduced by etching or grinding.

[0027] The support substrate, adhesion layer, element substrate, element, and protective layer used in the device manufacturing method will be described below.

[0028] (Support Substrate) The support substrate 10 is a member that supports and reinforces the adhesive layer 12. The support substrate 10 also functions as a transfer substrate. For example, a glass plate is used as the support substrate 10. As the type of glass for the glass plate, alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses containing silicon oxide as a main component are preferred. As oxide-based glasses, glass having a silicon oxide content of 40 to 90 mass % calculated as oxide is preferred. More specifically, as the glass plate, a glass plate made of alkali-free borosilicate glass (manufactured by AGC Inc. under the trade name "AN100" and having a linear expansion coefficient of 38×10 -７ / °C, trade name "AN-Wizus" manufactured by AGC Inc.) A glass plate is usually produced by melting glass raw materials and forming the molten glass into a plate. Such a forming method may be a common method, for example, a float method, a fusion method, or a slot downdraw method. When the glass plate is not flexible, the thickness of the glass plate is preferably 0.3 mm or more, more preferably 0.5 mm or more. On the other hand, the thickness of the glass plate is preferably 1.0 mm or less.

[0029] The shape of the support substrate 10 when observed from the normal direction of the surface 10a of the support substrate 10 is not particularly limited, and may be either rectangular or circular, with a rectangular shape being preferred.

[0030] The support substrate 10 is larger than the adhesion layer 12 and the element substrate 14, and the surface 10a of the support substrate 10 has a peripheral region where the adhesion layer 12 and the element substrate 14 are not arranged, and the surface 10a of the peripheral region of the support substrate 10 is exposed. The width of the peripheral region is not particularly limited, but is preferably 1 to 30 mm, and more preferably 3 to 10 mm. The width of the peripheral region corresponds to the distance from the outer edge of the support substrate 10 to the end face 14c of the element substrate 14 shown in FIG. 1. If the width of the peripheral region is 30 mm or less, the effective area for forming the elements 16 and the like is increased, improving the efficiency of manufacturing the elements 16.

[0031] (Adhesion Layer) The adhesion layer 12 is a film for preventing peeling of the element substrate 14 disposed thereon. The adhesion layer 12 is disposed on the surface 10 a of the support substrate 10 so that a peripheral region of the support substrate 10 that is not in contact with the adhesion layer 12 remains.

[0032] The adhesion layer 12 may be an organic layer or an inorganic layer. Examples of materials for the organic layer include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and fluororesin. The adhesion layer 12 can also be formed by mixing several types of resin. Examples of materials for the inorganic layer include oxides, nitrides, oxynitrides, carbides, carbonitrides, silicides, and fluorides. Examples of oxides (preferably metal oxides), nitrides (preferably metal nitrides), and oxynitrides (preferably metal oxynitrides) include oxides, nitrides, and oxynitrides of one or more elements selected from Si, Hf, Zr, Ta, Ti, Y, Nb, Na, Co, Al, Zn, Pb, Mg, Bi, La, Ce, Pr, Sm, Eu, Gd, Dy, Er, Sr, Sn, In, and Ba. Examples of the carbide (preferably, metal carbide) and carbonitride (preferably, metal carbonitride) include carbides, carbonitrides, and carbonates of one or more elements selected from Ti, W, Si, Zr, and Nb. Examples of the silicide (preferably, metal silicide) include silicides of one or more elements selected from Mo, W, and Cr. Examples of the fluoride (preferably, metal fluoride) include fluorides of one or more elements selected from Mg, Y, La, and Ba.

[0033] The adhesive layer 12 may be a plasma polymerized film. When the adhesive layer 12 is a plasma polymerized film, examples of materials for forming the plasma polymerized film include fluorocarbon monomers such as CF, CHF, C2H6, C3H6, C2H2, CH3F, and C4H8, hydrocarbon monomers such as methane, ethane, propane, ethylene, propylene, acetylene, benzene, and toluene, hydrogen, and SF6.

[0034] Among these, from the viewpoints of heat resistance and releasability, silicone resin and polyimide silicone resin are preferred as the material for the adhesion layer 12, silicone resin is more preferred, and silicone resin formed from condensation reaction type silicone is more preferred. Below, an embodiment in which the adhesion layer is a silicone resin layer will be described in detail.

[0035] Silicone resins are resins containing specific organosiloxy units and are usually obtained by curing curable silicones. Curable silicones are classified into addition reaction silicones, condensation reaction silicones, ultraviolet curable silicones, and electron beam curable silicones depending on their curing mechanism, and any of these can be used. Of these, condensation reaction silicones are preferred. As condensation reaction silicones, hydrolyzable organosilane compounds as monomers or mixtures thereof (monomer mixtures), or partial hydrolysis condensates (organopolysiloxanes) obtained by subjecting a monomer or monomer mixture to a partial hydrolysis condensation reaction can be suitably used. Using this condensation reaction silicone, a silicone resin can be formed by proceeding with a hydrolysis / condensation reaction (sol-gel reaction).

[0036] The adhesion layer 12 is preferably formed using a curable composition containing curable silicone. In addition to the curable silicone, the curable composition may contain a solvent, a platinum catalyst (when an addition reaction type silicone is used as the curable silicone), a leveling agent, a metal compound, etc. Examples of metal elements contained in the metal compound include 3d transition metals, 4d transition metals, lanthanoid metals, bismuth (Bi), aluminum (Al), and tin (Sn). The content of the metal compound is not particularly limited and may be adjusted as appropriate.

[0037] The adhesive layer 12 preferably has a hydroxy group. Hydroxy groups can appear when some of the Si—O—Si bonds constituting the silicone resin of the adhesive layer 12 are broken. In addition, when a condensation reaction type silicone is used, the hydroxy group can become a hydroxy group of the adhesive layer 12.

[0038] The thickness of the adhesion layer 12 in the normal direction to the surface 10a of the support substrate 10 is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 12 μm or less. On the other hand, the thickness of the adhesion layer 12 is preferably greater than 1 μm, and more preferably 6 μm or more in terms of superior foreign material embeddability. The thickness is determined by measuring the thickness of the adhesion layer 12 at five or more arbitrary positions using a contact film thickness measuring device and arithmetically averaging the measured values. Excellent foreign material embeddability means that even if foreign material is present between the support substrate 10 and the adhesion layer 12, the foreign material is embedded by the adhesion layer 12. Excellent foreign material embeddability reduces the risk of convex portions due to foreign material forming in the adhesion layer, thereby reducing the risk of disconnection of the element 16 due to convex portions when the element 16 is formed on the element substrate 14. Since the voids formed when the convex portions form are observed as air bubbles, the foreign material embeddability can be evaluated by the presence or absence of air bubbles.

[0039] (Element Substrate) The element substrate 14 is a member that supports and reinforces the elements 16, and is singulated to form the substrate of the device 26. The element substrate, like the support substrate, is made of the above-mentioned glass plate. The element substrate preferably has a thickness d (see FIG. 1 ) of 250 μm or less, for example. The thickness d of the element substrate is obtained by measuring the thickness d of the element substrate at five or more arbitrary positions with a micrometer and calculating the arithmetic average of these values. The lower limit of the thickness of the element substrate is preferably 10 μm, for example. In addition to a glass plate, the element substrate may be made of, for example, a ceramic substrate, a silicon wafer, a metal foil, or a resin substrate.

[0040] (Element) The element 16 and the element substrate 14 constitute the device 26. The function of the element 16 depends on, for example, the application of the device 26. The element is, for example, formed with various element component circuits for functioning as an electronic element. More specifically, examples of the element include memory circuits such as flash memory, microprocessors, and logic circuits such as field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), and complex programmable logic devices (CPLDs). Other examples of the element include antennas, communication modules such as wireless tags, and microelectromechanical systems (MEMS). Examples of MEMS include sensors and actuators. Sensors include various sensors that detect, for example, acceleration, sound, light, or contact. Elements also include those having wiring that only transmits electrical signals. Furthermore, the element 16 may perform a specific function on its own, or multiple elements may perform a specific function together.

[0041] When a semiconductor is used to form an element, the composition of the semiconductor is not particularly limited. Examples of the semiconductor composition include diamond, silicon (Si), germanium (Ge), silicon germanium (SiGe), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), and gallium oxide.

[0042] (Protective Layer) The protective layer 20 protects the element 16. For example, a film with an adhesive layer whose adhesiveness decreases with temperature or ultraviolet light is used as the protective layer 20. In this case, in order to easily peel off the protective layer 20, it is preferable to reduce the adhesiveness by performing a cooling treatment, a heating treatment, or an ultraviolet light exposure treatment depending on the characteristics of the protective layer 20. For example, a dicing tape or a backgrinding tape is used as the protective layer 20.

[0043] (Device) The device 26 includes an individualized element substrate 14 and elements 16 and performs a function corresponding to the element 16. As described above, the device 26 has, for example, a configuration in which one element 16 is arranged on one substrate 14d obtained by separating the element substrate 14, but this is not limited thereto. A configuration in which multiple elements 16 are arranged on one substrate 14d obtained by separating the element substrate 14 may also be used. In this case, by modifying the second cut line Lh shown in FIG. 10 to form cuts 19b, the substrate 14d of the single element substrate 14 is divided into sections in which multiple elements 16 are arranged, thereby obtaining a device in which multiple elements 16 are arranged on one substrate 14d. The device 26 can be used, for example, as a memory circuit, a processor, an antenna, a communication module, and a receiving sensor. Receiving sensors include electromagnetic wave receiving sensors, X-ray receiving sensors, ultraviolet receiving sensors, visible light receiving sensors, and infrared receiving sensors. When used as a receiving sensor, the element substrate may be reinforced with a reinforcing sheet made of resin or the like.

[0044] (Glass substrate, first glass substrate, and second glass substrate) The glass substrate, first glass substrate, and second glass substrate constitute a laminated base material. The first glass substrate serves as a support substrate. The glass substrate and second glass substrate serve as element substrates. For example, the glass substrate, first glass substrate, and second glass substrate all have the same configuration as the support substrate described above, and are made of, for example, the glass plate described above. Thickness d of the first glass substrate １ The thickness d of the glass substrate is preferably 0.3 to 2.8 mm. ０ and the thickness d of the second glass substrate ２ The thickness d of the first glass substrate is preferably 0.1 to 1.1 mm. １ , thickness of the glass substrate d ０ and the thickness d of the second glass substrate ２ is the arithmetic mean of thicknesses measured at five or more arbitrary positions using a micrometer.

[0045] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.

[0046] This application is based on a Japanese patent application filed on February 28, 2024 (Patent Application No. 2024-028191) and a Japanese patent application filed on August 28, 2024 (Patent Application No. 2024-146347), the contents of which are incorporated by reference into this application.

[0047] REFERENCE SIGNS LIST 10 Support substrate 10a Surface 10c, 12c, 14c, 18e End surface 12 Adhesion layer 12a, 14a, 20a, 30a Surface 14 Element substrate 14d Substrate 15 Laminated body 16 Element 17 Element member 18 Laminated substrate 18b Region 18d Edge region 19a, 19b Cut 20 Protective layer 22 Suction pad 24 Laminated member 26 Device 28 Glass substrate 29, 33 Laminated base material 30 First glass substrate 32 Second glass substrate Ds Lamination direction Lf First cut line Lh Second cut line d, d ０ , d １ , d ２ , dc thickness

Claims

1. A method for manufacturing a device, comprising: step 1 of forming a plurality of elements on an element substrate in a laminate including a support substrate, an adhesion layer, and an element substrate, thereby obtaining a laminated substrate in which a support substrate, an adhesion layer, the element substrate, and an element member including the plurality of elements are laminated in this order; step 2 of performing a first process of cutting the support substrate, the adhesion layer, and the element member at the edge region of the laminated substrate, and a second process of providing continuous or intermittent cuts that penetrate the element substrate and reach the adhesion layer in an area of ​​the laminated substrate where no elements are present, thereby separating the plurality of elements; step 3 of providing a protective layer on the element member of the laminated substrate; step 4 of separating a laminated member including the element member and the protective layer by mechanical peeling between the adhesion layer and the element member; and step 5 of peeling the protective layer from the element member in the laminated member to obtain individual devices each including an element from the element member.

2. The method for manufacturing a device according to claim 1, further comprising, before step 1, a step of reducing the thickness of the glass substrate in a laminated base material including a support substrate, an adhesion layer, and a glass substrate to obtain a laminated body including the support substrate, the adhesion layer, and the element substrate.

3. The method for manufacturing a device according to claim 1, further comprising, before step 1, a step of reducing the thicknesses of the first and second glass substrates in a laminated base material including the first glass substrate, an adhesion layer, and a second glass substrate to obtain a laminated body including the support substrate, the adhesion layer, and the element substrate, wherein the thickness of the support substrate is greater than the thickness of the element substrate.

4. The method for manufacturing a device according to claim 1, wherein in step 2, the cuts are provided by laser irradiation.

5. The method for manufacturing a device according to claim 1, wherein the thickness of the element substrate is 250 μm or less.

6. The method for manufacturing a device according to claim 1, wherein the adhesion layer comprises a silicone resin.

7. The method for manufacturing a device according to claim 1, wherein in step 2, the first treatment and the second treatment are carried out simultaneously by laser irradiation.

8. The method for manufacturing a device according to claim 1, further comprising, between step 4 and step 5, a step of performing a treatment for reducing the adhesive strength between the protective layer and the element member.

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