Thermal interface material for mobile application processor chip, and thermal interface sheet comprising same

Abstract

The present invention relates to a thermal interface material for a mobile application processor chip and a thermal interface sheet comprising same and, more specifically, to a thermal interface material for a mobile application processor chip and a thermal interface sheet comprising same, the thermal interface material not only having excellent reworkability but also having excellent thermal resistance, an excellent compression rate, and also excellent tackiness.

Description

Thermal interface material for mobile application processor chip, thermal interface sheet comprising same

[0001] The present invention relates to a thermal interface material for a mobile application processor chip and a thermal interface sheet including the same, and more particularly, to a thermal interface material for a mobile application processor chip having excellent thermal resistance and capable of quickly dissipating heat generated in the mobile application processor chip to the outside, as well as excellent reworkability, compressibility, and tackiness, and a thermal interface sheet including the same.

[0002]

[0003] The recent miniaturization and high integration of electronic devices has led to a rapid increase in thermal density, significantly impacting the lifespan and reliability of electronic components. Conventional thermal interface materials (TIMs) enhance heat transfer efficiency by bonding the two surfaces of an adherend or filling in microscopic surface imperfections. However, existing thermally conductive materials have low thermal conductivity, which hinders heat transfer and causes product deformation, making them difficult to use in electronic products.

[0004] In particular, as printed circuit boards (PCBs) used in electronic devices become increasingly miniaturized, complex, and integrated, their heat dissipation performance is becoming increasingly important. To reduce the heat generated by PCBs, the heat generated must be rapidly dissipated to the outside environment. Consequently, thermal interface materials (TIMs) are essential for PCBs.

[0005] Meanwhile, an application processor (AP) chip, one type of printed circuit board (PCB), is an integrated circuit that integrates multiple components or intellectual properties (IP) of an electronic system. In particular, mobile AP chips integrate the functions of a computer's CPU, memory, and GPU. Consequently, mobile AP chips not only generate more heat than typical PCBs, but also have varying levels due to the numerous auxiliary materials formed on the base substrate.

[0006] Therefore, there is a need to develop a thermal interface material optimized for such application processor chips.

[0007]

[0008] The present invention has been devised to solve the above problems, and the purpose of the present invention is to provide a thermal interface material for a mobile application processor chip, which has excellent thermal resistance and can quickly release heat generated from a mobile application processor chip to the outside, and also has excellent reworkability, compressibility, and tackiness, and a thermal interface sheet including the same.

[0009]

[0010] In order to solve the above-described problem, the thermal interface material for a mobile application processor chip of the present invention includes a base material.

[0011] In a preferred embodiment of the present invention, the base material may include a filler and a binder resin.

[0012] In a preferred embodiment of the present invention, the binder resin may include a styrenic thermoplastic elastomer.

[0013] In a preferred embodiment of the present invention, the binder resin may include 42 to 78 wt% of a styrenic thermoplastic elastomer based on the total wt%.

[0014] In a preferred embodiment of the present invention, it may include at least one selected from styrene-ethylene / butylene-styrene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), styrene-isobutylene-styrene block copolymer (SIBS), and styrene-isoprene-styrene block copolymer (SIS).

[0015] In a preferred embodiment of the present invention, the styrenic thermoplastic elastomer may be a styrene-ethylene / butylene-styrene block copolymer having a weight average molecular weight of 80,000 to 200,000.

[0016] In a preferred embodiment of the present invention, the styrenic thermoplastic elastomer may be a styrene-ethylene / butylene-styrene block copolymer containing 8 to 16 wt% of styrene based on the total wt%.

[0017] In a preferred embodiment of the present invention, the binder resin may further include a fluidizing agent.

[0018] In a preferred embodiment of the present invention, the binder resin may contain 28 to 52 wt% of a fluidizing agent based on the total wt%.

[0019] In a preferred embodiment of the present invention, the fluidizing agent may include a liquid fluidizing agent and a solid fluidizing agent.

[0020] In a preferred embodiment of the present invention, the liquid fluidizing agent may include paraffin oil having a pour point of -20 to -10°C, a specific gravity of 0.61 to 1.14, and a flash point of 200 to 280°C.

[0021] In a preferred embodiment of the present invention, the solid fluidizing agent may include paraffin wax having a melting point of 29 to 55°C and a viscosity of 3.08 to 5.72 (60°C).

[0022] In a preferred embodiment of the present invention, the thermal interface material for a mobile application processor chip of the present invention may further include a functional additive.

[0023] In a preferred embodiment of the present invention, the thermal interface material for a mobile application processor chip of the present invention may include 0.1 to 10 parts by weight of an additive per 100 parts by weight of the base material.

[0024] Meanwhile, the thermal interface sheet for the mobile application processor chip of the present invention may include the thermal interface material for the mobile application processor chip of the present invention.

[0025] Specifically, the thermal interface sheet for the mobile application processor chip of the present invention can be manufactured by curing the thermal interface material for the mobile application processor chip of the present invention.

[0026] In a preferred embodiment of the present invention, the thermal interface sheet for the mobile application processor chip of the present invention may have a thickness of 200 to 800 μm.

[0027]

[0028] The thermal interface material for a mobile application processor chip of the present invention, and the thermal interface sheet including the same, have excellent thermal resistance and can quickly release heat generated from the mobile application processor chip to the outside, and also have excellent reworkability, compressibility, and tackiness.

[0029]

[0030] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description have been omitted for clarity of description, and the same reference numerals are assigned to identical or similar components throughout the specification.

[0031]

[0032] A thermal interface material for a mobile application processor chip of the present invention comprises a base material.

[0033] The base material of the present invention may include a filler and a binder resin.

[0034] Specifically, the base material of the present invention may contain 83.65 to 93.65 wt% of filler, preferably 85.65 to 91.65 wt%, more preferably 87.65 to 89.65 wt%, and 6.35 to 16.35 wt%, preferably 8.35 to 14.35 wt%, more preferably 10.35 to 12.35 wt% of binder resin, based on the total wt%. If the filler is contained in an amount less than 83.65 wt%, there may be a problem with heat dissipation characteristics, and if it is contained in an amount exceeding 93.65 wt%, there may be a problem in forming the thermal interface material for the mobile application processor chip of the present invention.

[0035]

[0036] Meanwhile, the filler of the present invention may include at least one selected from aluminum oxide (Al2O3), zinc oxide (ZnO), boron nitride (BN), aluminum nitride (AlN), and magnesium oxide (MgO), and preferably may include aluminum oxide (Al2O3).

[0037] Specifically, the filler of the present invention may include a first filler, a second filler, and a third filler. In this case, the filler of the present invention may satisfy the following condition (1).

[0038] (1) A > B > C

[0039] In the above condition (1), A represents the average particle diameter of the first filler, B represents the average particle diameter of the second filler, and C represents the average particle diameter of the third filler. If condition (1) is not satisfied, the interface between filler particles increases, which may cause a problem of increased thermal resistance and decreased thermal conductivity.

[0040] In addition, the first filler may have an average particle diameter of 90 to 150 μm, preferably 100 to 140 μm, more preferably 110 to 130 μm, the second filler may have an average particle diameter of 11 to 45 μm, preferably 13 to 35 μm, more preferably 15 to 25 μm, and the third filler may have an average particle diameter of 0.5 to 10 μm, preferably 1 to 8 μm, more preferably 1.5 to 5 μm.

[0041] Meanwhile, the filler of the present invention can further satisfy the following condition (2).

[0042] (2) D > E + F

[0043] In the above condition (2), D represents the weight % of the first filler included in the filler of the present invention, E represents the weight % of the second filler included in the filler of the present invention, and F represents the weight % of the third filler included in the filler of the present invention. If condition (2) is not satisfied, the filling ratio may be low, making it difficult to process the thermal interface material for the mobile application processor chip of the present invention, or there may be a problem of low thermal conductivity.

[0044] In addition, the filler of the present invention can further satisfy the following condition (3).

[0045] (3) 2.2 ≤ ≤ 4.2, preferably ≤ 2.5 ≤ 3.8, more preferably ≤ 2.8 ≤ 3.5

[0046] In the above condition (3), D represents the weight % of the first filler included in the filler of the present invention, E represents the weight % of the second filler included in the filler of the present invention, and F represents the weight % of the third filler included in the filler of the present invention. If in condition (3), If it is less than 2.2, the interface between filler particles increases, which may cause an increase in thermal resistance and a decrease in thermal conductivity. If it exceeds 4.2, there may be an increase in the number of voids between filler particles.

[0047] Most preferably, the filler of the present invention may include, based on the total weight%, a first filler of 46.9 to 87.1 wt%, preferably 53.6 to 80.4 wt%, more preferably 60.3 to 73.7 wt%, a second filler of 16.8 to 31.2 wt%, preferably 19.2 to 28.8 wt%, more preferably 21.6 to 26.4 wt%, and a third filler of 6.3 to 11.7 wt%, preferably 7.2 to 10.8 wt%, more preferably 8.1 to 9.9 wt%. If the first filler is included in an amount less than 46.9 wt%, there may be a problem of increased thermal resistance, and if it is included in an amount exceeding 87.1 wt%, there may be a problem of decreased thermal conductivity due to a decreased filling ratio.

[0048]

[0049] Furthermore, the binder resin of the present invention may include a styrenic thermoplastic elastomer.

[0050] Specifically, the binder resin of the present invention may contain 42 to 78 wt%, preferably 48 to 72 wt%, and more preferably 54 to 66 wt% of a styrenic thermoplastic elastomer based on the total wt%. If the styrenic thermoplastic elastomer is contained in an amount less than 42 wt%, flexibility may increase excessively, which may cause problems with reworkability. If the styrenic thermoplastic elastomer is contained in an amount exceeding 78 wt%, surface hardness may increase, which may cause problems with increased thermal resistance.

[0051] In addition, the styrenic thermoplastic elastomer of the present invention may include at least one selected from a styrene-ethylene / butylene-styrene block copolymer (STYRENE-ETHYLENE / BUTYLENE-STYRENE BLOCK COPOLYMER), a styrene-butadiene-styrene block copolymer (SBS), a styrene-isobutylene-styrene block copolymer (SIBS), and a styrene-isoprene-styrene block copolymer (SIS), and preferably may include a styrene-ethylene / butylene-styrene block copolymer.

[0052] Most preferably, the styrenic thermoplastic elastomer of the present invention may be a styrene-ethylene / butylene-styrene block copolymer having a weight average molecular weight of 80,000 to 200,000, preferably 90,000 to 170,000, and more preferably 110,000 to 140,000. If the weight average molecular weight is less than 80,000, the hardness increases, which may cause problems in using it as a material for a thermal interface material for a mobile application processor chip of the present invention, and if it exceeds 200,000, the phase change time may increase excessively, which may cause problems in not exhibiting the properties of the styrene-ethylene / butylene-styrene block copolymer. In addition, the styrenic thermoplastic elastomer of the present invention may be a styrene-ethylene / butylene-styrene block copolymer having a styrene content of 8 to 16 wt%, preferably 10 to 14 wt%, and more preferably 11 to 13 wt%. If the styrene content is less than 8 wt%, flexibility may increase excessively, which may cause problems with reworkability and handling, and if it exceeds 16 wt%, hardness may increase excessively, which may cause problems with increased heat resistance. In addition, the styrenic thermoplastic elastomer of the present invention may be a styrene-ethylene / butylene-styrene block copolymer having a shore A hardness of 42 to 52, preferably 44 to 50, and more preferably 46 to 48.

[0053] In addition, the binder resin of the present invention may further include a fluidizing agent. Specifically, the binder resin of the present invention may include 28 to 52 wt% of the fluidizing agent, preferably 32 to 48 wt%, and more preferably 36 to 44 wt%, based on the total wt%. If the fluidizing agent is included in an amount less than 28 wt%, the phase change temperature may become excessively high, making it difficult to use as a heat-radiating material. If the fluidizing agent is included in an amount exceeding 52 wt%, the phase change temperature may become excessively low, making it difficult to store at room temperature.

[0054] Meanwhile, the fluidizing agent of the present invention may include a liquid fluidizing agent and a solid fluidizing agent, and thus, the present invention may have advantages such as reworkability and / or room temperature storage by including both a liquid fluidizing agent and a solid fluidizing agent. Specifically, the binder resin of the present invention may include 21 to 39 wt%, preferably 24 to 36 wt%, and more preferably 27 to 33 wt%, of a liquid fluidizing agent, and 7 to 13 wt%, preferably 8 to 12 wt%, and more preferably 9 to 11 wt%, of a solid fluidizing agent, based on the total weight%. If the liquid fluidizing agent is included in an amount of less than 21 wt%, the phase change temperature may be excessively high, which may cause difficulties in use as a heat-radiating material, and if the liquid fluidizing agent is included in an amount of more than 39 wt%, the phase change temperature may be excessively low, which may cause difficulties in storage at room temperature. In addition, if the solid fluidizing agent is included in an amount of less than 7 wt%, the phase change temperature may become excessively high, making it difficult to use as a heat-radiating material. If the solid fluidizing agent is included in an amount exceeding 13 wt%, the phase change temperature may become excessively low, making it difficult to store at room temperature.

[0055] In addition, the liquid type fluidizing agent may include at least one selected from paraffin oil, naphthalene oil, isoparaffin oil, and aromatic oil, and preferably may include paraffin oil.

[0056] Most preferably, the paraffin oil of the present invention may have a pour point of -20 to -10°C, preferably -17 to -13°C, a specific gravity of 0.61 to 1.14, preferably 0.69 to 1.05, more preferably 0.78 to 0.97, and a flash point of 200 to 280°C, preferably 220 to 260°C.

[0057] Additionally, the solid fluidizing agent may preferably include paraffin wax, and may preferably include paraffin wax.

[0058] Most preferably, the paraffin wax of the present invention may have a melting point of 29 to 55°C, preferably 33 to 50°C, more preferably 37 to 46°C, and a viscosity of 3.08 to 5.72 (60°C), preferably 3.52 to 5.28 (60°C), more preferably 3.96 to 4.84 (60°C).

[0059]

[0060] Furthermore, the thermal interface material for a mobile application processor chip of the present invention may further include a functional additive. At this time, the functional additive may include various possible additives commonly used in the art, and preferably may include at least one selected from a defoaming agent, a coupling agent, a leveling agent, and a dispersing agent, and more preferably may include a dispersing agent and a defoaming agent. In addition, the dispersing agent may include various dispersing agents commonly used in the art, and preferably may include a hydrophobic silica-containing organo-modified polysiloxane. In addition, the defoaming agent may include various defoaming agents commonly used in the art, and preferably may include a hydrophobic silica-containing organo-modified polysiloxane.

[0061] In addition, the thermal interface material for a mobile application processor chip of the present invention may contain 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight, and more preferably 1.0 to 3.0 parts by weight, of an additive, based on 100 parts by weight of the base material. If the additive is contained in an amount less than 0.1 parts by weight, there may be a problem that the additive does not perform its function, and if it exceeds 10 parts by weight, the content of the filler that may be included in the thermal interface material for a mobile application processor chip of the present invention may be lowered, resulting in a problem that thermal conductivity may be lowered. Specifically, the thermal interface material for a mobile application processor chip of the present invention may contain 0.05 to 5 parts by weight, preferably 0.5 to 1.5 parts by weight, of a dispersant, and 0.05 to 5 parts by weight, and preferably 0.2 to 1.0 parts by weight, of an antifoaming agent, based on 100 parts by weight of the base material.

[0062]

[0063] Meanwhile, the thermal interface sheet for a mobile application processor chip of the present invention may include the thermal interface material for a mobile application processor chip of the present invention. Specifically, the thermal interface sheet for a mobile application processor chip of the present invention may be manufactured by curing the thermal interface material for a mobile application processor chip of the present invention. In addition, the thermal interface sheet for a mobile application processor chip of the present invention may have a thickness of 200 to 800 μm, preferably 400 to 700 μm, and more preferably 500 to 650 μm. If the thickness is less than 200 μm, there may be a problem in that it cannot cover all the steps formed on one side of the adherend, and if it exceeds 800 μm, there may be a problem in that it is difficult to apply it to a mobile application processor chip.

[0064]

[0065] Although the present invention has been described above with reference to embodiments, these are merely examples and are not intended to limit the present invention to the embodiments. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present invention. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention defined in the appended claims.

[0066]

[0067] Example 1: Fabrication of a thermal interface material for a mobile application processor chip.

[0068] A thermal interface material for a mobile application processor chip was prepared by mixing 0.9 parts by weight of a dispersant (Rhodafac, RS-610) and 0.45 parts by weight of an antifoaming agent (TEGO, Airex 900) with respect to 100 parts by weight of a base material.

[0069] At this time, the base material used was a mixture of 88.65 wt% of filler and 11.35 wt% of binder resin based on the total weight%.

[0070] In addition, the filler was used in a mixture of 67 wt% of the first filler, 24 wt% of the second filler, and 9 wt% of the third filler, based on the total weight%. In addition, aluminum oxide (Al2O3) having an average particle size of 120 μm was used as the first filler, aluminum oxide (Al2O3) having an average particle size of 20 μm was used as the second filler, and 9 wt% of aluminum oxide (Al2O3) having an average particle size of 3 μm was used as the third filler.

[0071] In addition, the binder resin was used as a mixture of 60 wt% of styrene-based thermoplastic elastomer, 30 wt% of liquid-type fluidizing agent, and 10 wt% of solid-type fluidizing agent, based on the total weight%.

[0072] In addition, styrene-ethylene / butylene-styrene block copolymer (styrene content: 12 wt%, weight average molecular weight: 126,010, shore A hardness: 47) was used as a styrenic thermoplastic elastomer, paraffin oil (pour point: -15°C, specific gravity: 0.873, flash point: 240°C) was used as a liquid fluidizing agent, and paraffin wax (melting point: 41.6°C, viscosity: 4.4 (60°C), white) was used as a solid fluidizing agent.

[0073]

[0074] Example 2: Fabrication of a thermal interface material for a mobile application processor chip.

[0075] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that contained a mixture of 40 wt% of a styrene-based thermoplastic elastomer, 45 wt% of a liquid-type fluidizing agent, and 15 wt% of a solid-type fluidizing agent, based on the total weight%, to ultimately manufacture a thermal interface material for a mobile application processor chip.

[0076]

[0077] Example 3: Fabrication of thermal interface material for mobile application processor chip

[0078] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that was a mixture of 48 wt% of a styrene-based thermoplastic elastomer, 39 wt% of a liquid-type fluidizing agent, and 13 wt% of a solid-type fluidizing agent, based on the total weight%, to finally manufacture a thermal interface material for a mobile application processor chip.

[0079]

[0080] Example 4: Fabrication of thermal interface material for mobile application processor chip

[0081] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that was a mixture of 72 wt% of a styrene-based thermoplastic elastomer, 21 wt% of a liquid-type fluidizing agent, and 7 wt% of a solid-type fluidizing agent, based on the total weight%, to finally manufacture a thermal interface material for a mobile application processor chip.

[0082]

[0083] Example 5: Fabrication of thermal interface material for mobile application processor chip

[0084] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that was a mixture of 80 wt% of a styrene-based thermoplastic elastomer, 15 wt% of a liquid-type fluidizing agent, and 5 wt% of a solid-type fluidizing agent, based on the total weight%, to ultimately manufacture a thermal interface material for a mobile application processor chip.

[0085]

[0086] Example 6: Fabrication of a thermal interface material for a mobile application processor chip.

[0087] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-ethylene / butylene-styrene block copolymer (styrene content: 12 wt%, weight average molecular weight: 70,000, shore A hardness: 60) was used as a styrene-based thermoplastic elastomer, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0088]

[0089] Example 7: Fabrication of thermal interface material for mobile application processor chip

[0090] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-ethylene / butylene-styrene block copolymer (styrene content: 12 wt%, weight average molecular weight: 220,000, shore A hardness: 32) was used as a styrene-based thermoplastic elastomer, and thus a thermal interface material for a mobile application processor chip was finally manufactured.

[0091]

[0092] Example 8: Fabrication of thermal interface material for mobile application processor chip

[0093] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-ethylene / butylene-styrene block copolymer (styrene content: 7 wt%, weight average molecular weight: 126,010, shore A hardness: 40) was used as a styrene-based thermoplastic elastomer, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0094]

[0095] Example 9: Fabrication of thermal interface material for mobile application processor chip

[0096] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-ethylene / butylene-styrene block copolymer (styrene content: 17 wt%, weight average molecular weight: 126,010, shore A hardness: 60) was used as a styrenic thermoplastic elastomer, and thus a thermal interface material for a mobile application processor chip was finally manufactured.

[0097]

[0098] Example 10: Fabrication of a thermal interface material for a mobile application processor chip.

[0099] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-butadiene-styrene block copolymer (kraton, D111) was used instead of a styrene-ethylene / butylene-styrene block copolymer, ultimately manufacturing a thermal interface material for a mobile application processor chip.

[0100]

[0101] Example 11: Fabrication of a thermal interface material for a mobile application processor chip.

[0102] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a styrene-isoprene-styrene block copolymer (Kraton, 14424) was used instead of a styrene-ethylene / butylene-styrene block copolymer, ultimately manufacturing the thermal interface material for a mobile application processor chip.

[0103]

[0104] Example 12: Fabrication of a thermal interface material for a mobile application processor chip.

[0105] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that was a mixture of 60 wt% of a styrene-based thermoplastic elastomer and 40 wt% of a liquid-type fluidizing agent based on the total weight%, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0106]

[0107] Example 13: Fabrication of a thermal interface material for a mobile application processor chip.

[0108] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a binder resin was used that was a mixture of 60 wt% of a styrene-based thermoplastic elastomer and 40 wt% of a solid fluidizing agent based on the total weight%, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0109]

[0110] Example 14: Fabrication of a thermal interface material for a mobile application processor chip.

[0111] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a base material containing 84.65 wt% of filler and 15.35 wt% of binder resin was used, based on the total weight, to ultimately manufacture a thermal interface material for a mobile application processor chip.

[0112]

[0113] Example 15: Fabrication of a thermal interface material for a mobile application processor chip.

[0114] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, the base material was mixed with 92.65 wt% of filler and 7.35 wt% of binder resin based on the total weight%, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0115]

[0116] Example 16: Fabrication of a thermal interface material for a mobile application processor chip.

[0117] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a base material containing 81.65 wt% of filler and 18.35 wt% of binder resin was used, based on the total weight%, to ultimately manufacture a thermal interface material for a mobile application processor chip.

[0118]

[0119] Example 17: Fabrication of a thermal interface material for a mobile application processor chip.

[0120] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, the base material was mixed with 95.65 wt% of filler and 4.35 wt% of binder resin based on the total weight%, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0121]

[0122] Example 18: Fabrication of a thermal interface material for a mobile application processor chip.

[0123] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, only the first filler was used as a filler, and a final thermal interface material for a mobile application processor chip was manufactured.

[0124]

[0125] Example 19: Fabrication of a thermal interface material for a mobile application processor chip.

[0126] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, only the second filler was used as a filler, and a thermal interface material for a mobile application processor chip was finally manufactured.

[0127]

[0128] Example 20: Fabrication of a thermal interface material for a mobile application processor chip.

[0129] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, only the third filler was used as a filler, and a thermal interface material for a mobile application processor chip was finally manufactured.

[0130]

[0131] Example 21: Fabrication of a thermal interface material for a mobile application processor chip.

[0132] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, a mixture of 67 wt% of the first filler and 36 wt% of the second filler was used based on the total weight percentage, thereby finally manufacturing a thermal interface material for a mobile application processor chip.

[0133]

[0134] Comparative Example 1: Fabrication of Thermal Interface Material for Mobile Application Processor Chip

[0135] A thermal interface material for a mobile application processor chip was manufactured using the same method as in Example 1. However, unlike Example 1, styrene butadiene rubber (SBR) was used instead of a styrene-based thermoplastic elastomer to ultimately manufacture the thermal interface material for a mobile application processor chip.

[0136]

[0137] Manufacturing Examples 1 to 21 and Comparative Manufacturing Example 1: Manufacturing of thermal interface sheets for mobile application processor chips

[0138] The thermal interface materials for mobile application processor chips manufactured in Examples 1 to 21 and Comparative Example 1 were each cured with hot air at a temperature of 80°C for 10 minutes to manufacture a thermal interface sheet for mobile application processor chips having a thickness of 600 μm. At this time, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 1 is manufactured as Manufacturing Example 1, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 2 is manufactured as Manufacturing Example 2, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 3 is manufactured as Manufacturing Example 3, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 4 is manufactured as Manufacturing Example 4, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 5 is manufactured as Manufacturing Example 5, the thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 6 is manufactured as Manufacturing Example 6, and the mobile application processor manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 7 is manufactured as A thermal interface sheet for a chip is manufactured by manufacturing example 7, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured by manufacturing example 8 is manufactured by manufacturing example 8, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured by manufacturing example 9 is manufactured by manufacturing example 9, and a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured by manufacturing example 10 is manufactured by manufacturing example 10.A thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 11 is manufactured as Manufacturing Example 11, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 12 is manufactured as Manufacturing Example 12, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 13 is manufactured as Manufacturing Example 13, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 14 is manufactured as Manufacturing Example 14, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 15 is manufactured as Manufacturing Example 15, a thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Example 16 is manufactured as Manufacturing Example 16, and a thermal interface sheet for a mobile application processor chip manufactured in Example 17 is manufactured as Manufacturing Example 17. A thermal interface sheet for a mobile application processor chip manufactured by curing a material is manufactured as Manufacturing Example 17, a thermal interface sheet for a mobile application processor chip manufactured by curing a thermal interface material for a mobile application processor chip manufactured in Example 18 is manufactured as Manufacturing Example 18, a thermal interface sheet for a mobile application processor chip manufactured by curing a thermal interface material for a mobile application processor chip manufactured in Example 19 is manufactured as Manufacturing Example 19, a thermal interface sheet for a mobile application processor chip manufactured by curing a thermal interface material for a mobile application processor chip manufactured in Example 20 is manufactured as Manufacturing Example 20, and a thermal interface sheet for a mobile application processor chip manufactured by curing a thermal interface material for a mobile application processor chip manufactured in Example 21 is manufactured as Manufacturing Example 21.The thermal interface sheet for a mobile application processor chip manufactured by curing the thermal interface material for a mobile application processor chip manufactured in Comparative Example 1 is indicated as Comparative Manufacturing Example 1, and in Tables 1 to 4 below, even if they are experimental values ​​for Manufacturing Examples and Comparative Manufacturing Examples, they are indicated as Examples and Comparative Examples.

[0139]

[0140] Experimental Example 1: Thermal Resistance Measurement

[0141] The thermal resistance of the thermal interface sheets manufactured in Manufacturing Examples 1 to 21 and Comparative Manufacturing Example 1 was measured using the ASTM D5470 method, and the results are shown in Tables 1 to 6 below.

[0142]

[0143] Experimental Example 2: Compression ratio measurement

[0144] The compressibility of the thermal interface sheets manufactured in Manufacturing Examples 1 to 21 and Comparative Manufacturing Example 1 was measured using the ASTM D3574 method, and the results are shown in Tables 1 to 6 below.

[0145]

[0146] Experimental Example 3: Measurement of Tackiness and Reworkability

[0147] A printed circuit board having various steps due to the auxiliary materials formed on the base substrate was prepared, and the thermal interface materials for mobile application processor chips manufactured in Examples 1 to 21 and Comparative Example 1 were respectively applied to one surface of the printed circuit board having the steps formed, and cured with hot air at a temperature of 80°C for 10 minutes to form a thermal interface sheet for mobile application processor chips having a thickness of 600 μm. Thereafter, when the thermal interface sheet formed on the printed circuit board was removed, if no residue of the thermal interface sheet remained on the printed circuit board, the tackiness was evaluated as A, if even a little residue of the thermal interface sheet remained on the printed circuit board, the tackiness was evaluated as B, and if the thermal interface sheet was torn, the tackiness was evaluated as C, which are shown in Table 1 below. In addition, the reworkability was determined by checking the state of the thermal interface sheet removed from the printed circuit board to determine whether it could be reused. If it was reusable, it was evaluated as ○, and if it was not reusable, it was evaluated as X, which are shown in Tables 1 to 6 below.

[0148]

[0149] Experimental Example 4: Surface Roughness Measurement

[0150] The surface roughness of the thermal interface sheets manufactured in Manufacturing Examples 1 to 21 and Comparative Manufacturing Example 1 was measured using the ASTM D4417 method, and is shown in Tables 1 to 6 below. At this time, the surface roughness was judged as good if no irregularities were observed with the naked eye on the surface of the thermal interface sheet, and as bad if irregularities were observed with the naked eye on the surface of the thermal interface sheet.

[0151]

[0152] Experimental Example 5: Evaluation of Porosity

[0153] A first glass substrate, a thermal interface material for a mobile application processor chip manufactured in each of Examples 1 to 21 and Comparative Example 1, and a second glass substrate were sequentially laminated, and the thermal interface material for a mobile application processor chip manufactured in each of Examples 1 to 21 and Comparative Example 1 was cured at a temperature of 80°C for 10 minutes. Whether pores were formed on the surface of the cured thermal interface material for a mobile application processor chip manufactured in each of Examples 1 to 21 and Comparative Example 1 was visually determined, and the results are shown in Tables 1 to 6 below.

[0154]

[0155]

[0156] As can be seen in Table 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was above a certain level.

[0157] However, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 2 not only had poor reworkability, but also had pores formed.

[0158] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 3 had poor reworkability.

[0159] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 4 not only had an increased thermal resistance, but also a decreased compressibility and a worse tackiness.

[0160] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 5 not only had an increased thermal resistance, but also a decreased compressibility and a worse tackiness.

[0161]

[0162]

[0163] As can be seen in Table 2, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was high above a certain level.

[0164] However, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 6 not only had an increased thermal resistance, but also a decreased compressibility and a worse tackiness.

[0165] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 7 had poor reworkability.

[0166] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 8 had poor reworkability.

[0167] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 9 not only had an increased thermal resistance but also had a worse tackiness.

[0168]

[0169]

[0170] As can be seen in Table 3, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was high above a certain level.

[0171] However, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 10 not only had an increased thermal resistance, but also a decreased compressibility and a worse tackiness.

[0172] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 11 not only had an increased thermal resistance, but also had a decreased compressibility and a worse reworkability.

[0173] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Comparative Example 1 not only had an increased thermal resistance, but also had a decreased compressibility, deteriorated tackiness and reworkability, and formed pores.

[0174]

[0175]

[0176] As can be seen in Table 4, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was high above a certain level.

[0177] However, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 12 not only had an increased thermal resistance, but also had a worse reworkability.

[0178] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 13 not only had a lower compressibility, but also had worse tackiness and reworkability, and formed pores.

[0179]

[0180]

[0181] As can be seen in Table 5, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was high above a certain level.

[0182] However, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 14 had a significantly increased thermal resistance.

[0183] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 15 not only had a lower compressibility, but also had poor tackiness and reworkability, poor surface roughness, and formed pores.

[0184] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 16 not only had a significantly increased thermal resistance, but also had poor reworkability and formed pores.

[0185] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 17 not only had a significantly lower compressibility, but also had poor tackiness and reworkability, poor surface roughness, and formed pores.

[0186]

[0187]

[0188] As can be seen in Table 6, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 1 not only had excellent reworkability, but also had low thermal resistance and a compression ratio that was high above a certain level.

[0189] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 18 not only had an increased thermal resistance, but also a decreased compressibility and poor surface roughness.

[0190] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 19 not only had an increased thermal resistance, but also had a decreased compressibility, poor reworkability, and poor surface roughness.

[0191] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 20 not only had an increased thermal resistance, but also had a decreased compressibility and worsened tackiness and reworkability.

[0192] In addition, compared to Example 1, it was confirmed that the thermal interface sheet manufactured using the thermal interface material manufactured in Example 21 not only had an increased thermal resistance but also a decreased compressibility.

[0193]

[0194] Simple modifications or changes of the present invention can be easily implemented by a person having ordinary skill in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

Claims

1. Base material; including, The above base material includes a filler and a binder resin, A thermal interface material for a mobile application processor chip, characterized in that the binder resin comprises a styrene-based thermoplastic elastomer.

2. In paragraph 1, A thermal interface material for a mobile application processor chip, characterized in that the binder resin comprises 42 to 78 wt% of a styrene-based thermoplastic elastomer based on the total wt%.

3. In paragraph 1, A thermal interface material for a mobile application processor chip, characterized in that the above styrenic thermoplastic elastomer comprises at least one selected from a styrene-ethylene / butylene-styrene block copolymer (SEBS), a styrene-butadiene-styrene block copolymer (SBS), a styrene-isobutylene-styrene block copolymer (SIBS), and a styrene-isoprene-styrene block copolymer (SIS).

4. In paragraph 1, A thermal interface material for a mobile application processor chip, characterized in that the above styrene-based thermoplastic elastomer is a styrene-ethylene / butylene-styrene block copolymer having a weight average molecular weight of 80,000 to 200,000.

5. In paragraph 4, A thermal interface material for a mobile application processor chip, characterized in that the above styrene-based thermoplastic elastomer is a styrene-ethylene / butylene-styrene block copolymer containing 8 to 16 wt% of styrene based on the total wt%.

6. In paragraph 1, The above binder resin further comprises a fluidizing agent, A thermal interface material for a mobile application processor chip, characterized in that the binder resin comprises 28 to 52 wt% of a fluidizing agent based on the total wt%.

7. In paragraph 6, A thermal interface material for a mobile application processor chip, characterized in that the fluidizing agent comprises a liquid fluidizing agent and a solid fluidizing agent.

8. In paragraph 7, The above liquid type fluidizing agent comprises paraffin oil having a pour point of -20 to -10°C, a specific gravity of 0.61 to 1.14, and a flash point of 200 to 280°C. A thermal interface material for a mobile application processor chip, characterized in that the solid fluidizing agent comprises paraffin wax having a melting point of 29 to 55°C and a viscosity of 3.08 to 5.72 (60°C).

9. A thermal interface sheet for a mobile application processor chip comprising a thermal interface material for a mobile application processor chip of the first paragraph.

10. In paragraph 9, A thermal interface sheet for a mobile application processor chip, characterized in that the thermal interface sheet has a thickness of 200 to 800 μm.

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