Systems and methods for a multistage melter

Abstract

A vitrification system comprises a container loading and unloading area, a multistage melter module comprising a turntable, a container preparation area, a melt area, a first container cooling area wherein the processed container is cooled, and a second container cooling area wherein the processed container is cooled. In some embodiments, the container preparation area, melt area, first cooling area, and second cooling area are part of the multistage melter module.

Description

Systems and Methods for a Multistage MelterTECHNICAL FIELD

[0001] This relates generally to systems and methods for vitrification. More specifically, this relates to systems and methods for increasing the efficiency of a vitrification process.BACKGROUND

[0002] The human health and environmental impacts of waste produced from nuclear power, asbestos decommissioning, or other waste from various toxic industrial processes must be carefully managed. In the case of nuclear waste, this requires isolating or diluting the waste such that the exposure or concentration of any radionuclides is rendered as harmless as possible. To achieve this, radioactive waste is usually enclosed and managed, with some waste requiring deep and permanent burial.

[0003] The process of toxic waste vitrification entrains radionuclides in a glass matrix by using glass formers, electricity, and high heat to melt the waste material, thereby capturing hazardous contaminants in a permanent solid glass configuration with no chance of liquid or sludge leaking out. Generally, the entire vitrification process, from melter preparation to vitrification to preparation of the vitrified product for final storage, can be labor intensive and inefficient for massive-scale operations. It would be desirable to develop systems and methods that increase the efficiency and / or throughput of vitrification processes.GENERAL DESCRIPTION

[0004] A vitrification system may comprise a variety of components and features. For example, in some embodiments, a multistage melting module comprises one or more of the following: a container loading and unloading area; a turntable; a container preparation area; a melt area; a first container cooling area wherein a processed container is cooled; and a second container cooling area wherein the processed container is cooled.

[0005] In some embodiments, the container preparation area, the melt area, the first container cooling area, and the second container cooling area are turntable incorporated into the multistage melter module. In some embodiments, a turntable within the turntable multistage melter module is operably configured to turn resulting in moving containers from one area to the next area. In some embodiments, the turntable multistage melter module includes cascading ventilation.

[0006] In some embodiments, the multistage melter module includes one or more off-gas outlets. In some embodiments, the multistage melting module includes an airlock in the container loading and unloading area.

[0007] In some embodiments, the multistage melter module includes one or more container lifts. In some embodiments, the multistage melter module includes a feed inlet in the melt area. In some embodiments, the feed inlet is configured to one of provide free or metered feed to a container in the melt area. In some embodiments, the feed may include waste or other process material(s), glass frit, silica sand, and / or glass formers.

[0008] In some embodiments, the multistage melter module includes one or more air inlets. In some embodiments, the multistage melter module includes a ventilation system. In some embodiments, the multistage melter module includes one or more melt position seals configured to prevent release of gases, vapors, and / or particulates.

[0009] In some embodiments, the vitrification system includes one or more remote manipulators or other remotely operated systems for performing operations in the system remotely. In some embodiments, the vitrification system further includes a control room that is operable to control operations in the vitrification system and / or monitor operations in the vitrification system. In some embodiments, the control room is remote from the vitrification system. In some embodiments, the control room is proximate to the vitrification system. In some embodiments, the vitrification system further includes a human machine interface.

[0010] In some embodiments, the vitrification system further includes one or more sensors. In some embodiments, the one or more sensors include contact sensors, noncontact sensors, capacitive sensors, inductive sensors, 2D range sensor, 3D imager, fiber optic cable, camera, thermal imager, thermometer, pressure sensor, accelerometer, inertial measurement unit (IMU), rotary encoder, radiation detector, LIDAR, and / or strain sensors. In some embodiments, the camera is an IR camera, and wherein the IR camera includes one or more of heat or radiation shielding.

[0011] In some embodiments, a vitrification system can utilize a novel multistage melter module to efficiently vitrify hazardous and radioactive waste into a stable glass form. This system can significantly improve throughput and simplify waste handling compared to conventional vitrification processes by integrating container preparation, melting, cooling, and unloading stages into a multi-position turntable design. The vitrification process occurs entirely within sealed melt containers, minimizing equipment needs and handling steps associated with transferring vitrified materials and thereby reducing operational complexity and improving overall efficiency.

[0012] The vitrification system can comprise a container preparation area, used for assembling melt containers and loading starter paths and feed materials such as glass frit and glass formers into appropriate feed hoppers. The prepared containers can then be delivered to a melt station area containing the multistage melter module. The multistage melter module can comprise a turntable configured to rotate meltcontainers sequentially through designated functional positions or stages within the module.

[0013] The multistage melter module can include a container staging and removal position, located within an airlock, where newly prepared containers enter and fully processed containers exit the system. The multistage melter module can include a temporary lidding and preparation position configured for removing containment seals from incoming containers and installing temporary lids to minimize contamination. The melter module can include at least one melt position wherein waste or other materials are melted and vitrified within the container through joule heating powered by two or more electrodes.

[0014] Moreover, the multistage melter module can feature a first cooling position and second cooling position, allowing continued cooling and controlled solidification of the vitrified material before proceeding to the removal stage. The system can also feature cascading ventilation with multiple ventilation zones, including the airlock for initial container handling, secondary containment area around the turntable area, primary containment around melt and cooling positions, and dedicated active melt offgas areas positioned to capture and isolate particulates and gases released during the vitrification process.

[0015] The vitrification system can include an efficient off-gas treatment area to ensure environmentally responsible operation. The off-gas treatment area can be designed to collect and process off-gases through filtration, quenching, scrubbing, chemical treatment, and / or selective catalytic reduction to safely remove and dispose of contaminants such as radionuclides, volatile iodine isotopes, cesium isotopes, technetium isotopes, and strontium isotopes. The collected particulates or radionuclides from sintered metal filters and other secondary waste streams can be recycled back into subsequent melt processes to maximize efficiency and minimize waste.

[0016] The vitrification system can include electronic computing devices, sensors, imaging devices, and remote manipulators to enable robust monitoring, control, and automation of vitrification processes. The electronic computing devices can use detailed sensor data, including temperature data via non-contact thermal imagers, radiation detectors, pressure sensors, cameras, LIDAR, and / or strain sensors to control and adjust process parameters in real-time or near real-time, enhancing system reliability and stability.

[0017] A vitrification system comprises a container preparation area, a melt station area, and an off-gas treatment area. The melt station area includes at least one multistage melter module configured with a turntable. The multistage melter module comprises a container staging and removal position, a temporary lidding andpreparation position, a melt position, a first container cooling position, and a second container cooling position. The turntable is configured to move melt containers sequentially through each stated position. In some embodiments, multiple containers can be processed concurrently, with each container being located at a different position within the multistage melter module. In some embodiments, the container staging and removal position can be located within an airlock. The vitrification system further comprises an off-gas treatment area operatively configured to process offgases released during melting, thus safely capturing contaminants and radionuclides in the vitrification process.

[0018] A vitrification method comprises preparing a melt container in a container preparation area, and using a multistage melter module comprising a turntable to process melt containers through multiple sequential stages. The method includes positioning a prepared melt container in a container staging and removal position of the multistage melter module, removing a lid from the melt container in a temporary lidding and preparation position, loading starter paths and process materials into the melt container, and melting the process materials at a melt position. The melt container containing vitrified process materials is sequentially cooled in a first container cooling position and a second container cooling position. After cooling, the container proceeds back to the temporary lidding and preparation position for installation of a containment seal and then back to the container staging and removal position, where it is re-lidded and removed from the multistage melter module. Offgases released during melting are concurrently treated in an off-gas treatment area comprising filtration, quenching, scrubbing, and selective catalytic reduction processes to remove contaminants.

[0019] In some embodiments, a vitrification system can include a multistage melter module. The multistage melter module can include a container loading and unloading area. The multistage melter module can include a turntable. The multistage melter module can include a container preparation area. The multistage melter module can include a melt area. The multistage melter module can include a first container cooling area wherein a processed container is cooled. The multistage melter module can include a second container cooling area wherein the processed container is cooled.

[0020] The container preparation area, the melt area, the first container cooling area, and the second container cooling area can be incorporated into the turntable of the multistage melter module. The turntable within the multistage melter module can be operably configured to turn resulting in moving containers from one area to the next area. The multistage melter module can include cascading ventilation.

[0021] The multistage melter module can include one or more off-gas outlets. The multistage melter module can include an airlock in the container loading and unloading area. The multistage melter module can include one or more container lifts.The multistage melter module can include a feed inlet in the melt area. The feed inlet can be configured to provide free or metered feed to a container in the melt area. The feed can include waste or other process material, glass frit, silica sand, and / or glass formers.

[0022] The multistage melter module can include one or more air inlets. The multistage melter module can include a ventilation system. The multistage melter module can include one or more melt position seals configured to prevent release of gases, vapors, and / or particulates.

[0023] The vitrification system can include one or more remote manipulators or other remotely operated systems for performing operations in the system remotely. The vitrification system can further include a control room that is operable to control operations in the vitrification system and / or monitor operations in the vitrification system. The control room can be remote from the vitrification system. The control room can be proximate to the vitrification system. The vitrification system can further include a human machine interface.

[0024] The vitrification system can further include one or more sensors. The one or more sensors can include contact sensors, non-contact sensors, capacitive sensors, inductive sensors, 2D range sensors, 3D imagers, fiber optic cables, cameras, thermal imagers, thermometers, pressure sensors, accelerometers, inertial measurement units (IMU), rotary encoders, radiation detectors, LIDAR, and / or strain sensors. The camera can be an IR camera, and the IR camera can include heat or radiation shielding.

[0025] The general description is provided to give a general introduction to the described subject matter as well as a synopsis of some of the technological improvements and / or advantages it provides. The general description and background are not intended to identify essential aspects of the described subject matter, nor should they be used to constrict or limit the scope of the claims. For example, the scope of the claims should not be limited based on whether the recited subject matter includes any or all aspects noted in the general description and / or addresses any of the issues noted in the background.DESCRIPTION OF DRAWINGS

[0026] The preferred and other embodiments are described in association with the accompanying drawings in which:

[0027] Fig. 1A is an isometric view of an embodiment of an exemplary melt container.

[0028] Fig. IB is an isometric cross-sectional view of the melt container embodiment of Fig. 1A.

[0029] Fig. 1C is a cross-section illustration of the melt container embodiment of Fig.1A.

[0030] Fig. 2 is a block diagram depicting an exemplary vitrification system.

[0031] Fig. 3A is an isometric view of the exemplary vitrification system of Fig. 2.

[0032] Fig. 3B is a top view of the exemplary vitrification system of Fig. 2.

[0033] Fig. 3C is a front view of the exemplary vitrification system of Fig. 2.

[0034] Fig. 4 is a block diagram depicting an overview of an exemplary vitrification system.

[0035] Fig. 5 is a block diagram depicting an exemplary Container Preparation and Material Handling Area.

[0036] Fig. 6 is an isometric view of an embodiment of a multistage melter module.

[0037] Fig. 7 is a top view of the multistage melter module embodiment of Fig. 6.

[0038] Fig. 8 is an angled view showing the internal components of the multistage melter module embodiment of Fig. 6.

[0039] Fig. 9 is an angled view of the multistage melter module embodiment of Fig. 6.

[0040] Fig. 10 is zoomed in angled cross-section view of the top of the multistage melter module embodiment of Fig. 6.

[0041] Fig. 11 is an illustration depicting various zones within the multistage melter module.

[0042] Fig. 12A is an illustration depicting dual multistage melter modules.

[0043] Fig. 12B is an illustration depicting three multistage melter modules.

[0044] Fig. 12C is an illustration depicting four multistage melter modules.

[0045] Fig. 13 is a block diagram depicting an exemplary Melt Station Area.

[0046] Fig. 14 is a block diagram depicting an exemplary Off-Gas Treatment Area.

[0047] Fig. 15 depicts an embodiment of an electronic computing device.

[0048] Fig. 16 depicts embodiments of the devices that may be included as part of the electronic computing device.

[0049] Fig. 17 depicts various embodiments of the electronic computing device in Fig. 15 communicatively linked to one or more additional electronic computing devices by way of a network.DETAILED DESCRIPTION OF EMBODIMENTSIntroduction

[0050] Vitrification processes entail processing retrieved waste, or other material, to produce a stable glass waste form / vitrified product suitable for permanent disposal. Waste may come in many different forms and be retrieved in many ways. For example, it may be steel drums of waste that get shredded and fed to the melter, or sodium containing waste, contaminated soil, spent sorption media, processed or unprocessed asbestos waste (wherein the asbestos waste is ground, milled, shredded, or left in original form), plenum tips, liquid raffinate, or a multitude of other waste sources. Other materials may be processed. The term waste, as used herein, indicates any material or materials that are being processed into the final vitrified product whether derived from a waste form or not. The term waste may also be used interchangeably with process material.

[0051] In container vitrification treatment is similar to conventional vitrification methods. It differs in that the entire vitrification process and subsequent storage of the vitrification process product can occur within the same container thus reducing equipment and steps required in final processing of the vitrification process product for storage. The container used in the vitrification process may be a sealed electric arc furnace, joule heated melter, other type of sealed furnace or melter, three cubic meter box, four cubic meter box, metal drum, industrial drum containers, a custom design, a square shaped box, a rectangular shaped box, a cylinder, a high level waste (HLW) container, a short naval SNF container, or any known in the art or conceived unique container rated for heat levels required for vitrification of materials within it. In some embodiments, the container is comprised at least partially of steel. In some embodiments, the container may be comprised of one or more of steel, lead, concrete, or ceramic. The container(s) may vary in size and form depending on required throughput and facility size, among other factors.

[0052] Figs. 1A, IB, and 1C depict various views of an embodiment of an exemplary container 400. The depicted embodiment is merely one example of a container 400. The container 400 can take a variety of different shapes, forms, and sizes depending upon the application and / or final disposition requirements. In some embodiments, the container 400 may have a high aspect ratio, for instance in the range of 10 feet tall by 2 feet in diameter, while other ranges are possible. In some embodiments, larger Short Naval SNF containers may be utilized. Utilization of larger containers, SNF or otherwise, allows for greater flow rates, larger throughput, and dual phase (4 electrode) melt configurations which allows for a melt to complete if one of the phases is lost, in some embodiments. The container may be referred to herein as container, melt container, or vitrification container, which are all used interchangeably.

[0053] In the embodiment depicted in Figs. 1A through 1C, the container 400 is lined with refractory / insulation 405. Two electrodes 2 extend through the top of the container 400 to near the base of the container 400. The starter path 410 extends partway up the container 400 past the base of the electrodes 2. The waste or material to be processed fills the container 400 above the starter path 410. Other embodiments are possible. For instance, in some embodiments, more than two electrodes 2 may be utilized, particularly for larger melt containers. In some embodiments, the melt may be top down in which the container is pre-filled with waste and the starter path 410 is placed on top of the waste. In some embodiments, the melt may be bottom up in which the starter path is installed at the base of the container 400 and waste is added to the container 400 as the melt progresses.Vitrification Process Overview

[0054] Fig. 2 is a block diagram depicting an exemplary vitrification system. Figs. 3A through 3C are system drawings depicting various views of the exemplary vitrification system of Fig. 2.

[0055] In some embodiments, the vitrification system 1 comprises one or more of a blending system 10, feed system 20 (pneumatic, in some embodiments), multistage melter module 200, and off-gas treatment system (OGTS) 40 (separate process, in some embodiments). The multistage melter module 200 may also be referred to herein as the multistage melter system and / or the multistage melter. In some embodiments, the multistage melter is at least one of modular or mobile to allow for quick installation on a site or within an existing process. In some embodiments, the vitrification system 1 may be used for calcine processing. In some embodiments, one or more of each of the blending system 10, feed system 20, multistage melter module 200, and off-gas treatment system (OGTS) 40 may be included for safety, redundancy, and / or increased throughput.

[0056] In some embodiments, the OGTS 40 comprises one or more of filtration system(s) 30, 60 (sintered metal filter(s) and / or HEPA filters, in some embodiments), scrubbing system 50 (wet scrubbing, in some embodiments), one or more blowers 70 (including redundant blowers, in some embodiments), and an emissions point 80.

[0057] In some embodiments, off-gas treatment begins above the container with a filter 30 (sintered metal filter (SMF), in some embodiments) where the majority of offgas particulate (99.97%, in some embodiments) may be removed. In some embodiments, the Off-Gas Treatment System (OGTS) 40 filters, scrubs, tempers, and / or monitors the process off-gases prior to release to the environment. Typical constituents of concern (COCs) for removal from the off-gas to meet environmental requirements may include one or more of volatile iodine (1-131), semi-volatile cesium- 134 (Cs-134), cesium-137 (Cs-137), technetium (Tc-99), and much less volatilestrontium-90 (Sr-90), in some embodiments. Other contaminants may be monitored and / or removed.

[0058] Filters may be one or more of sintered metal filters (SMF), HEGA, and / or HEPA filters. In some embodiments, particulates from the one or more filters 30, 60 may be captured and recycled to the container to be incorporated into the melt. In some embodiments, particulates from the one or more filters 30, 60 may be recycled back into the waste for processing. In some embodiments, spent filters 30, 60 may be disposed of in appropriately licensed landfills or follow established site-specific disposal pathways.

[0059] OGTS embodiments are described in more detail in co-pending application Systems and Methods for Vitrification Process Control, PCT App. No. PCT / US2022 / 074945 filed August 12, 2022, with a priority date of August 13, 2021, which is herein incorporated by reference in its entirety.Melt Process

[0060] Figs. 4, 5, 13, and 14 depict an exemplary vitrification system. Fig. 4 depicts an overview of an exemplary vitrification system. The depicted vitrification system comprises a Container Preparation and Material Handling Area 5 (Fig. 5), a Melt Station Area 25 (Fig. 13), and Off-Gas Area 40 (Fig. 14), and Discharge / Disposal / Storage Area 85.

[0061] Fig. 5 depicts a Container Preparation and Material Handling Area 5. The Container Preparation and Material Handling Area 5 is a clean area where empty melt containers (an embodiment of a possible container is depicted in Figs 1A through 1C) are assembled and bulk materials (i.e. glass formers and starter path) are loaded into their respective feed hoppers 515, 520, 525. In some embodiments, the Container Preparation and Material Handling Area 5 requires approximately 320 square feet of space; however, other sizes and configurations are possible. In some embodiments, the Container Preparation and Material Handling Area 5 may be co-located with the Melt Station Area 25. The majority of container preparation could also be performed off-site and delivered in a near ready-to-go configuration on-site, in some embodiments. The material handling is typically located within the distance allowable for a conveyance system (typically pneumatic vacuum transfer) to connect to the Melt Station Area 25.

[0062] In the depicted embodiment, the container is prepared 505 using an empty container, insulation, refractory, two or more electrodes, an outer lid, and a containment seal. The prepared container then moves to the Melt Station Area 25 (Fig. 13). Refractory and insulation materials may be used to separate the area where the waste and vitrification process occur from the container walls. The refractory creates a “freeze plane” zone where, should the refractory develop a crack, the molten glasswill freeze within the refractory extents, thus self-sealing against potential molten glass leaks.

[0063] In some embodiments, the two or more electrodes are composed of a graphite or other conductive material and conduct the electricity to the starter path and ultimately directly to the waste, or material to be processed, to perform the joule heating of the contents of the container. The temperature differences in the vicinity of the two or more electrodes create convection currents within the container to mix waste with the one or more feed materials and create homogeneity in the vitrified product. The containment seal isolates the container contents from the environment when it is not within the melt station enclosure. The outer lid provides a second layer of isolation.

[0064] Different electrode configurations are possible: single-phase (2 electrodes) and dual-phase (4 electrodes) configurations. In some embodiments, single-phase electrode configurations may be utilized to maximize the available area for vitrified waste in each container. While a dual-phase configuration (4 electrodes) reduces the available volume by the volume of the electrodes, its main benefit is that if one of the phases has an issue the melt can continue to finish using the other phase. Larger diameter electrodes may be utilized to increase robustness, in some embodiments. Other quantities of electrodes are possible depending on the size and configuration of the system and container.

[0065] Graphite and / or glass frit may proceed through a graphite hopper 520 and a glass frit hopper 525, respectively, into a starter path / blender hopper 510 where they are mixed before proceeding to the Melt Station Area 25 (Fig. 13). In some embodiments, the graphite and / or glass frit can be fed into the blender hopper 510 by pneumatic vacuum conveyance, an auger system, by gravity feed, or other methods. The graphite and / or glass frit may be supplied in supersacks or other bulk delivery methods. The quantity of one or both the graphite and glass frit may be based on a predefined ratio which may be based on the properties of the waste or other material to be processed. In some embodiments, each hopper 510, 520, 525 is sized to contain, at a minimum, slightly more material than required to perform a single melt. The starter path material may be conveyed (by pneumatic vacuum conveyance, in some embodiments) directly to the melt container in the Melt Station Area 25 (Fig. 13) from the blender hopper 510. Depending on the site-specific and waste / process materialspecific needs, the ratio of glass frit to graphite, or other starter materials, may vary.

[0066] Glass formers may be fed through the glass forming materials (GFM) hopper 515 to the Melt Station Area 25 (Fig. 13). The glass forming materials may be supplied in supersacks or other bulk delivery methods. In some embodiments, each hopper 515 is sized to contain, at a minimum, slightly more material than required to perform a single melt. The glass forming material (GFM) is ready to be conveyed (typically bypneumatic vacuum conveyance, in some embodiments) directly to the feed blend hopper 540 in the Melt Station Area 25 (Fig. 13) from the storage hopper 515.

[0067] Dust handling for Container Preparation and Material Handling Area 5 activities is typically handled by either local filtration to the hoppers 510, 520, 525 themselves and / or supplemented by a dust collection system. Since this area is generally located outside of potentially contaminated zones, any dust mitigation is typically not co-mingled with dust handling performed on equipment in the Melt Station Area 25 (Fig. 13). Power is supplied. In some embodiments, the Container Preparation and Material Handling Area 5 further comprises at least one of an electronic computing device 101 and one or more sensors 139. In some embodiments, data from the one or more sensors 139 may be processed by the electronic computing device 101. The electronic computing device 101 can use sensor data to generate control signals used to control one or more operations in the system.Multistage Melter Module Embodiment

[0068] Figs. 6 through 9 depict various views of an embodiment of a multistage melter module 200. In some embodiments, the multistage melter module 200 comprises one or more of an off-gas and feed connections 215, container staging and removal area or position 305, container loading and unloading port 210, container lifts 230, and a turntable 225. In some embodiments, the turntable 225 comprises cascading ventilation. The turntable 225 allows for multiple containers 400 (Figs 1A- 1C) to proceed through different melt and cooling stages concurrently.

[0069] Fig. 10 depicts a zoomed in cross-section view of the top of the multistage melter module 200. The depicted embodiment comprises feed inlet 245, air inlet 250, off-gas outlet 240, electrode contactor 255, and melt position seals 235. The feed inlet 245 is positioned just above the melt stage (Stage 3) 315. Waste material, frit, and / or glass formers may be fed into the process through the feed inlet 245. Melt position seals 235 are used to seal the melt stage (Stage 3) 315 area during melting to prevent release of potentially hazardous gases, vapors, and particulates from being released to the environment by isolating the melt container 400 (Figs 1A-1C) plenum process ventilation area. The off-gas outlet 240 directs off-gases produced during the melt stage (Stage 3) 315 away from the multistage melter module 200 to be processed and / or released to the environment depending on contaminant types and levels present. The air inlet 250 provides fresh air to the process. The electrode contactor 255 provides electrical contact to the two or more electrodes to generate heat for the melt process (Stage 3) 315.

[0070] Fig. 11 is an illustration depicting various zones within the multistage melter module 200. The positions comprise Container Staging and Removal 305, Temporary Lidding and Preparation 310, Melting 315, and Cooling 320, 325. In someembodiments, other stage configurations are possible including more or fewer stages, as needed for the application.

[0071] In position one, Container Staging and Removal 305, the vitrification container having most recently completed the processing steps is unloaded and a new container 400 (Figs 1A-1C) is loaded into the multistage melter module 200 to initiate processing. Position one is located within an airlock 205, in some embodiments. In the airlock 205, the outer lid is removed from any new container being moved in and held in place for installation on any container that is ready to be sealed and removed from the Melt Area.

[0072] In position two, Temporary Lidding and Preparation 310, the new container 400 (Figs 1A-1C) is prepared for the following melt and cooling steps by removing the containment seal and placing a temporary lid that minimizes contaminated surfaces during container 400 transport to / from position one.

[0073] In position three, Melting 315, the feed material (i.e. blend of waste and glass formers), starter path(s), and process material / waste are fed in the container and the contents are vitrified. Both the feed material and starter path materials are conveyed (typically pneumatic vacuum conveyance) to receivers located above position three, in some embodiments. The materials may be gravity fed in measured batches through isolation valves directly into the container, in some embodiments.

[0074] During the vitrification process, the melt progresses from where the starter path (single or multiple paths) are layered during the fill process. The starter path location(s) increase throughput by allowing the melt to proceed in multiple directions up and down the container, and also protects the bottom of the container from unnecessary heat exposure. The volume reduction of the feed material allows for additional feeding of waste material to occur as needed until the container is full of melted glass. Melt progress can be observed visually with an infrared (IR) camera that monitors the top material surface, in some embodiments. External container noncontact temperature indication gives the operator an indication of melt progress below the top material surface, in some embodiments. In some embodiments, the melt may be top down in which the container is pre-filled with waste and the starter path 410 is placed on top of the waste. In some embodiments, the melt may be bottom up in which the starter path is installed at the base of the container 400 and waste is added to the container 400 as the melt progresses.

[0075] The container plenum (i.e. head space above the melt surface) is isolated from the rest of the enclosure, in some embodiments, and utilizes a small amount of sweep air to collect process off-gas and dust from the material feed and melt processes. This process off-gas may be handled by a separate system than the balance of enclosure ventilation. The process off-gas dust may be captured in a close coupledsintered metal filter (SMF), in some embodiments, and may be subsequently recycled directly into the melt container for high material retention within the system.

[0076] In some embodiments, the total time for a container in position three is 40 hours. This includes the time to load the feed material and perform the melt. This time will vary depending on a number of factors including process material, multistage melter module and container sizes, throughput, and number of electrodes.

[0077] In positions four and five, Cooling 320, 325, the container 400 (Figs 1A-1C) cools after the melt until it reaches a predetermined temperature where the containment seal and outer lid can be reinstalled. After cooling, the completed container with solidified glass product proceeds back to position one (i.e., Container Staging and Removal 305) for unloading. The quantity and length of required cooling stages depends on the throughput of the process and environmental factors relative to the container (surface temperature, glass temperature).

[0078] The positions can be occupied simultaneously with containers at various processing stages. For example, while a melt is being performed in position three, there can also be two containers cooling in positions four and five while a fourth container is getting lidded, removed, and a new container loaded in positions one and two.

[0079] The multistage melter module 200 cascading ventilation is comprised of multiple zones, in some embodiments. The zones comprise:• Zone 1 - Airlock. An area isolated from Zone 2 and the facility and used for container loading and unloading. Separation between Zone 1 and the facility and between Zone 1 and Zone 2 is maintain with operable doors / lids. When required, the processed container is inspected for contamination and where identified the contamination is removed or fixed in place (may also be placed in Zone 2). When required, the processed container receives a final lid that is securely fastened.• Zone 2 - Secondary Containment. An area isolated from the airlock and primary sources of contamination that contains the container lifts 230 and turntable 225 along with additional actuators and one or more sensors. Separation between Zone 2 and Zone 3 is maintained by the melt position seals and a temporary lid is used to minimize contaminated surfaces. The container lift raises the container and seals the upper surface of the temporary lid to the lid removal tool and the upper seal of the container to the melt position seals. The melt position seals are energized and when the container lift partially lowers the lower surface of the temporary lid and the interior of the container are exposed to Zone 3 while the upper surface of the temporary lid and exterior of the container are maintained as Zone 2.• Zone 3 - Primary Containment. An area isolated from Zone 2 and active melt off-gas. Separation between Zone 3 and Zone 4 is maintained by the melt position seals and placed by the container lifts. Raising the container also connects the electrode contactors and the electrodes. Zone 3 also confines potentially hazardous gases, vapors, and particulates generated in Stages 4 and 5. Furthermore, Zone 3 isolates any potential release from Zone 4 that may occur during melting.• Zone 4 - Active Melt Off-Gas.

[0080] Fig. 12A depicts a dual multistage melter system with a shared airlock 205. In the depicted embodiment, both multistage melter modules 200a, 200b comprise the same components (e.g„ turntables 225a, 225b, temporary lidding and preparation 310a, 310b, melting 315a, 315b, and cooling 320a, 320b, 325a, 325b) and steps with shared airlock 205 and container staging and removal 305 process area. The airlock 205 is flexible and can be expanded to meet the desired throughput. For example, a single airlock 205 can feed both multistage melter modules 200a, 200b. In some embodiments, the airlock may comprise one or more turntables (not shown) to facilitate in movement and transfer between the two or more multistage melter modules 200a, 200b. In some embodiments, four or more multistage melter modules may be positioned to utilize a single airlock. Figs. 12B and 12C depict embodiments comprising three multistage melter modules 200a, 200b, 200c and four multistage melter modules 200a, 200b, 200c, 200d, respectively, with a shared airlock. These embodiments operate in similar fashion to the dual system.

[0081] When multiple multistage melter modules 200a, 200b are utilized, each multistage melter module 200a, 200b may require its own vacuum conveyance receiver and SMF. In some embodiments, the material hopper 530 and feed blender / hopper 540 can optionally be shared with more than one multistage melter module 200a, 200b. Typically, the volume of these hoppers 530, 540 (Fig. 5) is, at a minimum, slightly larger than required to perform a single melt. The components in the Container Preparation and Material Handling Area 5 (Fig. 5) can also be shared with all melters.

[0082] Fig. 13 depicts an embodiment of a Melt Station Area 25. In some embodiments, the vitrification system utilizes electric current (joule heating) to convert waste, or other material(s) to be processed, and glass formers into stable monolithic glass / vitrified product. The process occurs in a container with internal insulative layers surrounding a waste product, or other material(s) to be processed, with glass forming materials referred to as feed material. The melting of the feed material is initiated by a low temperature melting “starter path” and direct resistive heating, in some embodiments. Once the temperature of the nearby waste / process material and glass formers is high enough, they begin to incorporate into the melt andbecome increasingly conductive, thereby allowing for increased power to progress the melt throughout the container. As the glass depth reduces inside the container, additional feed material may be added in order to maximize utilization of the melt container volume. The insulative materials serve to protect the container and direct the melt process towards the lower melting point waste and glass formers.

[0083] The prepared container 505 (Fig. 5) is loaded 545 into the first position (i.e., container staging and removal 305; Fig. 11) in the airlock 205 where the lid is removed 550. The containment seal is removed 555 in the second position (i.e., temporary lidding and preparation 310; Fig. 11). The container then proceeds to the third position (melt stage (Stage 3) 315; Fig. 11). Waste, or other material(s) to be processed, from material receipt hopper 530 and glass formers, from the GFM hopper 515 (Fig. 5) are conveyed (typically pneumatic vacuum transfer) to a feed blender / hopper 540 to create the feed material which is loaded 560 into the container in the third position (melt stage (Stage 3) 315; Fig. 11). The starter path is conveyed (typically pneumatic vacuum transfer) from starter path blender / hopper 510 (Fig. 5) to be loaded 560 into the container in the third position (melt stage (Stage 3) 315; Fig. 11). Other material conveyance systems and methods are possible.

[0084] Off-gas generated during the melt process may proceed through a sintered metal filter (SMF) 535, in some embodiments. In some embodiments, the off-gas may proceed directly to an off-gas processing system. In some embodiments, the SMF 535 captures most of the particulate generated during the melt process. In some embodiments, the SMF 535 is close-coupled HEPA rated. The SMF 535 can be rated up to 99.97 percent removal efficiency for 0.3 pm particulate, in some embodiments. The SMF 535 is cleaned of particulate through back pulsing using compressed air. This particulate collected from the SMF 535 backpulse may be recycled into the melt. In some embodiments, other filter(s) or filter type(s) may be utilized as needed for the particular material to be processed.

[0085] Once the melt is complete, the multistage melter module 200 rotates the container to a first cooling stage at position four (i.e., cooling 320) where the container is cooled 565 followed by another cooling stage at position 5 325 where the container continues cooling 570. After cooling 565, 570, the container returns to position two (temporary lidding and preparation 310; Fig. 11) where the containment seal is installed 575. Finally, the container returns to position one (i.e., container staging and removal 305; Fig. 11) in the airlock 205 where it is re-lidded 580. The cooled and sealed container is removed 585 from the melt station through the airlock 205. The container is then moved to storage or other disposition 590. In some embodiments, the container is moved outside of the multistage melter module 200 (Figs 6-10) using an overhead crane.

[0086] In some embodiments, the Melt Station Area 25 requires approximately 320 square feet (160 square feet for each of two melters, plus another 160 square feet for the hopper and hopper / blender) of space for the hoppers and the melt station itself. Other embodiments are possible.

[0087] Dust handling for the Melt Station Area 25 hoppers 530, 540 is used to mitigate contamination, in some embodiments. As such, equipment such as a SMF 535 on the material receipt hopper 530 may be used to collect and recycle waste, or other materials to be processed, back into the melt system. In some embodiments, for the pneumatic vacuum conveyors, the receivers have a HEPA rated backpulsable filter to retain as much dust within the system as practicable. The exhaust of the vacuum pumps may be HEPA filtered and, in some embodiments, may be routed to the facility exhaust stack.

[0088] Air and power may be supplied to the Melt Station Area 25. In some embodiments, the air is pre-filtered with a filter such as the depicted HEPA filter. In some embodiments, the Melt Station Area 25 further comprises at least one of an electronic computing device 101 and one or more sensors 139. In some embodiments, data from the one or more sensors 139 may be processed by the electronic computing device 101. The electronic computing device 101 can use sensor data to generate control signals used to control one or more operations in the system.The Off-Gas Area

[0089] Fig. 14 is a block diagram depicting an embodiment of an Off-Gas Treatment System Area 40. The Off-Gas Treatment System Area 40 may be used to treat the process off-gas as well as the ventilation filtration for the melt station. The Off-Gas Treatment System (OGTS) 40 tempers, chemically treats, scrubs, filters, and monitors the process off-gases before discharge to the atmosphere. The OGTS 40 collects gases, particulates, and vapors from the melt container. In addition, the OGTS 40 maintains flow through, and a negative pressure relative to atmospheric within, the melt container during processing.

[0090] During the initial start of the melt process, the OGTS 40 is at ambient temperature from the melt container to the inlet of heater 615. To minimize the potential for condensation of acidic gases, the inlet air to the melt container may be heated and the lines from the melt container to the sintered-metal filter and to the quencher inlet, heat traced. Heat is supplied to maintain the walls of the piping and components above the condensation temperature, in some embodiments.

[0091] In the depicted embodiment, off-gas proceeds from the Melt Station Area 25 (Fig. 13) into a quencher / scrubber 605. The quencher / scrubber 605 comprises one or more of a quencher, scrubber tower, mist eliminator, independent or integral sumps, in some embodiments. The gas is quenched in the quencher / scrubber 605 with waterto cool the off-gas to saturation. The saturated off-gas in the scrubber 605 and is reacted with a dilute caustic (sodium hydroxide, in some embodiments) solution to remove acid gases. The scrubber 605 has an integrated mesh type mist eliminator to remove any remaining entrained moisture in the off-gas stream. A condenser can be added to the system to reduce the amount of fresh water consumption, in some embodiments.

[0092] In some embodiments, semi-volatile radionuclides and / or blowdown (dissolved solids, salinity, in some embodiments) from the quench / scrubber may be treated at 610 using one or more of ion exchange, evaporation, crystallization, and / or water reclamation.

[0093] The off-gas stream is then heated 615 to reduce the relative humidity, the offgas stream is drawn through one or more HEGA filters 620 (redundant, in some embodiments) with one or more carbon filter(s) to adsorb mercury and one or more carbon filter(s) to absorb any residual radioactive iodine, in some embodiments. In some embodiments, the off-gas stream is drawn through a polishing filter to capture any “break-up” of the carbon filter media and prevent the media from entering the HEPA filter 625. After the HEGA filter(s) 620, the gas passes through a HEPA filter 625. In some embodiments, the gas is pre-filtered prior to entering the HEPA filter 625. In some embodiments, two HEPA filter 625 banks are used in series to remove radioactive particulate. The HEGA 620 and HEPA filter 625 have redundancy, with the off-gas stream passing through one set of adsorbers and filters, while the second set of adsorbers and filters are on standby. In some embodiments, the filters 620, 625 are installed on one or more skids. Any spent filters can be periodically disposed at 630

[0094] The treated off-gas from the HEPA filter 625 is then heated 635 prior to passing through a selective catalytic reduction 640 to react nitrogen oxide gases to nitrogen. The selective catalytic reduction 640 uses ammonia or urea and a titanium and vanadium oxide catalyst at elevated temperatures to reduce the nitrogen oxides, in some embodiments.

[0095] Additional off-gas from the melt station area 25 can also be directed to the off-gas treatment system area 40 and filtered by a filter 650 (e.g., HEPA filter). The offgas is then discharged through an exhaust stack 660 (or into existing facility ventilation, as appropriate) by an off-gas exhaust blower 645. The exhaust blowers 645, 655 provide the motive force to move the exhaust gases and vapors through the OGTS 40 and maintain a negative pressure within the melt container.

[0096] Before being discharged to the atmosphere, the off-gas stack monitoring system may be used to sample the off-gas stream to measure and totalize the discharge flow, temperature, radioactive and nonradioactive contaminants present (such as nitrogen oxides, sulfur oxides, carbon monoxide, hydrogen chloride,chlorine, and total hydrocarbons) being exhausted to the atmosphere. Analysis of the off-gas stream for radioactive contaminants may comprise: (1) record sample for iodine and particulate, (2) beta and gamma radiation, and (3) carbon-14 collection, in some embodiments.

[0097] In some embodiments, the Off-Gas Treatment Area 40 requires approximately 500 square feet of space and can either be co-located with the Melt Station Area 25 (Fig. 13) or in a separate area. The off-gas components can be configured in a wide variety of orientations to accommodate existing facility layout restrictions and environmental regulations.

[0098] In some embodiments, the Off-Gas Treatment System Area 40 further comprises at least one of an electronic computing device 101 and one or more sensors 139. In some embodiments, data from the one or more sensors 139 may be processed by the electronic computing device 101. The electronic computing device 101 can use sensor data to generate control signals used to control one or more operations in the system.Bulk Material Storage

[0099] Bulk materials include prepared containers, graphite, glass frit, and glass formers. The area required for storage can vary greatly depending on the preferred method(s). For example, supersacks can be stored in a separate location and delivered to the Container Preparaton and Material Handling Area 5 (Fig. 5) on a just in time basis in order to minimize square footage required in the immediate vicinity of the equipment.Sampling and Analysis

[0100] An OGTS stack monitoring system may be used to analyze the off-gas stream, collect data and samples for regulatory reporting, provide feedback for the performance of the OGTS, and provide warnings to personnel in the event of elevated exhaust stack emissions. In some embodiments, the stack monitoring system comprises one or more of:• Continuous radiation monitor (beta and gamma)• Record sampler• Carbon-14 collection system• Continuous gas emissions monitor (nitrogen oxide, sulfur dioxides, hydrogen chloride, and carbon monoxide, in accordance with applicable environmental permits)• Particulate monitor: P-10 (sub 10-micron particle)• Oxygen monitor• Total hydrocarbon monitor• Off-gas stack flow measurement• Off-gas stack temperature measurement• Shrouded and un-shrouded sample probes• Heat-traced sample transport lines• Cabinets / enclosures required to house equipment• Additional sampling may be added as required to meet specific regulatory monitoring requirements for the particular facility or waste / process materialSecondary Waste

[0101] In some embodiments, radionuclides and / or particulates from the sintered metal filter may be recycled to the melt container. In some embodiments, semi- volatile radionuclides and / or blowdown (dissolved solids, salinity, in some embodiments) from the quench / scrubber may be treated using one or more of ion exchange, evaporation, crystallization, and / or water reclamation. In some embodiments, solid wastes from the quench / scrubber may be recycled to the melt container.Chemicals and Material

[0102] The amount of materials varies by site requirements, container size, and container type. In some embodiments, the amount of graphite per container may vary between 7-74 lbs. In some embodiments, the amount of frit (low temperature engineering glass grit, in some embodiments) per container may vary between 17-174 lbs. In some embodiments, the amount of glass formers (one or more of SiO2, A12O3, BO2, etc., in some embodiments) per container may vary between 1,400-18,150 lbs. In some embodiments, water through the quench / scrubber may vary between 0.6 gpm and 7 gpm. In some embodiments, NaOH through the quench / scrubber may vary between Igph and 0.3 gpm. In some embodiments, the ammonia / urea through the selective catalytic reduction process may vary between 0.3-7.4 gph depending on bin set (based on aqueous ammonia).Sensors

[0103] One or more sensors and instruments may be used to monitor and control system properties throughout the process. The positions and types of sensors and / or instruments may be dependent upon the scale of the process as well as the chemical properties of the off-gas, among other design considerations. Types of sensors may comprise one or more of contact sensors, non-contact sensors, capacitive sensors, inductive sensors, 3D imagers, fiber optic cable, cameras, thermal imagers, thermometers, pressure sensors, radiation detectors, LIDAR, microphones, amongothers. In some embodiments, one or more infrared (IR) cameras, with or without radiation shielding, may be used in the system.

[0104] Some embodiments may comprise one or more imaging sensors. The one or more imaging sensors may comprise one or more of 3D imaging, 2D range sensor, camera (such as an IR camera or heat / radiation shielded IR camera, in some embodiments), thermal imager, and radiation detector, among others. One or more imaging sensors may be used to provide inspection and monitoring capabilities for remote operators. Signals from one or more imaging sensors may be displayed in realtime, recorded for later review, and / or recorded for operational records. Any one or more of the cameras may be one of fixed or pan-tilt-zoom types. An operator may select and manage desired camera views for operations, while controlling the cameras with associated control features such as the pan, tilt, zoom (PTZ), focus, and lights. In an embodiment, proper visual coverage of operations may be made possible by a camera system through adequate camera coverage, determined by camera quantity and location.

[0105] In some embodiments, sensors are added merely for tracking of the properties of the materials throughout the process. In some embodiments sensor data is used to control the operation of the system. Some embodiments may utilize sensor fusion algorithms to analyze data retrieved from one or more sensors of one or more different types. In some embodiments, the sensor data will automatically be analyzed and automatically effect changes in the control system for the process requiring little to no input from a human operator. In some embodiments, the sensor data and or analysis is displayed for a human operator to perform manual adjustments. In some embodiments, fiber optic cable is placed in the container with the blended waste material prior to heating. The fiber optic cable may use Raleigh backscatter to determine at least one of the temperatures of the melt material, depth of the melt activity, or progress of the melt activity.

[0106] In some embodiments, appropriate sensors may be used to monitor process conditions at one or more key locations to identify issues early, including process flow, pressure, and temperature, as well as activity levels (dose) at one or more key locations.

[0107] In some embodiments, a thermal imaging (infrared) system may be used to monitor the ICV container plenum. In some embodiments, the one or more imaging systems used may further comprise lens cleansing means to accommodate high humidity conditions that might occur, so that the image(s) are not affected. In some embodiments, a plenum inlet air heater may be utilized to overcome some of this potential issue.Control

[0108] In some embodiments, the control system may capture, store, and trend key process and facility data including but not limited to ICV and off-gas temperatures, pressures, and flow rates. In some embodiments, data may be processed on-site in near real-time. In some embodiments, data and / or processed information may be transmitted to a remote location for long-term storage. In some embodiments, the control system may comprise a Human Machine Interface (HMI) to control relevant processes.

[0109] In some embodiments, one or more remote manipulators may be used to perform remote operations. In some embodiments, one or more of silica sand, glass formers, graphite, glass frit, waste, and blended waste may be automatically metered at a controlled rate. The controlled rate may be a regular rate or automatically adjusted based on input from one or more sensors and / or imagers in the system.Reliability. Availability, and Maintainability

[0110] In some embodiments, one or more of redundancy, diversity, testing, diagnostics, and modularity are utilized to increase system robustness. The systems and methods disclosed herein are capable of processing a wide range of waste streams; in terms of size, shape, and volume and in diversity of chemical composition. In some embodiments, the system comprises of four primary subcomponents: 1) the melt container, 2) the hood / plenum, 3) the off-gas treatment system, and 4) the waste loading system. Additional support equipment may comprise power supply, waste feed conditioning, material handling equipment, thermal imaging, and facility support utilities, (such as compressed air, electrical supply, backup power systems, etc.).

[0111] In some embodiments, the melter systems are flexible and can be a batch or a batch combined with feed-while-melting waste treatment process. In some embodiments, the melt process is performed in a refractory-lined steel container. Containers may serve as the disposal / transport container or may be reused, depending on project, site, and / or waste requirements. Waste material can either be blended with glass-formers (if needed) and transferred to the treatment container or be placed directly into the treatment container in a separate smaller container and surrounded with glass forming materials, in some embodiments.

[0112] Reliability improvements to the container may comprise one or more of: reinforcing walls of larger sized containers; modular walls for easier removal of vitrified material, replacement of a damaged panel, or a configuration change; materials of construction; and mobility considerations. In some embodiments, additional melt containers are kept on standby, such that if process issues arise with a particular container, that container is easily removed and replaced with the standbymelter container, and treatment can be continued with no need for plant shutdown and / or costly and time-consuming repair.

[0113] The modular nature of the off-gas treatment system allows it to be tailored to a specific waste stream, enabling optimal emissions control with minimal complexity. Waste feed systems can become very complex depending on the nature of the waste. In some embodiments, a waste feed system utilizes gravity feed hoppers, dual valve air-lock isolation, and mechanical conveyance that blends the waste and glass forming material at the appropriate ratios before introducing it into the melter at a controlled feed rate. The feed rate may be one of continuous or metered.Accessibility

[0114] In some embodiments, major components are designed to be less than 10 feet wide. In some embodiments, major components are sized to be shipped by road, rail, or air. In some embodiments, the system is assembled and commissioned off-site, then disassembled, and shipped on-site for reassembly to ensure that it is sized appropriately for the available site access. In some embodiments, the components are placed using a combination of overhead cranes, mobile cranes, and forklifts. In some embodiments, the equipment lifting features are tailored to best fit individual facility requirements.

[0115] The embodiments described above and illustrated in the figures are presented by way of example only and are not intended as a limitation upon the concepts and principles of the present disclosure. As such, it will be appreciated by one having ordinary skill in the art that various changes in the elements and their configuration and arrangement are possible without departing from the spirit and scope of the present disclosure as set forth in the appended claims.Illustrative Embodiments

[0116] The following is a description of various embodiments of the disclosed subject matter. Each embodiment may include one or more of the various features, characteristics, or advantages of the disclosed subject matter. The embodiments are intended to illustrate a few aspects of the disclosed subject matter and should not be considered a comprehensive or exhaustive description of all possible embodiments.

[0117] Pl. A vitrification system, comprising: a container preparation area (5) where melt containers (400) are prepared; a melt station area (25) comprising at least one multistage melter module (200), wherein the at least one multistage melter module (200) comprises: a container staging and removal position (305); a temporary lidding and preparation position (310); a melt position (315); a first container cooling position (320); a second container cooling position (325); and a turntable (225), wherein the turntable (225) is configured to move the melt containers (400) between the container staging and removal position (305), the temporary lidding and preparation position(310), the melt position (315), the first container cooling position (320), and the second container cooling position (325); and an off-gas treatment area (40).

[0118] P2. The vitrification system of Pl, further comprising at least one sensor(139).

[0119] P3. The vitrification system of P2, further comprising: processing sensor data from the at least one sensor (139) with an electronic computing device (101) configured to provide control signals to operate the vitrification system using data received from the at least one sensor (139).

[0120] P4. The vitrification system of any one of P1-P3, wherein the container staging and removal position (305) is located within an airlock (205).

[0121] P5. The vitrification system of any one of P1-P4, wherein more than one melt container (400) is processed concurrently, with each melt container (400) at a different position with the at least one multistage melter module (200).

[0122] P6. The vitrification system of any one of P1-P5, wherein the at least one multistage melter module (200) comprises a feed inlet, wherein the feed inlet is configured to provide feed to one of the melt containers in the melt position (315) and wherein the feed comprises process material, waste, glass frit, silica sand, and / or glass formers.

[0123] P7. The vitrification system of any one of P1-P6, comprising dual multistage melter modules (200a, 200b) and wherein the dual multistage melter modules (200a, 200b) share the container staging and removal position (305).

[0124] P8. A vitrification process, comprising: preparing a melt container (400) in a container preparation area (5) resulting in a prepared melt container (400); using a multistage melter module (200) comprising a turntable (225) to: receive the prepared melt container (545) in a container staging and removal position (305); remove a lid (550) from the melt container (400) at a temporary lidding and preparation position (310); load starter path and process material (560) into the prepared melt container (400); melt the process material (560) in the melt container (400) at a melt position (315) resulting in a processed container containing vitrified process material; cooling the processed container (565) at a first container cooling position (320); cooling the processed container (570) at a second container cooling position (325); installing a containment seal (575) to the processed container at the temporary lidding and preparation position (310); removing the containment seal (580) from the processed container at the container staging and removal position (305); and removing the processed container (585) from the container staging and removal position (305); and treating process off-gas in an off-gas treatment area.

[0125] P9. The vitrification process of P8, wherein the process material comprises calcine containing materials, process waste, sodium containing wastes, shredded steel drums, contaminated soil, spent sorption media, processed or unprocessed asbestos waste, plenum tips, and / or liquid raffinate.

[0126] PIO. The vitrification process of any one of P8-P9, further comprising monitoring at least one process parameter with at least one sensor (139).

[0127] Pll. The vitrification process of PIO, further comprising processing sensor data from the at least one sensor (139) with an electronic computing device (101) configured to provide control signals to operate the vitrification process.

[0128] P12. The vitrification process of any one of P8-P11, wherein the container staging and removal position (305) is located within an airlock (205).

[0129] P13. The vitrification process of any one of P8-P12, wherein more than one melt container (400) is processed concurrently, with each melt container (400) at a different position with the multistage melter module (200).

[0130] P14. The vitrification process of any one of P8-P13, wherein the multistage melter module (200) comprises a feed inlet, wherein the feed inlet is configured to provide feed to the melt container in the melt position (315) and wherein the feed comprises the process material, waste, glass frit, silica sand, and / or glass formers.

[0131] P15. The vitrification process of any one of P8-P14, comprising dual multistage melter modules (200a, 200b) and wherein the dual multistage melter modules (200a, 200b) share the container staging and removal position (305).

[0132] P16. A vitrification system, comprising: a container preparation area; a melt area comprising a multistage melter module; and an off-gas treatment area.

[0133] P17. A vitrification system, comprising: a container preparation area; a melt area comprising a multistage melter module, wherein the multistage melter module comprises: a container staging and removal position; a temporary lidding and preparation position; a melt position; a first container cooling position; and a second container cooling position; and an off-gas treatment area.

[0134] P18. A vitrification system, comprising: a container preparation area where melt containers are prepared; a melt area comprising a multistage melter module, wherein the multistage melter module comprises: a container staging and removal position where the melt containers enter and exit the multistage melter module; a temporary lidding and preparation position where temporary lids are installed on the melt containers; a melt position where contents of the melt containers undergoes a melt process; a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled; and an off-gas treatment area.

[0135] P19. A multistage melting system, comprising: a turntable, a container staging and removal position, where melt containers enter and exit the turntable; a temporary lidding and preparation position, where temporary lids are installed on the melt containers; a melt position where contents of the melt containers undergo a melt process; a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled.

[0136] P20. A multistage melting system, comprising: a container loading and unloading area; a turntable; a container preparation area; a melt area; a first container cooling area wherein a processed container is cooled; and a second container cooling area wherein the processed container is cooled.

[0137] P21. A vitrification system, comprising: a blending system; a feed system; a multistage melter module; and an off-gas treatment system.

[0138] P22. A vitrification system, comprising: a blending system; a feed system; and a multistage melter module.

[0139] P23. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in a melt area, wherein the melt area comprises a multistage melter module; and treating process off-gas in an off-gas treatment area.

[0140] P24. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in the melt container in a melt area, wherein the melt area comprises multistage melter module and wherein the multistage melter module comprises: a container staging and removal position; a temporary lidding and preparation position; a melt position; a first container cooling position; and a second container cooling position; and treating process off-gas in an off-gas treatment area.

[0141] P25. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in the melt container in a melt area comprising a multistage melter module, wherein the multistage melter module comprises: a container staging and removal position where melt containers enter and exit the multistage melter module; a temporary lidding and preparation position where temporary lids are installed on the melt containers; a melt position where the process material undergoes a melt process; a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled; and treating process off-gas in an off-gas treatment area.

[0142] P26. A multistage melting process, comprising: loading a melt container into a container staging and removal position; installing a temporary lid to the melt container at a temporary lidding and preparation position; vitrifying process material in the melt container at a melt position resulting in vitrified process material; coolingthe melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; and removing the melt container with the vitrified process material from the container staging and removal position.

[0143] P27. A multistage melting process, comprising: preparing a melt container in a container preparation area; and using a turntable to rotate the melt container through a multistage melt process comprising: loading the melt container in a container loading and unloading area; vitrifying process material in the melt container at a melt position resulting in vitrified process material; cooling the melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; and removing the melt container with the vitrified process material from the container loading and unloading area.

[0144] P28. A multistage melting process, comprising: preparing a melt container in a container preparation area; and using a turntable to rotate the melt container through a multistage melt process comprising: loading the melt container in a container staging and removal position; removing a lid of the melt container in the container staging and removal position; installing a first containment seal in a temporary lidding and preparation position; loading process materials, glass formers, starter path, and / or glass frit into the melt container; vitrifying process material in the melt container at a melt position resulting in vitrified process material; cooling the melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; installing a second containment seal at the temporary lidding and preparation position; removing the melt container with the vitrified process material from the container staging and removal position.

[0145] P29. The systems and methods of any one or more of the preceding paragraphs, wherein one or more components of the systems are modular.

[0146] P30. The systems and methods of any one or more of the preceding paragraphs, wherein the container staging and removal position is an airlock.

[0147] P31. The systems and methods of any one or more of the preceding paragraphs, wherein the process material comprises calcine containing materials, process waste, sodium containing wastes, shredded steel drums, contaminated soil, spent sorption media, processed or unprocessed asbestos waste, plenum tips, and / or liquid raffinate.

[0148] P32. The systems and methods of any one or more of the preceding paragraphs, wherein the melt container is a sealed electric arc furnace, a joule heated melter, other type of sealed furnace or melter, a three cubic meter box, a four cubicmeter box, a metal drum, an industrial drum container, a custom design, a square shaped box, a rectangular shaped box, a cylinder, a high-level waste container, or a short naval SNF container.

[0149] P33. The systems and methods of any one or more of the preceding paragraphs, wherein the melt container is composed or made of steel, lead, concrete, and / or ceramic.

[0150] P34. The systems and methods of any one or more of the preceding paragraphs, wherein the melt container is lined with refractory and / or insulation.

[0151] P35. The systems and methods of any one or more of the preceding paragraphs, wherein a starter path is inserted into the melt container prior to the vitrification process.

[0152] P36. The systems and methods of any one or more of the preceding paragraphs, wherein the melt container is prepared with insulation, refractory, two or more electrodes, an outer lid, and a containment seal.

[0153] P37. The systems and methods of any one or more of the preceding paragraphs, wherein two electrodes are used in the melt container.

[0154] P38. The systems and methods of any one or more of the preceding paragraphs, wherein four electrodes are used in the melt container.

[0155] P39. The systems and methods of any one or more of the preceding paragraphs, wherein melt containers are prepared and bulk materials are loaded.

[0156] P40. The systems and methods of any one or more of the preceding paragraphs, wherein bulk materials comprise glass formers, starter path, graphite, and / or glass frit.

[0157] P41. The systems and methods of any one or more of the preceding paragraphs, wherein bulk materials are conveyed using pneumatic vacuum transfer.

[0158] P42. The systems and methods of any one or more of the preceding paragraphs, wherein bulk materials are loaded into at least one hopper.

[0159] P43. The systems and methods of any one or more of the preceding paragraphs, wherein the at least one hopper is sized to accommodate at least one full melt process.

[0160] P44. The systems and methods of any one or more of the preceding paragraphs, wherein bulk materials are fed into the at least one hopper using pneumatic vacuum conveyance, an augur, and / or gravity feed.

[0161] P45. The systems and methods of any one or more of the preceding paragraphs, wherein the amount of graphite per melt container is approximately 7 lbs to approximately 74 lbs.

[0162] P46. The systems and methods of any one or more of the preceding paragraphs, wherein the amount of glass frit per melt container is approximately 17 lbs to approximately 174 lbs.

[0163] P47. The systems and methods of any one or more of the preceding paragraphs, wherein the amount of glass formers per melt container is approximately 1,400 lbs to 18,150 lbs.

[0164] P48. The systems and methods of any one or more of the preceding paragraphs, wherein glass formers comprise SiO2, A12O3, and / or BO2.

[0165] P49. The systems and methods of any one or more of the preceding paragraphs, wherein a container staging and removal position, a melt position, a first container cooling position, and a second container cooling position are located on the turntable.

[0166] P50. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable is operably configured to turn resulting in moving containers from one position to the next position.

[0167] P51. The systems and methods of any one or more of the preceding paragraphs, wherein a container staging and removal position, a melt position, a first container cooling position, and a second container cooling position are located on the multistage melter module.

[0168] P52. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module is operably configured to turn resulting in moving containers from one position to the next position.

[0169] P53. The systems and methods of any one or more of the preceding paragraphs, wherein multiple melt containers can be processed concurrently.

[0170] P54. The systems and methods of any one or more of the preceding paragraphs, wherein multiple melt containers proceed through the systems and processes concurrently with one container in each position.

[0171] P55. The systems and methods of any one or more of the preceding paragraphs, wherein dual turntables are utilized concurrently.

[0172] P56. The systems and methods of any one or more of the preceding paragraphs, wherein the dual turntables share an airlock.

[0173] P57. The systems and methods of any one or more of the preceding paragraphs, wherein the dual turntables share the container staging and removal position.

[0174] P58. The systems and methods of any one or more of the preceding paragraphs, wherein dual multistage melter modules are utilized concurrently.

[0175] P59. The systems and methods of any one or more of the preceding paragraphs, wherein the dual multistage melter modules share an airlock.

[0176] P60. The systems and methods of any one or more of the preceding paragraphs, wherein the dual multistage melter modules share the container staging and removal position.

[0177] P61. The systems and methods of any one or more of the preceding paragraphs, wherein the shared container staging and removal position accommodates two or more containers at a time.

[0178] P62. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable comprises cascading ventilation.

[0179] P63. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable comprises one or more off-gas outlets.

[0180] P64. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable comprises an airlock in the container staging and removal position.

[0181] P65. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable comprises one or more container lifts.

[0182] P66. The systems and methods of any one or more of the preceding paragraphs, wherein the turntable comprises a feed inlet in the melt area.

[0183] P67. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module comprises cascading ventilation.

[0184] P68. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module comprises one or more off-gas outlets.

[0185] P69. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module comprises an airlock in the container staging and removal position.

[0186] P70. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module comprises one or more container lifts.

[0187] P71. The systems and methods of any one or more of the preceding paragraphs, wherein the multistage melter module comprises a feed inlet in the melt area.

[0188] P72. The systems and methods of any one or more of the preceding paragraphs, wherein the feed inlet is configured to one of provide free or metered feed to a container in the melt area.

[0189] P73. The systems and methods of any one or more of the preceding paragraphs, wherein the feed comprises waste, glass frit, silica sand, and / or glass formers.

[0190] P74. The systems and methods of any one or more of the preceding paragraphs, comprising one or more air inlets.

[0191] P75. The systems and methods of any one or more of the preceding paragraphs, comprising a ventilation system.

[0192] P76. The systems and methods of any one or more of the preceding paragraphs, comprising one or more melt position seals configured to prevent release of gases, vapors, and / or particulates.

[0193] P77. The systems and methods of any one or more of the preceding paragraphs, comprising one or more ventilation zones.

[0194] P78. The systems and methods of any one or more of the preceding paragraphs, wherein the multiple ventilation zones comprise an airlock, secondary containment, primary containment, and active off-gas.

[0195] P79. The systems and methods of any one or more of the preceding paragraphs, further comprising one or more remote manipulators configured to perform operations in the systems and methods disclosed herein remotely.

[0196] P80. The systems and methods of any one or more of the preceding paragraphs, further comprising a control room wherein the control room is operable to one of control operations in the system and monitor operations in the system.

[0197] P81. The systems and methods of any one or more of the preceding paragraphs, wherein the control system captures, stores, and / or trends key processes and / or facility data.

[0198] P82. The systems and methods of any one or more of the preceding paragraphs, where data is processed in near real-time.

[0199] P83. The systems and methods of any one or more of the preceding paragraphs, wherein data and / or processed information is transmitted to a remote location for long-term storage.

[0200] P84. The systems and methods of any one or more of the preceding paragraphs, further comprising a human machine interface.

[0201] P85. The systems and methods of any one or more of the preceding paragraphs, wherein materials from hoppers are delivered at a metered or controlled rate.

[0202] P86. The systems and methods of any one or more of the preceding paragraphs, further comprising at least one sensor.

[0203] P87. The systems and methods of any one or more of the preceding paragraphs, wherein the at least one sensor comprises a contact sensor, a noncontact sensor, a capacitive sensor, an inductive sensor, a 2D range sensor, a 3D imager, a fiber optic cable, a camera, a thermal imager, a thermometer, a pressure sensor, an accelerometer, an inertial measurement unit (IMU), a rotary encoder, a radiation detector, LIDAR, and / or a strain sensor.

[0204] P88. The systems and methods of any one or more of the preceding paragraphs, wherein the camera is an IR camera, and wherein the IR camera includes heat and / or radiation shielding.

[0205] P89. The systems and methods of any one or more of the preceding paragraphs, wherein an off-gas stack monitoring system comprises a radiation monitor (beta and gamma), a record sampler, a carbon-14 collection system, a gas emissions monitor (nitrogen oxide, sulfur dioxides, hydrogen chloride, and / or carbon monoxide), a particulate monitor P-10 (sub 10-micron particle), an oxygen monitor, a total hydrocarbon monitor, an off-gas stack flow measurement, an off-gas stack temperature measurement, a shrouded or un-shrouded sample probe, a heat-traced sample transport line, and / or cabinets / enclosures to house equipment.

[0206] P90. The systems and methods of any one or more of the preceding paragraphs, wherein the off-gas treatment system is operable to remove volatile iodine (1-131), semi-volatile cesium-134 (Cs-134), cesium-137 (Cs-137), technetium (Tc-99), and / or strontium-90 (Sr-90) from process off-gas.

[0207] P91. The systems and methods of any one or more of the preceding paragraphs, comprising at least one filter such as a sintered metal filter, a HEGA filter, and / or a HEPA filter.

[0208] P92. The systems and methods of any one or more of the preceding paragraphs, wherein particulates and / or radionuclides from the at least one filter are recycled to the melt container during the vitrification process.

[0209] P93. The systems and methods of any one or more of the preceding paragraphs, wherein semi-volatile radionuclides and / or blowdown from the quencher / scrubber are treated using one or more of ion exchange, evaporation, crystallization, and / or water reclamation.

[0210] P94. The systems and methods of any one or more of the preceding paragraphs, wherein solid wastes from the quencher / scrubber are recycled to the melt container during the melt process.

[0211] P95. The systems and methods of any one or more of the preceding paragraphs, wherein the off-gas treatment system tempers, chemically treats, scrubs, filters, and / or monitors the process off-gas.Electronic Computing Device

[0212] Fig. 15 shows one embodiment of an electronic computing device 101 (alternatively referred to as an electronic controller, programmable logic controller, electronic control system, or electronic computing system) that can be part of the system. Fig. 16 shows embodiments of the devices that can be included as part of the electronic computing device 101.

[0213] The electronic computing device 101 includes one or more processors 103 (alternatively referred to as a digital processing unit or microprocessor) and memory 105 communicatively linked to each other by way of a system bus 107. In some embodiments, the electronic computing device 101 can also include one or more other interfaces and / or devices communicatively linked to the system bus 107.

[0214] For example, one or more storage devices 109 can be communicatively linked to the system bus 107 by way of one or more storage interfaces 111. One or more display devices 113 can be communicatively linked to the system bus 107 by way of one or more graphics interfaces 115. One or more input devices 117 can be communicatively linked to the system bus 107 by way of one or more input interfaces 119. One or more output devices 121 can be communicatively linked to the system bus 107 by way of one or more output interfaces 123. One or more communication devices 125 can be communicatively linked to the system bus 107 byway of one or more communication interfaces 127.

[0215] It should be appreciated that the electronic computing device 101 can have a variety of configurations. For example, in some embodiments, the various components of the electronic computing device 101 can be positioned near each other in one or more housings and on a single circuit board or multiple circuit boards communicatively linked together, or the like. In other embodiments, the various components of the electronic computing device 101 can be located remotely. For example, the one or more input devices 117 and / or the one or more output devices 121 can be located remotely or at a distance from the one or more processors 103 and / or the memory 105.Processor

[0216] Each of the one or more processors 103 is an electric circuit such as an integrated circuit that executes program instructions. The processor 103 can perform operations such as arithmetic operations, logic operations, controlling operations, and input / output (I / O) operations specified by the program instructions. In some embodiments, the processor 103 includes a control unit (CU), an arithmetic logic unit (AEU), and / or a memory unit (alternatively referred to as cache memory).

[0217] The control unit can direct the operation of the processor 103 and / or instruct the memory 105, arithmetic logic unit, and output devices 121 how to respond toinstructions in the program. It can also direct the flow of data or information between the processor 103 and other components of the electronic computing device 101. It can also control the operation of other components by providing timing and control signals.

[0218] The arithmetic logic unit is an electric circuit in the processor 103 that performs integer arithmetic and bitwise logic operations. The arithmetic logic unit receives input in the form of data or information to be operated on and code describing the operation to be performed. The arithmetic logic unit provides the result of the performed operation as output. In some configurations, the arithmetic logic unit can also include status inputs and / or outputs that convey information about a previous operation or the current operation between the arithmetic logic unit and external status registers.

[0219] It should be appreciated that the processor 103 can have any suitable configuration. For example, the processor 103 can range from a simple processor specially built or configured to execute one or more programs for a specific application or device to a complex central processing unit configured to be used in a wide variety of ways and an equally wide variety of applications. Examples of processors 103 include a general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a central processing unit (CPU), a field programmable gate array (FPGA) or other programmable logic device (PLD), and / or discrete gate or transistor logic. The processor 103 can also be implemented as any one or combination of these devices.Memory

[0220] The memory 105 (alternatively referred to as primary memory, main memory, or a computer-readable medium) is a semiconductor device or system used to store information for immediate use by the processor 103. The memory 105 is generally directly accessible to the processor 103. The processor 103 can read and execute program instructions stored in the memory 105 as well as store data and / or other information in the memory 105 that is actively being operated on. The memory 105 is generally more expensive and operates at higher speeds compared to the storage device 109. The memory 105 can be volatile such as random-access memory (RAM) or non-volatile such as read-only memory (ROM).System Bus

[0221] The system bus 107 broadly refers to the communication system through which information is transferred between the processor 103, the memory 105, and / or other components such as peripherals that can be considered part of the electronic computing device 101. The system bus 107 can include a physical system ofconnectors, conductive pathways, optical pathways, wires, or the like through which information travels.

[0222] The system bus 107 can have a variety of physical configurations. In some embodiments, the system bus can be configured as a backbone connecting the processor 103, the memory 105, and / or the various devices and / or interfaces as shown in the figure. In other embodiments, the system bus 107 can be configured as separate buses that communicatively link one or more components together. For example, the system bus 107 can include a bus communicatively linking the processor 103, the memory 105, and / or circuit board (the bus can alternatively be referred to as the front-side bus, memory bus, local bus, or host bus). The system bus 107 can include multiple additional I / O buses communicatively linking the various other devices and / or interfaces to the processor 103.

[0223] It should be appreciated that information shared between the components of the electronic computing device 101 can include program instructions, data, signals such as control signals, commands, bits, symbols, or the like. The information can be represented using a variety of different technologies and techniques. For example, in some embodiments, the information can be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields, or the like.

[0224] The system bus 107 can also be used for other purposes besides sharing information. For example, the system bus 107 can be used to supply power from the power source 129 to the various devices and / or interfaces connected to the system bus 107. Likewise, the system bus 107 can include address lines which match those of the processor 103. This allows information to be sent to or from specific memory locations in the memory 105. The system bus 107 can also provide a system clock signal to synchronize the various devices and / or interfaces with the rest of the system.

[0225] The system bus 107 can use a variety of architectures, communication protocols, or protocol suites to communicatively link the processor 103, the memory 105, and / or any of the other devices and / or interfaces. For example, suitable architectures include Industry Standard Architecture (ISA), Extended Industry Standard Architecture (EISA), Micro Channel Architecture (MCA), Video Electronics Standards Association (VESA), Peripheral Component Interconnect (PCI), PCI Express (PCI-X), Personal Computer Memory Card Industry Association (PCMCIA or PC bus), Accelerated Graphics Port (AGP), Small Computer Systems Interface (SCSI), and the like. Suitable communication protocols include TCP / IP, IPX / SPX, Modbus, DNP, BACnet, ControlNet, Ethernet / IP, or the like.Program Instructions

[0226] The instructions stored in the electronic computing device 101 can include software algorithms and / or application programs. It should be appreciated that thesoftware algorithms can be expressed in the form of methods or processes performed in part or entirely by the electronic computing device 101 or as instructions stored in a computer-readable medium such as the memory 105 and / or the storage device 109. Likewise, the software algorithms are shown in the flowcharts and described in the methods and / or processes.

[0227] It should be appreciated that instructions can take the form of entirely software (including firmware, resident software, micro-code, or the like), entirely hardware, or a combination of software and hardware. If implemented in software executed by the processor 103, the information may be stored on or transmitted over a computer-readable medium such as the memory 105 and / or the storage device 109. In some embodiments, the instructions can be contained in any tangible medium of expression having program code embodied in the medium. In some embodiments, the instructions can be written in any combination of one or more programming languages, which can be text-based or graphical languages.

[0228] It should also be appreciated that the flowcharts, block diagrams, methods, and / or processes describe algorithms and / or symbolic representations of information operations. The algorithmic descriptions and representations are the means used by those skilled in the data processing arts to convey the substance of their work most effectively to others skilled in the art. These operations, while described functionally or logically, are understood to be implemented by software and / or hardware that can be readily and easily created from the functional or logical descriptions of the algorithms.

[0229] For example, the instructions can include an algorithm for making a decision — e.g., determining whether a parameter satisfies one or more conditions and performing various operations based upon the parameter satisfying the one or more conditions. This can be represented in the instructions with a conditional statement or conditional expression written in a programming language. An example of such a conditional statement or expression is shown below. It should be appreciated that the syntax for the conditional statement or expression will vary depending on the chosen programming language. if conditionlsatisfied then perform operation 1 elseif condition2satisfied then perform operation 2 elseif condition3satisfied then perform operation 3 else perform operation 4; end if;

[0230] The instructions can be used to perform a variety of operations. For example, the instructions can be used to control the receipt and processing of data from the input devices 117. The instructions can also be used to control hardware such as any of the output devices 121.

[0231] In some embodiments, the instructions can include firmware such as a basic input / output system (BIOS) 131, an operating system 133, one or more application programs 135, program data 137, and the like. These can be stored in the memory 105 and / or the storage device 109. In general, the instructions are stored in the memory 105 when the electronic computing device 101 is on and running or while the instructions are being used (e.g., an application program is running). Likewise, the instructions are stored in the storage device 109 when the electronic computing device 101 is off.

[0232] In some embodiments, the instructions are used to control one or more system components or operation thereof. For instance, in some embodiments, the instructions may be used to control when the turntable turns according to data received from the one or more sensors. In some embodiments having remote manipulator systems for performing operations remotely, the instructions may be used to control the operation thereof. In some embodiments, the instructions may be used to control routing or release of off-gases depending on data received from the one or more sensors. In some embodiments, the instructions may control one or more cameras or other sensors to provide continuous display and / or data to an operator in real time. The instructions can control any aspect of the system or subsystems as needed to provide for safe and controlled remote operation.Storage Device

[0233] Each of the one or more storage devices 109 (alternatively referred to as secondary memory, or a computer-readable medium) is a device or system used to store information that is not needed for immediate use by the processor 103. The storage device 109 can be communicatively linked to the system bus 107 by way of a storage interface 111. The storage device 109 is generally not directly accessible to the processor 103. The storage device 109 is generally less expensive and operates at lower speeds compared to the memory 105. The storage device 109 is also generally non-volatile and used to permanently store the information.

[0234] The storage device 109 can take a variety of physical forms and use a variety of storage technologies. For example, in some embodiments, the storage device 109 can be in the form of a hard disk storage device, solid-state storage device, optical storage device, or the like. Also, in some embodiments, the storage device 109 can use technologies such as a magnetic disk (e.g., disk drives), laser beam (e.g., opticaldrives), semiconductor (e.g., solid-state drives), and / or magnetic tape to store information.Display Device

[0235] Each of the one or more display devices 113 (alternatively referred to as a human-machine interfaces (HMI) or screens) is a device that visually conveys text, graphics, video, and / or other information. In some embodiments, the information shown on the display device 113 exists electronically and is displayed for a temporary period of time. It should be appreciated that the display device 113 can operate as an output device and / or input device (e.g., touchscreen display or the like).

[0236] The display device 113 can be communicatively linked to the system bus 107 by way of one or more graphics interfaces 115. In some embodiments, the graphics interface 115 can be used to generate a feed of output images to the display device 113. In some embodiments, the graphics interface 115 can be a separate component such as a dedicated graphics card or chip or can be an integrated component that is part of or a subset of the processor 103.

[0237] It should be appreciated that the display device 113 can include a variety of physical structures and / or display technologies. For example, in some embodiments, the display device 113 can be a screen integrated into a specific application or technology, a separate screen such as a monitor, or the like. The display device 113 can also be a liquid crystal display, a light emitting diode display, a plasma display, a quantum dot display, or the like.Input Devices

[0238] Each of the one or more input devices 117 is a physical component that provides information to the processor 103 and / or the memory 105. The input device 117 can be communicatively linked to the system bus 107 byway of one or more input interfaces 119. The input device 117 can be any suitable type and can provide any of a variety of information. For example, the input device 117 can be a digital and / or analog device and can provide information in a digital or analog format. Also, the input device 117 can be used to provide user input for controlling the electronic computing device 101 or operational input for controlling aspects of a specific application.

[0239] The input device 117 can include one or more sensors 139 and / or one or more other miscellaneous input devices 141. It should be appreciated that the input device 117 is not limited to only providing information. In some embodiments, the input device 117 can also receive information. Such devices can be considered both an input device 117 and an output device 121.

[0240] The miscellaneous input device 141 can include a variety of devices or components. In some embodiments, the miscellaneous input devices 141 can includeswitches such as limit switches, level switches, vacuum switches, pressure switches, or the like, as well as buttons including pushbuttons or the like. In some embodiments, the miscellaneous input devices 141 include user interface components such as a pointing device, for example a mouse, text input devices, for example a keyboard, a touch screen, or the like.Sensors

[0241] Each of the one or more sensors 139 can be used to provide information about a wide variety of measured parameters. In general terms, the sensor 139 is used to measure or detect information about its environment and send the information to the processor 103 and / or the memory 105. In some embodiments, the sensor 139 can operate as a transducer and generate an electrical signal as a function of the measured parameter. The electrical signal is communicated to the processor 103 and / or the memory 105 where it can be used for a variety of purposes.

[0242] The sensor 139 can be a digital sensor and / or an analog sensor. For example, in some embodiments, the sensor 139 provides digital information to the processor 103 and / or the memory 105. In other embodiments, the sensor 139 provides analog information to the processor 103 and / or the memory 105. Also, in some embodiments, the information can be converted from one type to the other — e.g., from digital to analog or from analog to digital.

[0243] The sensor 139 can measure the parameter directly (i.e., direct measurement) or indirectly (i.e., indirect measurement). A direct measurement sensor directly measures the parameter itself. An indirect measurement sensor measures a secondary parameter that can be translated into the parameter of interest.

[0244] The sensor 139 can communicate information to the processor 103 and / or the memory 105 in a variety of ways and / or using a variety of protocols. In some embodiments, the sensor 139 can be a protocol-based sensor that uses a protocol to communicate with the processor 103 and / or the memory 105, or it can be a nonprotocol-based sensor that does not use a protocol to communicate with the processor 103 and / or the memory 105. A protocol-based sensor communicates with the processor 103 by sending a data stream by way of a communication protocol. In some embodiments, the protocol-based sensor includes a separate processor that is part of the sensor and used to communicate using the protocol.

[0245] It should be appreciated that the information provided by the sensor 139 can be used in a variety of ways by the processor 103. For example, in some embodiments, the processor 103 can compare the information to a set point. In some embodiments, analog information is amplified before being compared to the set point.

[0246] In some embodiments, the sensor 139 can be used to measure one or more properties or parameters. For example, the sensors 139 can be used to measure position, radiation, temperature, sound, and the like.Image Sensors

[0247] In some embodiments, the sensor 139 is an image sensor used to create an image of an aspect of the system and / or vitrification process. In general, an image sensor is a device that detects and conveys information used to make an image. The image sensor converts the variable attenuation of radiation waves (infrared, visible, and / or ultraviolet spectrum radiation as well as other frequencies) into signals that convey the information.

[0248] The image sensor can be any of a variety of types of image sensors. For example, suitable image sensors include electronic image sensors such as a charge- coupled device (CCD), active-pixel sensor (CMOS sensor), or the like. The image sensor can be part of a camera or other imaging device.Temperature Sensors

[0249] In some embodiments, the sensor 139 is a temperature sensor used to measure the temperature of the vitrification process. Temperature is the physical quantity expressing the thermal energy present in matter. In some embodiments, the temperature sensor acts as a transducer and generates an electrical signal as a function of the measured temperature.

[0250] The temperature sensor can be a contact type temperature sensor or a noncontact type temperature sensor. Contact type temperature sensors are positioned in physical contact with the material and rely primarily on conduction to detect changes in its temperature. Non-contact type temperature sensors are not positioned in physical contact with the material and rely primarily on convection and / or radiation to detect changes in its temperature.

[0251] The temperature sensor can be any of a variety of types of temperature sensors. For example, suitable temperature sensors include thermocouples (type K, J, T, E, N, S, R, or the like), resistance temperature detectors (RTDs), thermistors, bimetallic strips, semiconductor temperature sensors, thermometers, vibrating wire temperature sensors, infrared temperature sensors, or the like.Pressure Sensors

[0252] In some embodiments, the sensor 139 is a pressure sensor used to measure the pressure of fluids such as pneumatic and / or hydraulic fluids. Pressure is an expression of the force required to stop the fluid from expanding and is expressed in force per unit area. In some embodiments, the pressure sensor acts as a transducer and generates an electrical signal as a function of the measured pressure.

[0253] The pressure sensor can be configured to measure a variety of pressures. In some embodiments, the pressure sensor is an absolute pressure sensor configured to measure the pressure relative to a vacuum. In some embodiments, the pressure sensor is a gauge pressure sensor configured to measure the pressure relative to ambient atmospheric pressure. In some embodiments, the pressure sensor is a differential pressure sensor configured to measure the difference between two pressures. In some embodiments, the pressure sensor is a sealed pressure sensor configure to measure the pressure relative to some fixed pressure other than ambient atmospheric pressure.

[0254] The pressure sensor can use a variety of pressure sensing technologies. In some embodiments, the pressure sensor can use force collecting pressure sensing technology. These types of electronic pressure sensors use a force collector such as a diaphragm, piston, bourdon tube, bellows, or the like, to measure strain or deflection due to applied force over an area. Examples of suitable force collector pressure sensors includes piezoresistive strain gauge pressure sensors, capacitive pressure sensors, electromagnetic pressure sensors, piezoelectric pressure sensors, straingauge pressure sensors, optical pressure sensors, potentiometric pressure sensors, force balancing pressure sensors, or the like. In some embodiments, the pressure sensor can use other properties such as density to infer pressure of a fluid.Position Sensors

[0255] In some embodiments, the sensor 139 is a position sensor configured to measure the position of the turntable, electrodes, grippers, and the like. The position sensor can be used to determine the absolute position or location of the component or the relative position or displacement of the component in terms of linear travel, rotational angle, or three-dimensional space. In some embodiments, the position sensor acts as a transducer and generates an electrical signal as a function of the measured position.

[0256] The position sensor can be a contact type position sensor or a non-contact type position sensor. Contact type position sensors are positioned in physical contact with the component to detect changes in its position. Non-contact type position sensors can detect changes in the position of the component without being in physical contact with it.

[0257] The position sensor can be any of a variety of types of position sensors and can be used to measure a variety of positions or movements including linear, rotary, and / or angular positions or movements. For example, suitable position sensors include potentiometric position sensors, inductive position sensors such as a linear variable differential transformer or a rotary variable differential transformer, eddy current-based position sensors, capacitive position sensors, magnetostrictive positionsensors, hall effect-based magnetic position sensors, fiber optic position sensors, optical position sensors, ultrasonic position sensors, or the like.Light Sensors

[0258] In some embodiments, the sensor 139 is a light sensor configured to measure various aspects of the system and / or vitrification process. The light sensor can be used to determine the presence and / or intensity of light by measuring the radiant energy that exists in a certain range of frequencies, which typically include the infrared, visible, and / or ultraviolet light spectrum. In some embodiments, the light sensor acts as a transducer and generates an electrical signal as a function of the measured radiant energy.

[0259] The light sensor can include a variety of different light sensing technologies. In some embodiments, the light sensor generates electricity when illuminated. Examples of such light sensors include photovoltaic light sensors and photo-emissive light sensors. In some embodiments, the light sensor changes its electrical properties when illuminated. Examples of such light sensors include photoresistor light sensors and photoconductor light sensors.Output Devices

[0260] Each of the one or more output devices 121 is a physical component that receives information from the processor 103 and / or the memory 105. The output device 121 can be communicatively linked to the system bus 107 by way of one or more output interfaces 123. The output device 121 can be any suitable type and can receive any of a variety of information. For example, the output device 121 can be a digital and / or analog device and can receive information in a digital and / or analog format. Also, the output device 121 can be used to provide information to the user or perform various operations related to the specific application.

[0261] The output device 121 can include one or more actuators 143 and / or one or more other miscellaneous output devices 145. It should be appreciated that the output device 121 is not limited to only receiving information. In some embodiments, the output device 121 can also send information. Such devices can be considered both an output device 121 and an input device 117.

[0262] The miscellaneous output devices 145 can include a variety of devices or components. In some embodiments, the miscellaneous output devices 145 can include audio output devices such as speakers as well as other output devices.Actuators

[0263] Each of the one or more actuators 143 can be used to activate movement or an operation. In general terms, the actuator 143 is used to activate something in response to an instruction or control signal sent from the processor 103. In someembodiments, the actuator 143 can act as a transducer by receiving an electrical signal and transforming it into the desired movement or operation.

[0264] The information received by the actuator 143 can take a variety of forms and use a number of technologies. For example, the information may be in the form of an electric voltage or current, pneumatic or hydraulic fluid pressure, binary data, or the like. The information can be provided as digital and / or analog format. For example, in some embodiments, the actuator 143 receives digital information from the processor 103 or other component(s) in the electronic computing device 101. In other embodiments, the actuator 143 receives analog information from the processor 103 or other component(s) in the electronic computing device 101. Also, in some embodiments, the information received by the actuator 143 can be converted from one type to the other — e.g., from digital to analog or from analog to digital.

[0265] The actuator 143 can use a variety of energy sources to operate. For example, the actuator 143 can operate using electrical energy, hydraulic energy, pneumatic energy, thermal energy, magnetic energy, or the like. Likewise, the actuator 143 can be an electric actuator, hydraulic actuator, pneumatic actuator, thermal actuator, magnetic actuator, or the like. The actuator 143 can also be used to produce a variety of movements. For example, the actuator 143 can be used to produce linear movement and / or rotary movement.Motors

[0266] In some embodiments, the actuator 143 can include an electric motor. In general, the electric motor is a device that converts electrical energy to mechanical energy. In some embodiments, the mechanical energy produced by the electric motor is in the form of the rotation of a shaft. The mechanical energy can be used directly or converted into other mechanical movement using levers, gears, ratchets, cams, or the like. The motor can be a DC motor or an AC motor.Relays

[0267] In some embodiments, the actuator 143 can include a relay. In general, a relay is an electrically operated switch. In some embodiments, the relay includes one or more input terminals to receive information or control signals and one or more operating contact terminals electrically linked to a separate electrical device.

[0268] In some embodiments, the relays can include electromechanical relays having contacts that mechanically open and close. For example, the relay can include an electromagnet that opens and closes the contacts. In other embodiments, the relays can include solid state relays that use semiconductor properties to control the on or off state of the relay without any moving parts. Solid state relays can include thyristors and transistors to switch currents up to a hundred amps or more.Communication Devices

[0269] Each of the communication devices 125 is a physical component that allows the electronic computing device 101 to communicate with other devices, components, and / or networks. The communication device can be communicatively linked to the system bus 107 by way of one or more communication interfaces 127. The communication device 125 can include one or more wired communication devices 147 and / or one or more wireless communication devices 149.

[0270] It should be appreciated that the communication device 125 can be any suitable physical device. For example, in some embodiments, the communication device 125 is a network interface controller used to connect the electronic computing device 101 to a larger network such as a local area network (LAN), wide area network (WAN), or the Internet.

[0271] It should also be appreciated that the communication device 125 can use a variety of communication protocols. For example, in some embodiments, the wired communication device 147 can use communication protocols such as Ethernet, RS- 232, RS-485, USB, or the like. Also, in some embodiments, the wireless communication devices 149 can use communication protocols such as Wi-Fi, Bluetooth, Zigbee, LTE, 5G, or the like.Power Source

[0272] The power source 129 can be used to supply electric power to the electronic computing device 101. The power source 129 can provide any suitable type of power including AC power, DC power, or the like. The power source 129 can obtain power from any suitable source including an AC power source (standard wall outlet), DC power source (a transformer plugged into a wall outlet), battery, generator, or the like.

[0273] In some embodiments, the power source 129 includes a power supply that converts electric current from a source to a desired voltage, current, and / or frequency to power the electronic computing device 101. In some embodiments, the power supply can convert AC power ranging from 110-240 VAC to DC power ranging from 6- 60 VDC.Circuit Board

[0274] The electronic computing device 101 can include one or more circuit boards (alternatively referred to as logic boards) to which one or more of the components can be coupled. For example, the processor 103, the memory 105, the storage device 109, the display device 113, the input device 117, the output device 121, the communication device 125, and / or the power source 129 can be coupled to one or more circuit boards. In some embodiments, the processor 103, the memory 105, and / or the storage device 109 can be coupled to one circuit board.

[0275] In some embodiments, the circuit board can contain a series of conductive tracks, pads, and / or other features etched from one or more sheet layers of copper laminate laminated onto and / or between sheet layers of nonconductive substrate. The conductive features can be part of the system bus 107 communicatively linking the various components of the electronic computing device 101. In some embodiments, the circuit board can be a printed circuit board. In some embodiments, the circuit board can be a motherboard.Multiple Electronic Computing Devices Communicatively Linked

[0276] Referring to Fig. 17, the electronic computing device 101 can be communicatively linked to and / or controlled by one or more additional electronic computing devices 151. For example, the additional electronic computing device(s) 151 can be used to send data to or receive data from the electronic computing device 101. The additional electronic computing device(s) 151 can also be used to control or operate the electronic computing device 101. For example, the additional electronic computing device(s) 151 can be used to control the electronic computing device 101 to perform any of the methods, processes, or other operations described above.

[0277] The additional electronic computing device(s) 151 can be the same as or similar to the electronic computing device 101. The additional electronic computing device(s) 151 can also be a different device than the electronic computing device 101 even though it can have any of the components and / or features described in connection with the electronic computing device 101. The additional electronic computing device 151 can be a mobile electronic computing device, a personal electronic computing device, a wearable electronic computing device, a general- purpose electronic computing device, a special-purpose electronic computing device (e.g., designed for a specific purpose, application, or field of applications), an industrial electronic computing device, or the like.

[0278] By way of example, the additional electronic computing device 151 can be a mobile electronic computing device such as a mobile phone, smartphone, tablet computer, handheld personal computer, or the like. The additional electronic computing device 151 can also be a personal electronic computing device such as a laptop computer, desktop computer, or workstation. The additional electronic computing device 151 can also be a wearable electronic computing device such as a smartwatch, smartband, smartglasses, or the like. The additional electronic computing device 151 can also be an industrial electronic computing device such as a programmable logic controller, system on a module, or the like.

[0279] The electronic computing device 101 can be communicatively linked with the additional electronic computing device(s) 151 using any suitable wired or wireless communication protocol. For example, the electronic computing devices 101, 151 cancommunicate using one or more of the following wired communication protocols: ethernet, HDMI, SATA, CAN, RS-232, RS-485, UART, USART, USB, or the like. The electronic computing devices 101, 151 can communicate using one or more of the following wireless communication protocols: Wi-Fi, Bluetooth, Bluetooth Low Energy, Zigbee, Z-wave, GSM / GPRS, CDMA, NFC, RFID, 6E0WPAN, or the like.

[0280] The additional electronic computing device(s) 151 can be connected directly to the electronic computing device 101 without connecting to any intermediate electronic computing devices, or the additional electronic computing device(s) 151 can be connected to the electronic computing device 101 by way of one or more intermediate electronic computing devices — e.g., a network 153. Likewise, the additional electronic computing device(s) 151 can be positioned adjacent to or nearby the electronic computing device 101 (e.g., same room, line of sight, etc.), or it can be positioned remotely relative to the electronic computing device 101 (e.g., different rooms, out of sight, different continents, etc.).

[0281] In one example, the additional electronic computing device 151 can be a mobile electronic computing device capable of running applications obtained from an app source (e.g., an app store) including an application designed to communicate with and / or control the electronic computing device 101. In another example, the additional electronic computing device 151 can be a personal electronic computing device such as a laptop computer capable of running software designed to communicate with and / or control the electronic computing device 101. It should be appreciated that there are numerous other ways the additional electronic computing device 151 can connect to, communicate with, and / or control the electronic computing device 101.Network Computing

[0282] One or more of the electronic computing devices 101, 151 can be part of or communicatively linked to a network 153 of computing devices having a variety of topologies. The network 153 can include a local area network (LAN), wide area network (WAN) or the Internet. The electronic computing devices 101, 151 on the network 153 can be similar and / or dissimilar to each other. The program instructions described above can be implemented by a single electronic computing device 101, 151 or by multiple electronic computing devices 101, 151 communicatively linked over the network 153.

[0283] The one or more electronic computing devices 101, 151 can be part of a wide variety of computer systems. In some embodiments, the one or more electronic computing devices 101, 151 can be part of or communicatively linked to a cloud computing environment. Cloud computing refers to a model for enabling ubiquitous, convenient, on-demand network access to a shared pool of configurable computing resources (e.g., networks, servers, storage, applications, and / or services) that can berapidly provisioned via virtualization and released with minimal management effort or service provider interaction, and then scaled accordingly. A cloud computing environment can have a variety of characteristics (e.g., on-demand self-service, broad network access, resource pooling, rapid elasticity, measured service, etc.), service models (e.g., software as a service (“SaaS”), platform as a service (“PaaS”), infrastructure as a service (“laaS”)), and deployment models (e.g., private cloud, community cloud, public cloud, hybrid cloud, etc.).

[0284] The one or more electronic computing devices 101, 151 can communicate with each other using a variety of network protocols — i.e., a set of rules for formatting and processing data. The use of network protocols makes it possible for electronic computing devices 101, 151 having vastly different software and hardware to communicate with each other.Network Interconnection Model

[0285] In general, network protocols take complex processes and divide them into smaller tasks or functions. These functions work at different layers of a network hierarchy to fulfill certain tasks that contribute to the overall operations of a network. Although there are different types of networks that use different protocol sequences, one common structure is based on the Open Systems Interconnection (OSI) model. The OSI model includes one or more of the following seven layers.• Physical layer: this is the first layer and it includes the tangible electronic computing device 101, 151 and its mechanical characteristics, which allow it to connect with a network.• Data link layer: the second layer handles data packaging by creating data packets, detecting packet transmission errors, and correcting the packet transmission errors.• Network layer: the third network layer manages the routes the electronic computing devices 101, 151 use to transfer data and controls how information travels along the network to prevent congestion and improve efficiency.• Transport layer: this layer is the fourth layer, where protocols manage the delivery of data packages over the network. Protocols at this layer can also recover or troubleshoot errors.• Session layer: layer five protocols handle user sessions by starting new sessions, ending completed sessions, and displaying dialogues for users to interact within the interface.Presentation layer: the sixth layer of a network contains protocols that translate data from one format into another. For example, a first electroniccomputing device 101, 151 may send data to a second electronic computing device 101, 151 using a different coding or encryption type than that used by the second electronic computing device 101, 151. This layer decodes the data into a format that the second electronic computing device 101, 151 can use.• Application layer: the application layer uses protocols that provide services like file transfers and operations.

[0286] At each layer of the network, protocols determine how to carry out specific tasks. Multiple protocols can operate at each layer to initiate, coordinate, and fulfill each function. In an OSI, the lower layers of the network focus primarily on the transport of data between the electronic computing devices 101, 151. The higher layers — i.e., the session layer, presentation layer, and application layer — manage data application.

[0287] The following is a list of common classifications of network protocols with examples of each:Network Communication Protocols

[0288] A network communication protocol allows basic data transfers between networked electronic computing devices 101, 151. These protocols can communicate text-based files between two or more electronic computing devices 101, 151 or over a larger network such as the internet. They can also establish communication between routers and external or linked electronic computing devices 101, 151 in a network. Examples of network communication protocols include:• Bluetooth: A Bluetooth protocol can connect electronic computing devices 101, 151 that perform the same or different functions to each other. Examples of such electronic computing devices 101, 151 include laptops, mobile phones, cameras, printers, and tablets.• File transfer protocol (FTP): FTP protocols allow electronic computing devices 101, 105 to share files between hosts. They enable the electronic computing devices 101, 105 to share large files, resume sharing after an interruption, recover lost files, and schedule file transfers.• Transmission control protocol / internet protocol (TCP / IP): this protocol provides reliable delivery to applications and ensures that the message arrives at the correct location, on time and without duplication.• User datagram protocol (UDP): UDP is an alternative to TCP and also works with IP to transmit time-sensitive data. UDP allows low-latency data transmissions between network applications, making it especially suitable for VoIP or other audio and video requirements.• Hypertext transfer protocol (HTTP): a protocol used for distributed and collaborative hypermedia information systems that allow for sharing data like text files, images, and videos over the internet.• Simple mail transfer protocol (SMTP): the SMTP transfers emails between electronic computing devices 101, 105 and notifies the user of incoming electronic messages.• Address resolution protocol (ARP): ARP translates IP addresses to MAC addresses and vice versa so LAN endpoints can communicate with one another. ARP is used because IP and MAC addresses are different lengths.• Domain name system (DNS): DNS is a database that includes a website's domain name and its corresponding IP addresses. DNS translates a domain name into IP addresses. DNS also includes the DNS protocol, which is within the IP suite and details the specifications DNS uses to translate and communicate.• Dynamic host configuration protocol (DHCP): DHCP assigns IP addresses to network endpoints so they can communicate with other network endpoints over IP. Whenever an electronic computing device 101, 105 joins a network with a DHCP server for the first time, DHCP automatically assigns it an IP address and continues to do so each time an electronic computing device 101, 105 moves locations on the network.Network security protocols

[0289] These protocols ensure that data transmitted over a network remains secure. They prevent unauthorized users from accessing information by incorporating passwords, authentication systems, or data encryption. Encryption is the process that converts plain or standard text into a coded form so that unauthorized users can't read it. Network security protocols include:• Hypertext transfer protocol secure (HTTPS): this protocol works similarly to HTTP but uses encryption to ensure the secure communication of data over a network like the internet.• Secure sockets layer / transport layer security (SSL / TLS): SSL and TLS protocols also use encryption to secure information transferred between two electronic computing devices 101, 105 in a network. TLS is the most recent version of this protocol, though the term “SSL” is still often used to refer to this type of protocol.• Secured shell (SSH): the SSH protocol provides secure connections to a network and is the primary method of managing network devices at thecommand level, which is the level at which the user can control the operating system of an electronic computing device 101, 105.• Secure file transfer protocol (SFTP): SFTP allows for secure file access, transfer and management over a network.Network management protocols

[0290] Network management protocols define the procedures used to operate a network. This includes how networks function and their maintenance requirements. Management protocols apply to all the electronic computing devices 101, 105 in a network, including routers, servers, and computers. They coordinate operations between all the electronic computing devices 101, 105.

[0291] Network management protocols are important for maintaining the stability of connections between electronic computing devices 101, 105 in a network and the connections of individual electronic computing devices 101, 105 to the network. A user can implement a network protocol to troubleshoot issues with connectivity. Types of network management protocols include:• Simple network management protocol (SNMP): SNMP allows network administrators to evaluate a network's performance, identify network errors and troubleshoot problems.• Internet control message protocol (ICMP): this protocol can send error messages and information about an electronic computing device 101, 105 or a network’s operations. They can announce an error and assist with troubleshooting tasks.• Telnet: Telnet works similarly to SSH. It is a method of managing electronic computing devices 101, 105 at the command level, but unlike SSH, it doesn't provide a secure connection to a network.General Terminology and Interpretative Conventions

[0292] Articles such as “the,” “a,” and “an” shall be interpreted as connoting the singular or plural. Also, the word “or” when used without a preceding “either” (or other similar language indicating that “or” is unequivocally meant to be exclusive - e.g., only one of x or y, etc.) shall be interpreted to be inclusive (e.g., “x or y” means one or both x or y).

[0293] The term “and / or” shall also be interpreted to be inclusive (e.g., “x and / or y” means one or both x or y). In situations where “and / or” or “or” are used as a conjunction for a group of three or more items, the group shall be interpreted to include one item alone, all the items together, or any combination or number of the items.

[0294] The phrase “based on” shall be interpreted to refer to an open set of conditions unless unequivocally stated otherwise (e.g., based on only a given condition). For example, a step described as being based on a given condition can be based on the recited condition and one or more unrecited conditions.

[0295] The term “can,” when used as an auxiliary verb, shall refer to an optional or noncompulsory capability of the described subject matter that is not required to be present in any given embodiment.

[0296] The terms have, having, contain, containing, include, including, and characterized by shall be interpreted to be synonymous with the terms comprise and comprising — i.e., the terms are inclusive or open-ended and do not exclude additional unrecited subject matter. The use of these terms shall also be understood as disclosing and providing support for narrower alternative embodiments where these terms are replaced by “consisting of,” “consisting of the recited subject matter plus impurities and / or trace amounts of other materials,” or “consisting essentially of.”

[0297] Certain features described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described in certain combinations and even initially claimed as such, one or more features from a claimed combination can be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.

[0298] Many aspects or features are described as being optional, e.g. through the use of the term “can” or otherwise. For the sake of brevity and legibility, this document does not explicitly recite each combination and / or permutation that may be obtained by choosing from the set of optional aspects or features. However, this document is to be interpreted as explicitly disclosing all such combinations and / or permutations. For example, something described as having three optional aspects may be embodied in seven different ways, namely with only one of the three aspects, with any two of the three aspects, or with all three of the aspects.

[0299] Any methods described in this document should not be interpreted to require the steps to be performed in a specific order unless expressly stated otherwise or doing so is literally impossible. The methods should also be interpreted to provide support to perform the recited steps in any sequence unless expressly stated otherwise.

[0300] The example configurations described in this document do not represent all the examples that may be implemented or that are within the scope of the claims. Theterm “example” shall be interpreted to mean “serving as an example, instance, or illustration,” and not “preferred” or “advantageous over other examples.”

[0301] Unless otherwise indicated, all numbers or expressions, such as those expressing dimensions, physical characteristics, or the like, used in the specification (other than the claims) are understood to be modified in all instances by the term “approximately.” At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the claims, each numerical parameter recited in the specification or claims which is modified by the term “approximately” should be construed in light of the number of recited significant digits and / or by applying ordinary rounding techniques.

[0302] All disclosed ranges are to be understood to encompass and provide support for claims that recite any subranges or any individual values subsumed by each range. For example, a stated range of 1 to 10 should be considered to include and provide support for claims that recite any subranges or individual values that are between and / or inclusive of the minimum value of 1 and the maximum value of 10; that is, all subranges beginning with a minimum value of 1 or more and ending with a maximum value of 10 or less (e.g., 5.5 to 10, 2.34 to 3.56, and so forth) or any values from 1 to 10 (e.g., 3, 5.8, 9.9994, and so forth), which values can be expressed alone or as a minimum value (e.g., at least 5.8) or a maximum value (e.g., no more than 9.9994).

[0303] All disclosed numerical values are to be understood as being variable from 0- 100% in either direction and thus provide support for claims that recite such values (either alone or as a minimum or a maximum - e.g., at least <value> or no more than <value>) or any ranges or subranges that can be formed by such values. For example, a stated numerical value of 8 should be understood to vary from 0 to 16 (100% in either direction) and provide support for claims that recite the range itself (e.g., 0 to 16), any subrange within the range (e.g., 2 to 12.5) or any individual value within that range expressed individually (e.g., 15.2), as a minimum value (e.g., at least 4.3), or as a maximum value (e.g., no more than 12.4).

[0304] The terms recited in the claims should be given their ordinary and customary meaning as determined by reference to relevant entries in widely used general dictionaries and / or relevant technical dictionaries, commonly understood meanings by those in the art, etc., with the understanding that the broadest meaning imparted by any one or combination of these sources should be given to the claim terms (e.g., two or more relevant dictionary entries should be combined to provide the broadest meaning of the combination of entries, etc.) subject only to the following exceptions: (a) if a term is used in a manner that is more expansive than its ordinary and customary meaning, the term should be given its ordinary and customary meaning plus the additional expansive meaning, or (b) if a term has been explicitly defined to have a different meaning by reciting the term followed by the phrase “as used in thisdocument shall mean” or similar language (e.g., “this term means,” “this term is defined as,” “for the purposes of this disclosure this term shall mean,” etc.). References to specific examples, use of “i.e.,” use of the word “invention,” etc., are not meant to invoke exception (b) or otherwise restrict the scope of the recited claim terms. Other than situations where exception (b) applies, nothing contained in this document should be considered a disclaimer or disavowal of claim scope.

[0305] None of the limitations in the claims shall be interpreted as invoking 35 U.S.C. 112(f) unless the words “means for” or “step for” are explicitly recited in the claim.

[0306] Unless explicitly stated otherwise or otherwise apparent from context, terms such as “processing,” “computing,” “calculating,” “determining,” “displaying,” or the like, refer to the action and processes of an electronic computing device including a processor and memory.

[0307] The subject matter recited in the claims is not coextensive with and should not be interpreted as coextensive with any embodiment, feature, or combination of features described or illustrated in this document. This is true even if only a single embodiment of the feature or combination of features is illustrated and described.Joining or Fastening Terminology and Interpretative Conventions

[0308] The term “coupled” means the joining of two members directly or indirectly to one another. Such joining may be stationary in nature or movable in nature. Such joining may be achieved with the two members or the two members and any additional intermediate members being integrally formed as a single unitary body with one another or with the two members or the two members and any additional intermediate member being attached to one another. Such joining may be permanent in nature or alternatively may be removable or releasable in nature.

[0309] The term “coupled” includes joining that is permanent in nature or releasable and / or removable in nature. Permanent joining refers to joining the components together in a manner that is not capable of being reversed or returned to the original condition. Releasable joining refers to joining the components together in a manner that is capable of being reversed or returned to the original condition.

[0310] Releasable joining can be further categorized based on the difficulty of releasing the components and / or whether the components are released as part of their ordinary operation and / or use. Quickly releasable joining (i.e., quick-release) refers to joining that that can be released without the use of tools. Readily or easily releasable joining refers to joining that can be readily, easily, and / or promptly released with little or no difficulty or effort. Some joining can qualify as both quickly releasable joining and readily or easily releasable joining. Other joining can qualify as one of these typesof joining but not the other. For example, one type of joining may be readily or easily releasable but also require the use of a tool.

[0311] Non-quickly releasable joining (i.e., non-quick-release) refers to joining that can only be released with the use of tools. Difficult or hard to release joining refers to joining that is difficult, hard, or arduous to release and / or requires substantial effort to release. Some joining can qualify as both non-quickly releasable joining and difficult or hard to release joining. Other joining can qualify as one of these types of joining but not the other. For example, one type of joining may require the use of a tool but may not be difficult or hard to release.

[0312] The joining can be released or intended to be released as part of the ordinary operation and / or use of the components or only in extraordinary situations and / or circumstances. In the latter case, the joining can be intended to remain joined for a long, indefinite period until the extraordinary circumstances arise.

[0313] It should be appreciated that the components can be joined together using any type of fastening method and / or fastener. The fastening method refers to the way the components are joined. A fastener is generally a separate component used in a mechanical fastening method to mechanically join the components together. A list of examples of fastening methods and / or fasteners is given below. The list is divided according to whether the fastening method and / or fastener is generally permanent, readily released, or difficult to release. A general reference to fastening or fasteners without specifying a particular fastening method(s) or fastener(s) should be interpreted as including any type of fastening method and / or fastener.

[0314] Examples of permanent fastening methods include welding, soldering, brazing, crimping, riveting, stapling, stitching, some types of nailing, some types of adhering, and some types of cementing. Examples of permanent fasteners include some types of nails, some types of dowel pins, most types of rivets, most types of staples, stitches, most types of structural ties, and toggle bolts.

[0315] Examples of readily releasable fastening methods include clamping, pinning, clipping, latching, clasping, buttoning, zipping, buckling, and tying. Examples of readily releasable fasteners include snap fasteners, retainer rings, circlips, split pin, linchpins, R-pins, clevis fasteners, cotter pins, latches, hook and loop fasteners (VELCRO), hook and eye fasteners, push pins, clips, clasps, clamps, zip ties, zippers, buttons, buckles, split pin fasteners, and / or confirmat fasteners.

[0316] Examples of difficult to release fastening methods include bolting, screwing, most types of threaded fastening, and some types of nailing. Examples of difficult to release fasteners include bolts, screws, most types of threaded fasteners, some types of nails, some types of dowel pins, a few types of rivets, a few types of structural ties.

[0317] It should be appreciated that the fastening methods and fasteners are categorized above based on their most common configurations and / or applications. The fastening methods and fasteners can fall into other categories or multiple categories depending on their specific configurations and / or applications. For example, rope, string, wire, cable, chain, or the like can be permanent, readily releasable, or difficult to release depending on the application.Drawing Related Terminology and Interpretative Conventions

[0318] Reference numbers in the drawings and corresponding description refer to identical or similar elements although such numbers may be referenced in the context of different embodiments.

[0319] The drawings are intended to illustrate embodiments that are both drawn to scale and / or not drawn to scale. This means the drawings can be interpreted, for example, as showing: (a) everything drawn to scale, (b) nothing drawn to scale, or (c) one or more features drawn to scale and one or more features not drawn to scale. Accordingly, the drawings can serve to provide support to recite the sizes, proportions, and / or other dimensions of any of the illustrated features either alone or relative to each other. Furthermore, all such sizes, proportions, and / or other dimensions are to be understood as being variable from 0-100% in either direction and thus provide support for claims that recite such values or any ranges or subranges that can be formed by such values.

[0320] Spatial or directional terms, such as “left,” “right,” “front,” “back,” or the like, relate to the subject matter as it is shown in the drawings and / or how it is commonly oriented during manufacture, use, or the like. However, it is to be understood that the described subject matter may assume various alternative orientations and, accordingly, such terms are not to be considered as limiting.Composition Related Terminology and Interpretative Conventions

[0321] Values expressed as a percentage, parts of, or a ratio are by weight unless expressly stated otherwise.

[0322] The description of a group or class of materials as suitable or preferred for a given purpose shall be understood as disclosing that a single member of the group or class or a mixture of any two or more members of the group or class are equally suitable or preferred.

[0323] The description of constituents in chemical terms refers to the constituents: (a) at the time of addition to any combination specified in the description (e.g., the formal or analytical concentration of a salt that dissociates in solution) and / or (b) generated in situ by chemical reactions with other constituents. The description of theconstituents does not preclude other chemical interactions among the constituents of a mixture once mixed unless expressly stated otherwise.

[0324] The description of materials in ionic form additionally implies the presence of sufficient counter ions to produce electrical neutrality for the composition.Incorporation by Reference

[0325] The entire content of each document listed below is incorporated by reference into this document (the documents below are collectively referred to as the “incorporated documents”). If the same term is used in both this document and one or more of the incorporated documents, then it should be interpreted to have the broadest meaning imparted by any one or combination of these sources unless the term has been explicitly defined to have a different meaning in this document. If there is an inconsistency between any incorporated document and this document, then this document shall govern. The incorporated subject matter should not be used to limit or narrow the scope of the explicitly recited or depicted subject matter.Benefit / priority patent documents incorporated by reference:- U.S. Prov. App. No. 63 / 561,629, titled “Systems and Methods for a MultistageMelter,” filed on 5 Mar 2024.- U.S. Prov. App. No. 63 / 573,308, titled “Systems and Methods for a MultistageMelter,” filed on 2 Apr 2024.Additional documents incorporated by reference:- U.S. Pat. No. 6,283,908 (App. No. 09 / 564,7741), titled “Vitrification of Waste withContinuous Filling and Sequential Melting,” filed on 4 May 2000, issued on 4 Sep 2001.- U.S. Pat. No. 6,558,308 (App. No. 10 / 063,460), titled “AVS Melting Process,” filed on25 Apr 2002, issued on 6 May 2003.- U.S. Pat. No. 6,941,878 (App. No. 10 / 605,384), titled “Advanced Vitrification System2,” filed on 26 Sep 2003, issued on 13 Sep 2005.- U.S. Pat. No. 7,211,038 (App. No. 10 / 808,929), titled “Methods for Melting ofMaterials to be Treated,” filed on 25 Mar 2004, issued on 1 May 2007.- U.S. Pat. No. 7,429,239 (App. No. 11 / 796,263), titled “Methods for Melting ofMaterials to be Treated,” filed on 27 Apr 2007, issued on 30 Sep 2008.- U.S. Pat. No. 9,981,868 (App. No. 14 / 748,535), titled “Mobile Processing System forHazardous and Radioactive Isotope Removal,” filed on 24 Jun 2015, issued on 29 May 2018.- U.S. Pat. No. 10,290,384 (App. No. 15 / 012,101), titled “Ion Specific Media Removal from Vessel for Vitrification,” filed on 1 Feb 2016, issued on 14 May 2019.- U.S. Pat. No. 10,311,989 (App. No. 15 / 603,222), titled “System for Storage Container with Removable Shield Panels,” filed on 23 May 2017, issued on 4 Jun 2019.- U.S. Pat. No. 10,449,581 (App. No. 15 / 388,299), titled “System and Method for anElectrode Seal Assembly,” filed on 22 Dec 2016, issued on 22 Oct 2019.- U.S. Pat. No. 10,486,969 (App. No. 14 / 294,033), titled “Balanced Closed LoopContinuous Extraction Process for Hydrogen Isotopes,” filed on 2 Jun 2014, issued on 26 Nov 2019.- Int’l Pat. Pub. No. WO 2023 / 019273 (App. No. PCT / US2022 / 074945), titled “Systems and Methods for Vitrification Process Control,” filed on 12 Aug 2022, published on 16 Feb 2023.

Claims

WHAT IS CLAIMED IS:

1. A vitrification system, comprising: a container preparation area (5) where melt containers (400) are prepared; a melt station area (25) comprising at least one multistage melter module (200), wherein the at least one multistage melter module (200) comprises: a container staging and removal position (305); a temporary lidding and preparation position (310); a melt position (315); a first container cooling position (320); a second container cooling position (325); and a turntable (225), wherein the turntable (225) is configured to move the melt containers (400) between the container staging and removal position (305), the temporary lidding and preparation position (310), the melt position (315), the first container cooling position (320), and the second container cooling position (325); and an off-gas treatment area (40).

2. The vitrification system of claim 1, further comprising at least one sensor (139).

3. The vitrification system of claim 2, further comprising: processing sensor data from the at least one sensor (139) with an electronic computing device (101) configured to provide control signals to operate the vitrification system using data received from the at least one sensor (139).

4. The vitrification system of any one of claims 1-3, wherein the container staging and removal position (305) is located within an airlock (205).

5. The vitrification system of any one of claims 1-4, wherein more than one melt container (400) is processed concurrently, with each melt container (400) at a different position with the at least one multistage melter module (200).

6. The vitrification system of any one of claims 1-5, wherein the at least one multistage melter module (200) comprises a feed inlet, wherein the feed inlet is configured to provide feed to one of the melt containers in the melt position (315) and wherein the feed comprises process material, waste, glass frit, silica sand, and / or glass formers.

7. The vitrification system of any one of claims 1-6, comprising dual multistage melter modules (200a, 200b) and wherein the dual multistage melter modules (200a, 200b) share the container staging and removal position (305).

8. A vitrification process, comprising: preparing a melt container (400) in a container preparation area (5) resulting in a prepared melt container (400); using a multistage melter module (200) comprising a turntable (225) to: receive the prepared melt container (545) in a container staging and removal position (305); remove a lid (550) from the melt container (400) at a temporary lidding and preparation position (310); load starter path and process material (560) into the prepared melt container (400); melt the process material (560) in the melt container (400) at a melt position (315) resulting in a processed container containing vitrified process material; cooling the processed container (565) at a first container cooling position (320); cooling the processed container (570) at a second container cooling position (325); installing a containment seal (575) to the processed container at the temporary lidding and preparation position (310); removing the containment seal (580) from the processed container at the container staging and removal position (305); and removing the processed container (585) from the container staging and removal position (305); and treating process off-gas in an off-gas treatment area.

9. The vitrification process of claim 8, wherein the process material comprises calcine containing materials, process waste, sodium containing wastes, shredded steel drums, contaminated soil, spent sorption media, processed or unprocessed asbestos waste, plenum tips, and / or liquid raffinate.

10. The vitrification process of any one of claims 8-9, further comprising monitoring at least one process parameter with at least one sensor (139).

11. The vitrification process of claim 10, further comprising processing sensor data from the at least one sensor (139) with an electronic computing device (101) configured to provide control signals to operate the vitrification process.

12. The vitrification process of any one of claims 8-11, wherein the container staging and removal position (305) is located within an airlock (205).

13. The vitrification process of any one of claims 8-12, wherein more than one melt container (400) is processed concurrently, with each melt container (400) at a different position with the multistage melter module (200).

14. The vitrification process of any one of claims 8-13, wherein the multistage melter module (200) comprises a feed inlet, wherein the feed inlet is configured toprovide feed to the melt container in the melt position (315) and wherein the feed comprises the process material, waste, glass frit, silica sand, and / or glass formers.

15. The vitrification process of any one of claims 8-14, comprising dual multistage melter modules (200a, 200b) and wherein the dual multistage melter modules (200a, 200b) share the container staging and removal position (305).

16. A vitrification system, comprising: a container preparation area; a melt area comprising a multistage melter module; and an off-gas treatment area.

17. A vitrification system, comprising: a container preparation area; a melt area comprising a multistage melter module, wherein the multistage melter module comprises: a container staging and removal position; a temporary lidding and preparation position; a melt position; a first container cooling position; and a second container cooling position; and an off-gas treatment area.

18. A vitrification system, comprising: a container preparation area where melt containers are prepared; a melt area comprising a multistage melter module, wherein the multistage melter module comprises: a container staging and removal position where the melt containers enter and exit the multistage melter module; a temporary lidding and preparation position where temporary lids are installed on the melt containers; a melt position where contents of the melt containers undergoes a melt process; a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled; and an off-gas treatment area.

19. A multistage melting system, comprising: a turntable, a container staging and removal position, where melt containers enter and exit the turntable; a temporary lidding and preparation position, where temporary lids are installed on the melt containers; a melt position where contents of the melt containers undergo a melt process;a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled.

20. A multistage melting system, comprising: a container loading and unloading area; a turntable; a container preparation area; a melt area; a first container cooling area wherein a processed container is cooled; and a second container cooling area wherein the processed container is cooled.

21. A vitrification system, comprising: a blending system; a feed system; a multistage melter module; and an off-gas treatment system.

22. A vitrification system, comprising: a blending system; a feed system; and a multistage melter module.

23. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in a melt area, wherein the melt area comprises a multistage melter module; and treating process off-gas in an off-gas treatment area.

24. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in the melt container in a melt area, wherein the melt area comprises multistage melter module and wherein the multistage melter module comprises: a container staging and removal position; a temporary lidding and preparation position; a melt position; a first container cooling position; and a second container cooling position; and treating process off-gas in an off-gas treatment area.

25. A vitrification process, comprising: preparing a melt container in a container preparation area; vitrifying process material in the melt container in a melt area comprising a multistage melter module, wherein the multistage melter module comprises:a container staging and removal position where melt containers enter and exit the multistage melter module; a temporary lidding and preparation position where temporary lids are installed on the melt containers; a melt position where the process material undergoes a melt process; a first container cooling position where the melt containers are cooled; and a second container cooling position where the melt containers are cooled; and treating process off-gas in an off-gas treatment area.

26. A multistage melting process, comprising: loading a melt container into a container staging and removal position; installing a temporary lid to the melt container at a temporary lidding and preparation position; vitrifying process material in the melt container at a melt position resulting in vitrified process material; cooling the melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; and removing the melt container with the vitrified process material from the container staging and removal position.

27. A multistage melting process, comprising: preparing a melt container in a container preparation area; and using a turntable to rotate the melt container through a multistage melt process comprising: loading the melt container in a container loading and unloading area; vitrifying process material in the melt container at a melt position resulting in vitrified process material; cooling the melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; and removing the melt container with the vitrified process material from the container loading and unloading area.

28. A multistage melting process, comprising: preparing a melt container in a container preparation area; and using a turntable to rotate the melt container through a multistage melt process comprising: loading the melt container in a container staging and removal position;removing a lid of the melt container in the container staging and removal position; installing a first containment seal in a temporary lidding and preparation position; loading process materials, glass formers, starter path, and / or glass frit into the melt container; vitrifying process material in the melt container at a melt position resulting in vitrified process material; cooling the melt container containing the vitrified process material at a first container cooling position; cooling the melt container containing the vitrified process material at a second container cooling position; installing a second containment seal at the temporary lidding and preparation position; removing the melt container with the vitrified process material from the container staging and removal position.

29. The systems and methods of any one or more of the preceding claims, wherein one or more components of the systems are modular.

30. The systems and methods of any one or more of the preceding claims, wherein the container staging and removal position is an airlock.

31. The systems and methods of any one or more of the preceding claims, wherein the process material comprises calcine containing materials, process waste, sodium containing wastes, shredded steel drums, contaminated soil, spent sorption media, processed or unprocessed asbestos waste, plenum tips, and / or liquid raffinate.

32. The systems and methods of any one or more of the preceding claims, wherein the melt container is a sealed electric arc furnace, a joule heated melter, other type of sealed furnace or melter, a three cubic meter box, a four cubic meter box, a metal drum, an industrial drum container, a custom design, a square shaped box, a rectangular shaped box, a cylinder, a high-level waste container, or a short naval SNF container.

33. The systems and methods of any one or more of the preceding claims, wherein the melt container is composed or made of steel, lead, concrete, and / or ceramic.

34. The systems and methods of any one or more of the preceding claims, wherein the melt container is lined with refractory and / or insulation.

35. The systems and methods of any one or more of the preceding claims, wherein a starter path is inserted into the melt container prior to the vitrification process.

36. The systems and methods of any one or more of the preceding claims, wherein the melt container is prepared with insulation, refractory, two or more electrodes, an outer lid, and a containment seal.

37. The systems and methods of any one or more of the preceding claims, wherein two electrodes are used in the melt container.

38. The systems and methods of any one or more of the preceding claims, wherein four electrodes are used in the melt container.

39. The systems and methods of any one or more of the preceding claims, wherein melt containers are prepared and bulk materials are loaded.

40. The systems and methods of any one or more of the preceding claims, wherein bulk materials comprise glass formers, starter path, graphite, and / or glass frit.

41. The systems and methods of any one or more of the preceding claims, wherein bulk materials are conveyed using pneumatic vacuum transfer.

42. The systems and methods of any one or more of the preceding claims, wherein bulk materials are loaded into at least one hopper.

43. The systems and methods of any one or more of the preceding claims, wherein the at least one hopper is sized to accommodate at least one full melt process.

44. The systems and methods of any one or more of the preceding claims, wherein bulk materials are fed into the at least one hopper using pneumatic vacuum conveyance, an augur, and / or gravity feed.

45. The systems and methods of any one or more of the preceding claims, wherein the amount of graphite per melt container is approximately 7 lbs to approximately 74 lbs.

46. The systems and methods of any one or more of the preceding claims, wherein the amount of glass frit per melt container is approximately 17 lbs to approximately 174 lbs.

47. The systems and methods of any one or more of the preceding claims, wherein the amount of glass formers per melt container is approximately 1,400 lbs to 18,150 lbs.

48. The systems and methods of any one or more of the preceding claims, wherein glass formers comprise SiO2, A12O3, and / or BO2.

49. The systems and methods of any one or more of the preceding claims, wherein a container staging and removal position, a melt position, a first container cooling position, and a second container cooling position are located on the turntable.

50. The systems and methods of any one or more of the preceding claims, wherein the turntable is operably configured to turn resulting in moving containers from one position to the next position.

51. The systems and methods of any one or more of the preceding claims, wherein a container staging and removal position, a melt position, a first container cooling position, and a second container cooling position are located on the multistage melter module.

52. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module is operably configured to turn resulting in moving containers from one position to the next position.

53. The systems and methods of any one or more of the preceding claims, wherein multiple melt containers can be processed concurrently.

54. The systems and methods of any one or more of the preceding claims, wherein multiple melt containers proceed through the systems and processes concurrently with one container in each position.

55. The systems and methods of any one or more of the preceding claims, wherein dual turntables are utilized concurrently.

56. The systems and methods of any one or more of the preceding claims, wherein the dual turntables share an airlock.

57. The systems and methods of any one or more of the preceding claims, wherein the dual turntables share the container staging and removal position.

58. The systems and methods of any one or more of the preceding claims, wherein dual multistage melter modules are utilized concurrently.

59. The systems and methods of any one or more of the preceding claims, wherein the dual multistage melter modules share an airlock.

60. The systems and methods of any one or more of the preceding claims, wherein the dual multistage melter modules share the container staging and removal position.

61. The systems and methods of any one or more of the preceding claims, wherein the shared container staging and removal position accommodates two or more containers at a time.

62. The systems and methods of any one or more of the preceding claims, wherein the turntable comprises cascading ventilation.

63. The systems and methods of any one or more of the preceding claims, wherein the turntable comprises one or more off-gas outlets.

64. The systems and methods of any one or more of the preceding claims, wherein the turntable comprises an airlock in the container staging and removal position.

65. The systems and methods of any one or more of the preceding claims, wherein the turntable comprises one or more container lifts.

66. The systems and methods of any one or more of the preceding claims, wherein the turntable comprises a feed inlet in the melt area.

67. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module comprises cascading ventilation.

68. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module comprises one or more off-gas outlets.

69. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module comprises an airlock in the container staging and removal position.

70. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module comprises one or more container lifts.

71. The systems and methods of any one or more of the preceding claims, wherein the multistage melter module comprises a feed inlet in the melt area.

72. The systems and methods of any one or more of the preceding claims, wherein the feed inlet is configured to one of provide free or metered feed to a container in the melt area.

73. The systems and methods of any one or more of the preceding claims, wherein the feed comprises waste, glass frit, silica sand, and / or glass formers.

74. The systems and methods of any one or more of the preceding claims, comprising one or more air inlets.

75. The systems and methods of any one or more of the preceding claims, comprising a ventilation system.

76. The systems and methods of any one or more of the preceding claims, comprising one or more melt position seals configured to prevent release of gases, vapors, and / or particulates.

77. The systems and methods of any one or more of the preceding claims, comprising one or more ventilation zones.

78. The systems and methods of any one or more of the preceding claims, wherein the multiple ventilation zones comprise an airlock, secondary containment, primary containment, and active off-gas.

79. The systems and methods of any one or more of the preceding claims, further comprising one or more remote manipulators configured to perform operations in the systems and methods disclosed herein remotely.

80. The systems and methods of any one or more of the preceding claims, further comprising a control room wherein the control room is operable to one of control operations in the system and monitor operations in the system.

81. The systems and methods of any one or more of the preceding claims, wherein the control system captures, stores, and / or trends key processes and / or facility data.

82. The systems and methods of any one or more of the preceding claims, where data is processed in near real-time.

83. The systems and methods of any one or more of the preceding claims, wherein data and / or processed information is transmitted to a remote location for long-term storage.

84. The systems and methods of any one or more of the preceding claims, further comprising a human machine interface.

85. The systems and methods of any one or more of the preceding claims, wherein materials from hoppers are delivered at a metered or controlled rate.

86. The systems and methods of any one or more of the preceding claims, further comprising at least one sensor.

87. The systems and methods of any one or more of the preceding claims, wherein the at least one sensor comprises a contact sensor, a non-contact sensor, a capacitive sensor, an inductive sensor, a 2D range sensor, a 3D imager, a fiber optic cable, a camera, a thermal imager, a thermometer, a pressure sensor, an accelerometer, an inertial measurement unit (IMU), a rotary encoder, a radiation detector, LIDAR, and / or a strain sensor.

88. The systems and methods of any one or more of the preceding claims, wherein the camera is an IR camera, and wherein the IR camera includes heat and / or radiation shielding.

89. The systems and methods of any one or more of the preceding claims, wherein an off-gas stack monitoring system comprises a radiation monitor (beta and gamma), a record sampler, a carbon-14 collection system, a gas emissions monitor (nitrogen oxide, sulfur dioxides, hydrogen chloride, and / or carbon monoxide), a particulate monitor P-10 (sub 10-micron particle), an oxygen monitor, a total hydrocarbon monitor, an off-gas stack flow measurement, an off-gas stack temperature measurement, a shrouded or un-shrouded sample probe, a heat-traced sample transport line, and / or cabinets / enclosures to house equipment.

90. The systems and methods of any one or more of the preceding claims, wherein the off-gas treatment system is operable to remove volatile iodine (1-131), semi-volatile cesium-134 (Cs-134), cesium-137 (Cs-137), technetium (Tc-99), and / or strontium-90 (Sr-90) from process off-gas.

91. The systems and methods of any one or more of the preceding claims, comprising at least one filter such as a sintered metal filter, a HEGA filter, and / or a HEPA filter.

92. The systems and methods of any one or more of the preceding claims, wherein particulates and / or radionuclides from the at least one filter are recycled to the melt container during the vitrification process.

93. The systems and methods of any one or more of the preceding claims, wherein semi-volatile radionuclides and / or blowdown from the quencher / scrubber are treated using one or more of ion exchange, evaporation, crystallization, and / or water reclamation.

94. The systems and methods of any one or more of the preceding claims, wherein solid wastes from the quencher / scrubber are recycled to the melt container during the melt process.

95. The systems and methods of any one or more of the preceding claims, wherein the off-gas treatment system tempers, chemically treats, scrubs, filters, and / or monitors the process off-gas.

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