Cooling system, polishing apparatus and polishing system for heavy-duty silicon carbide wafer processing

Abstract

The present application relates to a cooling system, polishing apparatus and polishing system for heavy-duty silicon carbide wafer processing. The cooling system comprises a main body unit (100), a liquid storage unit (200), a first cooling unit (300), a second cooling unit (400), a third cooling unit (500) and an electronic control unit (600).

Description

Cooling systems, polishing equipment and polishing systems for heavy-duty silicon carbide wafer processing

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 19, 2024, with application number 202410314144.8, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of semiconductor chip manufacturing technology, for example, to a cooling system, polishing equipment, polishing system and polishing system for heavy silicon carbide wafer processing. Background Art

[0003] In the field of chemical mechanical polishing technology, the wafer is clamped at the lower end of a rotating polishing head, a polishing pad is provided at the upper end of a rotating polishing disk, and polishing liquid is provided between the wafer on the polishing head and the polishing pad. Under the combined action of chemistry and mechanics, the wafer is globally flattened.

[0004] The processing equipment and methods for chemical mechanical polishing of silicon carbide wafers in the related art are mainly the following: the first process route is to use batch polishing equipment for processing 8-inch and smaller silicon wafers for single-sided polishing; the second process route is to use double-sided polishing equipment to polish both sides of the silicon carbide wafer at the same time; the third process route is to use chemical mechanical planarization (CMP) equipment similar to the chip segment to clamp the wafer single-piece and use high pressure for processing.

[0005] For the above chemical mechanical polishing, the following situations exist:

[0006] 1. The first type of processing equipment is suitable for polishing silicon wafers. The power and rigid structure of this type of equipment are suitable for the polishing process and conditions of silicon wafers, but cannot effectively meet the long-term and high-intensity polishing process requirements of silicon carbide wafers. Using this type of equipment to polish silicon carbide wafers will result in low polishing efficiency, high polishing track repetition leading to deterioration of polishing accuracy, and excessively high polishing processing costs.

[0007] 2. Although the second type of processing equipment can process both sides of the wafer at the same time, and the planetary motion can produce a repeatable and lower trajectory to effectively achieve processing accuracy, the efficiency of the double-sided polishing process is limited by the strength of the planetary wheel, resulting in the inability to use high pressure and high strength to improve the polishing efficiency in the double-sided polishing process of silicon carbide wafers. At the same time, the double-sided polishing process has a high risk of fragmentation, high maintenance costs, and large equipment investment.

[0008] 3. The third type of processing equipment uses a CMP device with airbag pressurization to complete the single-wafer polishing processing of the wafer. The processing pressure can reach 7PSI, which far exceeds the 3-4PSI pressure commonly used in silicon wafer processing, thereby achieving high-efficiency silicon carbide polishing processing. However, when this equipment and process are applied to the polishing of silicon carbide wafers, the equipment investment cost is huge, far exceeding the single-sided or double-sided polishing equipment in related technologies. Although the wafer polishing time is short, compared with batch-type polishing equipment, the single-wafer polishing cycle of this equipment for silicon carbide wafers is too long. At the same time, the cost of special accessories or auxiliary materials used in this equipment is also very high, which is not suitable for mass production of silicon carbide substrates.

[0009] Currently, no effective solutions have been proposed for the problems existing in related technologies, such as poor heat dissipation of polishing equipment, low polishing efficiency, excessive repetition of polishing tracks leading to deterioration of polishing accuracy, and high polishing processing costs.

[0010] Summary of the Invention

[0011] The embodiments of the present application provide a cooling system, polishing equipment and polishing system for heavy silicon carbide wafer processing, so as to avoid the problems existing in the related art such as low polishing efficiency, high polishing track repetition leading to deterioration of polishing accuracy, and high polishing processing costs.

[0012] In a first aspect, the present application provides a cooling system for heavy silicon carbide wafer processing, comprising:

[0013] A main unit, wherein the main unit is configured to install components;

[0014] A liquid storage unit, the liquid storage unit being provided on the main body unit and configured to store polishing liquid and cooling liquid;

[0015] a first cooling unit, the first cooling unit being provided on the polishing plate of the polishing device and being in communication with the liquid storage unit, and being configured to cool the polishing plate;

[0016] a second cooling unit, the second cooling unit being arranged in a pipeline connecting the liquid storage unit and the polishing device and being in communication with the liquid storage unit, and being arranged to cool the polishing liquid;

[0017] a third cooling unit, the third cooling unit being provided in the polishing device and being in communication with the air compressor and being configured to cool the polishing pad mounted on the polishing plate;

[0018] An electronic control unit is provided in the main unit and is connected to the first cooling unit, the second cooling unit and the third cooling unit respectively, and is configured to control the first cooling unit, the second cooling unit and the third cooling unit.

[0019] In a second aspect, the present application further provides a polishing device for heavy silicon carbide wafer processing, connected to the cooling system described in the first aspect, comprising:

[0020] A box unit, wherein the box unit is configured to install components;

[0021] A horizontal moving unit, wherein the horizontal moving unit is provided on the box unit;

[0022] a vertical moving unit, the vertical moving unit being arranged on the horizontal moving unit and capable of reciprocating in a horizontal direction under the action of the horizontal moving unit;

[0023] The pressure plate unit is arranged on the vertical moving unit and can move back and forth in the vertical direction under the action of the vertical moving unit, and is arranged to apply pressure to the silicon carbide wafer placed on the polishing pad.

[0024] In a third aspect, a polishing system for heavy silicon carbide wafer processing is provided, comprising: a first cooling device, a second cooling device, such as the cooling system described in the first aspect, and the polishing device described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic diagram of a cooling system provided in an embodiment of the present application;

[0026] FIG2 is a schematic diagram of a liquid storage unit in a cooling system provided in an embodiment of the present application;

[0027] FIG3 is a schematic diagram (I) of a first cooling unit in a cooling system provided in an embodiment of the present application;

[0028] FIG4 is a schematic diagram (1) of a second cooling unit in a cooling system provided in an embodiment of the present application;

[0029] FIG5 is a schematic diagram (1) of a third cooling unit in a cooling system provided in an embodiment of the present application;

[0030] FIG6 is a schematic diagram (II) of a third cooling unit in a cooling system provided in an embodiment of the present application;

[0031] FIG7 is a schematic diagram (III) of a third cooling unit in a cooling system provided in an embodiment of the present application;

[0032] FIG8 is a schematic diagram of a polishing device provided in an embodiment of the present application;

[0033] FIG9 is a schematic diagram of a horizontal moving unit in a polishing device provided in an embodiment of the present application;

[0034] FIG10 is a schematic diagram of a vertical moving unit in a polishing device provided in an embodiment of the present application;

[0035] FIG11 is a schematic diagram of a pressure plate unit in a polishing device provided in an embodiment of the present application;

[0036] FIG12 is a schematic diagram of a polishing system provided in an embodiment of the present application (I);

[0037] FIG13 is a schematic diagram (II) of a first cooling unit in a cooling system provided in an embodiment of the present application;

[0038] FIG14 is a schematic diagram (II) of a second cooling unit in a cooling system provided in an embodiment of the present application;

[0039] FIG15 is a schematic diagram (II) of a polishing system provided in an embodiment of the present application;

[0040] FIG16 is a schematic diagram (III) of a polishing system provided in an embodiment of the present application;

[0041] FIG17 is a schematic diagram of a cooling system provided in another embodiment of the present application.

[0042] The accompanying drawings are as follows:

[0043] 10. Cooling system;

[0044] 100. Main unit;

[0045] 200, liquid storage unit; 210, first liquid storage element; 220, second liquid storage element; 230, first pump element; 240, second pump element; 250, first cooling coil element; 260, heat exchange element; 270, first connecting pipe element; 280, second connecting pipe element; 290, first valve element;

[0046] 300, first cooling unit; 310, first cooling element; 320, second cooling coil element; 330, first cooling line element; 340, second valve element;

[0047] 400, second cooling unit; 410, second cooling element; 411, first liquid inlet; 412, first liquid outlet; 413, second liquid inlet; 414, second liquid outlet; 420, third cooling coil element; 430, second cooling line element; 440, third valve element;

[0048] 500, third cooling unit; 510, third cooling element; 511, air inlet; 512, air outlet; 513, cooling chamber; 520, air nozzle element; 530, third cooling pipeline element;

[0049] 600, electronic control unit;

[0050] 20. Polishing equipment;

[0051] 700, cabinet unit;

[0052] 800, horizontal moving unit; 810, slide rail component; 820, slider component; 830, support component; 840, first driving component;

[0053] 900, vertical moving unit; 910, telescopic connecting element; 920, second driving element;

[0054] 1000, pressure disc unit; 1010, pressure disc element; 1020, pressure applying element;

[0055] 1100, first cooling equipment;

[0056] 1200, second cooling equipment;

[0057] 1300, air compressor;

[0058] 1400 polishing disc; 1410 polishing pad. DETAILED DESCRIPTION

[0059] Unless otherwise defined, the technical or scientific terms used in this application should have the ordinary meaning understood by a person of ordinary skill in the technical field to which this application belongs. The words "one", "a", "the" and the like used in this application do not indicate a limit on quantity and may indicate the singular or plural. The terms "include", "comprise", "have" and any variations thereof used in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units that are inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The word "multiple" used in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific order for the objects.

[0060] As shown in Figures 1, 2, 3, 4, 5, 6, 7, 13 and 14, a cooling system 10 for heavy silicon carbide wafer processing includes a main unit 100, a liquid storage unit 200, a first cooling unit 300, a second cooling unit 400, a third cooling unit 500 and an electronic control unit 600. Among them, the main unit 100 is configured to install parts; the liquid storage unit 200 is arranged on the main unit 100, and is configured to store polishing liquid and cooling liquid; the first cooling unit 300 is arranged on the polishing disk 1400 of the polishing equipment 20, and is connected to the liquid storage unit 200, and is configured to cool the polishing disk 1400; the second cooling unit 400 is arranged in the pipeline connecting the liquid storage unit 200 and the polishing equipment 20, and is connected to the liquid storage unit 200, and is configured to cool the polishing liquid; the third cooling unit 500 is arranged on the polishing equipment 20, and is connected to the air compressor 1300, and is configured to cool the polishing pad 1410 installed on the polishing disk 1400; the electronic control unit 600 is arranged in the main unit 100, and is respectively connected to the first cooling unit 300, the second cooling unit 400 and the third cooling unit 500, and is configured to control the first cooling unit 300, the second cooling unit 400 and the third cooling unit 500.

[0061] It should be noted that the electronic control unit 600 can provide power to the first cooling unit 300 , the second cooling unit 400 and the third cooling unit 500 , and control the first cooling unit 300 , the second cooling unit 400 and the third cooling unit 500 .

[0062] In some embodiments, the electric control unit 600 includes but is not limited to an electric control cabinet.

[0063] The main unit 100 includes a main frame and a roller element. The main frame is made of acid- and alkali-resistant materials and can be configured to install various components. The roller element is set at the bottom of the main frame and is configured to enable the main frame to move.

[0064] It should be noted that the main frame of the equipment can be set according to the actual equipment assembly requirements, and no excessive restrictions are made here; in addition, the structure of the main frame of the equipment is related technology and will not be repeated here.

[0065] The roller element is installed on the bottom of the main frame of the equipment by welding, riveting or bolting, and the roller element can realize the free movement of the main frame of the equipment.

[0066] In some embodiments, the scroll wheel element includes but is not limited to a directional wheel.

[0067] The number of roller elements can be 4, and the 4 roller elements are respectively installed at the corners of the bottom of the device main frame.

[0068] In some of the embodiments, the number of roller elements may be 6, 8, etc., that is, the number of roller elements may be set according to actual needs, and no further restrictions are imposed here.

[0069] As shown in FIG2 , the liquid storage unit 200 includes a first liquid storage element 210 and a second liquid storage element 220. The first liquid storage element 210 is disposed in the main unit 100 and communicates with the second cooling unit 400. It is configured to store polishing liquid and supply polishing liquid to the second cooling unit 400. The second liquid storage element 220 is disposed in the main unit 100 and communicates with the first cooling unit 300 and the second cooling unit 400. It is configured to store coolant and supply coolant to the first cooling unit 300 and the second cooling unit 400.

[0070] The first liquid storage element 210 is formed on the main frame of the device; the second liquid storage element 220 is formed on the main frame of the device, and the second liquid storage element 220 is arranged in a rectangular box structure.

[0071] In some embodiments, the first liquid storage element 210 is configured as a rectangular box structure.

[0072] In some embodiments, the first liquid storage element 210 includes but is not limited to a liquid reservoir.

[0073] In some embodiments, the second liquid storage element 220 is configured as a rectangular box structure.

[0074] In some embodiments, the second liquid storage element 220 includes but is not limited to a liquid reservoir.

[0075] The liquid storage unit 200 further includes a first pump element 230. The first pump element 230 is connected to the first cooling unit 300 and is configured to pump the polishing liquid.

[0076] Among them, the first pump body element 230 can be arranged inside the first liquid storage element 210. For example, the first pump body element 230 is installed inside the first liquid storage element 210 by welding, riveting or bolting, and the liquid outlet end of the first pump body element 230 is connected to the second cooling unit 300 to realize the pumping of the polishing liquid.

[0077] In some embodiments, the first pump element 230 includes, but is not limited to, a liquid pump.

[0078] As shown in FIG. 2 and FIG. 17 , the liquid storage unit 200 further includes a second pump element 240 , a first communication pipe element 270 , a first cooling coil element 250 , a heat exchange element 260 , a second communication pipe element 280 and a first valve element 290 . Among them, the second pump body element 240 is respectively connected to the first cooling unit 300 and the second cooling unit 400, and is configured to pump coolant; the first end of the first connecting pipeline element 270 is connected to the second pump body element 240; the first cooling coil element 250 is coiled and arranged at the side wall of the first liquid storage element 210, and the first end of the first cooling coil element 250 is connected to the second end of the first connecting pipeline element 270; the heat exchange element 260 is arranged in the main unit 100, and the heat exchange element 260 is connected to the second end of the first cooling coil element 250; the first end of the second connecting pipeline element 280 is connected to the heat exchange element 260, and the second end of the second connecting pipeline element 280 is connected to the second liquid storage element 220; the first valve element 290 is arranged in the first connecting pipeline element 270 and the second connecting pipeline element 280, and is configured to control the circulation of the first connecting pipeline element 270 and the second connecting pipeline element 280.

[0079] Among them, the second pump body element 240 can be arranged inside the second liquid storage element 220. For example, the second pump body element 240 is installed inside the second liquid storage element 220 by welding, riveting or bolting, and the liquid outlet end of the second pump body element 240 is connected to the second cooling unit 400 to realize the pumping of the coolant.

[0080] In some embodiments, the second pump element 240 includes, but is not limited to, a liquid pump.

[0081] The first end of the first connecting pipe element 270 is connected to the liquid outlet end of the second pump body element 240 via a joint or other structure, and the second end of the first connecting pipe element 270 is connected to the first cooling coil element 250 via a joint or other structure. It should be noted that the first end and the second end of the first connecting pipe element 270 are respectively the two ends of the length direction of the first connecting pipe element 270.

[0082] In some embodiments, the first connecting pipe component 270 includes but is not limited to a stainless steel pipe.

[0083] The first end of the first cooling coil element 250 is connected to the second end of the first connecting pipe element 270 via a joint or other structure, and the second end of the first cooling coil element 250 is connected to the liquid inlet end of the heat exchange element 260 via a joint or other structure. It should be noted that the first end and the second end of the first cooling coil element 250 are respectively the two ends of its length.

[0084] In some embodiments, the first cooling coil element 250 includes, but is not limited to, a stainless steel tube.

[0085] The first end of the second connecting pipe element 280 is connected to the liquid outlet end of the heat exchange element 260 through a joint or other structure, and the second end of the second connecting pipe element 280 is connected to the second liquid storage element 220 through a joint or other structure. It should be noted that the first end and the second end of the second connecting pipe element 280 are respectively the two ends of the length direction of the second connecting pipe element 280.

[0086] In some embodiments, the second connecting pipe component 280 includes but is not limited to a stainless steel pipe.

[0087] The first valve element 290 includes a first diaphragm valve and a second diaphragm valve. The first diaphragm valve is provided on the first communication line element 270 to control the flow of the first communication line element 270 ; the second diaphragm valve is provided on the second communication line element 280 to control the flow of the second communication line element 280 .

[0088] As shown in Figures 3 and 13, the first cooling unit 300 includes a first cooling element 310, a first cooling circuit element 330, a second cooling coil element 320, and a second valve element 340. The first cooling element 310 is disposed at the bottom of the polishing plate 1400 and connected to the polishing plate 1400, configured to mount components; the first end of the first cooling circuit element 330 is connected to the liquid storage unit 200 and configured to transport coolant; the second cooling coil element 320 is disposed on the first cooling element 310 and connected to the second end of the first cooling circuit element 330, configured to cool the polishing plate 1400; and the second valve element 340 is disposed on the first cooling circuit element and configured to control the flow of the first cooling circuit element 330.

[0089] The first cooling element 310 is connected to the polishing plate 1400 by welding, riveting or bolting, and the first cooling element 310 is arranged in a round seat structure.

[0090] It should be noted that the diameter of the first cooling element 310 is adapted to the diameter of the polishing plate 1400. It should be understood that the diameter of the first cooling element 310 is the same as the diameter of the polishing plate 1400.

[0091] In some embodiments, the first cooling element 310 includes but is not limited to a polishing plate water cooling seat.

[0092] The first cooling circuit component 330 includes a first pipeline. The first end of the first pipeline is connected to the liquid outlet of the second pump component 240 via a joint or other structure. The second end of the first pipeline is connected to the first cooling element 310 and is configured to transport coolant. It should be noted that the first and second ends of the first pipeline are respectively the two ends of its length.

[0093] In some embodiments, the first cooling circuit element 330 includes, but is not limited to, a stainless steel tube.

[0094] The second cooling coil element 320 is disposed in a curved and coiled manner along the circumference of the first cooling element 310 , and the second cooling coil element 320 is in communication with the first cooling element 310 .

[0095] In some embodiments, the second cooling coil element 320 includes, but is not limited to, a stainless steel tube.

[0096] The second valve element 340 includes a third diaphragm valve, wherein the third diaphragm valve is disposed in the first pipeline and controls the flow of the first pipeline.

[0097] As shown in Figures 4 and 14, the second cooling unit 400 includes a second cooling element 410, a third cooling coil element 420, a second cooling pipe element 430, and a third valve element 440. The second cooling element 410 is disposed in the pipeline connecting the liquid storage unit 200 and the polishing device 20, and is in communication with the first liquid storage element 210 of the liquid storage unit 200. The third cooling coil element 420 is coiled inside the second cooling element 410 and is in communication with the second liquid storage element 220 of the liquid storage unit 200, and is configured to cool the polishing liquid. The second cooling pipe element 430 connects the third cooling coil element 420 with the second liquid storage element 220 of the liquid storage unit 200, and the third cooling pipe element 430 connects the third cooling coil element 420 with the heat exchange element 260 of the liquid storage unit 200. The third valve element 440 is disposed in the second cooling pipe element 430 and is configured to control the flow of the second cooling pipe element 430.

[0098] The second cooling element 410 is configured as a hollow cylindrical structure, and a first end of the second cooling element 410 is connected to the first liquid storage element 210 via a pipeline, and a second end of the second cooling element 410 is connected to the polishing device 20 via a pipeline. It should be noted that the first end and the second end of the second cooling element 410 are respectively the two ends of the second cooling element 410 in the longitudinal direction.

[0099] In some embodiments, the second cooling element 410 includes, but is not limited to, a stainless steel cylinder.

[0100] The second cooling element 410 includes a first liquid inlet 411 (cooling liquid inlet), a first liquid outlet 412 (cooling liquid outlet), a second liquid inlet 413 (polishing liquid inlet), and a second liquid outlet 414 (polishing liquid outlet). The first liquid inlet 411 is located at the first end of the second cooling element 410 and communicates with the first liquid storage element 210 via a pipeline; the first liquid outlet 412 is located on the sidewall of the second end of the second cooling element 410 and communicates with the polishing device 20 via a pipeline; the second liquid inlet 413 is located on the sidewall of the first end of the second cooling element 410 and communicates with the second liquid storage element 220 via a second cooling line element 430; and the second liquid outlet 414 is located on the sidewall of the second end of the second cooling element 410 and communicates with the heat exchange element 260 of the liquid storage unit 200 via the second cooling line element 430.

[0101] The first liquid inlet 411 is opened at the center of the first end of the second cooling element 410 and is connected to the second liquid storage element 220 through the second cooling pipeline 430 .

[0102] The first liquid outlet 412 is opened at the arc-shaped side wall of the second end of the second cooling element 410 and is connected to the heat exchange element 260 through the second cooling pipeline 430 .

[0103] The second liquid inlet 413 is opened at the arc-shaped side wall of the first end of the second cooling element 410 , and the second liquid inlet 413 and the first liquid outlet 412 are located on the same straight line. The second liquid inlet 413 is connected to the first liquid storage element 210 through a pipeline.

[0104] The second liquid outlet 414 is opened at the arc-shaped side wall of the second end of the second cooling element 410 , and the second liquid outlet 414 is symmetrically arranged with the first liquid outlet 412 . The second liquid outlet 414 is connected to the polishing device 20 through a pipeline.

[0105] The third cooling coil element 420 is installed inside the second cooling element 410 , and the third cooling coil element 420 is coiled along the axial direction of the second cooling element 410 .

[0106] In addition, the first end of the third cooling coil element 420 is connected to the second liquid storage element 220 through the second cooling pipe element 430, and the second end of the third cooling coil element 420 is connected to the heat exchange element 260 through the second cooling pipe element 430; it should be noted that the first end and the second end of the third cooling coil element 420 are respectively the two ends in its length direction.

[0107] In some embodiments, the third cooling coil element 420 includes, but is not limited to, a stainless steel tube.

[0108] The second cooling circuit element 430 includes a second pipeline and a third pipeline. The first end of the second pipeline is connected to the second pump element 240 , and the second end of the second pipeline is connected to the first liquid inlet 411 . The first end of the third pipeline is connected to the first liquid outlet 412 , and the second end of the third pipeline is connected to the heat exchange element 260 .

[0109] It should be noted that the first end and the second end of the second pipeline are respectively the two ends in the length direction thereof; the first end and the second end of the third pipeline are respectively the two ends in the length direction thereof.

[0110] In some embodiments, the second cooling circuit element 430 includes, but is not limited to, a stainless steel tube.

[0111] The third valve element 440 includes a fourth diaphragm valve and a fifth diaphragm valve. The fourth diaphragm valve is disposed in the second pipeline to control the flow of the second pipeline; the fifth diaphragm valve is disposed in the third pipeline to control the flow of the third pipeline.

[0112] As shown in Figures 5, 6, 7, and 16, the third cooling unit 500 includes at least one third cooling element 510, a plurality of air nozzle elements 520, and a plurality of third cooling line elements 530. The third cooling element 510 is disposed on the polishing apparatus 20 and is connected to the air compressor 1300 to store compressed air. The plurality of air nozzle elements 520 are connected to the third cooling element 510 to purge air toward the polishing pad 1410. The plurality of third cooling line elements 530 connect the corresponding air nozzle elements 520 to the third cooling element 510, and connect the third cooling element 510 to the air compressor 1300 to deliver air.

[0113] The third cooling element 510 is arranged in a hollow cylindrical structure. The third cooling element 510 is installed on the polishing device by welding, riveting or bolting, and the third cooling element 510 is connected to the air compressor 1300 and the air nozzle element 520 through the third cooling pipeline element 530.

[0114] In some embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylinder.

[0115] It should be noted that the number of the third cooling elements 510 may be two, and the two third cooling elements 510 are arranged at intervals on the polishing device 20 .

[0116] In some embodiments, the number of the third cooling elements 510 may be 1, 3, etc., that is, the number of the third cooling elements 510 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0117] The third cooling element 510 includes an air inlet 511 and an air outlet 512. The air inlet 511 is located on the sidewall of the third cooling element 510 and communicates with the air compressor 1300 via the third cooling pipe component 530. The air outlet 512 is located at the bottom of the third cooling element 510 and communicates with the air nozzle component 520 via the third cooling pipe component 530.

[0118] The air inlet 511 is opened at the arc side wall in the middle of the third cooling element 510 , and the air inlet 511 is connected to the air compressor 1300 through the third cooling pipeline element 530 .

[0119] The air outlet 512 is formed at the bottom of the third cooling element 510 , and the air outlet 512 is connected to the air nozzle element 520 through the third cooling pipe element 530 .

[0120] In addition, a cooling chamber 513 is formed inside the third cooling element 510. The cooling chamber 513 is formed inside the third cooling element 510 and is configured to cool the air compressed by the air compressor 1300.

[0121] The air nozzle element 520 is connected to the third cooling element 510 through the third cooling pipe element 530 , and the air nozzle element 520 blows compressed air at room temperature toward the polishing pad 1410 on the polishing device 20 , thereby cooling the polishing pad 1410 .

[0122] In some embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylinder.

[0123] It should be noted that the number of the air nozzle elements 520 can be set according to actual needs and no excessive restrictions are imposed here.

[0124] The third cooling circuit element 530 includes a fourth circuit and a fifth circuit. The first end of the fourth circuit is connected to the air compressor 1300 , and the second end of the fourth circuit is connected to the air inlet 511 . The first end of the fifth circuit is connected to the air outlet 512 , and the second end of the fifth circuit is connected to the air nozzle element 520 .

[0125] It should be noted that the first end and the second end of the fourth pipeline are respectively the two ends in the length direction thereof; the first end and the second end of the fifth pipeline are respectively the two ends in the length direction thereof.

[0126] In some embodiments, the third cooling circuit element 530 includes, but is not limited to, a stainless steel tube.

[0127] It should be noted that the number of the fourth pipelines matches the number of the third cooling elements 510 , that is, the number of the fourth pipelines is the same as the number of the third cooling elements 510 .

[0128] It should be noted that the number of the fifth pipelines matches the number of the gas nozzle elements 520 , that is, the number of the fifth pipelines is the same as the number of the gas nozzle elements 520 .

[0129] The working process of the cooling system in this embodiment is as follows:

[0130] In actual operation, the electronic control unit 600 starts the first pump element 230, and the first pump element 230 pumps the polishing liquid in the first liquid storage element 210 to the polishing device 20 through the pipeline;

[0131] The electronic control unit 600 activates the second pump element 240 and opens the first diaphragm valve. The second pump element 240 pumps the coolant in the second liquid storage element 220 into the first cooling coil element 250 through the first connecting pipe element 270, thereby cooling the polishing liquid in the first liquid storage element 210.

[0132] The electronic control unit 600 opens the second diaphragm valve, connecting the heat exchange element 260 and the second liquid storage element 220 via the second connecting pipe 280. The coolant in the first cooling coil element 250 exchanges heat with the polishing liquid in the first liquid storage element 210 and flows to the heat exchange element 260, lowering the temperature of the coolant. The coolant in the heat exchange element 260 then flows back to the second liquid storage element 220 via the second connecting pipe 280, thereby achieving coolant recycling.

[0133] The electronic control unit 600 opens the third diaphragm valve, allowing the coolant to flow through the first pipeline to the second cooling coil element 320, thereby cooling the polishing plate 1400;

[0134] The electronic control unit 600 opens the fourth diaphragm valve to connect the second pipeline with the third cooling coil element 420, thereby allowing the coolant to flow to the third cooling coil element 420, so that the coolant can exchange heat with the polishing liquid in the third cooling element 510, thereby cooling the polishing liquid;

[0135] The electronic control unit 600 opens the fifth diaphragm valve, allowing the coolant after heat exchange to flow to the heat exchange element 260 through the third pipeline, thereby realizing the recycling of the coolant;

[0136] The electronic control unit 600 starts the air compressor 1300 and the air nozzle element 520. The air compressor 1300 can compress the external air and pump it to the third cooling element 510 through the fourth pipeline. The third cooling element 510 can cool the compressed air and then pump it to the air nozzle element 520 through the fifth pipeline. The air nozzle element 520 blows out air to cool the polishing pad 1410.

[0137] In this embodiment, a first cooling unit 300 is provided on the polishing disc 1400 and the first cooling unit 300 is connected to the liquid storage unit 200, so that the polishing disc 1400 can be cooled, thereby preventing the polishing disc 1400 from being overheated during operation and affecting the polishing accuracy; a second cooling unit 400 is provided on the pipeline connecting the liquid storage unit 200 and the polishing equipment 20, so that the second cooling unit 400 can further cool the polishing liquid in the pipeline; a third cooling unit 500 is provided on the polishing equipment 20, and the polishing pad 1410 is cooled by compressed air, so that the polishing accuracy of the polishing equipment 20 can be guaranteed.

[0138] As shown in Figure 8, a polishing apparatus 20 for heavy-duty silicon carbide wafer processing includes a housing unit 700, a horizontal moving unit 800, a vertical moving unit 900, and a pressure plate unit 1000. The housing unit 700 is configured to mount components; the horizontal moving unit 800 is mounted on the housing unit 700; the vertical moving unit 900 is mounted on the horizontal moving unit 800 and reciprocates horizontally under the control of the horizontal moving unit 800; and the pressure plate unit 1000 is mounted on the vertical moving unit 900 and reciprocates vertically under the control of the vertical moving unit 900, configured to apply pressure to a silicon carbide wafer placed on a polishing pad 1410.

[0139] It should be noted that the cabinet unit 700 is a related technology and will not be described in detail here.

[0140] As shown in Figure 9, the horizontal movement unit 800 includes a slide rail component 810, a slider component 820, a support component 830, and a first drive component 840. The slide rail component 810 is disposed on the housing unit 700; the slider component 820 is disposed on the slide rail component 810 and is slidably connected to the slide rail component 810; the support component 830 is disposed on the top of the slider component 820 and is configured to mount the vertical movement unit 900 and the pressure plate unit 1000; the first drive component 840 is disposed on the housing unit 700 and is connected to the support component 830, and is configured to drive the support component 830 to reciprocate on the slide rail component 810.

[0141] The slide rail element 810 is fixed to the top of the box unit 700 by welding, riveting or bolting, and the length direction of the slide rail element 810 is set along the length direction of the box unit 700.

[0142] In some embodiments, the rail component 810 includes but is not limited to a guide rail.

[0143] The number of the slide rail elements 810 is two, and the two slide rail elements 810 are spaced apart along the width direction of the box unit 700 .

[0144] In some embodiments, the number of the slide rail components 810 may be 1, 3, etc., that is, the number of the slide rail components 810 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0145] The slider element 820 is slidably connected to the rail element 810 , and the slider element 820 can reciprocate along the length direction of the rail element 810 .

[0146] In some of these embodiments, the slider element 820 includes, but is not limited to, a stainless steel block.

[0147] The number of slider elements 820 provided on each slide rail element 810 is 6, and the 6 slider elements 820 are arranged at intervals along the length direction of the slide rail element 810 .

[0148] In some embodiments, the number of slider elements 820 provided on each slide rail element 810 may also be 4, 8, etc., that is, the number of slider elements 820 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0149] The support element 830 is mounted on the slider element 820 by welding, riveting or bolting, and the support element 830 is configured to mount the vertical movement unit 900 and the pressure plate unit 1000 .

[0150] In some embodiments, the support member 830 includes, but is not limited to, a stainless steel plate.

[0151] The number of the supporting elements 830 is two, and the two supporting elements 830 are respectively connected to corresponding slider elements 820 .

[0152] In some embodiments, the number of support elements 830 may be 1, 3, etc., that is, the number of support elements 830 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0153] The first driving element 840 is installed on the top of the box unit 700 by welding, riveting or bolting, and the output end of the first driving element 840 is connected to the supporting element 830 to drive the supporting element 830.

[0154] In some embodiments, the first driving element 840 includes but is not limited to a driving motor.

[0155] As shown in Figure 10, the vertical movement unit 900 includes a telescopic connection element 910 and a second drive element 920. The telescopic connection element 910 is vertically mounted on the horizontal movement unit 800 and connected to the pressure plate unit 1000. The second drive element 920 is mounted on the horizontal movement unit 800 and connected to the telescopic connection element 910, configured to drive the telescopic connection element 910 to reciprocate and extend.

[0156] The telescopic connection element 910 is mounted on the support element 830 by welding, riveting, or bolting, and an end of the telescopic connection element 910 is connected to the pressure plate unit 1000 .

[0157] In some embodiments, the telescopic connection element 910 includes but is not limited to a telescopic rod.

[0158] The second driving element 920 is mounted on the telescopic connection element 910 by welding, riveting or bolting, and is configured to drive the telescopic connection element 910 to extend and retract.

[0159] In some embodiments, the second driving element 920 includes but is not limited to a driving motor.

[0160] As shown in Figure 11, the pressure plate unit 1000 includes a pressure plate element 1010 and a pressure applying element 1020. The pressure plate element 1010 is mounted at the end of the vertically movable unit 900 and reciprocates vertically under the action of the vertically movable unit 900, configured to install components. A plurality of pressure applying elements 1020 are mounted on the pressure plate element 1010 and spaced apart along the circumference of the pressure plate element 1010, configured to apply pressure to the silicon carbide wafer placed on the polishing pad 1410.

[0161] The pressure disc element 1010 is provided in a disc-shaped structure, and the center position of the pressure disc element 1010 is connected to the end of the telescopic connection element 910 by welding, riveting or bolting.

[0162] In some embodiments, the pressure plate element 1010 includes, but is not limited to, a ceramic carrier plate.

[0163] The pressure applying element 1020 is mounted on the pressure disc element 1010 by riveting or bolting, and a plurality of pressure applying elements 1020 are arranged around the pressure disc element 1010 in a circular ring structure.

[0164] In some embodiments, the pressure applying element 1020 includes, but is not limited to, a gas nozzle.

[0165] There are four circular ring structures composed of a plurality of pressure applying elements 1020 disposed on the pressure disc element 1010 , and the four circular ring structures are spaced apart along the radial direction of the pressure disc element 1010 .

[0166] In some embodiments, the number of circular structures formed by multiple pressure-applying elements 1020 on the pressure disc element 1010 can also be 3, 5, etc., that is, the number of pressure-applying elements 1020 can be set according to actual needs, and no excessive restrictions are imposed here.

[0167] The working process of the polishing equipment provided in this embodiment is as follows:

[0168] In actual operation, the first driving element 840 is activated, and the first driving element 840 drives the slider element 820 to reciprocate on the slide rail element 810, thereby causing the support element 830 to reciprocate on the slide rail element 810, thereby causing the pressure plate element 1010 to align with a preset position on the polishing plate 1400;

[0169] The second driving element 920 is started, and the second driving element 920 drives the telescopic connecting element 910 to operate, so that the pressure plate element 1010 abuts against the polishing plate 1400, thereby applying pressure to the silicon carbide wafer placed on the polishing plate 1400.

[0170] This embodiment sets a horizontal moving unit and a vertical moving unit, thereby enabling the pressure plate unit to move on the box unit. The position of the pressure plate unit relative to the polishing plate 1400 can be adjusted according to actual processing requirements, thereby improving convenience and functional diversity.

[0171] As shown in FIG. 12 , FIG. 15 and FIG. 16 , a polishing system for heavy silicon carbide wafer processing includes the cooling system 10 and the polishing device 20 described in the above embodiment.

[0172] The polishing system further includes a first cooling device 1100 and a second cooling device 1200. The first cooling device 1100 is connected to the cooling system 10 and is configured to cool the cooling system 10; the second cooling device 1200 is connected to the polishing device 20 and is configured to cool the polishing device 20.

[0173] In some embodiments, the first cooling device 1100 and the second cooling device 1200 include but are not limited to refrigerators.

Claims

1. A cooling system for heavy silicon carbide wafer processing, comprising: A main unit, wherein the main unit is configured to install components; A liquid storage unit, the liquid storage unit being provided on the main body unit and configured to store polishing liquid and cooling liquid; a first cooling unit, the first cooling unit being provided on the polishing plate of the polishing device and being in communication with the liquid storage unit, and being configured to cool the polishing plate; a second cooling unit, the second cooling unit being arranged in a pipeline connecting the liquid storage unit and the polishing device and being in communication with the liquid storage unit, and being configured to cool the polishing liquid; a third cooling unit, the third cooling unit being provided in the polishing device and being in communication with the air compressor, and being configured to cool the polishing pad mounted on the polishing plate; An electronic control unit is provided in the main unit and is connected to the first cooling unit, the second cooling unit and the third cooling unit respectively, and is configured to control the first cooling unit, the second cooling unit and the third cooling unit.

2. The cooling system according to claim 1, wherein: The liquid storage unit comprises: a first liquid storage element, the first liquid storage element being disposed in the main body unit, communicating with the second cooling unit, and configured to store the polishing liquid and supply the polishing liquid to the second cooling unit; The second liquid storage element is provided in the main body unit, is communicated with the first cooling unit and the second cooling unit respectively, and is configured to store the coolant and supply the coolant to the first cooling unit and the second cooling unit respectively.

3. The cooling system according to claim 2, wherein: The liquid storage unit further includes at least one of the following: a first pump element, the first pump element being in communication with the second cooling unit and configured to pump the polishing liquid; a second pump body element, the second pump body element is respectively connected to the first cooling unit and the second cooling unit, and is configured to pump the coolant; a first connecting pipeline element, the first end of the first connecting pipeline element is connected to the second pump body element; a first cooling coil element, the first cooling coil element is coiled and arranged at the side wall of the first liquid storage element, and the first end of the first cooling coil element is connected to the second end of the first connecting pipeline element; a heat exchange element, the heat exchange element is arranged in the main unit, and the heat exchange element is connected to the second end of the first cooling coil element; a second connecting pipeline element, the first end of the second connecting pipeline element is connected to the heat exchange element, and the second end of the second connecting pipeline element is connected to the second liquid storage element; a first valve element, the first valve element is arranged in the first connecting pipeline element and the second connecting pipeline element, and is configured to control the flow of the first connecting pipeline element and the second connecting pipeline element.

4. The cooling system according to claim 1, wherein: The first cooling unit comprises: a first cooling element, the first cooling element being disposed at the bottom of the polishing plate and connected to the polishing plate, and being configured to mount components; a first cooling line element, wherein a first end of the first cooling line element is in communication with the liquid storage unit and is configured to transport the coolant; a second cooling coil element, the second cooling coil element being disposed on the first cooling element and communicating with the second end of the first cooling pipe element, and being configured to cool the polishing disc; A second valve element is provided on the first cooling line element and is configured to control the flow of the first cooling line element.

5. The cooling system according to claim 1, wherein: The second cooling unit comprises: a second cooling element, the second cooling element being disposed in a pipeline connecting the liquid storage unit and the polishing device and being in communication with the liquid storage unit; a third cooling coil element, the third cooling coil element being coiled inside the second cooling element and being in communication with the liquid storage unit, and being configured to cool the polishing liquid; a second cooling pipeline element, the second cooling pipeline element being in communication with the third cooling coil element and the liquid storage unit respectively; A third valve element is provided on the second cooling line element and is configured to control the flow of the second cooling line element.

6. The cooling system according to claim 1, wherein: The third cooling unit comprises: at least one third cooling element, the at least one third cooling element being disposed in the polishing device and in communication with the air compressor and configured to store compressed air; a plurality of air nozzle elements, each of which is in communication with the third cooling element and configured to blow air toward the polishing pad; A plurality of third cooling pipeline elements are provided, wherein the plurality of third cooling pipeline elements respectively connect the corresponding air nozzle elements with the third cooling elements, and connect the third cooling elements with the air compressor, and are configured to transport gas.

7. A polishing device for heavy silicon carbide wafer processing, connected to the cooling system according to any one of claims 1 to 6, comprising: A box unit, wherein the box unit is configured to install components; A horizontal moving unit, wherein the horizontal moving unit is provided on the box unit; a vertical moving unit, the vertical moving unit being arranged on the horizontal moving unit and capable of reciprocating in a horizontal direction under the action of the horizontal moving unit; The pressure plate unit is arranged on the vertical moving unit and can move back and forth in the vertical direction under the action of the vertical moving unit, and is arranged to apply pressure to the silicon carbide wafer placed on the polishing pad.

8. The polishing apparatus according to claim 7, wherein: Meet at least one of the following: The horizontal moving unit includes: a slide rail element, the slide rail element is arranged on the box unit; a slider element, the slider element is arranged on the slide rail element and is slidably connected to the slide rail element; a support element, the support element is arranged on the top of the slider element and is configured to install the vertical moving unit and the pressure plate unit; a first driving element, the first driving element is arranged on the box unit and is connected to the supporting element, and is configured to drive the supporting element to reciprocate on the slide rail element; The vertical moving unit includes: a telescopic connecting element, which is vertically arranged on the horizontal moving unit and connected to the pressure plate unit; a second driving element, which is arranged on the horizontal moving unit and connected to the telescopic connecting element, and is configured to drive the telescopic connecting element to reciprocate and extend.

9. The polishing apparatus according to claim 7 or 8, wherein: The pressure plate unit comprises: a pressure plate element, the pressure plate element being disposed at an end of the vertically movable unit, capable of reciprocating in a vertical direction under the action of the vertically movable unit, and being configured to install components; A plurality of pressure applying elements are provided on the pressure plate element and spaced apart along the circumference of the pressure plate element, and are configured to apply pressure to the silicon carbide wafer placed on the polishing pad.

10. A polishing system for heavy silicon carbide wafer processing, comprising: A first cooling device, a second cooling device, a cooling system according to any one of claims 1 to 6, and a polishing device according to any one of claims 7 to 9.

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