Assembling consistency evaluation method and system, assembling method, device, and medium

Abstract

Provided are an assembling consistency evaluation method and system, an assembling method, a device, and a medium. The assembling consistency evaluation method comprises: connecting a first component and a second component as a whole, using an excitation signal to excite the whole, and acquiring a response signal generated by the whole responding to the excitation signal; then, on the basis of the excitation signal and the response signal, determining a target transfer function used for quantitatively representing physical characteristics of a mating surface; and finally, on the basis of the target transfer function, evaluating whether the physical characteristics of the mating surface meet an assembling consistency condition. The method is easy to implement, and can evaluate in the device assembling process the mating surface formed during current assembling, without the need to perform overall evaluation on a device; and the device assembling method applying the assembling consistency evaluation method can improve the device assembling efficiency.

Description

Assembly consistency evaluation method, assembly method, equipment, system and medium

[0001] The present invention claims priority to the Chinese patent application filed with the Patent Office of China on March 17, 2024, with application number 202410301838.8 and application name “Assembly consistency evaluation method, assembly method, device, system and medium”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of intelligent manufacturing technology, and in particular to an assembly consistency evaluation method, assembly method, equipment, system and medium. Background Art

[0003] In the prior art, the assembly evaluation method for equipment that requires assembly, such as machine tools, is to measure the frequency and mode of the equipment after all equipment is assembled, and then determine whether the equipment assembly meets the consistency conditions based on the frequency and mode of the equipment.

[0004] However, using this existing evaluation method, when the device is large, it is necessary to assemble multiple sensors and related measuring equipment to measure the frequency and mode of the entire device. The evaluation method is complex, requires high computing power, and is inconvenient to find the specific fault location or low installation accuracy location.

[0005] The above description is merely the technology known to the inventor of this application, and does not necessarily constitute the prior art of this application just because it appears in the background technology. Summary of the Invention

[0006] In order to solve the existing technical problems, the present application provides an assembly consistency evaluation method, an equipment assembly method, a computer device, an assembly consistency evaluation system and a computer-readable medium that can effectively improve the equipment assembly efficiency and has a simple evaluation method.

[0007] According to a first aspect of an embodiment of the present application, a method for evaluating assembly consistency is provided, comprising:

[0008] After the first component and the second component are connected as a whole, exciting the whole with an excitation signal, and obtaining a response signal generated by the whole in response to the excitation signal;

[0009] determining a target transfer function for quantitatively characterizing a physical property of a bonding interface between the first component and the second component based on the excitation signal and the response signal;

[0010] According to the target transfer function, it is evaluated whether the physical properties of the bonding surface meet the assembly consistency conditions.

[0011] According to a second aspect of an embodiment of the present application, a method for assembling a device is provided, comprising:

[0012] After the current component and the previous component are connected as a whole, evaluating whether the joint surface between the current component and the previous component meets the assembly consistency condition according to the assembly consistency evaluation method;

[0013] If the joint surface meets the assembly consistency condition, the assembly of the next component of the current component is performed.

[0014] According to the third aspect of an embodiment of the present application, a computer device is provided, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the processor implements the steps of the assembly consistency evaluation method or the steps of the assembly method of the device.

[0015] According to a fourth aspect of an embodiment of the present application, there is provided an assembly consistency evaluation system, comprising a stimulus response system and a processing system;

[0016] The stimulus response system is used to input a stimulus signal to the whole after the first component and the second component are connected to form a whole, collect a response signal generated by the whole in response to the stimulus signal, and send the stimulus signal and the response signal to the processing system;

[0017] The processing system is used to implement the steps of the assembly consistency evaluation method or the steps of the device assembly method, and display the evaluation result indicating whether the bonding surface meets the assembly consistency condition.

[0018] According to a fifth aspect of an embodiment of the present application, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer program instructions;

[0019] When the computer program instructions are executed by a processor, the steps of the assembly consistency evaluation method or the steps of the device assembly method are implemented.

[0020] As can be seen from the above, the assembly consistency evaluation method provided by the embodiment of the present application treats the bonding surface between the first component and the second component as equivalent to a virtual material. After the first component and the second component are connected as a whole, the whole is stimulated by an excitation signal, and the response signal generated by the whole in response to the excitation signal is obtained. Then, based on the excitation signal and the response signal, the target transfer function for quantitatively characterizing the physical properties of the bonding surface is determined. Finally, the target transfer function is used as an evaluation index to evaluate whether the physical properties of the bonding surface meet the assembly consistency conditions. Therefore, the implementation method of the assembly consistency evaluation method provided by the embodiment of the present application is simple, the required computing power is low, and the bonding surface formed by the current assembly is evaluated during the equipment assembly process. There is no need to wait until the equipment is fully assembled before performing the assembly consistency evaluation, which is conducive to improving the assembly efficiency of the equipment.

[0021] In the above embodiments, the equipment assembly method, computer equipment, assembly consistency evaluation system and computer-readable storage medium all belong to the same concept as the corresponding assembly consistency evaluation method embodiments, and thus have at least the same technical effects as the corresponding assembly consistency evaluation method embodiments, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the drawings. In the drawings:

[0023] FIG1 is a flow chart of an assembly consistency evaluation method according to some embodiments of the present application;

[0024] FIG2 is an equivalent schematic diagram of a first component assembled on a second component;

[0025] FIG3 is a flow chart illustrating a method for evaluating whether the physical properties of the bonding surface meet assembly consistency conditions according to a target transfer function in an assembly consistency evaluation method provided in some embodiments of the present application;

[0026] FIG4 is a flow chart of an assembly consistency evaluation method according to other embodiments of the present application;

[0027] FIG5 is a schematic diagram showing a comparison between a test physical property change curve of a bonding surface and a reference property change curve in an assembly consistency evaluation method provided according to some embodiments of the present application;

[0028] FIG6 is a schematic flow chart of a method for assembling a device according to some embodiments of the present application;

[0029] FIG7 is a schematic diagram of the structure of a computer device provided according to some embodiments of the present application;

[0030] FIG8 is a schematic structural diagram of an assembly consistency evaluation system provided according to some embodiments of the present application. DETAILED DESCRIPTION

[0031] The technical solution of this application is further elaborated in detail below with reference to the accompanying drawings and specific embodiments.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items. In the description of this application, unless otherwise stated, the meaning of "plurality" is two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0034] The applicant uses the following means to judge the assembly consistency of the machine tool: after the entire equipment is assembled, certain parameters of the entire machine are measured, and then based on these parameters, whether the equipment assembly consistency meets the requirements is evaluated.

[0035] The applicant discovered that this consistency evaluation method for a complete machine is complex and not only inconvenient for accurately locating the faulty part, but also requires disassembly of some or all components before reassembly upon detection of the faulty part, resulting in low assembly efficiency. Therefore, the applicant proposed a consistency evaluation method that facilitates the determination of assembly consistency for machine tools.

[0036] Before describing the consistency evaluation method of this application, the applicable equipment is described first.

[0037] Equipment can be assembled from multiple components. For example, a machine tool might include the following: a headstock, feed box, slide box, saddle, tailstock, and bed. Components are connected by joints. Similarly, each part is assembled from multiple parts, which are connected by joints.

[0038] The bonding surface is divided into static bonding surface, quasi-static bonding surface and dynamic bonding surface.

[0039] The static joint surface is the joint surface between the bolt and the first component (or the second component) after the components are assembled together by bolt connection.

[0040] The quasi-static bonding surface is the bonding surface produced after the tool holder is assembled, that is, the bonding surface between the outer cylindrical surface of the tool holder and the inner hole wall of the spindle.

[0041] Dynamic joint surfaces include bearings (the joint surface between rolling elements and raceways), screws (the joint surface between screws and nuts), and sliding guides (sliding surfaces that contact each other).

[0042] The microscopic contact of the bonding surface is invisible to the naked eye, but the actual microscopic contact phenomenon determines the contact rigidity and interface heat conduction characteristics. In some embodiments, the physical properties of the bonding surface include mechanical properties and thermal properties.

[0043] Based on this, the inventors of this application believe that if the quality of the interface between components can be controlled during the assembly process, the assembly efficiency of the equipment can be greatly improved compared to the assembly method that evaluates the assembly consistency after the assembly is completed. Therefore, this application provides an assembly consistency evaluation method for evaluating whether the assembly between two components meets the consistency conditions, so as to control the quality of the interface between components during the assembly process.

[0044] Please refer to Figure 1, which is a flow chart of an assembly consistency evaluation method provided according to some embodiments of the present application. The assembly consistency evaluation method provided in the present application includes S02, S04 and S06, and each step is described as follows.

[0045] S02: After the first component and the second component are connected as a whole, the whole is stimulated by an excitation signal, and a response signal generated by the whole in response to the excitation signal is obtained.

[0046] The first component and the second component can be different components of a device, or different parts of a component. An excitation signal is applied to the entirety of the first and second components by an excitation point, and a response signal is generated by a response point on the entirety in response to the excitation signal. The first and second components can be connected to form an entirety by assembling the first component onto the second component, or by assembling the second component onto the first component. An excitation signal is applied to the entirety by an excitation point on one of the first and second components, and a response point on the other of the first and second components generates a response signal in response to the excitation signal.

[0047] In some embodiments, a first component is assembled onto a second component, the excitation point is on the first component, and the response point is on the second component. The excitation signal is input to the entire component via the first component, and then transmitted to the second component via the interface between the first and second components. The response point on the second component responds to generate a response signal. For example, in some embodiments, the first and second components each have a first side and a second side that are opposite, the second side of the first component contacts the first side of the second component to form a bonding interface, the excitation point is located on the first side of the first component, and the response point is located on the second side of the second component.

[0048] As shown in Figure 2, which is an equivalent schematic diagram of the first component assembled on the second component, for ease of understanding, the interface between the first component (made of M1) and the second component (made of M2) can be equivalent to a virtual material M1_2.

[0049] An excitation signal X is input into the entire system by the first component and then transmitted to the second component via the interface made of material M1_2. The second component responds to the excitation signal X by generating and outputting a corresponding response signal Y. Obviously, the physical properties of the virtual material M1_2 at the interface affect the relationship between the response signal Y and the corresponding excitation signal X.

[0050] Therefore, the target transfer function G that characterizes the physical characteristics of the bonding surface can be determined based on the excitation signal X and the corresponding response signal Y. The excitation signal X and the response signal Y correspond to the excitation and response corresponding to the target transfer function G, respectively.

[0051] In some embodiments, the excitation signal X may include multiple different types of excitation signals. Multiple different types of excitation signals may be input into the entire component from different positions of the first component. Each corresponding position of the second component responds to the corresponding type of excitation signal and generates a corresponding type of response signal.

[0052] For example, the excitation signal X may include a force excitation signal X11 and a thermal excitation signal X12. The force excitation signal X11 is input to the entire component by a first excitation point on the first component, and a corresponding first response point on the second component generates and outputs a corresponding vibration response signal Y11 in response to the force excitation signal X11. The thermal excitation signal X12 is input to the entire component by a second excitation point on the first component, and a corresponding second response point on the second component generates and outputs a corresponding temperature response signal Y12 in response to the thermal excitation signal X12. The first component and the second component may be respectively selected from one of assembly parts such as a bolt, a tool handle, a bearing, a screw, and a guide rail. The component interface between the first component and the second component may be a static interface, a quasi-static interface, or a dynamic interface.

[0053] S04: Determine, based on the excitation signal and the response signal, a target transfer function for quantitatively characterizing physical properties of the interface between the first component and the second component.

[0054] The target transfer function (G) is the transfer function of the interface after the interface is equivalent to the virtual material M1_2. The target transfer function (G) corresponding to the interface is determined based on the excitation signal (X) and the response signal (Y). Specifically, the excitation signal (X) and the response signal (Y) represent the excitation and response of the target transfer function (G), respectively, to determine the target transfer function (G).

[0055] Specifically, determining a target transfer function G for quantitatively characterizing the physical properties of the interface between the first component and the second component includes: performing Laplace transforms on the corresponding excitation signal X and the response signal Y to obtain corresponding Laplace transform signals X' and Y', and determining the target transfer function G as G=Y' / X'.

[0056] S06: Based on the target transfer function, evaluate whether the physical properties of the bonding surface meet the assembly consistency conditions.

[0057] The target transfer function G is used to quantitatively characterize the physical properties of the mating surface. Using the target transfer function G as an evaluation metric, it is evaluated to determine whether the physical properties of the mating surface meet assembly consistency requirements. Assembly consistency requirements refer to the conditions that the physical properties of the mating surface must meet for the assembly between the first and second components to be acceptable. If the physical properties of the mating surface meet the consistency requirements, the assembly between the first and second components is acceptable; otherwise, the assembly between the first and second components is unacceptable.

[0058] The assembly consistency evaluation method provided in the embodiment of the present application treats the bonding surface between the first component and the second component as equivalent to a virtual material M1_2. After the first component and the second component are connected as a whole, the whole is stimulated with an excitation signal X, and a response signal Y generated by the whole in response to the excitation signal X is obtained. Then, based on the excitation signal and the response signal, a target transfer function G for quantitatively characterizing the physical properties of the bonding surface is determined. Finally, the target transfer function G is used as an evaluation index to evaluate whether the physical properties of the bonding surface meet the assembly consistency conditions. Therefore, the assembly consistency evaluation method provided in the embodiment of the present application is simple to implement, requires low computing power, and evaluates the bonding surface formed by the current assembly during the equipment assembly process. There is no need to wait until the equipment is fully assembled before performing the assembly consistency evaluation. After the assembly problem is discovered, it can be adjusted immediately, which is conducive to improving the assembly efficiency of the equipment.

[0059] In some embodiments, the excitation signal X may be solely a force excitation signal X11 or solely a thermal excitation signal X12. When the excitation signal X is the force excitation signal X11, the corresponding response signal Y11 is a vibration signal, and the corresponding target transfer function G is a mechanical property transfer function used to quantitatively characterize the mechanical properties of the bonding surface. Specifically, the force excitation signal X11 may be a signal generated by a hammer excitation. When the excitation signal X is the thermal excitation signal X12, the corresponding response signal Y12 is a temperature signal, and the corresponding target transfer function G is a thermal property transfer function used to quantitatively characterize the thermal properties of the bonding surface.

[0060] Force excitation signal X11 and thermal excitation signal X12 are used as excitation to obtain the mechanical and thermal properties of the bonding surface. By combining these properties, the microscopic bonding characteristics of the bonding surface can be better reflected, which helps to increase the accuracy of assembly consistency evaluation. In addition, using force excitation signal X11 and thermal excitation signal X12 to stimulate the entire system simplifies the collection of the corresponding response signals Y11 and Y12, which helps to reduce the cost of assembly consistency evaluation.

[0061] Please refer to Figure 3, which is a flow chart of evaluating whether the physical properties of the bonding surface meet the assembly consistency conditions based on the target transfer function in the assembly consistency evaluation method provided in some embodiments of the present application. Step S06 further includes S061 and S062.

[0062] S061: Compare the target transfer function with the corresponding threshold range.

[0063] The target transfer function G herein includes the mechanical property transfer function and / or the thermal property transfer function. Different types of target transfer functions G correspond to different threshold ranges.

[0064] For example, the mechanical property transfer function corresponds to a first threshold range, and the thermal property transfer function corresponds to a second threshold range. The first threshold range represents the value range of the mechanical property transfer function when the bonding surface meets the consistency condition, and the second threshold range represents the value range of the thermal property transfer function when the bonding surface meets the consistency condition.

[0065] Specifically, the threshold range corresponding to the target transfer function G can be obtained based on a probabilistic statistical method. For example, the target transfer function G corresponding to the bonding surface between the first component and the second component that meet the consistency condition in batch assembly is first obtained and stored, and probabilistic statistics are performed based on the stored target transfer function G to determine its normal fluctuation range, and the normal fluctuation range is used as the threshold range corresponding to the target transfer function G of the bonding surface that currently needs to be evaluated.

[0066] In one embodiment, the first component and the second component are two components in a machine tool. The threshold range corresponding to the target transfer function G can be obtained based on a machine tool of the same model that has been stably used for a predetermined period of time (for example, one or two years). That is, after disassembling the above-mentioned machine tool of the same model, the first component and the second component that are connected to each other are obtained, and their transfer function G1 is obtained. The value range of the transfer function G1 is used as the threshold range corresponding to the target transfer function G.

[0067] S062: If the target transfer function exceeds the threshold range, the physical properties of the evaluation interface do not meet the assembly consistency conditions.

[0068] In some embodiments, as long as it is determined that the target transfer function G exceeds the corresponding threshold range, it can be determined that the currently assembled joint surface does not meet the consistency condition.

[0069] In this case, the evaluation result may be further displayed, and the user may be prompted to inspect the assembly quality.

[0070] In one application scenario, the above information can be sent to the server for storage. The above information records the current assembly time, the worker's operation method (such as the bolt tightening torque, the degree of contact between the track and the sliding body), specific components (first component and second component), the image of the transfer function G of the specific component in the threshold diagram (such as within the coordinate system), the assembly personnel number, etc. The management personnel can log in to the cloud account to check whether the assembly is carried out in accordance with the assembly regulations (including assembly sequence, joint surface consistency requirements), so as to facilitate maintaining the consistency of machine tool assembly.

[0071] In another application scenario, the collected data can be associated with the scenario. For example, in a scenario where bolt connection is required, the first component and the second component are connected by bolts, and the pre-tightening force during tightening is measured by professional equipment. The pre-tightening force is then associated with the consistency evaluation result. The tightening force in this scenario is used as input, and the consistency evaluation result is used as a label. The neural network model is used to train the above-mentioned associated data, thereby measuring the real-time tightening force of the workers, and the trained neural network model is used to predict the consistency evaluation result.

[0072] In some embodiments, after step S061, the assembly consistency method further includes: if the target transfer function G is within the threshold range and the number of updates of the target transfer function G reaches a preset number of updates, then evaluating that the physical properties of the bonding surface do not meet the assembly consistency conditions; if the target transfer function G is within the threshold range and the number of updates of the target transfer function G does not reach the preset number of updates, then updating the excitation signal X to update the target transfer function G, and returning to execute the step of evaluating whether the physical properties of the bonding surface meet the assembly consistency conditions based on the target transfer function G.

[0073] The target transfer function G is updated at a predetermined frequency. Each time it is detected that the physical properties of the bonding surface do not meet the assembly consistency conditions and the current frequency of the target transfer function G updates has not reached the predetermined frequency, an update of the excitation signal X is automatically triggered to update the target transfer function G, thereby re-evaluating whether the physical properties of the bonding surface meet the assembly consistency conditions. If the target transfer function G is still within the corresponding threshold range after the predetermined frequency of updates, the bonding surface is evaluated to meet the assembly consistency conditions. The update of the excitation signal X may include updating its size, type, or location of action.

[0074] Therefore, in this embodiment, the evaluation method of performing multiple excitations on the entire system to determine whether the physical properties of the bonding surface meet the assembly consistency conditions based on the target transfer function G corresponding to the multiple excitations has higher evaluation accuracy.

[0075] In some embodiments, the excitation signal X includes both a force excitation signal X11 and a thermal excitation signal X12, the excitation signal X11 and the thermal excitation signal X12 are respectively input into the entire body by the first component, the response signal Y11 generated and output by the second component in response to the excitation signal X11 is a vibration signal, and the response signal Y12 generated and output by the second component in response to the thermal excitation signal X12 is a temperature signal, and the target transfer function G includes a mechanical transfer function determined based on the force excitation signal X11 and the response signal Y11, and a thermal transfer function determined based on the thermal excitation signal X12 and the response signal Y12. The above-mentioned S061 specifically includes: comparing the mechanical property transfer function and the thermal property transfer function with corresponding threshold ranges, respectively. The above-mentioned S062 specifically includes: if one of the mechanical property transfer function and the thermal property transfer function exceeds the corresponding threshold range, then evaluating that the physical properties of the bonding surface do not meet the assembly consistency conditions.

[0076] Please refer to Figure 4, which is a flow chart of an assembly consistency evaluation method according to some other embodiments of the present application. In some other embodiments, step S02 includes S021, step S04 includes S041, and step S06 includes S063, S064, S065, and S066. The description of each step is as follows.

[0077] S021: After the first component and the second component are connected as a whole, the first component is continuously stimulated multiple times with the stimulation signal X, and a response signal generated by the whole in response to each stimulation signal is obtained.

[0078] S041: After the first component and the second component are connected as a whole, the whole is continuously stimulated multiple times with an excitation signal, and a response signal generated by the whole in response to each excitation signal is obtained.

[0079] S063: Determine a test physical property change curve of the bonding surface according to a target transfer function corresponding to each time the excitation signal excites the entire surface.

[0080] S064: Compare the test physical property change curve with a reference physical property change curve that characterizes that the bonding surface meets the assembly consistency condition to determine whether the test physical property change curve and the reference physical property change curve meet a preset relationship.

[0081] S065: If satisfied, evaluate whether the physical properties of the bonding surface meet the assembly consistency conditions.

[0082] S066: If not, the physical properties of the joint surface are evaluated to determine whether they meet the assembly consistency conditions.

[0083] The transfer function G is obtained by repeatedly stimulating the first component with an excitation signal X according to a preset excitation strategy. After each excitation, a response signal Y generated by the second component in response to the previous excitation signal X is obtained. It is understood that the first component on the same machine tool can be used for multiple excitations, or the same first component on multiple machine tools of the same type (with the same excitation point) can be used for excitation.

[0084] In the case of stimulating the first component of the same machine tool, the excitation signal X continuously stimulates the first component multiple times at a preset time interval to obtain multiple target transfer functions G that change in the time domain or frequency domain. Based on the multiple target transfer functions G, a physical property change curve of the bonding surface can be fitted, which is called a test physical property change curve. The fitted test physical property change curve is then compared with the reference physical property change curve to determine whether the bonding surface meets the assembly consistency condition.

[0085] In the case of using the same type of first component on multiple machine tools of the same type for excitation, the excitation signal X excites the first component at the same position of the first components of the multiple machine tools of the same type, respectively, to obtain multiple target transfer functions corresponding to the multiple bonding surfaces of the first components of the multiple machine tools of the same type under the excitation of the excitation signal X. Further, based on each target transfer function, the frequency characteristics of each bonding surface in the multiple machine tools of the same type are obtained. Based on the different frequency characteristics, a physical property change curve of the bonding surface can be fitted.

[0086] In this embodiment, a coordinate system is drawn with the machine tool name as the abscissa and the frequency characteristics corresponding to each machine tool as the ordinate, and then a physical characteristic change curve of the joint surface is fitted within the coordinate system.

[0087] In one embodiment, a specific number of times may be selected, and the excitation signal and response signal of a single machine tool within the specific number of times may be averaged, and the average values ​​may be used as the excitation signal and response signal finally used by the machine tool.

[0088] Please refer to FIG5 , which is a schematic diagram showing a comparison between a test physical property change curve of a bonding surface obtained in an improved assembly consistency evaluation method according to an embodiment of the present application and a reference property change curve.

[0089] Among them, the reference physical property change curve includes curve Cref1 and curve Cref2. Curve Cref1 is a curve obtained by fitting the highest value of the target transfer function G corresponding to the external excitation at different times when the bonding surface meets the assembly consistency condition. Curve Cref2 is a curve obtained by fitting the lowest value of the target transfer function G corresponding to the external excitation at different times when the bonding surface meets the assembly consistency condition.

[0090] In this application, a straight line may also be referred to as a curve. When the test physical change curve Cdet exceeds the interval defined by the curve Cref1 and the curve Cref2, it is determined that the bonding surface does not meet the assembly consistency condition.

[0091] In this embodiment, the physical property change curve Cdet is first obtained, and then the test physical property change curve Cdet is compared with the reference physical property change curve. The assembly consistency evaluation result of the bonding surface determined based on the comparison result is more accurate.

[0092] In some embodiments, in order to facilitate users to understand the assembly consistency evaluation results of the bonding surface in real time and to understand the assembly dynamics in real time, the assembly consistency evaluation method provided in the present application also includes displaying the results of the comparison in S061 or S064 and / or displaying the evaluation results of whether the physical properties of the bonding surface meet the assembly consistency conditions.

[0093] Please refer to Figure 6, which is a flow chart of an assembly method of a device according to some embodiments of the present application. The assembly method of a device according to some embodiments of the present application includes S12 and S14, and each step is described as follows.

[0094] S12: After the current component and the previous component are connected as a whole, whether the bonding surface between the current component and the previous component meets the assembly consistency condition is evaluated according to the assembly consistency evaluation method provided in any embodiment of the present application.

[0095] S14: If the joint surface meets the assembly consistency condition, assembling the next component of the current component is performed.

[0096] The assembly method of the equipment provided by the embodiment of the present application can be used for machine tool equipment, and the machine tool equipment is assembled from a plurality of components. Different from the prior art, the assembly method provided by the embodiment of the present application is that during the assembly process of the equipment, after the current component being assembled is connected to the previous component that has been assembled before the current component into a whole, it is not directly assembling the next component to be assembled, but first evaluating whether the bonding surface between the current component (one of the first component and the second component) and the previous component (the other of the first component and the second component) meets the assembly consistency condition based on the assembly consistency evaluation method provided by any of the embodiments of the present application, and only assembling the next component after it is met. Therefore, the assembly method of the equipment provided by the present application can decouple the evaluation of the equipment assembly consistency and improve the efficiency of the equipment assembly.

[0097] Continuing with FIG6 , in some embodiments, after S12 , the device assembly method provided by the present application further includes S16 and S18 .

[0098] S16: If the joint surface does not meet the assembly consistency condition and the number of reassembly times of the current component does not reach the preset number of reassembly times, the current component is reassembled with the previous component and the process returns to S12.

[0099] S18: If the joint surface does not meet the assembly consistency condition and the number of reassembly times of the current component reaches the preset number of reassembly times, it is determined that the assembly of the current component is abnormal, and a corresponding abnormal prompt is given.

[0100] In this embodiment, by setting a preset number of reinstallations between the current component and the previous component, before the number of reinstallations between the current component and the previous component reaches the preset number of reinstallations, if the result of the current assembly consistency evaluation of the joint surface is not satisfied, the connection relationship (e.g., preload) between the previous component and the next component is automatically adjusted according to the preset adjustment strategy to reinstall the previous component on the previous component, and then the updated joint surface is re-evaluated again. Otherwise, it is determined that the assembly of the current component is abnormal, and further abnormal prompts are given, such as prompting the user to start the inspection of the quality of the current component. Therefore, the assembly method provided by this embodiment can further improve the assembly efficiency of the device and improve the overall stability of the device.

[0101] The assembly method of the equipment provided in the above embodiments, based on the means of evaluating the assembly consistency of the joint surface, can evaluate the assembly accuracy of the joint surfaces of various components of the equipment, such as screws, bearings, guide rails, etc. in real time, and evaluate the assembly consistency of the joint surface by digital means, thereby improving the consistency of the overall performance of the equipment. The next assembly operation will only be carried out after the evaluation result of the joint surface between the current component and the previous component meets the assembly consistency requirement. Therefore, the assembly method provided in some embodiments of the present application can standardize assembly skills, form standard assembly methods and assembly process control, and reduce dependence on the skills of assembly personnel.

[0102] As shown in FIG7 , in some embodiments, the present application further provides a computer device comprising a processor 100 and a memory 200. Specifically, when the processor 100 executes the computer program instructions stored in the memory 200, it executes the steps of the assembly consistency evaluation method or device assembly method provided in any embodiment of the present application. The computer device provided in accordance with the embodiments of the present application and the assembly consistency evaluation method or device assembly method provided in accordance with the embodiments of the present application can achieve the same technical effects, and will not be repeated here.

[0103] Please refer to Figure 8, which is a structural diagram of the assembly consistency evaluation system provided according to some embodiments of the present application. In some embodiments, the assembly consistency evaluation system provided by the present application includes an excitation response system 10 and a processing system 20. Among them, the excitation response system 10 is used to input an excitation signal X to the whole after the first component and the second component are connected as a whole, and collect the response signal Y and the second response signal generated by the whole response to the excitation signal, and send the excitation signal X and the response signal Y to the processing system 20. The processing system 20 is used to implement the steps of the assembly consistency evaluation method provided according to any embodiment of the present application, and display the evaluation results that characterize whether the bonding surface meets the assembly consistency conditions. The assembly consistency evaluation system provided according to the embodiment of the present application and the assembly consistency evaluation method embodiment belong to the same concept, and thus have at least the same technical effect as the corresponding assembly consistency evaluation method embodiment, and will not be repeated here.

[0104] Continuing to refer to FIG8 , in some embodiments, the excitation response system 10 includes a hammer excitation response system 101 and a thermal excitation response system 102. The hammer excitation response system 101 includes a hammer excitation and vibration pickup unit, which is used to input force excitation to the excitation point of the first component and collect the vibration signal generated by the first component under the force excitation as a force excitation signal X11. The hammer excitation response system 101 also includes a first response sensor, which is used to collect the vibration response signal Y11 generated by the second component in response to the force excitation signal X11. The thermal excitation response system 102 includes a thermal excitation and temperature collection unit, which is used to input thermal excitation to the excitation point of the first component and collect the temperature signal generated by the first component under the thermal excitation as an excitation signal X12. The thermal excitation response system 102 also includes a second response sensor, which is used to collect the temperature response signal Y12 generated by the corresponding response point of the second component in response to the thermal excitation signal X12. The hammer excitation response system 101 and the thermal excitation response system 102 send the excitation signals and response signals collected by each to the processing system 20, so that the processing system 20 can obtain the assembly consistency evaluation results of the bonding surface according to the received response signals and the assembly consistency evaluation method provided in any embodiment of the present application.

[0105] In some embodiments, the processing system 20 includes a terminal 201 and a cloud server 202. The terminal 201 is used to send an excitation signal X and a response signal Y to the cloud server 202. The cloud server is used to implement the steps of the assembly consistency evaluation method provided in any embodiment of the present application, and send the evaluation result characterizing whether the bonding surface meets the assembly consistency condition to the terminal 201, and the evaluation result is displayed by the terminal 201. In this embodiment, the collected signal is transmitted to the cloud server 202, and the cloud server 202 executes the steps of the assembly consistency evaluation method provided in the embodiment of the present application, which is conducive to speeding up data processing while saving the user's hardware costs.

[0106] In some embodiments, terminal 201 is a portable industrial computer, the hammer excitation response system 101 is a hammer and vibration pickup system, and the thermal excitation response system 102 is a thermal change measurement system. Both the hammer and vibration pickup system and the thermal change measurement system are communicatively connected to the portable industrial computer. The portable industrial computer is provided with an interface, and signal transmission is achieved by plugging the plugs of the hammer and vibration pickup system and the thermal change measurement system into the interface. The portable industrial computer is connected to a cloud server 202, thereby uploading data to the cloud server 202. Furthermore, the portable industrial computer has a display screen that can display the assembly consistency evaluation results of the detected joint surfaces in real-time in the form of charts.

[0107] This application also provides a computer-readable storage medium storing computer program instructions. When executed by a processor, the computer program instructions implement the steps of the assembly consistency evaluation method or device assembly method provided in accordance with any embodiment of this application. The computer-readable storage medium provided in accordance with the embodiments of this application can achieve the same technical effects as the assembly consistency evaluation method or device assembly method provided in accordance with the embodiments of this application, and will not be repeated here.

[0108] The processor may be a CPU (Central Processing Unit), an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present invention. The one or more processors included in the control device may be processors of the same type, such as one or more CPUs, or may be processors of different types, such as one or more CPUs and one or more ASICs or FPGAs.

[0109] The memory may include high-speed RAM (Random Access Memory), and may also include NVM (Non-Volatile Memory), such as at least one disk memory.

[0110] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for evaluating assembly consistency, characterized in that: include: After the first component and the second component are connected as a whole, exciting the whole with an excitation signal, and obtaining a response signal generated by the whole in response to the excitation signal; determining a target transfer function for quantitatively characterizing a physical property of a bonding interface between the first component and the second component based on the excitation signal and the response signal; According to the target transfer function, it is evaluated whether the physical properties of the bonding surface meet the assembly consistency conditions.

2. The assembly consistency evaluation method according to claim 1, characterized in that: The excitation signal includes a force excitation signal and / or a thermal excitation signal; When the excitation signal includes the force excitation signal, the corresponding response signal is a vibration signal, and the corresponding target transfer function is a mechanical property transfer function for quantitatively characterizing the mechanical properties of the bonding surface; When the excitation signal is the thermal excitation signal, the corresponding response signal is a temperature signal, and the corresponding target transfer function is a thermal characteristic transfer function for quantitatively characterizing the thermal characteristics of the bonding surface.

3. The assembly consistency evaluation method according to claim 1, characterized in that: The step of evaluating whether the physical properties of the bonding surface meet assembly consistency conditions according to the target transfer function includes: comparing the target transfer function with a corresponding threshold range; If the target transfer function exceeds the threshold range, it is evaluated that the physical characteristics of the bonding surface do not meet the assembly consistency condition.

4. The assembly consistency evaluation method according to claim 3, characterized in that: After comparing the target transfer function with the corresponding threshold range, the method further includes: If the target transfer function is within the threshold range and the update number of the target transfer function reaches a preset update number, then it is evaluated that the physical characteristics of the bonding surface do not meet the assembly consistency condition; If the target transfer function is within the threshold range and the number of updates of the target transfer function does not reach the preset number of updates, the excitation signal and / or the point of action of the excitation signal on the whole are updated to update the target transfer function, and the process returns to the step of evaluating whether the physical properties of the bonding surface meet the assembly consistency conditions based on the target transfer function.

5. The assembly consistency evaluation method according to claim 3, characterized in that: The excitation signal includes a force excitation signal and a thermal excitation signal, the target transfer function includes the mechanical property transfer function and the thermal property transfer function, and evaluating whether the physical properties of the bonding surface meet the assembly consistency condition based on the target transfer function includes: comparing the mechanical property transfer function and the thermal property transfer function with corresponding threshold ranges respectively; If one of the mechanical property transfer function and the thermal property transfer function exceeds the corresponding threshold range, it is evaluated that the physical property of the bonding surface does not meet the assembly consistency condition.

6. The assembly consistency evaluation method according to claim 1, characterized in that: The step of exciting the whole with an excitation signal and obtaining a response signal generated by the whole in response to the excitation signal includes: After the first component and the second component are connected as a whole, the whole is excited with the excitation signal for multiple times, and a response signal generated by the whole in response to each excitation signal is obtained; The step of evaluating whether the physical properties of the bonding surface meet assembly consistency conditions according to the target transfer function includes: determining a test physical property change curve of the bonding surface according to the target transfer function corresponding to each time the excitation signal excites the entire body; Comparing the test physical property change curve with a reference physical property change curve that indicates that the bonding surface meets an assembly consistency condition, to determine whether a preset relationship is satisfied between the test physical property change curve and the reference physical property change curve; If so, the physical properties of the bonding surface are evaluated to meet the assembly consistency conditions; If not, the physical properties of the bonding surface are evaluated as not meeting the assembly consistency conditions.

7. The assembly consistency evaluation method according to claim 3 or 6, characterized in that: Also includes: The comparison result and / or the evaluation result of whether the physical characteristics of the bonding surface meet the assembly consistency conditions are displayed.

8. A method for assembling a device, characterized in that: include: After the current component and the previous component are connected as a whole, evaluating whether the joint surface between the current component and the previous component meets the assembly consistency condition according to the assembly consistency evaluation method according to any one of claims 1 to 7; If the joint surface meets the assembly consistency condition, the assembly of the next component of the current component is performed.

9. The method for assembling the device according to claim 8, characterized in that: Also includes: If the bonding surface does not meet the assembly consistency condition and the number of reassembly times of the current component does not reach the preset number of reassembly times, the step of assembling the current component with the previous component is repeated, and returning to the step of evaluating whether the bonding surface between the current component and the previous component meets the assembly consistency condition according to the assembly consistency evaluation method according to any one of claims 1 to 7.

10. The method for assembling the device according to claim 8, characterized in that: Also includes: If the joint surface does not meet the assembly consistency condition and the number of reassembly times of the current component reaches the preset number of reassembly times, it is determined that the assembly of the current component is abnormal, and a corresponding abnormal prompt is given.

11. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, implements the steps of the assembly consistency evaluation method as described in any one of claims 1 to 7 or implements the steps of the device assembly method as described in any one of claims 8 to 10.

12. An assembly consistency evaluation system, characterized in that: Including stimulus response system and processing system; The stimulus response system is used to input a stimulus signal to the whole after the first component and the second component are connected to form a whole, collect a response signal generated by the whole in response to the stimulus signal, and send the stimulus signal and the response signal to the processing system; The processing system is used to implement the steps of the assembly consistency evaluation method as described in any one of claims 1 to 7 or the steps of the equipment assembly method as described in any one of claims 8 to 10, and display the evaluation results that characterize whether the bonding surface meets the assembly consistency conditions.

13. A computer-readable storage medium, characterized in that The computer readable storage medium stores computer program instructions; When the computer program instructions are executed by a processor, the steps of the assembly consistency evaluation method according to any one of claims 1 to 7 or the steps of the device assembly method according to any one of claims 8 to 10 are implemented.

Images