Electronic component

Abstract

This electronic component comprises an electrically insulating substrate, a coil supported on the substrate, a first terminal supported on the substrate, a second terminal supported on the substrate, and a molded body which contains a magnetic material and which holds the substrate, the coil, the first terminal, and the second terminal. Each of the first terminal and the second terminal is integrated with the coil. The entirety of the coil is embedded in the molded body. Part of the first terminal is exposed on the outside of the molded body. Part of the second terminal is exposed on the outside of the molded body.

Description

Electronic Components

[0001] The present disclosure relates to electronic components, and more particularly to electronic components including coils.

[0002] Patent document 1 discloses an inductor in which the coil includes first and second coils respectively arranged on opposite surfaces of a support including a base material of an insulating material or a magnetic material, the first and second coils respectively having first and second lead portions exposed to the outside of the main body, first and second external electrodes arranged on the main body, and the first and second external electrodes electrically connected to the first and second lead portions, respectively.

[0003] Japanese Patent Application Laid-Open No. 2022-162132

[0004] An electronic component according to one aspect of the present disclosure includes an electrically insulating substrate, a coil supported by the substrate, a first terminal supported by the substrate, a second terminal supported by the substrate, and a molded body containing a magnetic material and holding the substrate, the coil, the first terminal, and the second terminal. Each of the first terminal and the second terminal is integrated with the coil. The entire coil is embedded in the molded body. A portion of the first terminal is exposed to the outside of the molded body. A portion of the second terminal is exposed to the outside of the molded body.

[0005] According to the present disclosure, reduction in electrical conductivity and thermal conductivity between the coil and each of the first terminal and the second terminal can be suppressed.

[0006] FIG. 1 is a perspective view of an electronic component according to a first embodiment. FIG. 2 is a perspective view of the electronic component according to the first embodiment. FIG. 3 is a perspective view of a substrate in the electronic component according to the first embodiment. FIG. 4 is a perspective view of the substrate in the electronic component according to the first embodiment. FIG. 5 is a perspective view of a coil in the electronic component according to the first embodiment. FIG. 6 is a perspective view of the coil in the electronic component according to the first embodiment. FIG. 7 is a front view of the coil in the electronic component according to the first embodiment. FIG. 8 is a side view of the coil in the electronic component according to the first embodiment. FIG. 9 is a perspective view of a combination of the substrate and coil in the electronic component according to the first embodiment. FIG. 10 is a perspective view of the electronic component according to the first embodiment with the molded body removed. FIG. 11 is a cutaway perspective view of the electronic component according to the first embodiment. FIG. 12 is a cutaway perspective view of the electronic component according to the first embodiment. FIG. 13 is a front view of the electronic component according to the first embodiment mounted on two substrates. FIG. 14 is a perspective view of an electronic component according to a second embodiment. FIG. 15 is a perspective view of an electronic component according to a third embodiment. Fig. 16 is a perspective view of a coil in an electronic component according to a third embodiment. Fig. 17 is a perspective view of a coil in an electronic component according to a third embodiment. Fig. 18 is a front view of a coil in an electronic component according to a third embodiment. Fig. 19 is a side view of a coil in an electronic component according to a third embodiment. Fig. 20 is a perspective view of a combination of a substrate and a coil in an electronic component according to a third embodiment. Fig. 21 is a perspective view of an electronic component according to a third embodiment with a molded body removed. Fig. 22 is a cutaway perspective view of an electronic component according to a third embodiment. Fig. 23 is a cutaway perspective view of an electronic component according to a third embodiment. Fig. 24 is a perspective view of an electronic component according to a fourth embodiment.

[0007] 1. Overview Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the present disclosure is not limited to the following embodiments. The following embodiments are merely some of the various embodiments of the present disclosure, and various modifications are possible depending on the design as long as the object of the present disclosure can be achieved. All of the drawings referred to below are schematic diagrams, and the dimensional ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0008] The electronic component 1 according to the embodiment includes an electrically insulating substrate 4, a coil 2 supported by the substrate 4, a first terminal 31 supported by the substrate 4, a second terminal 32 supported by the substrate 4, and a molded body 5 containing a magnetic material and holding the substrate 4, the coil 2, the first terminal 31, and the second terminal 32. The first terminal 31 and the second terminal 32 are each integrated with the coil 2. The entire coil 2 is embedded in the molded body 5. A portion of the first terminal 31 is exposed to the outside of the molded body 5. A portion of the second terminal 32 is exposed to the outside of the molded body 5.

[0009] In addition, when we say that each of the first terminal 31 and the second terminal 32 is integrated with the coil 2, we mean that there are no seams, interfaces, discontinuous composition changes, etc. between each of the first terminal 31 and the second terminal 32 and the coil 2, and the combination of the first terminal 31 and the second member with the coil 2 is recognized as a single member.

[0010] According to the embodiment, it is possible to suppress a decrease in electrical conductivity and a decrease in thermal conductivity between the coil 2 and each of the first terminal 31 and the second terminal 32. Therefore, it is possible to suppress a deterioration in performance of the electronic component 1 due to a decrease in electrical conductivity inside the electronic component 1, and to improve the heat dissipation properties of the electronic component 1.

[0011] 2. Embodiments More specific embodiments of the present disclosure will be described below.

[0012] 2.1 First Embodiment An electronic component 1 according to a first embodiment is shown in FIGS.

[0013] The electronic component 1 of the first embodiment is an inductor. The electronic component 1 is also a chip component. That is, the electronic component 1 of the first embodiment is a chip inductor (see FIGS. 1 and 2).

[0014] The electronic component 1 includes a substrate 4, a coil 2, and a molded body 5. The electronic component 1 further includes an insulating film 6.

[0015] The substrate 4 has electrical insulation properties. The substrate 4 is, for example, an inorganic board or a resin substrate. Examples of the resin substrate include a polyimide film or a glass-based epoxy resin substrate.

[0016] As shown in Figures 3 and 4, when the substrate 4 is viewed in the thickness direction, the substrate 4 has a shape that is elongated in one direction. Hereinafter, the direction along the thickness direction of the substrate 4 is defined as the Z direction, the direction along the longitudinal direction of the substrate 4 that is perpendicular to the Z direction is defined as the X direction, and the direction perpendicular to both the Z direction and the X direction is defined as the Y direction. Note that the longitudinal direction of the substrate 4 is also the longitudinal direction of the electronic component 1. The substrate 4 has a first main surface 401 and a second main surface 402 opposite the first main surface 401. The first main surface 401 and the second main surface 402 are perpendicular to the Z direction. In other words, the thickness of the substrate 4 is the dimension between the first main surface 401 and the second main surface 402.

[0017] The substrate 4 has a coil support portion 41, a first terminal support portion 43, and a second terminal support portion 44. The coil support portion 41 has a main portion 411, a first connecting portion 412, and a second connecting portion 413. When viewed in the Z direction, the main portion 411 has a ring shape that is long in the X direction. That is, the substrate 4 is surrounded by the main portion 411 and has an opening 47 that penetrates from the first main surface 401 to the second main surface 402. The outer periphery of the main portion 411 is linear on both sides in the Y direction and arc-shaped on both sides in the X direction. The first connecting portion 412 and the second connecting portion 413 each protrude in the X direction from both ends in the X direction on one side in the Y direction. The first terminal support portion 43 and the second terminal support portion 44 are located at both ends of the substrate 4 in the X direction. The first terminal support portion 43 and the second terminal support portion 44 are each long in the Y direction. The first terminal support portion 43 is connected to the main portion 411 and the first connecting portion 412 of the coil support portion 41. The second terminal support portion 44 is connected to the main portion 411 and the second connecting portion 413 of the coil support portion 41.

[0018] The main portion 411 of the coil support portion 41 has one coil connection hole 42 that penetrates from the first main surface 401 to the second main surface 402. The first terminal support portion 43 has three first terminal connection holes 45 that penetrate from the first main surface 401 to the second main surface 402. The three first terminal connection holes 45 are aligned in the Y direction. The second terminal support portion 44 has three second terminal connection holes 46 that penetrate from the first main surface 401 to the second main surface 402. The three second terminal connection holes 46 are aligned in the Y direction.

[0019] As described above, the coil 2, the first terminal 31, and the second terminal 32 are supported on the substrate 4, and each of the first terminal 31 and the second terminal 32 is integrated with the coil 2. Figures 5 to 8 show the coil 2, the first terminal 31, and the second terminal 32, and Figure 9 shows how the coil 2, the first terminal 31, and the second terminal 32 are supported on the substrate 4.

[0020] The coil 2, the first terminal 31, and the second terminal 32 are each made of an electrical conductor such as a metal. For example, the coil 2, the first terminal 31, and the second terminal 32 are each made of copper, but are not limited to this.

[0021] The coil 2 has a first coil portion 21 overlapping the first main surface 401 of the substrate 4, a second coil portion 22 overlapping the second main surface 402 of the substrate 4, and a coil connection portion 23 that electrically connects the first coil portion 21 and the second coil portion 22. The coil connection portion 23 is disposed in the coil connection hole 42 (see FIG. 11 ).

[0022] The first coil portion 21 has a first end portion 211 and a second end portion 212, and is long from the first end portion 211 to the second end portion 212. The first end portion 211 of the first coil portion 21 is arranged in the main portion 411 so as to cover the opening 47 on the first main surface 401 side of the coil connection hole 42. The first coil portion 21 has a shape in the main portion 411 such that it is wound outward from the first end portion 211 as a starting point and surrounds the opening 47. The second end portion 212 is drawn out to above the first connecting portion 412.

[0023] The second coil portion 22 has a first end 221 and a second end 222, and is long from the first end 221 to the second end 222. The first end 221 of the second coil portion 22 is arranged in the main portion 411 so as to cover the opening 47 on the second main surface 402 side of the coil connection hole 42. The second coil portion 22 has a shape in the main portion 411 such that it is wound outward from the first end 221 as a starting point and surrounds the opening 47. The second end 222 is drawn out onto the second connecting portion 413.

[0024] The winding direction from the first end 211 to the second end 212 of the first coil portion 21 when the coil 2 is viewed along the Z direction from the first coil portion 21 side is the same as the winding direction from the first end 221 to the second end 222 of the second coil portion 22 when the coil 2 is viewed along the Z direction from the second coil portion 22 side.

[0025] The coil connection portion 23 is located between the first end 211 of the first coil portion 21 and the first end 221 of the second coil portion 22, and is connected to each of the first end 211 of the first coil portion 21 and the first end 221 of the second coil portion 22. This allows the coil connection portion 23 to electrically connect the first coil portion 21 and the second coil portion 22. The coil connection portion 23 is disposed in the coil connection hole 42 in the main portion 411.

[0026] The first terminal 31 has a first terminal portion 311 overlapping the first main surface 401 of the substrate 4, a second sub-terminal portion 322 overlapping the second main surface 402 of the substrate 4, and a first terminal connection portion 313 electrically connecting the first terminal portion 311 and the first sub-terminal portion 312.

[0027] The first terminal portion 311 is elongated in the Y direction. The first terminal portion 311 is disposed on the first main surface 401 of the first terminal support portion 43. The first terminal portion 311 is disposed so as to cover the opening 47 of the first terminal connection hole 45 on the first main surface 401 side. The first sub-terminal portion 312 is elongated in the Y direction. The first sub-terminal portion 312 is disposed on the second main surface 402 of the first terminal support portion 43. The first sub-terminal portion 312 is disposed so as to cover the opening 47 of the first terminal connection hole 45 on the second main surface 402 side. It can also be said that the first terminal support portion 43 is sandwiched between the first terminal portion 311 and the first sub-terminal portion 312.

[0028] The first terminal 31 has three first terminal connection portions 313. The first terminal connection portions 313 are located between the first terminal portion 311 and the first sub-terminal portion 312 and are connected to each of the first terminal portion 311 and the first sub-terminal portion 312. As a result, the first terminal connection portions 313 electrically connect the first terminal portion 311 and the first sub-terminal portion 312. Each of the first terminal connection portions 313 is disposed in a corresponding first terminal connection hole 45.

[0029] The second end 212 of the first coil portion 21 is connected to the first terminal portion 311. There are no seams, interfaces, discontinuous composition changes, or the like between the first terminal portion 311 and the second end portion 212. Therefore, the coil 2 portion and the first terminal 31 are integrated. The Y-direction dimension of the first terminal portion 311 is larger than the Y-direction dimension of the entire first coil portion 21, and both Y-direction ends of the first terminal portion 311 protrude outward from both Y-direction ends of the entire first coil portion 21. The second end portion 212 is connected to one of the Y-direction ends of the first terminal portion 311, at a position slightly inside the edge of that end. In other words, the first terminal portion 311 protrudes outward in the Y-direction from the second end portion 212.

[0030] The second terminal 32 has a second terminal portion 321 that overlaps the second main surface 402 of the substrate 4, a second sub-terminal portion 322 that overlaps the first main surface 401 of the substrate 4, and a second terminal connection portion 323 that electrically connects the second terminal portion 321 and the second sub-terminal portion 322.

[0031] The second terminal portion 321 is long in the Y direction. The second terminal portion 321 is arranged on the second main surface 402 of the second terminal support portion 44. The second terminal portion 321 is arranged so as to cover the opening 47 of the second terminal connection hole 46 on the second main surface 402 side. The second sub-terminal portion 322 is long in the Y direction. The second sub-terminal portion 322 is arranged on the first main surface 401 of the second terminal support portion 44. The second sub-terminal portion 322 is arranged so as to cover the opening 47 of the second terminal connection hole 46 on the first main surface 401 side. It can also be said that the second terminal support portion 44 is sandwiched between the second terminal portion 321 and the second sub-terminal portion 322.

[0032] The second terminal 32 has three second terminal connection portions 323. The second terminal connection portions 323 are located between the second terminal portion 321 and the second sub-terminal portion 322 and are connected to the second terminal portion 321 and the second sub-terminal portion 322, respectively. As a result, the second terminal connection portions 323 electrically connect the second terminal portion 321 and the second sub-terminal portion 322. Each of the second terminal connection portions 323 is disposed in a corresponding second terminal connection hole 46 (see FIG. 12 ).

[0033] The second terminal portion 321 is connected to the second end portion 222 of the second coil portion 22. There are no seams, interfaces, discontinuous composition changes, etc. between the second terminal portion 321 and the second end portion 222. Therefore, the coil portion 2 and the second terminal 32 are integrated.

[0034] The second end 222 of the second coil portion 22 is connected to the second terminal portion 321. There are no seams, interfaces, discontinuous composition changes, or the like between the second terminal portion 321 and the second end portion 222. Therefore, the coil 2 portion and the second terminal 32 are integrated. The Y-direction dimension of the second terminal portion 321 is larger than the Y-direction dimension of the entire second coil portion 22, and both Y-direction ends of the second terminal portion 321 protrude outward from both Y-direction ends of the entire second coil portion 22. The second end portion 222 is connected to one of the Y-direction ends of the second terminal portion 321 at a position slightly inside the edge of this end portion. In other words, the second terminal portion 321 protrudes outward in the Y-direction from the second end portion 222.

[0035] In the first embodiment, since the substrate 4 and the coil 2 have the above-described configurations, the coil 2 can be arranged compactly and at high density on the substrate 4. Furthermore, the first terminal 31 and the second terminal 32 are arranged at both end portions of the substrate 4. Furthermore, the first terminal portion 311 and the first sub-terminal portion 312 of the first terminal 31 are arranged on the first main surface 401 and the second main surface 402 of the substrate 4, respectively, and the second sub-terminal portion 322 and the second terminal portion 321 of the second terminal 32 are arranged on the first main surface 401 and the second main surface 402 of the substrate 4, respectively.

[0036] In this embodiment, the thickness dimension of the first coil portion 21 along the thickness direction (Z direction) of the substrate 4 is smaller than the thickness dimension of the first terminal portion 311 of the first terminal 31 along the thickness direction of the substrate 4. Also, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction of the substrate 4. Also, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than the thickness dimension of the second terminal portion 321 of the second terminal 32 along the thickness direction of the substrate 4. Also, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than the thickness dimension of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction of the substrate 4.

[0037] In this embodiment, the first coil portion 21 and the first terminal portion 311 are each made of conductor wiring, and the second sub-terminal portion 322 is also made of conductor wiring. That is, the first coil portion 21, the first terminal portion 311, and the second sub-terminal portion 322 are made of conductor wiring on the first main surface 401 of the substrate 4. Also, the second coil portion 22 and the second terminal portion 321 are each made of conductor wiring, and the first sub-terminal portion 312 is also made of conductor wiring. That is, the second coil portion 22, the second terminal portion 321, and the first sub-terminal portion 312 are made of conductor wiring on the second main surface 402 of the substrate 4.

[0038] Furthermore, the width of the conductor wiring constituting the first coil portion 21 is smaller than the width of the conductor wiring constituting the first terminal portion 311 and is smaller than the width of the conductor wiring constituting the second sub-terminal portion 322. Therefore, it is easily possible to achieve a thickness of the first coil portion 21 in the thickness direction of the substrate 4 that is smaller than both the thickness of the first terminal portion 311 of the first terminal 31 in the thickness direction of the substrate 4 and the thickness of the second sub-terminal portion 322 of the second terminal 32 in the thickness direction of the substrate 4. Furthermore, the width of the conductor wiring constituting the second coil portion 22 is smaller than the width of the conductor wiring constituting the second terminal portion 321 and is smaller than the width of the conductor wiring constituting the first sub-terminal portion 312. Therefore, it is easily possible to achieve a thickness of the second coil portion 22 in the thickness direction of the substrate 4 that is smaller than both the thickness of the second terminal portion 321 of the second terminal 32 in the thickness direction of the substrate 4 and the thickness of the first sub-terminal portion 312 of the first terminal 31 in the thickness direction of the substrate 4. This point will be explained again later.

[0039] In this embodiment, as an example, a configuration has been described in which there is one coil connection portion 23 and one coil connection hole 42, and three first terminal connection portions 313, three second terminal connections 323, three first terminal connection holes 45, and three second terminal connection holes 46, as shown in Figures 4 to 8. However, the number of these is not limited to the number shown, and any number may be used as long as it is sufficient to achieve the purpose of fixing the coil 2, the first terminal 31, the second terminal 32, and the substrate 4.

[0040] The compact 5 contains a magnetic material. The compact 5 is produced, for example, by compressing magnetic powder. Specifically, the compact 5 is produced by compressing a magnetic composite material containing, for example, magnetic powder, an insulating resin, and appropriate additives used as needed, to form a compact, and then heating the compact as needed.

[0041] The magnetic powder is, for example, an iron-based soft magnetic alloy powder. The iron-based soft magnetic alloy powder is a powder containing at least one selected from the group consisting of, for example, soft magnetic iron-silicon (Fe—Si) alloys, soft magnetic iron-aluminum (Fe—Al) alloys, soft magnetic iron-aluminum-silicon (Fe—Al—Si) alloys, soft magnetic iron-silicon-chromium (Fe—Si—Cr) alloys, soft magnetic iron-chromium (Fe—Cr) alloys, soft magnetic iron-nickel (Fe—Ni) alloys, soft magnetic iron-silicon-boron (Fe—Si—B) alloys, soft magnetic iron-nitrogen (Fe—N) alloys, soft magnetic iron-carbon (Fe—C) alloys, soft magnetic iron-boron (Fe—B) alloys, soft magnetic iron-phosphorus (Fe—P) alloys, permendur (Fe—Co), soft magnetic iron-cobalt-vanadium (Fe—Co—V) alloys, Fe-based amorphous alloys, and Fe-based nanocrystalline alloys. The insulating resin contains at least one selected from the group consisting of, for example, epoxy resin, phenol resin, phenoxy resin, silicone, polyimide, and the like.

[0042] The molded body 5 holds the substrate 4, the coil 2, the first terminal 31, and the second terminal 32. The molded body 5 is a rectangular parallelepiped that is long in the longitudinal direction (X direction) of the substrate 4. Hereinafter, of the surfaces on both sides in the X direction of the molded body 5 and the electronic component 1, the surface on the first terminal 31 side will be referred to as a first end face 13, and the surface on the second terminal 32 side will be referred to as a second end face 14. Furthermore, of the surfaces on both sides in the Z direction of the molded body 5 and the electronic component 1, the surface on the first coil portion 21 side relative to the second coil portion 22 will be referred to as a first chip face 11, and the surface on the second coil portion 22 side relative to the first coil portion 21 will be referred to as a second chip face 12.

[0043] The coil 2 is held by the molded body 5 by being entirely embedded in the molded body 5 .

[0044] Each of the first terminal 31 and the second terminal 32 is partially embedded in the molded body 5. That is, a portion of the surface of each of the first terminal 31 and the second terminal 32 is exposed to the outside of the molded body 5.

[0045] The first terminal 31 and the second terminal 32 are respectively arranged at both ends of the molded body 5 and the electronic component 1 in one direction perpendicular to the thickness direction of the substrate 4. In particular, in the first embodiment, the first terminal 31 and the second terminal 32 are respectively arranged at both ends of the molded body 5 and the electronic component 1 in the longitudinal direction (X direction). Therefore, when the molded body 5 is mounted on a substrate, a short circuit between the first terminal 31 and the second terminal 32 is unlikely to occur.

[0046] At the first end surface 13 of the electronic component 1 and the molded body 5, the surface of the first terminal 31 opposite to the second terminal 32 side is exposed. That is, at this first end surface 13, the surface of the first terminal portion 311 opposite to the second terminal 32 side and the surface of the first sub-terminal portion 312 opposite to the second terminal 32 side are exposed. At this first end surface 13, the substrate 4 is interposed between the first terminal portion 311 and the first sub-terminal portion 312, and at this first end surface 13, the surface of the first terminal portion 311, the surface of the substrate 4, and the surface of the first sub-terminal portion 312 are all flush with each other. Furthermore, at the second end surface 14 of the electronic component 1 and the molded body 5, the surface of the second terminal 32 opposite to the first terminal 31 side is exposed. That is, the surface of the second terminal portion 321 opposite to the first terminal 31 and the surface of the second sub-terminal portion 322 opposite to the first terminal 31 are exposed at the second end surface 14. The substrate 4 is interposed between the second terminal portion 321 and the second sub-terminal portion 322 at this second end surface 14, and the surface of the second terminal portion 321, the surface of the substrate 4, and the surface of the second sub-terminal portion 322 exposed at this second end surface 14 are aligned flat.

[0047] On the first chip surface 11 of the molded body 5, a surface of the first terminal portion 311 of the first terminal 31 opposite the substrate 4 side and a surface of the second sub-terminal portion 322 of the second terminal 32 opposite the substrate 4 side are exposed. The surface of the molded body 5, the surface of the first terminal portion 311, and the surface of the second sub-terminal portion 322 on this first chip surface 11 are flush with each other. In the present embodiment, as described above, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than both the thickness dimension of the first terminal portion 311 along the thickness direction of the substrate 4 and the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction of the substrate 4. Therefore, while the first terminal portion 311 and the second sub-terminal portion 322 are exposed on the first chip surface 11, the entire first coil portion 21 can be embedded in the molded body 5.

[0048] Furthermore, on the second chip surface 12 of the molded body 5, the surface of the second terminal portion 321 of the second terminal 32 opposite the substrate 4 side and the surface of the first sub-terminal portion 312 of the first terminal 31 opposite the substrate 4 side are exposed. The surface of the molded body 5, the surface of the second terminal portion 321, and the surface of the first sub-terminal portion 312 on this second chip surface 12 are aligned flat. In the present embodiment, as described above, the thickness dimension of the second coil portion 22 in the thickness direction of the substrate 4 is smaller than both the thickness dimension of the second terminal portion 321 in the thickness direction of the substrate 4 and the thickness dimension of the first sub-terminal portion 312 of the first terminal 31 in the thickness direction of the substrate 4. Therefore, the second coil portion 22 can be entirely embedded in the molded body 5 while the second terminal portion 321 and the first sub-terminal portion 312 are exposed at the end surfaces.

[0049] Furthermore, in this embodiment, the first terminal portion 311 and the first sub-terminal portion 312 of the first terminal 31, and the second terminal portion 321 and the second sub-terminal portion 322 of the second terminal 32 are exposed at each end surface 15 at both ends of the molded body 5 in the Y direction (end surfaces 15 at both ends of the capacitor in the Y direction). The substrate 4 is also exposed at each end surface 15. At each end surface 15, the surface of the molded body 5, the surface of the first terminal portion 311, the surface of the first sub-terminal portion 312, the surface of the second terminal portion 321, the surface of the second sub-terminal portion 322, and the surface of the substrate 4 are all flush with each other. As described above, in the first embodiment, the dimension of the first terminal portion 311 in the Y direction is larger than the dimension of the entire first coil portion 21 in the Y direction, and both ends of the first terminal portion 311 in the Y direction protrude outward beyond both ends of the entire first coil portion 21 in the Y direction. Furthermore, the dimension in the Y direction of the second terminal portion 321 is larger than the dimension in the Y direction of the entire second coil portion 22, and both ends of the second terminal portion 321 in the Y direction protrude outward beyond both ends in the Y direction of the entire second coil portion 22. Therefore, the entire coil 2 can be embedded in the molded body 5 while the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, and the second sub-terminal portion 322 are exposed at each of the end faces 15 on both sides in the Y direction.

[0050] Each of the first terminal 31 and the second terminal 32 is exposed to the outside of the electronic component 1. In other words, the electronic component 1 does not have a conductor covering each of the first terminal 31 and the second terminal 32.

[0051] The insulating film 6 is interposed between the coil 2, the first terminal 31, and the second terminal 32 and the molded body 5 (see FIGS. 10 and 11). That is, the surfaces of the coil 2, the first terminal 311, and the second terminal 321 that face the molded body 5 are covered with the insulating film 6. This can prevent short circuits of current within the electronic component 1. The insulating film 6 is made of a resist material containing, for example, an epoxy resin, a phenolic resin, or the like.

[0052] An example of a method for manufacturing the electronic component 1 will now be described.

[0053] An original substrate is prepared as the material for the substrate 4. The original substrate has dimensions such that a plurality of substrates 4 can be obtained from this original substrate.

[0054] The coil connection holes 42, the first terminal connection holes 45 and the second terminal connection holes 46 corresponding to the plurality of base materials 4 are formed in the original substrate by laser processing, drilling or the like.

[0055] Next, the coils 2, first terminals 31, and second terminals 32 corresponding to each of the multiple substrates are fabricated on the original substrate. The coils 2, first terminals 31, and second terminals 32 are fabricated, for example, by electrolytic plating. That is, for example, an electroless plating film is first fabricated on the surface of the original substrate. A plating resist having a plating pattern that covers the electroless plating film is fabricated using photolithography or another method. After conductor wiring is fabricated on the original substrate using electrolytic plating, the plating resist is peeled off. The electroless plating film is then removed by flash etching or another method. Additionally, vias are fabricated in the coil connection holes 42, the first terminal connection holes 45, and the second terminal connection holes 46 by buried plating or another method. This results in the first coil portion 21, the second coil portion 22, the first terminal portion 311, the first sub-terminal portion 312, and the second terminal portion 321, each composed of conductor wiring, and the coil connection portion 23, the first terminal connection hole 45, and the second terminal connection portion 323, each composed of vias.

[0056] In this embodiment, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than both the thickness dimension of the first terminal portion 311 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4 and the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4. When conductor wiring is produced by electrolytic plating, the larger the width or area of ​​the conductor wiring, the more accelerated the growth of the conductor wiring by the electrolytic plating. Therefore, if the width dimension of the conductor wiring constituting the first coil portion 21 is smaller than the width dimension of the conductor wiring constituting the first terminal portion 311 and the width dimension of the conductor wiring constituting the second sub-terminal portion 322, the above-mentioned relationship between the thickness dimensions can be easily achieved by the electrolytic plating. Similarly, in the present embodiment, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than both the thickness dimension of the second terminal portion 321 of the second terminal 32 along the thickness direction of the substrate 4 (Z direction) and the thickness dimension of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction of the substrate 4 (Z direction). When the width dimension of the conductor wiring that constitutes the second coil portion 22 is smaller than the width dimension of the conductor wiring that constitutes the second terminal portion 321 and is also smaller than the width dimension of the conductor wiring that constitutes the first sub-terminal portion 312, the relationship between the thickness dimensions can be easily realized by electrolytic plating.

[0057] Alternatively, the first coil portion 21, the first terminal portion 311, and the second sub-terminal portion 322 may be grown by electrolytic plating first, and then only the first terminal portion 311 and the second sub-terminal portion 322 may be further grown by electrolytic plating. That is, by this method, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 may be smaller than both the thickness dimension of the first terminal portion 311 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4 and the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4. Similarly, the second coil portion 22, the second terminal portion 321, and the first sub-terminal portion 312 may be grown by electrolytic plating first, and then only the second terminal portion 321 and the first sub-terminal portion 312 may be further grown by electrolytic plating. In other words, by using this method, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 may be smaller than either the thickness dimension of the second terminal portion 321 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4 or the thickness dimension of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4.

[0058] Next, the original substrate is cut out by laser processing or the like, and openings 47 are formed in the portions of the original substrate that correspond to the plurality of substrates 4, so that these portions are formed into the shape of the substrate 4. Note that before the coil 2, the first terminal 31, and the second terminal 32 are produced, the portions of the original substrate that correspond to the plurality of substrates 4 may be formed into the shape of the substrate 4.

[0059] Next, the surfaces of the coil 2, the first terminal 31, and the second terminal 32 that will come into contact with the molded body 5 are covered with an insulating film 6. For example, the insulating film 6 can be produced by applying an insulating material to the surfaces, attaching an insulating film, or depositing an insulating material by vapor deposition, electrodeposition, or the like. Note that the insulating film 6 may be produced before the opening 47 is formed, and then the opening 47 may be formed.

[0060] Next, the magnetic composite material is thermocompressed to form an original compact, with the original substrate, the coil 2, the first terminal 31, and the second terminal 32 embedded in the original compact.

[0061] Next, the original substrate and the original molded body are cut to obtain a plurality of electronic components 1 .

[0062] The manufacturing method of the electronic component 1 is not limited to the above. For example, the electronic component 1 may be manufactured by forming the coil 2, the first terminal 31, and the second terminal 32 on the substrate 4 without using an original substrate, forming the insulating film 6, and then thermocompressing the magnetic composite material to produce the molded body 5.

[0063] The electronic component 1 of the first embodiment can be mounted on a substrate such as a printed wiring board using the first terminals 31 and the second terminals 32. In the first embodiment, the electronic component 1 can be mounted on both the first substrate 7 and the second substrate 8, with the electronic component 1 interposed between the opposing first substrate 7 and second substrate 8. The first terminal portion 311 and the second sub-terminal portion 322 can be used for mounting on the first substrate 7, and the second terminal portion 321 and the first sub-terminal portion 312 can be used for mounting on the second substrate 8.

[0064] Specifically, electronic component 1 is disposed between first substrate 7 and second substrate 8 such that first chip surface 11 faces first substrate 7 and second chip surface 12 faces second substrate 8. The surface of first terminal 311 exposed on first chip surface 11 and the surface of second sub-terminal 322 exposed on first chip surface 11 are respectively overlapped with terminals 71 on first substrate 7. First terminal 311 and terminal 71 are connected by solder, and second sub-terminal 322 and terminal 71 are connected by solder. In this manner, electronic component 1 is mounted on first substrate 7. Furthermore, the surface of second terminal 321 exposed on second chip surface 12 and the surface of first sub-terminal 312 exposed on second chip surface 12 are respectively overlapped with terminals 81 on second substrate 8. The second terminal portion 321 and the terminal 81 are connected by solder, and the first sub-terminal portion 312 and the terminal 81 are connected by solder. In this way, the electronic component 1 is mounted on the second substrate 8.

[0065] For example, a power supply circuit is mounted on the second substrate 8. For example, a computing device such as a central processing unit that is driven by power supplied from the power supply circuit is mounted on the first substrate 7. In this case, if the electronic component 1 is mounted on the first substrate 7 and the second substrate 8, the current path including the electronic component 1 between the power supply circuit and the computing device can be shortened.

[0066] When mounting the electronic component 1, for example, the first substrate 7 is first positioned so that the surface on which the electronic component 1 is to be mounted faces upward. Solder is placed on each of the two terminals 71 of the first substrate 7. With the first chip surface 11 of the electronic component 1 facing the first substrate 7, the first terminal 311 and the second sub-terminal 322 are placed on the solder on the terminal 71. In this state, the solder is heated in a reflow furnace or the like, thereby joining the first terminal 311 and the second sub-terminal 322 to the terminal 71 with the solder. This mounts the electronic component 1 on the first substrate 7. A fillet 72 formed from the solder adheres to the surface of the first terminal 311 exposed at the first end face 13, and a fillet 72 formed from the solder also adheres to the surface of the second sub-terminal 322 exposed at the second end face 14.

[0067] Next, the second substrate 8 is placed so that the surface on which the electronic component 1 is mounted faces upward. Solder is placed on each of the two terminals 81 of the second substrate 8. With the second chip surface 12 of the electronic component 1 facing the second substrate 8, the second terminal portion 321 and the first sub-terminal portion 312 are placed on the solder on the terminal 81. In this state, the solder is heated in a reflow furnace or the like, thereby joining the second terminal portion 321 and the first sub-terminal portion 312 to the terminal with the solder. This completes the mounting of the electronic component 1 on the second substrate 8. A fillet 82 formed from the solder adheres to the surface of the second terminal portion 321 exposed at the first end face 13, and a fillet 82 formed from the solder also adheres to the surface of the first sub-terminal portion 312 exposed at the second end face 14.

[0068] When the solder for mounting the electronic component 1 on the second substrate 8 is heated, the fillets 72 attached to the surface of the first terminal 311 exposed at the first end face 13 and the surface of the second sub-terminal 322 exposed at the second end face 14 may also be heated and melted. However, in this embodiment, the substrate 4 is interposed between the first terminal 311 and the first sub-terminal 312. The solder constituting the fillets 72 has a higher affinity for the first terminal 311 and a lower affinity for the substrate 4. Therefore, even if the fillets 72 melt, they are less likely to move from the first terminal 311 toward the substrate 4. This makes it easier for the fillets 72 to remain attached to the first terminal 311, which in turn makes it easier to maintain the connection between the first terminal 311 and the terminal 71 of the first substrate 7. Furthermore, a short circuit caused by the fillet 72 attached to the first terminal 311 reaching the first sub-terminal 312 can be suppressed. Similarly, in this embodiment, the substrate 4 is interposed between the second terminal 321 and the second sub-terminal 322. The solder constituting the fillet 72 has a higher affinity for the second sub-terminal 322 and a lower affinity for the substrate 4. Therefore, even if the fillet 72 melts, the fillet 72 is less likely to move from the second sub-terminal 322 toward the substrate 4. This makes it easier for the fillet 72 to remain attached to the second sub-terminal 322, and therefore makes it easier to maintain the connection between the second sub-terminal 322 and the terminal 71 of the first substrate 7. Furthermore, a short circuit caused by the fillet 72 reaching the second terminal 321 can be suppressed.

[0069] Although the above description shows that the first terminal portion 311 and the first sub-terminal portion 312 are electrically connected, the first terminal portion 311 and the first sub-terminal portion 312 do not have to be electrically connected. That is, although the above description shows that the first sub-terminal portion 312 is included in the first terminal 31, the first sub-terminal portion 312 may not be included in the first terminal 31 and may be a different element from the first terminal 31. In this case, the first sub-terminal portion 312 can be used to fix the electronic component 1 to the first substrate 7, but is not used to electrically connect the first substrate 7 and the electronic component 1. Similarly, the above description shows that the second terminal portion 321 and the second sub-terminal portion 322 are electrically connected, but the second terminal portion 321 and the second sub-terminal portion 322 do not have to be electrically connected. That is, although the above description has described the second sub-terminal portion 322 as being included in the second terminal 32, the second sub-terminal portion 322 may not be included in the second terminal 32 and may be an element different from the second terminal 32. In this case, the second sub-terminal portion 322 can be used to fix the electronic component 1 to the second substrate 8, but is not used for electrically connecting the second substrate 8 and the electronic component 1.

[0070] The thickness dimension TD2 (Z direction dimension) of the conductor wiring that constitutes the coil 2 in the first embodiment (the conductor wiring that constitutes each of the first coil portion 21 and the second coil portion 22) is, for example, 35 μm or more and 350 μm or less.

[0071] The conductor wiring constituting the coil 2 in the first embodiment extends in a spiral shape in the longitudinal direction DS2 of the conductor wiring. The width dimension WD2 of the conductor wiring constituting the coil 2 in the first embodiment (the dimension in the direction perpendicular to both the Z direction and the longitudinal direction DS2 of the conductor wiring) is, for example, 10 μm or more and 200 μm or less.

[0072] In the first embodiment, the thickness dimension TD3 (Z-direction dimension) of the conductor wiring constituting each of the first terminal 31 and the second terminal 32 (the conductor wiring constituting each of the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, and the second sub-terminal portion 322) is, for example, 35 μm or more and 500 μm or less. Furthermore, as described above, it is preferable that the width dimension WD2 of the conductor wiring constituting the coil 2 is smaller than the thickness dimension TD3 of the conductor wiring constituting each of the first terminal 31 and the second terminal 32.

[0073] In the first embodiment, the conductor wiring constituting each of the first terminal 31 and the second terminal 32 extends elongatedly in the longitudinal direction DS3. In the embodiment, the longitudinal direction DS3 is aligned with the Y direction. In the first embodiment, the width dimension WD3 (the dimension perpendicular to both the Z direction and the longitudinal direction DS3 of the conductor wiring) of the conductor wiring constituting each of the first terminal 31 and the second terminal 32 is, for example, 50 μm or more and 200 μm or less. Furthermore, as described above, it is preferable that the width dimension WD2 of the conductor wiring constituting the coil 2 is smaller than the width dimension WD3 of the conductor wiring constituting each of the first terminal portion 311 and the second terminal portion 321. When the coil 2 is composed of conductor wiring, it is easy to independently adjust the thickness dimension TD2 and the width dimension WD2 of the coil 2. By setting the thickness dimension and the TD2-width dimension WD2 of the conductor wiring constituting the coil 2 to different values, the electrical resistance value, L value, thermal characteristics, and the like of the coil 2 can be appropriately adjusted. Similarly, when the first terminal 31 and the second terminal 32 are each made of conductive wiring, it is easy to independently adjust the thickness dimension TD3 and the width dimension WD3 of each of the first terminal 31 and the second terminal 32. By setting the thickness dimension TD3 and the width dimension WD3 of the conductive wiring constituting each of the first terminal 31 and the second terminal 32 to different values, the electrical resistance value, L value, thermal characteristics, and the like of each of the first terminal 31 and the second terminal 32 can be appropriately adjusted.

[0074] In the first embodiment, each of the first terminal 31 and the second terminal 32 is exposed to the outside of the electronic component 1, and the electronic component 1 does not have a conductor covering each of the first terminal 31 and the second terminal 32. In other words, the electronic component 1 does not have an external electrode that is not integrated with the coil 2, such as an external electrode formed of silver paste or the like. Therefore, as described above, performance degradation of the electronic component 1 due to reduced conductivity inside the electronic component 1 is suppressed, and the heat dissipation properties of the electronic component 1 can be improved.

[0075] However, electronic component 1 may have at least one selected from the group consisting of a metal coating covering a portion of first terminal 31 that is exposed to the outside of molded body 5 and a metal coating covering a portion of second terminal 32 that is exposed to the outside of molded body 5. The metal coating is formed by, for example, a plating process. That is, the metal coating is, for example, a plated coating.

[0076] The thickness of the metal coating is, for example, not less than 0.1 μm and not more than 10 μm.

[0077] Even if the electronic component 1 has the metal coating, it is possible to suppress performance degradation of the electronic component 1 due to reduced conductivity inside the electronic component 1 and to improve the heat dissipation of the electronic component 1. Furthermore, the metal coating protects the surface of at least one of the first terminal 31 and the second terminal 32 to prevent oxidation and the like, and also improves the wettability of the solder of at least one of the first terminal 31 and the second terminal 32.

[0078] At least one selected from the group consisting of the portion of the first terminal 31 exposed to the outside of the molded body 5 and the portion of the second terminal 32 exposed to the outside of the molded body 5 may be subjected to an appropriate surface treatment. As the surface treatment, for example, at least one treatment selected from the group consisting of an anti-oxidation treatment, a flux treatment, a solder leveler, etc. may be performed.

[0079] 2.2 Second Embodiment An electronic component 1 according to a second embodiment will be described with reference to Fig. 14. In the following description, elements similar to those in the first embodiment are denoted by the same reference numerals in the drawings, and descriptions common to those in the first embodiment will be omitted as appropriate.

[0080] In the second embodiment, the surfaces of the first terminal 311 and the second sub-terminal 322 are not exposed on the first chip surface 11 of the electronic component 1 and the molded body 5. That is, the first chip surface 11 of the electronic component 1 is composed only of the surface of the molded body 5. Furthermore, on the first end surface 13 of the electronic component 1, the surface of the molded body 5, the surface of the insulating film 6, the surface of the first terminal 311, the surface of the substrate 4, and the surface of the first sub-terminal 312 are aligned in this order in the Z direction, and these surfaces are evenly aligned. Similarly, on the second end surface 14 of the electronic component 1, the surface of the molded body 5, the surface of the insulating film 6, the surface of the second sub-terminal 322, the surface of the substrate 4, and the surface of the second terminal 321 are aligned in this order in the Z direction, and these surfaces are evenly aligned. In the second embodiment, solder mounting defects such as chip standing are less likely to occur when the electronic component 1 is mounted on a substrate.

[0081] 2.3 Third Embodiment An electronic component 1 according to a third embodiment will be described with reference to Fig. 15 to Fig. 23. In the following description, elements similar to those in the first embodiment are denoted by the same reference numerals in the drawings, and descriptions of elements common to the first embodiment will be omitted as appropriate.

[0082] In the third embodiment, the surfaces of the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, and the second sub-terminal portion 322 are not exposed on each of the end surfaces 15 at both ends in the Y direction of the electronic component 1 and the molded body 5. In other words, each of the end surfaces 15 at both ends in the Y direction of the electronic component 1 is formed only by the surface of the molded body 5.

[0083] In the third embodiment, the Y-direction dimension of the first terminal portion 311 of the coil 2 is larger than the Y-direction dimension of the entire first coil portion 21, and both ends of the first terminal portion 311 in the Y-direction protrude outward beyond both ends of the entire first coil portion 21 in the Y-direction. Furthermore, the Y-direction dimension of the second terminal portion 321 of the coil 2 is larger than the Y-direction dimension of the entire second coil portion 22, and both ends of the second terminal portion 321 in the Y-direction protrude outward beyond both ends of the entire second coil portion 22 in the Y-direction. Otherwise, the substrate 4, coil 2, and insulating film 6 in the third embodiment have the same configurations as those in the first embodiment (see FIGS. 15 to 23 ).

[0084] According to the third embodiment, when a plurality of electronic components 1 are mounted on a substrate so as to be aligned in the Y direction, the first terminals 31 and the second terminals 32 of adjacent electronic components 1 are less likely to come into contact with each other. As a result, short circuits between the electronic components 1 are less likely to occur.

[0085] 2.4 Fourth Embodiment An electronic component 1 according to a fourth embodiment will be described with reference to Fig. 24. In the following description, elements similar to those in the first embodiment are denoted by the same reference numerals in the drawings, and descriptions common to those in the first embodiment will be omitted as appropriate.

[0086] In the fourth embodiment, the surfaces of the first terminal portion 311 and the second sub-terminal portion 322 are not exposed on the first chip surface 11 of the electronic component 1 and the molded body 5. That is, the first chip surface 11 of the electronic component 1 is composed only of the surface of the molded body 5. Furthermore, the surfaces of the second terminal portion 321 and the first sub-terminal portion 312 are not exposed on the second chip surface 12 of the electronic component 1 and the molded body 5. That is, the second chip surface 12 of the electronic component 1 is also composed only of the surface of the molded body 5.

[0087] Furthermore, at first end surface 13 of electronic component 1, the surface of molded body 5, the surface of insulating film 6, the surface of first terminal 311, the surface of substrate 4, the surface of first sub-terminal 312, and the surface of molded body 5 are aligned in this order in the Z direction, and these surfaces are flat. Similarly, at second end surface 14 of electronic component 1, the surface of molded body 5, the surface of insulating film 6, the surface of second sub-terminal 322, the surface of substrate 4, the surface of second terminal 321, and the surface of molded body 5 are aligned in this order in the Z direction, and these surfaces are flat.

[0088] According to the fourth embodiment, there is no need to expose the first terminals 31 and the second terminals 32 on each of the first chip surface 11 and the second chip surface 12, and therefore the process of exposing the first terminals 31 and the second terminals 32 by polishing or the like is not required.

[0089] 3. Aspects The present disclosure includes the following aspects.

[0090] The electronic component (1) according to the first aspect includes an electrically insulating substrate (4), a coil (2) supported by the substrate (4), a first terminal (31) supported by the substrate (4), a second terminal (32) supported by the substrate (4), and a molded body (5) containing a magnetic material and holding the substrate (4), the coil (2), the first terminal (31), and the second terminal (32). Each of the first terminal (31) and the second terminal (32) is integrated with the coil (2). The entire coil (2) is embedded in the molded body (5). A portion of the first terminal (31) is exposed to the outside of the molded body (5). A portion of the second terminal (32) is exposed to the outside of the molded body (5).

[0091] According to this aspect, reduction in electrical conductivity and thermal conductivity between the coil (2) and each of the first terminal (31) and the second terminal (32) can be suppressed.

[0092] In the second aspect, the substrate (4) of the first aspect has a first main surface (401) and a second main surface (402) opposite the first main surface (401). The coil (2) has a first coil portion (21) overlapping the first main surface (401), a second coil portion (22) overlapping the second main surface (402), and a coil connection portion (23) electrically connecting the first coil portion (21) and the second coil portion (22). The first terminal (31) has a first terminal portion (311) overlapping the first main surface (401). The second terminal (32) has a second terminal portion (321) overlapping the second main surface (402). The first terminal portion (311) is connected to and integrated with one end of the first coil portion (21). The second terminal portion (321) is connected to and integrated with one end of the second coil portion (22).

[0093] According to this aspect, the first terminal portion (311) and the second terminal portion (321) can be disposed on the first main surface (401) and the second main surface (402) of the substrate (4), respectively.

[0094] In a third aspect, the substrate (4) of the second aspect further has a coil connection hole (42) penetrating from the first main surface (401) to the second main surface (402). The coil connection portion (23) is disposed in the coil connection hole (42).

[0095] In a fourth aspect, in the second or third aspect, the first terminal (31) further has a first sub-terminal portion (312) that overlaps with the second main surface (402) of the substrate (4), and a first terminal connection portion (313) that electrically connects the first terminal portion (311) and the first sub-terminal portion (312).

[0096] According to this embodiment, both the first terminal portion (311) and the first sub-terminal portion (312) can be used to mount the electronic component (1) on a substrate, and heat dissipation is possible from both the first terminal portion (311) and the first sub-terminal portion (312), which can further improve the heat dissipation properties of the electronic component (1).

[0097] In a fifth aspect, the substrate (4) of the fourth aspect further has a first terminal connection hole (45) penetrating from the first main surface (401) to the second main surface (402). The first terminal connection portion (313) is disposed in the first terminal connection hole (45).

[0098] In a sixth aspect, in the fourth or fifth aspect, the second terminal (32) further has a second sub-terminal portion (322) that overlaps with the first main surface (401) of the substrate (4), and a second terminal connection portion (323) that electrically connects the second terminal portion (321) and the second sub-terminal portion (322).

[0099] According to this embodiment, both the second terminal portion (321) and the second sub-terminal portion (322) can be used to mount the electronic component (1) on a substrate, and heat dissipation is possible from both the second terminal portion (321) and the second sub-terminal portion (322), which can further improve the heat dissipation properties of the electronic component (1).

[0100] In a seventh aspect, the substrate (4) of the sixth aspect further has a second terminal connection hole (46) penetrating from the first main surface (401) to the second main surface (402). The second terminal connection portion (323) is disposed in the second terminal connection hole (46).

[0101] In the eighth aspect, in any one of the second to seventh aspects, the thickness dimension of the first coil portion (21) along the thickness direction of the substrate (4) is smaller than the thickness dimension of the first terminal portion (311) along the thickness direction of the substrate (4).

[0102] In a ninth aspect, in the eighth aspect, each of the first coil portion (21) and the first terminal portion (311) is composed of conductor wiring. The width dimension of the conductor wiring constituting the first coil portion (21) is smaller than the width dimension of the conductor wiring constituting the first terminal portion (311). The width dimension of the conductor wiring constituting the second coil portion (22) is smaller than the width dimension of the conductor wiring constituting the second terminal portion (321).

[0103] In the tenth aspect, in the eighth or ninth aspect, the surface of the first terminal portion (311) of the first terminal (31) opposite to the substrate (4) side is exposed to the outside of the molded body (5).

[0104] According to this embodiment, the surface of the first terminal portion (311) can be used to mount the electronic component (1) on a substrate.

[0105] In an eleventh aspect, in any one of the eighth to tenth aspects, the thickness dimension of the second coil portion (22) along the thickness direction of the substrate (4) is smaller than the thickness dimension of the second terminal portion (321) of the second terminal (32) along the thickness direction of the substrate (4).

[0106] In a twelfth aspect, in the eleventh aspect, the second coil portion (22) and the second terminal portion (321) are each composed of conductor wiring, and the width dimension of the conductor wiring constituting the second coil portion (22) is smaller than the width dimension of the conductor wiring constituting the second terminal portion (321).

[0107] In the thirteenth aspect, in the eleventh or twelfth aspect, the surface of the second terminal portion (321) of the second terminal (32) opposite to the substrate (4) side is exposed to the outside of the molded body (5).

[0108] According to this embodiment, the surface of the second terminal portion (321) can be used to mount the electronic component (1) on a substrate.

[0109] In a fourteenth aspect, in any one of the first to thirteenth aspects, a first terminal (31) and a second terminal (32) are respectively arranged at both ends of the electronic component (1) in one direction perpendicular to the thickness direction of the substrate (4).

[0110] According to this aspect, the first terminal (31) and the second terminal (32) are arranged apart from each other, which can prevent short circuits when the electronic component (1) is mounted on a substrate.

[0111] In the fifteenth aspect, in the fourteenth aspect, the surface of the first terminal (31) opposite to the second terminal (32) side is exposed to the outside of the molded body (5), and the surface of the second terminal (32) opposite to the first terminal (31) side is exposed to the outside of the molded body (5).

[0112] According to this embodiment, the surface of the first terminal (31) opposite to the second terminal (32) side and the surface of the second terminal (32) opposite to the first terminal (31) side can be used to mount the electronic component (1) on a substrate.

[0113] In a sixteenth aspect, in any one of the first to fifteenth aspects, an insulating film (6) is further provided between the coil (2), the first terminal (31), and the second terminal (32) and the molded body (5).

[0114] According to this aspect, short circuits in the coil (2), the first terminal (31), and the second terminal (32) can be suppressed.

[0115] In a seventeenth aspect, in any one of the first to sixteenth aspects, the electronic component (1) is a chip component.

[0116] In an eighteenth aspect, the electronic component (1) in any one of the first to seventeenth aspects has at least one selected from the group consisting of a metal coating covering a portion of the first terminal (31) that is exposed to the outside of the molded body (5) and a metal coating covering a portion of the second terminal (32) that is exposed to the outside of the molded body (5).

[0117] REFERENCE SIGNS LIST 1 Electronic component 2 Coil 21 First coil portion 22 Second coil portion 23 Coil connection portion 31 First terminal 311 First terminal portion 312 First sub-terminal portion 313 First terminal connection portion 32 Second terminal 321 Second terminal portion 322 Second sub-terminal portion 323 Second terminal connection portion 4 Substrate 401 First main surface 402 Second main surface 42 Coil connection hole 45 First terminal connection hole 46 Second terminal connection hole 5 Molded body 6 Insulating film

Claims

1. An electronic component comprising: an electrically insulating substrate; a coil supported on the substrate; a first terminal supported on the substrate; a second terminal supported on the substrate; and a molded body containing a magnetic material and holding the substrate, the coil, the first terminal, and the second terminal, wherein each of the first terminal and the second terminal is integrated with the coil, the entire coil is embedded in the molded body, a portion of the first terminal is exposed to the outside of the molded body, and a portion of the second terminal is exposed to the outside of the molded body.

2. The electronic component according to claim 1, wherein the substrate has a first main surface and a second main surface opposite the first main surface, the coil has a first coil portion overlapping the first main surface, a second coil portion overlapping the second main surface, and a coil connection portion electrically connecting the first coil portion and the second coil portion, the first terminal has a first terminal portion overlapping the first main surface, the second terminal has a second terminal portion overlapping the second main surface, the first terminal portion being connected to and integrated with one end of the first coil portion, and the second terminal portion being connected to and integrated with one end of the second coil portion.

3. The electronic component according to claim 2, wherein the base material further has a coil connection hole penetrating from the first main surface to the second main surface, and the coil connection portion is disposed within the coil connection hole.

4. The electronic component according to claim 2, wherein the first terminal further comprises a first sub-terminal portion overlapping the second main surface of the substrate, and a first terminal connection portion electrically connecting the first terminal portion and the first sub-terminal portion.

5. The electronic component according to claim 4, wherein the base material further has a first terminal connection hole penetrating from the first main surface to the second main surface, and the first terminal connection portion is disposed within the first terminal connection hole.

6. The electronic component according to claim 4, wherein the second terminal further comprises a second sub-terminal portion overlapping the first main surface of the substrate, and a second terminal connection portion electrically connecting the second terminal portion and the second sub-terminal portion.

7. The electronic component according to claim 6, wherein the base material further has a second terminal connection hole penetrating from the first main surface to the second main surface, and the second terminal connection portion is disposed within the second terminal connection hole.

8. The electronic component according to claim 2, wherein the thickness dimension of the first coil portion along the thickness direction of the substrate is smaller than the thickness dimension of the first terminal portion along the thickness direction of the substrate.

9. The electronic component according to claim 8, wherein each of the first coil portion and the first terminal portion is composed of conductor wiring, the width dimension of the conductor wiring that constitutes the first coil portion is smaller than the width dimension of the conductor wiring that constitutes the first terminal portion, and the width dimension of the conductor wiring that constitutes the second coil portion is smaller than the width dimension of the conductor wiring that constitutes the second terminal portion.

10. The electronic component according to claim 8, wherein the surface of the first terminal portion of the first terminal opposite to the substrate side is exposed to the outside of the molded body.

11. The electronic component according to claim 8, wherein the thickness dimension of the second coil portion along the thickness direction of the substrate is smaller than the thickness dimension of the second terminal portion of the second terminal along the thickness direction of the substrate.

12. The electronic component according to claim 11, wherein the second coil portion and the second terminal portion are each composed of conductor wiring, and the width dimension of the conductor wiring that constitutes the second coil portion is smaller than the width dimension of the conductor wiring that constitutes the second terminal portion.

13. The electronic component according to claim 11, wherein the surface of the second terminal portion of the second terminal opposite to the substrate side is exposed to the outside of the molded body.

14. The electronic component according to claim 1, wherein the first terminal and the second terminal are respectively disposed at both ends of the electronic component in a direction perpendicular to the thickness direction of the substrate.

15. The electronic component according to claim 14, wherein a surface of the first terminal opposite to the second terminal side is exposed to the outside of the molded body, and a surface of the second terminal opposite to the first terminal side is exposed to the outside of the molded body.

16. The electronic component according to claim 1, further comprising an insulating film interposed between the coil, the first terminal, and the second terminal and the molded body.

17. The electronic component according to claim 1, which is a chip component.

18. The electronic component according to claim 1, comprising at least one selected from the group consisting of a metal coating covering the portion of the first terminal exposed to the outside of the molded body, and a metal coating covering the portion of the second terminal exposed to the outside of the molded body.

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